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In the high end smartphone market fourmanufacturers, Apple, Samsung, Huaweiand Qualcomm, lead in the ApplicationProcessor Environment (APE) stakes. All fourhave a different supply chain but all remaincompetitive. Samsung is the only onepresent in two different supply chains. Itprovides the APE for its own flagship but italso provides the APE die for Qualcomm.Since 2016, the Galaxy smartphone serieshas featured the two APEs depending onwhere in the world they’re sold. This yearSamsung renewed this partnership byintegrating the Exynos 9 with severalinnovations like modified semi-additiveprocess (mSAP) printed circuit board (PCB)or new package-on-package (PoP)integration developed by Samsung itself orthe Qualcomm Snapdragon 845 withMolded Core Embedded Package (MCeP)developed by Shinko.
Depending on where in the world it’s sold,the Samsung Galaxy S9 Plus has severalfeatures that can differ. The ‘international’version features an Exynos 9810 chipsetwith mSAP technology for the main boardPCB while the US version features theSnapdragon 845 chipset with standard mainboard PCB.
The Exynos 9810 is an embedded diepackage with in-house packagingtechnology, using two moldings to improvethe well-known Through Molded Via (TMV)technology. The Snapdragon 845 still usesShinko’s MCeP technology, but with newimprovement since the last analyzed
Snapdragon APE. In this report, we will showthe differences between both packages andtheir innovations, including moldingcompound, substrate and decouplingcapacitors. The detailed comparisonbetween both APE packages will give thepros and the cons of the PoP technologies.
This report reviews the Exynos 9810 and theSnapdragon 845, including a completepackage analysis, cost analysis, and priceestimate for the chips. Also included is aphysical and cost comparison of thedifferent solutions. Finally, it features atechnical and physical comparison betweenthe previous generation of the Exynos andthe Snapdragon Series, and the other APEpackaging solutions from Huawei and Apple.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply-chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison of the Samsung Exynos 9 (Octa 9810) and Samsung Exynos 8 (Octa 8890)
• Comparison of the Qualcomm Snapdragon 845 with Snapdragon 820
• Comparison of the Samsung Exynos 9 (Octa 9810) and the Qualcomm Snapdragon 845
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Title: Samsung Exynos9 vs. Qualcomm 845 PoP
Pages: 130
Date: June 2018
Format: PDF & Excel file
Price: EUR 3,490
Samsung’s Galaxy S9 Plus Processor Packages: Samsung’s iPoP vs. Qualcomm/Shinko MCeP
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
Comparison of both Samsung Galaxy S9 processor packages: Samsung Exynos9810 with new TMV Package-on-Package vs. Qualcomm Snapdragon 845 withMCeP Packaging.
TABLE OF CONTENTS
Overview/Introduction
Samsung and Qualcomm - Company Profiles
Samsung Galaxy S9+ Teardown – US vs. EU versions
Exynos and Snapdragon Physical Analysis
• Physical Analysis – Methodology
• SM-G965F/N and SM-G965U1 Main Board Analysis
Board overview and cross-section
• Package Assembly
View and dimensions
Package overview and cross-section
Package opening
• Die
View, dimensions, and markings
Cross-section and process characteristics
Physical and Cost Comparison
• Qualcomm Snapdragon 820 vs. 845 PoP
• Samsung Exynos 8 vs. 9 PoP
• Snapdragon 845 vs. Exynos 9 - cost comparison
• PoP technology comparison
Manufacturing Process Flow
• Die process and wafer fabrication unit
• Packaging process and fabrication unit
Cost Analysis
• Cost analysis overview
• Main steps used in the economic analysis
• Yield hypotheses
• Die cost
Wafer and die cost
• Packaging assembly cost
Panel front-end cost
Cost per process steps
• Component cost
Estimated Price Analysis
AUTHORS
SAMSUNG’S GALAXY S9 PLUS PROCESSOR PACKAGES: SAMSUNG’S IPOP VS. QUALCOMM/SHINKO MCEP
Dr Stéphane Elisabeth has adeep knowledge of materialscharacterizations and electro-nics systems. He holds anE n g i n e e r i n g D e g r e e i nElectronics and NumericalTechnology, and a PhD in
Second Generation of TSMC’s Integrated Fan-Out (inFO) Packaging for the Apple A11 found in the iPhone XThe latest Apple application processor engine : from the stacked board to the A11, and reverse costing of TSMC's updated inFOpackaging.February 2018 - Price: EUR 3,490*
Qualcomm VIVE® QCA9500 High Density WiGig/WiFi802.11ad Chipset for the 60 GHz BandDisruptive double side moldedsystem-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae.January 2018 - EUR 3,990*
NXP SCM-i.MX6 Quad High Density Fan-Out Wafer-Level System-in-PackageThe first ultra-small multi-die low power module with boot memory and power management integrated in a package-on-package compatible device for the IoT.June 2017 - EUR 3,490*
RELATED REPORTS
Yvon Le Goff has joinedSystem Plus Consulting in2011 to setup its laboratory.He previously worked for25 years at Atmel NantesTechnological Analysis Labo-ratory as fab support in phy-
Materials for Microelectronics. sical analysis, and for three years at HirexEngineering in Toulouse, in a destructivephysical analysis lab.
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3D Package CoSim+ is a process based costing toolused to evaluate the manufacturing cost per waferusing your own inputs or using the pre-definedparameters included in the tool. It is possible toenter any Package process flow.
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