Samsung CSP LED LM101A - System Plus Consulting

©2017 by System Plus Consulting | Samsung LM101A 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Samsung LM101A Chip Scale Package LEDLED report by Sylvain HallereauFebruary 2017


SUMMARY

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 10

o Samsung

Physical Analysis 15

o Synthesis of the Physical Analysis

o Package analysis

Package Views & Dimensions

Package Cross-Section

o LED Die

LED Die View & Dimensions

LED Die Process

LED Die Cross-Section

LED Die Cross-Section Cathode

LED Die Cross-Section Anode

LED Die Process Characteristic

LED Manufacturing Process 41

o LED Die Front-End Process Flow

o LED Die Fabrication Unit

o Package Process flow

o Final Test & Packaging Fabrication unit

Cost Analysis 51

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o LED die

LED Front-End Cost

LED Die Probe Test, Thinning & Dicing

LED Wafer Cost

LED Die Cost

o LED Component

Packaging Cost

Packaging Step Cost

Component Cost

Component Cost Evolution

Price Analysis 65

o Estimation of selling price

Company services 68


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & SupplyChain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theSamsung LM101A Chip Scale Package LED.

The SCP8TT78HPL1TLS06E is the first generation Chip Scale Package (CSP) LED device from Samsung. The LED presents a flip chipstructure.

The SCP8TT78HPL1TLS06E is a neutral white (4000°K) LED with a CRI of 80.

The design allows low thermal resistance and a high degree of reliability with plastic free structure.

The wafer level packaging makes a very competitive cost.

The report goes into depth in its analysis of the packaging and the components, with images of the new Chip scale package structure.

The LM101A LED family is adapted to Bulb, Candle, MR16, PAR, Spot light products. The SCP LED is a new market which represents 0.8%of the LED market today but will be 6 times larger in 2021, (yole develloppement). With this component, Samsung positions in on thisnew CSP LED market.


Overview / Introduction


Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section


Cost Analysis


About System Plus

Package Views & Dimensions

o The package type is a chip scale package (CSP)

o Package size : 1.2mm x 1.2mm x 0.4mm

o Package area: 1.44mm²

o LED area: 0.67mm² (47% of the package)

Package Front view Package Back view

Package Side view

0.4mm

0.3

6m

m

0.82mm

0.82mm

1.2mm

0.2mm 0.2mm






Cost Analysis


About System Plus

LED die Dimensions

LED Die – Optical view

XXm

m

o Die area: XXmm² (XXmm x XXmm)

o There is no marking on the die.

XXmm






Cost Analysis


About System Plus

Die process

Detail back side – SEM View






Cost Analysis


About System Plus

Die cross section – Cathode Electrode EDX

Cathode metal layers – EDX Epitaxy




Physical Analysis

Manufacturing Process Flowo LED Front-End Fab Unito LED Front-End Processo Packaging Processo Packaging Unit

Cost Analysis


About System Plus

LED Process Flow (1/2)

Epitaxy

•Epitaxy GaN

Anode

Insulation

GaN Epitaxy

PSS (Patterned Sapphire Substrate)

Drawing not to Scale




Physical Analysis


Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution


About System Plus

LED Front-End Cost




Physical Analysis




About System Plus

LED Wafer Cost per process steps




Physical Analysis




About System Plus

Component Cost


COMPANYSERVICES




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

LED• CSP LED Lighting module 2017 • MicroLED Displays 2017 • LED Packaging 2017 • Automotive Lighting 2016• Bulk GaN Substrate Market 2017

PATENT ANALYSIS - KNOWMADE

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

LED• SP16273 - SETi 2 UVC 270 LED• SP15224 - Toshiba TL1L4 GaN on Si LED• SP13129 - SORAA GaN on GaN LED

Related Reports




Physical Analysis


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

Documents

Samsung CSP LED LM101A - System Plus Consulting