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ASIC System-on-Chip (SoC) Solutions
With the market moving to SoC technology, working with Samsung enables
customers to simplify and accelerate the creation of leading-edge products.
Samsung’s ASIC solutions are enhanced by the company’s system-level
knowledge and experience in deep sub-micron design methodologies. For
example, through Samsung’s unique embedded memory processes, engineers
can incorporate custom-sized DRAM and Flash memory blocks into their SoC
designs. With standard cell libraries from the Common Platform technology
alliance and ARM, Samsung takes the risk out of getting customers’ products to
market by providing high-performance, high-density or low-power expertise for
highly integrated ASIC SoCs.
Samsung Foundry: ASIC Design Solutions
Samsung takes the risk out of
getting products to market quickly.
Samsung continually advances its technology innovation, giving customers access to state-of-the-art logic processes that enrich and differentiate their products.
Samsung delivers the total solution, including 32/28nm design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging & testing capabilities. The result is a shortened design cycle, lower risk and first-pass design success for most products.
What Samsung Offers
Rich IP Portfolio, Standard Cell, I/O and Memory Libraries
Samsung offers the broadest selection
of ARM cores, along with embedded
DRAM and Flash and a wide range of
advanced mixed-signal IP solutions.
We also provide silicon-validated
SerDes and USB 2.0 IP cores for
various application.
State-of-the-Art Fabrication Facilities
When it comes to investing in the
most advanced production facilities,
Samsung is at the forefront of
the industry. Completely owned
by Samsung, the fabs have the
flexibility and back-end capacity to
accommodate the production of
customer’s ASIC solutions.
The appearance of all products, dates, figures, diagrams and tables are subject to change at any time, without notice. Copyright © 2005. Samsung Semiconductor, Inc. is a registered trademark of Samsung Electronics Co. Ltd. All other names and brands may be claimed as the property of others. Microsoft® and Windows® are registered trademarks of Microsoft Corporation.
DS-10-SRAM-002 Printed 2/20
Samsung Semiconductor, Inc.
3655 North First St., San Jose, CA 95134-1713 TEL: 408-544-4000 FAX: 408-544-4950www.usa.samsungsemi.com
Regional Design Centers
Samsung’s ASIC Design Centers
are focused on delivering superior
services. These centers are staffed
by highly skilled ASIC design
engineers who understand complex
implementations. These regional
design centers offer complete
support of deep sub-micron design
methodologies, architectural analysis,
cost analysis and evaluation of system-
level trade offs.
Advanced Process Technology
Utilizing years of success as a top
semiconductor supplier, Samsung
has developed the process expertise
for high-volume manufacturing while
Advanced Process Technologies• 32/28nm• 45nm• 65nm• 90nm
CPU Cores• ARM Cortex A, R & M
Families• ARM 7, 9 & 11 families
DSP Cores• TeakLite• Teak• Oak
Peripheral Cores• 10/100 MAC Ethernet
Controllers• USB 1.1, USB 2.0, USB
OTG• IEEE 1394 Link Controllers• PCIe Controllers• IrDA• UART• Synchronous Serial I/F• Real-Time Clocks• Keyboard/Mouse I/F• General-purpose I/F• Smart Card/SIM I/F• Multimedia Card I/F• Asynchronous Static
Memory Controllers (SRAM, Flash ROM)
• Universal Memory Controllers (SDRAM, Synch Flash, SRAM)
• DMA Controllers• LCD Controllers• Watch-do Timers• Programmable Interrupt
Controllers
Interface IP• HDMI Tx v1.3• MiPi• SMIA (CCP2)
Multimedia IP• 820/1080i/1080p MFC• Audio Codec• JPEC Codec
Mixed Signal Cores• ADC: 6 to 14 bits, up to
450MHz• DAC: 8 to 16 bits, up to
300MHz• PLL: Up to 2GHz, Frequency
Synthesizer, De-skew, Pixel Clock, Dithered, Clock Recovery
• CODEC: 16-bit Audio, 14-bit Voice
• AFE
Embedded Memories• Embedded DRAM• Embedded Flash
also using this knowledge to increase
the capabilities of customers’ ASIC
designs.
Packaging & Testing Services
Samsung offers a full selection of
packaging options that accommodate
high-level integration and multiple
form factors. Samsung is one of the
pioneers in PoP and SiP technologies
for various applications. Also available
are increasing popular packaging
options such as fine-pitch BGA and
Flip Chip. In addition, Samsung
provides complete testing services in
the fabs.
Samsung’s Breadth of ASIC Solutions