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©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
REVERSE COSTING® – STRUCTURAL, PROCESS AND COST REPORT
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22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Samsung’s 6th-generation 3D NAND TLC with 128 active wordlines in a single deck array with side peripheral logic.
SPR21584 - Memory report by Belinda DubePhysical analysis by Véronique Le Troadec
November 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Samsung 128-layer V-NAND Memory
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 9
o Samsung Financials
o Samsung Products
o Samsung Location
o Samsung 3D NAND Memory
Physical Analysis 19
o Samsung 980 PRO SSD Overview 22
o Samsung 980 PRO SSD Teardown 25
o Memory Package 27
✓ Memory Package View & Dimensions
✓ Memory Package Cross-Section
✓ Memory Package Opening
o Memory Die 35
✓ Memory Die View & Dimensions
✓ Memory Die Cross-Section
✓ Memory Die Delayering
✓ Patents
Comparison 64-layer, 92-layer, 128-layer 66
✓ SSD Comparison
✓ Memory Package
✓ Memory Die Area and Density
✓ Memory Die Cross Section
✓ Memory CMOS Transistors
✓ Memory Cost
Memory Manufacturing Process 72
o Memory Die Front-End Process
o Memory Die Fabrication Unit
o Memory Manufacturing Process
o Packaging & Final Test
Cost Analysis 83
o Summary of the cost analysis 84
o Yields Explanation & Hypotheses 86
o Memory die 88
✓ Memory Die Front-End Cost
✓ Memory Die Probe Test, Thinning & Dicing
✓ Memory Die Wafer Cost
✓ Memory Die Cost
✓ Memory Packaging Cost
✓ Memory Component Cost
✓ Memory Cost per Gb
Selling price 99
Feedback 102
Related Analyses 104
System Plus Consulting Services 106
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consulting
Executive Summary
Samsung is a giant in the NAND market, dominating for several years. In 2020, the company was the world's top NAND flash maker with amarket share of 34%, followed by Japan's Kioxia Corp. with 21% and U.S. chipmaker Western Digital Corp. with 18%.
There is an explosive worldwide growth of data production causing the demand for high-performing, reliable non-volatile memory. NANDmemory providers are continuously pushing the limits of 3D stacking to provide improved storage density with each generation of 3DNAND memories.
Samsung’s vertical-NAND flash technology satisfies rising data demands by increasing the number of stacked layers. Vertical stacking ofmemory cells or wordlines creates a three-dimensional structure which overcomes the capacity limitations. Samsung first commercializedits 24-layered V-NAND in 2013 and today has reached 128 layers in its 6th-generation V-NAND. This 6th-generation design stacks a totalof 136-layer wordlines in a single tier. Meanwhile, NAND memory competitors are using a double-stack technology to develop their 3DNAND stacked memories, yet Samsung sticks to using a single stack which requires a more advanced etching technique and results in anincreased high-aspect ratio. The company’s sixth-generation V-NAND adds almost 40% more cells to the previous 92-layer 5th-generation V-NAND, resulting in an almost 25% chip area reduction.
This report presents a detailed study of Samsung’s latest 128-layer V-NAND using charge trap flash and triple-level cell NAND memorycells. The high-quality optical images and high-resolution scanning electron microscope (SEM) images are extracted to give physicaldetails of the package and die cross-sections, including material identification. Also included are process details to better understand themajor fabrication steps. Additionally, this report provides a cost estimation for producing the memory wafer with multiple wordlines, thedie cost, and the packaging cost.
Finally, this report features a comparison of Samsung’s previous-generation memories: this includes Gen 4 with 64 layers, Gen 5 with 92layers, and Gen 6 with 128 layers. This comparison summary comprises the package and die physical comparison, die density, wafer cost,and die cost. It also identifies the similar physical features and the evolution of Samsung’s V-NAND with each generation.
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Summary of the Physical Analysis
NAND Memory Assembly©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Package Cross Section
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Die Overview
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section – NAND Array and Metal layers
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section – NAND Array and Metal layers
Memory Die Cross-Section 1 - SEM View©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section – NAND Array Channel Hole
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section - Staircase
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section - Channel Hole Contacts
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section - Contacts
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cross-Section - Contacts
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Die Delayering– NAND Strings
Die Delayering - SEM View©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Summaryo SSD Overviewo Package Assembly
o Views & Dimensionso Cross-Sectiono Opening
o Memory Dieo Views & Dimensionso Die Cross-sectiono Delayeringo Patents
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Die delayering – CMOS Transistors
P H Y S I C A LCOMPARISON
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Package Comparisono Die Comparisono Die Cross Sectiono CMOS Transistorso Summary & Cost
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Die Comparison
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Package Comparisono Die Comparisono Die Cross Sectiono CMOS Transistorso Summary & Cost
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Related Analyses
About System Plus Consulting
Comparison – Memory Die
MANUFACTURINGPROCESS FLOW
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Memory Die Front-End
Processo Memory Fabrication Unito Memory Die Process Stepso Final Test & Assembly Unit
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consulting
Channel Hole Formation
C O S TANALYSIS
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NAND Memory Costo Packaging Costo Memory Component Costo Memory Cost per GB/Gb
Selling Price Analysis
Related Analyses
About System Plus Consulting
NAND Memory - Front-End Cost
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NAND Memory Costo Packaging Costo Memory Component Costo Memory Cost per GB/Gb
Selling Price Analysis
Related Analyses
About System Plus Consulting
NAND Memory Steps Costs
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NAND Memory Costo Packaging Costo Memory Component Costo Memory Cost per GB/Gb
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Die Cost
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NAND Memory Costo Packaging Costo Memory Component Costo Memory Cost per GB/Gb
Selling Price Analysis
Related Analyses
About System Plus Consulting
Component Cost
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso NAND Memory Costo Packaging Costo Memory Component Costo Memory Cost per GB/Gb
Selling Price Analysis
Related Analyses
About System Plus Consulting
Memory Cost per GB/Gb
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definitions of Priceo Component Price 256GB NAND
Related Analyses
About System Plus Consulting
Component Price 256GB
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consulting
Related Analyses
RELATED MONITORSRELATED REPORTS
By System Plus Consulting:• Intel 144-layer 3D NAND
Memory
• SK hynix 128-Layer NAND Memory
• YMTC’s 3D-NAND Flash Memory
By Yole Développement:• Memory Packaging 2021
• Status of the memory Industry 2021
• Equipment and Materials for 3D-NAND Manufacturing 2020
By Yole Développement:• NAND Quarterly Market
Monitor 2021
• DRAM Quarterly Market Monitor 2021
COMPANYSERVICES
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consultingo Company serviceso Contact
A Structure, Process and Cost Analysis
Reverse Costing® consists of disassembling a device or a system in orderto identify its technology and discern its manufacturing processes andthen using in-house models and tools to determine its cost.
Our Core Activity : Reverse Costing®
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consultingo Company serviceso Contact
Fields Of Expertise
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 32
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consultingo Company serviceso Contact
Business Model
Teardown Track
205+ teardowns per
year
Monitor1 per year quarterly updated
Custom Analysis150 custom analyses per
year
Report60+ per year
Costing Tools
5 process-based and 3 parametric
costing tools
Cost MethodsTrainingOn demand
©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 33
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consultingo Company serviceso Contact
Worldwide Presence
100+ collaborators in 8 different countries
Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement
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©2021 by System Plus Consulting | SPR21584 - Samsung 128-layer V-NAND Memory | Sample 34
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Analyses
About System Plus Consultingo Company serviceso Contact
Contact
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