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Semiconducto r/ Polymer Integrated Fabrication Facility CLEANROOM

S emiconductor/ P olymer I ntegrated F abrication F acility

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S emiconductor/ P olymer I ntegrated F abrication F acility. CLEANROOM. WHAT TO EXPECT (OUTLINE). Why a cleanroom? What is it? Facilities Procedures. WHY?. IT’S A DIRTY WORLD! UNCOUNTABLE PARTICLES IN AIR ALL SIZES, SHAPES, PROPERTIES NANOTECH S M A L L L L L L L FRAGILE. - PowerPoint PPT Presentation

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Page 1: S emiconductor/ P olymer I ntegrated F abrication F acility

Semiconductor/PolymerIntegratedFabricationFacility

CLEANROOM

Page 2: S emiconductor/ P olymer I ntegrated F abrication F acility

WHAT TO EXPECT(OUTLINE)

• Why a cleanroom?

• What is it?

• Facilities

• Procedures

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WHY?• IT’S A DIRTY WORLD!

– UNCOUNTABLE PARTICLES IN AIR– ALL SIZES, SHAPES, PROPERTIES

• NANOTECH– SMALLLLLLL

– FRAGILE

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WHATis a cleanroom?

• A room, enclosure, and or environment in which you move the air by way of supply and return locations to control the airborne particle levels and in some cases temperature and humidity. Courtesy of http://www.mcr-1.com/definitions.html

• A place where harmful junk is kept away from sensitive items or materials.

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CLEANROOM CLASSIFICATION

Class limits [maximum allowable particles per cubic foot (SI/209) or meter (ISO)]

ISO SI Fed Std 209 0.1 micron 0.2 micron 0.3 micron 0.5 micron 5 micron

3 M 1 1 100 35     35 1  

  M 1.5 1 35 7 3 1 0

  M 2 10 99.1     2.83  4 M 2.5 10 10,000 345 75 30 352 10 0

  M 3 100 991     28.1  

5 M 3.5 100 100,000 3,450 750 300 3520 100 0

6 M 4.5 1,000 1,000,000 34,500 N/A N/A 35,200 1,000 7

7 M 5.5 10,000 345,000 N/A N/A 352,000 10,000 70

8 M 6.5 100,000 3,450,000 N/A N/A 3,520,000 100,000 700

Courtesy of http://www.mcr-1.com/class.html

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CLEANROOM FACILITIES

2003 July 15

Class 10,000 by airflow designUpgradable to Class 1,000Tested (empty) as Class 1,000 (~780 actual counts)

Mat

X-Ray 2

X-Ray 1OpticalTable

FileCab

SumpPump

Horizontal LaminarFlow Hood

Frig

Chille

r

Chiller

4 Feet

ChemicalCabinet

WeighStation

Shoes

ShoeBrush

FumeHood

ChemicalCabinet

ChemicalCabinet File Ca

bTe

chnic

ianDe

sk

Stairwell

ComputerDesk

ComputerDesk

Cabinet

MatMat

Work Bench

Work Bench

Wire

Bonde

r Benc

h

OpticalTable

ShoesMat

Cabinet

Acid/SolventCabinets

Cabinet

CabinetWireRack

Wire

Rack

Cabin

et

Mat

Mat

FileCab

SolvCab

AcidCabChemicalPreparation

CharterizationHall

Page 7: S emiconductor/ P olymer I ntegrated F abrication F acility

ENTRY INTO THE CLEAN WORLD

>>> STOP <<<NO

FOOD OR BEVERAGESBEYOND THIS POINT

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STAY ON THE MATS

PAST THIS POINT

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SHOES OR BOOTIES

Booties

Shoes

Shoes

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NOW YOU CROSS THE LINE

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CHEMICAL PREPARATION

SolventsAcids

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THE CLEANROOM

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THE GOWNING ROOM

• Follow the sequence of bouffant (hairnet), shoe covers, gloves, and frock.

• If you are only stepping out for a short time reuse the same items.

• If you are carrying something into the cleanroom wipe it down with the presoaked wipes.

• The reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

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CLEANROOM ENTRANCE

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GOWNINGSTEPS

REVERSE THE STEPSWHEN REMOVING THE

APPAREL

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COMMON GOWNING ERRORS

• Hair protruding from bouffant.• Ears not covered.• Open collar on frock.• Gloves rolled up and/or frock sleeves

pulled back from gloves. The gloves should be fully extended up the forearms.

• Once again, the reason for gowning is to expose a minimum of flaking skin, hair, etc. that could harm your work.

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WHITE ROOM

• 4’ Fume Hood

• In process of obtaining additional equipment.– Reactive Ion Etcher– Deposition System(s)

• Will be adding Emergency Eye Wash / Shower.

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WHITE ROOM

Acid

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YELLOW ROOM

• Exhausted Laminar Flow Hood– Photolithography

• Sink, Spinner, Hot Plate, Oven– ISO 5 (Class 100) environment

• Vertical Laminar Flow Hood– MJB 3 Mask Aligner– Microscope– ISO 5 (Class 100) environment

• If the room is occupied use the telephone’s intercomm from the White Room to verify it’s safe to open the door and enter.

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YELLOW ROOM

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PHOTOLITHOGRAPHY

Sink

Spinner

ContaminateWaste

Hot Plate

Oven

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HORIZONTAL LAMINAR HOOD

OLDMask Aligner

Microscope(No DIC)

MJB 3Mask Aligner

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MASK ALIGNER

MUST be trained before use

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MICROSCOPE

MUST be trained before use

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CHARACTERIZATION HALL• X-rays

– Scintag X’trA XRD: powder/low angle– Philips XRD: High Resolution

• Wiring Stations– Ball Bonder– Indium Soldering Station

• Horizontal Laminar Flow Hood– pH– Anodization Station

• Optical Tables (a work in progress)– Mid-IR Photoluminescence

• C-V Analysis• Coming Soon

– FIB– Hall Effect

Page 34: S emiconductor/ P olymer I ntegrated F abrication F acility

X-RAYS

Philips XRD Scintag X’trA XRD

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WIRING STATIONS

MEI 1204B Ball Bonder

Home Built Indium Soldering Station

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pH and ANODIZATION

pH

Anodization

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SOME GENERAL INFO

• You must be trained before using it unassisted.• Clean up and put away.

– Leaving your work area in better condition than you found it is a good habit to develop.

• If you have any doubts or questions, ASK.– Harm to you and / or equipment can result from

improper procedures.

• Using / operating available facilities / equipment is a privilege not a right.– Your privilege can be restricted or revoked if you

refuse to follow accepted practices or rules.

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Some Useful References

• UCLA Nanoelectronics Research Facility– http://nanolab.ucla.edu/new_users.htm– http://nanolab.ucla.edu/pdf/Orient.ppt

• University of California at Berkeley– http://microlab.berkeley.edu/

• Georgia Tech– http://www.mirc.gatech.edu/facilities/

• University of Alabama in Huntsville– http://www.licos.uah.edu/nmf.html

• Cornell Nanofabrication Facility– http://www.cnf.cornell.edu/cnf/– http://www.cnf.cornell.edu/cnf/CNFSafetyManual8.html