Rugged Mini E3 - TangentWith HDD: 1 Grms, 5 - 500 Hz, 0.5 hr/axis Certification CE, FCC Class A Physical Enclosure Materials Extruded Aluminum with Heavy Duty Metal Dimension (WxHxD)

System Processor /ŶƚĞů ϲƚŚ 'ĞŶ ŽƌĞ ŝϳŝϱŝϯ WĞŶƟƵŵ Žƌ ĞůĞƌŽŶ WƌŽĐĞƐƐŽƌƐ System Chipset Intel Q170 Express Chipset Graphics Controller Intel HD Graphics 530 (Core CPU) /ŶƚĞů , 'ƌĂƉŚŝĐƐ ϱϭϬ ;WĞŶƟƵŵ Θ ĞůĞƌŽŶͿ LAN Chipset 1x GbE: Intel I210-AT 1x GbE: Intel I219-LM ƵĚŝŽ Realtek ALC888S System Memory Up to 32GB DDR4 2133 (2x SO-DIMM) BIOS AMI 128Mbit TPM dWD ϭϮ ;/ŶĮŶĞŽŶͿ vPro zĞƐ ;WƌŽĐĞƐƐŽƌ ĞƉĞŶĚĞŶƚͿ tĂƚĐŚĚŽŐ ^ŽŌǁĂƌĞ WƌŽŐƌĂŵŵĂďůĞ ^ƵƉƉŽƌƚƐ ϭΕϮϱϱ ƐĞĐ ^ǇƐƚĞŵ Reset ^ƚŽƌĂŐĞ SSD/HDD 2x 2.5” SATA Bay (Internal) 2x 2.5” SATA Bay (Removable) mSATA Ϯǆ ŵ^d ;ƐŚĂƌĞĚ ǁŝƚŚ Ϯǆ DŝŶŝ W/ĞͿ Z/ ^ƵƉƉŽƌƚ RAID 0, 1, 5, 10 Expansion Mini PCI Express Ϯǆ DŝŶŝW/Ğ ;&Ƶůů ^ŝǌĞͿ SIM Socket 2x External SIM Sockets, 2x Internal SIM Sockets Other ŽŽůŝŶŐ DĞƚŚŽĚ Fanless I/O sŝĚĞŽ 1x DVI-I, 2x DP (Display Port) COM Ϯǆ ϵ ^ĞƌŝĂů Z^ϮϯϮϰϮϮϰϴϱ KDϭ Θ KDϮ Ϯǆ /ŶƚĞƌŶĂů ŚĞĂĚĞƌƐ Z^ϮϯϮϰϮϮϰϴϱ KDϯ Θ KDϰ USB ^ƚĂŶĚĂƌĚ DŽĚĞů Ϩǆ h^ ϥϢ ;Ϧǆ ZĞĂƌ Ϥǆ &ƌŽŶƚͿ Ϥǆ h^ ϤϢ ;&ƌŽŶƚͿ /ŶͲsĞŚŝĐůĞ DŽĚĞů Ϩǆ h^ ϥϢ ;Ϧǆ ZĞĂƌ Ϥǆ &ƌŽŶƚͿ LAN 2x GbE RJ45 WLAN /ŶƚĞů tŝƌĞůĞƐƐ ͲϳϮϲϬ н d ;KƉƟŽŶĂůͿ ƵĚŝŽ ϭǆ DŝĐͲŝŶ ϭǆ >ŝŶĞͲŽƵƚ DIO ϴ /E ϴ Khd ;/ƐŽůĂƚĞĚͿ Other ϭ ǆ WŽǁĞƌ ^ǁŝƚĐŚ ϭǆ ddy ^ǁŝƚĐŚ ϭǆ ZĞŵŽƚĞ WŽǁĞƌ ^ǁŝƚĐŚ ;Ϯ ƉŝŶ WŚŽĞŶŝǆ ŽŶŶĞĐƚŽƌͿ ƵƚŽ ^ŚƵƚͲKī dŝŵĞƌ ;/ŶͲsĞŚŝĐůĞ KŶůǇͿ KƉĞƌĂƟŶŐ ^ǇƐƚĞŵ tŝŶĚŽǁƐ tŝŶĚŽǁƐ ϳ WƌŽ ϯϮϲϰďŝƚ tŝŶĚŽǁƐ ϭϬ WƌŽ ϲϰďŝƚ WŽǁĞƌ WŽǁĞƌ DŽĚĞ ddy WŽǁĞƌ /ŶƉƵƚ sŽůƚĂŐĞ 9-48 VDC WŽǁĞƌ /ŐŶŝƟŽŶ ^ĞŶƐŝŶŐ /ŶͲsĞŚŝĐůĞ DŽĚĞů KŶůǇ WŽǁĞƌ ŽŶŶĞĐƚŽƌ 3-pin Phoenix Connector WŽǁĞƌ WƌŽƚĞĐƟŽŶ KsW ;KǀĞƌ sŽůƚĂŐĞ WƌŽƚĞĐƟŽŶͿ KW ;KǀĞƌ ƵƌƌĞŶƚ WƌŽƚĞĐƟŽŶͿ ZWW ;ZĞǀĞƌƐĞ WŽůĂƌŝƚǇ WƌŽƚĞĐƟŽŶͿ WŽǁĞƌ ĚĂƉƚĞƌ ǆƚĞƌŶĂů WŽǁĞƌ ĚĂƉƚĞƌ ϭϮs Λ ϱ Environment KƉĞƌĂƟŶŐ dĞŵƉ -13°F - 158°F (-25°C - 70°C) ^ƚŽƌĂŐĞ dĞŵƉ -22°F - 185°F (-30°C - 85°C) ZĞůĂƟǀĞ ,ƵŵŝĚŝƚǇ ϭϬй Ͳ ϵϱй ŶŽŶͲĐŽŶĚĞŶƐŝŶŐ Shock With SSD: 50 G, half sine, 11 ms sŝďƌĂƟŽŶ tŝƚŚ ^^ ϱ 'ƌŵƐ ϱ Ͳ ϱϬϬ ,ǌ Ϭϱ ŚƌĂǆŝƐ tŝƚŚ , ϭ 'ƌŵƐ ϱ Ͳ ϱϬϬ ,ǌ Ϭϱ ŚƌĂǆŝƐ ĞƌƟĮĐĂƟŽŶ CE, FCC Class A Physical ŶĐůŽƐƵƌĞ DĂƚĞƌŝĂůƐ ǆƚƌƵĚĞĚ ůƵŵŝŶƵŵ ǁŝƚŚ ,ĞĂǀǇ ƵƚǇ DĞƚĂů Dimension (WxHxD) 9.45" x 10.27" x 3.11" (240 x 261 x 79 mm) tĞŝŐŚƚ ϵϲϭ ůď ;ϰϯϳ ŬŐͿ DŽƵŶƟŶŐ tĂůů DŽƵŶƚ KŶůǇ Warranty Warranty ϭͲzĞĂƌ ^ƚĂŶĚĂƌĚ • /ŶƚĞů ϲƚŚ 'ĞŶ ŽƌĞ ŝϳŝϱŝϯ WĞŶƚŝƵŵ Žƌ ĞůĞƌŽŶ WƌŽĐĞƐƐŽƌƐ • Intel Q170 Chipset • Ϯǆ ϮϲϬͲƉŝŶ Zϰ ^KͲ/DD ƵƉ ƚŽ ϯϮ' • dƌŝƉůĞ ŝŶĚĞƉĞŶĚĞŶƚ ĚŝƐƉůĂǇ • Ϯǆ /ŶƚĞů 'ď ƐƵƉƉŽƌƚŝŶŐ tĂŬĞͲŽŶͲ>E ĂŶĚ Wy • ϰǆ Ϯϱ ^d , ďĂǇ ĂŶĚ Ϯǆ ŵ^d ƐƵƉƉŽƌƚŝŶŐ • ϰǆ &ƵůůͲƐŝǌĞ ŵŝŶŝ W/Ğ ĨŽƌ ĐŽŵŵƵŶŝĐĂƚŝŽŶ Žƌ ĞǆƉĂŶƐŝŽŶ ŵŽĚƵůĞƐ ϰǆ ^/D ƐŽĐŬĞƚ • 4x RS-232/422/485, 6x USB 3.0, 2x USB 2.0 • ϭϲͲďŝƚ /ƐŽůĂƚĞĚ ĚŝŐŝƚĂů /K • ϵ Ε ϰϴs ǁŝĚĞ ƌĂŶŐĞ ƉŽǁĞƌ ŝŶƉƵƚ • ͲϮϱΣ ƚŽ ϳϬΣ ĞǆƚĞŶĚĞĚ ŽƉĞƌĂƚŝŶŐ ƚĞŵƉĞƌĂƚƵƌĞ • ƵƚŽ ƐŚƵƚͲŽĨĨ ƚŝŵĞƌ ;ŝŶͲǀĞŚŝĐůĞ ŵŽĚĞůͿ ZƵŐŐĞĚͲDŝŶŝͲϯͲǀϭ Rugged Mini E3 FEATURES SPECIFICATIONS

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Rugged Mini E3 - TangentWith HDD: 1 Grms, 5 - 500 Hz, 0.5 hr/axis Certification CE, FCC Class A Physical Enclosure Materials Extruded Aluminum with Heavy Duty Metal Dimension (WxHxD)