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High-Frequency Electromagnetics Overview Overview Testimonial Testimonial Challenge Challenge To simulate the effect of a high-frequency (Infra red) plane wave (25-100THz) interacting (both normal and oblique incidence) with a periodic array reflective structure. The physical model size and frequency range said the problem was unsolvable by traditional FEA techniques, which typically require 10 -15 element per wavelength. i.e. At 100 THz, something approaching a 100 million degrees of freedom. Solution Solution ANSYS Multiphysics was used to perform a full wave electromagnetics harmonic scattering analysis on the device. Reflection coefficients were computed in the frequency range of 25 – 100 THz. The analysis took into account the skin depth and loss of RF energy through joule heating of the materials. A fully parametric model enabled rapid changes in materials, geometry and excitation. The numerical problem size was reduced considerably through the use of the periodic boundary condition. Benefits Benefits Provided us with the ability to validate experimental results and quickly improve device performance by investigating various structure parameter changes. The software contributed to a better scientific understanding of experimental results because we could actually visualize the electric field within and around the structure. ANSYS also allowed us to analyze results at discrete frequency points, which will help us to plan future equipment purchases for our experimental work. “We use ANSYS Multiphysics - High Frequency Emag - to better understand the physics behind our research and to choose the optimum device fabrication. ANSYS helps us to analyze different kinds of geometries to achieve the best design performance. Because we are able to simulate many different structures with a parametric model, we are able to save time and money in device development while improving device performance. The electromagnetic support staff at ANSYS have also added significant and prompt advice to help us further our simulation capabilities.” Cynthia Beasley Research Engineer RTI International USA USA RTI is dedicated to improving the human condition through cutting-edge study and analysis in health, environmental protection, education and training, economic and social development, and advanced technology. RTI is fast becoming the world's preferred resource for turning knowledge into practice. This testimonial relates to RTI’s Advanced Imaging Systems group. Exploiting the spectrum from millimeter wave to ultraviolet, RTI scientists and engineers have collaborated with a variety of federal and commercial organizations to develop solutions to high-risk, high-payoff imaging challenges. RTI has the personnel, intellectual property, and facilities to design, develop, and build imaging systems that exploit new technologies such as 3-D integrated circuitry, ultra-high-performance thin-film thermoelectric coolers, hyperspectral imagers and low-temperature cryogenic instrumentation. www.ansys.com ANSYS ® Multiphysics ©2004 ANSYS, Inc. All Rights Reserved. www.rti.org Electron microscope (SEM) image of actual device. FEA model of unit cell (left and analysis results of scattered plane wave.

RTI...the spectrum from millimeter wave to ultraviolet, RTI scientistsand engineers have collaborated with a variety of federal and commercial organizations to develop solutions to

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Page 1: RTI...the spectrum from millimeter wave to ultraviolet, RTI scientistsand engineers have collaborated with a variety of federal and commercial organizations to develop solutions to

High-Frequency Electromagnetics

OverviewOverview

TestimonialTestimonial

ChallengeChallengeTo simulate the effect of a high-frequency (Infra red) plane wave (25-100THz) interacting (both normal and oblique incidence) with a periodic array reflective structure. The physical model size and frequency range said the problem was unsolvable by traditional FEA techniques, which typically require 10 -15 element per wavelength. i.e. At 100 THz, something approaching a 100 million degrees of freedom.

SolutionSolutionANSYS Multiphysics was used to perform a full wave electromagnetics harmonic scattering analysis on the device. Reflection coefficients were computed in the frequency range of 25 – 100 THz. The analysis took into account the skin depth and loss of RF energy through joule heating of the materials. A fully parametric model enabled rapid changes in materials, geometry and excitation. The numerical problem size was reduced considerably through the use of the periodic boundary condition.

BenefitsBenefitsProvided us with the ability to validate experimental results and quickly improve device performance by investigating various structure parameter changes. The software contributed to a better scientific understanding of experimental results because we could actually visualize the electric field within and around the structure.ANSYS also allowed us to analyze results at discrete frequency points, which will help us to plan future equipment purchases for our experimental work.

“We use ANSYS Multiphysics - High Frequency Emag - to better understand the physics behind our research and to choose the optimum device fabrication. ANSYS helps us to analyze different kinds of geometries to achieve the best design performance.

Because we are able to simulate many different structures with a parametric model, we are able to save time and money in device development while improving device performance.

The electromagnetic support staff at ANSYS have also added significant and prompt advice to help us further our simulation capabilities.”

Cynthia BeasleyResearch Engineer

RTI International

USAUSA

RTI is dedicated to improving the human condition through cutting-edge study and analysis in health, environmental protection, education and training, economic and social development, and advanced technology. RTI is fast becoming the world's preferred resource for turning knowledge into practice.

This testimonial relates to RTI’s Advanced Imaging Systems group. Exploiting the spectrum from millimeter wave to ultraviolet, RTI scientists and engineers have collaborated with a variety of federal and commercial organizations to develop solutions to high-risk, high-payoff imaging challenges. RTI has the personnel, intellectual property, and facilities to design, develop, and build imaging systems that exploit new technologies such as 3-D integrated circuitry, ultra-high-performance thin-film thermoelectric coolers, hyperspectral imagers and low-temperature cryogenic instrumentation.

www.ansys.com

ANSYS® Multiphysics™

©2004 ANSYS, Inc. All Rights Reserved.

www.rti.org

Electron microscope (SEM) image of actual device.

FEA model of unit cell (left and analysis results of scattered plane wave.