MEDIA KIT 2010

EST. 1992

The Engineer’s Resource

rtcmagazine.com

The RTC Group905 Cal le Amanecer, Ste. 250, San Clemente, CA 92673

P (949) 226-2000 F (949) 226-2050 www.rtcgroup.com

CONTACTS

editorial

Tom Will iamsEditor- in-Chief(831) 335-1509tomw@rtcgroup.com

Marina TringaliManaging Editor/Ad Traff ic(949) 226-2020marinat@rtcgroup.com

sales

Stacy MannikWestern RegionalSales ManagerP (949) 226-2024C (949) 274-6134stacym@rtcgroup.com

Lauren TrudeauWestern RegionalSales ManagerP (949) 226-2014C (949) 554-9742laurent@rtcgroup.com

Shandi RicciottiEastern RegionalSales ManagerP (949) 226-2000C (949) 573-7660shandir@rtcgroup.com

rtcmk10.indd 3 8/21/09 11:18:17 AM

EDITORIALTECHNOLOGY IN CONTEXTThis sect ion fol lows developments in the technology underly ing the development of embedded systems. I t includes the latest advances in processors, form factors, programmable logic devices and standards. I t a lso covers approaches l ike fault tolerance, system management techniques, hot-swap and thermal management, high avai labi l i ty and safety-cr it ical concerns. Technology in Context focuses on the foundations upon which embedded systems are bui l t .

TECHNOLOGY CONNECTEDToday, the vast majority of embedded devices are connected via some sort of serial l ink or network to other embedded devices, supervisory systems and ultimately to the Internet. The newer, faster serial interconnect technologies l ike PCI Express, USB and RapidIO, to name a few, as well as variations on industrial Ethernet, also interface with legacy technologies such as CAN and ProfiBus, serial interconnects and a host of wireless technologies. These include 802.11, Bluetooth, Wi-Fi and a variety of wireless sensor network technologies. These many technologies and protocols eventually flow into Ethernet and Internet, and the Technology Connected section focuses on keeping our readers informed on the latest developments in connectivity in the embedded world.

TECHNOLOGY IN SYSTEMSPutting together the three major components of any computer-based system—the CPU, the software and the I/O—is often a challenging task, especial ly since the I/O and the software must be specifically tai lored to the needs of the application in combination with the appropriate processor. In addition, there are often other components such as a storage subsystem and display. This activity requires the ful l ski l l of the developer—in evaluating and selecting the components, integrating them electrically and mechanically and in developing and optimizing the application code. This section wil l look at the issues, the techniques and the tools for system development and integration.

TECHNOLOGY DEPLOYEDEmbedded systems operate in an endless var iety of appl icat ions that make dif fer ing demands on their capabi l i t ies and how they are designed and conf igured. Despite that, many of the components, tools and design techniques are simi lar. This sect ion wi l l cover representat ive broad appl icat ion areas and look at the unique problems they pose and the solut ions they offer. Such things as data acquis it ion are integral to a wide range of specif ic appl icat ions as are motor control , machine-to-machine systems, medical devices and many more. Looking at some of the broader issues presented here, readers wi l l be able to get ideas that they can apply to their specif ic needs in bui ld ing that dedicated embedded solut ion.

EDITORIAL CALENDAREvery Issue of RTC magazine contains staff-written and contr ibuted art ic les from leading technology experts and design integrators. RTC ’s staff produces a truly superior product, one that serves a cr i t ical need in the embedded community. Changes in the technology, market and pol i t ical/ legal arenas provide a true opportunity for RTC ’s editors to make real and meaningful contr ibut ions to their community.

Technology in Context Technology Connected Technology in Systems Technology Deployed

JanuaryFPGAs—Is Bigger Always

Better?Wireless Data Acquis it ion

Programmable Automation Control lers

Machine Vis ion in Factory Automation

FebruaryCompactPCI in Control

and AutomationSecurity for Networked Devices—Is I t Possible?

Sleep Modes and Power-Downs: Managing Power

in Smal l Systems

Wireless Networks for Bui ld ing and Faci l i ty

Management

MarchEmbedded Memory

System Options

Supervisory Systems: Br inging the Network to

the Operator

Mechanical Design for Chassis Coding

Machine to Machine Systems Smooth

Transportat ion

AprilPC/104 Derivat ives—This Town Ain’t Big Enough.. .

USB and/or PCI Express?Marrying COMs and

Carr iers—Not Always Made in Heaven

Data Acquis it ion with Smal l Modules

MayDevelopments in

Mult icore ProcessorsEthernet: 40Gbit to

100Gbit to.. .?Integrat ing Touch Screen

and Input TechnologiesGreen Engineering:

Making the Most of Power

JuneLow-Power CPUs Bring Intel l igence into Smal l

Spaces

Using CompactPCI and PXI

Hypervisors and Operat ing Systems for

Mult icoreMotor and Motion Control

JulyMini-, Nano- and Pico-ITX

ModulesMicroTCA in Networks

Embedded Windows vs. L inux

Medical Devices Bui ld on Smal l Modules with Low

Power

AugustBatter ies, Fuel Cel ls and Photovoltaics in

Embedded Design

Sort ing Out GSM, Wi-Fi and Bluetooth

Rugged, Hot-Swappable and Rel iable—Tough

Systems for Tough Jobs

Making Factory Automation Systems

Flexible and Conf igurable

SeptemberVME—Wil l I ts Derivat ives

Prevai l?Options for Industr ia l

NetworksThermal Management in

Tight Spaces

Robotic Systems Combine Sensors, Computer Power

and Motion

OctoberAdvances in Sol id-State

StorageLatest Generat ion PCI

ExpressSystem Monitor ing and

ManagementEmbedded Technologies for the Smart Power Grid

NovemberARM and Power Modules Move in on Appl icat ions

Remote Management and Maintenance

Wearable and Handheld Computers Move into

Special ized Jobs

Box PCs Package Modular i ty, Connectiv ity and Appl icat ion Diversity

DecemberCOMs vs. SBCs—What to

Use and WhenPCI Express over Cable

MicroTCA in Control and Automation

Standards Update: Report on the Most Signif icant

Industry Standards

rtcmk10.indd 38/21/09 11:18:17 AM

CIRCULATION

º mastered circuation

º regional events

º participation with industry exhibitions

º continual circulation development

º most focused, unique circulation in the industry

º readers are most active participants in the industry

º 82% of subscribers have attended an embedded industry conference/exhibition in past 12 mos.

º advertisers come to RTC for assistance in promoting activites through dedicated circulation

circulation:organic, focusedand growing

20,000 print

+ 17,000 digital

37,000 unique industry

professionals every month

Make sure our ads are

seen by these people!

Readers’ End Use Function

Communications12%

Automation& Control

26%

Medical12%Military

12%

Retail/POS12%

Transportation9%

Security15%

Test &Measurement

15%

Other3%

0 5 10 15 20 25 30

Connectivity30%

Signal Processing14%

Blade Server Processing14%

Blade Server Switching10%

Control Functions25%

POS/Retail Terminal22%

Safety/Protection16%

Areas of Engineering Development

0 5 10 15 20 25 30 35

Engineering Manager/Program Manager30%

Hardware Engineer/Designer26%

Business Development2%

Design Team Leader17%

Executive Management19%

Other2%

Job Titles

rtcmk10.indd 3 8/21/09 11:18:17 AM

PRICING

print advert is ing1X 2X 3X 4X 6X 8X 12X 18X 24X

two page spread $6,772 $6,416 $6,030 $5,672 $5,530 $5,275 $5,165 $4,988 $4,630

full page $4,516 $4,278 $4,020 $3,782 $3,686 $3,517 $3,444 $3,326 $3,0882/3 page $4,194 $3,980 $3,737 $3,500 $3,427 $3,307 $3,202 $3,080 $2,9061/2 page $3,012 $2,857 $2,684 $2,566 $2,463 $2,379 $2,300 $2,212 $2,0861/3 page $2,200 $2,086 $1,960 $1,903 $1,796 $1,760 $1,680 $1,588 $1,5231/4 page $1,666 $1,580 $1,485 $1,428 $1,360 $1,309 $1,273 $1,224 $1,155

MATERIAL INSTRUCTIONSAll advert is ing must be submitted as a high-resolut ion PDF (PDF/X-1a). Four-color images must be CMYK; minimum resolut ion 300 dpi; t i f f or eps are preferred; l ine art a minimum of 1200 dpi. Only ful l-page ads require a bleed of 1/8” (4 mm).

Ful l-page l ive area is 1/2” (13 mm) from tr im on al l s ides. For al l other ad sizes, a l l l ive content should stay 1/4” from the edge of the ad space.

Please submit PDFs via The RTC Group’s FTP site: http://upload.rtcgroup.com

AD SIZES

ful l page8-1/2” (216 mm) x11-1/8” (283 mm)

2/3 page7-3/8” (187 mm) x6-3/8” (162 mm)

1/2 page V3-1/2” (89 mm) x9-7/8” (251 mm)

1/2 page H7-3/8” (187 mm) x4-3/4” (121 mm)

1/2 page is land7-3/8” (187 mm) x4-3/4” (121 mm)

1/4 page V3-1/2” (89 mm) x4-3/4” (121 mm)

1/4 page H7-3/8” (187 mm) x

2-3/8” (60 mm)

1/3 page V2-1/4” (57 mm) x9-7/8” (251 mm)

1/3 page H7-3/8” (187 mm) x

3-3/8” (85 mm)

1/3 page square4-3/4” (121 mm) x4-3/4” (121 mm)