Roll-to-roll Sputter Metallizing of Polyimide Film for FCCL · Actual Production Technologies for FCCL · The production of copper foil < 10 mm is complicated and expensive ! Limiting

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Applied Materials Confidential.

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Applied Materials Confidential/Modifier

External Use

Main Color

Palette

R 255

G 255

B 204

R 202

G 222

B 233

Light BackgroundPalette

R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Roll-to-roll Sputter Metallizing of Polyimide Film for FCCL


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Contents

Background HDI

Actual Technologies for FCCL

What is sputtering

Features of sputtered layers

Requirements for a FCCL metallising machine

The metallising process

Peel strength of sputter metallised FCCL


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Background

Electronic Devices of Modern Mobile Phone and Flat Panel Displayrequire Flexible High Density Interconnects - HDI

· This specification requires a new type of flexible copper

clad laminate, FCCL

Characteristics of flexible HDI

Conductor Thickness < 10 um

Conductor Width < 20 um

Conductor Distance < 30 um

Base Material Polyimide Film, Thickness < 40 um


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Flexible Copper Clad Laminate,

FCCL

There are two major types of Flexible Copper Clad Laminates:

This FCCL can be made by electroplating-sputtering

Flexible Printed Circuits are made of semi- finished material:

2 layer, adhesiveless type copper foil--dielectric film =

high tech product

3 layer, adhesive type:dielectric film - adhesive- copper foil =

low cost commodity

COC WEB Sputter Metallizing of FCCL

PI Film > 30 mm

Adhesive » 20 mm

Cu > 20 um

Cu < 10 mm

PI < 40 mm


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Actual Production Technologies for FCCL

3 layer adhesive:

Copper foil “glued” onto a Polyimide film by a dedicated adhesive.

Total thickness > 70 mm --- not suitable for HDI

· Minimum Thickness for both adhesiveless types > 25 mm

· Both adhesiveless FCCL types meets most standard needs

2 layer adhesiveless:

Cast type: liquid PI resin cast on copper foil -- most common

product actually for thin FCCL.

Laminated type: copper foil and PI film merged under temperature

and pressure, sometimes also liquid PI resin as

adhesive


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Actual Production Technologies for FCCL

· The production of copper foil < 10 mm is complicated and expensive !

Limiting factor for further thinning of the FCCL is the copper foil

Cost effective roll annealed, RA, copper foil thickness limited > 10 mm

Copper foil < 10 mm,

Made by thinning of thicker foil by chemical etching

or

made by electrodeposition


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Vacuum Coating - Sputtering

- Simplified Sputtering Principle:

- hold an object above a pot of water

- throw a stone in a pot of water

- the water splashes and wets the object

This is sputtering

- There is a pot of water

Example: how to get water from a pot to an object above the water?

- Sputtering cathode

- PI Film

- Plasma, Ions


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

400 V dc

Inert process gas Argon

Vacuum system

Sputtering pressure 10-3 mbarVacuum

Chamber


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Features of sputtering:

- All metals can be sputter deposited, independent of the melting

temperature

- Sputtered particles have high condensation energy of > 4 eV,

thus having good adhesion

- Sputtered deposited layers have very high uniformity

- Sputtering is a very stable, easy controllable process, excellent for

high production yield

- Sputtering is environmental- friendly, no chemicals are involved !


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

COC Web Sputter Metallizing of FCCL

Drawbacks of Standard Sputter Film Metallizers

One common chamber, unwind, coating and rewind in the same chamber, Þ For loading and unloading the chamber needs to be opened, which

allows lots of particles to be transferred to the deposition area

No provision for plasma pre-treatment of the filmÞ poor copper adhesion as the PI-film surface cannot be activated,

Oil diffusion pumps for high vacuum Þ poor copper adhesion as oil back-streaming contaminates the film

Winding system with more or less vertically arranged rollersÞ Creates pinholes, as particles sticking to the outer area of the film

reel fall on the rollers and are transferred through the system

Insufficiently controlled winding drives (film tension) Þ scratches on the film caused by slip of the rollers


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

COC Web Sputter Metallizing of FCCL

Cross Section of a Standard Sputter Film Metallizer

Winding Section

Re-windingUn-Winding

Sputtering Section

Sputtering Cathode


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Vacuum Coating - Sputtering

Separated winding and coating sections and horizontal winding,Þ no particle transfer through the winding system

Features of a Modern FCCL Sputter Metallizer

Oil free vacuum by turbo-molecular pumpsÞ good copper adhesion as no oil contamination of the film

In-situ plasma film pre-treatment Þ micro-etching of the film surface increases the coating adhesion

Double ended machine, separate loading and unloading of the web reel, coating chamber kept closed for loading and unloadingÞ fully clean room compatible machine design.

Efficient film cooling Þ Permits high deposition rate =coating speed = high productivity


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

2.0 m

Process ModuleUnwind Module Rewind Module

Process module I

Process module II

Process module III

Design of a modern FCCL metallizer



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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Grey room


Design of a modern FCCL metallizer


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

The Sputter- Metallising Process:

- load the film reel and thread the film through the machine

- vacuum pumping for approx. 1 hour

- start metallizing process

- refill chamber with Argon gas to 10 –3 mbar

- start film winding and plasma pre-treatment

- start sputtering of Ni/Cr tie coat and copper seed layer

- process runs automatically controlled until film end

- vent the chamber to atmospheric pressure and unload the

coated film


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

2 Process Modules, 6 Deposition Compartments


Doubling Productivity


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

2 Process Modules, 6 Deposition Compartments SMARTWEB 6 – 400Coating Speed > 6 m/min


Doubling Productivity


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Peel Strength of Sputter- Metallized and Electroplated FCCL

Sample Preparation:

The reported data are gained from the same Kapton E film reel.

The electroplating process and the tests were performed by two

independent third party companies.

Comparable results have been obtained several times.

Sputtering process:

- In-situ plasma pre-treatment (confidential process data)

- Ni/Cr tiecoat 10 nm,

- Copper seed layer 200 nm,

- Film speed 2,6 m/min



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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Peel Strength of Sputter-Metallized and Electroplated FCCL during 7 days @ 150°C


Results Test 1

Electroplating process 1Peel strength : initial: 0.8 N/mm

after 7 days @ 150°C: 0.5 N/mm Electroplated copper 8 mm

Test standard: IPC TM 650

0

0,1

0,2

0,3

0,4

0,5

0,6

0,7

0,8

0 1 3 5 7

days

Peelin

g S

trength

(N

/mm

)


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Peel Strength of Sputter- Metallized and Electroplated FCCL after 7 days @ 150°C


Width of test specimen (mm)

Results Test 2Electroplating process 2Peel strength initially: 1.0 --0.8 N/mm

after 7 days @ 150°C: 1.0 -- 0.8 N/mm Electroplated copper 20 mmTest standard ASTM B 533-85

The two graphs show different measurements


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External Use

R 255

G 255

B 204

R 202

G 222

B 233


R 235

G 169

B 0

R 124

G 165

B 0

R 208

G 0

B 30

Bingo ColorPalette

Main Color

Palette

R 0G 204B 255

R 0G 153B 204

R 0G 51B 102

R 255G 153B 0

R 204G 51B 0

R 162G 0B 108

R 124G 168B 0

Peel Strength of Sputter- Metallized and Electroplated FCCL


- With other samples, tested according ASTM B 533-85 t he copper could not be peeled off,

a 38 um PI film was destroyed partially.

Is this the physical limit of Peeling Strength of copper on PI film?

- Rough results indicated Peeling Strength of approx. 1.4 N/mm.

Documents

Roll-to-roll Sputter Metallizing of Polyimide Film for FCCL · Actual Production Technologies for FCCL · The production of copper foil < 10 mm is complicated and expensive ! Limiting