SuperHydro

RockHydro Preliminary Design Review

Northwest Nazarene UniversityAdvisor: Dr. Lawrence

Chad LarsonBen GordonSeth LeijaDavid VinsonZach ThomasDrew JohnsonSection 1: Mission OverviewPurposeGoalsTheorySuccessBenefitsExpected ResultsConcept of OperationsSection 2: Design OverviewDesign ProcessDesign RequirementsSystem OverviewDesign ViewSuperhydrophobicFlexible ChipsRadiation Hardened ChipsData / SensorsBlock DiagramPrototyping PlanRockSat-C 2012 Users Guide ComplianceShared Can LogisticsTable of ContentsSection 3: ManagementTeam OrganizationBudgetWork Breakdown ScheduleTimelineRisk FactorsSection 4: Conclusions

Table of ContentsStudy the feasibility of using superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.

Test Radiation Hardened chips and new flexible chips with American SemiconductorsMission Overview: PurposeDo research on superhydrophic material that would allow it to be used in future space missions.

Gather data on Radiation hardened chips and to gain experience working with the microchip industry.

Mission Overview: GoalsMission Overview: TheoryWhen water is in contact with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.

For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the superhydrophobic material survived the flight.

Get usable data from the radiation hardened chips

Mission Overview: SuccessThe goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.

This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASAs Reduced Gravity program. NASA would benefit from the data gathered if they decide to use this material on future missions.

Provide data to American Semiconductors about their radiation hardened chips.

Mission Overview: BenefitsMission Overview: Expected ResultsIt is hypothesized that the material will survive the high acceleration and vibrations and still be functional in post-flight testing.

It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.Expected Results

Concept of OperationsRocket Launch/G-switch triggeredTime =1.3 minHeight: 75kmStart of main chip dataTime=2.8 minApogee of FlightBest data on chips gathered

Time= 4.5 minHeight: 75kmMain chip data completeTime=5.5 minChute is deployedTime= 15 minLands in oceanDesign Superhydrophobic EncasementDesign American Semiconductor Board/ Final Design of Plate.Build encasement/Build American Semiconductor board.Implement into PlateTest boardRun full flight test

Design ProcessPhysical Envelope Cylindrical: Diameter: 9.3 inches Height: 4.75 inchesMass Canister + Payload = 200.2 lbfCenter of Gravity Lies within a 1x1x1 inch envelope of the RockSat payload canisters geometric centroid.Design RequirementsA Superhydrophobic donut will be on one plateAlong with that is the Flexible chips attached to small cylinders.The electrical systems will be on another plate above the original plate.System OverviewDesign View

Superhydrophobic donutFlexible ChipsAmerican Semiconductor BoardGeiger CounterSuperhydrophobicDonutA donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.This will be on the lower plate and will be placed around the center support.

Flexible ChipsFlexible Chip CylindersNew flexible chips from American Semiconductors will be placed on different axis to find effects of space travel on them.

American Semiconductors will work with students to design a board which will test their radiation hardened chipsRadiation Hardened Chips

American Semiconductor Board & Geiger CounterTimeRadiation Geiger CounterAmerican Semiconductor data will be stored on a flash memory.Data/SensorsRadiation Hardened ChipFleXClock/SignalPowerMemoryBlock DiagramGeiger CounterBetween now and the CDR, the superhydrophobic enclosure will be in production. The American Semiconductor plate will be fully designed and the actual AVR board will be in production.Prototyping PlanPredicted mass - 10lbUsing Rocksat Workshop Plexiglas plateDiameter 9Height 3 to 4.5

A g-switch will be used for activation

Using deionized double contained water

Users Guide ComplianceWe will share a canister with the RockOn Workshop.We will stay in contact with Colorado via e-mail and keep then updated with our design.We will be using standoffs.Shared Can LogisticsTeam OrganizationElectrical American SemiconductorsDavid VinsonSeth LeijaDrew JohnsonMechanical - SuperhydrophobicBen GordonChad LarsonZach Thomas

BudgetItem

Amount Budgeted ($)

Can

$7000.00 paid by American SemiconductorsSuperhydrophobic Material

Made by NNU for less then $50.00Travel

Funded by Idaho Space Grant

FacilitiesProvided by NNU

Radiation Hardened Chips and ElectronicsProvided by American SemiconductorsWork Breakdown ScheduleElectrical/American SemiconductorsDesignFabricate AVRBuild Mechanical/SuperhydrophobicComplete DesignBegin Fabrication of EnclosurePaint material on interior of donut TimelineComplete design on SH subsystemNov 14Preliminary Design with American SemiconductorsBegin FabricationNov 30Finalized DesignJan 30Complete FabricationComplete FabricationElectrical SubsystemMechanical SubsystemBegin TestingBegin TestingRisk FactorsRisk 1: SH enclosure breaksRisk 2: G-switch fails to start data collectionRisk 3:Malfunction on electrical board.Consequence Risk 1Risk 2Risk 3PossibilityThe main focus before the CDR will be completing the design of the American Semiconductor board and begin the construction of the board.Begin fabrication of superhydrophobic enclosure.Future Work before CDRQuestions?