RFP for Characterization, Test & Evaluation Of Solid State ... · of FM & QM X-Band Solid State Power Amplifiers (SSPA) as per the details given in this RFP and complying to the R&QA

SAC/MRSA/RFP/Aug’18/SSPA V1

1

RFP for

Characterization, Test & Evaluation

Of

Solid State Power Amplifiers (SSPA)

Space Applications Centre

Indian Space Research Organization

Ahmedabad, Gujarat, India


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Contents

1. Introduction ................................................................................................................................... 3

2. Scope of Work ............................................................................................................................... 3

3. Deliverables ................................................................................................................................... 4

4. Delivery Schedule and Payment Terms ...................................................................................... 4

5. Milestones / Status Reviews .......................................................................................................... 5

6. Proprietary Rights ........................................................................................................................ 5

7. Guidelines to Vendor .................................................................................................................... 5

8. Vendor Evaluation Criteria ......................................................................................................... 6

Annexure A: General Description .......................................................................................................... 7

Annexure C: List of FIM ...................................................................................................................... 13

Annexure D: R&QA Requirement........................................................................................................ 14


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1. Introduction

Under Indian remote sensing program by ISRO, SAC is developing various microwave

payloads. Under this development activity, we are in process of developing X-Band Solid State

Power Amplifiers (SSPA).

SAC has plan for indigenous development of X-band SSPAs, wherein SAC would provide

the hardware and Test & Evaluation (T & E) would be done through Indian industry.

2. Scope of Work

The overall scope of this contract involves characterization and Testing & Evaluation (T & E)

of FM & QM X-Band Solid State Power Amplifiers (SSPA) as per the details given in this

RFP and complying to the R&QA requirements given in Annexure D.

SSPA is comprised of two separate mechanical packages (namely, RF-Tray 1 & RF-Tray 2).

All components required for assembly of RF-Tray 1 & RF-Tray 2 will be delivered to the

vendor along with Electronic Power Conditioner (EPC) as Free Issue Material. RF Harness

(i.e. semi-rigid RF cables) to be used between RF-Tray 1, RF-Tray will also be provided as

FIM. The SSPA hardware & EPC together (RF-Tray 1+RF-Tray 2+EPC) will be treated as

“Device under Test” (DUT) for this RFP. Vendor has to characterize the DUT as per this RFP

along with Testing & Evaluation (T & E) as per R & QA requirement given in Annexure D.

The scope of work is broadly listed below:

Sr. No Activity Responsibility

1 Delivery of FIM in batches SAC

2 Incoming Inspection of FIM on receipt & report to SAC Vendor

3 Compatibility of Carrier Plates (bare, without gold

plating) with MIC substrates & bare Aluminum package

Vendor

4 Surface treatment (gold/silver plating and black thermal

paint)

Vendor

5 MIC attachment to carrier plates & component mounting

& assembly

Vendor

6 Mechanical assembly in package, interconnection &

DC/RF Harnessing

Vendor

7 Electrical Tests & Performance Optimization using RF

absorber and gold ribbon tuning

Vendor

8 Temporary Cover Closing & Temperature Cycling Test Vendor

9 Temperature Operating Test Vendor

10 LP application wherever required Vendor

11 Phase shift characterization Vendor

12 Cover closing after results review Vendor with SAC’s

approval

13 Test & Evaluation Vendor

14 Delivery of DUT with Test Report Vendor

2.1 Procurement of materials and inspection

Procurement of consumable materials such as RTV, Conductive/Non-conductive Epoxies

(Cho-bond), gold ribbons, mounting screws, washers and other tools for mechanical assembly

related activities etc.as per requirements given in Annexure D.


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2.2 Processes

Following processes are involved:

a. Attachment of Alumina MICs to carrier plates

b. Attachment/mounting of SMD components like SLCs, Chip Resistors, Chip

Terminations, Cu-magnet wires etc on MIC/PCB.

c. RF & DC interconnection

d. Surface Treatment – gold plating on Al6061 package, Kovar & Cu-Molly carrier plates

e. 5/10/20 mil gold ribbon bonding from MIC substrates to components.

f. RF absorber & EMI Gasket Mounting on Al alloy cover

g. RTV application wherever required in integrated package

The processes to be used in this activity is listed in the R & QA Annexure (Annexure-D).

3. Deliverables

Sr. No Items

1 Flight Model (FM) SSPAs

2 Qualification Model (QM) SSPA

3 Data Package

4. Delivery Schedule and Payment Terms

Table 1: Delivery Schedule

Sr. No. Delivery Schedule Activities to be completed / Units to be

delivered

01 T0 PO Placement

02 T1=T0 + 2 weeks Submission of BG by Vendor

03 TFM_OUT1: TFM_IN1 + 7 weeks Delivery of 4 FM units

04 TFM_OUT2 = TFM_IN2 + 5 weeks Delivery of 4 FM Units every 5 weeks

05 TQM_OUT: TQM_IN + 20 weeks Delivery of 1 QM Units

Where, TFM_IN1: Delivery of 1st batch of FIM for FM Units

TFM_IN2: Delivery of 2nd batch of FIM for FM Units

TQM_IN: Delivery of FIM for QM Unit

Note:

I. Sr. No. 04 of Table 1 could be a repeat activity depending on the total no. of units to be

delivered as per PO.

II. Typically, a single batch for FIM will cater to 4 FM units. However, if the batch size <

4 FM units, vendor has to deliver the available units within the schedule given in Table

1 and if the batch size > 4 FM units, vendor has to maintain the above delivery schedule.

III. Delivery schedule is utmost critical and compliance to the schedule is essential.


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5. Milestones / Status Reviews

The pre-requisite for this activity is qualification and line certification of the assembly

line & the operators and implementation of QA approved PID.

Test Setup review and approval by SAC.

A Test Result Review shall be conducted after the first batch of SSPAs are ready for

dispatch.

6. Proprietary Rights

Vendor is required to have a non-disclosure agreement with SAC. The developed designs and

product will be the property of SAC and shall not be provided to third party without prior

written permission from competent authority of SAC.

7. Guidelines to Vendor

The Vendor should be an Indian company with their fabrication and test facilities in

India.

The vendor shall examine the whole RFP thoroughly and offer point-by-point

compliance matrix indicating clearly the parameter/specification in tabular format for

their offer. In case of non-compliance, the deviation from the specified parameter shall

be furnished.

Vendor must quote for all the requirements specified in the RFP for offer consideration.

It is necessary for the vendor to furnish complete information as required in the scope of

RFP for proper evaluation and assessment of the proposal.

The vendor may seek clarifications, if any, in advance before submitting the quotations.

Vendor shall quote in two parts:

PART-1: “Detailed Technical Proposal” giving all details as per the specifications.

Vendor should also provide the commercial itemized quote masking the pricing

information along with Part-1.

PART-2: “Commercial Proposal” giving cost, payment terms and other financial

details. Part-2 must be submitted in a separate sealed envelope. This requirement shall

be strictly adhered to.

Bidders should upload detailed/itemized break-up of price quoted as an attachment under

the link “Documents submitted by vendor (Price Related)” in the following format. No

Price details should be submitted under technical envelope. However, unpriced copy of

the itemized list also shall be uploaded with the technical documents. This requirement

shall be strictly adhered to.

Table 2: Quotation Format

Sr. No. Description Qty Unit Cost

01 FM units of X Band SSPA as per RFP 5-8

9-24

25-40

02 QM unit of X Band SSPA as per RFP 1

2-3


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For price comparison, the total cost of “24 FM Units and 1 QM Unit” ONLY will

be considered and L1 price will be obtained.

The purchase order will be split between two vendors, in the ratio of 60:40, with

vendor with L1 quote getting 60% of total quantity and vendor with L2 quote

getting 40% of total quantity, provided vendor with L2 quote accepting the L1 offer,

when asked for. If vendor with L2 quote does not accept the offer, then purchase

order for full quantity will be placed on vendor with L1 quote.

As the purchase order will be split to two vendors, order for 1 QM unit will be

placed to each vendor.

Vendors may be asked to take part in Technical Discussion during technical bid

evaluation, whenever deemed necessary, by SAC.

The vendor must ensure that the quotation along with all the required details reaches

SAC/ISRO before the due date.

Vendor should clearly indicate ordering information (order to be placed in favour of,

component’s part no. & other relevant information.

8. Vendor Evaluation Criteria

It is mandatory that the vendor’s MIC and PCB assembly lines as well as manpower

should have valid certification from ISRO, at the time of bidding.

Vendor must have prior experience of Fabrication, Assembly, Test & Evaluation of

flight-worthy (FM/QM) RF Subsystems.

Vendor must have sufficient technical expertise of optimization and testing of high

power RF subsystems specifically and pulsed in general. In this context, vendor has

to provide details of similar contracts executed in the last 5 years.

Vendor should preferably have vacuum compatible high power test accessories like high

power Couplers, Attenuators, Loads, RF Cables etc and RF instruments with Pulsed

measurement capability.

Vendor is required to provide the details of the available test equipment like, make, brief

specifications, year of procurement, number of equipment, etc.

Based on the details provided by the vendor, SAC will assess the capability of the vendor

to take up this work. Decision of SAC will be final in this regard.

SAC/ISRO reserves the right to visit & audit the facility at vendor site for vendor

capability evaluation before PO placement.

Vendor must provide the project execution with reference to proposed schedule in terms

of available resources like certified manpower, testing infrastructure, usage of external

agencies for testing etc.

All the required test facilities should preferably be available with the vendor. However,

if vendor proposes to use external test facilities, a letter of consent from the external

vendor must be produced at the time of bidding. Vendor shall also bring out its impact

on schedule.


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Annexure A: General Description

A1. Feeder SSPA Block Schematic & Specifications

The major specifications of the SSPA are given in Table A1:

Table A1: SSPA Specifications

PARAMETER SPECIFICATION

Frequency 9600 ± 300MHz

Phase control 6 bit, 360° in steps of 5.625°

RMS Phase Setability Error <5.625°

Input Power 0 dBm (nom.)

Peak Transmit Power 54 dBm (250 Watts)

Transmit Pulse Duration 40µs (max)

Transmit Duty Cycle 22% (max)

O/P Power Flatness ± 0.5 dB for 300 MHz Bandwidth

± 1 dB for 600 MHz Bandwidth

O/P Power Variation over Temp. (-15oC to

55 oC) ± 0.75 dB w.r.t. ambient

Input Return Loss -10 dB

Total DC Power with EPC 350W

Harmonic Rejection -20 dBc

Out-of-Band Spurious -50 dBc

Figure A1: Tentative Mechanical Hardware of SSPA Tentative Dimension: 250 X 200 X 65 (in mm)

Approximate Weight: 2 Kg


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A2. EPC Specifications

Table A2: EPC Input Specification

PARAMETER SPECIFICATION

Input Raw Bus Voltage

Vmin: 34.45 V

Vnominal: 40 V

Vmax: 41.55 V

Input Average Current 12 A (max.) at Vmin

10 A (max.) at Vmax


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Annexure B: Functional Testing

The scope of work is listed as follows:

EPC will be provided at the time of IBT of T & E; entire T & E has to be carried out for

the (SSPA+EPC) combination.

Typical test plan is provided in following sub-sections. However, the exact test parameters

as well as the test conditions will be specified at the time of execution of this contract.

Vendor must provide detailed Test set-up along with instrument details for testing of

SSPA; the set-up has to be approved by SAC. These details must be provided by the vendor

along with the technical bid.

B1. General Guidelines

1. Vendor has to test the SSPA as per specifications given in Table A1 and test plan given

in para B3. Unless specified, all the tests as per para B3 are to be carried out at nominal

input power level (refer Table A1 of Annexure A).

2. The Test Setup shall be able to run through the test plan under pulsed condition with

selectable PRF.

3. Test data provided should comprise of plots, Microsoft Excel spreadsheets or any

spreadsheet software, e.g. open-office with all the necessary annotations. Test Results

to be compiled by vendor in formats of SnP / CSV, plots and images in jpeg.

4. Vendor shall compile the summary of the test results in a format approved by SAC for

each unit.

5. Modifications in the specifications, assembly and test plan, if any, along with the

required data format will be given by SAC at the time of PO placement.

B2. Test Setup Interface

One SSPA with its power supply is defined as one DUT as shown in Figure B1. The test setup

shall be controlling the DUT.

SSPA

EPC

Test S

et-u

p (TS

)

Figure B1: Integrated SSPA Test Setup


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B3. Test Plan I/O test

S Parameter Measurement

Input Level Tx input: 0 dBm

Phase control 0 deg

On a pulsed VNA, Pulsed Sij parameters with above conditions are to be recorded over 600

MHz bandwidth around 9600 MHz for at least 61 points. Data is analyzed to calculate Power

Gain and Input Return Loss.

Flatness, Peak Output Power & Droop Measurement

RF Input Level 0 dBm

Phase control 0 deg setting

Output is to be observed on a Peak Power Meter and the following are to be recorded

Peak Power

Power Droop

Pulse profile plot

The above measurements are required over 600 MHz bandwidth centered around 9600 MHz

in 100 MHz steps.

Input Power Sweep Measurement

RF Input Power -20 dBm to +2 dBm


Peak output Power is to be recorded. The above measurements are required over swept input

power levels of -20dBm to +2 dBm in 1 dB steps and at 7 points around 9600 MHz over 600

MHz bandwidth.

Harmonic Level & Out of Band Spurious Measurement

Out of band Spurious search up to 18 GHz.

Input Level Tx input: 0 dBm at 9300, 9600 & 9900 MHz


Phase Control Characterization

Phase shifter is to be varied through all the 64 states and both "Phase & Magnitude" for all the

pulsed S-parameters need to be recorded. S21 data is to be analyzed to estimate RMS Phase

setability Error & RMS ∆A with 64 phase states over the frequency band. The above

measurement is required over at least 7 frequency points over the bandwidth of 600 MHz

around 9600 MHz.

From the above measured S parameter data following are to be calculated:

RMS Phase Setability Error (Tx Path)

RMS Gain variation with Phase control (Tx Path)


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B4. Non-Operating Temperature Cycling Test

After performance optimization and temporary cover closing, the DUT shall undergo

temperature-cycling test under non-operating condition as per the profile given in Figure B2.

B5. Temperature Operating Test

Before final cover closing & stacking, the DUT is to be tested in a thermal chamber as per

following profile (Figure B3):

Temp. transition rate of 10C/min is

to be followed for this test.

Following parameters are to be

recorded during the measurement

slot:

Output Power (dBm) from 9.3

to 9.9 GHz at 7 equidistant

frequency points.

Out of band spurious at 9.3, 9.6

& 9.9 GHz

Harmonic Level at 9.3, 9.6 &

9.9 GHz.

Note:

1) This test may be continued with the above thermal cycling test.

2) Vendor has to test the DUT with values of DC Bias Voltages as defined by SAC.

B6. Phase Shifter Control Characterization Data for LUT generation

After successful TOT, final cover closing of RF-Tray 1 & RF-Tray 2 will be carried out and

both the trays will be stacked as per SAC approved drawing. Subsequently, the SSPA

Characterization data (S-parameters for each of the 64 phase states) shall be acquired and

Figure B2: Non-operating Temp. Cycling Profile

Figure B3: Operating Temp. Cycling Profile


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recorded, in 5°C steps over -15 to +55°C, for generating the Look Up Table. Characterization

data shall be collected twice and verified for repeatability, before proceeding for next

temperature. The Test Setup shall generate Look Up Table from the above collected data of

each of the SSPAs as per format provided by SAC. This data has to be captured in 5 set of

input power levels, details of which will be communicated at the time of execution of this

contract.

Note: 1. The Test Setup shall be able to de-embed test accessories connecting the DUT over the

complete DUT operating temperature range. The final Look Up Table should be with

deembedded values.

2. Figure B4 represents the temperature profile for the Temperature operational test.

Fast Ramp Rate (for transitions from 250C to -150C & 550C to 250C): 10C/min Slow Ramp Rate (for transitions in 50C steps): 0.10C/min

Figure B4: Temp. Profile for TOT


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Annexure C: Component & Material List

Table C1: List of Components & Material per SSPA

List of FIM

Sr. No Component Qty/unit FIM (Y/N)

1 Carrier Plates 30 Y

2 Patterned MICs (Alumina) 40 Y

3 FR4 PCB 3 Y

4 SLC Capacitor 70 Y

5 EMI Line Filters 20 Y

6 Chip Resistors 15 Y

7 Chip Terminations 6 Y

8 Cu-magnet Wire (24, 28, 32 Gauge) - N

9 Thermopad 2 Y

10 Drop-in Isolators 3 Y

11 SMD Resistors 80 Y

12 SMD Capacitors 80 Y

13 CKR type Capacitors 20 Y

14 SMA Connectors 3 Y

15 Sub D Connectors 3 Y

16 Multi-pin Header 1 Y

17 EMI Gasket - Y

18 Ground Lug 20 Y

19 PGS Sheet - Y

20 RF Active Devices 9 Y

21 Digital ICs 2 Y

22 Power MOSFETs/BJTs 10 Y

23 Diodes 20 Y

24 Thermisters 2 Y

25 RF Absorber - Y

26 Semi-rigid RF Cable 1 Y

27 Polyamide Wires - N

Note: FIMs will be given in batches. The maximum value of FIM given at any point of time

will be 50 lakhs.


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Annexure D: R & QA Requirement

Para No. Requirements Vendor’s

Compliance

1.0 INTRODUCTION: This section describes the Reliability and Quality Assurance requirements

to be followed by Vendor during optimization & testing of ordered

subsystems.

Mandatory requirements: It is mandatory that ISRO qualified PCB, MIC

(25 mil Alumina) fabrication and assembly process line of the vendor

including fabricators & inspectors shall have valid qualification status at

the time of bid. Necessary certificate shall be attached along with the quote.

SAC may visit the vendor facility to access their capability after receiving

the quote.

Vendor shall have capability in terms of SAC/ISRO qualified fabrication,

test and storage facilities as well as necessary technical expertise to build,

optimize, test and deliver the high reliability product including test

engineers.

2.0 APPLICABLE DOCUMENTS:

Following reference documents are applicable during realization of the

hardware.

ISRO-PAS-100

Issue-3, Nov

2012

Non-conformance control requirements for ISRO

projects

ISRO-PAS-201

Issue-3, Nov

2012

Failure Reporting, Analysis and corrective Action

procedures

ISRO-PAS-202,

Issue 2, Aug

2014

Environmental Test Specification Requirements for

ISRO Space craft

ISRO-PAS-207 Storage, Handling and Transportation requirements for

Electronic Hardware

ISRO-PAX-300

Issue-5, Nov

2012

Workmanship Standards for the Fabrication of

Electronic Packages

ISRO-PAX-305 Qualification requirements and Workmanship Standard

for Microwave Integrated Circuits (MIC)

MIL-STD-461E Requirements for the control of Electromagnet

Interference Characteristics of Subsystems and

Equipment

3.0 OPERATING CONDITION FOR ACTIVE COMPONENTS:

The electrical designs are made compliant to the SAC derating

requirements. During optimization the electrical operating conditions of

active devices shall be selected such that junction/ channel temperatures of

all solid-state devices shall not exceed +110ºC for GaAs and 150 0C for

GaN (or Tj max-75 °C, whichever is lower) under nominal operating (RF


15


Compliance

ON in case of RF active components) and worst case environmental

conditions.

4.0 ENVIRONMENTAL SPECIFICATIONS

4.1 Non-Operating Environment:

The units are designed to withstand following environmental conditions: a) Temp. Range : - 40oC to +70oC

b) Pressure : Ambient and hard vacuum better than 10-6 torr.

c) Relative Humidity : Up to 95% without condensation of water at +40oC

(Applicable for storage on ground only)

4.2 Operating Environment:

The unit is designed to meet all the performance requirements as given in

electrical specifications under the following environmental conditions:

a) Temp. Range:

i) Flight Acceptance : -10C to +50oC

ii) Proto Flight / Qualification : -15oC to +55oC#

# Tentative; to be finalized during PO placement

b) Pressure: The unit shall be capable of operating and compliant to the

specifications at ambient pressure as well as vacuum level of 10-5 torr

and hard vacuum of the order of 10 -13 torr.

4.3 EMI / EMC :

EMI / EMC requirements of MIL-STD-461E (Test applicability is shown

in Table – D1)

Unit shall meet be tested for Conducted susceptibility and Radiated

Susceptibility requirements of MIL-STD-461E. Further test conditions

TBD.

4.4 Space Radiation:

Radiation shielding shall be carried out by the vendor as per SAC approved

drawing.

5.0 Incoming inspection of FIM form SAC:

All the active & passive electronic parts, Materials and hardware shall be

subjected to incoming visual inspection, in as received condition.

Traceability shall be maintained from incoming inspection to the final units.

Regarding the active components in bare die version, visual inspection shall

be carried out just prior to the assembly in the module.

Any defect / damage observed during visual inspection shall be informed

to SAC.

6.0 MATERIALS:

Vendor shall ensure to use ISRO approved / qualified materials for

fabrication & rework. Procurement of fabrication materials shall be done as

per SAC Approved Materials List (DML). Vendor shall review & clear

Material Test Report (MTR) & CoC of the manufacturer. Non-metallic

materials shall have a Total Mass Loss (TML) of less than 1% and

Collectable Volatile Condensable Materials (CVCM) of less than 0.1%

when subjected to a test condition of +125ºC and 1x10-06 torr pressure for


16


Compliance

24 hours. If CoC contains outgassing parameters, then separate test not

required. All inspection and clearance records for the materials shall be

maintained by the vendor.

Materials list consisting of the name of vendor, shelf life, qualifying agency,

location of application in the sub-systems shall be submitted to SAC for

approval.

All the materials shall be used within their shelf life.

7.0 PROCESSES:

ISRO-PAX-300 / 305 workmanship standards shall be followed for the

fabrication work/rework. All electronic fabrication processes shall be ISRO

qualified. Similarly, whenever required the processes used for surface

treatment shall also be ISRO qualified. All the processes shall be carried

out in accordance with PIDs reviewed by QA-SAC.

The following processes are likely to be used for fabrication/rework of unit.

1. Attachment of Alumina MICs to Kovar carrier plates

2. Attachment of Alumina MIC on Cu-Molly CP

3. Attachment/mounting of SMD components like SLCs, Chip

Resistors, Chip Terminations, Cu-magnet wires etc on MIC / PCB

& CP.

4. RF & DC interconnection

5. Surface Treatment – Gold plating on Al 6061, Kovar & Cu-Molly

6. 5 / 10 / 20 mil gold ribbon bonding

7. Fabricated CPs / PCBs assembly in RF tray

8. Cu enamel wire soldering on Substrates & PCB

9. Local potting & araldite application wherever ever required as per

SAC approved location diagram

10. Test harnessing external D connector

11. CHO bond – 1075 application on RF connector, if required

12. Gasket & microwave absorber attachment as per SAC approved

drawing

13. SR cable assembly

In case of processes qualified by other agencies, process qualification

reports shall be submitted to QA SAC for review. After review of previous

qualification plan, SAC will decide for requirement of full qualification /

delta qualification of such processes.

Assembly / Rework work shall be carried out on ISRO qualified fabrication

line by ISRO certified operators. In case, where consistently poor

workmanship is observed, Verification of the Process Qualification (VOQ)

/ operator re-certification shall be carried out at the discretion of SAC.


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Compliance

It is mandatory that all processes listed above shall ISRO qualified at the

time of submission of BID, except following two process - which shall have

to be qualified prior to starting of work as per this RFP.

1. Alumina attachment to Cu-Molly CP

2. Gold plating on Cu-Moly CP

Vendor to provide qualification status of all above 13 processes.

8.0 FABRICATION DOCUMENTATION:

All the activities involved during optimisation and Rework of FM units

shall be addressed in this sheet. Vendor shall prepare sheet / document,

identifying all the activities, methods / procedures & inspection check

points that will be followed during the fabrication activities.

For traceability of fabrication/assembly/testing activities, Vendor shall

maintain, a history sheet for each unit, where-in all the activities and QC

inspection comments are logged. This shall include any non-conformance

reported by QC and its close out, if any.

Work flow: A work sequence detailing each step of handling, optimisation, rework and

testing shall be jointly worked out before start of work.

(a) Name of processes and PID numbers.

(b) Permanent/Temporary torque values.

(c) Specific instructions, caution notes etc.

9.0 QUALITY CONTROL (QC): Vendor’s in-house Quality Control (QC) shall carry out 100% inspection of

all the units in as received conditions. Non Conformance, if any, shall be

reported to SAC immediately. In case of ribbon bonding required during

optimization / rework, such bonds shall be tested for NDT on 100% bonds.

QA Audit:

The QA audit shall be carried by QA SAC on vendor QC accepted hardware

from both electronic & mechanical point of view at various stages of

hardware realization. Following may be noted.

The frequency for QA audit shall be decided by SAC and intimated to

the Vendor.

Audit shall cover Electronic & Mechanical aspects for the following,

a) Surface finishing (plating / painting)

b) Wired Substrate / PCB

c) Packaging & fixing of cards/ substrates/ connectors & internal

harness

d) Integrated package level.


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Compliance

SAC shall audit all related facilities, Fabrication processes, cleanliness

records, overall documentation, parts & materials evaluation/test

reports, etc.

The Vendor shall generate close outs of discrepancies observed during

audit and submit the same to QA-SAC for review and acceptance, stage

wise clearance shall be given by QA SAC.

Virtual Audit (Online / Photographic & Documentation): Based on

confidence level build-up on fabricated hardware, SAC may opt for

virtual audit of hardware, provided vendor facility, process line, their

quality system, etc. found satisfactory.

10.0 STORAGE and TRANSPORTATION

Storage of hardware, parts & materials: Storage of fabricated hardware, parts & materials shall be done as per

ISRO-PAS-207. Active & Passive Component shall be stored in controlled

area environment under Class 100,000 clean room with round the clock

controlled temperature (22±3ºC) & humidity (45 to 55% RH). Parts shall

be stored in such manner as to prevent damage due to undue stresses. ESD

protection care shall be taken while receiving & issue of components. A

manufacturer instruction for storage & handling of parts shall strictly be

followed during the storage. Dry N2 (Nitrogen) purged packaging and

storage cabinets shall be used for storage of critical components like MMIC

bare dice and oxygen sensitive items like PCBs / mechanical hardware.

Transportation:

Suitable packing (as specified in ISRO-PAS-207) shall be provided for the

transportation of the unit by air or road without any degradation / damage.

Each unit shall be packaged in individual ESD protective packaging and

protect the unit from environmental conditions encountered during

transportation, like heat, humidity & dust. This individual container shall

then be placed in a transportation container. More than one individual unit

may be placed in the transportation container. The transportation container

shall protect the units from heat, humidity, dust, mechanical shock &

vibrations during transportation.

The individual unit packages and transportation containers shall be clearly

marked with following instructions along with other mandatory markings.

“ESD sensitive units”

“To be opened only under clean environment with ESD

precautions”

“High reliability space usage systems”

11.0 Test Applicability: All FM units shall undergo Acceptance level T&E and ONE unit identified by

SAC shall be subjected to QM level tests. Applicable tests for QM and FM are

given in Table-D1 below.


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Compliance Table – D1 : Tests applicability

Sr.

No.

Test QM (if

applicable)

FM

1 Visual Inspection X X

2 Initial Bench Test (IBT) X X

3 Burn-in-Test X

(168Hrs)

X

(168 Hrs)

4 Post Burn-in electrical tests X X

5. Temperature tests

a) Storage temperature (hot & cold) X -

b) Humidity Storage X -

c) Temp. operational test X -

6. EMI / EMC

CE102, RE102, RS-103 (@5V/m) X X

CS-101 (up to 1 Vrms)

CS-114 (curve3)

CS-115, 116 (Imax=5A)

X -

7. Sine Vibration X -

8. Random Vibration X X

9 Thermo-Vacuum test X X

10 Mechanical Shock X -

11 ESD test

Radiated Field (7 KV, 1pps, 30

pulses) X -

Single Point Discharge (5 KV, 30

pulses, 1 pps) X -

Structural Current ( 5KV, 1pps,

30 pulses) X -

12 Life Test X

(2000Hrs) -

13 Final Bench Tests (FBT) X X

14 Final Visual inspection X X

Requirement of QM will be decided at the time of placing order

Note:

1. ‘X’ denotes applicability of test.

2. At the end of each environmental /mechanical test, visual

inspection and electrical performance check shall be carried out.

3. Vendor shall send the Test data to SAC for review & clearance

for next test.

4. Buffer connectors suitable for mating with FM hardware, shall be

provided to protect input / output connectors of the device from

wear and tear due to mating / de-mating with other connectors


20


Compliance

during testing. Record of number of time mating / de-mating of

connectors shall be maintained.

12.0 Failure:

Deviation from the agreed electrical specifications shall be treated as non-

compliance, and as cause to reject the units.

Any failure observed at any stage during testing shall be reported to SAC

immediately. This shall be followed by detailed failure analysis, clearly

identifying the cause of failure; random or design related, handling or test

induced etc. Based on analysis, further action shall be decided. In case of

mechanical or electrical failures; a retest plan or modification in the test

plan shall be decided and implemented after approval by SAC. This may

include re-qualification of process or the unit / Proto flight level testing.

13.0 TESTS:

All the specification requirements of this RFP shall be verified by testing.

Vendor is required to generate test procedure, clearly showing test set-up

and connection details including grounding as well as details of ATE. This

test procedure shall be sent to SAC for review & clearance. Testing shall be

done as per SAC approved test procedure using calibrated test & measuring

instruments. It is preferred that cable types used by the vendor for

harnessing during testing shall be similar or very close to cable type to be

used in harnessing of FM unit in the Space craft.

Acceptance of the test set-up shall be done jointly by SAC and vendor

before the testing of the QM & FM units. This will include verification of

control software of ATE. This shall also be audited, during the testing

activity. Vendor shall inform the readiness of the test set-up as well as the

schedule well in advance. Grounding scheme will be provided by SAC.

Representatives from SAC may participate in the testing.

Input level required for testing need to be as per specified by the SAC.

(a) Measurement Accuracy:

The measurement accuracy, calibration, etc. of the test instruments shall be

verified and the factors shall be stated in the test plan and procedures

document submitted by the vendor. All test & measuring instruments / unit

shall have valid calibration status at the time of testing.

(b) Temperature Stabilization:

Temperature stabilization shall be considered achieved when all the

temperature readings are within 3 C of the specified temperature for at

least three consecutive readings taken at ten minutes intervals.


21


Compliance

(c) Maximum Allowable Tolerance in Test Conditions:

Parameter Tolerance

Temperature

1C Amb. Pressure

3C under vacuum

Atmospheric Pressure

Greater than 0.1 Torr

Below 0.1 Torr

5%

50%

Relative Humidity 5 %

Acceleration 10%

Sine Vibration

Frequency

Amplitude

Sweep rate

Time

2% above 25 Hz & 0.5 Hz below 25 Hz

10%

5%

1%

Random Vibration

Power Spectral Density

Overall grms

Duration

1.5 dB for 20-300 Hz & 3.0 dB for 300-

2000 Hz

10%

+10% / - 0%

Mechanical SRS

Amplitude

-3dB / +6dB

NOTE: The instruments shall be capable of measuring at least 10 times

better than tolerance limits.

14.0 TEST CONDITION & DETAILS: Following paragraphs give details of various tests to be performed on QM

/ FM units. Electrical test shall be carried out within 96 hours after

completion of each environmental test. The test parameters to be measured

during / after each of following test are given in Sub-Annexure D1. for

qualification unit and Sub-Annexure D2 for Flight unit. External visual

inspection shall be conducted after each environmental test.

14.1 Visual Inspection & Electrical test:

All the units shall be examined visually at 10 X magnification before and

after each environmental test. The units shall be inspected for surface

finish, plating, mechanical and workmanship related defects.

14.2 Electrical Test (IBT): This test shall be performed to verify compliance to all the electrical

parameters and will be taken as reference for all subsequent tests.

Electrical parameters shall be measured as specified. The electrical

parameter measurements, and DC current shall be measured at Minimum,

Maximum and Nominal input DC voltages as defined in EPC specifications

of this document.


22


Compliance

14.3 Burn-In Test

Burn-in shall be carried out at maximum Operating Temperature for

QM/FM unit, as specified in this annexure. Unit shall be in power ‘ON’

condition. The duration of Burn-in shall be 168 hrs for all units. Data log

for Time-Temperature shall be kept for verification.

14.4 Post Burn-in Electrical Test:

This test shall be conducted at ambient temperature. Electrical parameters

shall be measured during Post burn-in functional tests.

14.5 Temperature storage test:

Temperature storage test is applicable to QM only. The unit shall be

subjected to minimum storage temperature for 24 hours. After this storage,

electrical and visual inspection shall be performed.

The test shall be repeated for maximum storage temperature. Units shall be

in non-operating conditions for the storage duration.

Visual inspection shall be performed after the test. Pre and post electrical

measurements shall also be carried out outside the chamber.

14.6 Humidity Test: This test shall be conducted on QM units as per the following conditions

Humidity : 95 % RH

Temperature : 40 0C

Duration : 24 Hrs.

After the humidity test, unit shall be visually inspected. There shall be no

visual defect like, degradation of plating/coating, discoloration, patches,

etc. Electrical parameters shall be measured after the test.

14.7 Operational temperature test: This test shall be performed to check the performance specifications of the

units at the specified Lowest and Highest operating temperatures. The units

shall be placed in a suitable thermal chamber, and connected with the

external test set-up. Dwell time at temperature extreme shall be at least 6

hours. Electrical parameters shall to be measured as specified.

14.8 EMI /EMC Test: The units shall be subjected to EMI / EMC tests as per MIL-STD-461E.

Test applicability is shown in Table - D1. Any additional tests, if required

by SAC, shall also be carried out by the vendor. Plots taken during all the

tests shall be kept for verification.

14.9 Vibration Test: Sine / Random vibration tests shall be carried out on applicable QM / FM

units. Visual & electrical measurement shall also be performed after each

Sine & Random vibration test. Vibration levels given below are tentative.

Final levels will be decided at the time of execution.


23


Compliance

Vendor shall generate a vibration test report in a standard format, as shown

in Sub-Annexure D4, which will be sent to SAC for review and acceptance.

14.9.1 Resonance Search Pre & Post Vibration, resonance search shall be carried out in all the three

axes as per following levels. Natural resonance frequency (Fn) shall be

greater than 100 Hz and drift in pre & post vibration ‘Fn’ shall be within

10%.

Frequency (Hz) Amplitude

10 - 2000 0.5 g

Sweep rate 2 Oct / Minute

Resonance search success criteria are as under,

(i) < 10% in frequency shifts for modes with effective mass >10%

(ii) < 20% in amplitude shifts for modes with effective mass >10%

Vibration test sequence:

For QM Unit (all axis): LLS, Sine Vib, LLS, Functional test, LLS

Random Vibration, LLS

For FM Unit (all axis) LLS pre, Random vibration, LLS post.

Vendor shall use valid calibrated torque wrenches for fixture & package

mounting.

14.9.2 Sine Vibration: Sine vibration test shall be conducted only on QM unit. The unit shall be in

non-operating condition for the duration of vibration test.

Normal to mounting plane

(Z-axis)

Parallel to mounting plane

(X & Y axes)

Frequency

(Hz) Amplitude

Frequency

(Hz) Amplitude

5-20 12.4 mm (0–p) 5-18 11.5 mm ( 0 – p)

20-70 20g 18-70 15g

70-100 10g 70-100 8g

sweep rate

QM

2 Oct./minute

sweep rate

QM

2 Oct./minute

1 sweep in each axis shall be performed.

14.9.3 Random Vibration:

Units shall be subjected to random vibration tests with levels as given below

in passive mode. Frequency verses PSD plots shall be obtained and shall be

kept along with the test results for verification.

For QM units: Power spectral density


24


Compliance

Frequency

(Hz)

Normal to mounting plane

(z-axis)


(X & Y axes)

20-100 + 3 dB/octave + 3 dB/octave

100-700 0.28 g2/Hz 0.1 g2/Hz

700-2000 -6 dB/octave -3 dB/octave

Overall RMS 17.5 g 11.8g

Duration 120 sec. 120 sec.

For FM units:

Frequency

(Hz)

Power spectral density

Normal to mounting

plane (z-axis)


(X & Y axes)

20-100 + 3 dB/octave + 3 dB/octave

100-700 0.12 g2/Hz 0.044 g2/Hz

700-2000 -6 dB/octave -3 dB/octave

Overall RMS 11.7 g 7.9 g

Duration 60 sec. 60 sec.

Note: Levels are tentative and shall be finalised before actual testing

based on weight & mounting configuration

14.10 Thermo vacuum Test: QM / FM units shall be subjected to thermal vacuum test as per the test

profiles shown in Figure-D1.

Following points shall be considered before starting thermo-vacuum test:

a) It shall be ensured that the parameters of the thermos-vacuum

chamber i.e. temperature, air pressure measuring device, etc. are

properly calibrated prior to the start of the test.

b) The input and output cables shall be properly identified and calibrated

at lab temperature.

c) The cables to be used in test setup shall be properly calibrated for the

extreme cold and hot temperatures in vacuum and the correction factor

shall be applied accordingly to the test data.

d) It should be ensured that the temperature sensors are mounted at pre-

determined locations for monitoring base plate and package

temperatures.

Electrical measurements shall be carried out at the points mentioned in test

profiles. The electrical parameter measurements, and DC current shall be

measured at Minimum, Maximum and Nominal input DC voltages as

defined in EPC specifications (Table A2 of Annexure A). During Turn-On,

DC inrush current shall be recorded and no RF measurement shall be

performed. Time-Temperature and Pressure data shall be logged along with

electrical results for verification.

14.11 Mechanical Shock Test: QM unit shall be subjected to mechanical shock test as per the following

test levels in all the 3 axes. Number of shocks in each axis shall be 2 and

Shock levels specified with Q = 10.

Frequency (Hz) SRS

100 – 600 +15 dB / octave


25


Compliance

600-5000 1000 g

Note: Levels are tentative and shall be finalised before actual testing

14.12 ESD Test ESD tests shall be conducted on QM units only. Electrical measurements

shall be carried out after ESD tests.

14.12.1 Radiated field Test The unit (EUT) shall not exhibit any degradation of performance when

subjected to the radiated fields of less than or equal to 7 kV ESD, simulated

at 30 cm from all critical points identified by SAC. Discharge rate shall be

1 discharge per second for a period of 30 seconds at each point. The test set

up is as shown in figure below.

14.12.2 Single point Discharge Test The Unit (EUT) shall not exhibit any degradation of performance when

subjected to discharges equal to or less than 5 kV with discharge current

return wire in close proximity, applied to subsystem surface directly at

critical points to simulate the discharge and local flowing of arc currents.

Discharge rate shall be 1 discharge per second for a period of 30 seconds at

each point. The test set up is as shown in Figure below.

14.12.3 Structural current test The Unit (EUT) shall not exhibit any malfunction, degradation of

performance or deviation from the specifications when subjected to contact

discharges of less than or equal 5 kV, simulating structural current


26


Compliance

transients, with discharge current return wire at diagonally opposite corners,

to simulate blow-off discharge currents. Discharge rate shall be 1 discharge

per second for a period of 30 seconds at each point.

14.13 Life test:

Life test shall be carried out during qualification testing. The unit shall be

subjected at maximum operating temperature for 2000 hours, with DC

biasing and normal RF input applied. During this test, electrical

measurement of critical parameters shall be carried out at suitable intervals

(e.g. 240 hours, 500 hours, 1000 hours, 1500 hours and 2000 hours). The

critical parameters of the unit under test shall be monitored continuously

during testing. However, the parameters to be monitored, duration and

interval for monitoring of parameters (typically 24 hours) shall be mutually

agreed between SAC and vendor. Acceptance criteria and parametric drift

shall be decided later.

14.14 Final Bench Test (FBT) :

The final bench test shall be conducted for measurement of electrical

parameters as given in test matrix. The electrical parameter measurements

and DC current shall be measured at Minimum, Maximum and Nominal

input DC voltages as defined in EPC specifications. The test shall be

conducted at ambient temperature. All the test results shall be recorded and

any performance deviation with respect to Initial Bench Test shall be

evaluated.

14.15 Final Visual Inspection: The unit shall be inspected for plating, surface, finish, mechanical

deviations, corrosion and workmanship related defects. No visual

degradation shall be allowed after completion of QM or FM test.

15.0 NON-CONFORMANCE MANAGEMENT:

Effective non-conformance management mechanism shall be established

by the vendor. Major non-conformance at any stage, which affects the

quality & reliability of any unit , shall be reported to SAC immediately with

photographs, nature of non-conformance observed, etc. Disposition shall be

taken in consultation with QA, SAC. However, for all the minor non-

conformances, approval from SAC is not mandatory, and shall be reviewed

and discussed by the vendor’s NCR board. This NCR board shall be


27


Compliance

constituted by vendor in consultation with SAC. Non-conformance report

shall be generated by the concerned agency and shall be reviewed and

disposed-off by the NCR board.

Any non-conformance affecting the fabrication and / or inspection

procedure shall be reported to SAC. Changes in related documents shall be

implemented and revision number of the document shall be updated. This

shall be followed by updating all the documentation (fabrication,

inspection, test etc).

All the non-conformances with the disposition given by the NCR board

shall be reported to SAC within 2 working days. This shall be followed by

report of close out action completion, if any. For all the non-conformance

report, SAC representative shall be the focal the person.

16.0 DOCUMENT TO BE SUPPLIED :

16.1 The following documents shall be supplied along with the quote:

a) Pont by point compliance to all the requirements of this document.

b) Details to be provided as per QA check list given in Sub-Annexure D3.

16.2 The following documents shall be supplied during the contract:

a) Materials & Process List to be used for the fabrication / rework of units,

detailing process qualification status, procurement specifications,

traceability information, out gassing specifications etc.

b) Record of Bias conditions of identifying the channel / junction

temperatures of all the active devices

c) Process Identification Document.

d) Test procedure documents for Qualification and Acceptance (FM) tests

with test conditions, procedures, list of equipment and their calibration

status, for review & approval by SAC

e) Non-conformance management plan

16.3 Following documents shall be supplied during the program with respect to

relevant activity.

a) Schedule for final Cover closing of the QM and FM units

b) Details of test set-up and readiness

c) Non-conformance report

d) Failure Report; as and when failure occurs

16.4 Following detailed documents shall be supplied for each unit along with

deliverables, in soft copy on CD/ DVD.

a) T & E report of each unit containing detailed test results, test history,

conformance matrix, TBD value of components etc.

b) CoC of the deliverable units

c) CoC of materials Including screening report

d) Non Conformance reports with close-outs


28


Compliance

Figure -

D1

Test Profile for Thermo-Vacuum

Sub-

Annexure

D1

TEST PARAMETER MATRIX for QM

Sr.

No.

Parameter

Fu

nct

ion

al T

est

on

Rec

eip

t

IB

T

B

urn

-in

Po

st B

urn

-in

ele

ctri

cal

Po

st

cold

sto

rag

e

Po

st h

ot

sto

rag

e

Po

st

Hu

mid

ity

sto

rag

e

Tem

p.

op

erat

ion

al t

est

EM

I/ E

MC

tes

t

Po

st

sin

e v

ibra

tion

P

ost

R

and

om

v

ibra

tion

Th

erm

o v

ac

Po

st m

ech

anic

al s

ho

ck

Po

st E

SD

Lif

e te

st

FB

T

1 Output Power X X X X X X X X X X X X X X X

2 Gain flatness

Over 300 MHz X X X X X X X X X X X X X X X

Over 600 MHz

3 Gain variation over operating

Temp. Range (max.)

X X

4 Phase Shift X X X X X X X

5 (a) Harmonic Level X X X X X X X X

(a) out of band spurious X X X X X X X X X

6 Input RL X X X X X

7 DC voltage X X X X X X X X X X X X X X X X

8 DC current X X X X X X X X X X X X X X X X

9 In-rush Current X X


29


Compliance

Sub-

Annexure

D2

TEST MATRIX for FM

Sr.

No. Parameter

Fu

nct

ion

al T

est

on

Rec

eip

t o

f

Har

dw

are

IB

T

Bu

rn-i

n

Po

st B

urn

-in

ele

ctri

cal

EM

I/ E

MC

tes

t

Po

st

Ran

do

m v

ibra

tion

Th

erm

ov

ac

FB

T

1 Output Power X X X X X X X

2 Gain flatness

Over 300 MHz X X X X X X X

Over 600 MHz

3 Gain variation over operating

Temp. Range (max.)

X

4 Phase Shift X X X X

5 (b) Harmonic Level X X X X X

(b) out of band spurious X X X X X X

6 Input RL X X X

7 DC Voltage X X X X X X X X

8 DC Current X X X X X X X X

9 In-rush Current X X


30

Sub-Annexure D3: QA Check List

Vendor to provide complete details of following with relevant certificates.

Sr.

No

Details of information required Vendor response

1 Point by Point compliance provided ? Yes / No

2 List each applicable process ISRO qualified at your / sub-vendor’s

facility, their qualification status & attach qualification certificate.

Process Name Facility Certi. No.

a) Fabrication facilities : MIC

PCB

b) Component mounting & Assembly process on,

MIC

PCB

c) Details of ISRO qualified process available at vendor end,

Attachment of Alumina MICs to Kovar carrier plates Yes / No

Attachment of Alumina MIC on Cu-Molly CP Yes / No

Attachment / mounting of SMD components like SLCs,

Chip Resistors, Chip Terminations, Cu-magnet wires etc

on MIC/PCB and CP.

Yes / No

Gold plating on Al6061, Kovar and Cu-Molly Yes / No

5 / 10 / 20 mil gold ribbon bonding Yes / No

Cu enamel wire soldering on Substrates & PCB Yes / No

Local potting & araldite application wherever ever required

as per SAC approved location diagram

Yes / No

Test harnessing external D connector Yes / No

CHO bond – 1075 application on RF connector, if required Yes / No

Gasket & microwave absorber attachment as per SAC

approved drawing

Yes / No

SR cable assembly Yes / No

Note : If YES, pl. attach qualification certificate.

If NO, pl. provide status of process qualification & expected date of

completion.

3 Details of ISRO certified fabricator and Inspector for both MIC

and PCB work with its validity date

4 Details of Manpower for optimization & testing of Hi-Rel

subsystems & their experience

5 Location of test facilities likely to be used for following tests shall

be provided. (whichever applicable)

a) Visual Inspection (internal & external)

b) Electrical measurements

c) Burn-in test

d) Storage temperature test

e) Humidity storage test

f) Temp. operational test

g) EMI / EMC test

h) Sine Vibration test

i) Random Vibration test


31

j) Thermo-Vacuum test

k) Mechanical Shock test

l) ESD test

m) Life Test


32

Sub-Annexure D4


33


34