RF Front-EndModule Comparison2020 Volume 3...o Google Pixel 4XL vs. LG V60 ThinQ –Archi. Wifi 6.0 Module o Murata 1VF & QCA6391 Analysis o QCA6391 vs. WCN2998 vs. WCN3615 o Broadcom

©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

RF Front-End Module Comparison 2020 – Volume 3Technical and cost overview of the latest Radio Frequency connectivity Front-End technologies, with deep analysis of Wifi 6.0 and Ultra-Wide Band architecture.

SP20523 - RF report by Stéphane ELISABETHLABORATORY ANALYSIS done by Nicolas RADUFE

October 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4o Executive Summaryo Key Take Awayo Reverse Costing Methodology

Company Profile 11o Apple, Samsung, Huawei, OnePlus, Google, LG Electronics, Oppoo Smartphones Teardown:

iPhone 11, Galaxy Note 10+, 8 5G, Pixel 4 XL, V60 ThinQ, Reno 3 5G

Physical Analysis Summary 37

o Summary of the analyzed RF components

o Comparative Analysis:Module in Connectivity, Connectivity Area, Design Win, Main Supplier,

Function, OEMs main Supplier

Physical Comparison 47

o Area Distribution per Supplier & Function

o Area Distribution per Supplier & Function for Wifi 6.0

o Die Design Win in Number & Area

o Die Distribution per Function

o Die Distribution per Function for Wifi 6.0

o Filter Distribution per Smartphone: Technology and Substrate

o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate

o Material Substrate Distribution per Smartphone

Cost Comparison 61

o Cost Distribution per Supplier & Function

o Cost Distribution per Supplier & Function for Wifi 6.0

Market Analysis 65

o Wifi Evolution

o Connectivity Market Ecosystem & Forecast

Physical Analysis 71o HiSilicon – Front-End Analysis 72

o Huawei Mate 20 X (5G) vs. Huawei P40 pro – Archi. Wifi 5.0 vs. 6.0

o Hi1105V100 Analysis✓ Package View & Dimensions✓ Package Opening & Cross-Section

✓ Die View And Dimensions✓ Die Delayering & Main Block IDs✓ Die Process

o Hi1105V100 vs. Hi1103V110o Mediatek – Front-End Analysis 89

o HTC desire 19s vs. Oppo Reno3 5Go MT6635 Analysiso MT6635 vs. MT6631N

o Qualcomm – Front-End Analysis 105o Samsung Galaxy M11 & OnePlus 7 pro 5G vs. OnePlus 8 5G –

Archi. Wifi 4.0 to 6.0o Google Pixel 4XL vs. LG V60 ThinQ – Archi. Wifi 6.0 Module

o Murata 1VF & QCA6391 Analysiso QCA6391 vs. WCN2998 vs. WCN3615

o Broadcom – Front-End Analysis 128o Apple iPhone SE (2020) vs. Galaxy Note10+ vs. Apple iPhone 11

Pro Max – Archi. Wifi 6.0 Module from Murata, USI and Samsungo SEMCO 4005C2, USI APPL339S00648, Murata 1VC &

BCM4378 Analysiso BCM4378 vs. BCM4377

o Apple UWB – Front-End Analysis 154o USI U1 and Antenna Analysis

SoC Physical Comparison 177

SoC Manufacturing Process 180o Wafer Die Front-End Process & Fabrication Unit

SoC Cost Analysis 184o Summary of the cost analysis 185o Yields Explanation & Hypotheses 187

o SoC Die 189✓ SoC Die Front-End Cost✓ SoC Die Probe Test, Thinning & Dicing✓ SoC Die Wafer & Die Cost✓ SoC Component Cost

Selling price 193

Feedbacks 197

SystemPlus Consulting services 199



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis Summary

Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis

SoC Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Executive Summary

Each year System Plus opens hundreds of Front-End Modules (FEMs) and components to provide an overview of the RadioFrequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers anopportunity to keep track of the evolution of this technology market.

This year, System Plus Consulting offers different volumes on technical and cost comparisons of smartphone RFFEMs. Everyreport will focus on a specific subject, either a player’s evolution, a specific technology or a comparison of flagship devices.

This third volume provides insights into technology and cost data for FEMs and several components found in 14 latestsmartphones made by companies from Apple to Xiaomi. It features a comprehensive overview of the connectivityarchitecture on the market, comparing Wifi ac/5.0 to Wifi ax/6.0. As the architecture is centered on the Systems-on-Chips(SoCs), that’s what we’ve done a detailed analysis with cross-section and technology analysis on. Different choices ofarchitecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei. Additionally, the analysis provides insightinto Apple’s Ultra Wide Band (UWB) technology from the antenna to the SoC.

With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed,from the output of the transceiver to the antenna. Packaging, sizes and technologies are studied to provide a large panel oftechnical and economical choices and an overview of the market.

Moreover, the report includes an overview of other flagship smartphones released by the end of 2019 and provides astatistical analysis for most connectivity modules. It also tries to explain the smartphone makers’ choices and suppliertendencies. Analyses of FE modules for LTE and 5G modules are not included in this report.

Note:

Discrete filters and duplexer has been integrated in this report.

Wifi, Bluetooth and UWB Module analysed are included in this report.

RF Front-End Module for LTE/5G connectivity are not included in this report.






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

Executive Summary

RF Front-End Module Comparison 2020 – Vol. 1Study on smartphones on Q3 2019

RF Front-End Module Comparison 2020 – Vol. 2Study on Huawei smartphones

The report includes the study of at least twenty FEM and severalcomponents found in three smartphones: Apple iPhone 11 Pro,Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comesalong with a database including information on 485 componentsin 17 smartphones.

The report includes the study of at least eighty FEM and severalcomponents found in ten smartphones: Mate and P series from2015 to 2019. Also, it came along with a database includinginformation on 483 components in 13 smartphones.

Serie Generation Version # of Components

11 Pro 26

11 - 20

11 Pro Max 27

Note 10 Plus 19

Note 10 - 33

A80 - 22

Fold - 24

Xcover 4 S 21

OnePlus OnePlus 7 Pro 5G 33

Meizu - 16 S 22

Xiaomi Black Shark 2 - 41

Asus ROG Phone II - 33

Motorola One Vision - - 28

Huawei Mate 20 X (5G) 45

Oppo Reno - 5G 24

Royole FlexPai - - 31

LG Electronics V50 ThinQ 5G 36

Total 485

Smartphone List

iPhone

Galaxy Samsung

AppleSerie Generation Version Addon # of Components

30 Pro 5G 60

20 X 5G 45

20 - - 22

10 Lite - 34

10 - - 28

9 - - 40

8 - - 42

30 Pro - 41

30 - - 31

20 Pro - 37

10 - - 45

9 - - 30

9 Lite - 28

Total 483

Smartphone List

Mate

PHuawei

Huawei






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

Related Reports

About System Plus

Executive Summary

RF Front-End Module Comparison 2020 – Vol. 3Wifi & Connectivity

The report includes the study of several FEMs and componentsfound in 14 smartphones: From Apple to Xiaomi. Also, it camealong with a database including information on 281 componentsin 44 smartphones.

Serie Generation Version Addon # of Components

11 - - 5

11 Pro - 4

11 Pro Max 3

SE (2020) - - 3

Asus Rog Phone II - - 8

Google Pixel 4 XL - 6

HTC Desire 19s - - 4

20 X 5G 8

30 Pro 5G 9

Xs - - 8

P 40 Pro - 10

LG V60 ThinQ - - 8

Edge + - - 7

Moto G8 Plus - 5

Hyper - - 6

Macro - - 4

Razr 2019 - - 5

7 Pro - 5G 9

8 - - 5G 10

Find X2 - - 10

3 - 5G 6

3 Pro 5G 6

Ace - - 7

A10 s - 4

A50 - - 7

A51 - - 6

Fold - - 5

M11 - - 4

M31 - - 7

Note10 - - 7

Note10 + - 8

S20 Ultra 5G 8

S20 + 5G 8

Xcover 4S - 5

Z Flip - - 5

Sharp Aquos R - 5G 5

Nex 3s - - 8

Nex S - - 5

X30 Pro - - 7

Mi 10 Pro 5G 8

Mi Note 10 - 5

K30 - 5G 6

Note 8 Pro 5

ZTE Nubia Red Magic - 5G 7

Total 281

Redmi

One

Reno

Vivo

Xiaomi

GalaxySamsung

Smartphone List

HuaweiMate

Apple iPhone

Motorola

OnePlus

Oppo



Overview / Introduction

Company Profile & Supply Chain o Apple & iPhone 11 Teardowno Huawei & P40 Pro Teardowno Samsung & Galaxy Note 10+

Teardowno OnePlus & 8 5G Teardowno Google & Pixel 4 XL Teardowno LG & V60 ThinQ Teardowno Oppo & Reno 3 5G Teardown


Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


FeedbacksRelated ReportsAbout System Plus

Samsung Smartphone Teardown – Samsung Galaxy Note 10 plus

Connectivity Board Area : 346 mm²

RF Components(Marking)

Manufacturer Type Area(mm²)

Quantity RF Board Proportion

Cost

4005C2 SEMCO Wifi FEM 76.97 1 XX% $ XX BCM4775 Broadcom GPS SoC 9.83 1 XX% $ XX

B8920 (8PR) Epcos (TDK) SAW Diplexer 3.00 1 XX% $ XX B8893 (8NX) Epcos (TDK) BAW Filter 0.99 2 XX% $ XX

yEx Wisol SAW Filter 0.99 1 XX% $ XX 7Hx Wisolm SAW Filter 0.99 1 XX% $ XX

BGA855N6 Infineon LNA 0.78 1 XX% $ XX Sx Infineon LNA 0.99 1 XX% $ XX

Total 94.54 9 XX% $ XX





Physical Analysis Summaryo Summary of the analyzed RF

componentso Comparative Analysis

Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

Related Reports

About System Plus

Components Summary

Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev.

HiSiliconHi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0

Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1

MediatekMT6631N WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac - 5.0

MT6635 WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac/ax 2x2 5.0

Murata

1RH Double Side Molding Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0

1TR MCM Qualcomm WCN3990 Wifi, BT, FM a/b/g/n/ac 2x2 5.0

1VF Double Side Molding Qualcomm QCA6390 Wifi, BT a/b/g/n/ac/ax 2x2 5.1

1VC MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0

Qualcomm

QCA6391 FCBGA - - Wifi, BT a/b/g/n/ac/ax 2x2 5.1

WCN3615 WLCSP - - Wifi, BT b/g/n - 4.2

WCN3950 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0




SamsungS5N5C12 WLCSP - - Wifi, BT, FM a/b/g/n/ac - 4.2

S5N5C20 WLCSP - - Wif, BT, FM a/b/g/n/ac - 5.0

4005C2 MCM Double Sided Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0

USIAPPL339S00648 MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0

U1 MCM Apple (Est.) TMKA75 UWB - - -

• The components using Wifi 6 and UWB will be opened, and the die pictures will be presented in this report.







Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

Module in connectivity

0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%

iPhone 11 Pro Max

iPhone SE (2020)

P40 Pro

8 5G

Reno 3 5G

Galaxy Note10+

Ap

ple

Hu

awei

On

ePlu

sO

pp

oSa

msu

ng

Percentage of module in connectivty area

Module in Connectivity Area proportion

Sum of Total Module Area

Sum of Blank Space & Discrete

XX,XXX mm²

XX,XXX mm²

XX,XXX mm²

XX,XXX mm²

XX,XXX mm²

XX,XXX mm²







Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

46%

18%

14%

8%

8%

4%

2% 0%

Component Distribution per Funtion

Filter

LNA

FEM

SoC

Switch

LNA/Switch

Multiplexer

RFIC

Components Summary

26%

17%

14%

10%

7%

6%

6%

3%

2%

2%

1%

1%

1%1%

1%1% 0% 0%

Component Distribution per Supplier

MURATA

QUALCOMM

NXP

QORVO

SKYWORKS

UNIDENTIFIED

WISOL

TAIYO YUDEN

INFINEON TECHNOLOGIES

SAMSUNG

MEDIATEK

USI

HISILICON

MAXSCEND

AWINIC

BROADCOM

WILLSEMI

TST

Share in design win©2020 by System Plus Consulting

Smartphone List Serie Generation Version Addon # of Components

11 - - 5

11 Pro - 4

11 Pro Max 3

SE (2020) - - 3

Asus Rog Phone II - - 8

Google Pixel 4 XL - 6

HTC Desire 19s - - 4

20 X 5G 8

30 Pro 5G 9

Xs - - 8

P 40 Pro - 10

LG V60 ThinQ - - 8

Edge + - - 7

Moto G8 Plus - 5

Hyper - - 6

Macro - - 4

Razr 2019 - - 5

7 Pro - 5G 9

8 - - 5G 10

Find X2 - - 10

3 - 5G 6

3 Pro 5G 6

Ace - - 7

A10 s - 4

A50 - - 7

A51 - - 6

Fold - - 5

M11 - - 4

M31 - - 7

Note10 - - 7

Note10 + - 8

S20 Ultra 5G 8

S20 + 5G 8

Xcover 4S - 5

Z Flip - - 5

Sharp Aquos R - 5G 5

Nex 3s - - 8

Nex S - - 5

X30 Pro - - 7

Mi 10 Pro 5G 8

Mi Note 10 - 5

K30 - 5G 6

Note 8 Pro 5

ZTE Nubia Red Magic - 5G 7

Total 281

Redmi

One

Reno

Vivo

Xiaomi

GalaxySamsung

Motorola

OnePlus

Oppo

HuaweiMate

Apple iPhone

Share in implemented function©2020 by System Plus Consulting

44 Smartphones; From 2019 to 2020; 281 Components

281 Components

281 Components






Physical Comparisono Area Distribution per Supplier &

Functiono Die Design Win in Number &

Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis



Filter Distribution

3%

10%

13%

70%

4%

Filter Distribution per technology

Filter BAW FBAR

Filter BAW SMR

Filter IPD -

Filter SAW -

Filter SAW IHP

67%

3%

30%

Filter substrate Area

LT/LN

Sapphire

Silicon

Filter die type distribution©2020 by System Plus Consulting

Filter die substrate distribution©2020 by System Plus Consulting









Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis



PA/LNA/Switch Die Distribution









Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis



Material Distribution






Physical Comparison

Cost Comparisono Cost Distribution per Supplier &

Function

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

Related Reports

About System Plus

Cost Distribution – Wifi 6.0






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis



Cost Analysis


Feedbacks

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About System Plus

RF Components Summary

Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev. Cost

HiSiliconHi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0 $XX

Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1 $XX

Manufacturer Model Type Series Module Cost

HiSiliconHi1103V110 RFIC Mate 20 X (5G); Mate 30 Pro 5G; Mate Xs $XX

Hi1105V100 RFIC P40 Pro $XX

Mate 20 X (5G)

Manufacturer Model Type Quantity Module Cost

HiSilicon Hi1103V110 RFIC 1 $XX

NXP BGF8458 LNA/Switch 2 $XX

NXP BGS8324 LNA/Switch 2 $XX

Triquint A7C BAW Filter 2 $XX

Mate 30 Pro 5G





Murata SADEN2G45MC0F0A SAW Filter 1 $XX

Epcos B8921 (8PS) SAW Filter 1 $XX

Mate Xs






Epcos B8857 (8MS) BAW Filter 2 $XX

P40 Pro



NXP 102# FEM 2 $XX


Taiyo Yuden 166# BAW Filter 1 $XX


Solution Cost: $XX

Solution Cost: $XX

Solution Cost: $XX

Solution Cost: $XX






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Oppo Reno3 5G – Architecture Wifi 6.0

Oppo Reno3 5G


Mediatek MT6635 RFIC 1 $XX

Murata SAFQA2G45MA0G0A IHP SAW Filter 2 $XX

Solution Cost: $XX






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

Murata 1VF & Qualcomm QCA6391 – Package View & Dimensions

Package Top View – Optical View©2020 by System Plus Consulting

• Package Type : XX XX BGA

• Dimensions : XX mm² x XX mm(XX x XX x XX mm)

• Pin Pitch : XX mm

• Marking : <Logo Murata>1VF

Package Bottom View – Optical View©2020 by System Plus Consulting

Package Side View – Optical View©2020 by System Plus Consulting

XX

mm

XX mm

XX

mm

Package Bottom View – Optical View©2020 by System Plus Consulting

Package Top View – Optical View©2020 by System Plus Consulting

Package Side View – Optical View©2020 by System Plus Consulting

XX

mm

• Package Type : XX XX BGA

• Dimensions : XX mm² x XX mm(XX x XX x XX mm)

• Pin Pitch : XX mm

• Marking : <Logo Qualcomm>QCA6391002JE004F96

XX mm

XX

mm






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Murata 1VC – Package Cross-Section

Package Cross-Section Plan©2020 by System Plus Consulting

Package Cross-Section – Optical View©2020 by System Plus Consulting

Package Cross-Section – SEM View©2020 by System Plus Consulting

XX µm

XX µm

Package Molding

Conformal Shielding

Silicon SubstrateCopper Notch

8-Layer PCB Substrate






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

Related Reports

About System Plus

Broadcom BCM4378 – Die Main Block IDs

Die Delayering – Optical View©2020 by System Plus Consulting

XX

XX

XX

XX

XX






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Broadcom BCM4377 vs. BCM4378 – Die View & Dimensions

+xx %

TSMC XX nm TSMC XX nm

Norme Die Size RF/LF Ratio

BCM4377 ax XX mm² XX %

BCM4378 ax XX mm² XX %






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Antenna Overview






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Apple U1 – Die Overview






Physical Comparison

Cost Comparison

Market Analysis




Cost Analysis


Feedbacks

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About System Plus

Apple U1 – Die Cross-Section

XX µm

Silicon Die

Polyimide

Metal Layers

Solder Ball

Package Molding

UBM

RDL

• Die substrate thickness:

XX µm

Die Cross-Section – SEM View©2020 by System Plus Consulting






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

SoC Die Comparison – Wifi 6.0






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso SoC Wafer Costo SoC Component Cost


Feedbacks

Related Reports

About System Plus

Synthesis of the cost analysis






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso SoC Wafer Costo SoC Component Cost


Feedbacks

Related Reports

About System Plus

Wafer Front-End Cost






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price

Feedbacks

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About System Plus

Component Selling Price






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• 5G’s Impact on RF Front-End and Connectivity for Cellphones

2020

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PACKAGING• RF Front-End Module Comparison 2020 – Volume 2• RF Front-End Module Comparison 2020 – Volume 1• SAW Filter Comparison 2020• Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD

SKY78221• Qualcomm’s Second Generation 5G mmWave Chipset,

from Modem to Antenna


https://www.systemplus.fr/reverse-costing-reports/saw-filter-comparison-2020/

https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-2/


https://www.systemplus.fr/reverse-costing-reports/saw-filter-comparison-2020/

https://www.systemplus.fr/reverse-costing-reports/skyworks-fbar-baw-filter-technology-in-2guhb-pamid-sky78221/

https://www.systemplus.fr/reverse-costing-reports/qualcomms-second-generation-5g-mmwave-chipset-from-modem-to-antenna/



https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/


COMPANYSERVICES





Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Physical Comparison

Cost Comparison

Market Analysis

Physical Analysis



Cost Analysis


Feedbacks

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About System Pluso Company serviceso Contact

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

KOREAYOLE

CORNELIUSYOLE Inc.

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]

America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]


mailto:[email protected]



Documents

RF Front-EndModule Comparison2020 Volume 3...o Google Pixel 4XL vs. LG V60 ThinQ –Archi. Wifi 6.0 Module o Murata 1VF & QCA6391 Analysis o QCA6391 vs. WCN2998 vs. WCN3615 o Broadcom