Jeffrey A. SmithLOCAL ADDRESSP.O. Box 609110 Clarkson Ave.Potsdam, NY 13699-6091jeasmith@clarkson.edu

PERMANENT ADDRESS503 Deerwood Rd.Utica, NY 13502-2017(315) 733-0225icepik38@gmail.com

Research InterestsSemiconductor Physics, CMOS IC Design, Electro-thermal modeling of ICs.

EducationUniversity of Notre Dame, South Bend, INPh. D., Electrical Engineering May 2020 (expected)

Clarkson University, Potsdam, NYBachelor’s of Science in Physics May 2015Bachelor’s of Science in Mathematics May 2015Minor in Electrical EngineeringCumulative G.P.A.: 3.864/4.000

Teaching Experience

Undergraduate TA Clarkson University Math and Physics Depts. August 2012 - Present

Led one weekly recitation reviewing the material covered in lecture for Differential Equations, PhysicsI (Spring 2013, 2014) and Physics II (Fall 2013, 2014). Duties include holding office hours, gradinghomework and exams and leading a bi-weekly physics lab course. Graded homework and tests forElectromagnetic Theory I, Thermal Physics and Quantum Physics I courses (2013-2015).

Tutoring Clarkson University Student Success Center February - December 2012Tutored students on the concepts covered in Calculus I/II/III, Differential Equations, Physics I/IIand Chemistry I/II. Duties include holding a weekly one hour group session for students and a fourhour weekly drop-in tutoring session.

Research Experience

McNair Scholar’s Program Clarkson University May 2012 - Present

• Dynamic Electro-thermal Modeling of FinFET DevicesFebruary 2014 - Present

Coupled developed steady-state thermal models for single fin FinFET structures with FinFETelectronic models to perform electro-thermal simulation. Current research also includes ex-traction of thermal capacitance to study signal propagation delay time induced by self-heatingeffects in FinFET digital logic devices.

• A Physics-based Thermal Model for Multi-gate Field Effect TransistorsJune - November 2013

Used finite element simulations to construct and verify the accuracy of a proposed thermalmodel on the single and multi-gate FinFET structures.

• Simulation of Quantum Well Structures in 3rd-Generation PVsMay - August 2012

Simulated InGaAs PIN-diodes to study the quantum mechanical phenomena associated withinterband and subband transistions in photovoltaic materials.

Publications

1. M.-C. Cheng, J.A. Smith, W. Jia, and R. Coleman, ”An Effective Thermal Model for FinFETStructure,” IEEE Trans. on Electron Devices, vol. 61, pp. 202-206, January 2014.

Conference Presentations

1. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-thermal Simulation of FinFET Devices,” IMPETUS Clarkson Discovery Challenge Undergrad-uate Research Category, February 25, 2015, Clarkson University, Potsdam, NY, USA.

2. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-thermal Simulation of FinFET Devices,” St. Lawrence County College Career Symposium,January 31, 2015, Clarkson University, Potsdam, NY, USA.

3. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-thermal Simulation of FinFET Devices,” Symposium for Undergraduate Research Experiences(SURE), July 31, 2014, Clarkson University, Potsdam, NY, USA.

4. Jeffrey A. Smith, Ming-C. Cheng, ”A Physics-based Thermal Model for Dynamic Electro-thermal Simulation of FinFET Devices,” University at Buffalo National McNair Scholars’Conference, July 23-27, 2014, Buffalo, NY, USA.

5. Jeffrey A. Smith, Wangkun Jia and Ming-C. Cheng, ”A Physics-based Compact ThermalModel for Single and Multi-gate Field Effect Transistor Structures,” 14th InterSociety Conf.on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2014), pp.18-25, May 27-30, 2014, Orlando, FL, USA.

6. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Model for Multi-gate FieldEffect Transistor Structures,” Mathematics Conference of Northern New York, February 28,2014, Clarkson University, Potsdam, NY, USA.

7. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Circuit Model for Multi-gate Field Effect Transistor Structures,” Symposium for Undergraduate Research Experiences(SURE), August 1, 2013, Clarkson University, Potsdam, NY, USA.

8. Jeffrey A. Smith and Ming-C. Cheng, ”A Physics-based Thermal Circuit Model for Multi-gateField Effect Transistor Structures,” University at Buffalo National McNair Scholars’ Confer-ence, July 10-14, 2013, Buffalo, NY, USA.

9. Jeffrey A. Smith and Ming-C. Cheng, ”Effective Thermal Modeling of FinFETs,” Symposiumfor Undergraduate Research Experiences (SURE), April 13, 2013, Clarkson University, Pots-dam, NY, USA.

10. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Struc-tures in 3rd Generation Photovoltaics,” McNair Scholar’s Conference of Northern NY at St.Lawrence University, February 1, 2013, Canton, NY, USA.

11. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Struc-tures in 3rd Generation Photovoltaics,” Symposium for Undergraduate Research Experiences(SURE), August 2, 2012, Clarkson University, Potsdam, NY, USA.

12. Jeffrey A. Smith and Ming-C. Cheng, ”Simulation and Application of Quantum Well Structuresin 3rd Generation Photovoltaics,” University at Buffalo National McNair Scholars’ Conference,July 18-22, 2012, Buffalo, NY, USA.

Computer Skills

• Knowledgeable in using Autodesk Inventor, AutoCAD, ANSYS APDL, LTSPICE, MATLAB,Maple, Minitab, Xilinx PlanAhead and Nextnano3 for simulations and data fitting.

• Extensive experience using LATEX and Microsoft Office for professional presentations.

ActivitiesStudent Member, American Physical Society August 2013 - PresentStudent Member, Society for Industrial and Applied Mathematics January 2012 - PresentPhysics Club Treasurer September 2011 - May 2012

HonorsDean’s Fellowship, University of Notre Dame, Electrical Engineering Dept. March 2015Honorable Mention, Mechanical/Electrical Engineering Poster Category, SURE August 2014Teaching Assistant Recognition Award, Dept. of Physics, Clarkson University June 2014Honorable Mention, Barry M. Goldwater Scholarship March 2014Donald Clark Memorial Scholarship, Clarkson University October 2013Best Poster, Computation and Modeling Poster Category, SURE August 2013Inductee, Pi Mu Epsilon Mathematics Honor Society April 2013Honorable Mention, Environmental Issues Poster Category, SURE August 2012Presidential Scholar, Clarkson University, 5/7 semesters.

Selected Work ExperienceSales Representative Vector Marketing, Inc., Utica, NY July 2011 - April 2012

Presented applications of CutCo Cutlery to prospective clientel. Duties included book-keeping,management of collected funds and the scheduling of appointments with prospective customers.Attended local and national conferences for Vector Marketing, Inc.