Research into high thermal conductivity materials related ... Documents/Presentations and... · Summer 2010 Mukund Gupta Chandana Avasarala Technical Students Research into high thermal

Summer 2010

Mukund Gupta Chandana Avasarala

Technical Students

Research into high thermal conductivity materials related to the upgrade of the CMS tracker

Table of Contents

Introduction ............................................................................................................................................ 4

Structural Materials ............................................................................................................................ 6

Carbon Fibers ............................................................................................................................................ 6

CYTEC Thornel Carbon fibers ........................................................................................................... 6

CYTEC ThermalGraph fibers ............................................................................................................ 7

TPG ............................................................................................................................................................ 9

Minteq Pyrolytic Graphite ............................................................................................................... 9

Momentive Pyrolytic Graphite ...................................................................................................... 13

Optigraph Thermal Management ................................................................................................. 18

Graphite Machining Pyrolytic Graphite ........................................................................................ 19

Panasonic PGS Graphite Sheets .................................................................................................... 20

SGL Group Expanded Natural Graphite ........................................................................................ 22

Diamond ................................................................................................................................................. 25

Sumitomo Diamonds ..................................................................................................................... 25

Element 6 Synthetic CVD Diamond ............................................................................................... 26

Carbon Foams ......................................................................................................................................... 28

POCO Graphite POCO HTC ............................................................................................................ 28

Koppers K Foam ............................................................................................................................ 29

Other Materials....................................................................................................................................... 32

Sumitomo Heat spreader Materials .............................................................................................. 32

Nanocyl Carbon Nanotubes ........................................................................................................... 33

Adhesives ............................................................................................................................................... 35

Dow Corning Thermally Conducting Materials .............................................................................. 35

Aratherm Advanced Thermal Conductive Encapsulants .............................................................. 45

Sunray Scientific Maxiglow .......................................................................................................... 48

TedPella Conducting Adhesives .................................................................................................... 53

PELCO High Performance Silver Paste .......................................................................................... 54

Epoxy Technology H20-E .............................................................................................................. 56

Henkel Ablestik Semiconductor Materials .................................................................................... 58

Ellsworth Adhesives Tra-Con Tra-Bond 2153 ................................................................................ 65

Arctic Silver Premium Silver Thermal Epoxy ................................................................................. 67

Diamond Technologies Diamond Powder ..................................................................................... 68

Product List ............................................................................................................................................ 69

References ............................................................................................................................................. 71

Introduction

This document is a market survey of high thermal conductivity materials for the upgrade of the CMS

tracker. The first part of the paper considers structural materials that are light weight and that could be

manufactured into thin sheets. The sheets are to be used as a support structure in the CMS Pixel

detector where there is a need for efficient heat transfer between the cooling pipes and the silicon

wafers. The second part deals with high performance adhesives to glue the sheets to the cooling pipes

with the best conductivity possible. Mainly three types of structural materials are considered: carbon

fiber materials, thermal pyrolytic graphite (TPG) and diamond. It is noted that the first two can have a

highly anisotropic thermal conductivity.

Carbon fibers and graphite fibers materials have extremely thin fibers of about 0.005–0.010 mm in

diameter. They are highly conductive, but only along these fibers. Also, they lose conductivity when

mixed with epoxy. In the material, the fibers can be oriented in one, two or all three directions.

Depending on the required performance, different ratios of fibers along each axis can be chosen.

TPG is a unique form of graphite manufactured by decomposition of a hydrocarbon gas at very high

temperature in a vacuum furnace. Its layered structure is responsible for the material being highly

anisotropic. Thus, TPG has high thermal conductivity along the horizontal plane but very low along the

vertical plane. Some experiments done at Fermilab revealed that the TPG substrate needs to be

stiffened due to delamination and strengthened because parts got damaged easily. They used CFRP

encapsulation to avoid too much mass and for good conductivity. The material was successfully used for

Fermilab MTest Pixel Detector and the Phenix Pixel Detector. Finite Element Analysis was made with this

material for the CMS FPIX Detector. The results were quite satisfying since the temperature differences

across each module were within 5 °C. For more details on the experiments, refer to this link:

http://postema.web.cern.ch/postema/CO2_cooling/Fermilab/TPG_090209_f.pdf

Diamond is known for its high thermal conductivity. Several methods exist to produce diamond

synthetically, such as Chemical Vapour Deposition (CVD) and High-Pressure High-Temperature (HPHT)

synthesis. Diamond offers conductivity in all directions but the limiting factor is the shaping.

http://postema.web.cern.ch/postema/CO2_cooling/Fermilab/TPG_090209_f.pdf

The market research confirms that these materials are high end products. Their applications include

heat sinks, semiconductor manufacturing equipment, aerospace industry, optical communications

equipment and medical diagnostic imaging instruments. The thermal conductivity of these materials

exceeds that of gold, copper and silver and they are very light weight compared to these metals. For the

purpose of the CMS tracker, low density materials should be used, partly because they need to be

“transparent” to radiation. TPG and carbon fiber materials can be made into thin sheets. However, these

sheets don’t transfer heat across their thickness very well. Diamond sheets are available but in small

dimensions.

Typical Properties for Thornel carbon fibers - Standard Products BP Amoco Chemicals

Long. Thermal Trans. Thermal Electrical Cross Yield g/m Yield Specific FiberFiber Conductivity Conductivity Resistivity Section Yield Relative Tex Heat Resistance Resistance Diameter Density

Grade W/mK W/mK(EST) micro ohm-m in 2 * 1 0 - 5 grams/m To T-3003k g/km (300K) ohms/cm ohms/ft microns g/cc

PAN Based Carbon FibersT-350 Ablative Products/21X AB 3k 150 21.8 0.249 126% 249 0.17 10.65 324.6 7 1.768/23X AB 3k 9 0 21.4 0.244 123% 244 0.17 6.52 198.8 7 1.768/25X AB 3k 7 0 21.0 0.240 121% 240 0.17 5.16 157.4 7 1.77

T-3001k 8.5 5 1 8 5.8 0.066 33% 6 6 0.17 4.80 146.3 7 1.763k 8.5 5 1 8 17.5 0.198 100% 198 0.17 1.59 48.6 7 1.766k 8.5 5 1 8 3 5 0.395 199% 395 0.17 0.80 24.3 7 1.7612k 8.5 5 1 8 7 0 0.794 401% 794 0.17 0.40 12.1 7 1.76

T - 6 5 0 / 3 53k 1 4 5 14.9 17.2 0.196 99% 196 0.17 1.34 40.9 6.8 1.776k 1 4 5 14.9 34.1 0.391 197% 391 0.17 0.68 20.6 6.8 1.7712k 1 4 5 14.9 66.9 0.763 385% 763 0.17 0.35 10.5 6.8 1.77

T - 6 5 0 / 4 26k 1 5 5 14.2 19.5 0.224 113% 224 0.17 1.13 34.40 5.1 1.7812k 1 5 5 14.2 38.2 0.44 222% 440 0.58 17.6 5.1 1.78

Pitch Based Carbon FibersP-252k 2 2 1 0 13.0 2 6 0.332 168% 332 0.17 0.78 23.6 1 1 1.904k 2 2 1 0 13.0 5 9 0.715 361% 715 0.17 0.34 10.4 1 1 1.90

P-30X2k 4 0 1 0 11.2 2 6 0.328 166% 328 0.17 0.67 20.4 1 1 1.992k (GPX-7) 11.6 12.2 0.155 78% 155 0.17 1.47 44.9 7 1.992k (GPX-8) 11.6 15.6 0.198 100% 198 0.17 1.15 35.1 7 1.99P-55S2k 120 5 8.5 2 5 0.320 162% 320 0.17 0.53 16.1 1 0 2.004k 120 5 8.5 5 6 0.714 361% 714 0.17 0.24 7.2 1 0 2.00

P-75S 2k 185 2.4 7.0 2 5 0.320 162% 320 0.17 0.43 13.2 1 0 2.05

P-100S 2k 520 2.4 2.5 2 3 0.317 160% 317 0.17 0.17 5.1 1 0 2.15

P-120S 2k 640 2.4 2.2 2 3 0.325 164% 325 0.17 0.15 4.5 1 0 2.18

K-1100 2k 1000 2.4 1.3 2 3 0.325 164% 325 0.17 0.09 2.7 1 0 2.20

The information contained in this publication is not comprehensive. Despite our efforts, it may not be accurate, up to date or applicable to the circumstances of any particular case. We cannot accept any liability for any inaccuracies or omissions in this publication and any decisions you make based on information contained in this publication are your sole responsibility. We are of course happy to discuss with you the implications of any issue raised if you contact us. No information contained in this publication constitutes an invitation by or on behalf of BP Amoco p.l.c. or any of its subsidiaries to enter into a contract with you.

Page 1

! " # "

$%&'()*(+,

-

. /0/( 1+2 !)++3 . /0/ ( ! Typical Properties of ThermalGraph DKD

Fiber Properties

Reported Fiber Properties Range

Electrical Resistivity < 3.0 micro ohm-m

Bulk Density 0.25 - 0.55 g/cc

Characteristic Fiber Properties

Estimated Thermal Conductivity 400 - 650 W/mK

Average Filament Length 200 microns

Filament Diameter 10 microns

Filament Length Distribution < 20% less than 100 microns and < 20 % greater than 300 microns

Tensile Strength 200 ksi

Tensile Modulus 100 - 120 Msi

Fiber Density 2.15 - 2.20 g/cc

Carbon Assay 99+%

Surface Area 0.4 m2/g

Cytec Engineered Materials Overview Product Information Selector Guides

Thornel® and ThermalGraph® Performance & Design Advantages

Browse Related Products: Thornel (Pitch Based) | Thornel (Pan Based) | ThermalGraph | All Carbon FiberProducts

Select a Carbon Fiber Product:

Back to Carbon Fiber Home

Low Density

Graphite fibers have significantly lower density than aluminum. This not only allows reduced weight, but also makes thinnercomponents possible. Compared to copper, graphite fibers are 75 percent lighter and have 7 times the modulus. For aerospace andsatellite applications where every ounce is critical, Thornel® and ThermalGraph® products present tremendous opportunities for thedesigner. Manufacturers can tailor CTE to a variety of materials by combining a metal or polymer with ThermalGraph® fibers, whichhave a negative CTE along the fiber axis.

Negative CTE

Controlling the coefficient of thermal expansion (CTE) is becoming a critical factor in electronic packaging. Unlike metals, graphitefibers have a negative CTE along the fiber axis. By combining Thornel® and ThermalGraph® products with a metal or polymer, youcan tailor CTE to a wide range of materials.

Composites containing these materials can be used to create components with zero CTE. They also can be used to fine-tune theCTE of other materials to give you an impressive degree of dimensional stability.

Inertness

Unlike metals, graphite fibers are inert. They are extremely stable to very high temperatures, even in corrosive environments, and aregenerally unaffected by strong acids, bases, oxidants, salt water and atmospheric moisture.

Design Flexibility

The distinct advantages of Thornel® and ThermalGraph® products offer designers a broad range of opportunities.

Exceptional static and dynamic fatigue strength1.High tensile strength2.Excellent friction and wear characteristics3.Easily combined with a wide range of matrices4.Available in a variety of forms5.Easy to machine and plate6.

High Thermal Conductivity

For applications that need fast, high-capacity heat transfer, graphite fibers offer outstanding performance. In fact, only diamond canconduct more heat than highly crystalline graphite products.

Because of their directional conduction capability, graphite fibers can be used in applications where far more metal would have to beused to accomplish the same heat transfer objective. Thornel® and ThermalGraph® products can be produced in grades that have 2to 3 times the thermal conductivity of copper.

© 2009 Cytec Industries Inc. All Rights Reserved. Site Map | Important Notices | Corporate Contact

CYTEC - Engineered Materials http://www.cytec.com/engineered-materials/performance-design.htm

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Minteq PyrogenicsGroup

About Us

PYROID PyrolyticGraphite

Carbon Composites

Pyrolytic Film / Foil

Applications

PYROID HT PyrolyticGraphite

FIREX Fire andThermal ProtectionCoatings

Minteq - Home > Our Products > Minteq Pyrogenics Group > PYROID Pyrolytic Graphite

PYROID Pyrolytic Graphite

PYROID pyrolytic graphite (PG) is a specialized, "five-nine" purity, chemical vapor deposition(CVD), carbon product grown atom-by-atom with unique thermal, electrical and chemical propertiesincluding superior EMI performance. These materials have applications where extreme temperature upto 6000°F (3300°C) and corrosive environments exist, conducting heat across its (a-b) planar surfacelike copper and insulating like ceramics in the (c) thickness direction. As a result of our proprietaryfinishing process we achieve extremely low particulates and chemical resistance to fluorine-basedgases that provide solutions to problems in plasma and semi-conductor etching systems. In addition,PG has been determined to be highly diamagnetic, conducive to enhanced imaging process formedical applications.

The Pyrogenics Group provides parts and CNC machining, of diameters up to 18 in. (46 cm) andthickness up to 1 in. (2.5 cm). We supply PG in custom free standing as deposited shapes, havingdiameters up to 18 in. (46 cm) and varying wall thickness. Shapes can be manufactured such ascylindrical tubes, spherical domes, rods, plates, cones, and other intricate geometries.

We are also the leading supplier of a special grade of freestanding PYROID pyrolytic graphite films(2-75µm thickness) for use in high energy and radiation projects. With its unique thermal andelectrical characteristics.

PYROID pyrolytic graphite is used by industries facing problem applications resulting fromexcessively high temperature, stress, corrosion, and friction, requiring a lightweight material solution.

Technical DataListed below is a general description of the processing and a summary of the key properties ofpyrolytic graphite. The summary also lists important parameters of the product as it pertains toapplications for thermal management.

PYROID pyrolytic graphite is markedly different from polycrystalline graphite and is in aspecialty category. The absence of granular components and the unique structures of CVDdeposited PG, yields components that achieve dropout rates at or below 10 per wafer—farbelow commercial graphite, and approaching that of silicon. In addition to having the lowesterosion material rate known, the size of the particulates generated is <0.1 µm and dropoutdistribution is uniform. The low ion sputtering rate in plasma applications results in enhanced lifetime, approachingseveral hundred hours in RF driven plasma devices, and is therefore, economically beneficialproviding total cost solutions and enhanced productivity. PG is used widely in ion and rail gunapplications due to its combination of high conductivity (in the a-b plane) and the very lowsputtering rate offered by carbon in general. According to Ion Tech, PG offers the lowestsputtering erosion rate of any material used to construct ion grids.Exceptionally low metallic impurities (typical GDMs data avaiable upon request.)PG performs well at high temperatures and is stable up to 2200°C.PG approaches carbon’s theoretical density of 2.25 g/cc, and hence is essentiallynon-porous resulting in no outgassing of contaminants and is very stable in the morechemically active etching plasma applications, employing chlorofluro carbons and nitrogentrifluoride, that attack silicon. PG has excellent thermal conductivity, approaching copper in the a-b direction, whereas itacts almost as a ceramic on the 'c' direction. In an annealed PYROID HT state, the thermalconduction properties increase up to four to eight times that of copper and aluminum,

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Minteq: PYROID Pyrolytic Graphite http://www.minteq.com/our-products/minteq-pyrogenics-group/pyroid-...

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respectively (thermal conductivity as high as 1700 W/m°K). We are able to selectively bondthe planes through special fixturing to take maximum advantage of its directional conductivity.In this regard it is an excellent material in special thermal management applications, includinglids and heat sinks.

MINTEQ supplies PG in flat machined pieces as required by the customer or fully machined parts(such as etching cathodes or grids) from customer specification or drawing. We have a CNCequipped machine shop and access to laser machining to fabricate complex shapes, criticaldimensions and hole patterns in grids. We also offer a special surface treatment process after partsare machined to virtually eliminate particulate debris from the parts.

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Learn more:

About UsApplicationsCarbon CompositesFirex™ Fire and Thermal Protection CoatingsPYROID HT Heat Spreaders and Thermal Vias

®


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DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively “SUPPLIERS”), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS’ STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS’ PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS’ STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers’ materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers’ products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers’ Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.

SaleS OfficeS USaT: 440.878.5700F: 440.878.5928E: [email protected]

GermanyT: 49.4152.9380F: 49.4152.938.136E: [email protected]

JapanT: 81.3.5114.3774F: 81.3.5114.3779E: [email protected]

chinaT: 86.21.6288.1088F: 86.21.6289.0681E: [email protected]

www.momentive.com

Pyrolytic Graphite

Copyright 2006-2007 Momentive Performance Materials Inc. All rights reserved.ISO 9001 Certified

CVD-85507 (11/07)

Pyrolytic graphite (PG) is a unique form of graphite manufactured by decomposition of hydrocarbon gas at very high temperature in a vacuum furnace. The result is an ultra-pure product which is near theoretical density and extremely anisotropic. As an example, PG exhibits thermal conductivity consistent with the best conductors in the “ab” plane and lower than alumina brick in the “c” direction. Mechanical, thermal, and electrical properties are generally far superior to conventional graphites.

PG is available as plate and as an impermeable coating on graphite and other substrates.

Features

• Chemically inert• High purity• Stable to 3000ºC• Impermeable• Directional electrical and thermal characteristics• Self-lubricating• Non-dusting• Low etch rate

Applications

• Sputtering Targets• Ion Beam Grids• Ion Implant Hardware• Liquid Phase Epitaxy Hardware• Crucibles for Ultra High Vacuum• Thermal Insulators• Rocket Nozzles• Heater Elements

Typical Properties (@ 300K)

PROPERTY VALUE

Density 2.18-2.22 g/ccFlexural Strength (a,b) 18,000 psi (120 MPa)Tensile Strength (a,b) 12,000 psi (80 MPa)Compressive Strength (a,b) 15,000 psi (100 MPa)Young’s Modulus (a,b) 3 x 106 psi (20,000 MPa)Thermal Expansion (a,b) 0.5 x 10-6 /K (c) 20 x 10-6 /KThermal Conductivity (a,b) 300 W/m-K (c) 3.5 W/m-KElectrical Resistivity (a,b) 0.5 x 10-3 ohm-cm (c) 0.5 ohm-cmCrystal Structure HexagonalC/2 Spacing 3.42 ÅMelting Point (Atmosphere) Sublimes at 3650ºCImpurities Total 0.01% Maximum Metallic 10 ppmOutgassing Negligible

TPG* Thermal Management Material

TPG (thermal pyrolytic graphite) is a unique form of pyrolytic graphite manufactured from thermal decomposition of hydrocarbon gas in a high temperature chemical vapor deposition reactor.

Benefi ts• Thermal conductivity to 4 times copper• Lighter than aluminum• Compatible with many encapsulating techniques• Sizes from dies and packages to PWB’s• Passive, high performance heat transfer

Features

• Highly oriented crystals in a layered structure• In-plane conductivity typically 1350 to 1700 watts/m-K• Fully dense ceramic• High c-direction modulus, contributing to improved

section properties in composite structures• Layered structure avoids brittle, catastrophic failure• Easily machined, provided as plates or as fi nal shapes• Thickness ranges from less than 0.010" (0.25 mm) to

over 0.200" (5 mm)• Plate sizes up to 5" (125 mm) x 20" (500 mm)• Special sizes can usually be provided upon request

Applications

The high thermal conductivity of TPG comes from a crystal structure that usually requires capturing the TPG material in some structural member. Final products typically include encapsulations such as aluminum, copper, AlSiC and carbon fi ber composite to solve thermal problems in such needs as:

• Heat spreaders in packages• Thermal cores for PWB's• Heat spreaders for improved performance of fi nned sinks• Laser diode mounts

ITRS Impact - The International Technology Roadmap for Semiconductors shows power dissipation increasing by 10 watts per year from 130 watts in 2002 at the 130 nm node to 160 watts in 2005 at the 100 nm node. TPG can enable transparent thermal solutions without the need for dramatic changes in fans or forced cooling.

DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively “SUPPLIERS”), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS’ STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS’ PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS’ STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers’ materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its fi nished parts incorporating Suppliers’ products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers’ Standard Conditions of Sale or this Disclaimer, unless any such modifi cation is specifi cally agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affi liates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.

SALES OFFICES USAT: 440.878.5700F: 440.878.5928E: [email protected]

GERMANYT: 49.4152.9380F: 49.4152.938.136E: [email protected]

JAPANT: 81.3.5114.3774F: 81.3.5114.3779E: [email protected]

CHINAT: 86.21.6288.1088F: 86.21.6289.0681E: [email protected]

www.momentive.com

Copyright 2006-2007 Momentive Performance Materials Inc. All rights reserved.*TPG is a trademark of Momentive Performance Materials Inc. CVD-85505 Rev (11/07)

Typical TPG* Properties

Thermal Images

6061 Aluminum

Tmax = 115oC

TPG

Tmax = 44oC

TPG shows over 5X the power dissipation capability of aluminum

Thermal Conductivity 1500 Watts/m-K, a-b axis <20 Watts/m-K, c axis Density 2.26 gm/cc

Thermal Expansion 0 to -1 ppm/oC, a-b axis Coeffi cient 25 ppm/oC, c axis

Specifi c Heat 0.71 J/gm-oC @ 25o C

Flexural Strength 36.7 +/-4%, MPa, ab 38.5 +/-4%, MPa, ab

Stiffness 1050 +/-2%, GPa, c11 36 +/-3%, GPa, c33

Compressive Strength nil ab

Tensile Strength nil ab

Typical Thermal Performance

0

20

40

60

80

100

0 10 20 30 40 50

Dissipated Power (W)

Del

ta T

(C

) Aluminum

Copper

TC1050

TPG

TC1050* Thermal Management Materials

Momentive Performance Materials has developed a family of thermal management products based upon its high conductivity TPG* (thermal pyrolytic graphite) material. TPG is a unique form of pyrolytic graphite manufactured from thermal decomposition of hydrocarbon gas in a high temperature, chemical vapor deposition reactor. TC1050 is a macrocomposite of a TPG core encapsulated in various structural materials:

• Aluminum (TC1050.ALY)• Copper (TC1050.COP)• Other encapsulations and systems are often available,

such as kovar, tungsten/copper, carbon fi ber composites, etc.

The thermal expansion properties are defi ned by the selection of the encapsulating material.

Benefi ts

• Thermal conductivity to 3 times copper• Lighter than aluminum• Adjustable coeffi cients of thermal expansion• Low thermal resistance• High reliability from passive conduction• Sizes from diode mounts to whole chassis panels

Applications

• Heat spreaders in packages• Thermal cores for PWB's• Improved performance of fi nned sinks• Laser diode mounts• Avionics thermal cores• Satellite traveling wave tube mounts• Electronic chassis

DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MATERIALS GmbH & Co. KG, MOMENTIVE PERFORMANCE MATERIALS SUISSE Sarl, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively “SUPPLIERS”), ARE SOLD BY THE RESPECTIVE LEGAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS’ STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS’ PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABILITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS’ STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers’ materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its fi nished parts incorporating Suppliers’ products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers’ Standard Conditions of Sale or this Disclaimer, unless any such modifi cation is specifi cally agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affi liates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.

SALES OFFICES USAT: 440.878.5700F: 440.878.5928E: [email protected]

GERMANYT: 49.4152.9380F: 49.4152.938.136E: [email protected]

JAPANT: 81.3.5114.3774F: 81.3.5114.3779E: [email protected]

CHINAT: 86.21.6288.1088F: 86.21.6289.0681E: [email protected]

www.momentive.com

Copyright 2006-2007 Momentive Performance Materials Inc. All rights reserved.*TPG and TC1050 are trademarks of Momentive Performance Materials Inc. CVD-85504 Rev (2/08)

Typical TPG* Properties

Thermal Images

6061 Aluminum

Tmax = 115oC

TPG

Tmax = 44oC

TPG shows over 5X the power dissipation capability of Al

Typical Thermal Performance

0.020.040.060.080.0

100.0

0.0 20.0 40.0

Dissipated Power [W]

Del

ta T

[C]

Aluminum

Copper

TC1050

TPG

Thermal Conductivity 1500 Watts/m-K, a-b axis <20 Watts/m-K, c axis Density 2.26 gm/cc

Thermal Expansion 0 to -1 ppm/oC, a-b axis Coeffi cient 25 ppm/oC, c axis

Specifi c Heat 0.71 J/gm-oC @ 25o C

Flexural Strength 36.7 +/-4%, MPa, ab 38.5 +/-4%, MPa, ll ab

Stiffness 1050 +/-2%, GPa, c11 36 +/-3%, GPa, c33

Compressive Strength nil ll ab

Tensile Strength nil ll ab

– EC178 –

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.Should a safety concern arise regarding this product, please be sure to contact us immediately.

Product Code

E

1

Y

2

G

3 4 5 6 7 8 9 10 11 12

S

S PGS onlyTaping

1

ACoating

8 2 3 1 0

Other materials laminatedCM

Suffix

Thickness (mm)

Dimension Y (Long)Dimension X (Short)

Style

10 0.10.07070.02503

Custom product is suffix.

Y(mm)X

(mm

)

“PGS” Graphite Sheets

“PGS” Graphite SheetsType: EYG

Recommended applications Cellular phone, DVC, DSC, PC and peripherals, pickup Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers) Optical communications equipment

Features Excellent thermal conductivity : 700 to 1600 W/(m·K) (2 to 4 times as high as copper, 3 to 6 time as high

as aluminum) Lightweight: Specifi c gravity : 0.85 to 1.9 g/cm3

(1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density) Flexible and easy to be cut or trimmed. (withstands repeated bending) Low thermal resistance

PGS (Pyrolytic Graphite Sheet) is a thermal interface material which is very thin, synthetically made, has high thermal conductivity, and is made from a higly oriented graphite polymer film. It is ideal for providing thermal management/heat-sinking in limited spaces or to provide supplemental heat-sinking in addition to conventional means. This material is flexible and can be cut into customizable shapes.

Explanation of Part Numbers

Dimensions in mm (not to scale)

Characteristics

Part No. Dimension X (Short) Dimension Y (Long) Thickness (mm)

EYGS1823 180±5 mm 230±5 mm 0.10±0.03, 0.07±0.015

EYGS1218 115±5 mm 180±5 mm 0.10±0.03, 0.07±0.015, 0.025±0.010

EYGS0912 90±5 mm 115±5 mm 0.10±0.03, 0.07±0.015, 0.025±0.010

Characteristics Specifi cation Specifi cation Specifi cationThickness 0.10 ± 0.03 mm 0.07 ± 0.015 mm 0.025 ± 0.010 mmDensity 0.85 g/cm3 1.21 g/cm3 1.90 g/cm3

Thermal conductivity a-b plane 700 W/(m·K) 1000 W/(m·K) 1600 W/(m·K)Electrical conductivity 10000 S/cm 10000 S/cm 20000 S/cmExtensional strength 19.6 MPa 22.0 MPa 30.0 MPa

Expansion coeffi cienta-b plane 9.3 10-7 1/K 9.3 10-7 1/K 9.3 10-7 1/Kc axis 3.2 10-5 1/K 3.2 10-5 1/K 3.2 10-5 1/K

Heat resistance 400 °CBending(angle 180,R5) 10000 cycles

Handling Precautions (See Page 182)

1 00 7

1 00 70 3

1 00 70 3

Dimension of representative

Please contact us for other dimensions other than those above.

Values are for reference, not guaranteed.

May. 201001

– EC179 –

Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.Should a safety concern arise regarding this product, please be sure to contact us immediately.

Coefficient of thermal conductivity (W/(m·k))0 200 400 600 800 1000 1200 1400 1600

Heat-conductive sheet

Magnesium alloy

Stainless steel

Pure iron

Aluminum

Pure copper

Conventional graphite

PGS 100 μm

PGS 70 μm

PGS 25 μm

Thermal conductivity:2 to 4 times as high as copper,Specific gravity:1/10 to 1/4 that of copper

a-b plane

Cax

is

3.354 to 3.35610-8cm

0102030405060708090

100110120130140

10 100 1000 10000Frequency (MHz)

Effe

ctof

shie

ld(d

B)

a-b plane(KEC method)

Effect of magnetic field shield

Effect of electric field shield

Effect of shield (dB)=–20 log (Vs/V0)

Acrylic Adhesivetape 30 μm

Separating paper

PGSGraphite sheet

PGSGraphite sheet


Separating paper

PGS Graphite sheet

Polyester(PET)tape 30 μm


Separating paper

PGSGraphite sheet


Separating paper

PGS Graphite sheet



Separating paper

PGS Graphite sheet


“PGS” Graphite Sheets

Thermal conductivity of PGS compared to other Layered structure of PGS

Rating and Characteristics Standard series ( PGS 100, 70, 25 μm )

Please contact our engineering section or factory about to special applications.

Electric fi eld shield performance

TypePGS Only Adhesive Type Laminated type (Insulation & Adhesive)

S type A-A type A -M type A-PA type A-PM type A-SM type

Front face – – – Polyester tapestandard type 30 μm

Polyester tapestandard type 30 μm

Polyester tapethin type 10 μm

Rear face – Insulative adhesion type 30 μm

Insulative thinadhesion type 10 μm

Insulativeadhesion type 30 μm



Structure

Features

· High Thermal ConductivityHigh Flexibility

· Low Thermal Resistance

· Available up to 400 °C· Conductive Material

· With insulation materialon one side

· With strong adhesivetape for putting chassis

· Withstanding Voltage: 2 kV

· With insulation materialon one side

· Low thermal resistancecomparison with A-A type

· Withstanding Voltage: 1 kV

· With insulation materialon both side

· Withstanding VoltagePET tape : 4 kVAdhesive Tape : 2 kV





Withstand temperature 400 °C 100 °C 100 °C 100 °C 100 °C 100 °CStandard Size 115 180 mm 90 115 mm 90 115 mm 90 115 mm 90 115 mm 90 115 mm

Maximamsize

180 230 mm 115 180 mm(25 μm)

115 180 mm 115 180 mm 115 180 mm 115 180 mm 115 180 mm

100μm

Part No. EYGS121810 – – – – –Thickness 100 μm – – ‒ – –

70μm

Part No. EYGS121807 EYGA091207A EYGA091207M EYGA091207PA EYGA091207PM EYGA091207SMThickness 70 μm 100 μm 80 μm 130 μm 110 μm 90 μm

25μm

Part No. EYGS121803 EYGA091203A EYGA091203M EYGA091203PA EYGA091203PM EYGA091203SMThickness 25 μm 55 μm 35 μm 85 μm 65 μm 45 μm

May. 201002

CVD Diamond eShop Technology & Materials About eShop About E6

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Mechanical Grade CVD

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Electronic Grade Plates

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Product Details

Product Ref. No. Description Qty. Price GBP

145-500-0090 TM100 10x10 mm, 0.25 mmthick

37.50 Buy

Specifications and Standard Tolerances

Tolerances

+0.2 / -0.0 mm on lateral dimensions, +/- 0.05 mm on thickness

Surface finish: 1 side polished Ra < 50 nm, 1 side lapped Ra < 250 nm

Laser Kerf <3°, Dimensions to smaller side

Properties

Thermal conductivity >1000 Wm-1K-1

Bulk resistivity (Rv) > 1012 Ωcm, Surface resistivity (Rs) > 1010 Ω

Laser cut edges, edge features < 200 µm

Related Products


145-500-0095 TM100 10x10 mm, 0.50mm thick

45.00 Buy

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Copyright Element Six 2001 - 2010, All rights reserved

Product Detail http://193.120.252.126/cvd/page.jsp?pageid=309&prod=16

1 of 1 7/22/2010 10:12 AM

CVD Diamond eShop Technology & Materials About eShop About E6

CVD Diamond eShop

Optical Grade CVD

Thermal Management GradeCVD

Mechanical Grade CVD

Electrochemistry Grade CVD

Single Crystal Diamond Plate

Electronic Grade Plates

Custom Product Request Form

Contact

FAQ

How To Buy

Product Details


145-500-0025 TM180 10x10 mm, 0.25 mmthick

77.50 Buy

Specifications and Standard Tolerances

Tolerances

+0.2 / -0.0 mm on lateral dimensions, +/-0.05 mm on thickness

Surface finish: 1 side polished Ra < 50 nm, 1 side lapped Ra < 250 nm

Laser Kerf <3°, Dimensions to smaller side

Properties

Thermal conductivity >1800 Wm-1K-1

Bulk resistivity (Rv) > 1012 Ωcm, Surface resistivity (Rs) > 1010 Ω

Laser cut edges, edge features < 200 µm

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Copyright Element Six 2001 - 2010, All rights reserved

Product Detail http://193.120.252.126/cvd/page.jsp?pageid=309&prod=18

1 of 1 7/22/2010 10:13 AM

062008© Poco Graphite, Inc. 2008 All rights reserved.

Thermal Management Material

POCO HTCPoco Graphite, a manufacturer of specialty materials, has developed a new graphite material specifically designed for applications that require high thermal performance. A unique manufacturing process yields a lightweight, porous graphite that has high thermal conductivity and very efficient thermal energy transfer characteristics. Thermal management applications for POCO HTC include heat sinks, heat exchangers, heat pipes, evaporative coolers, and phase-change cooling systems. POCO HTC can be laminated into thermal structures for satellite thermal panels and avionics enclosures. As the base material for a thermal composite, the open porosity of POCO HTC allows it to be filled with other materials such as copper, polymer or additional carbon.

The versatility of this porous graphite makes it desirable for a number of industries that currently use non conductive carbon, aluminum foam, copper or other metals.

These markets include electronics, aerospace, ground vehicles, medical, electrochemical (fuel cells, batteries) and general industrial.

Material Features l High specific thermal conductivity – 272 W/m∙K / g/cc

l Wetted by liquid nitrogen, methanol, Fluorinert™

l RF shielding capability – RF energy is not transmitted through the material

l Chemical inertness – highly graphitic structure makes it inert to most acids and organic solvents

TyPiCal MaTerial PrOPerTiesAVERAGE

Density 0.9 g/cc

Compressive Strength 855 psi

Thermal conductivity

Out of Plane 245 W/m∙K

In Plane 70 W/m∙K

Total Porosity 61%

Open Porosity (% of total) 95%

Average Pore Diameter 400 microns

CTe

Temperature Range In-Plane AVG

Out-of-Plane AVG

323 to 423°K/50 to 150°C 1.02 -1.07

423 to 573°K/150 to 300°C 1.91 -0.02

573 to 873°K/300 to 600°C 2.64 0.73

873 to 1073°K/600 to 800°C 3.26 1.31

Values in ppm/°K or ppm/°C

Poco Graphite, Inc., 300 Old Greenwood Rd., Decatur, Texas 76234 USA • 1-800-433-5547 (Toll Free) • 1-940-627-2121 • Fax: 1-940-393-8366 • http://www.poco.com • E-mail: [email protected] REGIONAL OFFICES • Poco Graphite, SARL, 1, rue des Vergers, 69760 Limonest - France • Tel: +33 (0)4 72 52 00 40 • Fax: +33 (0)4 72 52 00 49 • E-mail: [email protected]

US Patent Number 6776936

Technical Data SheetKoppers Inc.

Technical Center

1005 William Pitt Way

Pittsburgh, PA 15238-1362

412 826 3970

www.koppers.com

Grade L1a

Property Units Value

Density [g/cc] 0.34

Compressive Strength MPa 1.7

Compressive Modulus GPa 0.15

Tensile Strength MPa 4.4

Tensile Modulus GPa 0.19

Flexural Strength MPa 2.1

Flexural Modulus GPa 0.12

Shear Strength MPa 0.54

Shear Modulus GPa 0.06

Coefficient of ThermalExpansion

E-6/°C @650°C 1.72

Thermal Conductivity - Z W/m·K 55

Electrical Resistivity - Z μ ·m 40.8

Average Pore Size μm 500

Average Pore Volume % 78


Technical Center



412 826 3970

www.koppers.com

Grade L1


Density [g/cc] 0.38










E-6/°C @650°C 3.0






Technical Center



412 826 3970

www.koppers.com

Grade D1


Density [g/cc] 0.48










E-6/°C @650°C 0.69





Category Material Composition 25ºC 100ºCSSC200 18Si-SiC 200 N/ASSC230 18Si-SiC 230 N/A

SALN-20 White >200 >180SALN-17 White >170 >150SALN-14B Black >140 >120

β8 70SiC-30Al 8 150 N/A 0.80 2.6 N/A 0.24 N/A 0.13 N/A N/Aβ10 60Sic-40Al 10 160 N/A 0.82 2.65 N/A 0.24 N/A 0.13 N/A N/Aβ12 50SiC-50Al 12 180 N/A 0.84 2.7 N/A 0.28 N/A 0.12 N/A N/Aβ14 40SiC-60Al 14 200 N/A 0.86 2.75 N/A 0.28 N/A 0.10 N/A N/A

Cu-Buster Cub 15 Al-20SiC-α 15 180 N/A 0.88 2.8 N/A 0.25 N/A 0.10 N/A N/AW-10 89W-11Cu 6.5 180 176 0.16 17.00 300 1.1 0.56 0.33 5.3x10-8 N/AW-15 85W-15Cu 7.2 190 183 0.17 16.40 280 1.2 0.53 0.31 4.6x10-8 N/AW-20 80W-20Cu 8.3 200 197 0.18 15.65 260 1.3 0.49 0.28 4.0x10-8 N/A

W-10S 89W-11Cu 6.5 210 N/A 0.16 17.00 300 1.1 0.56 0.33 5.3x10-8 N/AW-15S 85W-15Cu 7.2 220 N/A 0.17 16.40 280 1.2 0.53 0.31 4.6x10-8 N/AW-20S 80W-20Cu 8.3 230 N/A 0.18 15.65 260 1.3 0.49 0.28 4.0x10-8 N/AW-30S 70W-30Cu 10.2 250 N/A N/A N/A N/A N/A N/A N/A N/A N/AW-40S 60W-40Cu 12.1 270 N/A N/A N/A N/A N/A N/A N/A N/A N/ACM-15 85Mo-15Cu 7.0 160 156 0.28 10.01 150 1.2 0.54 0.28 5.3x10-8 N/APCM30 70Mo-30Cu x7.0-y8.3 200 196 0.31 9.80 180 N/A 0.60 0.23 4.0x10-8 N/APCM35 65Mo-35Cu x7.2-y9.2 210 205 0.32 9.70 170 N/A 0.56 0.22 3.5x10-8 N/ARCM60 40Mo-60Cu x10.2-y13.8 286 280 0.26 9.40 160 N/A 0.44 0.17 2.7x10-8 N/ACMC111 Cu/Mo/Cu 8.9 232 227 0.24 9.40 N/A N/A 0.40 N/A N/A N/A

CPC141(30) Cu/PCM/Cu x7.3-y10.0 220 211 0.24 9.40 N/A N/A 0.38 0.16 N/A N/ACPC232(30) Cu/PCM/Cu x7.5-y11.0 255 250 0.35 9.30 N/A N/A 0.25 0.17 N/A N/A

4.5 167 159 0.13 19.30 370 N/A N/A 0.38 5.5x10-8 N/A5.1 159 138 0.25 10.20 160 N/A N/A 0.32 5.7x10-8 N/A2.3 2,000 1400 0.51 3.52 9000~10000 3.9 N/A 1.05 1014 5.72.3 >1000 N/A 0.51 3.52 9000~10000 1 N/A 1.05 5.0x107 5.8

Diamond-Cu 4 600 N/A 0.47 4.60 N/A N/A N/A 0.62 3.5x10-4 N/ADiamond-Cu 6 550 N/A 0.45 5.00 N/A N/A N/A 0.41 2.6x10-4 N/A

3 151 N/A 0.75 2.30 N/A 0.2 N/A 0.17 2.3x10-3 11.75.9 46 34 0.33 5.32 N/A N/A 0.29 0.09 3.8x10-6 11.14.5 70 N/A 0.32 4.79 N/A N/A N/A 0.06 8.2x10-7 12

a5.6-c3.2 130 N/A 0.49 6.15 N/A N/A N/A N/A N/A N/A6.7 17 17 0.8 3.60 1,900 0.3 N/A 0.37 1012 8.9

7.6 251 180 0.96 2.90 1,200 0.2 N/A 0.33 1013 6.73 1.4 N/A N/A 0.70 N/A N/A N/A N/A N/A N/A

11.5 0.2 N/A N/A 1.00 N/A N/A N/A N/A N/A N/A3 210 190 0.73 3.20 2,800 0.4 N/A 0.39 1011 40

17.0 393 393 0.38 8.96 80 N/A 0.25 0.12 1.7x10-8 N/A23.0 238 N/A 0.27 2.70 N/A N/A N/A 0.08 N/A N/A5.3 17 17 0.44 8.36 160 N/A 0.54 0.14 4.9x10-7 N/A

x15-y17 0.2 N/A N/A N/A N/A N/A N/A N/A N/A N/A25 0.2 N/A N/A N/A N/A N/A N/A N/A N/A N/A

OrganicFR-4

Polyimide

A.L.M.T. Corp

MetalsCuAl

Fe-Ni-Co

Ceramics

Al2O3

BeOSiO2

High C.T.E. Glass CeramicsSiC

Semiconductor

SiGaAs

InPGaN

SUMICRYSTALCVD-DIAMOND

DMCHDiamond-Metal

DC40

DC60

Metals

Cu-W

Cu-Mo

WMo

1011 8.5

Metal Ceramics Al-SiCSinteredAl-SiC

4.7 N/A

AlN 4.5 0.67 3.26 1,200 0.3 N/A 0.27

N/A 0.35 N/A 0.40

ElectricResistivity

[Ωm]

DielectricConstant [at

1MHz]Trade Name

Heatspreader

Ceramics

SiSiC Invavder 3 0.67 3.0

Comparison of Physical and Mechanical Properties of Heatspreader MaterialsCoefficient of

ThermalExpansion

[10-6/K]

ThermalConductivity

[W(m.K)]

SpecificHeat

[kJ/(kg-K)]

SpecificGravity Hardness [Hv]

TransverseRaptureStrength

[GPa]

TensileStrength

[GPa]

Young'sModulus

[TPa]

Confidential

P R O D U C T I N F O R M A T I O N

Information About Dow Corning® Brand Thermally Conductive Materials

Thermally Conductive MaterialsLong-term, reliable protection of sensitive circuits and components is important in many of today’s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more com-pact electronic modules, the need for thermal management is growing. Dow Corning’s family of thermally conductive materials provides excellent thermal management options. Thermally conductive silicones function as heat transfer media, durable dielectric insulation, barriers against envi-ronmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range.

In addition to sustaining their physical and electrical proper-ties over a broad range of operating conditions, silicones are resistant to ozone and ultraviolet degradation and have good chemical stability. Dow Corning’s line of thermal management materials includes adhesives, encapsulants, compounds and gels.

Good heat transfer is dependent on a good interface between the heat producing device and the heat transfer media. Silicones have a low surface tension that enables them to wet most surfaces, which can lower the thermal contact resistance between the substrate and the material.

Thermally Conductive Adhesives

TypeNoncorrosive, one-part, moisture-cure RTV and one- or two-part heat-cure silicone elastomers

Physical FormNonflowing and flowable options; cure to flexible elastomers

Special PropertiesRoom-temperature or fast thermal cure; variety of thermal con-ductivities; resist humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress

Potential UsesHeat sink or base plate attach; potting power supplies

Thermally Conductive Encapsulants

TypeTwo-part silicone elastomers

Physical FormFlowable liquid; cures to flexible elastomer

Special PropertiesConstant cure rate, regardless of sectional thickness or degree of confinement; no post-cure required

Potential UsesPotting of high-voltage transformers and sensors; assembly of substrates to heat sinks; gap fill material between heat sources and heat sinks

Thermally Conductive Compounds

TypeNon-curing; thermally conductive silicone pastes

Special PropertiesHigh thermal conductivity; low bleed; high-temperature stability

Potential UsesGap fill materials between heat sources and heat sinks

Thermally Conductive Gels

TypeTwo-part heat-cure gels

Physical Form1:1 mix ratio; low viscosity

Special PropertiesHeat accelerable; wide operating temperatures; cure to low-modulus materials

Potential UsesGap fill material; potting of electronic modules; base materials for thermally conductive gel sheet

Materials for Pad Manufacturing

TypeTwo-part heat-cure materials

Special PropertiesSoft, good thermal conductivity, low viscosity

Potential UsesBase material for thermally conductive pads

2

PRODUCT INFORMATION – THERMALLY CONDUCTIVE ADHESIVES

Dow Corning® Brand Product Description Features

Dow Corning® Brand Product Potential Uses Application Methods

Thermally Conductive Adhesives Thermally Conductive Adhesives

SE4420 Thermally Conductive Adhesive

One-part moisture cure Flowable with moderate thermal conductivity; fast tack-free SE4420 Thermally Conductive Adhesive

Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks

Automated or manual dispensing


One-part moisture cure High viscosity with moderate thermal conductivity;UL 94 V-1 rating; fast tack-free


Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners


SE4486 CV Thermally Conductive Adhesive

Flowable; one-part moisture cure Flowable with good thermal conductivity and controlled volatility (D4-D10 < 0.002); fast tack-free





One-part; non-flow; moisture cure Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free


Bonding integrated circuit substrates; adhering lids and housings; heat sink attach



Two-part; semi-flowable Long pot life; rapid heat cure; self-priming SE4400 Thermally Conductive Adhesive

Bonding hybrids or microprocessors to heat sinks Automated or manual dispensing


One-part; gray; heat cure Moderate thermal conductivity; controlled volatility SE4402 CV Thermally Conductive Adhesive




One-part; gray; heat cure High thermal conductivity SE4450 Thermally Conductive Adhesive



1-4173 Thermally Conductive Adhesive

One-part; low flow; gray Rapid heat cure; high thermal conductivity 1-4173 Thermally Conductive Adhesive

Bonding integrated circuit substrates; adhering lids and housings; base plate attach; heat sink attach



One-part; low flow; gray Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control




Q1-9226 Thermally Conductive Adhesive

Two-part; semi-flowable Long pot life; rapid heat cure; self-priming Q1-9226 Thermally Conductive Adhesive



One-part; gray Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; contains 7-mil (178 micron) glass beads for bond line control


Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates

Manual or automated dispensing

Q3-3600 Thermally Conductive Encapsulant

Two-part; gray; 1:1 Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating


Potting of high voltage transformers and sensors; assembly of hybrid substrates to heat sinks


3-6605 Thermally Conductive Elastomer

Two-part; gray; 1:1; medium viscosity; heat cure Good flowability 3-6605 Thermally Conductive Adhesive


Automated, two-part airless mix equipment; manual mixing and de-airing


Two-part; gray Low modulus; low viscosity; heat curable; UL94 V-0 rating 3-6751 Thermally Conductive Adhesive


Manual or automated meter-mix and dispensing


One-part; gray Rapid heat cure and primerless adhesion to common substrates used in the electronics industry


Bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed



Two-part; gray; heat cure Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control


Bonding heat sinks to electronic devices; bonding printed circuit boards to substrates


3





One-part moisture cure Flowable with moderate thermal conductivity; fast tack-free SE4420 Thermally Conductive Adhesive




One-part moisture cure High viscosity with moderate thermal conductivity;UL 94 V-1 rating; fast tack-free


Adhesive for power supply components, ink jet printer heads; bonding ICs with heat sinks; sealing gas hot water heater burners



Flowable; one-part moisture cure Flowable with good thermal conductivity and controlled volatility (D4-D10 < 0.002); fast tack-free





One-part; non-flow; moisture cure Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free


Bonding integrated circuit substrates; adhering lids and housings; heat sink attach



Two-part; semi-flowable Long pot life; rapid heat cure; self-priming SE4400 Thermally Conductive Adhesive



One-part; gray; heat cure Moderate thermal conductivity; controlled volatility SE4402 CV Thermally Conductive Adhesive




One-part; gray; heat cure High thermal conductivity SE4450 Thermally Conductive Adhesive




One-part; low flow; gray Rapid heat cure; high thermal conductivity 1-4173 Thermally Conductive Adhesive




One-part; low flow; gray Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control





Two-part; semi-flowable Long pot life; rapid heat cure; self-priming Q1-9226 Thermally Conductive Adhesive



One-part; gray Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; contains 7-mil (178 micron) glass beads for bond line control





Two-part; gray; 1:1 Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating





Two-part; gray; 1:1; medium viscosity; heat cure Good flowability 3-6605 Thermally Conductive Adhesive


Automated, two-part airless mix equipment; manual mixing and de-airing


Two-part; gray Low modulus; low viscosity; heat curable; UL94 V-0 rating 3-6751 Thermally Conductive Adhesive




One-part; gray Rapid heat cure and primerless adhesion to common substrates used in the electronics industry


Bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed



Two-part; gray; heat cure Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control


Bonding heat sinks to electronic devices; bonding printed circuit boards to substrates


4



Thermally Conductive Encapsulants Thermally Conductive Encapsulants

SE4410 Thermally Conductive Encapsulant

Two-part; low viscosity Heat cure; moderate thermal conductivity; UL 94 V-0 rating SE4410 Thermally Conductive Encapsulant



SE4447 CV Thermally Conductive Encapsulant

Two-part; gray Excellent thermal conductivity; low volatility; excellent high temperature stability and low temperature resistance


Cured-in-place gap filling between heat-generating electronic components and the case or heat sink

Automated meter-mix


Two-part, thermally conductive elastomer Excellent thermal conductivity; low volatility (D4-D10 0.03% wt); heat cure; high viscosity


Excellent cured-in-place gap filling between heat-generating electronic components and the case or heat sink

Automated meter-mix


Two-part; gray Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating




3-6651 Thermally Conductive Encapsulant

Two-part; gray Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating


Potting or encapsulating power supplies, power convertors and similar electronic applications where heat dissipation is critical

Manual or automated meter-mix


Two-part; gray Low modulus; thixotropic; good thermal conductivity 3-6652 Thermally Conductive Encapsulant

Gap filler where a soft, thermally conductive material is required; thixotropic property allows the user to dispense onto specific components without flow onto other components



Two-part; gray Low viscosity; soft; excellent thermal conductivity; UL 94 V-0




Thermally Conductive Compounds Thermally Conductive Compounds

SC102 Thermally Conductive Compound

Non-curing, thermally conductive silicone paste Moderate thermal conductivity; low bleed; stable at high temperatures


Gap fill material between electronic heat sources and heat sinks


340 Heat Sink Compound Non-curing, thermally conductive silicone paste Low bleed; stable at high temperatures 340 Heat Sink Compound Thermal coupling of electrical/electronic devices to heat sinks


SE4490CV Thermally Conductive Compound

Non-curing, thermally conductive silicone paste High thermal conductivity; low bleed; stable at high temperatures; low volatility; low thermal-cycle-induced pump-out




TC-5021 Thermally Conductive Compound

Non-curing, thermally conductive silicone paste Low thermal resistance; high thermal conductivity TC-5021 Thermally Conductive Compound

Thermal interface for CPUs, etc. Screen print, stencil print or dispense




Thermally Conductive Gels Thermally Conductive Gels

SE4440-LP Thermally Conductive Gel

Two-part; thermally conductive gel Heat cure; low viscosity SE4440-LP Thermally Conductive Gel

Gap fill or potting material between electronic heat sources and heat sinks


SE4445CV Thermally Conductive Gel

Two-part; thermally conductive gel Heat cure; moderate viscosity; UL 94 V-0 rating; controlled volatility (D4-D10 0.09)





Two-part; thermally conductive gel Heat cure; moderate viscosity; controlled volatility (D4-D10 0.04)




Thermally Conductive Materials for Pad Manufacturing Thermally Conductive Materials for Pad Manufacturing

SE4430 Two-part; thermally conductive elastomer Soft; good thermal conducitvity; low viscosity SE4430 Base material for thermally conductive pads Manual or automated meter-mix

PRODUCT INFORMATION – THERMALLY CONDUCTIVE MATERIALS

5





Two-part; low viscosity Heat cure; moderate thermal conductivity; UL 94 V-0 rating SE4410 Thermally Conductive Encapsulant




Two-part; gray Excellent thermal conductivity; low volatility; excellent high temperature stability and low temperature resistance


Cured-in-place gap filling between heat-generating electronic components and the case or heat sink

Automated meter-mix


Two-part, thermally conductive elastomer Excellent thermal conductivity; low volatility (D4-D10 0.03% wt); heat cure; high viscosity


Excellent cured-in-place gap filling between heat-generating electronic components and the case or heat sink

Automated meter-mix


Two-part; gray Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating





Two-part; gray Low modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating





Two-part; gray Low modulus; thixotropic; good thermal conductivity 3-6652 Thermally Conductive Encapsulant

Gap filler where a soft, thermally conductive material is required; thixotropic property allows the user to dispense onto specific components without flow onto other components



Two-part; gray Low viscosity; soft; excellent thermal conductivity; UL 94 V-0






Non-curing, thermally conductive silicone paste Moderate thermal conductivity; low bleed; stable at high temperatures




340 Heat Sink Compound Non-curing, thermally conductive silicone paste Low bleed; stable at high temperatures 340 Heat Sink Compound Thermal coupling of electrical/electronic devices to heat sinks



Non-curing, thermally conductive silicone paste High thermal conductivity; low bleed; stable at high temperatures; low volatility; low thermal-cycle-induced pump-out












Two-part; thermally conductive gel Heat cure; low viscosity SE4440-LP Thermally Conductive Gel




Two-part; thermally conductive gel Heat cure; moderate viscosity; UL 94 V-0 rating; controlled volatility (D4-D10 0.09)





Two-part; thermally conductive gel Heat cure; moderate viscosity; controlled volatility (D4-D10 0.04)





SE4430 Two-part; thermally conductive elastomer Soft; good thermal conducitvity; low viscosity SE4430 Base material for thermally conductive pads Manual or automated meter-mix

6

TYPICAL PROPERTIES – THERMALLY CONDUCTIVE ADHESIVESSpecification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.

Dow Corning® Brand Product P

rodu

ct F

orm

Col

or

Vis

cosi

ty/F

low

abili

ty,

cent

ipoi

se o

r m

Pa*

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Dur

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(Sho

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)

Spec

ific

Gra

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Wor

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Tim

e1 at

RT

Cur

e T

ime

at R

T, h

r

Heat Cure Time2, minutes

Unprimed Adhesion, Lap Shear

Dow Corning® Brand Product T

herm

al C

ondu

ctiv

ity

at

25°C

(77

°F),

Wat

t/m

eter

-K

Tensile Strength

Elo

ngat

ion,

%

Com

pres

sion

Mod

ulus

at

10%

, psi

Lin

ear

CT

E,

mic

ron/

mC

Dielectric Strength

Die

lect

ric

Con

stan

t at

100

Hz

Die

lect

ric

Con

stan

t at

100

kH

z

Die

lect

ric

Con

stan

t at

1 M

Hz

Dis

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tion

Fac

tor

at 1

00 H

z

Dis

sipa

tion

Fac

tor

at 1

00 k

Hz

Dis

sipa

tion

Fac

tor

at 1

MH

z

Vol

ume

Res

isti

vity

,oh

m-c

m

Shel

f L

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from

Dat

e of

M

anuf

actu

re, m

onth

s

at 1

00°C

(2

12°F

)

at 1

25°C

(2

57°F

)

at 1

50°C

(3

02°F

)

psi

N/c

m2

kgf/

cm2

psi

MP

a

kgf/

cm2

volt

s/m

il

kV/m

m



One-Part White 108,000 74 A 2.26 <10 min 2003 NA NA NA 500 345 35SE4420 Thermally Conductive Adhesive

0.9 725 5 50.9 90 – 162 370 14.6 3.96 3.87 4.8 0.00525 0.00153 0.002 1.00E+15 12


One-Part Gray 200,000 69 A 2.17 <10 min 1443 NA NA NA 230 160 16SE4422 Thermally Conductive Adhesive

0.9 754 5.2 53 120 – 203 365 14.3 4.44 4.38 4.9 0.00498 0.00498 0.006 5.00E+15 9


One-Part White 19,000 78 A 2.59 <4 min 1203 NA NA NA 200 140 14SE4486 CV Thermally Conductive Adhesive

1.53 551 3.8 38.7 50 – 124 329 13 4.16 4.12 4.8 0.00807 0.00325 0.003 2.00E+14 12


One-Part White Nonflow 72 A 2.22 NA 483 NA NA NA 300 205 21SE9184 CV Thermally Conductive Adhesive

0.84 421 2.9 29.6 70 – – 508 20 – – 3.9 – – 0.002 1.00E+15 7


Two-Part Gray 76,000 78 A 2.15 17 hr – – – 30 439 303 30.9SE4400 Thermally Conductive Adhesive

0.92 841 5.8 59.1 90 – – 635 25 – – 4.2 – – 0.002 1.00E+15 7


One-Part Gray 34,000 74 A 2.16 NA – – – 30 485 335 34SE4402 CV Thermally Conductive Adhesive

0.92 885 6.1 62.2 120 – – 660 26 – – 4.8 – – 0.002 3.00E+156 @ 10°C


One-Part Gray 61,000 95 A 2.74 NA – – – 30 530 365 37SE4450 Thermally Conductive Adhesive

1.97 1,044 7.2 73.4 40 – – 610 24 – – 4.7 – – 0.002 2.00E+15 6


One-Part Gray 58,000 92 A 2.7 NA – 90 30 20 640 440 451-4173 Thermally Conductive Adhesive

1.9 900 6.2 63.3 20 – 126 425 16.7 4.98 4.86 – 0.008 <0.003 – 2.20E+146 @ 5°C



1.9 900 6.2 63.3 22 – – 425 16.7 – 4.63 – – 0.0021 – 1.90E+146 @ 5°C


Two-Part Gray 50,000 66 A 2.13 16 hr – 60 – 30 – – –Q1-9226 Thermally Conductive Adhesive

0.74 508 3.5 35.7 110 – – 635 25 – 4.5 – – 0.0013 – 1.90E+14 12


One-Part Gray 68,700 88 A 2.6 NA – 60 45 10 510 352 35.93-1818 Thermally Conductive Adhesive

1.8 625 4.3 43.9 20 – 137 395 15.6 5.6 5.5 – 0.0059 <0.0002 – 6.85E+13 6


Two-Part Gray 4,700 87 A 2.13 24 hr – 60 – 30 – – –Q3-3600 Thermally Conductive Encapsulant

0.77 957 6.6 67.3 55 – – 660 26 – – – – – – 1.00E+13 12


Two-Part Gray 47,000 78 A 2.14 >24 hr – 90 45 <15 350 241 24.63-6605 Thermally Conductive Elastomer

0.85 850 5.9 59.8 90 – 225 455 17.9 4.51 4.5 – 0.0058 <0.001 – 1.00E+14 12


Two-Part Gray 10,000 67 A 2.3 2 hr NA4 50 40 10 555 383 39.03-6751 Thermally Conductive Adhesive

1.1 400 2.76 28.1 35 125 179 454 17.9 4.7 4.7 – 0.0045 0.00013 – 7.20E+13 12


One-Part Gray 81,000 87 A 2.6 NA NA 40 10 3 540 372 37.93-6752 Thermally Conductive Adhesive

1.8 545 3.76 38.3 15 – 138 400 15.7 5.6 5.5 – 0.007 <0.0001 – 7.10E+13 6



1.4 400 2.76 28.1 35 125 179 454 17.9 4.7 4.7 – 0.0045 0.00013 – 7.2E+13 12

1 Time to double initial mixed viscosity.2Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.

3Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.4Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion.

7


rodu

ct F

orm

Col

or

Vis

cosi

ty/F

low

abili

ty,

cent

ipoi

se o

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Pa*

s

Dur

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(Sho

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)

Spec

ific

Gra

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Wor

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Tim

e1 at

RT

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ime

at R

T, h

r



Dow Corning® Brand Product T

herm

al C

ondu

ctiv

ity

at

25°C

(77

°F),

Wat

t/m

eter

-K

Tensile Strength

Elo

ngat

ion,

%

Com

pres

sion

Mod

ulus

at

10%

, psi

Lin

ear

CT

E,

mic

ron/

mC

Dielectric Strength

Die

lect

ric

Con

stan

t at

100

Hz

Die

lect

ric

Con

stan

t at

100

kH

z

Die

lect

ric

Con

stan

t at

1 M

Hz

Dis

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tion

Fac

tor

at 1

00 H

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Dis

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Fac

tor

at 1

00 k

Hz

Dis

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Fac

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at 1

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Vol

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Res

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,oh

m-c

m

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Dat

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M

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s

at 1

00°C

(2

12°F

)

at 1

25°C

(2

57°F

)

at 1

50°C

(3

02°F

)

psi

N/c

m2

kgf/

cm2

psi

MP

a

kgf/

cm2

volt

s/m

il

kV/m

m



One-Part White 108,000 74 A 2.26 <10 min 2003 NA NA NA 500 345 35SE4420 Thermally Conductive Adhesive

0.9 725 5 50.9 90 – 162 370 14.6 3.96 3.87 4.8 0.00525 0.00153 0.002 1.00E+15 12


One-Part Gray 200,000 69 A 2.17 <10 min 1443 NA NA NA 230 160 16SE4422 Thermally Conductive Adhesive

0.9 754 5.2 53 120 – 203 365 14.3 4.44 4.38 4.9 0.00498 0.00498 0.006 5.00E+15 9


One-Part White 19,000 78 A 2.59 <4 min 1203 NA NA NA 200 140 14SE4486 CV Thermally Conductive Adhesive

1.53 551 3.8 38.7 50 – 124 329 13 4.16 4.12 4.8 0.00807 0.00325 0.003 2.00E+14 12


One-Part White Nonflow 72 A 2.22 NA 483 NA NA NA 300 205 21SE9184 CV Thermally Conductive Adhesive

0.84 421 2.9 29.6 70 – – 508 20 – – 3.9 – – 0.002 1.00E+15 7


Two-Part Gray 76,000 78 A 2.15 17 hr – – – 30 439 303 30.9SE4400 Thermally Conductive Adhesive

0.92 841 5.8 59.1 90 – – 635 25 – – 4.2 – – 0.002 1.00E+15 7


One-Part Gray 34,000 74 A 2.16 NA – – – 30 485 335 34SE4402 CV Thermally Conductive Adhesive

0.92 885 6.1 62.2 120 – – 660 26 – – 4.8 – – 0.002 3.00E+156 @ 10°C


One-Part Gray 61,000 95 A 2.74 NA – – – 30 530 365 37SE4450 Thermally Conductive Adhesive

1.97 1,044 7.2 73.4 40 – – 610 24 – – 4.7 – – 0.002 2.00E+15 6



1.9 900 6.2 63.3 20 – 126 425 16.7 4.98 4.86 – 0.008 <0.003 – 2.20E+146 @ 5°C



1.9 900 6.2 63.3 22 – – 425 16.7 – 4.63 – – 0.0021 – 1.90E+146 @ 5°C


Two-Part Gray 50,000 66 A 2.13 16 hr – 60 – 30 – – –Q1-9226 Thermally Conductive Adhesive

0.74 508 3.5 35.7 110 – – 635 25 – 4.5 – – 0.0013 – 1.90E+14 12


One-Part Gray 68,700 88 A 2.6 NA – 60 45 10 510 352 35.93-1818 Thermally Conductive Adhesive

1.8 625 4.3 43.9 20 – 137 395 15.6 5.6 5.5 – 0.0059 <0.0002 – 6.85E+13 6


Two-Part Gray 4,700 87 A 2.13 24 hr – 60 – 30 – – –Q3-3600 Thermally Conductive Encapsulant

0.77 957 6.6 67.3 55 – – 660 26 – – – – – – 1.00E+13 12


Two-Part Gray 47,000 78 A 2.14 >24 hr – 90 45 <15 350 241 24.63-6605 Thermally Conductive Elastomer

0.85 850 5.9 59.8 90 – 225 455 17.9 4.51 4.5 – 0.0058 <0.001 – 1.00E+14 12



1.1 400 2.76 28.1 35 125 179 454 17.9 4.7 4.7 – 0.0045 0.00013 – 7.20E+13 12


One-Part Gray 81,000 87 A 2.6 NA NA 40 10 3 540 372 37.93-6752 Thermally Conductive Adhesive

1.8 545 3.76 38.3 15 – 138 400 15.7 5.6 5.5 – 0.007 <0.0001 – 7.10E+13 6



1.4 400 2.76 28.1 35 125 179 454 17.9 4.7 4.7 – 0.0045 0.00013 – 7.2E+13 12

1 Time to double initial mixed viscosity.2Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.

3Cure time for 3 mm thickness at 20°C (68°F) and 55 percent relative humidity.4Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion.

8

TYPICAL PROPERTIES – THERMALLY CONDUCTIVE MATERIALSSpecification Writers: Please contact your local Dow Corning sales office or your Global Dow Corning Connection before writing specifications on these products.


rodu

ct F

orm

Col

or

Vis

cosi

ty/F

low

abili

ty,

cent

ipoi

se o

r m

Pa*

s

Dur

omet

er

(Sho

re s

cale

)

Pen

etra

tion

(1

/10

of m

m)

Spec

ific

Gra

vity

Wor

king

Tim

e1 at

RT

Cur

e T

ime

at R

T, h

r



The

rmal

Con

duct

ivit

y at

25

°C (

77°F

), W

att/

met

er-K

Dow Corning® Brand Product

Tensile Strength

Elo

ngat

ion,

%

Com

pres

sion

Mod

ulus

at

10%

, psi

Lin

ear

CT

E,

mic

ron/

mC

Dielectric Strength

Die

lect

ric

Con

stan

t at

100

Hz

Die

lect

ric

Con

stan

t at

100

kH

z

Die

lect

ric

Con

stan

t at

1 M

Hz

Dis

sipa

tion

Fac

tor

at 1

00 H

z

Dis

sipa

tion

Fac

tor

at 1

00 k

Hz

Dis

sipa

tion

Fac

tor

at 1

MH

z

Vol

ume

Res

isti

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,oh

m-c

m

Shel

f L

ife

from

Dat

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M

anuf

actu

re, m

onth

s

at 1

00°C

(2

12°F

)

at 1

25°C

(2

57°F

)

at 1

50°C

(3

02°F

)

psi

N/c

m2

kgf/

cm2

psi

MP

a

kgf/

cm2

volt

s/m

il

kV/m

m



Two-Part Gray 3,500 87 A NA 2.14 24 hr – – – 30 370 255 26 0.92SE4410 Thermally Conductive Encapsulant

972 6.7 68.3 60 – – 660 26 – – 4.4 – – 0.002 1.00E+15 12


Two-Part Gray 140,000 86 OO 39 3.01 – 4 5.5 4.9 3.7 NA NA NA 2.5


20 0.14 1.4 20 7 72 270 10.6 6.6 6.5 – 0.002 <0.0001 – 8.2E+14 6


Two-Part Gray 102,000 59 OO 36 2.86 3.5 hr 5 –30

min @ 120°C

– NA NA NA 2.2


– – – – – – 279 11 – – 5.9 – – 0.0006 2.0E+15 6


Two-Part Gray 4,700 87 A NA 2.13 24 hr – 60 – 30 NA NA NA 0.77Q3-3600 Thermally Conductive Encapsulant

957 6.6 67.3 55 – – 660 26 – – – – – – 1.00E+13 12


Two-Part Gray 32,000 53 OO NA 2.4 20 min 5 3.3 2.1 1.6 NA NA NA 1.13-6651 Thermally Conductive Encapsulant

85 0.59 6 180 3 180 335 13.2 4.1 4.1 – 0.003 <0.0001 – 8.80E+14 12


Two-Part Gray 34,000 71 OO NA 2.7 >6 hr 7 5.0 3.1 2.4 NA NA NA 1.93-6652 Thermally Conductive Encapsulant

45 0.31 3.2 70 10 137 405 15.9 5.7 5.7 – 0.001 <0.0003 – 2.30E+13 12


Two-Part Gray 33,000 71 OO NA 2.7 1 hr 17 7.7 6.0 3.6 NA NA NA 1.83-6655 Thermally Conductive Encapsulant

45 0.31 3.2 90 6.5 145 345 13.6 5.2 5.2 – 0.001 <0.0001 – 1.10E+15 12



One-Part White Nonflowing NA NA 2.37 NA NA NA NA NA NA NA NA 0.8SC102 Thermally Conductive Compound

NA NA NA NA – – 210 21.7 – – 4.4 – – 0.02 5.00E+15 24

340 Heat Sink Compound

One-Part White Nonflowing NA NA 2.1 NA NA NA NA NA NA NA NA 0.59340 Heat Sink Compound

NA NA NA NA – – 210 8.3 5 5 – 0.001 0.02 – 2.00E+15 60


One-Part White 500,000 NA NA 2.62 NA NA NA NA NA NA NA NA 1.7


NA NA NA NA – – 100 35 – – – – – – 2.00E+14 11


One-Part Gray 102,000 NA NA 3.5 NA NA NA NA NA NA NA NA 3.3TC-5021 Thermally Conductive Compound

NA NA NA NA – – 128 5 – – – – – – 3.7E+11 24



NA NA NA NA – – 115 4.5 –18 @ 1 kHz

–0.128 @

1 kHz– – 5.5E+10 24



Two-Part Gray 3,600 NA 58 2.01 24 hr – –30

min @ 120°C

– NA NA NA 0.83SE4440-LP Thermally Conductive Gel

NA NA NA NA – – 330 13 – – 4.0 – – 0.001 1.00E+15 12


Two-Part Gray 14,000 NA 57 2.36 5 hr – – 45 – NA NA NA 1.26SE4445CV Thermally Conductive Gel

NA NA NA NA – – 127 5 – – 6.2 – – 0.009 7.00E+15 6



min @ 120°C

– NA NA NA 1.26SE4446CV Thermally Conductive Gel

NA NA NA NA – – 150 6 – – 6.0 – – 0.01 3.00E+16 6


SE4430 Two-Part Gray 5,600 70 OO 35 2.2 4 hr 7 3.5 2.5 1.9 NA NA NA 0.95 SE4430 60 0.4 4.2 400 – 174 455 17.9 4.6 4.6 – 0.002 0.00015 – 1.90E+14 81 Time to double initial mixed viscosity.2 Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.

3 Measurement after dilution with 1 wt % Dow Corning® OS-30 Fluid.

9


rodu

ct F

orm

Col

or

Vis

cosi

ty/F

low

abili

ty,

cent

ipoi

se o

r m

Pa*

s

Dur

omet

er

(Sho

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cale

)

Pen

etra

tion

(1

/10

of m

m)

Spec

ific

Gra

vity

Wor

king

Tim

e1 at

RT

Cur

e T

ime

at R

T, h

r



The

rmal

Con

duct

ivit

y at

25

°C (

77°F

), W

att/

met

er-K

Dow Corning® Brand Product

Tensile Strength

Elo

ngat

ion,

%

Com

pres

sion

Mod

ulus

at

10%

, psi

Lin

ear

CT

E,

mic

ron/

mC

Dielectric Strength

Die

lect

ric

Con

stan

t at

100

Hz

Die

lect

ric

Con

stan

t at

100

kH

z

Die

lect

ric

Con

stan

t at

1 M

Hz

Dis

sipa

tion

Fac

tor

at 1

00 H

z

Dis

sipa

tion

Fac

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at 1

00 k

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Dis

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Fac

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at 1

MH

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Vol

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Res

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,oh

m-c

m

Shel

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Dat

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M

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actu

re, m

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s

at 1

00°C

(2

12°F

)

at 1

25°C

(2

57°F

)

at 1

50°C

(3

02°F

)

psi

N/c

m2

kgf/

cm2

psi

MP

a

kgf/

cm2

volt

s/m

il

kV/m

m



Two-Part Gray 3,500 87 A NA 2.14 24 hr – – – 30 370 255 26 0.92SE4410 Thermally Conductive Encapsulant

972 6.7 68.3 60 – – 660 26 – – 4.4 – – 0.002 1.00E+15 12


Two-Part Gray 140,000 86 OO 39 3.01 – 4 5.5 4.9 3.7 NA NA NA 2.5


20 0.14 1.4 20 7 72 270 10.6 6.6 6.5 – 0.002 <0.0001 – 8.2E+14 6


Two-Part Gray 102,000 59 OO 36 2.86 3.5 hr 5 –30

min @ 120°C

– NA NA NA 2.2


– – – – – – 279 11 – – 5.9 – – 0.0006 2.0E+15 6


Two-Part Gray 4,700 87 A NA 2.13 24 hr – 60 – 30 NA NA NA 0.77Q3-3600 Thermally Conductive Encapsulant

957 6.6 67.3 55 – – 660 26 – – – – – – 1.00E+13 12


Two-Part Gray 32,000 53 OO NA 2.4 20 min 5 3.3 2.1 1.6 NA NA NA 1.13-6651 Thermally Conductive Encapsulant

85 0.59 6 180 3 180 335 13.2 4.1 4.1 – 0.003 <0.0001 – 8.80E+14 12


Two-Part Gray 34,000 71 OO NA 2.7 >6 hr 7 5.0 3.1 2.4 NA NA NA 1.93-6652 Thermally Conductive Encapsulant

45 0.31 3.2 70 10 137 405 15.9 5.7 5.7 – 0.001 <0.0003 – 2.30E+13 12


Two-Part Gray 33,000 71 OO NA 2.7 1 hr 17 7.7 6.0 3.6 NA NA NA 1.83-6655 Thermally Conductive Encapsulant

45 0.31 3.2 90 6.5 145 345 13.6 5.2 5.2 – 0.001 <0.0001 – 1.10E+15 12



One-Part White Nonflowing NA NA 2.37 NA NA NA NA NA NA NA NA 0.8SC102 Thermally Conductive Compound

NA NA NA NA – – 210 21.7 – – 4.4 – – 0.02 5.00E+15 24

340 Heat Sink Compound

One-Part White Nonflowing NA NA 2.1 NA NA NA NA NA NA NA NA 0.59340 Heat Sink Compound

NA NA NA NA – – 210 8.3 5 5 – 0.001 0.02 – 2.00E+15 60


One-Part White 500,000 NA NA 2.62 NA NA NA NA NA NA NA NA 1.7


NA NA NA NA – – 100 35 – – – – – – 2.00E+14 11



NA NA NA NA – – 128 5 – – – – – – 3.7E+11 24



NA NA NA NA – – 115 4.5 –18 @ 1 kHz

–0.128 @

1 kHz– – 5.5E+10 24




min @ 120°C

– NA NA NA 0.83SE4440-LP Thermally Conductive Gel

NA NA NA NA – – 330 13 – – 4.0 – – 0.001 1.00E+15 12


Two-Part Gray 14,000 NA 57 2.36 5 hr – – 45 – NA NA NA 1.26SE4445CV Thermally Conductive Gel

NA NA NA NA – – 127 5 – – 6.2 – – 0.009 7.00E+15 6



min @ 120°C

– NA NA NA 1.26SE4446CV Thermally Conductive Gel

NA NA NA NA – – 150 6 – – 6.0 – – 0.01 3.00E+16 6


SE4430 Two-Part Gray 5,600 70 OO 35 2.2 4 hr 7 3.5 2.5 1.9 NA NA NA 0.95 SE4430 60 0.4 4.2 400 – 174 455 17.9 4.6 4.6 – 0.002 0.00015 – 1.90E+14 81 Time to double initial mixed viscosity.2 Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.

3 Measurement after dilution with 1 wt % Dow Corning® OS-30 Fluid.

10

THERMALLY CONDUCTIVE ADHESIVESDow Corning offers a variety of noncorrosive, thermally conductive silicone adhesives that are ideally suited for use in bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are major concerns. The flowable versions are also ideal for use as thermally conductive potting materials for transformers, power supplies, coils and other electronic devices that require improved thermal dissipation.

The thermally conductive adhesives cure either with moisture or heat to produce durable, relatively low-stress elastomers. The one-part RTV-cure materials have a noncorrosive by-product and are available in a variety of viscosities. RTV-cure thermally conductive adhesives with controlled volatility and UL listings are available.

The heat-cure, thermally conductive adhesives produce no by-products in the cure process, allowing their use in deep section and complete confinement. These adhesives will develop good, primerless adhesion to a variety of common substrates including metals, ceramics, epoxy laminate boards, reactive materials and filled plastics. Controlled volatility adhesives and UL-rated adhesives are available.

THERMALLY CONDUCTIVE ENCAPSULANTSDow Corning thermally conductive silicone encapsulants are supplied as two-part liquid component kits. When the liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, suitable for the protection of electri-cal/electronic applications where heat dissipation is critical. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning thermally conductive elastomers require no post-cure and can be placed in service immediately at oper-ating temperatures of -45 to 200°C (-49 to 392°F) following the completion of the cure schedule.

THERMALLY CONDUCTIVE COMPOUNDSDow Corning thermally conductive compounds are grease-like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall effi-ciency of the device. Refer to Table I for specific test results.

THERMALLY CONDUCTIVE GELSDow Corning silicone gels are soft and cure to form a cush-ioning, low-modulus, resilient, gelled material. Cured gels retain much of the stress relief capability while developing the dimensional stability of an elastomer.

Dow Corning offers a line of thermally conductive gels that couple the stress-relieving capability of a silicone gel with the ability to dissipate heat from devices. These thermally conductive gels can be used as potting materials for transformers, power supplies, coils, relays and other electronic devices that require a low-modulus material for thermal dissipation. They can also be used as ingredients in formulations for thermally conductive gel sheets.

These silicone gels cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning features thermally conductive gels that have controlled volatility, including one UL 94 V-0 approved product.

Specific versions of thermally conductive gels contain glass beads designed to guarantee a minimum bond line, ensuring a reliable electrical insulation. Those materials find their use as liquid gap fillers and can favorably replace thermal pads.

Table I. Thermally Conductive Compound Properties

Dow Corning Product Test Test Method Result

SC102 Thermally Oil Separation JIS K 2220 0.02% Conductive Compound Consistency JIS K2220 10/mm 308 Volatile Content 24 hr/120°C 0.40%

340 Heat Sink Bleed after 24 hr/200°C Fed Std 791 Method 321.2 0.05% Compound Consistency ASTM D 217 300 Evaporation after 24 hr/200°C Fed Std 791 Method 321.2 0.50%

SE4490CV Thermally Oil Separation JIS K 2220 0.00% Conductive Compound Consistency JIS K2220 10/mm 250 Volatile Content 24 hr/120°C 0.40%

TC-5021 Thermally Volatile Content 24 hr/150°C <1% Conductive Compound Bleed 24 hr/150°C 0.15%

TC-5022 Thermally Volatile Content 24 hr/150°C <0.05% Conductive Compound Thermal Resistance 0.02-mm Bond Line, 40 psi 0.06°C.cm2/W

Aratherm™

Advanced thermal conductive encapsulants Products and Properties

Product Single component system XB 2720

(LMB 5667)XB 2721(LMB 5665)

Application Electro motors, generators, power modules, solenoids, powerdiodes ...

Key properties high thermal conductivityλλλλ = 1.5 W/mKvery low thermal expansion

high thermal conductivityλλλλ = 2.0 W/mKvery low thermal expansion

Colour of casting grey grey

Single components(guideline values)

Viscosity @ 25°C Brookfield mPas 97,000 184,000Viscosity @ 40°C Brookfield mPas 24,000 35,000Gel time @ 90°C/110°C/120°C Gelnorm min 130 / 30 / 15 120 / 30 / 15Minimum curing time h/°C 1h/ 130°C 1h/ 130°C

Properties of cured castings(guideline values)

1h/90°C + 1h/150°C 1h/90°C + 1h/150°

Glass transition temperature ISO 6721/94 °C 115 115Hardness DIN 53505 Shore D 90 D 91Tensile strength ISO 527 MPa 93 92Elongation at break ISO 527 % 0.8 0.6Thermal expansion coefficient DIN 53752 ppm/K 23 (40°C - 115°C)

85 (115°C - 200°C)20 (40°C - 115°C)85 (115°C - 200°C)

Thermal conductivity@ 25°C

ISO 8894/90 W/mK 1.5 2.0

Flammability UL 94 Grade V-0 (internal test, not yet listed) V-0 (internal test, not yet listed)

Dissipation factor tanδ@ 50 Hz/ 25°C

IEC 250 % 2.4 2.6

Dielectric constant εR

@ 50 Hz/ 25°CIEC 250 [-] 4.9 5.1

Specific volume resistivity @ 25°C IEC 93 Ωcm (1 kV) 6.4x1014

(1 kV) 5.0x1014

Product

Aratherm™


Single component system XB 2730(LMB 5668)

XB 2731(LMB 5672)

Application Electro motors, generators, power modules, solenoids,power diodes ...

Key properties high thermal conductivityλλλλ = 2.3 W/mKgood thermal resistancevery low thermal expansionroom temperatur storage possible

high thermal conductivityλλλλ = 3.0 W/mKgood thermal resistancevery low thermal expansionroom temperatur storage possible

Colour of casting grey grey

Single components(guideline values)

Viscosity @ 25°C Brookfield mPas 127,000 257,000Viscosity @ 40°C Brookfield mPas 40,000 84,000Gel time @ 90°C/110°C/120°C Gelnorm min 420 / 45 / 15 650 / 85 / 30Minimum curing time h/°C 1h/ 220°C 1h/ 220°C


1h/120°C + 1h/200°C 1h/120°C + 1h/200°C

Glass transition temperature ISO 6721/94 °C 160 160Hardness DIN 53505 Shore D 90 D 92Tensile strength ISO 527 MPa 87 93Elongation at break ISO 527 % 0.4 0.5Thermal expansion coefficient DIN 53752 ppm/K 25 (40°C - 160°C)

38 (160°C - 200°C)21 (40°C - 160°C)50 (160°C - 200°C)


ISO 8894/90 W/mK 2.3 3.0

Flammability UL 94 Grade V-0 (internal test, not listed) V-0 (internal test, not listed)


IEC 250 % 2.6 -


@ 50 Hz/ 25°CIEC 250 [-] 5.1 -

Specific volume resistivity @ 25°C IEC 93 Ωcm (1 kV) 3.6x1014

(100 V) 4.7x1014

Product Resin CW 1312 GB XB 2710

(LMB 5669)XB 2710(LMB 5669)

Hardener HY 1300 HY 1300 XB 2711(LMB 5670)

Aratherm™


Application Electro motors, generators, power modules, solenoids,power diodes ...

Key properties high thermalconductivityλλλλ = 1.0 W/mK)room temperaturecuring possible

high thermalconductivityλλλλ = 1.3 W/mKroom temperaturecuring possible

high thermalconductivityλλλλ = 1.5 W/mKmix ratio:1 : 1 by volume

Colour of casting beige grey grey

Single components andmixture (guideline values)

Mix ratio Resin / Hardener pbw 100/9 100/8 100/100Viscosity @ 25°C Resin mPas 32,500 45,000 15,000 (60°C)

Hardener mPas 190 190 30,000Mixture mPas 14,500 25,000 5,000 (60°C)

Gel time @ 25°C/40°C/60°C Gelnorm min 180 / 95 / 40 65 / 50 / 20 35 / 15 / 5 (90,110 u.120°C)

Minimum curing time h/°C 48h/RT or4h 60°C

48h/RT or4h/60°C


4h/40°C + 2h/60°C 4h/40°C + 2h/60°C 1.5/90°C + 1h/150°C

Glass transition temperature ISO 6721/94 °C 29 55 120Hardness DIN 53505 Shore D 58 D 89 D 92Tensile strength ISO 527 MPa 5 - 7 79 70Elongation at break ISO 527 % >15 0.7 0.5Thermal expansioncoefficient

DIN 53752 ppm/K 103 (23°C - 82°C) - -


ISO 8894/90 W/mK 1.0 1.3 1.5

Flammability UL 94 Grade V-0 3,2 mm V-0 (internal test,not yet listed)

V-0 (internal test,not yet listed)


IEC 250 % 14.7 4.2 1.2


@ 50 Hz/ 25°CIEC 250 [-] 7.4 4.9 4.7

Specific volume resistivity @25°C

IEC 93 Ωcm (100 V) 2.6x1011

(100 V) 5.8x1014

(100 V) 2.3x1015

Ciba Specialty Chemicals Inc.

Performance Polymers

Trademark

APPROVED TO ISO 9000 ff

All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from results of tests carried out by us are based on the

current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied

by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility

therefore. The Buyer shall ensure that the intended use of the products will not infringe any third party’s intellectual property rights. We warrant that our products

are free from defects in accordance with and subject to our general conditions of supply.

DS-SRS501T REV1

PRODUCT DESCRIPTION

MAXIGLOWTM 501T is a RoHS compliant, two-part,

silver based conductive epoxy developed for electrical,

thermal and mechanical attachment of surface mount

devices to flexible substrates. MAXIGLOWTM 501T

forms a strong bond with polyester and thermoplastic

substrates, surface mount electronic devices, and

printed circuit boards. MAXIGLOWTM 501T provides

process flexibility, and is resistant to harsh environ-

mental attacks. MAXIGLOWTM 501T is optimized for

flexible circuit component assembly using MAXI-

GLOWTM DS-1 and other SunRay silver conductor

inks.

KEY BENEFITS Rapid cure at low temperatures Long shelf life High die shear strengthResistant to Ag migration Outstanding corrosion resistanceLow outgassingExcellent ductility for component attach to flex cir-

cuits

RECOMMENDED PROCESSING Substrates: Polyester, thermoplastic substrates,

ceramic substrates and packages, printed circuit substrates, printed wiring boards, lead frames

Substrate cleaning: Rinse contaminated

substrates with isopropanol before screening Epoxy application: Screen printing1, stenciling2

Mixing: Supplied as two components which must

be mixed before application. The typical ratio is 4% of catalyst to 96% of conductive epoxy, by weight

Typical box oven cure conditions: 45 min at

75C, OR 30 min at 100C, OR 20 min at 150C Dilution & cleanup solvent: Dibasic ester-1

MAXIGLOW™ Ag EPOX-

IES

SunRay Scientific offers high

performance silver epoxies for

structural attachment of sur-

face mount devices on a

variety of substrates such as

polyester, PCBs, PWBs and

lead frames.

PROVEN RELIABIL ITY

Our epoxies are RoHS

compliant and have been used

in flex circuits in appliances

and telecom for over 15 years

without any failures in the field.

CUSTOM SOLUTIONS

We work c losely wi th

customers to tailor the viscosity

and resistivity to their

requirements.

MAXIGLOW™ 501T Conductive Ag Epoxy

TYPICAL PROPERTIES OF UNCURED EPOXY

PROPERTY SPECIFICATION

Viscosity at RT (Brookfield RV #6, 10 rpm)

>60,000 cP

Solids, Percent 90%

Filler Silver flake

Binder Catalyzed epoxy

Shelf life 6 months at 22C1

Pot life 4-6 hrs dependent

on mass

Appearance Dark silver

Density 1.77 g/cc

TYPICAL PROPERTIES OF CURED

EPOXYPROPERTY SPECIFICATION

Glass transition temperature (Tg)

50C

Coefficient of thermal expansion (CTE) below Tg

67 ppm/C

Shrinkage < 4.4%

Thermal conductivity > 5 W/mK

Die shear strength Meets MIL STD 883

Method 2006

Volume resistivity < 0.3 m cm

Elastic modulus (ISO 527-2)

3600 N/mm2

Adhesion (DIN 1465) > 8.5 N/mm2

Operating temperature Max. 180C

Uncatalyzed condition

Screen printing: 325 WPI Stainless Steel Mesh, 1.5 mil dia wire, 0..5 mil emulsion

Stenciling: 4 mil thick

DS-SRS501S REV-

PRODUCT DESCRIPTION

MAXIGLOWTM 501S is a RoHS compliant, one-part,


thermal and mechanical attachment of surface mount

devices to flexible substrates. MAXIGLOWTM 501S

forms a strong bond with polyester and thermoplastic

substrates, surface mount electronic devices, and

printed circuit boards. MAXIGLOWTM 501S provides


mental attacks. MAXIGLOWTM 501S is optimized for

flexible circuit component assembly using MAXI-

GLOWTM DS-1 and other SunRay silver conductor

inks.

KEY BENEFITS

Rapid cure at low temperatures

Long shelf life

High die shear strength

Resistant to Ag migration

Outstanding corrosion resistance

Low outgassing

Excellent ductility for component attach to flex cir-

cuits

RECOMMENDED PROCESSING

Substrates: Polyester, thermoplastic substrates,

ceramic substrates and packages, printed circuit

substrates, printed wiring boards, lead frames


substrates with isopropanol before screening

Epoxy application: Syringe dispensing1


75˚C, OR 30 min at 100˚C, OR 20 min at 150˚C

Dilution & cleanup solvent: Dibasic ester-1

supplied by DuPont


IES







lead frames.

PROVEN RELIABIL ITY



in flex circuits in appliances

and telecom for over 15 years

without any failures in the field.

CUSTOM SOLUTIONS




requirements.

MAXIGLOW™ 501S Conductive Ag Epoxy

TYPICAL PROPERTIES OF UNCURED

EPOXY



>60,000 cP

Solids, Percent 90%

Filler Silver flake


Shelf life 6 months at 22˚C1


on mass


Density 1.77 g/cc


EPOXY


Glass transition

temperature (Tg) 50˚C

Coefficient of thermal

expansion (CTE) below Tg 67 ppm/˚C

Shrinkage < 4.4%



Method 2006

Volume resistivity < 0.3 mΩ cm

Elastic modulus (ISO 527-

2) 3600 N/mm2


Operating temperature Max. 180˚C


Syringe dispensing: 0.024" dia needle (20 gauge)

DS-SRS502T REV1

PRODUCT DESCRIPTION

MAXIGLOWTM 502T is a RoHS compliant, two-part,


thermal and mechanical attachment of semiconductor

die and other substrates to leadframes, printed wiring

boards and ceramics. MAXIGLOWTM 502T provides


ments.

KEY BENEFITS

Extremely low ionic impurity levels


Long shelf life




Low outgassing


Substrates: Ceramic substrates and packages,

printed circuit substrates, printed wiring boards,

lead frames



Mixing: 502T epoxy is supplied as two components

which must be adequately mixed before applica-

tion. The typical ratio is 4.0% of catalyst to 96% of

conductive epoxy, by weight. Hand stirring is typi-

cally sufficient but a small hand stirrer might elimi-

nate human mixing error

Epoxy application: Screen printing1, stenciling2




supplied by DuPont


IES







lead frames.

PROVEN RELIABIL ITY



in appliances and telecom for

over 15 years without any

failures in the field.

CUSTOM SOLUTIONS




requirements.

MAXIGLOW™ 502T Conductive Ag Epoxy


EPOXY



>60,000 cP

Solids, Percent 90%

Filler Silver flake




on mass


Density 1.77 g/cc


EPOXY


Glass transition




Shrinkage < 4.4%



Method 2006



2) 3600 N/mm2


Ionic content (ppm)

Cl-

Na+

K+

< 20



Screen printing: 325 WPI Stainless Steel Mesh, 1.5 mil dia wire, 0..5 mil emulsion

Stenciling: 4 mil thick

DS-SRS502S REV-

PRODUCT DESCRIPTION

MAXIGLOWTM 502S is a RoHS compliant, one-part,


thermal and mechanical attachment of semiconductor

dies and other substrates to leadframes, printed wiring

boards and ceramics. MAXIGLOWTM 502S provides


ments.

KEY BENEFITS

Extremely low ionic impurity levels


Long shelf life




Low outgassing


Substrates: Ceramic substrates and packages,

printed circuit substrates, printed wiring boards,

lead frames



Epoxy application: Syringe dispensing1




supplied by DuPont


IES







lead frames.

PROVEN RELIABIL ITY



in appliances and telecom for

over 15 years without any

failures in the field.

CUSTOM SOLUTIONS




requirements.



EPOXY



>60,000 cP

Solids, Percent 90%

Filler Silver flake




on mass


Density 1.77 g/cc


EPOXY


Glass transition




Shrinkage < 4.4%



Method 2006



2) 3600 N/mm2


Ionic content (ppm)

Cl-

Na+

K+

< 20



Syringe dispensing: 0.024" dia needle (20 gauge)

DS-SRS502S REV-

STORAGE AND D ISPOSAL

Unopened containers of silver filled epoxy can be

stored for up to 6 months at 40˚F and for up to 10

months at 0˚F. Catalyzed epoxy should be used within

6 hours (pot life). The viscosity of blended material will

vary during the pot life period. Unopened containers of

catalyst can be stored for up to 6 months at 70˚F.

Dispose of properly. Generally as a solid it can be

reclaimed as a highly silver filled material and sold to a

reclaiming organization. Often all associated debris

from the operation can be sold to a reclaiming organi-

zation for the silver content. We will be happy to assist

in developing a cost effective mechanism for any cus-

tomer requiring support.

SAFETY AND HANDLING

Use with adequate ventilation. This product

contains organic solvents as well as silver flakes

Avoid skin contact

Avoid eye contact with catalyst to prevent eye

damage

If skin contact occurs wash immediately with soap

and water

Avoid breathing the vapor

Refer to MSDS for more details


For more information on

any of our products or

services contact us.

New Jersey:

SunRay Scientific

100 Technology Way,

Mt. Laurel, NJ 08054

Tel:856-439-0799

Fax:856-439-0154

Indiana:

SunRay Scientific

296 Gradle Drive

Carmel, IN 46032

Tel:317-848-2744

Fax:317-848-2744

CL ICK TO:

V IS IT OUR WEBSITE

www.sunrayscientific.com

EMAIL US

[email protected]

THIS TECHNICAL INFORMATION IS BASED ON DATA BELIEVED TO BE RELIABLE. HOW-

EVER, NO WARRANTY IS EXPRESSED OR IMPLIED WITH RESPECT TO ACCURACY OF

RESULTS AND SUNRAY SCIENTIFIC ASSUMES NO LIABILITY ARISING OUT OF ITS USE.

USERS SHOULD CONDUCT THEIR OWN TESTS TO DETERMINE THE SUITABILITY OF THIS

PRODUCT FOR THEIR APPLICATION.

Home Page Abbreviated Contents Customer Login Quick Order / View Order

Contact Us Search Indexes Finish Order

Conductive Adhesives Comparison TablePrintable Version (PDF 38KB)

Carrier Application

Prod. No. Description FormServiceTemp.

CureTemp.

ConductiveMedia(%)

Binder SolventMechanicalStrength

SheetResistance

@1mil(ohms/sq)

RoHsCompliant

MountingUse InHigh

Vacuum

EDX/EDS

EMI/RFShield

Cleaving

Thermo-conductivityBTU-in/ft2-

hr-F°

16058GraphiteAerosol283.5G

aerosol 200°C graphitethermo-plastic

resinisopropanol medium 1200 X X X

16051

PELCOConductiveGraphite,50g

paint 140°C graphite

22%gel water low 30 X X X X

16053

PELCOConductiveGraphite,30g

paint

binder93°C

service204°C

graphite

20%cellulose resin Isopropanol low 1200 X X X X

16056Electrodag502, 30g

paint-40°C to260°C

carbon12.6%

flouroelastomerresin

MEK medium 130 X X X X

16046Leit-C-Plast15g

putty 120°C carbonproprietary

puttyethanol medium X X X X

16022PELCO GoldPaste, 2g

paste-200°C to

65°C gold 75% lacquer

16021Gold/SilverExtender

low .02-.05 X X

16031,34

PELCOColloidalSilver, 30gor 15g

paint 200°C silver 60% lacquer16021

Gold/SilverExtender

medium .02-.04 X X

16032

PELCOColloidalSilver Paste,25g

paint 200°C silver 60% lacquer16021

Gold/SilverExtender

medium .02-.05 X X

16035Leitsilber200, SilverPaint, 30g

paint 120°C silver 45%cellulose nitride

lacquer

ethoxypropanol

or16021

Extender

low .02-.04 X X X

16045

PELCOConductiveSilver 187,30g

paint 100°C silver 50% acrylic resin acetone high .015 X X

16047

PELCO HighPerformanceSilver Paste,50g

pastecryogenicto 927°C

93°C2hr

silver 60%inorganicsilicate

water medium 0.08 X X 63.2

16040-30

Fast DryingSilverSuspension,30g

paint 105°C silver 58%thermoplastic

resin

16048-25Silver

SuspensionDiluent

medium .015 X X

16014

SilverConductiveEpoxyH20E, 1 oz.

1:1 epoxy

200°Ccontinuous,

400° Cmax

80°Cto

175°Csilver 76%

epoxy lowviscosity2000cps

permanentbond

high .16 X X X X 13.9

16016

SilverConductiveEpoxy H22,1 oz.

100:4.5epoxy

200°Ccontinuous,300-400°

C max

80°Cto

175°Csilver 60%

epoxy highviscosity20000cps

permanentbond

high 2 X X X X 6.53

16043SilverConductiveEpoxy, 14g

1:1 epoxy-91°C to100°C

25°Cto

121°Csilver epoxy

permanentbond

high 0.4 X X 11

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Page Last Updated: November 18, 2009

Conductive Adhesives - Comparison table http://www.tedpella.com/adhesive_html/adhesive-comp.htm

1 of 1 7/23/2010 11:01 AM

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EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782

www.EPOTEK.com

Epoxies and Adhesives for Demanding Applications™ This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties

(expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product. Rev. XI Feb 2010

EPO-TEK® H20E Technical Data Sheet

For Reference Only Electrically Conductive, Silver Epoxy

Number of Components: Two Frozen Syringe Minimum Bond Line Cure Schedule*: Mix Ratio By Weight: 1:1 175°C 45 Seconds Specific Gravity: 2.67 150°C 5 Minutes Part A 2.03 120°C 15 Minutes Part B 3.07 100ºC 2 Hours Pot Life: 2.5 Days 80°C 3 Hours Shelf Life: One year at 23°C One year at -40°C Note: Container(s) should be kept closed when not in use. For filled systems, mix contents of each container (A & B) thoroughly before mixing the two together. *Please see Applications Note available on our website.

Product Description:

EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.

EPO-TEK® H20E Advantages & Application Notes: Processing info: It can be applied by many dispensing, stamping and screen printing techniques.

o Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion.

o Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness. o Stamping: small dots 6 mil in diameter can be realized.

Misc / Other notes o Many technical papers written over 30-40 year lifetime. Contact [email protected]. o Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner. o Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor

coil. o Many custom modified products available, for the following improvements: viscosity and appearance, flexibility and thermal

conductivity. Contact [email protected] for your best recommendation.

Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; *denotes test on lot acceptance basis)

Physical Properties: *Color: Part A: Silver Part B: Silver Weight Loss: *Consistency: Smooth, thixotropic paste @ 200°C: 0.59% *Viscosity (@ 100 RPM/23°C): 2,200 – 3,200 cPs @ 250°C: 1.09% Thixotropic Index: 4.63 @ 300°C: 1.67% *Glass Transition Temp.(Tg): ≥ 80°C (Dynamic Cure Operating Temp: 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) Continuous: -55°C to 200°C Coefficient of Thermal Expansion (CTE): Intermittent: -55°C to 300°C Below Tg: 31 x 10-6 in/in/°C Storage Modulus @ 23°C: 808,700 psi Above Tg: 158 x 10-6 in/in/°C Ions: Cl - 73 ppm Shore D Hardness: 75 Na+ 2 ppm Lap Shear Strength @ 23°C: 1,475 psi NH4

+ 98 ppm Die Shear Strength @ 23°C: > 5 Kg / 1,700 psi K+ 3 ppm Degradation Temp. (TGA): 425°C *Particle Size: ≤ 45 Microns Electrical Properties: *Volume Resistivity @ 23°C: ≤ 0.0004 Ohm-cm Thermal Properties: Thermal Conductivity: 2.5 W/mK Thermal Resistance: (Junction to Case) Thermal Conductivity: 29 W/mK Based on Thermal Resistance Data: R = L x K-1 x A-1

TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK® H20E (2 mils thick)

EPO-TEK® H20E: 6.7 to 7.0°C/W Solder: 4.0 to 5.0°C/W

EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782

www.EPOTEK.com

Rev X Epoxies and Adhesives for Demanding Applications™ 01/2009

EPO-TEK® H20E Suggested Applications

o Semiconductor IC Packaging Die-attaching chips to leadframes; compatible with Si and MEM’s chips, 260ºC lead-free reflow and

JEDEC Level I packaging requirements. Capable of being snap cured in-line, as well as traditional box oven techniques. Adhesive for solderless flip chip packaging and ultra fine pitch SMD printing.

o Hybrid Micro-electronics A comparable alternative to solder and eutectic die attach, in terms of thermal peformance; very

commonly no more than 1-2ºC/watt difference in thermal resistance. Die-attaching of quartz crystal oscillators (QCO) to the Au posts of TO-can style lead-frame. Used with GaAs chips for microwave/radar applications up to 77GHz. SMD attach adhesive which can be cured simultaneously with die-attach processes.

o Compatible with Au, Ag, Ag-Pd terminations of capacitors and resistor SMDs. NASA approved low outgassing adhesive. Adhesive for EMI and Rf shielding of Rf, microwave and IR devices.

o Electronic & PCB Circuit Assembly Used to make electrical contacts in acoustical applications of speakers/microphones. Electrical connection of piezo’s to PCB. Pads of PZT are connected to many kinds of circuits using

H20E, including ink jet heads, MEMs and ultrasound devices. Automotive applications include pressure sensing and accelerometer circuits. Electrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna

applications such as smart cards and RFID tags. ECA for attaching SMDs to membrane switch flex circuits. Compatible with Ag-PTF and carbon

graphite PCB pads. A low temperature “solder free” solution. Solar-Photovoltaic industry

o ECA for the electrical connection of transparent conductive oxide (TCO) to PCB pads. o Replacement of solder joints of Cu/Sn ribbon wire, from cell-to-cell; a common “solar cell

stringing” adhesive. o Die-attach of III-V semiconductor chips to substrates used in solar concentrator technology,

such as CdTe and GaAs. o An effective heat-sink on thermal substrates using Cu, BeO, aluminum nitride, etc. o Ability to be dispensed in high volumes via dots, arrays, and writing methods.

o Medical Applications USP Class VI adhesive for circuits requiring implantation/biocompatibility. Die-attaching photo diode arrays in X-ray circuits. Vibration resistant adhesive for ultrasound applications < 20 MHz frequency; making the electrical

connection of PZT to Au/PCB substrate. Electrical connections of die, SMDs and QCO for pacemaker hybrid circuits. A common ECA for hearing aid applications using hybrid, ECM or MEMs technology.

o Opto-Electronic Packaging Applications Adhesive for fiber optic components using DIP, Butterfly or custom hybrid IC packages. As an

ECA, it attaches waveguides, die bonds laser diodes and heat sinks the high power laser circuits. Die-attaching IR-detector chips onto PCBs or TO-can style headers. Die-attaching LED chips to substrates using single chip packages, or arrays.

o Adhesion to Ag, Au and Cu plated leadframes and PCBs. Electrical connection of ITO to PCBs found in LCD industry.

o A low temp ECA for OLED displays and organically printable electronics.

Contents

semiconductor Market solutions

Discrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Quad Flat no-Lead (QFn) . . . . . . . . . . . . . . . . . . . . . . 11

Dynamic Random Access Memory (DRAM) . . . . . . . 14

Ball Grid Array/Chip scale Package (BGA/CsP) . . . . 15

Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

semiconductor Materials

Die Attach Adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . 21

semiconductor Underfills . . . . . . . . . . . . . . . . . . . . . . 26

Hysol® semiconductor encapsulants . . . . . . . . . . . . . 29

Hysol® thermal Compression Materials . . . . . . . . . . 31

Hysol® Coating Powders . . . . . . . . . . . . . . . . . . . . . . . 33

Hysol® electronic Molding Compounds . . . . . . . . . . . 34

Hysol® and Hysol® Huawei™ semiconductor

Molding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Multicore® Accurus™ solder spheres . . . . . . . . . . . . . 44

Periodic table of elements . . . . . . . . . . . . . . . . . . . . . 48

2

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Please see LT-5012 for PCB Assembly Solutions Guide

Please see LT-5014 for Flat Panel Display Solutions Guide

4

Across the Board,Around the Globe .www .henkel .com/electronics

SeMiconductor Market SolutionS

™

5

diScrete coMPonentS

conductive

da100™ (Solder)

2600at™

non-conductive

electronic Molding Compounds

gr2220™

gr2310™

encapsulants

fP0087™ green

Discrete Components

QMi529Ht™

8008Ht™ (Wbc)

gr2710™

gr2811™

Mg40fS™

QMi536Ht™

QMi547™

gr15f-a™

gr15f-1™

gr360a-f8™

gr750™

gr750-Sc™

non-green

kl1000-3lX™

kl1000-4t™

kl5000-Ht™

Mg15f™

gr750Ht-25™

klg100™

klg200™

fS849-ti™

Molding CompoundsDie Attach Adhesives

Product descriPtionFinish

(cu, Ag, Au)Mrt

electricAl conductivity

disPensAbilitycure

schedule

therMAl conductivity,

W/mK

QMi529ht™For component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.

Ag, Au L1 - 260 4 x 10-5 Fair≥ 60 sec @ 185°C

(SkipCure™)30 min @ 185°C (Oven)

7.0

2600At™High thermal conductivity adhesive for thermal management applications.

Cu, Ag, Au L3 - 260 5 x 10-5 Fair30 min ramp to 200°C

+ 15 min @ 200°C20

8008ht™ (Wbc)High electrical and thermal conductivity die attach. Excellent temperature resistance.

Ag, Cu, Au L1 - 260 6 x 10-5 NAB-stage +

20 sec @ 280°C11

Fs849-ti™ High thermal conductivity adhesive with low electrical resistance. Ag, Au L2 - 260 2 x 10-5 Good15 min ramp to 175°C

+ 30 min @ 175C7.8

die attacH adHeSiveS: conductive

SeMiconductor Market SolutionS

Advertise with MatWeb!

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Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating Compound

Categories: Polymer; Adhesive; Thermoset; Epoxy

MaterialNotes:

TRA-BOND 2153 is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASAOutgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and otherheat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, highimpact bonds at room temperature which improve heat transfer while maintaining electrical insulation.TRA-BOND 2153 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics,glass, plastics and many other materials, because its coefficient of thermal expansion provides a good matchfor those materials over a farily wide temperature range. Fully cured TRA-BOND 2153 provides excellentresistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents,lubricating oils, and alcohol.

Information provided by Tra-Con Inc.

Vendors: Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

Printer friendly version Download as PDF Download to Excel (requires Excel and Windows)

Export data to your CAD/FEA program Add to Folder: 0/0

Physical Properties Metric English Comments

Specific Gravity 2.45 g/cc 2.45 g/cc Mixed

Solids Content 100 % 100 % Reactive Solids Content Mechanical Properties Metric English Comments

Hardness, Shore D 90 90 Electrical Properties Metric English Comments

Volume Resistivity 5.50e+15 ohm-cm 5.50e+15 ohm-cm

4.00e+13 ohm-cm@Temperature 100 °C

4.00e+13 ohm-cm@Temperature 212 °F

Dielectric Constant 6.00@Frequency 1000 Hz

6.00@Frequency 1000 Hz

Dielectric Strength 16.1 kV/mm 410 kV/in

Dissipation Factor 0.0100@Frequency 1000 Hz

0.0100@Frequency 1000 Hz

Thermal Properties Metric English Comments

CTE, linear 18.0 µm/m-°C@Temperature 20.0 °C

10.0 µin/in-°F@Temperature 68.0 °F

Thermal Conductivity 1.00 W/m-K 6.94 BTU-in/hr-ft²-°F

Maximum Service Temperature,Air

125 °C 257 °F

Minimum Service Temperature,Air

-70.0 °C -94.0 °F

Glass Transition Temp, Tg 110 °C 230 °F Ultimate Tg Processing Properties Metric English Comments

Cure Time 120 - 240 min 2.00 - 4.00 hour At 65°C

1440 min 24.0 hour At 25°C

Pot Life 30.0 min 30.0 min Descriptive Properties

Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating... http://www.matweb.com/search/datasheet.aspx?matguid=44c864f2364...

1 of 2 7/23/2010 11:16 AM

Color Dark GrayMix Ratio, parts by weight 100/7 Resin/HardenerOutgassing, NASA Passes

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Usersrequiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalentunits. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer toMatWeb's disclaimer and terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered intoMatWeb.

Users viewing this material also viewed the following:Tra-Con Tra-Bond 2151 Thermally Conductive Electrically Insulating CompoundTra-Con Tra-Bond 2152 Thermally Conductive Electrically Insulating CompoundTra-Con Tra-Bond 2154 Thermally Conductive Electrically Insulating CompoundTra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating CompoundTra-Con Tra-Bond 2155 Thermally Conductive Electrically Insulating Compound

PTRAC035 / 70963

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Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating... http://www.matweb.com/search/datasheet.aspx?matguid=44c864f2364...

2 of 2 7/23/2010 11:16 AM

Product Company Thermal

conductivity

a,b,c axis

[W/mK]

Additional information

PYROID® HT pyrolytic

graphite

Minteq

1700[a], 7[c]

Sheets up to 30 cm2 and thickness from

0.25 to 1.3 mm

TPG Thermal

management material

Adv.

Ceramics/Momentive

1500[a,b],

<20[c]

Layered structur. Easily machined,

provided as plates or as final shapes.

Thickness from less than 0.25 mm to

over 5 mm

TC1050 Thermal

management material

Adv.

Ceramics/Momentive

TPG core encapsulated in various

structural materials: Aluminum, copper,

kovar, tungsten/copper, carbon

Pyrolytic Graphite Adv.

Ceramics/Momentive300[a,b], 3.5

[c]

Chemically inert, high purity,

impermeable, self‐lubricating, non‐

TCPG‐plate Optigraph

1700/100

150 mm x 30 mm x 0.5(+1) mm,

other sizes on request

TCPG‐film Optigraph

1900

Thickness 50‐500 µm,

size on request

PGS Graphite Sheets Panasonic 700‐1600

ECOPHIT SGL Group 250‐500

DIAFILM TM100: CVD

Diamond

Element 6

>1000

10x10 mm, 0.25 mm thick

DIAFILM TM150: CVD

Diamond

Element 6

>1500


DIAFILM TM180: CVD

Diamond

Element 6

1800


POCO HTC POCO 245 (out of

plane), 70 (in

plane)

Eventual fillers: copper, polymer or

additional carbon. Wetted by liquid

nitrogen, methanol, Fluorinert™

POCO Foam POCO 135 (out of

plane), 45 (in

plane)

Structure of highly aligned graphitic

ligaments within the foam’s cell walls.

K Foam Grade D KOPPERS 110 (z‐dir)

K Foam Grade L1a KOPPERS 55 (z‐dir)

K Foam Grade L1 KOPPERS 55 (z‐dir)

Aluminum Nitride

Ceramics (AlN)

Sumitomo

95 410 x 95 x 0.6mm sheets

CVD Diamond Sumitomo >1000

Structural Materials

Product Company Thermal

conductivity

[W/mK]

Density

[g/cc]

Additional information

3‐6652 Thermally

Conductive

Encapsulant

Dow Corning

1.9 2.7

Two‐Part. Low modulus;

thixotropic; good thermal

conductivity

3‐6655 Thermally

Conductive

Encapsulant

Dow Corning

1.8 2.7

Two‐part. Low viscosity; soft;

excellent thermal conductivity;

UL 94 V‐0.SE4490CV

Thermally

Conductive

Compound

Dow Corning

1.7 2.62

One‐Part. Non‐curing, thermally

conductive silicone paste

TC‐5021 Thermally

Conductive

Compound

Dow Corning

3.3 3.5

One‐part. Non‐curing, thermally


TC‐5022 Thermally

Conductive

Compound

Dow Corning

4 3.23

One‐part. Non‐curing, thermally


XB 2731 Ciba Aratherm™ 3

XB 2730 Ciba Aratherm™ 2.3

XB 2721

(LMB 5665)

Ciba Aratherm™

2

MAXIGLOW™ 501/502 Sunray scientific 5 1.77 Ag, Au.

Pelco High Performance Silver

Paste. PELCO® 16047

TedPella

9.1 2.3

Ag (20 um flakes). Requires a 2

hour cure at 93°C (200 °F) to

achieve stated high conductivity

Silver Conductive Epoxy, H2OE

Epo‐Tek®

TedPella

2.5

Ag (20 um flakes)

Loctite 9497 Henkel 1.4

QMI505MT™ Henkel: Ablestik 2.4 Au.

QMI519™ Henkel: Ablestik 3.8 Ag, Au. High adhesion.

QMI529HT™ Henkel: Ablestik

7

Ag, Au. For component or die

attach. Suitable for

devices and solder replacement QMI718™ Henkel: Ablestik 2.7 Cu.

8290™ Henkel: Ablestik

1.6

Ag,Cu,Au. Low stress die attach

adhesive suitable for die size

<200 mil.

Tra‐Con Tra‐Bond 2153 Ellsworth Adhesives 1 2.45

Tra‐Con Supertherm 826M01 Ellsworth Adhesives 2.3 2.55 Diamond.

SUPERTHERM 816H01 Ellsworth Adhesives 2 1.3

Premium Silver Thermal Epoxy Arctic Silver 7

Adhesives

References

Structural Materials

1. CYTEC http://www.cytec.com/engineered-materials/carbon-fiber-index.htm http://www.cytec.com/engineered-materials/thermalgraph.htm http://www.cytec.com/engineered-materials/carbon-fiber-index.htm

2. Minteq http://www.minteq.com/our-products/minteq-pyrogenics-group/pyroid-pyrolytic-graphite/pyrolytic-film-foil/

3. Advanced Ceramics/Momentive http://www.advceramics.com/

4. Optigraph http://www.optigraph.eu/thermographite.html

5. Graphite Machining http://www.graphitemachininginc.com/pyrolytic-graphite.html

6. Panasonic http://industrial.panasonic.com/www-ctlg/ctlg/qAYA0000_WW.html

7. SLG Group http://www.sglgroup.com/cms/international/products/product-groups/eg/ecophit-graphite-powder/index.html?__locale=en

8. Sumitomo http://www.sumitomoelectricusa.com/scripts/products/ts/hs_mat6.cfm

9. Element 6 http://www.e6.com/en/businessareas/e6technologies/products/title,197,en.html

10. POCO Graphite http://www.poco.com/MaterialsandServices/ThermalMaterials/POCOHTC/tabid/125/Default.aspx

11. Nanocyl http://www.nanocyl.com/en/CNT-Expertise-Centre/Carbon-Nanotubes

http://www.cytec.com/engineered-materials/carbon-fiber-index.htm

http://www.cytec.com/engineered-materials/thermalgraph.htm

http://www.cytec.com/engineered-materials/carbon-fiber-index.htm

http://www.minteq.com/our-products/minteq-pyrogenics-group/pyroid-pyrolytic-graphite/pyrolytic-film-foil/

http://www.minteq.com/our-products/minteq-pyrogenics-group/pyroid-pyrolytic-graphite/pyrolytic-film-foil/

http://www.advceramics.com/

http://www.optigraph.eu/thermographite.html

http://www.graphitemachininginc.com/pyrolytic-graphite.html

http://industrial.panasonic.com/www-ctlg/ctlg/qAYA0000_WW.html

http://www.sglgroup.com/cms/international/products/product-groups/eg/ecophit-graphite-powder/index.html?__locale=en

http://www.sglgroup.com/cms/international/products/product-groups/eg/ecophit-graphite-powder/index.html?__locale=en

http://www.sumitomoelectricusa.com/scripts/products/ts/hs_mat6.cfm

http://www.e6.com/en/businessareas/e6technologies/products/title,197,en.html

http://www.poco.com/MaterialsandServices/ThermalMaterials/POCOHTC/tabid/125/Default.aspx

http://www.poco.com/MaterialsandServices/ThermalMaterials/POCOHTC/tabid/125/Default.aspx

http://www.nanocyl.com/en/CNT-Expertise-Centre/Carbon-Nanotubes

Adhesives

12. Dow Corning http://www.dowcorning.com.cn/zh_CN/content/publishedlit/10-900C-01.pdf?DCWS=Electronics&DCWSS=Thermal%20Interface%20Wet%20Dispensed

13. Aratherm/Ciba

http://www.lindberg-lund.no/files/Tekniske%20datablad/VAN-XB2720-TG.pdf

14. Sunray maxiglow http://www.sunrayscientific.com/epoxy.html

15. TedPella http://www.tedpella.com/SEMmisc_html/SEMpaint.htm#16047 http://www.tedpella.com/technote_html/16047-TN-V1-06232009.pdf

http://www.epotek.com/

16. Henkel: ablestik http://www.henkelna.com/us/content_data/115004_LT5013_Catalog_Semiconductor_Solutions.pdf

17. Tra-bond technical sheets: http://www.matweb.com/search/GetMatlsByTradename.aspx?navletter=T&tn=Tra-Bond

http://www.dowcorning.com.cn/zh_CN/content/publishedlit/10-900C-01.pdf?DCWS=Electronics&DCWSS=Thermal%20Interface%20Wet%20Dispensed

http://www.dowcorning.com.cn/zh_CN/content/publishedlit/10-900C-01.pdf?DCWS=Electronics&DCWSS=Thermal%20Interface%20Wet%20Dispensed

http://www.lindberg-lund.no/files/Tekniske%20datablad/VAN-XB2720-TG.pdf

http://www.sunrayscientific.com/epoxy.html

http://www.tedpella.com/SEMmisc_html/SEMpaint.htm#16047

http://www.tedpella.com/technote_html/16047-TN-V1-06232009.pdf

http://www.epotek.com/

http://www.henkelna.com/us/content_data/115004_LT5013_Catalog_Semiconductor_Solutions.pdf

http://www.henkelna.com/us/content_data/115004_LT5013_Catalog_Semiconductor_Solutions.pdf

http://www.matweb.com/search/GetMatlsByTradename.aspx?navletter=T&tn=Tra-Bond