Upload
others
View
1
Download
0
Embed Size (px)
Citation preview
Optimizing Smart Manufacturing -Reducing Cost and Time-to-Market with New Sensing and Communication Technologies
Vipin Bothra
Santa Clara, CA
May 2019
Optimizing Smart ManufacturingOptimizing Smart Manufacturing -- Reducing Cost and Time-to-Market with New Sensing and Communication Technologies
While consumer devices led the introduction of solid-state sensors, Industrial applications are driving innovations for best-in-class sensors coupled with communication technologies. Designing for Industrial environments requires addressing the unique challenges of noise robustness, interoperability and real-time operation. This session will cover:• Latest developments in sensors (Accelerometers, Gyroscopes, Microphones, Temperature, Humidity
and Time-of-Flight);
• Communication solutions (real-time Ethernet and IO-Link) for the Industrial applications;
• Examples of ready-to-implement solutions that address challenges in cost and time-to-market.
2
Smart IndustrySmart Industry Focus 3
Internet connected Industrial devices
Billionsof installed devices
ST SAM ($Bn) 2017 2020 CAGR
Manufacturing & Process Automation
9.4 12.8 12%
Medical 4.3 5.9 11%
Military & CivilAerospace
3.0 3.7 8%
Power & Energy 5.0 6.9 11%
Source: IHS Markit, ABI Research
Focus Growth Areas
0
2
4
6
8
10
12
2017 2018 2019 2020 2021
Utilities, Industrial IoT, Retail, Advertising, and Supply Chain
1st
Mechanical production equipment driven by water
and steam power
Industrial Revolution 2nd
Mass production achieved by division of labour
concept and the use of electrical energy
Industrial Revolution 3rd
Based on the use of electronics and IT to
further automate production
Industrial Revolution 4th
Use of cyber-physical systems, communications,
IoT and decentralized decisions
Industrial Revolution
18th century 20th century 1970’s Today
All new machines Change of driving mechanism
Machines largely replaced
Machines partially replaced - connected
From Industry to Smart Industry 4
Big data & Cloud computing
Local, mass customized production
Producing more efficiently and in more environmentally friendly manner
Evolved man-machine cooperation
Safer working environments
More efficient operation
Less waste
Collecting and using manufacturing and supply chain data better
Responding to demand more flexibly and with more
customization
With a better and safer human experience
How will Industry evolve? 5
Industrial Sensors 6
Temperature sensorsAnalog and digital contact temperature sensors
Humidity sensorsCombo humidity and temperature sensor
Pressure sensorsWith water proof solutions
Accelerometer Ultra Wide Bandwidth, Ultra low power
GyroscopeWide Bandwidth and Smart Features
MagnetometerLow-Noise, Low Power
MicrophonesAnalog, digital, top and bottom port solutions
Time of FlightHigh precision, surface agnostic distance measure
Environmental
Motion
Acoustic
Optical
Time of FlightVL53L0X: World’s smallest ToF Ranging sensor
• Fully integrated (IR 940nm Vcsel emission, filters, SPAD receiving array, advanced µC)
• Various operating modes available:• Long range: Up to 4 meters (white target, dark, 33ms)• High-Accuracy: Up to +/- 3%• Low power: 10uA-standby, ~200uA in nominal operation • High-Speed: Configurable timing budget (up to 30Hz)
• Better ambient light robustness and no visible red glow (940nm)• Laser Class1 device (eye safe)• Complete Android SW driver provided by ST
7
OLGA: 4.9x2.5x1.56 mmFoV: 15-27° (programmable)
VL53L1X ApplicationsObject / user detection• Autonomous mode with interrupts• Vacuum cleaners: Obstacle avoidance• Smart home• IoT
Simple & robust gesture recognition• Control of devices• Loudspeaker• Coffee machines• White goods
Connectivity Optionsto Match the Needs of Industrial Environments
8
P2p, Industrial Fieldbus, Industrial Ethernet
Wired Connectivity Wireless Connectivity
Retrofit, flexibility of technologies and protocols, interoperability with Ethernet and Cloud
Any Industrial protocol for any STM32
And more ..
Wired ConnectivityIO-Link: from ICs to Development support
9
STEVAL-IFP016V2
L6360Single port Master PHY for IO-Link and SIO mode
• Supply voltage up to 32.5 V• Up to 200 mW max. power dissipation• Over-voltage (>36 V) and over-temperature protection• ESD protection according IEC 61000-4-2• Conform to IEC 61000-4-4, IEC 61000-4-5
L6362ATransceiver Device for IO-Link and SIO mode
• Configurable Output stage: High Side, Low Side, Push-Pull• Reverse Polarity and Surge protections on chip• Up to 400 mA output Current with Overload and Cut-OFF
protections • 5 V or 3.3 V / 8 mA selectable linear regulator
STEVAL-IFP017V3
10
Wide STM32 offer as host controller
All real-time Ethernet slave stacks available
Industrial IoT and Industry 4.0MQTT and OPC-UA
Hilscher netX connects the STM32 to Real-Time Ethernet
Wired ConnectivityRT Ethernet development partner
11
IEEE 802.3 Ethernet PHY
IEEE 802.3 Ethernet MAC Dedicated slave controller
TCP/IP UDP
Ethernet/IPPROFINETModbus TCP
…
Ethernet/IPPROFINET
RT…
Ethernet/IPEtherCATCC-Link IE
PROFINET IRTSercos IIIVaran …
…
Hardware
Software
User application
IEEE 802.3 Ethernet PHY
User application
Real-timecapability
~1 ms ~10 µs
Priority Scheduling
Latency
Managed switch controller
Bandwidth
NUCLEO-F767ZI + netSHIELDSTM32 Nucleo-144 development
board with STM32F767ZI
Wired ConnectivityDemanding real-time application solutions
Connectivity Optionsto Match the Needs of Industrial Environments
12
P2p, Industrial Fieldbus, Industrial Ethernet
Wired Connectivity Wireless Connectivity
Retrofit, flexibility of technologies and protocols, interoperability with Ethernet and Cloud
Any Industrial protocol for any STM32
And more ..
ST BLE Portfolio Roadmap13
PERFORMANCE LINE
FEAT
UR
ES
BlueNRG-MSBLE4.1 Network processor
QFN32, WLCSP34
BlueNRG-2BLE5.0 Application processor
Cortex-M0 32MHz, 256KB QFN32, QFN48, WLCSP34
STM32WBxxBLE5.0 Application processor
Multi-standard: Thread, Zigbee, prop 2.4GHzDual core Cortex-M4 / M0+
Flash: 256K up to 1MBRAM: 128K up to 256K
UQFN48, VQFN64, WLCSP100
BlueNRG-LPBLE5.0 Application processorCortex-M0+ 64MHz, 256KB
Flash, up to 36 GPIOsQFN, WLCSP
(in development)
Single Core BLE
Dual-Core BLE
BlueNRG-1BLE4.2 Application processor
Cortex-M0 32MHz, 160KB QFN32, WLCSP34
VALUE LINE
BlueNRG-2 SoC at a GlanceThe lowest power
consumption
>3 years lifetime on CR2032(*)
25 µA/MHz0.9 µA sleep
(*) Based on the average current consumption in connection mode (7.059 μA, connection interval 1000 ms)
Low-power architecture, Cortex-
M0 @ 32 MHz
Flexible memoryarchitecture
256 KB eFLASH24 KB ULL SRAM
(with full SRAM data retention)
Processing power on demand
Maximum security
ECC-256AES-128
Factory UIDSecure KEY
Optimized BLE Radio stack
70 kB FLASH8 kB RAM
0.9uA with full RAM retention
Sensors
Robust and Reliable BLE Link
Comprehensive tools for developers
Seamless connection with SENSORS
Small form factor
Privacy 1.2 and secure connection 4.2
Faster and more reliable data transfer
Bluetooth 5.0 certified
Low power budget
5 data
14
BlueNRG for 2.4 GHz Proprietary RadioWireless Link Through a Proven 2.4 GHz Radio
Open RF SoC solutionUltra-low latency RF link (~100µs) for HID and gaming solutions
• Built-in acknowledge mechanism• Proprietary implementation possible• Improved data rate (~600 Kbps)• Small memory footprint (~5 Kbyte)• Encryption feature supported
15
Extending Bluetooth’s Capabilities
one-to-onePAIRING
DATA TRANSFER- Sports & fitness devices- Health and wellness devices- Peripherals and accessories
one-to-manyBROADCASTING
LOCALIZED INFORMATION- Point of interest beacons- Item finding beacons- Way finding beacons
many-to-manyMESH
LARGE DEVICE NETWORKS- Building automation- Wireless sensor networks- Asset tracking
16
Bluetooth Mesh TopologyManaged Flooding
PROXYNODE
RELAYNODE
RELAYNODE
RELAYNODE
NODENODE
NODE
NODE
RELAYNODE
LOW POWER NODELOW
POWER NODE
Advertising Bearer
Advertising “not relayed”
Advertising “Low power”
GATT (BLE connection)
The Bluetooth Mesh working group chose a flooding protocol for mesh network mechanism. Compared to routed protocols, it is much simpler to deploy. To stay
efficient, the BLE Mesh takes advantage of a managed flooding network.
17
ST EnablersProducts & Solutions
18
End-to-End Approachfrom Sensors to Cloud
19
Sensing
Processing
Products Solutions and fast prototyping Long lifetime support
Reference Design
Fast Prototyping and Development KitsSecurity
Connectivity
Feature highlight, prototyping
Discovery Kits
Full features evaluation
Evaluation BoardsSTM32 Nucleo Boards
Fast agile prototyping
ST EnablersFocus on products: STM32 and hardware tools 20
Sensing ProcessingSecurityConnectivity
Modular Hardware 21
32 expansion boards and growing… covering all the key functionsSense
5
Connect
9
PowerDrive
3
Move Actuate
12
Translate
3
27 development boards and growing… in two flavors (Processing and Security)
Covering all STM32 microcontroller families and different development needs
Motion & environmental sensors
Proximity sensorMicrophone
BLEWi-Fi
Sub-GHzNFC
Power managementLED boost
Motor driveActuator
Audio amplifierOp-Amp
Pre-integrated Application Packages 22
integrating functionality from several expansion boards
Function PacksPre-packaged functionalities
used in most popular application domains
Smart Industry
Cloud Prototyping
STM32Cube Hardware Abstraction Layer (HAL)
STM32 Nucleo development boards
STM32 Nucleo expansion(X-NUCLEO)
STM32Cube middleware STM32Cube
expansion HAL
High value middleware STM32Cube expansions
Pre-integrated application examples (Function Packs)
3 Cloud providers SDK supported for direct connection to the Cloud
Libraries (Audio, Connectivity, Sensor ..) with examples and free license
Pre-integrated drivers and libraries with usage examples for STM32 Nucleo expansion boards
22
32
23
MEMS Sensors
& Drivers
SW Tools
HW Tools
ST Sensors & Motion AlgorithmsComplete package to support development of custom application
MEMS Sensors & Drivers
http://www.st.com/content/st_com/en/support/resources/product-longevity.html
X-CUBE_MEMS1• Package with example
code, libraries and sample apps for STM32 dev ecosystem
X-CUBE_MEMS_XT1• Sensor and DSP
algorithm expansion software pack for STM32
Algobuilder• SW tool for libriary
development
SW ToolsHW Tools
STM32 Nucleo board • Evaluation board based
on different MCU core: M0+, M3, M4
X- Nucleo expansion board• MEMS sensor Plug-in
board for Nucleo
Unicleo-GUI• GUI to configure MEMS
devices and display sensor & apps output
Accelerometer
Gyroscope / IMU
Magnetometer eCompass
Pressure Sensor
ST MEMS complete software solution 24
Low-level Drivers
Standard C Platform Independent driversWindows driversLinux drivers
X-CUBE-MEMS-XT1X-CUBE_MEMS1
Development Tool based on Low level drivers Runs on STM32Sample implementation of device embedded features
Libraries
Generic sw librariesAccuracy, Calibration, Positioning, Activity tracking, Health monitoring
Dedicated sw librariesFSM & Prog Sensor Libs
AlgoBuilder Tool Dedicated software Tool for libraries developmentGraphical design apps to build and use algorithms
Go to st.com
Go to ST.com
MEMS and Sensors Software -STMicroelectronics
Open.MEMS - STMicroelectronics
From drivers to software development tools
25System Solutions Development Platforms
General Purpose Wearable & IoT
AudioMEMS Evaluation ProfiMEMSMainboard supports most MEMS devices via 24-pin socket
STEVAL-MKI109V3
X-NucleoSet of modular developer boards Designed around the STM32 microcontroller family motherboards and sensor expansion boards as for Motion MEMS, Environmental and Microphones
Sensor TileBluetooth low energy, with a wide spectrum of motion and environmental MEMS sensors, and microphone
STEVAL-STLKT01V1
Blue CoinMultiple microphones, Proximity, Environmental and Motion sensing + BLE
STEVAL-BCNKT01V1
NFC Tag Sensor Node SmarTAGDynamic NFC Tracker with sensors
STEVAL-SMARTAG1
IoT & CloudIoT DiscoverySensorized IoT node, allows direct cloud connections
STM32F0DISCOVERY
Thanks
26
Motion MEMS Sensors for Smart Industry
16
IIS2DLPCAccelerometer - Wide Bandwidth, Ultra-low-power
ISM330DLCCombo accelerometer & Gyroscope & -
Wide Bandwidth
IIS3DWBAccelerometer - Ultra Wide Bandwidth LGA-14 2.5x3mm2
3D Accelerometer – 16g Full ScaleDigital Output Ultra Low Noise / Bandwidth (Min 5KHz)Up to 105°C Operating Temp
IIS2MDC3-axis, High Accuracy Magnetometer
Low-Noise, Low Power
LGA-14 2.5x3mm2
LGA-12 2x2mm2
3D Accelerometer + 3D Gyro - Digital OutputAccelerometer with Wide Bandwidth (up to 3 kHz)Ultra Low Power and Smart Features
3D Accelerometer – Digital OutputWide Bandwidth (up to 2.3 kHz)Ultra Low Power – Ultra Compact
3D Magnetometer – Digital OutputAMR Technology - up to 50 Gauss Full ScaleUltra Low Noise, Low Power
LGA-12 2x2mm2
I3G4250D3-axis, High Accuracy Magnetometer
Low-Noise, Low Power
Image stabilizationHigh thermal stability
LGA-12 2x2mm2
Environmental Sensors for Smart Industry
HTS221Humidity and Temp Sensor – High Accuracy
LPS33HWPressure Sensor – Water Resistant
LPS22HHPressure Sensor: Dust resistant,
High Accuracy – Compact Size HLGA-10L 2x2x0.76 mm
Absolute Pressure Sensor260 to 1260 hPa Range - Digital OutputHigh Accuracy (±1 hPa)Low noise (0.75 Pa RMS)Ultra Compact full molded package
STTS751Digital Temperature Sensor
3.3x3.3x2.9 mm
HLGA-6 2x2x0.9mm2
Absolute Pressure Sensor260 to 1260 hPa Range - Digital OutputHigh Accuracy (±2.5 hPa)Low noise (0.8 Pa RMS)Water resistant up to 10 ATM
Digital OutputHigh Accuracy:
• Humidity: ±3.5 %RH• Temperature: ±0.5 deg
Low Power; Supply voltage: 1.7 to 3.6 V
Accuracy: ±1.0 ºC ; Programmable resolutionUDFN-6L or SOT23-6L
TO92/SO8 Accuracy ±1.0 °C ; Op. Temp up to 150 °CLM235 / STLM20Analog Temperature Sensor
28
MEMS Microphones for Smart Industry
3.35x2.5x0.98 mm
Bottom Port MicrophoneAnalog Differential OutputWide Acoustic Bandwidth (up to 80 kHz) Wide Dynamic Range (AOP up to 130 dBSPL)
3.25x1.9x0.8 mm
Bottom Port MicrophoneAnalog Differential OutputWide Acoustic Bandwidth (up to 80 kHz) Wide Dynamic Range (AOP up to 135 dBSPL)
Integrated Temperature Sensor With High Accuracy (+/-0.5 °C)
3x4x1 mm
Top Port MicrophoneDigital OutputWide dynamic range (AOP up to 122 dBSPL)-26dBFS + 3 dB sensitivity
STTS751EMTemperature sensor and Microphone Module
MP23ABS1Analog Differential Microphone
IMP34DT05Digital Top Port Microphone
29