14
2013 Microchip Technology Inc. DS00001519B-page 1 AN1519 This document is designed to serve as a starting point when choosing a crystal to operate alongside the Microchip Stand-Alone Real-Time Clock/Calendar devices (Figure 1). FIGURE 1: OSCILLATOR DIAGRAM To oscillate as closely as possible to the desired fre- quency, a crystal must have load capacitors that match the value recommended by the crystal manufacturer, according to Equation 1. Also, the oscillator pin capacitance (available in the device data sheet as COSC) must be included in CX1 and CX2, and stray board capacitance (C stray ) must be taken into consideration when choosing the capacitors. EQUATION 1: CONSIDERATIONS The Microchip stand-alone RTCC’s have been designed to work with 32.768 kHz tuning fork crystals with a load capacitance (CLOAD or CL) of 6-9pF. For tuning fork crystals, the frequency has a parabolic dependence on temperature. Therefore, when it changes, the frequency decreases accordingly, as shown in Equation 2 and Figure 2. See AN1413, “Tem- perature Compensation of a Tuning Fork Crystal Based on MCP79410” (DS01413). EQUATION 2: FIGURE 2: PARABOLIC CURVE FOR TUNING FORK CRYSTALS Author: Florian Gheorghe Microchip Technology Inc. X1 X2 RTCC C X1 C X2 C load C x2 C x1 C x2 C x1 + ------------------------ +C stray = Where: C x1 = Capacitor value on pin X1 + C pin C x2 = Capacitor value on pin X2 + C pin C stray = Trace capacitance C pin = 3 pF typical f f 0 [1-Tc T T 0 2 = Where: f 0 = Frequency at turnover point Tc = Temperature coefficient T-T 0 = Deviation from turnover point T = Current temperature (°C) T 0 = Turnover point (°C) Recommended Crystals for Microchip Stand-Alone Real-Time Clock/Calendar Devices

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AN1519Recommended Crystals for Microchip

Stand-Alone Real-Time Clock/Calendar Devices

This document is designed to serve as a starting pointwhen choosing a crystal to operate alongside theMicrochip Stand-Alone Real-Time Clock/Calendardevices (Figure 1).

FIGURE 1: OSCILLATOR DIAGRAM

To oscillate as closely as possible to the desired fre-quency, a crystal must have load capacitors that matchthe value recommended by the crystal manufacturer,according to Equation 1.

Also, the oscillator pin capacitance (available in thedevice data sheet as COSC) must be included in CX1and CX2, and stray board capacitance (Cstray) must betaken into consideration when choosing the capacitors.

EQUATION 1:

CONSIDERATIONSThe Microchip stand-alone RTCC’s have beendesigned to work with 32.768 kHz tuning fork crystalswith a load capacitance (CLOAD or CL) of 6-9pF. Fortuning fork crystals, the frequency has a parabolicdependence on temperature. Therefore, when itchanges, the frequency decreases accordingly, asshown in Equation 2 and Figure 2. See AN1413, “Tem-perature Compensation of a Tuning Fork Crystal Basedon MCP79410” (DS01413).

EQUATION 2:

FIGURE 2: PARABOLIC CURVE FOR TUNING FORK CRYSTALS

Author: Florian GheorgheMicrochip Technology Inc.

X1

X2RTCC

CX1

CX2

CloadCx2 Cx1Cx2 Cx1+-------------------------+Cstray=

Where:Cx1 = Capacitor value on pin X1 + CpinCx2 = Capacitor value on pin X2 + CpinCstray = Trace capacitanceCpin = 3 pF typical

f f0 [1-Tc T T0– 2 =

Where: f0 = Frequency at turnover pointTc = Temperature coefficientT-T0 = Deviation from turnover pointT = Current temperature (°C)T0 = Turnover point (°C)

2013 Microchip Technology Inc. DS00001519B-page 1

AN1519

For best results, it is recommended that a ground ringshould encompass the crystal and the X1 and X2 pins.See AN1365, “Recommended Usage of MicrochipSerial RTCC Devices” (DS01365). Also, the tracesfrom the RTCC to the capacitors and crystal should beas short as possible in order to minimize the strayboard capacitance (CSTRAY). See AN1288, “DesignPractices for Low-Power External Oscillators”(DS01288).

Table 2 shows recommended crystals and loadcapacitors.

Some crystal vendors use the term oscillation allow-ance as the sum of negative R value and ESR(Equation 3). The negative R (-R) which has been mea-

sured on the AC164140 RTCC PICtail™ board is ameasure of the ability of the oscillator to drive the crys-tal over temperature (Figure 3). An oscillation allow-ance value of three to five times the crystal ESR willprovide an acceptable margin. See AN943, “PracticalPICmicro® Oscillator Analysis and Design” (DS00943)and AN949, “Making Your Oscillator Work” (DS00949).

CRYSTAL TEST RESULTSThe crystals listed in Table 1 have been tested on theAC164140 RTCC PICtail board (unless noted). Theresults are in Table 2.

TABLE 1: CRYSTAL TEST RESULTS

EQUATION 3:

FIGURE 3: NEGATIVE RESISTANCE TEST SETUP

Crystal Appendix

Citizen CMR200T-32.768KDZB-UT Appendix A: “CMR200T-32.768KDZB-UT”Citizen CFS206-32.768KDZB-UB Appendix B: “CMR-32.768KDZB-UB”ECS ECS.327-6-13X Appendix C: “ECS327-6-13X”ECS ECS.327-6-17X-TR Appendix D: “ECS.327-6-17X-TR”Epson MC405-32.7KE3R Appendix E: “EPSON MC405-32.7KE3R”Epson C002RX32.76K-EPB Appendix F: “EPSON C002RX32.76K-EPB”AVX ST3215SB32768C0HPWBB Appendix G: “AVX ST3215SB32768C0HPWBB”FOX NC38LF-32.768kHz Appendix H: “FOX MC38LF-32.768kHz”HK Crystals Appendix I: “HK Crystals”

Oscillation Allowance = |-R| + ESR []

X1 X2

RTCC

CX1 CX2

RTEST

DS00001519B-page 2 2013 Microchip Technology Inc.

AN

1519

DS

00001519B-page 3

2013 M

icrochip Technology Inc.

s/ Oscillation Allowance

Oscillation Allowance/ESR Ratio

Start-up Time

(seconds)

480 kΩ 9.6 1.3780 kΩ 22.28 1.25360 kΩ 10.28 1540 kΩ 13.5 1300 kΩ 6 1.5370 kΩ 6.16 1.6800 kΩ 11.42 1600 kΩ 17.14 1390 kΩ 9.75 0.85400 kΩ 10 1.1

1600 kΩ 32 11370 kΩ 19.57 0.5250 kΩ 3.57 0.75300 kΩ 6 1.4340 kΩ 8.5 1.7220 kΩ 5.5 1.2300 kΩ 4.28480 kΩ 9.6390 kΩ 6460 kΩ 9.2

TABLE 2: CRYSTALS

Crystal Vendor

Crystal PartNumber

ESR(Max.)

CLOAD (pF)

C1 Capacitor

Value (pF)

C2 Capacitor Value (pF)

PPM Error

(at 25°C)

SecondDay

Citizen CMR200T-32.768KDZB-UT 50 kΩ 6 10 10 -3.17 -0.274Citizen CFS206-32.768KDZB-UB 35 kΩ 6 10 12 -9.60 -0.829ECS ECS.327-6-13X 35 kΩ 6 12 10 1.07 0.092ECS ECS.327-6-17X-TR 40 kΩ 6 10 8.2 10.93 0.944Epson Crystals MC405-32.7KE3R 50 kΩ 6 10 10 -1.71 -0.148Epson Crystals C002RX32.76K-EPB 60 kΩ 6 12 10 -0.66 -0.057AVX Crystals ST3215SB32768C0HPWBB 70 kΩ 7 10 12 -1.22 -0.105FOX Crystals MC38LF-32.768kHz 35 kΩ 6 8.2 8.2 1.47 0.127HK Crystals 3T 40k 6 8.2 8.2 -4.36 -0.377HK Crystals 2T 40k 6 8.2 10 1.64 0.142HK Crystals M3 50k 6 8.2 10 3.21 0.277HK Crystals M8 70k 7 10 12 -4.98 -0.430HK Crystals M8 70k 9 15 12 2.78 0.240HK Crystals M3 50k 8 12 12 -1.96 -0.169HK Crystals 2T 40k 8 12 12 3.89 0.336HK Crystals 3T 40k 8 12 15 4.65 0.402Micro Crystal (Note) CM7V-T1A 70 kΩ 7 10 12 3 0.259Citizen (Note) CM200S32.768KDZB-UT 50 kΩ 6 10 8 1.2 0.104Seiko (Note) SSP-T7-F 65 kΩ 7 10 12 -0.76 0.066Seiko (Note) VT-200-F 50 kΩ 6 9 9 -2.14 0.185

Note: Not included in this document.

AN1519

APPENDIX A: CMR200T-32.768KDZB-UT

FIGURE 4: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 10 PF; C2 = 10 PF

APPENDIX B: CMR-32.768KDZB-UB

FIGURE 5: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 10 PF; C2 = 12 PF

32,767.890

32,767.892

32,767.894

32,767.896

32,767.898

32,767.900

32,767.902

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF, C2 = 10 pF

32,767.60

32,767.62

32,767.64

32,767.66

32,767.68

32,767.70

32,767.72

32,767.74

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF, C2 = 12 pF

DS00001519B-page 4 2013 Microchip Technology Inc.

AN1519

APPENDIX C: ECS327-6-13X

FIGURE 6: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 12 PF; C2 = 10 PF

APPENDIX D: ECS.327-6-17X-TR

FIGURE 7: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 10 PF; C2 = 8.2 PF

32,768.025

32,768.030

32,768.035

32,768.040

32,768.045

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 12 pF, C2 = 10 pF

32,768.335

32,768.340

32,768.345

32,768.350

32,768.355

32,768.360

32,768.365

32,768.370

32,768.375

32,768.380

32,768.385

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF, C2 = 8.2 pF

2013 Microchip Technology Inc. DS00001519B-page 5

AN1519

APPENDIX E: EPSON MC405-32.7KE3R

FIGURE 8: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 10 PF; C2 = 10 PF

APPENDIX F: EPSON C002RX32.76K-EPB

FIGURE 9: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 12 PF; C2 = 10 PF

32,767.936

32,767.938

32,767.940

32,767.942

32,767.944

32,767.946

32,767.948

32,767.950

32,767.952

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF, C2 = 10 pF

32,767.965

32,767.970

32,767.975

32,767.980

32,767.985

32,767.990

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 12 pF, C2 = 10 pF

DS00001519B-page 6 2013 Microchip Technology Inc.

AN1519

APPENDIX G: AVX ST3215SB32768C0HPWBB

FIGURE 10: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 10 PF; C2 = 12 PF

APPENDIX H: FOX MC38LF-32.768KHZ

FIGURE 11: FREQUENCY/VOLTAGE CHARACTERISTIC FOR C1 = 8.2 PF; C2 = 8.2 PF

32,767.92

32,767.93

32,767.94

32,767.95

32,767.96

32,767.97

32,767.98

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF, C2 = 12 pF

32,768.040

32,768.042

32,768.044

32,768.046

32,768.048

32,768.050

32,768.052

32,768.054

32,768.056

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 8.2 pF, C2 = 8.2 pF

2013 Microchip Technology Inc. DS00001519B-page 7

AN1519

APPENDIX I: HK CRYSTALS

I.1 HK 3T 6PF

FIGURE 12: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 8.2 PF, C2 = 8.2 PF

I.2 HK 2T 6PF

FIGURE 13: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 8.2 PF, C2 = 10 PF

32,767.850

32,767.852

32,767.854

32,767.856

32,767.858

32,767.860

32,767.862

32,767.864

32,767.866

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 8.2 pF C2 = 8.2 pF

32,768.042

32,768.044

32,768.046

32,768.048

32,768.050

32,768.052

32,768.054

32,768.056

32,768.058

32,768.060

32,768.062

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 8.2 pF C2 = 10 pF

DS00001519B-page 8 2013 Microchip Technology Inc.

AN1519

I.3 HK M3 6PF

FIGURE 14: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 8.2 PF, C2 = 10 PF

I.4 HK M8 7PF

FIGURE 15: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 10 PF, C2 = 12 PF

32,768.1040

32,768.1045

32,768.1050

32,768.1055

32,768.1060

32,768.1065

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 8.2 pF C2 = 10 pF

32,767.74

32,767.76

32,767.78

32,767.80

32,767.82

32,767.84

32,767.86

32,767.88

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 10 pF C2 = 12 pF

2013 Microchip Technology Inc. DS00001519B-page 9

AN1519

I.5 HK M8 9PF

FIGURE 16: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 15 PF, C2 = 12 PF

I.6 HK M3 8PF

FIGURE 17: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 12 PF, C2 = 12 PF

32,768.02

32,768.04

32,768.06

32,768.08

32,768.10

32,768.12

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 15 pF C2 = 12 pF

32,767.920

32,767.925

32,767.930

32,767.935

32,767.940

32,767.945

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 12 pF C2 = 12 pF

DS00001519B-page 10 2013 Microchip Technology Inc.

AN1519

I.7 HK 2T 8PF

FIGURE 18: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 12 PF, C2 = 12 PF

I.8 HK 3T 8PF

FIGURE 19: FREQUENCY VOLTAGE CHARACTERISTIC FOR C1 = 12 PF, C2 = 15 PF

32,768.110

32,768.115

32,768.120

32,768.125

32,768.130

32,768.135

32,768.140

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 12 pF C2 = 12 pF

32,768.142

32,768.144

32,768.146

32,768.148

32,768.150

32,768.152

32,768.154

32,768.156

32,768.158

32,768.160

32,768.162

1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Freq

uenc

y (H

z)

Voltage (V)

C1 = 12 pF 2 = 15 pF

2013 Microchip Technology Inc. DS00001519B-page 11

AN1519

NOTES:

DS00001519B-page 12 2013 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

2013 Microchip Technology Inc.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV

== ISO/TS 16949 ==

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 9781620774601

Microchip received ISO/TS-16949:2009 certification for its worldwide

DS00001519B-page 13

headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

DS00001519B-page 14 2013 Microchip Technology Inc.

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