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Recent results on using LSVNA for Compact modeling of GaN FET devices.
I. Angelov, M. Thorsell, K. Andersson, N. Rorsman, H.Zirath
Microwave Electronics Laboratory, Department of Microtechnology and Nanoscience MC‐2,
Chalmers University of Technology, 412 96 Gothenburg, SwedenPRESENTER ILTCHO ANGELOV [email protected]
ADDITIONAL INFO CAN BE FOUND https://document.chalmers.se/workspaces/chalmers/mikroteknologi‐och/iltcho‐angelow‐documents/openfolder
WMB: Device Model Extraction from Large-Signal Measurements
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 2
Model Types
• 1Physical Models- very important in the device design stage.• 2Table Based Models- accurate in the Measurement range!• Typ. 1000 measurement points! X-parameters- now!• Problems: Outside Measured Frequency Range ? Harmonics? Change of working
conditions :Temp,Rtherm,Ctherm etc. ? Manufacturing tolerances? Scaling to High Power Devices( it is easier with smaller devices and scale later). Do not provide feedback for the device quality, change of parameters-> this is important issue for foundries! Data set is large>20 mB->slow.
• 3Empirical Equivalent Circuit Models. 100-200 measurements points • Accurate enough for many applications-1-5%.• Comparably easy to understand and extract, compact form- parameter list.• Extendable out of the Measurement Range> from 65GHz to 230GHz [Ref:46-48]. • Possibility to tune& change model parameters, production tolerances, Rtherm...• Provide feedback for device parameters change, quality of processing .• All model types have their place. We should use the right type for the specific
application. We can mix& integrate different type models- example: Empirical &Physical; Empirical &Table Based ( ETB ) etc.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 3
Important for Large&High Power devices:
• 1.The Gate Control is delayed and reduced at high frequency: • Large&High Power Devices do not respond immediately at RF! • Cdel =2-3fF- is the capacitance of the gate footprint, Rdel=2kOhm(chan.
resistance) • 2 Current slump -In some cases at RF we do not reach the DC Ids values.• 3. (Back-gate) voltage will change the effective Vgs at RF ->dispersion• 4. Higher Rs and Rd/ mm for SiC and GaN FET in comparison with GaAs FET • 5. Rd, Rs bias and temperature dependent! (A.Inoe et al., IMS2006 WE2F2, M.
Thorsel)• 6. Self-heating model-must! Mounting quality is critical. • 7. Breakdown important for high power devices!• 8 Keep device safe<Pmax!• Organize measurements properly. For GaN• Dual region measurements& simulations:• A)High Ids, Low Vds; • B)Low Ids, High Vds -Cover the load line!!!
2 4 6 8 10 12 14 16 180 20
0.1
0.2
0.3
0.4
0.0
0.5
vd
id.i
DCLowvoltage..vd
DC
Low
volta
ge..i
d.i
VdshP
max
Pmax
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 4
Ids model1: Simple 5 Parameters, Vds>Vknee: Ipks,Vpks,P1, s
-1 -0.5 0 0.5 1
Gate voltage, (V)
0102030405060
I
Idsgmpks
Vpks
Ipks
0
20
40
60
80
100
0 0,5 1 1,5 2 2,5
Ids(mA)@ Vg=0.6VIds(mA)@ Vg=0.4VIds(mA)@ Vg=0.2VIds(mA)@ Vg=0VIds(mA)@ Vg=-0.2VIds(mA)@ Vg=-0.4V
Ids(
mA
)
Vds(V)
Vknee
s
r
11 (( )); /
(1 tanh( )). tanh( )(1 )p
p m gs mpk
s
p kks m p
ds dspks ds
VP PV g I
I V VI
With 5 parameters, typical global error <10%.This simple model gives directly correct shape of the IV and Gm Single definition -∞+ ∞; Infinite & correct derivatives.
Ids, gm are exact( defined) at Vpks!
5 10 15 20 25 30 350 400.00
0.05
ts(v2)-1.5
I2dc
IdsvsVds from LSNA
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 5
Ids Model Function SelectionFET Ψ Examples GaN, SiC FET
-3
-2
-1
0
1
2
-6 -5 -4 -3 -2 -1 0 1 2
GaN
PsiSinhVd10PsiVd=10
Vgs
P1
y
-4
-3
-2
-1
0
1
-15 -10 -5 0
SiC
PsiVd10PsisinhVd10
Vgs
P1
y
a) GaAs: f1a(Vgs)=1+Tanh[P1.Vgs]Ψ1a(Vgs)=ArcTanh[(Ids/Ipk0)-1]
b) GaN and SiC: f1b(Vgs)=1+Tanh[Sinh(P1.Vgs)]Ψ1b(Vgs)=ArcSinh[ArcTanh[(Ids/Ipk0)-1]]
c)Directly extractable; d)Using Tanh[Sinh] improves the harmonics fit for low P1<1
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 6
Ids Model Function Selection forComplicated Gm
-3 -2 -1 0 10.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Gate voltage, V
gm,A
v
-2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5-3.0 1.0
0.02
0.04
0.06
0.08
0.10
0.00
0.12
Vgs
mag
(Y(2
,1))
At some moment we should stop to increase parameters-> we can switch to Table Based Model, Xparameters , ETB !!!
Vpks2=-2.0v; Vpks=-0.3V, AA=0.1;Ids=Ipk0T*(1+AA*tanp+(1-AA)*tanp11)*tanh(alphap*Vds)*(1+lambdap*Vds+Lsb0*exp(Ebd*(Vds-Vtr)))Vpkm=Vpks -DVpks+DVpks*tanh(Alphas*Vds)-Vbg-Vsb2*(Vdg-Vtr)^2Vpkm2=Vpks2 -DVpks+DVpks*tanh(Alphas*Vds)-Vbg-Vsb2*(Vdg-Vtr)^2
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 7
GaN GS,GD, DC Breakdown MeasurementsCompliance is not fast enough and difficult to model
GateGroundedGSJunctionBrekdown
Vsi
Drain
SourceFET05mmX1
RR5R=1 kOhm
RR4R=1 MOhm
I_Probeidsp
DCDC1
Step=0.1Stop=2Start=-20SweepVar="vg"
DCV_DCSRC2Vdc=vg
I_Probeigp
-18 -16 -14 -12 -10 -8 -6 -4 -2 0-20 2
-1.5
-1.0
-0.5
0.0
0.5
1.0
-2.0
1.5
vg
igp.
i, m
A
m1
m1vg=igp.i=0.001
2.000
Vdsi
Vsi
CommongateDG JunctionBreakdown
ÿDrain
GateSource
FET05mmDevDVerilogMX1
I_ProbeidspI_Probe
igp
V_DCSRC2Vdc=vd
RR4R=50 Ohm
DCDC1
Step=0.1Stop=40Start=-1SweepVar="vd"
DC
VARVAR1
vd = 0 Vvg = 1 V
EqnVar
RR5R=1 MOhm
m1indep(m1)=plot_vs((idsp.i), vd)=-0.003
40.000
4 9 14 19 24 29 34-1 39
-0.003
-0.002
-0.001
0.000
0.001
-0.004
0.002
vd(id
sp.i)
m1m1indep(m1)=plot_vs((idsp.i), vd)=-0.003
40.000
Rmeas=1 kOhm defines the current in the measuremnt pathRcon=1MOhm defines the current in the connected path.Injected current <0.1mA/mm for safety!!!Setup can be combined with LSNA measurements.
Gate -Source breakdown measurement setup.
Gate -Drain breakdown measurement setup
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 8
Resitances Rd,Rs for GaN depend strongly on the dissipated power!
1
2
3
4
5
6
7
8
0
0.5
1
1.5
2
2.5
3
3.5
-1.5 -1 -0.5 0 0.5 1
Pdc=const
RdVd8
RdVd14
RdVd10
PdcVd8
PdcVd10
PdcVd14
Rd(
Ohm
)
Pdc(W)
Vgs(V)
RdCappy; Berroth- Cold FET method (VDS=0) for extraction will not give correct results for GaN!The reason : Rs and Rd are bias and temperature dependent. GaN Resitances Rd,Rs depend strongly on the dissipated power. For constant power they are quite constant with Vds. When cold values for Rs and Rd are used, unrealisticly high Output Power and PAE will be predicted! Cold values should be used only as a start and limit the optimization values.
Bias dependence Rd,Pdc vs. Vgs(Ids)
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 9
GaN Dispersion Modelling Implementation
1 Simple> Rc,Crf at the ouput,input , usually implemented in CAD toolsThough :Rc is bias dependent! Rc1=Rcmin+Rc/(1+tanp)
2 Back-gate Approach: (J. Conger, A. Peczalski, M. Shur, SC,Vol. 29, No.1)3 Physical Approach: (K. Kunihiro, Y.Ohno, ED, Vol. 43, No. 9)4 Device is symmetric>output and input dispersion: Rcin,Crfin
ADS2009 GaN Extended dispersion Modelling–combined Rc and back-gate+ Rdel,Cdel:8 par.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 10
GaN model implemented in VerilogA summary :
1 f1(Ψ(Vgs))=1+Tanh[Sinh(P1.Vgs)]
2 Cap model with peaking Cgs
3 Rd and Rs are bias( Rd2) and temperature dependent (TcRs),Rsbdep=Rs*(1+Rd2*(1+tanh(Ψ))); Rdbdep=Rd*(1+Rd2*(1+tanh(Ψ))); Bias dependence Rd2 for Rs, Rd is the same dependence as Ids.RsbdepT=Rsbdep*(1+TcRs*DTj); RdbdepT=Rdbdep*(1+TcRs*DTj);
4 Dispersion(Rc,Rcmin,Crf,Rcin Crfin)+2 new options :1Backgate Kbgate 2 Rdel, Cdel
5 Breakdown for GS,GD Junctions: Kbdgate,Vbdgs,Vbdgd, Pbdg
6 GaN+Noise :RF and LF;
7VA implementation :Many functional changes made by Tiburon to improve the stability.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 11
VA Model Parameters GaN tot. 69GaN Ids parameters:12Cap parameters:15Thermal parameters:8Igs:3
30
Parasitics&packageFETGaN2FET1
tau=2 psecPbdg=0.45Vbdgd=50 VVbdgs=10 VKbdgate=0.0001Vsb2=0 VEbd=0.3Vbdrain=60 VLsb0=0.05Cdel=2 fF
Rdel=2 kOhmRcin=500 kOhmCrfin=20 fFKbgate=0.01Crf=100 fFRc=10 kOhmRcmin=0.4 kOhmLs=8.8 pHLd=100 pHLg=100 pHRdsleak=1 GOhmRgsleak=1 GOhmRgdleak=1 GOhmRgd=5 OhmRd2=0 Ohm
Rd=1.55 OhmRs=0.88 OhmRi=2.5 OhmRg=2.5 OhmVjg=0.9 VPg=15.2Ij=0.0005 ATamb=25TcRtherm=0.005TcCrf=+0.002TcCgd0=+0.002TcCgs0=+0.002TcRs=+0.0002TcP1=-0.0025TcIpk0=-0.004
Ctherm=0.001 FRtherm=8.5 OhmP111=0.008P41=0.25P40=0.48P31=0.21P30=0.03P21=0.21P20=0.03P11=0.25P10=0.48Cgdpe=8 fFCgd0=376 fFCgdpi=200 fFCgs0=3500 fF
Cgspi=615 fFCds=800 fFB2=3.0B1=0.08Lvg=0.000lambda=0.02Alphas=0.7Alphar=0.1P3=0.05P2=-0.03P1=0.62DVpks=0.5 VVpks=-2.4 VIpk0=0.61 AIdsmod=1
Breakdown:7Dispersion:8
VARVAR23
Wtot=Nfing*Wfing/1000Wfing=100Nfing=4
EqnVarVAR
VAR21
Ijw=0.00006Rthermw=6Rcminw=0.622729 oTauw=0.772053 oLsw=9.3351 oLdw=36.5984 oLgw=3.01362 o
EqnVar
VAR5
Tau=Tauw*WtotRcmin=Rcminw/WtotIj=Ijw*WtotLs=5 +Lsw*Wtot
Ld=10 +Ldw*Wtot/NfingLg=10 + Lgw*Wtot/NfingRth=0.1+Rthermw/WtotRgd=0.1+Rgdw/WtotRd=0.1+Rdw/WtotRs=0.1+Rsw/WtotRi=0.1+Riw/WtotRg=0.1+Rgw/WtotCgdpe=3+Cgdpew*(Wtot)Cgd0=3+Cgs0w*(Wtot)Cgdpi=3+Cgdpiw*(Wtot)Cgs0=5+Cgs0w*(Wtot )Cgspi=5+Cgspiw*(Wtot)Cds=5+Cdsw*(Wtot)Ipk0=Ipk0w*WtotVAR24
Rdw=4.92371 oRsw=0.991473 oRiw=0.275402 oRgdw=0.414728 oRgw=0.798131 oCgdpew=20.8513 oCgdpiw=72.5009 oCgs0w=397.479 oCgspiw=41.9464 oCdsw=280.572 oP3=0.399587 -oP1=0.769999 oIpk0w=0.55 o
Ipk0 and Cgs0 scale were well!Using layout, parasitics scale very well
InputPadPortGateNum=1
MLINTL17
L=119 umW=50 umSubst="MSub1"
PortDrainNum=2
MTAPERTaper6
L=70 umW2=96 umW1=50 umSubst="MSub1"
MLINTL18
L=97 umW=96 umSubst="MSub1"
MTAPERTaper7
L=30 umW2=115 umW1=96 umSubst="MSub1"
MLINTL8
L=100 umW=50 umSubst="MSub1"
MTAPERTaper4
L=70 umW2=96 umW1=50 umSubst="MSub1"
MLINTL16
L=97 umW=96 umSubst="MSub1"
MTAPERTaper5
L=30 umW2=134 umW1=96 umSubst="MSub1"
PortP3Num=3
Angelov_FETANGELOV2
Trise=Temp=Model=ANGELOVM1
MLINTL19
L=7 umW=50 umSubst="MSub1"
MLINTL10
L=7 umW=50 umSubst="MSub1"
RR4R=0.05 Ohm
RR3R=0.05 Ohm
VI AV5
T= 3 umH= 1 0 0 umD2 = 1 1 0 umD1 = 7 0 um
VI AV4
T= 3 umH= 1 0 0 umD2 = 1 1 0 umD1 = 7 0 um
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 12
Ron=Rd+Rs+Rch is the first we need to find.
1
10
100
1000
104
105
106
107
-2 -1,5 -1 -0,5 0 0,5
Vds=1Rds2=10kOhm
Ron=6 Ohm
RdsRds2
Rds
Vgs
Roff=5MOhm
Roff=10kOhm
1 2 3 4 5 6 7 8 9 10 11 12 13 140 15
0.1
0.2
0.0
0.3
VDS
Idsm
0
5
10
15
20
25
30
-0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8
ids(vg)
Ids(mA)@Vd=0.2V
Ids(
mA
)
Vgs(V)
Nonlinear Models for currents& capacitances are controlled by intrinsic voltages. We need Rs,Rd to account for the voltage drop on Rs, Rd.Ids vs. Vgs for low Vds, below the knee region in the linear part of the IV: sweeping Vgs, fixed low Vds. ->safe measurement, GaN-> Vds=1v, GaAs-> Vds=0.1v . Rds(Ron)=Vds/Ids: For gate in the middle S-D :Rs=Rd=Rch=Rds/3 Very good staring values for optimization.
GaN,Vds=1V Ids vs. Vgs,Vd=1Good device:Ron=3 oHm,Roff>3MOhmWorking device:Ron=6 oHm;Roff=10 kOhm
Do not forget to measure resistances in the bias lines!!!
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 13
LSVNA Measurement Set-up Active Load Pull
It is very fast& accurate!The amplifier at the output should provide enough power to compensate circulator&cable losses ( 2-3 dB).
The circulator separates the injected and outgoing wave, terminating b2 in a 50 Ω load. This gives full control of ΓL seen by the DUT at f0, according to:
2 2 21 2 2 2
2
; ; ;2 2
where Zc is the system impedance.
IN OUTC C
a b a aP PZ Z b
02
,
02
020
0,fb
eVVAfbfa
fQI VVj
QI
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 14
Ids=f(Vgs) model extractionTwo frequencies Low RF an High RF
m11indep(m11)=plot_vs(ts(i2.i), ts(v1))=0.277INDEX=1.000000
-1.063
-3.5 -3.0 -2.5 -2.0 -1.5-4.0 -1.0
0.075
0.150
0.225
0.000
0.300
ts(v1)
ts(i2
.i)
m11m11indep(m11)=plot_vs(ts(i2.i), ts(v1))=0.277INDEX=1.000000
-1.063
Active load RF=0.1GHzIsatindep(Isat)=plot_vs(ts(i2m), ts(v1m))=0.215INDEX=1.000000
-1.728
-5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0-6.0 -1.5
0.00
0.05
0.10
0.15
0.20
-0.05
0.25
ts(v1)
ts(i2
.i)
ts(v1m)
ts(i2
m)
IsatIsatindep(Isat)=plot_vs(ts(i2m), ts(v1m))=0.215INDEX=1.000000
-1.728
Active load Pin=12dBm,RF=3Ghz
LF RF ->current models, High RF-> Cap models
We need: Ipks,Vpks,P1=Gm/Ipks, s1.Read the maximum current. Ipks=Imax/22.Read the gate voltage Vpks for Imax/23.Adjust P1 to get the slope ( gm) correctYou have the gate part of the model ready.
1. Derivatives, inflection voltage forthe current and capacvitances are the same!Start with P1=P11=P41;P10=P40P21=P31= Alphar
Vpks
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 15
1LS Harmonics Evaluation- Power Spectrum
For LS & Harmonics modelling we need correct derivativesSelf-Heating, Dispersion, Memory effects, complicate the picture. DC data for Ids harmonics are often noisy! Solutions:1Power Spectrum Evaluation (PS)using LSVNA, Spectrum Analizer ,Power meter; 2Load Pull or LSNA or Combined Load Pull & LSNA Evaluation!!
-1.3 -1.1 -0.9 -0.7 -0.5 -0.3 -0.1 0.1 0.3-1.5 0.5
-20
0
20
-40
Vgs
dBm
(Vlo
ad[::
,1])
m1
VGSdB
m(P
out1
mea
s)
m2
dBm
(Pou
t2m
eas)
dBm
(Pou
t3m
eas)
dBm
(Vlo
ad[::
,2])
dBm
(Vlo
ad[::
,3])
-1.5 -1.0 -0.5 0.0-2.0 0.5
-20
-10
0
10
20
-30
30
Vgs
dBm
(v2[
::,2]
)dB
m(v
2[::,
3])
dBm
(v2[
::,1]
)
m1
VGS
dBm
(Pou
t2m
eas)
dBm
(Pou
t3m
eas)
dBm
(Pou
t1m
eas)
m2
PS: GaN C-band and X- band Measured and modeled
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 16
PS optimization. Minimize error for Ids, 1-st, 2-nd,3-rd harmonics .
v1
v2
DataAccessComponentDAC3
iVal2=1iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGANND5VD15powerspectrum.c iti"
DAC
DataAccessComponentDAC1
iVal2=freq/fundamentaliVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGANND5VD15powerspectrum.citi"
DAC
DataAccessComponentDAC4
iVal2=1iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGANND5VD15powerspectrum.c iti"
DAC
DataAccessComponentDAC2
iVal2=0iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGANND5VD15powerspectrum.citi"
DAC
FET05mmG2X1
OptimOptim1
EnableCockpit=yesSaveCurrentEF=noUseAllGoals=yes
UseAllOptVars=yesSaveAllIterations=noSaveNominal=yesUpdateDataset=yesSaveOptimVars=yesSaveGoals=yesSaveSolns=yesSetBestValues=yesNormalizeGoals=noFinalAnalysis="None"StatusLevel=4DesiredError=0.0MaxIters=1ErrorForm=L2OptimType=Random
OPTIM
GoalOptimGoal6
RangeMax[1]=RangeMin[1]=RangeVar[1]=Weight=1Max=1e-2Min=-1e-2SimInstanceName="HBsimulationExpr="ErrorIds"
GOAL
MeasEqnMeas4
ErrorIds=(Idsmeas-Idssim)ErrorP3=P3meas-P3simErrorP2=P2meas-P2simErrorP1=P1meas-P1sim
EqnM eas VAR
VAR4
numberOfHarmonics=4fundamental=4 GHzINDEX=2INDEXmax=10
EqnVar
MeasEqnMeas7
ErrorP3L=real((P3measL-P3simL)/P3measL)ErrorP2L=real((P2measL-P2simL)/P2measL)ErrorP1L=real((P1measL-P1simL)/P1measL)
EqnM eas
MeasEqnMeas6
P3simL=v2[::,3]P2simL=v2[::,2]P1simL=v2[::,1]
EqnM eas
GoalOptimGoal5
RangeMax[1]=RangeMin[1]=RangeVar[1]=Weight=1Max=1e-2Min=-1e-2SimInstanceName="HBsimulation"Expr="ErrorP3L"
GOAL
GoalOptimGoal4
RangeMax[1]=RangeMin[1]=RangeVar[1]=Weight=2Max=1e-2Min=-1e-2SimInstanceName="HBsimulation"Expr="ErrorP2L"
GOAL
GoalOptimGoal3
RangeMax[1]=RangeMin[1]=RangeVar[1]=Weight=10Max=1e-2Min=-1e-2SimInstanceName="HBsimulation"Expr="ErrorP1L"
GOAL
MeasEqnMeas5
P3measL=v2m[::,3]P2measL=v2m[::,2]P1measL=v2m[::,1]
EqnM eas
VARVAR5
V2DC=fileDAC2,"V2"V1DC=fileDAC2,"V1"
EqnVar
MeasEqnMeas8
Igssim=real(i1.i[::,0])Idss im=real(i2.i[::,0])
EqnM eas
MeasEqnMeas2
P3sim=dbm(v2[::,3])P2sim=dbm(v2[::,2])P1sim=dbm(v2[::,1])
EqnM easMeasEqn
Meas1
Igsmeas=real(i1m[::,0])Idsmeas=real(i2m[::,0])P3meas=dbm(v2m[::,3])P2meas=dbm(v2m[::,2])P1meas=dbm(v2m[::,1])
EqnM eas
LL2
R=1L=1.0 mH
LL1
R=1L=1.0 mH
V_DCSRC3Vdc=real(V1DC)
I_ProbeIgsDC
HarmonicBalanceHBsimulation
Order[1]=numberOfHarmonicsFreq[1]=fundamental
HARMONIC BALANCE
I_ProbeIdsDC V_DC
SRC4Vdc=real(V2DC)
VARVAR1
b1m=(v1m-50*i1m)/2a1m=(v1m+50*i1m)/2b2m=(v2m-50*i2m)/2a2m=(v2m+50*i2m)/2P1m=fileDAC3, "V2"i2m=fileDAC1, "I2"i1m=fileDAC1, "I1"v2m=fileDAC1,"V2"v1m=fileDAC1,"V1"
EqnVar
VARVAR8V1in=real(v1m[::,1])
EqnVar
V_1ToneSRC1
Freq=fundamentalV=0 V_All=2*a1m
V_1ToneSRC2
Freq=fundamentalV=0 V_All=2*a2m
RR2R=50R
R3R=50
DC_BlockDC_Block1
I_Probei1
DC_BlockDC_Block2
I_Probei2
Power Spectrum IV optimization using LSVNA data.Operating voltages, Pin for model simulations are calculated from the measured waveforms.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 17
2Optimization using LSNA Active Load Pull Data
v1
v2
OptimOptim1
UseAllOptVars=yesSaveAllIterations=noSaveNominal=yesUpdateDataset=yesSaveOptimVars=yesSaveGoals=yesSaveSolns=yesSetBestValues=yesNormalizeGoals=noFinalAnalysis="None"StatusLevel=4DesiredError=0.0MaxIters=5ErrorForm=L2OptimType=Random
OPTIM
GoalOptimGoal7
RangeMax[1]=RangeMin[1]=RangeVar[1]=Weight=1Max=1e-2Min=-1e-2SimInstanceName="HBsimulation"Expr="ErrorGamma"
GOAL
MeasEqnVoltageWavefroms
b2sim=(v2-i2.i*50)/2a2sim=(v2+i2.i*50)/2b1sim=(v1-i1.i*50)/2a1sim=(v1+i1.i*50)/2
EqnM eas
MeasEqnMeas7
ErrorP3L=real((P3measL-P3simL)/P3measL)ErrorP2L=real((P2measL-P2simL)/P2measL)ErrorP1L=real((P1measL-P1simL)/P1measL)
EqnM eas
MeasEqnMeas6
P3simL=v2[::,3]P2simL=v2[::,2]P1simL=v2[::,1]
EqnM eas
MeasEqnLoadReflection
ErrorGamma=abs(real(GammaSim)-real(GammaM))+abs(imag(GammaSim)-imag(GammaM))GammaM=a2m[::,1]/b2m[::,1]GammaSim=a2sim[::,1]/b2sim[::,1]
EqnM eas
MeasEqnMeas5
P3measL=v2m[::,3]P2measL=v2m[::,2]P1measL=v2m[::,1]
EqnM eas
MeasEqnMeas4
ErrorIds=real((Idsmeas-Idssim)/Idsmeas)ErrorP3=P3meas-P3simErrorP2=P2meas-P2simErrorP1=P1meas-P1sim
EqnM eas
DataAccessComponentDAC2
iVal2=0iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGAND15VGm04LP02.citi"
DAC
VARVAR1
b1m=(v1m-50* i1m)/2a1m=(v1m+50* i1m)/2b2m=(v2m-50* i2m)/2a2m=(v2m+50* i2m)/2i2m=fileDAC1, "I2"i1m=fileDAC1, "I1"v2m=fileDAC1,"V2"v1m=fileDAC1,"V1"
EqnVar
DataAccessComponentDAC4
iVal2=1iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGAND15VGm04LP02.citi"
DAC
MeasEqnMeas2
P3sim=dbm(v2[::,3])P2sim=dbm(v2[::,2])P1sim=dbm(v2[::,1])
EqnM eas
MeasEqnMeas1
Igsmeas=real(i1m[::,0])Idsmeas=real(i2m[::,0])P3meas=dbm(v2m[::,3])P2meas=dbm(v2m[::,2])P1meas=dbm(v2m[::,1])
EqnM eas
VARVAR4
numberOfHarmonics=4fundamental=4 GHzINDEX=1INDEXmax=7
EqnVar
DataAccessComponentDAC5
iVal2=1iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGAND15VGm04LP02.citi"
DAC
DataAccessComponentDAC3
iVal2=0iVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGAND15VGm04LP02.citi"
DAC
DataAccessComponentDAC1
iVal2=freq/fundamentaliVar2="FREQ"iVal1=INDEX-1iVar1="INDEX"ExtrapMode=Interpolation ModeFile="MGAND15VGm04LP02.citi"
DACHarmonicBalanceHBsimulation
Order[1]=numberOfHarmonicsFreq[1]=fundamental
HARMONIC BALANCE
MeasEqnMeas3
Igssim=real(IgsDC.i[::,0])Idssim=real(IdsDC.i[::,0])
EqnM eas
VARVAR5
V2DC=fileDAC2,"V2"V1DC=fileDAC2,"V1"
EqnVar
FET05mmG2X1
I_ProbeIgsDC
I_ProbeIdsDC
TLINTL1
F=4 GHzE=-1Z=50.0 Ohm
RR3R=50
V_1ToneSRC1
Freq=fundamentalV=0 V_All=2*a1m
V_1ToneSRC2
Freq=fundamentalV=0 V_All=2*a2m
RR2R=50
DC_BlockDC_Block2
I_Probei2
I_Probei1DC_Block
DC_Block1
DC_FeedDC_Feed2
V_DCSRC4Vdc=real(V2DC)DC_Feed
DC_Feed1V_DCSRC3Vdc=real(V1DC)
Optimization Loadpul :one goal- gamma error. Operating voltages, Pin for model simulations are calculated from measured waveforms.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 18
Combined LSNA & Load-Pull Measurements -the best approach for LS evaluation for GaN
INDEX (1.000 to 32.000)
a2_s
im[::
,1]/b
2_si
m[::
,1]
a2[::
,1]/b
2[::,
1]
-1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4-1.6 0.6
2.0
2.5
3.0
3.5
1.5
4.0
VGS
Pou
t1m
eas
V
mag
(Pou
t1si
m)
-1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4-1.6 0.6
0.5
1.0
1.5
2.0
0.0
2.5
VgsP
dcsi
mP
dcm
eas
100 200 300 4000 500
-0.10-0.050.000.050.100.15
-0.15
0.20
Time(ps)
Ids(
A)
5 10 15 20 25 300 35
-0.050.050.15
-0.15
0.25
Vds(V)
Igat
e (A
)
100 200 300 4000 500
-0.10-0.050.000.050.10
-0.15
0.15
Time(ps)
Igat
e(A
)
5 10 15 20 25 300 35
-0.050.050.15
-0.15
0.25
Vds(V)
Ids(
A)
-4 -3 -2 -1 0-5 1
-0.050.050.15
-0.15
0.25
Vgs(V)
Igat
e(A
)
-4 -3 -2 -1 0-5 1
-0.050.050.15
-0.15
0.25
Vgs(V)
Ids(
A)
a)
b)
c)
d)
e)
f)
Measured (points) and modeled RF and DC Power Load Pull C- band
Measured and simulated Load Impedances C band.I2,V2 should be correct to get this right!
Measured and modeled Waveforms Vds=15V; C -band Harmonic Load pull evaluation.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 19
3LSNA & Load-Pull Measurements:GaN Knee walkout evaluation:Real Active Load Evaluation
INDEX (1.000 to 8.000)
Z
2 3 4 5 6 71 8
29
30
31
32
33
28
34
INDEX
dBm
(v2m
[::,1
])
5 10 15 20 25 300 35
0.07
0.14
0.21
0.28
0.00
0.35
Vds(V)
Ids(
A)
Zl from 50 to 280 oHm
Sweeping real Zload RF=4 GHz;Pin=14 dBm GaN DC Ids (red) and dynamic Ids(Blue) sweeping real ZloadThe high freqency IV slump is accuratelly modeled with the Rd2 and gate control network Rdel,Cdel
2GHz
2 4 6 8 10 12 140 16
0.00
0.05
0.10
0.15
0.20
-0.05
0.25
v2mts
i2m
ts
v2sts
i2st
si1
mts
i1st
s
5 6 7 8 9 104 11
-0.05
0.00
0.05
0.10
0.15
-0.10
0.20
v2sts
i2m
tsi2
sts
i1m
tsi1
sts
12GHZ 18GHz
6.5 7.0 7.5 8.0 8.5 9.06.0 9.5
0.00
0.05
0.10
-0.05
0.15
v2sts
i2m
tsi2
sts
i1m
tsi1
sts
Knee walkout: 2GHz Vmin=0.8V(DCKnee GaAs) 12GHz Vmin=4.5V 18GHz Vmin=6.3V
Knee walkout is modeled with Rd2
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 20
Typical results after the optimizations.Accuracy in the range better 5%
2 3 4 5 6 7 81 9
15.5
23.0
30.5
8.0
38.0
INDEX
dBm
(v2[
::,1
])
m5
dBm
(v2m
[::,
1])
m6
m5INDEX=dBm(v2[::,1])=33.466
9.000m6INDEX=dBm(v2m[::,1])=33.403
9.000
INDEX (1.000 to 9.000)
a2[:
:,1]
/b2[
::,1
]a2
m[:
:,1]
/b2m
[::,
1]
2 3 4 5 6 7 81 9
0.0250.0500.0750.1000.1250.1500.1750.2000.2250.2500.2750.3000.3250.3500.3750.4000.4250.4500.475
0.000
0.500
INDEX
PAEm
eas
m7
PAEs
im
m8
m7INDEX=PAEmeas=0.458
9.000m8INDEX=PAEsim=0.451
9.000
2 3 4 5 6 7 81 9
3.4
3.6
3.8
4.0
4.2
4.4
4.6
3.2
4.8
INDEX
mag
(Prfm
eas)
m9
mag
(Prfs
im)
m10
m9INDEX=mag(Prfmeas)=3.861
6.000
m10INDEX=mag(Prfsim)=3.970
6.000
Eqn DPAEmeas=100*(PAEmeas-PAEsim)/PAEmeas
2 3 4 5 6 7 81 9
0.5
1.0
1.5
2.0
2.5
3.0
0.0
3.5
INDEX
DPm
DPA
Emea
s
Load Pull 7 Ghz Vd20v Pin 18 dBm
Load Pull 7 Ghz Vd20v Pin 18 dBm
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 21
Self-heating measurement and modeling problems LSNA users should be aware!LSNA measurement at single temperature is not enough to evaluate self-heating properties.
3 6 9 12 15 18 21 24 270 30
0.09
0.18
0.27
0.36
0.00
0.45
vd
DC
2.D
C.id
sp.i,
A
Vdsexp
Idse
xp
3 6 9 12 15 18 21 24 270 30
0.09
0.18
0.27
0.36
0.00
0.45
vd
DC
2.D
C.id
sp.i,
A
Vdsexp
Idse
xp
INDEX (1.000 to 9.000)
a2[::
,1]/b
2[::,
1]a2
m[::
,1]/b
2m[::
,1]
m1INDEX=dBm(v 2[::,1])=33.696
9.000
2 3 4 5 6 7 81 9
15.5
23.0
30.5
8.0
38.0
INDEX
dBm
(v2[
::,1]
)
m1
dBm
(v2m
[::,1
]) m1INDEX=dBm(v 2[::,1])=33.696
9.000
m10INDEX=mag(Prf sim)=3.970
6.000
2 3 4 5 6 7 81 9
3.4
3.6
3.8
4.0
4.2
4.4
4.6
3.2
4.8
INDEX
mag
(Prfm
eas)
mag
(Prfs
im)
m10
m10INDEX=mag(Prf sim)=3.970
6.000m8INDEX=PAEsim=0.451
9.000
2 3 4 5 6 7 81 9
0.0250.0500.0750.1000.1250.1500.1750.2000.2250.2500.2750.3000.3250.3500.3750.4000.4250.4500.475
0.000
0.500
INDEX
PAEm
eas
PAEs
im
m8
m8INDEX=PAEsim=0.451
9.000
INDEX (1.000 to 9.000)
a2[::
,1]/b
2[::,
1]a2
m[::
,1]/b
2m[::
,1]
m1INDEX=dBm(v 2[::,1])=33.681
9.000
2 3 4 5 6 7 81 9
15.5
23.0
30.5
8.0
38.0
INDEX
dBm
(v2[
::,1]
)
m1
dBm
(v2m
[::,1
]) m1INDEX=dBm(v 2[::,1])=33.681
9.000
m10INDEX=mag(Prf sim)=3.946
6.000
2 3 4 5 6 7 81 9
3.4
3.6
3.8
4.0
4.2
4.4
4.6
3.2
4.8
INDEX
mag
(Prfm
eas)
mag
(Prfs
im)
m10
m10INDEX=mag(Prf sim)=3.946
6.000m8INDEX=PAEsim=0.451
9.000
2 3 4 5 6 7 81 9
0.0250.0500.0750.1000.1250.1500.1750.2000.2250.2500.2750.3000.3250.3500.3750.4000.4250.4500.475
0.000
0.500
INDEX
PAEm
eas
PAEs
im
m8
m8INDEX=PAEsim=0.451
9.000
Rtherm=26 Ohm ,PAE=0.451Output power 33,681 dBm
Rtherm=6 oHm,PAE=0.451 Output power 33,696 dBm
Rtherm 6 ohm Rtherm 26 ohmLSVNA results are not sensitive to Rthermalchanges .Additional measurements needed to extract Rthermal!
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 22
Conclusions:
LSVNA is very important and useful tool for evaluating the quality of new devices!Arranging measurements in two frequency ranges:Low RF and high RF, simplifies evaluation procedure and model extraction. At low RF Ids parameters are evaluated and extracted and at High RF- reactive part .A general purpose large-signal modeling approach for GaN FET was proposed, implemented in CAD tools and evaluated experimentally with DC, S-par, LSVNA with devices from different foundries. Models show good accuracy and stable behavior in HB simulations. Thank you for your attention! S.D.GL.
Questions?Meyer’s Law, part of Murphy’s Law:It is a simple task to make things complex, but a
complex task to make them simple.
WMB: Device Model Extraction from Large-Signal Measurements IMS2012, Montreal, June 17-22, 2012 23
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