Reprinted from MACHINE DESIGN April 23,1993 2Y&/ P N A SPECIAL SUPPLEMENT TO MACHINE DESIGN

PROTECTING THE OZONE LAYER A GLOBAL BUSINESS INITIATIVE

he depletion of the Earth’s stratospheric ozone layer is a global problem that necessitates global initiatives toward a solution. Since the mid

certain industrially-produced halocarbons transport chlo- rine and bromine into the stratosphere, contributing to the depletion of the ozone layer. The full extent of strato- spheric ozone depletion became known when satellite measurements of the ozone layer over Antarctica revealed a hole about the size of the United States which appeared each spring and grew worse every year.

The stratospheric ozone layer protects the earth from harmful ultraviolet radiation, which may be lethal to plant, bacteria, and animal species. In humans, there is likely to be an increase in serious burns and skin care fatalities from excess ultraviolet radiation. The Montreal Protocol, which I signed in 1987 on behalf of the United States as EPA Administrator, was the first international agreement among 23 nations to reduce ozone-depleting substances (ODSs).

As new scientific information became available about the depletion of the ozone layer, the Montreal Protocol was amended, and quicker phase outs of ozone-depleting substances were imposed. In 1990, the partiesto the Mon- treal Protocol passed amendments that call for the total phase out of production of CFCs by the year 2000. In Feb- ruary 1992, President Bush announced a unilateral accel- eration of phase outs of ODSs in the United States by De- cember 31, 1995. This action, in turn, put pressure on other parties of the Montreal Protocol to accelerate the phase out of certain ODSs by the end of 1995 at their No- vember meeting in Copenhagen.

In response to the challenges of the Montreal Protocol, companies using and producing ODSs began to search for viable alternatives.

Companies took the lead in developing new technolo- gies to meet the goals of the Montreal Protocol and broaden the market for environmentally sound alterna- tives. In addition, many companies which used ODSs have realized that in the long run, phasing out their use of these substances will actually save them money.

The Industry Cooperative for Ozone Layer Protection (ICOLP) was formed in 1989 as a nonprofit organization of leading electronic and aerospace companies that were major ODS users. ICOLP’s goal is to speed the elimination of ozone-depleting substances, thereby aiding in the pres- ervation of the earth’s stratospheric ozone layer.

T 1970s, a scientific consensus has developed that

The hole in the ozone layer over the Antarctic is evident in this pseudocolor- enhanced satellite photo from the National Oceanic & Atmospheric Administration.

ICOLP is a new model for dealing with global environ- mental problems. First, ICOLP has demonstrated that voluntary partnerships of government and industry can be effective in solving environmental problems. ICOLP exemplifies that environmental protection and eco- nomic development are not adversarial, but go hand in hand. Second, ICOLP is creating a forum for the intro- duction of technologies globally that will help to reduce the use of ozone-depleting substances.

-LeeM. Thomas

Lee M. Thomas was Administrator of the US. Envi- ronmental Protection Agencyfrom 1985 -1989, signing the Montreal Protocol in 1987. Mr. Thomas serves as Program Advisor to ICOLP.

Produced in conjunction with

INDUSTRY COOPERATIVE FOR OZONE LAYER PROTECTION

The Industry Cooperative for Ozone Layer Protection: Its Conception and Purpose

Margaret G. Kerr, W? Environment, Health and Safety Northern Telecom Inc.

David R. Chittick Kl? Environment and Safety AT& T

When CFCs were introduced, they seemed to be the per- fect substance. They were inert, nontoxic, nonflammable, nonexplosive, and non-carcinogenic. They were extremely useful and low in cost. Consequently, industries all over the world began to use them as refrigerants, solvents, foam-blowing agents, aerosol propellants, and for many other uses.

Now, after more than half a century of use, chlorofluo- rocarbons (CFCs) have been found to contribute to two of the broadest environmental problems affecting us - ozone depletion and global warming.

The use of CFCs and other ozone-depleting chemicals cannot just be eliminated, however. The functions that these substances performed must be replaced with some- thing else.

The very usefulness, versatility, and low cost of CFCs, however, has created a problem in replacing them. They are vital to many industrial processes. The problem is to find alternatives, and make them available to both current and potential users, especially in less-developed countries that are trying to build better lives for their people. If indi- vidual companies and nations struggled with the problem of finding these alternatives, valuable efforts would be du- plicated and time lost. In addition, less-developed coun- tries do not have the resources to create alternative tech- nologies independently.

To combat these problems, and to phase out the use of

CFC solvents, methyl chloroform and other ozone-deplet- ing solvents as quickly as possible, a group of multina- tional corporations and the U S . Environmental Protection Agency banded together in late 1989 to form ICOLP and explore how the process of technological change can be accelerated.

Technology cooperation is the reason for ICOLP’s exis- tence. It is an organization whose purpose is to help over- come some of the obstacles to technological change and the transfer of technologies.

ICOLP is truly international. It is a worldwide partner- ship in government and industry whose membership and affiliates embrace all political and economic systems. ICOLP’s members and affiliates also work with other na- tional and international organizations, such as the United Nations Environment Programme, the World Bank, the United Nations Development Programme, and others, to ensure that alternative technologies are available when and where they are needed.

Corporate members of ICOLP will be taking the lead role on a series of technology cooperation projects in develop- ing countries with assistance from the World Bank. Individ- ual ICOLP companies are organizing workshops and dem- onstration projects in these developing countries to help industry speed the elimination of ozone-depleting solvents. Northern Telecom began this process in 1991 in Mexico, and plans to continue similar projects in 1993 in Turkey and China. AT&T, IBM, Motorola, Ford, JEMA, MITI and the U.S. EPA will be leading similar projects in China, Malaysia, Brazil, Thailand, India, Korea, and other countries.

The evolution of a global economy has generated greater international cooperation among nongovernmen- tal organizations. In the case of the Montreal Protocol, banding together to confront a global problem has

reached unprecedented peacetime levels. ICOLP is an ex- cellent example of what industry, government, and private organizations can accomplish by working together coop- eratively. The environment knows no national boundaries, and cooperation is essential to resolve global environmen- tal problems. ICOLP has taken a major first step in pro- moting this cooperation, and we hope it will serve as a model for future efforts to protect the environment.

ICOLP: An €PA Perspective Dr. Stephen 0. Andersen Acting Deputy Dk, Stratospheric Protection Division US EPA

Diane B. Zoi The Bruce Company

Chlorofluorocarbon (CFC)-113 and methyl chloroform solvents were considered vital to electronics and aerospace manufacturing for nearly twenty years. But to- day industry leaders are eliminating their use to protect the ozone layer, and in doing so are improving product performance and saving substantial amounts of money. ICOLP member companies, as solvent users, have estab- lished a corporate priority to end their use of ozone-de- pleting solvents (ODS) as soon as is technically feasible.

In December 1991, Northern Telecom became the first multi-national company to completely halt the use of CFC solvents, and has committed to methyl chloroform elimi- nation in 1993. Many companies with successful ODS phase out programs developed new cleaning methods, or eliminated the need to clean altogether, while maintaining their competitive edge. Electronics companies report cost savings, simplified manufacturing, and higher reliability by switching to new technologies. For example, Ford, Honey- well, Hughes, Motorola, and Texas Instruments are now manufacturing printed circuit boards that are cleaner than

boards produced with CFCs, and meet the most demand- ing military specifications. These progressive companies have proven that environmental protection and economic development are compatible because they have created the corporate infrastructure to succeed.

By accelerating their phase out of ODSs, companies in the electronics and aircraft industry are avoiding potential shortages and high prices of these chemicals as national and global production is curbed. These industry leaders are years ahead of some of their competitors in imple- menting substitutes and alternatives to ODSs. Their initia- tives earn the companies praise from environment agen- cies, politicians, and the public. Customers choose products based on performance and environmental com- patibility, and these companies are poised to capture mar- ket share if their competition can not supply products due to shortages of CFC, MCF, or the alternative technologies. Total customer satisfaction is the goal and an environmen- tally sound product - from cradle to grave - has be- come an integral part of the equation.

ICOLP member companies are also commended for sharing their technical knowledge and experiences with industry around the world. They see their environmental obligations extending beyond in-house compliance, and have adopted corporate policies guided by global envi- ronmental responsibility. Specifically, while implement- ing their own phase outs of ODSs, they are assisting other companies -including their competitors - in planning phase outs. A new corporate culture has emerged in which corporate experts are helping solve global environ- mental problems.

ICOLP companies are sharing their expertise and inno- vative ozone-safe technology with their worldwide com- petitors via technology cooperation projects. AT&T, Ford, IBM, Motorola, and Northern Telecom, for example, have formed voluntary partnerships with developing country national environmental authorities, and the United States Environmental Protection Agency (US EPA) to accelerate the phase out of CFC-113 and methyl chloroform in devel-

The impact of treaties and gov- ernment man- dates on ozone depleting chemi- cals has been to con tinually stiffen the time table for phase out as consensus has grown about the magnitude of the problem.

oping countries. Through partnerships like these, industry is working with government to create a global force to pro- tect the environment. Voluntary cooperation on the part of industry has allowed the U.S. EPA to supplement the tradi-

The US. EPA came up with this analysis of how chlorine will build up in the atmosphere under several different scenarios.

tional role of command-control enforcement with joint project planning.

The electronics and aerospace industry must continu- ally change and remain abreast of new technologies in or- der to be successful. ICOLP member companies’ ability to set and meet new corporate challenges paves the way for creative and successful industry/government partnerships. The EPAis able to expand existing phase out programs and plan innovative approaches with the support of industry- generated research and expertise.

Clean Connections - Putting Innovation to Work for the Environment Ronald L. /man, Sandia Na tiona I Labo ra tories President- Elect American Sta tistical Asso cia tion

Larry R. Lichtenberg, Government Electronics Group Motorola Inc.

Each year the electronics industry uses millions of gal- lons of chemical solvents, including hundreds of thou- sands of gallons of ozone-depleting chemicals, to clean flux residues from electronic equipment. This use ac- counts for as much as 20 to 24% of the worldwide con-

sumption of CFCs. With the U.S. committed to phasing out the use of CFCs by 1995, strong environmental and eco- nomic pressure is being applied to electronics manufac- turers to eliminate the use of CFCs in soldering processes. The industry has responded by experimenting with a host of approaches, ranging from using different types of agents for removing flux residues to developing alternative fluxes that leave no residues. Among these diverse approaches, one alternative-a “no-clean” soldering process-has recently been thoroughly tested and seems poised for find- ing widespread application in the electronics industry.

The no-clean soldering process - which eliminates cleaning, costs less than most other processes, and pro- duces strong, reliable electrical connections - offers the potential of a long-term solution for environmentally con- scious soldering.

The three main modes of soldering in use today are wave, reflow, and hand soldering. Traditionally, each of these three processes has used different forms of solder and different equipment. But these three processes share a common denominator - the need for some type of flux material to aid in the smooth distribution (wetting) of molten solder to circuit boards and components.

One obstacle to this proper wetting is the presence of varying degrees of surface oxides on components and cir- cuit boards. These oxides inhibit the soldering process, which later causes electrical failures in the product. The solution has been to use more highly activated fluxes, which promote better soldering than milder, low activa- tion fluxes. The primaryingredient in most fluxes has been naturally occurring rosin, derived from pine trees.

Historically, there has been a concern when using fluxes with higher levels of activation that, if the rosin residues are not removed from the printed wiring board after soldering, they may absorb moisture and thus inhibit the product performance. This problem was highlighted for the military during the Vietnam War when electronic equipment, assembled with higher-level activators and not properly cleaned, failed in the field due to corrosion, as a result of moisture absorption by flux residues.

However, not all rosin-based fluxes produce residue that attracts moisture. Some rosin-based fluxes lack the additives that enhance the activation level of the rosin, so these fluxes do not have to be cleaned from the circuits.

In the past few years considerable research has been directed toward developing fluxes using alternate materi- als, ranging from different formulations of rosin-based fluxes to chemicals totally free of rosins. This research has paid off in many new flux materials that respond well to al- ternate cleaning solvents. Even more exciting is the fact that several do not require cleaning at all.

Nevertheless, it is likely that numerous commercial manufacturers will continue using old cleaning pro- cesses. The reason is that military specifications have a big impact on the commercial electronics industry, and Mil specs have been biased in favor of cleaning electron- ics products at all costs, regardless of environmental im- pact. This is in contrast to the compelling evidence from a number of major commercial electronics manufacturers around the world proving the benefits and successes of no-clean flux materials.

It is time to change the specifications to bring them up

~~ ~

The ATT LSF 2000 spray fluxer.

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To find out about installing the LSF-2000 in your production line, call AT&T today.

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- - - - - ATaT - - -

At ISM Corp.3 San Jose plant, assembled cir- cuit boards go through a water cleaning process in a machine that behaves like a powerful dish washer.

to date with current practices. This would not only help the environment, but would boost the profitability of both commercial and military electronics manufacturers.

The no-clean process eliminates cleaning equipment and its associated overhead. It not only eliminates the need for ozone-depleting solvents but also reduces energy con- sumption. It uses a dilute adipic acid flu to remove oxida- tion from components and circuit boards.

In one of the alternative wave solder processes, an am- bient atmosphere of dilute formic acid vapor in nitrogen is used to inhibit oxidation during soldering. The adipic acid and formic acid react similarly to normal rosin flux with respect to reducing oxides.

The high temperature used in wave soldering during the preheat and wave solder stages causes the adipic acid to evaporate during soldering and the formic acid to con- vert to carbon dioxide and water. The process leaves only minimal noncorrosive residue on the surface of the printed wiring boards and thus eliminates the need for a fi- nal cleaning.

The no-clean process offers the potential of a long-term solution. It eliminates the costs and environmental im- pacts associated with the manufacture, use, maintenance, and disposal of cleaning equipment. It also eliminates problems associated with the manufacture, storage, han- dling, and disposal or reclamation of solvents.

The potential savings in energy and waste from using the no-clean process is sigtllficant. Conservative projections for the U.S. indicate a potential energy savings in the year 2010 of more than 4 billion kilowatt hours and a waste saving equivalent to 18,000 tons of CFC-113.

Alternate manufacturing soldering processes must be developed and implemented to respond to the require- ments mandated by law and to a general concern for pro- tecting the environment. Although only one process was evaluated in the study detailed in this presentation, there are a number of alternate processes available at this time that provide high-quality electronics with no compromise in performance.

Motorola and other ICOLP members have worked with the U.S. EPA to develop a series of technical manuals on ODS alternatives. The sixth manual in the series will pro- vide a more detailed description of “no-clean” soldering processes and will be available through ICOLP in early May.

Previous manuals in the series include: Manual of Practices to Reduce and Eliminate CFC-113 Use in the Electronics Industry Aqueous and Semi-Aqueous Alternatives for CFC-113 and Methyl Chloroform Cleaning of Printed Circuit Boards Conservation and Recycling Practices for CFC-113 and Methyl Chloroform Eliminating CFC-113 and Methyl Chloroform in Preci- sion Cleaning Operations Alternatives for CFC-113 and Methyl Chloroform in Metal Cleaning

Making it Happen- lmplemen ting Company Wide Phase Out Programs R. Cynthia Pruett Director of Environmental Affairs IBM Asia Pacific

June Andersen, Cory R. Landgren, Joseph Hoeflein, Jerome Wagnec David Yetter IBM Corp.

IBM has a long history of concern for the environment. In 1970 a corporate environmental policy was initiated. The issue of how to proceed regarding ozone depletion surfaced in 1987. In 1988, IBM surveyed its Technology Products Group whose manufacturing locations were re- sponsible for 50% of the company’s use of CFC-113. The survey revealed that IBM could cut its CFC use some 85% by year end 1993. In essence, phase out was framed as a design problem for process and development engineers that would require innovation and invention for success.

With new information surfacing on the worsening of the ozone hole, and the likelihood that the Montreal Protocol would be strengthened in the future, a work group meet- ing in 1988 agreed on firm deadlines for company wide phase outs. The group also decided on a more aggressive goal of phase out by year end 1993.

Top management endorsed the program. The only caveats were that CFC replacements be safe and product

integrity be maintained. At the end of 1991 reductions achieved exceeded 80%, right on target. The success of this program was recognized with the 1992 Environmental Protection Agency Administrator's Pollution Prevention Award for the San Jose, Calif., facility and the 1992 Envi- ronmental Protection Agency's Stratospheric Ozone Award for the Rochester, Minn., and Endicott, N.Y. facilities.

Updating phase out sched- ules and enlisting support from management as tech- nical fcasibility components were demonstrated; and L'sing the task force to begin technical exchange projects and improve communica- tions efforts. IIead/disk assembly (HDA)

cleaning accounted for roughly 58% of site CFC us- age. An engineering task force compared the cleaning effec- tiveness of three processes: CF(:/ultrasonics, water/ ultra- sonics and water spray. IBM collaborated with its vendor to design, build and test a new aqueous disk drive parts cleaner. The resulting cleaner is still being fine tuned hut \\>as the first of its type to he used i n the six IBM HDA man-

IBM San Jose IBM's San Jose operation was one of the world's largest users of CFCs in 1987. In fact, it had the highest CFC industrial emissions (1.5 million lb) in the U.S. that year. Five years later, IBM had successfully elimi- nated CFC use from its manufacturing operations. This dramatic reduction took place with the most environmen- tally sound method available -substituting for CFCs aque- ous cleaning and high temperature drying.

The San Jose facility developed a detailed phase out pro- gram that now serves as a model at other IBM facilities and companies around the world. Key components included

Establishing a task force to determine and track the uses of ozone depleting substances in plant processes, and set goals for their elimination; Formulating a two-pronged elimination strategy first concentrating on reducing and maximizing the effi- ciency of current CFC use while working on alternative technologies; Conducting monthly or quarterly reviews with the site's general manager to track progress;

The Goals of the Industry Cooperative for Ozone Layer Protection

IC0I.P was formed in 1989 by leading electronics and aerospace compAues to co- ordinate the open, worldwide exchange of non-proprietary information on substitute technologies, substances, and processes for ozone depleting solvents (ODSs). ICOLP works with ODS users, suppliers, and re- lated organizations to speed protection of the stratospheric ozone layer. ICOLP:

Encourages the prompt substitution of safe, environmentally sound alternatives to industrial ODS use; Acts as an international clearinghouse for information on ODS alternatives: and Coordinates programs among national and international trade groups, research orga- nizations, and government bodies for co- operative efforts in generating, gathering, and distributing alteinatives information.

Machine Design

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ufacturing sites around the world. The product has be- come the benchmark for aqueous cleaning of precision parts throughout IBM and the industry.

Most CFCs at San Jose came from the HDA parts clean-

ers. As an interim step, IBM replaced the largest convey- orized cleaner with small, low emission manual CFC clean- ers. This cut CFC use by 10,000 lbs, or 80%. Most remark- ably, the use of deionized water dropped by 30% by converting existing cleaners to an all aqueous process - a welcome conservation measure during a severe Califor- nia drought.

Water and air drying of disk substrates accounted for nearly 30% of San Jose’s disk manufacturing-related CFC use. A CFC drying bath was replaced with heated deionized water, a heat-staged high efficiency particle filtration dry- ing station and a cooling station. The project contributed to “just in time” manufacturing by eliminating a 24-hour cooling period for disk substrates. It also cut CFC use by about 900,000 lbs. per year.

In the last three years alone, approximately 2,100,000 lbs. of emissions have been prevented at just the San Jose facility. New aqueous cleaning and drying technologies are a part of new product development efforts.

While the overall dollar value is difficult to assess, many of the projects have been highly cost effective. We estimate the break-even point for site-wide CFC replacement oc- curred in the third quarter of 1991. During this time, how- ever, the cost of CFCs has more than tripled. That means the site will save a potential $3 million annually by elimi- nating CFCs.

In 1988, IBM also decided to share its aqueous clean- ing technology with other companies. Since then, IBM has

responded to over 900 requests both inside and outside of the company.

IBM Rochester In 1987, the Rochester, Minn. facility was among the five largest emitters of CFCs in the U.S. Rochester used almost 1 million lbs. of CFCs in 70 distinct cleaning processes. The key to Rochester’s elimination ef- ~ ~

fort was understanding its processes and the users of CFCs. The plant set up a tracking system to monitor each depart- ment’s use. Monthly meetings reviewed CFC use, discussed elimination strategies, and successes and failures in CFC elimination projects. A special department reviewed the cleaning processes and the types of soil being removed in connection with them. The team developed some simple and effective measurements for monitoring results.

The plant team investigated numerous CFC replacement options including other chlorinated solvents, hydrocar- bons, alcohols, ketones, and glycol ethers. Process, safety, or environmental factors eliminated all of them. The only real options were water and surfactants, which eventually replaced more than 95% of Rochester’s CFC processes.

Early R&D efforts had pointed to high quality deionized (DI) water as the way to clean precision parts and circuit boards. There were four basic cleaning and drying pro- cesses developed at Rochester. Each is unique, but the basic concept is to have the final DI rinse as hot as possible with- out damaging the parts, to remove as much water as possi- ble from the surface prior to drying, and to dry the parts

~ -~

INDUSTRY COOPERATIVE FOR OZONE LAYER PROTECTION

The environment is one of the most important issues of our time.

@ Which is why Northern Telecom is proud to share the

technology that made us the first multinational corporation to stop using ozone-depleting CFC solvents in manufacturing.

Technology the world calls on.

0 1992 Northern Telecom

The Montreal Protocol I991

Assessment Re- port of the Sol- vents, Coatings and Adhesives Technical Op-

tions Committee categorized the

main uses of trichloroethane

this way.

quickly to reduce corrosion and water spotting. Part design, such as eliminating blind holes or voids if possible, is a very impor- tant part of the total process.

The four basic cleaning and drying processes are circuit board defluxing, metal cleaning, precision cleaning for disk drives, and CFC based disk dry- ing. The circuit card area uses water soluble fluxes on the pin through hole cards. A new water base solder paste was devel- oped for the surface mount cards. Deflecting and cleaning takes place in a commercially available conveyor card cleaner which uses DI water pressure spray above and below the card. An air knife removes the major- ity of the water from the cards. Infrared heat dries the cards in the final section of the cleaner.

The most important informa- tion needed in evaluating phase out programs includes: the sur- face condition and the material to be cleaned, the type of soil to be removed, and the necessary standard of cleanliness when 6nished. Rochester experts have found that water based systems require tighter control and more monitoring than the old CFC base vapor degreasers, but are an excellent alternative.

IBM Endicott The Endi- cott, N.Y., facility developed a

task force in 1989 find ways of minimizing ozone deplet- ing chemicals and methylene chloride (MC). In just three years, the site MCF emissions dropped by over 1 million lbs. (90%) and MC emissions were reduced over 1.8 million lbs. (95%).

Panel manufacturing switched from solvent based to aqueous based photoresist. Inorganic solutions of so- dium carbonate and sodium hydroxide, both with very low volatility, replaced the highly volatile developing and stripping agents MCF and MC. Aqueous processes also replaced these agents in printband manufacturing as well. In advanced circuit panel manufacturing, a process using a non-chlorinated organic chemical, which can serve as both a developer and stripper for photoresist de- signed to stand-up to inorganic solutions, was developed to replace MCF and MC. And the whole facility now uses no-clean fluxes.

IBM Endicott spent over $22 million on solvent emis- sion reduction. The investment is paying significant divi- dends. It has cut virgin chemical purchases, distillation, and recycling efforts associated with MCF and MC. Car- bon absorption units for abating solvent fumes and their

associated costs have been reduced. A reduction in off- site waste shipments has been realized as well. In all, over $7 million in annual savings has accrued.

CFC Elimination on Printed Wiring Board Processes at Ford Motor Company Peter Sinkunas Manufacturing Staff Engineer Ford Motor Company

Ford Electronics Div. researched every available CFC-free technology. Results showed inert gas solder- ing systems as the best for high-volume electronic pro- duction. A pilot build of 968 electronic modules were soldered using 1.88% adipic acid/isopropanol as a flux and formic acid atomization. The resulting solder joints were better than those soldered with CFC clean- ing. Comparable data indicates a fourfold improve- ment in solderability with PPM inert gas soldering. Process improvements eliminated the use of formic acid in the solder process, alleviating other environ- mental concerns.

Inert gas soldering cuts VOC and lead emissions and to- tally eliminates CFC emissions. Costs of inert gas soldering compare favorably to current solder systems when costs for cleaning machines and CFCs are included.

Machine operators like the system. Two assembly line personnel helped conduct product and system soldering evaluations in the Ford Electronics Research Lab. They ob- served that: start-up time and machine maintenance were reduced, system cleanliness was improved, and the capa- bility of the system to produce consistent solder joints was proven in the final solder inspection.

Ford Electronics Div. has attained a leadership role in inert gas soldering and is sharing this accomplishment with other companies.

Digital Eliminates CFCs from Worldwide Semiconductor Operations Joanne 5. Lutian, Corporate Director EH&S Comm mica tions Digital Equipment Corporation

Today, Digital is well on its way to eliminating all CFCs by the end of 1994, with an 85% reduction in CFC use since 1990. Some of the most notable reductions took place in the company’s semiconductor operations, located in Hudson, Mass. and South Queensferry, Scotland. In 1989, Digital’s semiconductor operations used 52,000 lbs of CFCs; in 1993, the use is zero.

Digital’s next-generation semiconductor facility cur- rently under construction in Hudson, Mass. - Fab 6 - eliminates solvent degreasing operations and re- fines manufacturing chemistry to remove many toxic chemicals used in the early 1980s. In developing new product technologies, Digital design engineers are re-

sponsible for selecting processes, components and sub-assemblies compatible with non-CFC cleaning and servicing methods. Digital’s Alpha ASP chip is a prime example of this engineering leadership. The entire pro- cess for designing and manufacturing this 64-bit chip is CFC-free.

In 1986, Digital chaired a CFC task force established by the American Electronics Association’s Environmental Committee. The task force worked with the U.S. State De- partment and the U.S. EPA to formulate the U.S. positions that were later used in the development of the Montreal Protocol. In 1988, Digital instituted its own worldwide CFC elimination policy - focusing on manufacturing, engi- neering, product marketing, field saleshervice, and facili- ties (including fire suppression, air conditioning and re- frigeration systems).

For the past 12 years, Digital has used aqueous clean- ing in many of its printed-circuit board manufacturing op- erations, instead of CFC-based solvents. Consequently, Digital developed and patented a new aqueous process that could be used with more sophisticated surface- mount manufacturing techniques. Digital supplied techni- cal specifications for this process at no charge for indus- try-wide use.

In addition to the Hudson and South Queensferry semi- conductor operations, other Digital CFC-free manufactur- ing facilities include Nijmegan, Netherlands; Kaufbeuren, Germany; and Taiwan, Republic of China.

Concern for protecting the ozone layer extends to Japan, as evi- denced by the interest of these representatives of Japanese compa- nies in the Ozonet database demonstration being put on by ICOLP president Art FitzGerald. Japan Electrical Manufacturers’ Associa- tion (JEMA) has sponsored several important stratospheric ozone protection efforts. An association of over 170 Japanese electrical manufacturers, JEMA launched its ozone protection campaign in July 1989 with the co-founding of the Ozone Layer Protection Com- mittee. JEMA expanded its ozone protection activities in December 1990 by joining ICOLP. With fellow Japanese members Hitachi, Mat- sushita, Mitsubishi Electric, and Toshiba, JEMA pushed for in- creased international cooperation to protect the ozone layer.

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Copyright @ 1993 by Penton Publishing, Inc., Cleveland, Ohio 441 14