Programma 2Exo 10/8/07 3:14 PM ™ÂÏ›‰· 5€¦ · The conference consists of contributed oral and poster presentations, while selected conference papers will be reviewed by

Programma_2Exo 10/8/07 3:14 PM ™ÂÏ›‰· 5

W E L C O M E L E T T E R

We are pleased to welcome you to the EURO-INTERFINISH 2007, entitled “NNaannootteecchhnnoollooggyy

aanndd IInnnnoovvaattiivvee CCooaattiinnggss” held in Athens, Greece, on 18th and 19th October 2007. The

conference is co-organized by the International Society of Electrochemistry (ISE), the European

Academy of Surface Technology (EAST), the International Union for Surface Finishing

(INTERFINISH), and the National Technical University of Athens (NTUA).

EURO-INTERFINISH is a biannual event of knowledge and experience exchange for researchers

and engineers from industry, research laboratories and academic community. Following the

success of the previous events, Eurointerfinish 2007 brings together state-of-the-art

developments on all aspects related to the processing, characterization and applications of

surfaces, coatings and novel nanostructured materials.

The conference consists of contributed oral and poster presentations, while selected conference

papers will be reviewed by members of the Scientific Committee and be processed for

publication in EElleeccttrroocchhiimmiiccaa AAccttaa.

The Organizing Committee also welcomes you in the city of Athens which has a long and rich

history, holding a prominent place in Greek mythology and in the hearts and minds of millions

of people around the World. The main attractions of Athens, namely Acropolis, the Ancient

Marble Stadium, the ancient Agora, the ancient Theatre and Plaka are within walking distance

from the Divani Palace Acropolis, where the EURO-INTERFINISH 2007 is being held.

CCoo--CChhaaiirrmmeenn

PPrrooffeessssoorr PPiieettrroo LL.. CCaavvaalllloottttii PPrrooffeessssoorr NNiiccoollaass SSppyyrreelllliissPolytechnico di Milano, Italy National Technical University

of Athens (NTUA), Greece


C O M M I T T E E S

CCoo--CChhaaiirrmmeenn

PPrrooffeessssoorr PPiieettrroo LL.. CCaavvaalllloottttiiPolytechnico di Milano, Italy

PPrrooffeessssoorr NNiiccoollaass SSppyyrreelllliissNational Technical University of Athens (NTUA), Greece

SScciieennttiiffiicc CCoommmmiitttteeee

DDrr.. BBaakkoonnyyii IImmrree Hungarian Academy of Sciences, HungaryPPrrooffeessssoorr BBeennaabbeenn PPaattrriicckk Association pour la Recherche et le Developpement

des Methodes et Processus Industriels, FranceAAssssiisstt..PPrrooffeessssoorr BBoouurroouusshhiiaann MMiirrttaatt National Technical University of Athens, GreecePPrrooffeessssoorr CCeelliiss JJeeaann--PPiieerrrree Katholieke Universiteit Leuven, BelgiumDDrr.. DDaaeenneenn TThheeoo BelgiumPPrrooffeessssoorr JJoovviicc VVllaaddiimmiirr University of Belgrade, Serbia MontenegroPPrrooffeessssoorr KKrraasstteevv IIvvaann Bulgarian Academy of Sciences, BulgariaPPrrooffeessssoorr KKuuddrryyaavvttsseevv VVllaaddiimmiirr D. Mendeleyev University of Chemical Technology of

Russia, RussiaPPrrooffeessssoorr LLaannddoolltt DDiieetteerr Swiss Federal Institute of Technology, SwitzerlandPPrrooffeessssoorr LLeeiissnneerr PPeetteerr Jonkoping University, SwedenPPrrooffeessssoorr MMuulllleerr CCaarrllooss Universitat de Barcelona, SpainPPrrooffeessssoorr PPaaaattsscchh WWoollffggaanngg BAM Bundesanstalt ffir Material- forschung und -

prfifung, GermanyAAssssiisstt.. PPaavvllaattoouu EEvvaannggeelliiaa National Technical University of Athens, GreecePPrrooffeessssoorrDDrr.. PPuuiippppee Steiger Galvanotechnique Abt. INNOSURF,

JJeeaann--CCllaauuddee SwitzerlandPPrrooffeessssoorr SSaazzoouu DDiimmiittrraa Aristotle University of Thessaloniki, GreecePPrrooffeessssoorr UUrrggeenn MMuussttaaffaa Istanbul Technical University, TurkeyPPrrooffeessssoorr VVaaggeennaass KKoonnssttaannttiinnooss University of Patras, GreeceDDrr.. ZZiieelloonnkkaa AAnnddrreeaass FEM-Forschungsinstitut ffir Edelmetalle und

Metallchemie, Germany

LLooccaall OOrrggaanniizziinngg CCoommmmiitttteeee

PPrrooffeessssoorr SSppyyrreelllliiss NNiiccoollaass NTUA, GreeceAAssssiisstt.. PPrrooffeessssoorr PPaavvllaattoouu EEvvaannggeelliiaa NTUA, GreeceDDrr.. GGyyffttoouu PPiinneellooppii NTUA, GreeceDDrr.. KKoossaannoovviicc TTaattiiaannaa NTUA, GreeceMMrr.. ZZooiikkiiss KKaarraatthhaannaassiiss AAlleexxaannddrrooss NTUA, GreeceMMss.. SSppaannoouu SSttiilliiaannii NTUA, Greece

1

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 1

G E N E R A L I N F O R M AT I O N

Congress VenueDivani Palace Acropolis HotelParthenonos Street 19 - 25, 117 42 Athens - Greecewww.divanis.com/acropolis

Congress DatesOctober 18 - 19 , 2007

Secretariat Operating Hours09.00 - 19.00 Thursday, October 18th

09.00 - 18.00 Friday, October 19th

Web Sitewww.euro-interfinish2007.gr

LanguageThe official Language of the Congress is English

On Site Registration Fees

RReeggiissttrraattiioonn TTyyppee CCoosstt iinn EEuurroo

ñ Full Participants 500 ñ East European Participants 400 ñ Students 300 ñ Accompanying Persons 50

The Registration fees includeFFoorr PPaarrttiicciippaannttss && SSttuuddeennttss::� Attendance to all Congress Sessions� Conference material� Conference proceedings � Coffee-breaks and lunches� Greek Evening

FFoorr AAccccoommppaannyyiinngg PPeerrssoonnss::� City Tour� Greek Evening

Visual EquipmentThe meeting hall will be equipped with slide, overhead and data video projectors, as well as PCfor speakers needs. All speakers are kindly requested to check and deliver their presentations tothe visual reception at least 30 minutes prior to their presentation. Due to changes in computerconfiguration, laptops will not be accommodated

Poster PresentationsPoster Placement : October 18 at 09.00hrsPoster Dismantling : October 19 until 16.00 hrsPoster Session : Thursday, October 18 at 18.00 - 19.00, Hall ARISTOTELES B

Congress SecretariatTriaena Tours & Congress S.A.15, Messogion Avenue, 115 26 Athens - GreeceTel: +30 210-7499300 Fax: +30 210-7705752Email: [email protected] Website: www.triaenatours.gr

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Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 2

S C I E N T I F I C P R O G R A M

TThhuurrssddaayy,, OOccttoobbeerr 1188 22000077 AArriissttootteelleess AA HHAALLLL

09:00 - 09:30 RReeggiissttrraattiioonnss

09:30 - 10:00 WWeellccoommee AAddddrreesssseess

10:00 - 11:00 1st Session, Chairpersons: PP..--LL.. CCaavvaalllloottttii,, NN.. SSppyyrreelllliiss

10:00 - 10:20OO0011

AACCIIDD CCOOPPPPEERR PPLLAATTIINNGG WWIITTHH CCuuOO UUSSIINNGG IINNSSOOLLUUBBLLEE AANNOODDEESS IINN PPCCBB IINNDDUUSSTTRRYYYum H.T.Adviser, Samsung Electro-Mechanics Co., Ltd

10:20 - 10:40OO0022

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EECCDD NNAANNOOCCRRYYSSTTAALLLLIINNEE GGOOLLDD FFIILLMMSSVicenzo A., Cojocaru P., Cavallotti P.Dipartimento CMIC “Giulio Natta”, Politecnico di Milano, Milano, Italy.

10:40 - 11:00OO0033

PPLLAASSMMAA--PPRRIINNTTIINNGG AANNDD GGAALLVVAANNIICC MMEETTAALLLLIIZZAATTIIOONN HHAANNDD IINN HHAANNDD--AA NNEEWW TTEECCHHNNOOLLOOGGYYFFOORR TTHHEE CCOOSSTT--EEFFFFIICCIIEENNTT MMAANNUUFFAACCTTUURREE OOFF FFLLEEXXIIBBLLEE PPRRIINNTTEEDD CCIIRRCCUUIITTSSMöbius A. 1, Elbick D.1,Klages C.P.2,Thomas M.2 , Zänker A.2, Borris J.2

1 Enthone GmbH, Langenfeld, Germany2 Fraunhofer Institute for Surface Engineering and Thin Films IST, Braunschweig, Germany

11:00 - 11:30 CC oo ff ff ee ee BB rr ee aa kk

11:30 - 12:50 2nd Session, Chairpersons: JJ.. -- PP.. CCeelliiss,, AA.. ZZiieelloonnkkaa,, JJ..CC..PPuuiippppee

11:30 - 11:50OO0044

PPRREEPPAARRAATTIIOONN OOFF NNAANNOOPPAARRTTIICCLLEESS OONN BBOORROONN--DDOOPPEEDD DDIIAAMMOONNDD SSUUBBSSTTRRAATTEE FFOORREELLEECCTTRROOCCAATTAALLYYSSIISSComninellis C., Roustom B.E.Group of Electrochemical Engineering, Swiss Federal Institute of Technology EPFL-SB-ISIC-GGEC, Lausanne, Switzerland

11:50 - 12:10OO0055

PPRROOPPEERRTTIIEESS OOFF SSIILLVVEERR--IINNDDIIUUMM AALLLLOOYYSS EELLEECCTTRROODDEEPPOOSSIITTEEDD FFRROOMM CCYYAANNIIDDEE EELLEECCTTRROOLLYYTTEESSKrastev I.1, Dobrovolska TS.1, Kowalik R.2, Zabinski P2., Zielonka A.3

1. Rostislav Kaischew Institute of Physical Chemistry, BAS, Sofia, Bulgaria 2. Physical Chemistry and Electrochemistry Laboratory, Faculty of Non-Ferrous Metals, AGHUniversity of Science and Technology, Krakow, Poland3. Forschungsinstitut fur Edelmetalle und Metallchemie, Schwabisch Gmund, Germany

3

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 3

12:10 - 12:30OO0066

EELLEECCTTRROOLLYYTTIICC CCOOAATTIINNGG OOFF ““NNiiFFeeBB”” AANNDD ““CCooNNiiFFeeBB”” AALLLLOOYYSS:: SSTTRRUUCCTTUURRAALL AANNDD MMAAGGNNEETTIICCPPRROOPPEERRTTIIEESSYuksel B., Cakir A.F.Istanbul Technical University Department of Metallurgy and Materials Engineering 46469Maslak, Istanbul / TURKEY

12:30 – 12:50OO0077

IINNVVEESSTTIIGGAATTIIOONN OOFF EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF SSOOMMEE AANNTTIIMMOONNIIUUMM AALLLLOOYYSS ((BBiiSSbb,, BBiiSSbbTTeeAANNDD ZZnnSSbb)) AASS TTHHEERRMMOOEELLEECCTTRRIICC FFIILLMMSSNedelcu M.1, Manea A.C.2, Cojocaru A2., Visan T.2

1. ENVIREX GRUP Company, Bucharest, Romania2. Department of Applied Physical Chemistry and Electrochemistry, University POLITEHNICABucharest, Romania

13:00 - 14:30 LL uu nn cc hh BB rr ee aa kk

14:30 - 15:50 3rd Session, Chairpersons: AA.. -- FF.. CCaakkiirr,, II.. KKrraasstteevv

14:30 - 14:50OO0088

MMIICCRROOVVIIAA--FFIILLLLIINNGG BBYY CCOOPPPPEERR EELLEECCTTRROOPPLLAATTIINNGGLuhn O.1,2, Celis J.P.1,3, Van Hoof C.2, Ruythooren W.1. Katholieke Universiteit Leuven, Dept. MTM, Kasteelpark Leuven, Belgium 2. Interuniversity Microelectronics Center (IMEC), Kapeldreef Leuven, Belgium 3. Katholieke Universiteit Leuven, Dept. ESAT, Kasteelpark Leuven, Belgium

14:50 - 15:10OO0099

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNAANNOOSSCCAALLEEDD HHAARRDD MMAAGGNNEETTIICC FFeePPtt FFIILLMMSS AANNDD FFee//PPtt MMUULLTTIILLAAYYEERRSSLeistner K., Fahler S., Schlorb H., Schultz L.IFW Dresden, Institute for Metallic Materials, Dresden, Germany

15:10 - 15:30OO1100

SSYYNNTTHHEESSIISS OOFF PPOOLLYYMMEERRIICC AANNDD HHYYBBRRIIDD NNAANNOOPPAARRTTIICCLLEESS FFOORR EELLEECCTTRROOPPLLAATTIINNGGAAPPPPLLIICCAATTIIOONNSSKammona O.1, Kotti K.1, Kiparissides C.1, Fransaer J.2, Celis J.P.2

1. Department of Chemical Engineering, Aristotle University of Thessaloniki and ChemicalProcess Engineering Research Institute, Thessaloniki, Greece 2. Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven,Kasteelpark, Leuven, Belgium

15:30 - 15:50OO1111

NNAANNOOSSCCAALLEE EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF MMEETTAALLSS ((AAll,, TTii,, NNii,, FFee eettcc)) AANNDD SSEEMMIICCOONNDDUUCCTTOORRSS((GGee,, AAllSSbb,, ZZnnSSbb)) FFRROOMM RRTT IIOONNIICC LLIIQQUUIIDDSSMann O., Freyland W.Institute of Physical-Chemistry, University of Karlsruhe, Germany


4

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 4

16:30 - 17:50 4th Session, Chairpersons: CC.. MMüülllleerr,, CC.. CCoommnniinneelllliiss

16:30 - 16:50OO1122

IINNFFLLUUEENNCCEE OOFF HHYYDDRROODDYYNNAAMMIICCSS AANNDD PPUULLSSEE PPLLAATTIINNGG PPAARRAAMMEETTEERRSS OONN TTHHEEEELLEECCTTRROOCCOODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL NNAANNOOCCOOMMPPOOSSIITTEE FFIILLMMSSThiemig D.1, Bund A.1, Talbot J.B.2

1. Dresden University of Technology, Department of Physical Chemistry, Dresden, Germany 2. University of California, San Diego, Chemical Engineering Program, San Diego, USA

16:50 - 17:10OO1133

NNii//NNAANNOO--TTiiOO22

CCOOMMPPOOSSIITTEE EELLEECCTTRROODDEEPPOOSSIITTSS:: TTEEXXTTUURRAALL AANNDD SSTTRRUUCCTTUURRAALLMMOODDIIFFIICCAATTIIOONNSSSpanou S., Pavlatou E.A., Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens , Greece

17:10 - 17:30OO1144

MMEECCHHAANNIICCAALL AANNDD AANNTTIICCOORRRROOSSIIVVEE PPRROOPPEERRTTIIEESS OOFF CCOOPPPPEERR MMAATTRRIIXX MMIICCRROO--AANNDD NNAANNOO--CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSSLekka M.1, Koumoulis D.2, Kouloumbi N.2, Bonora P.L.1

1. Department of Materials Engineering and Industrial Technology, University of Trento, ViaMesiano , Trento, Italy 2. School of Chemical Engineering, NTUA, Athens, Greece

18:00 - 19:00 PPoosstteerr SSeessssiioonn (( AArriissttootteelleess BB HHAALLLL ))

20:30 GGrreeeekk EEvveenniinngg

5

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 5

FFrriiddaayy,, OOccttoobbeerr 1199 22000077 AArriissttootteelleess AA HHAALLLL

09:00 - 09:30 RReeggiissttrraattiioonnss

09:30 - 10:50 1st Session, Chairpersons: MM.. ÜÜrrggeenn,, EE..AA.. PPaavvllaattoouu

09:30 - 09:50OO1155

LLOOWW--CCOOSSTT HHIIGGHH PPRREECCIISSIIOONN PPRROOCCEESSSSIINNGG IINN MMEEMMSS PPAACCKKAAGGIINNGG BBAASSEEDD OONNEELLEECCTTRROOCCHHEEMMIICCAALL PPRROOCCEESSSSEESSGunnarsson N.1-4, Leisner P.2, Wang X.3, Svensson M.3, Vieider C.3, Hultman L.4

1. Acreo AB, Gjuterigatan 9, Jonkoping, Sweden 2. SP, Swedish National Testing and Research Institute, and Jonkoping University, Sweden 3. Acreo AB, Norrkoping/Kista, Sweden 4. Thin Film Physics Division, Department of Physics, IFM, Linkoping University, Sweden

09:50 - 10:10

OO1166

IIOONNIICC LLIIQQUUIIDDSS AASS EELLEECCTTRROOLLYYTTEESS FFOORR MMEETTAALL DDEEPPOOSSIITTIIOONNBoeck R.Fem - Research Institute for Precious Metals and Metals Chemistry, Schwaebisch Gmuend,Germany

10:10 - 10:30OO1177

AA DDEESSIIGGNN OOFF EEXXPPEERRIIMMEENNTT AAPPPPRROOAACCHH TTOO EELLEECCTTRROOCCHHEEMMIICCAALL MMIICCRROO-- FFAABBRRIICCAATTIIOONNNouraei S., Roy S.School of Chemical Engineering and Advanced Materials Institute of Nanoscale Science andTechnology Merz Court Newcastle University, UK

10:30 - 10:50OO1188

DDEEVVEELLOOPPMMEENNTT OOFF AA HHOOLLIISSTTIICC MMOODDEELL FFOORR TTHHEE SSTTEEAADDYY SSTTAATTEE GGRROOWWTTHH OOFF PPOORROOUUSSAANNOODDIICC AALLUUMMIINNAA FFIILLMMSSPatermarakis G., Moussoutzanis K.School of Chemical Engineering, Department of Materials Science and Engineering, NationalTechnical University, Athens, Greece


11:30 - 13:00 2nd Session, Chairpersons: DD.. LLaannddoolltt,, WW.. PPaaaattcchh

11:30 - 11:50OO1199

AANNOODDIICC OOXXIIDDEE TTEEMMPPLLAATTEESS FFOORR TTHHEE PPRROODDUUCCTTIIOONN OOFF NNAANNOO--PPAATTTTEERRNNEEDD SSUURRFFAACCEESSÜrgen M., Yesil Y., Demirel A.Department of Metallurgical and Materials Engineering Istanbul Technical University, Maslak- Istanbul Turkey

6

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 6

11:50 - 12:10OO2200

PPUURREELLYY IINNOORRGGAANNIICC CCOOAATTIINNGGSS BBAASSEEDD OONN NNAANNOOPPAARRTTIICCLLEESS FFOORR MMAAGGNNEESSIIUUMM AALLLLOOYYSSFeil F., Furbeth W., Schutze M.DECHEMA e.V, Karl-Winnacker-Institut, Frankfurt am Main, Germany

12:10 - 12:30OO2211

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF CCoo--PPtt CCOONNTTIINNUUOOUUSS FFIILLMMSS AANNDD NNAANNOOWWIIRREESSKhatri M.S.1, Schlorb H.1, Fahler S.1, Schultz L.1, Nandan B.2, Krenek R.2, Stamm M.2

1.IFW Dresden, Dresden, Germany 2.IPF Dresden, Postfach Dresden, Germany

12:30 - 13:00PPRREESSEENNTT SSTTAATTUUSS OOFF KKOORREEAANN SSUURRFFAACCEE FFIINNIISSHHIINNGG IINNDDUUSSTTRRYY and PPRREESSEENNTTAATTIIOONN OOFF IINNTTEERRFFIINNIISSHH 22000088 IINN KKOORREEAAH.-T. Yum, Chairman

13:00 - 14:30 LL uu nn cc hh BB rr ee aa kk

14:30 - 15:50 3rd Session, Chairpersons: PP.. LLeeiissnneerr,, TT.. VViissaann

14:30 - 14:50OO2222

TTHHEE EEFFFFEECCTT OOFF HHEEAATT TTRREEAATTMMEENNTT OONN TTHHEE SSTTRRUUCCTTUURREE AANNDD HHAARRDDNNEESSSS OOFF PPUULLSSEEEELLEECCTTRROODDEEPPOOSSIITTEEDD NNIIPP--WWCC CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSSZoikis-Karathanasis A., Pavlatou E.A., Spyrellis N.General Chemistry Laboratory, School of Chemical Engineering, National Technical Universityof Athens, Zografos Campus, Athens, GREECE

14:50 - 15:10OO2233

VVAACCUUUUMM TTHHEERRMMAALL TTRREEAATTEEDD EELLEECCTTRROOLLEESSSS NNiiPP--TTiiOO22 CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSSNovakovic J., Vassiliou P.School of Chemical Engineering, National Technical University of Athens, Zografou, Athens,Greece

15:10 - 15:30OO2244

PPLLAASSMMAA PPRROOCCEESSSSIINNGG IINN FFAABBRRIICCAATTIINNGG NNAANNOO--TTEEXXTTUURREEDD,, SSUUPPEERR--HHYYDDRROOPPHHOOBBIICC PPOOLLYYMMEERRIICCCCOOAATTIINNGGSSVourdas N., Vlachopoulou M.E., Tserepi A., Gogolides E.Institute of Microelectronics, NCSR “Demokritos”, Aghia Paraskevi , Greece

15:30 - 15:50OO2255

PPRREEPPAARRAATTIIOONN OOFF NNAANNOO--SSTTRRUUCCTTUURREEDD MMEEMMBBRRAANNEE SSUUPPPPOORRTT SSYYSSTTEEMM BBYY MMUULLTTII--CCOOAATTIINNGGAhmadian Namini P., Babaluo A.A., Bayati B.Research Center of Polymeric Materials, Sahand University of Technology, Tabriz, I.R. Iran


7

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 7

16:30 - 18:10 4th Session, Chairpersons: HH.. -- TT.. YYuumm,, MM.. BBoouurroouusshhiiaann

16:30 - 16:50OO2266

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF PPOOLLYYCCRRYYSSTTAALLLLIINNEE ZZnnTTee IINN AAQQUUEEOOUUSS MMEEDDIIUUMM UUSSIINNGG CCOONNSSTTAANNTTAANNDD PPUULLSSEEDD PPOOTTEENNTTIIAALLSS Kosanovic T., Karoussos D., Bouroushian M., Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens, Greece

16:50 - 17:10OO2277

EELLEECCTTRROOCCRRYYSSTTAALLLLIISSAATTIIOONN OOFF ZZIINNCC FFRROOMM AACCIIDDIICC BBAATTHHSS;; AA NNUUCCLLEEAATTIIOONN AANNDD CCRRYYSSTTAALLGGRROOWWTTHH PPRROOCCEESSSSVasilakopoulos D., Bouroushian M., Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens, Greece

17:10 - 17:30OO2288

CCOORROOOOSSIIOONN BBEEHHAAVVIIOORR OOFF CCHHRROOMMAATTEE FFRREEEE PPAASSSSIIVVEE MMUULLTTII--LLAAYYEERR OONN ZZIINNCC CCOOAATTIINNGGSSStancu R.1, Parvu C.2, Sovar M.2, Nicolae A.1

1. Mechanical Engineering and Research Institute, Bucharest, Romania 2. Facukty of Applied Chemistry and Material Science, University Politehnica Bucharest, Bucharest, Romania

18:00 - 20:00 FFPP77 MMeeeettiinngg

SSaattuurrddaayy,, OOccttoobbeerr 2200 22000077

10:00 - 14:00 EAST & IUSF Meetings

8

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 8

P O S T E R S E S S I O N

TThhuurrssddaayy,, OOccttoobbeerr 1188 1188..0000 -- 1199..0000

PP0011

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL CCOOMMPPOOSSIITTEESS WWIITTHH SSUUBBMMIICCRROONN SSIIZZEE PPAARRTTIICCLLEESSCavallotti P.L., Magagnin L., Pompei E.Dip. Chimica, Materiali e Ing. Chimica G. Natta Politecnico of Milano - Milano – Italy

PP0022

TTHHEE EEFFFFEECCTT OOFF CCAARRBBOONN CCOONNTTEENNTT OONN TTHHEE PPRROOPPEERRTTIIEESS OOFF TTIITTAANNIIUUMM OOXXYYNNIITTRRIIDDEE TTHHIINNFFIILLMMSSVaz F., Chappé J.M., Cunha L., Moura C.Universidade do Minho, Departamento de Fisica

PP0033

SSOOLLVVAATTOOCCHHRROOMMIISSMM OOFF 11--AARRYYLL--11’’ --PPEENNTTAACCYYAANNOOFFEERRRRAATTEE--44,,44’’ --BBIIPPYYRRIIDDIINNEESSPapadakis R., Tsolomitis A.Laboratory of Organic Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Athens, Greece

PP0044

LLOOWW--TTEEMMPPEERRAATTUURREE FFUUEELL CCEELLLLSS.. MMOODDIIFFIIEEDD OOXXIIDDEE GGRRAAPPHHIITTEE AASS AA SSUUPPPPOORRTT FFOORREELLEECCTTRROOCCAATTAALLYYSSTTSSNizhnikovsky E.A., Poluboyarinov V.S., Fesenko A.V., Skundin A.M., Kulova T.L.Scientific Council on Complex Problems in Physics, Chemistry, and Biology, Moscow, Russia

PP0055

HHYYDDRROOGGEENN EEVVOOLLUUTTIIOONN AACCTTIIVVIITTYY OOFF NNIICCKKEELL BBAASSEEDD CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSS CCOONNTTAAIINNIINNGGCCHHRROOMMIIUUMM GGRROOUUPP MMEETTAALL AANNDD SSIILLIICCOONN PPOOWWDDEERRSSPopczyk M., Kubisztal J., Budniok A.University of Silesia, Institute of Materials Science, Katowice, Poland

PP0066

SSTTUUDDYY OOFF TTHHEE HHYYDDRROOGGEENN PPEERRMMEEAATTIIOONN TTHHRROOUUGGHH FFee IINN SSEEAAWWAATTEERR BBYY TTRRAANNSSFFEERRFFUUNNCCTTIIOONNSS AANNAALLYYSSIISS IINN AA DDEEVVAANNAATTHHAANN CCEELLLLMikrova L.1, Maurin G.2, Gabrielli C.2

1. Institute of Phisical Chemistry, Bulgarian Academy of Sciences, Sofia 2. UPR 15-CNRS, LISE, University “ Pierre et Marie Curie “

PP0077

EELLEECCTTRROOCCAATTAALLYYTTIICC AACCTTIIVVAATTIIOONN OOFF NNii EELLEECCTTRROODDEE FFOORR TTHHEE HHYYDDRROOGGEENN PPRROODDUUCCTTIIOONN BBYYEELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF VV AANNDD CCoo SSPPEECCIIEESSMarceta Kaninski M.P., Potkonjak N.I., Maksic A.D., Nikolic V.M.Vinca Institute of Nuclear Sciences, Belgrade, Serbia

PP0088

EELLEECCTTRROODDEEIIOONNIIZZAATTIIOONN PPRROOCCEESSSSEESS FFOORR EENNVVIIRROONNMMEENNTTAALLLLYY--FFRRIIEENNDDLLYY PPLLAATTIINNGGBergmann H.M.E., Iourtchouk T., Rittel A., Zuleeg H.1.Anhalt University, FB 6/7, Koethen/Germany 2.Präzisionsgalvanik Wolfen, Wolfen/Germany

9

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 9

PP0099

IINNFFLLUUEENNCCEE OOFF TTHHEE EELLEECCTTRROODDEEPPOOSSIITTIIOONN PPAARRAAMMEETTEERRSS OONN TTHHEE GGRRAAIINN SSIIZZEE OOFFNNAANNOOCCRRYYSSTTAALLLLIINNEE NNii CCOOAATTIINNGGSSRashidi A.M.1,2, Amadeh A.2

1. Metallurgy & Materials Engineering Faculty, Tehran University, Tehran, Iran. 2. Mechanical Engineering Department, Engineering and Technical Faculty, Razi University,Kermanshah, Iran.

PP1100

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EELLEECCTTRROOLLEESSSS CCOOPPPPEERR DDEEPPOOSSIITTIIOONN IINNTTOO PPOORROOUUSS SSIILLIICCOONNSam S.1,2, Gabouze N.1, Djebbar S.2

1. UDTS, 02, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, 16200 Algiers, Algeria 2. USTHB, B.P. 32 El Alia, Bab Ezzouar, Algiers, Algeria

PP1111

CCOOVVAALLEENNTT GGRRAAFFTTIINNGG OOFF GGLLYYCCIINNEE OONNTTOO TTHHEE PPOORROOUUSS SSIILLIICCOONN SSUURRFFAACCEESam S.2,3, Gouget-Laemmel A.C.2, Chazalviel J.N.2, Ozanam F.2, Gabouze N.1, Djebbar S.2

1. UDTS, 02, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, 16200 Algiers, Algeria 2. LPMC, CNRS-Ecole Polytechnique, Palaisau, France 3. USTHB, B.P. 32 El Alia, Bab Ezzouar, Algiers, Algeria

PP1122

EELLEECCTTRROOCCHHEEMMIICCAALL SSYYNNTTHHEESSIISS OOFF NNAANNOOSSCCAALLEE OOXXIIDDEE FFIILLMMSS AANNDD NNAANNOOSSIISSEEDD OOXXIIDDEEPPOOWWDDEERRSS BBYY AANNOODDIICC OOXXIIDDAATTIIOONN OOFF MMEETTAALLSS IINN MMOOLLTTEENN SSAALLTTSSYolshina L.A.Institute of High-Temperature Electrochemistry, Urals Branch of Russian Academy of Sciences,Ekaterinburg, Russia

PP1133

SSYYNNTTHHEESSIISS AANNDD CCHHAARRAACCTTEERRIISSAATTIIOONN OOFF CCAARRBBOONN SSUUPPPPOORRTTEEDD MMooOOxx--PPtt AANNDD TTiiOOxx--PPttCCAATTAALLYYSSTTSS FFOORR OOXXYYGGEENN RREEDDUUCCTTIIOONN RREEAACCTTIIOONNElezovic N.R.1, Babic B.2, Vracar LJ.M., Krstajic N.V.3

1. Center for Multidisciplinary Studies of the Belgrade University, Belgrade, Serbia. 2. Vinca Institute of Nuclear Sciences, Belgrade, Serbia. 3. Faculty of Technology and Metallurgy, University of Belgrade, Belgrade, Serbia.

PP1144

IINNHHIIBBIITTEEDD GGRROOWWTTHH OOFF EELLEECCTTRROOFFOORRMMEEDD NNAANNOOCCRRYYSSTTAALLLLIINNEE NNIICCKKEELLFeizmandian M., Karimzadeh F., Raeissi K., Golozar M.A.Department of materials science and engineering Isfahan University of Technology, Isfahan,Iran

PP1155

MMIICCRROOSSTTRRUUCCTTUURREE FFAACCTTOORR OOFF HHOOTT--DDIIPP GGAALLVVAANNIIZZEEDD SSTTEEEELL AANNDD IITTSS EEFFFFEECCTTSS OONNCCOORRRROOSSIIOONN PPEERRFFOORRMMAANNCCEELukjanichev D.A., Kazakevich A.V.Moscow Institute of Steel and Alloys (Technical University), Moscow, Russia

PP1166

SSYYNNTTHHEESSIISS OOFF CCAARRBBOONN NNAANNOOTTUUBBEESS WWIITTHH CCAATTAALLYYTTIICC PPYYRROOLLYYSSIISS OOFF SSOOLLIIDD NNii ((ddmmgg))22

Vlasopoulos A.D., Strikos S., Pouleros K., Kordatos K., Kasselouri-Rigopoulou V.School of Chemical Engineering, National Technical University of Athens, Zografou, Greece

10

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 10

PP1177

CCOONNVVEENNTTIIOONNAALL AANNDD MMIICCRROO--EENNCCAAPPSSUULLAATTEEDD DDIISSPPEERRSSEE IINNKKSS FFOORR DDIIGGIITTAALL TTEEXXTTIILLEEPPRRIINNTTIINNGGKosolia C., Tsatsaroni E.Aristotle University of Thessaloniki, School of Chemistry, Department of Organic ChemicalTechnology, Thessaloniki, Greece

PP1188

EEFFFFEECCTT OOFF SSiiCC PPAARRTTIICCLLEE SSIIZZEE OONN EELLEECCTTRROODDEEPPOOSSIITTIIOONN BBEEHHAAVVIIOORR OOFF NNii--SSiiCC CCOOMMPPOOSSIITTEEFeizmandian M., Golozar M.A., Karimzadeh F.Department of materials science and engineering Isfahan University of Technology, Isfahan,Iran

PP1199

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF CCooFFeeCCuu AALLLLOOYYSS OONN NN--TTYYPPEE SSIILLIICCOONNFortas G., Sam S., Gabouze N.U.D.T.S, 2Bd Frantz-Fanon, B.P .339 Algiers, Algeria

PP2200

EEFFFFEECCTT OOFF WWCC PPAARRTTIICCLLEESS EEMMBBEEDDDDIINNGG OONN TTHHEE TTRRIIBBOOLLOOGGIICCAALL BBEEHHAAVVIIOOUURR OOFF NNii MMAATTRRIIXXCCOOMMPPOOSSIITTEE EELLEECCTTRROOCCOOAATTIINNGGSSPavlatou E.A.1, Asimidis P.2, Spyrellis N.1

1. Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens, GREECE 2. CERECO S.A., Chalkida, GREECE

PP2211

WWEEAARR RREESSIISSTTAANNCCEE AANNDD FFRRIICCTTIIOONN PPRROOPPEERRTTIIEESS OOFF TTHHIINN SSOOFFTT FFIILLMMSSAmell A.1, D›ez J.A.2, Garc›a E.2, Gastfin B.2, Müller C.M.1, Sarret M.1

1. Electrodep. Dpt. Qu›mica F›sica, University of Barcelona, Mart› i Franquès, Barcelona, Spain2. CIDETEC, Paseo Miramfin, - Donostia, Spain

PP2222

CCOOMMPPAARRIISSOONN OOFF GGOOLLDD NNAANNOOPPIILLLLAARR EELLEECCTTRROODDEE AANNDD PPLLAATTIINNUUMM NNAANNOOPPIILLLLAARR EELLEECCTTRROODDEEFFOORR SSEEPPAARRAATTIIOONN OOFF DDOOPPAAMMIINNEE AANNDD AASSCCOORRBBIICC AACCIIDDHyo Jung K., Chun Mee S., Hun-Gi H.Dept. of Chemistry Education, Seoul National University, Gwanak-Gu, Seoul

PP2233

FFOORRMMAATTIIOONN AANNDD CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF PPOOLLYYPPYYRRRROOLLEE--PPHHOOSSPPHHOOMMOOLLYYBBDDAATTEECCOOMMPPOOSSIITTEE CCOOAATTIINNGG LLAAYYEERRSS OONNTTOO AA11 SSUUBBSSTTRRAATTEESSAnicai L., Pertache A., Buda M., Visan T.PETROMSERVICE SA, Division of Ecological Technologies Development, Bucharest, Romania POLITEHNICA University Bucharest, Department of Applied Physical Chemistry andElectrochemistry, Bucharest, Romania

PP2244

FFEEAASSIIBBIILLIITTYY SSTTUUDDYY FFOORR AA DDIIAAGGNNOOSSTTIICC CCOORRRROOSSIIOONN SSEENNSSOORR SSYYSSTTEEMM Khedkar B., Roy S., Thennadil S.School of Chemical Engineering and Advanced Materials, Merz Court, Newcastle University,Newcastle upon Tyne, UK

11

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 11

PP2255

TTHHEE CCOOBBAALLTT--MMOOLLYYBBDDEENNUUMM ((CCoo--MMoo)) AALLLLOOYY EELLEECCTTRROODDEEPPOOSSIITTEEDD OONN NN--TTYYPPEE SSIILLIICCOONNFekih Z.1, Ghellai N.1, Fortas G.2, Chiboub N.2, Sam S.2, Gabouze N.2, Chabanne-sari N.E.1

1. Unite de Recherche des Materiaux et des Energies Renouvelables (U.R.M.E.R) Universite Abou-Baker Belkaid, ALGERIE 2. U.D.T.S, 2Bd Frantz-Fanon, 7merveilles Algiers, Algeria

PP2266

AA PPRREEDDIICCTTIIVVEE MMOODDEELL FFOORR MMIICC ((MMIICCRROOBBIIAALL IINNDDUUCCEEDD CCOORRRROOSSIIOONN)) IINN SSUUBB--SSEEAAPPRROODDUUCCTTIIOONN PPIIPPEELLIINNEESSSmith P., Roy S.School of Chemical Engineering and Advanced Materials Merz Court, University of Newcastleupon Tyne, Newcastle upon Tyne, UK

PP2277

DDIISSCCLLOOSSUURREE OOFF TTHHEE MMAAIINN FFAACCTTOORRSS DDEETTEERRMMIINNGG TTHHEE HHEEXXAAGGOONNAALLLLYY OORRDDEERREEDDNNAANNOOSSTTRRUUCCTTUURREE OOFF PPOORROOUUSS AANNOODDIICC AALLUUMMIINNAA FFIILLMMSSPatermarakis G., Michali CH.School of Chemical Engineering, Department of Materials Science and Engineering, NationalTechnical University, Athens, Greece

PP2288

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF IInn--SSnn AALLLLOOYYSS FFRROOMM CCIITTRRAATTEE SSOOLLUUTTIIOONNSS FFOORR LLEEAADD--FFRREEEESSOOLLDDEERRIINNGGOzga P.Institute of Metallurgy and Materials Science of the Polish Academy of Sciences, Krakfiw, Poland

PP2299

IINNVVEESSTTIIGGAATTIIOONN OOFF IINNDDUUCCEEDD CCOODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL--TTUUNNGGSSTTEENN AANNDD NNIICCKKEELL--MMOOLLYYBBDDEENNUUMM AALLLLOOYYSSAnicai L.1, Prioteasa P.2, Petrache A.1, Visan T.3

1. PETROMSERVICE SA, Division of Ecological Technologies Development, Bucharest, Romania 2. Natl.Research, Inst., for Electrical Engineering -Advanced Researches-, Bucharest, Romania 3. University POLITEHNICA, Department of Applied Physical Chemistry and Electrochemistry,Bucharest, Romania

PP3300

TTHHEE FFee--NNii--MMoo AALLLLOOYY EELLEECCTTRROODDEEPPOOSSIITTEEDD OONN NN--TTYYPPEE SSIILLIICCOONNFekih Z.1, Ghellai N.1, Fortas G.2, Sam S.2, Chabanne-sari N.E1, Gabouze N.2

1. Unite de Recherche des Materiaux et des Energies Renouvelables (U.R.M.E.R) Universite Abou-Baker Belkaid TLEMCEN ALGERIE 2. U.D.T.S, 2Bd Frantz-Fanon, 7merveilles Algiers, Algeria

PP3311

SSUUIITTAABBLLEE AALLUUMMIINNAA TTEEMMPPLLAATTEESS FFOORR EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNAANNOOSSTTRRUUCCTTUURREESSMontero J.M., Sarret M., Müller C.ELECTRODEP, Dpto. Quimica Fisica, Universitat de Barcelona, Barcelona, Spain

12

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 12

PP3322

EELLEECCTTRROOCCHHEEMMIICCAALL PPRREEPPAARRAATTIIOONN AANNDD CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF NNii//SSiiCC CCOOMMPPOOSSIITTIIOONNAALLLLYYGGRRAADDEEDD MMUULLTTIILLAAYYEERREEDD CCOOAATTIINNGGSSGarc›a-Lecina E.1, Garc›a-Urrutia I.1, D›ez J.A.1, Salvo M.2, Smeacetto F.2, Stepanov G.3, BabutskyA.3, Seddon R.3, Martin R.3

1. Surface Finishing Department, CIDETEC, Donostia-San Sebastian, Spain 2. Materials Science and Chemical Engineering Department, Politecnico di Torino, Torino, Italy 3. Institute for Problems of Strength, National Academy of Sciences, Kiev,Ukraine 4. Materials Engineering Research Laboratory, MERL, Ltd, Hertfordshire , UK

PP3333

PPRROOPPEERRTTYY CCHHAANNGGEE IINN TTiiCCOONN BBAASSEEDD CCOOAATTIINNGGSS:: EEFFFFEECCTT OOFF TTHHEE OOXXYYGGEENN FFRRAACCTTIIOONNCarvalho S.1, Henriques M.2, Oliveira R.2, Escobar-Gallindo R.3, Vaz F.s

1. Dept. Fisica, Universidade do Minho, Campus de Azurem, Guimaraes, Portugal 2. Dept de Eng, Biologica, Universidade do Minho, Campus de Gualtar, Portugal 3. Instituto de Ciencia de Materiales de Madrid (ICMM -CSIC), Cantoblanco, Madrid, Spain

PP3344

EELLEECCTTRROOCCTTRROOCCHHEEMMIICCAALL SSYYNNTTHHEESSIISS AANNDD AANNTTIICCOORRRROOSSIIVVEE PPRROOPPEERRTTIIEESS OOFF PPOOLLYY ((AANNIILLIINNEE--CCOO--OO--AAMMIINNOOPPHHEENNOOLL)) CCOOAATTIINNGGSS OONN SSTTAAIINNLLEESSSS SSTTEEEELLKourouzidou M., Sazou D.Laboratory of Physical Chemistry, Department of Chemistry, Aristotle University of Thessaloniki,Greece

PP3355

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EELLEECCTTRROODDEEPPOOSSIITTEEDD CCOO--AAGG NNAANNOO--HHEETTEERROOGGEENNEEOOUUSS FFIILLMMSSJ. Garc›a-Torres, E.Gfimez, E. Vallés,Electrodep, Dpt. Qu›mica F›sica, Universitat de Barcelona, Barcelona Spain

13

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 13

C H A I R M E N I N D E X

NNaammee PPaaggee

BBoouurroouusshhiiaann MM.. ......................................................................................................................8

CCaakkiirr AA..--..FF.. ..............................................................................................................................4

CCaavvaalllloottttii PP..--LL.. ........................................................................................................................3

CCeelliiss JJ.. -- PP.. ..............................................................................................................................3

CCoommnniinneelllliiss CC.. ........................................................................................................................5

KKrraasstteevv II.. ................................................................................................................................4

LLaannddoolltt DD.. ..............................................................................................................................6

LLeeiissnneerr PP.. ................................................................................................................................7

MMüülllleerr CC.. ................................................................................................................................5

PPaaaattcchh WW.. ................................................................................................................................6

PPaavvllaattoouu EE..AA.. ..........................................................................................................................6

PPuuiippppee JJ..CC.. ..............................................................................................................................3

SSppyyrreelllliiss NN.. ..............................................................................................................................3

ÜÜrrggeenn MM.. ................................................................................................................................6

VViissaann TT.. ..................................................................................................................................7

YYuumm HH..--TT.. ................................................................................................................................8

ZZiieelloonnkkaa AA.. ..............................................................................................................................3

14

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 14

AABBSSTTRRAACCTT BBOOOOKK

OORRAALL PPRREESSEENNTTAATTIIOONNSS

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 15

16

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 16

OO0011

AACCIIDD CCOOPPPPEERR PPLLAATTIINNGG WWIITTHH CCuuOO UUSSIINNGG IINNSSOOLLUUBBLLEE AANNOODDEESS IINN PPCCBB IINNDDUUSS

Hee-Taek YUMAdviser, Samsung Electro-Mechanics Co., Ltd.

These days, many PCB plating lines are installed more and more horizontally as the thickness ofthe printed circuit board (PCB) became thinner and its pattern became smaller. In these cases, ifsoluble anodes are used, many problems can be occurred such as difficulties of copper refilling,continuous changing anode surface, the increase of anode sludge and organic breakdownbyproducts, etc. On the other hand, for plating Cu on the flexible PCB and on flexible copperclad laminate(FCCL) by reel to reel, whether the plating is done horizontally or vertically, it willbe very convenient if insoluble anodes are used which supply Cu+2 metal through CuO powder.If the CuO is pure enough, particularly, if Cl- ion is as low as under 10 ppm by using specialionic membranes, successful copper plating can be achieved with a high purity withoutbreakdown of organic additives on the anodes surface. In addition, by using the insolubleanode, higher cathode current densities can be obtained during the plating. Consequently, byusing insoluble anodes with CuO, the improvement of production rate, long lifetime of platingbath, production cost down, etc. can be realized by eliminating impurities in the bath as well ashigh throwing power on the deposits. In the presentation, the above plating technology will bediscussed in more details.

17

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 17

OO0022

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EECCDD NNAANNOOCCRRYYSSTTAALLLLIINNEE GGOOLLDD FFIILLMMSS

Vicenzo A., Cojocaru P., Cavallotti P.Dipartimento CMIC “Giulio Natta”, Politecnico di Milano, via Mancinelli 7, 20131 Milano, Italy.

The deformation behavior of nanocrystalline materials has been extensively studied during thelast twenty to thirty years and the main characteristics that differentiate nanocrystalline fromcoarse-grained materials have been identified [1]. The experimental evidence is epitomized bythe so-called inverse Hall-Petch behaviour and the anomalously high strain rate sensitivitytypically observed in nanocrystalline fcc metals.Nanocrystalline gold thin films and thick coatings, with thickness ranging from a few tenths ofnanometers to several tenths of micrometers are produced by different techniques such as gasdeposition [2], sputtering [3], vapour deposition [4] and electrodeposition [5].However, pure gold electrodeposits having nanocrystalline structure have raised relatively littleinterest in the recent literature, possibly because of the uncertainty introduced by thecodeposition of impurities that characterizes the deposition of gold from cyanide as wellsulphite plating baths and/or the related decrease of density relative to the bulk material.However, because of both a fundamental and technological interest, the mechanical behaviourof ECD n-Au thin films and coatings should be investigated systematically in more details. In the present work, gold coating with grain size in the nanocrystalline range (<100 nm)deposited from a non cyanide bath were studied by different techniques. Structure and surfacemorphology are characterized by X-ray diffraction analysis, scanning electron microscopy andatomic force microscopy, respectively. The mechanical behaviour is investigated bymicroindentation in order to obtain information on the relationship between structureparameters and specific features of the deformation behaviour of the material. Thermal stabilityis also studied and shown to be particularly susceptible to different additive components of thebath.

References[1] M.A. Meyers, A. Mishra, D.J. Benson, Progress in Materials Science 51 (2006) 427.[2] S. Sakai, H. Tanimoto and H. Mizubayashi, Acta Mater. 47 (1999) 211.[3] H. Tanimoto, Y. Koda, S. Sakai, H. Mizubayashi, and E. Kita, Scripta Mater. 44 (2001) 2231.[4] I. Chasiotis, C. Bateson, K. Timpano, A.S. McCarty, N.S. Barker, J.R. Stanec, Thin Solid Films

515 (2007) 3183.[5] O. Yevtushenko, H. Natter, R. Hempelmann, Thin Solid Films 515 (2006) 353.

KKeeyywwoorrddss:: nanocrystalline; gold; electrodeposition

18

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 18

OO0033

PPLLAASSMMAA--PPRRIINNTTIINNGG AANNDD GGAALLVVAANNIICC MMEETTAALLLLIIZZAATTIIOONN HHAANNDD IINN HHAANNDD –– AA NNEEWW TTEECCHHNNOOLLOOGGYYFFOORR TTHHEE CCOOSSTT--EEFFFFIICCIIEENNTT MMAANNUUFFAACCTTUURREE OOFF FFLLEEXXIIBBLLEE PPRRIINNTTEEDD CCIIRRCCUUIITTSS

Möbius A.1, Elbick D.1, Claus-Peter Klages2, Michael Thomas2, Antje Zänker2, Jochen Borris2

1 Enthone GmbH, Langenfeld, German.2 Fraunhofer Institute for Surface Engineering and Thin Films IST, Braunschweig, Germany.

The market for flexible printed circuit boards (FPC) is constantly growing but also increasinglycompetitive [1]. Efforts are therefore made to reduce cost for their manufacture. A potentiallycost-efficient technology being developed in a joint BMBF (Federal Ministry of Education andResearch, FKZ 13N8883, FKZ 13N8877) project is based on a combination of the so-calledPlasma-Printing [2] with chemical and electrochemical metallization. Plasma-Printing in thiscontribution refers to patterned atmospheric pressure dielectric barrier discharge (DBD)treatment. A major aim of the project is the realisation of the technology in a reel-to-reelproduction system that has a capability for fast and low-cost manufacture even of large-areaFPC. Plasma-Printing experiments have so far been performed on a lab-scale batch plant built at theFraunhofer Institute for Surface Engineering and Thin Films IST. Substratewise the focus hasbeen on polyimide (PI) though more recently other polymers such as polyethylene naphthalate(PEN) or polyether imide (PEI) have also been included in the investigations. Radio FrequencyIdentification (RFID) tags and interdigital structures with resolutions down to less than 200 _mcould be produced on a PI foil of 50 _m thickness applying the Plasma-Printing technique andcopper plating baths developed at the Enthone GmbH. Metallization starts with Pd initiationfollowed by elelctroless copper and electrolytic copper.Using plasma process gases including nitrogen, forming gas or gaseous plasma-polymerisablemonomers such as aminopropyl-trimethoxysilane (APTMS) in an inert carrier gas an adhesionstrength of copper on PI according to DIN 53494 could be achieved of almost 1 N/mm. Thisvalue already meets the requirements for FPC applications. It is assumed that amino groupsgenerated on the polymer surface during DBD treatment effect significantly enhancedchemisorption of palladium in the primary step of the chemical metallization process and thuslead to improved adhesion of the metal coating on the polymer [3]. Using oxygen-containingplasma process gases such as air did not lead to satisfactory metallization results. The contribution will explain the Plasma-Printing technique, give a survey of important resultsobtained in the project so far and touch on current challenges.

References[1] BCC Research Group, market research report “Flexible Circuits: Materials and Applications”,

January 2006. [2] C.-P. Klages, A. Hinze, K. Lachmann, C. Berger, J. Borris, M. Eichler, M. v. Hausen, A.

Zänker, M. Thomas, Plasma Process. Polym. 4 (2007) 208. [3] M. Charbonnier, M. Alami, M. Romand, J. Electrochem. Soc. 143 (1996) 472.

19

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 19

OO0044

PPRREEPPAARRAATTIIOONN OOFF NNAANNOOPPAARRTTIICCLLEESS OONN BBOORROONN--DDOOPPEEDD DDIIAAMMOONNDD SSUUBBSSTTRRAATTEE FFOORREELLEECCTTRROOCCAATTAALLYYSSIISS

Comninellis C. , Roustom B.E.1Group of Electrochemical Engineering, Swiss Federal Institute of TechnologyEPFL-SB-ISIC-GGEC, Lausanne, Switzerland

Gold and Pt nanoparticles are currently attracting a great deal of interest due to their propertieswitch differs from those of bulk materials. Their electrochemical properties have been thesubject of numerous studies in heterogeneous catalysis andsurface electrochemistry [1, 2].A novel two-step method was developed to synthesize goldnanoparticles [3] on boron-doped diamond (BDD) electrode. Itconsisted of sputter deposition of maximum 15 equivalentmonolayers of gold, followed by a heat treatment at400-600ÆC. Gold nanoparticles with an average size of 5-35nm could be prepared by this method on polycrystalline BDDfilm electrode, the particle size being dependent on theamount of deposited gold. A novel method was also developed to synthesize bi-metallicnanoparticles (Au-Pt) on boron-doped diamond (BDD)electrode. This method consisted of electrodeposition of asmall amount of Pt on the Au/BDD composite electrode. The Ptwill be deposited selectively on the Au nanoparticles andcovered them. A heat treatment at 400ÆC was suggested toenhance the interaction between Au and Pt nanoparticles. Thesurface ratio between Au and Pt nanoparticles can be modifiedwith modifying the amount of electrodeposited Pt andcontrolled with Cyclic Voltammetry.IrO

2nanoparticles have been also deposited on BDD substrate

by the thermal decomposition technique for the investigationof both oxygen evolution and organics oxidation reactions.Finally Pt, Pt-Ru and Pt-Sn nanoparticles have been prepared by the micro-emulsion techniqueand then deposited on BDD for the investigation of methanol and ethanol oxidation.

1. G. Sine and Ch. Comninellis, Electrochim. Acta, 5500 (2005) 2249.2. G. Siné, I. Duo, B. E. Roustom, G. Ffiti and Ch. Comninellis, J Appl. Electrochem. 3366 (2006)

847.3. B. E. Roustom, G. Foti and Ch. Comninellis, Electrochem. Communicat. 77 (2005) 398.

20

Fig.1: SEM photos of Au/BDD electrodes

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 20

OO0055

21

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 21

OO0066

EELLEECCTTRROOLLYYTTIICC CCOOAATTIINNGG OOFF ““NNiiFFeeBB ““AANNDD ““CCooNNiiFFeeBB”” AALLLLOOYYSS::SSTTRRUUCCTTUURRAALL AANNDD MMAAGGNNEETTIICC PPRROOPPEERRTTIIEESS

Yüksel B., CakÈr A.F.Istanbul Technical University Department of Metallurgy and Materials Engineering46469 Maslak, Istanbul / TURKEY

NiFeB and CoNiFeB alloys are produced from sulfate solutions using dimethyamine borane(DMAB) as boron source. Platings were carried out both with DC and pulse currents. The efectof bath composition, current density, and pulsing conditions on the composition, structure,grain size . surface roughness and on the magnetic properties of the coatings weredetermined.

22

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 22

OO0077

IINNVVEESSTTIIGGAATTIIOONN OOFF EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF SSOOMMEE AANNTTIIMMOONNIIUUMM AALLLLOOYYSS ((BBIISSBB,, BBIISSBBTTEEAANNDD ZZNNSSBB)) AASS TTHHEERRMMOOEELLEECCTTRRIICC FFIILLMMSS

Nedelcu M.1, Manea A.C.2, Cojocaru A.2, Visan T.2

1ENVIREX GRUP Company, Bucharest, Romania2Department of Applied Physical Chemistry and Electrochemistry, University POLITEHNICABucharest, Bucharest, Romania

The binary (BiSb, SbTe) and ternary (BixSb

2-xTe

3) alloys were electrodeposited as films on various

substrates (Pt, Cu, Ni, steel). The electrolyte was a mixture of 5 M NaCl + 1 M HCl solutions,each containing 0.1 M Bi3+, Sb3+ or Te4+ ions. Either dc current source or pulse generator wereused for electrolysis in current controlled conditions. By recording cyclovoltammograms the underpotential deposition (UPD) of Bi, Sb and Te assingular metals was evidenced, a phenomenon which is involved in simultaneous co-depositionof metallic components of alloys. Some data about the cathodic process and properties of filmswere obtained by electrochemical impedance spectroscopy.The electrodeposition of Zn

4Sb

3alloy was also investigated in ethylene glycol as solvent. In this

case, zinc chloride and antimony potassium tartrate were used as zinc and antimony ionssources, respectively. Cyclic voltammetry on platinum substrate was performed.

KKeeyywwoorrddss:: BiSbTe binary and ternary alloys, ZnSb alloy, thermoelectric films

23

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 23

OO0088

MMIICCRROOVVIIAA--FFIILLLLIINNGG BBYY CCOOPPPPEERR EELLEECCTTRROOPPLLAATTIINNGG

1, 2Lühn, O., 1Celis, J.-P., 1,3Van Hoof, C., 2Ruythooren, W. 1Katholieke Universiteit Leuven, Dept. MTM, Kasteelpark Leuven, Belgium2Interuniversity Microelectronics Center (IMEC), Kapeldreef Leuven, Belgium3Katholieke Universiteit Leuven, Dept. ESAT, Kasteelpark Leuven, Belgium

The filling of microvias by copper electroplating is a key technology to achieve the integrationof different levels of finished device wafers in the third dimension [1]. These microvias areroughly 40 to 100 ¯ larger (in diameter) than damascene structures and over 10 ¯ smaller thanthrough-holes in PCBs. The bottom-up plating behavior for the smallest features can bequantitively described by a curvature enhanced accelerator coverage (CEAC) [2], while for largefeatures, in the surface finishing industry, leveling describes the smoothening of film surfacesthrough adsorption of inhibitors/levelers at protrusions of the surface [3]. Which of the twodeposition mechanisms is prevailing for microvias or a combination of the two mechanisms, isnot yet fully understood.We report the filling of microvias with diameters from 5 to 50 Ìm and aspect ratios (aspect ratio= depth to width ratio) up to five. Filling experiments are evaluated by analyzing cross-sectionsof filled vias with optical microscopy, scanning electron microscopy and focused ion beam. Thefill-up evolution shows a bottom-up fill also known as superfilling mechanism. The grain sizes ofthe deposit differ along the via profile. Furthermore, the influence of the bath chemistry on viafilling is investigated by electrochemical studies in order to acquire a better understanding ofthe behavior of additives (suppressor, accelerator, and leveler) in the copper electroplating ofvias. The bottom-up fill mode depends on convection-dependent adsorption and theconcentration of leveler inside the vias. Galvanostatic measurements show that the cathodicoverpotential is higher at high mass-transport and high leveler concentration and is small at lowmass-transport and low leveler concentration. The differential plating rate along the via profile,responsible for bottom-up plating, originates from a synergistic effect for inhibition due toconditions for convection and concentration of leveler. This inhibition effect is strong at the topof vias and weak at the bottom of vias. From our experiments, we conclude that leveling is theprevailing mechanism for the electrodeposition of copper in microvias of these dimensions.

References[1] Beyne, E., IEEE, International Interconnect Technology Conference (IITC), (2006), p1-5[2] T. P. Moffat, D. Wheeler, S.-K. Kim, and D. Josell, J. Electrochem. Soc., 115533 (2006) C127.[3] C. Madore, M. Matlosz, D. Landolt, J. Electrochem. Soc., 114433 (1996) 3927.

KKeeyywwoorrddss:: Copper electroplating, Via-filling, 3D Integration.

24

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 24

OO0099

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNAANNOOSSCCAALLEEDD HHAARRDD MMAAGGNNEETTIICC FFEEPPTT FFIILLMMSS AANNDD FFEE//PPTTMMUULLTTIILLAAYYEERRSS

Leistner K., Fähler S., Schlörb H., Schultz L.IFW Dresden, Institute for Metallic Materials, Dresden, Germany

Electrodeposited Fe-Pt films are interesting for hard magnetic film applications due to the largemagnetocrystalline anisotropy of the L1

0phase.

Fe(Pt)/Pt(Fe) multilayers have been prepared by single bath technique using pulse depositionunder potential control. With this approach, the oxygen incorporation, which reaches 30 at.%in homogeneous electrodeposited films [1], can be significantly reduced. To electrodeposit the multilayers, a careful pH and potential selection has been performed.Bilayer thickness as well as the integral composition of the multilayers are adjusted by the pulsedurations. Multilayers with the Fe/Pt ratio of 1.0 needed for L1

0phase formation exhibit less

than 10 at.% O [2]. The bilayer thickness can be reduced down to 40 nm. This nanoscaled microstructure is of benefit during annealing to form the L1

0phase and for

remanence enhancement through exchange coupling. Annealing the multilayers in hydrogenatmosphere results in excellent magnetic properties.

Fig. 1: Potential pulse sequence and current density for the electrodeposition of a nanoscaled Fe/Ptmultilayered structure together with the corresponding FIB-image

[1] K. Leistner, S. Oswald, J. Thomas, S. Fähler, H. Schlörb, L. Schultz, Electrochim. Acta 52(2006) 194

[2] K. Leistner, S. Fähler, H. Schlörb, L. Schultz, Electrochem. Comm. 8 (2006) 892

KKeeyywwoorrddss:: multilayers, FePt, hard magnetic films

25

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 25

OO1100

SSYYNNTTHHEESSIISS OOFF PPOOLLYYMMEERRIICC AANNDD HHYYBBRRIIDD NNAANNOOPPAARRTTIICCLLEESS FFOORR EELLEECCTTRROOPPLLAATTIINNGGAAPPPPLLIICCAATTIIOONNSS

Kammona O.1, Kotti K.1, Kiparissides C.1, Fransaer J.2 , Celis J.P.2

1Department of Chemical Engineering, Aristotle University of Thessaloniki and Chemical ProcessEngineering Research Institute, Thessaloniki, Greece2Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven,Kasteelpark, Leuven, Belgium

The low cost and large recyclability of steel makes this material most effective for productmanufacturing. The major limitation for its use is the low corrosion resistance which requiresthe use of protective layers like zinc coatings and solvent-born paints. The protectiveperformance of the zinc coatings depends on their quality as well as on the level of paintadhesion thus requiring the use of adhesion promoting intermediate layers (e.g., phosphating)and primers. Phosphating treatment however, as a prerequisite for achieving good adhesion ofpaint on zinc coated steel is responsible for the largest part of the solid waste produced duringthe production process of electrogalvanized steel and thus its elimination is highly desirable. Inaddition to the above, the tendency to use waterborne primers and paints due to legalrestrictions on the use of organic solvents makes necessary the synthesis of polymer containingzinc coatings with improved corrosion and paint adhesion properties to be used as topcoatingson steel and as undercoats for painted steel. These composite zinc coatings can be prepared byelectrolytic codeposition of uniform waterborne polymeric or hybrid (i.e., polymeric/silica)nanoparticles. The nanoparticles employed in a codeposition process should have a fairlynarrow particle size distribution within a specific size range depending on the thickness of thecoating and the material should be carefully selected in order to be compatible with theingredients of the electroplating bath.In the present study, uniform anionic and cationic poly(methyl methacrylate) (PMMA) andpolystyrene (PS) nanoparticles with various functional groups (e.g., amide, hydroxyl, carboxyl,pyridine) on their surfaces were prepared by (emulsifier-free) emulsion polymerisation. Theeffect of various process parameters (e.g., type of initiator and comonomer, type andconcentration of surfactant) on the particle size and stability was examined. The polymerizationexperiments were carried out in laboratory-scale glass reactors and the most promising recipeswere successfully scaled-up in a fully automated pilot-scale reactor. Replicates of somerepresentative experiments, which were run both in lab and pilot-scale reactors, indicatedexcellent reproducibility of the polymerization process. The particles thus prepared weresubsequently codeposited from an acid zinc plating bath in the presence of the cationicsurfactant CTAHS resulting in the production of uniform composite zinc coatings. Theelectrolytic codeposition behavior of the polymeric nanoparticles was examined using a rotatingdisc electrode (RDE) and a parallel plate flow cell and the effect of the fluid flow and currentdensity on the codeposition experiments was investigated.In addition, raspberry-like poly(styrene/1-vinylimidazole)/silica P(St/1-VD)/Si hybridnanoparticles were prepared via emulsifier-free emulsion copolymerization, in the presence ofan ultrafine aqueous silica sol. The P(St/1-VD)/Si nanoparticles were purified by successivecentrifugation-redispersion cycles for the removal of the unbound silica. The effect of keyprocess parameters, such as reaction temperature, pH and initial monomers molar ratio on thesize, morphology and silica content of the produced hybrid nanoparticles was investigated. TheP(St/1-VD)/Si nanoparticles were subsequently codeposited from an acid zinc electroplatingbath on an RDE resulting in the formation of rather uniform composite zinc coatings.

KKeeyywwoorrddss:: Monodisperse polymeric nanoparticles, hybrid nanoparticles, electrolytic codeposition

26

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 26

OO1111

NNAANNOOSSCCAALLEE EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF MMEETTAALLSS ((AALL,, TTII,, NNII,, FFEE EETTCC)) AANNDD SSEEMMIICCOONNDDUUCCTTOORRSS((GGEE,,AALLSSBB,,ZZNNSSBB)) FFRROOMM RRTT IIOONNIICC LLIIQQUUIIDDSS

Mann O., Freylad W. Institute of Physical-Chemistry, University of Karlsruhe, Kaiserstrasse 12

Employing ionic liquids as electrolytes we succeeded for the first time to electrodeposit the titlemetals and semiconductors on metal and semiconductor substrates at room temperature withnanometer or atomic resolution. For this aim in-situ scanning tunnelling microscopy (STM) andspectroscopy (STS) methods have been applied. Our primary interest in these studies is focusedon the 1D, 2D and 3D electrochemical phase formation, in particular, their nucleation andgrowth mechanisms. However, these materials and their nanoscale fabrication have also astrong impact on technological applications such as: strongly adherent, corrosion resistantsurface coatings (Al, Ti), magnetic thin film storage devices (Ni, Fe), miniaturized electronicdevices or solar cell layering materials (AlSb, ZnSb). In this contribution we give a few specificexamples.

In-situ EC-STM image of oriented ironnanocrystals electrodeposited from anionic liquid at E = 0.4 V vs Al/Al(III),E

tip= 0.7 V and I

tun= 1 nA.

KKeeyywwoorrddss:: Nanoscale Electrodeposition, Ionic Liquids, In-situ EC-STM.

27

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 27

OO1122

IINNFFLLUUEENNCCEE OOFF HHYYDDRROODDYYNNAAMMIICCSS AANNDD PPUULLSSEE PPLLAATTIINNGG PPAARRAAMMEETTEERRSS OONN TTHHEEEELLEECCTTRROOCCOODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL NNAANNOOCCOOMMPPOOSSIITTEE FFIILLMMSS

Thiemig D.1, Bund A.1, Talbot J.B.2

1 Dresden University of Technology, Department of Physical Chemistry, Dresden, Germany2 University of California, San Diego, Chemical Engineering Program, San Diego, USA

Metal matrix composites can exhibit unique mechanical, physical, and chemical properties [1-5].This makes them promising candidates for advanced materials which can be produced cost-effectively by means of electrocodeposition. The advantages of the electrochemical fabricationmethod include for instance the homogenous distribution of particles, ability of continuousprocessing, and reduced waste [6]. However, there are also several challenges. Just dispersing theparticles in a common plating bath does not work very well. In most cases coagulation andsedimentation of the particles occurs which makes successful codeposition difficult.In this paper we will discuss recent results on the electrocodeposition of nickel matrixcomposites deposited from an acidic sulfamate electrolyte. Apart from the well establishedparallel plate direct current deposition, nanocomposites were produced by means of pulse-plating and jet-plating. The effects of the deposition parameters (type of current, currentdensity, pH, hydrodynamics, etc.) on the co-deposition of nanoparticles with nickel wereinvestigated by evaluating the particle content, microstructure, microhardness, and electricalconductivity of the nanocomposite coatings. The amount of codeposited particles wasdetermined using both electrogravimetric measurements and energy dispersive X-ray analysis.The crystallite size of the deposits was evaluated by XRD technique.Particle incorporation increased linearly with the particle loading for all deposition conditionsstudied. A maximum incorporation of 5.2 wt-% alumina in a nickel matrix was achieved usingan unsubmerged impinging jet electrode system at a current density of 10 A dm-2 and a flowrate of 2.5 L min-1. Regardless of the deposition conditions Ni/alumina nanocomposites showedan obvious strengthening effect with respect to the pure nickel coatings. The enhancedhardness of the composite films was associated to modifications in the microstructure of thenickel matrix as well as to the nanoparticle incorporation. The pure nickel deposits exhibited astrong (100) texture. As a result of increasing plating current density and particle incorporation,a decrease in the crystallite size and a loss of texture was found.

[1] E.A. Pavlatou, M. Stroumbouli, P. Gyftou, N. Spyrellis, J. Appl. Electrochem. 36 (2006) 385.[2] E. Gfimez, S. Pané, E. Vallés, Electrochem. Comm. 7 (2005) 1225.[3] S. Guan, B.J. Nelson, K. Vollmers, J. Electrochem. Soc. 151 (2004) C545.[4] L. Stappers, Y. Yuan, J. Fransaer, J. Electrochem. Soc. 152 (2005) C457.[5] J. Li, Y. Sun, X. Sun, J. Qiao, Surf. Coat. Technol. 192 (2005) 331.[6] J.L. Stojak, J. Fransaer, J.B. Talbot, in: R.C. Alkire, D.M. Kolb (Eds.), Advances in

Electrochemical Science and Engineering, Weinheim, 2002, pp. 193.

KKeeyywwoorrddss:: Electrocodeposition; Nanocomposites; alumina; impinging jet electrode, nanocomposites.

28

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 28

OO1133

NNII//NNAANNOO--TTIIOO22

CCOOMMPPOOSSIITTEE EELLEECCTTRROODDEEPPOOSSIITTSS:: TTEEXXTTUURRAALL AANNDD SSTTRRUUCCTTUURRAALLMMOODDIIFFIICCAATTIIOONNSS

Spanou S., Pavlatou E.A., Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens , Greece

A new generation of metal matrix coatings reinforced by nano-sized particles has attractedscientific and technological interest due to the recent availability of ever decreasing particlesizes and the resulting enhanced properties, such as hardness, wear and corrosion resistance[1]. Amongst the diversified synthesis processes, the electrochemical method has been used fora wide range of nanostructured materials, e.g., metal nanoparticles, nanowires, nanofilms, bulknanocrystalline metals, and nanoparticle-reinforced composite coatings. TiO

2nanoparticle-

reinforced Ni composite coatings exhibit improved mechanical properties, accompanied by aninteresting photoelectrochemical and photocatalytical behaviour [2]. In the present study, coatings are obtained by electrochemical codeposition of TiO

2nano-

particles (mean diameter 21 nm) with nickel, from an additive-free Watts type bath. Theelectrodeposition of Ni/TiO

2composites was carried out on a rotating disk electrode (RDE), by

applying direct current (DC) conditions. Pure Ni deposits were also produced under the sameexperimental conditions, as reference state for comparison. The surface morphology, thecrystallographic orientation of nickel matrix, and the grain size of the deposits wereinvestigated, along with the distribution and the percentage, of the embedded nanoparticles innickel matrix, affected by the electrodepostion parameters like the pH, the current density andthe concentration of TiO

2nanoparticles in the bath. The observed textural modifications of

composite coatings are associated with specific structural modifications of Ni crystallitesprovoked by the adsorption - desorption phenomena occurring on the metal surface [3],induced by the presence of TiO

2nanoparticles. It has been observed that the presence of TiO

2

nanoparticles favours the (100) texture of nickel matrix. Additionally, it has been established theinfluence of the electrolysis parameters such as pH and current density on the concentration ofthe embedded particles in the metal matrix. The concentration of the codeposited particlesaffects the size of metal crystallites and consequently the mechanical properties of the deposits.Moreover, the experimental findings demonstrate that the incorporation of the nanoparticlestakes place, between the grains as well as inside the crystals.

References:[1] J E.A. Pavlatou, M. Stroumbouli, P. Gyftou and N. Spyrellis, J. Appl. Electrochem. 3366 (2005) 385. [2] J.Li, J.Jiang, H.He and Y.Sun, J. Mater. Sci. Letters 2211 (2002) 939-941.[3] J. Amblard, M. Froment, N. Spyrellis, Surf. Technol. 55 (1977) 205.

KKeeyywwoorrddss: composites, nickel electrodeposits, titania, texture

29

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 29

OO1144

MMEECCHHAANNIICCAALL AANNDD AANNTTIICCOORRRROOSSIIVVEE PPRROOPPEERRTTIIEESS OOFF CCOOPPPPEERR MMAATTRRIIXX MMIICCRROO-- AANNDD NNAANNOO--CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSS

Lekka M.1, Koumoulis D.2, Kouloumbi N.2, Bonora P.L.1

[1]Department of Materials Engineering and Industrial Technology, University of Trento, ViaMesiano , Trento, Italy[2] School of Chemical Engineering, NTUA, 9th Iroon Polytechniou str, Athens ,Greece

The electrolytic codeposition of ceramic particles for the production of metal matrix compositecoatings is a research domain of wide interest as these coatings could be used for a large field ofindustrial applications, especially in cases where high abrasive and protective properties arerequired. The aim of the present work was the production of copper electrodeposits containing micro-and nano-particles of SiC. The electrodeposition was carried out under DC galvanostaticconditions using a copper pyrophosphate plating bath into which 20g/l of micro- or nano-SiCparticles were suspended. The composite coatings were tested and compared to pure coppercoatings regarding their microstructure as well as their mechanical and anticorrosive properties.The coatings microstructure was observed using SEM. Microhardness (HV) and abrasionresistance (Taber test) measurements were performed for the evaluation of their mechanicalproperties. The general corrosion behaviour of the coatings was estimated by potentiodynamicpolarization measurements in acid and alkaline environment. The pitting corrosion resistancewas evaluated after exposure, for various time intervals, to a salt spray cabinet using visual andSEM observation combined with Electrochemical Impedance Spectroscopy. The codeposition of SiC in the metal matrix changed the microstructure of the copper coatingsleading to amelioration of both their mechanical and, in some cases, their protective properties.The Vickers microhardness presented an increase of about 35 and 61% in the case of SiC micro-and nanoparticles incorporation while the corresponding increase of the abrasion resistancewas 88 and 58% respectively. The changes in the microstructure induced by the codeposition of the SiC particles influencedthe protective behaviour of the composite coatings. The presence of the microparticles lead toan increase of the coating general corrosion as well as of the time interval needed for theappearance of first micropit. Nevertheless the incorporation of the nano-particles lead to aslight amelioration of the resistance of the coating to general corrosion and to a double timeinterval needed for the first pit appearance.

KKeeyywwoorrddss:: composite coatings, nano- micro- SiC, abrasion, protection.

30

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 30

OO1155

LLOOWW--CCOOSSTT HHIIGGHH PPRREECCIISSIIOONN PPRROOCCEESSSSIINNGG IINN MMEEMMSS PPAACCKKAAGGIINNGG BBAASSEEDD OONNEELLEECCTTRROOCCHHEEMMIICCAALL PPRROOCCEESSSSEESS

Gunnarsson N.a&d, Leisner P.b, Wang X.c, Svensson M.c, Vieider C.c, Hultman L.d

aAcreo AB, Gjuterigatan 9, Jönköping, SwedenbSP, Swedish National Testing and Research Institute, and Jönköping University, SwedencAcreo AB, Norrköping/Kista, SwedendThin Film Physics Division, Department of Physics, IFM, Linköping University, Sweden

Encapsulation of electronics and sensors has traditionally been used as a protection against theoutside environment, but through integration of additional functions (e.g. lenses, electric andoptic conductors etc.) the functionality can be increased and further miniaturisation can beaccomplished. Cost-effective polymer technique has the potential to realize multifunctionalencapsulation in combination with 3D-silicon technique and advanced surface technology The focus of this paper has been to identify material and process techniques suitable forrealizing multi-functional encapsulation of microsystems. Precision processing in MEMSpackaging for low-cost applications has been studied based on electrochemical processes withthe purpose of generating knowledge for the entire process of low cost assembly of opto-electric access links in polymer. The electrochemically based processes studied in this paper include:1. Electroforming of a polymer moulding tool (stamper) in a nickel sulfamate electrolyte on a

high-precision 3D etched silicon template.2. Patterning of 3D surfaces by an electrophoretic photoresist.3. Precision plating of eutectic Au-Sn solder for self-alignment of chips.The results showed that nickel stampers with adequately low internal stress could beelectroformed on 3D silicon wafers. Further more, 3D polymer samples manufactured by thenickel stampers could be patterned with metal lines down to 25 Ìm wide using theelectrophoretic photoresist. Finally, eutectic Au-Sn solder bumps were realized by subsequentelectroplating of gold and tin followed by reflowing, satisfying the demands on dimension andalloy composition control over a whole wafer.

KKeeyywwoorrddss:: Electroforming, micro replication, 3D patterning, self aligning soldering, MEMS

31

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 31

OO1166

IIOONNIICC LLIIQQUUIIDDSS AASS EELLEECCTTRROOLLYYTTEESS FFOORR MMEETTAALL DDEEPPOOSSIITTIIOONN

Boeck R.fem – Research Institute for Precious Metals and Metals Chemistry, Schwaebisch Gmuend,Germany

In recent years the development of room-temperature molten salts (= ionic liquids) enables thepossibility for electrodeposition of elements like aluminium, tantalum or titanium, which cannotbe obtained from aqueous solutions at moderate temperatures.Whereas the electrochemistry for the metal deposition from aqueous electrolytes is adequatelydescribed and investigated respectively, the understanding of the electrochemistry fromelectrolytes based on ionic liquids is at the early stages.In the first part of the presentation there will be given an (i) overview of the most importantionic liquid systems which are used as electrolytes so far, (ii) a description of the physicalproperties of ionic liquids like electrochemical window, conductivity, transport number,diffusion coefficients, solubility for metal salts, viscosity and (iii) their impact on the metalplating process.In the second part of the presentation their will be discussed the impact of temperature, metalcontent and applied current density on the deposition rate and morphology of aluminium,nickel, gold and palladium micro- and nanocrystalline deposits by means of the results fromSEM and XRD investigations in our laboratory.

KKeeyywwoorrddss:: ionic liquids, metal deposition, aprotic eletrolytes

32

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 32

OO1177

AA DDEESSIIGGNN OOFF EEXXPPEERRIIMMEENNTT AAPPPPRROOAACCHH TTOO EELLEECCTTRROOCCHHEEMMIICCAALL MMIICCRROO-- FFAABBRRIICCAATTIIOONN

Nouraei S. , Roy S.School of Chemical Engineering and Advanced Materials Institute of Nanoscale Science andTechnology Merz Court Newcastle University, NE1 7RU, UK

Material etching techniques have been identified as one of the key processing technologies forthe fabrication of components such as micro-electronics and biocompatible devices [1].Electrochemical techniques have attracted a significant amount of attention in the “wet” metaletching arena, as the process typically involves neutral salt electrolytes and is relatively safe tooperate. There are also economical and environmental advantages associated with thesetechniques compared with competing etching methods such as plasma chemical etching [2].

A new concept of electrochemical micro-fabrication on substrates has been developed atNewcastle University. In the technique the workpiece, which is the anode in theelectrochemical reactor, is placed closely to a tool, which is the cathode containing the micro-pattern. Pattern transfer on the anode is achieved by selective electrochemical etching. This isthe result of higher etching rate on the areas opposing “exposed” regions of the cathode, andlower etching rates in the areas directly opposite to the areas, on the cathode, covered by aninsulator.

In this investigation the electrochemical micro-patterning process has been evaluated andcharacterised in a vertical flow system described previously in literature [3] . The experimentswere carried out using copper disk anodes and patterned gold-coated glass cathodes in a 0.1Mcopper sulphate electrolyte. An experimental design procedure [4] was adopted to determinethe influence of process parameters on the electrochemical micro-fabrication process in termsof variability in the percentage pattern transfer on the electrode’s surface area. The parameterswhich had been identified to influence the performance of the electrochemical micro-fabrication process were current density (mA.cm-2), processing time (s), electrolyte flow rate(cm3/s) and micro-pattern (feature) density (cm/cm2). The effects of these parameters on theprocess output were quantified by performing a 24 factorial experiment. In the 24 factorialdesigns, 16 experiments were carried out at upper and lower experimental levels, with anadditional 3 experiments at centre of the factorial design. The results of these experiments willbe discussed during the meeting.

1. M. Datta, IBM J. Res. Develop., 4422, 655 (1998).2. M. Datta and D. Landolt, Electrochim. Acta, 4455, 2535 (2000).3. W. R. A. Meuleman and S. Roy, Trans. Inst. Met. Fin., 8811, 55 (2003).4. D. C. Montgomery, Design and Analysis of Experiments, John Wiley & Sons, Chichester

(1991).

33

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 33

OO1188

DDEEVVEELLOOPPMMEENNTT OOFF AA HHOOLLIISSTTIICC MMOODDEELL FFOORR TTHHEE SSTTEEAADDYY SSTTAATTEE GGRROOWWTTHH OOFF PPOORROOUUSSAANNOODDIICC AALLUUMMIINNAA FFIILLMMSS

Patermarakis G., Moussoutzanis K.School of Chemical Engineering, Department of Materials Science and Engineering, NationalTechnical University, Athens, Greece

A holistic model for the kinetics and mechanism of growth of porous anodic alumina filmcoatings during Al anodising, interrelating various macroscopic, atomic – ionic scale kinetic,thermodynamic and field strength parameters, was formulated. It was based on the Alconsumption according to Faraday’s law, solely ionic current across the barrier layer andmobility of O2- and Al3+ species near the metal|oxide interface [1]. The model was tested inanodic alumina film coatings of different thicknesses formed in sulphuric and oxalic acidsolutions of various concentrations, at different current densities and temperaturescharacterised by strongly different pore/cell surface density, pore base diameter, amount ofincorporated electrolyte anions in pore walls [2], etc. Various structural and kinetic parameterswere determined while other physical, structural, kinetic and electrical conductance parameterswere interrelated. The validity of the model was tested on the basis of SEM observations. By thismodel the effect of anodising conditions on the transport numbers of Al3+ cations and O2- anionsacross the solid barrier layer below the porous layer was revealed [3]. Among others it wasfound that the cation (anion) transport number decreases (increases) with current density,increases (decreases) with temperature and is unaffected by the kind and concentration ofelectrolyte. Also the rate of film thickness growth was found to be strictly proportional to the O2-

anionic current through the barrier layer and be independent of electrolyte kind andconcentration. By this model it has been shown that the activation distances of Al3+ and O2-

transport are comparable but the activation energy of Al3+ transport is lower mainly due to themuch smaller size of Al3+. The results introduced a new growth mechanism theory embracingthe densification of barrier layer oxide lattice around a hemispherical shell and its rarefactiontowards the metal|oxide and oxide|electrolyte interfaces. This distribution of oxide density isestablished as a result of the high field ionic transport across the barrier layer accompanied bysettling deviation from stoichiometry in favour of cations and anions towards these interfaces toan extent depending on the position across this layer and anodising conditions. The oxidedensity near the metal|oxide is closely independent of anodising conditions and electrolyte andis related to the transformation of Al lattice to a metastable oxide lattice about 35% rarer thanthat of Á-Al

2O

3that is further suitably transformed to amorphous or nanocrystalline material as

this oxide is shifted to the oxide|electrolyte interface and becomes the pore wall material. Thismodel strongly changes our heretofore mind on the mechanism of growth of anodic films.

References[1] G.S. Patermarakis, V.N. kytopoulos, Mater. Lett. in press, first electronic publication, DOI

10.1016/j.matlet.2007.03.091.

[2] G. Patermarakis, K. Masavetas, J. Electroctroanal. Chem. 588 (2006) 179.[3] G. Patermarakis, J. Chandrinos, K. Masavetas, J. Solid State Electrochem. 11 (2007) 1191.

KKeeyywwoorrddss:: Porous anodic alumina; steady state; kinetics and mechanism of growth; holisticmodel.

34

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 34

OO1199

AANNOODDIICC OOXXIIDDEE TTEEMMPPLLAATTEESS FFOORR TTHHEE PPRROODDUUCCTTIIOONN OOFF NNAANNOO--PPAATTTTEERRNNEEDD SSUURRFFAACCEESS

Ürgen M., Yesil Y., Demirel A.Department of Metallurgical and Materials Engineering Istanbul Technical University, Maslak-Istanbul Turkey

On some metals and alloys it is possible to grow thick oxide films upon anodizing(electrochemical oxidizing) in suitable solutions. Structural materials that exhibit this propertyare aluminum, titanium and magnesium. Among these metals aluminum has a very specialplace. The oxide films grown on aluminum have a special porous structure that can be easilymodified by playing with the parameters of anodizing1. This characteristic film structure resultedin utilization of aluminum for different template applications. After the invention of two stepanodization by Matsuda et2 al it became possible to have more regular arrays of the porousstructure which made these structures more attractive. Recently studies3 started on thepossibility of formation of porous anodic oxides with a regular array structure on titanium.Titanium oxide, porous regular structures with their semi-conductor and bio-active propertiesmay become a more favorable nano template structure compared to aluminum oxides. In thistalk, the recent developments on anodic oxide templates on aluminum and titanium, theirapplication areas will be summarized and the related studies conducted in our group will begiven.

References[1] Jessensky O., Muller F. and Gosele U., 1998., Appl. Phys. Lett., 72, 1173-1175.[2] Masuda, H. and Fukuda, K., 1995., Science,268, 1466–1468. [3] Gopal, K. Mor, Oomman K. Varghose, Maggie Paulose, Karthnik Shankar, Craig A. Grimes,

Solar Energy Materials&Solar Cells, 90 (2006), 2011-2075

KKeeyywwoorrddss:: porous anodic oxide templates, aluminium, titanium

35

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 35

OO2200

PPUURREELLYY IINNOORRGGAANNIICC CCOOAATTIINNGGSS BBAASSEEDD OONN NNAANNOOPPAARRTTIICCLLEESS FFOORR MMAAGGNNEESSIIUUMM AALLLLOOYYSS

Feil F., Fürbeth W., Schütze M.DECHEMA e.V, Karl-Winnacker-Institut, Frankfurt am Main, Germany

The application of magnesium alloys is not always facile especially under corrosive andmechanical and/or thermal stresses. Nevertheless demand for this delicate metal is increasingwherever reduction in weight is beneficial. Particularly in automotive and electronic industriesalso the necessity for excellent corrosion protection is escalating.A chance for the application of stable coatings onto magnesium alloys is offered by chemicalnanotechnology. Already at moderate conditions nanoparticles may form solid composites [1].This enables to coat even thermally precarious magnesium alloys with dense, purely inorganicprotective layers. Contrary to most organic coatings, these vitreous layers offer high thermaland mechanical stability. Furthermore they enable to keep the decorative metallic appearanceas requested e.g. for cases and rims.The applied coatings are based on SiO

2nanoparticles which could be obtained commercially

[2]. Various suppliers offer base stabilized colloidal dispersions containing primary particlesstarting with diameters of just a few nanometers and low polydispersity. The addition of boron,aluminium or alkali salts as sintering aids can decrease the treatment temperature furthermoreand helps to adjust the coating properties. The cast alloy AZ91 as well as the wrought alloyAZ31 could be coated with these dispersions by dipping or brushing. Another coatingtechnique is based on the electrophoretic deposition of nanoparticles already containing allsintering aids [3]. Such particles can be synthesised by a base catalysed sol-gel process.Polydiethoxysiloxane can act as adhesion promoter for these coatings. Additionallyconcentration gradients of different oxides within these particles can tune the coatingproperties, too.Usually single coatings are very thin. However multiple coating applications as well as a processinvolving special particle mixtures lead to coatings with a thickness of up to severalmicrometers. Even after thermal treatment at 200 or 400 ÆC these coatings stay crack-free. Thecomposition and texture of these coatings were studied by IR, AFM, REM and other techniques.Their corrosion protection properties and their chemical and mechanical resistance wereinvestigated using standard tests as well as electrochemical methods.

References[1] D.M. Liu, J. Mater. Sci. Lett. 17 (1998) 467.[2] H.Q. Nguyen, W. Fürbeth, M. Schütze, Materials and Corrosion, 53 (2002) 772.[3] H.C. Hamaker, E.J.W. Verwey, Trans. Faraday Soc. (1940) 36.

KKeeyywwoorrddss:: magnesium alloys, protective coatings, nanoparticles, sol-gel.

36

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 36

OO2211

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF CCOO--PPTT CCOONNTTIINNUUOOUUSS FFIILLMMSS AANNDD NNAANNOOWWIIRREESS

Khatri M.S.1,, Schlörb H.1, Fähler S.1, Schultz L.1, Nandan B.2, Krenek R.2, Stamm M.2

1IFW Dresden, Dresden, 2IPF Dresden, Postfach Dresden, Germany

Co-Pt and Fe-Pt alloys are favored materials for future magnetic data storage due to good hardmagnetic properties like high coercivity and anisotropy. The Co-rich Co

80Pt

20was chosen for this

study because it does not require post annealing as in the case of ordered L10CoPt or FePt.

The Co-Pt films have been deposited from an aqueous bath containing Pt-p-salt and Cosulphamate [1] at different current densities. The influence of deposition current density on filmthickness, chemical composition, growth morphology, and structural and magnetic propertieswas investigated.Porous alumina templates have been developed for the preparation of ordered arrays ofnanostructured materials for various applications [2]. The temperature dependence of themagnetic properties of Ni nanowires was analyzed in detail and a maximum of coercivity andanisotropy field was observed around room temperature which cannot simply be explained byshape anisotropy. A model was proposed which considers the competing magnetoelasticanisotropy originating from the difference in thermal expansion coefficient of the Al-substrateand the filled alumina template [3]. As a promising alternative diblock copolymer templates have been proposed that allow smallerfeature sizes and thus yield to higher storage densities. The filling of these templates with Nickelby electrodeposition was successfully demonstrated [4]. Templates have been fabricated by dip-coating a conducting substrate into a solution ofpolystyrene-block-poly(4-vinylpyridine) (PS-b-P4VP) and 2-(4’-hydroxybenzeneazo) benzoicacid (HABA). Depending on the polymer composition lamellar or cylindrical structures can beachieved. For better ordering vapour annealing step was interposed. By dissolving the HABA thepores are opened and afterwards filled with Co-Pt by electrodeposition.First results on templates electrochemically filled with Co-Pt will be presented together with ananalysis of their magnetic properties.

References:[1] I. Zana, and G. Zangari, Electrochem. Solid-State Lett. 66(12) (2003) C153 – C156.[2] K. Nielsch, R. Hertel, R.B. Wehrspohn, J. Barthel, J. Kirschner, U. Gosele, S.F. Fischer, H.

Kronmuller, IEEE Trans Mag. 3388(5) (2002) 2571.[3] A. Kumar, S. Fähler, H. Schlörb, K. Leistner, and L. Schultz, Phys. Rev. B 7733 (2006) 064421.[4] A. Sidorenko, I. Tokarev, S. Minko, and M. Stamm, J. Am. Chem. Soc. 112255 (2003) 12211.

KKeeyywwoorrddss:: hardmagnetic alloys, nanowires, diblock copolymer templates

37

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 37

OO2222

TTHHEE EEFFFFEECCTT OOFF HHEEAATT TTRREEAATTMMEENNTT OONN TTHHEE SSTTRRUUCCTTUURREE AANNDD HHAARRDDNNEESSSS OOFF PPUULLSSEEEELLEECCTTRROODDEEPPOOSSIITTEEDD NNIIPP--WWCC CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSS

Zoikis – Karathanasis A., Pavlatou E.A., Spyrellis N.General Chemistry Laboratory, School of Chemical Engineering, National Technical Universityof Athens, 9 Heroon Polytechniou Str., Zografos Campus, Athens 15780, GREECE

Composite materials of nickel – phosphorus matrix are relative new materials that findenduringly ongoing interest due to their significantly improved mechanical properties towardsnickel and other alloy matrixes [1-3]. In the present work electrolytic NiP and NiP-WCcomposite coatings have been produced under direct and pulse current conditions from amodified Watts bath free of additives. The impact of current parameters, such as current type(direct or pulse) plus frequency and duty cycle of the imposed current pulses, on the co-deposition process of nano WC particles as well as, on the structure, the morphology and themechanical properties of the produced composite coatings was studied. Furthermore, the effectof heat treatment at various temperatures on the microstructure and micro-hardness of thecoatings was investigated.XRD analysis revealed an amorphous structure of NiP matrix in NiP deposits, as well as in NiP-WC composite coatings in the as plated form, with a phosphorous content in the range of 12-13,5 w/w%. The SEM micrographs and EDX analysis indicated that the imposition of pulsecurrent conditions leads to more compact coatings with increased embedded percentage andmore homogenous distribution of nano WC particles in the matrix compared to those preparedunder direct current conditions. Composite NiP-WC coatings exhibited higher micro-hardnessvalues than NiP deposits in the as plated form. The gradual heat treatment of the coatings atdifferent temperatures demonstrated a significant increase of the micro-hardness values of thedeposits, reaching a peak at about 400 OC due to crystallization and formation of steady phasesof Ni, Ni

2P and Ni

3P, while at higher temperatures the micro-hardness falls dramatically

reaching the initial values at about 600 OC. Overall, coatings that have been produced under pulse current conditions surpass those thathave been produced under direct current regarding the homogeneity of the embeddedparticles as well as the mechanical properties. It is worth mentioning that the micro-hardness ofcomposite coatings produced under specific pulse current conditions followed up by properheat treatment can reach the value of 19 GPa.

References[1] I.R. Aslanyan, J.P. Bonino, J.P. Celis, Surf. Coat. Techn., 2006, p.581[2] K.H. Hou, W.H. Hwu, S.T. Ke, M. D. Ger, Mater. Chem. Phys., 2006, p.54[3] I. Apachitei, F.D. Tichelaar, J. Duszczyk, L. Katgerman, Surf. Coat. Technol., 2002, p.263

KKeeyywwoorrddss:: pulse electrodeposition, nickel-phosphorous, tungsten carbide, micro-hardness, heattreatment.

38

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 38

OO2233

VVAACCUUUUMM TTHHEERRMMAALL TTRREEAATTEEDD EELLEECCTTRROOLLEESSSS NNIIPP--TTIIOO22

CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSS

Novakovic J. , Vassiliou P.School of Chemical Engineering, National Technical University of Athens, Zografou, Athens, Greece

Composite are one of the most recently developed types of electroless nickel coatings. Thesecermet deposits consist of small particles of intermetallic compounds, fluorocarbons, oxides ordiamonds dispersed in an electroless nickel-phosphorus matrix. These coatings have a highapparent hardness and superior wear and abrasion resistance. Composite NiP-TiO

2layers were prepared by simultaneous electroless deposition of NiP and

TiO2

on steel and brass substrates, from a solution in which TiO2

particles were kept insuspension by stirring. Following heat treatment in a high vacuum, the plating acquireschromium equivalent hardness. The major advantages offered by vacuum heating process are(i) the absence of gas to chemically react with the heated surface, and (ii) degassing of theadsorbed hydrogen from the volume of the coatings and gas removal by the vacuum, thusminimizing hydrogen embrittlement. The deposit surfaces were characterized by SEM/EDAX,Vickers microhardness, by X-ray diffraction and optical microscopy in the crossesctions. Thefabricated composite materials were tested under saline corrosion conditions by linearpolarization measurements . Chemical and phase analysis of the produced NiP-TiO

2coatings confirm the codeposition of

nickel and TiO2

and the formation of a homogeneous material. Electroless deposited compositecoatings exhibit an amorphous structure of the nickel matrix in which crystalline titanium oxideis incorporated. Heat treatment of these layers leads to the formation of a crystalline layer inwhich the Ni and Ni

3P crystallites appear apart from those of the TiO

2(anatase). Corrosion

resistance for both the as-plated and the vacuum heat-treated composite NiP-TiO2

coatings isexcellent and the co-deposition of the TiO

2particles in the metallic matrix does not seem to

effect pore creation in the Ni matrix. Composite coatings of a nickel matrix with stable inorganic TiO

2oxide offer the synergistic

advantage of the metal matrix which is conductive, corrosion resistant and the oxide which mayenhance the corrosion and wear resistance or catalytic properties of the system. These coatingsmay also be employed on other engineering materials and increase the properties of the systemby tailoring the suitability to a new need.

39

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 39

OO2244

PPLLAASSMMAA PPRROOCCEESSSSIINNGG IINN FFAABBRRIICCAATTIINNGG NNAANNOO--TTEEXXTTUURREEDD,, SSUUPPEERR--HHYYDDRROOPPHHOOBBIICC PPOOLLYYMMEERRIICC CCOOAATTIINNGGSS

Vourdas N., Vlachopoulou M.E., Tserepi A. ,Gogolides E.Institute of Microelectronics, NCSR “Demokritos”, Aghia Paraskevi , Greece

Wettability is a property of great importance in many coatings, from biology to corrosionprotection applications. Wetting or water repellent behaviour is governed by both surfacechemistry and topography. In particular, super-hydrophobicity (SH) is attained by combininglow surface energy coatings and high-aspect-ratio (HAR) geometrical characteristics in whichliquids contact only the upper part of HAR surfaces in a state called Cassie-Baxter. In this studywe present a novel, simple, generic and fast technique to nano-texture and fabricate stable SH,yet transparent poly(methyl methacrylate) (PMMA) and poly(dimethyl siloxane) (PDMS)coatings or substrates, by means of high-density plasma etching and deposition [1],[2].An Inductively Coupled source is used to generate cold plasma within a low-pressure reactorwhich is used to treat the PMMA and PDMS surfaces. First O

2based plasma for the case of

PMMA, and SF6

plasma for the case of PDMS, is applied to etch the surface and create surfaceroughness, with controlled characteristics. The time of the process may differ from 1 min toseveral min depending on the roughness amplitude and on the degree of transparency desired.Pressure and bias voltage effect on HAR morphology is also explored and discussed. After thisfirst step the gas chemistry is altered into a fluorocarbon one, for both PMMA and PDMS, whichleads to a Teflon-like deposition and controlling thus the surface chemistry. Following thisprocess SH surfaces are produced.AFM (Atomic Force Microscopy) and SEM (Scanning Electron Microscopy) is used tocharacterize morphology and water contact angle (CA) and CA hysteresis to characterizewetting properties. We demonstrate high aspect ratio pillars with height ranging from ~350 nmto several Ìm depending on the processing time, and contact angles of 150o with hysteresislower than 10o within 1 min of plasma processing (see Fig. 1). Surfaces with pillars shorter than400 nm are simultaneously transparent. Bias voltage favours the surface roughness formation,e.g. for the case of PDMS an increase of bias voltage from 0 to 150 V results in an amplificationof the nano-column height from ~20 to ~550 nm (see Fig. 2).

References[1] Tserepi A., Vlachopoulou M.-E., Gogolides E. 2006 Nanotechnology 17 3977[2] Vourdas N., Tserepi A., Gogolides E. 2007 Nanotechnology 18 125304

KKeeyywwoorrddss:: Plasma treatment; super-hydrophobicity; PMMA; PDMS

40

Fig. 1 CA and hysteresis of Teflon-likecoated PMMA samples after oxygen plasmatreatment for 0 to 5 min. SH is attainedwithin 1 min, and samples are opticallytransparent up to 3 min treatment.

Fig. 2 Nano-column topography variationof 2 min SF

6plasma-treated PDMS

surfaces with bias voltage. Roughnessfactor, from AFM analysis, is increasedfrom 1.05 (0 V) to 3.36 (-150 V).

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 40

OO2255

PPRREEPPAARRAATTIIOONN OOFF NNAANNOO--SSTTRRUUCCTTUURREEDD MMEEMMBBRRAANNEE SSUUPPPPOORRTT SSYYSSTTEEMM BBYY MMUULLTTII--CCOOAATTIINNGG

Ahmadian Namini P., Babaluo A.A. , Bayati B.Research Center of Polymeric Materials, Sahand University of Technology, Tabriz, I.R. Iran.

Tubular alumina porous support systems for nanostructure ceramic-composite membraneswere prepared by gel-casting method. The support systems made in this work, have an openporosity about 48% and pore size in the range of 100–600 nm. In order to achieve higherperformance of nanocomposite membranes, the average pore size of the support outer surfacewas reduced employing dip-coating in submicron and nano ·-alumina slurries. In this respect,the effects of several parameters such as solid content, dipping time, vacuum pressure, heatingrate and number of coated layers on prepared layers microstructure and morphology wereinvestigated. Experimental results demonstrated that using vacuum at the first coating stepcauses undesired penetration of submicron particles in pores of the support systems, so that themore vacuum pressure, the more powder penetration. Therefore, the optimum routine for thistechnique was obtained as twice coating of 5 wt.% submicron slurry without applying vacuumand a dipping time of 30 s for each stage followed by vacuum dip-coating (0.02-0.03 bar) of 5wt.% submicron slurry for 15 s. The optical microscope micrographs illustrated that the surfaceof the coated layers had been improved to some extent. However, to attain a nano-structuredsurface for more desirable performance, another coating layer with 1 wt.% aluminananoparticle slurry by the same vacuum conditions was applied. The heating rate for all stageswas 1 oC/min up to 850oC for the slow elimination of polymeric binder and dispersant followedby temperature increasing at a rate of 5 oC/min up to 1350 ÆC. Then the articles weremaintained at this temperature for 2 hr and cooled slowly to ambient temperature. SEM imagesindicated that the support surface was improved dramatically. Also, the pore size distribution ofthe coated layers was measured by mercury porosimeter which was indicative of the formationof a layer with narrow pore size distribution in the range of 4-30 nm.

References:[1] Y.S. Lin, J. Memb. Sci., 79 (1993) 55.[2] Y.S. Lin, A. J. Burggraaf, J. Memb. Sci., 79 (1993) 65.

KKeeyywwoorrddss:: Nano-structured membrane; Ceramic support; Dip-coating; Pore size.

41

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 41

OO2266

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF PPOOLLYYCCRRYYSSTTAALLLLIINNEE ZZNNTTEE IINN AAQQUUEEOOUUSS MMEEDDIIUUMM UUSSIINNGG CCOONNSSTTAANNTTAANNDD PPUULLSSEEDD PPOOTTEENNTTIIAALLSS

Kosanovic T., Karoussos D., Bouroushian M. , Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens , HELLAS

Zinc telluride (ZnTe) is a tetrahedral II-VI compound with a great potential for optoelectronicand photovoltaic heterojunction device applications as having a wide 2.26 eV band gap ofdirect transition, a low affinity of 3.53 eV and p-type doping ability. In this connection,improved ZnTe ohmic contacts have been constructed in high efficiency photovoltaic cells likethose based on p-type CdTe and GaAs while polycrystalline, thin (<100 nm) ZnTe films havebeen mounted as passivating layers, instead of CdS, in CdTe and also in CdSe-based SIS solarcells [1-3].Electrodeposition of ZnTe in aqueous medium has been widely reported [1-4]. In the presentwork, cathodic electrodeposition was performed from acidic (pH = 2–4), zinc sulphate andtellurite containing baths at 85oC, under constant or pulsing voltage onto rotating-disc metallic(Ni, Ti) and non-metallic (TO glass, CdTe, CdSe) electrodes. A zinc-citrate complex precursorwas employed in certain cases by addition of C

6H

8O

7, C

6H

5O

7Na

3in the prime solution. The

process led to the formation of 100 to 500 nm-thick barrier layers of cubic-blend, stoichiometricZnTe or to mixed (ZnCd)Te structures. The as-obtained deposits were characterized by XRD,SEM-EDAX, AFM, FTIR & photocurrent spectroscopy techniques.Improved micro-structure of the binary ZnTe layers, in terms of crystallinity and stoichiometry,could be attained (a) by the application of pulse plating conditions in the customary acidicsulphate bath, and even more (b) by the introduction of citrate ligand in the prime depositionbath. Moreover, the employment of CdTe or CdSe substrates of (111) texture (preparedthemselves by a similar electrodeposition technique [5]) featured an epitaxially [111]-orientedgrowth of ZnTe as well as an improved Zn/Te atomic ratio. The directed growth was moreefficient with CdSe, underscoring the low mismatch (-0.84%) in the ZnTe/CdSe heterojunction,which thus is very attractive for solid state applications. Finally, we were able to develop ternaryZn

xCd

1-xTe (CZT) layers (x = 0.8 - 0.9) of high electric resistivity by cathodic treatment of

suitably prepared porous CdTe; this CZT system can be advantageously used as a radiationdetector component. The illustrated electrodeposition method may be capable for directfabrication of Schottky and semiconductor heterojunctions.

References[1] F. Buch, A.L Fahrenbruch, R.H. Bube, J. Appl. Phys. 48 (1977) 1596.[2] M. Neumann-Spallart, C. Königstein, Thin Solid Films 265 (1995) 33.[3] J. Merchant, M. Cocivera, J. Electrochem. Soc. 143 (1996) 4054.[4] T. Ishizaki, N. Saito, O. Takai, S. Asakura, K. Goto, A. Fuwa, Electrochimica Acta 50 (2005)

3509.[5] M. Bouroushian, T. Kosanovic, N. Spyrellis, J. Cryst. Growth 277 (2005) 335.

KKeeyywwoorrddss:: ZnTe electrodeposition; II-VI chalcogenides; Heterojunctions; Optoelectronics

42

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 42

OO2277

EELLEECCTTRROOCCRRYYSSTTAALLLLIISSAATTIIOONN OOFF ZZIINNCC FFRROOMM AACCIIDDIICC BBAATTHHSS;; AA NNUUCCLLEEAATTIIOONN AANNDD CCRRYYSSTTAALLGGRROOWWTTHH PPRROOCCEESSSS

Vasilakopoulos D., Bouroushian M., Spyrellis N.Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens ,HELLAS

The electrocrystallisation of Zn from acidic baths on low-carbon stainless steel (SS 316L) wasstudied as a process of heterogeneous nucleation and crystal growth, considering its importantimplications in the massive deposition of Zn coatings. In particular, the kinetics of the initialstages of the electrochemical Zn formation was investigated by chronoamperometry.A conventional three-electrode cell was used for the electrochemical measurements, with aworking solution of pH 2.0 - 4.5 containing ZnSO

4-7H

2O (or ZnCl

2), NaCl and H

3BO

3.

Potentiostatic current-time transients (CTTs) were recorded at various cathodic potentials,i.e. -1100, -1150, -1300, -1550 and -2100 mV/SCE [E

redox(Zn)= -1007 mV/SCE in the present

system], which lie within the experimental range of potentials used elsewhere for the bulkgalvanostatic electrodeposition of Zn [1, 2].Given that the electrochemical reaction was controlled by charge transfer at theelectrode/electrolyte interface, the analysis of the experimental CTTs was done on the basis of ananalytical model regarding the instantaneous or progressive nucleation of 3D growth centershaving the shape of right circular cones. Assuming that nucleation follows 1st order kinetics, anon-linear regression fit of the experimentally recorded CTTs, in terms of the above mentionedmodel, was used in order to estimate the kinetic parameters of nucleation and growth, that is,the rate constants and the number density of nucleation sites on the surface of the substrate [3]. Instantaneous nucleation was predominant in the major part of the experimental conditions, inparticular for cathodic overpotentials greater than ca. 300 mV. On the other hand, progressivenucleation was seen to prevail for larger overpotentials and highly acidic baths. This change inthe nucleation mode could be attributed to the intense hydrogen evolution blocking the activesites of the substrate.The calculated nucleation rate constants along with their respective overpotentials werecorrelated analytically using the classical theory of heterogeneous nucleation, in order toestimate the radius of the critical nucleus. The latter was found to be in the range 0.26 - 1.42 Å;however the atomic radius of a Zn atom is known to be 1.33 Å. Therefore, the estimated radiusof the critical nucleus is too small to be consistent with the classical theory of heterogeneousnucleation, since this theory is strictly valid when the nucleus contains an appreciable numberof atoms (at least a hundred) [4].

References[1] D. Vasilakopoulos, M. Bouroushian and N. Spyrellis, J. Mater. Sci. 41 (2006) 2869.[2] D. Vasilakopoulos, M. Bouroushian and N. Spyrellis, Trans. IMF 79 (2001)107.[3] M.Y. Abyaneh, J. Electroanal. Chem. 530 (2002) 82.[4] A. Milchev, S. Stoyanov and R. Kaischev, Thin Solid Films 22 (1974) 255.

KKeeyywwoorrddss:: Electrocrystallisation; Nucleation; Crystal Growth; Zinc Electrodeposition.

43

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 43

OO2288

CCOORROOOOSSIIOONN BBEEHHAAVVIIOORR OOFF CCHHRROOMMAATTEE FFRREEEE PPAASSSSIIVVEE MMUULLTTII--LLAAYYEERR OONN ZZIINNCC CCOOAATTIINNGGSS

Stancu R.1, Parvu C.2, Sovar M.2, Nicolae A.1

1Mechanical Engineering and Research Institute, Oltenitei 103, Bucharest, Romania2Facukty of Applied Chemistry and Material Science, University Politehnica Bucharest,Bucharest, Romania

Investigations have been made on passive multi-layer – inorganic and organic layers -on zinccoatings. The layers were developed as an alternative of conventional passive chromate layerson zinc coatings. In order to improve the anticorrosion protection properties of molibdate/phosphate and cerium conversion layer were electrodeposited pyrrole layer.Different electrochemical techniques and neutral salt corrosion tests were performed tocharacterized coroosion resistance of multi-layer system developed.

References[1] G.M. Treacy, G.D. Wilcox and M.O.W. Richardson, J. Appl. Electrochem. 29 (1999) 647[2] J.A.Wharton, G.D. Wilcox and K.R.Baldwin, Trans.I.M.F. 74 (1996) 210

KKeeyywwoorrddss:: chromate replacement, molibdate, pyrrole electrodeposition

44

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 44

AABBSSTTRRAACCTT BBOOOOKKPPOOSSTTEERR PPRREESSEENNTTAATTIIOONNSS

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 45

46

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 46

PP0011

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL CCOOMMPPOOSSIITTEESS WWIITTHH SSUUBBMMIICCRROONN SSIIZZEE PPAARRTTIICCLLEESS

Cavallotti P.L., Magagnin L., Pompei E.Dip. Chimica, Materiali e Ing. Chimica G. NattaPolitecnico of Milano - Via Mancinelli, 7 - 20131 Milano (Italy)

ElectroChemical Deposition ECD of composites are well known processes applied for wearresistance. Some new results are reported on the electrodeposition of nickel with Boron Nitrideparticles of submicron size, showing a great increase of the wear resistance of plated samples.Problems related to the process realisation are pointed out. A comparison with a nickelcomposite with diamond particles obtained in an acid nickel electroforming bath at hightemperatures is reported.The effect of bath loading with powders on cathodic current efficiency in ECD baths, oncrystallographic structure of the deposit, both as deposited and after thermal treatment, and onpowder content is examined. Electrolytes were electrochemically characterised withpotentiodynamic runs at a rotating disc electrode. Mechanical properties of composites weredetermined with microindentation measurements and with friction and wear tests. Compositefilms show an increased microhardness, a decreased friction coefficient and a great increase ofthe wear resistance.

KKeeyywwoorrddss:: nickel, composite, diamond.

47

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 47

PP0022

TTHHEE EEFFFFEECCTT OOFF CCAARRBBOONN CCOONNTTEENNTT OONN TTHHEE PPRROOPPEERRTTIIEESS OOFF TTIITTAANNIIUUMM OOXXYYNNIITTRRIIDDEE TTHHIINNFFIILLMMSS

Vaz F., Chappé J.M., Cunha L., Moura C.Universidade do Minho, Departamento de FÍsica

Reactive sputtered titanium oxide, titanium nitride and titanium carbide thin films have beenextensively investigated because of their remarkable optical, electrical, mechanical and chemicalproperties. The possibility to join all these systems appears to be an important issue in order tofind new and multifunctional applications for a combined material, Ti-C-O-N. Based on thenewly studied oxynitride systems within the group [1,2], the present study will be focused onthe influence of carbon additions to the optical, electrical and structural properties of thesemultifunctional systems. Taking this into account that the properties of deposited films dependstrongly on the deposition conditions and consequent composition and structural features, themain purpose of this work consists in the establishment of coherent correlation between thefilms particular compositions as well as the consequent developed structural arrangements. Thedepositions will be carried out from a Ti target, varying the ratio, r, of injected gases, r = º

C

(from C2H

2)/º

N2+O2(a mixed N

2+O

2gas - 17:3 ratio). The already obtained results show that the

composition of the films presented significant variations as a function of the gas ratio r. X-raydiffraction results showed a progressive amorphization of the samples with both increasing Ccontent as well as oxygen. Raman spectra revels the presence of amourphous carbon andtitanium oxide phases. This progressive amorphization resulted also in an increase in electricalresistivity of the samples. Regarding optical characteristics, the results reveal a substantialdarkening of the samples with increasing C content.

References[1] F. Vaz, P. Cerqueira, L. Rebouta, S. M. C. Nascimento, E. Alves, Ph. Goudeau, J. P. Rivière,

K. Pischow, J. de Rijk, “Structural, Optical and Mechanical Properties of Coloured TiNxO

y

Thin Films”, Thin Solid Films 447-448 (2004) 449-454.[2] F. Vaz, P. Carvalho, L. Cunha, L. Rebouta, C. Moura, E. Alves, A.R. Ramos, A. Cavaleiro,

Ph. Goudeau and J.P. Rivière, “Property change in ZrNxO

ythin films: effect of the oxygen

fraction and bias voltage”, Thin Solid Films 469-470 (2004) 11-17.

KKeeyywwoorrddss:: Thin films, oxynitrides, TiCON, structure.

48

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 48

PP0033

SSOOLLVVAATTOOCCHHRROOMMIISSMM OOFF 11--AARRYYLL--11ãã--PPEENNTTAACCYYAANNOOFFEERRRRAATTEE--44,,44ãã--BBIIPPYYRRIIDDIINNEESS

Papadakis R., Tsolomitis A. Laboratory of Organic Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, I Athens, Greece

Solvatochromic phenomena are discussed from both fundamental aspects as well as practicalpoints of view. Optical neural networks using photochromic memory media, molecularelectronics applications, applications to three dimensional and nearfield optical memory media,photooptical switching devices using photochromic hybrid organic materials, chiropticalmolecular switches and non-linear optical properties of photochromic molecules [1,2], areamong the most active topics.The viologen dications have a relatively high electron affinity and therefore behave as goodelectron acceptors. Accordingly, these species readily form outer-sphere charge-transfercomplexes with species possessing low ionization potentials (electron donors). Typical donorsare electron-rich species such as organic moieties possessing lone pairs or anions, among themthe pentacyanoferrate (II) moiety.Here, we describe the synthesis of some new 1-aryl-1ã-pentacyanoferrate-4,4ã-bipyridinecomplexes, and their characterization spectroscopically and by chemical analysis. Thesecompounds exhibited a negative solvatochromism using electron absorption spectroscopy; theabsorption spectra of complexes have been measured in different polarity solvents such asmethanol, acetonitrile and dimethylformamide (in increasing polarity). These spectra featureintense UV absorption due to ➝* intraligand transitions together with intense broadd(FeII)➝*(L), (L = bipyridyl ligand), visible metal to ligand charge-transfer (MLCT) bands.These complex salts can be considered halosolvatochromic because by substitution of thecounter anion, chlorine, by the iodine anion, a hypsochromic shift of the electron absorptionspectrum is induced that increases with the charge density of the cation.The observed negative solvatochromism indicated that the ground-state is more polar than theexcited-state, therefore the transition occurs at shorter wavelength i.e. there is hypsochromicshift with increasing polarity of the solvent.These results agree with the reported conformation of viologen dications in which the twopyridine rings are twisted while in the viologen monocation radicals the conformation of thesetwo rings proved to be planar.We are currently investigating the electronic and optical properties using cyclic voltammetry,HRS, and single crystal X-ray studies.

References[1] Benjamin J. Coe et al, Inorg. Chem. 37 (1998) p.3391-3399[2] Masato Nanasawa, Organic Photochromic and Thermochromic Compounds,

Kluwer, Vol 1, p.341-369

KKeeyywwoorrddss:: pentacyanoferrate complexes, bipyridines, solvatochromism

49

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 49

PP0044

LLOOWW--TTEEMMPPEERRAATTUURREE FFUUEELL CCEELLLLSS.. MMOODDIIFFIIEEDD OOXXIIDDEE GGRRAAPPHHIITTEE AASS AA SSUUPPPPOORRTT FFOORREELLEECCTTRROOCCAATTAALLYYSSTTSS

Nizhnikovsky E.A.1, Poluboyarinov V.S., Fesenko A.V., Skundin A.M., Kulova T.L.1Scientific Council on Complex Problems in Physics, Chemistry, and BiologyMoscow, Russia

Platinum and other platinum metals are known to be the best elelctrocatalysts for fuel cells upto now. For increasing effectiveness of using so expensive metals they are used in highlydisperse form. For enhancing stability of such high-dispersed systems the common practice is toapply platinum at proper support, e.g. carbon blacks. It’s known also that performances ofsupported electrocatalysts strongly depend on kind of carbon black. The aim of the present work was to search the possibility of enhancement of electrocatalyticactivity of platinum at expense of altering traditional support. As such carbon support newmaterial, namely modified oxide graphite was used. The modified oxide graphite was createdfive years ago [1]. Its feature is special nano-structure. The particles of modified oxide graphitewith typical size about 25-50 Ìm have so-called cabbage-head-like structure. They are formedfrom leaves with thickness of 50-100 nm and inter-leaves space is about 1-3 nm. The gas-diffusion electrodes for oxygen reduction in acid electrolyte were manufactured fromplatinized modified oxide graphite, platinum loading being as low as 0.7 mg/cm2. The trueelectrocatalityc activity of new electrodes was found to be ca. 5-fold in comparison withstandard E-TEK catalysts.

Reference[1] Russian Patent No. RU 2198137, 26.04.02.

KKeeyywwoorrddss:: Modified oxide graphite, oxygen electrode

50

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 50

PP0055

HHYYDDRROOGGEENN EEVVOOLLUUTTIIOONN AACCTTIIVVIITTYY OOFF NNIICCKKEELL BBAASSEEDD CCOOMMPPOOSSIITTEE CCOOAATTIINNGGSS CCOONNTTAAIINNIINNGGCCHHRROOMMIIUUMM GGRROOUUPP MMEETTAALL AANNDD SSIILLIICCOONN PPOOWWDDEERRSS

Popczyk M., Kubisztal J., Budniok A.University of Silesia, Institute of Materials Science, Katowice, Poland

Many papers have dealt with ways of increasing the effectiveness of cathodes used for thehydrogen evolution reaction in an alkaline solutions [1-3]. Many transition metals and metalalloys have been characterized as hydrogen electrodes. Among them, nickel and nickel-basedalloys have a catalytic activity. However, their activity and stability are insufficient. They areusually prepared by electrodeposition [1-3] or dip coating [4]. In order to improve the utilizationof these materials and to enhance their electrocatalytic activity, various modifications could beapplied, such as the use of alloys or composites instead of pure elements and other modificationsto obtain electrodes with very developed, rough or porous electrode surface [1-3].This study was undertaken in order to obtain the nickel coatings, containing an additionalcomponents of metallic (Cr, Mo, W) and non-metallic (Si) powders. It was assumed that themetallic (Cr, Mo, W) components perform a function of activator in the HER and non-metalliccomponent (Si) performs a function of surface modifier. The purpose of this work was toevaluate effectiveness of these coatings as electrode materials for hydrogen evolution in analkaline solution.Ni+Cr+Si, Ni+Mo+Si and Ni+W+Si composite coatings were obtained by electrodeposition ofcrystalline nickel from an electrolyte containing suspension of suitable metallic and non-metalliccomponents (Cr, Mo, W and Si). These coatings were obtained under galvanostatic conditions,at the current density of j

dep.= 0.100 A cm-2 and at the temperature of 338 K. Chemical

composition of obtained coatings was determined by EDS method. The electrochemical activityof these coatings was studied in the process of hydrogen evolution reaction (HER) from 5 MKOH solution using steady-state polarization and electrochemical impedance spectroscopy (EIS)methods. The kinetic parameters of hydrogen evolution reaction on particular electrodematerials were determined. It was found that Ni+Mo+Si composite coatings are characterizedby enhanced electrochemical activity towards hydrogen evolution as compared with Ni+W+Siand Ni+Cr+Si coatings. Thus obtained coatings may be useful in application as electrodematerials for the hydrogen evolution reaction.

References[1] M. Popczyk, A. Budniok, A. Lasia, Int. J. Hydrogen Energy 30 (2005) 265.[2] M. Popczyk, A. Serek, A. Budniok, Nanotechnology 14 (2003) 341. [3] R.K. Shervedani, A. Lasia, J. Electrochem. Soc. 145 (1998) 2219.[4] D.E. Brown, M.N. Mahmood, A.K. Turner, S.M. Hall, P.O. Fogarty, Int. J. Hydrogen Energy7 (1982) 405.

KKeeyywwoorrddss:: Nickel, chromium group, silicon, composite coatings, hydrogen evolution reaction.

51

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 51

PP0066

SSTTUUDDYY OOFF TTHHEE HHYYDDRROOGGEENN PPEERRMMEEAATTIIOONN TTHHRROOUUGGHH FFEE IINN SSEEAAWWAATTEERR BBYY TTRRAANNSSFFEERRFFUUNNCCTTIIOONNSS AANNAALLYYSSIISS IINN AA DDEEVVAANNAATTHHAANN CCEELLLL

Mirkova L.a, Maurin G.b, Gabrielli C.c

a: Institute of Phisical Chemistry, Bulgarian Academy of Sciences, Sofiab: UPR 15-CNRS, LISE, University « Pierre et Marie Curie »c: UPR 15-CNRS, LISE, University « Pierre et Marie Curie »

The problem of hydrogen embrittlement of steel constructions used in the oil and gas industryis particularly serious in marine environment. The corrosion, due to the chloride medium andalso to cathodic protection, is a source of hydrogen. In addition, the hydrogenation of the steelis accelerated by the presence of S-containing species such as Na

2S in the petroleum fractions or

H2S in the seawater. Inhibitors are used widely to protect the steel in oil pipelines. Several

studies have been conducted, but the mechanism of corrosion and hydrogen embrittlement ofsteel in aqueous environment with S-containing compounds is not clarified in details. The new experimental approach - Devanathan-Stachurski technique, combined withimpedance and transfer function analyser, has been used to study this problem. The experimetswere carried out with pure iron foils (50 Ìm thick, annealed) in synthetic seawater at differentinput potentials. The promoting effect of Na

2S as a layer on the cathodic surface, or as an

additive in the seawater was investigated. The changes in the hydrogen permeation rate areassociated with significant changes in electrochemical parameters, such as applied electrodepotential EE

11, charge transfer resistance RR

cctt, double layer capacitance CC and coefficient aa.

The transients, measured at different input potentials in the presence of Na2S layer show an

abrupt maximum at the beginning of polarization and lower steady state value of permeationrate as compared with that in absence of Na

2S layer. Such a behaviour could be associated with

some modification of the Fe surface. The enhanced hydrogen permeation at the beginning ofthe process is attributed to the corrosion as well as to H

2S, formed on the iron surface under

polarization. Afterwards, the corrosion products, formed during the process, play a role of abarrier for hydrogen permeation into steel. These suggestions are well confirmed by the SEMobservations of the iron surface in the presence of Na

2S layer.

KKeeyy wwoorrddss:: hydrogen embrittlement of steel, sea water, S-containing promoters

52

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 52

PP0077

EELLEECCTTRROOCCAATTAALLYYTTIICC AACCTTIIVVAATTIIOONN OOFF NNII EELLEECCTTRROODDEE FFOORR TTHHEE HHYYDDRROOGGEENN PPRROODDUUCCTTIIOONNBBYY EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF VV AANNDD CCOO SSPPEECCIIEESS

Marceta Kaninski M.P., Potkonjak N.I., Maksic A.D., Nikolic V.M.Vinca Institute of Nuclear Sciences, POB 522, 11000 Belgrade, Serbia

Hydrogen is considered to be the most promising candidate as a future energy carrier. One ofcommercial technologies for the electrolytic hydrogen production is alkaline water electrolysis.Electrode materials used in alkaline water electrolysis are mainly made form Ni or Ni-basedalloys due to their desirable mechanical and chemical stability in hot and alkaline solution.Much of research effort has been conducted on the enhancement of thr electrocatalytic activityof Ni electrodes. Electrocatalytic activity of Ni electrode for the hydrogen evolution reaction (HER) in alkalinesolution was compared to the electrode made from electrodeposition of Co and V-Co specieson Ni support electrode using ac and dc electrochemical techniques. Analysis of Tafelpolarization curves for the HER in alkaline solution reveal an increased electrocatalytic activity ofthe electrodeposited electrodes if compared to the Ni. This was additionally proved bymeasuring energy input (overpotential) for the given hydrogen production (fixed currentdensity) and vice versa. Electrochemical impedance spectroscopy was applied in order toinvestigate the obtained effect of electrodeposited electrodes.

KKeeyywwoorrddss:: HER, Electrodeposition, Electrocatalytic activity, Impedance spectroscopy

53

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 53

PP0088

EELLEECCTTRROODDEEIIOONNIIZZAATTIIOONN PPRROOCCEESSSSEESS FFOORR EENNVVIIRROONNMMEENNTTAALLLLYY--FFRRIIEENNDDLLYY PPLLAATTIINNGG

Bergmann M.E.H.1, Iourtchouk T.1, Rittel A.1 , Zuleeg H.2

1Anhalt University, FB 6/7, Koethen/Germany 2Präzisionsgalvanik Wolfen, Wolfen/Germany

Electrodeionisation (EDI) is a technology combining ion exchange and electrodialysis forcontinuous operation in loading/regeneration of ion exchangers. Firstly, it has been applied forthe production of ultra-pure water. This work presents results of a research project (supportedby BMBF/AIF KF 0067005KLF2) studying processes in precision plating industry. The work wasfocused on diluted solution treatment (rinse waters) containing chromate and sulphate ions inppm range (1... 300 ppm). Several materials of ion exchange resins and ion exchangemembranes were tested. The determination of resin conductivities, exchange capacities andtransport numbers was part of the studies. During electrodeionization, concentrations of ionsinside the resin and in the electrolytes, pH, current efficiencies of ion transport, cell current andvoltage were measured or calculated. The temperature of electrolytes was in the range between20ÆC and 40ÆC. As one result of the work, a 2-compartment technology was worked out withuseful conditions of application. In addition, other variants were suggested [1]. Typical values for electrolyte end concentrations were 1 ... 15 ppm and 5 ... 20 g[Cr/VI)] kg-1 forthe resins. In the concentrate, concentrations until 13 g[Cr] l-1 were reached. Fig. 1 shows resin concentration, cell voltage and current efficiency values for two ions passingthe ion exchange membrane. It demonstrates high selectivity for chromium transport throughthe membrane. However the process of separating chromium from the resin is even faster, thatindicates on problems of optimization.

FFiigg.. 11 Treatment in a 2-compartment EDI cell withstarting concentrations: Cr(VI) -270 ppm, SO

42- -55 ppm

Both from the results obtained and theoretical consideration, it was concluded that a time-phased operation mode is the most useful technical variant. In this case, many of EDIadvantages can be preserved.

References[1] Bergmann, H., Iourtchouk, T. European Patent DE AZ I0 206 016 688.4-44

KKeeyywwoorrddss:: electrodeionization, rinse waters, metal removal

54

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 54

PP0099

IINNFFLLUUEENNCCEE OOFF TTHHEE EELLEECCTTRROODDEEPPOOSSIITTIIOONN PPAARRAAMMEETTEERRSS OONN TTHHEE GGRRAAIINN SSIIZZEE OOFFNNAANNOOCCRRYYSSTTAALLLLIINNEE NNII CCOOAATTIINNGGSS

Rashidi A.M.1, 2 , Amadeh A.1

1. Metallurgy & Materials Engineering Faculty, Tehran University. Tehran, Iran.2. Mechanical Engineering Department, Engineering and Technical Faculty, Razi University,Kermanshah, Iran.

Nanocrystalline nickel was synthesized by direct current electrodeposition from a modified Watts-type bath. The effect of electrodeposition parameters include: bath temperature (45-65ÔC), currentdensity (10-300mA/cm2 ) and saccharin-containing (0-10g/l) on the average grain size ofcoatings were investigated. XRD, AFM and TEM were used to characterize the microstructureof nickel deposits. The results show that nanocrystalline nickel coatings with average grain sizebelow 50nm can be synthesized from modified Watts-type baths with saccharin-containingabove 3g/l and current density higher 25mA/cm2 . In current density higher 25mA/cm2, average grain size changed progressively from a fewmicrometers to nanometer range as saccharin concentration increased from 0 to 3 g/l and thenslightly changed. In baths with saccharin-containing above 3g/l, by increased of current densityfrom 10mA/cm2 to 25 mA/cm2, the average grain size sharply decreased and effect of currentdensity above 25 mA/cm2 is negligible. The average grain size of nanocrystalline Ni coatingsdcreased as bath temperature increased from 45ÔC to 55ÔC , and then increased. Nucleationand growth electrocrystallization kinetic model was used for description of results.

Select References:[1] S.C. Tjong and H. Chen, Materials Science and Engineering R 45 (2004) 1–88[2] A.M.El-Sherik and U. Erb, J. of Materials Science 30, (1995), 5743-5749[3] D. Pin-qiang, etal., Trans. Materi. & Heat Treatment, 25 ( 2004) .1283-1286[4] Imre Bakonyi, et al, Surface and Coatings Technology 78 (1996) 124 136[5] E.A. Pavlatou et al., Surface & Coatings Technology 201 (2007) 4571 - 4577[6] F. Ebrahimi and Z. Ahmed, Journal of Applied Electrochemistry 33 (2003.) 733–739,[7] T. UngaÂr, et al., J. Appl. Cryst. 34 (2001), 298-310[8] B.E. Warren and B.L. Averbach, J. Applied Physics, 23,(1952), 497-498[9]. K. I. Popov et al, Fundamental Aspects of Electrometallurgy, (2002), Kluwer Academic

Publishers..[10] A. Michev, Electrocrystallization, fundamentals of nucleation and growth, (2002), Boston,

Mass. luwer Academic.

KKeeyywwoorrddss:: Nanocrystalline,electrodeposition, bath temperature, current density, grain size.

55

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 55

PP1100

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EELLEECCTTRROOLLEESSSS CCOOPPPPEERR DDEEPPOOSSIITTIIOONN IINNTTOO PPOORROOUUSS SSIILLIICCOONN

Sam S.1, 2, Gabouze N.1, Djebbar S.2

1. UDTS, 02, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, 16200 Algiers, Algeria 2. USTHB, B.P. 32 El Alia, Bab Ezzouar, Algiers, Algeria

Porous silicon has stimulated an intense interest mainly since the discovery of itsphotoluminescence and electroluminescence [1]. These properties confer to the materialpotential applications which can contribute to the development of the silicon optoelectronictechnology [2]. However, porous silicon shows a very low electrical conductivity and a chemicalinstability due to its large internal surface. In the aim to improve the conductivity and stabilityof the porous silicon we proceeded to copper deposition into the porous layer using immersionplating method. This technique takes advantage of an interesting chemical property of poroussilicon, namely its ability to act as a moderate reducing agent [3]. Porous silicon can effectivelyreduce from solution any aqueous metal ion system with a positive standard reduction potentialwith respect to that of standard hydrogen electrode [4]. It is apparent that noble metals wouldbe ideally suited for this process. To check whether the metal entered the pores, the formedmaterial was studied in the basis of the Scanning Electron Microscopy (SEM) observations. Theresults indicated that copper was diffused through the Porous layer at a thickness of about 0,7mm. In addition, the samples were characterized using energy dispersive X-ray (EDX) and X-raydiffraction (XRD). Moreover, metal deposition mechanism and reactions involved during thedeposition process were studied by mean of Fourier Transform Infrared spectroscopy (FTIR)which revealed that metal reduction reaction is accompanied by the oxidation of the silicon toSiO

2. Finally, recorded luminescence measurements indicated an efficient PL of the metallized

porous silicon sample.

References[1] L. T. Canham, Appl. Phys. Lett. 57 (1990) 1046. [2] S. Belhousse, H. Cheraga, N. Gabouze, sensors and actuators chemical B in press.[3] L. A. Porter, H. C. Choi, A. E. Ribbe and J. M. Buriak, Nano Lett. 10 (2002)1067 [4] I. Coultard, S. Degen, Y. J. Zhu et T. K Sham, Can. J. Chem. 76 (1998) 1707.

KKeeyywwoorrddss:: Porous silicon, Copper, Immersion plating

56

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 56

PP1111

CCOOVVAALLEENNTT GGRRAAFFTTIINNGG OOFF GGLLYYCCIINNEE OONNTTOO TTHHEE PPOORROOUUSS SSIILLIICCOONN SSUURRFFAACCEE

Sam S.1, 3,Gouget-Laemmel A.C.2, Chazalviel J.N.2, Ozanam F.2, Gabouze N.1, Djebbar S.3

1. UDTS, 02, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, 16200 Algiers, Algeria 2. LPMC, CNRS-Ecole Polytechnique, Route de saclay, 91128 Palaisau, France3. USTHB, B.P. 32 El Alia, Bab Ezzouar, Algiers, Algeria

One of the most exciting applications of porous silicon is that of a sensing material for a wholerange of different analyte classes (bio - and chemical sensing). While initially thephotoluminescence emission was used as the transduction event, new approaches exploitingother properties of the nanocrystalline architecture of the material are especially promising,such as electrochemical strategy (potentiometric and capacitance). Advances in techniques ofchemical functionalization of porous silicon have increased the material stability and introducednew ways of organic molecules grafting to silicon via stable and covalent bonds. Hydrideterminated porous silicon surfaces are reactive enough to allow for a wide range of chemistry,thus a variety of functional groups can be anchored to the surface upon demand. On the otherhand, amino acids are known to be usable as recognition elements for electrochemical metalion sensing. In this work, we report a three-step route to Glycine and Glycine ester graftingonto the porous silicon surface. The first step consists in thermal hydrosilylation of undecylenicacid with hydrogen terminated porous silicon surface at 150ÆC. It yields an organic monolayercovalently attached to the surface through Si-C bonds. The reaction takes place at the terminalC=C double bond of the molecule and the acid terminal groups remain intact. In the secondstep, the carboxylic-acid terminated monolayer was transformed to a succinimidyl ester. Thisactivation was achieved using N-hydroxysuccinimide (NHS) and N-ethyl-N’-(3-dimethylaminopropyl) carbodiimide (EDC) as a coupling reagent. Finally, the amino acid wasattached to the monolayer, by reacting with the activated ester. The reaction efficiency at eachstage of the functionalization was confirmed using FTIR measurements. SIMS depth profilingshowed a consistent level of carbon incorporation throughout the porous silicon.Electrochemical behaviour of the Glycine modified porous silicon in the presence of copper ionswas studied by means of cyclic voltammetry measurements.

KKeeyywwoorrddss:: Porous silicon, Glycine, Functionalization

57

Programma_6 10/9/07 11:44 AM ™ÂÏ›‰· 57

PP1122

EELLEECCTTRROOCCHHEEMMIICCAALL SSYYNNTTHHEESSIISS OOFF NNAANNOOSSCCAALLEE OOXXIIDDEE FFIILLMMSS AANNDD NNAANNOOSSIISSEEDD OOXXIIDDEEPPOOWWDDEERRSS BBYY AANNOODDIICC OOXXIIDDAATTIIOONN OOFF MMEETTAALLSS IINN MMOOLLTTEENN SSAALLTTSS

Yolshina L.A.Institute of High-Temperature Electrochemistry, Urals Branch of Russian Academy of Sciences,Ekaterinburg, Russia

Oxidation of metals with high affinity for oxygen in the salt melts with oxygen-containinganions is one of the most effective methods of high-temperature synthesis of oxides. It wascarried out numerous investigations on passivation of metallic surfaces by oxide coatings whichwere formed because direct interaction of metal with oxide-containing ions in the salt moltenbath. Last years oxide synthesis science develops in two ways: formation of ultra-thin layers andultra-disperse powders. The most interest is connected with the synthesis of thin layers andnano-powders of valve metals oxide such as Al

2O

3, TiO

2, Ta

2O

5and zirconium dioxide ZrO

2.

Such oxide layers obtain high dielectric properties and can be used in supercapacitors, fuel cellsand in computer deviceAnodic oxidation of metals such as aluminum, titanium, zirconium and tantalum in moltenchloride-nitrate bath at temperatures more than 800 K leads to formation on metallic surfacesdense defensive oxide films with good adhesion. The thickness of such covering is varying in thelimits 5 nm to 20 Ìm.Valve metals and zirconium have the great affinity for oxygen so even under currentlessexposure of mentioned above metals with molten eutectic mixture CsCl-NaCl with NaNO

3

oxide coverings may be obtained on the metallic surfaces. The values of metals open-circuitpotentials have been stated more quickly with the rise of temperature and with the increasingof nitrate content in the melt. The polarization curves look like passivation ones. Theycharacterized with prolonged passivation plateau and low values of passivation currentdensities. The build-up of oxide film continues to increase during all time of anodic polarization. As to chemical analysis data no escape of metallic ions of these metals was observed. So all themetals corroded are bonded into very stable oxides. If nitrate content is more than some limitvalue for each metal a lot of ultra-micro-dispersed oxide powders accumulates in saltelectrolyte. So as all salts and products of reaction are soluble in water one can obtain pureoxide powders after water solution and drying. Average size of oxide particles is 70-200 nm.X-rays analysis data shows that both dense coating which was formed on zirconium surface andultra-disperse powder which was filtered from the dissolved in pure water melt were monoclinicform of ZrO

2. Anodic oxidation of tantalum leads to formation of ‚-Ta

2O

5under 870 K and at

rising of oxidation temperature to 970 K allows to obtain Na2TaO

3powders. Because tantalum

pentoxide has mixed oxygen-ionic permeability it is possible to make under polarizationthrough tantalum oxidation forming pure Ta

2O

5 pellets. So as the increasing of anodic oxidation

temperature of aluminum from 790 to 900 K changes oxidation products from Al2O

3to cesium

aluminate CsAlO2. Oxidation of titanium in molten chloride-nitrate bath leads to full interaction

of titanium with the TiO2

nano-powders formation .Under varying temperature, anodic current density, exposure time and nitrate content, it ispossible to obtain powders with different particle sizes. This method permits to obtain pureoxide powders from either metal powder or metal plate. Even metallic slam can be used toform pure oxide powders.So oxidation of metals which have got great affinity for oxygen in chloride - nitrate electrolyteis very effective method of ultra-thin oxide films and nano-powders production.

58

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PP1133

SSYYNNTTHHEESSIISS AANNDD CCHHAARRAACCTTEERRIISSAATTIIOONN OOFF CCAARRBBOONN SSUUPPPPOORRTTEEDD MMOOOOXX--PPTT AANNDD TTIIOOXX--PPTTCCAATTAALLYYSSTTSS FFOORR OOXXYYGGEENN RREEDDUUCCTTIIOONN RREEAACCTTIIOONN

N. R. Elezovic1, B. Babic2, Lj. M. Vracar3, N. V. Krstajic3

1 Center for Multidisciplinary Studies of the Belgrade University, Belgrade, Serbia. 2 Vin_a Institute of Nuclear Sciences, Belgrade, Serbia. 3 Faculty of Technology and Metallurgy, University of Belgrade, Belgrade, Serbia.

The oxygen reduction reaction (ORR) was studied at carbon supported MoOx-Pt and TiOx-Ptnanocatalysts in 0.5 mol dm-3 HClO

4solution, at 250C. The MoOx-Pt/C and TiOx-Pt catalysts

were prepared by the polyole method combined by MoOx or TiOx post-deposition. Homemade catalysts were characterized by TEM and EDAX techniques. It was found that catalystnanoparticles are homogenously distributed over carbon support with a mean particle sizeabout 2.48 nm. The quite similar distribution and particle size was previously obtained for Pt/Ccatalyst. Results confirmed that MoOx and TiOx post-deposition does not lead to a significantlygrowth of the Pt nanoparticles.The ORR kinetics and mechanism were investigated by cyclic voltammetry and linear sweepvoltammetry at the rotating disc electrode. These results showed the existence of two E-log jregions, usually referred to polycrystalline Pt in acid solution. It was proposed that the mainpath in the ORR mechanism on MoOx-Pt/C and TiOx-Pt/C catalysts was the direct four electronprocess with the transfer of the first electron as the rate determining step. The increase incatalytic activity for ORR on MoOx-Pt/C and TiOx-Pt/C catalysts, in comparison with Pt/Ccatalyst, was explained by synergetic effects due to the formation of the interface between theplatinum and oxide materials and by spill over due to the surface diffusion of intermediates.

KKeeyywwoorrddss:: oxygen reduction reaction, MoOx-Pt/C catalyst, nanoparticles, acid solution

59

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PP1144

IINNHHIIBBIITTEEDD GGRROOWWTTHH OOFF EELLEECCTTRROOFFOORRMMEEDD NNAANNOOCCRRYYSSTTAALLLLIINNEE NNIICCKKEELL

Feizmandian M.1, Karimzadeh F., Raeissi K., Golozar M.A.1. Department of materials science and engineering Isfahan University of Technology,Isfahan, Iran

Nanocrystalline materials have received considerable attention as a result of their uniquephysical, chemical and mechanical properties. In this research nanocrystalline nickelelectrodeposits were fabricated at current density of 1 A/dm2 using sulfamate-based electrolyte.Electrodeposition was carried out for six different periods (15, 30, 60, 120, 240, 480 second) toinvestigate the effect of inhibitor particles in electrocrystallization steps (nucleation andgrowth). The crystallite size of the deposits was evaluated by XRD technique using Shererequation. Texture parameter calculations showed that the initial texture of deposits is <111>which have a lower work of formation in Fcc metals. Also with increasing the electrodepositiontime, the concentration of inhibitor particles increases near the cathode surface andconsequently causes change in deposits texture by inhibiting the growth of (111) plane.Calculated texture parameter of electroformed nickel at maximum electroplating time (480sec.) showed that inhibitor particles have a minimum effect on the growth of (200) plane whichis related to the lower adsorption tendency of this plane for this particles.

[1] D.Y.Li, J.A. Szpunar, Journal of Material Science, 32 (1997) 5513-5524[2] V.M.Kozlov, l. Peraldo Bicelli, Materials Chemistry and Physics, 77 (2002) 289-293[3] C.Leger, L. Servant, Physica A, 263 (1999) 305-314[4] Benedetto Bozzini, Materials Chemistry and Physics, 66 (2000) 278-285[5] V.Fleury, J.N. Chazalviel, M. Rosso, Physical Review Letters, 68 (1992) 2492-2495

KKeeyywwoorrddss: initial texture, Shere equation, sulfamate, electrocrystallization

60

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PP1155

MMIICCRROOSSTTRRUUCCTTUURREE FFAACCTTOORR OOFF HHOOTT--DDIIPP GGAALLVVAANNIIZZEEDD SSTTEEEELL SSHHEEEETT AANNDD IITTSS EEFFFFEECCTTSS OONNCCOORRRROOSSIIOONN PPEERRFFOORRMMAANNCCEE

Lukjanichev D. A., Kazakevich A. V.Moscow Institute of Steel and Alloys (Technical University), 4 Leninsky prospekt,119049 Moscow, Russia

Galvanized steel is a wide spread constructive material. It has found its application as roofmaterial, as a part of facade systems and may be used for outdoor design. Hot-dip galvanizedsteel sheets are used extensively in building industry. This study presents relation between structural characterization of galvanized steel and itscorrosion behavior. It has been carried out corrosion study of rolled galvanized sheet of fewsteel producers. These results were compared with corrosion data of pure zinc and ternary zinc-based alloy (Zn-0,18Cu-0,08Ti).Most corrosion studies consist of tests in humidity chamber, salt spray tests or immersion testsin salt solution and corrosion rate characterize with such values as red rust appearance time.Such data is not enough to make any suggest about predictable service life of galvanized steeleven to classify samples. Therefore this work represents close study of corrosion performance and establishes parameterswhich influence corrosion behavior of Zn coatings. In this paper corrosion resistance ofgalvanized steel was studied in relation to the coating topography, which is the result of theorientation of the solidification structure. The goal of present research was to identify theinfluence of the spangle type and size on corrosion-resistant properties of post-treatedgalvanized samples.The samples were examined by using Scanning Electron Microscopy (SEM) and Second IonMass Spectroscopy (SIMS). This results show three morphologies on the galvanized steelsamples. Good correlation between corrosion behavior and microstructure allow us to linkcorrosion rate of all groups of galvanized steel with its surface morphologies. This suggests wascorroborate with electrochemical tests.

References: [1] A.K. Singh, G. Jha, S. Chakrabarti, Corrosion, Vol. 59, No 2, 189-196.[2] P.R. Sere. et al., Surface and Coatings Technology 122 (1999) 143–149[3] A.R. Marder, Progress in Materials Science 45 (2000) 191-271[4] Surface and Coatings Technology 122 (1999) 18–20[5] C. Maeda, J. Shimomura, H. Fujisawa, M. Konishi, Scripta Materialia, Vol. 35,No 3, 333-338.[6] R. Ramanauskas . R. Jusv kv enas . A. Kalinicv enko, L. F. Garfias-Mesias, J Solid State

Eletrochem (2004) 8: 416 - 421

KKEEYY WWOORRDDSS:: Corrosion resistance, galvanized steel, immersion test, spangle formation

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PP1166

SSYYNNTTHHEESSIISS OOFF CCAARRBBOONN NNAANNOOTTUUBBEESS WWIITTHH CCAATTAALLYYTTIICC PPYYRROOLLYYSSIISS OOFF SSOOLLIIDD NNII((DDMMGG))22

Vlasopoulos A.D., Strikos S., Pouleros K., Kordatos K., Kasselouri-Rigopoulou V.School of Chemical Engineering, National Technical University of Athens, Zografou, Greece,

Chemical vapour deposition (CVD) is a popular method in the semi-conductor industry. Recently,it has been applied by many research groups in order to synthesize carbon nanotubes [1-2] fromcommon raw materials, mainly due to the scalability and versatility of the method. Although itsmain principle remains the same, several techniques have been developed, varying according tothe chemical substances chosen as carbon sources and the catalyst, which affects the reactionmechanism as well as other parameters such as the quality and morphology of the resultingproducts. Among those techniques, catalytic pyrolysis of solid compounds is included [3].In the present study, we have examined whether a common organometallic substance,Ni(C

4H

7N

2O

2)

2 (Ni(dmg)

2) can function as precursor for the formation of carbon nanotubes. The

Ni(DMG)2 compound has a very low solubility, and thus it was pyrolysed in solid state in a two

zone horizontal cylindrical oven with Ar as the carrier gas. The deposited materials which were produced were analyzed by several characterizationtechniques such as scanning electron microscopy (SEM), energy dispersive X-ray analysis(EDAX), X-ray diffraction (XRD), thermogravimetric analysis (TGA) and Raman scattering, whichrevealed the formation of multi walled carbon nanotubes (MWNTs) surrounded by a varyingquantity of byproducts (depending mainly on the reaction temperature) such as amorphouscarbon and metallic particles. We then determined the optimum production conditions of thenanotube material. The results show that low flow of the carrier gas and temperatures in therange of 900 - 950 0C are the best conditions for the production of good quality material. While CVD offers less control over the formation of the nanotubes when compared to ArcDischarge[4], Laser Ablation [4] or other methods, the products demonstrate exceptionally highdensity and purity, in addition to CVD being the most economical way of producing massMWNTs.

References[1] S. Iijima, Nature 354 (1991) 56.[2] S. Iijima, T. Ichihashi, Nature 363 (1993) 603.[3] M. Terrones, N. Grobert, J. Olivares, J. P. Zhang, H. Terrones, K. Kordatos, W. K. Hsu, J. P.

Hare, P. D. Townsend, K. Prassides, A. K. Cheetham, H. W. Kroto and D. R. M. Walton,Nature 388 (1997) 52.

[4] A.P. Moravsky, E.M. Wexler, R.O. Loutfy, Growth of Carbon Nanotubes by Arc Dischargeand Laser Ablation, CRC Press, Boca Raton, (2005).

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PP1177

CCOONNVVEENNTTIIOONNAALL AANNDD MMIICCRROO--EENNCCAAPPSSUULLAATTEEDD DDIISSPPEERRSSEE IINNKKSS FFOORR DDIIGGIITTAALL TTEEXXTTIILLEEPPRRIINNTTIINNGG

Kosolia Ch., Tsatsaroni E.Aristotle University of Thessaloniki, School of Chemistry, Department of Organic ChemicalTechnology, Thessaloniki, Greece

New series of disperse inks for textile digital printing were prepared using distilled water andone/ or mixture of short chain alcohols (propanol-2, isoboutanol) and poly-ethers (2-n-butoxyethanol, dipropylenoglycol monomethylether) as co-solvent. Critical properties weremeasured such as surface tension, conductivity, pH, viscosity; molecular size distribution andthe optimal inks were selected. [1, 2, 3, 6]Test printing on PE (polyester) fabric took place for these and wash, light and crock-meterfastness test results were estimated. [8]Similar series of disperse inks were prepared by microencapsulating the molecules of the dyeusing conventional and gemini surfactants, the above co-solvents and in order to enhance theencapsulation process chlorinated hydrocarbon solvents as well which were regenerated afterthe procedure. [4,5,7]Moreover same properties of the micro encapsulated inks and of the printed fabrics as wellwere measured an the results indicate how the micro encapsulation of the ink alters theproperties of the ink both in bulk and as printing result.

References[1] S.Daplyn, L. Lin, Pigment and Resin Technology, 32, (2003), p307 [2] Ged. Hastie, WO Patent 2005113692, (2005)[3] Y. Kawashima, H. Morimoto, T. Takagi, and T. Abe, International Conference on Digital

Printing Technologies (2003), p630[4] S. Magdassi, M. Ben Moshe, Langmuir, 19, (2003), p939[5] S. Magdassi, M. Ben-Moshe, L. Berenstein, and A. Zaban, Journal of Imaging Science and

Technology, 47, (2003), p357[6] Umada Akira, Koji Azuma, Tanaka Nobushige WO Pantent 2006046759, (2006)[7] André J. P.Van Zyl, Deon d Wet-Roos, Ronald D. Sanderson, and Bert. Klumperman,

European Polymer Journal, 40, (2004), p2717[8] H.R. Kang, Journal of Imaging Science and Technology, 35, (1991), p189

KKeeyywwoorrddss:: disperse inks, digital printing, micro encapsulation

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PP1188

EEFFFFEECCTT OOFF SSIICC PPAARRTTIICCLLEE SSIIZZEE OONN EELLEECCTTRROODDEEPPOOSSIITTIIOONN BBEEHHAAVVIIOORR OOFF NNII--SSIICC CCOOMMPPOOSSIITTEE

Feizmandian M.1, Golozar M.A.1, Karimzadeh F.1

1. Department of materials science and engineering Isfahan University of Technology, Isfahan, Iran

Adsorption of particles at the surface of a solid body submerged in suspension is a veryimportant phenomenon which became the basis for technology of synthesis of particulatereinforced metal matrix composites (MMC). In this study, nickel silicon carbide composite wasobtained by electrochemical deposition. Nickel sulfamate plating bath containing siliconcarbide particles with two different sizes (100 and 300nm) were used. Electrochemicalimpedance spectroscopy (EIS) was performed in the presence of silicon carbide particles todistinguish the effects of semi conductive particle size on the mechanism of nickel deposition.Single semi circle was observed in the impedance Nyquist plots which showed one electrontransfer reaction to occur during the reduction. It could be seen that charge transfer resistancein the presence of 100nm silicon carbide particle is smaller. On the other hand decrease insilicon carbide particle size enhances the ionic transport to the cathode surface.

[1] F. Hu, K.C. Chan, Materials Chemistry and Physics, Article in press, 2005[2] Sh. Chang Wang, W. Cheng J. Wei, Materials Chemistry and Physics, 78 (2003), 574-580[3] L.Benea, P.L Bonora, A. Borello, S. Martelli, Solid State Ionics, 151 (2002), 89-95[4] R.P. Socha, P. Nowak, K. Laajalehto, J. Vayrynen, Colloids and Surfaces A: Physicochem.

Eng. Aspects 235 (2004), 45-55

KKeeyywwoorrddss:: sulfamate, EIS, polarization resistance, EDL

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PP1199

EELLEECCRROODDEEPPOOSSIITTIIOONN OOFF CCOOFFEECCUU AALLLLOOYYSS OONN NN--TTYYPPEE SSIILLIICCOONN..

G.Fortas, S. Sam, N Gabouze.U.D.T.S, 2Bd Frantz-Fanon, B.P .339 Algiers, Algeria

During the last years, considerable progress was devoted to the development of magnetic thinlayers for applications in high-density magnetic recording, magnetic head, magnetoresistivemicrosystems integers….CoFeCu alloy was selected for its soft magnetic properties. In this work, magnetic layers ofCoFeCu were carried out on n-type silicon by electrodeposition. Electrochemical study of thedeposit process allowed the determination of the operating parameters which influence thecomposition alloy, thickness and uniformity of the layer. The CoFeCu deposits werecharacterized by scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), X-rays diffraction of (XRD), Fourier transform infrared spectroscopy (FTIR) and magneticmeasurements. The results show that the morphology and composition of CoFeCu layerdepend on several parameters (solution composition, pH….). Moreover, it has been showsthat the addition of sodium acetate (complexion agent) in the bath leads to the formation ofhighly compacted and smooth CoFeCu films with a good adherence to the substrate.

KKeeyywwoorrddss:: Electrodeposition, X ray diffraction, Electrochemical study.

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PP2200

EEFFFFEECCTT OOFF WWCC PPAARRTTIICCLLEESS EEMMBBEEDDDDIINNGG OONN TTHHEE TTRRIIBBOOLLOOGGIICCAALL BBEEHHAAVVIIOORR OOFF NNII MMAATTRRIIXXCCOOMMPPOOSSIITTEE EELLEECCTTRROOCCOOAATTIINNGGSS

Pavlatou E.A.(1), Asimidis P.(2), Spyrellis N.(1)

(1)Laboratory of General Chemistry, School of Chemical Engineering, National TechnicalUniversity of Athens, Zografos Campus, Athens , GREECE(2)CERECO S.A., Chalkida , GREECE

The electrochemical deposition of finely dispersed particles in a metallic matrix has lead to anew generation of composites, a process that provides the possibility to produce compositecoatings with different combination of properties, such as improved wear and corrosionresistance relative to the metal matrix, by changing properly the electroplating parameters.In this study Ni matrix composite electrocoatings containing WC particles with a mean size of100 and 200 nm were produced from an additive-free nickel Watts’ type bath.Electrodeposition of Ni/WC composites was carried out on a rotating disk electrode under bothdirect and pulse current conditions, in order to study the effect of the electroplatingparameters, such as type of current, rotation velocity of the cathode and duty cycle of theimposed pulse on the tribological properties of Ni/WC composite coatings.The crystallographic orientation of nickel matrix, the distribution and the percentage of theembedded particles were examined as well as, the structure and the surface morphology of theproduced composite coatings. In order to study the tribological behaviour of the compositesball-on-disc wear tests were performed and the coefficient of friction as well as, the volumetricwear factor of the composite coatings was estimated.The tribological properties of the composite Ni/WC electrocoatings were shown to depend onthe type of current, the codeposition percentange of particles and the microstructuralmodification induced by codepositing WC particles. Specifically, the best wear resistance isobserved for composite coatings prepared at low duty cycles and high rotation velocity ofcathode containing reduced size of embedded WC particles. Furthermore, it has been revealedthat in comparison with pure nickel the incorporation of WC particles in Ni matrix improvessignificantly the wear behaviour of composite coatings.

KKeeyywwoorrddss:: Nickel composite electrocoatings, tungsten carbide, pulse plating, wear resistance.

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PP2211

WWEEAARR RREESSIISSTTAANNCCEE AANNDD FFRRIICCTTIIOONN PPRROOPPEERRTTIIEESS OOFF TTHHIINN SSOOFFTT FFIILLMMSS

Amell A.a, Díez J.A.b, Garc›a E.b, Gastón B.b, Müller C.M.a, Sarret M.a

aElectrodep. Dpt. Química Física. University of Barcelona. Martí i Franquès, Barcelona. Spain.bCIDETEC. Paseo Miramón,-Donostia, Spain.

The development of new coatings with improved tribological behaviour involves the use ofexperimental techniques to characterize coefficient of friction (COF) and wear resistance in asimple, quick and reproducible way. Moreover, these techniques have to be easily introduced inthe routine control of the laboratory process.There are so many methods to characterize the tribological properties but the most popular ofthem are approached to bulk materials. When coated materials are tested, thick coatings can betreated as bulk materials but thin coatings will often be penetrated. In this work, there are twofactors that determine the characterization: the softness of the coatings and the small samplesize due to lab scale working.During the last decade, novel experimental techniques are developed to check hard thincoatings and separate the influence of the substrate from the intrinsic coating properties. Manyof them are the micro or nanoscaled version of the traditional ones. Other methods find newuses for equipments initially intended to other uses, e.g. the crater grinder test [1]. Taking into account the availability and the easiness to work in a routine way, a commercialdimple grinder, an atomic force microscopy (AFM), a home-made ball-on-disk microscaledtribometer and a pin-on-disk and a scratch tester in the macro range are checked to analyzecoatings from different nature: metal matrix composites and other soft materials. The hardnessof the samples could vary between 10 to 1100 HV, the thickness from 500 nm to 50Ìm, theroughness from 10 to 1300 nm and the maximum sample size is about 1x1 cm2.

References[1] A. Kassman, S. Jacobson, L. Erickson, P. Hedenqvist and M. Olsson; Surface and Coatings

Technology, 5500 (1991) 75-84.

KKeeyywwoorrddss:: wear resistance, coefficient of friction, tribology, thin soft coatings, microscaled testing

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PP2222

CCOOMMPPAARRIISSOONN OOFF GGOOLLDD NNAANNOOPPIILLLLAARR EELLEECCTTRROODDEE AANNDD PPLLAATTIINNUUMM NNAANNOOPPIILLLLAARR EELLEECCTTRROODDEEFFOORR SSEEPPEERRAATTIIOONN OOFF DDOOPPAAMMIINNEE AANNDD AASSCCOORRBBIICC AACCIIDD

Hyo Jung Kim, Chun Mee Shin, Hun-Gi HongDept. of Chemistry Education, Seoul National University, san 56-1 Sillim-Dong, Gwanak-Gu, Seoul

We have fabricated platinum and gold nanopillar electrode by electrodeposition onto amine-terminated self-assembled monolayer (SAM) modified gold thin film using AAO nanoporousmembrane as a template. These modified electrodes show an excellent electro-catalytic effect or selectivity for theresponse of DA in the presence of AA. Pt nanopillar electrode especially exhibits an attractiveability to determine DA and AA selectively according to roughness factor (RF). The nano Ptelectrode resolved the mixed voltammetric signals into two well-defined voltammetric peaks atthe only RF 6 nano-Pt electrode. In the case of Pt nanopillar electrode which has higher surfacearea over 10 of rouhgness factor, it shows one broad peak like bare Pt electrode. Consequently,Pt electrode has interesting ability that is sensitive and selective detection of dopamine in thepresence of ascorbic acid according to roughness factor.In contrast to Pt nanopillar electrode, Au nanopillar electrode always shows well-seperatedvoltammetric peaks for AA and DA independent of roughness factor (RF).

68

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PP2233

FFOORRMMAATTIIOONN AANNDD CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF PPOOLLYYPPYYRRRROOLLEE -- PPHHOOSSPPHHOOMMOOLLYYBBDDAATTEECCOOMMPPOOSSIITTEE CCOOAATTIINNGG LLAAYYEERRSS OONNTTOO AALL SSUUBBSSTTRRAATTEESS

Anicai L.*, Pertache A.*, Buda M.a, Visan T.a

PETROMSERVICE SA, Division of Ecological Technologies Development, Bucharest, Romania(a) POLITEHNICA University Bucharest, Department of Applied Physical Chemistry andElectrochemistry, Calea Grivitei 132, Bucharest, Romania

The present paper deals with some experimental results regarding electrodeposition ofpolypyrrole films doped with phosphomolybdate anions onto Al substrates involving an initialanodizing in nitric acid electrolyte. From early studies this stage proved to offer a very goodadherence of the further layer on Al surfaces. The phosphomolybdate doped polypyrrole films have been formed both galvanostatically andinvolving cyclic voltammetry, in aqueous solutions containing H

3[PMo

12O

40] - 12.785 g/L and

0.18 M pyrrole. In several experiments 0.5 M Tiron (4,5-dihydroxy-1,3-benzenedisulfonic aciddisodium salt) has been added.The films exhibit a very good adherence on the metallic substrate, with a uniform black colourand show a classical cauliflower morphology, more dense and ordered in the presence of Tiron,according to SEM and AFM investigations. EDX analysis revealed the presence of doping anionwithin polypyrrole layer. Also EDX measurements suggest that the film incorporates a 1:9 ratioof phosphomolybdate anion to Ppy units. When both Tiron and phosphomolybdate anions arepresent in the solution, phosphomolybdate and other related anions are preferentiallyincorporated within the layer. The presence of Tiron lowers significantly the deposition potential of polypyrrole, acting asmediator, that is in accordance with other literature reports.Some preliminary corrosion tests involving potentiodynamic measurements and EIS spectraduring continuous immersion in NaCl 0.5 M solution are also discussed.

KKeeyywwoorrddss:: polypyrrole coating, phosphomolybdate ion, composite, Al substrate,electrodeposition

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PP2244

FFEEAASSIIBBIILLIITTYY SSTTUUDDYY FFOORR AA DDIIAAGGNNOOSSTTIICC CCOORRRROOSSIIOONN SSEENNSSOORR SSYYSSTTEEMM

Khedkar B., Roy S., Thennadil S.School of Chemical Engineering and Advanced Materials, Merz Court, Newcastle University,Newcastle upon Tyne, UK, NE1 7RU

Reinforced concrete is one of the most important building materials. Due to its prevalence inthe built environment, an in-depth knowledge of the safety and strength of such structures is ofvital importance. Corrosion of rebars in concrete is a major problem in the maintenance of thereinforced cement concrete structures. Since pitting corrosion causes local failure, this hasserious implications for the safety as well as the lifetime of the reinforced concrete structures.Also economically the repair of the corrosion damaged structure is a significant undertaking. Inmany situations, however, it is more important to determine if corrosion may occur. Forexample, owners of smaller structures, who can not afford asset management systems, need toknow if their structure is likely to suffer corrosion damage, and if so, at which location. Oncethis is known, they can target corrosion management procedures on the area. The current investigation was proposed to study the feasibility of developing such an advancewarning system. The corrosion sensor system would analyse the chemical environment inconcrete as well as its effect on the state of steel rebar within this environment. The systemwould provide information on the aggressiveness of the concrete surrounding the rebar, as wellas provide a method to assess whether the environment would be likely to damage the passivefilm over a reasonable length of time.In order to achieve this, experiments were carried out to establish a reproducible and stabledata set using sensors to measure chloride ion concentration and pH within the concretemixture with the steel rebars. The interpretation of the noise data was based on the theory thatelectrochemical noise data for a weakened passive film would be different from that of a stableoxide film. Noise data was analyzed in time and frequency domain to detect any trends inpotential transients and possible correlation with the occurrence of corrosion events.

References[1] K. Hladky, J. Dawson, Corrosion Science 22 (1982) 231[2] D. Eden, Proc. Corrosion 98, Houston, (1998)386.[3] A. Legat, V. Dolecïek, Journal of the Electrochemical Society 142 (1995) 1851[4] U. Bertocci, F. Huet, Corrosion 51 (1995) 131.

KKeeyywwoorrddss:: Reinforced cement concrete, electrochemical noise, localised corrosion,time-frequency analysis, Fast Fourier Transforms.

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PP2255

TTHHEE CCOOBBAALLTT--MMOOLLYYBBDDEENNUUMM ((CCOO--MMOO)) AALLLLOOYY EELLEECCTTRROODDEEPPOOSSIITTEEDD OONN NN--TTYYPPEE SSIILLIICCOONN

Fekih Z.(1), Ghellai N.(1), Fortas G.(2), Chiboub N.(2), Sam S.(2), Gabouze N.(2) , Chabanne-sari N.E.(1)

(1). UNITE DE RECHERCHE DES MATERIAUX ET DES ENERGIES RENOUVELABLES (U.R.M.E.R)Université Abou –Baker Belkaid ,ALGERIE(2). U.D.T.S, 2Bd Frantz-Fanon, 7merveilles Algiers, Algeria

Thin films of metal alloys (Co-Mo) have been electrodeposited on silicon (Si) surface. The effects of two different additives (H

3BO

3 and Na

2CO

3) and pH solution on the

electrochemically deposited films (morphology, stochiometry…) have been studied.Meanwhile the properties of these later were characterized by different techniques such as theX-rays diffraction (XRD), scanning electron microscopy (SEM), Fourier Transform Infra-Redspectroscopy (FT-IR) and Energy Dispersive X-ray Spectroscopy (EDS). The results show that themorphology and film composition depend on both pH solution and additives. Finally, the electrodeposition was shown as an efficient method to obtain a homogeneousdeposit of the Co-Mo alloy on Si.

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PP2266

AA PPRREEDDIICCTTIIVVEE MMOODDEELL FFOORR MMIICC ((MMIICCRROOBBIIAALL IINNDDUUCCEEDD CCOORRRROOSSIIOONN)) IINN SSUUBB--SSEEAAPPRROODDUUCCTTIIOONN PPIIPPEELLIINNEESS

Smith P., Roy S.School of Chemical Engineering and Advanced Materials Merz Court, University of Newcastleupon Tyne, Newcastle upon Tyne, NE1 7RU.

Corrosion is the natural process of metal destruction by chemical or electrochemical reactionwith its environment, producing metals in their oxide forms. Corrosion is recognised as a majorissue in many of the worlds industries. It can compromise the integrity of building structuresand products, affect the safety of people and endanger the environment due to chemicalrelease by the failure of components. Nationally funded bodies, including The NationalAssociation of Corrosion Engineers (NACE) have been set up to distribute corrosion knowledgethroughout the globe. Microbial Induced Corrosion (MIC) is a very aggressive form of corrosion with many proposedmechanisms but as yet there is no internationally agreed mechanism for its action. Rapid pittingattack can quickly lead to equipment failure, which is a particular problem in the petrochemicalindustry where the effects of MIC are prevalent. MIC is a highly complex process but it isbelieved that Sulphate Reducing Bacteria (SRB) perform a major role [1]. SRB present inanaerobic layers of biofilms at the metal surface, can be detected at corrosion sites in the fieldby the presence of sulphide films. Many of the models used to predict MIC offer only anindication of the extent of MIC and are often unpredictable [2] as they do not often includeknowledge of SRB activity or biofilm growth rates. The notion of this investigation is to develop a physical model for the prediction of pitting ratesassociated with MIC in subsea pipelines. The model is based on heterogeneous reactions at theelectrode surface, a species concentration profile described by the Nernst diffusion layer model,and overall anodic and cathodic current densities balancing each other. In addition, the modelwill include the influence of biofilms on corrosion via Monod kinetics releasing additionalcorrosive materials at the metal surface. The effects of each corrosion component are also beingmeasured experimentally using potentiodynamic polarisation techniques, a glass corrosion celland a three electrode potentiostat system. A reaction cell is being employed for the assessmentof the influence of synthetic hydrogen sulphide on corrosion. At a later stage a flow reactorsystem will be employed to simulate MIC observed in pipelines in the field due to biofilmgeneration. The results of the model will then be validated against data collected in the field.

1. Kuhr, V.W. and V.D. Flugt, De grafiteering van gietijzer als electrbiochemisch process inanaerobe gronden. Water (den Haad), 1934. 1188: p. 147-165.

2. Pots, B.F., Improvements on De Waard - Milliams Corrosion prediction and applicationsto corrosion management. Corrosion, 2002 (no. 02235).

AAcckknnoowwlleeddggeemmeennttssThe authors would like to thank the EPSRC for their support, Chevron and CommercialMicrobiology Ltd for their very generous sponsorship and invaluable technical input to thestudy.

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PP2277

DDIISSCCLLOOSSUURREE OOFF TTHHEE MMAAIINN FFAACCTTOORRSS DDEETTEERRMMIINNIINNGG TTHHEE HHEEXXAAGGOONNAALLLLYY OORRDDEERREEDDNNAANNOOSSTTRRUUCCTTUURREE OOFF PPOORROOUUSS AANNOODDIICC AALLUUMMIINNAA FFIILLMMSS

Patermarakis G., Michali Ch.School of Chemical Engineering, Department of Materials Science and Engineering, NationalTechnical University, Athens, Greece

Due to the peculiar mechanical, electrical, adsorptive, reactive etc properties of porous anodicalumina film coatings allied with their hexagonally ordered nanoporous structure andamorphous or nanocrystalline nature, these films find numerous applications such asimprovement of mechanical properties of Al surface, as anticorrosion and decorating coatingsand membranes, magnetic memories, nuclear reactors, rechargeable batteries, templates forsynthesising emitters, fuels cells, ordered forms for electroplating metal nanowires andtemplates for C or TiO

2nanotubes, nanoparticle sized ultra active catalysts or supports, etc. The

structure of films, determined by SEM, TEM, AFM and many other methods of solid stateanalysis, is defined by the surface density of pores, base diameter, shape and ordering degree ofpores. Despite the extensive work on the nanostructure and nature / composition of these filmsthe mechanisms by which the characteristic features of nanostructure are determined by the Alanodising conditions, electrolyte kind and related parameters still remain unknown. In this worka first integrated theory for the effect of the main physicochemical factors determining theirstructure is presented. This theory has been derived on the basis of experimental results relevantto film mass, thickness and film thickness growth rate, at various times, current densities,temperatures and in various electrolytes, SEM of both the film surface and imprints of scallopedbarrier layer on Al metal, etc, and the application of a holistic kinetic model [1] capable ofinterrelate macroscopic structural with ordered nanostructure characteristics and elementaryatomic – ionic scale kinetic and thermodynamic parameters. It has been shown that the pore /cell surface density, of the order of 1010 and above, is primarily defined by the Al3+ transportnumber within the solid oxide of barrier layer below the porous layer and the concentration ofelectrolyte anions in anodising electrolyte solution [2]. It rises with increasing temperature,decreasing current density and increasing concentration of electrolyte anions and secondarily itis affected by the kind of anions, while the role of H+ or pH is secondary or complementarythrough the complex physicochemical processes following the solvation of Al3+ in theoxide/electrolyte interface where charge exchange takes place. On the other hand, the porebase diameter and thickness of barrier layer in the steady state are determined by kinetic,thermodynamic and field strength parameters, embodied in the holistic kinetic model, affectedthe amount of incorporated electrolyte anions. It seems that the accurate design of desiredordered nanostructure in large ranges of pore surface density, pore diameter and relatedproperties is now possible in the light of this theory, with evident significance for the numerousapplications of porous anodic alumina film coatings.

References[1] G. Patermarakis, J. Chandrinos, K. Masavetas, J. Solid State Electrochem. 11 (2007) 1191.[2] G. Patermarakis, K. Moussoutzanis and J. Chandrinos, Appl. Catal. A: General 180 (1999) 345

KKeeyywwoorrddss:: Porous anodic alumina films; ordered nanostructure; determining factors.

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PP2288

EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF IINN--SSNN AALLLLOOYYSS FFRROOMM CCIITTRRAATTEE SSOOLLUUTTIIOONNSS FFOORR LLEEAADD--FFRREEEESSOOLLDDEERRIINNGG

Ozga P.Institute of Metallurgy and Materials Science of the Polish Academy of Sciences,30-059 Kraków, Poland

In-Sn alloys are especially interesting as the materials for lead-free interconnection technology(diffusion soldering) and as the replacement materials for toxic cadmium layers (similar tocadmium layers high corrosive resistance) [1]. Citrate electrolytes are attractive as the non-toxicbaths for electrodeposition of metals, alloys and semiconductor materials [2-4]. Citrates form alot of various metal complexes. The potentiometric titration experiments were performed fordetermination of conditional stability constants of complex species in system In(III)-Sn(II)-Citrate. Analysis of thermodynamic models builded on the base of conditional stabilityconstants allows to determine the predominant citrate complexes. The kinetics ofelectroreduction of citrate complexes was studied in the solutions which contain the differentpredominant citrate complexes. Depositions were conducted under various hydrodynamicconditions by the rotating disc electrode technique (RDE). The applied potential, hydrodynamicconditions, pH, composition of solution and additional organic compounds (polyethyleneglycol, ascorbic acid, pyrogallol) have a strong effect on the physicochemical propertieselectrodeposited layers. Citrate baths are not stable for pH lower than about 2.4 becauseformation of citrate complexes of Sn(II) starts above pH about 2. Current efficiency of indiumelectrodeposition diminshes with an increase of pH above 2.6 hence the optimal pH range forelectrodeposition of In-Sn alloys is between 2.4 to 2.6. The decay of current efficiency of indiumelectrodeposition on the cathode is connected with formation in solutions as the predominantelectrochemically non-active indium citrate complex with high negative charge. Strong effect ofanions was stated. The eletrodepositon process was activated by presence of chloride ions inbath. On the partial polarization curves of indium the strong maxima were observed aboutpotential -700 mV vs SCE, where also were observed maximal contents of indium in In-Snalloys. The microstructure, formation of phases and their thermal stability, crystallographictexture of the deposits on the copper base as well as of the joints prepared by diffusionsoldering were also investigated. The positive effect of polyethylene glycol (PEG- 3000) on thequality of the deposits was stated.

AAcckknnoowwlleeddggeemmeennttssThis work was supported by grants from MNISW (Poland): 3 T08A 04527.

References[1] S.Sommadossi, W.Gust, EJ Mittemeijer, Mat. Chem. Phys., 77 (2003) 924.[2] E.Beltowska-Lehman, P.Ozga, Electrochim. Acta, 43 (1998) 617..[3] E.Beltowska-Lehman, P.Ozga, Z.Swiatek, C.Lupi, Cryst. Eng., 5 (2002) 335.[4] E.Beltowska-Lehman, P.Ozga, Arch.Metall.Mat., 50 (2005) 319.

KKeeyywwoorrddss:: Lead-free Soldering, Electrodeposition, In-Sn Alloy, Citrate Bath.

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PP2299

IINNVVEESSTTIIGGAATTIIOONN OOFF IINNDDUUCCEEDD CCOODDEEPPOOSSIITTIIOONN OOFF NNIICCKKEELL--TTUUNNGGSSTTEENN AANNDD NNIICCKKEELL--MMOOLLYYBBDDEENNUUMM AALLLLOOYYSS

Anicai L.1, Prioteasa P.2, Pertache A.1, Visan T.3

1PETROMSERVICE SA, Division of Ecological Technologies Development, Bucharest, Romania2Natl.Research.Inst.for Electrical Engineering -Advanced Researches-, Bucharest, Romania3University POLITEHNICA, Department of Applied Physical Chemistry and Electrochemistry,Bucharest, Romania

After three free lines, text body Among electrochemical processes having a considerableimpact on technical development in a large range of industrial areas and implications fromenvironmental view points, the electrodeposition and electroforming play an important role.Ni alloys are among the most widely involved electrodepositions and they proved beneficial forcertain applications, due to their better mechanical, anticorrosive and thermal stabilitycharacteristics. Moreover, under the frame of the efforts to find ecological alternatives tochromium plating, alloyed Ni with tungsten or molybdenum as well as boron or SiC basedcomposites are showing promise for specific applications.With this in view, several experiments dealing with Ni-W (5-25% W) and Ni-Mo (15-45% Mo)alloys electrodeposition are presented.Ni-W and Ni-Mo coatings belong to the so-called induced co-deposition systems, when nickel’sreaction rate enhances the codeposition of tungsten/molybdenum. The electrodeposition hasbeen performed on brass and copper as metallic supports from ammonium-citrate electrolytes,in stationary conditions for current densities between 0.5-7 A/dm2 and temperatures of 40-80oC, at thicknesses of 5-15 Ìm.The influence of some operating parameters on Ni-W and Ni-Mo film electrodeposition hasbeen investigated. The cathodic current efficiency and alloy composition have been determinedagainst nickel and alloying element concentration in the electrolyte. The potentiodynamicpolarization curves in various hydrodynamic regimes, pH values were recorded and discussed.The W and Mo percentages in the alloy slightly increases with stirring regime and ionconcentration in the electrolyte. The effect of citrate concentration both on the deposit qualityand alloy composition has been evidenced.

KKeeyywwoorrddss:: induced codeposition, Ni-W alloy, Ni-Mo alloy, ammonium-citrate bath

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PP3300

TTHHEE FFEE--NNII -- MMOO AALLLLOOYY EELLEECCTTRROODDEEPPOOSSIITTEEDD OONN NN -- TTYYPPEE SSIILLIICCOONN

Fekih Z.(1), Ghellai N.(1), Fortas G.(2), Sam S.(2), Chabanne-sari N.E.(1), Gabouze N.(2)

(1). UNITE DE Recherche DES MATERIAUX ET DES ENERGIES Renouvelables (U.R.M.E.R)Université Abou - Baker Belkaid TLEMCEN, ALGERIE(2). U.D.T.S, 2Bd Frantz-Fanon, 7merveilles Algiers, Algeria

The present work is registered in frame of a contribution to the electrodeposition method ofmetallic alloys on silicon substrate.The FeNiMo alloys have been chosen for electrodeposition directly on n-type silicon substrates.This removes the need of thin layer deposited by some other methods as a part of the growthprocess and integrates an efficient, inexpensive and convenient method for fabricating thin filmwith silicon technology.The deposits were prepared under potentiostatic conditions from aqueous solution.The aspects related to the deposition process and deposited layers were investigated by currentand potential transients, X-rays diffraction (XRD), Scanning Electron Microscopy (SEM), andEnergy Dispersive X-ray Spectroscopy (EDS).The results show that the deposit (morphology, stochiometry…) varied with electrodepositionparameters (current density, voltage and the pH solution).

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PP3311

SSUUIITTAABBLLEE AALLUUMMIINNAA TTEEMMPPLLAATTEESS FFOORR EELLEECCTTRROODDEEPPOOSSIITTIIOONN OOFF NNAANNOOSSTTRRUUCCTTUURREESS

Montero J.M., Sarret M. , Müller C.ELECTRODEP, Dpto. Química Física, Universitat de Barcelona, Barcelona

In the last decade many research has been carried out in the subject of alumina templates forthe synthesis of new 1D-nanostructures, like nanowires or nanotubes. The characteristicphysical and chemical properties of these materials make them very useful for a wide variety ofapplications (magnetic storage of information, gas sensors, catalysis, fuel cells, electronic andopto-electronic devices, nanoprobes, nanoconnectors for quantum and nanodevices...),depending on the nature of the material (metallic, ceramic or polymeric). Porous anodicalumina membranes (AAM) have appeared as feasible templates for the synthesis of thesematerials using a wide variety of methods [1]. Electrodeposition of metals and alloys is a reliablemethod for this purpose. However, the possibility of using anodized aluminium as an electrodeis rather difficult due to the fact that the structure of the anodic layer (barrier - porous layer)isolates the aluminium matrix from the electrodeposition bath. Electrochemical deposition isthen only possible after a reduction of the barrier layer thickness. In the present work, theinfluence of the barrier layer thinning process (BLT) on the structure of the alumina templateand the shape of the electrodeposited Ni nanowires is analyzed. It is known that BLT produces abranch-shaped structure at the bottom of the pores (Fig. 1), but little work has been done inorder to characterize and minimize it. Moreover, other interesting applications are derived fromthis process: the possibility of fabricating ordered AAMs with pore diameters smaller than 20nm, which is difficult to get with conventional two-step anodizing processes even for sulphuricacid baths, and the synthesis of tree-shaped nanostructures, which can be useful for electronicor opto-electronic devices.

Fig.1: Ni nanowire obtained by electrodepositionin alumina template after a BLT process.

References[1] A. Huczko, Appl. Phys. 70 (2000) 365.

KKeeyywwoorrddss:: alumina template, anodizing, barrier layer thinning, nanowires and nanotubes.

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PP3322

EELLEECCTTRROOCCHHEEMMIICCAALL PPRREEPPAARRAATTIIOONN AANNDD CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF NNII//SSIICC CCOOMMPPOOSSIITTIIOONNAALLLLYYGGRRAADDEEDD MMUULLTTIILLAAYYEERREEDD CCOOAATTIINNGGSS

Garc›a-Lecina E.a, García-Urrutia I.a, Díez J.A.a, Salvo M.b, Smeacetto F.b, Stepanov G.c, BabutskyA.c, Seddon R.c, Martin R.c

aSurface Finishing Department, CIDETEC, Donostia-San Sebasti ãan, SpainbMaterials Science and Chemical Engineering Department, Politecnico di Torino, Torino, ItalycInstitute for Problems of Strength, National Academy of Sciences, Kiev,UkrainedMaterials Engineering Research Laboratory, MERL, Ltd, Hertfordshire , UK

Composite electroplating is a method of codepositing fine particles of metallic, non-metalliccompounds or polymers in an electrodeposited metal matrix in order to improve materialproperties such as wear resistance, lubrication, or corrosion resistance [1]. The properties of these electrodeposited metal matrix composites coatings depend on severalvariables, in particular on the content and nature of the particles dispersed in the metallic matrix. In this sense, the codeposition of ceramic particles gives exceptional advantages in terms ofmechanical properties (hardness, chemical inertia, good frictional behaviour).This study aims to obtain Ni/SiC multilayered coatings with different content of SiC particles inorder to obtain high-performance compositionally graded coatings for specific applications.The graded multilayered coatings were electrodeposited from suspensions of SiC microparticles(d

m= 1 Ìm) in nickel Watts baths without additives.

The coatings obtained were characterized from the compositional (EDX), structural (XRD) andmorphological (OM, SEM) points of view.As the mechanical behaviour of these systems are very important from the viewpoint ofpractical applications, some functional properties such as adhesion, stress, hardness and wearresistance were measured. These properties were compared to those of pure nickel coatings.

References[1] C. Kerr, D. Barker, F. Walsh, J. Archer, Trans IMF, 78 (2000) 171

KKeeyywwoorrddss:: graded coatings; composite coatings; Ni/SiC

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PP3333

PPRROOPPEERRTTYY CCHHAANNGGEE IINN TTIICCOONN BBAASSEEDD CCOOAATTIINNGGSS:: EEFFFFEECCTT OOFF TTHHEE OOXXYYGGEENN FFRRAACCTTIIOONN

Carvalho S.1, Henriques M.2, Oliveira R.2, Escobar-Gallindo R.3, Vaz F.1

1 Dept. Física, Universidade do Minho, Campus de Azurém, Guimarães, Portugal2 Dept de Eng· Biolfigica, Universidade do Minho, Campus de Gualtar, Portugal3 Instituto de Ciencia de Materiales de Madrid (ICMM -CSIC), Cantoblanco, Madrid, Spain

Dramatic development of nanotechnology in material science and engineering has taken placein the last decade. The recent interest in the so-called multifunctional-coating materials is ofgrowing importance, from both the fundamental scientific viewpoint and in terms of Industrialapplications. Such coatings are intended for applications where beneficial properties in severaldifferent areas are required. Currently, medicine and biomedical engineering are promising andchallenging fields where the application of these coatings should be attractive. More specific,the nowadays tendency in implant science is to substitute the total hip replacement, usuallymaking use of a variety of materials such metals, ceramics, polymers and composites, by thosecoated with protective thin-films. The purpose of this work is to start to investigate the feasibility of various Ti-Si-C-N-O films forload–bearing medical devices. For this, Ti-Si-C-ON films with different O/N ratio were depositedby unbalanced reactive magnetron sputtering. Extended physical, chemical and structuralcharacterization such as the study of composition, phase composition: nanocrystalline oramorphous, were achieved resorting to surface analysis techniques, such as, Glow DischargeOptical Emission Spectroscopy (GDOES) and X-ray diffraction (XRD). The mechanicalcharacterization (stress, hardness, Young’ s modulus) was realized by using deflection techniqueand depth sensing nanoindentation. The cytotoxicity of the films will be related with thestructural evolutions promoted by the variation of the O/N ratio. The degree of hydrophobicitywas determined based on the measurement of water, formamide and ·-bronaphatalene.

References (in Arial 10pt)[1] N. Spyrellis, Journal volume (year) page.

KKeeyywwoorrddss:: At the end of the document, please specify 3 to maximum 5 keywords.

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PP3344

EELLEECCTTRROOCCTTRROOCCHHEEMMIICCAALL SSYYNNTTHHEESSIISS AANNDD AANNTTIICCOORRRROOSSIIVVEE PPRROOPPEERRTTIIEESS OOFF PPOOLLYY((AANNIILLIINNEE--CCOO--OO--AAMMIINNOOPPHHEENNOOLL)) CCOOAATTIINNGGSS OONN SSTTAAIINNLLEESSSS SSTTEEEELL

Kourouzidou M., Sazou D.Laboratory of Physical Chemistry, Department of Chemistry, Aristotle University ofThessaloniki, Thessaloniki, Greece

During the last years intrinsically electronic conducting polymers (IECPs) are exploredintensively for the corrosion control of metal and alloys as more environmentally friendlymaterials compared to chromate-based coatings. IECPs differ from the traditional organiccoatings in that they are electroactive materials and hence, as with chromates, redoxinteractions of IECPs with metal and alloys are expected resulting in a diminution of metalcorrosion rates [1]. Polyanilne (PAn) and its derivatives are among the most widely used IECPsfor this purpose [1-6]. Limitations of the protection performance of PAn coatings are reported inchloride-containing solutions [6]. Different strategies were implemented aiming to improve theprotective effectiveness of PAn. Recent results suggest that the Nafion®-PAn composite filmsshow a better protective behavior than the simple PAn films against pitting corrosion ofstainless-steel (SS) in chloride-containing acidic solutions [7]. Due to the cation-selectivity of theNafion® chloride insertion is prevented.The aim of this study is to synthesize composite poly(aniline-co-o-aminophenol) coatings onstainless steel (AISI 304) electrodes (SS) by using Nafion® membranes with an ultimate goal theimprovement of the anticorrosion properties of PAn coatings in chloride media. The copolymer,poly(aniline-co-o-aminophenol) synthesized electrochemically by using cyclic voltammetryshows different electrochemical characteristics as compared with the PAn. The electrochemicalactivity of the copolymer is very good up to higher pH values (up to pH=9) and the redoxbehavior of the functional group - OH on the copolymer chain is associated with protonexchange resulting in an adjustment of pH near the copolymer surface [6]. Due to theseproperties, the copolymer is expected to have also improved anticorrosion properties. The copolymer was synthesized on the Nafion®-coated SS electrode by cyclic voltammetry in0.5 M H

2SO

4containing 0.1 M aniline and 5 mM o-aminophenol. The redox properties of the

composite coatings were improved in comparison with those of the PAn ones. Scanningelectron microscopy was used to reveal the structure and morphology of the compositedeposits. The results show that Nafion®-copolymer films do not favor chloride exchangebetween the composite film and the solution preventing the initiation of pitting corrosion ofstainless steel.

References[1] P. Chadrasekhar, Conducting polymers. Fundamentals and applications, Kluwer Academic

Publlishers, Boston (1999).[2] D.W. DeBerry, J. Electrochem. Soc. 132 (1985) 1022.[3] N. Ahmad, A.G. MacDiarmid, Synth. Met.78 (1996) 103.[4] D. Sazou, C. Georgolios, J. Electroanal. Chem. 429 (1997) 81.[5] D. Sazou, Synthy. Met. 118 (2001) 133.[6] D. Sazou, M. Kourouzidou, E. Pavlidou, Electrochim. Acta 52 (2007) 4385.[7] D. Sazou, D. Kosseoglou, Electrochim. Acta 51 (2006) 2503. [8] S.L. Mu, Synth. Met. 143 (2004) 259.

KKeeyywwoorrddss:: Anticorrosion coatings; Conducting polymers; Nation membrane; Composite films;Stainless steel pitting corrosion

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PP3355

CCHHAARRAACCTTEERRIIZZAATTIIOONN OOFF EELLEECCTTRROODDEEPPOOSSIITTEEDD CCOO--AAGG NNAANNOO--HHEETTEERROOGGEENNEEOOUUSS FFIILLMMSS

J. García-Torres, E.Gómez, E. Vallés*,Electrodep, Dpt. Química Física, Universitat de Barcelona, Martí i Franquès 1, 08028 Barcelona Spain

The study of heterogeneous structures such as multilayers or granular films of ferromagneticand nonmagnetic metals has attracted much attention because of its technological importance.These systems are characterized by showing magnetoresistance (MR), a change of electricalresistance in a varying external magnetic field. For these systems to present MR, sharp interfacesbetween the ferromagnetic and the nonmagnetic metal are necessary. In this regard, Co-Agsystem is an ideal system to prepare magnetoresistive films because of complete solid solubilityis precluded. Granular Co-Ag films have been mainly prepared by means of physical methods (magneton-sputtering or ion-beam cosputtering) but electrodeposition has also been recently tested as analternative tool to those techniques.The magnetotransport properties of the coatings are highly dependent on the preparationconditions because they determine the cobalt content, the structural properties and the size ofthe dispersed ferromagnetic grains in the matrix. In our laboratory, a complex bath containinga complexing agent and some additives was developed to codeposit cobalt and silver [1]. Theaim of the present work is to analyse the morphology, the structure and the magnetic responseof the obtained deposits as well as the effect of annealing on those properties. Cobalt-silver deposits have been obtained from the selected bath [1] applying differentpotentials in the range -770 mV, -830 mV, potentials selected from a previous voltammetricstudy. The deposits were characterized by showing nodular morphology, high roughness andbeing black in colour in all electrodepositing conditions.The XRD characterization of Co-Ag films revealed the presence of two phases, the fcc phase ofsilver and a new phase never detected in the Co-Ag system. The detected phase presented aclose packed hexagonal cell (hP2 in Pearson nomenclature) with cell parameters a = 2.887 (2)Å, c = 4.745 (6) Å and c/a = 1.644. This phase can probably correspond to a CoAg

3 metastable

compound. Similar XRD patterns were obtained when Co-Ag deposits were prepared atdifferent deposition potentials and at different deposition charges. The annealing of thesamples revealed the disappearance of the new phase and the amorphous nature of cobalt asno peaks related to it were detected. Due to the heat treatment, a drastic change in themagnetisation curve was observed: a clear increase in the coercive field as well as a decrease inthe saturation magnetization.Samples of pure cobalt obtained in the same electrolytic bath without silver (I) were preparedas a reference for cobalt-silver deposits. Co films were characterized by showing nodularmorphology instead of the more common acicular one. The XRD pattern could be assignedneither the usual hexagonal close packed (hcp) nor the face centred cubic (fcc) structures ofcobalt. The indexation of peaks led to assign all the diffraction peaks to a primitive cubic phaseof cell parameter a = 6.093 (1) Å (cP20 in Pearson nomenclature). The annealing provoked thedisappearance of the metastable phase and the oxidation of the film. Regarding magneticproperties, a clear decrease on the coercive field and a decrease on the saturationmagnetization were observed when annealing cobalt films.

[1] E. Gfimez, J. Garc›a-Torres, E. Vallés. Anal. Chim. Acta. In press

KKeeyywwoorrddss:: electrodeposition, XRD, cobalt-silver, structures, magnetic curves

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A U T H O R S I N D E X

AAhhmmaaddiiaann NNaammiinnii PP............................................................................................................ O25AAmmaaddeehh AA.. ........................................................................................................................ P09AAmmeellll AA................................................................................................................................ P21AAnniiccaaii LL.. .................................................................................................................... P23, P29AAssiimmiiddiiss PP.. .......................................................................................................................... P20BBaabbaalluuoo AA..AA........................................................................................................................ O25BBaabbiicc BB.. .............................................................................................................................. P13BBaabbuuttsskkyy AA.. ........................................................................................................................ P32BBaayyaattii BB.. ............................................................................................................................ O25BBeerrggmmaannnn HH..MM..EE.. .............................................................................................................. P08BBooeecckk RR.. ............................................................................................................................ O16BBoonnoorraa PP..LL.. ........................................................................................................................ O14BBoorrrriiss JJ.. .............................................................................................................................. O03BBoouurroouusshhiiaann MM.. ........................................................................................................ O26, O27BBuuddaa MM.. ............................................................................................................................ P23BBuuddnniiookk AA............................................................................................................................ P05BBuunndd AA.. ............................................................................................................................ O12CCaakkiirr AA..FF.. .......................................................................................................................... O06CCaarrvvaallhhoo SS.. ........................................................................................................................ P33CCaavvaalllloottttii PP..LL.. ............................................................................................................ O02, P01CCeelliiss JJ..PP...................................................................................................................... O08, O10CChhaabbaannnnee--ssaarrii NN..EE.. .................................................................................................... P25, P30CChhaappppéé JJ..MM.. ...................................................................................................................... P02CChhaazzaallvviieell JJ..NN.. .................................................................................................................... P11CChhiibboouubb NN.. ........................................................................................................................ P25CChhuunn MMeeee SS.. ...................................................................................................................... P22CCoojjooccaarruu AA.. ...................................................................................................................... O07CCoojjooccaarruu PP.......................................................................................................................... O02CCoommnniinneelllliiss CC.. .................................................................................................................. O04CCuunnhhaa LL.. ............................................................................................................................ P02DDeemmiirreell AA.. ........................................................................................................................ O19DD››eezz JJ..AA........................................................................................................................ P21, P32DDjjeebbbbaarr SS.. .................................................................................................................. P10, P11DDoobbrroovvoollsskkaa TTSS.. ................................................................................................................ O05EEllbbiicckk DD.. ............................................................................................................................ O03EElleezzoovviicc NN..RR.. ...................................................................................................................... P13EEssccoobbaarr--GGaalllliinnddoo RR.. ............................................................................................................ P33FFaahhlleerr SS.. .................................................................................................................. O09, O21FFeeiill FF.. ................................................................................................................................ O20FFeeiizzmmaannddiiaann MM............................................................................................................ P14, P18FFeekkiihh ZZ.. ...................................................................................................................... P25, P30FFeesseennkkoo AA..VV.. ...................................................................................................................... P04FFoorrttaass GG.. ............................................................................................................ P19, P25, P30FFrraannssaaeerr JJ............................................................................................................................ O10

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FFrreeyyllaanndd WW.. ........................................................................................................................O11FFuurrbbeetthh WW.. ........................................................................................................................ O20GGaabboouuzzee NN.. ........................................................................................ P10, P11, P19, P25, P30GGaabbrriieellllii CC.. ........................................................................................................................ P06GGaarrcc››aa EE.. ............................................................................................................................ P21GGaarrcc››aa--LLeecciinnaa EE.. .................................................................................................................. P32GGaarrcc››aa--TToorrrreess JJ.. .................................................................................................................. P35GGaarrcc››aa--UUrrrruuttiiaa II.. .................................................................................................................. P32GGaassttfifinn BB.. .......................................................................................................................... P21GGhheellllaaii NN.. .................................................................................................................. P25, P30GGooggoolliiddeess EE.. ...................................................................................................................... O24GGoolloozzaarr MM..AA.. .............................................................................................................. P14, P18GGfifimmeezz EE.............................................................................................................................. P35GGoouuggeett--LLaaeemmmmeell AA..CC.. ........................................................................................................ P11GGuunnnnaarrssssoonn NN.. .................................................................................................................. O15HHeennrriiqquueess MM........................................................................................................................ P33HHuullttmmaann LL.. ........................................................................................................................ O15HHuunn--GGii HH.. .......................................................................................................................... P22HHyyoo JJuunngg KK.. ........................................................................................................................ P22IIoouurrttcchhoouukk TT........................................................................................................................ P08KKaammmmoonnaa OO.. .................................................................................................................... O10KKaarriimmzzaaddeehh FF.. ............................................................................................................ P14, P18KKaarroouussssooss DD........................................................................................................................ O26KKaasssseelloouurrii--RRiiggooppoouulloouu VV.. .................................................................................................... P16KKaazzaakkeevviicchh AA..VV.. .................................................................................................................. P15KKhhaattrrii MM..SS.. ........................................................................................................................ O21KKhheeddkkaarr BB.. .......................................................................................................................... P24KKiippaarriissssiiddeess CC...................................................................................................................... O10KKllaaggeess CC..PP.. ........................................................................................................................ O03KKoorrddaattooss KK.. ........................................................................................................................ P16KKoossaannoovviicc TT.. ...................................................................................................................... O26KKoossoolliiaa CC.. .......................................................................................................................... P17KKoottttii KK.. .............................................................................................................................. O10KKoouulloouummbbii NN.. .................................................................................................................... O14KKoouummoouulliiss DD.. .................................................................................................................... O14KKoouurroouuzziiddoouu MM.. ................................................................................................................ P34KKoowwaalliikk RR............................................................................................................................ O05KKrraasstteevv II.. .......................................................................................................................... O05KKrreenneekk RR.. .......................................................................................................................... O21KKrrssttaajjiicc NN..VV.......................................................................................................................... P13KKuubbiisszzttaall JJ............................................................................................................................ P05KKuulloovvaa TT..LL.. ........................................................................................................................ P04LLeeiissnneerr PP.. .......................................................................................................................... O15LLeeiissttnneerr KK............................................................................................................................ O09LLeekkkkaa MM.............................................................................................................................. O14LLuuhhnn OO.. ............................................................................................................................ O08

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LLuukkjjaanniicchheevv DD..AA.. ................................................................................................................ P15MMaaggaaggnniinn LL.. ...................................................................................................................... P01MMaakkssiicc AA..DD.. ........................................................................................................................ P07MMaanneeaa AA..CC.. ...................................................................................................................... O07MMaannnn OO.............................................................................................................................. O11MMaarrcceettaa KKaanniinnsskkii MM..PP.. ........................................................................................................ P07MMaarrttiinn RR.. ............................................................................................................................ P32MMaauurriinn GG.. .......................................................................................................................... P06MMiicchhaallii CCHH.. ........................................................................................................................ P27MMiikkrroovvaa LL.. .......................................................................................................................... P06MMööbbiiuuss AA.. .......................................................................................................................... O03MMoonntteerroo--MMoorreennoo JJ..MM.. ........................................................................................................ P31MMoouurraa CC.............................................................................................................................. P02MMoouussssoouuttzzaanniiss KK.. .............................................................................................................. O18MMüülllleerr CC..MM.. ................................................................................................................ P21, P31NNaannddaann BB.. ........................................................................................................................ O21NNeeddeellccuu MM.. ...................................................................................................................... O07NNiiccoollaaee AA............................................................................................................................ O28NNiikkoolliicc VV..MM.......................................................................................................................... P07NNiizzhhnniikkoovvsskkyy EE..AA.. .............................................................................................................. P04NNoouurraaeeii SS.. ........................................................................................................................ O17NNoovvaakkoovviicc JJ.. ...................................................................................................................... O23OOlliivveeiirraa RR.. .......................................................................................................................... P33OOzzaannaamm FF............................................................................................................................ P11OOzzggaa PP.. .............................................................................................................................. P28PPaappaaddaakkiiss RR.. ...................................................................................................................... P03PPaarrvvuu CC.. ............................................................................................................................ O28PPaatteerrmmaarraakkiiss GG.. ........................................................................................................ O18, P27PPaavvllaattoouu EE..AA.. .................................................................................................... O13, O22, P20PPeerrttaacchhee AA.. ................................................................................................................ P23, P29PPoolluubbooyyaarriinnoovv VV..SS.. ............................................................................................................ P04PPoommppeeii EE.. .......................................................................................................................... P01PPooppcczzyykk MM.. ........................................................................................................................ P05PPoottkkoonnjjaakk NN..II.. .................................................................................................................... P07PPoouulleerrooss KK.. ........................................................................................................................ P16PPrriiootteeaassaa PP.. ........................................................................................................................ P29RRaaeeiissssii KK.. ............................................................................................................................ P14RRaasshhiiddii AA..MM.. ...................................................................................................................... P09RRiitttteell AA.. .............................................................................................................................. P08RRoouussttoomm BB..EE.. .................................................................................................................... O04RRooyy SS.. ................................................................................................................ O17, P24, P26RRuuyytthhoooorreenn WW.. .................................................................................................................. O08SSaallvvoo MM.. ............................................................................................................................ P32SSaamm SS.. ................................................................................................ P10, P11, P19, P25, P30SSaarrrreett MM.. .................................................................................................................... P21, P31SSaazzoouu DD.. ............................................................................................................................ P34

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SScchhlloorrbb HH.. ................................................................................................................ O09, O21SScchhuullttzz LL.. .................................................................................................................. O09, O21SScchhuuttzzee MM.. ........................................................................................................................ O20SSeeddddoonn RR.. .......................................................................................................................... P32SSkkuunnddiinn AA..MM........................................................................................................................ P04SSmmeeaacceettttoo FF.. ...................................................................................................................... P32SSmmiitthh PP.. ............................................................................................................................ P26SSoovvaarr MM.............................................................................................................................. O28SSppaannoouu SS.. .......................................................................................................................... O13SSppyyrreelllliiss NN........................................................................................ O13, O22, O26, O27, P20SSttaammmm MM.. ........................................................................................................................ O21SSttaannccuu RR.. .......................................................................................................................... O28SStteeppaannoovv GG.. ...................................................................................................................... P32SSttrriikkooss SS.. ............................................................................................................................ P16SSvveennssssoonn MM.. ...................................................................................................................... O15TTaallbboott JJ..BB............................................................................................................................ O12TThheennnnaaddiill SS.. ...................................................................................................................... P24TThhiieemmiigg DD.. ........................................................................................................................ O12TThhoommaass MM.. ........................................................................................................................ O03TTssaattssaarroonnii EE.. ...................................................................................................................... P17TTsseerreeppii AA.. .......................................................................................................................... O24TTssoolloommiittiiss AA.. ...................................................................................................................... P03ÜÜrrggeenn MM.. .......................................................................................................................... O19VVaallllééss EE.. .............................................................................................................................. P35VVaann HHooooff CC.. ...................................................................................................................... O08VVaassiillaakkooppoouullooss DD.. .............................................................................................................. O27VVaassssiilliioouu PP.. ........................................................................................................................ O23VVaazz FF.. ........................................................................................................................ P02, P33VViicceennzzoo AA.. ........................................................................................................................ O02VViieeiiddeerr CC.. .......................................................................................................................... O15VViissaann TT................................................................................................................ O07, P23, P29VVllaacchhooppoouulloouu MM..EE.. ............................................................................................................ O24VVllaassooppoouullooss AA..DD.. ................................................................................................................ P16VVoouurrddaass NN.. ........................................................................................................................ O24VVrraaccaarr LLJJ..MM.......................................................................................................................... P13WWaanngg XX.. ............................................................................................................................ O15YYeessiill YY.. .............................................................................................................................. O19YYoollsshhiinnaa LL..AA.. ...................................................................................................................... P12YYuukksseell BB.. ............................................................................................................................ O06YYuumm HH..TT.. .......................................................................................................................... O01ZZaabbiinnsskkii PP.. ........................................................................................................................ O05ZZäännkkeerr AA.. .......................................................................................................................... O03ZZiieelloonnkkaa AA.. ........................................................................................................................ O05ZZooiikkiiss--KKaarraatthhaannaassiiss AA.. ........................................................................................................ O22

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Programma 2Exo 10/8/07 3:14 PM ™ÂÏ›‰· 5€¦ · The conference consists of contributed oral and poster presentations, while selected conference papers will be reviewed by