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Printed Circuit Boards The Design Process

Printed Circuit Boards

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Printed Circuit Boards. The Design Process. What is the Output?. Not just a PCB Engineering Drawing Set. Design Specification Schematics PCB Artwork Fab Drawing Bill of Materials Part Drawings Procurement Specifications Firmware Assembly Drawings Test Specifications. - PowerPoint PPT Presentation

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Page 1: Printed Circuit Boards

Printed Circuit Boards

The Design Process

Page 2: Printed Circuit Boards

What is the Output?• Not just a PCB

• Engineering Drawing Set–Design Specification–Schematics–PCB Artwork–Fab Drawing–Bill of Materials–Part Drawings–Procurement Specifications–Firmware–Assembly Drawings–Test Specifications

Minimum Set to Produce PCB

–PCB Artwork–Fab Drawing

Page 3: Printed Circuit Boards

PCB Artwork

• Negatives that will be used to produce layers of the PCB

• Currently created from Gerber files– Gerber Photoplotter– RS-274X Gerber format is current standard

• also known as X-Gerber or Extended Gerber

• Produced via EDA (Electronic Design Automation) Software

Page 4: Printed Circuit Boards

Typical set of RS-274X file names• .GBL - Gerber Bottom Layer• .GTL - Gerber Top Layer• .GBS - Gerber Bottom Solder Resist• .GTS - Gerber Top Solder Resist• .GBO - Gerber Bottom Overlay• .GTO - Gerber Top Overlay• .GBP - Gerber Bottom Paste• .GTP - Gerber Top Paste• .GKO - Gerber Keep-Out Layer• .GM1 - Gerber Mechanical 1• .GM2 - Gerber Mechanical 2• .GPT - Gerber Top Pad Master• .GPB - Gerber Bottom Pad Master

Page 5: Printed Circuit Boards

NC Drill File

• The other type of file

• NC Drill file provides X and Y locations along with size for all holes

• Plated through holes vs uplated holes

Page 6: Printed Circuit Boards

Eagle Extensions

*.cmp Top, Via, Pad Component side*.ly2 Route2, Via, Pad Inner signal layer*.ly3 Route3, Via, Pad Inner signal layer*.ly4 $User1 Inner supply layer... ...*.sol Bot, Via, Pad Solder side*.plc tPl, Dim, tName, Silkscreen comp. side*.pls bPl, Dim, bName, Silkscreen solder side*.stc tStop Solder stop mask comp. side*.sts bStop Solder stop mask sold. side*.drd Drills, Holes Drill data for NC drill st.

Page 7: Printed Circuit Boards

Design Process in Practice

• Create Parts

• Create Schematic– Run ERC (Electrical Rules Check)

• Create Board

• Place Components

• Route Traces– Run DRC (Design Rules Check)

• Produce Gerbers and Drill Data

Page 8: Printed Circuit Boards

Design Rules

• Manufacturer Specific• Advanced Assembly

– Rules• 4 Mil Line Width/Spacing, 1-24 Layers, .02-.15 thick• 2-3 Mil Line Width/Spacing, 25-38 Layers, .01-.25 thick• Minimum Drill Size = 15 to 1 Aspect Ratio• Minimum Pad Size over finished hole Internal .012/External .008

– Recommendations (http://www.aapcb.com/PCBAssemblyTips.asp)• Component to Component 10mil• Component to Board Edge 125mils• Part Polarity/Pin 1 Markers

– Diodes/LEDs mark cathode (-) end with a bar– Capacitors mark positive end – use square hole– Number pins/pads as the manufacturer does

Page 9: Printed Circuit Boards

Ogres, Onions, and Parfaits

• Parts, Schematics, and PCBs are like Ogres– They have layers

• Pretty Much Automatic – but Pay Attention to them

Page 10: Printed Circuit Boards

Creating Parts in Eagle

• Parts are created and stored in a library– Difficult to move from one library to another

• Parts consist of– Package: The footprint in the layout– Symbol: The drawing for the schematic– Device: Assigns a symbol to a package

Page 11: Printed Circuit Boards

Symbol• Pins

– Visible attribute • Pad – Display pad name from Package• Pin – Displays pin name from Symbol• Both – Displays both pin and pad names

– Direction should match pin’s function• ERC issue

• Outline “Wires” on 94 Symbols layer• Name “>NAME” on 95 Names layer• Value “>VALUE” on 96 Values layer

– Instead of “>VALUE” may use name of device– i.e. TSP78514, Teensy++

Page 12: Printed Circuit Boards

Package

• Package name should reflect package type– DIP14, TO220-5, LCC20

• Pads – type ‘1’ including ‘s in text box then place pads - pads will be numbered sequentially

• Pin 1’s pad should be square – or otherwise identified

• Package outline on 21 tPlace layer• Name “>NAME” on 25 tNames layer• Value “>VALUE” on 27 tValues layes

Page 13: Printed Circuit Boards

Package cont.

• Critical Dimensions– Hole to hole spacing– Pad to pad spacing in surface mount devices– Package size is non-critical

• Start by placing Pin 1’s pad– Place other pads, holes, and outlines in

reference to Pin 1

Page 14: Printed Circuit Boards

Device

• Add a Symbol (Library editor calls this Add a Part) by clicking on two input AND

• Add a Package by clicking on the New button• Connect the Symbol’s Pins to the Package’s Pads

by clicking on the Connect button– Opens a new dialog box

• Click on Pin and Pad to be connected then

• Click on Connect

• Repeat

• Click on Prefix button to assign a prefix– IC, R, C, CONN, J, etc…

Page 15: Printed Circuit Boards

Save Library

• Perhaps you shouldn’t have waited until now to save your work

Page 16: Printed Circuit Boards

Schematic Entry

• Schematic captures the electrical connections of your design

• Schematic should flow from left to right• Frames make your schematic look

professional• Decoupling Capacitors

– Bulk where power connects to board– At least one per IC

Page 17: Printed Circuit Boards

Schematic Entry Design Flow

• Place parts

• Define electrical connections

• Run ERC

Page 18: Printed Circuit Boards

Eagle Schematic Tool Bar

Info

Move

Group

Cut

Delete

Name

Smash

Bend a Line

Bus

Place Net Junction

ERC

Copy

Rotate – also right click when moving or placing

Change

Paste

Place Part

Value

Text

Electrical Connection

Label Net or Bus

Page 19: Printed Circuit Boards

PCB Design• Define board outline and other mechanicals

– Mounting holes

• Place parts– Use Air Wires/Ratsnest to help place

• Autoroute• Add finishing touches

– Name of Board– Board Revision– Assembly Revision

• Helpful silkscreen legends• DRC

Page 20: Printed Circuit Boards

PCB Design cont.

• Edit/Net classes– Allows different widths and hole sizes for

named nets

Page 21: Printed Circuit Boards

Eagle Board Tool Bar

Route Manually Rip up Route

Autorouter

DRC

Page 22: Printed Circuit Boards

Eagle WindowSwitch to Board Command Line

Info Bar

CAM Processor

Page 23: Printed Circuit Boards

Creating Gerbers and Drill File• Create Drill File

– File/Run drillcfg.ulp create .drl file– A list of all drill sizes needed

• Use CAM Processor to Create more Drill files– File/Open/Job – choose excellon.cam– Click on Process Job button– Creates .dri and .drd files

• Use CAM Processor to Create Gerbers– File/Open/Job – choose gerb274x.cam– Check Tabs for proper layer setup– Click on Process Job button– Creates .cmp, .gpi, .plc, .sol, .stc, .sts, .crc, etc…– Might have to add cream component

Page 24: Printed Circuit Boards

View Gerbers

• Before submitting your files to a board house view them in a Gerber file viewer– Viewplot www.viewplot.com