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PRINTED CIRCUIT BOARD DESIGN AND MANUFACTURING CORP .
Corporate Information
• Established in 2004• Headquarter office in San Jose, CA• Production factory located in Binh Duong, Vietnam
- Center of hi-tech industrial parks- 30 min. from Ho Chi Minh City- 20,000 sq. ft. manufacturing facility- 2,000 sq. ft. office space
• 35 employees combined• 100% US owned company• Revenue for Y2009: USD 1.0M• Revenue for Y2010E: USD 1.2M
Mission Statement
FAB-9 strives to become the Low Cost Solution for the PCB design & manufacturing service while maintaining consistent quality, delivery and customer support
Quality Policy
It is the policy of Fab-9 to provide all customers with the highest quality workmanship. We enforce strict Quality Management System and continuous improvement process to ensure our products exceed customer’s specifications
Fab-9 Vietnam have achieved ISO 9001 certification in March 2007
Management Team
Anthony Viet Tran – CEOCo-founder of Hytek Services USA since 1993, he has extensive experience background in the PCB design layout. Anthony holds a BS Computer Science from the University of Indiana
Prudencio Valdez –Technical VPPrudencio has more than 25 years of experience in the manufacturing of printed circuit boards. He has helped startup various PCB companies in the silicon valley, CA. Prudencio have managed teams at the Tyco Elec. Div. and Sanmina
Company Structure
FAB-9 JOINT STOCK CO.,
Headquarter OfficeCalifornia, USA
ManufacturingBinh Duong, VN
Sales
Design Services
Customer Support
PCB Manufacturing
Design Services
Sales
Customer Support
Professional Services
PCB Manufacturing� Complex-Multilayer Printed Circuit Board � UL and RoHS certified materials � Impedance Controlled (50 ohm, 5%)� Quick-turn Prototypes (3 days, 4-10 layers)�Medium Volume Production (20,000 sq ft / month)
Layout Design� Net Topology Optimization�Material Performance Recommendation� Stack-up Creation� PCB Layout Guideline Creation� Pad-Stack / Component Footprint Creation & Verification
Manufacturing Capabilities
10:18:1Aspect Ratio64Maximum Layer Count – (rigid +flex)
5 mil (0.13mm)7 mil (0.18mm)Drill to Metal Minimum Spacing12Maximum Layer Count – flexible
n/a2.5 mil (0.06mm)Image to Hole Location Accuracy3016Maximum Layer Count – rigid
n/a2 mil (0.05mm)Hole Location AccuracyLayer Count
6.0 mil (0.15mm)10.0 mil (0.25mm)Minimum Drilled Hole0.003“(0.07mm)0.004” (0.1mm)Spaces – External (1/2oz copper thk)
Drilling Capability0.003“(0.07mm)0.004” (0.1mm)Spaces – Internal (1/2oz copper thk)
2.0 mil (0.05mm)2.5 mil (0.06mm)External Layers0.003“(0.07mm)0.004” (0.1mm)Lines – External (1/2oz copper thk)
2.0 mil (0.05mm)2.5 mil (0.06mm)Internal Layers0.003“(0.07mm)0.004” (0.1mm)Lines – Internal (1/2oz copper thk)
Annular RingMinimum Lines & Spaces
yesn/a4.0 oz (144um)n/a16x22“(406x559)Maximum Board Dimensions
yesn/a3.0 oz (108um)n/a18x24“(457x610)Maximum Panel Dimensions
n/ayes2.0 oz (72um)n/a18x24“(457x610)Minimum Panel Dimensions
n/ayes1.0 oz (36um)Panel / Board Dimensions
n/ayes0.5 oz (18um).200“ (5.08mm).125“ (3.175mm)Maximum
yesn/a0.25 oz (9um).024" (0.61mm).040" (1mm)Minimum
Based Copper Thickness (All Layers)Board Thickness
SPECIALSTANDARDCATEGORIESSPECIALSTANDARDCATEGORIES
Manufacturing Capabilities Cont.
0.75%1.50%Maximum Warpage
Board Warpagen/an/aImmersion Silver
9 mil (0.23mm)11 mil (0.28mm)Minimum Pitch (pad-to-pad)n/an/aImmersion Gold Thickness
5 mil (0.13mm)7 mil (0.18mm)Minimum pad sizen/an/aHAL Thickness
n/ayesMin Continuity Resistancen/an/aOSP Thickness
n/ayesMax Isolation Resistancen/an/aGold Edge Connector Thickness
n/ayesTest Voltage30uinch (0.7 um)2-3 uinch (0.07um)Selective Electrolytic Gold Plating
5%10%Differential Impedance
250uinch
(6.35um)150 uinch (3.8um)Nickel Thickness
5%10%Single Ended Impedancen/a1 mil (.025mm)Minimum Copper Plating (inside hole)
Electrical Testn/a1 mil (.025mm)Average Copper Plating (inside hole)
yes (30, 45, 60,
90 deg)
yes (30, 45, 60, 90
deg)V-Groove Angles CapabilityPlating Capability
025 mil (.63mm)Metal to Edge Minimum>0.8 mil0.8 mil (0.02mm)Minimum Solder Mask Thickness
7 mil(.18mm)10.0 mil ( .25mm)Hole to Edge Location2.0 mil (0.05mm)3.0 mil (0.08mm)Minimum Solder Mask Dam Between SMD Pads
+/-5mil(.12mm)+/- 10mil ( .25mm)Routing Tolerance2 mil (0.05mm)4.0 mil (0.05mm)Minimum Solder Mask Clearance SMD Pads
MachiningSolder Mask
SPECIALSTANDARDCATEGORIESSPECIALSTANDARDCATEGORIES
Equipment List
Photo• Orbotech 5008 Express (1998)• Orbotech 5008• CA Picard film registration punch (2001)
Primary Imaging• 2 Colight Exposure Unit (8kW)• Colight Exposure Unit (5kW)• CA Picard material registration punch (2001)• 2 Teknek CM6 clean machines
Equipment List
Wet Processing:• Chemcut clean line 547XL (2000)• Chemcut DES line 547XL• Chemcut SES lines 547• Chemcut Deburrer 604• MacDermid Multibond line (1998)• IS pumice scrubber, Pumiflex• Vertical Electroless and DC plating lines
Water Purification and Waste Treatment:• DI water system• Clarifier waste treatment system
Equipment List
Lamination:• TMP vacuum assisted press. 4 openings hot and cold. Automatic loader
Drilling/Fabrication:• 2 Excellon Mark VI drill with CNC-6 controllers• 1 Excellon Mark V Driller/Router• 1 Excellon Mark IV drill• 1 Excellon XL-3 Router
Inspection/Testing:• AOI Orbotech 206E• Probot Super Six-D
Material Suppliers
Fab-9 uses high end materials from top quality manufacturers to fabricate our PCBs. The materials we use are also UL listed and RoHS compliant
Yesn/an/aGoBrightUyemuraNickel/Gold Finishing
Yesn/an/aCupracidAtotechCopper Plating
YesYes1/2 oz, 1 ozHTENikko MaterialsCopper Foil
YesYesWhiteS-200WTaiyoLegend Ink
YesYes
LPI Green, Blue,
ClearPSR-2000, 4000,..TaiyoSolder Mask
YesYesHigh Tg > 170
R1766T,
IT-180, NP-170
Matsushita,
Iteq, NanYa
Polyimide ISOLAPrepregs
YesYesHigh Tg >170
R1766T,
IT-180, NP-170
Matsushita,
Iteq, NanYa,
Polyimide ISOLACopper Clad Laminate
RoHS CompliantUL ListedSpecsSeriesManufacturerMaterials Description
Certifications
UL Listed• FAB-9 is UL Listed under product code E257250
ISO 9001:2008• FAB-9 obtained its ISO 9001 standard certification in March 2007
RoHS •FAB-9 products have been certified by TUV Vietnam as RoHS compliant
E257250
RoHSCOMPLIANT
Business Partners
Thank You
Fab-9 Corp.- Headquarter1630 Old Oakland Rd. Suite A212San Jose, CA 95131. USATel: (408)761-5267, 436-8896email: [email protected]
Fab-9 Joint Stock Company1B St. Dong An Industrial ParkBinh Duong Province, VietnamTel: (+84) 0650-783423, 783424, 783425Fax: (+84) 0650-783426email: [email protected]
http://fab-9.comEmail: [email protected]