Premjeet (”Prem”) Chahal May 01, 2020Associate Professor chahal@egr.msu.eduMichigan State University www.egr.msu.edu/emrg/group-membersElectrical and Computer Engineering Ph.: 517-355-0248428 S. Shaw St. Cell: 214-552-98712120 Engineering BuildingEast Lansing, MI 48864

Professional Preparation

• Georgia Institute of Technology Atlanta, GAPhD Electrical and Computer Engineering 1999

– Dissertation: Integral resistors and capacitors for mixed-signal packages using electrolessplating and polymer-ceramic nanocomposites

– Advisors: Profs. Rao R. Tummala and Mark G. Allen

• Iowa State University Ames, IAMS Electrical and Computer Engineering 1994

– Dissertation: CuInSe2 Films from Stacked (Cu/In)/Se Layers for Solar Cells

– Advisor: Prof. Vikram Dalal

• Iowa State University Ames, IABS Electrical and Computer Engineering 1991

Research Interests

Terahertz (THz) and Millimeter Wave Electronics, Microsystems Packaging, RF-MEMS, RF Sensorsand RFIDs, Microwave NDE, Additive Manufacturing, and Flex Electronics.

Teaching Interests

Electromagnetics, Antenna Theory and Practice, Electronics Packaging and Interconnects, Microwaveand Millimeter Wave Circuits, Solid State Devices, Integrated Circuits and Microfabrication, Electro-Optics, EMI/EMC.

Professional Appointments

• Associate Professor Oct. 2015 - CurrentMichigan State University E. Lansing, MI

• Assistant Professor Jan. 2009 - Sept. 2015Michigan State University E. Lansing, MI

• Research Scientist Nov. 2006 - Dec. 2008Abbott Laboratories Abbott Park, IL

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– Led effort in the development of MEMS for drug discovery applications. This involved design,fabrication and testing of biocompatible microfluidic devices. Large area low-cost processing ofsingle use Bio-MEMS devices.

• Principal Engineer June 1999 - Oct. 2006Raytheon Dallas, TX

– Led effort in the development of system on package (SOP) for microwave and millimeter waveradar applications. Developed large number of 3D packaging systems and integrated passivesfor compact sensors, T/R modules, and MEMS. In parallel, led research in the areas of THzcircuits and systems for sensing and imaging applications, and high power MMIC designs.

• Summer Intern July 1997 - Oct. 1997GT Packaging Research Center Atlanta, GA

– Development of flex-electronics for cellular applications.

• Summer Intern July 1996 - Oct. 1996Motorola Schaumburg, IL

– Research work geared towards the development of integrated passives (inductors, capacitors,resistors and batteries) for handheld applications.

• Summer Intern July 1995 - Oct. 1995BFGoodrich Cuyahoga Falls, OH

– Setup a small cleanroom facility, and characterization of low-loss polymer dielectrics forpackaging and semiconductor applications.

Awards and Honors

1. IEEE/EPS ECTC Volunteer Award, 2020

2. IEEE Senior Member, April 2019

3. International Symposium on Microelectronics (IMAPS) Best Session Paper Award, 2017 (Student:Saranraj Karappuswami)

4. International Symposium on Microelectronics (IMAPS) Best Session Paper Award, 2017 (Student:Mohd Ifwat Mohd Ghazali)

5. International Symposium on Microelectronics (IMAPS) Best Student Paper Award, 2017 (Student:John Dorosewitz, undergraduate student researcher)

6. Withrow Teaching Excellence Award, 2016

7. IEEE ECTC Best Poster Paper Award, 2015 (Student: Amanpreet Kaur)

8. DARPA YFA, 2012

9. The American Society for Nondestructive Testing Fellowship (2013 and 2014) Students: KyoungPark (2013) and Amin Tayebi (2014)

10. Raytheon Outstanding Individual Technical Contributions, 2002

11. Motorola Packaging Research Fellow, 1996

12. Georgia Tech Electronics Packaging Poster Paper Awards (1996, 1997 and 1998)

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Funding

Past Projects:1. 2010 − 2013: PI − BRIGE: Terahertz Planar Circuits, NSF, $174K2. 2012 − 2013: PI − STTR: Metamaterial-based MEMS Ultra-low-loss Non-dispersive Phased-array

Antenna, A. Brown Design, $40K3. 2012 − 2013: PI − Advanced Aperture Research −2, AFRL, $125K4. 2012 − 2015: PI − Heterogeneous Integration of Nano-Devices, DARPA−YFA, $300K5. 2012 − 2015: Co-PI − Collaborative Research: MEMS Frequency Converters Based on Nonlinear

Resonances, NSF, $240K6. 2015 − 2017: Co-PI − Advanced Aperture Research −3, AFRL, $1.09M7. 2015: PI − Equipment Donation, IBM, $80K8. 2015 − 2018: PI − Embedded Passive Tags Towards Intrinsically Locatable Buried Plastic Mate-

rials, DOT, $140K9. 2016 − 2021: Co-PI − CSR: Small: RF-Wear: Enabling RF Sensing on Wearable Devices for

Non-Intrusive Human Activity, Vital Sign and Context Monitoring, NSF, $496K10. 2014 − 2017: Co-PI − Reconfigurable Array Performance Improvement and Development,

DARPA, $1.08M11. 2015 − 2017: Co-PI − Free Space Characterization and Advanced Apertures, $207K12. 2016 − 2018: Co-PI − Product DNA, MSU-Axia Institute, $300K13. 2017 − 2018: Co-PI − Bio-films, MSU-Axia Institute, $200K14. 2018 − 2019: PI − SiC Devices Growth using Laser Annealing, MSU-Advance, $64K15. 2019: PI − Wireless Tags for Buried Plastic Pipes, Michigan-MTRAC, $36K

Active Projects:16. 2016 − current: PI − RFIDs for Supply Chain, MSU-Axia Institute, To date = $515K (renewed

yearly)17. 2017 − current: Co-PI − Additive Manufacturing for Radars, Honeywell, To date = $1.3M (renewed

yearly)18. 2019 − current: PI − Metamaterials for THz and IR Applications, Honeywell, To date = $120K

(renewed yearly)19. 2019 − 2021: PI − 3D Printed Automotive Sensors, Ford Motor Company, $200K20. 2019 − 2021: PI − Wireless Automotive Sensors, Ford Motor Company, $200K

Pending Projects:21. Pending: 2 NSF, 1 Ford and 1 USDA ($2.6M total) are currently under review (as of

06/05/2020)

Committees

University and Department Committees:

1. IEEE Electronics Packaging Society, MSU Student Chapter Advisor (2019 − current)

2. Electromagnetics Group Chair (2019 − current)

3. University Curriculum Committee (2018 − current)

4. NDE Faculty Search Committee Chair (2017)

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5. MRIVCC Faculty Search Committee (2017)

6. Department Lab Committee (2016 − current)

7. Electromagnetics Faculty Search Committee Chair (2016)

8. Undergraduate Studies Committee (2014 − 2018)

9. Graduate Studies Committee (2013 − 2014)

10. Electroscience Chair (2010 − 2013)

11. Faculty Search Committee: Mechanical Engineering, 2012

12. College Admission Committee (GARFAC, 2011 − 2013)

13. IEEE Student Branch Advisor (2010 − current)

14. Department Graduate Poster Paper Reviewer (2013, 2014)

Thesis Committees:

1. Serving/served as thesis committee member for >45 Ph.D. students

2. Serving/served as thesis committee member for >10 M.S. students

Synergistic Activities

1. IEEE CPMT RF THz Technologies Technical Committee(https://site.ieee.org/cpmt-rfthz/meet-the-committee-chairs/)- Co-Chair (2020 − current)

2. IEEE CPMT − Associate Editor (2018 − current)

3. AP-S/URSI 2019 Organizing Committee − Special Sessions

4. AP-S/URSI Review Committee (2018 − current)

5. Organizer of special session on 3D RF/mm-wave packaging (MRS 2016)

6. Chair, High-Speed, Wireless Components, Electronic Components and Technology Conference(2015 − 2016)

7. Assistant Chair, RF and Electronic Components Technical Group, Electronic Components andTechnology Conference (2014 − 2015)

8. Technical Committee, Electronic Components and Technology Conference (2010 − current)

9. Session Chair, IEEE International Symposium on Antennas and Propagation (2010, 2011, 2012,2013, 2018, 2019)

10. Organizer of Special Sessions on THz NDE at QNDE conference (2013, 2014)

11. Reviewer for multiple journals, including:

(a) IEEE ELECTRON DEVICE LETTERS

(b) IEEE ACCESS

(c) Nature Electronics

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(d) IEEE SENSORS JOURNAL

(e) JOURNAL OF MODERN OPTICS

(f) APPLIED OPTICS

(g) APPLIED PHYSICS LETTERS

(h) IEEE CPMT

Courses Taught

1. ECE 280: Electrical Engineering Analysis

• Spring 2019

2. ECE 305: Electromagnetics I

• Fall 2009

• Fall 2010

• Spring 2012

• Fall 2013

• Fall 2015

• Fall 2016

• Spring and Fall 2017

• Fall 2019

• Summer 2020

3. ECE 405: Electromagnetics II

• Fall 2010

• Fall 2011

• Fall 2012

• Fall 2013

• Fall 2014

• Fall 2015

• Fall 2016

• Fall 2017

• Fall 2018

• Fall 2018

4. ECE 407: Electromagnetic Compatibility

• Spring 2015

5. ECE 476: Electro-Optics

• Summer 2014

6. ECE 480: Senior Design

• Spring 2013 • Spring 2017

7. ECE 802 (Special Topics, New Course): Electronic Systems Packaging

• Spring 2010

8. ECE 802 (Special Topics, New Course): Microwave and Millimeter Wave Circuits

• Spring 2013 • Spring 2016 • Spring 2018

Advising

Current PhD Students

1. Saikat Mondal

• expected graduation: May 2021

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2. Michael Craton (co-advised with Prof. J. Papapolymerou)

• expected graduation: Dec. 2020

3. Vincens Gjokaj (co-advised with Prof. J. Papapolymerou)

• expected graduation: May 2021

4. Yihang Chu

• expected graduation: Dec. 2022

5. Yamini Kotriwar

• expected graduation: May 2023

Current MS Students (Thesis Option)

1. Cameron Crump

• expected graduation: Dec. 2020

2. Eleazar Gutierrez

• expected graduation: May. 2022

Completed PhD Degrees (Total: 10)

1.Jose Hejase May 2012IBM Corporation (Chief Engineer) Austin, TX

• Dissertation: Terahertz time domain methods for material characterization of layereddielectric media

2.Nophadon Wiwatcharagoses May 2012King Mongkut’s University of Technology North Bangkok (Dept. Chair) Bangkok, Thailand

• Dissertation: Metamaterial Microstrip Transmission Line Based Microwave Circuits andSensors

3.Kyoung K. Park May 2014Agency for Defense Development (Senior Researcher) Daejeon, S.Korea

• Dissertation: A THz focal plane imaging array using metamaterial-inspired bolometer andwafer-level integrated focusing elements

4.Xianbo Yang Sept. 2014IBM Corporation (Signal Integrity Engineer) Austin, TX

• Dissertation: Study of nanocomposites and nanowire devices for THz circuit applications

5.Scott Strachan Sept. 2015SiTime (Senior MEMS Development Engineer) Mountain View, CA

• co-advised with Prof. Steve Shaw, ME

• Dissertation: Exploiting Internal Resonance in MEMS for Signal Processing Applications

6.Joshua Myers Dec. 2015IBM (Chief Engineer) Austin, TX

• Dissertation: Investigation of planar terahertz passive devices and coupling methods foron-wafer applications

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7.Amanpreet Kaur Sept. 2016Oakland University (Asst. Professor) Rochester, MI

• Dissertation: Heterogeneous integration of microwave and millimeter-wave diodes on siliconand flex substrates

8.Jennifer Byford Dec. 2018Lincoln Labs (Member of Technical Staff) Boston, MA

• Dissertation: Design of Wideband On-Board Terahertz Interconnects, Circuits and Sensors

9.Mohd Ifwat Mohd Ghazali May 2019University Sains Islam Malaysia (USIM) (Associate Professor) Negeri Sembilan, Malaysia

• Dissertation: Additive manufacturing for electronic systems (AMES)

10.Saranraj Karrupuswami Dec. 2019Altair (Technical Staff) Troy, MI

• Dissertation: Design of Wideband On-Board Terahertz Interconnects, Circuits and Sensors

Completed MS Degrees (with thesis, Total: 6)

1.Xianbo Yang May 2011IBM Corporation (Signal Integrity Engineer) Austin, TX

• Dissertation: Study of Carbon Nanotube Based Schottky Diode Terahertz Detectors

2.Stephen Zajac Sept. 2013Tesla (Senior Engineer) Palo Alto, CA

• Dissertation: High Power, Reflection Tolerant RF Solid State Amplifier Design

3.Cecilia Acosta May. 2014Eaton Corporation (Product Manager) Moon Township, PA

• Dissertation: Terahertz Photonic Crystal Microfluidic Sensors

4.Mohd Ifwat Mohd Ghazali Dec. 2014University Sains Islam Malaysia (USIM) (Associate Professor) Negeri Sembilan, Malaysia

• Dissertation: 3D Printed Antennas

5.Joshua Myers Sept. 2014IBM (Chief Engineer) Austin, TX

• Dissertation: The Design Study of a Miniaturized Multi-Layered Metamaterial-InspiredMiniaturized Dynamically-Tunable Antenna

6.Nitya Kriti Dec. 2019Startup: Novi, MI

• Dissertation: Blockchain Inspired Product Authentication

Undergraduate Student Researchers Advised (Total: 19)

1. Steve Shane (graduated)

2. Lanea Williamson (graduated)

3. Brian Schulte (graduated)

4. Jessica Oakes (graduated)

5. Jennifer Byford (graduated)

6. Cecilia Acosta (graduated)

7. Joshua Myers (graduated)

8. Arber Nicaj (graduated)

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9. Eleazar Gutierrez (graduated)

10. Zachary Purtill (graduated)

11. Caelan Zakari Fields (graduated)

12. Nathan Blanke (graduated)

13. Vincens Gjokaj (graduated)

14. John Doroshewitz (graduated)

15. Zhi Zhou (graduated)

16. Nicholas Bannon (graduated)

17. Rachel Steinhorst

18. Kanishka P. Wijewarden

19. Andrew Caldarone

20. Avi Rajendra-Nicolucci

* Eleven of these undergraduate students have co-authored conference or journal papers.

Key Invited Talks

1.Seminar: Application of RFIDs in the Food and Pharma Supply Chain Nov. 19, 2019Packaging School, Michigan State University (E. Lansing, MI)

2.RFID Based Pharma Systems Dec. 2018Bristol Myers Squibb (Princenton, NJ)

3.Smart Packages for Pharmaceutical Applications Nov. 2018Eli Lilly (Indianapolis, IN)

4.Metamaterial-inspired Research in the Tri-state Region Dec. 2018AMTA (Dayton, OH)

5.Additive Manufacturing of Electronic Systems Oct. 26, 2017Raytheon (Dallas, TX)

6.Aerosol and Polyjet 3D Printing for SOP RF Front Ends 2016EuMW Workshop and Short Courses P. Chahal and J. Papapolymerou

7.Additive Manufacturing of RF to THz Components and Circuits: Opportunities and ChallengesMay 2017IMS Workshop

8.Keynote Talk: Terahertz Research at MSU: Actives and Passives Oct. 24 - 25, 2014University of Pennsylvania, MEMS Expert Group Workshop (Indianapolis, IN)

9.Study of Wafer-level Integration Compatible Terahertz Waveguides and Their CharacterizationMay 2014IMS Workshop (San Francisco, CA, USA)

10.Terahertz Packaging and Integration: Interconnects April 26, 2013IBM Corporation (online audience, worldwide)

11.Metamaterials in RF/THz Applications June 22, 2010Raytheon (Dallas, TX)

Patents and Publications

Publications: http://scholar.google.com/citations?user=o6JASRcAAAAJhl=en

Patents

9. P. Chahal, T. Hogan, A. Kaur, ”Laser assisted SiC growth on silicon,” US Patent 9,960,037, 2018

8. P. Chahal and F. J. Morris, ”Hermetic packaging of integrated circuit components,” US Patent8,803,314, 2014

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7. P. Chahal, ”Multiple substrate electrical circuit device,” US Patent 8,344,430, 2013

6. P. Chahal and F. J. Morris, ”Hermetic packaging of integrated circuit components,” US Patent8,343,806, 2013

5. P. Chahal, ”Multiple substrate electrical circuit device,” US Patent 7,825,005, 2010

4. P. Chahal and F. J. Morris, ”Thin micropolarizing filter, and a method for making it,” US Patent7,859,658, 2010

3. F. J. Morris and P. Chahal, ”Method and system of local oscillator signal generation,” US Patent,7,405,869, 2008

2. A. J. Syllaios and P. Chahal, ”Integrated spectroscopic microbolometer with microfilter arrays,” USPatent 6,998,613, 2006.

1. P. Chahal and F. J. Morris, ”Thin micropolarizing filter, and a method for making it,” US Patent7,098,442, 2006

Patents Pending

2. P. Chahal, B. D. Ables, S. Rajendran, and F. J. Morris, “Method for sealing vias in a substrate,”May 1 2008. US Patent App. 11/555,090

1. P. J. Chahal and S. , “Harmonic rfid tag-reader system for long range sensing identification andsecurity,” Nov. 28 2019. US Patent App. 16/420,711

Journal Papers

53. M. T. Craton, X. Konstantinou, J. D. Albrecht, P. Chahal, and J. Papapolymerou, “A chip-firstmicrowave package using multimaterial aerosol jet printing,” IEEE Transactions on MicrowaveTheory and Techniques, 2020

52. D. Kumar, S. Mondal, A. Kaur, Y. Deng, and P. Chahal, “An RF backscatterer system forreal-time multi-sensing applications,” Sensors and Actuators A: Physical, vol. 303, p. 111685, 2020

51. A. M. Craton, J. Albrecht, P. Chahal, and J. Papapolymerou, “In situ nanocomposite fabricationfor RF electronics applications with additive manufacturing,” IEEE Transactions on MicrowaveTheory and Techniques, 2020

50. S. Mondal, D. Kumar, and P. Chahal, “A continuous-mode single-antenna harmonic RFID tag,”IEEE Microwave and Wireless Components Letters, 2020

49. S. Karuppuswami, S. Mondal, D. Kumar, and P. Chahal, “RFID coupled passive digital ammoniasensor for quality control of packaged food,” IEEE Sensors Journal, 2020

48. V. Gjokaj, J. Papapolymerou, J. D. Albrecht, B. Wright, and P. Chahal, “A compact receivemodule in 3D printed vivaldi antenna,” IEEE Transactions on Components, Packaging andManufacturing Technology, vol. 10, no. 2, pp. 343–346, 2020

47. M. T. Craton, J. D. Albrecht, P. Chahal, and J. Papapolymerou, “A Chip-First Approach toMillimeter-Wave Circuit Packaging,” IEEE Microwave and Wireless Components Letters, vol. 29,no. 2, pp. 116–118, 2019

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46. S. Mondal, D. Kumar, and P. Chahal, “A Wireless Passive pH Sensor With Clutter RejectionScheme,” IEEE Sensors Journal, vol. 19, no. 9, pp. 3399–3407, 2019

45. Y. Chu, C. Qian, P. Chahal, and C. Cao, “Printed Diodes: Materials Processing, Fabrication, andApplications,” Advanced Science, vol. 6, no. 6, p. 1801653, 2019

44. M. I. M. Ghazali, S. Karuppuswami, S. Mondal, A. Kaur, and P. Chahal, “Embedded Actives UsingAdditive Manufacturing For High Density RF Circuits and Systems,” IEEE Transactions onComponents, Packaging and Manufacturing Technology, 2019

43. V. Gjokaj, J. Papapolymerou, J. D. Albrecht, and P. Chahal, “Design and Fabrication of AdditivelyManufactured Hybrid Rigid-Flex RF Components,” IEEE Transactions on Components, Packagingand Manufacturing Technology, vol. 9, no. 4, pp. 779–785, 2019

42. M. I. M. Ghazali, S. Karuppuswami, and P. Chahal, “3-D Printed Embedded Passive HarmonicSensor Tag as Markers for Buried Assets Localization,” IEEE Sensors Letters, vol. 3, no. 4, pp. 1–4,2019

41. S. Mondal, K. Wijewardena, S. Karuppuswami, N. Kriti, D. Kumar, and P. Chahal, “BlockchainInspired RFID based Information Architecture for Food Supply Chain,” IEEE Internet of ThingsJournal, vol. 6, no. 3, pp. 5803–5813, 2019

40. S. Mondal and P. Chahal, “A Passive Harmonic RFID Tag and Interrogator Development,” IEEEJournal of Radio Frequency Identification, vol. 3, no. 2, pp. 98–107, 2019

39. D. Kumar, S. Mondal, S. Karuppuswami, Y. Deng, and P. Chahal, “Harmonic RFIDCommunication using Conventional UHF System,” IEEE Journal of Radio Frequency Identification,vol. 3, no. 4, pp. 227–235, 2019

38. C. Oakley, J. D. Albrecht, J. Papapolymerou, and P. Chahal, “Low-Loss Aerosol-Jet PrintedWideband Interconnects for Embedded Devices,” IEEE Transactions on Components, Packagingand Manufacturing Technology, vol. 9, no. 11, pp. 2305–2313, 2019

37. M. I. M. Ghazali, S. Karuppuswami, A. Kaur, and P. Chahal, “3D Printed high functional densitypackaging compatible out-of-plane antennas,” Additive Manufacturing, vol. 30, p. 100863, 2019

36. S. Mondal, S. Karuppuswami, and P. Chahal, “ID Integrated Batteryless Wireless Digital pHSensor,” IEEE Sensors Journal, vol. 19, no. 24, pp. 12079–12086, 2019

35. S. Karuppuswami, E. Rothwell, P. Chahal, and M. Havrilla, “A Triaxial Applicator for theMeasurement of the Electromagnetic Properties of Materials,” Sensors, vol. 18, no. 2, p. 383, 2018

34. A. L. Allafi, P. Chahal, R. Mukherjee, and H. K. Khalil, “Variable Structure Control of a MassSpring Damper Subjected to a Unilateral Constraint: Application to Radio-Frequency MEMSSwitches,” Journal of Dynamic Systems, Measurement, and Control, vol. 140, no. 8, p. 081004, 2018

33. D. Kumar, S. Karuppuswami, Y. Deng, and P. Chahal, “A wireless shortwave near-field probe formonitoring structural integrity of dielectric composites and polymers,” NDT & E International,vol. 96, pp. 9–17, 2018

32. J. L. Frasch, E. J. Rothwell, P. Chahal, and J. Doroshewitz, “Insertable Waveguide VerificationStandards for the Electromagnetic Characterization of Materials,” Progress in ElectromagneticsResearch M, vol. 66, pp. 183–191, 2018

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31. L. L. Matta, S. Karuppuswami, P. Chahal, and E. C. Alocilja, “AuNP-RF sensor: An innovativeapplication of RF technology for sensing pathogens electrically in liquids (SPEL) within the foodsupply chain,” Biosensors and Bioelectronics, vol. 111, pp. 152–158, 2018

30. S. Karuppuswami, L. L. Matta, E. C. Alocilja, and P. Chahal, “A wireless RFID compatible sensortag using gold nanoparticle markers for pathogen detection in the liquid food supply chain,” IEEEsensors letters, vol. 2, no. 2, pp. 1–4, 2018

29. S. Mukherjee, X. Shi, L. Udpa, S. Udpa, Y. Deng, and P. Chahal, “Design of a split-ring resonatorsensor for near-field microwave imaging,” IEEE Sensors Journal, vol. 18, no. 17, pp. 7066–7076,2018

28. A. Kaur and P. Chahal, “RF characterization of NiO and TiO2 based metal-insulator-metal (MIM)diodes on flexible substrates,” IEEE Access, vol. 6, pp. 55653–55660, 2018

27. C. Oakley and P. Chahal, “Aerosol Jet Printed Quasi-Optical Terahertz Components,” IEEETransactions on Terahertz Science and Technology, vol. 8, no. 6, pp. 765–772, 2018

26. J. A. Byford and P. Chahal, “Demonstration of Substrate Integrated Ribbon Waveguide Using 3-DPrinting,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9,no. 1, pp. 146–155, 2018

25. S. Karuppuswami, S. Mondal, M. I. M. Ghazali, and P. Chahal, “A Multiuse Fully 3-D PrintedCavity Sensor for Liquid Profiling,” IEEE Sensors Letters, vol. 3, no. 2, pp. 1–4, 2018

24. M. I. Ghazali, K. Y. Park, and P. Chahal, “3D Printed Metalized Plastic Waveguides for MicrowaveComponents,” Journal of Microelectronics and Electronic Packaging, vol. 45, no. 2, pp. 14–18, 2018

23. A. Kaur, T. Hogan, and P. Chahal, “Selective Fabrication of SiC/Si Heterojunction Diodes byLocal Laser Annealing Process for Microwave Circuit Applications,” IEEE Journal of the ElectronDevices Society, vol. 5, no. 5, pp. 291–298, 2017

22. S. Mukherjee, L. Udpa, Y. Deng, P. Chahal, and E. J. Rothwell, “Design of a microwave timereversal mirror for imaging applications,” Progress In Electromagnetics Research, vol. 77,pp. 155–165, 2017

21. S. Karuppuswami, A. Kaur, H. Arangali, and P. P. Chahal, “A hybrid magnetoelastic wirelesssensor for detection of food adulteration,” IEEE Sensors Journal, vol. 17, no. 6, pp. 1706–1714, 2017

20. J. A. Byford, M. I. M. Ghazali, S. Karuppuswami, B. L. Wright, and P. Chahal, “Demonstration ofRF and microwave passive circuits through 3-D printing and selective metalization,” IEEETransactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 3, pp. 463–471,2017

19. M. I. M. Ghazali, S. Karuppuswami, A. Kaur, and P. Chahal, “3-D printed air substrates for thedesign and fabrication of RF components,” IEEE Transactions on Components, Packaging andManufacturing Technology, vol. 7, no. 6, pp. 982–989, 2017

18. A. Kaur, X. Yang, and P. Chahal, “CNTs and graphene-based diodes for microwave andmillimeter-wave circuits on flexible substrates,” IEEE Transactions on Components, Packaging andManufacturing Technology, vol. 6, no. 12, pp. 1766–1775, 2016

17. A. Tayebi, P. Chahal, L. Udpa, and S. S. Udpa, “Nondestructive Testing of Dielectric Materialsusing an Active Reflecting Microwave Array,” Materials Evaluation, vol. 74, no. 12, pp. 1684–1691,2016

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16. E. J. Rothwell, J. L. Frasch, S. M. Ellison, P. Chahal, and R. O. Ouedraogo, “Analysis of theNicolson-Ross-Weir method for characterizing the electromagnetic properties of engineeredmaterials,” Progress In Electromagnetics Research, vol. 157, pp. 31–47, 2016

15. A. Kaur, P. Chahal, and T. Hogan, “Selective fabrication of SiC/Si diodes by excimer laser underambient conditions,” IEEE Electron Device Letters, vol. 37, no. 2, pp. 142–145, 2015

14. X. Yang and P. P. Chahal, “On-wafer terahertz ribbon waveguides using polymer–ceramicnanocomposites,” IEEE Transactions on Components, Packaging and Manufacturing Technology,vol. 5, no. 2, pp. 245–255, 2015

13. J. C. Myers, P. Chahal, E. Rothwell, and L. Kempel, “A multilayered metamaterial-inspiredminiaturized dynamically tunable antenna,” IEEE Transactions on Antennas and Propagation,vol. 63, no. 4, pp. 1546–1553, 2015

12. M. Yuan, P. Chahal, E. Alocilja, and S. Chakrabartty, “Wireless Biosensing UsingSilver-Enhancement Based Self-assembled Antennas in Passive Radio Frequency Identification(RFID) Tags,” IEEE Sensors Journal, vol. 15, no. 8, 2015

11. J. Byford, K. Park, P. Chahal, and E. Rothwell, “Frequency reconfigurable patch antenna array,”Electronics Letters, vol. 51, no. 21, pp. 1628–1630, 2015

10. R. O. Ouedraogo, J. Tang, K. Fuchi, E. J. Rothwell, A. R. Diaz, and P. Chahal, “A tunabledual-band miniaturized monopole antenna for compact wireless devices,” IEEE Antennas andWireless Propagation Letters, vol. 13, pp. 1247–1250, 2014

9. J. A. Hejase, E. J. Rothwell, and P. Chahal, “A multiple angle method for THz time-domainmaterial characterization,” IEEE Transactions on Terahertz Science and Technology, vol. 3, no. 5,pp. 656–665, 2013

8. J. A. Hejase, E. J. Rothwell, and P. Chahal, “Self-calibrating technique for terahertz time-domainmaterial parameter extraction,” JOSA A, vol. 28, no. 12, pp. 2561–2567, 2011

7. C. S. Meierbachtol and P. Chahal, “A novel subwavelength microbolometer for terahertz sensing,”International Journal of High Speed Electronics and Systems, vol. 20, no. 03, pp. 611–619, 2011

6. J. A. Hejase, P. R. Paladhi, and P. P. Chahal, “Terahertz Characterization of Dielectric Substratesfor Component Design and Nondestructive Evaluation of Packages,” IEEE Transactions onComponents, Packaging and Manufacturing Technolog, vol. 3, no. 2, pp. 1685–1694, 2011

5. B. Pillans, F. Morris, P. Chahal, G. Frazier, and J.-B. Lee, “Schottky barrier contact-based RFMEMS switch,” Journal of Microelectromechanical Systems, vol. 17, no. 6, pp. 1439–1446, 2008

4. S. K. Bhattacharya, M. G. Varadarajan, P. Chahal, G. C. Jha, and R. R. Tummala, “A novelelectroless process for embedding a thin film resistor on the benzocyclobutene dielectric,” Journalof electronic materials, vol. 36, no. 3, pp. 242–244, 2007

3. P. Chahal, F. Morris, and G. Frazier, “Zero bias resonant tunnel schottky contact diode forwide-band direct detection,” IEEE electron device letters, vol. 26, no. 12, pp. 894–896, 2005

2. Q. Liu, A. Seabaugh, P. Chahal, and F. J. Morris, “Unified ac model for the resonant tunnelingdiode,” IEEE Transactions on electron devices, vol. 51, no. 5, pp. 653–657, 2004

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1. P. Chahal, R. R. Tummala, M. G. Allen, and M. Swaminathan, “A novel integrated decouplingcapacitor for MCM-L technology,” IEEE Transactions on Components, Packaging, andManufacturing Technology: Part B, vol. 21, no. 2, pp. 184–193, 1998

Conference Papers

2019

123. V. Gjokaj, C. Crump, J. Papapolymerou, J. Albrecht, and P. Chahal, “Vivaldi Antenna ArrayFabricated Using a Hybrid Process,” in 2019 IEEE 69th Electronic Components and TechnologyConference (ECTC), pp. 948–953, IEEE, 2019

122. S. Mondal, M. I. M. Ghazali, K. Wijewardena, D. Kumar, and P. Chahal, “3D Printed InterposerLayer for High Density Packaging of IoT Devices,” in 2019 IEEE 69th Electronic Components andTechnology Conference (ECTC), pp. 1687–1692, IEEE, 2019

121. S. Mondal, S. Karuppuswami, R. Steinhorst, and P. Chahal, “A Wearable Passive pH Sensor forHealth Monitoring,” in 2019 IEEE 69th Electronic Components and Technology Conference(ECTC), pp. 1240–1245, IEEE, 2019

120. M. I. M. Ghazali, S. Mondal, S. Karuppuswami, and P. Chahal, “3D Printed Substrates for theDesign of Compact RF Systems,” in 2019 IEEE 69th Electronic Components and TechnologyConference (ECTC), pp. 113–118, IEEE, 2019

119. S. Mondal, S. Karuppuswami, M. I. M. Ghazali, A. Kaur, P. Chahal, et al., “A PSK ModulationScheme for Sensor Integrated RFIDs,” in 2019 IEEE International Symposium on Antennas andPropagation and USNC-URSI Radio Science Meeting, pp. 635–636, IEEE, 2019

118. M. I. M. Ghazali, S. Karuppuswami, S. Mondal, and P. Chahal, “A 3D Printed Compact PIFA for5G Applications,” in 2019 IEEE International Symposium on Antennas and Propagation andUSNC-URSI Radio Science Meeting, pp. 1995–1996, IEEE, 2019

117. S. Karuppuswami, M. I. M. Ghazali, S. Mondal, D. Kumar, A. Kaur, and P. Chahal, “A 3D PrintedUHF Passive RFID tag for Plastic Components,” in 2019 IEEE International Symposium onAntennas and Propagation and USNC-URSI Radio Science Meeting, pp. 597–598, IEEE, 2019

116. M. T. Craton, Y. He, A. Roch, P. Chahal, and J. Papapolymerou, “Additively ManufacturedInterdigitated Capacitors Using Barium Titanate Nanocomposite Inks,” in 2019 49th EuropeanMicrowave Conference (EuMC), pp. 488–491, IEEE, 2019

115. S. Karuppuswami, S. Mondal, D. Kumar, A. Kaur, and P. Chahal, “Thin-film based passive RFIDsensor tag for detection of packaged food volatiles,” in International Microelectronics Assembly andPackaging Society, vol. 2019, pp. 599–602, 2019

114. S. Mondal, S. Karuppuswami, D. Kumar, A. Kaur, and P. Chahal, “A Miniaturized Dual BandAntenna for Harmonic RFID Tag,” in International Microelectronics Assembly and PackagingSociety, vol. 2019, pp. 33–36, 2019

113. S. Karuppuswami, A. Rajendra-Nicolucci, S. Mondal, M. I. M. Ghazali, and P. Chahal, “Designand Fabrication of 3D Printed Reconfigurable Metamaterial-inspired Structures,” in InternationalSymposium on Microelectronics, vol. 2019, pp. 595–598, 2019

2018

13

112. S. Mondal, D. Kumar, M. I. Ghazali, P. Chahal, L. Udpa, and Y. Deng, “Monitoring andlocalization of buried plastic natural gas pipes using passive rf tags,” in AIP ConferenceProceedings, vol. 1949, p. 020020, AIP Publishing, 2018

111. M. T. Craton, V. Gjokaj, C. Oakley, B. Wright, J. D. Albrecht, P. Chahal, and J. Papapolymerou,“A broadband (10–20 ghz) lightweight receive module on multilayer lcp technology for radarapplications,” in 2018 IEEE Radar Conference (RadarConf18), pp. 0135–0139, IEEE, 2018

110. S. Karuppuswami, J. A. Byford, and P. Chahal, “A volatile molecular sensor using terahertzresonators on porous substrates,” in 2018 IEEE 68th Electronic Components and TechnologyConference (ECTC), pp. 2295–2300, IEEE, 2018

109. J. A. Byford and P. Chahal, “Broad-band dielectric probes for on-wafer characterization ofterahertz devices,” in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),pp. 2367–2373, IEEE, 2018

108. K. Y. Park, M. I. M. Ghazali, N. Wiwatcharagoses, and P. Chahal, “Thick 3d printed rfcomponents: Transmission lines and bandpass filters,” in 2018 IEEE 68th Electronic Componentsand Technology Conference (ECTC), pp. 2186–2191, IEEE, 2018

107. V. Gjokaj and P. Chahal, “A design study of 3d printed reduced height waveguide structures,” in2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 125–130, IEEE,2018

106. M. I. M. Ghazali, S. Karuppuswami, S. Mondal, and P. Chahal, “Embedded active elements in 3dprinted structures for the design of rf circuits,” in 2018 IEEE 68th Electronic Components andTechnology Conference (ECTC), pp. 1062–1067, IEEE, 2018

105. S. Karuppuswami, M. I. M. Ghazali, S. Mondal, and P. Chahal, “Wireless eas sensor tags forvolatile profiling in food packages,” in 2018 IEEE 68th Electronic Components and TechnologyConference (ECTC), pp. 2174–2179, IEEE, 2018

104. S. Mondal, D. Kumar, S. Karuppuswami, and P. Chahal, “A harmonic rf phase-shifter basedwireless ph sensor,” in 2018 IEEE 68th Electronic Components and Technology Conference(ECTC), pp. 796–801, IEEE, 2018

103. Y. He, M. T. Craton, P. Chahal, and J. Papapolymerou, “A bi-material fully aerosol jet printedw-band quasi-yagi-uda antenna,” in 2018 11th Global Symposium on Millimeter Waves (GSMM),pp. 1–3, IEEE, 2018

102. J. A. Byford, C. Oakley, and P. Chahal, “Additively manufactured frequency selective structures oncurved surfaces,” in 2018 48th European Microwave Conference (EuMC), pp. 671–674, IEEE, 2018

101. M. I. M. Ghazali and P. Chahal, “Ultra-wideband high gain vivaldi antennas using additivemanufacturing,” in International Symposium on Microelectronics, vol. 2018, pp. 000754–000759,International Microelectronics Assembly and Packaging Society, 2018

100. S. Karuppuswami, S. Mondal, M. I. M. Ghazali, and P. Chahal, “A reusable 3d printed cavityresonator for liquid sample characterization,” in International Symposium on Microelectronics,vol. 2018, pp. 000389–000392, International Microelectronics Assembly and Packaging Society, 2018

99. E. Rothwell, S. Karuppuswami, and P. Chahal, “Implementation of a partial overlay technique forthe characterization of the electromagnetic properties of conductor-backed materials,” in 2018USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), pp. 121–122, IEEE, 2018

14

98. S. Mondal, E. J. Rothwell, and P. Chahal, “A wideband antenna for buried rfid applications,” in2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National RadioScience Meeting, pp. 327–328, IEEE, 2018

97. V. Gjokaj and P. Chahal, “3d printed hybrid rigid-flex coaxial-like transmission line structures,” in2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National RadioScience Meeting, pp. 1425–1426, IEEE, 2018

96. S. Mukherjee, L. Udpa, S. Udpa, and P. Chahal, “Design of a split-ring resonator based microstripsensor for near-field inspection of composites,” in 2018 IEEE International Symposium on Antennasand Propagation & USNC/URSI National Radio Science Meeting, pp. 643–644, IEEE, 2018

95. M. I. M. Ghazali and P. Chahal, “A 3d printed cavity backed 2 4 slotted waveguide antenna array,”in 2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI NationalRadio Science Meeting, pp. 1435–1436, IEEE, 2018

94. M. T. Craton, C. Oakley, J. D. Albrecht, P. Chahal, and J. Papapolymerou, “Fully additivelymanufactured broadband low loss high frequency interconnects,” in 2018 Asia-Pacific MicrowaveConference (APMC), pp. 327–329, IEEE, 2018

93. V. Gjokaj, J. Papapolymerou, J. Albrecht, and P. Chahal, “A novel rigid-flex aperture coupledpatch antenna array,” in 2018 Asia-Pacific Microwave Conference (APMC), pp. 597–599, IEEE,2018

2017

92. J. A. Byford, M. I. M. Ghazali, S. Karuppuswami, B. L. Wright, and P. Chahal, “Demonstration ofRF and microwave passive circuits through 3-D printing and selective metalization,” IEEETransactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 3, pp. 463–471,2017

91. L. Hernandez, Y. He, A. Kaur, J. Papapolymerou, and P. Chahal, “Low-loss RF filter through acombination of additive manufacturing and thin-film process,” in 2017 IEEE Radio and WirelessSymposium (RWS), pp. 114–116, IEEE, 2017

90. M. I. M. Ghazali, S. Karuppuswami, A. Kaur, and P. Chahal, “3-D printed air substrates for thedesign and fabrication of RF components,” IEEE Transactions on Components, Packaging andManufacturing Technology, vol. 7, no. 6, pp. 982–989, 2017

89. Y. He, C. Oakley, P. Chahal, J. Albrecht, and J. Papapolymerou, “Aerosol Jet printed 24 GHzend-fire quasi-Yagi-Uda antenna on a 3-D printed cavity substrate,” in 2017 InternationalWorkshop on Antenna Technology: Small Antennas, Innovative Structures, and Applications(iWAT), pp. 179–182, IEEE, 2017

88. S. Mondal, M. I. M. Ghazali, S. Karuppuswami, A. Kaur, and P. Chahal, “A nonlinear transmissionline based harmonic RF tag,” in 2017 IEEE 67th Electronic Components and TechnologyConference (ECTC), pp. 2237–2242, IEEE, 2017

87. S. Karuppuswami, M. I. M. Ghazali, A. Kaur, and P. Chahal, “Multi-band harmonic RF tags forbarcode applications in a cluttered environment,” in 2017 IEEE 67th Electronic Components andTechnology Conference (ECTC), pp. 1861–1867, IEEE, 2017

86. S. Karuppuswami, N. Wiwatcharagoses, A. Kaur, and P. Chahal, “Capillary condensation basedwireless volatile molecular sensor,” in 2017 IEEE 67th Electronic Components and TechnologyConference (ECTC), pp. 1455–1460, IEEE, 2017

15

85. M. I. M. Ghazali, J. A. Byford, S. Karuppuswami, A. Kaur, J. Lennon, and P. Chahal, “3D printedout-of-plane antennas for use on high density boards,” in 2017 IEEE 67th Electronic Componentsand Technology Conference (ECTC), pp. 1835–1842, IEEE, 2017

84. M. Craton, J. A. Byford, V. Gjokaj, J. Papapolymerou, and P. Chahal, “3D printed high frequencycoaxial transmission line based circuits,” in 2017 IEEE 67th Electronic Components and TechnologyConference (ECTC), pp. 1080–1087, IEEE, 2017

83. V. Gjokaj, J. Doroshewitz, J. Nanzer, and P. Chahal, “A Design Study of 5G Antennas OptimizedUsing Genetic Algorithms,” in 2017 IEEE 67th Electronic Components and Technology Conference(ECTC), pp. 2086–2091, IEEE, 2017

82. C. Oakley, A. Kaur, J. A. Byford, and P. Chahal, “Aerosol-jet printed quasi-optical terahertzfilters,” in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),pp. 248–253, IEEE, 2017

81. Y. He, P. Chahal, and J. Papapolymerou, “A lego-like reconfigurable cavity using 3-D polyjettechnology,” in 2017 IEEE MTT-S International Microwave Symposium (IMS), pp. 525–528, IEEE,2017

80. S. Mukherjee, Y. Deng, L. Udpa, S. Udpa, P. Chahal, and E. Rothwell, “Microwave time reversalmirror for breast tumor detection,” in 2017 IEEE International Symposium on Antennas andPropagation & USNC/URSI National Radio Science Meeting, pp. 791–792, IEEE, 2017

79. V. Gjokaj, P. Chahal, J. Papapolymerou, and J. D. Albrecht, “A novel 3D printed vivaldi antennautilizing a substrate integrated waveguide transition,” in 2017 IEEE International Symposium onAntennas and Propagation & USNC/URSI National Radio Science Meeting, pp. 1253–1254, IEEE,2017

78. V. Gjokaj, P. Chahal, L. Kempel, and E. Rothwell, “A novel 3D printed half-width microstripleaky-wave antenna,” in 2017 IEEE International Symposium on Antennas and Propagation &USNC/URSI National Radio Science Meeting, pp. 1249–1250, IEEE, 2017

77. J. A. Byford and P. Chahal, “Common misunderstandings and challenges in learning gausss law ina junior level electromagnetic engineering course,” in International Conference on InteractiveCollaborative Learning, pp. 741–751, Springer, Cham, 2017

76. J. Doroshewitz, A. Kaur, J. Nanzer, and P. Chahal, “Multi-factor product authentication usingintegrated Quick Response (QR) code pixelated antenna,” in International Symposium onMicroelectronics, vol. 2017, pp. 000608–000612, International Microelectronics Assembly andPackaging Society, 2017

75. C. Oakley, P. Chahal, J. Papapolymerou, and J. D. Albrecht, “Fabrication of X-band Oscillator onLCP Substrate Using Aerosol Printing,” in International Symposium on Microelectronics, vol. 2017,pp. 000052–000055, International Microelectronics Assembly and Packaging Society, 2017

74. M. Craton, M. I. M. Ghazali, B. Wright, K. Y. Park, P. Chahal, and J. Papapolymerou, “3Dprinted integrated microfluidic cooling for high power RF applications,” in InternationalSymposium on Microelectronics, vol. 2017, pp. 000675–000680, International MicroelectronicsAssembly and Packaging Society, 2017

73. M. I. M. Ghazali, K. Y. Park, V. Gjokaj, A. Kaur, and P. Chahal, “3D printed metalized plasticwaveguides for microwave components,” in International Symposium on Microelectronics, vol. 2017,pp. 000078–000082, International Microelectronics Assembly and Packaging Society, 2017

16

72. M. I. M. Ghazali, K. Y. Park, V. Gjokaj, A. Kaur, and P. Chahal, “3D printed metalized plasticwaveguides for microwave components,” in International Symposium on Microelectronics, vol. 2017,pp. 000078–000082, International Microelectronics Assembly and Packaging Society, 2017

2016

71. M. I. M. Ghazali, K. Y. Park, J. A. Byford, J. Papapolymerou, and P. Chahal, “3d printedmetalized-polymer uwb high-gain vivaldi antennas,” in 2016 IEEE MTT-S International MicrowaveSymposium (IMS), pp. 1–4, IEEE, 2016

70. J. A. Byford and P. Chahal, “Ultra-wideband hybrid substrate integrated ribbon waveguides using3d printing,” in 2016 IEEE MTT-S International Microwave Symposium (IMS), pp. 1–4, IEEE,2016

69. S. Karuppuswami, A. Kaur, M. I. M. Ghazali, and P. Chahal, “Rfid compatible sensor tags forremote liquid sample interrogation,” in 2016 IEEE 66th Electronic Components and TechnologyConference (ECTC), pp. 2401–2407, IEEE, 2016

68. M. I. M. Ghazali, S. Karuppuswami, and P. Chahal, “Embedded passive rf tags towardsintrinsically locatable buried plastic materials,” in 2016 IEEE 66th Electronic Components andTechnology Conference (ECTC), pp. 2575–2580, IEEE, 2016

67. S. Karuppuswami, H. Arangali, and P. Chahal, “A hybrid electrical-mechanical wirelessmagnetoelastic sensor for liquid sample measurements,” in 2016 IEEE 66th Electronic Componentsand Technology Conference (ECTC), pp. 2535–2540, IEEE, 2016

66. K. Y. Park, P. Chahal, and N. Wiwatcharagoses, “Ultra-miniaturized planar absorbingmetamaterial structures for millimeter wave and terahertz imaging array,” in 2016 IEEE 66thElectronic Components and Technology Conference (ECTC), pp. 2239–2244, IEEE, 2016

65. N. Wiwatcharagoses, K. Y. Park, and P. Chahal, “Metamaterial-inspired sensor on porous substratefor detection of volatile organic compounds in air,” in 2016 IEEE 66th Electronic Components andTechnology Conference (ECTC), pp. 1557–1562, IEEE, 2016

64. J. A. Byford, Z. Purtill, and P. Chahal, “Fabrication of terahertz components using 3d printedtemplates,” in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),pp. 817–822, IEEE, 2016

63. A. L. Allafi, P. Chahal, R. Mukherjee, and H. K. Khalil, “A control strategy for eliminatingbouncing in rf mems switches,” in ASME 2016 Dynamic Systems and Control Conference,American Society of Mechanical Engineers Digital Collection, 2016

62. M. SAYBOLT, S. MUKHERJEE, L. UDPA, and P. CHAHAL, “A low cost microwave imagingsystem using a 6-port reflectometer for nde of composites,” in Proceedings of the American Societyfor Composites: Thirty-First Technical Conference, 2016

2015

61. J. A. Byford, K. Y. Park, and P. Chahal, “Metamaterial inspired periodic structure used formicrofluidic sensing,” in 2015 IEEE 65th Electronic Components and Technology Conference(ECTC), pp. 1997–2002, 2015

60. A. Kaur, J. C. Myers, M. I. M. Ghazali, J. Byford, and P. Chahal, “Affordable terahertzcomponents using 3D printing,” in 2015 IEEE 65th Electronic Components and TechnologyConference (ECTC), pp. 2071–2076, 2015

17

59. J. C. Myers, A. Kaur, J. A. Byford, and P. Chahal, “Investigation of modulation-capable siliconwaveguides for efficient on-wafer terahertz interconnects,” in 2015 IEEE 65th ElectronicComponents and Technology Conference (ECTC), pp. 1010–1016, 2015

58. J. C. Myers, A. Kaur, K. Y. Park, and P. Chahal, “Design of thin-film quasi-optical terahertzcomponents using evolutionary algorithms,” in 2015 IEEE 65th Electronic Components andTechnology Conference (ECTC), pp. 2012–2019, 2015

57. M. I. M. Ghazali, E. Gutierrez, J. C. Myers, A. Kaur, B. Wright, and P. Chahal, “Affordable 3Dprinted microwave antennas,” in 2015 IEEE 65th Electronic Components and TechnologyConference (ECTC), pp. 240–246, 2015

56. M. Yuan, P. Chahal, E. C. Alocilja, and S. Chakrabartty, “Sensing by growing antennas: A novelapproach for designing passive RFID based biosensors,” in 2015 IEEE International Symposium onCircuits and Systems (ISCAS), pp. 2121–2124, 2015

55. T. Ozdemir, Y. M. Goykhman, A. R. Brown, B. Crowgey, E. J. Rothwell, and P. Chahal,“Frequency tunable antenna for LTE (4G) handsets operating in the 2.3–2.7 GHz global roamingband,” in 2015 IEEE International Symposium on Antennas and Propagation & USNC/URSINational Radio Science Meeting, pp. 1134–1135, 2015

2014

54. J. A. Hejase, S. S. Shane, K. Y. Park, and P. Chahal, “Nondestructive millimeter wave imaging andspectroscopy using dielectric focusing probes,” in AIP Conference Proceedings, vol. 1581,pp. 1588–1593, 2014

53. P. Chahal, J. A. Hejase, S. Shane, K. Y. Park, A. Kaur, and J. Byford, “Millimeter wave andterahertz dielectric probe microfluidic sensors,” in 2014 39th International Conference on Infrared,Millimeter, and Terahertz waves (IRMMW-THz), pp. 1–2, 2014

52. K. Y. Park and P. Chahal, “Novel THz imaging array using high resistivity metasurfaces,” in 2014IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 775–781, 2014

51. X. Yang, A. Kaur, and P. Chahal, “Embedded diodes for microwave and millimeter wave circuits,”in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 2144–2150,2014

50. A. Kaur, X. Yang, and P. Chahal, “Study of microwave circuits based on Metal-Insulator-Metal(MIM) diodes on flex substrates,” in 2014 IEEE 64th Electronic Components and TechnologyConference (ECTC), pp. 2168–2174, 2014

49. K. Y. Park and P. Chahal, “A near-field spoof plasmon THz probe using metallized 3-D printedplastic,” in 2014 39th International Conference on Infrared, Millimeter, and Terahertz waves(IRMMW-THz), pp. 1–2, 2014

48. K. Akinlabi-Oladimeji, E. J. Rothwell, and P. Chahal, “Free-space characterization ofconductor-backed absorbing materials using an aperture screen,” in 2014 USNC-URSI RadioScience Meeting (Joint with AP-S Symposium), pp. 15–15, 2014

2013

47. N. Wiwatcharagoses, K. Y. Park, P. Chahal, and L. Udpa, “Metamaterial-inspired miniaturizedmicrowave edge coupled surface scanning probe,” in AIP Conference Proceedings, vol. 1511,pp. 1789–1794, 2013

18

46. X. Yang, A. Kaur, and P. Chahal, “Implementation of semiconducting nanowires for the design ofTHz detectors,” in 2013 IEEE 63rd Electronic Components and Technology Conference,pp. 2375–2380, 2013

45. J. C. Myers, B. S. Strachan, X. Yang, and P. Chahal, “Integration of piezoelectric energy harvestingand antenna elements on a common substrate,” in 2013 IEEE 63rd Electronic Components andTechnology Conference, pp. 1662–1666, 2013

44. A. Kaur, K. Y. Park, X. Yang, N. Wiwatcharagoses, and P. Chahal, “Terahertz micropolarizersusing carbon microfibers,” in 2013 IEEE 63rd Electronic Components and Technology Conference,pp. 2102–2106, 2013

43. A. Kaur, X. Yang, K. Y. Park, and P. Chahal, “Reduced graphene oxide based schottky diode onflex substrate for microwave circuit applications,” in 2013 IEEE 63rd Electronic Components andTechnology Conference, pp. 1037–1042, 2013

42. J. C. Myers, P. Chahal, and E. Rothwell, “A multi-layered metamaterial inspired dynamicallytunable antenna,” in IEEE Antennas and Propagation Society International Symposium(APSURSI), pp. 934–935, 2013

41. K. Y. Park, C. S. Meierbachtol, and P. Chahal, “Enhanced bandwidth bull’s eye antenna usingcorrugated metalized plastic,” in IEEE Antennas and Propagation Society International Symposium(APSURSI), pp. 970–971, 2013

40. J. Myers, P. Chahal, and E. Rothwell, “A multilayered metamaterial inspired dynamically tunableantenna,” in IEEE International Symposium Digest Antennas and Propogation, vol. 1, pp. 934–934,2013

39. K. Y. Park, N. Wiwatcharagoses, and P. Chahal, “Wafer-level integration of micro-lens for THzfocal plane array application,” in 2013 IEEE 63rd Electronic Components and TechnologyConference, pp. 1912–1919, 2013

2012

38. L. C. A. Silveira, J. A. Hejase, and P. Chahal, “A terahertz photonic crystal structure for sensingapplications,” in Proceedings of the 2012 IEEE International Symposium on Antennas andPropagation, pp. 1–2, 2012

37. J. Hejase, E. Rothwell, and P. Chahal, “A multiple angle material parameter extraction method forstacked layers of dielectrics using thz time domain spectroscopy,” in AIP Conference Proceedings,vol. 1430, pp. 581–588, 2012

36. N. Wiwatcharagoses, K. Y. Park, and P. Chahal, “Metamaterial-inspired miniaturized microwavesensing probes,” in 2012 IEEE 62nd Electronic Components and Technology Conference,pp. 2106–2111, 2012

35. P. Chahal, J. Myers, K. Y. Park, C. Meierbachtol, and N. Nair, “Planar surface plasmonicstructures for terahertz circuits and sensors,” in 2012 IEEE 62nd Electronic Components andTechnology Conference, pp. 930–935, 2012

34. K. Y. Park, N. Wiwatcharagoses, C. A. Silveira, and P. Chahal, “Plastic injection micromolding ofTHz circuits and microfluidic sensors,” in 2012 IEEE 62nd Electronic Components and TechnologyConference, pp. 1562–1566, 2012

33. N. Wiwatcharagoses, K. Y. Park, and P. Chahal, “Metamaterial transmission line basedreconfigurable X-band phase shifter design,” in 2012 IEEE 62nd Electronic Components andTechnology Conference, pp. 2018–2024, 2012

19

32. X. Yang and P. Chahal, “THz ribbon waveguides using polymer-ceramic nanocomposites,” in 2012IEEE 62nd Electronic Components and Technology Conference, pp. 225–230, 2012

31. K. Y. Park, C. S. Meierbachtol, N. Wiwatcharagoses, and P. Chahal, “Surface plasmon-assistedterahertz imaging array,” in 2012 IEEE 62nd Electronic Components and Technology Conference,pp. 1846–1851, 2012

30. K. Y. Park, N. Wiwatcharagoses, and P. Chahal, “Miniaturization of microstrip band stop filterusing a novel periodic structure,” in Proceedings of the 2012 IEEE International Symposium onAntennas and Propagation, pp. 1–2, 2012

29. N. Wiwatcharagoses, K. Y. Park, and P. Chahal, “A modified split ring resonator loadedminiaturized reconfigurable antenna,” in Proceedings of the 2012 IEEE International Symposium onAntennas and Propagation, pp. 1–2, 2012

28. J. C. Myers, C. S. Meierbachtol, J. A. Hejase, and P. Chahal, “Plasmonic waveguide coupling atterahertz frequencies,” in Proceedings of the 2012 IEEE International Symposium on Antennas andPropagation, pp. 1–2, 2012

27. “A metamaterial-inspired high-Q X-band oscillator, author=Park, Kyoung Youl andWiwatcharagoses, Nophadon and Chahal, Premjeet,” in Proceedings of the 2012 IEEE InternationalSymposium on Antennas and Propagation, pp. 1–2, 2012

2011

26. J. A. Hejase, B. Schulte, and P. Chahal, “Design and test of wide-band terahertz dielectricsub-wavelength focusing probes,” in 2011 IEEE 61st Electronic Components and TechnologyConference (ECTC), pp. 1035–1040, 2011

25. N. Wiwatcharagoses, K. Y. Park, J. A. Hejase, L. Williamson, and P. Chahal, “Microwaveartificially structured periodic media microfluidic sensor,” in 2011 IEEE 61st ElectronicComponents and Technology Conference (ECTC), pp. 1889–1893, 2011

24. N. Wiwatcharagoses and P. Chahal, “A novel reconfigurable metamaterial unit cell based compositeright/left handed microstrip design,” in 2011 IEEE International Symposium on Antennas andPropagation (APSURSI), pp. 2954–2957, 2011

23. J. A. Hejase, J. Myers, L. Kempel, and P. Chahal, “Design study of electronically steerablehalf-width microstrip leaky wave antennas,” in 2011 IEEE 61st Electronic Components andTechnology Conference (ECTC), pp. 1348–1353, 2011

22. K. Y. Park, J. A. Hejase, C. S. Meierbachtol, N. Wiwatcharagoses, and P. Chahal,“Metamaterial-inspired absorbers for terahertz packaging applications,” in 2011 IEEE 61stElectronic Components and Technology Conference (ECTC), pp. 2107–2113, 2011

21. L. Kempel, E. Rothwell, B. Shanker, and P. Chahal, “Theoretical analysis of a varactor-loadedhalf-width leaky-wave antenna,” in 2011 IEEE XXXth URSI General Assembly and ScientificSymposium, pp. 1–4, 2011

20. X. Yang and P. Chahal, “Large-area low-cost substrate compatible CNT Schottky diode for THzdetection,” in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC),pp. 2158–2164, 2011

19. N. Wiwatcharagoses, K. Y. Park, and P. Chahal, “A new metamaterial unit cell for compactmicrostrip circuit designs,” in 2011 IEEE 61st Electronic Components and Technology Conference(ECTC), pp. 169–172, 2011

20

18. K. Y. Park, N. Wiwatcharagoses, A. Baczewski, and P. Chahal, “A novel terahertz power meterusing metamaterial-inspired thin-film absorber,” in 2011 IEEE International Conference onInfrared, Millimeter, and Terahertz Waves, pp. 1–2, 2011

17. X. Yang, J. Hejase, P. Paladhi, and P. Chahal, “Planar terahertz circuits using thin dielectricwaveguides,” in 2011 IEEE International Conference on Infrared, Millimeter, and Terahertz Waves,pp. 1–2, 2011

16. K. Y. Park, N. Wiwatcharagoses, and P. Chahal, “Plastic injection micromachining of millimeterand sub-millimeter rectangular waveguide filters,” in 2011 IEEE International Conference onInfrared, Millimeter, and Terahertz Waves, pp. 1–2, 2011

2010

15. C. Meierbachtol, T. Brown, P. Chahal, and B. Shanker, “Development of a novel hemt-basedplasmonic sensor,” in 2010 IEEE Antennas and Propagation Society International Symposium,pp. 1–4, 2010

14. J. A. Hejase, P. R. Paladhi, and P. Chahal, “Terahertz packaging: Study of substrates for novelcomponent designs,” in 2010 IEEE Proceedings 60th Electronic Components and TechnologyConference (ECTC), pp. 744–751, IEEE, 2010

13. C. Meierbachtol, , and P. Chahal, “Simulation of a subwavelength aperture - micro sensor system,”in 2010 IEEE Lester Eastman Conference on High Performance Devices, pp. 1–2, 2010

12. P. Paladhi, J. Hejase, C. Gardner, C. Meierbachtol, and P. Chahal, “Application of taguchi methodto determine exact thicknesses of a stacked dielectric,” in 2010 Inverse Problems Symposium,pp. 1–2, 2010

2009 and Earlier

11. B. Pillans, F. Morris, P. Chahal, G. Frazier, and J.-B. Lee, “Schottky contact rf mems switchcharacterization,” in 2007 IEEE/MTT-S International Microwave Symposium, pp. 379–382, 2007

10. S. Bhattacharya, M. Varadarajan, P. Chahal, K. J. Lee, A. Bhattacharjee, R. R. Tummala,S. Sitaraman, J. Papapolymerou, M. Tentzeris, and J. Laskar, SOP Embedded Thin Film Resistorson High and Low Loss Thin Film Dielectrics, vol. Advances in Electronic Packaging, Parts A, B,and C of International Electronic Packaging Technical Conference and Exhibition. 2005

9. P. Chahal, F. Morris, and G. Frazier, “50 ghz resonant tunneling diode relaxation oscillator,” inConference Digest Device Research Conference, 2004. 62nd DRC., pp. 241–242 vol.1, June 2004

8. P. Chahal, R. Tummala, M. Allen, and G. White, “Electroless ni-p/ni-wp thin-film resistors formcm-l based technologies,” in 48th IEEE Electronic Components and Technology Conference (Cat.No. 98CH36206), pp. 232–239, 1998

7. V. Agarwal, P. Chahal, R. R. Tummala, and M. G. Allen, “Improvements and recent advances innanocomposite capacitors using a colloidal technique,” in 48th IEEE Electronic Components andTechnology Conference (Cat. No. 98CH36206), pp. 165–170, 1998

6. R. Tummala, P. Chahal, and S. Bhattacharya, “Recent advances in integral passives at prc,” inIMAPS 35th Nordic Conference, Sweden, 1998

5. S. K. Bhattacharya, Y. W. Kim, P. Chahal, M. G. Allen, R. R. Tummala, and R. L. Hubbard,“Mcm-l compatible integrated resistors and capacitors,” in Proceedings. 4th InternationalSymposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153), pp. 295–299, 1998

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4. P. Chahal, A. Haridass, A. Pham, R. Tummala, M. Allen, M. Swaminathan, and J. Laskar,“Integration of thin film passive circuits using high/low dielectric constant materials,” in IEEE 47thElectronic Components and Technology Conference, pp. 739–744, 1997

3. J. Bandyopadhyay, P. Chahal, and M. Swaminathan, “Importance of damping and resonance inthin-film integrated decoupling capacitor design,” in Electrical Performance of ElectronicPackaging, pp. 31–34, 1997

2. S. Bhattacharya, R. Tummala, P. Chahal, and G. White, “Integration of polymer/ceramic thin filmcapacitor on pwb,” in Proceedings 3rd International Symposium on Advanced Packaging MaterialsProcesses, Properties and Interfaces, pp. 68–70, IEEE, 1997

1. P. Chahal, R. R. Tummala, and M. G. Allen, “Integrated capacitors using polymer-ceramiccomposites for mcm-l,” in Proceedings-SPIE The International Society for Optical Engineering,pp. 126–131, 1996

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