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02.202
0
External cylindrical grinding tools in CBN and diamond
Honing and finishing tools made of corundum and silicon carbide
02.202
0
Top class diamond dressing tools of highly advanced technology
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in corundum and silicon carbide
02.202
0
External cylindrical grinding tools in CBN and diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Top class diamond dressing tools ofhighly advanced technology
Precision grinding tools for the semi-conductor industry
Internal cylindrical grinding in corund-um and silicon carbide
Internal cylindrical grinding in CBN and diamond
Dimension: IGF 125° 2.85x4.3/M2.5
Specification: B35VX-AS71615
Material: AISI 440
Stock removal seat / bore: 0.04mm / 0.1 mm
Dressing interval seat / bore: 80 / 160 pcs.
Surface quality seat / bore: Ra 0.08 / Rz 0.5 Ra 0.1 / Rz 0.63
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
02
.2021
Grinding competence for high level industrial applications
Case Study:GDI
Double disk fine grinding wheels in CBN and diamond
02.202
0
Double disk fine grinding wheels inCBN and diamond
Internal cylindrical grinding in CBN and diamond
02.202
0
Honing and finishing tools made of corundum and silicon carbide
02.202
0
Top class diamond dressing tools of highly advanced technology
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in corundum and silicon carbide
02.202
0
Internal cylindrical grinding in CBNand diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Top class diamond dressing tools ofhighly advanced technology
Precision grinding tools for the semi-conductor industry
Internal cylindrical grinding in corund-um and silicon carbide
Double disk fine grinding wheels in CBN and diamond
02.202
0
Double disk fine grinding wheels inCBN and diamond
Dimension:14A1R 500x45x203.2 X=5/4 U=11.2/19.8
Specification: CB47-126-125-V-358450
Material: X46Cr13
Dressing interval: 450 pcs.
Cycle time: 14 sec.
Stock removal: 0.2 mm
02
.2021
Grinding competence for high level industrial applications
Case Study:Hollow shaft
External cylindrical grinding tools in CBN and diamond
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
Internal cylindrical grinding in CBN and diamond
02.202
0
02.202
0
External cylindrical grinding tools in CBN and diamond
Top class diamond dressing tools of highly advanced technology
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in corundum and silicon carbide
02.202
0
Internal cylindrical grinding in CBNand diamond
External cylindrical grinding tools in CBN and diamond
Top class diamond dressing tools ofhighly advanced technology
Precision grinding tools for the semi-conductor industry
Internal cylindrical grinding in corund-um and silicon carbide
Double disk fine grinding wheels in CBN and diamond
02.202
0
Double disk fine grinding wheels inCBN and diamond
Honing and finishing tools made of corundum and silicon carbide
Dimension: 18x4.5x100 R=2.4 / R=13
Specification: 55C/5 1000-45 V781 PS
Surface quality: Ra 0.1 ; Rz 1.0
RPM workpiece: 370 1/min / 500 1/min
Passes: 6 / 2
Oscillation angle: 2.2° / 2°
02
.2021
Grinding competence for high level industrial applications
Case Study:Rack finishing EPS
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
Internal cylindrical grinding in CBN and diamond
02.202
0
02.202
0
External cylindrical grinding tools in CBN and diamond
Honing and finishing tools made of corundum and silicon carbide
02.202
0
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in corundum and silicon carbide
02.202
0
Internal cylindrical grinding in CBNand diamond
External cylindrical grinding tools in CBN and diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Precision grinding tools for the semi-conductor industry
Internal cylindrical grinding in corund-um and silicon carbide
Double disk fine grinding wheels in CBN and diamond
02.202
0
Double disk fine grinding wheels inCBN and diamond
Top class diamond dressing tools of highly advanced technology
Case Study:Stationary dresser valve stem
Dimension:DT 20x33x6 X=5 W=3 5 CVD-Inserts 0.6 x 0.6
Specification: D45-252-175-H-328658
Grinding wheel: CBN B64 ø600 x 108 mm
Surface quality: Ra 0.25 ; Rz 1.6
Dressing amount: 2 x 0.004 mm
Dressing interval: 5000 pcs.
02
.2021
Grinding competence for high level industrial applications
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
Internal cylindrical grinding in CBN and diamond
02.202
0
02.202
0
External cylindrical grinding tools in CBN and diamond
Honing and finishing tools made of corundum and silicon carbide
02.202
0
Top class diamond dressing tools of highly advanced technology
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in CBNand diamond
External cylindrical grinding tools in CBN and diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Top class diamond dressing tools ofhighly advanced technology
Precision grinding tools for the semi-conductor industry
Double disk fine grinding wheels in CBN and diamond
02.202
0
Double disk fine grinding wheels inCBN and diamond
Internal cylindrical grinding in corundum and silicon carbide
Dimension: 72x56x22
Specification: 550A-100-K-10-155-V302T-3
Material: 100Cr6
Dressing interval: 7 Stk.
Time savings: 6 sec. / pcs.
Surface quality: Ra 0.31 ; Rz 2
02
.2021
Grinding competence for high level industrial applications
Case Study:Wheel bearing
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
Internal cylindrical grinding in CBNand diamond
External cylindrical grinding tools in CBN and diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Top class diamond dressing tools ofhighly advanced technology
Internal cylindrical grinding in corund-um and silicon carbide
Double disk fine grinding wheels in CBN and diamond
Dimension: 1A2T 720x40x320 X=5 W=200
Specification: CB55-76-75-V-357220
Material: 1.1248 / CK spring steel
Dressing interval: 3x / week
Wheel wear: 2µm/h
Surface quality: Ra 0.25 ; Rz 1.7
02
.2021
Grinding competence for high level industrial applications
Case Study:Spring steel
02.202
0
External cylindrical grinding tools in CBN and diamond
Honing and finishing tools made of corundum and silicon carbide
02.202
0
Top class diamond dressing tools of highly advanced technology
Precision grinding tools for the semiconductor industry
Internal cylindrical grinding in corundum and silicon carbide
02.202
0
Internal cylindrical grinding in CBN and diamond
02.202
0
Internal cylindrical grinding in CBNand diamond
External cylindrical grinding tools in CBN and diamond
Honing and finis-hing tools made ofcorundum and sili-con carbide
Top class diamond dressing tools ofhighly advanced technology
Precision grinding tools for the semi-conductor industry
Internal cylindrical grinding in corund-um and silicon carbide
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
Double disk fine grinding wheels inCBN and diamond
Precision grinding tools for the semiconductor industry
ISO 25178
SP: 51.19 Ångström
Sv: 71.14 Ångström
Sz: 122.3 Ångström
Sa: 9.39 Ångström
Sq: 11.81 Ångström
02
.2021
Grinding competence for high level industrial applications
Case Study:Ultra fine grinding on large SiC-Wafer
Switzerland
Meister Abrasives AG HeadquarterIndustriestrasse 10CH-8450 AndelfingenTel. +41 52 304 22 [email protected]
Italy
Meister Abrasivi s.r.l.Via Giacomo Matteotti 54IT - 20017 Rho (MI)Tel. +39 02 931 82 [email protected]
Germany
Alfons Schmeier GmbH & Co. KGFeldweg 3D-95233 HelmbrechtsTel. +49 9252 3508 [email protected]
China
Meister Abrasives China1988 Dongfang Road200125 ShanghaiTel. +86 21 61 096 [email protected]
USA
Meister Abrasives USA Inc.201 Circuit DriveNorth Kingstown, RI 02852Tel. +1 [email protected]
High-tech processes in the manufacture of semiconductor components require high-precision diamond grinding tools.
Your benefits:• Customer specific Solutions• Surface qualities in Angstrom ranges• Grinding of ultra-thin wafers• Processing of Si, SiC, Saphir, GaN, InP,
GaAS, LiNbO3, LiTaO3, glass, glass ceramic, and other hard materials
For more information:www.meister-abrasives.com/technology
VM (DIA)Diamond micro grains for precise geome-tries and best surface qualities
3D (DIA)3D diamond structure with extremely high pore volume for maximum service life and low grin-ding forces with the best surface quality
Technologies:
Vit (DIA)High cutting volumes and high wear resistan-ce for best economy
Ceramet (DIA)Hybrid bond with high wear resistance and exceptional cutting performance for de-manding hard material processing