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Power Choke Presentation
Shenzehn Maji Dianzi Youxiain Gongsi
Suzhou Somotil Elec-tech Co,Ltd
Outline
• Applications for Power Choke
• Principles of Inductors and Magnetic
Materials
• Characteristics Design
• Inductor Introduction
• MJC Power Choke
SMD Power Inductor
Dip Inductor
SMD Chip Inductor
Dip Bead Inductor
SMD Chip Bead
Dip Bead
Classifying
Major Applications for Power Choke
UMPC / NBPC
Cell Phone / PDA
Graph Cards
Server Systems
Lap Top
PS3
Desk Top / LCD Monitor POL
EMS
PC/IT Others Communications Consumer
Retail Market、Consumer Market
Brands、Traders
Supply Chain of IT
Up
stream
Middle
stream
Down
stream
Brands
Market
Raw materials
R&D Co,. Parts Modules Equipment Vendor
Mechanical Parts Passive Active
Electronic
Components
What is the Inductor?
• Coil stores energy with magnet field is called inductance, the coil as the
inductor.
• The symbol for inductance is L.
• The unit is Henry (H)
1mH = 10-3H
1μH = 10-6H
1 nH = 10-3μH = 10-6mH
• V = L ×（di/dt）
Ohm inductive theorem
V = L ×（di/dt）
V: Induced voltage
L=:inductance
di/dt: Current rates of change
Inductor Charge and Discharge
PWM (Pulse Width Modulation) Circuit
An integral part of PWM Circuit
(VRM ：Voltage Regulator Module)
• PWM IC (Controller)
• MOSFET
• Inductor (Choke)
• Capacitor
Electric Circuit of Power Supply
Circuit Classifying
Choke Application in Buck Circuit
In Buck Circuit (Vin > Vout):
△I=(Vin-Vout)/L*(Vout/Vin)/Frequency
△I: Ripple Current, L: Inductance
Copper Loss: I2 × Rdc
Core Loss:
Hmax
Bmax
Hmin
Bmin
Choke Application in Boost Circuit
In Boost Circuit (Vout > Vin):
△I=(Vout-Vin)/L*(Vin/Vout)/Frequency
△I: Ripple Current, L: Inductance
Core Loss:
Hmax
Bmax
Hmin
Bmin
Copper Loss: I2 × Rdc
* Example: Choke Selection for Heavy Load Application
(100 kHz, 12 Vin, 5 Vout)
Core Loss Dominated Copper Loss Dominated
Customer Selected
MJC Suggested
(100 kHz, 12 Vin, 5 Vout)
Core Loss Dominated Copper Loss Dominated
Customer Selected
MJC Suggested
* Example: Choke Selection for Heavy Load Application
Outline
• Applications for Power Choke
• Principles of Inductors and Magnetic
Materials
• Characteristics Design
• Inductor Introduction
• MJC Power Choke
磁性材料簡表
D.磁性材料
Ferrite
Mn-Zn : 優點: 導磁率高,低能量轉換損耗,飽和磁束密度高.
缺點:電阻值低,導磁率公差較大,熱敏感度高.
Ni-Zn : 優點: 電阻值高,價格低,容易加工…..
缺點: 飽和磁束密度低,熱敏感度高.
D.磁性材料
B-H curve introduction
Different density AC B-H curve T-core fabricated by 緯格
• 100 kHz AC B-H curve measurement by IWASU
• Test core ：6mm*3mm*1mm (OD/ID/H)
JMC JRM40LG B-H curve
0
50
100
150
200
250
300
350
400
450
500
0 500 1000 1500 2000
Hm (A/m)
Bm
(m
T)
100kHz
Outline
• Applications for Power Choke
• Principles of Inductors and Magnetic
Materials
• Characteristics Design
• Inductor Introduction
• MJC Power Choke
Simulation capability • B/H Field • Core-Loss • Inductance • Saturation Current
Function analyzer • LCR / DCR Meter • Efficiency system • Power loss system • Failure analysis
Material research • Magnetic powder • Insulated coating • Binder system
Coil • Coil winding • Pressing electrode
Inter connection • Laser welding • Spot welding • Soldering
MJC Power Choke Technology Platform
Packaging • Powder molded • Powder injected • Assembled
Small choke
0.29
2.12
0.31
0.5 1.33
2.64
0.398
0.1
0.9
Unit：mm
1.15
線徑
圈數
長度
DCR
R=ρ* L/A
ρ= 0.021992664 mΩ-mm
名詞參數
1.靜態電感值 L0 ( Inductance ) :
在無任何外加電流負載情況下的起始電感值,一般使用
LCR Meter測試.
B.名詞參數
2.測試頻率 f ( Frequency ) :
使用LCR Meter 測試時的頻率條件.其頻率輸出為一無
負載之正弦波訊號.
3.測試電壓 V ( Voltage ) :
使用LCR Meter 測試時的電壓條件.
Bpk = Vrms / 4.44ANf
環型線圈磁束密度計算公式
4.電感值公差 ( Inductance Tolerance ) :
標準電感值公差一般以英文字母表示如下表:
B.名詞參數
5.額定電流 Irms ( Rate Current ) :
泛指電感線圈通過電流負載時,因銅線阻抗所造成的溫昇達
到額定溫度時的電流值,決定銅線溫昇的主因為直流損耗及
高頻集膚效應.
Letter Tolerance Letter Tolerance
J ± 5% M ± 20%
K ± 10% N ± 30%
L ± 15%
W = I² x DCR
銅線損耗計算
B.名詞參數
6.飽和電流 Isat ( Saturation Current ) :
當電流上升而導致電感值下降的現象稱之為磁飽和,電感的
飽和電流會隨著製造廠的定義有所不同,常見為導致靜態電
感達到80%為標準.下圖為磁飽和示意:
B=Ø /A
B: 磁束密度
Ø: 磁力線數
A: 磁體截面積
H=NI / l
H: 磁場強度 N: 銅線圈數
I: 電流 l:平均磁路徑 L = μN²A/ l
7.銅線阻抗 DCR ( DC Resistance ) :
靜態測試時的銅線阻抗,可藉由DCR值的大小來判定電感的額
定電流值是否正確.
B.參數定義
8.導磁率 µ ( Permeability ) :
導磁率是以描述材料被磁化之難易程度,亦即導通磁力線之
能力.對相同材料而言,導磁率並非一個定常數,其與外加磁
場強度(H)及磁通密度(B)之比例有關。
9. AL值 :
由於使用透磁率換算電感值時需要冗長的計算程序，所以
供應商都會提供比較容易執行換算的AL值.
B.名詞參數
L = AL x Nx
AL公式應用(μ×Ae)
10. Core Loss :
磁性材料在磁電能量轉換當中,會有能量轉換的功率損耗,
通常耗功以熱能方式表現,可分類如下:
a.磁滯損耗 (低頻影響大)
b.渦流損耗 (高頻影響大)
c.剩餘損耗 (一般忽略不記)
Outline
• Applications for Power Choke
• Principles of Inductors and Magnetic
Materials
• Characteristics Design
• Inductor Introduction
• MJC Power Choke
電感分類
由於電感的形成乃是由導電體繞過磁性體後,形成一
環狀迴路稱之為線圈,而其形式更是複雜多變,大致上可以
依下列所示區分:
1.SMD 表面黏著式.
1.1積層式晶片電感: 常用於抑制電子迴路上的低
功率高頻雜訊.各式應用皆能發現其蹤跡.
QT,QTL SERIES QHL SERIES
C.電感分類
1.2 繞線式晶片電感:提供高電流特性的晶片電感.
常見應用實例如: LCD Monitor, DVD Recorder,
xDSL, Cable Modem, Mother Board, VGA Card,
Notebook PC…………..
CML SERIES
QPI SERIES
開放型磁路
開放型磁路
C.電感分類
1.3開磁路SMD功率電感:適用於各式DC/DC儲能
電感運用.
QPC SERIES
SPT SERIES
開放型磁路
開放型磁路
C.電感分類
1.4閉磁路SMD功率電感:適用於各式DC/DC儲能
電感運用.
QPCR SERIES
QPCRH SERIES
C.電感分類
封閉型磁路
封閉型磁路
2.DIP 插件式.
2.1色碼電感:
AL SERIES
DR SERIES
2.2 開磁路工字型電感
開放型磁路
開放型磁路
C.電感分類
DRR SERIES
2.2 閉磁路工字型(加磁套)電感
C.電感分類
2.3 開磁路棒型電感:
R SERIES
開放型磁路
封閉型磁路
M SERIES
2.4閉磁路環型電感:適用於各式大電流電源儲
能電感運用.
常見應用實例如:主機板、伺服器、電源供應
器、多功能事務機、直流轉換器 ……..
封閉型磁路
C.電感分類
Outline
• Applications for Power Choke
• Principles of Inductors and Magnetic
Materials
• Characteristics Design
• Inductor Introduction
• MJC Power Choke
Schematic diagram of the internal structure
winding
绕 线
Pressing
裁 切
welding
點銲
Molded/ Injected
粉末成型
Forming
電極成型
Tapping
包 装
Powder
造 粉
Electrodes Coil Powder
Function test
测 试
Power Choke Process Flow
P
r
o
c
e
s
s
P
r
o
d
u
c
t
Function
test/Tapping
Power Choke Process Flow
Winding Welding Pressing Molding Forming V/C
Stripping
copper wire
& winding
the wire as
a coil
Joint the
coil & lead
frame
together by
laser or
spot
welding
Cut off the
lead frame
as a single
piece of coil
by pressing
Inserting
the coil into
powder by
molding
Bending the
leads which
are out of
powder
body as
electrodes
To visual
check the
appearance
of all
products
Testing
inductance,
DCR, then
packaging
to a reel by
tapping
machine
Pressing 6~8 ton/cm2
Construction Forming
Insulated powder
Coil
Excellent power dissipation
Magnetic Technology in Power Choke
Strength:
- High saturated current
- Low eddy current
- High power density
Constraint:
- Low inductance
Process Technology: Molding
Major Competitor: Cyntec, Vishay-Dale,
Tokin, Panasonic, …
Applications: POL, VRM, DC/DC converter
MJC’s winding patent:
Start outside, end outside
- Approved: China
- In process: China, USA, Japan
MJC’s v.s. Vishay’s winding patents
Vishay’s winding patent:
Start inside, end outside
MJCC powder MJCB powder
SEM 3000x SEM 200x
Know How of Powder Materials
MJC owned Know How: 1. Material combination for performance requirements
2. Insulated coating technology
3. Binder system
Capability of Simulation:
B/H Field simulation
Core-loss simulation
Inductance simulation
Saturation current simulation
Choke Simulation Capability
1.Draft 3D Model
Software : Ansoft Maxwell
2. Measure Material Property
by IWATSU B-H/u Analyzer
3. Input Material Property
into Software
Magnetic Flux Simulation
Magnetic Flux Simulation
B Field of
Modeling Type
Power Choke
B Filed of
Assembly Type
Power Choke
Magnetic flux checked at 8 A
• Isat = 11.2 A
1.275 mm
2.465 mm
9.6 mm
3.62 mm
1 mm
方柱
Core-loss Simulation
Core-loss with 30 Amp.,
200 kHz AC input.
Saturation Current Simulation VS Experiment
The differences between experimental and simulated results
for 220 and 150 nH Power Choke are less than 5% !!
MJCB Power Choke Series
Size:
• 4x4x2 mm
5x5x3 mm
6x6x1.8/ 6x6x2.4/ 6x6x3/ 6x6x4/ 6x6x5 mm
10x10x3/ 10x10x4/ 10x10x4.5 mm
• 5~70A applications
• High permeability material • Low DC resistance
• Low temperature rise
Features:
MJCC Power Choke Series
Features:
Size:
• 6x6x3 mm
10x10x4 mm
13x13x3.5/ 13x13x5 mm
• 3.8~75A applications
• Low permeability • High saturation current
• Low inductance drop
Low Profile Molded Type Power
Choke Features:
Low Profile
High Current
Size:
• MJC: 4x4x2 mm, 6~45A
7x7x1.8mm, 6~45A
7x7x2.4mm, 10~70A
8x8x1.1m
• MJC: 5x5x3mm, 3.8~11A
Benchmark between Assembly and Molding Type
-
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 10 20 30 40 50 60
DC Bias Current (A)
Ind
uc
tan
ce
(u
H)
0
20
40
60
80
100
120
Te
mp
era
ture
Ris
e (
K)
MJC1250T-R68
Matsushita 13x13x6 R60
Inductance Change & Temp. Rise
Introduction of Low Profile Injected
Chokes
For All Low Current, Compact
size Applications:
LCD Monitor/ Mobile Phone/ DV/
HDD/ PDA/ UMPC
Low profile Injected Power Choke
Features:
• Compact size
• Low current
• Low profile
• Applications: GPS, LCD panel,
Smart phone,
MP3 player application
Size:
3x3x0.8~2.0mm, 0.45~1.6A
4x4x0.8~2.0mm, 0.6~1.8A
Comparison of MJC Low Profile Chokes
Molding Type:
• Iron powder material
• Low inductance: 0.1~2.2μH
• Low profile: 1.1~2.4 mm
• Low DCR: < 52 mΩ
• High Current Applications: > 5 A
Benchmark : Vishay-Dale
Injection Type:
• Ferrite core material
• High inductance: 1.5 ~10μH
• Low profile: 0.8~ 2.0 mm
• Low DCR: < 500 mΩ
• Low Current Applications: < 1.9 A
Benchmark : TDK
Molding Type Choke 4x4x2.0 mm benchmark
MJC(MJC0402H) Vishay-Dale(IHLP1616BZ-11)
Inductance (uH)
DCR(mΩ) Isat(A) DCR(mΩ) Isat(A)
0.1 3.5 22 4.1 12
0.22 6 12.5 6.5 9
0.47 12.5 9.5 14.5 7
1.0 24 7 24 5
2.2 52 5 61 3.25
Injection Type Choke 4x4x1.2 mm benchmark
MJC（MJC0412B） TDK(VLF4012)
Inductance (uH)
DCR(mΩ) Isat(A) DCR(mΩ) Isat(A)
1.5 52 1.9 69 1.8
2.2 61 1.57 76 1.5
3.3 98 1.35 100 1.3
4.7 140 1.16 140 1.1
6.8 191 1.0 200 0.96
10 285 0.84 300 0.8
Reliability Test by Category
High temperature storage life
Low temperature storage life
High temperature resistance
Humidity resistance
Thermal shock
Vibration
Solderbility
