PATENTS GRANTED lkt the Metal F ais hktg Fie [6 Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 2023 l.

Powder Coatin9 Spray Gun U.S. Patent 5,678,770. Oct. 21, 1997 A.B. Shah, Andheri, Bombay, India

Spray gun apparatus including voltage multiplier circuitry supplied by an electri- t,"dl "p'o wcl ~o t rc,,'~.

Precious Metal Recovery U.S. Patent 5,678,775. Oct' 21, 1997 R. Chapman, assignor to Resouce Concepts Inc., Dallas

An apparatus and system to separate and isotate precious and semiprecious metals from electronic circuit boards.

Lighting Fixture with Anodized Louver System u.s. Patent 5,678,922. Oct. 21, 1997 R.K. Robertson, assignor to H.E. Williams Inc., Carthage, Mo.

A lighting fixture for mounting relative to a ceiling comprising a housing; means for receipt of an electrical light generating element; and a light directing anodized me- tallic sheet louver system.

C02 Cleaning Nozzle U.S. Patent 5,679.062, Oct. 21, 1997 L.N. Goenka, assignor to Ford Motor Co., Dearborn, Mich.

An apparatus for cleaning a workpiece with abrasive CO 2 snow, comprising a nozzle for creating and expelling the CO 2 snow.

Molded Abrasive Brush u.s. Patent 5,679,067. Oct. 21, 1997 D.E. Johnson et aL, assignors to 3M Co., SL Paul, Minn.

An integrally molded abrasive brush comprising a flexible base and a plurality of bristles extending from the first side of the base, wherein the molded abrasive brush comprises a moldable polymeric ma- terial and includes abrasive particles inter- spersed throughout at least a plurality of bristles.

Paint Spray Booth Module u.s. Patent 5,679,071. Oct. 21, 1997 R.D. Proctor, assignor to ABB Flexible Automation Inc., New Berlin, Wis.

A_paint spray booth having aplurality of booth walls and including a support appa- ratus and a plenum, said plenum compris- ing a plurality of stilts extending from the support apparatus; and at least one first

plenum module includinz a tqo member, a floor member, at least two end members, each including a truss, and at least two side walls, each including a truss.

Nickel-Plated Steel Sheet u.s. Patent 5,679,181. Oct. 21, 1997. H. Ohmura et aL, assignors to Toyo Kohan Co. Ltd., Tokyo

A method of manufacturing a corrosion- resisant nickel-plated steel sheet or strip having a diffusion layer on at least one surface comprising electroplating at least one side of a steel base sheet or strip with nickel having an initial thickness in the range of 1 to 5 pm; and heat treating at a temperature of 450 to 680°C for 6 to 13 hours to recrystallize the nickel plating layer and form a diffusion layer.

Process for Making Wire U.S. Patent 5,679,232. Oct. 21, 1997 R.J. Fedor et aL, assignors to ElectroCopper Products Ltd., Chandler, Ariz.

A process for making copper wire com- prising flowing an electrolyte solution be- tween an anode and a cathode in an elec- troforming cell and applying an effective amount of voltage to deposit a thin web of copper foil having a thickness of 0.001 to 0.05 in. on the cathode, said electrolyte solution being characterized by a free chlo- ride ion concentration of up to 5 ppm; removing the copper foil from the cathode; cutting the foil to form at least one strand of copper wire; and shaping the strand to provide copper wire with desired cross- sectional shape and size.

Anodizing Apparatus U.S. Patent 5,679,233. Oct. 21, 1997 E.S. Van Anglen et aL, assignors to Electroplating Technologies Ltd., Coplay, Pa.

A method of anodizing a metallic work- piece comprising passing a longitudinally extended thin anodic workpiece past a se- ries of dielectric spacers in the form of thin extended contact blades mounted between a cathode and the longitudinally extended

thin anodic workpiece within an electro- lytic liquid containing space; establishing an electric potential between the cathode and anodic workpiece; and wiping the sur- face of as well as stabilizing the position of the anodic work oiece with resoect to the cathode by means of the thin extended contact blades mounted adjacent the cath- ode as the longitudinally extended thin an- odic workpiece passes the cathode.

Selective Plating Process u.s. Patent 5,679,234. Oct. 21, 1997 T. Imamura, assignor to NEC Co~., Tokyo

A process of forming a miniature pattern well controlled in thickness on a semiconduc- tor wafer through selective electroplating.

Anode for Electrowinning U.S. Patent 5,679,240. Oct. 21, 1997 N. Anastasijevic et aL, assignors to Metallgesellschaft AG, Frankfurt am Main, Germany

A process for electrolytic extraction of a metal from an electrolytic bath in which the metal is ionogenically contained, which com- prises providing an electrolytic cell with an- odes disposed in the cell container adapted for partial immersion, each of the anodes comprising a substantially horizontal carry- ing bar comprising a copper conductor.

Method for Recovering Metals U.S. Patent 5,679.259. Oct. 21, 1997 D.G. Bolser, assignor to Great Western Chemical Co., Portland, Ore.

A method for recovering copper metal from an aqueous solution comprising add- ing to the solution a sufficient amount of an acid to obtain a solution pH of less than 2.5; adding iron particles to the solution in an amount sufficient to reduce the copper ions in solution, the iron particles having a mesh size of from 230 to 400; and adjust- ing the pH of the solution to greater than 5 by the addition of sufficient amounts of magnesium hydroxide, or compounds that form magnesium hydroxide in an aqueous system, to the solution.

Vacuum Coating Process u.s. Patent 5,679,448. OcL 21, 1997 K. Kawata, assignor to Orienta/ Engineering Co. Ltd., Tokyo

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