EPOXY TECHNOLOGY, INC. 14 Fortune D rive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782 www.EPOTEK.com Epoxies and Adhesives for Demanding Applications™ This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product. Rev. II 12/2008 EPO-TEK ® T905BN-4 Technical Data Sheet For Reference Only Thermally Conductive Epoxy Number of Components: Two Minimum Bond Line Cure Schedule*: Mix Ratio By Weight: 100:25 80ºC 1 Hour Specific Gravity: 23ºC 1 Day Part A 1.63 Part B 1.16 Pot Life: 1 Hour Shelf Life: One year at room temperature Note: Container(s) should be kept closed when not in use. For filled systems, mix contents of each container (A & B) thoroughly before mixing the two together. *Please see Appli cations Note available on ou r website. Product Description: EPO-TEK ® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications EPO-TEK ® T905BN-4 Advantages & Application Notes: A moderate viscosity resin with flowing properties enables potting of cavities, packages and housings. Contains a coarse grade of filler, which needs to be taken into account in all bonding, sealing and potting applications. Contact [email protected] to review your choice. Pure white color after cure allows for easy inspection by operators on common electronic packaging surfaces. Versatilit y in cure: 23ºC and 100ºC ambient, box oven o r tunnel oven processes. Suggested Applications: o Hybrids: thermally conductive adhesive bonding ceramics and metals o Electronics: General PCB level potting and adhe sive applications. Bonding metal and composite he at sinks to PCBs or SMDs. Transformers: potting of Cu coils, magnets, inductors and other SMDs into their respective casing. o Medical Devices Heat sinking of x-ray and ultrasound circuits via adhesive and potting processes. Typical Properties: (To be u sed as a guide only, not as a s pecification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 80° C/1 Hour; * denotes test on lot acceptance basis) Physical Properties: *Color: Part A: White Part B: Light Mauve Die Shear Strength @ 23°C: ≥ 5 Kg / 1,700 psi *Consistency: Granular paste Degradation Temp. (TGA): 350°C *Viscosity (@ 20 RPM/ 23° C): 12,000 – 18,000 cPs Weight Loss: Thixotropic Index: 2.58 @ 200°C: 0.18% *Glass Transition Temp.(Tg): ≥ 50°C (Dynamic Cure @ 250°C: 0.64% 20—200°C /ISO 25 Min; Ramp -40—200°C @ 20° C/Mi n) @ 300°C: 1.44% Coefficient of Thermal Expansion (CTE): Operating Temp: Below Tg: 24 x 10 -6 in/in/°C Continuous: - 55°C to 200°C Above Tg: 120 x 10 -6 in/in/°C Intermittent: - 55°C to 300°C Shore D Hardness: 79 Storage Modulus @ 23°C: 1,152,068 psi Lap Shear Strength @ 23°C: 1,412psi *Particle Size: ≤ 300 Microns Thermal Properties: Thermal Conductivity: 1.78 W/mK Electrical Properties: Dielectric Constant (1KHz): 3.82 Volume Resistivity @ 23°C: ≥ 4 x 10 14 Ohm-cm Dissipation Factor (1KHz): 0.012

Potting Resin T905BN-4

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EPOXY TECHNOLOGY, INC.14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782

www.EPOTEK.com

Epoxies and Adhesives for Demanding Applications™ This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties

(expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product.Rev. II12/2008

EPO-TEK® T905BN-Technical Data Shee

For Reference OnThermally Conductive Epo

Number of Components: Two Minimum Bond Line Cure Schedule*:

Mix Ratio By Weight: 100:25 80ºC 1 Hour

Specific Gravity: 23ºC 1 Day

Part A 1.63

Part B 1.16

Pot Life: 1 Hour

Shelf Life: One year at room temperatureNote: Container(s) should be kept closed when not in use. For filled systems, mix contents of each container (A & B) thoroughly before mixing the

two together. *Please see Applications Note available on our website.

Product Description: EPO-TEK

® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding,

sealing, potting and encapsulation applications

EPO-TEK® T905BN-4 Advantages & Application Notes:

A moderate viscosity resin with flowing properties enables potting of cavities, packages and housings.Contains a coarse grade of filler, which needs to be taken into account in all bonding, sealing and potting applications. [email protected] to review your choice.Pure white color after cure allows for easy inspection by operators on common electronic packaging surfaces.Versatility in cure: 23ºC and 100ºC ambient, box oven or tunnel oven processes.Suggested Applications:

o Hybrids: thermally conductive adhesive bonding ceramics and metalso Electronics:

General PCB level potting and adhesive applications. Bonding metal and composite heat sinks to PCBs orSMDs.

Transformers: potting of Cu coils, magnets, inductors and other SMDs into their respective casing.o Medical Devices

Heat sinking of x-ray and ultrasound circuits via adhesive and potting processes.

Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions anapplications yield differing results; Cure condition: 80°C/1 Hour; * denotes test on lot acceptance basis)

Physical Properties: *Color: Part A: White Part B: Light Mauve Die Shear Strength @ 23°C: ≥ 5 Kg / 1,700 psi *Consistency: Granular paste Degradation Temp. (TGA): 350°C*Viscosity (@ 20 RPM/23°C): 12,000 – 18,000 cPs Weight Loss:Thixotropic Index: 2.58 @ 200°C: 0.18%*Glass Transition Temp.(Tg): ≥ 50°C (Dynamic Cure @ 250°C: 0.64%

20—200°C /ISO 25 Min; Ramp -40—200°C @ 20°C/Min) @ 300°C: 1.44%Coefficient of Thermal Expansion (CTE): Operating Temp:

Below Tg: 24 x 10-6 in/in/°C Continuous: - 55°C to 200°CAbove Tg: 120 x 10-6 in/in/°C Intermittent: - 55°C to 300°C

Shore D Hardness: 79 Storage Modulus @ 23°C: 1,152,068 psiLap Shear Strength @ 23°C: 1,412psi *Particle Size: ≤ 300 Microns

Thermal Properties: Thermal Conductivity: 1.78 W/mK

Electrical Properties: Dielectric Constant (1KHz): 3.82 Volume Resistivity @ 23°C: ≥ 4 x 1014 Ohm-cm

Dissipation Factor (1KHz): 0.012

mailto:[email protected]