Porter Marcompresentation

New Approach to Marketing Communications

Develop cost-effective, non-traditional marcom tactics to support goals and achieve brand recognition.

Communication Vehicles & Skills:• Press releases• External and internal Web• Product trainings & seminars• Data sheets• Blogs• eKnowledge • Logos• Illustrations• Editing• Wrtiting• Graphic Design• Powerpoint presentations• Videos

• Email blasts• Surveys• Print mailers• Custom Giveaways• Authored Articles• Press relationships• LCD screens• Posters• Tradeshows & events• Social Media tools• Brochures & catalogues

Andy Porter • Jessica Faulkner • Evan Kuhlman

UltraWave 12G

DELIVERING THE INDUSTRY’S BEST RF PERFORMANCE AND FASTEST TIME

TO MARKET FOR CURRENT AND NEXT GENERATION DEVICES, TERADYNE'S

ULTRAWAVE™ 12G WIRELESS TEST SOLUTION WILL BLOW YOU AWAY.

Featuring intuitive programming and highly interactive debugging, the

UltraWave 12G saves time with its embedded industry-standard VSA

algorithms and tools, and backgrounded VSA DSP processing.

Scalable to 96 universal ports, the UltraWave 12G has industry-leading

level accuracy, phase noise and settling time.

Its measurement performance, ease of use and speed will amaze you.

600 Riverpark DriveNorth Reading, MA978.370.2700www.teradyne.com

BE BLOWN AWAY

Advertisements & Magazine Covers

Copy, illustrations, design

January 1Happy New Year

SOC Test$3 Billion

Mem

ory Test

Teradyne Expands Total Available Market

Flash $100Million

Tera

dyne

Sem

ico

nd

uct

or

Test

According to Teradyne and Industry Sources

As a leader in the Automatic Test Equipment industry, we are proud to test the technology that makes catching the game on your TV, computer and cell phone possible.

Ultrawideband Frequency Plan

128 sub carriers528 MHz BW

Band Group 6

3432MHz

3960MHz

4488MHz

Band Group 2

Carrier 1 Carrier 3Carrier 2

Band Group 3 Band Group 4 Band Group 5

5016MHz

5544MHz

6072MHz

6680MHz

7128MHz

7656MHz

8184MHz

8712MHz

9240MHz

9768MHz

10296MHz

Band Group 1

Illustrations:

Teradyne proudly supports the Boston Food Bank

5th Generation Wireless TestUltraWaveTM 1000th

System Shipped

Logos:

Tradeshows, events, & meetings:

P R E S S R E L E A S E 600 Riverpark Drive, North Reading, MA 01864 | p: 978.370.2700 | www.teradyne.com

More Than 400 Participants Attend Teradyne’s Device Test Seminars in Asia

NORTH READING, Mass. – December 8, 2008 – Teradyne, Inc. (NYSE: TER) announced more than 400 participants from approximately 110 companies attended Teradyne’s Device Test Seminar series in October and November. The technical seminars, held in China, Japan, Korea and Taiwan, discussed evolving device technologies and also presented Teradyne’s industry leading solutions addressing these test challenges.

“The large number of test engineers and test managers who participated from a broad range of companies demonstrates the importance of the technologies discussed in these seminars,” said Randy Kramer, manager, Teradyne's Factory Applications Organization. “Teradyne differentiates itself by providing customers with the most advanced test products as well as industry-leading device test expertise. Customers count on our expertise to implement the best test solutions for their devices.”

Teradyne’s Factory and Field Applications Engineering teams developed and delivered presentations including testing digital TV devices with an HDMI port, DDR2/DDR3 memory bus interface tests, DigRF bus testing on next-generation mobile phones, and microwave test measurements and wafer probe testing. The seminars provided test engineers with an understanding of test strategies that provide improved test quality, faster time-to-market and lowest cost of test.

About Teradyne Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2007, Teradyne had sales of $1.1 billion and currently employs about 3,800 people worldwide. For more information, visit www.teradyne.com. Teradyne (R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).

###

Editor’s Note: For product photography and other resources, please visit Teradyne’s press room at: http://www.teradyne.com/pressRoom/index.html

Media Relations:

« Back | Print

From potential energy to value added by test (Guest commentary)

Dr. Fang Xu, Teradyne -- Test & Measurement World, 9/19/2007 11:23:00 AM

Recently, there have been many discussions in the press about how people have changed their perceptions of being an engineer. More and more young people are reluctant to consider engineering as their lifetime profession, and it seems unlikely that many among those who are currently studying engineering are willing to become future test engineers. Moreover, how many of our talented test-engineering colleagues have quit the test profession?

It is unfortunate that interest in engineering in general and test engineering in particular is diminishing, because test itself has become increasingly challenging and important. In the semiconductor industry, for instance, we predict that the cost of testing an equivalent transistor will eventually be higher than its manufacturing cost.

It is my contention that test is at least as important and valuable as any other stage in production. I employ the concept of generalized potential to demonstrate that using test to screen scrap from a production line to make the final product is not fundamentally different from extracting silicon from its dioxide in order to make wafers. They all elevate the potential and add value to the product in the same way.

We have learned in our physics class that if we elevate an object of a mass m from level 0 to a height h using a force of mg, we need to engage a certain amount of work:

where g is the standard gravity (approximately 9.8 m/s2 at the earth's surface).

If that object falls to level 0, it can produce work of equivalent energy value. So we say that when this object of a mass m is at height h from level 0, its potential energy is:

Then we learned that the weight of that object is due to universal attraction between the object and the earth. Surprisingly, the reference to define the zero of mutual potential energy of that object and the earth is when their distance is infinite. Therefore, the potential energy of that object at a distance r from the center of gravity of earth is:

where M is the mass of the earth; G is the gravitational constant, 6.6742 x 10-11m3s-2kg-1.

Indeed, this means any object on earth, including us humans, has a negative potential energy according to the definition in physics!

The more lessons learned, the more this statement rings true: almost every formula to calculate potential energy in physics starts with a negative sign; electrons around the nuclei; atoms in a crystal; planets around the sun; solar systems in the universe! As electronic engineers, we are all familiar with the electrostatic potential energy:

Postscript

DUMMY

MECHANICAL

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Next Generation RFIC & RFSOC Test Challenges

This three-part article series written by Ken Harvey from Teradyne focuses on the test cost impact of next generation consumer wireless semiconductors. Ken is responsible for the RF product line architecture at Teradyne. His twenty years of RF/microwave experience includes product development and business management roles for R&D, manufacturing, and field maintenance applications of commercial and military instrumentation through millimeterwave frequencies. He graduated from the University of Akron with a B.S.E.E. and Santa Clara University with an M.B.A. Ken holds two patents in the microwave instrumentation and precision sensor technology.

The first article looks at the structural differences between device generations to suggest the likely impact by using existing RF ATE. The second article examines key performance aspects of future device generations to assess where instrumentation improvements are most likely to occur. The third article synthesizes the combined needs and proposes a cost structure and sys-tem-level requirements based on established multisite economic principles.

Contact:Ken Harvey, Teradyne, MS 600-2, 600 Riverpark Drive, North Reading, MA 01864, Telephone: 978-370-3670, e-mail: [email protected]

EE October 2007 Feature Article

Next-Generation RFDevices Impact Test

by Ken Harvey, Teradyne

The past decade’s build-up of RF ATE for second-generation (2G) cellular transceivers now is testing more than two billion RF devices annually (Figure 1). Next-generation consumer wireless devices are much more complex due to additional RF pin-count, new standards support, and increased digital pin-counts for RF system on a chip (RFSOC) and RF system in a package (RFSIP) designs.

The test requirements also are changing to include added modulation tests and DSP requirements, concurrent test capability, and more multisite testing. Both sets of trends impact costs.

New standards for wireless communications are expanding mobile handset capability at a seemingly relentless pace. Just as relentless is the pace of competitive cost pressure.

The next generation of wireless semiconductors appears to threaten cost-reduction objectives. New RF standards tend to require either new transmission frequencies or new noninterference capabilities with respect to existing RF signals. But, new RF products maintain compatibility with previous standards: Backward compatibility with the installed network enhances the value of both the wireless network and

Figure 1. Growth in consumer wireless devices

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1094-6969/07/$25.00©2007IEEEFebruary 2007 IEEE Instrumentation & Measurement Magazine 29

Now that we are adults, we may not remember exactly how we learned to count but itprobably involved associating numbers with real objects. If we have children and areteaching them to count, we ask them questions like “How many people are there in thispicture?” During school days, children learn about decimals, fractions, and eventually

complex numbers before going to college. When the concept of complex numbers was first intro-duced, it served the purpose of accommodating the square root of negative numbers. Rarely has any-one realized the full usefulness of complex numbers; it goes far beyond the initial application.

In instrumentation and measurement, when we measure a voltage, a current, a power, or whenwe measure acceleration, force, pressure, or temperature, traditionally we dealt only with real num-bers. We used complex numbers only once in a while; for instance, to calculate the impedance of anRC circuit. Despite the fact that complex numbers were obtained in more sophisticated measure-ments when Fourier’s analysis was performed, phase information was usually considered as a sideproduct and ignored in most applications.

© EYEWIRE

February 2007 IEEE Instrumentation & Measurement Magazine 29

Replacing real values with complex can lead to new ideas

Fang Xu

Published Articles:

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BECAUSE TESTING MATTERS

Introducing, Teradyne’s Next Generation LCD Driver Test System— The D750Ex

Ex D

B E C A U S E T E S T I N G M A T T E R S

Visit us in our Meeting Suite Second Floor, West Hall

Booth 8010


www.teradyne.com/careers

The electronics industry

challenges Teradyne employees to develop

creative approaches to

testing the next big thing...before it is born.

Here, work is innovative, cross-functional, and

fast-paced with a vision.

Gain hands-on experience with today’s most complex technologies.

Tradeshows, events, & meetings:

You're invited to see the next generation of test

Teradyne invites you to see the next generation of commercial avionics test, featuring:

Join us for a brief Spectrum CTS

presentation followed by a reception in the second floor Regency Room on Monday,

March 30 from 5-7 p.m. Complimentary beer, wine and hors

d’oeuvres will be served.

Visit Teradyne at Suite 2421 each evening

during the conference to learn more about

Spectrum CTS, and for your chance to win a

Nintendo Wii Fit Game Package, Garmin GPSand other great prizes.

787 support stretegy Teradyne's Spectrum CTS (Common Test System) and 240 OEM-certified test programs

New at 2009 AMC: Teradyne, Boeing and other key 787 suppliers have agreed on a support strategy.

Spectrum CTS replaces the ATS-182a for testing Boeing 737, 747, 757, 767 avionics and features new capability for 737NG, 777 and now the 787 airplanes.

Suite Hours:Monday: 7:00 p.m. - 12:00 a.m. Tuesday: 6:00 p.m. - 12:00 a.m. Wednesday: 5:00 p.m. - 12:00 a.m

We look forward to seeing you at 2009 AMC!

For more information, call (978) 370-6528 email [email protected] visit www.teradyne.com/AMC

© 2009 Teradyne, Inc. All rights reserved.

Teradyne is a leading worldwide supplier of automatic test equipment for logic, RF, analog, power, mixed-signal, and memory technologies.

Teradyne’s UltraWave 12G Named Finalist in Test and Measurement World’sBest in Test Awards Test & Measurement World editors have selected the UltraWave 12G test instrument as a finalist for the 2009 Best in Test awards. The winner in each category will be chosen by a vote of readers and editorial staff. Voting deadline is February 6.

VOTE FOR TERADYNE TODAYhttp://www.tmworld.com/article/CA6619985.html

Teradyne’s wireless device test solutions, including the UltraWave 12G instrument, cover the entire spectrum of current and emerging connectivity and cellular technologies, including wireless LAN, Bluetooth®, 3G cellular, 4G cellular, WiMAX™ and ultrawideband.

For more information on the UltraWave 12G, visit http://www.teradyne.com/flex/UltraWave.html.


Teradyne Introduces the UltraWave 12G Wireless Test Solution

Building on four generations of Teradyne wireless test solutions and over 30 years of RF test experience, Teradyne introduces the UltraWave™ wireless test instrument.

UltraWave offers customers 12 GHz source and measurement performance, with greater parallel test efficiency to ultimately lower the cost of test. Combined with the UltraFLEX™ test platform, UltraWave covers the entire spectrum of current and emerging connectivity and cellular technologies, including wireless LAN, Bluetooth, 3G cellular, and new emerging standards like 4G cellular and ultrawideband.

For more information, click here.

To read the full press release, click here.


The New D750Ex Test System is designed for testing high-definition LCD driver devices. It is based on the highly successful J750 platform, which is approaching 2700 systems installed worldwide.

The D750Ex system provides a true high density resource per pin architecture that supports over 97 percent parallel test efficiency of the overall program. It also features both an embedded DSP and central DSP architecture to improve processing throughput. And its zero footprint design takes up 50-85 percent less floor space than competitive systems.

For more information on D750Ex, click here.

To read the announcement press release, click here.


AUTOTESTCON 2007

YOUR INVITATION TO JOIN US AT AUTOTESTCON 2007

Join us at Autotestcon 2007 in Baltiimore, Maryland from September 17 - 20 at the Renaissance Hotel and Baltimore Convention Center. Bring a copy of this e-mail to our booth #445 for a free gift!

Teradyne Celebration: Be our guest for a special celebration of tradition and technology. Date: Tuesday, following dinner, September 18 from 8:00 PM to 11: PM Location: Renaissance Hotel, Baltimore Harbor, Maryland Ballroom Why: Prizes and gifts to fortunate winners.

New Product Demonstrations:Teradyne will demonstrate its Core System Instrumentation (CSi) products, including the Di-Series of high-performance digital test instruments and the Ai-760 high-density analog test instrument. Also on display will be our Spectrum 9100 Test System. Please visit our booth for more detailed information and technical demonstrations.

Daily Raffle PrizesTuesday at 2:00 PM Wednesday at 11:30 AM and 3:00 PM Thursday at 11:30 AM Drop your business card at either registration desk to enter!

IEEE Paper Presentations

"Digital Test Program Re-hosting Considerations and Applications" by Eric Truebenbach. Tuesday, Sept 18, 3:15 PM - 5:00 PM, Track D.1This paper examines simultaneously upgrading digital test instruments and maintaining compatibility with older programs. Specific features are included in a new instrument to minimize or eliminate conversion effort.

"ATML Capabilities Explained" by Teresa Lopes. Wednesday, Sept 19, 8:00 AM - 9:45 PM, Track C.2This paper describes the major concepts of ATML Capabilities and how they are used to describe instrument performance and capabilities, using simple examples and use casesr.

"Benefits of LRU-centric Fibre Channel Testing" by Yonet Eracar Thursday, Sept 20, 10:00 AM - 11:45 AM, Track D.7This paper provides a brief overview of the Fibre Channel technology, the Military/Avionics applications, and test requirements. The Paper specifies an LRU-centric Fibre Channel testing framework and provides implementation guidelines using example applications.

"Managing Testability" Panel co-hosted by Dean Matsuura Wednesday, Sept 19, 10:00 AM - 11:45 AM, Track D.3., Track C.2Moderator is Louis Ungar of A.T.E. Solutions, Inc..

Teradyne is a leading worldwide supplier of automatic test equipment for logic, RF, analog, power, mixed-signal, and memorytechnologies.

Teradyne is the top story today on the Semiconductor International web site. See what Rod Stewart, Teradyne’s general manager of System-On-a-Chip (SOC) test, and Mark Kohalmy, Teradyne’s marketing manager for semiconductor test, had to say about the ATE market. Click here to read the article.


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D750Ex TEST PLATFORM

D

SMALL FOOTPRINT, HIGH THROUGHPUT & LOW COST OF OWNERSHIP

The LCD driver market is driven primarily by consumer goods, from large panel TVs to computer monitors to mobile phones. There is an increasing need for better quality, highercomplexity products which requires a higher quality of test for the devices that drive them.Teradyne's D750Ex™ test system offers high throughput performance in a small footprintdesign, which is key in meeting the time to market and cost-of-test demands for this extremelycost sensitive market.

The D750Ex test system was designed for testing next generation high-definition LCD driverdevices. Incorporating all the economical advantages and distinct characteristics of theJ750 test system, including small footprint, high throughput and low cost of ownership. TheD750Ex includes expanded pin density and configuration flexibility to accommodate varioustesting strategies to increase site count and test time for the latest driver devices. This offersLCD driver IC manufacturers a more cost-effective solution to help enhance their success.

D750EX FEATURES

� Greater than 97% parallel test efficiency - true high density resource per pin architecture

� Universal Slot Architecture - allows unprecedented flexibility to achieve higher site count testing with different test methodologies for high pin count large panel and mobile devices

� Lowest Cost of Test - True per pin test architecture provides faster throughput

� "Zero footprint" tester-in-a-test-head design - requires 50-85% less floor space thancompetitive systems

� Flexible Multi-Site Development Environment - ’Any Pin’ architecture for all channels, dramatically simplifies probe card design

D750Ex SYSTEM HIGHLIGHTS

Greater than 97% parallel test efficiency

Embedded & central DSP processors

“Zero-footprint” tester-in-a-test-head design

Universal Slot Architecture - LCD, HSD & APMU

Memory Test Option (MTO)

DIB and program compatible with J750 systems

Configurable for Swing Production

IG-XL™ Software

D750Ex HIGH DENSITY LCD DRIVER TEST SYSTEM

Rev 2207

POOL2 On-Site Calibration Annual calibration of the FLEX POOL2 instrument is critical to insure the instrument’s performance against its published specifications. In addition to Teradyne’s current repair and calibration services (ECAL and SCAL), you now have the ability to calibrate a POOL2 instrument at your site without returning boards to Teradyne for their annual calibration.

On-Site External Calibration ProcessThe on-site calibration process is a condensed calibration process (calibration time is approximately 10 minutes per board) and not the full repair, calibration and verification process that boards undergo when sent back to Teradyne utilizing ECAL or SCAL services. The condensed on-site calibration process does not perform an external calibration of the picoAmmeter which significantly reduces the calibration time and complexity of the calibration process. Therefore, there is an additional specification for the Ammeter performance when utilizing the on-site calibration process versus the full calibration process performed with ECAL / SCAL services. On-site calibration is optimal for customers with a large install base of POOL2 instruments that will benefit from the operational efficiency of quick calibration time versus sending boards back to Teradyne for their annual calibration and can accept the performance of the Ammeter without external calibration. For detailed instrument specifications, refer to the POOL2 ESSD in the IG-XL Solutions documentation V5.10.40 or later. Please work with your local sales or TAG representative to determine if the on-site calibration process can be implemented at your site.

On-Site Calibration Equipment RequirementsOn-site calibration is an external calibration process and requires the purchase and use of certain equipment to complete the calibration:

• HP3458A meter (not supplied by Teradyne)• 810-358-00 POOL2 External Calibration DIB• 810-358-10 POOL2 Calibration Module (Optional)

The HP3458A meter is used by the on-site calibration process for the calibration of the POOL2 UPVS. The on-site calibration process also requires the purchase of an external DIB kit, Teradyne part number 810-358-00. Each DIB kit contains one calibration module which enables the calibration of one instrument at a time and also some miscellaneous cables needed to perform the calibration. If there are more than one POOL2 instruments per tester, it is recommended that you order additional DIB calibration modules for each additional POOL2 instrument in the tester. The calibration process is a serial process and having more than one

FLEX TEST PLATFORM

E N G I N E E R I N G L A B P R O D U C T D E S I G N U LT R A F L E X AT E P R O D U C T I O N T E S T

Embedded Signal Analyzer (ESA) ToolkitDesign and Test Engineering Can Now Use the Same Tools FEATURES

Support for 20+ Wireless Standards

Signal Definition Explorer and Library for

waveform generation

Integrated Agilent 89600 VSA software

for signal analysis

UltraFLEX Background DSP support for all

measurements to minimize test time

ESA TOOLKIT AVAILABILITY

Teradyne UltraFLEX

IG-XL offline wWorkstations

MINIMUM SOFTWARE

REQUIREMENTS

2GB RAM

IG-XL 7.01.01 or later

Windows XP Service Pack 2

ACCELERATERELEASE TO

PRODUCTION

Teradyne integrated one of Agilent's easy-to-use VSA software tools and enhanced it with an extensive wireless waveform library for use on the UltraFLEX™. The resulting Embedded SignalAnalyzer (ESA) Toolkit now offers test engineers the ability to use the same signal analysis toolscurrently used by designers for characterization to background the measurement computationtasks in production via the UltraFLEX background DSP architecture. With this industry first, testengineers can now dramatically reduce program development and debug time for wireless devicetest lists that require modulated signal analysis and reduce time-to-market for common wirelessstandards such as W-CDMA, WLAN 802.11n, WiMAX and more.

FLEX TEST PLATFORM

DC90 V/I INSTRUMENT

SPECIFICATIONS

FEATURE SPECIFICATION

Independent V/Is 4

Per Channel Meters 4

V/I Source Memory 2.5k samples

Sample Rate 1 µS/sample to

1k µS/sample

Meter Capture Memory 4k samples

Sample Rate 1.26 µS/sample to

1639 µS/sample

High Voltage Front-ends 4

Input Voltage -90 to ± 180V DC

Time Measurement 2, each with a dual

Units threshold front end

V/I Output

Voltage

Four Quadrant ± 90V DC

Single Quadrant 0 to 180V DC

Compliance

Continuous 25V @ 2A DC

50V @ 1A DC

90V @ 500mA DC

180V @ 200mA DC

Pulsed (2 ms, 10% duty cycle)

25V @ 10A DC

50V @ 10A DC

90V @ 1A DC

180V @ 1A DC

Current Metering ± 10A DC

± 40A DC Merged

mode

DC90HIGH POWER V/I INSTRUMENTDelviering High Voltage and High Current TestCapability with Unmatched Configureation Flexiblity

D C I N S T R U M E N T S The Teradyne FLEX™ Platform delivers a suite of highly integrated DC instrumentation that sup-ports the highest levels of multi-site test efficiency. The instruments utilize the FLEX Platform’sUniversal Slot Test Head design to allow a broad range of functionality without increasing testingcost. The Platform’s configuration flexibility and applications-friendly environment allow engi-neers to reduce or eliminate the number of testing resources needed to perform multi-site test-ing, resulting in broader test capabilities and improved results, with reduced cost of test.

D C 9 0The DC90 instrument is the high-power choice for testing automotive, power management, indus-trial/consumer motor-controller, and power switch semiconductors, providing the highest quality oftest. The instrument targets test applications across a range of different density and voltage/cur-rent profiles, aligning to a wide range of voltage/current test requirements.

The DC90 is a 4-channel V/I. Each channel is independently isolated and “floats” in conjunctionwith four high-voltage front-end subsystems. Each channel also contains its own ArbitraryWaveform Generator (AWG) that produces up to ± 10A per quadrant. These channels can bemerged (or unmerged) during testing, creating a single ± 40A pulsed instrument capability.Capture memory (in 4k samples) and two dual Time Stampers simultaneously record each chan-nel’s data during testing. Power supplies can be set for symmetric or asymmetric rail voltagesup to 180V, and two DC90 instruments can be connected in series for a total output voltage upto ± 250 volts from ground.

DC90

DC90 Channel Board

DUAL TMUS

PATTERN CONTROL

INDEPENDENTFLOATING V/IS

FLEX TEST PLATFORM

RF IS EVERYWHERE AND GROWING

The popularity of consumer wireless products keeps growing as consumers look for ever-increasing functionality and bandwidth. Demand for the semiconductors at the heart of everywireless product drives RF chip production. While relentless pressure on price and shrinkingproduct life cycles force designers and manufacturers to cut costs in every way possible, creat-ing unprecedented levels of integration with ever increasing device complexity.

Complex RF SOCs and SIPs produced in high volumes at the lowest possible cost place threecritical demands on the RF test strategy:

• Reach the lowest possible cost of test (COT)• Achieve the fastest possible ramp to full production volumes• Provide performance headroom to meet the test requirements of tomorrow’s

wireless standards

The UltraWave 12G wireless test instrument on Teradyne’s UltraFLEX™ test platform meets allthese demands.

ULTRAWAVE TEST INSTRUMENT

Designed and built on four generations of RF wireless test solutions, UltraWave meets today’sdemanding RF/digital device, SOC and SIP test requirements and provides the performance tohandle emerging wireless standards. At the lowest cost of test, from test strategy designthrough end-of-life production, UltraWave spans the broadest range of complex RFIC andRFSOC wireless device applications, including:

• Wireless LAN • 4G cellular• Cellular • MIMO• Bluetooth® • WiMax • Set-top box (STB) • Ultrawideband

5th Generation Wireless TestUltraWaveTM

ULTRAWAVE KEY FEATURES

First fully integrated ATE instrument for wireless

device characterization & production

Spans broadest range of complex RFIC and RFSOC

applications

Fastest single-site test time / Highest multi-site

test efficiency

Unique Universal RF port architecture

Up to 64 RF ports per instrument set

Multiple instrument sets per system

Parallel test of high port count devices

50 MHz to 12 GHz Source and Measure with uniform

capability on every port

TVS™ Synthesizer technology

• Fast settling time to 0.07dB within 1 millisecond

• Superior phase noise

RF DSP per receiver

Pattern Oriented Programming

• Multi-site Software with automatic program

conversion from single site

• Graphical on-screen debug with Smith charts,

vector scopes, Constellation and EVM

UltraWave 12GWIRELESS TEST SOLUTION OFFERING LOWEST COST OF TEST AND

FASTEST TIME TO VOLUME FOR RF SOC AND SIP TECHNOLOGIES

ULTRAWAVE 12G

J750Ex TEST PLATFORM

J750Ex configured with 512 pins

J750Ex - THE SOLUTION FOR LOW COST,HIGH EFFICIENCY PARALLEL TESTFor Advanced Microcontrollers and Consumer SOC Package Test and Wafer Sort

Approaching 2500 systems installed worldwide, the J750 is one of the most successful platforms in ATE history. Now, Teradyne takes that capability to a new level and continuesto redefine the economics of test with the J750Ex™.

THE J750Ex REDUCES COST OF TEST, EVEN AS DEVICE COMPLEXITY RISES, IN MULTIPLE WAYS:

� Configurations supporting higher parallelism delivers up to 50% improved throughput

� New dedicated instrument resources for digital, mixed signal, memory and converter test

� Up to 99+% parallel test efficiency across a wide range of device pin counts and types

The J750Ex provides highly economical parallel test solutions needed for today’s cost sensitive, but high performance microcontrollers, consumer SoCs, and digital wafer sort applications. The system delivers 200 MHz / 400Mbps performance, deep vector memory, accurate edge placement, per-pin test architecture, pattern-controlled instrumentation, andflexible site mapping with no slot boundaries.

THE J750 FAMILY BENEFITS

� Low capital cost with J750 Family pricing starting at $99,000

� Easily upgradeable from current J750 systems to J750Ex

� “Zero footprint” design for minimum use of space on the manufacturing floor

� IG-XL™ software for rapid program development that automatically scales to multisite,saving development time and cost

TECHNOLOGY OVERVIEW

The J750Ex enhances Teradyne’s revolutionary J750 Family technology by providingenhanced capabilities with a higher digital data rate, increased vector memory, more powersupplies for higher parallelism, better edge placement accuracy, and more scan depth.

Teradyne was the first ATE vendor to combine four channels of ATE timing functionality into a single ASIC enabling the integration of a full 64 channels of a VLSI test system onto a single printed circuit board. Now the J750Ex builds on that foundation for even higherproductivity.

J750Ex SYSTEM HIGHLIGHTS

50% higher throughput

Up to 99+% parallel test efficiency

200MHz / 400Mbps digital

Up to 1024 digital pins, 96 device power supplies,

and analog

Deep Vector Memory up to 64 LVM

Edge Placement Accuracy +/-250ps

PPMU Fast Measure and Fast Fall

Deep diagnostic capture

DIB and program compatible across J750 platform

DEVICE TEST SOLUTIONS FOR

Microcontrollers

FPGA

RFID/Smartcards

ASIC

PLD

Consumer SOC

Baseband

Converters

Memory

Logic

J750Ex TEST PLATFORM

J750Ex configured with 512 pins

J750Ex - THE SOLUTION FOR LOW COST,HIGH EFFICIENCY PARALLEL TESTFor Advanced Microcontrollers and Consumer SOC Package Test and Wafer Sort

Approaching 2500 systems installed worldwide, the J750 is one of the most successful platforms in ATE history. Now, Teradyne takes that capability to a new level and continuesto redefine the economics of test with the J750Ex™.

THE J750Ex REDUCES COST OF TEST, EVEN AS DEVICE COMPLEXITY RISES, IN MULTIPLE WAYS:

� Configurations supporting higher parallelism delivers up to 50% improved throughput

� New dedicated instrument resources for digital, mixed signal, memory and converter test

� Up to 99+% parallel test efficiency across a wide range of device pin counts and types

The J750Ex provides highly economical parallel test solutions needed for today’s cost sensitive, but high performance microcontrollers, consumer SoCs, and digital wafer sort applications. The system delivers 200 MHz / 400Mbps performance, deep vector memory, accurate edge placement, per-pin test architecture, pattern-controlled instrumentation, andflexible site mapping with no slot boundaries.

THE J750 FAMILY BENEFITS

� Low capital cost with J750 Family pricing starting at $99,000

� Easily upgradeable from current J750 systems to J750Ex

� “Zero footprint” design for minimum use of space on the manufacturing floor

� IG-XL™ software for rapid program development that automatically scales to multisite,saving development time and cost

TECHNOLOGY OVERVIEW

The J750Ex enhances Teradyne’s revolutionary J750 Family technology by providingenhanced capabilities with a higher digital data rate, increased vector memory, more powersupplies for higher parallelism, better edge placement accuracy, and more scan depth.

Teradyne was the first ATE vendor to combine four channels of ATE timing functionality into a single ASIC enabling the integration of a full 64 channels of a VLSI test system onto a single printed circuit board. Now the J750Ex builds on that foundation for even higherproductivity.

J750Ex SYSTEM HIGHLIGHTS

50% higher throughput

Up to 99+% parallel test efficiency

200MHz / 400Mbps digital

Up to 1024 digital pins, 96 device power supplies,

and analog

Deep Vector Memory up to 64 LVM

Edge Placement Accuracy +/-250ps

PPMU Fast Measure and Fast Fall

Deep diagnostic capture

DIB and program compatible across J750 platform

DEVICE TEST SOLUTIONS FOR

Microcontrollers

FPGA

RFID/Smartcards

ASIC

PLD

Consumer SOC

Baseband

Converters

Memory

Logic

Data Sheets & brochures:

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Annual Report:

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FIVE-YEAR RECONDITIONING

Mechanical parts that experience wear and electrical parts that experience drift over time need to be

maintained or replaced at given intervals. The interval between maintenance cycles is important to

ensure no failures occur before the part is serviced or replaced. To ensure ATE functionality through

accountability, tools and test equipment are important in a maintenance program plan. Having tools

properly calibrated and periodically inspected is critical to ensuring maintenance is performed

properly. Personnel assigned to a maintenance task should be required to sign-off once the task

is completed.

COMPLETE PREVENTATIVE MAINTENANCE INCLUDING CALIBRATION VERIFICATION

Teradyne GFS personnel utilize a preventive maintenance checklist to ensure that all required

procedures are completed. This checklist can be the standard checklist for a particular test system, or

the checklist can be optimized for a customer’s specific requirements. This checklist confirms that all

procedures were performed by Teradyne.

CHECK FOR A/C NOISE AND RIPPLE ON DC POWER SUPPLIES

Undetected power supply noise and ripple will cause unreliable tester performance. The correct

measurement procedure utilizes an oscilloscope and two probes to measure power supply noise.

This eliminates radiated noise from tester instruments and other local power supplies to prevent

unnecessary power supply replacement, while providing the most accurate measurements for a

customer’s accountability documentation.

REPLACEMENT OF HFE FILTERSCorrect HFE flow rate is critical to maintain the specified operating temperatures of Teradyne liquid

cooled instruments. All liquid cooled systems utilize a particulate filter to prevent contamination of the

cooling loop mechanical components and to ensure the correct flow rate of the HFE. Use of the correct

HFE particulate filter and the proper replacement procedure is the best way to ensure that there are no

HFE leaks or cooling reliability issues.

BACK FLUSH OF THE COOLING SYSTEMCorrosion and contaminants can build up on the inside of the heat exchangers and radiators causing

degraded heat transfer and possible temperature regulation problems. This can be prevented through

the proper back flushing of the cooling system.

VERIFICATION OF ALL BUS BAR AND CABLE CONNECTIONS

DC power supplies are connected to tester backplanes by cables and bus bars. The bus bars distribute

the DC power to the individual backplane slots. Over time the fasteners attaching the cables and

connections to DC power can loosen, which can cause localized resistive areas and unreliable test

results. Verification of torque specifications by Teradyne ensures proper DC levels.

EXTERIOR PANEL PAINT TOUCH-UP

Teradyne GFS personnel can provide the correct paint color to keep your tester looking

professionally maintained.

Teradyne, Inc. - Austin5700 Mopac Expressway South

Building D, Suite 400

Austin, TX 78749

Tel: +512-891-9600

Fax: +512-891-9043

Teradyne, Inc. - West Coast1321 Ridder Park Dr.

San Jose, CA 95131

Tel: +408-437-9700

Fax: +408-451-3202

Teradyne, Inc.- South West

2535 West Fairview st.

Suite 106

Chandler, AZ 85224

Tel: +480-777-7090

Fax: +480-777-7099

Teradyne, Inc. - RichardsonSuite 128

1840 North Greenville Ave.

Richardson, TX 75081

Tel: +972-231-5384

Fax: +972-231-5963

Teradyne, Inc. - East Coast38 River Road

Essex Junction, VT 05452

Tel: +802-879-9600

Fax: +802-879-9622

Teradyne, GmbHDingolfinger Straße 2

D-81673 München, Germany

Tel: +49/89-41861-0

Fax: +49/89-41861-299

Teradyne, S.A.Les Jardins de Maupertuis

Le Verone

3 Chemin de la Dhuy

38240 Meylan, France

Tel: +33/4-76-04-1170

Fax: +33/4-76-41-9591

Teradyne, S.A.S.Zone Industrielle de Rousset

Avenue Victoire 13106

Rousset, France

Tel: 33/4-42-29-85-00

Fax: 33/4-42-29-85-16

Teradyne, Italia Srl.Strada Statale 11

Padana Superiore 2/B

20063 Cernusco-sul-Naviglio

Milan, Italy

Tel: +39/02-921331

Fax: +39/02-92133-201

Teradyne Co., Ltd.Building 10, No. 1201 Gui Qiao Road

Jin Qiao Export Processing Zone

Pudong, Shanghai 201206

P.R.C.

Tel: +86-21-38424668

Fax: +86-21-58996197

Teradyne Co., Ltd.Shenzhen Office

Room 401, 4/F North Wing

BLK 1, Phase 1

Vision Business Park

Nanshan District

Shenzhen 518057

P.R.C.

Tel: +86-755-3363-0330

Fax: +86-755-3363-0326

Teradyne Co., Ltd.Tianjin Office

Room 1001, Building A

No. 50 You Yi Road

He Xi District

Tianjin 300061

P.R.C.

Tel: +86-22-5879-3965

Fax: +86-22-5879-3975

Teradyne K.K.1-23-20 Esaka-cho

Suita-shi

Osaka 564-0063

Japan

Tel: +81/6-6369-0817

Fax: +81/6-6369-0827

Teradyne K.K.1-23-20 Esaka-cho

Suita-shi

Osaka 564-0063

Japan

Tel: +81/6-6369-0817

Fax: +81/6-6369-0827

Teradyne Korea Ltd.Hi Brand Bldg. 10F,

215, Yangjae-dong,

Seocho-Gu, Seoul, 137-924,

Korea

Tel : +82-2-2155-2888

Fax : +82-2-2155-3120, 2155-3130

(CPS)

Teradyne Malaysia Ltd. (K.L.)Lot 13.01, 13th Floor,

HeiTech Village

Persiaran Kewajipan, USJ1,

UEP Subang Jaya

47600 Selangor, Malaysia

Tel: +603-80235388

Fax: +603-80235155

Teradyne Malaysia Ltd. - PenangUnit 1, Lower Level 3

c/o Hotel Equatorial Penang

1, Jalan Bukit Jambul

Bayan Lepas

11900 Penang, Malaysia

Tel: +604-6408835

Fax: +604-6408811

Teradyne Malaysia Ltd. - MuarNo. 32 & 33, Jalan Pesta

Off Jalan Bakri, Taman Tun

Dr.Ismail (1)

84000 Muar, Johor, Malaysia

Tel: +606-9540033

Fax: +606-9540034

Teradyne Taiwan Ltd. 3F, No. 20, Tai Yuen Street

Tai Yuen Hi-Tech Industrial Park

Jubei City

Hsinchu, Taiwan 302, R.O.C.

Tel: +886/3-5530808

Fax: +886/3-5530606

Teradyne (Asia) Pte. Ltd.51 Science Park Road

(off Pasir Panjang Road)

#02-01 The Aries

Singapore Science Park 2

Singapore 117586

Tel: +65-6773-0788

Fax: +65-6773-0961

Teradyne Philippines, Ltd.Mactan Export Processing Zone 2

Basak, Lapu-Lapu City, 6015

Philippines

Tel: +63/32-340-5447

Fax: +63/32-340-5446

Teradyne Philippines Ltd. - Alabang16th Floor Insular Life Corporate Center

Commerce Avenue, Filinvest

Corporate City

Alabang, Multinlupa City 1781

Philippines

Tel: +63-2-771-1590

Fax: +63-2-771-1643

Teradyne K.K.272-13, Heisei

Takaono, Ozu-machi

Kikuchi-gun

Kumamoto 869-1232

Japan

Tel: +81/96-292-1300

Fax: +81/96-292-1428

United States:

Asia:

Europe:

CALL YOUR LOCAL FIELD SERVICE OFFICE FOR MORE DETAILS

CATALYST LEGACY SYSTEM SUPPORT

With full spectrum instrumentation, broad configurability and multi-site test, the Catalyst™ test

system delivers full test coverage for a wide range of semiconductor applications.

The Catalyst test platform has a solid reputation of reliability. But even a tester as well built as the

Catalyst requires maintenance. Everything from the installation of your tester to our 5 year

reconditioning program is best provided by the experts in the Teradyne field offices across the U.S.

I N S TA L L AT I O N S E R V I C E S

Pre-installation site inspection

System installation

Option installation

Calibration verification

Full checker verification

Limited troubleshooting

Installation report

Teradyne Install Certificate

D E- I N S TA L L AT I O N S E RV I C E S

Full checker verification

System de-installation

Limited troubleshooting

De-installation report

System status report

Teradyne De-install Certificate

P R E V E N T I V E M A I N T E N A N C E S E R V I C E S

System inspection and verification

Calibration verification (see above)

Power supply adjustments

Identify defective fans

Internal and external system cleaning

Teradyne supported manipulator checkout

Perform full system lubrication check

C A L I B R AT I O N / N I S T S E R V I C E S

NIST verification of hardware against Teradyne

external reference equipment

Baseline checker verification before calibration

Internal system calibration

Full checker verification after calibration

Full continuity check

Calibration/ISO documentation provided by

Teradyne

5 -Y E A R R E C O N D I T I O N I N G S E R V I C E S

Complete preventive maintenance including

calibration verification (see above)

Check for A/C noise and ripple on DC

power supplies

Replacement of filters (if available)

Verification of all screw and cable connections

Exterior panel paint touch-up

T R A I N I N G

Best Practices Workshops

Basic Maintenance Training

Advanced Troubleshooting techniques

Available at Teradyne or at your office

E K N O W L E D G E A N D P H O N E S U P P O R T

24x7 access to a database created by

Teradyne field service engineers

eKnowledge database accounts and training

Teradyne manned call centers

The knowledge of the entire company is a

click away

COMPLETE TESTER AND OPTIONS INSTALLATION SERVICES

Teradyne provides expert personnel to ensure the most efficient tester installation and optimal tool productivity for customers.

SITE PREPARATION

Site readiness is confirmed through the use of the site preparation guide recommendation and by a walk-through with the customer.

SYSTEM INSTALLATION

Complete system integration utilizes Teradyne specifications and guidelines.

CALIBRATION VERIFICATION

Full system calibrations are verified through all levels of Teradyne specifications.

DIAGNOSTIC VERIFICATION

Full checker verification after calibration is performed to ensure there are no failures following installation.

CORRECTIVE ACTION TROUBLESHOOTING

Systems with documented issues can be diagnosed and resolved, returning the system to Teradyne specifications.

INSTALLATION REPORT

Installation reports describe any actions required during the installation process. Any defects or limitations and their prescribed resolutions are identified.

TERADYNE INSTALL CERTIFICATE

Verifying that the system is production ready, Teradyne’s installation certificate states that all system specifications and calibrations are satisfied. This certificate may extend warranties and leaves room for additional service agreements.

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About Semiconductor Test

Advanced Search | Site Map

Semiconductor Test is a lead-ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Home > Test Products: UltraWave Instrument- Stretching the Boundaries of Test

Universal RF Port Architecture with Higher Port Count

UltraWave’s unique universal RF port architecture provides 12 GHz source and measure with uniform test capability on every port. UltraWave can be configured withup to 64 universal RF ports per instrumentset and multiple instruments per system, easily providing parallel octal site test without needing complex DIB circuitry for high port count devices such as WEDGE transceivers and 802.11n applications.

Faster Waveform Synthesis & Analysis

UltraWave incorporates Teradyne’s patent-pending TVS™ synthesizer technology that provides fast settling time to 0.07dB within 1 millisecond and superior phase noise. UltraWave delivers DSP per receiver (with calculations performed in less than 20 microseconds).

UltraFLEX Test Architecture: Fastest Single-Site Test Time/ Highest Efficiency Mult-Site Test

UltraWave leverages Teradyne’s UltraFLEX system architecture that incorporates Sync-Link™ test technology for pattern-controlled instrument set-up at device clock speed, System Broadcast™ for faster, high-efficiency instrument set up, and a Background DSP™ environment that puts data moves and analysis in the background of program execution. The result is the highest parallel efficiency for RF multi-site test.

IG-XL Software for Faster Development to

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-- FLEX

Teradyne Introduces the UltraWave 12G Wireless Test Solution

Building on four generations of Teradyne wireless test solutions and over 30 years of RF test experience, Teradyne introduces the UltraWave™ wireless test instrument.

UltraWave offers customers 12 GHz source and measurement performance, with greater parallel test efficiency to ultimately lower the cost of test. Combined with the UltraFLEX™ test platform, UltraWave covers the entire spectrum of current and emerging connectivity and cellular technologies, including wireless LAN, Bluetooth, 3G cellular, and new emerging standards like 4G cellular and ultrawideband.

For more information, click here.

To read the full press release, click here.


FLEX TEST PLATFORM

RF IS EVERYWHERE AND GROWING

The popularity of consumer wireless products keeps growing as consumers look for ever-increasing functionality and bandwidth. Demand for the semiconductors at the heart of everywireless product drives RF chip production. While relentless pressure on price and shrinkingproduct life cycles force designers and manufacturers to cut costs in every way possible, creat-ing unprecedented levels of integration with ever increasing device complexity.

Complex RF SOCs and SIPs produced in high volumes at the lowest possible cost place threecritical demands on the RF test strategy:

• Reach the lowest possible cost of test (COT)• Achieve the fastest possible ramp to full production volumes• Provide performance headroom to meet the test requirements of tomorrow’s

wireless standards

The UltraWave 12G wireless test instrument on Teradyne’s UltraFLEX™ test platform meets allthese demands.

ULTRAWAVE TEST INSTRUMENT

Designed and built on four generations of RF wireless test solutions, UltraWave meets today’sdemanding RF/digital device, SOC and SIP test requirements and provides the performance tohandle emerging wireless standards. At the lowest cost of test, from test strategy designthrough end-of-life production, UltraWave spans the broadest range of complex RFIC andRFSOC wireless device applications, including:

• Wireless LAN • 4G cellular• Cellular • MIMO• Bluetooth® • WiMax • Set-top box (STB) • Ultrawideband


ULTRAWAVE KEY FEATURES

First fully integrated ATE instrument for wireless

device characterization & production

Spans broadest range of complex RFIC and RFSOC

applications

Fastest single-site test time / Highest multi-site

test efficiency

Unique Universal RF port architecture

Up to 64 RF ports per instrument set

Multiple instrument sets per system

Parallel test of high port count devices

50 MHz to 12 GHz Source and Measure with uniform

capability on every port

TVS™ Synthesizer technology

• Fast settling time to 0.07dB within 1 millisecond

• Superior phase noise

RF DSP per receiver

Pattern Oriented Programming

• Multi-site Software with automatic program

conversion from single site

• Graphical on-screen debug with Smith charts,

vector scopes, Constellation and EVM

UltraWave 12GWIRELESS TEST SOLUTION OFFERING LOWEST COST OF TEST AND

FASTEST TIME TO VOLUME FOR RF SOC AND SIP TECHNOLOGIES

ULTRAWAVE 12G


New logo, external Web page, web banner, cutomer email blast, press release, authored article, cover advertisement, market shot, internal recognition event, branded give-aways, Teradyne World & In-site article, trade-show poster, trade-press interviews, data sheet.


Teradyne

BenefitsYour

FOR TERADYNE NEXTEST DIVISION EMPLOYEES AND THEIR FAMILIESNovember 2008

Welcome to Teradyne’s Benefits Plan

Teradyne is proud to offer Nextest employees a comprehensive range of benefits for the

upcoming year. This year’s Open Enrollment is Nov 3-Nov 21. It’s the only time of the year you

can enroll in Teradyne benefits.

Your Health Benefits book contains 2009 rates for the health, dental, vision and disability plans.

As you know, these costs continue to rise dramatically. Teradyne is no exception. Our rates are

based on our use of the plans over the course of the year. We continue to try to keep health care

costs as low as possible for employees, and continue to contribute $18 million per year toward

employee health care, vision and dental costs. Review the Your Health Benefits booklet included

in this mailing before making your health plan choice.

Meetings will be held onsite with employees to discuss Teradyne’s benefits in more detail and to

answer questions.

Medical Benefits:

Teradyne offers a variety of medical plans to help meet the health care needs of you and your

family. All of our plans offer comprehensive care for you, your spouse or domestic partner and

children. While all Teradyne medical plans offer comparable coverage and quality of care, the

plans differ in how care is delivered, how much you contribute toward the cost of coverage, how

much you pay when you receive care, and how claims are filed.

Teradyne’s medical plan offerings provide coverage for a wide range of medical services,

including preventive care, doctor’s visits, hospitalization, surgery and emergency care. With the

Health Maintenance Organization (HMO) offerings, you must obtain health services from your

Primary Care Physician (PCP) and stay within the HMO network.

New to Nextest Division employees is the Exclusive Provider Organization (EPO) plan. Similar

to an HMO, with this plan you do not need to choose a PCP and you do not need referrals to

see specialists, as long as they are a preferred provider in the network. Generally, your care is

covered at 100 percent after you pay a small co-payment. If you join an EPO and later move out

of its service area, you may change to another Teradyne medical plan that services the area in

which you live. You must make this change within 30 days of moving.

Financial Benefits:

Stock Purchase Plan:Teradyne offers a Stock Purchase Plan so you can purchase company stock at a 15 percent

discount, and share in the growth of the company. You may enroll in the Stock Purchase Plan

prior to each six month offering period.

You may authorize payroll deductions from two to 10 percent of your pay, including overtime,

incentives and profit sharing. Your election must be in whole percentages made on an

after-tax basis.

Teradyne’s Savings Plan:Teradyne’s Savings Plan provides you with a great way to save for retirement. Teradyne matches

$1 for every $1 you save each year, up to the first five percent of your pay. You may use pre-

tax or after-tax dollars to invest up to 20 percent of your pay. The Plan offers more than 25

investment choices and is administered through Fidelity investments. Look for more information

to come on enrolling in the plan.

Deadline to Make Changes for 2009:

November 21, 2008

Protection BenefitsOur voluntary Short Term Disability (STD) Plan provides you with replacement income if you are

hospitalized or out of work for a illness or injury. You’re automatically covered up to a certain

pay level, and can purchase supplemental STD protection. We also provide a company-paid Long

Term Disability (LTD) plan for longer absences. If you are a California employee, you may opt

out of the voluntary plan and remain in the state plan.

Teradyne pays for Basic Life Insurance coverage of one and a half times annual salary and you

can purchase additional coverage at low group rates. We also offer spouse, domestic partner

and dependent child life insurance, also at low group rates. In addition, Teradyne pays for Travel

Accident Insurance to cover you when you are traveling on business.

THE TERADYNE EMPLOYEE NEWSLETTER

Q3’07

Teradyne Continues to Gain Praise from Customers

Continued on Page 12

The environment has become a hot topic and companies are being held accountable for the products that they produce.

Teradyne is becoming more environmentally conscious and through partnerships and new design initiatives, Teradyne is striving to be green.

“We want our employees to be proud,” said Debra Pulpi, Teradyne Corporate Environment, Health and Safety Engineer. “Helping the environment is good business. In the long-term environmental stability will allow for businesses’ economic stability.”

Over the last few years the global community has lobbied companies, like Teradyne, to move away from traditional lead-containing solder and other hazardous substances that are typically contained in electronics because of concern that these hazardous substances would end up in landfill and ultimately contaminate water supplies and land.

In addition to supporting recycling of bottles, batteries, paper, light bulbs, cardboard and water conservation, the Environmental Health and Safety Services group, has joined forces with the AeA (formerly the American Electronics Association), a nationwide non-profit trade association that represents all segments of the technology industry and its International Environmental Compliance program.

In April, Teradyne’s North Reading office hosted the association’s environmental compliance conference. The meeting brought regulators and representatives from other electronic companies together to talk about the latest waste, energy and environmental regulations and review

environmental regulations in China, the European Union, the United States.

As of July 1, 2006 all 27 European Union countries must abide by new rules set by the Restriction of Hazardous Substance (RoHS) directive. These rules have inspired similar legislation in China, Korea, Japan and the Pacific Rim countries. In these countries there is a general acceptance that lead-free soldering will become the norm in the next few years. Select states within the U.S. are also adopting RoHS legislation.

“Working with AeA, Teradyne hopes to benchmark with others in the industry to better understand

what we need to do in the ever changing terrain of the environment,” said Debra.

As part of the AeA, Teradyne has been able to keep up with legislative changes across the globe. Teradyne is currently a member of the AeA’s China RoHS and EU RoHS study group, participating in calls and meetings.

WHAT’S INSIDE

Continued on Page 2

Teradyne Strives to be Green

“Helping the environment is good business. In the long-term environmental stability will

allow for businesses’ economic stability.”

-- Debra Pulpi, Environmental Health and Safety

Does it seem that Teradyne is winning more customer awards lately?

The company is on an impressive streak, winning top customer support honors from industry-leading companies.

Brad Nelson, Teradyne vice president, worldwide sales and Ty Akin, Teradyne regional sales manager, share their views on why the company’s Semiconductor Test Division is winning these awards and their thoughts on customer satisfaction.

Why do you think Teradyne is winning so many supplier awards?

Brad Nelson: About three years ago, the division launched a Customer Delight Initiative to significantly improve the customers’ experience in doing business with Teradyne. We realized that we had

to become more responsive and flexible in every customer interaction so that our customers view Teradyne as the only Automatic Test Equipment supplier they prefer to do business with. I believe the results of this program are finally starting to pay off.

The field teams have done an exceptional job interacting with the customer; they resolve problems more creatively and responsively.

Ty Akin: We understand our customers’ business and what they value most from a test supplier. We work very hard developing trusting and lasting customer relationships by delivering on our commitments and being extremely responsive.

What do you think Teradyne is doing better than the competition?

Brad Nelson: I think we respond more quickly than the

competition to concerns such as system reliability, product delivery and engineering misalignment issues. Our relationships with our customers are very strong, and we differentiate ourselves as not only a technology driven company, but one that is equally focused on improving customer satisfaction.

Ty Akin: We’re focused on delivering the entire test solution to our customers, and we do a better job understanding our customers’ business models. It’s a total team effort. The Operations team offers our customers the flexibility and responsiveness that minimizes delays. Engineering not only focuses on delivering the best test capability but they also understand the importance of delivering improvements in quality and reliability.

In addition, the business units and marketing team work with the Test Assistance Group (TAG) and Sales to provide our customers excellent business

San Jose Caters Toward Next Big Thing

4

Teradyne Delivers J750 for New Smart Phone

12

Agoura HIlls Employees Spend Day with the Horses

11

TUG 2007: Mission Accomplished

9

Employees First to Men-tor Chinese Students

8

LCDs Appearing on More

Than Televisions6

UltraFLEX Makes its Way to India

3

VMM Drives Record DS Year4

FLEX and OpenFLEX a Winning Combination

10

Teradyne Makes Strong Impression at Conference

2

Teradyne Goes Platinum8

Agoura Hills Shows Its Irish Pride By: Evan Kuhlman Date: March 25, 2009

Employees in Agoura Hills, CA celebrated their Irish heritage with Saint Patrick’s Day activities. In addition to wearing green, Teradyners participated in a karaoke contest and competed for “best holiday attire.”

Plenty of Irish and St. Patrick’s Day jokes kept the afternoon light with laughs.

The holiday celebration was part of the site’s tradition of hosting an activity for employees each quarter.

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