11
Thermoplastic Composite Materials For Portable Electronic Enclosures

Portable Electronic Equipment Enclosures 2010

Embed Size (px)

Citation preview

Page 1: Portable Electronic Equipment Enclosures 2010

Thermoplastic Composite Materials For Portable Electronic Enclosures

Page 2: Portable Electronic Equipment Enclosures 2010

New Solution To An Old Problem• Many materials and processes have been proposed for Portable

Electronic Enclosures, each requiring compromise in one or more key characteristics.

• Traditional materials such as aluminum require extensive machining steps, are not easily adapted to imaginative style, and they lack damage tolerance.

• Steel is generally limited to rectilinear design and is very heavy. • Magnesium alloys require expensive tooling, considerable post

processing, lack damage tolerance, and are expensive. • Injection molding processes offer lightweight fabrications with

considerable style in smaller components. Injection molded parts are generally less damage tolerant, do not have good thermal properties, and require expensive tooling. They are very competitive in high volume small parts.

• A new alternative to all these is continuous fiber thermoplastic composite products made by American Matrix LLC, Tarpon Springs Florida.

Page 3: Portable Electronic Equipment Enclosures 2010

Continuous Fiber Thermoplastic Composites

• The continuous fiber in a thermoplastic matrix such as nylon combines to make an extremely stiff, damage tolerant, lightweight structural composite.

• A comparable part in machined aluminum would weigh 40% more. This is a strong advantage for the composite.

• In addition to the high strength to weight ratio they also have very good thermal conductivity and have extremely low coefficients of thermal expansion. This simplifies tolerance issues for devices such as optical benches that would be affected by movement of a cover. It also simplifies many thermal management problems.

• EMI/EMC shielding is incorporated in the composite and provide superior performance that does not erode or flake off with time. Styling and ergonomic designs are very compatible with the process; your designers are free to be creative in their designs.

Page 4: Portable Electronic Equipment Enclosures 2010

Low Cost Fabrication• The continuous fiber thermoplastic composites

are made through a melt and compression molding process.

• Contrasting with conventional thermoset composites which rely on solvent based chemistry and complicated cure schedules.

• Many of these materials can be molded in low cost aluminum molds, higher temperature materials require steel.

• The process is very fast for a composite, under 5 minutes a part for many of the parts contemplated for this application.

Page 5: Portable Electronic Equipment Enclosures 2010

Thermoplastic Composite AdvantagesCompared to Metals:• High Strength/Stiffness; Toughness• Reduced Weight• Low Coefficient of Thermal Expansion (CTE)• Corrosion and Chemical Resistance• Increased Part Function via Parts Consolidation• Reduced Secondary Operations• Styling Freedom/Contoured Shapes

Compared to Thermoset Composites:• No Need For Controlled Storage/Unlimited Shelf Life• Significantly Faster Cycle Times (lower mfg. cost)• Environmentally Sound and Recyclable• Can be re-processed – reduced scrap• Superior Toughness

Page 6: Portable Electronic Equipment Enclosures 2010

Winning Solution

• Consistency, rapid processing, and style • Combined with high strength, light weight,

and thermal conductivity • Make this material the best choice for high

performance portable equipment enclosures.

Page 7: Portable Electronic Equipment Enclosures 2010

Thermoplastic ResinsAmerican Matrix Corp’s offers a wide variety of matrix resins and fibers suitable for many applications.

Increasing Use Temperature andPerformance

High Performance Aerospace Defense High Temperature Industrial Oil Field/Down Hole Medical

Engineering Sporting Goods Automotive General Industrial Lawn & Garden

Commodity Orthotic/Prosthetic Infrastructure Packaging

PIPAIPES PPS

PEEK

PAPET

POMPBT

SMA

PMMAABSPVC

PC

PMMA/PC

PPO

PP

PA12

HDPELDPE

Amorphous Crystalline

PEI

PU

Page 8: Portable Electronic Equipment Enclosures 2010

Thermal Performance

Page 9: Portable Electronic Equipment Enclosures 2010

PP and N6 Properties

Page 10: Portable Electronic Equipment Enclosures 2010

PP and N6 Properties

Page 11: Portable Electronic Equipment Enclosures 2010

PPS, PEI, and PEEK Properties