POLYTRONICS Multifunctional Heterosystemintegration

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POLYTRONICSMultifunctional Heterosystemintegration

Karlheinz Bock, November 27th, 2012 at the University POLITEHNICA of Bucharest, RomaniaEmail: [email protected] and [email protected]

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Polytronic Systems

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R&D Topics for Polytronic Systems

Reel-to-Reel Application Center

MEMS technology

Wafer thinning

Ultra Thin Chip Assembly

Organic Electronics

Electronics,chemical and biosensors

Substrate Handling

Smart Plastics Analysis and testing of integrated Systems

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Agenda

4

Introduction to Polytronics and Heterosystemintegration

Acknowledgements

Why modular technology integration

Integration technologies for flexible foil systems

Homogeneous integration HF lines, passives, OFET, CMOS

2D& 3D Heterointegration of (not only foil) components

Summary and future work

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Hetero-System Integration of Peripherics with Electronics in an OLAE substrate

Organic displayshuman interface

Si electronics forhigh functionality

polymerelectroniclow cost, large area

polymer solar cells,batteriesenergy

sensorspassive

s

Interconnect actuator

Human Ambient Intelligence

Fluidics &Pneumatics Biosystemintegration lab-on a foil

Smart Plastic

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Polytronic Systems

Micro-

system-

technologies

Silicon technology3D-Integration

Modular On-Top Technologies MOTT

Bio-

system

integration

Radiation detectors3D-Silicon

Integration

Chemical andbiological

Materials andSensors

Flexible multi-funcional patient

wrist-strap

Smart lab on chip, disposable

sensors

Bio- implantablecomponents

Fraunhofer EMFT Mission: Modular System Integration

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Fraunhofer EMFT – Polytronics Area of research

7

Bavarian Polytronics Demonstration Center in Munich - funded 2001Focus on Polytronic , FOLAE and Multi-functional Systems (sheet and R2R)

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Bavarian Demonstration Center Polytronics (funded2001) at Fraunhofer EMFTroll-to-roll and sheet-to-sheet enabled pilot line for microfabrication on flexible substrates

Fine-line patterning ofmetallized plastic films

Thick-film screen printing on sheets and rolls (ink-Jet, μ-contact, NIL, micro-dispense, nano-spot…

Electrical testingLaser processingFoil laminationFoil assembly

Sputter depo. Web coating

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Roll-to-Roll Fabricated Devices on Plastic Films

temperatureelectrochemical

RFId antennaePolymer electronics

EL signageultra thin ICs fabrication handling and assembly

capacitive sensor

High resolution wiring Printed passives

through-hole vias(arrow = 50μm)

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Plastic Film Systems at BDP Center

have been demonstrated for• high resolution wirings, 3D foil assembly• radio frequency, antennas and wave guides• sensor and components• organic electronic applications

Foldable wiringand 3D

Foil electronics andcomponents assembly

Printed photo detector and sensors for bacterias, viruses, toxines, gases, environmental conditions…

Organic circuits

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Acknowledgements and Thank You

All co-workers and colleagues at TU Berlin, Fraunhofer EMFTFraunhofer IZM and other Fraunhofer institutions, all cooperatingresearchers and friends in other institutions all over the world,…only because of their continued cooperation, contribution andsupport this event could happen.

Bavarian State Government STMWVT MunichGerman Ministry of Education and Research BMBFEuropean Commission FP5, FP6, FP7Fraunhofer Society…for continued funding from 2001 until present in many projects.Their funded projects are the frame of our research and thedriving force over the years enabling this event could happen.

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Modular system integration on flexible film substrates

Advantages:

enables chip integration on films

thin film wiring offers high performance signal transmissionin the high GHz range

enables integration of passive elements

multi-functional elements can beintegrated in a modular concept

allows for mechanical flexibility

allows for roll-to-roll manufacture

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Components building a flexible foil system

one or more wiring layers several foil components (sensors, batteries, photovoltaic modules) integrated circuits (e. g. Si-IC) passives (resistors, capacitors, antenna)

Integration Technologies

flexible foil system

Homogeneous Integration Heterogeneous IntegrationThe foil component is fabricated within the technology process for preparing the wiring layer.

The pre-fabricated functional foil component is subsequently assembled on the wiring layer.

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Double Sided Wiring Layer with Blind-hole vias

Cu tracks

Cu metallisation

alignment hole

via hole

photoresist

foil with interconnect wires on top

laser drilling of alignment holes (through-hole) and via holes (blind hole; stop on metallisation)

sputtering of backside metallisation

1. lamination of photoresist2. exposure relative to alignment holes3. development of resist

pattern electroplating

1. resist stripping2. Cu-etching metalized via hole

double sided wiring layer

Homogeneous Integration

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Front to Rear Side Interconnections (filling by Cu e-plating)

measurement of via resistance (4-point):yield: 98.3% mean resistance 9.6mOhm

0

10

20

30

40

50

60

1 3 5 7 9 11 13 15 17 19 21 23

R [mOhm]

coun

t

Via Size polyimide film 50 µmbottom Ø ≈ 15µmtop Ø: ≈ 85µm


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Double Side Wiring in a Roll-to-Roll Process DIL-FlexFlexible RF Transmission Lines on Foilimpedance and dispersion optimized

polyimide film

rear side electroplating

blind via formation: laser and plasma etching

front side electroplating

substrate: PI 50 μmmetallization: Cu, 5 μm

min. linewidth: 10 μmvia size: 50 μmalignmentfront to rear: ± 25 μm

bandwidth(-3 db, 40 mm): 40 GHz

Process flow


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Schichtdickenprofil: PI/LCP Substrat

PI/LCP: vergleichbare Rauigkeit

-16

-14

-12

-10

-8

-6

-4

-2

0

2

0 100 200 300 400 500 600

length pos/µm

heig

ht/µ

m

LCP

PI

Scanrichtung

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Copper conductor on PI substrate

Cross section detail: semi-additive copper conductor path

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Comparison EMFT/Commercial GCPW (L = 40 mm)

3 dB Bandwidth: Commercial 10 GHz / EMFT 40 GHz EMFT: lower Edge-/Substrate-roughness

Backside fully metallized-12

-10

-8

-6

-4

-2

0

0 20 40 60

Frequency / GHz

Mag

nitu

de /

dBS21 (PI Substrate)

Semi-Additive

Commercial Subtractive Technology

GCPW-LineL = 40 mmW = 100 μm(G = 60 μm)

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5.0

5.1

5.2

5.3

5.4

5.5

5.6

0 10 20 30 40 50 60

Frequency / GHz

grou

p de

lay

/ ns/

m

0123456789

skin

dep

th /µ

m

Skin Effekt Ursache für unterschiedliches Verhalten unter 20 GHz Leiterbahnhöhe: 13 - 14 μm Commercial; 7 – 8 μm EMFT

EMFTCommercial

Vergleich Group Delay g Commercial/EMFT

calculated skin depth

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Example: Printed passives on foil

Screen printed carbon resistors Printed plate capacitorson foilStructure: Cu/Dielectrics/Carbon

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Example: Printed Carbon Paste Resistors

Test structures performance measured:

15 x 3 mm; 200 mesh; Carbon paste

resistance: 743 Ω ± 6,3%Area resistance:101,4 Ω/sqr (100 Ω/sqr*)

Interflex Demonstrator: 27 different R values between 100 Ω and 10 MΩ

fabricated and characterized required accuracy for system ± 5% Integrated directly on the systems foil

0

2

4

6

8

10

12

14

16

18

0,67 0,7 0,73 0,76 0,79 0,82 undgrößer

qu

an

tity

Resistance [kOhm]

Fabricated with two screen printing steps

* Supplier data for the paste

Distribution of R-values of 69 screen printed test structures

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Project example: EC-Project COSMIC

The COSMIC concept is to enable an organic mainstream technology by:

Develop an Organic “CMOS” Technology Platform

Establish robust and reproducible full-printing process flows

Library of Digital and Analogue Building Blocks

Demonstrate the strength of organic CMOS platform on four lead applications A/D converter, Silent Tag, Display line driver


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EMFT – R2R Process Integration for CMOS (COSMIC)

wiringantenna diode capacitor p-oTFT n-oTFT resistor

p-semiconductorn-semiconductorprinted carbon

metalprinted carbondielectric

Integration of different components in one material system with mixed processingmetal printed/carbon

Strong support for the low cost application area


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High Mobility p-Channel oTFTs mit Carbon-SD in R2R

Printed Carbon Source/Drain-electrodes and TIPS-Pentacenebased OSC formulation/blending

Bottom Gate/TopContact - Structure Imroved Transistor-Performance

Factor 10

µ [cm²/(Vs)] 0,34 ±0,09

Uth [V] -2,4 ±0,5

On/Off 8500

IGate @ 0V [nA] ~1


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Key Issue: Highly Precise Web-Coating With Sub-μm Layers

40

45

50

55

60

65

-10 -5 0 5 10

Thic

knes

s(d

ry) [

nm]

Position TD [cm]

400

450

500

550

600

650

700

-10 -5 0 5 10

Thic

knes

s(d

ry) [

nm]

Position TD [cm]

554 nm ± 69nm (3σ) 52,3 nm ± 5,6 nm (3σ)

Uniform deposition of gatedielectrics for oTFTs

Resist coating for R2R-photolithography with CD below 15 μm


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MEMS und Plastik-MEMS

Route1: Plastic Film ProcessingReel-to-Reel Technology

Route2: Silicon Wafer Processing

MEMS Technology

Example: Combination of MEMS Wafer and Foil Processes

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Combination of MEMS and Foil Processes on electrostatic carrier substrates

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Technology: Thin film Au metallisation on polyimide substrate for sensors application

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Application in bio-systems integration:

Cognitive bio-chips, bio-analytics and bio-sensors

diagnosing deep vein thrombosis – fabrication and assembly of lab-on-chip systems –integration of conventional components and roll-to-roll processing

Example: Deep-Vene Thrombosis- EU DVTimp

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Project EU DVT-Imp Plastic-Lab-on-Chip in R2R

Reader‘Smart’ Software, electronics and wireless device

Micro Fluid Array

Analysis

Cartridge

EU project DVT-IMPwww.diagnosingdvt.com

Sensor principle:• Impedimetric immunoassay for detection

of biomolecules• Cartridge concept with integrated

immunorecation zone

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Outview: Smart Materials - Non-OSC functions in foil systems

Application of color changing sensor layers

Colour changing package gives warning signal to the consumer

Sensor module for monitoring trade and transport

Integrated system for full time monitoring and data storage

PolyOpto

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Printing sensor dyes> Printing of sensor dyes directly to reactive materials

(e.g. cotton textiles, paper)


> Structures via masque technology

and coatable/printable in R2R

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2D Integration of Functional foils

Approach is to built component loaded layers using two wiring layers on one large area foil

Heterogeneous Integration

3D integration of large foil components on a wiring layer

2D integration of (foil) components on a wiring layer


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Sensor Foil

Double-sided Adhesive FoilOTFT

EL Element

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POLYOPTO Device setup

PEN Foil

ITO

PHS

EL Paste

Ag SP

ITOPHSTIPS

Carbon SP

Cross-sectional view

Laser cut holeGas

Gas

Top view

Cross-sectional view after folding process

Magnified top view showing laser hole

see SPIE Symposium San Diego, August 2012


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Structure of the color changing sensor material

Receptor(Selectivity / Sensitivity / Reversibility)

Linker(solvability / Immobilisation)

NN

O

O

R1R2

ImmobilisiationDetection reaction

Chromophor(Signalchange)

Information

pH, T, P…Ions

GasesSaccharidesNukleotidesToxines…


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Principle of operation

The sensor foil acts as a filter in between the EL light source and the OTFT.

The colouration of the foil changes to darker shades of blue according to the intensity ofthe amines present in the atmosphere.

Different peak levels correlate to creation of optically generated carriers in the channelleading to an identifiable sensor response to the different amine levels.



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Selection of materials


Control the crystallization of TIPS-Pentacene with a two-solvent μ-dispensing process.

Adapt the source-drain structures to be circular to benefit from the crystallization process.

Limit the variation in the OTFT currents to be an order below the sensor's current responseto the different amine concentration levels as trade-off to mobility by adjusting the binderconcentration levels.


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Circular OFET– Source-drain pattering

Source-drain contacts using evaporated gold via a shadow mask and screen printed carbon paste.



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Example: RF-Application – Sensor Label (COSMIC Project Demonstrator)

Organic Diode Oscillator Load transistor

Capacitor

Resistor


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Ultra-thin silicon devices open the door to ...

„vertical“devices

flexible electronics

3d stacked devices

very thin packages

Akita Elpida Memory

efficient power devices and thinner solar cells

Infineon

Polytronic SystemsFraunhofer EMFT

3d-integration Fraunhofer EMFT

self-assembly

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Examples: Thin silicon devices in Polytronic SystemsExample: RF data transmission module on film substrates

SMD type passive components, thickness 1-2 mm

25 μm thin silicon transceiver chip, laminated below polyimide film cover

Thin film copperwiring (roll-to-roll processing) on PI film

Development tasks:

• Homogeneous integration of thin passives (replace SMD components)

• Thin dies should be delivered in a robust thin chip foil package


EC FP7 Interflex, design by ST-I, passives and quartz assembly by Bosch

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surface programmingtechniques of substrates, both silicon and foils –

shown here by selfalignement, self-contacted, fullyfunctionable LEDs on silicon

Outview: Autonomous motion and self-alignment of thin dies on surface programmed substrates

surface tension of liquids isstrong enough to move andalign thin silicon dies and otherthin components in an autonomous manner on anysubstrate including foils

ECTC 2008, see also ESTC 2012, Amsterdam, September 2012

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Accuracy for self-alignment of plasma diced 50 μm thindies on Si-wafer substrates of < 1μm this process istransferable to foil!

surface tension forces of liquids enable directed movement of thin silicon chips

For wafer level assembly

self-alignment accuracy in the range of <1 μm

programming of specific substrate wettability by fluorine plasma

overlay of top and bottom fiducials after self-alignment (IR microscope)

ESTC 2012, Amsterdam, September 2012

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3D-Integration technology = foil stacking

Approach is to stack at least two sheets of component loaded wiring layers or large area foil components and interconnect them mechanical and electrical to build a multilayer flexible foil system.


3D integration of large foil components on a wiring layer

2D integration of small (foil) components on a wiring layer

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copper wiring on PI foil(500 nm sputtered Cu)

Types of wiring layers produced on foil substrates

silver coated copper wiring on PI foil(5 μm electroplated Cu)

printed thick-film silver wiring with printed carbon based resistors

foil substrates: PI, PEN, PET process technique: combinations of lithographic thin film, thick-film screen printing equipment: roll to roll production line between a minimum of such two wiring layers and a via process all different

devices/functions can be integrated for a multi-functional system (interconnects, passives, OFET, sensing layers and sensors, Actuators, fluidic devices (filter, pumps…), optical devices (display, optical detector, illumination…) …

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Enabling Step: Laser drilling of via holes

Laser micromachining at Fraunhofer EMFT

500 μm through-hole via in a copper metalized PI foil (laminating adhesive film on PI backside)

after plasma cleaning: smoke is removed; adhesive film splash remain largely unaffected

frequency tripled solid-state-laser = 355 nm optical power = 5 W 50 via/minute (at 500 μm) 1 000 via/minute (at 50 μm)

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Project example: FP7-ICT STREP INTERFLEX 2010-2013Question: How to increase performance in flexible electronics?

Solution: Integration?

Prerequisites: Reliable assembly and interconnection technologies

Targets the development of reliable assembly and interconnection technologies for a flexible foil system.

www.project-interflex.eu

2009 Heterointegrated Circuitry on a flexible partially printed wiring layerTransceiver and wireless sensor for customer inertial sensor system

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3D integration of two wiring (foil)layers (WL)

cutting of top WL and bottom WL to size

lamination of adhesive film on backside of top WL

laser cutting of via holes through metal, foil, adhesive film and protection liner

metallization foils adhesive film liner

aligned lamination of top WL on bottom WL

Top foil

Bottom foil

conductive material

via filling by dispensing conductive material

1.)

2.)

3.)

4.)

5.)

3D Heterogeneous Integration

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Via-fill process for electrical foil to foil interconnections

1.) adhesive film lamination2.) via hole drilling 3.) pick&laminate

two layer foil laminate with foil to foil interconnections

via fill

Method:

needle dispenser

via diameter: 500 μm

via depth: 70 μm

filled via hole

by dispensing

foil to foil daisy chain for evaluation of via fill process

Result:

20 – 40 Ω per daisy chain with 36 via holes


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Enabling Step: Pick&Laminate approach for large area

Preparation of WL top with backside PSA film and via holes.

Placing WL bottom on vacuum chuck.

Pick WL top with foil chuck equipped with an adhesion foil.

Alignment of WL top and WL bottom by moving the foil chuck.

Lower foil chuck:WL top < air gap < WL bottom.

Place roller on foil chuck; press WL top on WL bottom.

Roller lamination.

Remove foil chuck.

Process steps


© Fraunhofer

Pick&Laminate tool

video camera

wafer frame

vacuum plateadjustable in x, y, direction

magnetic holder adjustment screw

vacuum switch

3DHeterogeneous Integration

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Alignment accuracy with the pick&laminate tool

misalignment in x and y-direction: better than 100 μm, possibly to be improved to less than 40μm

Determination:

Result:

Aligned lamination of 2 WLs with identical copper pattern

determination of shift between top to bottom WL in x-and y-direction at 6 positions.

calculation of mean value and standard deviation


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T-peel test to determine bond strength of foil laminates

Working principle:measure the force to pull apart two foil stripes at constant speed


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Reliability studies on bending stress: bending machine and test

A clamped foil is moved back and forth over a roller at a 90O angle. During one cycle the foil passes the roller two times and is stressed twice.

foil

laminated foilcomponent


© Fraunhofer

Reliability characteristics of interfoil vias under bending stress

Daisy chain with 36 vias

bending diameter: 100 mm – 10 mm

number of cycles: 10, 100

electrical character-isation after each test

at 10 mm diameter bending stress starts damaging interconnections

a total black-out is not observed even after 100 cycles

Results:

20

25

30

35

initial

d=10

0mm; n

=10

d=10

0mm; n

=100

d=50

mm; n=10

d=50

mm; n=10

0d=

25mm; n

=10d=

25mm; n

=100

d=10

mm; n=10

d=10

mm; n=10

0

Res

ista

nce

[Ω)]

Daisy Chain 1 Daisy Chain 2 Daisy Chain 3


© Fraunhofer

Example: Double side wiring and 3D integrationEU Project INTERFLEX: Demonstration of 3d-assembled multi-functional foil components

front side elements: photovoltaic modules window opening for sensors (temp., hum., dew,

CO2) thinned silicon devices (micro controllers)

rear side elements: batteries RF antenna wiring

sheet size: 20 x 20 cm2


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Summary EU Interflex 3D foil integration will increase the performance in flexible electronics.

In the EU-funded project Interflex a 3D integration concept for the fabrication of flexible foil system is developed and studied in details.

The developed 3D integration technology will be demonstrated by realising an energy autonomous, indoor air quality sensing system capable of wireless communication of the measured data as flexible foil system. Battery

StandardisedInterfaces

Lamination

Power management

Antenna

SensorsT

R.H.

CO2

DewµC

Tx

IC

ICWiring layer

Energy

Sensing

Communication

Photo-voltaics

Battery

StandardisedInterfaces

Lamination

Power management

Antenna

SensorsT

R.H.

CO2

DewµC

Tx

IC

ICWiring layer

Energy

Sensing

Communication

Photo-voltaics

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Thermogenerators from Chains with 2200 vias: failure of via < 10ppm

Outview: Project OTEPS –Thermogenerator in foilDurchkontaktierungsprozessMultilayer foil through connectby screen print

R2R-Plasma etch for through foil via

Pat. pend. and to be published

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Outview: Bio-Sensors:„Intelligent micro filter“: working principle

+ -

-+

Layer 1: finger type electrodes at inlet

Layer 2: Filter membrane

Layer 3: finger type electrodes at outlet

1 2

3

see also EUROSENSORS, September 2012


© Fraunhofer

Outview: Sensor filter: preparation of micro electrodeson polyimide film

Perforation betweenelectrodes: diameter > 30 μm

see also EUROSENSORS, September 2012


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Outview: Implantable Biosensor Project EU P.Cezanne –

Aim: Glucose measurement for Diabetes patients. Implantable works with Calcium. The silicon-based Hydrogel optical wave guide FRET sensor, recently is also detecting Glucosis directly

21mm x 69mm

CFP

GBPfluo1

YFPGBP

T. Förster, C. Strohhöfer, K. Bock, et. al., "Biosensor for calcium based on a hydrogel optical waveguide with integrated sensor proteins“, Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009.

© Fraunhofer

Outview: Bio Sensor demonstrator

Demonstrator measures without extern Spectrometer FRET.

T. Förster, C. Strohhöfer, K. Bock, et. al., "Biosensor for calcium based on a hydrogel optical waveguide with integrated sensorproteins“, Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009.

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Bio-Sensorproteines and FRET

Th. Förster, "Zwischenmolekulare Energiewanderung und Fluoreszenz", Annalen der Physik, vol. 437, no. 1-2, pp. 55–75.

CFP

GBPfluo1

YFP

GBP

YFP: yellow fluorescent protein. CFP: cyan fluorescent protein. FRET: fluorescence resonance energy transfer.

© Fraunhofer

Hetero-Integration von FoliensystemenOutview: Heterointegration of Bio-Systems in a Foil

Wireless Patient Wrist StrepPrinted EL display, passive elements andfoil bio-sensors Combined with thin ACA assembled Si chips and soldered SMD‘s for ICs R2R compatible fabrication process

© Fraunhofer

Functional (device) Heterointegration

Materials & Process &EquipmentChallenge

Hybride Approach

Open evolution of materials, processes,

design and architectures “Cross-

Science”

• Improve Materials by

• A Joint Development of Materials & Processes

• Because: Different functional device blocks will have

to be realized on different (the most appropriate)

process and substrate levels

• Together with the right equipment

© Fraunhofer

SummarySmart Materials & Process Integration RequirementsAdditive structurization, Smart Processing, Advanced Functions

Additive patterning i.e. embossing, (contact, micro,…)-printing

Surface-Energy „Addressable“ (hydrophilic, hydrophobic...)

Self Assembling (i.e. self assembling monolayers)

Micro phase separating material mix (i.e. block co-polymers)

Processability on different (wafer, PCB and foil)- substrates

Process Compatibility with different device technology Materials & Processes

UV curable (non-thermal for low-cost substrates)

© Fraunhofer

Conclusion: Modular Solid State Technologies Materials and Processes co-integrated are the key for interfacingdevice technologies and systems integration technologies

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IDTECHEX Forecasts for OLAE Polytronics

The leading market research company IDTechEx forecasts a

market size by 2027 of US$ 330 Billion for the sector as a whole, a volume comparable to that of the traditional CMOS based electronics sector of 2009 in terms of size importance.

It is expected that the size of logic and memory devices will grow disproportionally and will by 2027 constitute a market volume of US$ 115 Billion-

© Fraunhofer

OLAE Market Polytronic Systems

The worldwide sales of organic and printed electronics is expected to grow to almost60 billion US$ by 2019. (Data: WSTS, DisplaySearch, SIA von Custer, NanoMarkets, IDTechEx;Graph OE-A , 2009).flat-panel displays based on organic light-emitting diodes (OLED) will achieve a global marketsize of approx. € 1.4 Bn by 2015 (Source: DisplaySearch, 2009). The equivalent global market size forOLED lighting is to reach € 4 Bn by 2015 (Source: Photonics21, WG4, 2009).

© Fraunhofer

BaselineCMOS Memory

Sense, Interact,Power

RFHV

Power PassivesSensors,Actuators

Bio,Fluidics

Compute/Storage

‘Moore’s law’ ‘More than Moore’

Heterogeneous IntegrationSystem in package

Digital contentComplex Design (SoC)

Non-digital contentLots of processes

Polytronics

Scope and functionality (EPOSS) and Polytronics (OLAE)

© Fraunhofer

Cos

t / fu

nctio

n

System complexity

System Integration Platforms (EPOSS)

SOC

MEMS

Bio-Interface

Hetero SystemIntegration

Power supply

PolytronicsRFID & Smart Objects

© Fraunhofer

Millenium Packaging Challenge 2002/3 !

...Cubic Integration, E-grain,

e-cubes,Polytronics , R2R, Nanomaterials , Nanotechnologies ...Bottom-up Self-assembly ...

„System-drivenPackaging Wave“

Through-Hole Wave

1970 1980 1990 2000 2010

10

100

1000

Sys

tem

Vol

ume

a.u

Surface-Mount Wave

Area-Array Wave

10E4

1

2020

Packaging Gap

10E5

10E6

HDI Wave

© Fraunhofer

Products: ‘Ambient Intelligence’ - “Small Tech” Symbiosis

Satellite

Global

Suburban Urban In- Building

Pico-Cell

Micro-Cell

Macro-Cell Home-Cell

Seamless & Rich Connectivity

Intelligent Environments

Human Interfaces

© Fraunhofer

...Cubic Integration, E-grain,

e-cubes,Polytronics , R2R, Nanomaterials , Nanotechnologies ...Bottom-up Self-assembly ...

„Modular Solid StateTechnologiesWave“

TVs

1970 1980 1990 2000 2010

10

100

1000

Sys

tem

Vol

ume

a.u

mobiles

Computer

10E4

1

2020

10E5

10E6

Millenium Technology Challenge 2012-25 !

Internet of Things?

Internet ofHumans andEnvironment

© Fraunhofer

Conclusions 3D Hetero system Integration for foils could open towards an OEM

platform for multi-functional (open form factor) flexible systems bridging the gap to flexible board technologies and paving the way for flexible organic (OSC-based) and large area electronics (FOLAE)

Cost may be reduced for 3D hetero-integration compared to homogeneous multi-functional integration

Products are probably sooner compared to complex homogeneous integrated foil systems, examples: foil chip packages, integrated foil based passives , interconnects and transmission lines in foils, foil sensors,smart objects

Organic semiconductors are not a basic requirement for 3D hetero-integrated foil systems, but, can be an important option

3D foil integration will increase the performance in flexible electronics. Even Highest Performance might be reached by 3D hetero integrated foil systems

Foils does not mean only flexible systems (handling, surface, power, cooling, transparent, conformable)

© Fraunhofer

[email protected]@emft.fraunhofer.de

Karlheinz Bock 1),2),

1) University of Berlin, Gustav-Meyer Allee 25, 13355 Berlin, [email protected]

2) Fraunhofer Institution for Modular Solid State Technologies (EMFT), Hansastr. 27d, D-80686 Munich, Germany, email: [email protected]

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POLYTRONICS Multifunctional Heterosystemintegration