Embed Size (px)
Citation preview
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 1Report Ref: SP19472
22 bd Benoni Goulin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Piezoelectric Material From Bulk to Thin Film
Comparison 2019MEMS report by Sylvain HallereauSeptember 2019 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 2Report Ref: SP19472
Table of ContentsOverview / Introduction 4
o Executive Summaryo Analyzed Piezoelectric by Functiono Glossary
Thin Film Market Analysis 13
o Key Device Players
Piezoelectric material: Function and integration 18
o Ultrasonic sensoro Bosch – Ultrasonic Park Assist Sensor (Bulk)o Continental – AdBlue Sensor Module (Bulk)
o Inkjeto Toshiba TEC - CA4 (Bulk)o OCE ColorWave 600 Printhead (Bulk)o Kyocera KJ4B-1200 Printhead (Bulk)o Fujifilm Dimatix Samba Inkjet Die (Thin Film)o EPSON - PrecisionCore PZT Inkjet (Thin Film)o XAAR - 1201 Printhead (Thin Film)
o MEMSo Qualcomm 3D UltraSonic Fingerprint Sensor (Piezo Polymer)o Vesper VM1000 microphone (Thin Film)o Panasonic Inertial Gyroscope MEMS (Thin Film)o Silicon Sensing CMS300 Gyroscope MEMS (Thin Film)o Usound MEMS Speaker (Thin Film)
o RF and BAW Filtero Paratek_BST Tunable_Capacitor (Thin Film)o Quorvo (Thin Film)o Broadcom (Thin Film)
Physical Analysis and Process 106
o PZT Bulk Piezoelectric materialo Physical Analysis
o PZT Thin Filmo Physical Analysis and Process Flow
o AlN Thin Filmo BST Thin Filmo Piezo polymer
Cost Analysis 230
o Bulko Bosch – Ultrasonic Park Assist Sensor (Bulk)o Continental – AdBlue Sensor Module (Bulk)o Toshiba TEC - CA4 (Bulk)o OCE ColorWave 600 Printhead (Bulk)o Kyocera KJ4B-1200 Printhead (Bulk)
o Thin Film Piezoelectric o Fujifilm Dimatix Samba Inkjet Die (PZT Thin Film)o EPSON - PrecisionCore PZT Inkjet (PZT Thin Film)o XAAR - 1201 Printhead (PZT Thin Film)o Vesper VM1000 microphone (AlN Thin Film)o Panasonic Inertial Gyroscope MEMS (PZT Thin Film)o Silicon Sensing CMS300 Gyroscope MEMS (PZT Thin Film)o Usound MEMS Speaker (PZT Thin Film)o Quorvo (AlN Thin Film)o Broadcom (AlN Thin Film)o Paratek Tunable capacitor (BST thin film)o Qualcomm 3D UltraSonic Fingerprint Sensor (Piezo Polymer)
Comparison 260
o Printhead Review
o Piezoelectric Component Review
o Piezoelectric Component Wafer Cost Review
Customer Feedbacks 265
Company services 267
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 3Report Ref: SP19472
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Market Analysis
Piezo Material Integration
Physical Analysis and Process
Cost Analysis
Comparison
Related Reports
About System Plus
Application Summary
o Ultrasonic sensor
o Bosch – Ultrasonic Park Assist Sensor (Bulk)
o Continental – AdBlue Sensor Module (Bulk)
o Inkjet
o Toshiba TEC - CA4 (Bulk)
o OCE ColorWave 600 Printhead (Bulk)
o Kyocera KJ4B-1200 Printhead (Bulk)
o Fujifilm Dimatix Samba Inkjet Die (Thin Film)
o EPSON - PrecisionCore PZT Inkjet (Thin Film)
o XAAR - 1201 Printhead (Thin Film)
o MEMS
o Qualcomm 3D UltraSonic Fingerprint Sensor Ist and 2nd generation (Piezo Polymer)
o Vesper VM1000 microphone (Thin Film)
o Panasonic Inertial Gyroscope MEMS (Thin Film)
o Silicon Sensing CMS300 Gyroscope MEMS (Thin Film)
o Usound MEMS Speaker (Thin Film)
o RF and BAW Filter
o Paratek_BST Tunable_Capacitor (Thin Film)
o Quorvo BAW Filter (Thin Film)
o Broadcom BAW Filter (Thin Film)
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 4Report Ref: SP19472
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Market Analysis
Piezo Material Integration
Physical Analysis and Process
Cost Analysis
Comparison
Related Reports
About System Plus
Piezoelectric Materialo PZT (Lead zirconium titanate)
o Bosch – Ultrasonic Park Assist Sensor (Bulk)
o Continental – AdBlue Sensor Module (Bulk)
o Toshiba TEC - CA4 (Bulk)
o OCE ColorWave 600 Printhead (Bulk)
o Kyocera KJ4B-1200 Printhead (Bulk)
o Fujifilm Dimatix Samba Inkjet Die (Thin Film)
o EPSON - PrecisionCore PZT Inkjet (Thin Film)
o XAAR - 1201 Printhead (Thin Film)
o Panasonic Inertial Gyroscope MEMS (Thin Film)
o Silicon Sensing CMS300 Gyroscope MEMS (Thin Film)
o Usound MEMS Speaker (Thin Film)
o AlN (Aluminum nitride)
o Vesper VM1000 microphone (Thin Film)
o Quorvo BAW Filter (Thin Film)
o Broadcom BAW Filter (Thin Film)
o BST (Barium Strontium Titanate)
o Paratek_BST Tunable_Capacitor (Thin Film
o Piezo Polymer
o Qualcomm 3D UltraSonic Fingerprint Sensor Ist and 2nd generation (Thin Film)
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 5Report Ref: SP19472
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Market Analysis
Piezo Material Integration
Physical Analysis and Process
Cost Analysis
Comparison
Related Reports
About System Plus
Piezoelectric Inkjet
Bulk PZT piezoelectric inkjet printhead
PZT Thin film piezoelectric inkjet printhead
KJ4B-1200 PrintHeadColorwave 600 PrintHeadCA4 Printhead
Samba Inkjet die1201 Printhead
Precison Core inkjet
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 6Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
Toshiba TEC CA4 Printhead – PZT Bulk Inkjet
The ink falls in a reservoir
The liquid ink goes in via this pipe
The piezoelectric actuators push the ink toward the nozzle.
Toshiba TEC CA4 printhead – Optical view©2019 by System Plus Consulting
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 7Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
XAAR 1201 Printhead - Teardown
Nozzle plate in steel
Head case
Printhead top view©2018 by System Plus Consultingxxmm
xxmm
4 nozzle rows
2xmm
xxmm
xxmm
xxmmxxmm
xxmm
xxmm
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 8Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
Vesper VM1000 Piezoelectric MEMS Microphone - Teardown
Package Cross-Section – Optical View
Cross-Section Plan
Package Cap
MEMS Sensor ASIC
PCB Substrate
Solder
MEMS Sensor ASIC
PCB Substrate
Package Cross-Section – SEM View
Acoustic hole
Diameter xxµmBlack silicone
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 9Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
Silicon Sensing Piezoelectric Gyroscope MEMS
MEMS Gyroscope Die Overview
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 10Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
Usound 2000-1012Piezoelectric MEMS Speaker
MEMS Speaker Die Overview
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 11Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integrationo Ultrasonic Sensor
o Bosch – Ultrasonico Continental– Ultrasonic
o Inkjeto Toshiba – Inkjeto OCE – Inkjeto Kyocera – Inkjeto Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjet
o MEMSo Qualcom - Fingerprinto Vesper – Microphoneo Panasonic – Inertialo Silicon Sensing - Inertialo Usound – Speaker
o RF & BAW Filtero Paratek BST Tunable
Capacitoro Quorvo – BAWo Broadcom - BAW
Physical Analysis and ProcessCost AnalysisComparisonRelated ReportsAbout System Plus
BroadcomFilm Bulk Acoustic Resonator
(FBAR) Filter
Broadcom FBAR filter
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 12Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integration
Physical Analysis and Processo PZT Bulk Piezo
o Physical Analysis
o Bosch – Ultrasonico Continental– Ultrasonic o Toshiba – InkjetoOCE – Inkjeto Kyocera – Inkjet
oGlobal Process Flow
o PZT Thin FilmoPhysical Analysis + Process
o Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjeto Panasonic – Inertialo Silicon Sensing - InertialoUsound - Speaker
o AlN Thin FilmoPhysical Analysis + Process
oVesper – MicrophoneoQuorvo – BAWoBroadcom - BAW
o BST Thin FilmoPhysical Analysis + Process
oParatek - Capacitoro Piezo Polymer Film
oPhysical Analysis + ProcessoQualcom - Fingerprint
Cost AnalysisComparisonRelated ReportsAbout System Plus
Fujifilm Dimatix Samba Inkjet Die - PZT Inkjet actuator
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 13Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integration
Physical Analysis and Processo PZT Bulk Piezo
o Physical Analysis
o Bosch – Ultrasonico Continental– Ultrasonic o Toshiba – InkjetoOCE – Inkjeto Kyocera – Inkjet
oGlobal Process Flow
o PZT Thin FilmoPhysical Analysis + Process
o Fujifilm – Inkjeto Epson – Inkjeto XAAR – Inkjeto Panasonic – Inertialo Silicon Sensing - InertialoUsound - Speaker
o AlN Thin FilmoPhysical Analysis + Process
oVesper – MicrophoneoQuorvo – BAWoBroadcom - BAW
o BST Thin FilmoPhysical Analysis + Process
oParatek - Capacitoro Piezo Polymer Film
oPhysical Analysis + ProcessoQualcom - Fingerprint
Cost AnalysisComparisonRelated ReportsAbout System Plus
XAAR & Ricoh 1201 Inkjet Die - PZT Thin Film
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 14Report Ref: SP19472
Overview / Introduction
Market Analysis
Piezo Elements Integration
Physical Analysis and Process
Cost Analysis o Piezoelectric PZT Disco Toshiba TEC CA4 Printheado OCE Colorwave Printheado Kyocera KJ4B-1200 Printheado Bulk Piezoelectric Actuatorso Fujifilm Samba Inkjet Dieo Epson Precision Core Inkjeto XAAR MEMS Inkjet Dieo Panasonic Piezoelectric
MEMS Gyroscopeo Silicon Sensing Piezoelectric
MEMS Gyroscopeo USound Piezoelectric MEMS
Speakero Vesper Piezoelectric MEMS
Microphoneo Qorvo Piezoelectric BAW
Filtero Broadcom Piezoelectric FBAR
Filtero Paratek Tunable Capacitoro Qualcomm 3D Ultrasonic
Fingerprint Sensor
ComparisonRelated ReportsAbout System Plus
OCE Colorwave Printhead – PZT Inkjet actuator
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 15Report Ref: SP19472
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical & Cost Comparison
Physical Analysis
Related Reports
About System Plus
Linked Report
Piezoelectric Devices: From Bulk to Thin-Film 2019 – Market andTechnology Report by Yole Développement
How strongly will piezoelectric’s good vibrations resonate in thedevice market?
KEY FEATURES OF THE REPORT• Introduction to piezoelectric devices• From bulk piezoelectric materials to thin-film materials• 2018 – 2024 market forecasts for piezo devices• Market trends, by device type and product availability• Detailed analysis of the manufacturing process and challenges ahead, including technology roadmaps• Piezoelectric device supply chain
• Bundle offer possible with the Piezoelectric Material From Bulk to Thin Film – Comparison 2019report by System Plus Consulting, contact us for more information.
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 16Report Ref: SP19472
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical & Cost Comparison
Physical Analysis
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS• Qualcomm 3D Sonic Sensor Fingerprint• Broadcom AFEM-8092 - FBAR Filter• Epson PrecisionCore Inkjet Head• Xaar 1201 Inkjet Head• Bosch Ultrasonic Sensor• Vesper VM1000 MEMS Microphone• Murata FAJ15 TC-SAW Filter - Band 8• Qualcomm Snapdragon Sense ID 3D Fingerprint• Qorvo TFQ6405 BAW Filter• Silicon Sensing CMS300 Combo Sensor• Paratek_BST Tunable_Capacitor
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMS & SENSORS• Status of the MEMS Industry 2019• Inkjet Printheads: Dispensing Technologies & Market Landscape
2019
This review study has been conducted toprovide insights and technology data for alarge range of functions based onpiezoelectric material characteristics.
Piezoelectric materials allow interactionsbetween electronic components and themechanical world, so that actuator andsensor functions can be integrateddirectly with electronic die. That’s whypiezoelectric materials are used in moreand more modules. Traditional productsinclude printheads, ultrasonictransducers, and radiofrequency (RF)filters. New MEMS products includemicrophones and speakers. The reportproposes a study of 16 piezoelectrictechnologies from 16 manufacturersincluding Qualcomm, Broadcom, Qorvo,Panasonic, Silicon Sensing, XAAR-Ricoh,Epson, Fujifilm, Vesper, Usound, Kyocera,Toshiba, OCE, and Paratek.
System Plus consulting has beenperforming reverse engineering andcosting of a large variety of componentsbased on the piezoelectric effect for morethan 10 years. However, only the latestgenerations are presented in this report.This review has been conducted toprovide insights into the structures,technical and design choices of thecomponents at the center of the mostinnovative functions.
We analyzed and compared twoultrasonic sensors, six printheads, fiveMEMS dies and three RF components.
This report contains a physical analysisand a cost estimation of the integration ofpiezoelectric material in a system orwafer. We base our analysis on fullteardowns of the piezoelectric materialand electrodes to unveil the technologicalchoices made by the differentmanufacturers. Finally, it features anexhaustive comparison between thestudied samples, highlighting thesimilarities and differences and theirimpact on cost.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Piezoelectric actuator cross-sections
• Materials analysis
• Manufacturing process flow
• Manufacturing cost analysis
• Physical comparisons
• Cost comparisons
Unique technical and cost review of 16 piezoelectric modules from marketpioneers, including transducers, inkjet dies, MEMS gyroscopes, RF filters, MEMSmicrophones and micro-speakers.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Piezoelectric Material Comparison 2019
Pages: 271
Date: September 2019
Format: PDF & Excel file
Price: EUR 6,490
Piezoelectric Material From Bulk to Thin Film –Comparison 2019
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS*
Overview/Introduction
• Executive Summary
• Analyzed Piezoelectric Devices, by Function
Market Analysis
Piezoelectric material: Function and Integration
• Ultrasonic sensor
• Inkjet
• MEMS
• RF and BAW Filter
Physical Analysis
• PZT Bulk Piezoelectric Material, PZT Thin Film, AlN Thin Film, BST Thin Film, Piezo Polymer
Cost analysis
• Bulk
o Ultrasonic sensors: Bosch, Continental
o Inkjet: Toshiba, OCE, Kyocera
• Thin Film & Piezoelectric Polyimer
o Inkjet: Fujifilm, Epson, Xaar
o MEMS: Vesper, Panasonic, Silicon Sensing, Usound, Qualcomm 3D
• RF & BAW filter: Qorvo, Broadcom, Paratek
Review
• Printhead Review
• Piezoelectric Component Review
• Piezoelectric Component Wafer Cost Review
*Detailed Table of Contents available on the webpage.
PIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
RELATED REPORTS
AUTHORS
Qualcomm 3D Sonic Sensor FingerprintJuly 2019 - EUR 3,990*
Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr SeriesFebruary 2019 - EUR 3,990*
Epson PrecisionCorePrinthead with MicroTFPInkjet DiesSeptember 2018 - EUR 3,990*
Sylvain Hallereau is in chargeof costing analyses for IC,power and MEMS. He has morethan 10 years of experience inpower device manufacturingcost analysis and has studied awide range of technologies.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer.She holds a Master degree inMicro-electronics from theUniversity of Nantes.
Guillaume Chevalier has joinedSystem Plus Consulting in early2018 to perform physicalanalyses. He holds a two-yearuniversity degree in technologyof physical measurements andinstru-mentation technics.
LINKED REPORT
Piezoelectric Devices: From Bulk to Thin-Film 2019 – Market and
Technology Report by Yole Développement
Bundle offer possible with the Piezoelectric Material From Bulk to
Thin Film – Comparison 2019, contact us for more information at
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
IC Price+
MEMS CoSim+
MEMS Price+
Power CoSim+
Power Price+
LED CoSim+
3D PackageCoSim+
DisplayPrice+
PCBPrice+
SYSCost+
CONTACTS
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized
in the cost analysis of electronics
from semiconductor devices to
electronic systems.
A complete range of services and
costing tools to provide in-depth
production cost studies and to
estimate the objective selling price of
a product is available.
Our services:
• STRUCTURE & PROCESS
ANALYSES
• TEARDOWNS
• CUSTOM ANALYSES
• COSTING SERVICES
• COSTING TOOLS
• TRAININGS
www.systemplus.fr
Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]
America Sales OfficeSteven LAFERRIEREWestern USA & Canada+1 [email protected]
Chris YOUMANEastern USA & Canada+1 919-607-9839 [email protected]
Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 80 4371 [email protected]
Mavis WANGGreater China+886 979 336 [email protected]
Peter OKKorea+82 10 4089 [email protected]
Our analysis is performed with our costing tool MEMS CoSim+.
System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from
single chip to complex structures.
MEMS CoSim+
Cost simulation tool to evaluate the cost of any MEMS process or device.
ORDER FORMPlease process my order for Piezoelectric Material From Bulk to Thin Film – Comparison 2019, Reverse Costing® – Structure, Process & Cost Report Ref: SP19472
Full Structure, Process & Cost Report : EUR 6,490* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTPIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
Return order by: FAX: +33 (0)472 83 01 83MAIL: YOLE DEVELOPPEMENT
75 Cours Emile Zola69100 Villeurbanne – France
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.i-micronews.com. The present document is valid 6 months after its publishing date: September 2019
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - 1 place de la Bourse, F-69002 Lyon, FranceBIC code: CCFRFRPPBank code : 30056 - Branch code : 00170 - Account : 0170 200 1565 87 IBAN: FR76 3005 6001 7001 7020 0156 587
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 17Report Ref: SP19472
COMPANYSERVICES
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 18Report Ref: SP19472
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical & Cost Comparison
Physical Analysis
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2019 by System Plus Consulting | Piezoelectric Material From Bulk to Thin Film – Comparison 2019 | Sample 19Report Ref: SP19472
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical & Cost Comparison
Physical Analysis
Related Reports
About System Pluso Company serviceso Contact
Contact
www.systemplus.fr
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 [email protected]
America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]
Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]
ORDER FORMPlease process my order for Piezoelectric Material From Bulk to Thin Film – Comparison 2019, Reverse Costing® – Structure, Process & Cost Report Ref: SP19472
Full Structure, Process & Cost Report : EUR 6,490* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTPIEZOELECTRIC MATERIAL FROM BULK TO THIN FILM - COMPARISON 2019
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING
22, bd Benoni GoullinNantes Biotech44200 Nantes – France
EMAIL: [email protected]
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: September 2019
1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.
4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the
total invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES
![Power Enhancement for Piezoelectric Energy Harvester · General schematic of piezoelectric energy harvester [4] ... piezo = m. MFC. Fig. 4 ... the shaker is excited by an amplifier](https://img.pdfslide.us/doc/110x75/5b0a02fc7f8b9a0c4b8b536d/power-enhancement-for-piezoelectric-energy-schematic-of-piezoelectric-energy-harvester.jpg)
