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29/4/2014
1
Penchem’s Profile
Founded: 1 OCTOBER 1999
Address: BUKIT MINYAK INDUSTRIAL PARK, PENANG, MALAYSIA
Nature of Business: DESIGN, MANUFACTURE and SUPPLY of ADVANCED POLYMER and COMPOSITE MATERIALS for ELECTRONICS and MEDICALS
Penchem General Electronics Materials
Customer Applications Product Category
Product Code Applications Special Features
Chip On Board Epoxy (COB)
EN453 EN485 EN525 EN690
• Chip-On-Board • Dam & Fill • Encap and protect components and bonded wires
• Good mechanical and adhesion strength • Low stress • Good thermal-mechanical properties • Good weather resistance
Die Attach / SMT Epoxy / Silver Epoxy / Under Fill
CB625 CB643 DA669 AG806
CB626 CB648 AG803
• Bonding chip and component on PCB • Die attach (Electrically & non- electrically conductive) • Under-fill
• Good mechanical and adhesion strength • Non sagging/smearing • No bleeding and tailing • High electrical conductivity (silver epoxy)
Epoxy Sealant EN690 GL172 GL174 GL440 GL616
• Relays & Contactors • Fiber optic • Lens
• Low thermal-mechanical stress • High thermal and moisture resistance • Good chemicals resistance
Epoxy Potting / Silicone Potting
PT365 PT497 PT638 PT910
• Transformer • Sensor
• Low stress • Good thermal-mechanical properties • Good weather resistance • Good flow & self-leveling
UV Epoxy UV367 UV379-1 UV405 UV702
• Bonding Fiber optic • Bonding Lens • Tacking Coils • Coating
• High Refractive index (RI=1.4 to 1.5) • Good mechanical and adhesion strength • Fast curing
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Penchem Thermal Interface Materials (TIM)
Customer Applications Product Category
Product Code Applications Special Features
Silicone Pad TH933 TH936-1
• Heat sink for Power devices • High power IC for PC, Notebook, & Server • Heat sink for high power LED and controller • Heat sink for automobile and heat exchangers
• Very good thermal conductivity up to 7.1W/mK • 2 types of Pad: (a)Non-sticky and (b)One- side sticky • Can die cut to specific size and dimensions • Wide range of thickness (0.2mm up to 5mm)
Silicone Putty / Grease
TH931-2 TH932-2
• Excellent outdoor performance with good stability & reliability • Ease of use by dispensing or screen printing
Silicone Potting TH934 • 2-Part RTV potting compound • Good adhesion and weather resistance • Good flow and self-leveling
Thermal Conductive Epoxy
TH732-1 • 1-Part heat curable epoxy • Excellent adhesion and good mechanical strength • Good thermal conductivity
Penchem Optoelectronics Materials
Customer Applications Product Category
Product Code Applications Special Features
Casting Epoxy OP590 OP692 OP589
• Automobile lighting • Turn signal bulbs • Electronic signs • Signboards • Backlighting • Traffic signal lights Through-hole LED (3mm, 5mm, Oval, Flat-top, etc.) Super Flux Snap LED
• Outstanding performance for outdoor application • Pass TMCL -55°C/100°C, -40°C/120°C • Meet MSL specifications • Low Iv degradation (<10%) • Comply to REACH & RoHS requirements • Halogen free
Encapsulation Silicone
OP955 UV923
• Commercial lighting • Architectural lighting • Outdoor lighting High power LED
• Low thermal-mechanical stress • High thermal & radiation resistance • Low gas permeability • Refractive index 1.41 & 1.55 • Comply to REACH & RoHS requirements
Encapsulation Epoxy / Silicone
OP589 • Backlighting for signage, LCD panel (TV, hand phone, tablet, etc.) • Architectural Lighting • Automotive Accent Lighting SMD LED
• Good heat & UV resistance • Meet MSL specification • Comply to REACH & RoHS requirements
Potting Epoxy OP281 OP577
• S4 (seven Segment Display) for clocks, watches, digital instruments, and many household appliances
• Low stress • pass TMCL • Comply to REACH & RoHS requirements
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Penchem low
surface energy
ring barrier
Penchem UV
silicone
by needle
dispense
The finished High
Brightness LED
product
Self dome-forming silicone process replaced conventional
Molding Process. Saved customer 1 million USD per mold.
Customers seek us for engineering solutions
Penchem advanced epoxies with no shifting at high-low temperatures for fiber optics and
microwave devices. Replaced expensive brands with excellent engineering support.
Conventional Compression Mold
Automatic
dispenser
from syringe
needle
1
2 3
4
Microwave Fibre Optics Microwave (Aeroplanes)
Innovations
Customers seek us for engineering solutions
Penchem develop a one part silver conductive epoxy
with high peel strength, low out-gassing and
exceptionally low volume resistivity. This has help
the customer to save process cost with replacement
of two-part system
5
6 3
Hard Disk Drive
MEMS Microphone
Penchem UV and heat curable epoxies that meet
HDD cleanliness requirement. Extremely stable with
low shrinkage and no micro-movement or migration
at high-low temperatures and humidity test.
Successfully replace expensive brands.
Innovations
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Developing 3D Printer Technology & Materials
Labs are opened on weekends for “ideas”
2010
Custom Formulations
COB & Relay Sealants
Silver DA & SMT Epoxies
LED Epoxies & UV Cure Adhesives
Markets
Electronics
Automotive
Solar
Medical
Aerospace
Epoxy Technology Roadmap
1999
2001
2003
2006
Aerospace & Composites
Medical Devices
Silicone Epoxy Hybrids Fibre
Optics 2013
2014
2010
2015
29/4/2014
5
Penchem Analytical Capability Exploring Possibilities, Developing Solutions
GPC – Reaction progress
Pyrolizer GC-MS – Purity & rev. eng.
Micro-FTIR – Correct product
Sub-amb. TMA – CTE
TGA-DTA - Hi. temp. stability
Sub-ambient DSC
- % cure
UV Conveyor Oven
– UV polymers Tensile Tester
– Material strength
Silicone synthesis DMA – Modulus & flexibility
Spectrophotometer
– color & % T
High resolution NMR
– Silicone structure detn
& QC
Thermal
Conductivitimeter
- TIM
Applications Lab • Simulate customers process conditions • Help customers resolve material & process issues • Develop semiconductor packaging technology • Build prototypes
Die-Attach Machine
Wire Bond Machine
Color Check Light Box
Solder Reflow with Real Time Video Record Integrating Sphere Light Measurement Humidity Chamber
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6
Research Collaborations
1. UKM 2014: Graphenes & conductive ceramics to enhance thermal conductivity
2. Kannur University, India 2014: Silicone chemistry & technology
3. USM 2013: Carbon nanotube composites for high power ICs
4. USM 2012: Synthesis of silicones of useful functional groups
5. USM 2011: Synthesis of POSS silicones
6. USM 2010: Nano-silver adhesives, enhanced electrical conductivity
7. USM 2007: Synthesis of silicone resins
Global Standard
ISO 9001:2008
Quality Management ISO/TS 16949:2009
Automotive Quality ISO 14001:2004
Environmental
Penchem Certifications and Compliances
Meets Global Standard
Large multi-nationals are confident buying from us.
ISO 13485
Medical
29/4/2014
7
Global Footprint
New York China
California
France
Japan
Taiwan
Malaysia
Thailand
Germany
Some key reasons:
Wide range of high quality and performance products Custom formulations and solutions Cost effective alternative
• Synthesis of own key raw materials • Industry leading price and performance • Small Minimum Order Quantity, MOQ
Strong and comprehensive technical support • Provide competitors evaluations, incorporate with professional
system/equipment manufacturer to provide total solutions, materials failure analysis and process trouble shooting
RoHS compliant (test report issue by SGS and accredited test labs)
Why Penchem Products
29/4/2014
8
Penchem won Most Innovative SME Award 2012
2012 SME Innovation Award,
Manufacturing Category
Most Innovative SME Award 2012
with RM 1 Million Prize
Winning Together
21 June 2012
Penchem won Quality Management Excellence Award 2011
Learning, Exposure & Employee’s Ownership
24 October 2012
29/4/2014
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Continuous Learning and Benchmarking Penchem Won 2013 Enterprise 50 Award
Penchem was among top 10 winners of 2013 Enterprise 50 Award 15 November 2013
Contact Information
Company Address: Penchem Technologies Sdn. Bhd. 1015, Jalan Perindustrian Bukit Minyak 7, Kawasan Perindustrian Bukit Minyak, 14100 Penang, Malaysia. Tel: +604-5015976, 77, 78 Fax: +604-5015979 Website: www.penchem.com Contact persons: KG Wong ([email protected]) Pierre Tham ([email protected])