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FORWARD CONCEPTS® Electronics Market Research
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Table of Contents
COMPREHENSIVE CELLPHONE & TABLET
CHIP MARKETS '14
Market Analysis of all Significant Cellular Handset & Tablet ICs
Author:
Carter L. Horney
Editor & Contributor:
Will Strauss
Report No. 1410 March, 2014
About the Author Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this report. Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning. He was formerly Division Planner for Rockwell International’s Digital Communications Division and earlier Strategic Marketing manager for Rockwell’s Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and high-speed modem chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University. About the Editor Will Strauss, President of Forward Concepts, is the editor and significant contributor for this report. Mr. Strauss is internationally recognized as the leading authority on markets driven by digital signal processing (DSP), and wireless is the largest market for DSP technology. Copyright © 2014 by Carter L. Horney for the exclusive use of Forward Concepts Company. All rights, including that of translation into other languages are specifically reserved. No part of the this publication may be reproduced in any form, stored in a retrieval systems or transmitted by any method or means, electrically, mechanically, photographic or otherwise, without the express permission of Carter L. Horney, (d\b\a Teletronix) P.O Box 487 San Clemente, California 92674. (Tel 949-492-8885: Fax: 949-361-8885). Personal E-mail: [email protected]
FORWARD CONCEPTS and the stylized FC Logo are registered trademarks of
Forward Concepts Co. ® Reg. U.S. Patent & Trademark Office.
TABLE OF CONTENTS
Forward Concepts Page i
I. EXECUTIVE SUMMARY ........................................................................................... 1
A. Overview ............................................................................................................. 1
B. Major Component Growth Summary ................................................................ 3
C. Baseband Processors ........................................................................................ 7
D. Connectivity Devices ....................................................................................... 10
E. Sensors: Image, Touch, MEMS Microphones and Sensors .......................... 11
F. ABB/PMU, RF and Power Amplifiers Chips .................................................... 13
II. MOBILE MARKET .................................................................................................. 15
A. Mobile Phones .................................................................................................. 15
1. Quarterly/YOY Handset Unit Market Share from 2012-2013 ....................................... 17
2. Top Thirteen Supplier Revenue for 2013 ..................................................................... 19
3. Mobile Phone Forecast by Type from 2013-2018 ........................................................ 19
B. Smartphones .................................................................................................... 20
1. Global Distribution of Smartphones by Region ............................................................ 22
2. Top 30 Smartphone Market Share Leaders 2012-2013 .............................................. 24
3. LTE Smartphone Market Leaders ................................................................................ 26
4. Entry-level Smartphone Trends ................................................................................... 27
5. Smartphone Supplier Profiles ...................................................................................... 27
a) Apple ......................................................................................................................... 28
b) Samsung ................................................................................................................... 29
c) LG ............................................................................................................................. 29
d) Sony .......................................................................................................................... 30
e) Huawei Devices ........................................................................................................ 30
f) ZTE Mobile Devices .................................................................................................. 30
g) Lenovo ...................................................................................................................... 31
h) Nokia ......................................................................................................................... 31
i) Xiaomi ....................................................................................................................... 31
j) TCL Communications Technology Holdings ............................................................. 32
6. Smartphone Five Year Forecast by Geographical Region .......................................... 32
7. Smartphone Five Year Forecast by Classification ....................................................... 33
8. Smartphone Five Year Forecast by Operating System Type ...................................... 34
9. Smartphone Baseband Market Share Supplier Summary ........................................... 35
C. Tablets .............................................................................................................. 37
1. The White Box Tablet Movement ................................................................................. 37
2. Tablet Quarterly and YOY Market Share from 2012-2013 .......................................... 38
3. Tablet Shipments by Operating Systems ..................................................................... 40
4. Tablet Manufacturing Sources Statistics ...................................................................... 40
5. Top 10 Tablet Suppliers ............................................................................................... 41
a) Apple ......................................................................................................................... 41
b) Samsung Electronics ................................................................................................ 41
c) ASUS ........................................................................................................................ 41
d) Amazon ..................................................................................................................... 42
e) Acer ........................................................................................................................... 42
f) Lenovo ...................................................................................................................... 42
g) Hewlett Packard ........................................................................................................ 42
h) Toshiba ..................................................................................................................... 43
i) Windows 8 Suppliers ................................................................................................ 43
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Forward Concepts Page ii
j) Microsoft RT .............................................................................................................. 43
k) ZTE ........................................................................................................................... 44
6. Five-Year Media Tablet Forecast ................................................................................. 44
7. Embedded Tablet Quarterly Shipments ....................................................................... 45
D. Chromebook Forecast ..................................................................................... 46
E. Modem Hotspots and USB Modem Sticks ...................................................... 48
1. LTE and LTE VoLTE Hotspot Routers ......................................................................... 49
2. USB Modem Sticks ...................................................................................................... 49
3. 4G Sticks, Hotspots, Tablet/Notebook Modem Forecast ............................................. 50
4. The Market & Supplier Profiles .................................................................................... 51
a) Huawei Device Division (Cat 5 Mobile HotSpot ........................................................ 51
b) Novatel Wireless (MIFI Home with VoLTE) .............................................................. 51
c) Sierra Wireless (Express Cards) ............................................................................... 52
d) Samsung Electronics ................................................................................................ 52
e) ZTE Mobile ................................................................................................................ 52
f) Franklin Wireless....................................................................................................... 53
III. BASEBAND PROCESSORS .................................................................................. 54
A. Overall Baseband Processor Market Shares.................................................. 57
B. Digital Baseband Processor Forecast by Air Type ........................................ 64
C. LTE Technology Movements ........................................................................... 68
1. LTE Voice Technology Transition ................................................................................ 68
2. VoLTE Operator Movement ......................................................................................... 69
3. Carrier Aggregation ...................................................................................................... 70
4. LTE Global Operator Status and Deployment Bands .................................................. 71
5. LTE Frequency Bands and Channel Bandwidths ........................................................ 76
6. Global LTE Network Deployment Trends .................................................................... 78
D. LTE Five Year Forecasts .................................................................................. 79
1. LTE Forecast by Global Regions ................................................................................. 79
2. TD-LTE Five-Year Forecast by Frequency Band ......................................................... 80
3. LTE & 3G/LTE Baseband Five-Year Forecast ............................................................. 81
E. LTE Supplier Market Shares ............................................................................ 85
F. LTE Baseband Supplier Profiles ..................................................................... 86
1. Altair Semiconductor Ltd. ............................................................................................. 87
2. Huawei-HiSilicon (LTE/3G Rel.9 baseband chip) ........................................................ 88
3. Innofidei (LTE & LTE/TD-SCDMA Modems) ................................................................ 88
4. Intel Mobile Communications (FD-LTE RF and 3G/LTE basebands) .......................... 89
5. GCT Semiconductor (GDM7240 LTE Cat3 Baseband/Transceiver) ........................... 90
6. Marvell (PXA1802 LTE/3G + TD-SCDMA thin modem) .............................................. 90
7. MediaTek (TD-LTE + TD-SCDMA Com-processor) .................................................... 91
8. NVIDIA-Icera (LTE & 21 Mbps HSPA+ platform) ......................................................... 91
9. Qualcomm (MDM 9x25 LTE/ EVDO or MC-HSPA+ modem) ...................................... 92
10. Qualcomm MDM9x35 20nm Cat. 6 LTE/3G/2G Thin Modem ................................. 93
11. Qualcomm (64-bit Single-Core S410) ...................................................................... 94
12. Qualcomm (64-bit S615/S610 OCTA/QUAD ARMv8) ............................................. 94
13. Samsung (CMC221 LTE Baseband only) ............................................................... 95
14. Sequans Communications (LTE Baseband/RF modem) ......................................... 95
15. Spreadtrum (LTE/TD-SCDMA/GSM baseband platform) ........................................ 96
16. Ericsson (M7400 LTE 4/3G modem – DBB, ABB and RF) ...................................... 97
G. 3G HSPA+ Enhancements in 3GPP R10 and R11 .......................................... 98
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Forward Concepts Page iii
H. WCDMA Baseband Market & Vendor Shares ............................................... 100
I. WCDMA/HEDGE Baseband Chip Profiles ..................................................... 101
1. Broadcom (7.2Mbps HSDPA / HSUPA Basebands) .................................................. 101
2. NVIDIA (21 Mbps HSPA+ Receive Diversity Modem) ............................................... 102
3. Intel (Release 7 diversity HSPA+ 21/11 Mbps Baseband Platform) .......................... 103
4. Marvell (PXA R81202 DC-HSPA+, PXA180x with R9 LTE) ...................................... 104
5. MediaTek (MT6268/76M WEDGE Platform) ............................................................. 104
6. Qualcomm (Gobi MDM Series of Thin Modems) ....................................................... 106
7. ST-Ericsson (7.2 and 21 Mbps HSPA+ Connect Platforms) ...................................... 107
J. CDMA Baseband Market & Vendor Shares .................................................. 108
K. CDMA2000 Baseband Supplier Profiles ....................................................... 109
1. VIA Telecom ............................................................................................................... 109
2. Qualcomm (CDMA2000 1x Advanced Chip Set) ....................................................... 109
3. Qualcomm (CDMA2000 EV-DO Rel. 0 and Rel. A) ................................................... 110
4. Qualcomm (Tri-mode CDMA1x EV-DO Rev. A, HSPA+/EDGE) ............................... 110
L. TD-SCDMA Baseband Supplier Profiles ....................................................... 111
1. Leadcore Technology Co Ltd. (TD-HSPA) ................................................................. 111
2. MediaTek (TD-SCDMA/TD-HSPA Baseband & 2 RFs) ............................................. 112
3. Marvell (TD-SCDMA, TD-HSPA Com -Processor) .................................................... 113
4. Spreadtrum (TD-HSPA DBB & RF, Triple-SIM) ......................................................... 113
5. Spreadtrum (LTE and TD-HSPA-SCDMA Baseband) ............................................... 114
M. TD-SCDMA Baseband Market & Vendor Shares .......................................... 114
N. GSM/GPRS & EDGE Baseband Market & Vendor Shares ............................ 117
O. GSM, GPRS & EDGE Baseband Supplier Profiles ....................................... 119
1. MediaTek (MT6236 312MHz ARM9 EDGE Platforms) ............................................. 119
2. Spreadtrum Communications (Multichip GSM/GPRS Baseband) ............................. 120
3. ST-Ericsson (Quad GPRS or EDGE-RX monolithic modem) .................................... 121
IV. INTEGRATED BASEBAND & RF CHIPS ............................................................. 122
A. ULC Modem Market Size & Vendor Shares .................................................. 123
B. ULC Modem Market Forecast ........................................................................ 126
C. Ultra-Low-Cost (BB/RF) Modem Supplier Profiles ....................................... 127
1. Broadcom (65nm Monolithic EDGE Modem, H.264) ................................................. 130
2. Intel (65nm Monolithic EDGE, BT4.0/FM, 5MP) ....................................................... 131
3. MediaTek, Inc. (GSM/GPRS 1-SIP RF, 2-Die hybrid MCP) ...................................... 132
4. MediaTek, Inc (EDGE/GPRS/GSM-TRx + MCP)....................................................... 132
5. RDA Microelectronics (Single-Chip GSM/GPRS DBB +BT/FM)................................ 133
6. Spreadtrum Communications (GSM/GPRS 3 die MCP) ............................................ 134
7. ST-Ericsson (Monolithic GSM/GPRS and EDGE DSDS) .......................................... 135
8. Qualcomm (WCDMA/HSDPA Single-Package Modems) .......................................... 136
9. Qualcomm (WCDMA/HSUPA 10Mbps/5.76 MCP Modem) ....................................... 136
10. Qualcomm (CDMA 1x & 1X EVDO MCP Modems) ............................................... 137
V. STAND-ALONE APPLICATION PROCESSORS ................................................. 138
A. Overview ......................................................................................................... 138
B. Cellphone vs. Tablet Apps Processors ........................................................ 139
C. Com-Processor vs. Standalone Processor .................................................. 140
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Forward Concepts Page iv
D. New Video Codecs: H.265 versus VP9 ......................................................... 141
E. Application Processor Trends ...................................................................... 142
F. Application Processor Market & Vendor Shares ......................................... 144
1. Smartphone Application Processor Vendor Market Shares ...................................... 144
2. Tablet Application Processor Market & Vendor Shares ............................................. 145
G. Application Processor and Com-Processor Forecast ................................. 146
H. Stand-alone Application Processor Suppliers ............................................. 148
I. Stand-Alone Application Processor Supplier Profiles ................................ 148
1. Allwinner (A31x ARM quad-core Cortex-A7 & SGX544MP2). ................................... 152
2. Allwinner (A80 OctaCore 4x Cortex A15+4x CortexA7) ............................................ 152
3. Amlogic (1.2 GHz Single Core Cortex A9 & Dual 2.5D & 3D GPU) .......................... 152
4. Amlogic (M802 1.5 GHz 4x Cortex A9r + Mali450MP6) ............................................ 152
5. Apple A6 (1.3 GHz dual-core Cortex Swift SGX543MP3) ......................................... 153
6. Apple A6X (1.4 GHz dual-core Cortex Swift SGX544MP4) ....................................... 153
7. Apple A7 (1.4 GHz dual-core Cortex Cyclone S5L8960X.) ....................................... 153
8. Freescale (iMX6 1.2 GHz Single, Dual and Quad-core Cortex A9) ........................... 154
9. Huawei (HiSilicon K3V3 1.8/1.2Ghz Dual Cortex A15/1.2GHz A7) ........................... 155
10. Huawei (HiSilicon K3V2 1.5 GHz Quad Cortex A9, 720P) .................................... 155
11. Intel (Z2420 1.2GHz x86HT processor, SGX540 GPU HD 1080P) ...................... 155
12. Intel (Z2760 Dual Processor, SGX544MP2 GPU HD 1080P) ............................... 155
13. Intel (Z2580 1.8MHz Dual Processor, SGX544MP GPU, HD 1080P) ................... 156
14. Intel (Z3770 Quad-Core, Intel HD graphics) .......................................................... 156
15. Intel (Z34/Z35: Merrifield/Moorefield, Power VR6 graphics) .................................. 156
16. Marvell (ARMADA Applications Processors) ......................................................... 157
17. Marvell (PXA986 1.2GHz 2x Cortex A9/Vivante GC1000/720P30) ...................... 158
18. Marvell (PXA2128 1.2 GHz Dual ARMv7 /Vivante GPU) ...................................... 159
19. MediaTek (MT8125/8389 Quad Cortex A7/PVR5/HD 1080P) .............................. 159
20. MediaTek (MT8377 1GHZ Dual Cortex A9+SGX531, HD1080p) ......................... 160
21. MediaTek (MT8135 2x A15+2xA7+SGX Rogue/FHD 1080p ................................ 160
22. MediaTek (MT8132 1.5GHz 64-bit Cortex A53+MaliT760) ................................... 160
23. MediaTek (MT6732 1.5GHz Quad 64-bit Cortex A53 with LTE) ........................... 160
24. MediaTek (MT6752 Octa Cortex A53/T760 GPU Standalone) ............................. 161
25. MediaTek (MT6595 4xA17+4xA7 Octa-Rogue S6) ............................................... 161
26. MediaTek (MT6752 64-bit Octa Cortex A53 with 3G/LTE) .................................... 163
27. Nufront (Dual Cortex A9+Mali400 Applications Processor) ................................... 163
28. NVIDIA (Tegra3 Quad Cortex A9-12core GeForce Processor)............................. 163
29. NVIDIA (Tegra4 Quad Cortex A15 72-Core GPU) ................................................ 165
30. Nvidia Tegra5 (Quad Cortex A15 192-Core GPU) ................................................ 165
31. Qualcomm (1.9 GHz Quad APQ8064T S600 Krait 300/320GPU/HD) .................. 166
32. Qualcomm (1.7GHZ Dual APQ8030 S400 Krait 300/305GPU/HD) ...................... 166
33. Qualcomm (2.5 GHz Quad APQ8084 Krait450/ 420GPU/UHD (4K) .................... 167
34. Rockchip (RK2918 ARM Cortex-A8+ GC800GPU) ............................................... 168
35. RockChip (RK3066 2x Cortex A9+ Mali400MP4 GPU) ......................................... 168
36. Rockchip (RK3188 2x Cortex-A9+Mali400MP4) ................................................... 168
37. Rockchip (RK3288 4x Cortex-A12+MaliT764+H.265 decoder) ............................. 169
38. Samsung Exynos4 (1.2 GHz Dual Cortex-A9+ Mali400 1080P) ........................... 169
39. Samsung Exynos4 (1.4 GHz Quad Cortex A9+Mali400, 1080P) .......................... 170
40. Samsung Exynos 5 (1.7 GHz Dual Cortex A15+ Mali-T604GPU) ......................... 170
41. Samsung Exynos 5 Octa-core (1.7 GHz Quad Cortex A15+ SGX544MP3) ......... 170
42. Samsung (Exynos 5460 Hexa and Exynos 5422 Octa) ........................................ 171
43. Texas Instruments OMAP5 (2GHz dual-Cortex-A15 + SGX544MP2) .................. 172
44. Via/Wonder Media (Dual-Core Cortex-A7) ............................................................ 172
TABLE OF CONTENTS
Forward Concepts Page v
VI. COMMUNICATION PROCESSORS ..................................................................... 173
A. Com-Processor Growth Trends .................................................................... 176
B. Supplier Positioning ...................................................................................... 178
1. MediaTek .................................................................................................................... 178
2. Spreadtrum Communications ..................................................................................... 180
3. Broadcom ................................................................................................................... 180
4. Nvidia ......................................................................................................................... 181
5. Marvell ........................................................................................................................ 181
6. STMicroelectronics (ex ST-Ericsson) ......................................................................... 182
7. Qualcomm .................................................................................................................. 182
C. Communications Processor Market Share Leaders .................................... 184
D. Communications Processor Five Year Forecast ......................................... 186
E. Communications Processor Supplier Profiles ............................................. 188
1. Broadcom (BCM21553 832MHz ARM11 R6/7 HSPA-Processor) ............................. 192
2. Broadcom (BCM21654G 1GHz CortexA9 R7 HSPA-720P Processor) ..................... 192
3. Broadcom (BCM28145/155 1.2GHz Dual A9+VC4 R8 HSPA+ with 720p/1080P) ... 193
4. Broadcom (BCM23550 1.2GHz 4x CA7/1080P+ R8 HSPA+) ................................... 193
5. Broadcom (MP5232 CA9/GSX543, LTE/DC-HSPA-Processor) ................................ 194
6. Broadcom (MP6530 DualA15/DualA7-SGX544 LTE-Cat4/3G Processor) ................ 195
7. Broadcom (M320 2x Cortex CA9+HSPA+/LTE) ........................................................ 195
8. Leadcore Technology LC1810 (CortexA9+ Mali400 LTE/TD-SCDMA-processor) .... 196
9. MediaTek MT6516 (416MHz ARM926 GSM/EDGE-processor) ................................ 196
10. MediaTek MT6575 (1GHz A9+SGX531QHD-720P HSDPA- Processor) ............. 197
11. MediaTek MT6577 (1GHz 2x-A9+SGX531, qHD 720P HSUPA- Processor) ....... 197
12. MediaTek MT6583/2 (1.2GHz 2x A7 TDSDMA+SGX544 720P) .......................... 198
13. MediaTek MT6589 (1.2GHz 4x-A7+SGX544 HSPA+/TD-SCDMA 720P) ............ 198
14. MediaTek MT6517 (1GHz A9+SGX531-720P TD-SCDMA) ................................. 199
15. MediaTek MT6572 (1.2 GHz 2x CA7, Mali400, qHD720P TD-SCDMA/HSPA ..... 199
16. MediaTek MT6592 (1.7 GHz Octa CA7, 4x Mali450, FHD-1080P ........................ 199
17. MediaTek MT6595 (4xA17+4xA7 Rogue Octa Core) ............................................ 200
18. Marvell (PXA930/40 1GHz ARMv7+Vivante HEDGE–Processor-1080P)............. 200
19. Marvell (PXA920H 1GHz ARMv7+Vivante, TD-SCDMA-Processor with 720P) ... 201
20. Marvell (PXA986/988 1.2GHz 2x A9, Vivante, HD-720P, R7 HSPA+/TD-HSPA) . 202
21. Marvell (PXA1088 1.2GHz 4x Cortex A7, GPU, R7 FD/TD HSPA+ ...................... 202
22. Marvell (PXA1088L 1.2GHz 4x Cortex A, GPU, R7 FD/DT HSPA+/LTE .............. 203
23. Marvell (PXA1928 1.5GHZ 64-bit Quad A53/GC5000 5 mode LTE) .................... 203
24. Nvidia (Tegra 4i 4x CA9-R4,HD1080P, HSPA+/TD-HSPA/ LTE) ......................... 204
25. Qualcomm (MSM7x27A 1 GHz Cortex A5, 480P, HSUPA) .................................. 205
26. Qualcomm (MSM7x25A 800 MHz A5 480P, HSUPA) ........................................... 205
27. Qualcomm (MSM8x25 Dual Cortex A5 720P HSUPA/EVDO) .............................. 206
28. Qualcomm (MSM8x25Q 1.2GHz 4x Cortex A5, 720P, HSPA/CDMA) .................. 206
29. Qualcomm (MSM8930 1.2 GHz 2x K200, HD1080P LTE/HSPA+/1XEVDO) ....... 207
30. Qualcomm (MSM8x30AB 1.7GHz 2xK300, HD1080P LTE CAT3/HSPA+/EVDO)207
31. Qualcomm (MSM8230 1.2 GHz 2x K200, 1080P HSPA+/EVDO) ........................ 208
32. Qualcomm (MSM8630 1.2 GHz 2x K200, 1X EVDO) ........................................... 208
33. Qualcomm (MSM8626 1.2 GHZ 4x CA7, HD1080P 1xEVD)/HSPA+). ................. 208
34. Qualcomm (MSM8x60A 1.7GHz 2x S4 1080p, DC-HSPA+/SVDO processor) .... 209
35. Qualcomm (MSM8960T 1.7GHz 2x K200 1080P DC-HSPA+/SVDO Processor) 209
36. Qualcomm (MSM8974 2.3GHz 4XK400, 2160P R9 HSPA+/TD-HSPA/1xEVDO) 209
37. Spreadtrum (SC6810/20 1 GHz Cortex A5/GSM/EDGE) ...................................... 210
38. Spreadtrum (SC8825 1GHz 2x CortexA5/Mali400/WVGA 720p HSPA/TD-HSPA) 210
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Forward Concepts Page vi
39. Spreadtrum (SC8735S 1GHz Cortex7/Mali400MP4, HD1080p, HSPA+, TDSCDMA/HSPA+ ............................................................................................................. 211
40. Spreadtrum (SC7710 1GHz Cortex A7/Mali400/WVGA 720P HSPA+) ................ 211
41. Spreadtrum (SC8810 1GHz Cortex A5+Mali400 TD-SCDMA HD video).............. 212
42. Spreadtrum (SC9620 TD-SCDMA/TD-LTE) .......................................................... 213
43. ST-Ericsson (U8500 2xA9/Mali400, HSPA/TDHSPA-HD1080P) .......................... 214
VII. RADIO TRANSCEIVERS ...................................................................................... 215
A. Overview ......................................................................................................... 215
B. LTE Radio Technology Evolution ................................................................. 216
C. Overall RF Transceiver Market Shares ......................................................... 220
D. GSM/GPRS & EDGE Transceiver Market Shares ......................................... 221
E. CDMA Transceiver Market Shares ................................................................ 222
F. WCDMA/UMTS Transceiver Market Shares .................................................. 223
G. TD-SCDMA Transceiver Market Shares ........................................................ 224
H. LTE Transceiver Market Shares .................................................................... 225
I. Radio Transceiver Forecast .......................................................................... 225
J. 2G/3G/4G RF Transceiver Supplier Profiles ................................................. 227
1. MediaTek (TD-SCDMA and WCDMA Xceiver) .......................................................... 229
2. Broadcom (BCM2091 Bands I-X WCDMA/HSPA/EDGE Xceiver ............................ 229
3. GCT Semiconductor (CMOS CDMA2000 Xceiver) .................................................... 230
4. Intel (130nm CMOS WEDGE & LTE Xceivers) .......................................................... 230
5. Nvidia/Icera (CMOS 7-band WCDMA/HEDGE Xceiver) ............................................ 231
6. ST-Ericsson (130nm dual-band CMOS TD-SCDMA Xceiver) ................................... 231
7. Qualcomm (CMOS Diversity WEDGE Xceiver + GLONASS GPS) ........................... 232
8. RDA Microelectronics (CMOS GSM/GPRS/EDGE Xceivers) .................................... 232
9. RDA Microelectronics (CMOS TD-HSUPA Xceivers) ................................................ 233
10. Spreadtrum (7-band CMOS WEDGE, TD-SCDMA Xceiver) ................................. 234
K. 4G LTE RF Transceiver Chip Suppliers ........................................................ 235
1. Altair Semiconductor (1.9-2.7 GHz CMOS Transceiver) ........................................... 235
Altair is inside Verizon’s private-branded LTE tablet. ......................................................... 236
2. Broadcom (BCM2095 LTE Cat4 / HSPA+/ GSM/ EDGE) .......................................... 236
3. GCT Semiconductor (R8 FDD Multiband +700 MHz) ................................................ 236
4. Intel (XMM7160 LTE/3G R9 HSPA Multiband Transceiver) ...................................... 236
5. Intel (XMM7260 R10 LTE/3G R9 DCHSPA/TD-SCDMA Transceiver ....................... 237
6. Intel (XMM7260 LTE-Advanced) ................................................................................ 238
7. NVIDIA (FDD LTE/HSPA+ Transceiver) .................................................................... 238
8. Qualcomm (LTE/3G/2G Cat 4 Transceivers) ............................................................. 238
9. Silicon Motion (FD LTE Cat3 and LTE/CDMA Cat3 Transceiver) ............................. 240
10. Spreadtrum Communications (4G TD LTE/3G TD-SCDMA/WEDGE) .................. 241
11. ST-Ericsson (LTE 4/HSPA+ Transceiver) ............................................................. 241
VIII. CELLPHONE POWER AMPLIFIERS .............................................................. 242
A. Overview ......................................................................................................... 242
B. Cellphone Power Amplifier Market Share Leaders ...................................... 243
C. Mobile Power Amplifier Five Year Forecast ................................................. 244
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Forward Concepts Page vii
D. Frequency Bands ........................................................................................... 246
E. Cellular PA Supplier Profiles ......................................................................... 248
1. Anadigics .................................................................................................................... 249
2. Avago Technologies ................................................................................................... 251
3. Black Sand Technologies (CMOS) ............................................................................ 252
4. Javelin (CMOS) .......................................................................................................... 253
5. Murata-Renesas Technology Corp ............................................................................ 253
6. Peregrine Semiconductor ( Reconfigurable PA Front End) ....................................... 254
7. Qualcomm (RF360 PA Front End System) ................................................................ 254
8. RF Micro Devices ....................................................................................................... 255
9. RDA Microelectronics (Quad GSM & TD-SCDMA 1800) .......................................... 257
10. Skyworks ................................................................................................................ 258
11. TriQuint Semiconductor ......................................................................................... 260
F. LTE PA Supplier Profiles ............................................................................... 262
1. Anadigics (FDD 1, 2, 7, 8, 20, 3/4/9/10, 5/6/18/19, 12/17, 13/14; TDD 38, 40) ......... 262
2. Mitsubishi Electric (Six LTE-Compliant Power Amplifiers) ......................................... 263
3. Skyworks (FDD 1, 4/9, 5/6, 7, 8, 9, 13/14, 12/17 and TDD 38/40) ............................ 263
4. Nujira (Envelope Tracking Chip) ................................................................................ 264
5. Qualcomm (QFE1100 RF/Envelope Tracking PA.) ................................................... 265
6. RFMD (LTE Single bands 3, 4,7,11,13,17,20 and 21) ............................................... 265
7. TriQuint Semiconductor (band 13, 17 of the USA 700 MHz) ..................................... 267
IX. POWER MANAGEMENT UNITS .......................................................................... 268
A. Overview ......................................................................................................... 268
B. PMU Audio Codec/Speakerphone Drivers .................................................... 271
1. AKM Semiconductor (CMOS 24-bit Audio) ................................................................ 272
2. Cirrus Logic (CMOS Audio Codec) ............................................................................ 272
3. Texas Instruments (Audio Codec+ USB and miniDSP) ............................................. 273
4. Maxim (Stereo Audio Codec) ..................................................................................... 273
5. Qualcomm (WCD9310 Audio DAC) ........................................................................... 274
6. Wolfson (WM8994E Multichannel Audio Codec) ....................................................... 274
7. Wolfson Microelectronics (Stereo Codec with SPKR drivers and Class W headphone) 275
C. PMU Market Shares ........................................................................................ 277
D. PMU Five-Year Forecast .................................................................................. 278
E. PMU Company Profiles .................................................................................. 279
1. Anpec Electronics (Battery charge management) ..................................................... 279
2. Broadcom ................................................................................................................... 280
3. Dialog Semiconductor (CMOS PMU/Audio subsystem) ............................................ 280
4. Intel (RF-Baseband Power Management) ................................................................. 281
5. Linear Technology (Energy Management) ................................................................. 281
6. Maxim Integrated Products (System PMUs) .............................................................. 282
7. Maxim Integrated (Compact1S/2S Fuel Gauge) ........................................................ 282
8. Micrel (BiCMOS, discrete specific PMUs) .................................................................. 283
9. Qualcomm (Cellular Power Management) ................................................................. 283
10. Texas Instruments (Processor PMUs) ................................................................... 284
X. Wi-Fi and Wi-Fi Combinations ............................................................................ 285
A. Overview ......................................................................................................... 285
B. Wi-Fi Trends by Standard .............................................................................. 286
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C. Cellular and Tablet Wi-Fi Market & Vendor Shares ...................................... 287
D. Wi-Fi Direct Certified Standard...................................................................... 288
E. MiFi Hotspot ................................................................................................... 289
F. IEEE 802.11 Standards ................................................................................... 289
1. IEE802.11b ................................................................................................................. 290
2. IEE802.11g ................................................................................................................. 290
3. IEEE802.11a 5GHz .................................................................................................... 291
4. IEEE802.11n (2.4 and 5GHz) .................................................................................... 291
5. IEE802.11ac (5 GHz) ................................................................................................. 291
G. Wi-Fi Five-Year Forecast ............................................................................... 293
H. Wi-Fi Chip Suppler Profiles ........................................................................... 294
1. Qualcomm (Embedded 802.11acgn Wi-Fi, BTv2.1 EDR & FM) ................................ 295
2. Broadcom (802.11abgn/Bluetooth 4.0 + HS/FM 802.11n) ......................................... 295
3. Broadcom (40nm Wi-Fi 802.11acbgn, BT4.0, FM Txcvr) .......................................... 296
4. Broadcom (BCM4354 5G Wi-Fi 802.11ac, 2x2 MIMO).............................................. 297
5. Samsung Electronics (Wi-Fi/BT/FM Rx/Tx inside Exynos) ........................................ 297
6. Marvell (55nm 2X2 MIMO 802.11abg+ BTv2.1) ........................................................ 298
7. Marvell (Dual-band 2-Steam 802.11ac/BT4.0/NFC) .................................................. 298
8. MediaTek (MT6620 4in1 802.11abgn, BT3.0, V4.0/GNSS/FM Rx/Tx) ...................... 299
9. MediaTek (MT6630 5-in-1 Wi-Fi ac/BT4.1/FM/GLONASS/NFC) .............................. 299
10. MediaTek (MT6628T 3-in 1 802.11bgn, FMRx and BT4.0) ................................... 300
11. MediaTek (MT6628Q 4-in1 802.11bgn, BT 3.0, FMRx and GPS) ........................ 300
12. MediaTek (MT7612x 3 in one Wi-Fi 802.11ac, BT4.0 and FMRx) ........................ 300
13. Qualcomm (Wi-Fi 802.11ac/BT4.0/FM) ................................................................. 301
14. ST-Ericsson (Wi-Fi 802.11bgn, or abgn) ............................................................... 302
15. Redpine Signals (Wi-Fi-802.11abgn/ac+BT4.0) .................................................... 302
16. RDA Microelectronics (Wi-Fi 802.11bg.BT2.1/FM Rx/Tx) ..................................... 303
17. Texas Instruments (Wi-Fi 802.11bgn/BT/FM/ GPS) .............................................. 304
18. Texas Instruments (Wi-Fi 802.11abgn/BT 4.0 LE, FMRxTx)................................. 304
XI. BLUETOOTH ........................................................................................................ 306
A. Overview ......................................................................................................... 306
B. The Bluetooth Standards ............................................................................... 307
1. Bluetooth 2.0 EDR...................................................................................................... 307
2. Bluetooth 2.1 .............................................................................................................. 307
3. Bluetooth 3.0 .............................................................................................................. 308
4. Bluetooth Low Energy (BTLE) .................................................................................... 308
C. Cellphone Bluetooth Market Shares ............................................................. 310
D. Cellphone Bluetooth Forecast ...................................................................... 311
E. Cellphone Bluetooth Supplier Profiles ......................................................... 312
1. MediaTek (Bluetooth +FM RDS/RBDS) ..................................................................... 312
2. Broadcom (65nm Bluetooth 3.0, RDS FM Rx/Tx) ...................................................... 312
3. IC Plus (Bluetooth v1.1 and v 1.2) ............................................................................. 313
4. Qualcomm (130nm CMOS BT 3.0 + EDR) ................................................................ 313
5. RDA (CMOS BT 2.1+ EDR +FM receiver) ................................................................. 314
6. STMicroelectronics (45nm CMOS v3.0 +HS & FM Rx/Tx) ........................................ 314
7. Texas Instruments (65nm CMOS Bluetooth 4.0+) ..................................................... 315
XII. GPS ...................................................................................................................... 317
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A. New GPS Enhancements & Market Changes ............................................... 318
1. GLONASS, Galileo & Chinese Compass Satellite Status ......................................... 318
2. GNSS Augmentation System ..................................................................................... 319
3. Assisted GPS and Location Awareness Growth ........................................................ 320
4. Simultaneous GPS (S-GPS) ...................................................................................... 321
5. The Indoor Positioning System (IPS) Movement ....................................................... 321
B. GPS Market Vendor Shares ........................................................................... 323
C. GPS Forecast.................................................................................................. 324
D. GPS Supplier Profiles .................................................................................... 325
1. Broadcom (65nm GPS/GLONASS, BT V3.0, FM RX/Tx ) ......................................... 325
2. Intel (GPS Receiver device) ....................................................................................... 326
3. MediaTek (65nm GPS/QZSS/SBAS Monolithic Receiver) ........................................ 326
4. Qualcomm (3G RF transceiver and GNSS support) .................................................. 327
5. Silicon Motion (RF transceiver and GPS receiver) .................................................... 328
6. ST-Ericsson (GNSS, BTv3.0/v4.0 and FM Rx/Tx) ..................................................... 328
7. Texas Instruments (Wi-Fi +GPS+BTv2.1+FM Rx/Tx) ................................................ 328
8. u-Blox (GPS receiver) ................................................................................................ 329
XIII. NEAR FIELD COMMUNICATIONS (NFC) ...................................................... 331
A. Overview ......................................................................................................... 331
B. Alternatives to NFC ........................................................................................ 332
1. Bluetooth Proximity Beacon Technology ................................................................... 332
2. Goodx-MediaTek Hotknot Projected Capacitive Interfaces ....................................... 333
C. NFC Technology Standard Overview ............................................................ 334
1. Three Signaling Standards ......................................................................................... 335
2. Four Mandated Tags Standards ................................................................................ 336
3. NFC Forum Modes of Operation ................................................................................ 336
4. NFC Forum NCI Logical Interface Standard .............................................................. 337
D. FeliCa Technology Standard, emerging NFC-F ............................................ 339
E. Security ........................................................................................................... 339
F. Single Wireless Protocol Standard UICC ..................................................... 340
G. NFC Chip Market Share ................................................................................. 341
H. NFC and FeliCa Chip Forecast ...................................................................... 342
I. NFC Chip Supplier Profiles ............................................................................ 344
1. Broadcom Corporation (NFC Controller + Secure element) ...................................... 346
2. Fudan Microelectronics Co., Ltd. (Controller+ Secure Element) ............................... 346
3. Infineon (Secure Element and MIFARE Classic 1K) .................................................. 347
4. Inside Secure (Controller & Infineon Secure Element) .............................................. 348
5. NXP Semiconductor N.V. (NFC Controller +Secure element) ................................... 348
6. MediaTek (SWP/NCI NFC Chip- secure elements ) .................................................. 350
7. MStar (NFC Controller – No Secure Element) ........................................................... 350
8. Qualcomm (NFC Controller–Secure element, dual SIMS) ........................................ 351
9. Renesas Electronics (NFC/FeliCa Controller+ secure element)................................ 351
10. Samsung Electronics (NFC/Felica Controller+ Secure Element) .......................... 352
11. Sony (NFC Type3 FeliCa with AES Secure Element) ........................................... 352
12. STMicroelectronics (NFC Controller and Secure Element) ................................... 353
XIV. CAMERAS & IMAGE PROCESSORS ............................................................ 354
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A. Overview ......................................................................................................... 354
B. Image Sensor Consumption Smartphones and Tablets .............................. 354
C. Image Sensor Distribution by Resolution .................................................... 355
D. Image Sensor Market & Vendor Shares ........................................................ 358
E. Camera Imaging Market Forecast ................................................................. 359
F. Camera Image Sensor Supplier Profiles ....................................................... 360
1. Aptina (FSI 1.75-2.2µm, VGA, 1.3-, 2-, 3.1, 5MP) ..................................................... 360
2. Galaxycore (VGA to UXGA resolution) ...................................................................... 361
3. Himax Imaging (1,4µm FSI: VGA, 1.3-, 2- 3- 5-MP) .................................................. 362
4. Hynix Semiconductor (FSI 1.4µm, VGA, 1.3- 2-, -3, 5MP, WLO) .............................. 363
5. OmniVision (1.4µm BSI; VGA, 1.3-, 2-, 3.2- & 5-MP; WLO) ...................................... 364
6. OmniVision (2µm BSI; 4MP HD Video at 90fps) ........................................................ 366
7. Samsung (1.4µm FSI, VGA, 1.3; 2,3, 5 and 8MP EDOF) .......................................... 366
8. SETi (2.25µm FSI, VGA, 1.3 MP and 2MP CIS Chips) ............................................. 368
9. Sony (5, 8, 12, -16MP CMOS 1.1µm2 BSI Image Modules) ..................................... 369
10. STMicroelectronics (1.1µ BSI plan, 2, 3, 5 and 8MP FSI modules) ...................... 371
11. Toshiba Electronic Components (1.12µm BSI 2, 3, 5, 8,13 MP) ........................... 372
XV. TOUCH CONTROLLERS...................................................................................... 375
A. Overview ......................................................................................................... 375
B. PCAP Full Touch Controller Trends............................................................. 376
C. Touch Screen Sensor Technology Overview ............................................... 377
1. Haptics Touchscreens ................................................................................................ 379
2. Resistive Touch Screens ........................................................................................... 380
3. Capacitive Touch Screens ......................................................................................... 381
4. Optical Touch Technology ......................................................................................... 382
D. Touch Controller Vendor Market Shares ...................................................... 383
E. Touch Screen Controller Forecast ................................................................ 385
F. Touch Controller Suppliers ........................................................................... 387
1. Analog Devices (Resistive only) ................................................................................. 388
2. Asahi Kasei Microsystems (Resistive controller) ....................................................... 388
3. Atmel (Capacitive-touch controllers) .......................................................................... 388
4. Broadcom (Full panel custom Capacitive) ................................................................. 390
5. Cypress Semiconductor (Capacitance Key and Full TSP) ........................................ 390
6. Cypress (Optical Track Pad) ...................................................................................... 392
7. ELAN Microelectronics (Capacitive multi-touch Module & chip) ................................ 392
8. eGalax EETI (Capacitive Controller) .......................................................................... 393
9. FocalTech Systems (Capacitive Touch Controller) .................................................... 393
10. Fudan Microelectronics Co., Ltd (Capacitive Controller) ....................................... 395
11. ILI Technology (Complete Capacitive Controller line) ........................................... 395
12. Melfas (Capacitive Controllers and touch modules) .............................................. 396
13. Renesas Electronics (Capacitive Touch Controller) .............................................. 398
14. Silicon Labs (Multitouch Capacitive Controller) ..................................................... 398
15. Sitronix Technology (Multitouch voltage-driven) .................................................... 399
16. STMicroelectronics (Full Screen Capacitive) ......................................................... 400
17. Synaptics (Cap Arrays and Full Screen Capacitive) .............................................. 401
18. Texas Instruments (Custom Capacitive Controller) ............................................... 402
XVI. MEMS and SENSORS .................................................................................... 403
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A. Market Leaders ............................................................................................... 405
1. MEMS and Sensor Forecast ...................................................................................... 406
B. MEMS Gyroscopes ......................................................................................... 409
1. Gyro Consumption by OEMs ..................................................................................... 409
2. Gyro Market Share by Supplier .................................................................................. 410
3. Gyro Supplier Profiles ................................................................................................ 410
a) Bosch (30.4mm3, 3-axis Gyro+3-axis Accelerometer) ............................................ 411
b) Epson Toyocom (30.4mm3, 3-axis Gyro+3-axis Accelerometer) ............................ 411
c) InvenSense (16mm3 3- axis yaw and pitch Gyros) ................................................. 412
d) InvenSense (ICM0278 Gyro/Accelerometer/Proximity Sensor) ............................. 413
e) Kionix-ROHM (14.4mm3 3- Axis Gyro) ................................................................... 413
f) Kionix-ROHM (9mm2, 9- Axis Gyro, Acc, and magnetometer) .............................. 414
g) Maxim- Sensor Dynamics AG (Combo Accelerometer and Gyro) ......................... 414
h) Panasonic (single axis Yaw Vibration-based Gyros) .............................................. 415
i) Sony (2-Axis Gyros) ................................................................................................ 415
j) STMicroelectronics (16mm2 3-axis pitch, roll and yaw Gyro) ................................. 415
k) Virtus Advanced Sensors (22.4mm3 SOI 3-Axis Accelerometer) ........................... 417
l) Murata-VTI (12.7mm2 3-axis Gyro, 4 mm
2 3-axis ACC) ......................................... 417
C. Accelerometers & Supplier Profiles .............................................................. 419
1. MEMS Accelerometer Consumption By OEMs .......................................................... 420
2. Accelerometer Market Share Leaders ....................................................................... 420
3. MEMS Accelerometer Supplier Profiles ..................................................................... 421
a) Analog Devices (MEMS Accelerometers) ............................................................... 422
b) Bosch Sensortec (9mm3 3-axis Accelerometer) ..................................................... 423
c) Freescale (9mm3 capacitive 3-axis Accelerometer) ............................................... 424
d) Hokuriku Electric Industry (9mm3 3-axis Accelerometer) ....................................... 425
e) Kionix-Rohm (MEMS 3 axis-Capacitive Accelerometer) ........................................ 425
f) MEMSIC (3-Axis 88mm3 CMOS thermal- Accelerometers) .................................... 426
g) Lapis Semiconductor (28.7mm3 3-axis Piezoresistive ACC) .................................. 427
h) Murata-VTI Technologies (3- Axis Piezoresistive) .................................................. 428
i) VTI Technologies (19.8mm3 3- axis Capacitive Accelerometer) ............................ 428
j) STMicroelectronics (9mm3 Accelerometer, 16mm
3 Gyros) .................................... 429
D. Magnetometers (eCompass) ......................................................................... 430
1. MEMS Magnetometer Market Share Leaders ........................................................... 430
2. Consumption by Tablet and Smartphone OEMs ....................................................... 431
3. MEMS Digital Compass Supplier Profiles .................................................................. 432
a) AKM (19.5 mm3, 6 axis Compass and Accelerometer) ......................................... 432
b) Bosch Sensortec (8.55mm3 6 axis Magnetometer and ACC)................................. 433
c) MEMSIC (9 mm2 Magnetometer) ........................................................................... 434
d) Honeywell Microelectronics (8.1mm3, Magnetoresistive (AMR)) ............................ 435
e) STMicroelectronics (15mm3 6-axis Compass + Accelerometer) ............................ 435
f) Yamaha (4mm2 3-axis geomagnetic sensor chip) .................................................. 436
E. Light and Proximity Sensors ......................................................................... 438
1. Consumption by Tablet and Smartphone OEMs ....................................................... 438
2. MEMS Proximity and Light Sensor Market Share Leaders ....................................... 440
3. MEMS Proximity & Light Sensor Profiles ................................................................... 440
a) Analog Devices (Proximity sensor)) ........................................................................ 441
b) ams-TAOS (ALS and ALS/PS combo) ................................................................... 441
c) Intersil (2.8mm3 Digital PS and ALS) ..................................................................... 442
d) Capella Microsystems (ALS/PS/IRLED), RGB sensor) .......................................... 442
e) OSRAM Opto Semiconductor (13mm3 PS and 2.8mm
3 ALS) ................................ 443
f) Lapis-Rohm Semiconductor (Optical ALS/Proximity combo) ................................. 444
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g) Sharp Optronics (PS/ALS combo) .......................................................................... 445
h) Maxim Integrated (RGB, Temperature, Infrared Proximity Sensor) ....................... 445
i) Silicon Laboratories (PS or PS/ALS Combo) .......................................................... 446
F. MEMS Pressure Sensors ............................................................................... 447
1. Pressure Sensors Market Share Leaders .................................................................. 447
2. Consumption of Pressure Sensors by OEMS ............................................................ 448
3. MEMS Pressure Sensor Supplier Profiles ................................................................. 449
a) Murata-VTI Technologies (1.67mm3 Pressure Sensor) ......................................... 449
b) Freescale (16.5mm3 Pressure Sensor) .................................................................. 449
c) Bosch Sensortec (12.7mm3
Barometric Pressure Sensor .................................... 450
d) STMicroelectronics (9.0mm3 Piezio Barometric Pressure Sensor) ........................ 451
G. Humidity-Temperature Sensor ...................................................................... 451
1. Sensirion .................................................................................................................... 451
2. STMicroelectronics ..................................................................................................... 452
H. Biometric and Optical Chip Company Profiles ............................................ 452
1. Atmel (Thermo Fingerprint Sensor)............................................................................ 453
2. Avago Technologies (Optical Finger Navigator Chip/Sensor) ................................... 453
3. AuthenTec (64mm3 Secure Finger Swipe Sensor) ................................................... 454
4. CrucialTec (Biometric Multi Finger Sensor) ............................................................... 454
5. Cypress (Optical Track PAD ...................................................................................... 455
6. Fingerprint Cards AB (CMOS Touch or Swipe Finger sensors. ................................ 455
7. Precise Biometrics ( Algorithm Sofware).................................................................... 456
I. MEMS Microphones and Supplier Profiles ................................................... 457
1. MEMS Microphone Consumers ................................................................................. 458
2. Silicon Microphone Market Share Leaders ................................................................ 459
3. MEMS Microphone Supplier Profiles ......................................................................... 460
a) AAC Acoustics Technologies, (MEMS Microphones) ............................................. 460
b) Analog Devices ( Hi performance Silicon Microphone) .......................................... 460
c) Bosch-Akustica MEMS (CMOS Single chip Microphone) ...................................... 461
d) BSE ......................................................................................................................... 461
e) GoerTek Acoustics, China (MEMS Microphones) .................................................. 462
f) Knowles Electronics (11.5mm2 MEMS Microphones) ............................................ 462
g) STMicroelectronics (16mm2 high performance Microphone) ................................. 463
h) Wolfson Microelectronics (22 mm3, silicon Microphones) ...................................... 464
i) Omron (14.6mm3, MEMS Microphone) ................................................................... 464
j) MEMSensing Microsystems (MEMS Microphones) ................................................ 465
k) Solid State Systems (Single-die MEMS Microphone)............................................. 465
XVII. HDMI & MHL for Mobile (MHDI) ..................................................................... 466
A. HDMI (High-Definition Multimedia Interface) ................................................ 466
B. MHL™ Standard Overview ............................................................................. 467
1. HDMI 1.1 .................................................................................................................... 468
2. HDMI 1.2 .................................................................................................................... 468
3. HDMI 1.2a .................................................................................................................. 468
4. HDMI 1.3 .................................................................................................................... 469
5. HDMI 1.4 .................................................................................................................... 469
C. Transmitter Supplier Market Shares ............................................................. 470
D. HDMI/MHL Five Year Forecast ....................................................................... 472
E. HDMI/MHL Transmitter Supplier Profiles ...................................................... 472
1. Analog Devices (1080P HDMI 1.4 Tx) ....................................................................... 472
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2. Chrontel (1080P HDMI Tx) ......................................................................................... 473
3. Explore Microelectronics (HDMI TV-out Interface Device) ........................................ 474
4. NXP Semiconductor (Low Power 1.4 Compliant HDMI Tx) ....................................... 475
5. Parade Technologies (Display Port/HDMI Dual mode Tx)......................................... 475
6. Silicon Image (1080P MHL TV Interface) .................................................................. 476
7. Sunplus Technology ................................................................................................... 477
8. Texas Instruments (LVDS Transmitter)...................................................................... 477
9. Texas Instruments (HDMI Companion interface with 5 volt booster) ........................ 478
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FIGURES Figure 1 Cellular Handset & Tablet Component Markets by Type: 2013.......................... 1
Figure 2 2G/3G and 3G/4G Baseband Sales by Type: 2013 ........................................... 4
Figure 3 Application Processors – integrated and Standalone ......................................... 5
Figure 4 Digital Baseband Processor Forecast Summary ............................................... 9
Figure 5 Wireless Connectivity Device Forecast Summary............................................ 11
Figure 6 Sensor Revenue Split: Image, Touch & Microphones ...................................... 11
Figure 7 Imaging, Touch Capacitance and MEMS Forecast Summary .......................... 12
Figure 8 PMU, RF & Power Amplifier Revenues: 2013 .................................................. 13
Figure 9 Analog BB, PMU & Standalone RF Forecast: '12-'18 ...................................... 14
Figure 10 Distribution of Mobile Handsets by Type: 2013 .............................................. 15
Figure 11 Distribution of Mobile Cellular Devices by Type: 2013 ................................... 16
Figure 12 Distribution of Cellular Modems by Air Standard: '13 ..................................... 16
Figure 13 Mobile Cellular Device Growths: 2012 to 2018 .............................................. 17
Figure 14 Smartphone Growth Patterns by Type: '12-'18 .............................................. 21
Figure 15 Smartphone Shipments by Geographical Region: '13 .................................... 23
Figure 16 Non-Smart Handset Shipments by Geographical Region: '13 ........................ 23
Figure 17 LTE Smartphone Shipments by Geographical Region: '13 ............................ 24
Figure 18 Smartphone Market Shares by OS: 2013 ...................................................... 34
Figure 19 Smartphone Market Shares by OS: 2018 ...................................................... 35
Figure 20 2G, 3G, 3G/4G Smartphone Baseband Market Shares ................................. 35
Figure 21 3G, 3G/4G Thin Baseband Vendor Market Shares for Smartphones: '13 ...... 36
Figure 22 2G/3G, 3G/4G Smartphone App Processor Market Shares: '13 .................... 36
Figure 23 Chromebook Market Share Suppliers in 2013. .............................................. 47
Figure 24 LTE USER Device Segmentation in Units from 2011-2013 ........................... 48
Figure 25 Mobile Device Shipments by Market Segment: 2013 ..................................... 54
Figure 26 Handset Shipments by Major Region: 2013 ................................................... 55
Figure 27 Total Baseband Processor Market by Category: 2013 ................................... 57
Figure 28 Global Distribution of Non-Smart Handset Shipments: 2013 ......................... 58
Figure 29 Standalone Baseband Vendor Market Shares: 2013 ..................................... 59
Figure 30 Integrated AP & Baseband Vendor Market Shares: 2013 .............................. 59
Figure 31 All Digital Baseband Shipments by Cellular Standard: '13 ............................. 60
Figure 32 CDMA Handset Shipments by Region: 2013 ................................................. 62
Figure 33 LTE Baseband Shipments by Region: 2013 .................................................. 63
Figure 34 Forecasted Growth of 3G Basebands: ’12-‘18 ............................................... 65
Figure 35 Forecasted Growth of 3G/LTE and LTE Basebands: ‘12-'18 ......................... 66
Figure 36 Standalone vs. Com-Processor LTE Shipment Detail: '13 ............................. 82
Figure 37 Multi- and Single-mode FDD-LTE Baseband Supplier Shares: 2013 ............. 85
Figure 38 WCDMA/HSPA/HSPA+ Baseband Vendor Market Shares: '13 ................... 100
Figure 39 CDMA Stand-Alone Baseband Vendor Market Shares: '13 ......................... 108
Figure 40 DBB/AP TD-SCDMA Integrated Com-Processor Vendor Shares: '13 .......... 115
Figure 41 Standalone TD-SCDMA Baseband Vendor Market Shares: '13 ................... 115
Figure 42 TD-SCDMA DBB integrated APs Com-Processor Vendor Shares: '13 ........ 116
Figure 43 GSM/GPRS Baseband Market by Vendor: '13 ............................................. 117
Figure 44 GSM/GPRS/EDGE Integrated AP Baseband Market by Vendor: '13 ........... 118
Figure 45 Cellular Monolithic BB/RF Modem Chip Market by Vendor: '13 ................... 124
Figure 46 Cellular Monolithic BB/RF Modem Unit Shipments by Vendor: '13 .............. 124
Figure 47 ULC Basebands by Cellular Standard: 2013 ............................................... 126
Figure 48 Spreadtrum's SC6530 Baseband MCP Block Diagram ................................ 134
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Figure 49 Com-Processor vs. Apps Processor Revenues: ‘13 .................................... 140
Figure 50 Smartphone Application Processor Market Shares: '13 ............................... 144
Figure 51 Smartphone Application Processor Unit Distribution: '13 ............................. 144
Figure 52 Tablet Application Processor Vendor Revenue Market Shares: ‘13 ............. 145
Figure 53 Tablet Application Processor Unit Distribution/Shares '13 ........................... 145
Figure 54 Intel Atom Z34/Z35 (Merrifield/Moorefield) Block Diagram ........................... 157
Figure 55 Block Diagram MT6595 OCTA-core A17/A7 Com-Processor ..................... 162
Figure 56 Smartphone Growth Trends by Segment: '12-'18 ........................................ 174
Figure 57 Digital Baseband Com-Processors by Air Interface: 2013 ........................... 176
Figure 58 Digital Baseband Com-Processors by Air Interface: 2018 ........................... 176
Figure 59 Com-processor Growth by Air-Type: '11-'18 ................................................ 177
Figure 60 Communications Processor Vendor Market Shares: '13 .............................. 184
Figure 61 TD-SCDMA Communications Processor Market Shares: '13 ....................... 184
Figure 62 WCDMA/HSPA Com-Processor Market Shares: ‘13. ................................. 185
Figure 63 3G/LTE Com-Processor Market Shares: ‘13. .............................................. 186
Figure 64 Renesas MP5232 LTE Communication Processor Diagram ........................ 194
Figure 65 Overall Cellular RF Transceiver Market by Vendor: ‘13 ............................... 220
Figure 66 GSM/GPRS RF Transceiver Shipments by Vendor: '13 .............................. 221
Figure 67 CDMA/1xEV-DO Radio Transceiver Shipments by Vendor: '13 ................... 222
Figure 68 WCDMA RF Transceiver Shipments by Vendor: '13 .................................... 223
Figure 69 TD-SCDMA RF Transceiver Shipments by Vendor: '13 ............................... 224
Figure 70 LTE RF Transceiver Shipments by Vendor: '13 ........................................... 225
Figure 71 Cellphone Power Amplifier Market by Vendor: '13 ....................................... 243
Figure 72 Basic Digital Audio System Block Diagram .................................................. 271
Figure 73 PMU Revenue Market Share Leaders: '13 .................................................. 277
Figure 74 Wi-Fi Combo Shipment Forecast Growth: '12-'18 ........................................ 285
Figure 75 Wi-Fi Chip Market & Vendor Shares: '13. .................................................... 287
Figure 76 Cellphone Bluetooth Market & Vendor Shares: '13 ...................................... 310
Figure 77 GPS Growth by Cellphones & Combos: '12-'18 ........................................... 317
Figure 78 GPS Dedicated Chip Market & Vendor Shares: '13 ..................................... 323
Figure 79 NXP Identification Group Growth: '10-'14 .................................................... 331
Figure 80 NFC Architecture Embedded in a Mobile Phone & Standards Employed .... 338
Figure 81 NFC Market Shares by Vendor: '13 ............................................................. 341
Figure 82 STMicroelectronics Secure Element Chip for NFC ...................................... 353
Figure 83 Imager Consumption by Cellular Product: ‘13 .............................................. 355
Figure 84 Primary Image Sensor Size Consumption: ‘13 ........................................... 355
Figure 85 Sales Distribution of CIS by type: '13. .......................................................... 356
Figure 86 Imager Unit Growth by Pixel Sizes: '12-'18 ................................................. 356
Figure 87 Second Image Sensor Unit Growth by Pixel Sizes: '12-'18 ......................... 357
Figure 88 Image Chip Vendor Unit Shares: '13 ........................................................... 358
Figure 89 Image Chip Vendor Shares by Revenue: '13 ............................................... 358
Figure 90 Touch Overlay Growth by Phone Type: '12-'18............................................ 375
Figure 91 Touch Overlay Growth by Touch Technology: '12-'18 ................................. 376
Figure 92 Capacitance Touch Controller Vendor Market Shares: '13 .......................... 383
Figure 93 MEMS Sales Categories as Percent of Sales: '13 ....................................... 403
Figure 94 MEMS Sensor Shipments by Type: '13 ....................................................... 403
Figure 95 MEMS Shipment Growth by Type: '12-'18 ................................................... 406
Figure 96 Sensor Shipment Growth by Type: 12-'18 ................................................... 407
Figure 97 MEMS Gyro Market by Vendor: '13 ............................................................. 410
Figure 98 MEMS Accelerometer Market by Vendor: '13 .............................................. 420
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Figure 99 MEMS Compass (Magnetometer) Vendor Market Shares: '13 .................... 431
Figure 100 MEMS Proximity/ALS Vendor Market Shares: '13 ..................................... 440
Figure 101 Lapis Semiconductor Proximity & ALS Sensor Block Diagram .................. 445
Figure 102 Pressure Sensor Market Leaders .............................................................. 448
Figure 103 MEMS Microphone Market Share Leaders ................................................ 459
Figure 104 HDMI/MHL Market by Vendor: 2013 .......................................................... 470
Figure 105 Functional Block Diagram of ADI HDMI/DVI Transmitter ........................... 473
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TABLES Table 1 Component Growth by Segment: '10-'13 ............................................................ 3
Table 2 Component Sales Growth by Major Categories: ’10-‘13 ..................................... 6
Table 3 Five-Year 3G and 4G Subscriber Growth Rates by Geographical Regions ........ 8
Table 5 Sales & ASP of Tablet, Smartphone & Non-Smartphone Segments: 2013 ....... 15
Table 6 Handset Supplier Market Share Positions YOY ................................................ 18
Table 7 Top Thirteen OEM Handset & Tablet Sales Rank: 2013 ................................... 19
Table 8 Mobile Handset & Tablet Unit Forecasts by Type: '12-'18 ................................. 20
Table 9 Smartphone Comparisons by Price Category ................................................... 22
Table 10 Smartphone Suppliers YOY/Quarterly Market Shares: '12 & '13 ..................... 25
Table 11 LTE/3G Smartphone Quarterly Shipments by Vendor: '12 & '13. .................... 26
Table 12 Revenues of Top Thirteen Suppliers of Handsets and Tablets by Type .......... 28
Table 13 Smartphone Five-Year Forecast by Global Regions ....................................... 33
Table 14 Global Smartphone Five-Year Forecast by Classification ............................... 33
Table 15 Smartphone Five-Year Forecast by Operating System Usage ........................ 34
Table 16 Tablet Quarterly Supplier Growth YOY: '12 to '13 ........................................... 39
Table 17 Tablet Shipments by O/S: '12-'13 ................................................................... 40
Table 17 Media Tablet and Attached Modem Forecast: '12-'18 ..................................... 44
Table 18 3G & LTE/3G Tablet Shipments by Vendor: 2012 & 2013. ............................. 45
Table 19 Chromebook Growth Compared to Ultra and Standard Notebooks ................. 47
Table 20 Embedded Modems & Mobile Hotspots Forecast: '12-'18 ............................... 50
Table 21 3G HSPA Speed and Basic Features Compared to LTE ................................ 56
Table 22 DBB Processor Forecasts by Air Type: '12-'18 ............................................... 67
Table 23 HSPA and LTE Comparisons ......................................................................... 68
Table 24 LTE Spectrum & Active Operator Summary .................................................... 71
Table 25 LTE Spectrum and Active Operator Summary (continued) ............................. 72
Table 26 LTE Operator Frequency Band Usage in the Americas .................................. 73
Table 27 LTE FDD Frequency Band Usage: Europe, Asia, MEA & Oceania ................. 74
Table 28 TDD LTE Band Usage – Europe, Asia, MEAF, Oceania ................................. 75
Table 29 LTE Frequency Bands & Channel Bandwidths ............................................... 76
Table 30 LTE TDD Frequency Bands & Channel Bandwidths ....................................... 77
Table 31 LTE Subscriber Forecast by Major Regions: '12-'18 ....................................... 80
Table 32 TD-LTE Forecast by Frequency Bands from 2012-2018 ................................. 81
Table 33 Standalone LTE Baseband Forecasts by Type: '12-'18 .................................. 83
Table 34 LTE/3G Baseband Application Processor Forecasts: ’12-18 ........................... 83
Table 35 HSPA+ Continues to Evolve ........................................................................... 98
Table 36 Marvell's Thin Mobem Linup ......................................................................... 104
Table 37 Qualcomm’s Thin Modem Lineup ................................................................. 106
Table 38 Integrated BB/Radio Chip Forecast: '12-'18 .................................................. 126
Table 39 Comparison of Single-Chip GSM & EDGE Modems ..................................... 128
Table 40 Comparison of Multi-Chip, Single-Package GSM, & EDGE Modems ............ 129
Table 41 Comparison of Single-Chip GSM & EDGE Modems ..................................... 130
Table 42 Application & Com-Processor 5-Year Forecast by Type: '12-'18 ................... 146
Table 43 Application Processors by Vendor ................................................................ 148
Table 44 Samsung Galaxy S3, S3 Mini, S4, S4 Mini Comparison ............................... 175
Table 45 Feature Comparison of MediaTek’s 28nm Cortex A7 Lineup ........................ 179
Table 46 Communication Processor Forecast ’13-‘18 ................................................. 187
Table 47 Single-, Dual-, Quad- and Octa-core Communications Processor Profiles .... 188
Table 48 LTE Spectrum FDD Bands 1-20 and Region of Usage ................................. 217
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Table 49 LTE FDD Spectrum Bands 21-28 and Regions of Usage ............................. 218
Table 50 LTE TDD Spectrum Bands 33-44 ................................................................. 219
Table 51 Radio Transceiver 5-Year Forecast by Wireless Technology ........................ 226
Table 52 2G/3G/4G RF Transceiver Supplier Profiles ................................................. 227
Table 53 Qualcomm Cellular Baseband/Transceiver Modes Supported ...................... 239
Table 54 Cellular Power Amplifier Unit Forecast by Air Technology: '13-'18 ................ 244
Table 55 Cellular Power Amplifier Forecast by Type: '13-'18 ....................................... 245
Table 56 FDD Frequency Band Summary ................................................................... 246
Table 57 TDD LTE Bands ........................................................................................... 247
Table 58 Suppler of Multi Mode, 3G/LTE Penta Band PAMs ....................................... 249
Table 59 Anadigics Amplifier Modules for CDMA, GSM & HSPA ................................ 251
Table 60 Avago’s Lineup of CDMA & WCDMA Power Amplifiers ................................ 251
Table 61 Black Sand's PA Product Lineup .................................................................. 253
Table 62 RFMD’s 3G WCDMA/HSPA & CDMA EV-DO Power Amplifiers ................... 256
Table 63 Skyworks' Cellular 2G & 3G PA/FEM Product Line ....................................... 258
Table 64 TriQuint’s Lineup of WCDMA/HSUPA & HEDGE Power Amplifiers .............. 261
Table 65 RFMD 3G/4G LTE Most Recent Power Amplifiers ........................................ 266
Table 66 Cellphone Power Management Unit Forecast by Type: '12-'18 ..................... 278
Table 67 802.11 ac Device Comparisons .................................................................... 288
Table 68 802.11 Performance Standards .................................................................... 289
Table 69 Available 802.11 ac Chip Sets ...................................................................... 292
Table 70 802.11 Data Rate Performance Standards for Handsets .............................. 292
Table 71 Cellular Wi-Fi Chip Penetration by Standard: '12-'18 .................................... 293
Table 72 Cellular Wi-Fi Chip Five-Year Forecast: '12-'18 ............................................ 293
Table 73 Wi-Fi Vendors by Standard and Connectivity Options .................................. 294
Table 74 Texas Instruments 802.11ac Family of Device Features ............................... 305
Table 75 Bluetooth Data Rates ................................................................................... 307
Table 76 Comparison of BLTE vs. Standard Bluetooth Protocol .................................. 309
Table 77 Bluetooth Forecast with Wi-Fi: '12-'18 .......................................................... 311
Table 78 Qualcomm Bluetooth Integrated & Standalone Capabilities .......................... 313
Table 79 GPS Chip Five-Year Forecast: '12-'18 ......................................................... 324
Table 80 NFC-Related Standards ............................................................................... 335
Table 81 Various SIM Standards & Dimensions .......................................................... 341
Table 82 NFC Controller Forecast by Handset and Tablet Consumption ..................... 343
Table 83 SIM, NFC-SIM, NFC/NFC-F MPU & Bridge Forecast: '12-'18 ....................... 344
Table 84 Cellular Camera Image Sensor Forecast: '12-'18.......................................... 359
Table 85 Aptina’s 1.7µm, 2.2 µm CIS Line up ............................................................. 361
Table 86 Galaxycore Imaging Product Lineup ............................................................. 362
Table 87 Himax Imaging Product Lineup ..................................................................... 363
Table 88 OmniVision’s CIS Lineup .............................................................................. 365
Table 89 Samsung’s Lineup of Camera Sensors & SoC Options ................................ 367
Table 90 Toshiba’s Dynastron™ CIS Dies .................................................................. 373
Table 91 Touch Screen Technology Comparisons ...................................................... 377
Table 92 Touch Screen Controller Five-Year Forecast ................................................ 385
Table 93 Touch Controller Chip Vendors & their Customer Bases .............................. 387
Table 94 Cypress Programmable SoC Touch Controller Family Migration .................. 391
Table 95 Cypress Capacitive Touch Controller Lineup ................................................ 392
Table 96 Ilitek Capacitive Touch Screen Controller Family of Devices ........................ 395
Table 97 Silicon Labs Capacitive Small Array Touch Family ....................................... 399
Table 98 STM's Small Array Capacitive Touch Family ................................................ 400
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Table 99 STM Full Touch Capacitive Controllers ......................................................... 400
Table 100 MEMS Device Supplier Shipments: 2012-2013 .......................................... 405
Table 101 MEMS Five Year Forecast by Type: '12-'18 ................................................ 408
Table 102 Gyro Consumption by OEMs ...................................................................... 409
Table 103 Characteristics of competing tri-axis Gyro Devices ..................................... 410
Table 104 MEMS Accelerometer Consumption by OEMs: '12-'13 ............................... 420
Table 105 Bosch Sensotec Accelerometer family ........................................................ 423
Table 106 MEMSIC Thermal-Based vs. Capacitive Accelerometers ........................... 427
Table 107 Compass Device Consumption by OEM: '12-'13 ......................................... 431
Table 108 Comparison of Competing 6-Axis Compass/Accelerometers ...................... 432
Table 109 Top Consumers of ALS, RGB and Proximity Sensors: '12-'13 .................... 439
Table 110 Pressure Sensor Shipments by Vendors '12-'13 ......................................... 448
Table 111 Largest Consumers of MEMS Microphones by Units: '12-'13 ...................... 458
Table 112 Wolfson Microelectronics MEMS Microphone Product Line-up ................... 464
Table 113 HDMI & MHL Transmitter Chip Comparisons ............................................. 467
Table 114 HDMI & MHL Transmitter Usage by Major OEMs: '12 ................................ 471
Table 115 HDMI/MHL Forecast: '12-'18 ....................................................................... 472
