PCB Design Rule

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    Many PCB designers like to think of PCB layouts as

    works of art

    It is, however, quite difficult to try and teach

    PCB design It is like trying to teach someone how

    to paint a picture.

    apart from that PCB design is a highly creative

    and individualprocess.

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    These standards are controlled by the former

    Institute for Interconnecting and Packaging

    Electronic Circuits IPC(www.ipc.org).

    The major document that covers PCB design is

    IPC-2221, Generic Standard on Printed Board

    Design

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    you MUSThave a complete and accurate

    schematic diagram.

    Place notes in Schematic.

    i.e. this track should be as short as possible (ASPS-

    rule)

    putting bypass capacitors next to the component

    Your schematic really should be drawn with the

    PCB design in mind.

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    Imperial and Metric

    you should always use imperial units (i.e.

    inches)

    A thou ( /a/), also known as a mil, is the

    verbalized abbreviation for "thousandth(s) of

    an inch

    Whatever you have to do in PCB design youll

    need to become an expert at imperial to

    metric conversion, and vice-versa.

    http://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_Englishhttp://en.wikipedia.org/wiki/Wikipedia:IPA_for_English
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    Imperial and Metric

    100 mils = 0.1 inch = 2.54 mm

    50 mils = 0.05 inch = 1.27 mm

    1 pitch = 1 inch

    i.e. 0.1 pitch pin spacing

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    Imperial and Metric

    Use mils (thous) for tracks, pads, spacings and grids,

    which are most of your basic design and layout

    requirements.

    Only use mm for mechanical and manufacturing

    type requirements like hole sizes and board

    dimensions.

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    4. Snap Grids

    Lay out your board on a fixed grid

    Standard placement grid: 100 mils

    For finer routing and placement: 50 25 20 10 5

    Dont use anything else, youll regret it.

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    5. Visible Grid

    Most common: 100 mils visible grid

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    6. Component Grid

    Snap grids your PCB designs will be

    one step closer to being neat and

    professional.

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    7. Tracks

    Track size depend on:

    Electrical requirements

    Routing spaceClearance

    Your own personal preference

    The bigger the track width, the better

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    7. Tracks

    The bigger the track

    width, the better!

    keep tracks as big aspossible, and then to

    change to a thinner track

    only when required to

    meet clearance

    requirements.

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    7. Tracks

    The thickness of the copper on the PCB: is nominally

    specified in ounces per square foot, with 1oz copper

    being the most common. Other thicknesses like0.5oz, 2oz and 4oz.

    Required track width based on the current and the

    maximum temperature rise.

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    7. Track width vs. Current

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    8. Pads

    The pad should be at least 1.8 times the diameter of

    the hole, or at least 0.5mm larger.

    Pin 1 of the chip sould always be a different pad

    shape, usually rectangular (square).

    Most SM components use rectangular pads (R,C,),although surface mount SO package ICs should use

    oval (oblong) pads. Again, withpin 1 being

    rectangular.

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    8. Pads

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    9. Vias

    Vias connect the tracks from one side of

    your board to another, by way of a hole in

    your board.

    Holes in vias are usually a fair bit smaller

    than component pads, with 0.5-0.7mm

    being typical.

    Use vias as less as possible!

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    10. Polygons

    Copper Pour, Copper Area

    Solid vs. Hatched

    Make sure youplace polygons after you

    have placed all of your tracks and pads.

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    11. Clearances

    At least 15 mils is a good clearance limit

    for basic through hole designs.

    10 or 8 mils clearance for SMD layout.

    Be careful with HV on board.

    (i.e. 315mils (8mm) for 240V tracks and signal tracks)

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    11. Clearances

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    Set snap grid, visible grid, and default track/pad sizes.

    Throw down all the components onto the board.

    Divide and place your components into functional building

    blockswhere possible.Identify layout critical tracks on your circuit and route them

    first.

    Place and route each building block separately, off the board.

    Move completed building blocks into position on your main

    board, route the remaining signal and power connectionsbetween blocks.

    Do a general tidy upof the board.

    Do a Design Rule Check.

    Get someone to check it

    12. Component Placement

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    Your components should be neatly lined up.

    i.e. ICs in the same direction, resistors in neat columns,

    polarised capacitors all around the same way, and connectorson the edge of the board.

    Digital and analogjust do not mix, and will need to be

    physically and electrically separated.

    High frequency and high current circuits do not mix with

    low frequency and low current sensitive circuits.

    12. Component Placement

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    12. Component Placement

    If you have placed your componentswisely, 90% of your work will be done.

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    13. Basic RoutingSome basic routing rules:

    Keep nets as short as possible.

    Tracks should only have angles of45 degrees.

    Snake your tracks around the board, dont just go

    point to point.

    Always take your track to the center of the pad,

    dont make your track and pad just touch.

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    13. Basic RoutingSome basic routing rules:

    Only take one track between 100 mils pads unlessabsolutely necessary.

    Only one large and very dense designs should you

    consider two tracks between pads.

    For high currents, use multiple vias when going

    between layers.

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    13. Basic RoutingSome basic routing rules:

    Neck down between pads where possible.If your power and ground tracks are deemed to be

    critical, then lay them down first.

    Also, make yourpower tracks as BIG as possible.

    Keep power and ground tracks running in closeproximity to each otherif possible, dont send them

    in opposite directions around the board.

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    13. Basic Routing

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    13. Basic Routing

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    13. Basic Routing

    Some basic routing rules:

    Dont leave any unconnected copper fills (also called

    dead copper), ground them or take them out.

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    14. 2-Layer Routing

    Do not place vias under components.

    Try and use through hole component legs to connecttop tracks to bottom tracks. This minimises the

    number of vias.

    Use as less vias as possible

    SMDs are always better than leads components!

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    15. Finishing Touches

    If you have thin tracks

    (

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    15. Finishing Touches

    Check that you have any required mounting

    holes on the board. Keep mounting holes well

    clear of any components or tracks. Allow roomfor any washers and screws.

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    15. Finishing Touches

    Minimise the number of hole sizes. Extra hole sizes

    cost you money.

    Double check for correct hole sizes on all yourcomponents.

    Nothing is more annoying than getting your

    perfectly laid out board back from the manufacturer,

    only to find that a component wont fit in the holes!This is a very common problem, dont get caught

    out.

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    15. Finishing Touches

    Minimise the number of hole sizes. Extra hole sizes

    cost you money.

    Ensure that all your vias are identical, with the

    same pad and hole sizes. Remember yourpad to

    hole ratio.

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    15. Finishing Touches

    Check that there is adequate physical

    distance between all your components.

    Watch out for components with exposed

    metal that can make electrical contact

    with other components, or exposed

    tracks and pads.

    Add teardrops to all your pads and vias.

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    16.Silk Screen Layer

    Silk Screen Layer (SSTOP, SSBOT): contains your

    component outlines, designators (C1, R1 etc), and free

    text.

    Make sure that you keep all your component

    designators the same text size, and oriented in the

    same direction.

    Make sure that you add a component overlay that

    reflects the actual size of your component.

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    16.Silk Screen Layer

    Ensure that all polarised components are marked,

    and that pin 1 is identified.

    Ensure that no part of the silkscreen overlaps a bare

    pad.

    As a general rule, dont put component values onthe silkscreen, just the component designator

    (but)

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    17. Solder Mask

    Solder Mask Layer (SMTOP, SMBOT):

    The solder mask typically covers everything exceptpads and vias.

    The gap it leaves between the pad and the solder

    mask is known as the mask expansion.

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    18. Other Layers

    The mechanical layer is used to provide an outline

    for your board, and other manufacturing instructions.

    Keepout

    The keepout layer generally defines areas on your

    board that you dont want auto or manually routed.

    This can include clearance areas around mounting holepads or high voltage components for instance.

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    Auto Tool

    Auto Route

    Real PCB designers dont auto route!

    Artificial intelligence and neural based technology are

    some of the marketing buzz words used, but no matterhow smart an auto router is, it simply cannot replace

    a good human PCB designer.

    Auto Placement

    Professional PCB designers do not use Auto Placement

    tools. Dont rely on the Auto Place feature to select the

    most optimum layout for you. It will neverwork!

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    References

    [1] PCB Design Tutorials David L. Jones

    [2] wikipedia.org

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