PC367NJ0000F Series PC367NJ0000F Mini-flat … · PC367NJ0000F Series 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC367) 2. Package resin

PC367NJ0000F Series

1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC367)

2. Package resin : UL flammability grade (94V-0)

Features

Agency approvals/Compliance

1. Programmable controllers2. Facsimiles3. Telephones

Applications

Mini-flat PackageHigh CMR, Low Input Current Type Photocoupler

1. 4-pin Mini-flat package 2. Double transfer mold package (Ideal for Flow

Soldering)3. Low input current type (IF=0.5mA)4. High collector-emitter voltage (VCEO : 80V)5. High noise immunity due to high common mode

rejection voltage (CMR : MIN. 10kV/µs)6. High isolation voltage between input and output

(Viso(rms) : 3.75kV)7. RoHS directive compliant

DescriptionPC367NJ0000F contains an IRED optically coupled

to a phototransistor.It is packaged in a 4-pin mini-flat.Low input current type.Input-output isolation voltage(rms) is 3.75kV.Collector-emitter voltage is 80V and CTR is 100% to

500% at input current of 0.5mA.

1Sheet No.: D2-A00502FEN

Date Jun. 30. 2005© SHARP Corporation

Notice The content of data sheet is subject to change without prior notice.In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

PC367NJ0000F Series

Internal Connection Diagram

AnodeCathodeEmitterCollector

11

2

3

42

4

3

2Sheet No.: D2-A00502FEN

Outline Dimensions (Unit : mm)

Rank mark

5.3±0.3

2.6±0

.20.

1±0.1

0.5+0.4−0.2

7.0+0.2−0.7

Epoxy resin

45˚

6˚

0.2±0

.05

1 2 0.4±0.1

4.4±0

.2

4 3

3.6±0.3

2.54±0.25

367

SHARP mark"s"

Date code

Factory identification mark

Anode mark

PC367NJ0000F Series

Plating material : SnCu (Cu : TYP. 2%)

Product mass : approx. 0.1g

Date code (2 digit)

Rank markRefer to the Model Line-up table

A.D.

1990

1991

1992

1993

1994

1995

1996

1997

1998

1999

2000

2001

Mark

A

B

C

D

E

F

H

J

K

L

M

N

Mark

P

R

S

T

U

V

W

X

A

B

C

Mark

1

2

3

4

5

6

7

8

9

O

N

D

Month

January

February

March

April

May

June

July

August

September

October

November

December

A.D

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012···

···

2nd digit

Month of production

1st digit

Year of production

Factory identification mark

3

repeats in a 20 year cycle

Sheet No.: D2-A00502FEN

PC367NJ0000F Series

Factory identification Mark

no mark

Country of origin

Japan

Indonesia

China

* This factory marking is for identification purpose only. Please Contact the local SHARP sales reprsentative to see the actual status of the production.


Electro-optical Characteristics

Absolute Maximum Ratings

4

PC367NJ0000F Series

(Ta=25˚C)

Parameter Symbol Unit

Inpu

t

Forward current mA*1 Peak forward current mA

Power dissipation mW

Out

put

Collector-emitter voltage V

Emitter-collector voltage V

Collector current mA

Collector power dissipation mW

Total power dissipation mW

*2 Isolation voltage

Operating temperature ˚C

Storage temperature ˚C

*3 Soldering temperature

IF

IFM

P

VCEO

VECO

IC

PC

Ptot

Viso (rms)

Topr

Tstg

Tsol ˚C*1 Pulse width≤100µs, Duty ratio : 0.001*2 40 to 60%RH, AC for 1 minute, f=60Hz*3 For 10s

Rating

10

200

15

Reverse voltage VVR 6

80

6

50

150

170

−30 to +100

−40 to +125

260

3.75 kV

Parameter Conditions

Forward voltage

Reverse current

Terminal capacitance

Collector dark current

Transfercharac-teristics

Emitter-collector breakdown voltage

Collector current

Collector-emitter breakdown voltage

Collector-emitter saturation voltage

Isolation resistance

MIN.

−

−

−

−

6

0.5

−

5×1010

−

−

TYP.

1.2

−

30

−

−

−

−

−

1×1011

4

3

MAX.

1.4

10

250

100

−

−

2.5

0.2

−

18

18

Unit

V

V

µA

pF

nA

V

mA

V

Ω

µs

µs

Symbol

VF

IR

Ct

ICEO

BVCEO

BVECO

IC

VCE (sat)

tr

tf

RISO

Response timeRise time

Fall time

Input

Output

IF=10mA

VR=4V

V=0, f=1kHz

VCE=50V, IF=0

IC=0.1mA, IF=0

IE=10µA, IF=0

IF=0.5mA, VCE=5V

DC500V, 40 to 60%RH

VCE=2V, IC=2mA, RL=100Ω

Floating capacitance − 0.6 1.0 pFCf V=0, f=1MHz

IF=10mA, IC=1mA

80

(Ta=25˚C)

10 − − kV/µsCMRCommon mode rejection voltageTa=25˚C, RL=470Ω, VCM=1.5kV(peak)

IF=0mA, VCC=9V, Vnp=100mV


Model Line-up

5

Please contact a local SHARP sales representative to inquire about production status.

PC367NJ0000F Series

PC367NJ0000FPC367N1J000FPC367N2J000F

PC367NT0000FPC367N1T000FPC367N2T000F

Package

with or without

A

B

Model No.

IC [mA](IF=0.5mA, VCE=5V, Ta=25˚C)

0.5 to 2.5

0.75 to 1.5

1.0 to 2.0

3 000pcs/reel 750pcs/reel

TapingRank mark


Tot

al p

ower

dis

sipa

tion

P tot

(m

W)

Ambient temperature Ta (˚C)

0

200

250

150

170

100

50

−30 0 25 50 75 100 125

Fig.5 Total Power Dissipation vs. Ambient Temperature

Forw

ard

curr

ent I

F (m

A)


0

10

15

5

−30 0 25 50 75 100 125

Fig.2 Forward Current vs. Ambient Temperature

Dio

de p

ower

dis

sipa

tion

P (m

W)


0

15

10

5

−30 0 25 50 75 100 125

Fig.3 Diode Power Dissipation vs. Ambient Temperature

Col

lect

or p

ower

dis

sipa

tion

P C (

mW

)


0

200

250

150

100

50

−30 0 25 50 75 100 125

Fig.4 Collector Power Dissipation vs. Ambient Temperature

6

Fig.1 Test Circuit for Common Mode Rejection Voltae

Vnp1)

1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side.

Vcp

VCM

VCM : High wave pulseRL=470ΩVCC=9V

VCM

RL

VCC

(dV/dt)

VO

VO

(Vcp Nearly = dV/dt×Cf×RL)

PC367NJ0000F Series


Rel

ativ

e cu

rren

t tra

nsfe

r ra

tio (

%)


−30 −10−20 100 20 30 40 50 60 70 80 90 100

VCE=5VIF=0.5mA

0

160

140

120

100

80

60

40

20

Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature

Col

lect

or-e

mitt

er s

atur

atio

n vo

ltage

VC

E (

sat) (

V)


0

0.16

0.14

0.12

0.1

0.08

0.06

0.04

0.02

IF=10mAIC=1mA

−30 1009080706050403020100−10−20

Fig.11 Collector - emitter Saturation Voltage vs. Ambient Temperature

7

Col

lect

or c

urre

nt I

C (

mA

)

Collector-emitter voltage VCE (V)

0

30

0 2 4 6 8 10

Ta=25˚C

25

20

15

10

5

IF=7mA

IF=5mA

IF=3mA

IF=2mA

IF=1mA

IF=0.5mA

PC (MAX.)

Fig.9 Collector Current vs. Collector-emitter Voltage

Cur

rent

tran

sfer

rat

io C

TR

(%

)

Forward current IF (mA)

0.1 1 100

700VCE=5VTa=25˚C

600

500

400

300

200

100

Fig.8 Current Transfer Ratio vs. Forward Current

Forw

ard

curr

ent I

F (m

A)

0.1

1

10

100

0 0.5 1 1.5 2

Forward voltage VF (V)

Ta=25˚C

Ta=75˚C

Ta=100˚C

Ta=50˚C

Ta=0˚C

Ta=−25˚C

Fig.7 Forward Current vs. Forward Voltage

Peak

for

war

d cu

rren

t IFM

(m

A)

Duty ratio

10

1 000

100

10−210−3 10−1 1

Pulse width≤100µsTa=25˚C

Fig.6 Peak Forward Current vs. Duty Ratio

PC367NJ0000F Series


8

Vol

tage

gai

n A

V (

dB)

−25

5

0.1 1 10 100 1 000

Frequency f (kHz)

VCE=2VIC=2mATa=25˚C

0

−5

−10

−15

−20

RL=10kΩ

1kΩ

100Ω

Fig.16 Frequency Response


10−11

10−5

10−6

10−7

10−8

10−9

10−10

−30 1009080706050403020100−10−20

VCE=50V

Col

lect

or d

ark

curr

ent I

CE

O (

A)

Fig.12 Collector Dark Current vs. Ambient Temperature

Load resistance RL (kΩ)

0.11

10

100VCE=2V, IC=2mA

1

tf

ts

tr

td

10

Res

ponc

e tim

e (µ

s)

10%

InputOutput

Input Output

90%tstd

VCC

RD RL

tftr

Please refer to the conditions in Fig.13 and Fig.14

VCE

Fig.15 Test Circuit for Response Time

Load resistance RL (kΩ)

11

10

100

1 000Vcc=5V, IF=1mA, Ta=25˚C

10

tfts

tr

td

100

Res

ponc

e tim

e (µ

s)

Col

lect

or-e

mitt

er s

atur

atio

n vo

ltage

VC

E (

sat) (

V)

Forward current IF (mA)

0

5

0 2 4 6 8 10

Ta=25˚C

4

3

2

1

IC=7mA

IC=5mA

IC=3mA

IC=2mA

IC=1mA

IC=0.5mA

Fig.17 Collector-emitter Saturation Voltage vs. Forward Current

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

PC367NJ0000F Series

Fig.13 Response Time vs. Load Resistance(Active region)

Fig.14 Response Time vs. Load Resistance(Saturation region)


Design Considerations

While operating at IF<0.5mA, CTR variation may increase.Please make design considering this fact.

In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is fioating capacitance may be generated and result in false operation since current may go through IRED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of IRED.

This product is not designed against irradiation and incorporates non-coherent IRED.

DegradationIn general, the emission of the IRED used in photocouplers will degrade over time.In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.

Recommended Foot Print (reference)

For additional design assistance, please review our corresponding Optoelectronic Application Notes.

9

1.5

2.54

0.8

6.3

(Unit : mm)

Design guide

PC367NJ0000F Series


Manufacturing Guidelines

Reflow Soldering:Reflow soldering should follow the temperature profile shown below.Soldering should not exceed the curve of temperature profile and time.Please don't solder more than twice.

Soldering Method

Flow Soldering :Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.

Flow soldering should be completed below 260˚C and within 10s.Preheating is within the bounds of 100 to 150˚C and 30 to 80s.Please don't solder more than twice.

Hand solderingHand soldering should be completed within 3s when the point of solder iron is below 400˚C.Please don't solder more than twice.

Other noticesPlease test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

10

1 2 3 4

300

200

100

00

(˚C)

Terminal : 260˚C peak

( package surface : 250˚C peak)

Preheat

150 to 180˚C, 120s or less

Reflow

220˚C or more, 60s or less

(min)

PC367NJ0000F Series


Solvent cleaning:Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less

Ultrasonic cleaning:The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device.Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.

Recommended solvent materials:Ethyl alcohol, Methyl alcohol and Isopropyl alcoholIn case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.

Cleaning instructions

This product shall not contain the following materials.And they are not used in the production process for this product.Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).

Presence of ODC

11

PC367NJ0000F Series


12

Package specification Tape and Reel package

1. 3 000pcs/reelPackage materials

Carrier tape : A-PET (with anti-static material)Cover tape : PET (three layer system)Reel : PS

Carrier tape structure and Dimensions

A

12.0±0.3

B

5.5±0.1

C

1.75±0.1

D

8.0±0.1

E

2.0±0.1

H

7.4±0.1

I

0.3±0.05

J

3.1±0.1

K

4.0±0.1

F

4.0±0.1

G

φ1.5+0.1 −0

F E

I

D JG

B

A

C

H5˚M

AX

.

K

H

Dimensions List (Unit : mm)

a

c

e

g

f

b

d

a

370

b

13.5±1.5

c

80±1.0

d

13±0.5

e

21±1.0

f

2.0±0.5

g

2.0±0.5


Pull-out direction

[Packing : 3 000pcs/reel]

Reel structure and Dimensions

Direction of product insertion

PC367NJ0000F Series


2. 750 pcs / reelPackage materials

Carrier tape : A-PET (with anti-static material)Cover tape : PET (three layer system)Reel : PS

Carrier tape structure and Dimensions

13

A

12.0±0.3

B

5.5±0.1

C

1.75±0.1

D

8.0±0.1

E

2.0±0.1

H

7.4±0.1

I

0.3±0.05

J

3.1±0.1

K

4.0±0.1

F

4.0±0.1

G

φ1.5+0.1 −0

F E

I

D JG

B

A

C

H


5˚M

AX

.

K

H

a

c

e

g

f

b

d

a

180

b

13.5±1.5

c

80±1.0

d

13±0.5

e

21±1.0

f

2.0±0.5

g

2.0±0.5


Pull-out direction

[Packing : 750pcs/reel]

Reel structure and Dimensions

Direction of product insertion

PC367NJ0000F Series

· The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems rela-ted to any intellectual property right of a third party re-sulting from the use of SHARP's devices.

· Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec-ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufac-turing locations are also subject to change without no-tice.

· Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as:

--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment--- Industrial control--- Audio visual equipment--- Consumer electronics

(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection

with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers--- Alarm equipment--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-tion with equipment that requires an extremely high lev-el of reliability and safety such as:

--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g.,

scuba).

· If the SHARP devices listed in this publication fall with-in the scope of strategic products described in the For-eign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP de-vices.

· This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro-duced or transmitted in any form or by any means, elec-tronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.

· Contact and consult with a SHARP representative if there are any questions about the contents of this pub-lication.

14


Important Notices

PC367NJ0000F Series

[E199]

Documents

PC367NJ0000F Series PC367NJ0000F Mini-flat … · PC367NJ0000F Series 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC367) 2. Package resin