Patents of laser micro-machining technology for

Semicon drilling/cutting applications Dr. Li, Chun Hao (Owen Li) President of Hortech Company

Company Introduction

Laser Micro-machining technology

Integration technology of Opto-mechatronic、Control、Software、Material 、 Processing

Laser micro-machining / dry etching solution

Laser & Material reaction Opto-mechatronic system Optimal-processing

Laser-Opto Mechanic Electical Control Software Process

Patents for manufacturing solution

Related patents Countries Type

of Patent Application Status

Laser processing machine

US/Japan/K

orea/Taiwan

/China

Invention

USA Patent No.US 8,710,401

B2(2014)/特許第5531060/No. 10-1378619/第M417976號/第M417976號

Laser Device Of Equal-Energy Pulse

Synchronous With Motion

US/Taiwan/

China Invention

USA 8,422,521 B2/第I 403376號/ZL2011.1.0003852.2號CN

DOUBLE-DIRECTIONAL MACHINING

LASER MACHINE TOOL

US/Taiwan/

China Invention

This non-provisional application claims

priority under 35 U.S.C. § 119(a) on

Patent Application No. 201520663067.3

filed in China/第M515922/ZL2015.2.0663067.3

DOUBLE-SIDED MACHINING LASER

MACHINE TOOL

US/Taiwan/

China Invention

This non-provisional application

claims priority under 35 U.S.C. §

119(a) on Patent Application No.

201620426817.X filed in China

雷射製程參數調校方法及自動參數調校之雷射加工機

Taiwan/China

Invention 第I411484號/第1387752號CN

Video for laser micro-machining

system with Automation

Video for Demo-2

Video for Demo-1

Laser micro-drilling application

Laser drilling on ceramic : 50um diameter, thickness 200um

Laser drilling on ceramic : 50um square, thickness 200um

Laser drilling on PI/ceramic/ABF :

20~100um diameter hole/blind hole

Laser drilling on stainless : 50um diameter bowl dot

Laser drilling on Al : 7/15/25um diameter surface structure

Laser drilling on stainless : 3.6um diameter focus spot size

Laser drilling on stainless : 2um diameter focus spot size

Laser cutting application

Laser cut on sapphire wafer :

groove width around 24um, the depth around >60um

Laser cutting for IC package

Laser dry etching applications

Laser dry etching thin film ITO on thick film BM or glass