Upload
others
View
2
Download
0
Embed Size (px)
Citation preview
Package Net Group Creation
TPA Example Net Groupings
Parametric Variations
Routing (width and spacing)Bondwire profileSolderball profile
DSO – Distributed Solve Option
……
Paradigm shift:Old: 1 computer to 1 engineerNew: n number of CPU’s to 1 engineer
Host
Nodes
Trace width
Optimize PerformanceParametric Q3D Extractor
®project
Trace width and spacing changing
Optimize Performance
Near-End Crosstalk noise dataTr=200ps
Nominal Case
Improved Case
DesignerSITM/Nexxim®
Schematic view
3D EM Based circuit co-designChanged Routing
Trace length and spacingCrosstalk analysis
DSO Solution TimeDSO Solution Time
Optimize Simulation Run Times
7hr 2 min7hr 2 min
DSO Setup25 Parametric Case7 nodes used2.6 GHz Opteron 8 GB of RAM
Without DSO7 hr 2 min
Using DSO Time1hr 2 min
** Linear Speed Increase **~ 7X speed up with 7 nodes
SI Thermal EffectsePhysicsTM
Critical 3D Thermal and stress analysisSolderball interconnect reliabilityStress induced strains in solder joints
Thermal distribution wire padsThermal distribution wire padsNo wirebonds presentNo wirebonds present
Thermal distribution on bondwiresThermal distribution on bondwiresSingle vs. double bondwireSingle vs. double bondwire
DT: 64.56[C] DT: 61.51[C]
SI Mechanical EffectsePhysicsTM
Reduced design cycle time limits the use of testing to evaluate reliability.Stress induced strains in solder joints
PCB Thermal and Stress Analysis
Features:
- Complex geometry;- Anisotropic thermalmaterial properties;
- Anisotropic stressmaterial properties;
- Large thermal / stressFEM models
Forced convection model
“Bed of pins” stresssimulation
Thermal PCB simulation
10/31/2006 11
0 0
0
0
0
0
IZ=0ohm
PNUM=1RZ=0ohm
LDQ0_src36
LDQ1_src35LDQ2_src33
LDQ3_src34LDQ4_src31
LDQ5_src32LDQ6_src40
LDQ7_src37LDQS_src38
LDQSB_src41RDQS_src39
RDQSB_src42VDD_vddsrc
VDDQ_vddqsrc
VSS_vsssrcVSSQ_vssqsrc
LDQ0_Sink
LDQ1_Sink
LDQ2_SinkLDQ3_Sink
LDQ4_SinkLDQ5_Sink
LDQ6_SinkLDQ7_Sink
LDQS_SinkLDQSB_Sink
RDQS_SinkRDQSB_Sink
VDD_SinkVDDQ_SinkVSS_Sink
VSSQ_SinkGround_Bias
V596 V597
50
R598
Cin
/2
C59
9
Cin
/2
C60
0 cloa
d
C60
1
50
R602
V603
Port2Port11 2
ref
VDDQVDDQ
VSSQVSSQ
LDQ0
VDDQ
VSSQ
LDQ0
LDQ0_1
VDDQ1
LDQ1LDQ2
LDQ4
LDQ6LDQ7
VDDQ
VDDQ
LDQ1_1
LDQ2_1LDQ3_1
LDQ6_1
LDQ7_1
LDQ4_1LDQ5_1
LDQ3
LDQ5
LDQ0_1
LDQS_1LDQS_1
DDR2 Memory Channel
Digital Source
TRL line FBGA model
8Bit DQ Bus Channel
Direct import function keeps track of connections
S-parameter model
Unique Bit sequence sourcefor jitter analysis
S-parameter model
DDR2 package
DDR2 Package on PCB
NEXXIM / EM Co-Design
32ports S-Element
IBIS
PWR/GND Plane Impedance N-Ports S-Parameters
90 ohm
Transient TDR
(spec)
Transient Eye Diagram w/Jitter
Jitter
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
0 0
Port1 Port2
3e-0
12
0.21.27e-009
8.4e
-013
C_comp
L_pkg R_pkg
C_pkg
IBIS Driver and Package
* C_comp is important
IBIS Driver
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Main Board DQ0 lines : SIwave
* Series R and Swt. Included in DQ line
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Connector and Interface Board : HFSS
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Interface Board to Coaxial interconnection : Q3D Extractor
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Coaxial Cable : Ansoft Designer
* Er and TAND Optimized from Data Sheet (Delay and Attenuation)
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Coaxial to DUT Board interconnection : Q3D Extractor
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
DUT Board : SIwave
DDR Memory Test System
0
0
0
BitList=010101
BitList=010101
BitList=010101
400MbpsPW:2.5n
400MbpsPW:2.5n
400MbpsPW:2.5n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VV_driverA_out
VV_logicA
VV_driverB_out
VV_logicB
1e-
006
L107
8
12345
678910
ref
Port1 Port2
U2Chip_Package3
Port1 Port2
U3Chip_Package3
Port1 Port2
U4Chip_Package3
DC1_posPC1_DQ0_D46_posPD1_DQ0_D50_pos
P_U156_AE22_1_pos
P_U156_B4_1_posP_U156_C3_1_pos
VTT_pos
VV_dutA_out
8.5
e-0
13
C10
89
2000
0
R10
90
DQ0_driver_posDQ0_term_pos
P_U1_C8_1_posP_U2_C8_1_pos
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Cylinder1:Source1Rectangle11_1_1:Source2
Cylinder1:Sink1Rectangle11_1_1:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Coax_probe:Source1Gnd:Source2
Coax_probe:Sink1Gnd:Sink2
Port1Port1_ref
Port2Port2_ref
Port1Port1_ref
Port2Port2_ref
VV_comp
Test Probe modeling :From Data Sheet* Important
Ansoft Results : 50Mbps DQ0
Measurement and Ansoft Results
: Ansoft
: Measurement
50Mbps DQ0
Ansoft Results : 400Mbps DQ0
Measurement and Ansoft Results
: Ansoft
: Measurement
400Mbps DQ0
Measurement and Ansoft Results
: Ansoft
: Measurement
400Mbps DQ0
Ansoft Results : 830Mbps DQ0
Measurement and Ansoft Results
: Ansoft
: Measurement
830Mbps DQ0
Measurement and Ansoft Results
: Ansoft
: Measurement
830Mbps DQ0
10/31/2006 29
Bit Pattern1. - Jitter noise analysis (time domain)
0 0 0
0
0
0 0 0
0 0 0 0
IZ=0ohm
PNUM=1RZ=0ohm
IZ=0ohm
PNUM=2RZ=0ohm
IZ=0ohm
PNUM=3RZ=0ohm
IZ=0ohm
PNUM=4RZ=0ohm
IZ=0ohm
PNUM=5RZ=0ohm
IZ=0ohm
PNUM=6RZ=0ohm IZ=0ohm
PNUM=7RZ=0ohm
IZ=0ohm
PNUM=8RZ=0ohm
LDQ0_src36LDQ1_src35LDQ2_src33LDQ3_src34LDQ4_src31LDQ5_src32LDQ6_src40LDQ7_src37LDQS_src38
LDQSB_src41RDQS_src39
RDQSB_src42VDD_vddsrc
VDDQ_vddqsrcVSS_vsssrc
VSSQ_vssqsrc
LDQ0_SinkLDQ1_SinkLDQ2_SinkLDQ3_SinkLDQ4_SinkLDQ5_SinkLDQ6_SinkLDQ7_SinkLDQS_Sink
LDQSB_SinkRDQS_SinkRDQSB_Sink
VDD_SinkVDDQ_SinkVSS_Sink
VSSQ_SinkGround_Bias
V731 V732 V733
18
R736
Cin
/2
C737
Cin/
2
C738
75
R741Port2Port1
U3FBGA_00
1 2
ref
V
Vodt_0
V
18
R787
Cin
/2
C788
Cin/
2
C789
18
R795
Cin
/2
C796
Cin/
2
C797
18
R802
Cin
/2
C803
Cin/
2
C804
18
R809
Cin/
2
C810
Cin/
2
C811
18
R820
Cin/
2
C821
Cin/
2
C822
18
R823
Cin
/2
C824
Cin/
2
C825
18
R834
Cin
/2
C835
Cin/
2
C836
cloa
d
C855
75
R867Port2Port1
U4FBGA_00
1 2
ref
VVodt_1
cloa
d
C871
75
R884Port2Port1
U6FBGA_00
1 2
ref
VVodt_2
cloa
d
C888
75
R895Port2Port1
U8FBGA_00
1 2
ref
VVodt_3
cloa
d
C899
75
R906Port2Port1
U10FBGA_00
1 2
ref
VVodt_4
cloa
d
C91
0
75
R917Port2Port1
U12FBGA_00
1 2
ref
VVodt_5
cloa
d
C92
1
75
R928Port2Port1
U14FBGA_00
1 2
ref
VVodt_6
cloa
d
C93
2
75
R939Port2Port1
U16FBGA_00
1 2
ref
VVodt_7
cloa
d
C94
3
VDDQ VSSQ VDDQ1
LDQ0
VDDQ
VSSQ
LDQ0_1
VDDQ
VSSQ
VDDQ
VSSQ
LDQ0 LDQ0_1
LDQ1
VDDQ
VSSQ
LDQ2
VDDQ
VSSQ
LDQ3
VDDQ
VSSQ
LDQ4
VDDQ
VSSQ
LDQ5
VDDQ
VSSQ
LDQ6
VDDQ
VSSQ
LDQ7
VDDQ
VSSQ
VDDQ1 LDQ1_1 VDDQ1 LDQ2_1 VDDQ1 LDQ3_1 VDDQ1
LDQ4_1 VDDQ1 LDQ5_1 VDDQ1 LDQ6_1 VDDQ1 LDQ7_1 VDDQ1
LDQ1LDQ2LDQ3LDQ4LDQ5LDQ6LDQ7
LDQ1_1LDQ2_1LDQ3_1LDQ4_1LDQ5_1LDQ6_1LDQ7_1
Eye diagram is useful for jitter analysis for DQ Bus. 1 DQ pin is Victim, another pin is Aggressor.
AggressorVictim
Source is text file.(voltage profile)
DDR2 Channel Jitter AnalysisJitter Noise analysis in Vodt pin (Within 2 % signal voltage)
Skew Analysis (LDQ Bus vs. LDQS)
Maximum Skew valueLDQS
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1n1
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1n1
n1n1
n1n1
n1n1
n1n1
n1n1
n1n1
n1n1
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
n1
0
c0
I/O
P OW E R
GND
logic_in
enable
I/O
P OW E R
GND
logic_in
enable
I/O
P OW E R
GND
logic_in
enable
negative
positive
V 44
negative
positive
negative
positive
V 53
Vn1
coax_core:S ource1
coax_gnd:S ource2
coax_core:S ink1
coax_gnd:S ink2
Vn1
Vn1
Vn1
Vn1
object1_Aobject1_B
Ground_B ias
coax_core:S ource1
coax_gnd:S ource2
coax_core:S ink1
coax_gnd:S ink2
negative
positive
V 133
Vn1
negative
positive
V 174
Vn1
terminals_1terminals_0
1
R242
terminals_1terminals_0
1
R243
object1_A
object1_B
Ground_B ias1
2
3
45
6
7
8
9
ref
1
2
3
45
6
7
8
9
ref
I/O
P OW E R
GND
logic_in
enable
P in_01:S ource1
P in_02:S ource2
P in_03:S ource3
P in_04:S ource4P in_05:S ource5
P in_06:S ource6
P in_07:S ource7
P in_08:S ource8P in_09:S ource9
P in_10:S ource10
P in_11:S ource11
P in_12:S ource12
P in_01:S ink1
P in_02:S ink2
P in_03:S ink3
P in_04:S ink4P in_05:S ink5
P in_06:S ink6
P in_07:S ink7
P in_08:S ink8P in_09:S ink9
P in_10:S ink10
P in_11:S ink11
P in_12:S ink12
coax_core:S ource1
coax_gnd:S ource2
coax_core:S ink1
coax_gnd:S ink2
coax_core:S ource1
coax_gnd:S ource2
coax_core:S ink1
coax_gnd:S ink2
P _J11_3_pos
P _J11_5_pos
P _J15_17_pos
P _J15_19_posP _J15_33_pos
P _J15_35_pos
P _K 44_3_pos
P _K 44_4_posP _K 48_3_pos
P _K 48_4_pos
P _K 89_3_pos
P _K 89_4_posP _K 93_3_pos
P _K 93_4_pos
P _K 140_3_pos
P _K 140_4_pos
P _K X 9_5_posP _K X 9_6_pos
P _U6_A E 22_pos
P _U6_A F17_pos
P _U6_B 4_posP _U6_C3_pos
P _U6_C18_pos
P _U6_D19_pos
P _U6_V 18_posP _V TT_pos
negative
positive
V 410
negative
positive
V 435
negative
positive
V 521 U6_B 4
U6_C3
pattern0101pattern_ZZZ_B 4
pattern_ZZZ_C3
pattern0101
pattern0101
V _dcin
V _dcin
U6_B 4
U6_C3
K 89_3
K 89_4
K 89_4 K 89_3
J11_3
J11_3
sig1
sig1
sig1_coax
sig1_coaxcoax_out sig1_coax_outcoax_out
insert
U1_C8
J43_1
coax_out_b
coax_out_b sig2_coax
sig2_coax
sig2
sig2J11_5
K 93_3 K 93_4
K 93_4
U6_A E 22
V _enable
sig1_coax_out
insert_d
insert_d
cio_d8
cio_r50
Board #1
Connector
Insert
Board #2
Coax_cable_40cm
Board #3
K89
K4T51_DQ
Insert
Full Channel Analysis
Allegro to SIwave
PCB modeling Connector/cable modeling
HFSS
F_connectorM_connector
Coaxial cable-> K89.4 -> K89.3 -> R489.1 -> J11.3U6.B4 -> RN1.1,4 U6.C3 -> RN1.2,3
K93.4 <- K93.3 <- J11.5U6.AE22 <- RP29.1,2L33.1,2 <- RP30.1,2
Coaxial cable
J44.1
U1.C8
J43.1
Board #1 Board #2
=> Need Nexxim ++
Q3D Extractor
FBDIMM
Electromagnetics is key to chip/package/board simulation
Model order reduction is key to bringing electromagnetics into circuit toolsThe new methodology provides an effective environment for chip/package/board co-design
Conclusions