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P14452: Subsystems Design Review

P14452: Subsystems Design Review. Review Where we left off

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Page 1: P14452: Subsystems Design Review. Review Where we left off

P14452: Subsystems Design Review

Page 2: P14452: Subsystems Design Review. Review Where we left off

ReviewWhere we left off

Page 3: P14452: Subsystems Design Review. Review Where we left off

Updated Engineering Specifications

Page 4: P14452: Subsystems Design Review. Review Where we left off

Previous Functional Decomposition

Page 5: P14452: Subsystems Design Review. Review Where we left off

Capture Data

Page 6: P14452: Subsystems Design Review. Review Where we left off

Store Data

Page 7: P14452: Subsystems Design Review. Review Where we left off

Power Device

Page 8: P14452: Subsystems Design Review. Review Where we left off

Protect Device

Page 9: P14452: Subsystems Design Review. Review Where we left off

Chosen Concept

Concept # 4

Power Source UltraCap

Start Capture Reed Switch

Stop Capture Timer

Sensor Connection 4-Wire

Set Sampling Rate Digital Knob

Mount Device Magnet

High Pressure Composite

High Temp Insulated/Passive

Oily Env. Gaskets/Plugs

Data Storage microSD

Processor μC

Data Access USB

Sample Bit Width 16-bit

Sample Rate 10kHz

Page 10: P14452: Subsystems Design Review. Review Where we left off

Materials AnalysisBuilding a Better Box

Page 11: P14452: Subsystems Design Review. Review Where we left off

Plan

• Comparisons of Materials

• Acetal Resin (Delrin®-150)

• Polysulfone

• Polyester (Ertalyte® PET-P)

• Aluminum 6061

• Applied Loads

• 100psig applied to external surfaces

• 200F applied to bodies

Page 12: P14452: Subsystems Design Review. Review Where we left off

Acetal Resin (Delrin®-150)

Properties• Max Operating Temp

• 180F

• Yield Strength

• 10400psi

• Modulus

• 450ksi

• CTE

• 278μin/in-°F

• Cost: 1.5”x6”x6” sheet

• $35.71

• Max Deformation

• .060”

• Max Stress

• ?

ANSYS Simulation

Page 13: P14452: Subsystems Design Review. Review Where we left off

Polysulfone (PSU)

Properties• Max Operating Temp

• 285F

• Yield Strength

• 10900psi

• Modulus

• 390ksi

• CTE

• 29.4μin/in-°F

• Cost: 1.5”x6”x6” sheet

• $147.83

• Max Deformation

• .006”

• Max Stress

• 6862 psi

ANSYS Simulation

Page 14: P14452: Subsystems Design Review. Review Where we left off

Polyester (Ertalyte® PET-P)

Properties• Max Operating Temp

• 210F

• Yield Strength

• 12400psi

• Modulus

• 490ksi

• CTE

• 33μin/in-°F

• Cost: 1.5”x6”x6” sheet

• $48.57

• Max Deformation

• .007”

• Max Stress

• 9744 psi

ANSYS Simulation

Page 15: P14452: Subsystems Design Review. Review Where we left off

Aluminum 6061

Properties• Max Operating Temp

• 500F

• Yield Strength

• 40000psi

• Modulus

• 1000ksi

• CTE

• 13.1μin/in-°F

• Cost: 1.5”x6”x6” sheet

• $53.44

• Max Deformation

• .003”

• Max Stress

• ?

ANSYS Simulation

Page 16: P14452: Subsystems Design Review. Review Where we left off

Weight

• Density:

• Acetal:

• .0513 lb/in3

• Polysulfone:

• .0448 lb/in3

• Polyester:

• .0361 lb/in3

• Aluminum:

• .0975 lb/in3

• Mass:

• Acetal:

• .0671 lb (30.4g)

• Polysulfone:

• .0586 lb (26.6g)

• Polyester:

• .0472 lb (21.4g)

• Aluminum:

• .1275 lb (57.8g)

Volume: 1.3075

in3

Page 17: P14452: Subsystems Design Review. Review Where we left off

Other Properties

• Thermal Conductivity

• Acetal:

• 2.5 BTU-in/hr-ft²-°F

• Polysulfone:

• 3 BTU-in/hr-ft²-°F

• Polyester:

• 2 BTU-in/hr-ft²-°F

• Aluminum:

• 1160 BTU-in/hr-ft²-°F

• Electrical Resistivity

• Acetal:

• 1015 ohm-cm

• Polysulfone:

• 1016 ohm-cm

• Polyester:

• 1012 ohm-cm

• Aluminum:

• 10-6 ohm-cm

Page 18: P14452: Subsystems Design Review. Review Where we left off

Pugh Analysis

Delrin PSU PET Al

Strength -

DATUM

+ +

Operating Temp - - +

Cost + + +

Weight s + -

Thermal Conductivit

ys s -

ElectricalResistivity s s -

Total 1/2 3/1 3/3

Page 19: P14452: Subsystems Design Review. Review Where we left off

Case GeometryThe Best Things Come in Small Sizes

Page 20: P14452: Subsystems Design Review. Review Where we left off

PCB DimensionsShow 3D Rendering

Page 21: P14452: Subsystems Design Review. Review Where we left off

Mounting• Two part solution

• Flange Base

• Through Hole in each corner

• Can be used to mount directly

• Adapter Plates

• Attach to flange base

• Allow for Mounting on existing holes

• Allow for adhesive, zelcro, magnets, etc.

Page 22: P14452: Subsystems Design Review. Review Where we left off

Generalized Design

• Rectangular Prism

• 1-3 Ports for Analog I/O

• 1 Micro-USB Port

• Charging

• Data Access

• Flange Base

• Fasten from Bottom

• Locks access to inside of device when mounted

• Provides Mounting Holes

Page 23: P14452: Subsystems Design Review. Review Where we left off

MicrocontrollersChoosing a Better Brain

Page 24: P14452: Subsystems Design Review. Review Where we left off

Criteria 1: ADC Accuracy

Bit Width # of Values LSB (Accuracy)

10 1024 19.53 mV

12 4096 4.88 mV

14 16384 1.22 mV

16 65536 305 uV

18 262144 76.3 uV

20 1048576 19.1 uV

24 16777216 1.19 uV

Page 25: P14452: Subsystems Design Review. Review Where we left off

Criteria 2: ADC Type

Successive Approximation

• 10-12 bit Accuracy

• Fast Sample Rate (>200kS/s)

• Requires External Low-pass Filter

• Costs Board Space

• 3 Op-amps (Bi-Quad)

• Resistors and capacitors

Sigma-Delta• 12-24 bit Accuracy

• Slow Sample Rate (<200kS/s)

• No External Low-pass Filter

• Filter is part of sampling process

• Must be careful of bit width effect on frequency range

Page 26: P14452: Subsystems Design Review. Review Where we left off

Criteria 3: Serial Throughput (SD)

Bit Width Bits/s (1 Ch)* Bytes/hr (1 Ch)*

Bits/s (4 Ch)* Bytes/hr (4 Ch)*

10 100k 42.915 MB 400k ~172 MB

12 120k 51.498 MB 480k ~206 MB

14 140k 60.081 MB 560k ~240 MB

16 160k 68.885 MB 640k ~276 MB

18 180k 77.248 MB 720k ~309 MB

20 200k 85.831 MB 800k ~345 MB

24 240k 102.997 MB 960k ~412 MB* at 10kHz sampling rate

Page 27: P14452: Subsystems Design Review. Review Where we left off

Criteria 4: I/O Capability

• SD Card

• 1 SPI interface

• 1 Serial Clock

• USB Data Access

• 1 USB UART

• ADC

• 1-4 ADC Channels

• GPIO

• 1 Digital (SD)

• >2 Digital for Hardware Sampling Rate (per channel)

Page 28: P14452: Subsystems Design Review. Review Where we left off

Criteria 5: Processor Speed

• ADC requirement

• 10000 Samples/s per Channel

• May take more than 1 cycle per sample to read from ADC

• Estimated Minimum Speed

• 40000 Samples/s (4 Channels)

• 2 Cycles per Sample Read

• 112 Cycles per Sample Write

• 5 Bytes Data

• 1 Bytes Channel ID

• 5 Bytes Timestamp

• 2 Bytes “,”

• 1 Byte CR

• 4.56 MHz

Page 29: P14452: Subsystems Design Review. Review Where we left off

Microcontrollers

STM32F373• 32-bit ARM M4F (72 MHz)

• Floating Point

• DSP Instructions

• 1-3 Sigma-Delta ADC

• 16-bit

• 16.66 kHz max per channel

• DMA Interface

• ADC Synchronization

• 3 SPI (18 Mbit/s)

• Up to 84 GPIO

• 1 USB UART (12 Mbit/s)

MSP430F67XX• 16-bit RISC ( 8-25 MHz)

• No Floating Point

• No DSP Instructions

• 3 Sigma-Delta ADC

• 24-bit

• 31 kHz per channel max

• DMA Interface

• ADC Synchronization

• 2 SPI (5 Mbit/s)

• 52 or 72 GPIO

• No USB

Page 30: P14452: Subsystems Design Review. Review Where we left off

Input ConditioningThe Large Signal Problem

Page 31: P14452: Subsystems Design Review. Review Where we left off

Attenuation Circuit

• Use resistor bridge to reduce the voltage for input to microcontroller

• Set a unity gain

• Also decreases the current going into the uC

Page 32: P14452: Subsystems Design Review. Review Where we left off

Simplified Circuit

• Simplified circuit

Page 33: P14452: Subsystems Design Review. Review Where we left off

Final Circuit

Page 34: P14452: Subsystems Design Review. Review Where we left off

Attenuator Non-ideality

10 100 1000 100000

1

2

3

4

5

6

7

8

f(x) = − 5.74854197E-09 x² + 0.00080073565 x + 0.000515302233

Percent Error vs Sensor Output Im-pedance

Series1

Sensor Ouput Impedance (Ohms)

Pe

rce

nt

of

Err

or

Page 35: P14452: Subsystems Design Review. Review Where we left off

Power SourcePhenomenal Cosmic Power. Itty Bitty Living Space.

Page 36: P14452: Subsystems Design Review. Review Where we left off

LiPo vs. Ultra Capacitor

Ultra Capacitor (KEMET FT0H105ZF)

• Diameter = 21.5mm (0.846in)

• Height = 13mm(0.512in)

• Area= 1502mm^3

• Max Voltage 5.5V

• 1F capacitance

• Max current is 1.5mA for 30 mins

• Weight = 10 grams

• Price 1$4.23, 10$38.03

• KEMET FT Series pages 2-4

LiPo Battery (All-battery.com 602025)

• Base: 25mm x 20mm

• Height: 6mm

• Area=3000mm^3

• Voltage = 3.7V

• 240 mAh

• Max Current is 48mA for 5 Hours

• Weight = 4 grams

• Price for 5-10$3.25 each

• http://www.all-battery.com/polymerli-ionbattery37v240mah602025.aspx

Page 37: P14452: Subsystems Design Review. Review Where we left off

LiPo Charging• Spark Fun Power Cell – LiPo Charger/Booster

• Micro USB charging

• $19.99 breakout board for testing

• Eagle Files Available for PCB layout

Page 38: P14452: Subsystems Design Review. Review Where we left off

Schematic for LiPo Charging and Booster

https://www.sparkfun.com/products/11231

Page 39: P14452: Subsystems Design Review. Review Where we left off

Components Required LiPo Charger and Booster

• MCP73831/2: LiPo Charging IC

• Can get free samples

• TPS61200: 5 volt, 600mA boost converter

• Can get free samples

• Used for powering sensors and other components

• JST connector $0.95

• Micro USB SMD Connector $1.95

• Resistors and Capacitors <$2.00

Page 40: P14452: Subsystems Design Review. Review Where we left off

Action ItemsThe Road Ahead

Page 41: P14452: Subsystems Design Review. Review Where we left off

Mechanical Action Items

Materials and Modelling• Choose Final Material

• Solid Modelling

• Small Device

• Large Device

• Ansys Simulations

• Small Device

• Large Device

Sensor Characterization• Catalog Existing Sensors in

Compressor

• Centralized Collection of Data Sheets

• Reference Card for Sensors

• Voltage Range

• Current Output

• Frequency Ranges

• Optimal Sampling Rate

• Voltage to Unit Conversion Factor

Page 42: P14452: Subsystems Design Review. Review Where we left off

Electrical Action Items

PCB• Finalize Electrical Schematics

• Small Device

• Large Device

• Finalize PCB Designs

• Small Device

• Large Device

• Final Component Selection

Analog Analysis• Attenuator Final Design

• Differential Amplifier

• Precision Voltage Reference

• Input Voltage Clamping

• Overvoltage Protection

• LiPo Charging Circuitry

Page 43: P14452: Subsystems Design Review. Review Where we left off

Computer Action Items

Algorithms• Digital Filtering

• Sample Ordering

• Timestamp Calculation

• Processor Initialization Routines

Processes• Sampling Procedure

• Channel Switching

• Multiple Sampling Rate Switching

• DMA transfers

• Offload SPI

• Offload ADC

• Processor can focus on filtering and coordinating

Page 44: P14452: Subsystems Design Review. Review Where we left off

Questions?El fin.