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P13623: Conductive Heat Transfer Lab Equipment. System Design Review April 5th, 2013. Project Participants. Project Sponsor : RIT KGCOE, Chemical Engineering Dept. Dr. Karuna S. Koppula Mr . Paul Gregorius MSD 1 Team Guide: Michael Antoniades Project Members: - PowerPoint PPT Presentation
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P13623: Conductive Heat Transfer Lab Equipment
System Design Review
April 5th, 2013
P13623: Conductive Heat Transfer Lab Equipment
Project Participants
Project Sponsor : RIT KGCOE, Chemical Engineering Dept.
Dr. Karuna S. Koppula
Mr. Paul Gregorius
MSD 1 Team Guide: Michael Antoniades
Project Members:
David Olney - (ChemE) Project Manager
Todd Jackson - (ME) Project Engineer
Alysha Helenic - (ChemE) Documentation Engineer
Edward Turfitt - (ChemE) Design/Concept Engineer
Charles Pueschel - (ChemE) Data Acquisition Specialist
Ian Abramson - (ChemE) Customer Liaison
Agenda
Overview of project
Design specifications, needs and constraints
Customer needs
Engineering specifications
Project deliverables
Functional decomposition
Design process
Concept generation
Functional architecture
Physical architecture
Design generation and assessment
Initial concepts
Pros and cons
Final proposed design
Final design assessment
Benefits and limitations
Feasibility
Risk
Project planning
Project schedule
Deliverables
Quarter goals
Questions
Heat Transfer and Thermal Conductivity
Heat transfer can take place from three methods (Conduction, Convection , Radiation).
The most valuable method to calculate a constants for one specific mode of heat transfer is to reduce or eliminate the other two modes.
Project Overview
Problem Statement:
Build an apparatus that can demonstrate thermal conductivity reliably to students for educational purposes.
Resources:
The only limitation we have is the set budget for the project.
(space, cart, current lab equipment, donations) excluded from budget.
Expectations:
The purpose of this review session is for constructive criticism, recommendations, and validation by the customer for some of our current designs that we have derived.
Design Process Flow
Problem Definition
Define Requirements
Define Constraints
Define Systems
Research Systems
Develop Solutions
Concept Generation
External
Assess Solutions
Generate Designs
Assess Designs
Final Design
Design assessment
PRP
Functional Decomposition
Engineering Matrix
House of Quality
Constraint Criteria
Power Source
Temperature Sensors
Heating Element
Cooling Element
Insulation Methods
Data Collection
Contact Resistance
Interchangeability
Pugh Matrix
Design 1
Design 2
Design 3
Design 4
Final Design
Customer Specifications review
Risk Assessment
Cost Assessment
Pro/Con List
Customer Needs
Engineering Specifications
Engineering Specifications
Functional Decomposition
Functional Architecture
Heating Element
Cooling Element
Temperature Sensors
Insulation
Data Acquisition
Provide a constant heat source to the specimen
Provide a constant heat sink to the specimen
Provide a means for measuring temperature
Minimize the amount of heat loss
Provide a means for collecting data
Power Source
Provide a means for power heating element
Concept Generation
Criteria Generation
Pugh Matrix: Heating and Cooling
Pugh Matrix: Insulation
Pugh Matrix: Sample Container
Pugh Matrix: Data Measurement and Display
Design 1
Pros & Cons of Design 1
Pros
Simplicity
Cheap
Visual
Compatible with different samples
Easy to set up
Cons
Inconsistent insulation
Design 2
Pros & Cons of Design 2
Pros
Pressure can be applied to the heater
Cheap
Visual
Compatible with different length samples
Cons
Hard to swap different diameter samples
Potential air leaks because of water supply connections.
Design 3
HeaterDiskCoolerPlateTemp SensorThermo CpInsulationSolid or packedOrientationVerticalSet-upmed-hotPros & Cons of Design 3
Pros
No convection
Compatible with different length
Pressure can be applied on both the heater and cooler
Solid insulation adds support
Cons
Complex
Longer set up times
Not completely visible
Design 4
Pros & Cons of Design 4
Pros
Limits convections
Visual
Compatible with different length and diameter samples
Pressure can be applied on both the heater and cooler
Compatible with multiple insulations
Cons
Complex
Longer set up times
More expensive
Boat Design
Removable caps allow liquid , gases, and pastes to be inserted into the boat.
Temperature sensors will be placed at set lengths within the boat so that they do not move.
The ends will be made out of a conductive medal to minimize leakage.
Components
Subsystem
System
Heat conduction apparatus
Power source
Electric variable power generator
Temperature sensor
Thermocouple or silicon based temperature sensor
Heating element
Plate heater
Cooling element
Cold plate
Insulation
Variable insulation method
Data Collection
DAQ
LCD
Contact resistance
Screw cap (pressure)
Multi-material
Boats
Physical Architecture
Critique of Designs
Data Collection - Design #1
DAQsCostInterface (to PC)Arduino~60USB/OtherNi Equipment>600USB/OtherLabjack~110USB/OtherNeedsManual Data CollectionDigital Data CollectionEffective For Students of Various Learning Styles33Utilization is complex enough to involve 3-4 students in the allotted time11Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles3-Allows for manual Data Collection9-Allows for Digital Data Collection-9Data Collection - Design #1 (Digital Only)
NeedsManual Data CollectionDigital Data CollectionEffective For Students of Various Learning StylesN(3)3Utilization is complex enough to involve 3-4 students in the allotted timeN(1)1Utilization Requires Fundamental Understanding of Conducive Heat Transfer PrinciplesN(3)-Allows for manual Data CollectionN(9)-Allows for Digital Data Collection-9Data Collection - Design #2 (Analog Version)
NeedsManual Data CollectionDigital Data CollectionEffective For Students of Various Learning Styles3N(3)Utilization is complex enough to involve 3-4 students in the allotted time1N(1)Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles3-Allows for manual Data Collection9-Allows for Digital Data Collection-N(9)Data Collection Design #3
NeedsManual Data CollectionDigital Data CollectionEffective For Students of Various Learning Styles33Utilization is complex enough to involve 3-4 students in the allotted time11Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles3-Allows for manual Data Collection9-Allows for Digital Data Collection-9Temperature In Sample versus Length
Assumptions: Steady State, No conduction or convection from the air on the sample.
q = Q/A =-k(dT/dx)
Given Targets: Q = 500 W, Target T = 120 K
Chosen Parameters: T0 = 273 K, D = , L =
Feasibility Analysis
h
T1
T2
T3
T4
T5
One Dimensional Transient Analysis
One Dimensional Finite Difference Steady State Analysis
T1 and T5 will be known temperatures
The length of the rod and properties will be known
One Dimensional Transient Analysis
h
T1
T2
T3
T4
T5
One Dimensional Transient Analysis
h
T1
T2
T3
T4
T5
One Dimensional Finite Difference Steady State Analysis
h
T1
T2
T3
T4
T5
Simulation Parameters
Copper Rod ParametersDensity (kg/m3)8940Thermal Conductivity (W/m*K)401Specific Heat (J/kg*K)394Length (m)0.254Diameter (m)0.00635Stainless Steel ParametersDensity (kg/m3)7820Thermal Conductivity (W/m*K)43Specific Heat (J/kg*K)490Length (m)0.254Diameter (m)0.00635Copper Rod Results
After 1 minute
After 2 minutes
Copper Rod Results
After 3 minutes
After 4 minutes
Stainless Steel Rod Results
After 5 minutes
After 10 minutes
Stainless Steel Rod Results
After 20 minutes
After 40 minutes
Stainless Steel Rod Results
After 60 minutes
Feasibility Conclusion
Copper rod reaches steady state much quicker than the stainless steel rod.
In order to reach thermal equilibrium quicker, the length of the specimen can be diminished.
The lab can be conducted within the allotted time.
Means for Calculating Thermal Conductivity Steady State
Where:
Rs = thermal resistance of sample
F = heat flow transducer calibration factor
Tu = upper plate surface temperature
Ti = lower plate surface temperature
Q = heat flow transducer output
Where:
K = thermal conductivity
d = thickness of sample
Means for Calculating Thermal Conductivity Transient
Risk Assessment
Project Organization
Define Customer Needs and Specs
Develop Concepts
Create System Level Design
Create Detailed Design
Update Project Plan
Design Verification
Write Technical Paper
Create Poster
Final Presentation
Hold System Design Review
Revise design based on Review
Create test and assembly plans
Write BOM
Order Materials
Hold Detailed Design Review
Create test plans
Build system
Verify design through testing
MSD I and MSD II Goals
and Deliverables
Project Schedule for Quarter
GoalWeek CompletedRevise System Design based on Review feedbackWeek 6Create assembly plansWeek 7/8Create test plansWeek 7/8Write BOMWeek 9Order materialsWeek 9/10Hold Detailed Design ReviewWeek 10/11Questions?
050100150200250300350400450500
0
500
1000
1500
2000
2500
3000
3500
4000
Q W/(m.K)
Temperature (K)
Aluminum
Copper
Iron