P08312 – Concept Design Review – Meeting Outline

P08312 – Concept Design Review – Meeting Outline Friday October 12, 2007, 12:00 pm – 2:00 pm

CE Conference Room – 09-3489

Facilitator: Eric Steffan

I. Introduction to project, description of goals

- Brief overview for any committee members who are not familiar with project

- Show 1-page project summary

II. Review of customer needs and specifications

- Show needs and specs document

- Go over specs to make sure they are realistic

- Determine if there are any additional specs we have missed

III. Explain current concept for overall system design

- Show flow chart

- Briefly explain purpose of each subsystem

- Show parts list

IV. Discuss concepts for processor, sensors, & cooling

(Desired attendees: Dr Kandlikar., Dr. Phillips)

- Talk about FPGA vs. pre-made processor and why we chose to go with the Intel mobile.

- Explain how SPEC benchmarks will be used.

- Talk about different types of temperature sensors, and why we are using thermocouples.

- Attaching sensors with epoxy, and possible issues with isolation

- Discuss different cooling options, and why we chose to use a heat sink

- Explain how we will be adding sensors by drilling through heat sink

- Determine if parts on parts list are suitable

V. Discuss concepts for microcontroller & control software

(Desired attendee: Dr. Hsu)

- List all the functions the microcontroller needs to perform

- Discuss how the microcontroller will be interfaced with the sensors (amplifiers, multiplexers, A

to D, etc)

- How will microcontroller communicate with the web server and the control software? (USB /

Serial ports)

- Is control software even necessary or can we control the processor directly through hardware?

- Discuss why we chose the microcontroller that we did.

VI. Discuss webpage and web server

- Will web server run on the same machine that the benchmarks are on, or a separate one?

- Look at web page mockup

- What kind of information will it generate? Real time? Logging?

- How will it be programmed? What language? (Visual C++/C# / Java)

- Does the machine actually host the webpage or is it hosted elsewhere? If the latter, how does it

upload the data?

Page 1 of 27

Senior Design Project Data Sheet

Project Description

Project Background: Thermal monitoring and management is needed in mobile processors because as process technology results in smaller transistors, heat in mobile processors becomes a more prevalent issue, forcing the built-in thermal management systems of today to scale back processor speed or shut it down entirely. This is the first time this project has been attempted at RIT.

Problem Statement: The project will be concentrating on measuring the thermal dissipation of individual blocks in a production microprocessor used in mobile platforms. The team will be designing an interface/framework to measure the temperature using thermal sensors, when running benchmark programs on the processor. The modular thermal profile of the processor provides fine grain optimization. The goal is to have an accurate and realistic thermal monitoring. In addition, the thermal profile of the processor should be accessible on a LAN/WAN.

Objectives/Scope: Design and implement a system that will allow for reduced heat, and therefore higher speed in mobile microprocessors. In the future, this will allow for more powerful processors in smaller devices.

Deliverables: • Detailed, quantitative target specifications

mapped to customer needs. (DONE)

• Develop multiple concepts (on paper) and select most feasible. Update specifications. Customer Feedback. (DONE)

• System design with more detailed specifications. Determine greatest challenges / risks to project. (WiP)

• Proof of concept breadboard, brassboard, or simulation of high risk technologies defined in 4.. Risk assessment for technology / cost / schedule. (wks 6-7)

• Detailed design to meet all customer needs. All long lead items should be identified for ordering. Detail Design Review. (wks 8-9).

• Develop detailed test plan with linkage to engineering specifications and customer needs (wks 10-11)

• Update Design History File on EDGE,BOM sufficiently detailed to define source, cost, and lead time; Test Plan; Project Plan for SDII. (wk 11).

Expected Project Benefits: • At the end of MSD 1&2, the customer will

have a basic thermal mapping and management system that will allow mobile microprocessors to run at a high speed without overheating.

Core Team Members: • Rob Gedelian

• Anthony Macri

• Matt Ploutz

• Matt Montondo

• Eric Steffan

Strategy & Approach

Assumptions & Constraints: 1. An Intel mobile processor will be used with

external temperature sensors on the heat sink.

2. This is a small-budget project, so the team will have to be very cost-conscious as it selects the parts.

Issues & Risks: • The team will have to use external sensors

to monitor the package as a whole, approximating the temperature inside the microprocessor. This will likely be inaccurate.

• Lead time for some parts may be longer than desired.

• Compatibility issues with components

• Failure of parts.

Project # Project Name Project Track Project Family

P08312 Dynamic Thermal

Monitoring and

Management for Mobile

Processors

Systems and Controls

Technology Track

N/A

Start Term Team Guide Project Sponsor Doc. Revision

200701 Dr. Reddy Dr. Kudithipudi 4

Page 2 of 27

P08312 Senior Design Project Data Sheet



Monitoring and


Processors


Technology Track

N/A


200701 Dr. Reddy Dr. Kudithipudi 1.0

Customer Statement Interpreted Need Specifications

1. The temperature of all hot points

on the CPU need to be monitored

Multiple thermal sensors are to be

placed throughout the CPU

• 9 external temperature sensors placed through

the heat sink onto the core of the processor

• Thermal sensors must be able to detect up to

125ºC

• Thermal sensors must have accuracy of ± 2ºC

2. A thermal mapping of the CPU

surface needs to be generated

Thermal sensor data needs to be read

into a PC for thermal analysis

• Thermal map will incorporate entire processor

chip with information from each temperature

sensor

• Thermal monitoring/map will be in real time

• Optional: Ability to log history of thermal data

3. Determine location of hot spots

and find ways to prevent the core

from overheating

Analyze thermal mapping and

optimize layout of CPU • Intel dual-core processor will be used

• Based on internal layout of processor, sensors

will be placed on microprocessor parts that

perform computations

4. Sensor data should be accessible

over the internet/LAN

A web interface showing the thermal

mapping is to be developed

• Serial/USB interface between the

microcontroller and the PC

• PC will connect to LAN for remote access of

thermal monitoring webpage with information

updated every 10 seconds

5. If the CPU gets too hot,

preventative measures need to be

taken

When the CPU overheats, it should

enter a thermal safe mode (reduce

voltage, frequency, turn on a fan)

• Microcontroller will not allow the processor to

exceed 10ºC below max temperature, if

temperature approaches, system will shutdown

• Microcontroller will run thermal management

that lowers voltage, frequency, control fan speed

Page 3 of 27


6. The CPU needs to be run at its

hottest possible temperature when

testing

A benchmark program that fully

stresses the CPU needs to be

developed

• SPEC CPU2006 benchmark will be used that

stresses the system’s processor, memory

subsystem, & compiler

7. A hardware solution should be

implemented to control the

temperature of the system

Thermal sensor data will be read

into a microcontroller, which will

manage the processors temperature

• Microcontroller will not allow the processor to

exceed 10ºC below max temperature

• Microcontroller will run thermal management

8. System needs to be adaptable Need to be able to add additional

microprocessors to the design • Design will allow additional processor(s) to be

added to the design with minor changes

• Design will allow multiplexing of sensors

Page 4 of 27

1. Sensor Array 2. Microcontroller

4. Processor

5. Cooling System

Temperature Readings

Control signals (shutdown)Control signal

Voltage

Frequency

Heat

Control signals (fan speed)

Temperature Data Web page6. Web Server

3. Control Software

P08312: Overall System Concept #1

Page 5 of 27


4. Processor

5. Cooling System


Control signals (shutdown)

Voltage

Frequency

(hardware control)

Heat


Temperature. Data Web page6. Web Server


Page 6 of 27


4. Processor

5. Cooling System


Control signals (shutdown)

Voltage

Frequency

(hardware control)

Heat


Web page


Temperature Data

Page 7 of 27


4. Processor

5. Cooling System


Control signals (shutdown)Heat


Web page


Temperature Data

Control signal

Voltage

Frequency3. Control Software

Page 8 of 27


List of Subsystems and Functions

1. Sensor Array

Inputs: Heat generated by processor

Outputs: Temperature signal readable by microcontroller

• Sensor Layout

• Implementation/Attaching sensors

o Cutting grooves in heat sink o Attaching thermocouples to heat sink

• Interfacing/Signal amplification

o Make signal readable by microcontroller

2. Microcontroller

Inputs: Temperature signal

Outputs: freq, voltage, Fan RPM, shutdown

• May need to amplify signal from sensors and/or do ADC

• Simple analysis of temperature data

• Send control signals based on analysis

o Freq -> Control Software o Voltage -> Control Software o RPM -> Fan o Shutdown signal -> Motherboard

• Send raw temp data to web server

3. Control Software

Inputs: freq, voltage

Outputs: freq, voltage to CPU

• Read serial port for control signals

• Set processor freq, voltage accordingly

4. Processor Inputs: frequency, voltage

Outputs: Heat

• Run benchmark to get as hot as possible

• Respond to software’s frequency & voltage settings



Monitoring and


Processors


Technology Track

N/A



Page 9 of 27


5. Cooling system

Inputs: fan speed setting (if using fan)

Outputs: air or other cooling method

• Cools down processor

• Might be fan/heat sink combo, liquid cooling, or other system

6. Web Server Inputs: Temperature data

Outputs: Text and graphics for webpage

• Generate real-time graphical and numerical analyses of temperature data

• (Optional) Keep logs of past temperature data

• Publish to web

Page 10 of 27


Parts List Computer

1. AOpen H340D2.0BK Black SECC MicroATX Desktop Computer Case 200W Power Supply 2. ABIT IL-90MV 478 Intel 945GT HDMI Micro ATX Intel Motherboard 3. Intel Core 2 Duo T7200 Merom 2.0GHz Socket M Processor Model BX80537T7200 4. (2) Kingston 512MB 240-Pin DDR2 SDRAM DDR2 800 (PC2 6400) Desktop Memory Model KVR800D2N5/512 5. SAMSUNG Black 1.44MB 3.5" Internal Floppy Drive 6. Seagate Barracuda 7200.10 ST380815AS 80GB 7200 RPM SATA 3.0Gb/s Hard Drive 7. ASUS Black SATA DVD-ROM Drive Model DVD-E616A3T

Software

1. Microsoft Windows XP Professional 2. SPEC Benchmark Suite CPU2006 V1.0.1 – Non-profit/Educational

Interconnects

1. Cat5E Enhanced Network Cable

2. (2) Serial ATA Splitter Power Cable (6 inch)

Cooling System

1. Arctic Silver 5 Advanced Thermal Compound

2. Arctic Alumina Thermal Adhesive

3. (3) DC1207BM-X Dense Copper Microfin Cooler for P4 skt 478 3.4GH

Thermal Sensing System

1. 100 ft Thermocouple Type T – 40 Gauge

2. Op Amps

3. Thermistor

4. Resistors

5. Jumper wires kit

6. Breadboard



Monitoring and


Processors


Technology Track

N/A



Page 11 of 27


Microcontroller

1. Analog Devices ADUC7026 Precision Analog Microcontroller, 12-Bit Analog I/O

2. Analog Devices QuickStart EVAL-ADUC7026QSZ Evaluation Board (Serial cable, power supply, software)

Page 12 of 27

P0312 Senior Design Project Data Sheet ‘

PUGH MATRIX FOR MICROPROCESSOR CHOICE

PUGH MATRIX FOR MICROPROCESSOR

Option Intel AMD FPGA Laptop

Criteria Weight Rating Score Rating Score Rating Score Rating Score

Cost 0.1 3 0.3 3 0.3 3 0.3 2 0.2

Speed 0.05 4 0.2 4 0.2 1 0.05 3 0.15

Model Accuracy 0.15 3 0.45 3 0.45 1 0.15 5 0.75

Ease of Setup 0.3 4 1.2 4 1.2 1 0.3 2 0.6

Flexibility 0.05 3 0.15 3 0.15 5 0.25 1 0.05

Availability of Data 0.1 4 0.4 2 0.2 5 0.5 2 0.2

Ease of Adding Sensors 0.15 3 0.45 3 0.45 4 0.6 2 0.3

Controllability (frequency, voltage) 0.1 3 0.3 3 0.3 4 0.4 2 0.2

Total 1 3.45 3.25 2.55 2.45



Monitoring and


Processors


Technology Track

N/A



Page 13 of 27


SPEC CPU2006

CPU2006 is SPEC's next-generation, industry-standardized, CPU-

intensive benchmark suite, stressing a system's processor, memory

subsystem and compiler. SPEC designed CPU2006 to provide a

comparative measure of compute-intensive performance across the

widest practical range of hardware using workloads developed from real

user applications. These benchmarks are provided as source code and

require the user to be comfortable using compiler commands as well as

other commands via a command interpreter using a console or command

prompt window in order to generate executable binaries.

Information

SPEC CPU2006 Benchmark Descriptions

A survey of the benchmarks comprising each SPEC CPU2006

component suite:

• CINT2006 - The Integer Benchmarks.

• CFP2006 - The Floating Point Benchmarks.

Page 14 of 27


Using an Op-Amp to amplify thermocouple voltage:

U1

OPA336/BB

+3

-2

V+

7

V-4

OUT6

V1

5Vdc

0

0

R1

100k

R2

200

0

V2

.005Vdc

V

V

V_V2

0V 1.0mV 2.0mV 3.0mV 4.0mV 5.0mV

V(U1:OUT)

0V

2.0V

4.0V

SEL>>

V(V2:+)

0V

2.5mV

5.0mV

DC sweep, 0mV to 5mV (~25 deg C to 135 deg C output from thermocouple)



Monitoring and


Processors


Technology Track

N/A



Page 15 of 27


Hardware test using Burr-Brown OPA2337:

Input signal: Ramp from 0-500mV through a 100K/1K divider network. Actual input:

Ramp from 0V – 4.95mV.

Unfiltered Input/Output

Filtered Input/Output

The op amp was able to reject noise and amplify the signal to desired levels of 0V-2.5V.

Page 16 of 27


Comparing OPA2337 to AD8554:

AD8554 OPA2337

Offset Voltage 1uV-5uV 500uV-3mV

Input Voltage Noise 1uV_PP 6uV_PP

CMRR 130 dB 90 dB

Input Bias current 20pA 10pA

Supply Current 700 uA 525 uA

Supply Operation 2.7-5V RTR

2.5-5.5V RTR

The AD8554 will provide even better performance compared to the OPA2337 used in the

hardware test.

Page 17 of 27


Cold junction compensation process: The voltage measured at the microcontroller (V2) will be different from the voltage

created at the measurement point (V1) because a second junction is created at the

measurement point. The emf created at the microcontroller subtracts from the emf

created at the measurement point. To compensate the temperature at the microcontroller

(T2) will be measured using an internal sensor or an external thermistor.

1. Convert T2 to V2 using lookup table

2. Measure VOUT and add V2 to find V1

3. Use lookup table to convert V1 into T1

Page 18 of 27


Using BJT and PWM output of microcontroller to create variable fan speed:

V1

12Vdc

0

V2

TD = 0

TF = 1nPW = 15uPER = 30u

V1 = 2.5

TR = 1n

V2 = 0

R2

1kQbreakN

Q1

R1

1k

50% Duty Cycle:

Time

0s 20us 40us 60us 80us 100us

V(R1:2,R1:1)

0V

10V

20V

V(V2:+)

0V

2.0V

4.0V

SEL>>

83% Duty Cycle:

Time

0s 20us 40us 60us 80us 100us

V(R1:2,R1:1)

0V

10V

20V

V(V2:+)

0V

2.0V

4.0V

SEL>>

Page 19 of 27


PUGH MATRIX FOR COOLI�G SYSTEM CHOICE

PUGH MATRIX FOR COOLING SYSTEM

Options Liquid Cooling Heat sink w/ fan Fan-less Heat sink Peltier Heat Pump

Criteria Weight Rating Score Rating Score Rating Score Rating Score

Heat Transfer Coefficient 0.25 5 1.25 3 0.75 3 0.75 4 1

Cost 0.15 1 0.15 4 0.6 4 0.6 4 0.6

Feasibility (size, etc.) 0.3 1 0.3 5 1.5 1 0.3 1 0.3

Ease of Manufacture 0.2 2 0.4 5 1 5 1 3 0.6

Power Consumption 0.1 2 0.2 3 0.3 5 0.5 2 0.2

Total 1 11 2.3 20 4.15 18 3.15 14 2.7



Monitoring and


Processors


Technology Track

N/A





Monitoring and


Processors


Technology Track

N/A



Page 20 of 27

Page 21 of 27

38.705

020.75

TYP0.395

0 TYP0.79

.000203.15

03.65

006.5

05.7509.2507.75

3.645

NOTES:1. Begin with Dynatron Heat Sink Model # D622. Grooves are symmetrical excluding center groove3. Typical groove depth = 1mm

Tolerances:X.XX +/- 0.50 (0.02 in)X.XXX +/- 0.125 (0.005 in)

Dimensions in mm

Drawn by: Eric Steffan

Material: Copper C1020

Senior Design P08312

Concept A: Focused by core

10-11-07 Rev 1.0

SEE DETAIL A

DETAIL ASCALE 2.500

Page 22 of 27

39.455

020.75

TYP0.395

0 TYP0.79

002.5

4.795

03.65

.000609.25

1.145

.000 TYP4

.0006

09.25

NOTES:1. Begin with Dynatron Heat Sink Model # D622. Grooves are symmetrical excluding center groove3. Typical groove depth = 1mm

Drawn by: Eric SteffanTolerances:X.XX +/- 0.50 (0.02 in)X.XXX +/- 0.125 (0.005 in)

Senior Design P08312Concept B: 3x3 Array

Dimensions in mm Material: Copper C1020

10-11-07 Rev 1.0

SEE DETAIL A

DETAIL ASCALE 2.000

Page 23 of 27


PUGH MATRIX FOR MICROCO�TROLLER CHOICE

PUGH MATRIX FOR MICROCONTROLLER

Option Freescale ST Analog Devices

Criteria Weight Rating Score Rating Score Rating Score

Cost 0.1 1 0.1 3 0.3 5 0.5

Ease of Setup/Programming 0.1 3 0.3 2 0.2 3 0.3

Interfacing to computer 0.15 2 0.3 4 0.6 3 0.45

Scalability 0.05 3 0.15 3 0.15 3 0.15

Interfacing to sensors 0.15 3 0.45 3 0.45 5 0.75

Number of Inputs 0.3 3 0.9 4 1.2 5 1.5

Number of Outputs 0.1 5 0.5 5 0.5 4 0.4

Memory 0.05 5 0.25 4 0.2 3 0.15

Total 1 25 2.95 28 3.6 31 4.2



Monitoring and


Processors


Technology Track

N/A



Page 24 of 27


Page 25 of 27

Updated_Pseudo// // Pseudo-code for Microcontroller//

while(1){

double hottestTemp = 0.0;

// first find the sensor that's giving the hottest readingfor(each sensor reading) {

double thisHottestTemp=GetThisSensorTemp();if(thisHottestTemp > hottestTemp){

hottestTemp=thisHottestTemp;}// in all cases, send every reading to the web serversendThisTempReadingToWebServer();

}

if(hottestTemp > maxTempAllowed) {sendShutdownSigToBoard();

}if(hottestTemp > optimalTemp) {

increaseFanSpeed();// there will be some logic to determine decreasing freq or voltsendFreqDecreaseSigToSoftware();sendVoltDecreaseSigToSoftware();

}if(temp < optimalTemp) {

decreaseFanSpeed();// there will be some logic to determine increasing freq or voltsendFreqIncreaseSigToSoftware();sendVoltIncreaseSigToSoftware();

}}

//// Pseudo-code for Control Software//

while(1){

if(freqDecrease == 1) {sendFreqDecSignalsToBoard();

}if(voltDecrease == 1) {

sendVoltDecSignalsToBoard();}if(freqIncrease == 1) {

sendIncFreqSignalsToBoard();}if(voltIncrease == 1) {

sendIncVoltSignalsToBoard();}

}

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Documents

P08312 – Concept Design Review – Meeting Outline