1

OVERVIEW OF ORAL PRESENTATION SESSIONS

Friday, August 18, 2017

Parallel Sessions

Room A Room B Room C Room D Room E Room F Room G

Oral Session 1

(Session A-1)

Oral Session 2

(Session B-1)

Oral Session 3

(Session B-5)

Oral Session 4

(Session D-1)

Oral Session 5

(Session F-1)

Oral Session 6

(Session G-1)

Oral Session 7

(Session H-1)

Chair Jintang Shang Rong Sun Qian Wang Hua Lu Paul Wang Lei Liu CH. Chew

08:30 – 09:55 Keynote 01:

Yuan Lu

Keynote 02:

Changqing Liu

Keynote 03:

Zhi-Quan Liu

Keynote 04:

Chenxi Wang

Keynote 05:

Chunyan Yin

Keynote 06:

Asushi Okuno

Keynote 07:

Boping Wu

43,72,98 11,16,102 146,153,156 116,273,225 113,123,203 18,266,169 44, 299,70

09:55 – 10:50 Poster Session 1 & Coffee Break

Oral Session 8

(Session A-2)

Oral Session 9

(Session B-2)

Oral Session 10

(Session B-6)

Oral Session 11

(Session B-9 &F-5)

Oral Session 12

(Session F-2)

Oral Session 13

(Session G-2& H-3 & E-1)

Oral Session 14

(Session H-2)

Chair Yunhui Mei Changqing Liu Zhi-Quan Liu Liangliang Li Chunyan Yin Fei Xiao Boping Wu

10:50 – 12:10 293, 107,134,154

Keynote 08:

Rong Sun 159,168,177,187 280, 322,348,149 127,142,224,320 94,199,88,360

Keynote 9:

CH. Chew

20,45,103 75,65,209

12:10 – 13:30 Lunch: Sunlight Restaurant in VIP Building & Banquet Hall in Catering Building

2

OVERVIEW OF ORAL PRESENTATION SESSIONS (Cont.)

Friday, August 18, 2017

Parallel Sessions

Room A Room B Room C Room D Room E Room F Room G

Oral Session 15

(Session A-3& D-2)

Oral Session 16

(Session B-3)

Oral Session 17

(Session B-7)

Oral Session 18

(Session I-1)

Oral Session 19

(Session F-3)

Oral Session 20

(Session C-1)

Oral Session 21

(Session C-3)

Chair Hu He Daoguo Yang Dongyan Ding Ran He Hongjun Ji Hongtao Chen Chunjin Hang

13:30 – 14:50 250,326,128,230 47,51,87,104 167,189,222,265 288,180,234,89 232,301,335,364 186,155,253,260 86,172,302,201

14:50 – 15:50 Poster Session 2 & Coffee Break

Oral Session 22

(Session D-3)

Oral Session 23

(Session B-4)

Oral Session 24

(Session B-8)

Oral Session 25

(Session I-2)

Oral Session 26

(Session F-4)

Oral Session 27

(Session C-2)

Oral Session 28

(Session C-4)

Chair Yuan Lu Wei Liu Rong An Wenhua Yang Fengwen Mu Yujie Li Chenxi Wang

15:50 – 17:10 SP1, 66,192,278 92,93,99,140 197,231,276,282 330,233,297,151 275,258,100,179 81,109,213,96 90,36,175,256

17:30 – 20:30 Dinner: Sunlight Restaurant on 1st floor of the VIP Building

3

Introduction of Invited Session Keynotes Speakers

Dr. Yuan Lu, Institute of Microelectronics, Chinese Academy of Sciences,

China

Yuan Lu: Technical Director, National Center for Advanced Packaging (NCAP-CHINA);

Professor, Institute of Microelectronics, Chinese Academy of Sciences. Dr. Lu is a National

Distinguished Expert (“The Thousand Talents Plan”). Dr. Lu got his PhD from Wayne State

University (US) in 2006. Dr. Lu has been with Institute of Microelectronics, Chinese Academy

of Sciences and working on 3D microelectronics packaging since 2012. He joined

NCAP-CHINA in 2013. Before getting back to China, Dr. Lu had worked for various US

semiconductor companies (Freescale Semiconductor (now NXP), FlipChip International,

Lucent Technologies, Digital Semiconductor, AVX, General Motors, etc) for more than 20

years. In recent 5 years, Dr. Lu has been working on 3D semiconductor device integration, MEMS/IC integration,

ultra-fine pitch IC interconnect, and high speed OE/IC integration, etc. He has applied more than 50 patents.

Prof. Changqing Liu, Loughborough University, UK

Changqing Liu received his BEng from Nanjing University of Science and Technology in

1985, and his MSc from the Institute of Metals Research of Chinese Academy of Sciences in

1988. After five years appointment as an assistant professor at the Institute of Metals Research,

he secured an Overseas Research Scholarship (ORS-CVCP) and moved to UK in 1993 reading

his PhD at Hull University. From 1997 he was employed as postdoctoral research fellow at

Birmingham University (UK) for three years. Since 2000 he joined the Wolfson School of

Mechanical, Electrical and Manufacturing Engineering at Loughborough University (UK) as

research fellow, where he became Professor of Electronics Manufacture from January 2011,

following his appointment as Lecturer in 2005, Senior Lecturer in 2007. His current research focuses on advanced

materials and innovative manufacturing to enable 3D multi-material heterogeneous embodiment, integration and

miniaturisation of future generation multifunctional devices. He has published over 242 academic papers, and

currently a Fellow of Higher Education Academy, UK, and a Senior IEEE member. He has been active in the field of

electronics integration and manufacturing as a regular participant and contributor as well as technical committee

member to the IEEE CPMT conferences (e.g. ECTC, ESTC, EPTC, EMPC), and previously served as Chair of the

Interconnections Committee of ECTC (USA) and Chair of Packaging Materials & Processes Committee of ICEPT

(China).

Prof. Zhi-Quan Liu, Institute of Metal Research (IMR), China

Professor Zhi-Quan Liu is the Group Leader of Microelectronic Interconnect Materials at

Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS). After received a

doctor’s degree in April 2000, He worked in Japan (NIMS) for more than 6 years and then

joined in IMR as a Hundred Talent Scholar of CAS since 2017. His research expertise spans

across property related microstructure characterization and phase transformation, focusing on

microstructure and reliability of interconnect materials under thermal, mechanical and

electrical fields. He has been authored and co-authored more than 100 international

peer-reviewed journal papers, which were published in Nature, Science, Physical Review Letters, Acta Materialia,

Nanotechnology, etc.

4

Dr. Chenxi Wang, Harbin Institute of Technology, China

Dr. Chenxi Wang received the B.E. and M.E. degrees in materials science and engineering

from Harbin Institute of Technology, China, in 2002 and 2004 respectively and the Ph.D

degree in precision engineering, The University of Tokyo in 2009. From 2009 to 2011, he

received postdoctoral fellowship awarded by Japan Society for the Promotion of Science

(JSPS) at The University of Tokyo. From 2011 to 2014, he worked as a Senior Researcher at

the Department of Applied Chemistry, The University of Tokyo. He is currently working as an

Associate Professor at the School of materials science and engineering, Harbin Institute of

Technology from 2014. His research involved microsystem integration and packaging,

low-temperature wafer bonding, high-precision alignment, micro/nanofabrication, micro/nanofluidic devices. He has

co-authored more than 60 papers in international journals and conferences, and holds 2 Japan patents and 8 China

patents (pending). He received many awards, including the Best Paper Awards of international conferences on

electronic packaging technology (ICEPT) in 2003, 2007, 2010 and 2011, Chinese Government Award for

Outstanding Student Abroad in 2007, IEEE-CPMT travel award for ECTC 2009, Young award of IEEE CPMT

Symposium Japan 2010, and the 2010 Dean Award of School of Engineering, The University of Tokyo, Best

Presentation Award of 2nd Advanced Welding & Joining Technology Conference in 2011. He is a member of IEEE

and Electrochemical society (ECS).

Dr. Chunyan Yin, University of Greenwich, UK

Chunyan Yin received her Bachelor and Master Degrees in material engineering from Harbin

Institute of Technology, China in 1999 and 2001, and her PhD degree in computational science

and engineering from University of Greenwich, UK in 2006. She joined University of

Greenwich as a PhD research student in 2002, and worked as a research fellow since 2007 and

a lecturer since 2013. Prior to this, she worked at City University of Hong Kong as a research

assistant. Dr Yin's main research interests are in thermo-mechanical modelling,

physics-of-failure analysis, prognostic and reliability assessment. She has authored or

co-authored over 50 publications in these areas.

Dr. Atsushi Okuno, Green Planets CO.,LTD, Japan

Atsushi Okuno obtained master degrees in Kansai University with Plastic materials such as

epoxy resin in Osaka,Japan on 1969. Assistant professor in Kansai University. He joined

SANYU REC CO.,LTD in 1959. He developed electronic insulating materials, such as

semiconductor, transformation, LED, and capacitor. He is senior member of IEEE in 1995. He

received the best paper at ISEPT with IC Packaging. He has been R&D Center Executive

director in Fudan University. He received the best paper at ISPET with LED Packaging in

2003. He is Vice President in Japan LED Lighting association in 2004. He has been to CEO of

SANYU REC CO.,LTD in 2007. He has been R&D Center Executive Director in Tongji

University in 2009. Now, He is CEO of Green Planets CO.,LTD. His current research includes LED, Semiconductor,

insulating materials. He is vice president of Japan and China Friendship Association from 2015.

Dr. Boping Wu, HuaWei Central Research Institute, China

Boping Wu (S’04-M’10-SMIEEE’15) received the B.Eng. (Dean's Honor) from the City

University of Hong Kong in 2005, and the M.S. and Ph.D. from the University of Washington,

Seattle, in 2007 and 2010, respectively.

Presently, he is a Principal Researcher at HuaWei Central Research Institute. Prior to that,

he is a System Architect at Intel Corporation, working on various SoC core products and different high speed interfaces. He has extensive industry experiences of technology

development including 2004 at Philips (now NXP) and 2007 at IBM T.J. Watson Center. In

2008-09, he was a Lecturer at the University of Washington, teaching Microwave Engineering

5

and Computation Electromagnetics. He has published 16 research articles in refereed journals, presented over 40

technical papers at international conferences, and awarded 4 US patents. His research interests include signal

integrity, power delivery, 3D packaging, heterogeneous integration, microelectronics modeling, simulation and

characterization.

Dr. Rong Sun, Shenzhen Institutes of Advanced Technology, Chinese

Academy of Sciences, China

Dr. Rong Sun joined Shenzhen Institutes of Advanced Technology，Chinese Academy of

Sciences (SIAT, CAS), in 2006. Due to her outstanding performance and contribution, she was

appointed as deputy director of Shenzhen Institute of Advanced Integration Technology, one of

the branch institutes of SIAT. She also acts as the executive director of Center for Advanced

Materials, which is part of National Engineering Laboratory for Packaging Technology of

High-Density Integrated Circuit. As a renowned researcher in electronic materials area, her

current research interest focuses on advanced electronic packaging materials, embedded

electronic components, controllable nano-particles, phase-change materials, energy storage

materials, etc. Dr. Sun has been involved in more than 40 national or provincial major research programs as principle

investigator or core member, which include 02 Special National Grand Science-Technology Project of China,

Natural Science Foundation of China, Technology Development Project granted by the Department of Science and

Technology of Guangdong province, Major Project for Basic Research and Industry Development granted by

Shenzhen City, etc. Up to now, Dr. Sun has published one scientific monograph and more than 120 articles in the

international academic journals, with 50 patents applied for. As a reward for her profound work, Dr. Sun is

authorized for special government allowance granted by the State Council of China, and also elected as member of

Shenzhen Double-hundred Plan, which is an exceptional honor for those who have great contribution to Shenzhen

development.

Chee-Hiong Chew, ON Semiconductor, Malaysia

Chee-Hiong Chew received Bachelor of Engineering degree with 1st Class Honors from

University of Technology, Malaysia and best final year engineering student award from IEM

in 1989. He received MBA from Herriot Watts University in 1998. Currently, he is Senior

Director of Package Development for ON Semiconductor Malaysia, Vietnam, China and small

team in Munich.

He started his career as a development engineer with Motorola Semiconductor Sector. He is

pioneer to establish the packaging design group in Motorola Seremban in 1995. In 1997, He

was awarded Motorola Privileged Scientific and Technology Society Engineering Award for

his leadership and Motorola Six Sigma Black Belt award. To date, he owns 15 patents.He started few new innovative

platforms for ON Semiconductor like panel platform PIM, Wafer Level Micro Packaging and LLGA technology.

In early 2002, he has been working closely with Professor Seeta to startup CPMT chapter in Malaysia. He is

CPMT Chair for Malaysia Chapter for the year 2005 and 2006. He startup 1st IEMT conference in Malaysia with

industry colleagues and support from CPMT Santa Clara in 2006. He continues serve as key committee/ advisor for

EMAP, IMPACT and IEMT conferences. He also participates in strategic discussion to growth Malaysia R&D

organized by Ministry of Science and Technology Malaysia and university collaboration programs.

6

ORAL SESSIONS Note: Only the affiliation information of the first author is provided due to the space constraints.

Session 1: Advanced Packaging

Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room A Chair Jintang Shang

Keynote-01 8:30-8:55 Advanced Memory Fabrication Technology Based on 3D FOWLP

Yuan Lu Institute of Microelectronics, Chinese Academy of Sciences, China

043 8:55-9:15

A Study on a Simplified Liquid Cooling System

with a Pump Serving as Cold Plate Falong Liu, Bin Duan, Xingjian Yu, Ruikang Wu and Xiaobing Luo Huazhong University of Science and Technology , China

072 9:15-9:35 Package & Board Level Reliability Study of

0.35mm Fine Pitch Wafer Level Package

Peng Sun, Jun Liu, Cheng Xu and Liqiang Cao

The National Center for Advanced Packaging, China

098 9:35-09:55 Formation mechanism and reliability of Cu6Sn5

textures formed in-between liquid Sn and

(111)/(001) Cu single crystals

Shun Yao, Zhihao Zhang, Huijun Cao, Xuelin Wang

and Shihua Yang

Xiamen University, China

Session2: Packaging Materials & Processes

Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room B Chair Rong Sun

Keynote-02 8:30-8:55 Electronics manufacture for harsh, severe and extreme environments: materials, processes and interfacial behaviour

Changqing Liu Loughborough University, UK

011 8:55-9:15

Pb-free silver pastes with SnO-B2O3 glass frits for

crystalline silicon solar cells

Jiachu Jiang, Changli Li, Yue He, Jinquan Wei and

Liangliang Li

Tsinghua University, China

016 9:15-9:35

Effect of Thermal Cycling on Tensile Behaviour of

SAC305 Solder

Xu Long, Yao Yao, Yanpei Wu, Weijuan Xia and

Lianfeng Ren

Northwestern Polytechnical University, China

102 9:35-09:55

Metallization of diamond/Al composite surface

with Ni-P coating

Qi-Yuan Shi, Di Wu, Ding-rui Ni, Dong Wang, and

Zhi-Quan Liu

Institute of Metal Research, Chinese Academy of

Sciences, China

7

Session 3: Packaging Materials & Processes Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room C Chair Qian Wang

Keynote-03 8:30-8:55 Electrodeposition of nanotwinned copper film as under bump metallization

Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China

146 8:55-9:15 Microstructure and Intermetallic Compounds in Sn-3Ag-3Bi-3In solder joints on Cu Matrix Peng Li, Jing Han, Yan Wang, Fu Guo, Limin Ma and Yishu Wang Beijing University of Technology, China

153 9:15-9:35 Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites Yun Huang, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

156 9:35-09:55 The evaluation of mechanical properties of Sn58BiXTi solder by tensile test Shiqi Zhou, Xiangdong Liu, Omid Mokhtari and Hiroshi Nishikawa Osaka University, Japan

Session 4: Interconnect technologies Date Friday, August 13, 2017 Time 8:30 AM~09:55 AM Venue Room D Chair Hua Lu

Keynote-04 8:30-8:55 Room-Temperature Wafer Direct Bonding Using a One-Step Fluorinated Plasma Surface Activation

Chenxi Wang

Harbin Institute of Technology, China

116 8:55-9:15 Research of Via about Signal integrity Facing Complete Transmission Path Genxin Huang, Chunyue Huang, Lishuai Han, Rui Yin, Tianming Li, Ying Liang and Liangkun Lu Guilin University of Electronic Technology, China

273 9:15-9:35 Rapid Formation of Intermetallic Joints with Sn/Metal Composite Alloys by Ultrasonic-assisted Soldering for High-temperature Chip Attachment Shu Ma, Hongjun Ji and Junbo Zhou Harbin Institute of Technology (Shenzhen), China

225 9:35-09:55 Simulation of the temperature field for bonding IGBT chip and DBC substrate using Al/Ni self-propagating foil Yuyan Xiang, Fengshun Wu, Zheng Zhou, Liping Mo and Hui Liu Huazhong University of Science and Technology, China

8

Session 5: Quality & Reliability Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room E Chair Paul Wang

Keynote-05 8:30-8:55 Modelling the Impact of Conformal Coating Penetration on QFN Reliability

Chunyan Yin Greenwich University, UK

113 8:55-9:15 Microstructures and properties of Bi-11Ag solder doped with small amounts of Sn D. Li and Limeng Yin Chongqing University of Science and Technology, China

123 9:15-9:35 The Effect of Voids at the Cu3Sn/Cu Interface on the Failure Behavior of the Cu/Sn63Pb37 Solder Joints under High-speed Shear Loading Qi Lin, Li Hailong and Wang Chunqing Beijing Institute of Space Mechanics & Electricity, China

203 9:35-09:55 Study on the Factors which Affecting the Conductive Anodic Filament Reliability for Packing Substrate Chaohui Hu China Electronic Product Reliability and Environmental Testing Research Institute, China

Session 6: Solid State Lighting Packaging Integration Date Friday, August 13, 2017 Time 8:30 AM~09:55 AM Venue Room F Chair Lei Liu

Keynote-06 8:30-8:55 Unique Packaging Technology of High Bright Blue LED, UV LED and Micro LED Using VPES (Vacuum Printing Systems)

Asushi Okuno Green Planets Co. Ltd., Japan

018 8:55-9:15 White light-emitting diodes with enhanced luminous efficiency and high color rendering using separated quantum dots@silica/phosphor structure Bin Xie, Yanhua Cheng, Xingjian Yu, Weicheng Shu, Xiaobing Luo, Junjie Hao and Kai Wang Huazhong University of Science and Technology, China

266 9:15-9:35 Effect of Chips Surface Morphology on Optical Performance of Remote and Conformal Phosphor-converted Light-emitting Diodes Jiasheng Li, Caiman Yan, Dong Yuan, Zongtao Li, Binhai Yu and Yong Tang South China University of Technology, China

169 9:35-09:55 The degradation behaviors of white LEDs under highly accelerated stress testing (HAST) Bing Yan, Dongdong Teng, Lilin Liu and Gang Wang Sun Vat-sen University,China

9

Session 7: High-speed & High-frequency and Microwave and Power Electronics Packaging Date Friday, August 18, 2017 Time 8:30 AM~09:55 AM Venue Room G Chairs CH. Chew

Keynote-07 8:30-8:55 5G Millimeter Wave and EMC Technology Development of Advanced Packaging

Boping Wu HuaWei Central Research Institute, China

044 8:55-9:15 Antenna-on-Package on Low-Cost Organic Substrate for 60 GHz Wireless Communication Applications Chen Chao Wang ASE Group, China

299 9:15-9:35 Effect of Cryogenic Treatment on Mechanical Properties and Microstructure of Solder Joint Li Xiao and Yao Yao Northwestern Polytechnical University, China

070 9:35-09:55 Simulations on the Effective Thermal Dissipation of the Microchannel Heat Sink with Different Pin Fins Zhiyu Jin, Yunna Sun, Jiangbo Luo and Guifu Ding Shanghai Jiao Tong University, China

Session 8: Advanced Packaging Date Friday, August 18, 2017 Time 8:30 AM~10:00 AM Venue Room A Chairs Yunhui Mei

293 10:50-11:10 The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermo-mechanical property Yuan Gao, Pengli Zhu, Gang Li, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology,

Chinese Academy of Sciences

107 11:10-11:30 Compact and high density integrated design with

high isolation for S-band up-conversion system

Zhaorong Li and Liming Lv

Institute of Electronic Engineering ， China

Academy of Engineering Physics, China

134 11:30-11:50 Study of Wafer Warpage Evolution by Cooling to Extremely Low Temperatures Gong Cheng, Wei Gai, Gaowei Xu and Le Luo Shanghai Institute of Microsystem and Information Tehnology, Chinese Academy of Sciences , China

154 11:50-12:10 Effect of Annealling Processon Microstructure of Cu-TSV Zeliang Li, Limin Ma, Xuewei Zhao, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology,China

10

Session 9: Packaging Materials & Processes Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room B Chairs Changqing Liu

Keynote-08 10:50-11:15 Advanced Electronic Packaging Materials –Research

and Application

Rong Sun

Shenzhen Institutes of Advanced Technology, Chinese

Academy of Sciences, China

020 11:15-11:35 The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu Xi Niu and Kwang-Lung Lin Department of Automobile Engineering, Chongqing Vocational College of Public Transportation, China

045 11:35-11:55 Micromechanical modeling of the cyclic behavior of Sn-0.7Cu solder based on micromechanical polycrystalline approach Lu Liu and Yao Yao Northwestern Polytechnical University, China

103 11:55-12:15 Investigation on the melting and tensile properties of Bi-containing SAC105 lead-free solder alloys Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China

Session 10: Packaging Materials & Processes Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room C Chairs Zhi-Quan Liu

159 10:50-11:10 Study of the growth behavior of prism-type Cu6Sn5 in the liquid solder Shuo Zhang, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China

168 11:10-11:30 A rate-dependent constitutive model considering effects of temperature cycles for lead-free solders Kaimin Wang, Bingjie Chen and Yao Yao Northwestern Polytechnical University , China

177 11:30-11:50 The effect of conductive filler on the properties of electrically conductive adhesives(ECAs) Jian Hao, Dapeng Wang, Saipeng Li, Xinyue He, Jian Zhou and Feng Xue School of Materials Science and Engineering, Southeast University, China

187 11:50-12:10 Hermeticity Test of Low-Melting Point Sealing Glass and Analysis of Encapsulation Failure Rui Tian, Yi Li, Luqiao Yin and Jianhua Zhang Shanghai University, China

11

Session 11: Packaging materials & Processes

Quality & Reliability Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room D Chairs Liangliang Li

280 10:50-11:10 Electro-deposition of Co-Ni sulfide nanosheet arrays on nickel foam and investigation of the pseudocapacitive performance Chao Wang, Yanbin Shen, Zijie Song, Xiaodong Zhu, Shuhui Yu, Rong Sun and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

322 11:10-11:30 The investigation of interface effect on the properties of nanosilica-based underfill Tianhao Lu, Peng Zheng, Yuanrong Cheng, Zhuo Li and Pengli Zhu Fudan University,China

348 11:30-11:50 Size effect of Sn3.0Ag0.5Cu solder joint on intermetallic layer growth Shaobin Wang and Yao Yao School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, China

149 11:50-12:10 Inhomogeneous Evolution of Microscopic Structure and Crystal Orientation in Sn3Ag0.5Cu under Tensile Stress Yuhan Qian, Jing Han, Limin Ma, Yishu Wang and Fu Guo The College of Materials Science and Engineering, Beijing University of Technology, China

Session 12: Quality & Reliability Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room E Chairs Chunyan Yin

127 10:50-11:10 Finite-Element Calculations of Elastic Fields within Flip-chip Solder Bumps and Cu-Pillar Bumps under the Influences of Thermal Stresses and Joule Heating Peng Zhou, Baojie Zhao, Yubao Zhen, Shuo Liu, Yuehua Hu and Jiayu Li Harbin Institiute of Technology, China

142 11:10-11:30 Finite element analysis of micro - scale CSP solder joint in 3D packaging under random vibratio Li-Shuai Han, Chun-Yue Huang, Rui Yin, Gen-Xin Huang, Ying Liang, Tian-Ming Li and Wei He GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY , China

224 11:30-11:50 Reliability Analysis of Smartwatch Using Xiaomi Mi Band 2 as a Case Yuk Ngang Zita Yip, Zhu Ze and Yan Cheong Chan City University of Hong Kong, China

320 11:50-12:10 Failure analysis of wire bonding EOS with FEM Xin Tao, Yuanhong Zeng, Jun Wang and Xiaojing Wu Fudan University, China

12

Session 13: Advanced Manufacturing Technologies and Packaging Equipment Solid State Lighting Packaging & Integration High-speed & High-frequency Microwave and Power Electronics Packaging Date Friday, August 18, 2017 Time 10:50 AM~12:10 AM Venue Room F Chairs Fei Xiao

094 10:50-11:10 A Rapid PID Control Method for High-speed Macro-micro Composite Positioning Stage Yutao Tan, Jian Gao, Langyu Zhang, Yongjun Jiang, Hui Tang and Yunbo He Guangdong University of Technology, China

199 11:10-11:30 Recognition and classification of ultrasonic aluminum wire joint based on image morphology and C-SVM Wang Rui, Long Zhili and Zhou Xing Harbin Institute of Technology Shenzhen Graduate School, China

088 11:30-11:50 Effect of the substrate temperature on the phosphor sedimentation of phosphor-converted LEDs Weicheng Shu, Xingjian Yu, Run Hu, Qi Chen, Yupu Ma and Xiaobing Luo Huazhong University of Science and Technology, China

360 11:50-12:10 Rapid Fabrication of Joints Using Low Temperature Sintered Silver Nanoparticles Fan Yang, Mingyu Li and Shihua Yang Harbin Institute of Technology Shenzhen Graduate School

Session 14: Emerging Technologies Date Friday, August 18, 2017 Time 10:50 AM~12:15 AM Venue Room G Chairs Boping Wu

Keynote-9 10:50-11:15 Innovation in Power Integrated Modules CH. Chew Package Development for ON Semiconductor, Malaysia

075 11:15-11:35 Design and Analysis of Minichannels Heat Sinks with Indented Fins under Impingement Flow Condition Yang Sui, Hengyun Zhang, Peichao Li and Tingyu Lin Shanghai Univ. of Engineering Sci., China

065 11:35-11:55 Design and Simulation of a 2.4GHz bandpass filter on silicon substrate Ge Sima, Wenhua Hu, Jian Xu and Peng Sun The National Center for Advanced Packaging, China

209 11:55-12:15 Electro-thermal Modelling of Multichip Power Modules for High Power Converter Application Mohammad Shahjalal, Hua Lu and Chris Bailey University of Greenwich, UK

13

Session 15: Advanced Packaging & Interconnect technologies Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room A Chairs Hu He

250 13:30-13:50 A low cost method to synthesize silver nanoparticles for the screen printing conductive inks Wang Zhuang, Zhao Tao and Liang Xianwen Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

326 13:50-14:10 Integrated Process for High Aspect Ratio Through Glass Vias Kai Xue, Feng Jiang, Heng Wu, Xue Fei Ming and Xiu Feng Zhou Gmax, USA

128 14:10-14:30 Flexibale connection for Reflow Free Super Fine Pitch SMT Components Xiaosong Ma, Yongfa Cheng and Feiyang Liu Guilin University of Electronic Technology, China

230 14:30-14:50 Analysis of Wideband Multilayer LTCC Vertical Via Transition for Millimeter-wave System-in-package Zhipeng Li, Ping Wang, Rong Zeng and Wei Zhong Institute of Electronic Engineering, China Academy of Engineering Physics, China

Session 16: Packaging Materials & Processes Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room B Chairs Daoguo Yang

47 13:30-13:50 Impact of Substrate Surface Condition and Epoxy Mixture Properties on the Overflow/Incomplete Flow Xun Lou, Li Yang, Rui Zhu, Huan Wu, Lei Chen, Wenfeng Zhang, Chong Jia, Hwai Peng Yeoh and Junhong Xu Center for Joining and Electronic Packaging,School of Materials Science and Engineering, State Key Laboratory of Materials Processing and Die&Mould Technology Huazhong University of Science and Technology, China

51 13:50-14:10 Silver Nanoparticle deposited Boron Nitride Nanosheet/Nanofrbrillated Cellulose Composites with Enhanced Thermal Conductivity Jiajia Sun, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

87 14:10-14:30 Silica Doped Quantum Dots Film with Enhanced Light Conversion Efficiency for White Light Emitting Diodes Yanhua Cheng, Bin Xie, Yupu Ma, Weicheng Shu and Xiaobing Luo Huazhong University of Science and Technology, China

104 14:30-14:50 Effect of reflux time and aging treatment on the interfacial reaction of SnAgCuSbBiNi/Cu solder joint Zhi-Quan Liu Institute of Metal Research, Chinese Academy of Sciences, China

14

Session 17: Packaging Materials & Processes Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room C Chairs Dongyan Ding

167 13:30-13:50

Study of EM and TM of Sn0.3Ag0.7Cu solder joints

under high current stress and thermal gradient Zhijie Sun, Limin Ma, Yishu Wang, Fu Guo, Jing Han and Yong Zuo The College of Materials Science and Engineering, Beijing University of Technology, China

189 13:50-14:10 Highly Sensitive Flexible Pressure Sensor Based on Microstructured PDMS For Wearable Electronics Application Yuan Zhang, Yougen Hu, Tao Zhao, Pengli Zhu, Rong Sun and Chingping Wong Shenzhen Institutes of Advanced Technology, China

222 14:10-14:30 Effects of POSS on the interfacial reactions between Sn-3.5Ag solders and Cu substrates during soldering Xue Wang, Jing Han, Fu Guo, Limin Ma and Yishu WangInstitute of Microelectronics of Chinese Academy of Sciences, Beijing, China

265 14:30-14:50 Research on SnSbNi solder joints between light emitting diode chip and heat sink Wei Liu and Man Zhang PKUSZ, China

Session 18: Emerging Technologies Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room D Chairs Ran He

288 13:30-13:50 All-printed Paper Based Supercapacitors Lu Shi, Yang Wang, Wenhui Lai, Zhi Jiang, Ronghe Wang and Cheng Yang Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, China

180 13:50-14:10 Microstructure and properties of AlCrFeNi intermetallic based alloy Mingxing Ren and Guotian Wang Harbin Institute of Technology, China

234 14:10-14:30 Fabrication and optical properties of CuInS2 quantum dots Zhe Wang, Jie Wang, Zhihao He, Te Wang, Ronggang Liu, Jinfeng Ma, Peng Zhang and Yujie Li Harbin Institute of Technology at Weihai, China

89 14:30-14:50

Design of a hydro-dynamically levitated centrifugal micro-pump for the active liquid cooling system Ruikang Wu, Bin Duan, Falong Liu, Han Wu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China

15

Session 19: Quality & Reliability Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room E Chairs Hongjun Ji

232 13:30-13:50 Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu and Changqing Liu Huazhong University of Science and Technology, China

301 13:50-14:10 DDR4 Dual-Contact Interconnect Methodology, Component, and Board Level Reliability Paul Wang and David He Mitac International Inc.Taiwan, China

335 14:10-14:30 Thermal effect on material properties of sintered porous silver during high temperature ageing Chanyang Choe, Seungjun Noh, Chuantong Chen, Toshiyuki Ishina, Shijo Nagao and Katsuaki Suganuma Institute of Scientific and Industrial Research, Osaka University, Japan

364 14:30-14:50 Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing Chongyang Cai, Rong An, Chunqing Wang and Yanhong Tian Harbin Institute of Technology, China

Session 20: Packaging Design and Modeling Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room F Chairs Hongtao Chen

186 13:30-13:50 Investigation of Design and Material Optimization on High bandwidth Package on Package Ian Hu, Wei-Hong Lai and Ming-Han Wang Key Laboratory of MEMS of Ministry of Education, Advanced Semiconductor Engineering,Taiwan, China

155 13:50-14:10 Channel Concatenated Coding Transmission Scheme for TSV Array Transmission Xiaoyang Duan, Zhensong Li, Tianfang Chen, Min Miao and Yuexia Zhang Beijing Information Science and Technology University, Information Microsystem Institute, China

253 14:10-14:30 Electromigration simulation of flip chip CSP LED Rui Ma, Fei Qin, Jiajie Fan, Xuejun Fan and Cheng Qian Beijing University of Technology, China

260 14:30-14:50 System Level Mechanical Shock Reliability of BGA Packages: Experimental and Numerical Analysis Jianghai Gu, Weidong Xie, Cherif Guirguis, Mudasir Ahmad and Yaoyu Pang Cisco system, USA

16

Session 21: Packaging Design and Modeling Date Friday, August 18, 2017 Time 13:30~ 14:50 Venue Room G Chairs Chunjin Hang

86 13:30-13:50 A comparative study of phosphor scattering model for phosphor-converted light-emitting diodes Yupu Ma, Yanhua Cheng, Weicheng Shu, Falong Liu, Run Hu and Xiaobing Luo Huazhong University of Science and Technology, China

172 13:50-14:10 Fully-Coupled Electromigration Simulation of Sweat Structure Yiming Jiang, Hailong Li, Yunhui Mei and Xin Li Tianjin University, China

302 14:10-14:30 Void risk prediction for molded underfill technology on flip chip packages Cheng Xu, Jun Liu, Jian Xu, Peng Sun, Chih-Chung Hsu and Chao-Tsai Huang National Center for Advanced Packaging Co.,Ltd., China

201 14:30-14:50 Fine Tuning Development Software for High Precision and Multi-Axis Motion Control System Zhiping Zeng, Yunbo He, Yongshan Hu, Xin Chen, Jian Gao, Zhijun Yang, Yun Chen, Kai Zhang, Hui Tang and Xun Chen Guangdong University of Technology, China

Session 22: Interconnect technologies Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room A Chairs Yuan Lu

SP1 15:50-16:10 High Density, Ultra-thin/Small Packaging Tetsukazu Sugiya Disco Corporation, Japan

66 16:10-16:30 Etching Process Development for 3D Wafer Level Via Last TSV Package Yulong Ren, Geng Fei, Peng Sun, Yanan Sun and Ge Sima National Center for Advanced Packaging (NCAP China), China

192 16:30-16:50 Cu/Adhesive Hybrid Bonding Through a Cu-first

Bonding Approach by Using H-containing HCOOH

Vapor Surface Treatment

Ran He, Masahisa Fujino, Masatake Akaike, Taiji

Sakai, Seiki Sakuyama and Tadatomo Suga

The University of Tokyo, Japan

278 16:50-17:10 Low Temperature Sintering of Nanosilver Paste for

Super-Large-Area Substrate Bonding

Han-Ning Jiang, Xin Li and Yun-Hui Mei

Tianjin University, China

17

Session 23: Packaging Materials & Processes Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room B Chairs Wei Liu

92 15:50-16:10

Hierarchically Interconnected Epoxy/BN-SCMC

Polymer Composites with Enhanced Thermal

Conductivity

Jiantao Hu, Xiaoliang Zeng, Rong Sun, Jian-Bin Xu

and Ching-Ping Wong

Shenzhen Institutes of Advanced Technology,

Chinese Academy of Sciences, China

93 16:10-16:30

Effects of aging temperature on fatigue life of

Sn-3.0Ag-0.5Cu solder joints

Jundong Wang and Yao Yao

Northwestern Polytechnical University, China

99 16:30-16:50 Polyurethane-Based flexible conductive adhesives Ma Hongru, Yan Shaocun, Li Zhe, Tian Xun, Ma Lei and Ma Yanqing Shihezi university, China

140 16:50-17:10 Solvent effect on pressureless and

low-temperature sintering of Ag paste for

die-attachment in high-power devices

Hao Zhang, Chuantong Chen, Jingting Jiu and

Katsuaki Suganuma

Osaka University, Japan

Session 24: Packaging Materials & Processes Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room C Chairs Rong An

197 15:50-16:10 A Facile Route to Prepare Metal Nanostructure Applied in SERS Active Substrate Qionglin Ouyang, Gang Li and Pengli Zhu Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

231 16:10-16:30 Study on Slip Behavior of lead-free Solder Joints under Uniaxial Stress Gaqiang Dong and Limin Ma Beijing University of Technology, China

276 16:30-16:50 Improved permittivity and breakdown strength of PVDF composites filled with TiO2-SrTiO3 hybrids Xiaodong Zhu, Suibin Luo, Shanjun Ding, Chao Wang, Zijie Song, Shuhui Yu, Rong Sun and Ching-Ping Wong Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China

282 16:50-17:10 Corrosion process study of Zn-30Sn

high-temperature lead-free solder

Zhenghong Wang, Gong Zhang, Chuantong Chen

and Katsuaki Suganuma

Tsinghua University, China

18

Session 25: Emerging Technologies Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room D Chairs Wenhua Yang

330 15:50-16:10 Conductivity of Silver and Copper Film Printed by Particle-free Reactive Inks Hongbo Xu, Xingming Tang, Hailin Sun, Hongyun Zhao and Mingyu Li Harbin Institute of Technology, China

233 16:10-16:30

Easy-disassembly bonding of PDMS used for

leak-tight encapsulation of microfluidic devices

Jie Wang, Shijie Wang, Peng Zhang and Yujie Li

Harbin Institute of Technology at Weihai, China

297 16:30-16:50

CNT-Graphene Heterostructures: First-Principle

Study of Electrical and Thermal Conductions

Wei Yan, Guoyuan Li, Bin Li, Changjian Zhou,

Ren-Yu Tian, Xiao-Bao Yang and Cary Y Yang

South China University of Technology, China

151 16:50-17:10 Study on the Influence of LED PN Junction Area on

Modulation Bandwidth in Visible Light

Communication

Lilin Liu, Zheng Zhou and Gang Wang

Sun Yat-sen University, China

Session 26: Quality & Reliability Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room E Chairs Fengwen Mu

275 15:50-16:10 The Mechanism Study of Low-Temperature Brittle Fracture of Bulk Sn-Based Solder Qi An, Chunqing Wang, Hong Wang and Xiangxi Zhao Harbin Institute of Technology, China

258 16:10-16:30

On-line monitoring flip LED chip performance

degradation and failure analysis

Lin Zhou

Research Institute Of Tsinghua University In

Shenzhen, China

100 16:30-16:50 COB 3wheel Reliability Simulation Method

Development

Jianfei Long, Haomin Bao, Yonghua Zhou and

Jonghyun Chae

Samsung Semiconductor (China) R&D CO.,LTD ,

China

179 16:50-17:10 The stress strain analysis under the reverse load

of the embedded baseplate micro-scale grid array

welder

Rui Yin, Chun-Yue Huang, Gen-Xin Huang, Li-Shuai

Han, Jian-Pei Wang, Ying Liang and Tian-Ming Li

School of Electro-Mechanical Engineering, Guilin

University of Electronic Technology, China

19

Session 27: Packaging Design and Modeling Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room F Chairs Yujie Li

81 15:50-16:10 Solderablity Degradation of Electrodeposited Tin Finishes Jing Wang, Guang Chen, Henry Forbes, Katerina Christopoulos, and Changqing Liu Loughbouough University, UK

109 16:10-16:30 Fatigue life assessment of electronic components under vibration using displacement as a response metric Vinay Kumar, Prashant Tripathi and Wayne Sozansky DELPHI Electronics & Safety, USA

213 16:30-16:50 The influence of heat transfer boundary

conditions on the fusion zone size of Sn solder

under localized and rapid heat source

Zheng Zhou, Anna Zhang, Hui Liu, Liping Mo and Fengshun Wu Huazhong University of Science & Technology, China

96 16:50-17:10 Thermal-Stress Co-Simulation of a Ka-band

Millimeter-wave T/R System in Package

Gang Xu, Wei Zhong and Rong Zen

Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, China

Session 28: Packaging Design and Modeling Date Friday, August 18, 2017 Time 15:50~17:10 Venue Room G Chairs Chenxi Wang

90 15:50-16:10 Structural design of LED packaging in terms of lumen reliability by a statistical method Qi Chen, Bofeng Shang, Weicheng Shu, Yanhua Cheng and Xiaobing Luo Huazhong University of Science and Technology, China

36 16:10-16:30

Modeling and fabrication of the Redistribution

Layer on the 2.5D Si interposer Yunna Sun, Zhiyu Jin, Jiangbo Luo, Jian Li, Yating Sun, Yan Wang and Guifu Ding Shanghai Jiao Tong University, China

175 16:30-16:50 On reproducing the copper extrusion of through-silicon-via from the atomic scale Jinxin Liu, Zhiheng Huang, Paul Conway, Frank Altmann, Matthias Petzold and Falk Naumann Sun Yat-sen University, China

256 16:50-17:10 A Hybrid Genetic Algorithm for Automatic

Layout Design of Power Module

Baisen Hao, Yunhui Mei and Puqi Ning

Tianjin University, China

20