Ordering number: EP35E - Digchipapplication-notes.digchip.com/068/68-40511.pdf · STK762-921G (IGBT, rated output: 80A) STK623-400 (IGBT, rated output: 20A) External appearance Internal

Ordering number: EP35E

Combining Power and Control, Sanyo Inverter Power IC Enables Easy Realization of Power Saving for Equipment

CONTENTS

To what extent can electrical equipment become environ-mentally friendly? One of the answers is power-saving and low-consumption power technology. Inverter technology realizes fine control of the revolving speed and power sav-ing for motors widely used for applications ranging from consumer appliances such as air conditioners, refrigera-tors, and washing machines, to FA equipment, robots, and other industrial equipment. The use of this technology requires solving of a number of issues such as complica-tion in circuit configuration, increases in mounting space and noise. Sanyo's inverter power ICs use an original insulated metal substrate technology (IMST) that mounts on an aluminum substrate power output elements such as IGBTs, MOSFETs, and bipolar transistors, ICs required for control, as well as passive devices with high-density mounting. Since all kinds of peripheral circuits such as protective circuits are also incorporated, solving the issues mentioned above, more compact design and higher reliability can also be achieved. From small power applications (3A) to large power applica-tions (50A), Sanyo's lineup of inverter power ICs, whose product grade has been further enhanced, realizes labor saving for system design together with power saving.

n Proposal for inverter control systems …………………………

n Three main technologies supporting Sanyo's inverter power ICs ……

n Development history …………………………………………

n Inverter circuit block diagram ………………………………

3

4

5

5

n Series lineup …………………………………………………

n IMST hybrid IC fabrication process …………………………

n Sample Sanyo inverter power IC products ………………

n Features of Sanyo inverter power ICs …………………

6

7

8--9

10--12

Energy Saving and high performance through inverter control

Washing machine

Air conditioner

Refrigerators

Washing machine

Air conditioner

Refrigerators

n Main specifications

•STK621-000 / STK611-000 Series ……………………

•STK650-000 / STK651-000 Series …………………………

•Active filter circuit characteristics improvement examples …

13--14

15

16

•STK762-000G Series ……………………………………

•STK623-000 Series ………………………………………

•STK630-000 Series ………………………………………

n Packages dimensions …………………………………

17

18

19

20--22

Cars

General-purpose inverter

NC machine tool

FA

Robots

Cars

General-purpose inverter

NC machine tool

FA

Robots

1. Proposal for Inverter Control Systems

SANYO Inverter Power IC

3

Demands for inverter control systems, which are used in various kinds of electrical equipment, are evolving as time passes. Sanyo has from early on responded to evolving market needs, proposing optimum sys-

tems. Sanyo offers the sophisticated-function, high-performance hybrid IC that first integrates an active filt-er and inverter in the industry realizing a high power ratio through harmonic control in a single package.

Inverter Step 1

Active filter + inverterStep 2

Active filter inverter integrationStep 3

Buffer

Motor

Reg.

NF

Microcontroller

Inverter

AC 50/60Hz100V

Rotation control

AC 50/60Hz85 to 240V Free

InverterActive filter

Buffer

MotorNF

Microcontroller

BufferReg.

Microcontroller


Active filter inverter integration

Buffer

MotorNF

Microcontroller

BufferReg.

Rotation control Input voltage free High power ratio Harmonic suppression

Rotation control Input voltage free High power ratio Harmonic suppression Sophisticated function

2. Three Main Technologies Supporting Sanyo's Inverter Power ICs


4

Sanyo's inverter power ICs are supported by three technologies: High-density substrate mounting technol-ogy through insulated metal substrate technology (IMST), design technology exploiting Sanyo's exten-

sive know-how acquired through the use of chips developed in house, and small package technology enabling easy embedding in equipment.

Sanyo IMST power ICs

Mountingtechnology

Sanyo IMST power ICs

Bare chip mountingAl wire bonding

Integrated mounting of power &control elements

High reliability

PackagetechnologyFull molding Compact design Fasten pins for connecting loadsOn-board mounting pins

Designtechnology Accumulated design know-how Dedicated CAD system Built-in protective circuits Use of chips developed by Sanyo


5

3. Development History

4. Block Diagram of Inverter Circuit

Sanyo developed and commercialized the inverter power IC STK65000 series in 1986, first proposing the "intelligent power module" concept in the industry, and

in 1989, successfully released the active filter power IC STK76000 Series.

1985 1990 1995 2000

STK65000MK2

STK65000MK3

STK762-000

STK76000

STK650-000 BJT

STK651-000 SIT

STK620-000 IGBT & 4 power supplies

STK621-000 IGBT & single power supply

STK621-010

STK611-000

Industry's

first

Industry's

first

Industry's

first

For PAM control

Small full molding package

Single control circuit power supply

ActivActive filter power IC

Inverter power IC er IC Inverter power IC

Active filter power IC

MotorNF

High-voltage interface block

Waveform generation / control block (CPU) Position detectionSpeed detection

Control power supply

Pre-drive power supply

Protective circuit block • Excessive temperature • Overvoltage • Overcurrent

Protective circuit block • Excessive temperature • Excessive saturation voltage • Overcurrent • Low supply voltage

Shunt resistor

Three-phase power drive block (for example IGBT)

Temperature detection

Temperature detection

Pre

-driv

e bl

ock

(6 c

ircui

ts)

Cont

rol/

pre-

drive

blo

ck

A

B

C

B+C

Inverter STK650-000 Series/STK651-000 Series

Inverter + high-voltage interface STK611-000 Series/STK621-000 Series

Active Filter STK762-000G Series

Inverter + Active Filter STK623-000 Series

Block Function Series Name


6

5. Series Lineup

Function TableInverter power IC

Series Name Circuit function Features Block

Protection functions

Excessivetemperature Overcurrent

Excessive saturation voltage

Low supply voltage

Page

STK621-000 IGBT inverter power IC

Single power supply drive possible Control signal insulation not required B 13 to 14


STK762-000GIGBT active filter power IC

Step-up voltage type average current controlPAM control enabled Harmonic regulation supported

C 17

Active filter & Inverter integration power IC

STK623-000Integrated active filter & inverter power IC

Compact and sophisticatedfunction

B + C 18

Triac power IC Series Name Circuit function Features

STK630-000 19Triac power IC Multichannel

STK611-000 MOSFET inverter power IC

Single power supply drive possible Control signal insulation not required B 13 to 14

STK650-000 BJT inverter power IC

Low loss A 15

STK651-000 SIT inverter power IC

Super low loss A 15

Series ConfigurationInverter power IC

Series Name3A 5A 10A 15A 20A 25A 30A 50A

Rated output current

STK621-000 full-molding small package

STK621-010[No.4176]

STK621-051[No.4176]

Under developmentSTK621-060[No.4176]


13 to 14

13 to 14

15

17

18

19


Series Name40A 80A


STK762-000GUnder developmentSTK762-921G[No.4182]

STK630-252[No.4185]

STK630-255A[No.4185]

STK630-260[No.4174]

STK630-261[No.4174]


STK762-721G[No.4182]

Active filter & Inverter integration power IC

Series Name20A


STK623-000Under developmentSTK623-400[No.4183]

Triac power IC

Series Name

Rated output current & circuit configuration

Page

STK630-000

Numbers between brackets ( [ ] ) indicate the package No. Refer to p. 20 to 22.

8A x 3 circuits1A x 3 circuits

10A x 2 circuits 8A x 2 circuits1A x 3 circuits

10A x 2 circuits1A x 3 circuits1A x 3 circuits

3A x 1 circuits1A x 4 circuitsPower supply block

STK651-000STK651-500[No.4183]

STK621-000 current package

STK621-220[No.4177]

STK621-320[No.4177]

STK621-400[No.4177]STK621-401[No.4179]

STK621-601[No.4179]

STK621-722[No.4184]

STK650-000

STK650-310[No.4178]

STK650-410[No.4180]STK650-430[No.4180]

STK650-510[No.4181]

STK650-610[No.4181]

STK611-000STK611-031[No.4173]

Page

Page

Page

Page

Series Name Circuit function Features Block



Excessivetemperature Overcurrent


Low supply voltage

Page

Series Name Circuit function Features Block Excessivetemperature Overcurrent


Low supply voltage

Page

13 to 14

15


7

6. IMST Hybrid IC Production Process

From output power elements to control LSI elements, semiconduc-tors are mounted as bare chips and connected using aluminum wire ultrasonic bond-ing. As a result, the number of solder joints is reduced for higher reliability, and the realization of small hybrid ICs through high-density mount-ing is enabled.

In the tests per-formed to check whether defects exist in the bonding performed during the fabrication process, oper-ation checks are done with the IMST substrate heated up to 100˚C (for standard type products). This allows the elimina-tion of early failures that occur in the assembly process.

A significant feature of the IMST hybrid IC fabrication process is that multiple sub-

strates are linked together and passed through the line in that

state. The substrates are separat-ed and pressed at a later

stage. This results in a highly efficient fabrication sys-

tem. This fabrication technique is original

to Sanyo and is made possible by

the unique char-acteristics of

IMST.

Circuit adjustment/operation check

Resin coating

Chip component attachment

Small-signal device die bonding

Power device die bonding

Thick-wire bonding

Fine-wire bonding

Lead frame attachment

Lead cutting

Small package Current packages

Substrate process

Assembly process

Inspection process

Lot number printing

Capacity and resistor attachment

Small-signal device chip attachment

Power device chip attachment

Power device chip wire bonding

Small-signal device chipwire bonding

Output pin attachment

Domino-shaped substrate

For bonding pads

Wiring pattern formation

Copper foil pressure bonding

Partial Ni plating

Copper foil etching

Characteristics screening

Label printing

Visual inspection

Packing

Completion

Hot plate check 1

Elevated temperature operation check 1

Hot plate check 2

Elevated temperature operation check 2

Substrate

Assembly

Test

Outer shape forming press

Open/short inspection

Baking formation of printed resistors

Resistor adjustment

Solder cream printing

Visual inspection

With case

Gel filling

Epoxy resin sealing

Full molding


8

Inverter power ICs (IGBT)

Inverter power IC (MOSFET)

7. Sample Sanyo Inverter Power IC Products

STK621-051 (Full molding package, IGBT, rated output: 10A)

External appearance Internal mounting substrate

STK621-320 (IGBT, rated output: 15A)


STK621-722 (IGBT, rated output: 50A)


STK611-031 (MOSFET, rated output: 3A)


Sample Sanyo Inverter Power IC Products


9

Inverter power IC (BJT)

Inverter power IC (SIT)

Active filter power IC (IGBT)

Integrated active filter & inverter power IC (IGBT)

STK650-310 (BJT, rated output: 15A)

STK651-500 (SIT, rated output: 20A)

STK762-921G (IGBT, rated output: 80A)

STK623-400 (IGBT, rated output: 20A) Internal mounting substrateExternal appearance



Internal mounting substrateExternal appearance

8. Features of Sanyo Inverter Power ICs


10

8.1 Hybrid IC obtained through the use of insulated metal substrate technology

The basic patent on IMST was selected as one of 53 superlative patents for the commemorative event by the Patent Office marking 100 years of Japan's industrial(intellectual)rights.

Sanyo inverter power ICs utilize a metallic base sub-strate made of aluminum (Al). Aluminum, which has excellent thermal conductance characteristics, effi-ciently dissipates the heat loss from power elements. IMST is a mounting technology that is ideally suited

for the power electronics of inverter drive circuits. For further information about Sanyo's insulated metal substrate technology (IMST), refer to Pamphlet No. EP50, "IMST High-Density Mounting Technology".

Ideal for high-density mounting

Bare chip mounting possible

High reliability

Noise suppression effect

Superior thermal radiation

Insulated Metal Substrate Technology

Component mounting board Shielding board Part of the package itself

Power transistorsMOSFETIGBTICs

Chip capacitors and resistors Electrolytic capacitorsOscillator elements Connectors

Copper foil wiring pattern

Insulating layer

Aluminum Plate

Aluminum wires Ni plating

Solder

Heat sink

Higher reliability is obtained by considerably reducing the number of solder joints.

The whole aluminum plate can be held at the ground potential by connecting it to ground, thus providing a shielding effect.

The good thermal conductance of aluminum results in superior thermal radiation.

Various kinds of semiconductor devices including power elements can be mounted as bare chips.

A broad range of elements from bare chips and chip components to connectors can be mounted on the same substrate.

Mounting of components of various types Bare chip mounting Crossover line

Ultrasonic joint

Role of the IMST substrate

Insulated Metal Substrate Technology

Various kinds of semiconductor devices including power elements can be mounted as bare chips.

Higher reliability is obtained by considerably reducing the number of solder joints.

The whole aluminum plate can be held at the ground potential by connecting it to ground, thus providing a shielding effect.

The good thermal conductance of aluminum results in superior thermal radiation.

A broad range of elements from bare chips and chip components to connectors can be mounted on the same substrate.


11

8.2 Built-in protective circuits

Various protective circuits, including thermal, overcur-rent, excessive saturation voltage, short, and low sup-ply voltage protection, as well as detection elements

(shunt resistors, etc.) are mounted in a package with high-density mounting, enabling the realization of high accuracy, high stability, and high reliability.

8.3 Built-in pre-drive circuits of optimized design

Pre-drive circuits of optimized design are employed for the power output elements that are used, eliminat-ing the necessity of redesign based on consideration

of matching. As a result, the design period for embed-ded systems is shortened.

8.4 Easy intertace

Output signals from photocouplers can be used as input signals of hybrid ICs without modification. Fur-thermore, the use of high-voltage elements has ena-bled the lineup of a series (STK621-000 Series) that

does not require primary and secondary insulation through photocouplers, etc., and direct input from the microcontroller enables fast response and system min-iaturization.

8.5 High reliability

Compared to PCB mounting of discrete components, IMST hybrid ICs, which employ bare chip mounting

and aluminum wire bonding, have fewer solder joints and therefore higher reliability.

8.6 Electromagnetic shielding

Since the base substrate is made of aluminum, the hybrid IC itself is shielded. This structure is effective for the control of self noise from inverter control cir-

cuits that perform large current switching. Further-more, a cutoff effect for external noise is also obtained.

8.7 Lineup of various power element mounting types

With regard to power elements for use in IMST hybrid ICs such as Sanyo inverter power ICs, optimum series

lineups are provided to suit each application and pur-pose.


12

8.8 Small packages

A new thin-type package series created through the use of full molding has been added to current double insulation structure IMST package. In addition to con-

tributing to the further miniaturization of equipment, it has become possible to achieve embedding in equip-ment, which had heretofore been difficult.

8.9 External output pin

The external pins are devised to support various mountings due to end products. For instance, for ele-ments directly mounted on a PCB, pin leads are

employed, and fasten pins or screw pins are employed for the direct connection of loads.

8.10 Reduced total parts count

Chip capacitor/resistor

IMST substrate

IMST substrate (Insulator)

Aluminum thick-wire bonding

Aluminum fine-wire bonding

Ni plating

Case

Output pin (signal system)Output pin (power system)

Ground bonding

Epoxy filler Epoxy coating

Conducting paste

Solder

Gel

SolderHeat sink

Power transistor (bare chip)

ICs, small-signal devices (bare chip)

Double insulation type current package (DIP)

Copper foil pattern

Insulating layer

Aluminum plate

packageFu

ll molding

Capacity

Mounting surface

Thickness

Small

40%

53%77

%

Merits of Full Molding Package

Output pin (power & signal systems)

Full molding package

Small full molding package (SIP)

Package Structure Comparison

IMST substrate

Epoxy coating

The inverter control circuit block is designed in the form of a hybrid IC as a single module, reducing the

total count of components required for the system.The inverter control circuit block is designed in the form of a hybrid IC as a single module, reducing the

total count of components required for the system.

9. Main Characteristics


13

9.1 Inverter power IC STK621-000/STK611-000 Series

[Features]n Integrates power elements, pre-driver, and protec-

tive circuitsnA single power supply drive is enabled through the

use of bootstrap circuits for upper power supplies (externally set)

nProtective circuits including overcurrent (bus line), excessive temperature, and pre-drive low voltage protection are built in.

n In addition to current packages, full molding packag-es are also available (STK621-010, STK621-051)

nDirect input of CMOS level control signals without an insulating circuit (photocoupler, etc.) is possible.

nBuilt-in simultaneous upper/lower ON prevention cir-cuit to prevent arm shorting through simultaneous ON input for the upper and lower side transistors. 　(Dead time is required for preventing shorting due to

switching delay.)

Unit Parameter Symbol STK621-010

Supply voltage 500 450 VVCC

Collector-emitter voltage 600 450 VVCE

Output current ±5 ±10 ±10 ±15 ±20 ±20 ±30 ±50 ±3 AIOOutput peak current ±10 ±15 ±20 ±30 ±40 ±40 ±60 ±100 ±9 AIOP

Pre-driver voltage 20 VVD

Operating temperature -20 to +100 -20 to +115 ˚CTC

Storage temperature -40 to +125 ˚CTstg

STK621-051 STK621-220 STK621-320 STK621-400 STK621-401 STK621-601 STK621-722 STK611-031

Type No.

Transistor saturation voltage

2.8(Io=3.5A)

3.0(Io=5A)

3.6(Io=10A)

3.6(Io=15A)

3.4(Io=20A)

3.3(Io=20A)

3.3(Io=30A)

3.3(Io=50A)

6.5(Io=1.5A) VVCE(sat)

Diode forward voltage3.0

(Io=-3.5A)2.5

(Io=-5A)2.7

(Io=-10A)2.7

(Io=-15A)2.7

(Io=-20A)2.5

(Io=-20A)2.5

(Io=-30A)2.5

(Io=-50A)2.0

(Io=-1.5A) VVF

Input ON voltage 1.5 VVIH

Input OFF voltage 3.5 VVIL

Switching time

1.0(Io=3.5A)

1.0(Io=5A)

1.0(Io=10A)

1.0(Io=10A)

1.0(Io=20A)

1.0(Io=20A)

1.0(Io=30A)

1.0(Io=50A)

1.0(Io=1.5A) Uton

1.0(Io=3.5A)

1.0(Io=5A)

1.0(Io=10A)

1.0(Io=10A)

1.0(Io=20A)

1.0(Io=20A)

1.0(Io=30A)

1.0(Io=50A)

1.0(Io=1.5A) Utoff

Excessive temperature protection temperature 100 to 120 115 to 135 ˚CTSD

Overcurrent protection current 10 to 15 10 to 15 15 to 22 22 to 32 32 to 44 32 to 44 48 to 62 70 to 90 _ AISD

Low voltage protection voltage 9 to 12 VUVSD

Package dimensions No.4176 No.4177 No.4179 No.4184 No.4173

The data in parentheses indicates the measurement condition.

_

Power element type IGBT _MOSFET

[Main Characteristics] Tc=25˚C

[Comparison of application circuits of STK621-000 Series and STK650-000 Series]

Photocoupler

Photocoupler

Photocoupler

Photocoupler

Photocoupler

Photocoupler

Motor

Con

trol

blo

ck

Motor

0 6

1Number of control power supplies

System

Number of photocouplers

Application circuit example

4

Non-insulated system Insulated system

STK621-000 Series STK650-000 Series

ST

K62

1-00

0 S

erie

s

ST

K65

0-00

0 S

erie

s

Power supply

Pow

er s

uppl

y

Power supply

5V

Power supply

5V

Con

trol

blo

ck


14

[Equivalent Circuit Diagram]

-

+

VB1U

VB2V

VB3W

HIN1HIN2HIN3

LIN1LIN2LIN3

Shunt-Resistor

VBSU.V.

VBSU.V.

VBSU.V.

LevelShifter

Latch Reset (All Input = High)Overcurrent Over-Temp.

VDD-UnderVoltage

Logic Logic Logic

LevelShifter

LevelShifter

FAULTISO

VDD

VSS

-

+

VB1U

VB2V

VB3W

HIN1HIN2HIN3

LIN1LIN2LIN3

VBSU.V.

VBSU.V.

VBSU.V.

LevelShifter

LatchOver-Temp.

VDD-UnderVoltage

Logic Logic Logic

LevelShifter

LevelShifter

FAULT

VDD

VSS

Reset (All Input = High)



[Sample Application Circuit]

CI

CS

VCC+

-

CB

DB

CB

DB

CB

RB

DB

STK621-000 Series

CD

VD4

Motor

Control Logic(+5V)

CI

CS

VCC+

-

CB

DB

CB

DB

CB

RB

DB

STK611-000 Series

CD

VD4

Motor

Control Logic(+5V)


15

9.2 Inverter power IC STK650-000/STK651-000 Series

[Features]n Integrates power elements, pre-driver, and protec-

tive circuits nEmploys low-saturation bipolar transistors for the

power output stage to realize low loss (STK650-000 Series). Moreover, products further realizing ultra-low loss are also available through the use of the SIT process (STK651-000 Series).

nProtective circuits including overcurrent (bus line),

excessive temperature, and excessive saturation voltage protection are built in.

nLoads are easily connected thanks to the use of fasten pins for the power system output pins.

nControl signals can be supported at the logic level through the use of photocouplers.

nSeries offering pin compatibility from 15A to 30A. The power capacitance can be changed by simply replac-ing hybrid ICs, enabling standardized set design.


Unit Parameter Symbol

Supply voltage 450400 VVCC

Output current 20 AIOOutput peak current 40 AIOP

Pre-drive voltage 5.5 to 8.0 7.5 to 10.0 5.5 to 8.0 VVD1 to VD4Operating temperature -30 to +100 ˚CTC

Storage temperature -40 to +125 ˚CTstg

STK651-500

Type No.

Collector-to-emitter sustain voltage 500 VVCEX(sus)

Collector-to-emitter reverse voltage VVF

Switching time

Uton

Utstg

Excessive temperature protection temperature 100 to 120 ˚CTSD

Overcurrent protection current 25 to 31 AISD

Excessive saturation voltage protection level 15 VVSD

Package drawing No.4178 No.4180 No.4181


_

Power element type BJT SIT _

STK650-610STK650-510STK650-430STK650-410STK650-310

3060

600(ICEX=8mA)

2.5(Io=-30A)

2(Io=30A)

2(Io=30A)

2550

2.5(Io=-25A)

2(Io=25A)

5(Io=-25A)

8(Io=-30A)

2(Io=25A)

2040

2.5(Io=-20A)

2(Io=20A)

5(Io=-20A)

2(Io=20A)

2040

2.5(Io=-20A)

2(Io=20A)

5(Io=-20A)

2(Io=20A)

1530

500(ICEX=6mA)

2.5(Io=-15A)

4

1

Collector-to-emitter saturation voltage VVCE(sat)5

(Io=30A)

3.5(Io=20A)

1(Io=20A)

3(Io=20A)

5(Io=25A)

5(Io=20A)

5(Io=20A)

5(Io=15A)

2(Io=15A)

5(Io=-15A)

2(Io=15A) Utr

40 to 4827 to 3322 to 2722 to 2718 to 23

[Equivalent Circuit Diagram] [Sample Application Circuit]

* * * *

W V UUVWTRIP

VCC+

-

STK650-000/STK651-000 Series

VD1

VD2

VD3

VD4

Motor

*Only the STK650-610 require Zener diodes.

VD1UIN

RB1GND1

VD2VIN

RB2GND2

VD3WIN

RB3

+

UGND3

VD4

UIN

RB4GND4

VIN

WIN

TRIP

Overcurrent protection (ISD) Excessive temperature protection (TSD)

V

W

-


16

9.3 Active filter circuit characteristics improvement examples

Various electronic equipment is connected to commer-cial power supply lines, and the harmonic distortion generated from this equipment may cause interfer-ence with power equipment and other electronic equip-ment. Active filter circuits are effective for harmonic control

and power factor improvement. Sanyo has succeeded in creating hybrid ICs by employing insulated metal substrate technology (IMST) for these complex active filter circuits. Examples of improved characteristics of active filter cir-cuits are shown below.

Buffer

Motor

Reg.

NF

BufferReg.

Inverter Inverter AC 50/60Hz100V


Active filter

NF

BufferReg.

MicrocontrollerMicrocontroller Microcontroller

Motor

VI

VI

1 100

2

4

6

8

10Current (A)

Harmonic order 20 30 1 10

0

2

4

6

8

10Current (A)

Harmonic order 20 30

Capacitor input type rectifier circuit Active filter circuit

Voltage and current waveforms

Harmonic current spectrum

Circuit configuration


17

9.4 Active filter power IC STK762-000G Series

[Features]n Integrates the major circuits of active filters (power

elements, FRD, current detection resistors, control IC, protective circuits)

nUses IGBT for power elements nHigh power factor through the use of average cur-

rent control system nDirect output voltage can be controlled over a wide

range (Approx. 160 to 385V during AC100V input) n Built-in overcurrent, excessive temperature, and

overvoltage protection circuits


UnitParameter Symbol

Supply voltage 600 VVCE

Output current AICOutput peak current AICP

FRD reverse voltage 600 VVRM

FRD forward current 40 AIFFRD forward voltage 3 (IF=40A) V

20 V

VF

Type No.

Control supply voltage VCC

25 30 mAControl power supply current drain during operation ICC ON

100 to 120 ˚CExcessive temperature protection temperature TSD

6850 AOvercurrent protection current ISD

3020 ArmsBooster coil current ICOIL

160 to 385 VDCDirect current output voltage Vout

-20 to +100 ˚COperating temperature TC

-40 to +125 ˚CStorage temperature Tstg

No.4182 _Package dimensions


STK762-721G STK762-921G

80160

4080


Current detection resistor

IGBTFRD

Operation setting signal (output voltage, oscillation frequency, reference waveform, overvoltage setting)

Control power supply

(Vcc=17V)

Protection operation output

Soft start/Boost operation enable input

Control reference voltage/oscillation

frequency

R

C

-

+

Excessive temperature Overcurrent protection

Soft start circuit

PFC control IC

CSSfOSCOUT

CVC

Crf

CiCZ

Cf

Inductor

ENBL

TRIP

AC Input

STK762-000G Series

Inverter power IC

STK621-000 Series, etc.

VCC

Motor

(Application to inverter circuit)

ROL

RVL

RPH

RPLRT

RML

CMM

RMM

RMH

ROH

RSI

RVH CT


18

9.5 Integrated active filter & inverter power IC STK623-000 Series

[Features]n Integrates an active filter (PFC) circuit for power fac-

tor improvement and a 3-phase inverter circuit that can be driven with a single power supply.

n Inverter block: IGBT for power elements adopted. Driving with a single power supply is made possible

through the bootstrap system using a level shift cir-cuit in the high voltage pre-driver block.

Built-in overcurrent, excessive temperature, and low control power supply voltage protection circuits

nActive filter (PFC) block: IGBT for power elements adopted Built-in control IC (average current control type),

FRD, current detection resistors, soft start circuit, overcurrent and overvoltage protection circuits

nThe direct current output voltage of the active filter block can be set externally (PAM control supported)


Unit Parameter Symbol

Inverter blockSupply voltage 1 VVCE1Output current AIoOutput peak current AIOP

Control supply voltage 1 VVD1 to VD4Maximum loss (IGBT) W

V

Pd

Type No.

FWD forward voltage VF1

100 to 12025

˚CExcessive temperature protection temperature TSD

AOvercurrent protection current ISD

9 to 12 VLow pre-drive supply voltage protection level UVSD

600 V

Active filter blockVCE2Supply voltage 2

40 AICOutput current

600 VVRDFRD reverse voltage

±402036

Upper transistor 3.0 / Lower transistor 3.5 (Io=-20A)

VVsupplyControl supply voltage 2

3 (IF2=40A) VVF2FRD forward voltage

mAIonControl circuit current drainCommon block

450 VRectification output voltage VCC

15 ArmsBooster coil current ICOIL

160 to 385 VDCDirect current output voltage Vout

-20 to +100 ˚COperating temperature TC

-40 to +125 ˚CStorage temperature Tstg

No.4183 _Package dimensions


STK623-400

600±20

20

15


CiCL

CD4CS

CB

DB

CB

DB

CB

DBRTRU

RB

RO

RH RP RD

RQ

RE

CrCT

CZ

Inductor

AC Input

STK623-000 Series

VD4(15V)

Vsup(17V)

Motor

Control Logic(+5V)

(during drive with 1 power supply)

PWM signalOperation setting signal (voltage, frequency, reference waveform)

FAULT signal 15V power supply (INV block)

17V power supply

(PFC block)

R

C - + U V W

Bootstrap input (upper phase power supply)

Temperature/current protectionPFC control IC

High voltage pre-driver + low supply voltage protection


19

9.6 Triac power IC STK630-000 Series


[Features]nMulti-triac hybrid IC for AC power switch built in pre-

driver n Ideal for AC switches of washing machines, dryers,

heated toilet seats, etc. nThe power output block can be configured as 1

package, so that the standardization of parts is pos-sible. Moreover, more compact and thin sets can be designed.

nThe STK630-010 (under development) consists of

an AC switch block (other than motor) for inverter washing machine and a power supply block com-bined into 1 package.

nThe use of a low thermal resistant IMST substrate results in superior heat dissipation and enables the elimination of heat sinks.

nThe use of hollow structure packages, which make smoke emission and fires less likely, results in supe-rior safety.

Unit Parameter Signal

Repetitive peak off-state voltage VVDRM

Effective ON current AIT(RMS)

Power supply output current mAIo1

Type No.

Io2

up to 0.8at least 4.0

up to 0.4at least 0.8

VInput ON voltage VIH

VInput OFF voltage VIL

[Power supply circuit not built in] VPower supply output voltageVo1

Vo2

-20 to +100 ˚CTCOperating temperature

-40 to +125 ˚CTstgStorage temperature

No.4175 No.4185 No.4174_Package dimensions

6006008

[Power supply circuit not built in]

Under developmentSTK630-010 STK630-252 STK630-255A STK630-260 (D) STK630-261 (D)

5 built-in circuits 6 built-in circuits 5 built-in circuits 5 built-in circuits 5 built-in circuits3 circuits

50up to 0.4

200

14.5 to 16.54.7 to 5.3

at least 0.8

4001

3 circuits

3

1 circuits

1

4 circuits60010

2 circuits400 600 (800) 600 (800)

1

3 circuits

8

2 circuits

1

3 circuits

10

2 circuits

1

3 circuits

[Equivalent Circuit and Sample Application Circuit]

STK630-010

Inverter power IC

STK621-000 Series, etc.

Motor

Zero-cross circuit

AC Input85 to 264V

Triac output block

Pre-driver Microcontroller

DC-DC converter Reg.

15.5V 5V

VDDGND

U

UVB3 VB2 VB1

V

W-

+

V W U V W

INT

Feed valve, drain valve, etc. 3A output x 1 1A output x 4

(In case of use in inverter washing machine)

20

Package dimensions 4173





10. Package Dimensions

539

2152=42

22

221

21

0.5

0.4

5.2

7.5

5.5

31.1

160.

5

3.9

70

2.54

1 22

R2.3

0.5

2.5

5.5

4.6

78

2.54521=53.34

5.6

67

9

0.4

5.2

60

231

2--3.6

(8)

0.5

2252=44

2

11

16

25.5

13.2

8.5

0.4

2.9

16.5 21

328

78

70

27

2

1

0.5

(9) 2652=5.2

2--ø3.6

22

4--ø2.78 deep

2--ø4.4hole

4--ø1protrusion 0.5

2--R3

2.54

8

1

0.5

2152.54=53.34

61

1

4--hollow 1

73

87

1

7

14

48

2--73

1354=52

77.5

23 29

16.2

50.

416

.25

11

84

37

CA

IT

IMS

T + - U V W

21


22

4--ø2.78 deep

2--ø4.4hole

7

A


2--R3

7.5

DETAILE A

C1

ø1.65hole

6.35

2.54

8

1

0.5

2152.54=53.34

61

P=12

hollow 1

73

87

2--73

77.5

48

23 29

16.2

5

0.4

16

0.8

11

10

3.47.

95

4

37

CA

IT

IMS

T


22

4--ø2.78 deep

2--ø4.4hole

5

A


2--R3

7.5

DETAILE A

C1

ø1.65 hole

6.35

2.54

8

1

0.5

2152.54=53.34

61

P=12

4-- 1

73

87

2--73

77.5

48

23 29

26.5

0.4

26.2

5

0.8

11

10

3.47.

95

4

57.5

CA

IT

IMS

T


22

4--ø2.78 deep

2--ø4.4hole

5


2--R3

2.54

1

0.5

2152.54=53.34

61

1

4--hollow 1

73

87

1 14

4

52

23 29

(26.

5)

0.4

8

0.4

(26.

5)

11

84

57.5

CA

IT

IMS

T

77.5

2--73

53


22

A

10

4.5

DETAILE A

C1ø1.65 hole

6.35

7.5

2.5852.5=20 1152.5=27.5

1

52.5

124512=48

77.5

2526

.3

0.8

0.65

11 7.5 3.

47.95

57.5

ø4.4

CA

IT

IMS

T

+ - U V W

+ - U V W

+ - U V W

+ - U V W

22


22

4--ø2.78 deep

2--ø4.4hole

5


2--R3

2.54

1

0.5

2152.54=53.34

61

1

4--hollow 1

73

87

1 14

4

52

23 29

26.5

0.4

8

0.4

26.5

11

84

57.5

CA

IT

IMS

T

77.5

2--73

- + CR


A

10

2

8

DETAILE A

C1ø1.65 hole

6.35

7.5

2.54

22

100

1

0.5

2152.54=53.34

89

6015

2230

.5

0.8

0.4

11.5

5

3.47.

95

6654

ø4.4

IMS

TC

AIT


28

11

8

4--ø1 protrusion 0.5

2--ø4.4 hole

4--ø

2.7

8 de

ep

2

1

87

0.5

54

61

1

73

29 42

4

52

23 29

26.5

0.4

0.4

26.5

84

57.5

CA

IT

IMS

T

73

73

U V W + - R C


8.5

2.54

55.6

31

21

16.5

64

1 18

(6.21) 1752.54=43.18

0.5

2--ø3.6

(R0.4 to 0.8)

(R0.4 to 0.8)

34

5.2

DETAILE

0.4

7

U V W+ -

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Documents

Ordering number: EP35E - Digchipapplication-notes.digchip.com/068/68-40511.pdf · STK762-921G (IGBT, rated output: 80A) STK623-400 (IGBT, rated output: 20A) External appearance Internal