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OptiX OSN 1500 Intelligent Optical Transmission System
V100R007
Hardware Description
Issue 02
Date 2007-09-10
Part Number 31401357
Huawei Technologies Proprietary
Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For anyassistance, please contact our local office or company headquarters.
Huawei Technologies Co., Ltd.Address: Huawei Industrial Base
Bantian, LonggangShenzhen 518129People's Republic of China
Website: http://www.huawei.com
Email: [email protected]
Copyright © 2007 Huawei Technologies Co., Ltd. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions
and other Huawei trademarks are the property of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders. NoticeThe information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but the statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Proprietary
Contents
About This Document.....................................................................................................................1
1 Equipment Structure.................................................................................................................1-1
2 Cabinet.........................................................................................................................................2-12.1 Cabinet Type...................................................................................................................................................2-22.2 Cabinet Configuration.....................................................................................................................................2-2
2.2.1 Cabinet Indicator....................................................................................................................................2-32.2.2 DC PDU.................................................................................................................................................2-32.2.3 Other Configuration...............................................................................................................................2-4
2.3 Technical Specifications.................................................................................................................................2-5
3 Subrack.........................................................................................................................................3-13.1 Structure..........................................................................................................................................................3-23.2 Capacity...........................................................................................................................................................3-33.3 Slot Allocation.................................................................................................................................................3-43.4 Technical Specifications...............................................................................................................................3-17
4 Board List and Classification...................................................................................................4-14.1 Appearance and Dimensions of Boards..........................................................................................................4-24.2 Description of the Barcode on the Board........................................................................................................4-34.3 Board Classification........................................................................................................................................4-4
4.3.1 SDH Processing Boards.........................................................................................................................4-44.3.2 PDH Processing Boards.........................................................................................................................4-64.3.3 Data Processing Boards..........................................................................................................................4-74.3.4 Interface Boards and Switching Boards.................................................................................................4-94.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-104.3.6 Auxiliary Boards..................................................................................................................................4-104.3.7 WDM Processing Boards.....................................................................................................................4-114.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-114.3.9 Power Interface Boards........................................................................................................................4-12
5 SDH Processing Boards............................................................................................................5-15.1 SL1..................................................................................................................................................................5-3
5.1.1 Version Description................................................................................................................................5-35.1.2 Function and Feature..............................................................................................................................5-4
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Contents
Issue 02 (2007-09-10) Huawei Technologies Proprietary i
5.1.3 Working Principle and Signal Flow.......................................................................................................5-55.1.4 Front Panel.............................................................................................................................................5-75.1.5 Valid Slots..............................................................................................................................................5-85.1.6 Board Feature Code................................................................................................................................5-95.1.7 Board Configuration Reference.............................................................................................................5-95.1.8 Technical Specifications........................................................................................................................5-9
5.2 SLQ1.............................................................................................................................................................5-115.2.1 Version Description..............................................................................................................................5-115.2.2 Function and Feature............................................................................................................................5-125.2.3 Working Principle and Signal Flow.....................................................................................................5-135.2.4 Front Panel...........................................................................................................................................5-155.2.5 Valid Slots............................................................................................................................................5-165.2.6 Board Feature Code..............................................................................................................................5-175.2.7 Board Configuration Reference...........................................................................................................5-175.2.8 Technical Specifications......................................................................................................................5-17
5.3 SLO1.............................................................................................................................................................5-195.3.1 Version Description..............................................................................................................................5-195.3.2 Function and Feature............................................................................................................................5-195.3.3 Working Principle and Signal Flow.....................................................................................................5-205.3.4 Front Panel...........................................................................................................................................5-225.3.5 Valid Slots............................................................................................................................................5-245.3.6 Board Feature Code..............................................................................................................................5-245.3.7 Board Configuration Reference...........................................................................................................5-245.3.8 Technical Specifications......................................................................................................................5-25
5.4 SLT1..............................................................................................................................................................5-265.4.1 Version Description..............................................................................................................................5-265.4.2 Function and Feature............................................................................................................................5-265.4.3 Working Principle and Signal Flow.....................................................................................................5-275.4.4 Front Panel...........................................................................................................................................5-295.4.5 Valid Slots............................................................................................................................................5-315.4.6 Board Configuration Reference...........................................................................................................5-315.4.7 Technical Specifications......................................................................................................................5-31
5.5 SEP1..............................................................................................................................................................5-325.5.1 Version Description..............................................................................................................................5-335.5.2 Function and Feature............................................................................................................................5-335.5.3 Working Principle and Signal Flow.....................................................................................................5-345.5.4 Front Panel...........................................................................................................................................5-375.5.5 Valid Slots............................................................................................................................................5-395.5.6 TPS Protection for the Board...............................................................................................................5-395.5.7 Board Configuration Reference...........................................................................................................5-405.5.8 Technical Specifications......................................................................................................................5-41
5.6 SL4................................................................................................................................................................5-41
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
ii Huawei Technologies Proprietary Issue 02 (2007-09-10)
5.6.1 Version Description..............................................................................................................................5-425.6.2 Function and Feature............................................................................................................................5-425.6.3 Working Principle and Signal Flow.....................................................................................................5-435.6.4 Front Panel...........................................................................................................................................5-455.6.5 Valid Slots............................................................................................................................................5-475.6.6 Board Feature Code..............................................................................................................................5-475.6.7 Board Configuration Reference...........................................................................................................5-485.6.8 Technical Specifications......................................................................................................................5-48
5.7 SLD4.............................................................................................................................................................5-495.7.1 Version Description..............................................................................................................................5-505.7.2 Function and Feature............................................................................................................................5-505.7.3 Working Principle and Signal Flow.....................................................................................................5-515.7.4 Front Panel...........................................................................................................................................5-535.7.5 Valid Slots............................................................................................................................................5-555.7.6 Board Feature Code..............................................................................................................................5-555.7.7 Board Configuration Reference...........................................................................................................5-565.7.8 Technical Specifications......................................................................................................................5-56
5.8 SLQ4.............................................................................................................................................................5-575.8.1 Version Description..............................................................................................................................5-585.8.2 Function and Feature............................................................................................................................5-585.8.3 Working Principle and Signal Flow.....................................................................................................5-595.8.4 Front Panel...........................................................................................................................................5-615.8.5 Valid Slots............................................................................................................................................5-635.8.6 Board Feature Code..............................................................................................................................5-635.8.7 Board Configuration Reference...........................................................................................................5-635.8.8 Technical Specifications......................................................................................................................5-63
5.9 SL16..............................................................................................................................................................5-645.9.1 Version Description..............................................................................................................................5-655.9.2 Function and Feature............................................................................................................................5-665.9.3 Working Principle and Signal Flow.....................................................................................................5-675.9.4 Front Panel...........................................................................................................................................5-695.9.5 Valid Slots............................................................................................................................................5-705.9.6 Board Feature Code..............................................................................................................................5-705.9.7 Board Configuration Reference...........................................................................................................5-715.9.8 Technical Specifications......................................................................................................................5-71
5.10 SL16A.........................................................................................................................................................5-735.10.1 Version Description............................................................................................................................5-735.10.2 Function and Feature..........................................................................................................................5-745.10.3 Working Principle and Signal Flow...................................................................................................5-755.10.4 Front Panel.........................................................................................................................................5-775.10.5 Valid Slots..........................................................................................................................................5-795.10.6 Board Feature Code............................................................................................................................5-79
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Contents
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5.10.7 Board Configuration Reference.........................................................................................................5-795.10.8 Technical Specifications....................................................................................................................5-79
5.11 SF16............................................................................................................................................................5-815.11.1 Version Description............................................................................................................................5-815.11.2 Function and Feature..........................................................................................................................5-815.11.3 Working Principle and Signal Flow...................................................................................................5-835.11.4 Front Panel.........................................................................................................................................5-855.11.5 Valid Slots..........................................................................................................................................5-865.11.6 Board Configuration Reference.........................................................................................................5-865.11.7 Technical Specifications....................................................................................................................5-86
6 PDH Processing Boards............................................................................................................6-16.1 PL1..................................................................................................................................................................6-3
6.1.1 Version Description................................................................................................................................6-36.1.2 Function and Feature..............................................................................................................................6-36.1.3 Working Principle and Signal Flow.......................................................................................................6-46.1.4 Front Panel............................................................................................................................................. 6-66.1.5 Valid Slots..............................................................................................................................................6-76.1.6 Board Feature Code................................................................................................................................6-76.1.7 Board Configuration Reference............................................................................................................. 6-76.1.8 Technical Specifications........................................................................................................................ 6-8
6.2 PD1 .................................................................................................................................................................6-86.2.1 Version Description................................................................................................................................6-96.2.2 Function and Feature..............................................................................................................................6-96.2.3 Working Principle and Signal Flow.....................................................................................................6-106.2.4 Front Panel...........................................................................................................................................6-136.2.5 Valid Slots............................................................................................................................................6-136.2.6 Board Feature Code..............................................................................................................................6-146.2.7 TPS Protection for the Board...............................................................................................................6-156.2.8 Board Configuration Reference...........................................................................................................6-176.2.9 Technical Specifications......................................................................................................................6-17
6.3 PQ1................................................................................................................................................................6-186.3.1 Version Description..............................................................................................................................6-186.3.2 Function and Feature............................................................................................................................6-196.3.3 Working Principle and Signal Flow.....................................................................................................6-206.3.4 Front Panel...........................................................................................................................................6-226.3.5 Valid Slots............................................................................................................................................6-236.3.6 Board Feature Code..............................................................................................................................6-246.3.7 TPS Protection for the Board...............................................................................................................6-246.3.8 Board Configuration Reference...........................................................................................................6-266.3.9 Technical Specifications......................................................................................................................6-26
6.4 PQM .............................................................................................................................................................6-276.4.1 Version Description..............................................................................................................................6-27
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
iv Huawei Technologies Proprietary Issue 02 (2007-09-10)
6.4.2 Function and Feature............................................................................................................................6-276.4.3 Working Principle and Signal Flow.....................................................................................................6-286.4.4 Front Panel...........................................................................................................................................6-306.4.5 Valid Slots............................................................................................................................................6-316.4.6 TPS Protection for the Board...............................................................................................................6-326.4.7 Board Configuration Reference...........................................................................................................6-346.4.8 Technical Specifications......................................................................................................................6-34
6.5 PL3................................................................................................................................................................6-356.5.1 Version Description..............................................................................................................................6-356.5.2 Function and Feature............................................................................................................................6-366.5.3 Working Principle and Signal Flow.....................................................................................................6-366.5.4 Front Panel...........................................................................................................................................6-396.5.5 Valid Slots............................................................................................................................................6-406.5.6 TPS Protection for the Board...............................................................................................................6-406.5.7 Board Configuration Reference...........................................................................................................6-426.5.8 Technical Specifications......................................................................................................................6-42
6.6 PL3A.............................................................................................................................................................6-436.6.1 Version Description..............................................................................................................................6-436.6.2 Function and Feature............................................................................................................................6-446.6.3 Working Principle and Signal Flow.....................................................................................................6-456.6.4 Front Panel...........................................................................................................................................6-476.6.5 Valid Slots............................................................................................................................................6-486.6.6 Board Configuration Reference...........................................................................................................6-486.6.7 Technical Specifications......................................................................................................................6-48
6.7 PD3................................................................................................................................................................6-496.7.1 Version Description..............................................................................................................................6-506.7.2 Function and Feature............................................................................................................................6-506.7.3 Working Principle and Signal Flow.....................................................................................................6-516.7.4 Front Panel...........................................................................................................................................6-536.7.5 Valid Slots............................................................................................................................................6-546.7.6 TPS Protection for the Board...............................................................................................................6-556.7.7 Board Configuration Reference...........................................................................................................6-566.7.8 Technical Specifications......................................................................................................................6-57
6.8 PQ3................................................................................................................................................................6-576.8.1 Version Description..............................................................................................................................6-586.8.2 Function and Feature............................................................................................................................6-586.8.3 Working Principle and Signal Flow.....................................................................................................6-586.8.4 Front Panel...........................................................................................................................................6-616.8.5 Valid Slots............................................................................................................................................6-626.8.6 TPS Protection for the Board...............................................................................................................6-626.8.7 Board Configuration Reference...........................................................................................................6-646.8.8 Technical Specifications......................................................................................................................6-64
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Contents
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6.9 DX1...............................................................................................................................................................6-646.9.1 Version Description..............................................................................................................................6-656.9.2 Function and Feature............................................................................................................................6-656.9.3 Working Principle and Signal Flow.....................................................................................................6-666.9.4 Front Panel...........................................................................................................................................6-676.9.5 Valid Slots............................................................................................................................................6-686.9.6 Board Feature Code..............................................................................................................................6-686.9.7 TPS Protection for the Board...............................................................................................................6-696.9.8 Board Configuration Reference...........................................................................................................6-706.9.9 Technical Specifications......................................................................................................................6-70
6.10 DXA............................................................................................................................................................6-716.10.1 Version Description............................................................................................................................6-716.10.2 Function and Feature..........................................................................................................................6-726.10.3 Working Principle and Signal Flow...................................................................................................6-726.10.4 Front Panel.........................................................................................................................................6-736.10.5 Valid Slots..........................................................................................................................................6-746.10.6 Board Configuration Reference.........................................................................................................6-756.10.7 Technical Specifications....................................................................................................................6-75
6.11 SPQ4............................................................................................................................................................6-756.11.1 Version Description............................................................................................................................6-766.11.2 Function and Feature..........................................................................................................................6-766.11.3 Working Principle and Signal Flow...................................................................................................6-776.11.4 Front Panel.........................................................................................................................................6-806.11.5 Valid Slots..........................................................................................................................................6-816.11.6 TPS Protection for the Board.............................................................................................................6-826.11.7 Board Configuration Reference.........................................................................................................6-836.11.8 Technical Specifications....................................................................................................................6-83
7 Data Processing Boards.............................................................................................................7-17.1 EFT4................................................................................................................................................................7-3
7.1.1 Version Description................................................................................................................................7-37.1.2 Function and Feature..............................................................................................................................7-37.1.3 Working Principle and Signal Flow.......................................................................................................7-47.1.4 Front Panel............................................................................................................................................. 7-67.1.5 Valid Slots..............................................................................................................................................7-87.1.6 Board Configuration Reference............................................................................................................. 7-87.1.7 Technical Specifications........................................................................................................................ 7-8
7.2 EFT8................................................................................................................................................................7-97.2.1 Version Description................................................................................................................................7-97.2.2 Function and Feature..............................................................................................................................7-97.2.3 Working Principle and Signal Flow.....................................................................................................7-107.2.4 Front Panel...........................................................................................................................................7-127.2.5 Valid Slots............................................................................................................................................7-14
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
vi Huawei Technologies Proprietary Issue 02 (2007-09-10)
7.2.6 Board Configuration Reference...........................................................................................................7-157.2.7 Technical Specifications......................................................................................................................7-15
7.3 EFT8A...........................................................................................................................................................7-157.3.1 Version Description..............................................................................................................................7-167.3.2 Function and Feature............................................................................................................................7-167.3.3 Working Principle and Signal Flow.....................................................................................................7-177.3.4 Front Panel...........................................................................................................................................7-197.3.5 Valid Slots............................................................................................................................................7-217.3.6 Board Configuration Reference...........................................................................................................7-227.3.7 Technical Specifications......................................................................................................................7-22
7.4 EGT2.............................................................................................................................................................7-227.4.1 Version Description..............................................................................................................................7-237.4.2 Function and Feature............................................................................................................................7-237.4.3 Working Principle and Signal Flow.....................................................................................................7-247.4.4 Front Panel...........................................................................................................................................7-267.4.5 Valid Slots............................................................................................................................................7-277.4.6 Board Feature Code..............................................................................................................................7-277.4.7 Board Configuration Reference...........................................................................................................7-287.4.8 Technical Specifications......................................................................................................................7-28
7.5 EFS0..............................................................................................................................................................7-297.5.1 Version Description..............................................................................................................................7-297.5.2 Function and Feature............................................................................................................................7-307.5.3 Working Principle and Signal Flow.....................................................................................................7-327.5.4 Front Panel...........................................................................................................................................7-357.5.5 Valid Slots............................................................................................................................................7-367.5.6 TPS Protection......................................................................................................................................7-367.5.7 Board Configuration Reference...........................................................................................................7-377.5.8 Technical Specifications......................................................................................................................7-37
7.6 EFS4..............................................................................................................................................................7-377.6.1 Version Description..............................................................................................................................7-387.6.2 Function and Feature............................................................................................................................7-387.6.3 Working Principle and Signal Flow.....................................................................................................7-407.6.4 Front Panel...........................................................................................................................................7-437.6.5 Valid Slots............................................................................................................................................7-457.6.6 Board Configuration Reference...........................................................................................................7-457.6.7 Technical Specifications......................................................................................................................7-45
7.7 EGS2.............................................................................................................................................................7-457.7.1 Version Description..............................................................................................................................7-467.7.2 Function and Feature............................................................................................................................7-467.7.3 Working Principle and Signal Flow.....................................................................................................7-497.7.4 Front Panel...........................................................................................................................................7-517.7.5 Valid Slots............................................................................................................................................7-53
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Contents
Issue 02 (2007-09-10) Huawei Technologies Proprietary vii
7.7.6 Board Feature Code..............................................................................................................................7-537.7.7 Board Configuration Reference...........................................................................................................7-537.7.8 Technical Specifications......................................................................................................................7-53
7.8 EMS4.............................................................................................................................................................7-547.8.1 Version Description..............................................................................................................................7-557.8.2 Function and Feature............................................................................................................................7-557.8.3 Working Principle and Signal Flow.....................................................................................................7-577.8.4 Front Panel...........................................................................................................................................7-607.8.5 Valid Slots............................................................................................................................................7-627.8.6 Board Feature Code..............................................................................................................................7-627.8.7 Board Protection...................................................................................................................................7-637.8.8 Board Configuration Reference...........................................................................................................7-657.8.9 Technical Specifications......................................................................................................................7-66
7.9 EGS4.............................................................................................................................................................7-677.9.1 Version Description..............................................................................................................................7-677.9.2 Function and Feature............................................................................................................................7-677.9.3 Working Principle and Signal Flow.....................................................................................................7-697.9.4 Front Panel...........................................................................................................................................7-727.9.5 Valid Slots............................................................................................................................................7-747.9.6 Board Feature Code..............................................................................................................................7-747.9.7 Board Protection...................................................................................................................................7-747.9.8 Board Configuration Reference...........................................................................................................7-777.9.9 Technical Specifications......................................................................................................................7-78
7.10 EGR2...........................................................................................................................................................7-797.10.1 Version Description............................................................................................................................7-797.10.2 Function and Feature..........................................................................................................................7-797.10.3 Working Principle and Signal Flow...................................................................................................7-827.10.4 Front Panel.........................................................................................................................................7-847.10.5 Valid Slots..........................................................................................................................................7-867.10.6 Board Feature Code............................................................................................................................7-867.10.7 Board Configuration Reference.........................................................................................................7-867.10.8 Technical Specifications....................................................................................................................7-86
7.11 EMR0..........................................................................................................................................................7-877.11.1 Version Description............................................................................................................................7-887.11.2 Function and Feature..........................................................................................................................7-897.11.3 Working Principle and Signal Flow...................................................................................................7-927.11.4 Front Panel.........................................................................................................................................7-947.11.5 Valid Slots..........................................................................................................................................7-977.11.6 Board Feature Code............................................................................................................................7-987.11.7 Board Configuration Reference.........................................................................................................7-987.11.8 Technical Specifications....................................................................................................................7-98
7.12 ADL4...........................................................................................................................................................7-99
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
viii Huawei Technologies Proprietary Issue 02 (2007-09-10)
7.12.1 Version Description..........................................................................................................................7-1007.12.2 Function and Feature........................................................................................................................7-1007.12.3 Working Principle and Signal Flow.................................................................................................7-1017.12.4 Front Panel.......................................................................................................................................7-1037.12.5 Valid Slots........................................................................................................................................7-1047.12.6 Board Feature Code..........................................................................................................................7-1047.12.7 Board Configuration Reference.......................................................................................................7-1047.12.8 Technical Specifications..................................................................................................................7-105
7.13 ADQ1........................................................................................................................................................7-1067.13.1 Version Description..........................................................................................................................7-1067.13.2 Function and Feature........................................................................................................................7-1067.13.3 Working Principle and Signal Flow.................................................................................................7-1077.13.4 Front Panel.......................................................................................................................................7-1097.13.5 Valid Slots........................................................................................................................................7-1117.13.6 Board Feature Code..........................................................................................................................7-1117.13.7 Board Configuration Reference.......................................................................................................7-1117.13.8 Technical Specifications..................................................................................................................7-112
7.14 IDL4..........................................................................................................................................................7-1137.14.1 Version Description..........................................................................................................................7-1137.14.2 Function and Feature........................................................................................................................7-1137.14.3 Working Principle ...........................................................................................................................7-1157.14.4 Front Panel.......................................................................................................................................7-1177.14.5 Valid Slots........................................................................................................................................7-1187.14.6 Board Feature Code..........................................................................................................................7-1187.14.7 Board Protection...............................................................................................................................7-1187.14.8 Board Configuration Reference.......................................................................................................7-1197.14.9 Technical Specifications..................................................................................................................7-119
7.15 IDQ1..........................................................................................................................................................7-1207.15.1 Version Description..........................................................................................................................7-1207.15.2 Function and Feature........................................................................................................................7-1217.15.3 Working Principle and Signal Flow.................................................................................................7-1227.15.4 Front Panel.......................................................................................................................................7-1247.15.5 Valid Slots........................................................................................................................................7-1267.15.6 Board Feature Code..........................................................................................................................7-1267.15.7 Board Protection...............................................................................................................................7-1267.15.8 Board Configuration Reference.......................................................................................................7-1267.15.9 Technical Specifications..................................................................................................................7-127
7.16 MST4.........................................................................................................................................................7-1287.16.1 Version Description..........................................................................................................................7-1287.16.2 Function and Feature........................................................................................................................7-1287.16.3 Working Principle and Signal Flow.................................................................................................7-1307.16.4 Front Panel.......................................................................................................................................7-132
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7.16.5 Valid Slots........................................................................................................................................7-1337.16.6 Board Feature Code..........................................................................................................................7-1337.16.7 Board Configuration Reference.......................................................................................................7-1347.16.8 Technical Specifications..................................................................................................................7-134
8 Interface Boards and Switching Boards.................................................................................8-18.1 L12S................................................................................................................................................................8-3
8.1.1 Version Description................................................................................................................................8-38.1.2 Function and Feature..............................................................................................................................8-38.1.3 Working Principle and Signal Flow.......................................................................................................8-38.1.4 Front Panel.............................................................................................................................................8-48.1.5 Valid Slots..............................................................................................................................................8-58.1.6 Technical Specifications........................................................................................................................8-5
8.2 D12B...............................................................................................................................................................8-58.2.1 Version Description................................................................................................................................8-68.2.2 Function and Feature..............................................................................................................................8-68.2.3 Working Principle and Signal Flow.......................................................................................................8-68.2.4 Front Panel.............................................................................................................................................8-68.2.5 Valid Slots..............................................................................................................................................8-88.2.6 Technical Specifications........................................................................................................................8-9
8.3 D12S................................................................................................................................................................8-98.3.1 Version Description................................................................................................................................8-98.3.2 Function and Feature..............................................................................................................................8-98.3.3 Working Principle and Signal Flow.......................................................................................................8-98.3.4 Front Panel...........................................................................................................................................8-108.3.5 Valid Slots............................................................................................................................................8-128.3.6 Technical Specifications......................................................................................................................8-13
8.4 L75S..............................................................................................................................................................8-138.4.1 Version Description..............................................................................................................................8-138.4.2 Function and Feature............................................................................................................................8-138.4.3 Working Principle and Signal Flow.....................................................................................................8-148.4.4 Front Panel...........................................................................................................................................8-148.4.5 Valid Slots............................................................................................................................................8-158.4.6 Technical Specifications......................................................................................................................8-15
8.5 D75S..............................................................................................................................................................8-168.5.1 Version Description..............................................................................................................................8-168.5.2 Function and Feature............................................................................................................................8-168.5.3 Working Principle and Signal Flow.....................................................................................................8-168.5.4 Front Panel...........................................................................................................................................8-178.5.5 Valid Slots............................................................................................................................................8-198.5.6 Technical Specifications......................................................................................................................8-20
8.6 D34S..............................................................................................................................................................8-208.6.1 Version Description..............................................................................................................................8-20
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
x Huawei Technologies Proprietary Issue 02 (2007-09-10)
8.6.2 Function and Feature............................................................................................................................8-208.6.3 Working Principle and Signal Flow.....................................................................................................8-218.6.4 Front Panel...........................................................................................................................................8-218.6.5 Valid Slots............................................................................................................................................8-228.6.6 Technical Specifications......................................................................................................................8-23
8.7 C34S..............................................................................................................................................................8-238.7.1 Version Description..............................................................................................................................8-248.7.2 Function and Feature............................................................................................................................8-248.7.3 Working Principle and Signal Flow.....................................................................................................8-248.7.4 Front Panel...........................................................................................................................................8-258.7.5 Valid Slots............................................................................................................................................8-268.7.6 Technical Specifications......................................................................................................................8-26
8.8 EU04..............................................................................................................................................................8-278.8.1 Version Description..............................................................................................................................8-278.8.2 Function and Feature............................................................................................................................8-278.8.3 Working Principle and Signal Flow.....................................................................................................8-278.8.4 Front Panel...........................................................................................................................................8-288.8.5 Valid Slots............................................................................................................................................8-298.8.6 Technical Specifications......................................................................................................................8-30
8.9 EU08..............................................................................................................................................................8-308.9.1 Version Description..............................................................................................................................8-318.9.2 Function and Feature............................................................................................................................8-318.9.3 Working Principle and Signal Flow.....................................................................................................8-318.9.4 Front Panel...........................................................................................................................................8-328.9.5 Valid Slots............................................................................................................................................8-338.9.6 Technical Specifications......................................................................................................................8-33
8.10 OU08 ..........................................................................................................................................................8-348.10.1 Version Description............................................................................................................................8-348.10.2 Function and Feature..........................................................................................................................8-358.10.3 Working Principle and Signal Flow...................................................................................................8-358.10.4 Front Panel.........................................................................................................................................8-358.10.5 Valid Slots..........................................................................................................................................8-388.10.6 Technical Specifications....................................................................................................................8-38
8.11 MU04..........................................................................................................................................................8-398.11.1 Version Description............................................................................................................................8-398.11.2 Function and Feature..........................................................................................................................8-398.11.3 Working Principle and Signal Flow...................................................................................................8-398.11.4 Front Panel.........................................................................................................................................8-408.11.5 Valid Slots..........................................................................................................................................8-418.11.6 Technical Specifications....................................................................................................................8-42
8.12 TSB8............................................................................................................................................................8-428.12.1 Version Description............................................................................................................................8-43
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8.12.2 Function and Feature..........................................................................................................................8-438.12.3 Working Principle and Signal Flow...................................................................................................8-438.12.4 Front Panel.........................................................................................................................................8-448.12.5 Valid Slots..........................................................................................................................................8-458.12.6 Technical Specifications....................................................................................................................8-46
8.13 EFF8............................................................................................................................................................8-468.13.1 Version Description............................................................................................................................8-478.13.2 Function and Feature..........................................................................................................................8-478.13.3 Working Principle and Signal Flow...................................................................................................8-478.13.4 Front Panel.........................................................................................................................................8-488.13.5 Valid Slots..........................................................................................................................................8-498.13.6 Technical Specifications....................................................................................................................8-50
8.14 ETF8............................................................................................................................................................8-518.14.1 Version Description............................................................................................................................8-518.14.2 Function and Feature..........................................................................................................................8-518.14.3 Working Principle and Signal Flow...................................................................................................8-518.14.4 Front Panel.........................................................................................................................................8-528.14.5 Valid Slots..........................................................................................................................................8-548.14.6 Technical Specifications....................................................................................................................8-55
8.15 ETS8............................................................................................................................................................8-568.15.1 Version Description............................................................................................................................8-568.15.2 Function and Feature..........................................................................................................................8-568.15.3 Working Principle and Signal Flow...................................................................................................8-568.15.4 Front Panel.........................................................................................................................................8-578.15.5 Valid Slots..........................................................................................................................................8-598.15.6 Technical Specifications....................................................................................................................8-59
8.16 DM12..........................................................................................................................................................8-608.16.1 Version Description............................................................................................................................8-608.16.2 Function and Feature..........................................................................................................................8-608.16.3 Working Principle and Signal Flow...................................................................................................8-608.16.4 Front Panel.........................................................................................................................................8-618.16.5 Valid Slots..........................................................................................................................................8-648.16.6 Technical Specifications....................................................................................................................8-64
9 Cross-Connect and System Control Boards..........................................................................9-19.1 CXL1...............................................................................................................................................................9-2
9.1.1 Version Description................................................................................................................................9-29.1.2 Function and Feature..............................................................................................................................9-29.1.3 Working Principle and Signal Flow.......................................................................................................9-59.1.4 Front Panel.............................................................................................................................................9-99.1.5 Valid Slots............................................................................................................................................9-119.1.6 Board Feature Code..............................................................................................................................9-119.1.7 Board Configuration Reference...........................................................................................................9-11
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Hardware Description
xii Huawei Technologies Proprietary Issue 02 (2007-09-10)
9.1.8 Technical Specifications......................................................................................................................9-129.2 CXL4.............................................................................................................................................................9-13
9.2.1 Version Description..............................................................................................................................9-149.2.2 Function and Feature............................................................................................................................9-149.2.3 Working Principle and Signal Flow.....................................................................................................9-179.2.4 Front Panel...........................................................................................................................................9-209.2.5 Valid Slots............................................................................................................................................9-229.2.6 Board Feature Code..............................................................................................................................9-229.2.7 Board Configuration Reference...........................................................................................................9-229.2.8 Technical Specifications......................................................................................................................9-23
9.3 CXL16...........................................................................................................................................................9-249.3.1 Version Description..............................................................................................................................9-259.3.2 Function and Feature............................................................................................................................9-259.3.3 Working Principle and Signal Flow.....................................................................................................9-289.3.4 Front Panel...........................................................................................................................................9-319.3.5 Valid Slots............................................................................................................................................9-339.3.6 Board Feature Code..............................................................................................................................9-339.3.7 Board Configuration Reference...........................................................................................................9-339.3.8 Technical Specifications......................................................................................................................9-34
10 Auxiliary Boards.....................................................................................................................10-110.1 EOW............................................................................................................................................................10-2
10.1.1 Version Description............................................................................................................................10-210.1.2 Function and Feature..........................................................................................................................10-210.1.3 Working Principle and Signal Flow...................................................................................................10-210.1.4 Front Panel.........................................................................................................................................10-310.1.5 Valid Slots..........................................................................................................................................10-510.1.6 Technical Specifications....................................................................................................................10-5
10.2 AUX............................................................................................................................................................10-610.2.1 Version Description............................................................................................................................10-610.2.2 Function and Feature..........................................................................................................................10-610.2.3 Working Principle and Signal Flow...................................................................................................10-710.2.4 Jumper..............................................................................................................................................10-1110.2.5 Front Panel.......................................................................................................................................10-1110.2.6 Valid Slots........................................................................................................................................10-1410.2.7 Technical Specifications..................................................................................................................10-15
10.3 AMU..........................................................................................................................................................10-1510.3.1 Version Description..........................................................................................................................10-1510.3.2 Function and Feature........................................................................................................................10-1510.3.3 Working Principle and Signal Flow.................................................................................................10-1610.3.4 Front Panel.......................................................................................................................................10-1710.3.5 Valid Slots........................................................................................................................................10-2010.3.6 Technical Specifications..................................................................................................................10-20
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10.4 FAN...........................................................................................................................................................10-2110.4.1 Version Description..........................................................................................................................10-2110.4.2 Function and Feature........................................................................................................................10-2110.4.3 Working Principle and Signal Flow.................................................................................................10-2210.4.4 Front Panel.......................................................................................................................................10-2210.4.5 Valid Slots........................................................................................................................................10-2310.4.6 Technical Specifications..................................................................................................................10-23
11 WDM Processing Boards......................................................................................................11-111.1 CMR2..........................................................................................................................................................11-3
11.1.1 Version Description............................................................................................................................11-311.1.2 Function and Feature..........................................................................................................................11-311.1.3 Working Principle and Signal Flow...................................................................................................11-411.1.4 Front Panel......................................................................................................................................... 11-511.1.5 Valid Slots..........................................................................................................................................11-711.1.6 Board Feature Code............................................................................................................................11-711.1.7 Technical Specifications.................................................................................................................... 11-8
11.2 CMR4..........................................................................................................................................................11-911.2.1 Version Description............................................................................................................................11-911.2.2 Function and Feature..........................................................................................................................11-911.2.3 Working Principle and Signal Flow.................................................................................................11-1011.2.4 Front Panel.......................................................................................................................................11-1111.2.5 Valid Slots........................................................................................................................................11-1311.2.6 Board Feature Code..........................................................................................................................11-1311.2.7 Technical Specifications..................................................................................................................11-14
11.3 MR2...........................................................................................................................................................11-1511.3.1 Version Description..........................................................................................................................11-1611.3.2 Function and Feature........................................................................................................................11-1611.3.3 Working Principle and Signal Flow.................................................................................................11-1611.3.4 Front Panel.......................................................................................................................................11-1711.3.5 Valid Slots........................................................................................................................................11-1911.3.6 Board Feature Code..........................................................................................................................11-1911.3.7 Technical Specifications..................................................................................................................11-20
11.4 MR2A........................................................................................................................................................11-2111.4.1 Version Description..........................................................................................................................11-2111.4.2 Function and Feature........................................................................................................................11-2111.4.3 Working Principle and Signal Flow.................................................................................................11-2311.4.4 Front Panel.......................................................................................................................................11-2411.4.5 Valid Slots........................................................................................................................................11-2511.4.6 Technical Specifications..................................................................................................................11-25
11.5 MR2B........................................................................................................................................................11-2611.5.1 Version Description..........................................................................................................................11-2711.5.2 Function and Feature........................................................................................................................11-27
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11.5.3 Working Principle and Signal Flow.................................................................................................11-2811.5.4 Front Panel.......................................................................................................................................11-2911.5.5 Valid Slots........................................................................................................................................11-3011.5.6 Technical Specifications..................................................................................................................11-30
11.6 MR2C........................................................................................................................................................11-3111.6.1 Version Description..........................................................................................................................11-3211.6.2 Function and Feature........................................................................................................................11-3211.6.3 Working Principle and Signal Flow.................................................................................................11-3311.6.4 Front Panel.......................................................................................................................................11-3411.6.5 Valid Slots........................................................................................................................................11-3611.6.6 Technical Specifications..................................................................................................................11-36
11.7 MR4...........................................................................................................................................................11-3711.7.1 Version Description..........................................................................................................................11-3711.7.2 Function and Feature........................................................................................................................11-3711.7.3 Working Principle and Signal Flow.................................................................................................11-3811.7.4 Front Panel.......................................................................................................................................11-3911.7.5 Valid Slots........................................................................................................................................11-4111.7.6 Board Feature Code..........................................................................................................................11-4111.7.7 Technical Specifications..................................................................................................................11-42
11.8 LWX..........................................................................................................................................................11-4311.8.1 Version Description..........................................................................................................................11-4311.8.2 Function and Feature........................................................................................................................11-4311.8.3 Working Principle and Signal Flow.................................................................................................11-4411.8.4 Front Panel.......................................................................................................................................11-4611.8.5 Valid Slots........................................................................................................................................11-4811.8.6 Board Feature Code..........................................................................................................................11-4811.8.7 Technical Specifications..................................................................................................................11-48
11.9 OBU1........................................................................................................................................................11-5111.9.1 Version Description..........................................................................................................................11-5211.9.2 Function and Feature........................................................................................................................11-5211.9.3 Working Principle and Signal Flow.................................................................................................11-5211.9.4 Front Panel.......................................................................................................................................11-5411.9.5 Valid Slots........................................................................................................................................11-5511.9.6 Board Feature Code..........................................................................................................................11-5511.9.7 Technical Specifications..................................................................................................................11-56
11.10 FIB...........................................................................................................................................................11-5711.10.1 Version Description........................................................................................................................11-5711.10.2 Function and Feature......................................................................................................................11-5711.10.3 Working Principle and Signal Flow...............................................................................................11-5811.10.4 Front Panel.....................................................................................................................................11-5811.10.5 Valid Slots......................................................................................................................................11-5911.10.6 Technical Specifications................................................................................................................11-59
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12 Optical Amplifier Boards and Dispersion Compensation Boards...............................12-112.1 BA2............................................................................................................................................................. 12-2
12.1.1 Version Description............................................................................................................................12-212.1.2 Function and Feature..........................................................................................................................12-212.1.3 Working Principle and Signal Flow...................................................................................................12-312.1.4 Front Panel......................................................................................................................................... 12-512.1.5 Valid Slots..........................................................................................................................................12-712.1.6 Board Feature Code............................................................................................................................12-712.1.7 Technical Specifications.................................................................................................................... 12-7
12.2 BPA.............................................................................................................................................................12-812.2.1 Version Description............................................................................................................................12-912.2.2 Function and Feature..........................................................................................................................12-912.2.3 Working Principle and Signal Flow.................................................................................................12-1012.2.4 Front Panel.......................................................................................................................................12-1112.2.5 Valid Slots........................................................................................................................................12-1312.2.6 Board Feature Code..........................................................................................................................12-1312.2.7 Technical Specifications..................................................................................................................12-13
12.3 COA..........................................................................................................................................................12-1412.3.1 Version Description..........................................................................................................................12-1512.3.2 Function and Feature........................................................................................................................12-1512.3.3 Working Principle and Signal Flow.................................................................................................12-1812.3.4 Front Panel.......................................................................................................................................12-1912.3.5 Installation Position..........................................................................................................................12-2312.3.6 Board Feature Code..........................................................................................................................12-2412.3.7 Technical Specifications..................................................................................................................12-24
13 Power Interface Boards.........................................................................................................13-113.1 UPM............................................................................................................................................................13-2
13.1.1 Version Description............................................................................................................................13-213.1.2 Function and Feature..........................................................................................................................13-213.1.3 Working Principle and Signal Flow...................................................................................................13-313.1.4 Rear Panel.......................................................................................................................................... 13-413.1.5 Valid Slots..........................................................................................................................................13-613.1.6 Technical Specifications.................................................................................................................... 13-6
13.2 PIU.............................................................................................................................................................. 13-713.2.1 Version Description............................................................................................................................13-813.2.2 Function and Feature..........................................................................................................................13-813.2.3 Working Principle and Signal Flow...................................................................................................13-813.2.4 Front Panel......................................................................................................................................... 13-913.2.5 Valid Slots........................................................................................................................................13-1013.2.6 Technical Specifications..................................................................................................................13-10
13.3 PIUA..........................................................................................................................................................13-1113.3.1 Version Description..........................................................................................................................13-11
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
xvi Huawei Technologies Proprietary Issue 02 (2007-09-10)
13.3.2 Function and Feature........................................................................................................................13-1113.3.3 Working Principle and Signal Flow.................................................................................................13-1213.3.4 Front Panel.......................................................................................................................................13-1313.3.5 Valid Slots........................................................................................................................................13-1413.3.6 Technical Specifications..................................................................................................................13-14
14 Cables.......................................................................................................................................14-114.1 Fiber Jumper................................................................................................................................................14-2
14.1.1 Types of Fiber Jumpers......................................................................................................................14-214.1.2 Connector...........................................................................................................................................14-3
14.2 Power Cables and Grounding Cables..........................................................................................................14-514.2.1 Cabinet –48 V/BGND/PGND Power Cable.......................................................................................14-514.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable......................................................14-714.2.3 UPM Power Cable..............................................................................................................................14-9
14.3 Alarm Cable..............................................................................................................................................14-1014.3.1 Alarm Input/Output Cable................................................................................................................14-10
14.4 Management Cable....................................................................................................................................14-1214.4.1 OAM Serial Port Cable....................................................................................................................14-1214.4.2 Serial 1–4/F1/F&f Serial Port Cable................................................................................................14-1414.4.3 RS232/RS-422 Serial Port Cable.....................................................................................................14-1514.4.4 Ordinary Telephone Wire.................................................................................................................14-1714.4.5 COA Concatenating Cable...............................................................................................................14-1814.4.6 Straight Through Cable....................................................................................................................14-1914.4.7 Crossover Cable...............................................................................................................................14-20
14.5 Signal Cable..............................................................................................................................................14-2114.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-2214.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-2314.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-2614.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-2814.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-3014.5.6 Framed E1 Cable..............................................................................................................................14-3114.5.7 N x 64 kbit/s Cables.........................................................................................................................14-31
14.6 Clock Cable...............................................................................................................................................14-4814.6.1 Clock Cable......................................................................................................................................14-4814.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-50
A Equipment and Board Alarm Indicators.............................................................................A-1A.1 Indicators on the Cabinet...............................................................................................................................A-2A.2 Board Alarm Indicator...................................................................................................................................A-2
B Labels..........................................................................................................................................B-1B.1 Safety Label...................................................................................................................................................B-2
B.1.1 Label Description..................................................................................................................................B-2B.1.2 Label Position.......................................................................................................................................B-3
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B.2 Optical Module Labels...................................................................................................................................B-5B.3 Engineering Labels........................................................................................................................................B-7
C Power Consumption and Weight..........................................................................................C-1
D Board Version Configuration................................................................................................D-1
E Board Loopbacks.......................................................................................................................E-1
F Board Configuration Reference..............................................................................................F-1F.1 SDH Processing Boards..................................................................................................................................F-2F.2 PDH Processing Board...................................................................................................................................F-2F.3 Data Processing Board....................................................................................................................................F-4
F.3.1 SDH Parameters.....................................................................................................................................F-5F.3.2 Ethernet Parameters...............................................................................................................................F-6F.3.3 ATM Parameter.....................................................................................................................................F-7
F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8
G Glossary.....................................................................................................................................G-1
H Acronyms and Abbreviations...............................................................................................H-1
Index.................................................................................................................................................i-1
ContentsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
xviii Huawei Technologies Proprietary Issue 02 (2007-09-10)
Figures
Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1Figure 2-1 ETSI cabinet.......................................................................................................................................2-2Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5Figure 3-7 Slot access capacity of the OptiX OSN 1500A..................................................................................3-5Figure 3-8 Slot layout of the OptiX OSN 1500B subrack...................................................................................3-6Figure 3-9 Slot access capacity of the OptiX OSN 1500B..................................................................................3-6Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-6Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)..............................3-7Figure 4-1 Barcode of a board..............................................................................................................................4-3Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8Figure 5-4 Block diagram for the working principle of the SLQ1.....................................................................5-13Figure 5-5 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-15Figure 5-6 Front panel of the R1SLQ1.............................................................................................................. 5-16Figure 5-7 Block diagram for the working principle of the SLO1.....................................................................5-21Figure 5-8 Front panel of the SLO1...................................................................................................................5-23Figure 5-9 Block diagram for the working principle of the SLT1.....................................................................5-28Figure 5-10 Front panel of the SLT1..................................................................................................................5-30Figure 5-11 Block diagram for the working principle of the SEP1................................................................... 5-35Figure 5-12 Block diagram for the working principle of the SEP used with the EU08.....................................5-35Figure 5-13 Block diagram for the working principle of the SEP used with the OU08.................................... 5-36Figure 5-14 Front panel of the SEP1..................................................................................................................5-38Figure 5-15 Principle of the TPS protection for the SEP1 ................................................................................5-39Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-40Figure 5-17 Block diagram for the working principle of the SL4......................................................................5-44
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Issue 02 (2007-09-10) Huawei Technologies Proprietary xix
Figure 5-18 Front panel of the N1SL4/N2SL4.................................................................................................. 5-46Figure 5-19 Front panel of the R1SL4...............................................................................................................5-46Figure 5-20 Block diagram for the working principle of the SLD4...................................................................5-52Figure 5-21 Front panel of the N1SLD4/N2SLD4.............................................................................................5-54Figure 5-22 Front panel of the R1SLD4............................................................................................................5-54Figure 5-23 Block diagram for the working principle of the SLQ4...................................................................5-60Figure 5-24 Front panel of the SLQ4.................................................................................................................5-62Figure 5-25 Block diagram for the working principle of the SL16....................................................................5-67Figure 5-26 Front panel of the SL16..................................................................................................................5-69Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A....................................5-75Figure 5-28 Block diagram for the working principle of the N3SL16A............................................................5-76Figure 5-29 Front panel of the SL16A...............................................................................................................5-78Figure 5-30 Block diagram for the working principle of the SF16....................................................................5-83Figure 5-31 Front panel of the SF16..................................................................................................................5-85Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5Figure 6-3 Front panel of the PL1........................................................................................................................6-6Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11Figure 6-6 Front panel of the PD1......................................................................................................................6-13Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21Figure 6-12 Front panel of the PQ1....................................................................................................................6-23Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-28Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29Figure 6-17 Front panel of the PQM..................................................................................................................6-31Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack....6-34Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37Figure 6-22 Front panel of the PL3....................................................................................................................6-39Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-45Figure 6-27 Front panel of the PL3A.................................................................................................................6-47Figure 6-28 Block diagram for the functions of the PD3...................................................................................6-51
FiguresOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
xx Huawei Technologies Proprietary Issue 02 (2007-09-10)
Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52Figure 6-30 Front panel of the PD3....................................................................................................................6-54Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack......6-56Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-59Figure 6-35 Front panel of the PQ3....................................................................................................................6-61Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-62Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack......6-63Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-66Figure 6-39 Front panel of the DX1...................................................................................................................6-67Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-69Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-70Figure 6-42 Block diagram for the functions of the DXA................................................................................. 6-72Figure 6-43 Front panel of the DXA..................................................................................................................6-74Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-77Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-78Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-78Figure 6-47 Front panel of the SPQ4................................................................................................................. 6-81Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack......................... 6-82Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-83Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5Figure 7-2 Front panel of the EFT4......................................................................................................................7-7Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11Figure 7-4 Front panel of the EFT8....................................................................................................................7-13Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-24Figure 7-8 Front panel of the EGT2...................................................................................................................7-26Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-33Figure 7-10 Front panel of the EFS0..................................................................................................................7-35Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack.............................................................................................................................................................................7-37Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-41Figure 7-13 Front panel of the EFS4..................................................................................................................7-43Figure 7-14 Block diagram for the functions of the EGS2................................................................................ 7-49Figure 7-15 Front panel of the EGS2.................................................................................................................7-52Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-58Figure 7-17 Front panel of the EMS4................................................................................................................ 7-61Figure 7-18 Normal working of the EMS4........................................................................................................7-63Figure 7-19 Principle of the BPS protection for the EMS4............................................................................... 7-64Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-65
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Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-70Figure 7-22 Front panel of the EGS4.................................................................................................................7-73Figure 7-23 Normal working of the EGS4.........................................................................................................7-75Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-76Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-77Figure 7-26 Block diagram for the functions of the EGR2................................................................................7-82Figure 7-27 Front panel of the EGR2.................................................................................................................7-85Figure 7-28 Block diagram for the functions of the EMR0...............................................................................7-92Figure 7-29 Front panel of the N1EMR0...........................................................................................................7-95Figure 7-30 Front panel of the N2EMR0...........................................................................................................7-96Figure 7-31 Block diagram for the functions of the ADL4..............................................................................7-101Figure 7-32 Front panel of the ADL4..............................................................................................................7-103Figure 7-33 Block diagram for the functions of the ADQ1.............................................................................7-108Figure 7-34 Front panel of the ADQ1..............................................................................................................7-110Figure 7-35 Block diagram for the functions of the IDL4...............................................................................7-115Figure 7-36 Front panel of the IDL4................................................................................................................7-117Figure 7-37 Block diagram for the functions of the IDQ1...............................................................................7-123Figure 7-38 Front panel of the IDQ1................................................................................................................7-125Figure 7-39 Block diagram for the functions of the MST4..............................................................................7-130Figure 7-40 Front panel of the MST4..............................................................................................................7-132Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3Figure 8-2 Front panel of the L12S......................................................................................................................8-4Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6Figure 8-4 Front panel of the D12B.....................................................................................................................8-7Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10Figure 8-6 Front panel of the D12S....................................................................................................................8-11Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14Figure 8-8 Front panel of the L75S....................................................................................................................8-15Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17Figure 8-10 Front panel of the D75S..................................................................................................................8-18Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21Figure 8-12 Front panel of the D34S..................................................................................................................8-22Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24Figure 8-14 Front panel of the C34S..................................................................................................................8-25Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28Figure 8-16 Front panel of the EU04.................................................................................................................8-29Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31Figure 8-18 Front panel of the EU08.................................................................................................................8-32Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35Figure 8-20 Front panel of the N1OU08............................................................................................................8-36Figure 8-21 Front panel of the N2OU08............................................................................................................8-37Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40
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Figure 8-23 Front panel of the MU04................................................................................................................8-41Figure 8-24 Block diagram for the functions of the TSB8.................................................................................8-43Figure 8-25 Front panel of the TSB8.................................................................................................................8-44Figure 8-26 Block diagram for the functions of the EFF8.................................................................................8-47Figure 8-27 Front panel of the EFF8..................................................................................................................8-48Figure 8-28 Block diagram for the functions of the ETF8.................................................................................8-52Figure 8-29 Front panel of the ETF8..................................................................................................................8-53Figure 8-30 Block diagram for the functions of the ETS8.................................................................................8-57Figure 8-31 Front panel of the ETS8..................................................................................................................8-58Figure 8-32 Block diagram for the functions of the DM12................................................................................8-61Figure 8-33 Front panel of the DM12................................................................................................................8-62Figure 9-1 Block diagram for the functions of the CXL1....................................................................................9-6Figure 9-2 Block diagram of higher and lower order cross-connect modules....................................................9-9Figure 9-3 Front panel of the CXL1...................................................................................................................9-10Figure 9-4 Block diagram for the functions of the CXL4..................................................................................9-17Figure 9-5 Block diagram of higher and lower order cross-connect modules..................................................9-20Figure 9-6 Front panel of the CXL4...................................................................................................................9-21Figure 9-7 Block diagram for the functions of the CXL16................................................................................9-28Figure 9-8 Block diagram of higher and lower order cross-connect modules..................................................9-31Figure 9-9 Front panel of the CXL16.................................................................................................................9-32Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3Figure 10-2 Front panel of the EOW..................................................................................................................10-4Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9Figure 10-5 Position of J9 on the AUX............................................................................................................10-11Figure 10-6 Front panel of the AUX................................................................................................................10-12Figure 10-7 Block diagram for the functions of the AMU...............................................................................10-16Figure 10-8 Positions of orderwire bytes in the SDH frame............................................................................10-17Figure 10-9 Front panel of the AMU...............................................................................................................10-18Figure 10-10 Connection of the cabinet alarm indicators................................................................................10-20Figure 10-11 Block diagram for the functions of the FAN..............................................................................10-22Figure 10-12 Front panel of the FAN...............................................................................................................10-23Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4Figure 11-2 Front panel of the CMR2................................................................................................................11-6Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10Figure 11-4 Front panel of the CMR4..............................................................................................................11-12Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17Figure 11-6 Front panel of the MR2................................................................................................................11-18Figure 11-7 MR2A used as the OTM station...................................................................................................11-22Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23Figure 11-10 Front panel of the MR2A............................................................................................................11-24
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Figure 11-11 MR2B used as the OTM station.................................................................................................11-27Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28Figure 11-14 Front panel of the MR2B............................................................................................................11-29Figure 11-15 MR2C used as the OTM station.................................................................................................11-32Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX...........................................................................................................................................................................11-33Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33Figure 11-18 Front panel of the MR2C............................................................................................................11-35Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38Figure 11-20 Front panel of the MR4.............................................................................................................. 11-40Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45Figure 11-22 Front panel of the LWX..............................................................................................................11-47Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53Figure 11-24 Front panel of the OBU1............................................................................................................11-54Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-57Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-58Figure 11-27 Front panel of the FIB................................................................................................................ 11-59Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4Figure 12-3 Front panel of the BA2...................................................................................................................12-6Figure 12-4 Location of the BA and PA in the optical transmission system.....................................................12-9Figure 12-5 Block diagram for the working principle of the BPA...................................................................12-10Figure 12-6 Front panel of the BPA.................................................................................................................12-12Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-16Figure 12-8 Appearance of the case-shaped 62COA.......................................................................................12-17Figure 12-9 Application of the optical Raman amplifier (62COA).................................................................12-17Figure 12-10 Block diagram for the functions of the 61COA and N1COA.................................................... 12-18Figure 12-11 Front panel of the 61COA and N1COA.....................................................................................12-20Figure 12-12 Front panel of the 62COA..........................................................................................................12-20Figure 12-13 SC/PC fiber connector................................................................................................................12-21Figure 12-14 E2000 flange and fiber connector...............................................................................................12-21Figure 12-15 Position of the 61COA in the ETSI cabinet............................................................................... 12-24Figure 13-1 Appearance of the power supply case............................................................................................13-2Figure 13-2 Rear view of the UPM....................................................................................................................13-4Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9Figure 13-4 Front panel of the PIU..................................................................................................................13-10Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12Figure 13-6 Front panel of the PIUA............................................................................................................... 13-13Figure 14-1 LC/PC optical connector................................................................................................................14-3Figure 14-2 SC/PC optical connector.................................................................................................................14-4Figure 14-3 FC/PC optical connector.................................................................................................................14-4Figure 14-4 E2000/APC optical connector........................................................................................................14-5
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Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable....................................................14-6Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable..................................................................14-8Figure 14-9 PGND power cable.........................................................................................................................14-8Figure 14-10 Structure of the UPM power cable...............................................................................................14-9Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable..................................................................14-14Figure 14-14 Structure of the RS232/RS-422 serial port cable........................................................................14-16Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18Figure 14-17 Structure of the straight through cable........................................................................................14-19Figure 14-18 Structure of the crossover cable..................................................................................................14-20Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-26Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-28Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-30Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-33Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-36Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-39Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-40Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-43Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-45Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-47Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-49Figure 14-35 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-49Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-50Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-50Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4Figure B-3 Labels on a board..............................................................................................................................B-5Figure B-4 Optical module labels........................................................................................................................B-5
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Tables
Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5Table 3-1 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN1500A....................................................................................................................................................................3-7Table 3-2 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN1500B....................................................................................................................................................................3-7Table 3-3 Boards and their valid slots for the OptiX OSN 1500A.......................................................................3-8Table 3-4 Boards and their valid slots for the OptiX OSN 1500B.....................................................................3-12Table 3-5 Technical specifications of the OptiX OSN 1500A subrack..............................................................3-17Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack...................................................3-17Table 3-7 Technical specifications of the OptiX OSN 1500B subrack..............................................................3-18Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack...................................................3-18Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B.............................................................................................................................................................................4-10Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-10Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B.............................................................................................................................................................................4-12Table 5-1 Version Description of the SL1............................................................................................................5-3Table 5-2 Functions and features of the SL1........................................................................................................5-4Table 5-3 Optical interfaces of the SL1................................................................................................................5-8Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10
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Table 5-6 Version Description of the SLQ1.......................................................................................................5-12Table 5-7 Functions and features of the SLQ1...................................................................................................5-12Table 5-8 Optical interfaces of the SLQ1...........................................................................................................5-16Table 5-9 Relation between the board feature code and the optical interface type............................................5-17Table 5-10 Specifications of the optical interfaces of the SLQ1........................................................................5-18Table 5-11 Functions and features of the SLO1 board.......................................................................................5-20Table 5-12 Optical interfaces of the SLO1.........................................................................................................5-23Table 5-13 Relation between the board feature code and the optical interface type..........................................5-24Table 5-14 Specifications of the optical interfaces of the SLO1........................................................................5-25Table 5-15 Functions and features of the SLT1.................................................................................................5-26Table 5-16 Optical interfaces of the SLT1.........................................................................................................5-30Table 5-17 Specifications of the optical interfaces of the SLT1........................................................................5-31Table 5-18 Functions and features of the SEP1.................................................................................................5-33Table 5-19 Access capabilities for the SEP1......................................................................................................5-34Table 5-20 Electrical interfaces of the SEP1......................................................................................................5-39Table 5-21 Slots for the SEP1, EU08 and TSB8................................................................................................5-40Table 5-22 Technical specifications of the SEP1 board.....................................................................................5-41Table 5-23 Version Description of the SL4........................................................................................................5-42Table 5-24 Functions and features of the SL4....................................................................................................5-42Table 5-25 Optical interfaces of the SL4............................................................................................................5-47Table 5-26 Relation between the board feature code and the optical interface type of the SL4........................5-47Table 5-27 Specifications of the optical interfaces of the SL4...........................................................................5-48Table 5-28 Version Description of the SLD4.....................................................................................................5-50Table 5-29 Functions and features of the SLD4.................................................................................................5-50Table 5-30 Optical interfaces of the SLD4.........................................................................................................5-55Table 5-31 Relation between the board feature code and the optical interface type of the SLD4.....................5-56Table 5-32 Specifications of the optical interfaces of the SLD4........................................................................5-56Table 5-33 Version Description of the SLQ4.....................................................................................................5-58Table 5-34 Functions and features of the SLQ4.................................................................................................5-59Table 5-35 Optical interfaces of the SLQ4.........................................................................................................5-62Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4.....................5-63Table 5-37 Specifications of the optical interfaces of the SLQ4........................................................................5-64Table 5-38 Version Description of the SL16......................................................................................................5-65Table 5-39 Functions and features of the SL16..................................................................................................5-66Table 5-40 Optical interfaces of the SL16..........................................................................................................5-70Table 5-41 Relation between the board feature code and the optical interface type for the SL16.....................5-70Table 5-42 Specifications of the optical interfaces of the SL16.........................................................................5-71Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths.............................................................................................................................................................................5-72Table 5-44 Version Description of the SL16A...................................................................................................5-73Table 5-45 Functions and features of the SL16A...............................................................................................5-74Table 5-46 Optical interfaces of the SL16A.......................................................................................................5-78Table 5-47 Relation between the board feature code and the optical interface type..........................................5-79
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Table 5-48 Specifications of the optical interfaces of the SL16A......................................................................5-79Table 5-49 Functions and features of the SF16..................................................................................................5-81Table 5-50 Optical interfaces of the SF16..........................................................................................................5-86Table 5-51 Specifications of the optical interfaces of the SF16.........................................................................5-87Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths.............................................................................................................................................................................5-87Table 6-1 Functions and features of the PL1........................................................................................................6-3Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8Table 6-5 Version Description of the PD1...........................................................................................................6-9Table 6-6 Functions and features of the PD1.......................................................................................................6-9Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack.............................................................................................................................................................................6-14Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-14Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.......6-17Table 6-11 Version Description of the PQ1.......................................................................................................6-18Table 6-12 Functions and features of the PQ1...................................................................................................6-19Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500Bsubrack................................................................................................................................................................6-24Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack.......6-25Table 6-16 Functions and features of the PQM..................................................................................................6-27Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500Bsubrack................................................................................................................................................................6-32Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-33Table 6-19 Version description of the PL3........................................................................................................6-35Table 6-20 Functions and features of the PL3....................................................................................................6-36Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-40Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack........6-41Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42Table 6-24 Version description of the PL3A......................................................................................................6-44Table 6-25 Functions and features of the PL3A.................................................................................................6-44Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-48Table 6-27 Version Description of the PD3.......................................................................................................6-50Table 6-28 Functions and features of the PD3...................................................................................................6-50Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-55Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack.......6-56Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56
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Table 6-32 Functions and features of the PQ3...................................................................................................6-58Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-62Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack.......6-63Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-63Table 6-36 Functions and features of the DX1...................................................................................................6-65Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-68Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-70Table 6-40 Functions and features of the DXA..................................................................................................6-72Table 6-41 Version Description of the SPQ4.....................................................................................................6-76Table 6-42 Functions and features of the SPQ4.................................................................................................6-76Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-82Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-83Table 7-1 Functions and features of the EFT4.....................................................................................................7-3Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8Table 7-4 Functions and features of the EFT8.....................................................................................................7-9Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A.............................................................................................................................................................................7-15Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B.............................................................................................................................................................................7-15Table 7-9 Functions and features of the EFT8A................................................................................................7-16Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21Table 7-12 Functions and features of the EGT2.................................................................................................7-23Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-27Table 7-14 Relation between the board feature code and the optical interface type..........................................7-27Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-28Table 7-16 Version Description of the EFS0.....................................................................................................7-30Table 7-17 Functions and features of the EFS0.................................................................................................7-30Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-36Table 7-19 Version Description of the EFS4.....................................................................................................7-38Table 7-20 Functions and features of the EFS4.................................................................................................7-39Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-44Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-44Table 7-23 Version Description of the EGS2.....................................................................................................7-46Table 7-24 Functions and features of the EGS2.................................................................................................7-47Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-53
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Table 7-26 Relation between the board feature code and the optical interface type..........................................7-53Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-54Table 7-28 Functions and features of the EMS4................................................................................................7-55Table 7-29 Optical interfaces of the EMS4........................................................................................................7-62Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Asubrack................................................................................................................................................................7-62Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-62Table 7-32 Relation between the board feature code and the optical interface type..........................................7-63Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-66Table 7-34 Functions and features of the EGS4.................................................................................................7-68Table 7-35 Optical interfaces of the EGS4.........................................................................................................7-74Table 7-36 Relation between the board feature code and the optical interface type..........................................7-74Table 7-37 Specifications of the optical interfaces of the EGS4........................................................................7-78Table 7-38 Functions and features of the EGR2................................................................................................7-79Table 7-39 Optical interfaces of the EGR2 .......................................................................................................7-86Table 7-40 Relation between the board feature code and the optical interface type..........................................7-86Table 7-41 Specifications of the interfaces of the EGR2...................................................................................7-87Table 7-42 Version description of the EMR0....................................................................................................7-88Table 7-43 Comparison of features of the N1EMR0 and N2EMR0..................................................................7-88Table 7-44 Functions and features of the EMR0................................................................................................7-89Table 7-45 Optical interfaces of the EMR0 .......................................................................................................7-97Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Asubrack................................................................................................................................................................7-97Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-97Table 7-48 Relation between the board feature code and the optical interface type..........................................7-98Table 7-49 Specifications of the optical interfaces of the EMR0.......................................................................7-98Table 7-50 Functions and features of the ADL4..............................................................................................7-100Table 7-51 Optical interface of the ADL4 .......................................................................................................7-104Table 7-52 Relation between the board feature code and the optical interface type........................................7-104Table 7-53 Specifications of the optical interfaces of the ADL4.....................................................................7-105Table 7-54 Functions and features of the ADQ1..............................................................................................7-107Table 7-55 Optical interfaces of the ADQ1 .....................................................................................................7-111Table 7-56 Relation between the board feature code and the optical interface type........................................7-111Table 7-57 Specifications of the optical interfaces of the ADQ1.....................................................................7-112Table 7-58 Functions and features of the IDL4................................................................................................7-114Table 7-59 Optical interface of the IDL4 ........................................................................................................7-118Table 7-60 Relation between the board feature code and the optical interface type........................................7-118Table 7-61 Specifications of the optical interfaces of the IDL4.......................................................................7-119Table 7-62 Functions and features of the IDQ1...............................................................................................7-121Table 7-63 Optical interfaces of the IDQ1 ......................................................................................................7-126Table 7-64 Relation between the board feature code and the optical interface type........................................7-126
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Table 7-65 Specifications of the optical interfaces of the IDQ1......................................................................7-127Table 7-66 Functions and features of the MST4..............................................................................................7-129Table 7-67 Services and service rates provided by the MST4.........................................................................7-129Table 7-68 Optical interfaces of the MST4......................................................................................................7-133Table 7-69 Relation between the board feature code and service type............................................................7-133Table 7-70 Specifications of the optical interfaces of the MST4.....................................................................7-134Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack...............................................................................................................................................................................8-5Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack...............................................................................................................................................................................8-8Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-12Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-19Table 8-12 Interfaces of the D34S......................................................................................................................8-22Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-23Table 8-14 Specifications of the electrical interfaces of the D34S....................................................................8-23Table 8-15 Interfaces of the C34S......................................................................................................................8-26Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-26Table 8-17 Specifications of the electrical interfaces of the C34S.....................................................................8-26Table 8-18 Interfaces of the EU04.....................................................................................................................8-29Table 8-19 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30Table 8-20 Specifications of the electrical interfaces of the EU04....................................................................8-30Table 8-21 Interfaces of the EU08.....................................................................................................................8-33Table 8-22 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33Table 8-23 Specifications of the electrical interfaces of the EU08....................................................................8-33Table 8-24 Version description of the OU08.....................................................................................................8-34Table 8-25 Interfaces of the N1OU08................................................................................................................8-37Table 8-26 Interfaces of the N2OU08................................................................................................................8-38Table 8-27 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38Table 8-28 Specifications of the optical interfaces of the OU08........................................................................8-38Table 8-29 Interfaces of the MU04....................................................................................................................8-41Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42Table 8-31 Specifications of the electrical interfaces of the MU04...................................................................8-42Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-45
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Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-45Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-45Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-45Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-46Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-46Table 8-38 Interfaces of the EFF8......................................................................................................................8-49Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-49Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-49Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-49Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-50Table 8-43 Specifications of the optical interfaces of the EFF8........................................................................8-50Table 8-44 Interfaces of the ETF8......................................................................................................................8-53Table 8-45 Pins of the RJ-45 connector of the ETF8.........................................................................................8-54Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-54Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-55Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-55Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-55Table 8-50 Specifications of the electrical interfaces of the ETF8....................................................................8-55Table 8-51 Interfaces of the ETS8......................................................................................................................8-58Table 8-52 Pins of the RJ-45 connector of the ETS8.........................................................................................8-59Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-59Table 8-54 Specifications of the electrical interfaces of the ETS8....................................................................8-59Table 8-55 Interfaces on the front panel of the DM12.......................................................................................8-62Table 8-56 Pins of the DB44 interfaces of the DM12........................................................................................8-63Table 8-57 Pins of the DB28 interfaces of the DM12........................................................................................8-64Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-64Table 9-1 Function and feature of the SDH processing unit of the CXL1...........................................................9-3Table 9-2 Function and feature of the SCC unit of the CXL1.............................................................................9-3Table 9-3 Function and feature of the cross-connect unit of the CXL1...............................................................9-4Table 9-4 Function and feature of the clock unit of the CXL1............................................................................9-5Table 9-5 Optical interface and switches on the CXL1......................................................................................9-11Table 9-6 Relation between the board feature code and the optical interface type............................................9-11Table 9-7 Logical slots displayed on the T2000 for the CXL1..........................................................................9-12Table 9-8 Specifications of the optical interfaces of the CXL1.........................................................................9-12Table 9-9 Function and feature of the SDH processing unit of the CXL4.........................................................9-14Table 9-10 Function and feature of the SCC unit of the CXL4.........................................................................9-15Table 9-11 Function and feature of the cross-connect unit of the CXL4...........................................................9-16Table 9-12 Function and feature of the clock unit of the CXL4........................................................................9-16Table 9-13 Optical interface and switches on the CXL4....................................................................................9-22Table 9-14 Relation between the board feature code and the optical interface type..........................................9-22Table 9-15 Logical slots displayed on the T2000 for the CXL4........................................................................9-23Table 9-16 Specifications of the optical interfaces of the CXL4.......................................................................9-23
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Table 9-17 Function and feature of the SDH processing unit of the CXL16.....................................................9-25Table 9-18 Function and feature of the SCC unit of the CXL16.......................................................................9-26Table 9-19 Function and feature of the cross-connect unit of the CXL16.........................................................9-27Table 9-20 Function and feature of the clock unit of the CXL16......................................................................9-27Table 9-21 Optical interface and switches on the CXL16..................................................................................9-33Table 9-22 Relation between the board feature code and the optical interface type..........................................9-33Table 9-23 Logical slots displayed on the T2000 for the CXL16......................................................................9-34Table 9-24 Specifications of the optical interfaces of the CXL16.....................................................................9-34Table 10-1 Functions and features of the EOW.................................................................................................10-2Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-4Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5Table 10-5 Functions and features of the AUX..................................................................................................10-7Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-13Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-13Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-14Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14Table 10-12 Functions and features of the AMU.............................................................................................10-16Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-18Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-19Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-19Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19Table 10-17 Functions and features of the FAN..............................................................................................10-21Table 11-1 Functions and features of the CMR2...............................................................................................11-3Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7Table 11-3 Feature code of the CMR2...............................................................................................................11-7Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8Table 11-5 Functions and features of the CMR4.............................................................................................11-10Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13Table 11-7 Feature code of the CMR4.............................................................................................................11-13Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14Table 11-9 Functions and features of the MR2................................................................................................11-16Table 11-10 Optical interfaces of the MR2......................................................................................................11-19Table 11-11 Feature code of the MR2..............................................................................................................11-19Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20Table 11-13 Functions and features of the MR2A...........................................................................................11-22Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25Table 11-16 Functions and features of the MR2B...........................................................................................11-27Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30
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Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30Table 11-19 Functions and features of the MR2C...........................................................................................11-32Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36Table 11-22 Functions and features of the MR4..............................................................................................11-37Table 11-23 Optical interfaces of the MR4......................................................................................................11-41Table 11-24 Board feature code.......................................................................................................................11-41Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-42Table 11-26 Functions and features of the LWX.............................................................................................11-44Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-48Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-49Table 11-31 Functions and features of the OBU1............................................................................................11-52Table 11-32 Optical interfaces of the OBU1....................................................................................................11-55Table 11-33 Feature code of the OBU1............................................................................................................11-55Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-56Table 11-35 Functions and features of the FIB................................................................................................11-58Table 11-36 Optical interfaces of the FIB .......................................................................................................11-59Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-60Table 12-1 Functions and features of the BA2...................................................................................................12-3Table 12-2 Optical interfaces of the BA2 ..........................................................................................................12-7Table 12-3 Relation between the board feature code and output optical power for the BA2............................12-7Table 12-4 Specifications of the optical interfaces of the BA2..........................................................................12-8Table 12-5 Functions and features of the BPA...................................................................................................12-9Table 12-6 Optical interfaces of the BPA .......................................................................................................12-13Table 12-7 Relation between the board feature code and output optical power for the BPA..........................12-13Table 12-8 Specifications of the optical interfaces of the BPA........................................................................12-14Table 12-9 Version Description of the COA....................................................................................................12-15Table 12-10 Functions and features of the 61COA and N1COA.....................................................................12-16Table 12-11 Functions and features of the 62COA..........................................................................................12-18Table 12-12 Pins of the RS232 interface..........................................................................................................12-22Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-22Table 12-14 Pins of the RJ-45 connector of the 62COA..................................................................................12-23Table 12-15 Relation between the board feature code and output optical power for the 61COA...................12-24Table 12-16 Specifications of the optical interfaces of the COA.....................................................................12-24Table 13-1 Functions and features of the UPM..................................................................................................13-3Table 13-2 Interfaces on the rear panel of the UPM..........................................................................................13-5Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5Table 13-4 Specifications of the power supply of the UPM..............................................................................13-6Table 13-5 Functions and features of the PIU....................................................................................................13-8Table 13-6 Interfaces on the front panel of the PIU.........................................................................................13-10
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Table 13-7 Functions and features of the PIUA...............................................................................................13-12Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14Table 14-1 Types of fiber jumpers.....................................................................................................................14-2Table 14-2 Types of connectors.........................................................................................................................14-3Table 14-3 Equipment –48 V/–60 V power cable..............................................................................................14-8Table 14-4 Connection of the UPM power cable...............................................................................................14-9Table 14-5 Specifications of the UPM power cable.........................................................................................14-10Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable............................................................14-15Table 14-9 Pin assignment of the RS232/RS-422 serial port cable.................................................................14-16Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18Table 14-12 Pin assignment of the straight through cable...............................................................................14-19Table 14-13 Pin assignment of the crossover cable.........................................................................................14-20Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-22Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-28Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-31Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-33Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-35Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-36Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-37Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-38Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-39Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-41Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-42Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-43Table 14-32 Specifications of the RS449 DTE cable.......................................................................................14-44Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-45Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-46Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-47Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-48Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-49Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-51Table B-1 Labels on the equipment.....................................................................................................................B-2Table B-2 Optical module code and type mapping table.....................................................................................B-5
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Table B-3 Huawei specifications for engineering labels.....................................................................................B-7Table C-1 Power consumption and weight of each board for the OptiX OSN 1500..........................................C-1Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-2Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-3Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-4Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6
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About This Document
OverviewThis document describes the equipment structure, subrack structure and board classification.This document also describes each board of different classes in details.
This document helps you get the detailed information on the equipment hardware.
Product VersionsThe following table lists the product versions related to this document.
Product Name Version
OptiX OSN 1500 V100R007
OptiX iManager T2000 V200R005C01
Intended AudienceThe intended audience of this document are:
l Network planners and designers
l Installation personnel
l Commissioning engineers
l Network monitors
l Data configuration engineers
l Maintenance engineers
l On-site maintenance engineers
OrganizationThis document describes the cabinet, subrack, boards and each unit of the boards in terms of thefunction and working principle.
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Issue 02 (2007-09-10) Huawei Technologies Proprietary 1
Chapter Description
1 Equipment Structure This chapter describes the structure of the equipment.
2 Cabinet This chapter describes the dimensions, appearance andtechnical specifications of the cabinet. This chapter alsodescribes the configuration of the equipment in eachcabinet.
3 Subrack This chapter describes the structure of the subrack.
4 Board List andClassification
This chapter describes the classification of boards andappearance of the boards.
5 SDH Processing Boards This chapter describes the SDH processing boards in termsof the function, principle, front panel, interface andtechnical specifications.
6 PDH Processing Boards This chapter describes the PDH processing boards in termsof the function, principle, front panel, interface andtechnical specifications.
7 Data Processing Boards This chapter describes the data processing boards in termsof the function, principle, front panel, interface andtechnical specifications.
8 Interface Boards andSwitching Boards
This chapter describes the interface boards and switchingboards in terms of the function, principle, front panel,interface and technical specifications.
9 Cross-Connect and SystemControl Boards
This chapter describes the cross-connect and system controlboards in terms of the function, principle, front panel,interface and technical specifications.
10 Auxiliary Boards This chapter describes the auxiliary boards in terms of thefunction, principle, front panel, interface and technicalspecifications.
11 WDM Processing Boards This chapter describes the WDM processing boards interms of the function, principle, front panel, interface andtechnical specifications.
12 Optical Amplifier Boardsand DispersionCompensation Boards
This chapter describes the optical amplifier boards anddispersion compensation boards in terms of the function,principle, front panel, interface and technicalspecifications.
13 Power Interface Boards This chapter describes the power interface boards in termsof the function, principle, front panel, interface andtechnical specifications.
14 Cables This chapter describes the external cables and internalcables in terms of the structure, appearance, pin assignmentand technical specifications.
A Equipment and BoardAlarm Indicators
This appendix describes the indication of the equipment andboard alarm indicators.
About This DocumentOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Chapter Description
B Labels This appendix describes the safety labels, optical modulelabels and engineering labels.
C Power Consumption andWeight
This appendix describes the power consumption and weightof each board.
D Board VersionConfiguration
This appendix describes the compatibility among theproduct versions.
E Board Loopbacks This appendix describes the loopback capabilities of theboards.
F Board ConfigurationReference
This appendix describes the parameters that can beconfigured by using the T2000.
G Glossary This appendix lists the terms used in this document.
H Acronyms andAbbreviations
This appendix lists the acronyms and abbreviations used inthis document.
Conventions
Symbol ConventionsThe following symbols may be found in this document. They are defined as follows.
Symbol Description
DANGERIndicates a hazard with a high level of risk which, if notavoided, will result in death or serious injury.
WARNINGIndicates a hazard with a medium or low level of risk which,if not avoided, could result in minor or moderate injury.
CAUTIONIndicates a potentially hazardous situation that, if notavoided, could cause equipment damage, data loss, andperformance degradation, or unexpected results.
TIP Indicates a tip that may help you solve a problem or saveyou time.
NOTE Provides additional information to emphasize orsupplement important points of the main text.
General ConventionsConvention Description
Times New Roman Normal paragraphs are in Times New Roman.
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Issue 02 (2007-09-10) Huawei Technologies Proprietary 3
Convention Description
Boldface Names of files, directories, folders, and users are in boldface. Forexample, log in as user root.
Italic Book titles are in italics.
Courier New Terminal display is in Courier New.
Command ConventionsConvention Description
Boldface The keywords of a command line are in boldface.
Italic Command arguments are in italic.
[ ] Items (keywords or arguments) in square brackets [ ] are optional.
{ x | y | ... } Alternative items are grouped in braces and separated by vertical bars.One is selected.
[ x | y | ... ] Optional alternative items are grouped in square brackets andseparated by vertical bars. One or none is selected.
{ x | y | ... } * Alternative items are grouped in braces and separated by vertical bars.A minimum of one or a maximum of all can be selected.
GUI ConventionsConvention Description
Boldface Buttons, menus, parameters, tabs, window, and dialog titles are inboldface. For example, click OK.
> Multi-level menus are in boldface and separated by the “>” signs. Forexample, choose File > Create > Folder.
Keyboard OperationFormat Description
Key Press the key. For example, press Enter and press Tab.
Key 1+Key 2 Press the keys concurrently. For example, pressing Ctrl+Alt+A meansthe three keys should be pressed concurrently.
Key 1, Key 2 Press the keys in turn. For example, pressing Alt, A means the two keysshould be pressed in turn.
About This DocumentOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Mouse OperationAction Description
Click Select and release the primary mouse button without moving the pointer.
Double-click Press the primary mouse button twice continuously and quickly withoutmoving the pointer.
Drag Press and hold the primary mouse button and move the pointer to a certainposition.
Update HistoryUpdates between document versions are cumulative. Therefore, the latest document versioncontains all updates made to previous versions.
Updates in Issue 02 (2007-09-10) Based on Product Version V100R007
The updated contents are as follows.
This release of the document fixes several bugs, adds product labels, and checks the parametersof the dimensions and weight. It also details function block diagram and relative description foreach board.
Updates in Issue 01 (2007-06-15) Based on Product Version V100R007
This document of the V100R007 version is of the first release. Compared with the V100R006,this version has the following new or optimized content:l The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2,
TN11MR4, TN11CMR2, TN11CMR4 are added.l Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are
added.l The structure of the board description is adjusted and optimized. First the board version is
described, and then the board function and feature, working principle and signal flow, frontpanel, valid slots, board feature code, board configuration reference, technicalspecifications and so on are described.
Updates in Issue 03 (2007-03-30) Based on Product Version V100R006
The updated contents are as follows.
This release of the document fixes several bugs, adds product labels. It also checks the parametersof the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.
Updates in Issue 02 (2007-01-10) Based on Product Version V100R006
The updated contents are as follows.
This release of the document fixes several bugs in the document of previous version. The T2000is upgraded from V200R003C02 to V200R004C01.
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Issue 02 (2007-09-10) Huawei Technologies Proprietary 5
Updates in Issue 01 (2006-09-20) Based on Product Version V100R006This document of the V100R006 version is of the first release.
Updates in Issue 03 (2006-11-20) Based on Product Version V100R005The updated contents are as follows.
With updated naming of versions, this release of the document fixes several bugs in the manualof the previous version.
Updates in Issue 02 (2006-06-20) Based on Product Version V100R005The former manual version is T2-042521-20060620-C-1.51.
The updated contents are as follows.
This release of the document fixes several bugs in the manual of the previous version.
Updates in Issue 01 (2006-03-20) Based on Product Version V100R005The former manual version is T2-042521-20060320-C-1.50.
This document of the V100R005 version is of the first release.
About This DocumentOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
1 Equipment Structure
The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiXOSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inchcabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500Acan be installed on the desk.
Figure 1-1 shows the appearance of the OptiX OSN 1500A.
Figure 1-1 Appearance of the OptiX OSN 1500A
Figure 1-2 shows the appearance of the OptiX OSN 1500B.
Figure 1-2 Appearance of the OptiX OSN 1500B
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2 Cabinet
About This Chapter
The OptiX OSN subracks are installed in the cabinets.
2.1 Cabinet TypeThe OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inchcabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrackcan be installed against the wall.
2.2 Cabinet ConfigurationOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).
2.3 Technical SpecificationsThe specifications of the cabinet cover the dimensions, weight and number of allowed subracks.
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2.1 Cabinet TypeThe OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inchcabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrackcan be installed against the wall.
The OptiX OSN 1500 can be installed in the following cabinets:
l 300-mm deep ETSI cabinet
l 600-mm deep ETSI cabinet
l 19-inch cabinet
l Cabinet used for the access network equipment
2.2 Cabinet ConfigurationOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).
Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet.
Figure 2-1 ETSI cabinet
1
2
PowerCritical MajorMinor
Power distribution unit
W
H
D
1. Cabinet indicator 2. DC PDU
2.2.1 Cabinet IndicatorThe indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.
2.2.2 DC PDUThe DC PDU is on the top of the cabinet and used to supply power for the equipment.
2.2.3 Other Configuration
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The external case-shaped devices can be installed in the cabinet as required.
2.2.1 Cabinet IndicatorThe indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.
Table 2-1 lists the information about the indicators on the ETSI cabinet.
Table 2-1 Indicators on the ETSI cabinet
Indicator State Indication
Normal power supply indicator: Power(green)
Lit The power is suppliedto the equipment.
Unlit No power is supplied tothe equipment.
Critical alarm indicator: Critical (red) Lit Critical alarms aregenerated in theequipment.
Unlit No critical alarms aregenerated in theequipment.
Major alarm indicator: Major (orange) Lit Major alarms aregenerated in theequipment.
Unlit No major alarms aregenerated in theequipment.
Minor alarm indicator: Minor (yellow) Lit Minor alarms aregenerated in theequipment.
Unlit No minor alarms aregenerated in theequipment.
CAUTIONThe cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after thecables are correctly connected and the subrack is powered on.
2.2.2 DC PDUThe DC PDU is on the top of the cabinet and used to supply power for the equipment.
Figure 2-2 shows the appearance of the DC PDU.
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Figure 2-2 Appearance of the DC PDU
NEG2(-)
INPUT
RTN2(+)RTN1(+) NEG1(-)
2 3 4 5
ON
OFF20A32A 32A 20A
ON
OFF
1 2 3 4
1 6
1 2 3 4
20A32A 32A 20A
OUTPUT OUTPUTA B
7 8
1. Power terminal (A) 2. Power cable RTN1 (+)3. Power cable RTN2 (+) 4. Power cable NEG1 (–)5. Power cable NEG2 (–) 6. Power terminal (B)7. PGND 8. Power switch
For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIUboards at side A and side B of the subrack respectively. Table 2-2 shows the connections of thepower terminals at side A and side B.
For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boardsat the upper and lower subrack respectively.
Table 2-2 Connection of power terminals at side A and side B
PowerTerminal atSide A
Corresponding Subrackand PIU Board
PowerTerminalat Side B
Corresponding Subrackand PIU Board
1 The PIU board at side A ofthe first subrack
1 The PIU board at side B ofthe first subrack
2 The PIU board at side A ofthe second subrack
2 The PIU board at side B ofthe second subrack
3 The PIU board at side A ofthe third subrack
3 The PIU board at side B ofthe third subrack
4 The PIU board at side A ofthe fourth subrack
4 The PIU board at side B ofthe fourth subrack
2.2.3 Other ConfigurationThe external case-shaped devices can be installed in the cabinet as required.l UPM
The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPMdirectly converts the 220 V mains supply to the –48 V DC power supply required by the
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2-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
communication equipment. If operators cannot provide the –48 V DC power supply for theequipment or require that the battery be used, the UPM can be applied.
l COA
l Fiber management spool, which is used to spool the redundant fibers inside the cabinet.
2.3 Technical SpecificationsThe specifications of the cabinet cover the dimensions, weight and number of allowed subracks.
Table 2-3 lists the technical specifications of the ETSI cabinet.
Table 2-3 Technical specifications of the ETSI cabinet
Dimensions (mm) Weight (kg) Number of Allowed OptiXOSN 1500A/1500B Subracks
600 (W) x 300 (D) x 2000 (H) 55 The number of allowed OptiXOSN 1500A/1500B subracksvaries with the cabinet capacityand the number of the powersupplies.
600 (W) x 600 (D) x 2000 (H) 79
600 (W) x 300 (D) x 2200 (H) 60
600 (W) x 600 (D) x 2200 (H) 84
600 (W) x 300 (D) x 2600 (H) 70
600 (W) x 600 (D) x 2600 (H) 94
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3 Subrack
About This Chapter
This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technicalspecifications.
3.1 StructureThe OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot areafor boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrackis of a two-layer structure. The subrack consists of the slot area for processing boards, slot areafor interface boards, slot area for the auxiliary interface board, power supply area and fan area.
3.2 CapacityBoth the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-width slots. These slots have different service access capacities before and after the slot division.
3.3 Slot AllocationThe OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the divisionof slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where fourslots are present, is the slot area for interface boards. The lower tier of the subrack, where tenslots are present before the division of slots (including slots 4 and 5), is the slot area for processingboards.
3.4 Technical SpecificationsThe specifications of the subrack cover dimensions, weight and maximum power consumption.
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3.1 StructureThe OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot areafor boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrackis of a two-layer structure. The subrack consists of the slot area for processing boards, slot areafor interface boards, slot area for the auxiliary interface board, power supply area and fan area.
Figure 3-1 shows the structure of the OptiX OSN 1500A subrack.
Figure 3-1 Structure of the OptiX OSN 1500A subrack
1
2
4
5
6
3
W
H
D
1. Fan area 2. Slot area for boards 3. Power supply area4. Slot area for interface boards 5. Fiber routing area 6. Mounting ear
The functions of these areas are as follows:
l Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A.
l Fan area: This area is used to house one fan module, which dissipates heat generated bythe equipment.
l Power supply area: This area is used to house two PIU boards, which are used to supplypower for the equipment.
l Fiber routing area: This area is used to route fibers and cables in the subrack.
Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.
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Figure 3-2 Structure of the OptiX OSN 1500B subrack
3
4
5
6
7
1
2
4
W
H
D
1. Slot area for interface boards 2. Power supply area 3. Fan area4. Slot area for processing boards 5. Slot area for the auxiliary interface board 6. Fiber routing area7. Mounting ear
The functions of these areas are as follows:
l Slot area for interface boards: This area is used to house the tributary interface boards andEthernet interface boards for the OptiX OSN 1500B.
l Slot area for processing boards: This area is used to house the line, tributary and Ethernetprocessing boards for the OptiX OSN 1500B.
l Fan area: This area is used to house one fan module, which dissipates heat generated bythe equipment.
l Slot area for the auxiliary interface board: This area is used to house the auxiliary interfaceboard, which provides alarm interfaces, orderwire phone interface, management andmaintenance interface, and clock interface.
l Power supply area: This area is used to house two PIU boards, which are used to supplypower for the equipment.
l Fiber routing area: This area is used to route fibers and cables in the subrack.
3.2 CapacityBoth the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-width slots. These slots have different service access capacities before and after the slot division.
In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In theOptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots. Figure 3-3 shows
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the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity ofthe OptiX OSN 1500B.
In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots.
l When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.
l When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.
l When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s.
l When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.
In the OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots.
l When slot 11 is divided, the two half-width slots are numbered slot 1 and slot 11.
l When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.
l When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.
l When slots 11–13 are not divided, the access capacity of each slot is 2.5 Gbit/s.
l When slots 11–13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.
Figure 3-3 Slot access capacity of the OptiX OSN 1500A
XCS A XCS B
Slot20
Slot 1 Slot 11 Slot 6
Slot 2/12 Slot 7
Slot 3/13 Slot 8
Slot 4 Slot 9
Slot 5 Slot 102.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
1.25Gbit/s
1.25Gbit/s
1.25Gbit/s
1.25Gbit/s
PIU PIU
FAN
AUX
Figure 3-4 Slot access capacity of the OptiX OSN 1500B
Slot 14 Slot 18 PIU
Slot 15
Slot 16
Slot 17
Slot 20
FAN
Slot 1/11
Slot 2/12
Slot 3/13
Slot 4
Slot 19 PIU
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
622Mbit/s
622Mbit/s
622Mbit/s
622Mbit/s
3.3 Slot AllocationThe OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the divisionof slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four
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slots are present, is the slot area for interface boards. The lower tier of the subrack, where tenslots are present before the division of slots (including slots 4 and 5), is the slot area for processingboards.
Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack.
Figure 3-5 Slot layout of the OptiX OSN 1500A subrack
Slot 20
FAN
Slot 1
Slot 12
Slot 13
Slot 4
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
CXL16/4/1
CXL16/4/1
EOW
Slot 11
Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slotsrespectively. See Figure 3-6.
Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots
Slot 20
FAN
Slot 1
Slot 2
Slot 3
Slot 4
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
CXL16/4/1
CXL16/4/1
EOW
Slot 12
Slot 11
Slot 13
Figure 3-7 shows the slot access capacity of the OptiX OSN 1500A.
Figure 3-7 Slot access capacity of the OptiX OSN 1500A
XCS A XCS B
Slot20
Slot 1 Slot 11 Slot 6
Slot 2/12 Slot 7
Slot 3/13 Slot 8
Slot 4 Slot 9
Slot 5 Slot 102.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
1.25Gbit/s
1.25Gbit/s
1.25Gbit/s
1.25Gbit/s
When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots12 and 13 are divided, the access capacity of each slot is 1.25 Gbit/s.
The slots in the OptiX OSN 1500A subrack are allocated as follows:
l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5
l Slots for processing boards before the division of slots: slots 6–9 and 12–13
l Slots for processing boards after the division of slots: slots 6–9, 12–13, and 2–3
l Slot for the orderwire board: slot 9 (also for the processing board)
l Slot for the auxiliary interface board: slot 10
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l Slots for PIU boards: slots 1 and 11
l Slots for the fan board: slot 20
Figure 3-8 shows the slot layout of the OptiX OSN 1500B subrack. Figure 3-9 shows the slotaccess capacity of the OptiX OSN 1500B.
Figure 3-8 Slot layout of the OptiX OSN 1500B subrack
Slot 14 Slot 18 PIU
Slot 15
Slot 16
Slot 17
Slot 20
FAN
Slot 11
Slot 12
Slot 13
Slot 4
Slot 19 PIU
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
CXL16/4/1CXL16/4/1
EOW
Interface board
Interface board
Interface board
Interface boardProcessing board
Processing board
Processing board
Processingboard
Processingboard
Processingboard
Figure 3-9 Slot access capacity of the OptiX OSN 1500B
Slot 14 Slot 18 PIU
Slot 15
Slot 16
Slot 17
Slot 20
FAN
Slot 11
Slot 12
Slot 13
Slot 4
Slot 19 PIU
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
2.5Gbit/s
622Mbit/s
622Mbit/s
622Mbit/s
622Mbit/s
NOTE
Slots 11–13 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-10, the divided slotsare in the dashed area. The slots in the left portion of the original slots are slots 1–3, and the slots in theright portion of the original slots are slots 11–13. After the division of slots, the maximum access capacityof each slot is 1.25 Gbit/s. See Figure 3-11.
Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14 Slot 18 PIU
Slot 15
Slot 16
Slot 17
Slot 20
FAN
Slot 1
Slot 2
Slot 3
Slot 4
Slot 19 PIU
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
CXL16/4/1
CXL16/4/1
EOW
Slot 11
Slot 12
Slot 13
Interface boardInterface board
Interface board
Interface board
Interface boardProcessing
boardProcessing
boardProcessing
board
Processingboard
Processingboard
Processingboard
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Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14 Slot 18 PIU
Slot 15
Slot 16
Slot 17
Slot 20
FAN
Slot 1
Slot 2
Slot 3
Slot 4
Slot 19 PIU
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
2.5 Gbit/s
2.5 Gbit/s
622 Mbit/s
622 Mbit/s
622 Mbit/s
622 Mbit/s
Slot 11
Slot 12
Slot 13
1.25 Gbit/s
1.25 Gbit/s
1.25 Gbit/s
1.25 Gbit/s
1.25 Gbit/s
1.25 Gbit/s
The slots in the OptiX OSN 1500B subrack are allocated as follows:
l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5
l Slots for processing boards before the division of slots: slots 6–9 and 11–13
l Slots for processing boards after the division of slots: slots 1–9 and 11–13
l Slots for the interface boards: slots 14–17
l Slot for the orderwire board: slot 9 (also for the processing board)
l Slot for the auxiliary interface board: slot 10
l Slots for PIU boards: slots 18 and 19
l Slot for the fan board: slot 20
Mapping Relation Between Slots for Interface Boards and Slots for ProcessingBoards
Table 3-1 lists the mapping relation between slots for interface boards and slots for processingboards of the OptiX OSN 1500A.
Table 3-1 Mapping relation between slots for interface boards and slots for processing boardsof the OptiX OSN 1500A.
Slots for Processing Boards Slots for Interface Boards
Slot 12 Slots 6 and 7
Table 3-2 lists the mapping relation between slots for interface boards and slots for processingboards of the OptiX OSN 1500B.
Table 3-2 Mapping relation between slots for interface boards and slots for processing boardsof the OptiX OSN 1500B.
Slots forProcessingBoards
Slots for InterfaceBoards
Slots forProcessingBoards
Slots for InterfaceBoards
Slot 2 Slot 14 Slot 3 Slot 16
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Slots forProcessingBoards
Slots for InterfaceBoards
Slots forProcessingBoards
Slots for InterfaceBoards
Slot 7 Slot 15 Slot 8 Slot 17
Slot 12 Slots 14 and 15 Slot 13 Slots 16 and 17
The corresponding interface boards for the PD3, PL3, SEP, and SPQ4 can be housed only inslots of even numbers.
The boards housed in slots 12 and 7 share the same interface board housed in slot 15, and theboards housed in slots 13 and 8 share the same interface board housed in slot 17. Therefore,when you configure the boards:
l If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot houseany board used with an interface board.
l If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot houseany board used with an interface board.
Boards and Their Valid Slots
Table 3-3 lists the boards and their valid slots for the OptiX OSN 1500A.
Table 3-3 Boards and their valid slots for the OptiX OSN 1500A
Board Full Name Valid Slots
Q2CXL16 STM-16 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
Q2CXL4 STM-4 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
Q2CXL1 STM-1 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
N1SL16 (A) 1 x STM-16 optical interfaceboard
Slots 12 and 13
N2SL16 (A) 1 x STM-16 optical interfaceboard
Slots 12 and 13
N3SL16 (A) 1 x STM-16 optical interfaceboard
Slots 12 and 13
N1SF16 1 x STM-16 optical interfaceboard (with FEC)
Slots 12 and 13
N1SLQ4 4 x STM-4 optical interface board Slots 12 and 13
N2SLQ4 4 x STM-4 optical interface board Slots 12 and 13
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Board Full Name Valid Slots
N1SLD4 2 x STM-4 optical interface board Slots 12 and 13
N2SLD4 2 x STM-4 optical interface board Slots 12 and 13
N1SL4 1 x STM-4 optical interface board Slots 12 and 13
N2SL4 1 x STM-4 optical interface board Slots 12 and 13
N1SLT1 12 x STM-1 optical interfaceboard
Slots 12 and 13
N2SLO1 8 x STM-1 optical interface board Slots 12 and 13
N1SLQ1 4 x STM-1 optical interface board Slots 12 and 13
N2SLQ1 4 x STM-1 optical interface board Slots 12 and 13
N1SL1 1 x STM-1 optical interface board Slots 12 and 13
N2SL1 1 x STM-1 optical interface board Slots 12 and 13
N1SEP1 2 x STM-1 line processing board Slots 12 and 13
R1SLD4 2 x STM-4 optical interface board(half-width)
Slots 2–3, 6–9, and 12–13
R1SL4 1 x STM-4 optical interface board(half-width)
Slots 2–3, 6–9, and 12–13
R1SLQ1 4 x STM-1 optical interface board(half-width)
Slots 2–3, 6–9, and 12–13
R1SL1 1 x STM-1 optical interface board(half-width)
Slots 2–3, 6–9, and 12–13
N1PL3A 3 x E3/T3 processing board (notused with the interface board)
Slots 12 and 13
N2PL3A 3 x E3/T3 processing board (notused with the interface board)
Slots 12 and 13
R1PD1A 32 x E1 processing board (half-width)
Slots 2 and 12
R1PD1B 32 x E1 processing board (half-width)
Slots 2 and 12
R2PD1 32 x E1/T1 hybrid processingboard (half-width)
Slots 2 and 12
R1PL1A 16 x E1 processing board (half-width)
Slots 6–9
R1PL1B 16 x E1 processing board (half-width)
Slots 6–9
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Board Full Name Valid Slots
R1L75S 16 x EI 75-ohm interface board(half-width)
Slots 6 and 7
R1L12S 16 x E1 120-ohm interface board(half-width)
Slots 6 and 7
N2EGR2 2 x GE Ethernet ring processingboard
Slots 12 and 13 (2.5 Gbit/s)
N1EGS2 2 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)
N2EGS2 2 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)
N1EFS4 4 x 10M/100M Ethernetprocessing board
Slots 12 and 13
N2EFS4 4 x 10M/100M Ethernetprocessing board
Slots 12 and 13 (1.25 Gbit/s)
N1EMS4 4 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)
N1EGS4 4 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)
N1EGT2 2 x GE Ethernet transparenttransmission board
Slots 12 and 13 (2.5 Gbit/s)
R1EFT4 4 x 10M/100M Ethernettransparent transmission board(half-width)
Slots 2–3, 12–13 and 6–9 (622Mbit/s)
N1EFT8 (not usedwith the interfaceboard)
8 x 10M/100M Ethernettransparent transmission board
Slots 12–13 (622 Mbit/s)
N1EMR0 (not usedwith the interfaceboard)
1 x GE and 4 x FE Ethernetprocessing board
Slots 12 and 13 (2.5 Gbit/s)
N2EMR0 (not usedwith the interfaceboard)
1 x GE and 4 x FE Ethernetprocessing board
Slots 12 and 13 (2.5 Gbit/s)
N1EFT8A 8 x FE transparent transmissionboard (interfaces are available onthe front panel)
Slots 12 and 13 (622 Mbit/s)
N1ADL4 1 x STM-4 ATM processingboard
Slots 12 and 13 (1.25 Gbit/s)
N1ADQ1 4 x STM-1 ATM processingboard
Slots 12 and 13 (1.25 Gbit/s)
N1IDL4 1 x STM-4 IMA processing board Slots 12 and 13 (1.25 Gbit/s)
N1IDQ1 4 x STM-1 IMA processing board Slots 12 and 13 (1.25 Gbit/s)
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Board Full Name Valid Slots
N1MST4 4-channel multiservice (SAN orvideo service) transparenttransmission board
Slots 12 and 13 (2.5 Gbit/s)
N1LWX Arbitrary rate access board Slots 12 and 13
N1MR2A Arbitrary two-wavelength add/drop board (processing board)
Slots 12 and 13
N1MR2B Arbitrary two-wavelength add/drop board (half-width)
Slots 12 and 13
TN11OBU1 Optical booster amplifier board Slots 12 and 13
TN11MR2 2-channel optical add/dropmultiplexing board
Slots 12 and 13
TN11MR4 4-channel optical add/dropmultiplexing board
Slots 12 and 13
TN11CMR2 2-channel CWDM optical add/drop multiplexing board
Slots 12 and 13
TN11CMR4 4-channel CWDM optical add/drop multiplexing board
Slots 12 and 13
N1DXA N x 64 kbit/s convergence andprocessing board
Slots 12 and 13
R1AMU Orderwire processing or alarmconcatenation board
Slot 9
N1FIB Filter isolating board Slots 12 and 13
ROP Single wavelength long-haulboard (remote pumping)
Slot 103 (external)
R1AUX System auxiliary processing unit Slot 10
R2AUX System auxiliary processing unit Slot 10
R1PIUA PIU board Slots 1 and 11
CAU CAU power monitoring board Slot 50
COA COA board Slots 101 and 102
N1BA2 2-channel optical boosteramplifier board
Slots 12 and 13
N1BPA 1-channel amplifier and 1-channel preamplifier board
Slots 12 and 13
R1FAN Fan board Slot 20
R1EOW Orderwire communication board Slot 9
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Table 3-4 lists the boards and their valid slots for the OptiX OSN 1500B.
Table 3-4 Boards and their valid slots for the OptiX OSN 1500B
Board Full Name Valid Slots
Q2CXL16 STM-16 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
Q2CXL4 STM-4 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
Q2CXL1 STM-1 integrated board of theSCC, cross-connect, timing andline units
Slots 4 and 5
N1SL16 (A) 1 x STM-16 optical interfaceboard
Slots 11–13
N2SL16 (A) 1 x STM-16 optical interfaceboard
Slots 11–13
N3SL16 (A) 1 x STM-16 optical interfaceboard
Slots 11–13
N1SF16 1 x STM-16 outband opticalinterface board (with FEC)
Slots 11–13
N1SLQ4 4 x STM-4 optical interface board Slots 11–13
N2SLQ4 4 x STM-4 optical interface board Slots 11–13
N1SLD4 2 x STM-4 optical interface board Slots 11–13
N2SLD4 2 x STM-4 optical interface board Slots 11–13
N1SL4 1 x STM-4 optical interface board Slots 11–13
N2SL4 1 x STM-4 optical interface board Slots 11–13
N1SLQ1 4 x STM-1 optical interface board Slots 11–13
N2SLQ1 4 x STM-1 optical interface board Slots 11–13
N1SL1 1 x STM-1 optical interface board Slots 11–13
N2SL1 1 x STM-1 optical interface board Slots 11–13
R1SLD4 2 x STM-4 optical interface board(half-width)
Slots 1–3 and 11–13 (for theboard housed in any of slots 1–3and 11–13, two optical interfacescan be configured), slots 6–9 (forthe board housed in any of slots6–9, one optical interface can beconfigured)
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Board Full Name Valid Slots
R1SL4 1 x STM-4 optical interface board(half-width)
Slots 1–3, 6–9 and 11–13
R1SLQ1 4 x STM-1 optical interface board(half-width)
Slots 1–3, 6–9 and 11–13
R1SL1 1 x STM-1 optical interface board(half-width)
Slots 1–3, 6–9 and 11–13
N1SEP 8 x STM-1 (e) processing board(used with the interface board)
Slots 12–13
N1SEP1 2 x STM-1 (e) processing board(not used with the interface board)
Slots 11–13
N1SLT1 12 x STM-1 optical interfaceboard
Slots 11–13
N2SPQ4 4 x STM-1/E4 (e) processingboard (used with the interfaceboard)
Slots 12 and 13
N1EU08 8 x STM-1 (e) electrical interfaceboard
Slots 14 and 16
N1OU08 8 x STM-1 optical interface board Slots 14 and 16
N2OU08 8 x STM-1 optical interface board Slots 14 and 16
N1EU04 4 x STM-1 (e) electrical interfaceboard
Slots 14 and 16
N2SLO1 8 x AU-3 high density accessboard
Slots 11–13
R1PL1A 16 x E1 interface and processingboard (interfaces available on thefront panel)
Slots 6–9
R1PL1B 16 x E1 interface and processingboard (interfaces available on thefront panel)
Slots 6–9
N2PQ3 12 x E3/T3 processing board Slots 12 and 13
N2PD3 6 x E3/T3 processing board Slots 12 and 13
N2PL3 3 x E3/T3 processing board Slots 12 and 13
N1PL3A 3 x E3/T3 processing board (notused with the interface board)
Slots 11–13
N2PL3A 3 x E3/T3 processing board (notused with the interface board)
Slots 11–13
N1PD3 6 x E3/T3 processing board Slots 12 and 13
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 3 Subrack
Issue 02 (2007-09-10) Huawei Technologies Proprietary 3-13
Board Full Name Valid Slots
N1PL3 3 x E3/T3 processing board Slots 12 and 13
N1C34S 3 x 34M/45M electrical interfaceswitching board
Slots 14 and 16
N1D34S 6 x 34M/45M electrical interfaceswitching board
Slots 14–17
N1SPQ4 4 x E4/STM-1 processing board Slots 12–13
N1MU04 4 x E4/STM-1 processing board Slots 14 and 16
N1PQ1A 63 x E1 75-ohm processing board Slots 11–13
N1PQ1B 63 x E1 120-ohm processingboard
Slots 11–13
N1PQM 63 x E1 75-ohm or 120-ohmprocessing board
Slots 11–13
N2PQ1 63 x E1/T1 hybrid processingboard
Slots 11–13
R2PD1 32 x E1/T1 hybrid processingboard
Slots 1–3, 6–8 and 11–13
N1D75S 32 x E1/T1 75-ohm electricalinterface switching board
Slots 14–17
N1D12S 32 x E1/T1 120-ohm electricalinterface switching board
Slots 14–17
N1D12B 32 x E1/T1 120-ohm electricalinterface board
Slots 14–17
N1DX1 N x 64 kbit/s access andconvergence board
Slots 11–13
N1DXA N x 64 kbit/s convergence andprocessing board
Slots 11–13
N1DM12 N x 64 kbit/s interface board Slots 14–17
N1EMS4 (used withthe interface board)
4 x GE and 16 x FE Ethernetprocessing board
Slots 12 and 13 (2.5 Gbit/s)
N1EMS4 (not usedwith the interfaceboard)
4 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)
N1EGS4 4 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)
N2EFS4 4 x 10M/100M Ethernetprocessing board
Slots 11–13 (1.25 Gbit/s)
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3-14 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Full Name Valid Slots
N4EFS0 10M/100M Ethernet processingboard (used with the interfaceboard)
Slots 12 and 13 (1.25 Gbit/s)
N1EFT8A 8 x FE transparent transmissionboard (interfaces available on thefront panel)
Slots 11–13 (622 Mbit/s)
N1EFT8 (not usedwith the interfaceboard)
8 x 10M/100M Ethernettransparent transmission board
Slots 11–13 (622 Mbit/s)
N1EFT8 (used withthe interface board)
8 x 10M/100M Ethernettransparent transmission board
Slots 12 and 13 (1.25 Gbit/s)
R1AMU Orderwire processing or alarmconcatenation board
Slot 9
N1FIB Filter isolating board Slots 12 and 13
ROP Single wavelength long-haulboard (remote pumping)
Slot 103 (external)
R2AUX System auxiliary interface board Slot 10
N2EGR2 2 x GE Ethernet ring processingboard
Slots 11–13 (2.5 Gbit/s)
N2EMR0 (used withthe interface board)
1 x GE and 12 x FE Ethernetprocessing board
Slots 12–13 (2.5 Gbit/s)
N2EMR0 (not usedwith the interfaceboard)
1 x GE and 4 x FE Ethernetprocessing board
Slots 11–13 (2.5 Gbit/s)
R1EFT4 4 x FE processing board(interfaces available on the frontpanel)
Slots 1–3, 11–13 and 6–9 (622Mbit/s)
N1TSB8 8-channel electrical interfaceswitching board
Slots 14 and 15
N1TSB4 4-channel electrical interfaceswitching board
Slot 14
N1EFS0 (used withthe interface board)
10M/100M Ethernet processingboard
Slots 12–13 (622 Mbit/s)
N2EFS0 (used withthe interface board)
10M/100M Ethernet processingboard
Slots 12–13 (1.25 Gbit/s)
N1ETF8 8 x FE Ethernet electrical interfaceboard
Slots 14–17
N1EFS4 4 x 10M/100M Ethernetprocessing board
Slots 11–13
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Board Full Name Valid Slots
N2EGS2 2 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)
N1EGT2 2 x GE Ethernet transparenttransmission board
Slots 11–13 (2.5 Gbit/s)
N1MST4 4-channel multiservicetransparent transmission board
Slots 11–13 (2.5 Gbit/s)
N1EGS2 2 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)
N1EMR0 (used withthe interface board)
1 x GE and 12 x FE Ethernetprocessing board
Slots 12–13 (2.5 Gbit/s)
N1EMR0 (not usedwith the interfaceboard)
1 x GE and 4 x FE Ethernetprocessing board
Slots 11–13 (2.5 Gbit/s)
N1EFF8 8-channel Ethernet opticalinterface board
Slots 14–17
N1ETS8 8 x 10/100M Ethernet twisted pairinterface switching board
Slots 14 and 16
N1ADQ1 4 x STM-1 or 1 x STM-4 ATMprocessing board
Slots 11–13 (1.25 Gbit/s)
N1ADL4 1 x STM-4 ATM processing board Slots 11–13 (1.25 Gbit/s)
N1IDQ1 4 x STM-1 IMA processing board Slots 11–13 (1.25 Gbit/s)
N1IDL4 1 x STM-4 IMA processing board Slots 11–13 (1.25 Gbit/s)
CAU CAU power monitoring board Slot 50
COA COA board Slots 101–102
N1BA2 2-channel optical boosteramplifier board
Slots 11–13
N1BPA Optical booster preamplifierboard
Slots 11–13
R1PD1 32 x E1 processing board (half-width)
Slots 1–3, 6–8 and 11–13
R1FAN Fan board Slot 20
R1AUX System auxiliary processing unit Slot 10
R1EOW Orderwire communication board Slot 9
R1PIU PIU board Slots 18–19
N1MR2A Arbitrary two-wavelength add/drop board
Slots 11–13
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3-16 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Full Name Valid Slots
N1MR2B Arbitrary two-wavelength add/drop board (half-width)
Slots 1–3, 6–9 and 11–13
N1MR2C Arbitrary two-wavelength add/drop board
Slots 14–17
N1LWX Arbitrary rate access board Slots 11–13
TN11OBU1 Optical booster amplifier board Slots 11–13
TN11MR2 2-channel optical add/dropmultiplexing board
Slots 11–13
TN11MR4 4-channel optical add/dropmultiplexing board
Slots 11–13
TN11CMR2 2-channel CWDM optical add/drop multiplexing board
Slots 11–13
TN11CMR4 4-channel CWDM optical add/drop multiplexing board
Slots 11–13
3.4 Technical SpecificationsThe specifications of the subrack cover dimensions, weight and maximum power consumption.
Table 3-5 lists the technical specifications of the OptiX OSN 1500A subrack.
Table 3-5 Technical specifications of the OptiX OSN 1500A subrack
Dimensions (mm) Weight (kg)
444 (W) x 262 (D) x 131 (H) 8 (the backplane, fans and two PIUboards included)
Table 3-6 lists power consumption of the OptiX OSN 1500A subrack.
Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack
Subrack Type Maximum PowerConsumption
Fuse Capacity
OptiX OSN 1500A generalsubrack
200 W 10 A
OptiX OSN 1500A enhancedsubrack
313 W 15 A
Table 3-7 lists the technical specifications of the OptiX OSN 1500B subrack.
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Table 3-7 Technical specifications of the OptiX OSN 1500B subrack
Dimensions (mm) Weight (kg)
444 (W) x 263 (D) x 221 (H) 9 (the backplane, fans and two PIUboards included)
Table 3-8 lists power consumption of the OptiX OSN 1500B subrack.
Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack
Subrack Type Maximum PowerConsumption
Fuse Capacity
OptiX OSN 1500B generalsubrack
280 W 10 A
OptiX OSN 1500B enhancedsubrack
400 W 15 A
3 SubrackOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
3-18 Huawei Technologies Proprietary Issue 02 (2007-09-10)
4 Board List and Classification
About This Chapter
This chapter describes the appearance, barcode and classification of boards used for the OptiXOSN systems.
4.1 Appearance and Dimensions of BoardsDifferent boards have different appearance and dimensions.
4.2 Description of the Barcode on the BoardThe barcode on the front panel of the board indicates the board version, name and board features.
4.3 Board ClassificationBy function, the boards can be classified into SDH processing boards, PDH processing boards,data processing boards, WDM processing boards and auxiliary boards.
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4.1 Appearance and Dimensions of BoardsDifferent boards have different appearance and dimensions.
Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500.
Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500
Item Appearance and Dimensions
Boardappearance
Boardclassification
Integrated board of theSCC, cross-connect andline units (CXL)
Board housed in a dividedslot (PD1/PIUA/AUX/EOW)
Service interfaceboard (D75S, forexample)
Height(mm)
262.05 111.8 262.05
Depth (mm) 220 220 110
Width (mm) 25.4 25.4 22
Note: The figure in the right cell illustrates the three dimensions. Theheight and width are measured for the front panel and the depth ismeasured for the printed circuit board (PCB). W
H
D
CAUTIONWear the anti-static wrist strap when holding the board with hands. Make sure that the anti-staticwrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.
DANGERAvoid direct eye exposure to laser beams launched from the optical interface board or opticalinterfaces. Otherwise, damage may be caused to the eyes.
4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
CAUTIONl Do not directly insert the attenuators into the level optical modules. If the attenuators are
required, use the attenautors at the ODF side.l If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT
interface.l When performing the loopback, use attenuators to prevent damage to the optical modules.
4.2 Description of the Barcode on the BoardThe barcode on the front panel of the board indicates the board version, name and board features.
Two types of barcodes are used for the boards of the OptiX OSN 1500.
l 16-character manufacturing code + board version + board name + board feature code
l 20-character manufacturing code + board version + board name + board feature code
The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-charactermanufacturing code.
Figure 4-1 Barcode of a board
0364401055000015 -SSN3SL16A01
① ② ③ ④
① Last 6-character serial code of BOM② Internal code③
④
Board versionBoard name
Bar code
Board feature code
5
5
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 4 Board List and Classification
Issue 02 (2007-09-10) Huawei Technologies Proprietary 4-3
NOTE
For details on the board feature code, see the section that describes the board feature code for each board.
4.3 Board ClassificationBy function, the boards can be classified into SDH processing boards, PDH processing boards,data processing boards, WDM processing boards and auxiliary boards.
4.3.1 SDH Processing BoardsThe OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1levels.
4.3.2 PDH Processing BoardsThe OptiX OSN 1500 supports PDH processing boards at different rates and of differentimpedance.
4.3.3 Data Processing BoardsThe OptiX OSN 1500 supports data processing boards with the transparent transmission,switching or RPR function.
4.3.4 Interface Boards and Switching BoardsThe OptiX OSN 1500 supports the optical interface boards, electrical interface boards andswitching boards.
4.3.5 Cross-Connect Boards and SCC BoardsThe OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line unitsat different rates.
4.3.6 Auxiliary BoardsThe OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boardsand fan boards.
4.3.7 WDM Processing BoardsThe OptiX OSN 1500 supports WDM processing boards such as the optical add/dropmultiplexing boards and optical power amplifier boards.
4.3.8 Optical Amplifier Boards and Dispersion Compensation BoardThe OptiX OSN 1500 supports several optical booster amplifier boards.
4.3.9 Power Interface BoardsThe OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports theUPM and R1PIU.
4.3.1 SDH Processing BoardsThe OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1levels.
Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A.
Table 4-2 SDH processing boards for the OptiX OSN 1500A
Board Full Name
N1SL16 1 x STM-16 optical interface board
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Hardware Description
4-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Full Name
N2SL16 1 x STM-16 optical interface board
N3SL16 1 x STM-16 optical interface board
N1SL16A 1 x STM-16 optical interface board
N2SL16A 1 x STM-16 optical interface board
N3SL16A 1 x STM-16 optical interface board
N1SF16 1 x STM-16 optical interface board (with FEC)
N1SL4 1 x STM-4 optical interface board
N2SL4 1 x STM-4 optical interface board
R1SL4 1 x STM-4 optical interface board (half-width)
N1SLQ4 1 x STM-4 optical interface board
N2SLQ4 4 x STM-4 optical interface board
N1SLD4 2 x STM-4 optical interface board
N2SLD4 2 x STM-4 optical interface board
R1SLD4 2 x STM-4 optical interface board (half-width)
N1SLT1 12 x STM-1 optical interface board
N1SLQ1 4 x STM-1 optical interface board
N2SLQ1 4 x STM-1 optical interface board
R1SLQ1 4 x STM-1 optical interface board (half-width)
N1SL1 1 x STM-1 optical interface board
N2SL1 1 x STM-1 optical interface board
R1SL1 1 x STM-1 optical interface board (half-width)
N1SEP1 2 x STM-1 line processing board when interfaces are availableon the front panel
N2SLO1 8 x STM-1 optical interface board
Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B.
Table 4-3 SDH processing boards for the OptiX OSN 1500B
Board Full Name
N1SL16 1 x STM-16 optical interface board
N2SL16 1 x STM-16 optical interface board
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Board Full Name
N3SL16 1 x STM-16 optical interface board
N1SL16A 1 x STM-16 optical interface board
N2SL16A 1 x STM-16 optical interface board
N3SL16A 1 x STM-16 optical interface board
N1SF16 1 x STM-16 optical interface board (with FEC)
N1SL4 1 x STM-4 optical interface board
N2SL4 1 x STM-4 optical interface board
R1SL4 1 x STM-4 optical interface board (half-width)
N1SLQ4 4 x STM-4 optical interface board
N2SLQ4 4 x STM-4 optical interface board
N1SLD4 2 x STM-4 optical interface board
N2SLD4 2 x STM-4 optical interface board
R1SLD4 2 x STM-4 optical interface board (half-width)
N1SLT1 12 x STM-1 optical interface board
N1SLQ1 4 x STM-1 optical interface board
N2SLQ1 4 x STM-1 optical interface board
R1SLQ1 4 x STM-1 optical interface board (half-width)
N1SL1 1 x STM-1 optical interface board
N2SL1 1 x STM-1 optical interface board
R1SL1 1 x STM-1 optical interface board (half-width)
N1SEP1 2 x STM-1 line processing board when interfaces are availableon the front panel8 x STM-1 line processing board when used with an interfaceboard
N2SLO1 8 x STM-1 optical interface board
4.3.2 PDH Processing BoardsThe OptiX OSN 1500 supports PDH processing boards at different rates and of differentimpedance.
Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.
4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Table 4-4 PDH processing boards for the OptiX OSN 1500A
Board Full Name Board Full Name
R1PL1 16 x E1 processing board N1PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)
R1PD1 32 x E1 processing board N2PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)
R2PD1 32 x E1/T1 processing board N1DXA DDN service convergenceboard
Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B.
Table 4-5 PDH processing boards for the OptiX OSN 1500B
Board Full Name Board Full Name
R1PL1 16 x E1 processing board N2PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)
R1PD1 32 x E1 processing board N1PD3 6 x E3/T3 processing board
R2PD1 32 x E1/T1 processing board N2PD3 6 x E3/T3 processing board
N1PQ1 63 x E1 processing board N2PQ3 12 x E3/T3 processing board
N2PQ1 63 x E1 processing board N1DX1 DDN service access andconvergence board
N1PQM 63 x E1/T1 processing board N1DXA DDN service convergenceboard
N1PL3 3 x E3/T3 processing board N1SPQ4 4 x E4/STM-1 electricalprocessing board
N2PL3 3 x E3/T3 processing board N2SPQ4 4 x E4/STM-1 electricalprocessing board
N1PL3A 3 x E3/T3 processing board(interfaces available on the frontpanel)
- -
4.3.3 Data Processing BoardsThe OptiX OSN 1500 supports data processing boards with the transparent transmission,switching or RPR function.
Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.
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Table 4-6 Data processing boards for the OptiX OSN 1500A
Board Full Name Board Full Name
N1EFT4 4 x FE Ethernet transparenttransmission board (half-width)
N1EGS4 4 x GE Ethernet convergenceboard
N1EFT8 8 x FE Ethernet transparenttransmission board
N2EGR2 2 x GE Ethernet ring processingboard
N1EFT8A
8 x FE Ethernet transparenttransmission board
N1EMR0 4 x FE and 1 x GE Ethernet ringprocessing board
N1EGT2 2 x GE Ethernet transparenttransmission board
N2EMR0 4 x FE and 1 x GE Ethernet ringprocessing board
N1EFS4 4 x FE Ethernet processingboard with Lanswitch
N1ADL4 1 x STM-4 ATM processingboard
N2EFS4 4 x FE Ethernet processingboard with Lanswitch
N1ADQ1 1 x STM-4 ATM processingboard
N1EGS2 2 x GE Ethernet processingboard with Lanswitch
N1IDL4 1 x STM-4 ATM processingboard
N2EGS2 2 x GE Ethernet processingboard with Lanswitch
N1IDQ1 4 x STM-1 ATM processingboard
N1EMS4 4 x GE Ethernet transparenttransmission and convergenceboard
N1MST4 4-port multi-service transparenttransmission board
Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B.
Table 4-7 Data processing boards for the OptiX OSN 1500B
Board Full Name Board Full Name
N1EFT4 4 x FE Ethernet transparenttransmission board (half-width)
N1EMS4 4 x GE and 16 x FE Ethernettransparent transmission andconvergence board
N1EFT8 8 x FE or 16 x FE Ethernettransparent transmission board
N1EGS4 4 x GE Ethernet convergenceboard
N1EFT8A
8 x FE Ethernet transparenttransmission board
N2EGR2 2 x GE Ethernet ring processingboard
N1EGT2 2 x GE Ethernet transparenttransmission board
N1EMR0 12 x FE and 1 x GE Ethernetring processing board
N1EFS0 8-port Fast Ethernet processingboard with Lanswitch
N2EMR0 12 x FE and 1 x GE Ethernetring processing board
N2EFS0 8 x FE Ethernet processingboard with Lanswitch
N1ADL4 1 x STM-4 ATM processingboard
4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4-8 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Full Name Board Full Name
N4EFS0 8 x FE Ethernet processingboard with Lanswitch
N1ADQ1 1 x STM-4 ATM processingboard
N1EFS4 4 x FE Ethernet processingboard with Lanswitch
N1IDL4 1 x STM-4 ATM processingboard
N2EFS4 4 x FE Ethernet processingboard with Lanswitch
N1IDQ1 4 x STM-1 ATM processingboard
N1EGS2 2 x GE Ethernet processingboard with Lanswitch
N1MST4 4-port multi-service transparenttransmission board
N2EGS2 2 x GE Ethernet processingboard with Lanswitch
- -
4.3.4 Interface Boards and Switching BoardsThe OptiX OSN 1500 supports the optical interface boards, electrical interface boards andswitching boards.
Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A.
Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A
Board Full Name
R1L12S 16 x E1/T1 120-ohm electrical interface switching board
R1L75S 16 x E1 75-ohm electrical interface switching board
Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B.
Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B
Board Full Name Board Full Name
N1EU08 8 x STM-1 electrical interfaceboard
N1D12S 32 x E1/T1 120-ohmelectrical interface switchingboard
N1OU08 8 x STM-1 optical interfaceboard (LC)
N1D12B 32 x E1/T1 120-ohmelectrical interface board
N2OU08 8 x STM-1 optical interfaceboard (SC)
N1EFF8 8 x 100M Ethernet opticalinterface board
N1D75S 32 x E1/T1 75-ohm electricalinterface switching board
N1ETF8 8 x 100M Ethernet twistedpair interface board
N1MU04 4 x STM-1 electrical interfaceboard
N1ETS8 8 x 10/100M Ethernettwisted pair interfaceswitching board
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Board Full Name Board Full Name
N1D34S 6 x E3/T3 electrical interfaceswitching board
N1DM12 DDN service interface board
N1C34S 3 x E3/T3 electrical interfaceswitching board
N1TSB4 4-channel electricalinterface switching board
N1EU04 4 x STM-1 electrical interfaceboard
N1TSB8 8-channel electricalinterface switching board
4.3.5 Cross-Connect Boards and SCC BoardsThe OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line unitsat different rates.
Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500Aand the OptiX OSN 1500B.
Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and theOptiX OSN 1500B
Board Full Name
Q2CXL1 Integrated board of the SCC, cross-connect and line units at theSTM-1 level
Q2CXL4 Integrated board of the SCC, cross-connect and line units at theSTM-4 level
Q2CXL16 Integrated board of the SCC, cross-connect and line units at theSTM-16 level
4.3.6 Auxiliary BoardsThe OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boardsand fan boards.
Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN1500B.
Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B
Board Full Name Board Full Name
R1EOW Orderwire phoneprocessing board
R1AUX/R2AUX
System auxiliaryinterface board
R1AMU Orderwire processing oralarm concatenationboard
R1FAN Fan board
4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4-10 Huawei Technologies Proprietary Issue 02 (2007-09-10)
4.3.7 WDM Processing BoardsThe OptiX OSN 1500 supports WDM processing boards such as the optical add/dropmultiplexing boards and optical power amplifier boards.
Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A.
Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A
Board Full Name Board Full Name
TN11CMR2 2-channel optical add/dropmultiplexing board
N1MR2C 2-channel optical add/dropmultiplexing board
TN11CMR4 4-channel optical add/dropmultiplexing board
N1LWX Arbitrary bit rate wavelengthconversion board
MR2 2-channel optical add/dropmultiplexing board
TN11OBU1 Optical booster amplifierboard
MR4 4-channel optical add/dropmultiplexing board
N1FIB Filter isolating board
N1MR2A 2-channel optical add/dropmultiplexing board
- -
Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B.
Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B
Board Full Name Board Full Name
TN11CMR2 2-channel optical add/dropmultiplexing board
N1MR2B 2-channel optical add/dropmultiplexing board
TN11CMR4 4-channel optical add/dropmultiplexing board
N1MR2C 2-channel optical add/dropmultiplexing board
MR2 2-channel optical add/dropmultiplexing board
N1LWX Arbitrary bit rate wavelengthconversion board
MR4 42-channel optical add/dropmultiplexing board
TN11OBU1 Optical booster amplifierboard
N1MR2A 2-channel optical add/dropmultiplexing board
N1FIB Filter isolating board
4.3.8 Optical Amplifier Boards and Dispersion CompensationBoard
The OptiX OSN 1500 supports several optical booster amplifier boards.
Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported bythe OptiX OSN 1500A and the OptiX OSN 1500B.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 4 Board List and Classification
Issue 02 (2007-09-10) Huawei Technologies Proprietary 4-11
Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiXOSN 1500A/B
Board Full Name
N1BPA Optical booster and pre-amplifier board
N1BA2 Optical booster amplifier board
N1COA/61COA/62COA Case-shaped optical amplifier
4.3.9 Power Interface BoardsThe OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports theUPM and R1PIU.
The UPM is an uninterruptible power module.
The R1PIUA is used for the OptiX OSN 1500A as the power interface board.
The R1PIU is used for the OptiX OSN 1500B as the power interface board.
4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
4-12 Huawei Technologies Proprietary Issue 02 (2007-09-10)
5 SDH Processing Boards
About This Chapter
This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels.
5.1 SL1This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.2 SLQ1This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
5.3 SLO1This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
5.4 SLT1This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.5 SEP1This section describes the SEP1 board, in terms of the version, function, working principle, frontpanel, and specifications.
5.6 SL4This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.7 SLD4This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.8 SLQ4This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.9 SL16This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.
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5.10 SL16AThis section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.11 SF16This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FECfunction, in terms of the version, function, working principle, front panel and specifications.
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5.1 SL1This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.1.1 Version DescriptionThe SL1 board has three versions: R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, whichis housed in a divided slot in a subrack.
5.1.2 Function and FeatureThe SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.1.3 Working Principle and Signal FlowThe SL1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on.
5.1.4 Front PanelOn the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safetyclass label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.
5.1.5 Valid SlotsThe slots valid for the SL1 vary with the version of the board.
5.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL1 indicates the optical interface type.
5.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL1.
5.1.8 Technical SpecificationsThe technical specifications of the SL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.1.1 Version DescriptionThe SL1 board has three versions: R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, whichis housed in a divided slot in a subrack.
Table 5-1 lists the details on the versions of the SL1 board.
Table 5-1 Version Description of the SL1
Item Description
Functionalversion
The SL1 has three versions, R1, N1 and N2.
Difference The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do notsupport the TCM function. The R1SL1 is housed in a divided slot.
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Item Description
Replaceability The versions cannot be replaced by each other.
5.1.2 Function and FeatureThe SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-2 lists the functions and features of the SL1.
Table 5-2 Functions and features of the SL1
Function andFeature
SL1
Basic function Transmits and receives 1 x STM-1 optical signals.
Specification ofthe opticalinterface
Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 andVe-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 typescomply with ITU-T G.957 in features. The optical interface of the Ve-1.2type complies with the standards defined by Huawei.
Specification ofthe opticalmodule
Supports detection and query of the information on the optical module.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.
Serviceprocessing
Supports the processing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the two-fiber bidirectional MSP protection ring, linear MPS,SNCP, SNCTP and SNCMP.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
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5.1.3 Working Principle and Signal FlowThe SL1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on.
Figure 5-1 shows the block diagram for the working principle of the SL1.
Figure 5-1 Block diagram for the working principle of the SL1
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
155Mbit/sO/E
O/E
SPI
O/E
O/E
SPI
Frame headerCross-connect unit
K1 and K2155Mbit/s 155Mbit/s
155Mbit/s
155Mbit/s155Mbit/s
155Mbit/s 155Mbit/s 155Mbit/s
155Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-1 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
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RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
l In the transmit direction, RST performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.
MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
l In the transmit direction, MST it performs administration unit group (AUG) assembly,AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
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5.1.4 Front PanelOn the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safetyclass label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1.
Figure 5-2 Front panel of the N1SL1/N2SL1
SL1
SL1
STATACTPROGSRV
CLASS1LASER
PRODUCT
OUT
IN
Figure 5-3 shows the appearance of the front panel of the R1SL1.
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Figure 5-3 Front panel of the R1SL1
STATACTPROGSRV
OU
TIN
SL1
SL1
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type andusage of the optical interfaces.
Table 5-3 Optical interfaces of the SL1
Interfaces on theFront Panel
Interface Type Usage
IN LC Receives optical signals.
OUT LC Transmits optical signals.
5.1.5 Valid SlotsThe slots valid for the SL1 vary with the version of the board.
The slots valid for the SL1 are as follows:
l The R1SL1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.
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l The N1SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SL1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.
l The N1SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL1 indicates the optical interface type.
Table 5-4 lists the relation between the board feature code and optical interface type for the SL1.
Table 5-4 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN1SL110, SSN2SL110 10 S-1.1
SSN1SL111, SSN2SL111 11 L-1.1
SSN1SL112, SSN2SL112 12 L-1.2
SSN1SL113, SSN2SL113 13 Ve-1.2
SSN1SL114, SSN2SL114 14 I-1
5.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL1.
You can use the T2000 to set the following parameters for the SL1:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.1.8 Technical SpecificationsThe technical specifications of the SL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-5 lists the specifications of the optical interfaces of the SL1.
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Table 5-5 Specifications of the optical interfaces of the SL1
Item Specification
Nominalbit rate
155.52 Mbit/s
Line code NRZ
Opticalinterfacetype
I-1 S-1.1 L-1.1 L-1.2 Ve-1.2
Opticalsource type
MLM MLM MLM, SLM SLM SLM
Workingwavelength (nm)
1260–1360 1261–1360 1263–1360 1480–1580 1480–1580
Launchedopticalpower(dBm)
–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0
Receiversensitivity(dBm)
–23 –28 –34 –34 –34
Overloadopticalpower(dBm)
–8 –8 –10 –10 –10
Min.extinctionratio (dB)
8.2 8.2 10 10 10
Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinalmode.
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the N1SL1/N2SL1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
The mechanical specifications of the R1SL1 are as follows:
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l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.3
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL1/N2SL1 is14 W.
In the normal temperature (25℃), the maximum power consumption of the R1SL1 is 10.3 W.
5.2 SLQ1This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
5.2.1 Version DescriptionThe SLQ1 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,which is housed in a divided slot in a subrack.
5.2.2 Function and FeatureThe SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.2.3 Working Principle and Signal FlowThe SLQ1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
5.2.4 Front PanelOn the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.
5.2.5 Valid SlotsThe slots valid for the SLQ1 vary with the version of the board.
5.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLQ1 indicates the optical interface type.
5.2.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLQ1.
5.2.8 Technical SpecificationsThe technical specifications of the SLQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.2.1 Version DescriptionThe SLQ1 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,which is housed in a divided slot in a subrack.
Table 5-6 lists the details on the versions of the SLQ1 board.
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Table 5-6 Version Description of the SLQ1
Item Description
Functionalversion
The SLQ1 has three versions, R1, N1 and N2.
Difference The N2SLQ1 supports the TCM function. The N1SLQ1 and R1SLQ1do not support the TCM function. The R1SLQ1 is housed in a dividedslot.
Replaceability The versions cannot be replaced by each other.
5.2.2 Function and FeatureThe SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-7 lists the functions and features of the SLQ1.
Table 5-7 Functions and features of the SLQ1
Function andFeature
SLQ1
Basic function Transmits and receives 4 x STM-1 optical signals.
Specification ofthe opticalinterface
Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 andVe-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 typescomply with ITU-T G.957 in features. The optical interface of the Ve-1.2type complies with the standards defined by Huawei.
Specification ofthe opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.
Serviceprocessing
Supports the processing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to four channels of ECC communication.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the two-fiber unidirectional MSP protection ring, linear MSP,SNCP, SNCTP and SNCMP.
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Function andFeature
SLQ1
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.2.3 Working Principle and Signal FlowThe SLQ1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
Figure 5-4 shows the block diagram for the working principle of the SLQ1.
Figure 5-4 Block diagram for the working principle of the SLQ1
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
155Mbit/sO/E
O/E
SPI
O/E
O/E
SPI
Frame headerCross-connect unit
K1 and K2155Mbit/s 155Mbit/s
155Mbit/s
155Mbit/s155Mbit/s
155Mbit/s 155Mbit/s 155Mbit/s
155Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-1 units are described below:
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O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
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l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.2.4 Front PanelOn the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 5-5 shows the appearance of the front panel of the N1SLQ1/N2SLQ1.
Figure 5-5 Front panel of the N1SLQ1/N2SLQ1
SLQ1
SLQ1STATACTPROGSRV
CLASS1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
Figure 5-6 shows the appearance of the front panel of the R1SLQ1.
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Figure 5-6 Front panel of the R1SLQ1
SLQ1
SLQ1
STATACTPROGSRV
OU
T1IN
1O
UT2
OU
T3O
UT4
IN2
IN3
IN4
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-8 lists the typeand usage of the optical interfaces.
Table 5-8 Optical interfaces of the SLQ1
Interfaces Interface Type Usage
IN1-IN4 LC Receives optical signals.
OUT1-OUT4 LC Transmits optical signals.
5.2.5 Valid SlotsThe slots valid for the SLQ1 vary with the version of the board.
The slots valid for the SLQ1 are as follows:
l The R1SLQ1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.
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l The N1SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SLQ1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.
l The N1SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLQ1 indicates the optical interface type.
Table 5-9 lists the relation between the board feature code and optical interface type for theSLQ1.
Table 5-9 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN2SLQ110,SSN1SLQ110
10 S-1.1
SSN2SLQ111,SSN1SLQ111
11 L-1.1
SSN2SLQ112,SSN1SLQ112
12 L-1.2
SSN2SLQ113,SSN1SLQ113
13 Ve-1.2
SSN2SLQ114,SSN1SLQ114
14 I-1
5.2.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLQ1.
You can use the T2000 to set the following parameters for the SLQ1:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.2.8 Technical SpecificationsThe technical specifications of the SLQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
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Optical Interface Specifications
Table 5-10 lists the specifications of the optical interfaces of the SLQ1.
Table 5-10 Specifications of the optical interfaces of the SLQ1
Item Specification
Nominal bitrate
155.52 Mbit/s
Line code NRZ
Opticalinterface type
I-1 S-1.1 L-1.1 L-1.2 Ve-1.2
Optical sourcetype
MLM MLM MLM,SLM
SLM SLM
Workingwavelength(nm)
1260–1360 1261–1360 1263–1360 1480–1580 1480–1580
Launchedoptical power(dBm)
–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0
Receiversensitivity(dBm)
–23 –28 –34 –34 –34
Overloadoptical power(dBm)
–8 –8 –10 –10 –10
Min. extinctionratio (dB)
8.2 8.2 10 10 10
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
The mechanical specifications of the R1SLQ1 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.4
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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SLQ1/N2SLQ1 is 15 W.
In the normal temperature (25℃), the maximum power consumption of the R1SLQ1 is 12 W.
5.3 SLO1This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
5.3.1 Version DescriptionThe functional version of the SLO1 board is N1.
5.3.2 Function and FeatureThe SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to thesignals, to insert or extract the overhead bytes, and to generate alarm signals.
5.3.3 Working Principle and Signal FlowThe SLO1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
5.3.4 Front PanelOn the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety classlabel.
5.3.5 Valid SlotsIf the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eightoptical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiXOSN 1500B subrack, one to eight optical interfaces can be configured.
5.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLO1 indicates the optical interface type.
5.3.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLO1.
5.3.8 Technical SpecificationsThe technical specifications of the SLO1 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.3.1 Version DescriptionThe functional version of the SLO1 board is N1.
5.3.2 Function and FeatureThe SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to thesignals, to insert or extract the overhead bytes, and to generate alarm signals.
Table 5-11 lists the functions and features of the SLO1.
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Table 5-11 Functions and features of the SLO1 board
Function andFeature
SLO1
Basic function Receives and transmits 8 x STM-1 optical signals.
Specification of theoptical interface
Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 andL-1.2 types comply with ITU-T G.957 in features. The optical interfaceof the Ve-1.2 type complies with the standards defined by Huawei.
Specification of theoptical module
The optical module is pluggable. When optical modules of other typesare inserted, an alarm indicating the mismatch of the optical module isreported.Supports detection and query of the information on the optical module.Supports the default off state of the laser. The laser is turned off beforethe software finishes the initialization when the board is powered on.Supports the usage and detection of the pluggable optical module SFP.Supports the setting and query of the on/off state of the laser. An alarmis generated when the laser is turned off. Performance events arereported to indicate the performance of the optical module.
Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POHbytes.If the two SCC boards are not in service, the SLO1 does not transmitoverhead bytes (long 0s) to the two SCC boards.Supports one to eight channels of ECC communication.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protection scheme Supports the two-fiber unidirectional MSP protection ring, linear MSP,SNCP, SNCTP and SNCMP.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information ofthe board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.3.3 Working Principle and Signal FlowThe SLO1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
Figure 5-7 shows the block diagram for the working principle of the SLO1.
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Figure 5-7 Block diagram for the working principle of the SLO1
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
155Mbit/sO/E
O/E
SPI
O/E
O/E
SPI
Frame headerCross-connect unit
K1 and K2155Mbit/s 155Mbit/s
155Mbit/s
155Mbit/s155Mbit/s
155Mbit/s 155Mbit/s 155Mbit/s
155Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-1 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
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MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.
l In the transmit direction, MST it performs administration unit group (AUG) assembly,AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC Converter
It provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.3.4 Front PanelOn the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety classlabel.
Figure 5-8 shows the front panel of the SLO1.
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Figure 5-8 Front panel of the SLO1
SLO1
SLO1STATACTPROGSRV
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
OU
T5O
UT6
OU
T7O
UT8
IN5
IN6
IN7
IN8
CLASS1LASER
PRODUCT
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-12 lists thetype and usage of the optical interfaces.
Table 5-12 Optical interfaces of the SLO1
Interfaces Interface Type Usage
IN1–IN8 LC Receives optical signals.
OUT1–OUT8 LC Transmits optical signals.
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NOTE
The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 boardcan use the pluggable optical modules for easy maintenance.
WARNINGThe optical interfaces of the SLO1 board are level optical interfaces. Thus, use the opticalattenuator only at the ODF side.
5.3.5 Valid SlotsIf the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eightoptical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiXOSN 1500B subrack, one to eight optical interfaces can be configured.
5.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLO1 indicates the optical interface type.
Table 5-13 lists the relation between the board feature code and optical interface type for theSLO1.
Table 5-13 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN2SLO110 10 S-1.1
SSN2SLO111 11 L-1.1
SSN2SLO112 12 L-1.2
SSN2SLO113 13 Ve-1.2
SSN2SLO114 14 I-1
5.3.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLO1.
You can use the T2000 to set the following parameters for the SLO1:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
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5.3.8 Technical SpecificationsThe technical specifications of the SLO1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-14 lists the specifications of the optical interfaces of the SLO1.
Table 5-14 Specifications of the optical interfaces of the SLO1
Item Specification
Nominal bit rate 155520 kbit/s
Line code NRZ
Optical interfacetype
I-1.1 S-1.1 L-1.1 L-1.2 Ve-1.2
Optical source type MLM MLM MLM,SLM
SLM SLM
Workingwavelength (nm)
1261–1360 1261–1360
1263–1360
1480–1580
1480–1580
Launched opticalpower (dBm)
–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0
Receiversensitivity (dBm)
–23 –28 –34 –34 –34
Overload opticalpower (dBm)
–8 –8 –10 –10 –10
Min. extinctionratio (dB)
8.2 8.2 10 10 10
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the SLO1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SLO1 is 26W.
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5.4 SLT1This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.4.1 Version DescriptionThe functional version of the SLT1 board is N1.
5.4.2 Function and FeatureThe SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forSTM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.4.3 Working Principle and Signal FlowThe SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on. The external services are accessed by the external interface boards EU08and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
5.4.4 Front PanelOn the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety classlabel.
5.4.5 Valid SlotsThe SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve opticalinterfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN1500B subrack, one to twelve optical interfaces can be configured.
5.4.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLT1.
5.4.7 Technical SpecificationsThe technical specifications of the SLT1 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.4.1 Version DescriptionThe functional version of the SLT1 board is N1.
5.4.2 Function and FeatureThe SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forSTM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-15 lists the functions and features of the SLT1.
Table 5-15 Functions and features of the SLT1
Function andFeature
SLT1
Basic function Transmits and receives 12 x STM-1 optical signals.
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Function andFeature
SLT1
Specification ofthe opticalinterface
Supports S-1.1 standard optical interfaces compliant with ITU-T G.957in features.
Specification ofthe opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.
Serviceprocessing
Supports the processing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to eight channels of ECC communication.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection ring, SNCP, SNCTP, and SNCMP.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.4.3 Working Principle and Signal FlowThe SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on. The external services are accessed by the external interface boards EU08and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
Figure 5-9 shows the block diagram for the working principle of the SLT1.
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Figure 5-9 Block diagram for the working principle of the SLT1
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
155Mbit/sO/E
O/E
SPI
O/E
O/E
SPI
Frame headerCross-connect unit
K1 and K2155Mbit/s 155Mbit/s
155Mbit/s
155Mbit/s155Mbit/s
155Mbit/s 155Mbit/s 155Mbit/s
155Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-1 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
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MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.4.4 Front PanelOn the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 5-10 shows the appearance of the front panel of the SLT1.
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Figure 5-10 Front panel of the SLT1
SLT1
SLT1STATACTPROGSRV
CLASS1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
OU
T5O
UT6
OU
T7O
UT8
OU
T9O
UT10
IN5
IN6
IN7
IN8
IN9
IN10
OU
T11O
UT12
IN11
IN12
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-16 lists the typeand usage of the optical interfaces.
Table 5-16 Optical interfaces of the SLT1
Interface InterfaceType
Usage
IN1-IN12 LC Receives optical signals.
OUT1-OUT12 LC Transmits optical signals.
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WARNINGThe optical interfaces of the SLT1 board are level optical interfaces. Thus, use the opticalattenuator only at the ODF side.
5.4.5 Valid SlotsThe SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve opticalinterfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN1500B subrack, one to twelve optical interfaces can be configured.
5.4.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLT1.
You can use the T2000 to set the following parameters for the SLT1:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.4.7 Technical SpecificationsThe technical specifications of the SLT1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-17 lists the specifications of the optical interfaces of the SLT1.
Table 5-17 Specifications of the optical interfaces of the SLT1
Item Specification
Nominal bit rate 155.52 Mbit/s
Line code NRZ
Optical interface type S-1.1
Optical source type MLM
Working wavelength (nm) 1261–1360
Launched optical power (dBm) –15 to –8
Receiver sensitivity (dBm) –28
Overload optical power (dBm) –8
Min. extinction ratio (dB) 8.2
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Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the SLT1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.2
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the SLT1 is 15 W.
5.5 SEP1This section describes the SEP1 board, in terms of the version, function, working principle, frontpanel, and specifications.
5.5.1 Version DescriptionThe functional version of the SEP1 board is N1.
5.5.2 Function and FeatureThe SEP1 board processes STM-1 electrical signals.
5.5.3 Working Principle and Signal FlowThe SEP1 board consists of the line interface module and CDR module, SDH overheadprocessing module, RST and so on. The external services are accessed by the external interfaceboards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an opticalinterface board.
5.5.4 Front PanelOn the front panel of the SEP1, there are indicators, interfaces and barcode.
5.5.5 Valid SlotsWhen the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, itcannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces areavailable on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When theSEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housedin any of slots 12–13.
5.5.6 TPS Protection for the BoardThe TPS protection is equipment-level protection. When the working board fails, the accessedservices are switched to the protection board.
5.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SEP1.
5.5.8 Technical SpecificationsThe technical specifications of the SEP1 cover the board dimensions, weight and powerconsumption.
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5.5.1 Version DescriptionThe functional version of the SEP1 board is N1.
When interfaces are available on the front panel of the SEP1 (the logical board is displayed asthe SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (thelogical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electricalsignals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards forthe 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both theSEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.
5.5.2 Function and FeatureThe SEP1 board processes STM-1 electrical signals.
Table 5-18 lists the functions and features of the SEP1.
Table 5-18 Functions and features of the SEP1
Function andFeature
SEP1
Basic function Processes 2 x STM-1 signals when interfaces are available on the frontpanel.Processes 8 x STM-1 signals when used with the interface board.
Specification ofthe opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.
Serviceprocessing
Supports the processing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the TPS protection when used with the interface board and theswitching board.Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection, and SNCP.
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Function andFeature
SEP1
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
When the SEP1 is used with different interface boards and electrical interface switching boards,the access capabilities for the STM-1 signals are different. See Table 5-19.
Table 5-19 Access capabilities for the SEP1
Interface Board SEP1
None Accesses and processes 2 x STM-1 electrical signals, and does notsupport the TPS protection.
EU08 Accesses and processes 8 x STM-1 electrical signals.
OU08 Accesses and processes 8 x STM-1 optical signals.
EU08+OU08 The hybrid usage is not supported.
EU08+TSB8 Accesses and processes 8 x STM-1 electrical signals, and supports theTPS protection for the SEP1 board.
CAUTIONWhen the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.The hybrid usage of the EU08 and OU08 is not supported.
5.5.3 Working Principle and Signal FlowThe SEP1 board consists of the line interface module and CDR module, SDH overheadprocessing module, RST and so on. The external services are accessed by the external interfaceboards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an opticalinterface board.
Figure 5-11 shows the block diagram for the working principle of the SEP1.
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Figure 5-11 Block diagram for the working principle of the SEP1
Port 1
Port 2
Communication andcontrol module
Cross-connectunit A
SDH overhead processing module
DCC
K1 and K2insertion/extration
SCC unit
LOS
SCC unitCommunication
high speedbus
RST MST MSA HPT
Cross-connect unit
Cross-connectunit B
high speedbus
155 MHz PLL Cross-connect unitReference clock
155 Mbit/s
155 Mbit/s 155 Mbit/s
155 Mbit/sCDRTransfor
mer
CMI NRZ
155 Mbit/s
155 Mbit/s 155 Mbit/sCDR
CMI NRZ 155 Mbit/s
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
Encode/Decode
Transformer
Frame header Cross-connectunit
K1 and K2
Encode/Decode
SPI
Figure 5-12 shows the block diagram for the working principle of the SEP used with the EU08.
Figure 5-12 Block diagram for the working principle of the SEP used with the EU08
Communication andcontrol module
Cross-connect unitA
SDH overhead processingmodule
DCC
K1 and K2insertion/extration
SCC unit
LOS
SCC unitCommunication
high speedbus
RST MST MSA HPT
Cross-connectunit
Cross-connect unitB
high speedbus
155 MHz PLL Cross-connectunit
Reference clock
155 Mbit/s
155 Mbit/s 155 Mbit/s
155 Mbit/sCDRTransfor
mer
CMI NRZ
155 Mbit/s
155 Mbit/s 155 Mbit/sCDR
CMI NRZ
155 Mbit/s
155 Mbit/s
155 Mbit/s
155 Mbit/s
155 Mbit/s
155 Mbit/sCMI
155 Mbit/s
155 Mbit/sEncode
/Decode
Transformer
CMI
Port 1
Port 8
Port 1
Port 2
CDR
CDR155 Mbit/s
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
Transformer
Transformer
EU08
Encode/
Decode
Encode/Decode
Encode/Decode
SPI
Frame headerCross-connect unit
K1 and K2
Figure 5-13 shows the block diagram for the working principle of the SEP used with the OU08.
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Figure 5-13 Block diagram for the working principle of the SEP used with the OU08
Port 1
Port 2
Communication andcontrol module
Cross-connect unit A
SDH overhead processing module
DCC
K1 and K2insertion/extration
SCC unit
LOS
SCC unitCommunication
high speedbus
RST MST MSA HPT
Cross-connect unit
Cross-connect unitB
high speedbus
155 MHz PLL Cross-connect unitReference clock
155 Mbit/s
155 Mbit/s 155 Mbit/s
155 Mbit/sCDRTransfor
mer
CMI NRZ
155 Mbit/s
155 Mbit/s 155 Mbit/sCDRCMI NRZ
155 Mbit/s
155 Mbit/s
155 Mbit/s
155 Mbit/s
CDR
CDR155 Mbit/s
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
Transformer
LOSLaser shut down
155 Mbit/s
155 Mbit/s
155 Mbit/s
155 Mbit/sPort 1
Port 8
O/E
O/E
O/E
O/E
OU08
NRZ
NRZ
Encode/Decode
Encode/Decode
SPI
SPI
Frame header Cross-connect unit
K1 and K2
The function modules are described below:
Line Interface Module and CDR Modulel In the receive direction, the received electrical signals (CMI code) are isolated through the
converter and then transmitted to the decoding unit. The CDR module then recovers thedata and clock signals after decoding.
l In the transmit direction, the SDH signals, which are processed by the overhead processingunit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electricalsignals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It also provides inloop and outloop
function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
MSTl In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.
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l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect unit.
l Controls the laser.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constitutingthe ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC Converter ModuleIt provides the board with required DC voltages. It converts the –48 V/ –60 V power supply tothe following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.
5.5.4 Front PanelOn the front panel of the SEP1, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 5-14 shows the appearance of the front panel of the SEP1.
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Figure 5-14 Front panel of the SEP1
SEP1
SEP1
STATACTPROGSRV
OU
T1IN
1O
UT2
IN2
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are two pairs of optical interfaces on the front panel of the SEP1. Table 5-20 lists the typeand usage of the optical interfaces.
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Table 5-20 Electrical interfaces of the SEP1
Interface Interface Type Usage
IN1-IN2 75-ohm SMB Receives the STM-1 signals.
OUT1-OUT2 75-ohm SMB Transmits the STM-1 signals.
Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case,the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the twointerfaces on the front panel are invalid.
5.5.5 Valid SlotsWhen the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, itcannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces areavailable on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When theSEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housedin any of slots 12–13.
5.5.6 TPS Protection for the BoardThe TPS protection is equipment-level protection. When the working board fails, the accessedservices are switched to the protection board.
In this way, complex network-level protection, such as the MSP and SNCP, are not triggered,but the reliability of the equipment can be ensured.
The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be usedwith the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electricalsignals. The OptiX OSN 1500A does not support the SEP1 board.
Protection PrincipleFigure 5-15 shows the principle of the TPS protection for the SEP1 board.
Figure 5-15 Principle of the TPS protection for the SEP1
SEP
TSB8 EU08
SLOT12
SLOT 9/10
12 1 2
8×STM-1(e)
SLOT13
SEP
Switch controlsignal
Fail
WorkingProtection
Cross-connect
and timingboard
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l Normal state: When the working boards are running normally, the control switch of theEU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board.
l Switching state: When a failure is detected on the working board, the working board housedin each slot can be protected in the following ways.– When the working board housed in slot 13 fails, the control switch of the corresponding
EU08 shifts from position 1 to position 2. At the same time, the control switch of theTSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13is protected by the protection board housed in slot 12.
Hardware Configuration
Figure 5-16 shows the slot configuration for the 1:1 TPS protection for the SEP1.
Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1
Slot 14PIU
Slot 20
FAN
AUX
TSB8
EU08
Protection
Working
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
As shown in Figure 5-16, the protection board housed in slot 12 protects the board housed inslot 13.
Table 5-21 lists the slots for the SEP1, EU08 and TSB8.
Table 5-21 Slots for the SEP1, EU08 and TSB8
Board Protection Group
SEP1 (working board) Slot 12
TSB8 Slot 14
SEP1 (working board) Slot 13
EU08 Slot 16
5.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SEP1.
You can use the T2000 to set the following parameters for the SEP1:
l J0
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l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.5.8 Technical SpecificationsThe technical specifications of the SEP1 cover the board dimensions, weight and powerconsumption.
Table 5-22 Technical specifications of the SEP1 board
Item Specification
Nominal bit rate 155.520 Mbit/s
Line code Coded mark inversion (CMI), NRZ
Connector SMB
Mechanical SpecificationsThe mechanical specifications of the SEP1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SEP1 is 17 W.
5.6 SL4This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.6.1 Version DescriptionThe SL4 board has three versions, R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which ishoused in a divided slot in a subrack.
5.6.2 Function and FeatureThe SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overheadbytes, and to perform the MSP protection.
5.6.3 Working Principle and Signal FlowThe SL4 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on.
5.6.4 Front PanelOn the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safetyclass label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.
5.6.5 Valid Slots
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The slots valid for the SL4 vary with the version of the board.
5.6.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL4 indicates the optical interface type.
5.6.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL4.
5.6.8 Technical SpecificationsThe technical specifications of the SL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.6.1 Version DescriptionThe SL4 board has three versions, R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which ishoused in a divided slot in a subrack.
Table 5-23 lists the details on the versions of the SL4 board.
Table 5-23 Version Description of the SL4
Item Description
Functionalversion
The SL4 has three versions, R1, N1 and N2.
Difference The N2SL4 supports the TCM function. The N1 and R1SL4 do notsupport the TCM function. The R1SL4 is housed in a divided slot.
Replaceability The versions cannot be replaced by each other.
5.6.2 Function and FeatureThe SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overheadbytes, and to perform the MSP protection.
The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-24 lists the functions and features of the SL4.
Table 5-24 Functions and features of the SL4
Function andFeature
SL4
Basic function Receives and transmits 1 x STM-4 optical signals, and processes 1 xSTM-4 standard or concatenation services.
Specification ofthe opticalinterface
Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 andVe-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2types comply with ITU-T G.957 in features. The optical interface of theVe-4.2 type complies with the standards defined by Huawei.
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Function andFeature
SL4
Specification ofthe optical module
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.
Serviceprocessing
Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenationservices.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-4 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP, and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.6.3 Working Principle and Signal FlowThe SL4 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on.
Figure 5-17 shows the block diagram for the working principle of the SL4.
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Figure 5-17 Block diagram for the working principle of the SL4
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
O/E
O/E
SPI
O/E
O/E622Mbit/s
SPI
Frame headerCross-connect unit
K1 and K2
622Mbit/s
622Mbit/s
622Mbit/s 622Mbit/s 622Mbit/s
622Mbit/s
622Mbit/s
622Mbit/s622Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-4 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
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MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.6.4 Front PanelOn the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safetyclass label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 5-18 shows the appearance of the front panel of the N1SL4/N2SL4.
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Figure 5-18 Front panel of the N1SL4/N2SL4
SL4
SL4
STATACTPROGSRV
CLASS1LASER
PRODUCT
OUT
IN
Figure 5-19 shows the appearance of the front panel of the R1SL4.
Figure 5-19 Front panel of the R1SL4
STATACTPROGSRV
OU
TIN
SL4
SL4
Indicators
The following indicators are present on the front panel of the board:
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l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There is one pair of optical interfaces on the front panel of the SL4. Table 5-25 lists the typeand usage of the optical interfaces.
Table 5-25 Optical interfaces of the SL4
Interface Interface Type Usage
IN LC Receives optical signals.
OUT LC Transmits optical signals.
The SL4 board can use the pluggable optical modules for easy maintenance.
5.6.5 Valid SlotsThe slots valid for the SL4 vary with the version of the board.
The slots valid for the SL4 are as follows:
l The R1SL4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.
l The N1SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SL4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.
l The N1SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SL4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.6.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL4 indicates the optical interface type.
Table 5-26 lists the relation between the board feature code and optical interface type for theSL4.
Table 5-26 Relation between the board feature code and the optical interface type of the SL4
Board Feature Code Optical Interface Type
SSN1SL410, SSN2SL410 10 S-4.1
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Board Feature Code Optical Interface Type
SSN1SL411, SSN2SL411 11 L-4.1
SSN1SL412, SSN2SL412 12 L-4.2
SSN1SL413, SSN2SL413 13 Ve-4.2
SSN1SL414, SSN2SL414 14 I-4
5.6.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL4.
You can use the T2000 to set the following parameters for the SL4:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.6.8 Technical SpecificationsThe technical specifications of the SL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-27 lists the specifications of the optical interfaces of the SL4.
Table 5-27 Specifications of the optical interfaces of the SL4
Item Specification
Nominal bit rate 622080 kbit/s
Line code NRZ
Optical interfacetype
I-4 S-4.1 L-4.1 L-4.2 Ve-4.2
Optical sourcetype
MLM MLM SLM SLM SLM
Workingwavelength (nm)
1261–1360 1274–1356 1280–1335 1480–1580 1480–1580
Launched opticalpower (dBm)
–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2
Receiversensitivity (dBm)
–23 –28 –28 –28 –34
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Item Specification
Overload opticalpower (dBm)
–8 –8 –8 –8 –13
Min. extinctionratio (dB)
8.2 8.2 10 10 10.5
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the N1SL4/N2SL4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
The mechanical specifications of the R1SL4 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SL4/N2SL4 is15 W.
In the normal temperature (25℃), the maximum power consumption of the R1SL4 is 10 W.
5.7 SLD4This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.7.1 Version DescriptionThe SLD4 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,which is housed in a divided slot in a subrack.
5.7.2 Function and FeatureThe SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.7.3 Working Principle and Signal FlowThe SLD4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module so on.
5.7.4 Front PanelOn the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.
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5.7.5 Valid SlotsThe slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
5.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLD4 indicates the optical interface type.
5.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLD4.
5.7.8 Technical SpecificationsThe technical specifications of the SLD4 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.7.1 Version DescriptionThe SLD4 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,which is housed in a divided slot in a subrack.
Table 5-28 lists the details on the versions of the SLD4 board.
Table 5-28 Version Description of the SLD4
Item Description
Functionalversion
The SLD4 has three versions, R1, N1 and N2.
Difference The N2SLD4 supports the TCM function. The N1SLD4 and R1SLD4do not support the TCM function. The SLD4 board of the R1SLD4 ishoused in a divided slot.
Replaceability The versions cannot be replaced by each other.
5.7.2 Function and FeatureThe SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-29 lists the functions and features of the SLD4.
Table 5-29 Functions and features of the SLD4
Function andFeature
SLD4
Basic function Receives and transmits 2 x STM-4 optical signals, and processes 2 xSTM-4 standard or concatenation services.
Specification ofthe opticalinterface
Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 andVe-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2types comply with ITU-T G.957 in features. The optical interface of theVe-4.2 type complies with the standards defined by Huawei.
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Function andFeature
SLD4
Specifications ofthe optical module
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.
Serviceprocessing
Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenationservices.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-4 signals.Supports the transparent transmission or termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to two channels of ECC communication.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP, and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.7.3 Working Principle and Signal FlowThe SLD4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module so on.
Figure 5-20 shows the block diagram for the working principle of the SLD4.
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Figure 5-20 Block diagram for the working principle of the SLD4
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
O/E
O/E
SPI
O/E
O/E622Mbit/s
SPI
Frame headerCross-connect unit
K1 and K2
622Mbit/s
622Mbit/s
622Mbit/s 622Mbit/s 622Mbit/s
622Mbit/s
622Mbit/s
622Mbit/s622Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-4 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
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MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.7.4 Front PanelOn the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 5-21 shows the appearance of the front panel of the N1SLD4/N2SLD4.
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Figure 5-21 Front panel of the N1SLD4/N2SLD4
SLD4
SLD4
STATACTPROGSRV
CLASS1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
Figure 5-22 shows the appearance of the front panel of the R1SLD4.
Figure 5-22 Front panel of the R1SLD4
STATACTPROGSRV
SLD4
SLD4
OU
TIN
OU
TIN
IndicatorsThe following indicators are present on the front panel of the board:
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l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are two pairs of optical interfaces on the front panel of the SLD4. Table 5-30 lists thetype and usage of the optical interfaces.
Table 5-30 Optical interfaces of the SLD4
Interface Interface Type Usage
IN1-IN2 LC Receives optical signals.
OUT1-OUT2 LC Transmits optical signals.
The SLD4 board can use the pluggable optical modules for easy maintenance.
5.7.5 Valid SlotsThe slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
The slots valid for the SLD4 are as follows:
l The R1SLD4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.
l The N1SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The N2SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
l The R1SLD4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack. For the board housed in any of slots 1–3 and 11–13, two optical interfaces can beconfigured. For the board housed in any of slots 6–9, one optical interface can be configured.
l The N1SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
l The N2SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLD4 indicates the optical interface type.
Table 5-31 lists the relation between the board feature code and optical interface type for theSLD4.
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Table 5-31 Relation between the board feature code and the optical interface type of the SLD4
Board Feature Code Optical Interface Type
SSN1SLD410,SSN2SLD410
10 S-4.1
SSN1SLD411,SSN2SLD411
11 L-4.1
SSN1SLD412,SSN2SLD412
12 L-4.2
SSN1SLD413,SSN2SLD413
13 Ve-4.2
SSN1SLD414,SSN2SLD414
14 I-4
5.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLD4.
You can use the T2000 to set the following parameters for the SLD4:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.7.8 Technical SpecificationsThe technical specifications of the SLD4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-32 lists the specifications of the optical interfaces of the SLD4.
Table 5-32 Specifications of the optical interfaces of the SLD4
Item Specification
Nominal bit rate 622080 kbit/s
Line code NRZ
Opticalinterface type
I-4 S-4.1 L-4.1 L-4.2 Ve-4.2
Optical sourceinterface
MLM MLM SLM SLM SLM
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Item Specification
Workingwavelength(nm)
1261–1360 1274–1356 1280–1335 1480–1580 1480–1580
Launchedoptical power(dBm)
–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2
Receiversensitivity(dBm)
–23 –28 –28 –28 –34
Overloadoptical power(dBm)
–8 –8 –8 –8 –13
Min. extinctionratio (dB)
8.2 8.2 10 10 10.5
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the N1SLD4/N2SLD4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
The mechanical specifications of the R1SLD4 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SLD4/N2SLD4is 15 W.
In the normal temperature (25℃), the maximum power consumption of the R1SLD4 is 11 W.
5.8 SLQ4This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.8.1 Version DescriptionThe SLQ4 board has two versions, N1 and N2. The difference between the two versions lies inthe support for the TCM function.
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5.8.2 Function and FeatureThe SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.8.3 Working Principle and Signal FlowThe SLQ4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
5.8.4 Front PanelOn the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety classlabel.
5.8.5 Valid SlotsThe SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLQ4 indicates the optical interface type.
5.8.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLQ4.
5.8.8 Technical SpecificationsThe technical specifications of the SLQ4 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.8.1 Version DescriptionThe SLQ4 board has two versions, N1 and N2. The difference between the two versions lies inthe support for the TCM function.
Table 5-33 lists the details on the versions of the SLQ4 board.
Table 5-33 Version Description of the SLQ4
Item Description
Functionalversion
The SLQ4 has two versions, N1 and N2.
Difference The N2SLQ4 supports the TCM function. The N1SLQ4 does not supportthe TCM function.
Replaceability The versions cannot be replaced by each other.
5.8.2 Function and FeatureThe SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-34 lists the functions and features of the SLQ4.
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Table 5-34 Functions and features of the SLQ4
Function andFeature
SLQ4
Basic function Transmits and receives 4 x STM-4 optical signals.
Specification ofthe opticalinterface
Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 andVe-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 typescomply with ITU-T G.957 in features. The optical interface of the Ve-4.2type complies with the standards defined by Huawei.
Specification ofthe opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP .
Serviceprocessing
Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenationservices.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-4 signals.Supports the transparent transmission or termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to four channels of ECC communication.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
5.8.3 Working Principle and Signal FlowThe SLQ4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.
Figure 5-23 shows the block diagram for the working principle of the SLQ4.
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Figure 5-23 Block diagram for the working principle of the SLQ4
Communicationand control
module
Cross-connect unit A
+3.3 Vbackup power
+3.3 V
SDH overhead processing moduleDCC
SCC unit
LOSLaser shut down SCC unit
Communication
High speed bus
+5 V
+1.8 V
+3.3 V -48 V/ -60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit BHigh speed bus
155 MHzPLL
Cross-connect unit155 MHz Reference clock
K1 and K2 insertion/extration
MSA HPTMSTRST
IIC
CDR
. . . .
. . . .
CDR
-48 V/ -60 V
O/E
O/E
SPI
O/E
O/E622Mbit/s
SPI
Frame headerCross-connect unit
K1 and K2
622Mbit/s
622Mbit/s
622Mbit/s 622Mbit/s 622Mbit/s
622Mbit/s
622Mbit/s
622Mbit/s622Mbit/s
PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination
MST: multiplex section termination MSA: multiplex section adaptation
HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery
The function modules of the STM-4 units are described below:
O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical
signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.
CDR Modulel It recovers the data signal and the clock signal.
SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
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MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-
remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.
l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.
l MST provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Controls the laser.
l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
5.8.4 Front PanelOn the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 5-24 shows the appearance of the front panel of the SLQ4.
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Figure 5-24 Front panel of the SLQ4
SLQ4
SLQ4
STATACTPROGSRV
CLASS1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-35 lists thetype and usage of the optical interfaces.
Table 5-35 Optical interfaces of the SLQ4
Interface Interface Type Usage
IN1-IN4 LC Receives optical signals.
OUT1-OUT4 LC Transmits optical signals.
The SLQ4 board can use the pluggable optical modules for easy maintenance.
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5.8.5 Valid SlotsThe SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLQ4 indicates the optical interface type.
Table 5-36 lists the relation between the board feature code and optical interface type for theSLQ4.
Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4
Board Feature Code Optical interface type
SSN1SLQ410,SSN2SLQ410
10 S-4.1
SSN1SLQ411,SSN2SLQ411
11 L-4.1
SSN1SLQ412,SSN2SLQ412
12 L-4.2
SSN1SLQ413,SSN2SLQ413
13 Ve-4.2
SSN1SLQ414,SSN2SLQ414
14 I-4
5.8.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLQ4.
You can use the T2000 to set the following parameters for the SLQ4:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.8.8 Technical SpecificationsThe technical specifications of the SLQ4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-37 lists the specifications of the optical interfaces of the SLQ4.
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Table 5-37 Specifications of the optical interfaces of the SLQ4
Item Specification
Nominal bit rate 622080 kbit/s
Line code NRZ
Optical interfacetype
I-4 S-4.1 L-4.1 L-4.2 Ve-4.2
Optical sourcetype
MLM MLM SLM SLM SLM
Workingwavelength(nm)
1261–1360 1274–1356 1280–1335 1480–1580 1480–1580
Launchedoptical power(dBm)
–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2
Receiversensitivity(dBm)
–23 –28 –28 –28 –34
Overload opticalpower (dBm)
–8 –8 –8 –8 –13
Min. extinctionratio (dB)
8.2 8.2 10 10 10.5
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the SLQ4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SLQ4 is 16 W.
5.9 SL16This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.9.1 Version Description
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The SL16 board has three versions, N1, N2 and N3. The difference among the three versionslies in the support for the TCM function and AU-3 services.
5.9.2 Function and FeatureThe SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process theoverhead.
5.9.3 Working Principle and Signal FlowThe SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overheadprocessing module, RST and so on.
5.9.4 Front PanelOn the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.
5.9.5 Valid SlotsThe SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and anyof slots 11–13 in the OptiX OSN 1500B subrack.
5.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16 indicates the optical interface type.
5.9.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL16.
5.9.8 Technical SpecificationsThe technical specifications of the SL16 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.9.1 Version DescriptionThe SL16 board has three versions, N1, N2 and N3. The difference among the three versionslies in the support for the TCM function and AU-3 services.
Table 5-38 lists the details on the versions of the SL16 board.
Table 5-38 Version Description of the SL16
Item Description
Functionalversion
The SL16 has three versions, N1, N2 and N3.
Difference The N1SL16 does not support the TCM function and AU-3 services.The N2SL16 supports the TCM function, and it can be configured withAU-3 services.The TCM function and AU-3 services cannot be configured on theN3SL16 at the same time.The N3SL16 supports the board version replacement function.
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Item Description
Replaceability The N1SL16 and N2SL16 cannot be replaced by each other.When the TCM function and AU-3 services are not required, the N3SL16can fully replace the N2SL16 and N1SL16.The N3SL16 supports the board version replacement function and canreplace the N1SL16. After the N1SL16 is replaced, the N3SL16 isconsistent with the N1SL16 in configuration and service status.
5.9.2 Function and FeatureThe SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process theoverhead.
Table 5-39 lists the functions and features of the SL16.
Table 5-39 Functions and features of the SL16
Functionand Feature
SL16
Basic function Transmits and receives 1 x STM-16 optical signals.
Specificationof the opticalinterface
Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA),U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 typecomplies with ITU-T G.957 and ITU-T G.692 in features. The opticalinterfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA andPA) comply with the standards defined by Huawei.Supports the output of standard wavelengths that comply with ITU-T G.692.The U-16.2Je optical interface can be directly connected to the DWDMequipment.
Specificationof the opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.
Serviceprocessing
Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.Supports AU-3 services.
Overheadprocessing
Supports the processing of the SOH of the STM-16 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformanceevent
Provides rich alarms and performance events.
Processing ofthe K byte
Processes two sets of K bytes. One SL16 board supports a maximum of twoMSP protection rings.
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Functionand Feature
SL16
Specificationsof the REG
Supports the setting and query of the REG working mode.
Protectionscheme
Supports the two-fiber MSP protection ring, four-fiber MSP protection ring,linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
5.9.3 Working Principle and Signal FlowThe SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overheadprocessing module, RST and so on.
Figure 5-25 shows the block diagram for the working principle of the SL16.
Figure 5-25 Block diagram for the working principle of the SL16
2.488Gbit/s
2.488Gbit/s
Communicationand control
module
Cross-connectunit A
+3.3 V backup power+3.3 V
16 x 155Mbit/s
SDH overhead processing module
DCCSCC unit
LOSLaser shut down SCC unit
Communication
2.488Gbit/s
2.488Gbit/s
high speed bus
5 V
+1.8 V
+3.3 V -48 V/-60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connectunit
Cross-connectunit B
high speed bus
155 MHzPLL
Cross-connectunit
155 MHz Reference clock
16 x 155Mbit/s
K1 and K2 insertion/extration
MSA HPTMSTRST
MUX
DEMUX
IIC
-48 V/-60 V
Frame header Cross-connectunit
K1 and K2
O/E
SPI
O/E
O/E Conversion Modulel In the receive direction, it converts the received optical signals into electrical signals.
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l In the transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the function to shut down the laser.
MUX/DEMUX Modulel In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.l In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.
SDH Overhead Processing ModuleIt includes RST, MST, MSA and HPT, and provides outloop and inloop function.
RSTl In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.l In the transmitting direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.
MSTl In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.l In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion
of MS_REI MS_RDI and MS_AIS.l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
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l Tracing the clock signal from the active and the standby cross-connect units.
l Implements laser controlling function.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constitutingthe ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC Converter Modulel This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also providesprotection for the board +3.3V power supply.
5.9.4 Front PanelOn the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.
Appearance of the Front Panel
Figure 5-26 shows the appearance of the front panel of the SL16.
Figure 5-26 Front panel of the SL16
SL16
SL16
STATACTPROGSRV
CLASS 1LASER
PRODUCT
OUT
IN
! APDReceiver
MAX:-9dBm
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There is one pair of optical interfaces on the front panel of the SL16. Table 5-40 lists the typeand usage of the optical interfaces.
Table 5-40 Optical interfaces of the SL16
Interface Interface Type Usage
IN LC Receives optical signals.
OUT LC Transmits optical signals.
5.9.5 Valid SlotsThe SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and anyof slots 11–13 in the OptiX OSN 1500B subrack.
5.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16 indicates the optical interface type.
Table 5-41 lists the relation between the board feature code and optical interface type for theSL16.
Table 5-41 Relation between the board feature code and the optical interface type for the SL16
Board Feature Code Optical interface type
SSN1SL1601, SSN2SL1601 01 L-16.2
SSN1SL1602,SSN2SL1602, SSN3SL1602
02 L-16.2Je
SSN1SL1603,SSN2SL1603, SSN3SL1603
03 V-16.2Je
SSN1SL1604,SSN2SL1604, SSN3SL1604
04 U-16.2
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5.9.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL16.
You can use the T2000 to set the following parameters for the SL16:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.9.8 Technical SpecificationsThe technical specifications of the SL16 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 5-42 lists the specifications of the optical interfaces of the SL16.
Table 5-42 Specifications of the optical interfaces of the SL16
Item Specification
Nominalbit rate
2488320 kbit/s
OpticalInterfaceType
L-16.2 L-16.2Je V-16.2Je (BA) U-16.2Je (BA+PA)
Opticalsource type
SLM SLM SLM SLM
Workingwavelength (nm)
1500–1580 1530–1560 1530–1565 1550.12
Launchedopticalpower(dBm)
–2 to +3 5 to 7 –2 to +3(withoutBA)
13 to 15(with BA)
–2 to +3(withoutBA andPA)
15 to 18(with BA)
Receiversensitivity(dBm)
–28 –28 –28 –28(withoutPA andBA)
–32 (withPA)
Overloadopticalpower(dBm)
–9 –9 –9 –9(withoutPA andBA)
–10 (withPA)
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Item Specification
Min.extinctionratio (dB)
8.2 8.2 8.2 8.2
Note: The optical interface of the Le-16.2 type is the same as the optical interface of theL-16.2Je type.The launched optical power of the optical interface of the V-16.2Je type is measured whenthe booster amplifer (BA) is added. The launched optical power of the optical interfaces ofthe V-16.2Je and U-16.2Je types ranges from –2 dBm to –3 dBm when no BA is added.
Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standardwavelengths
Item Specification
Nominal bit rate 2488320 kbit/s
Dispersion limit (km) 170 640
Mean launched optical power (dBm) –2 to +3 –5 to –1
Receiver sensitivity (dBm) –28 –28
Min. overload (dBm) –9 –9
Max. allowed dispersion (ps/nm) 3400 10880
Min. extinction ratio (dB) 8.2 10
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the SL16 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SL16 is 20 W.
In the normal temperature (25℃), the maximum power consumption of the N2SL16 is 20 W.
In the normal temperature (25℃), the maximum power consumption of the N3SL16 is 22 W.
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5.10 SL16AThis section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.
5.10.1 Version DescriptionThe SL16A board has three versions, N1, N2, and N3. The difference among the three versionslies in the support for the TCM function.
5.10.2 Function and FeatureThe SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process theoverhead bytes, and to perform the MSP protection.
5.10.3 Working Principle and Signal FlowThe SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDHoverhead processing module, RST and so on.
5.10.4 Front PanelOn the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.
5.10.5 Valid SlotsThe SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16A indicates the optical interface type.
5.10.7 Board Configuration ReferenceYou can use the T2000 to set the J0 parameter for the SL16A.
5.10.8 Technical SpecificationsThe technical specifications of the SL16A cover the optical interface specifications, boarddimensions, weight and power consumption.
5.10.1 Version DescriptionThe SL16A board has three versions, N1, N2, and N3. The difference among the three versionslies in the support for the TCM function.
Table 5-44 lists the details on the versions of the SL16A board.
Table 5-44 Version Description of the SL16A
Item Description
Functionalversion
The SL16A has three versions, N1, N2, and N3.
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Item Description
Difference The N1SL16A does not support the TCM function and AU-3 services.The N2SL16A supports the TCM function, and it can be configured withAU-3 services.The TCM function and AU-3 services cannot be configured on theN3SL16A at the same time.The N3SL16A supports the board version replacement function and canreplace the N3SL16A and N1SL16A. After the N3SL16A and N1SL16Aare replaced, the N3SL16A and N1SL16A are consistent with theN1SL16A in configuration and service status.
Replaceability The N1SL16A and N2SL16A cannot be replaced by each other.When the TCM function and AU-3 services are not required, theN3SL16A can fully replace the N2SL16A and N1SL16A.
5.10.2 Function and FeatureThe SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process theoverhead bytes, and to perform the MSP protection.
Table 5-45 lists the functions and features of the SL16A.
Table 5-45 Functions and features of the SL16A
Function andFeature
SL16A
Basic function Transmit and receive 1 x STM-16 optical signals.
Specification of theoptical interface
Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types.The optical interfaces comply with ITU-T G.957 and ITU-T G.692 infeatures.Supports the output of standard wavelengths that comply with ITU-TG.692 and can be directly connected to the DWDM equipment.
Specification of theoptical module
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the SFP pluggable opticalmodule.
Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.
Overheadprocessing
Supports the processing of the SOH bytes of the STM-16 signals.Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0 bytes.
Alarm andperformance event
Provides rich alarms and performance events.
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Function andFeature
SL16A
Processing of the Kbyte
Processes two sets of the K bytes.
Specifications ofthe REG
Supports the setting and query of the REG working mode.
Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports AU-3 services.
5.10.3 Working Principle and Signal FlowThe SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDHoverhead processing module, RST and so on.
Figure 5-27 shows the block diagram for the working principle of the N1SL16A and N2SL16A.
Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A
2.488Gbit/s
2.488Gbit/s
Communicationand control
module
Cross-connectunit A
+3.3 V backup power+3.3 V
16 x 155Mbit/s
SDH overhead processing module
DCCSCC unit
LOSLaser shut down SCC unit
Communication
2.488Gbit/s
2.488Gbit/s
high speed bus
5 V
+1.8 V
+3.3 V -48 V/-60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connectunit
Cross-connectunit B
high speed bus
155 MHzPLL
Cross-connectunit
155 MHz Reference clock
16 x 155Mbit/s
K1 and K2 insertion/extration
MSA HPTMSTRST
MUX
DEMUX
IIC
-48 V/-60 V
Frame header Cross-connectunit
K1 and K2
O/E
SPI
O/E
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Figure 5-28 shows the block diagram for the working principle of the N3SL16A.
Figure 5-28 Block diagram for the working principle of the N3SL16A
2.488Gbit/s
2.488Gbit/s
Communicationand control
module
Cross-connectunit A
+3.3 V backup power+3.3 V
SDH overhead processing module
DCCSCC unit
LOSLaser shut down SCC unit
Communication
2.488Gbit/s
2.488Gbit/s
high speed bus
5 V
+1.8 V
+3.3 V -48 V/-60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connectunit
Cross-connectunit B
high speed bus
155 MHzPLL
Cross-connectunit
155 MHz Reference clock
16 x 155Mbit/s
K1 and K2 insertion/extration
MSA HPTMSTRST
MUX
DEMUX
IIC
-48 V/-60 V
Frame header Cross-connectunit
K1 and K2
O/E
SPI
O/E
16 x 155Mbit/s
O/E Conversion Modulel In the receive direction, it converts the received optical signals into electrical signals.
l In the transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the function to shut down the laser.
MUX/DEMUX Modulel In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In the transmit direction, the MUX part multiplexes the parallel electrical signals receivedfrom the SDH overhead processing module into high rate electrical signals.
SDH Overhead Processing Module
It includes RST, MST, MSA and HPT, and provides outloop and inloop function.
RSTl In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.
l In the transmitting direction, RST performs frame alignment insertion, regenerator sectionpath trace insertion, BIP-8 calculation and insertion.
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MSTl In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.l In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion
of MS_REI MS_RDI and MS_AIS.l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Tracing the clock signal from the active and the standby cross-connect units.
l Implements laser controlling function.
l Realizes the pass-through of orderwire and ECC bytes between the paired slots constitutingthe ADM when the CXL is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC Converter Modulel This module provides the board with required DC voltages. It converts the –48/–60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also providesprotection for the board +3.3V power supply.
5.10.4 Front PanelOn the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.
Appearance of the Front PanelFigure 5-29 shows the appearance of the front panel of the SL16A.
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Figure 5-29 Front panel of the SL16A
SL16A
SL16A
STATACTPROGSRV
CLASS 1LASER
PRODUCT
OUT
IN
MAX:-9dBm
! APDReceiver
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere is one pair of optical interfaces on the front panel of the SL16A. Table 5-46 lists the typeand usage of the optical interfaces.
Table 5-46 Optical interfaces of the SL16A
Interface Interface Type Usage
IN LC Receives optical signals.
OUT LC Transmits optical signals.
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5.10.5 Valid SlotsThe SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16A indicates the optical interface type.
Table 5-47 lists the relation between the board feature code and optical interface type for theSL16A.
Table 5-47 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN1SL16A01,SSN2SL16A01,SSN3SL16A01
01 I-16
SSN1SL16A02,SSN2SL16A02,SSN3SL16A02
02 S-16.1
SSN1SL16A03,SSN2SL16A03,SSN3SL16A03
03 L-16.1
SSN1SL16A04,SSN2SL16A04,SSN3SL16A04
04 L-16.2
5.10.7 Board Configuration ReferenceYou can use the T2000 to set the J0 parameter for the SL16A.
For details on the parameter, refer to F Board Configuration Reference.
5.10.8 Technical SpecificationsThe technical specifications of the SL16A cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 5-48 lists the specifications of the optical interfaces of the SL16A.
Table 5-48 Specifications of the optical interfaces of the SL16A
Item Specification
Nominalbit rate
2488320 kbit/s
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Item Specification
OpticalInterfaceType
I-16 S-16.1 L-16.1 L-16.2
Opticalsource type
MLM SLM SLM SLM
Workingwavelength(nm)
1266–1360 1260–1360 1280–1335 1500–1580
Launchedopticalpower(dBm)
–10 to –3 –5 to 0 –2 to +3 –2 to +3
Receiversensitivity(dBm)
–18 –18 –27 –28
Overloadopticalpower(dBm)
–3 0 –9 –9
Min.extinctionratio (dB)
8.2 8.2 8.2 8.2
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the SL16A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg):– N1SL16A and N2SL16A:1.1
– N3SL16A:0.9
l Weight (kg):1.1
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1SL16A andN2SL16A are 20 W.
In the normal temperature (25℃), the maximum power consumption of the N3SL16A is 17 W.
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5.11 SF16This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FECfunction, in terms of the version, function, working principle, front panel and specifications.
5.11.1 Version DescriptionThe functional version of the SF16 board is N1.
5.11.2 Function and FeatureThe SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) opticalsignals and to process the overhead.
5.11.3 Working Principle and Signal FlowThe SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDHoverhead processing module and so on.
5.11.4 Front PanelOn the front panel of the SF16, there are indicators, interfaces, barcode and laser safety classlabel.
5.11.5 Valid SlotsThe SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.11.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SF16.
5.11.7 Technical SpecificationsThe technical specifications of the SF16 cover the optical interface specifications, boarddimensions, weight and power consumption.
5.11.1 Version DescriptionThe functional version of the SF16 board is N1.
5.11.2 Function and FeatureThe SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) opticalsignals and to process the overhead.
Table 5-49 lists the functions and features of the SF16.
Table 5-49 Functions and features of the SF16
Function andFeature
SF16
Basic function Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals.Supports the enabling or disabling of the FEC function.
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Function andFeature
SF16
Specificationof the opticalinterface
Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types.The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f typescomply with the standards defined by Huawei.The optical interface supports the output of standard wavelengths thatcomply with ITU-T G.692 and can be directly connected to the DWDMequipment.
Specificationof the opticalmodule
Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.
Serviceprocessing
Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.Supports AU-3 services.The SF16 board encapsulates and encodes signals with the FEC function,and processes overhead bytes, which comply with ITU-T G.709.
Overheadprocessing
Supports the processing of the OTU, ODU, and OPU overhead bytes,performance monitoring, and alarm detection, which comply with ITU-TG.709.Supports the processing of the SOH of the STM-16 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformanceevent
Provides rich alarms and performance events.Supports alarms and performance events related to the OTU, ODU, andOPU layers and the FEC function.
Processing ofthe K byte
Processes two sets of K bytes. One SF16 board supports a maximum of twoMSP protection rings.
Specificationof the REG
Supports the setting and query of the REG working mode.
Protectionscheme
Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
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5.11.3 Working Principle and Signal FlowThe SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDHoverhead processing module and so on.
Figure 5-30 shows the block diagram for the working principle of the SF16.
Figure 5-30 Block diagram for the working principle of the SF16
2.666Gbit/s
2.666Gbit/s
FEC
Communicationand control
module
Cross-connect unit
+3.3 V backup power
16x155Mbit/s
16x155Mbit/s
SDH overhead processing module
DCC
K1 and K2 insertion/extration
SCC unit
LOSLaser shut down SCC unit
2.666Gbit/s
2.666Gbit/s
high speed bus
5 V
+1.8 V
+3.3 V
RST MST MSA HPT
O/E
-48 V/-60 VDC/DCconverter
Fuse
FuseDC/DC
converter
Cross-connect unit
Cross-connect unit
155 MHz PLL Cross-connect unit155 MHz Reference clock
16x166Mbit/s
16x166Mbit/s
166 MHz PLLIIC
MUX
155 MHz PLL
DEMUX
-48 V/-60 V
Cross-connect unit
K1 and K2
Communication
Frame header
SPI
O/Ehigh speed bus
The function modules are described below:
O/E Conversion Modulel In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals
into electrical signals.
l In the transmit direction, the module converts the electrical signals into SDH optical signals,and then send optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides function to shut down the laser.
MUX/DEMUX Modulel In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.
l In the transmit direction, the MUX part multiplexes the parallel electrical signals receivedfrom the FEC module into high rate electrical signals.
FEC Modulel In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing chip. After frame search,
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FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signalsare converted to 2.666 Gbit/s signals and then transmitted to the MUX module.
l In the upstream direction, signals take the reverse process. The FEC encoding and decodingmodule receives the 2.666 Gbit/s signals from the DEMUX module. After frame search,FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. Theframe format of the 2.666 Gbit/s signals complies with ITU G.709.
l The FEC processing module connects to the communication and control unit through aCPU bus. The CPU controls working modes of the FEC module by configuring the internalregister. The working mode can be regenerator mode, that is, REG mode. The CPU canmonitor the performance through the internal register.
SDH Overhead Processing ModuleThis module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0), mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
MSTl In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring)
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Manages and configures other modules of the boards.
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l Performs inter-board communication through internal Ethernet interface.l Traces the clock signal from the active and the standby cross-connect unit.l Controls the laser.l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.l Selects the clock and frame header from the active or the standby cross-connect units.l Controls the indicator on the board.
DC/DC ConverterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V powersupply.
5.11.4 Front PanelOn the front panel of the SF16, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 5-31 shows the appearance of the front panel of the SF16.
Figure 5-31 Front panel of the SF16
SF16
SF 16
STATACTPROGSRV
CLASS 1LASER
PRODUCT
OUT
IN
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IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere is one pair of optical interfaces on the front panel of the SF16. Table 5-50 lists the typeand usage of the optical interfaces.
NOTE
The SF16 uses the unpluggable optical module.
Table 5-50 Optical interfaces of the SF16
Interface InterfaceType
Usage
IN LC Receives optical signals.
OUT LC Transmits optical signals.
5.11.5 Valid SlotsThe SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
5.11.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SF16.
You can use the T2000 to set the following parameters for the SF16:
l J0
l J1
l C2
For details on the parameters, refer to F Board Configuration Reference.
5.11.7 Technical SpecificationsThe technical specifications of the SF16 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 5-51 lists the specifications of the optical interfaces of the SF16.
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Table 5-51 Specifications of the optical interfaces of the SF16
Item Specification
Nominal bit rate 2666057.143 kbit/s
Service processingcapability
1 x STM-16 standard services or concatenation services
Line code NRZ
Optical InterfaceTypea
Ve-16.2c Ve-16.2d Ve-16.2f
FEC+BA(14)+PA
FEC+BA(17)+PA
FEC+BA(17)+RA+PA
Optical source type SLM SLM SLM
Wavelength (nm) 1550.12
Launched opticalpower (dBm)b
–5 to –1 –5 to –1 –5 to –1
Launched opticalpower (dBm)c
13–15 13–15 15–18
Receiver sensitivity(dBm)b
–27.5 –27.5 –27.5
Receiver sensitivity(dBm)d
–37 –37 –42
Overload opticalpower (dBm)d
–10 –10 –10
Min. extinction ratio(dB)b
10 10 10
a: The numbers in the brackets indicate the specifications. For example, BA (14) indicatesthat the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that theoptical interface is used with the FEC, PA, Raman amplifier and BA.b: The specifications are for the optical module itself rather than for the amplifier.c: The specifications are for the BA.d: The specifications are for the PA.
Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standardwavelengths
Item Specification
Nominal bit rate 2666057.143 kbit/s
Dispersion limit (km) 640
Mean launched optical power (dBm) –5 to –1
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Item Specification
Receiver sensitivity (dBm) –28
Min. overload (dBm) –9
Max. allowed dispersion (ps/nm) 10880
Min. extinction ratio (dB) 8.2
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the SF16 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SF16 is 26 W.
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6 PDH Processing Boards
About This Chapter
This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDNsignals.
6.1 PL1This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.
6.2 PD1This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.
6.3 PQ1This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.4 PQMThis section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.5 PL3This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.6 PL3AThis section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.7 PD3This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.8 PQ3This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.9 DX1
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This section describes the DX1, a DDN interface convergence board, in terms of the version,function, principle, front panel, configuration and specifications.
6.10 DXAThis section describes the DXA, a DDN convergence board, in terms of the version, function,principle, front panel, configuration and specifications.
6.11 SPQ4This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,function, working principle, front panel and specifications.
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6.1 PL1This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.
6.1.1 Version DescriptionThe functional version of the PL1 is R1.
6.1.2 Function and FeatureThe PL1 is used to directly access and process E1 electrical signals, to process the overhead, toreport alarms and performance events and to provide the maintenance features.
6.1.3 Working Principle and Signal FlowThe PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.
6.1.4 Front PanelOn the front panel of the PL1, there are indicators and interfaces.
6.1.5 Valid SlotsThe PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN1500B subrack.
6.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PL1 indicates the interface impedance type.
6.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL1.
6.1.8 Technical SpecificationsThe technical specifications of the PL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
6.1.1 Version DescriptionThe functional version of the PL1 is R1.
6.1.2 Function and FeatureThe PL1 is used to directly access and process E1 electrical signals, to process the overhead, toreport alarms and performance events and to provide the maintenance features.
Table 6-1 lists the functions and features of the PL1.
Table 6-1 Functions and features of the PL1
Function andFeature
PL1
Basic function Processes 16 x E1 signals (interfaces available on the front panel).
Service processing Directly accesses and processes 16 x E1 electrical signals.
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Function andFeature
PL1
Overhead processing Supports the transparent transmission and termination of POH bytesat the VC-12 level, such as the J2 byte.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
Maintenance feature Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information ofthe board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affectingservices.Supports the PRBS function.
6.1.3 Working Principle and Signal FlowThe PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-1 shows the block diagram for the functions of the PL1.
Figure 6-1 Block diagram for the functions of the PL1
E1
E1
E1mapping/
demapping
Communication andcontrol module
Cross-connect unitA
155 Mbit/s
155 Mbit/s
LOS
6 x 2 Mbit/s High speed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
1.5 MHz/2 MHzOSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter+1.8 V
+2.5 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI
6 x 2 Mbit/s Cross-connect unitB
Cross-connect unit
High speed bus
Figure 6-2 shows the block diagram of the E1 mapping/demapping.
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Figure 6-2 Block diagram of the E1 mapping/demapping
E1 STM-1
PDH AISDetector
E1 mapping/demapping
LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
insertionTU-AIS/TU-LOP
Detector
E1 STM-1LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
Extraction
The function modules are described as follows.
PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloopfunction. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
E1 mapping/demappingl LPA
l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as tobe transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theVC-12 container and POH. The latter contains nine octets equally distributed within theframe bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are locatedprecisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytesinterleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
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l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1 mapping/demapping” block with the multiplex unit.
Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.
DC/DC converterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power areprovided to the board.
6.1.4 Front PanelOn the front panel of the PL1, there are indicators and interfaces.
Appearance of the Front PanelFigure 6-3 shows the appearance of the front panel of the PL1.
Figure 6-3 Front panel of the PL1
PL1
1-16
STATACTPROGSRV
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IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usageof the interfaces.
Table 6-2 Interfaces on the front panel of the PL1
Interface InterfaceType
Usage
1–8 2mmHM Receives the first eight channels (1–8) of E1 signals.
9–16 2mmHM Receives the last eight channels (9–16) of E1 signals.
6.1.5 Valid SlotsThe PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN1500B subrack.
6.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PL1 indicates the interface impedance type.
Table 6-3 lists the relation between the board feature code and interface impedance type for thePL1.
Table 6-3 Relation between the board feature code and the optical interface type of the PL1
Board Feature Code Interface Impedance Type
SSR1PL1A01 A01 75 ohms
SSR1PL1B01 B01 120 ohms
6.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL1.
You can use the T2000 to set the following parameters for the PL1:
l J2 byte
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l V5 byte
l Tributary loopback
l Service loading indication
For details on these parameters, see F Board Configuration Reference.
6.1.8 Technical SpecificationsThe technical specifications of the PL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 6-4 lists the specifications of the optical interfaces of the PL1.
Table 6-4 Specifications of the electrical interfaces of the PL1
InterfaceType
Code OutputSignal BitRate
AllowedInputFrequencyDeviation
AllowedInputAttenuation
InputJitterTolerance
2048 kbit/s HDB3 Compliant with ITU-T G.703
Mechanical SpecificationsThe mechanical specifications of the PL1 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PL1 is 7 W.
6.2 PD1This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.
6.2.1 Version DescriptionThe PD1 has two versions, R1 and R2. The two versions have different functions.
6.2.2 Function and FeatureThe PD1 is used to process E1 signals and the overhead, to report alarms and performance events,and to provide the maintenance features and TPS protection.
6.2.3 Working Principle and Signal FlowThe PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.
6.2.4 Front Panel
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On the front panel of the PD1, there are indicators.
6.2.5 Valid SlotsThe PD1 must be used with the L75S or L12S.
6.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PD1 indicates the interface impedance type.
6.2.7 TPS Protection for the BoardThe PD1 supports the 1:N TPS protection.
6.2.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PD1.
6.2.9 Technical SpecificationsThe technical specifications of the PD1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.2.1 Version DescriptionThe PD1 has two versions, R1 and R2. The two versions have different functions.
Table 6-5 lists the details on the versions of the PD1 board.
Table 6-5 Version Description of the PD1
Item Description
Functionalversion
The PD1 has two versions, R1 and R2.
Difference The R2PD1 supports the E13 function and the board version replacementfunction.
Replaceability The R1PD1A can be replaced by the R2PD1A.The R1PD1B can be replaced by the R2PD1B.
6.2.2 Function and FeatureThe PD1 is used to process E1 signals and the overhead, to report alarms and performance events,and to provide the maintenance features and TPS protection.
Table 6-6 lists the functions and features of the PD1.
Table 6-6 Functions and features of the PD1
FunctionandFeature
PD1
R1PD1 R2PD1
Basicfunction
Processes 32 x E1signals.
Processes 32 x E1 signals.
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FunctionandFeature
PD1
R1PD1 R2PD1
Serviceprocessing
Accesses andprocesses 32 x E1electrical signalswhen used with theinterface board.
Accesses and processes 32 x E1 electrical signals whenused with the interface board.Supports the E13 function, which is used to convergeE1 services into E3 services.
Overheadprocessing
Supports the transparent transmission and termination of the POH bytes at theVC-12 level, such as the J2 byte.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenance feature
Supports inloop and outloop for the electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of the board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
Protectionscheme
Supports the TPS protection when used with the electrical interface switchingboard.
6.2.3 Working Principle and Signal FlowThe PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-4 shows the block diagram for the functions of the PD1.
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Figure 6-4 Block diagram for the functions of the PD1
E1
E1
E1mapping/
demapping
Communication andcontrol module
Cross-connect unitA
155 Mbit/s
155 Mbit/s
LOS
6 x 2 Mbit/s High speed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
1.5 MHz/2 MHzOSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter+1.8 V
+2.5 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI
6 x 2 Mbit/s Cross-connect unitB
Cross-connect unit
High speed bus
Figure 6-5 shows the block diagram of the E1mapping/ demapping.
Figure 6-5 Block diagram of the E1 mapping/ demapping
E1 STM-1
PDH AISDetector
E1 mapping/demapping
LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
insertionTU-AIS/TU-LOP
Detector
E1 STM-1LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
Extraction
The function modules are described as follows.
PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloopfunction. This module:
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l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
E1 mapping/demappingl LPA
l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as tobe transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theVC-12 container and POH. The latter contains nine octets equally distributed within theframe bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are locatedprecisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytesinterleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1 mapping/demapping” block with the multiplex unit.
Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.
DC/DC converterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power areprovided to the board.
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6.2.4 Front PanelOn the front panel of the PD1, there are indicators.
Appearance of the Front PanelFigure 6-6 shows the appearance of the front panel of the PD1.
Figure 6-6 Front panel of the PD1
PD1
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the PD1.
In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75-ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S.
In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75-ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.
6.2.5 Valid SlotsThe PD1 must be used with the L75S or L12S.
In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12.Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S.
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Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiXOSN 1500A subrack
Valid Slot for the PD1 Corresponding Slot for the L75S and L12S
Slot 12 Slot 7 (1–16 channels services)Slot 6 (17–32 channels services)
NOTE
Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the boardhoused in slot 12.
In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 1–3, 6–8 and 11–13.Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S.
Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiXOSN 1500B subrack
Valid Slot for the PD1 Corresponding Slot for the D75S andD12S
Slot 2 Slot 14
Slot 3 Slot 16
Slots 7 and 12 Slot 15
Slots 8 and 13 Slot 17
NOTE
l Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the sametime.
l Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the sametime.
l Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boardshoused in slots 2 and 3.
l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects theboards housed in slots 12 and 13.
l Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boardshoused in slots 7 and 8.
6.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PD1 indicates the interface impedance type.
Table 6-9 lists the relation between the board feature code and interface impedance type for thePD1.
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Table 6-9 Relation between the board feature code and the interface impedance type
Board Feature Code Interface ImpedanceType
SSR1PD1A01,SSR2PD1A01
A01 75 ohms
SSR1PD1B01,SSR2PD1B01
B01 120 ohms
6.2.7 TPS Protection for the BoardThe PD1 supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1.
Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack
Detectboard fault
PD1
L75SL75S
PD1
SLOT2
SLOT12
SLOT6
SLOT7
E1protection bus
E1 service
bus
Fail
TPSswitching
control busCross-connect and timingboard
Protection
Working
In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N(1≤2) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.
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Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack
Detectboard fault
E1 protection bus
E1 service bus
TPS switchingcontrol bus
PD1PD1 PD1
D75S
D75S
Fail
Protection Working Working
Cross-connect andtiming board
When detecting a failure in the working PD1 board, the cross-connect board issues a commandto switch the services from the faulty PD1 to the protection PD1. In this way, services areprotected.
Hardware ConfigurationIn the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realizethe 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection forthe PD1.
Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500Asubrack
Slot 20
FAN
Slot 1
Slot 2
Slot 3
Slot 4
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10 AUX Slot 5
CXL16/4/1
CXL16/4/1
EOW
Slot 12
Slot 11
Slot 13
PD1(P) PD1(W) L75S(1~16)
L75S(17~32)
Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiXOSN 1500B subrack.
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Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500Bsubrack
Board Protection Group Beforethe Slot Division
Protection Group After the SlotDivision
PD1(protection)
Slot 6 Slot 1 Slot 11 Slot 6
PD1(working)
Slots 7 and 8 Slots 2 and3
Slots 12 and13
Slots 7 and8
D75S/D12S Slots 15 and 17 Slots 14 and16
Slots 15 and17
Slots 15and 17
The two protection groups that contain slots 6 and 11 share the protection bus and thus cannotcoexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protectionfor E1 services. After the slots are divided, the OptiX OSN 1500B supports a maximum of twoTPS protection groups for E1 services.
6.2.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PD1.
You can use the T2000 to set the following parameters for the PD1:
l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication
For details on these parameters, see F Board Configuration Reference.
6.2.9 Technical SpecificationsThe technical specifications of the PD1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. Forspecifications of the electrical interfaces, see the sections that describe these boards.
Mechanical Specifications
The mechanical specifications of the PD1 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg)– 0.5 (R1PD1)
– 0.56 (R2PD1)
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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the R1PD1 is 15 W.
In the normal temperature (25℃), the maximum power consumption of the R2PD1 is 10.4 W.
6.3 PQ1This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.3.1 Version DescriptionThe PQ1 has two versions, R1 and R2. The two versions have different functions.
6.3.2 Function and FeatureThe PQ1 can be used to process E1 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.
6.3.3 Working Principle and Signal FlowThe PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and soon.
6.3.4 Front PanelOn the front panel of the PQ1, there are indicators.
6.3.5 Valid SlotsThe PQ1 must be used with the D75S, D12S or D12B.
6.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PQ1 indicates the interface impedance type.
6.3.7 TPS Protection for the BoardThe PQ1 supports the 1:N TPS protection.
6.3.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQ1.
6.3.9 Technical SpecificationsThe technical specifications of the PQ1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.3.1 Version DescriptionThe PQ1 has two versions, R1 and R2. The two versions have different functions.
Table 6-11 lists the details on the versions of the PQ1 board.
Table 6-11 Version Description of the PQ1
Item Description
Functionalversion
The PQ1 has two versions, N1 and N2.
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Item Description
Difference The N2PQ1 supports the E13 function and the board version replacementfunction.The N2PQ1 does not perform the tributary timing function.
Replaceability When the tributary timing function is not required, the N1PQ1A can bereplaced by the N2PQ1A.When the tributary timing function is not required, the N1PQ1B can bereplaced by the N2PQ1B.
NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100ohms/120 ohms) are called PQ1 hereinafter.
6.3.2 Function and FeatureThe PQ1 can be used to process E1 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.
Table 6-12 lists the functions and features of the PQ1.
Table 6-12 Functions and features of the PQ1
FunctionandFeature
PQ1
N1PQ1 N2PQ1
Basicfunction
Processes 63 x E1signals.
Processes 63 x E1 signals.
Serviceprocessing
Processes 63 x E1electrical signalswhen used with aninterface board.
Processes 63 x E1 electrical signals when used with aninterface board.Supports the E13 function, which is used to convergeE1 services into E3 services.
Overheadprocessing
Supports the transparent transmission and termination of the POH bytes at theVC-12, such as the J2 byte.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenance feature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of the board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
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FunctionandFeature
PQ1
N1PQ1 N2PQ1
Protectionscheme
Supports the TPS protection when used with the interface board.When the working board is the PQ1, the protection board can be the PQM. Inthis way, the hybrid protection is provided.
6.3.3 Working Principle and Signal FlowThe PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and soon.
Figure 6-10 shows the block diagram for the functions of the PQ1.
Figure 6-10 Block diagram for the functions of the PQ1
E1/T1
E1/T1
E1/T1mapping/
demapping
Communication andcontrol module
Cross-connect unitA
155 Mbit/s
155 Mbit/s
LOS
6 x 1.5 Mbit/s/6 x 2 Mbit/s High speed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
1.5 MHz/2 MHzOSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter+1.8 V
+2.5 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 1.5 Mbit/s/
6 x 2 Mbit/s Cross-connect unitB
Cross-connect unit
High speed bus
Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.
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Figure 6-11 Block diagram of the E1/T1 mapping/ demapping
E1/T1 STM-1
PDH AISDetector
E1/T1 mapping/demapping
LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
insertionTU-AIS/TU-LOP
Detector
E1/T1 STM-1LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
Extraction
The function modules are described as follows.
PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloopfunction. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
E1/T1 mapping/demappingl LPA
l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to beadapted so as to be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theVC-12 container and POH. The latter contains nine octets equally distributed within theframe bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are locatedprecisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytesinterleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
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l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1/T1 mapping/demapping” block with the multiplex unit.
Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.
DC/DC converterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power areprovided to the board.
6.3.4 Front PanelOn the front panel of the PQ1, there are indicators.
Appearance of the Front PanelFigure 6-12 shows the appearance of the front panel of the PQ1.
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Figure 6-12 Front panel of the PQ1
PQ1
PQ1
STATACTPROGSRV
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are no interfaces on the front panel of the PQ1.
The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. Fordetails, see the sections that describe the D75S, D12S and D12B.
6.3.5 Valid SlotsThe PQ1 must be used with the D75S, D12S or D12B.
The OptiX OSN 1500A does not support the PQ1 board.
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In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 11–13, and must beused with the D75S, D12S or D12B.
Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B.
Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in theOptiX OSN 1500B subrack
Valid Slot for the PQ1 Corresponding Slot for the D75S, D12Sand D12B
Slot 12 Slot 14 (1–32 channels of services)Slot 15 (33–63 channels of services)
Slot 13 Slot 16 (1–32 channels of services)Slot 17 (33–63 channels of services)
NOTE
l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects theboards housed in slots 12 and 13.
l If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12and 13 cannot get the TPS protection.
6.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PQ1 indicates the interface impedance type.
Table 6-14 lists the relation between the board feature code and interface impedance type forthe PQ1.
Table 6-14 Relation between the board feature code and the interface impedance type
Board Feature Code Interface ImpedanceType
SSN1PQ1A01,SSN2PQ1A01
A01 75 ohms
SSN1PQ1B01,SSN2PQ1B01
B01 120 ohms
6.3.7 TPS Protection for the BoardThe PQ1 supports the 1:N TPS protection.
Protection Principle
In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (≤2)TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1.
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Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack
Protection
D75S
D75S
D75S
D75S
SLOT11
SLOT14
SLOT15
SLOT16
SLOT17
E1protection bus
E1 service
bus
TPS switchingcontrol bus
Working
Working
Fail
SLOT12
SLOT13
Detectboard fault
Cross-connect andtiming board
When detecting a failure in the working PD1 board, the cross-connect board issues a commandto switch the services from the faulty PQ1 to the protection PQ1. In this way, services areprotected.
Hardware ConfigurationTable 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN1500B subrack.
Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500Bsubrack
Working Board Protection Board Slot
PQ1A (75 ohms) PQ1A (75 ohms) Slot 11 can house the protection board.The board in slot 11 protects the boardsin slots 12 and 13. Figure 6-14 shows theslot configuration for the 1:2 TPSprotection for the PQ1.
PQ1B (120 ohms) PQ1B (120 ohms) orPQM
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Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1
Slot 14 Slot 18 PIU
Slot 20
FAN
PIU
AUX
D75S
D75S
WorkingWorking
CXL16/4/1
EOW
D75S
D75S
Protection
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 5
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10
Slot 4 CXL16/4/1
6.3.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQ1.
You can use the T2000 to set the following parameters for the PQ1:
l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication
For details on these parameters, see F Board Configuration Reference.
6.3.9 Technical SpecificationsThe technical specifications of the PQ1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications ofthese electrical interfaces, see the section that describes the D75S, D12S or D12B.
Mechanical Specifications
The mechanical specifications of the PQ1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PQ1 is 19 W.
In the normal temperature (25℃), the maximum power consumption of the N2PQ1 is 13 W.
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6.4 PQMThis section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.4.1 Version DescriptionThe functional version of the PQM board is N1.
6.4.2 Function and FeatureThe PQM is used to process E1/T1 signals and the overhead, to report alarms and performanceevents, and to provide the maintenance features and TPS protection.
6.4.3 Working Principle and Signal FlowThe PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,communication and control module and so on.
6.4.4 Front PanelOn the front panel of the PQM, there are indicators.
6.4.5 Valid SlotsThe OptiX OSN 1500A does not support the PQM board.
6.4.6 TPS Protection for the BoardThe PQM supports the 1:N TPS protection.
6.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQM.
6.4.8 Technical SpecificationsThe technical specifications of the PQM cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.4.1 Version DescriptionThe functional version of the PQM board is N1.
6.4.2 Function and FeatureThe PQM is used to process E1/T1 signals and the overhead, to report alarms and performanceevents, and to provide the maintenance features and TPS protection.
Table 6-16 lists the functions and features of the PQM.
Table 6-16 Functions and features of the PQM
Functionand Feature
PQM
Basic function Processes 63 x E1/T1 signals.
Serviceprocessing
The PQM accesses and processes 63 x E1/T1 electrical signals when usedwith the interface board. Each channel can be configured as E1 or T1.
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Functionand Feature
PQM
Overheadprocessing
Supports the transparent transmission and termination of the POH bytes atthe VC-12 level, such as the J2 byte.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenancefeature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
Protectionscheme
When used with the interface board, the PQM supports the TPS protection.When the working board is the PQ1, the protection board can be the PQM.In this way, the hybrid protection is provided.
6.4.3 Working Principle and Signal FlowThe PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-15 shows the block diagram for the functions of the PQM.
Figure 6-15 Block diagram for the functions of the PQM
E1/T1
E1/T1
E1/T1mapping/
demapping
Communication andcontrol module
Cross-connect unitA
155 Mbit/s
155 Mbit/s
LOS
6 x 1.5 Mbit/s/6 x 2 Mbit/s High speed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
1.5 MHz/2 MHzOSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter+1.8 V
+2.5 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 1.5 Mbit/s/
6 x 2 Mbit/s Cross-connect unitB
Cross-connect unit
High speed bus
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Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping.
Figure 6-16 Block diagram of the E1/T1 mapping/ demapping
E1/T1 STM-1
PDH AISDetector
E1/T1 mapping/demapping
LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
insertionTU-AIS/TU-LOP
Detector
E1/T1 STM-1LPA LPT HPA HPT
LPOH(V5/J2/N2/K4)
Extraction
The function modules are described as follows.
PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloopfunction. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
E1/T1 mapping/demappingl LPA
l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to beadapted so as to be transported into the synchronous network for check of the PDH AIS.
l LPT
l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theVC-12 container and POH. The latter contains nine octets equally distributed within theframe bytes for VC-12: V5, J2, N2, and K4.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are locatedprecisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytesinterleaving. The sequence is: TUG2->TUG3->VC-4.
l HPT
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l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1/T1 mapping/demapping” block with the multiplex unit.
Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.
DC/DC converterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power areprovided to the board.
6.4.4 Front PanelOn the front panel of the PQM, there are indicators.
Appearance of the Front PanelFigure 6-17 shows the appearance of the front panel of the PQM.
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Figure 6-17 Front panel of the PQM
PQM
PQM
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the PQM.
The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sectionsthat describe the D12S and D12B.
6.4.5 Valid SlotsThe OptiX OSN 1500A does not support the PQM board.
In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 11–13, and must beused with the D12S or D12B.
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Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B.
Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiXOSN 1500B subrack
Valid Slot for the PQM Corresponding Slot for the D12S andD12B
Slot 12 Slot 14 (1–32 channels of services)Slot 15 (33–63 channels of services)
Slot 13 Slot 16 (1–32 channels of services)Slot 17 (33–63 channels of services)
NOTE
l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects theboards housed in slots 12 and 13.
l If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots12 and 13 cannot get the TPS protection.
6.4.6 TPS Protection for the BoardThe PQM supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N≤2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.
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Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack
Protection
D12S
SLOT11
SLOT14
SLOT15
SLOT16
SLOT17
E1/T1protection bus
E1/T1 service
bus
TPS switchingcontrol bus
Working
Working
Fail
SLOT12
SLOT13
Detectboard fault
Cross-connect andtiming board
D12S
D12S
D12S
When detecting a fault in the working PQM board, the cross-connect board issues a commandto switch the services from the faulty PQM to the protection PQM. In this way, services areprotected.
Hardware ConfigurationTable 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN1500B subrack.
Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500Bsubrack
WorkingBoard
Protection Board Slot
PQM (E1) PQM (E1) Slot 11 can house the protection board. The boardin slot 11 protects the boards in slots 12 and 13.Figure 6-19 shows the slot configuration for the1:2 TPS protection for the PQM.
PQM (T1) PQM (T1)
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Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500Bsubrack
Slot 14 Slot 18 PIU
Slot 20
FAN
PIU
AUX
D12S
D12S
WorkingWorking
CXL16/4/1
EOW
D12S
D12S
Protection
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 5
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10
Slot 4 CXL16/4/1
6.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQM.
You can use the T2000 to set the following parameters for the PQM:
l J2 byte
l V5 byte
l Tributary loopback
l Service loading indication
l Path service type
For details on these parameters, see F Board Configuration Reference.
6.4.8 Technical SpecificationsThe technical specifications of the PQM cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
The D12S or D12B provides electrical interfaces for the PQM. For the specifications of theelectrical interfaces, see the sections that describe the D12S and D12B.
Mechanical Specifications
The mechanical specifications of the PQM are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the PQM is 22 W.
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6.5 PL3This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.5.1 Version DescriptionThe PL3 has two versions, N1 and N2. The two versions have different functions.
6.5.2 Function and FeatureThe PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.
6.5.3 Working Principle and Signal FlowThe PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
6.5.4 Front PanelOn the front panel of the PL3, there are indicators.
6.5.5 Valid SlotsThe OptiX OSN 1500A does not support the PL3 board.
6.5.6 TPS Protection for the BoardThe PL3 supports the 1:N TPS protection.
6.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3.
6.5.8 Technical SpecificationsThe technical specifications of the PL3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.5.1 Version DescriptionThe PL3 has two versions, N1 and N2. The two versions have different functions.
Table 6-19 lists the details on the versions of the PL3 board.
Table 6-19 Version description of the PL3
Item Description
Functionalversion
The PL3 has two versions, N1 and N2.
Difference The N1PL3 does not support the E13/M13 function.The N2PL3 supports the E13/M13 function.The N2PL3 supports the board version replacement function and canreplace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistentwith the N1PL3 in configuration and service status.
Replaceability The N2PL3 can fully replace the N1PL3.
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6.5.2 Function and FeatureThe PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.
Table 6-20 lists the functions and features of the PL3.
Table 6-20 Functions and features of the PL3
Function andFeature
PL3
Basic function Processes 3 x E3/T3 signals.
Service processing Accesses and processes 3 x E3/T3 electrical signals.
Overheadprocessing
Supports the setting and query of all path overhead bytes at the VC-3level.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenancefeature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
Protection scheme Supports the TPS protection when used with the interface board and theswitching board.
6.5.3 Working Principle and Signal FlowThe PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-20 shows the block diagram for the functions of the PL3.
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Figure 6-20 Block diagram for the functions of the PL3
E3/T3
E3/T3
E3/T3mapping/
demapping
Communication andcontrol module
Cross-connect unitA
2 x 155 Mbit/s
2 x 155 Mbit/s
LOS
6 x 34 Mbit/s/6 x 45 Mbit/s
Highspeed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
34 MHz/45 MHz
OSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 34 Mbit/s/
6 x 45 Mbit/s Cross-connect unitB
Highspeed bus
Cross-connect unit
OSC: Oscillator PPI: PDH physical interface
Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping.
Figure 6-21 Block diagram of the E3/T3 mapping/demapping
E3/T3 STM-1
PDH AISDetector
E3/T3 mapping/demapping
LPA LPT HPA HPT
LPOH(J1/C2/B3)insertion
TU-AIS/TU-LOPDetector
E3/T3 STM-1LPA LPT HPA HPT
LPOH(J1/C2/B3)extraction
LPA: Low order Path Adaptation LPT: Low order Path TerminationHPA: High order Path Adaptation HPT: High order Path Termination
The function modules are described as follows.
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PPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.
E3/T3 mapping/demappingl LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adaptedso as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,one STM–1 period), and consists of the VC-3 container and POH. The latter contains nineoctets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In thetransmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3sare multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect theinterface conversion module.
Interface conversion module
The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
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DC/DC converter moduleThrough the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.
6.5.4 Front PanelOn the front panel of the PL3, there are indicators.
Appearance of the Front PanelFigure 6-22 shows the appearance of the front panel of the PL3.
Figure 6-22 Front panel of the PL3
PL3
PL3
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
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l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the PL3.
The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3.For details, see the section that describes the D34S.
6.5.5 Valid SlotsThe OptiX OSN 1500A does not support the PL3 board.
In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 12–13, and must beused with the C34S.
Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S.
Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN1500B subrack
Valid Slot for the PL3 Corresponding Slot for the C34S
Slot 12 Slot 14
Slot 13 Slot 16
6.5.6 TPS Protection for the BoardThe PL3 supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.
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Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack
TSB8
SLOT12
PL3
1 2
SLOT13
3 xE3/T3
C34S
PL3
SLOT 4/5
123
Switchcontrolsignal
Protection Working
Fail
Cross-connect
and timingboard
l Normal stateWhen the working boards are running normally, the control switch of the C34S is in position1 and services are directly accessed to the PL3 board.
l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theC34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.
Hardware ConfigurationTable 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN1500B subrack.
Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500Bsubrack
WorkingBoard
Protection Board Slot
PL3 (E3) PL3 (E3)/PD3 (E3) If the working board is the PL3, the PD3can be the protection board. Figure 6-24shows the slot configuration for the 1:1 TPSprotection for the PL3.
PL3 (T3) PL3 (T3)/PD3 (T3)
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Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500Bsubrack
Slot 14PIU
Slot 20
FAN
AUX
TSB8
C34S
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
Working
Protection
As shown in Figure 6-24, the protection board housed in slot 12 protects the board housed inslot 13.
Table 6-23 lists the slots for the PL3, C34S and TSB8.
Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack
Board Protection Group
PL3 (working) Slot 13
PL3/PD3 (protection) Slot 12
TSB8 Slot 14
C34S Slot 16
6.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3.
You can use the T2000 to set the following parameters for the PL3:
l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type
For details on these parameters, see F Board Configuration Reference.
6.5.8 Technical SpecificationsThe technical specifications of the PL3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
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Electrical Interface SpecificationsThe C34S provides electrical interfaces for the PL3. For the specifications of the electricalinterfaces, see the section that describes the C34S.
Mechanical SpecificationsThe mechanical specifications of the PL3 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1PL3 is 15 W.
In the normal temperature (25℃), the maximum power consumption of the N2PL3 is 12 W.
6.6 PL3AThis section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.6.1 Version DescriptionThe PL3A board has two functional versions, N1 and N2. The difference between the twoversions lies in the support for the E13/M13 function.
6.6.2 Function and FeatureThe PL3A can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
6.6.3 Working Principle and Signal FlowThe PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
6.6.4 Front PanelOn the front panel of the PL3A, there are indicators and interfaces.
6.6.5 Valid SlotsThe PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks
6.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3A.
6.6.7 Technical SpecificationsThe technical specifications of the PL3A cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.6.1 Version DescriptionThe PL3A board has two functional versions, N1 and N2. The difference between the twoversions lies in the support for the E13/M13 function.
Table 6-24 lists the details on the versions of the PL3A board.
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Table 6-24 Version description of the PL3A
Item Description
Functionalversion
The PL3A has two versions, N1 and N2.
Difference The N1PL3A does not support the E13/M13 function.The N2PL3A supports the E13/M13 function.The N2PL3A supports the board version replacement function and canreplace the N1PL3A. After the N1PD3A is replaced, the N2PD3A isconsistent with the N1PD3A in configuration and service status.
Replaceability The N2PD3A can fully replace the N1PD3A.
6.6.2 Function and FeatureThe PL3A can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
Table 6-25 lists the functions and features of the PL3A.
Table 6-25 Functions and features of the PL3A
Function andFeature
PL3A
Basic function Processes 3 x E3/T3 signals.The N2PL3A supports the E13 function, which is used to converge E1services into E3 services.The N2PL3A supports the M13 function, which is used to converge T1services into T3 services.
Serviceprocessing
Accesses and processes 3 x E3/T3 electrical signals.
Overheadprocessing
Supports the setting and query of all path overhead bytes at the VC-3 level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenancefeature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
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6.6.3 Working Principle and Signal FlowThe PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-25 shows the block diagram for the functions of the PL3A.
Figure 6-25 Block diagram for the functions of the PL3A
E3/T3
E3/T3
E3/T3mapping/
demapping
Communication andcontrol module
Cross-connect unitA
2 x 155 Mbit/s
2 x 155 Mbit/s
LOS
6 x 34 Mbit/s/6 x 45 Mbit/s
Highspeed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
34 MHz/45 MHz
OSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 34 Mbit/s/
6 x 45 Mbit/s Cross-connect unitB
Highspeed bus
Cross-connect unit
OSC: Oscillator PPI: PDH physical interface
Figure 6-26 shows the block diagram of the E3/T3 mapping/demapping.
Figure 6-26 Block diagram of the E3/T3 mapping/demapping
E3/T3 STM-1
PDH AISDetector
E3/T3 mapping/demapping
LPA LPT HPA HPT
LPOH(J1/C2/B3)insertion
TU-AIS/TU-LOPDetector
E3/T3 STM-1LPA LPT HPA HPT
LPOH(J1/C2/B3)extraction
LPA: Low order Path Adaptation LPT: Low order Path Termination
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HPA: High order Path Adaptation HPT: High order Path Termination
The function modules are described as follows.
PPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.
E3/T3 mapping/demappingl LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adaptedso as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,one STM–1 period), and consists of the VC-3 container and POH. The latter contains nineoctets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In thetransmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3sare multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect theinterface conversion module.
Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
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l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC converter module
Through the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.
6.6.4 Front PanelOn the front panel of the PL3A, there are indicators and interfaces.
Appearance of the Front Panel
Figure 6-27 shows the appearance of the front panel of the PL3A.
Figure 6-27 Front panel of the PL3A
PL3A
PL3A
STATACTPROGSRV
OU
T1IN
1O
UT2
IN2
IN3
OU
T3
Indicators
The following indicators are present on the front panel of the board:
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l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.
6.6.5 Valid SlotsThe PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks
The PL3A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
The PL3A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
6.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3A.
You can use the T2000 to set the following parameters for the PL3A:
l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type
For details on these parameters, see F Board Configuration Reference.
6.6.7 Technical SpecificationsThe technical specifications of the PL3A cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
Table 6-26 lists the specifications of the electrical interfaces of the PL3A.
Table 6-26 Specifications of the electrical interfaces of the PL3A
Interface Type Code OutputSignal BitRate
AllowedInputFrequencyDeviation
AllowedInputAttenuation
InputJitterTolerance
34368 kbit/s HDB3 Compliant with ITU-T G.703
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Interface Type Code OutputSignal BitRate
AllowedInputFrequencyDeviation
AllowedInputAttenuation
InputJitterTolerance
44736 kbit/s B3ZS Compliant with ITU-T G.703
Mechanical Specifications
The mechanical specifications of the PL3A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PL3A is 15 W.
In the normal temperature (25℃), the maximum power consumption of the N2PL3A is 12 W.
6.7 PD3This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.7.1 Version DescriptionThe PD3 board has two functional versions, N1 and N2. The difference between the two versionslies in the support for the E13/M13 function.
6.7.2 Function and FeatureThe PD3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
6.7.3 Working Principle and Signal FlowThe PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
6.7.4 Front PanelOn the front panel of the PD3, there are indicators.
6.7.5 Valid SlotsThe OptiX OSN 1500A does not support the PD3 board.
6.7.6 TPS Protection for the BoardThe PD3 supports the 1:N TPS protection.
6.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PD3.
6.7.8 Technical SpecificationsThe technical specifications of the PD3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
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6.7.1 Version DescriptionThe PD3 board has two functional versions, N1 and N2. The difference between the two versionslies in the support for the E13/M13 function.
Table 6-27 lists the details on the versions of the PD3 board.
Table 6-27 Version Description of the PD3
Item Description
Functionalversion
The PD3 has two functional versions, N1 and N2.
Difference The N1PD3 does not support the E13/M13 function.The N2PD3 supports the E13/M13 function.The N2PD3 supports the board version replacement function and canreplace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistentwith the N1PD3 in configuration and service status.
Replaceability The N2PD3 can fully replace the N1PD3.
6.7.2 Function and FeatureThe PD3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
Table 6-28 lists the functions and features of the PD3.
Table 6-28 Functions and features of the PD3
Functionand Feature
PD3
Basic function Processes 6 x E3/T3 signals.
Serviceprocessing
Accesses and processes 6 x E3/T3 electrical signals.The N2PD3 supports the E13 function, which is used to converge E1services into E3 services.The N2PD3 supports the M13 function, which is used to converge T1services into T3 services.
Overheadprocessing
Supports the setting and query of all path overhead bytes at the VC-3 level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
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Functionand Feature
PD3
Maintenancefeature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
Protectionscheme
Supports the TPS protection when used with the interface and switchingboards.
6.7.3 Working Principle and Signal FlowThe PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-28 shows the block diagram for the functions of the PD3.
Figure 6-28 Block diagram for the functions of the PD3
E3/T3
E3/T3
E3/T3mapping/
demapping
Communication andcontrol module
Cross-connect unitA
2 x 155 Mbit/s
2 x 155 Mbit/s
LOS
6 x 34 Mbit/s/6 x 45 Mbit/s
Highspeed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
34 MHz/45 MHz
OSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 34 Mbit/s/
6 x 45 Mbit/s Cross-connect unitB
Highspeed bus
Cross-connect unit
OSC: Oscillator PPI: PDH physical interface
Figure 6-29 shows the block diagram of the E3/T3 mapping/demapping.
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Figure 6-29 Block diagram of the E3/T3 mapping/demapping
E3/T3 STM-1
PDH AISDetector
E3/T3 mapping/demapping
LPA LPT HPA HPT
LPOH(J1/C2/B3)insertion
TU-AIS/TU-LOPDetector
E3/T3 STM-1LPA LPT HPA HPT
LPOH(J1/C2/B3)extraction
LPA: Low order Path Adaptation LPT: Low order Path TerminationHPA: High order Path Adaptation HPT: High order Path Termination
The function modules are described as follows.
PPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.
E3/T3 mapping/demappingl LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adaptedso as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,one STM–1 period), and consists of the VC-3 container and POH. The latter contains nineoctets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In thetransmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3sare multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
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l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect theinterface conversion module.
Interface converting moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
DC/DC converter moduleThrough the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.
6.7.4 Front PanelOn the front panel of the PD3, there are indicators.
Appearance of the Front PanelFigure 6-30 shows the appearance of the front panel of the PD3.
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Figure 6-30 Front panel of the PD3
PD3
PD3
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesNo interfaces are present on the front panel of the PD3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3.For details, see the section that describes the D34S.
6.7.5 Valid SlotsThe OptiX OSN 1500A does not support the PD3 board.
In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 12–13, and must beused with the D34S.
Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S.
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Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN1500B subrack
Valid Slot for the PD3 Corresponding Slot for the D34S
Slot 12 Slot 14
Slot 13 Slot 16
6.7.6 TPS Protection for the BoardThe PD3 supports the 1:N TPS protection.
Protection PrincipleFor the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configuredinto one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection forthe PD3.
Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack
TSB8
SLOT12
PD3
1 2
SLOT13
6 xE3/T3
D34S
PD3
SLOT 4/5
123
Switchcontrolsignal
Protection Working
Fail
Cross-connect
andtimingboard
l Normal stateWhen the working boards are running normally, the control switch of the D34S is in position1 and services are directly accessed to the PD3 board.
l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theD34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.
Hardware ConfigurationTable 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN1500B subrack.
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Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500Bsubrack
WorkingBoard
Protection Board Slot
PD3 (E3) PD3 (E3) Figure 6-32 shows the slot configuration forthe 1:1TPS protection for the PD3
PD3 (T3) PD3 (T3)
Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500Bsubrack
Slot 14PIU
Slot 20
FAN
AUX
TSB8
D34S
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
Working
Protection
As shown in Figure 6-32, the protection board housed in slot 12 protects the board housed inslot 13.
Table 6-31 lists the slots for the PD3, D34S and TSB8.
Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack
Board Protection Group
PD3 (working) Slot 13
PD3 (protection) Slot 12
TSB8 Slot 14
D34S Slot 16
6.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PD3.
You can use the T2000 to set the following parameters for the PD3:
l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type
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For details on these parameters, see F Board Configuration Reference.
6.7.8 Technical SpecificationsThe technical specifications of the PD3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsThe D34S provides electrical interfaces for the PD3. For the specifications of the electricalinterfaces, see the section that describes the D34S.
Mechanical SpecificationsThe mechanical specifications of the PD3 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the N1PD3 is 19 W.
In the normal temperature (25℃), the maximum power consumption of the N2PD3 is 12 W.
6.8 PQ3This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.
6.8.1 Version DescriptionThe functional version of the PQ3 board is N2.
6.8.2 Function and FeatureThe PQ3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
6.8.3 Working Principle and Signal FlowThe PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
6.8.4 Front PanelOn the front panel of the PQ3, there are indicators.
6.8.5 Valid SlotsThe OptiX OSN 1500A does not support the PQ3 board.
6.8.6 TPS Protection for the BoardThe PQ3 supports the 1:N TPS protection.
6.8.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQ3.
6.8.8 Technical Specifications
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The technical specifications of the PQ3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.8.1 Version DescriptionThe functional version of the PQ3 board is N2.
6.8.2 Function and FeatureThe PQ3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.
Table 6-32 lists the functions and features of the PQ3.
Table 6-32 Functions and features of the PQ3
Function andFeature
PQ3
Basic function Processes 12 x E3/T3 signals.
Serviceprocessing
Accesses and processes 12 x E3/T3 electrical signals.Supports the E13 function, which is used to converge E1 services into E3services.Supports the M13 function, which is used to converge T1 services into T3services.
Overheadprocessing
Supports the setting and query of all path overhead bytes at the VC-3 level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Maintenancefeature
Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.
Protectionscheme
Supports the TPS protection when used with the interface board and theswitching board.
6.8.3 Working Principle and Signal FlowThe PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.
Figure 6-33 shows the block diagram for the functions of the PQ3.
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Figure 6-33 Block diagram for the functions of the PQ3
E3/T3
E3/T3
E3/T3mapping/
demapping
Communication andcontrol module
Cross-connect unitA
2 x 155 Mbit/s
2 x 155 Mbit/s
LOS
6 x 34 Mbit/s/6 x 45 Mbit/s
Highspeed bus
SCC UnitCommunication
Frame header
Outloop/Inloop control
Interfacecoversion
module
34 MHz/45 MHz
OSC
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
+1.8 V
155 MHzPLL
Reference clockCross-connect unit
LIU
LIU
PPI 6 x 34 Mbit/s/
6 x 45 Mbit/s Cross-connect unitB
Highspeed bus
Cross-connect unit
OSC: Oscillator PPI: PDH physical interface
Figure 6-34 shows the block diagram of the E3/T3 mapping/demapping.
Figure 6-34 Block diagram of the E3/T3 mapping/demapping
E3/T3 STM-1
PDH AISDetector
E3/T3 mapping/demapping
LPA LPT HPA HPT
LPOH(J1/C2/B3)insertion
TU-AIS/TU-LOPDetector
E3/T3 STM-1LPA LPT HPA HPT
LPOH(J1/C2/B3)extraction
LPA: Low order Path Adaptation LPT: Low order Path TerminationHPA: High order Path Adaptation HPT: High order Path Termination
The function modules are described as follows.
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PPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the A_LOS alarm.
E3/T3 mapping/demappingl LPA
l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adaptedso as to be transported into the synchronous network.
l LPT
l The virtual container (VC-3) is formatted by lower order path termination (LPT).
l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,one STM–1 period), and consists of the VC-3 container and POH. The latter contains nineoctets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,and N1.
l HPA
l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In thetransmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3sare multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.
l HPT
l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.
l MST and RST
l The functions are necessary to create a proprietary STM–1 signal in order to connect theinterface conversion module.
Interface conversion module
The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
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DC/DC converter module
Through the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.
6.8.4 Front PanelOn the front panel of the PQ3, there are indicators.
Appearance of the Front Panel
Figure 6-35 shows the appearance of the front panel of the PQ3.
Figure 6-35 Front panel of the PQ3
PQ3
PQ3STATACTPROGSRV
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
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InterfacesThere are no interfaces on the front panel of the PQ3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3.For details, see the section that describes the D34S.
6.8.5 Valid SlotsThe OptiX OSN 1500A does not support the PQ3 board.
In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 12–13, and must beused with the D34S.
Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S.
Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN1500B subrack
Valid Slot for the PQ1 Corresponding Slot for the D34S
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
6.8.6 TPS Protection for the BoardThe PQ3 supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3.
Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack
TSB8
1 2
6 xE3/T3
D34S
SLOT13
PQ3
SLOT 4/5
1 2
6 xE3/T3
D34S
1 2
TSB8
1 2
SLOT12
PQ3
Switchcontrolsignal
WorkingProtection
Fail
Cross-connect
and timingboard
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l Normal stateWhen the working boards are running normally, the control switch of the D34S is in position1 and services are directly accessed to the PQ3 board.
l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theD34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.
Hardware ConfigurationNOTE
Two TSB8 boards are required to configure the TPS protection for the N2PQ3.
Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN1500B subrack.
Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500Bsubrack
WorkingBoard
Protection Board Slot
PQ3 (E3) PQ3 (E3) Figure 6-37 shows the slot configuration forthe 1:3 TPS protection for the PQ3.
PQ3 (T3) PQ3 (T3)
Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500Bsubrack
Slot 14PIU
Slot 20
FAN
AUX
TSB8
D34S
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
TSB8
D34S
Protection
Working
As shown in Figure 6-37, the protection board housed in slot 12 protects the board housed inslot 13.
Table 6-35 lists the slots for the PQ3, D34S and TSB8.
Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack
Board Protection Group
PQ3 (working) Slot 13
PQ3 (protection) Slot 12
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Board Protection Group
TSB8 Slots 14–15
D34S Slots 16–17
6.8.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQ3.
You can use the T2000 to set the following parameters for the PQ3:
l J1 byte
l C2 byte
l Tributary loopback
l Service loading indication
l Path service type
For details on these parameters, see F Board Configuration Reference.
6.8.8 Technical SpecificationsThe technical specifications of the PQ3 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsThe D34S provides electrical interfaces for the PQ3. For the specifications of the electricalinterfaces, see the section that describes the D34S.
Mechanical SpecificationsThe mechanical specifications of the PL1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PQ3 is 13 W.
6.9 DX1This section describes the DX1, a DDN interface convergence board, in terms of the version,function, principle, front panel, configuration and specifications.
6.9.1 Version DescriptionThe functional version of the DX1 board is N1.
6.9.2 Function and FeatureThe DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k levelat the system side.
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6.9.3 Working Principle and Signal FlowThe DX1 consists of the interface and frame processing module, encoding/decoding module,timeslot cross-connect module, framing/deframing module and so on.
6.9.4 Front PanelOn the front panel of the DX1, there are indicators.
6.9.5 Valid SlotsThe OptiX OSN 1500A does not support the DX1 board.
6.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the DX1 indicates the interface impedance type.
6.9.7 TPS Protection for the BoardThe DX1 supports the 1:N TPS protection.
6.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the DX1.
6.9.9 Technical SpecificationsThe technical specifications of the DX1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.9.1 Version DescriptionThe functional version of the DX1 board is N1.
6.9.2 Function and FeatureThe DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k levelat the system side.
Table 6-36 lists the functions and features of the DX1.
Table 6-36 Functions and features of the DX1
FunctionandFeature
DX1
Basicfunction
Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services.Cross-connects 48 channels of N x 64 kbit/s signals at the system side.
Used withthe interfaceboard
Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services andrealizes the 1:N TPS protection when used with the DM12.One DX1 board should be used with two DM12 boards.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Connector The connectors of the DB28 and DB44 are present on the front panel of theDM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for theframed E1 signals.
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FunctionandFeature
DX1
Loopbackfunction
Supports inloop and outloop.
PRBS self-test
Supported.
6.9.3 Working Principle and Signal FlowThe DX1 consists of the interface and frame processing module, encoding/decoding module,timeslot cross-connect module, framing/deframing module and so on.
Figure 6-38 shows the block diagram for the functions of the DX1.
Figure 6-38 Block diagram for the functions of the DX1
Frame E1interfacemodule
N x 64 kbit/sinterfacemodule
64kbit/sTimeslot
cross-connectmodule
Framing/deframing
module
mapping/demapping
module
Cross-connect unit
DM12DX1
N x 64 kbit/sinterfacemodule
DM12
8XNx64 kbit/s
8XFrame E1
Frame E1encoding/decoding
and frameprocessing
module
Backplane
Power
Nx64k bit/sinterface and
frameprocessing
module
SCC unit
8XNx64 kbit/s
Power
Backplane
Frame E1interfacemodule
+3.3 Vbackuppower
+3.3 V -48 V/-60 VFuse
Fuse
-48 V/-60 V
Communicationand control
module
DC/DCconverter
DC/DCconverter
In the transmit directionThe SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,which recovers the signals. The framing/deframing module converts the signals to framed E1signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities, andtransmits the services that are dropped at the NE to the interface module.
In the receive directionThe DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channelsof N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, theDX1 recovers the clock and data signals.
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The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts theN x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/scross-connect module. The timeslot cross-connect module cross-connects and grooms thesignals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits thesignals to the framing/deframing module. The framing/deframing module then maps the signalsinto the VC-4 and transmits the signals into the SDH cross-connect board.
Control and communication moduleThe control and communication module performs the board communication, control and serviceconfiguration.
DC/DC converter moduleThe DC/DC converter module provides the DC voltages required by the modules of the board.
6.9.4 Front PanelOn the front panel of the DX1, there are indicators.
Appearance of the Front PanelFigure 6-39 shows the appearance of the front panel of the DX1.
Figure 6-39 Front panel of the DX1
DX1
DX1
STATACTPROGSRV
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are no interfaces on the front panel of the DX1.
When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/ssignals. For details, see the section that describes the DM12.
6.9.5 Valid SlotsThe OptiX OSN 1500A does not support the DX1 board.
In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 11–13, and must beused with the DM12.
Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12.
Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN1500B subrack
Valid Slot for the DX1 Corresponding Slot for the DM12
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
NOTE
l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects theboards housed in slots 12 and 13.
l One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channelsof N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to accessfour channels of N x 64 kbit/s signals.
6.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the DX1 indicates the interface impedance type.
Table 6-38 lists the relation between the board feature code and interface impedance type forthe DX1.
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Table 6-38 Relation between the board feature code and the interface impedance type
Board Barcode Feature Code Interface ImpedanceType
SSN1DX1A01 A01 75 ohms
SSN1DX1B01 B01 120 ohms
6.9.7 TPS Protection for the BoardThe DX1 supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N≤2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1.
Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack
protection bus
DM
12D
M12
DM
12D
M12
SLOT13
SLOT12
SLOT11
SLOT14
SLOT15
SLOT16
SLOT17
service bus
TPSswitching
control bus
Fail
Working
Working
Protection
Cross-connect and timingboard
Detectboard fault
When detecting a fault in the working DX1 board, the cross-connect board issues a commandto switch the services from the faulty DX1 to the protection DX1. In this way, services areprotected.
Hardware ConfigurationFigure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiXOSN 1500B subrack.
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Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500Bsubrack
Slot 14PIU
Slot20
FAN
PIU
AUX
DM12
WorkingWorking
CXL16/4/1
EOW
Protection
DM12DM12
DM12
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4 CXL16/4/1
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10
As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed inslots 12–13.
Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack.
Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack
Board Protection Group
DX1 (working) Slots 12 and 13
DX1 (protection) Slot 11
DM12 Slots 14–17
6.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the DX1.
You can use the T2000 to set the following parameters for the DX1:
l J2 byte
l Tributary loopback
l Service loading indication
l Protocol mode of serial ports
l DDN clock source management
For details on these parameters, see F Board Configuration Reference.
6.9.9 Technical SpecificationsThe technical specifications of the DX1 cover the electrical interface specifications, boarddimensions, weight and power consumption.
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Electrical Interface Specifications
The DM12 provides electrical interfaces for the DX1. For the specifications of the electricalinterfaces, see the section that describes the DM12.
Mechanical Specifications
The mechanical specifications of the DX1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the DX1 is 15 W.
NOTE
After the TPS protection is performed, the power consumption of the DX1 is 31 W.
6.10 DXAThis section describes the DXA, a DDN convergence board, in terms of the version, function,principle, front panel, configuration and specifications.
6.10.1 Version DescriptionThe functional version of the DXA board is N1.
6.10.2 Function and FeatureThe DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k levelat the system side.
6.10.3 Working Principle and Signal FlowThe DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/demapping module, control and communication module and power supply module.
6.10.4 Front PanelOn the front panel of the DXA, there are indicators.
6.10.5 Valid SlotsThe DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks.
6.10.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the DXA.
6.10.7 Technical SpecificationsThe technical specifications of the DXA cover the optical interface specifications, boarddimensions, weight and power consumption.
6.10.1 Version DescriptionThe functional version of the DXA board is N1.
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6.10.2 Function and FeatureThe DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k levelat the system side.
Table 6-40 lists the functions and features of the DXA.
Table 6-40 Functions and features of the DXA
Function andFeature
DXA
Basic function Cross-connects 63 x framed E1 signals.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Loopback function Supports inloop and outloop.
PRBS self-test Not supported.
6.10.3 Working Principle and Signal FlowThe DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/demapping module, control and communication module and power supply module.
Figure 6-42 shows the block diagram for the functions of the DXA.
Figure 6-42 Block diagram for the functions of the DXA
64 kbit/stimeslot
crossconnectmodule
Framing/deframing
module
Mapping/demapping
module
Control andcommunication
module
Cross-connect
unit
Backplane
Cross-connect
unit
+3.3 V BackupPower
+3.3 V -48 V/-60 VDC/DCconverter
Fuse
Fuse
-48 V/-60 VDC/DC
converter
In the transmit directionThe SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,which recovers the signals. The framing/deframing module converts the signals to framed E1
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signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities.
In the receive directionThe timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/sgranularities. The timeslot cross-connect module then transmits the signals to the framing/deframing module. The framing/deframing module then maps the signals into the VC-4 andtransmits the signals into the SDH cross-connect board.
Control and communication moduleThe control and communication module performs the board communication, control and serviceconfiguration.
DC/DC converter moduleThe DC/DC converter module provides the DC voltages required by the modules of the board.
6.10.4 Front PanelOn the front panel of the DXA, there are indicators.
Appearance of the Front PanelFigure 6-43 shows the appearance of the front panel of the DXA.
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Figure 6-43 Front panel of the DXA
DXA
DXA
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the DXA.
6.10.5 Valid SlotsThe DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks.
The DXA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.
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The DXA can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
6.10.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the DXA.
You can use the T2000 to set the following parameters for the DXA:
l J2 byte
l Tributary loopback
l Service loading indication
l Protocol mode of serial ports
l DDN clock source management
For details on these parameters, see F Board Configuration Reference.
6.10.7 Technical SpecificationsThe technical specifications of the DXA cover the optical interface specifications, boarddimensions, weight and power consumption.
Mechanical SpecificationsThe mechanical specifications of the DXA are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.8
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the DXA is 10 W.
6.11 SPQ4This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,function, working principle, front panel and specifications.
6.11.1 Version DescriptionThe SPQ4 has two versions, N1 and N2. The two versions have different functions.
6.11.2 Function and FeatureThe SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarmsand performance events, and to provide the maintenance features and protection.
6.11.3 Working Principle and Signal FlowThe SPQ4 consists of the interface module, encoding/decoding module, frame synchronizationand scramble processing module, mapping/demapping module, SDH overhead processingmodule, logic control module, and power supply module.
6.11.4 Front PanelOn the front panel of the SPQ4, there are indicators.
6.11.5 Valid Slots
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The OptiX OSN 1500A does not support the SPQ4 board.
6.11.6 TPS Protection for the BoardThe SPQ4 supports the 1:N TPS protection.
6.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SPQ4.
6.11.8 Technical SpecificationsThe technical specifications of the SPQ4 cover the electrical interface specifications, boarddimensions, weight and power consumption.
6.11.1 Version DescriptionThe SPQ4 has two versions, N1 and N2. The two versions have different functions.
Table 6-41 lists the details on the versions of the SPQ4 board.
Table 6-41 Version Description of the SPQ4
Item Description
Functionalversion
The SPQ4 has two versions, N1 and N2.
Difference The equipment of the V100R001 and V100R002 versions support theN1SPQ4. The equipment of the V100R003 and later versions support theN2SPQ2.
Replaceability The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 isreplaced, the NE should be upgraded.
6.11.2 Function and FeatureThe SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarmsand performance events, and to provide the maintenance features and protection.
Table 6-42 lists the functions and features of the SPQ4.
Table 6-42 Functions and features of the SPQ4
Function andFeature
SPQ4
Basic function Processes 4 x STM-1/E4 signals.
Serviceprocessing
Accesses and processes 4 x E4/STM-1 electrical signals. For eachchannel, the E4 and STM-1 signals are compatible. Supports theprocessing of the VC-12, VC-3 and VC-4 services.
Overheadprocessing
Supports the processing of SOH bytes for the STM-1 signals, such as B1,B2, K1, K2, M1, F1, and D1–D12.Supports the transparent transmission and termination of POH bytes,including J1, B3, C2, G1, and H4.Supports the setting and query of the J0/J1/C2 bytes.
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Function andFeature
SPQ4
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Protectionscheme
Supports the TPS protection when used with the interface board and theswitching board.Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection, and SNCP.
Maintenancefeature
Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.
6.11.3 Working Principle and Signal FlowThe SPQ4 consists of the interface module, encoding/decoding module, frame synchronizationand scramble processing module, mapping/demapping module, SDH overhead processingmodule, logic control module, and power supply module.
Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the blockdiagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDHoverhead processing module.
Figure 6-44 Block diagram for the functions of the SPQ4
E4/STM-1
140M mapping/demapping
Interfaceconversion
module
Communicationand control
module
Cross-connectunit A
DCC SCC unit
LOS
Outloop/Inloop control SCC unitCommunication
4x139 Mbit/s
Cross-connectunit B
High speed bus
34 MHzOSC
EN 140M/155M Frame header Cross-connectunit
SDH overhead processingmodule
4x155 Mbit/s
4x155 Mbit/s
4x155 Mbit/s
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
5 V
+1.8V+2.5V
155 MHzPLL
Reference clock Cross-connect unit
LIU
LIU
PPI/SPI
K1 and K2 Cross-connectunit
High speed bus
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Figure 6-45 Block diagram of the 140M mapping/demapping
139Mbit/s
140M mapping/demapping
PDH AISdetector
E4 AISinsertionJ1/C2/B3
139Mbit/s
E4 AISinsertion
155Mbit/s
155Mbit/s
LPA HPT PG MST RST
RSTMSTHPTLPASIPO
Figure 6-46 Block diagram of the SDH overhead processing module
155 Mbit/s
155 Mbit/s
SDH overhead processing module
DCC
K1 and K2 insertion/extration
SCC unit
155 Mbit/s
RST MST MSA HPT
Cross-connect unit
155 Mbit/s
The principle of the E4/ STM-1 electrical interface units is described below.
PPI/SPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the PDH LOS signals.
l The SPI module mainly consists of line interface units (LIUs). It provides inloop andoutloop function. This module:
l Encodes and decodes signals.
l Recovers data and clock.
l Processes the R_LOS signals.
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SDH Overhead Processing Module and 140M Mapping/Demapping Module
SDH Overhead Processing Module (155Mbit/s SDH Signals)The functions required to manage 155 Mbit/s SDH signals are implemented by the SDHoverhead processing module.
RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
MSTl In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.
HPTl OH terminationl J1 path trace message recoverl REI information recoveringl HP_RDI detection (path status monitoringl UNEQ and AIS detection (signal label monitoring)l VC-4 BIP-8 errored block count
140M mapping/demapping (140Mbit/s PDH signals)The functions required to manage 140 Mbit/s PDH signals are implemented by the 140Mmapping/demapping module.
LPAThe 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to betransported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.
HPTThe virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributedwithin a 125 us interval (for example, one STM–1 period), and consists of the C4 container and
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POH. The latter contains nine octets equally distributing within the frame. These overhead bytescan be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstreamdirection.
PG (Pointer generator)
A fixed pointer value is inserted in the SOH to structure the AU4 signal.
MST and RSTThese two functions are necessary to create a proprietary STM–1 signal in order to connect withinterface conversion module. In the receive direction, MST and RST perform frame alignmentdetection (A1, A2).
Interface converting moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control modulel Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
l Traces the clock signal from the active and the standby cross-connect units.
l Realizes the pass-through of orderwire and ECC bytes between the two service processingboards constituting the ADM when the GSCC is not online.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Control the indicator on the board.
DC/DC converter moduleIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V powerare provided to the board.
6.11.4 Front PanelOn the front panel of the SPQ4, there are indicators.
Appearance of the Front PanelFigure 6-47 shows the appearance of the front panel of the SPQ4.
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Figure 6-47 Front panel of the SPQ4
SPQ4
SPQ4
STATACTPROGSRV
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.
6.11.5 Valid SlotsThe OptiX OSN 1500A does not support the SPQ4 board.
In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 12–13, and must beused with the MU04.
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Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04.
Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN1500B subrack
Valid Slot for the SPQ4 Corresponding Slot for the DMU04
Slot 12 Slot 14
Slot 13 Slot 16
6.11.6 TPS Protection for the BoardThe SPQ4 supports the 1:N TPS protection.
Protection PrincipleIn the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4.
Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack
TSB8
SLOT12
SPQ4
1 2
SLOT13
SPQ4
SLOT 4/5
123
4×E4/STM-1
MU04
Cross-connect
andtimingboard
Switchcontrolsignal
Fail
Protection Working
l Normal stateWhen the working boards are running normally, the control switch of the MU04 is inposition 1 and the MU04 directly accesses the service signals to the SLH1.
l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theMU04 is shifted to position 2 and the control switch of the TSB8 is shifted to acorresponding position. In this way, the protection board protects the faulty working board.
Hardware ConfigurationFigure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiXOSN 1500B subrack.
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Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4
Slot 14PIU
Slot 20
FAN
AUX
TSB8
MU04
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
Working
Protection
As shown in Figure 6-49, the protection board housed in slot 12 protects the board housed inslot 13.
Table 6-44 lists the slots for the SPQ4, MU04 and TSB8.
Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack
Board Protection Group
SPQ4 (working) Slot 13
SPQ4 (protection) Slot 12
MU04 Slot 16
TSB8 Slot 14
6.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SPQ4.
You can use the T2000 to set the following parameters for the SPQ4:
l J1 byte
l C2 byte
For details on these parameters, see F Board Configuration Reference.
6.11.8 Technical SpecificationsThe technical specifications of the SPQ4 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electricalinterfaces, see the section that describes the MU04.
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Mechanical SpecificationsThe mechanical specifications of the SPQ4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SPQ4 is 24 W.
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7 Data Processing Boards
About This Chapter
This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals.
7.1 EFT4This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.
7.2 EFT8This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.
7.3 EFT8AThis section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.
7.4 EGT2This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.
7.5 EFS0This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
7.6 EFS4This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
7.7 EGS2This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
7.8 EMS4This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission andconvergence board, in terms of the version, function, principle, front panel, configuration andspecifications.
7.9 EGS4
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This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,function, principle, front panel, configuration and specifications.
7.10 EGR2This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.11 EMR0This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in termsof the version, function, principle, front panel, configuration and specifications.
7.12 ADL4This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.13 ADQ1This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.14 IDL4This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.15 IDQ1This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.16 MST4This section describes the MST4, a 4-channel multi-service transparent transmission board, interms of the version, function, principle, front panel, configuration and specifications.
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7.1 EFT4This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.
7.1.1 Version DescriptionThe functional version of the EFT4 board is R1.
7.1.2 Function and FeatureThe EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.1.3 Working Principle and Signal FlowThe EFT4 consists of the ethernet access module, mapping module, interface converting module,Communication and control module and so on.
7.1.4 Front PanelOn the front panel of the EFT4, there are indicators, interfaces and barcode.
7.1.5 Valid SlotsThe EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.
7.1.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT4.
7.1.7 Technical SpecificationsThe specifications of the EFT4 cover the mechanical specifications and power consumption.
7.1.1 Version DescriptionThe functional version of the EFT4 board is R1.
7.1.2 Function and FeatureThe EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-1 lists the functions and features of the EFT4.
Table 7-1 Functions and features of the EFT4
Function andFeature
EFT4
Basic function Transmits 4 x FE services.
Specification ofthe opticalinterface
Supports 10Base-T/100Base-TX signals. The optical interfaces complywith IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.Supports frames with a length ranging from 64 bytes to 9600 bytes.Supports Jumbo frames with a length less than 9600 bytes.
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Function andFeature
EFT4
Max. uplinkbandwidth
622 Mbit/s.
Number ofVCTRUNKs
4.
Encapsulationformat
HDLC.LAPS.GFP-F.
Mappinggranularity
Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).
Ethernet servicetype
Supports EPL.
MPLS Not supported.
VLAN Supports VLAN transparent transmission.
LPT Not supported.
CAR Not supported.
Flow controlfunction
Supports the IEEE 802.3x flow control based on FE port.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
Test frame Receives and transmits Ethernet test frames.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
7.1.3 Working Principle and Signal FlowThe EFT4 consists of the ethernet access module, mapping module, interface converting module,Communication and control module and so on.
Figure 7-1 shows the block diagram for the functions of the EFT4.
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Figure 7-1 Block diagram for the functions of the EFT4
Ethernetaccessmodule
Communicationand control
moduleSCC unit
FE
SCC unit
Communication
Cross-connect unit
Reference clock and frame header
Cross-connect unit
Clock module
77MHz
125MHz
155MHz
LOS
Interfaceconverting
module
ENCP
DENCP
Mapping module
VCP
Lasershutdown
- 48 V/-60V
+3.3 V backuppower
+3.3 V+2.5 V
+3.3 V - 48 V/-60VDC/DCconverter
Fuse
FuseDC/DCconverter
+1.8 V+1.5 V
The function modules of ethernet switching boards are described below:
ENCP: data encapsulation module DENCP: decapsulation module
VCP: virtual concatenation processing module
Ethernet access module
In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Mapping module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
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Interface converting moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and control moduleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock unitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC converter moduleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.1.4 Front PanelOn the front panel of the EFT4, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-2 shows the appearance of the front panel of the EFT4.
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Figure 7-2 Front panel of the EFT4
EFT4
STATACTPROGSRV
FE1FE2
FE3FE4
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usageof the interfaces.
Table 7-2 Optical interfaces of the EFT4
Interface Interface Type Usage
FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
Table 7-3 lists the pins of the RJ-45 interface.
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Table 7-3 Pins of the RJ-45 of the EFT4
Pin Description
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Grounding
5 Grounding
6 Receiving negative
7 Grounding
8 Grounding
7.1.5 Valid SlotsThe EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.
NOTE
The slots are divided slots.
7.1.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT4.
You can use the T2000 to set the following parameters for the EFT4:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.1.7 Technical SpecificationsThe specifications of the EFT4 cover the mechanical specifications and power consumption.
Mechanical SpecificationsThe mechanical specifications of the EFT4 are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT4 is 14 W.
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7.2 EFT8This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.
7.2.1 Version DescriptionThe functional version of the EFT8 board is N1.
7.2.2 Function and FeatureThe EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.2.3 Working Principle and Signal FlowThe EFT8 consists of the ethernet access module, mapping module, interface converting module,communication and control module and so on.
7.2.4 Front PanelOn the front panel of the EFT8, there are indicators, interfaces and barcode.
7.2.5 Valid SlotsThe EFT8 can be used with the ETF8 and EFF8.
7.2.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8.
7.2.7 Technical SpecificationsThe specifications of the EFT8 cover the mechanical specifications and power consumption.
7.2.1 Version DescriptionThe functional version of the EFT8 board is N1.
7.2.2 Function and FeatureThe EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-4 lists the functions and features of the EFT8.
Table 7-4 Functions and features of the EFT8
Function andFeature
EFT8
Basic function Transmits 8 x FE or 16 x FE services
Used with theinterface board
Accesses 8 x Ethernet signals at the electrical port.Accesses 16 x Ethernet signals at the electrical port when used with theETF8.Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signalswhen used with the EFF8.
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Function andFeature
EFT8
Specification ofthe opticalinterface
Supports the 10Base-T/100Base-TX signals when used with the ETF8.Supports the 100Base-FX/100Base-TX signals when used with theEFF8. The optical interfaces comply with IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.
Max. uplinkbandwidth
1.25 Gbit/s.
Number ofVCTRUNKs
16.
Encapsulationformat
Supports HDLC, LAPS, and GFP-F.
Mappinggranularity
Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).
Ethernet servicetype
Supports EPL.
MPLS Not supported.
VLAN Supports the VLAN transparent transmission.
LPT Not supported.
CAR Not supported.
Flow controlfunction
Supports the IEEE 802.3x flow control based on FE port.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
Test frame Receives and transmits GFP test frames.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarms andperformanceevents
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
7.2.3 Working Principle and Signal FlowThe EFT8 consists of the ethernet access module, mapping module, interface converting module,communication and control module and so on.
Figure 7-3 shows the block diagram for the functions of the EFT8.
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Figure 7-3 Block diagram for the functions of the EFT8
Ethernetaccessmodule
Communicationand control
moduleSCC unit
FE
SCC unit
Communication
Cross-connect unit
Reference clock and frame header
Cross-connect unit
Clock module
77MHz
125MHz
155MHz
LOS
Interfaceconverting
module
ENCP
DENCP
Mapping module
VCP
Lasershutdown
- 48 V/-60V
+3.3 V backuppower
+3.3 V+2.5 V
+3.3 V - 48 V/-60VDC/DCconverter
Fuse
FuseDC/DCconverter
+1.8 V+1.5 V
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access Module
In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
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Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.2.4 Front PanelOn the front panel of the EFT8, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-4 shows the appearance of the front panel of the EFT8.
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Figure 7-4 Front panel of the EFT8
EFT8
EFT8
STATACTPROGSRV
FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage ofthe interfaces.
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Table 7-5 Optical interfaces of the EFT8
Interface Interface Type Usage
FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE5 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE6 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE7 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE8 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
Table 7-6 lists the pins of the RJ-45 interface.
Table 7-6 Pins of the RJ-45 of the EFT8
Pin Description
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Grounding
5 Grounding
6 Receiving negative
7 Grounding
8 Grounding
7.2.5 Valid SlotsThe EFT8 can be used with the ETF8 and EFF8.
Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8and EFF8.
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Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500A
Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8
Slot 12 Without the interface board
Slot 13 Without the interface board
Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500B
Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8
Slot 11 Without the interface board
Slot 12 Slot 14
Slot 13 Slot 16
7.2.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8.
You can use the T2000 to set the following parameters for the EFT8:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.2.7 Technical SpecificationsThe specifications of the EFT8 cover the mechanical specifications and power consumption.
Mechanical SpecificationsThe mechanical specifications of the EFT8 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT8 is 26 W.
7.3 EFT8AThis section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.
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7.3.1 Version DescriptionThe functional version of the EFT8A board is N1.
7.3.2 Function and FeatureThe EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.
7.3.3 Working Principle and Signal FlowThe EFT8A consists of the ethernet access module, mapping module, interface convertingmodule, communication and control module and so on.
7.3.4 Front PanelOn the front panel of the EFT8A, there are indicators, interfaces and barcode.
7.3.5 Valid SlotsThe EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.3.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8A.
7.3.7 Technical SpecificationsThe specifications of the EFT8A cover the mechanical specifications and power consumption.
7.3.1 Version DescriptionThe functional version of the EFT8A board is N1.
7.3.2 Function and FeatureThe EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-9 lists the functions and features of the EFT8A.
Table 7-9 Functions and features of the EFT8A
Function andFeature
EFT8A
Basic function Transparently transmits 8 x FE services.
Specification of theoptical interface
Supports 10Base-T/100Base-TX signals. The optical interfacescomply with IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.
Max. uplinkbandwidth
622 Mbit/s.
Number ofVCTRUNKs
8.
Encapsulationformat
Supports HDLC, LAPS, and GFP-F.
Mapping granularity Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).
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Function andFeature
EFT8A
Ethernet service type Supports EPL.
MPLS Not supported.
VLAN Supports VLAN transparent transmission.
LPT Not supported.
CAR Not supported.
Flow controlfunction
Supports the IEEE 802.3x flow control based on FE port.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
Test frame Receives and transmits GFP test frames.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
7.3.3 Working Principle and Signal FlowThe EFT8A consists of the ethernet access module, mapping module, interface convertingmodule, communication and control module and so on.
Figure 7-5 shows the block diagram for the functions of the EFT8A.
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Figure 7-5 Block diagram for the functions of the EFT8A
Ethernetaccessmodule
Communicationand control
moduleSCC unit
FE
SCC unit
Communication
Cross-connect unit
Reference clock and frame header
Cross-connect unit
Clock module
77MHz
125MHz
155MHz
LOS
Interfaceconverting
module
ENCP
DENCP
Mapping module
VCP
Lasershutdown
- 48 V/-60V
+3.3 V backuppower
+3.3 V+2.5 V
+3.3 V - 48 V/-60VDC/DCconverter
Fuse
FuseDC/DCconverter
+1.8 V+1.5 V
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access Module
In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
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Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.3.4 Front PanelOn the front panel of the EFT8A, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-6 shows the appearance of the front panel of the EFT8A.
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Figure 7-6 Front panel of the EFT8A
EFT8A
EFT8A
STATACTPROGSRV
FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type andusage of the interfaces.
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Table 7-10 Optical interfaces of the EFT8A
Interface Interface Type Usage
FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE5 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE6 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE7 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE8 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
Table 7-11 lists the pins of the RJ-45 interface.
Table 7-11 Pins of the RJ-45 of the EFT8A
Pin Description
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Grounding
5 Grounding
6 Receiving negative
7 Grounding
8 Grounding
7.3.5 Valid SlotsThe EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
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7.3.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8A.
You can use the T2000 to set the following parameters for the EFT8A:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.3.7 Technical SpecificationsThe specifications of the EFT8A cover the mechanical specifications and power consumption.
Mechanical SpecificationsThe mechanical specifications of the EFT8A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT8A is 26 W.
7.4 EGT2This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.
7.4.1 Version DescriptionThe functional version of the EGT2 board is N1.
7.4.2 Function and FeatureThe EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.4.3 Working Principle and Signal FlowThe EGT2 consists of the ethernet access module, mapping module, interface convertingmodule, interface converting module, Communication and Control Module and so on.
7.4.4 Front PanelOn the front panel of the EGT2, there are indicators, interfaces and barcode.
7.4.5 Valid SlotsThe EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.4.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGT2 indicates the optical interface type.
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7.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGT2.
7.4.8 Technical SpecificationsThe specifications of the EGT2 cover the optical interface specifications, mechanicalspecifications and power consumption.
7.4.1 Version DescriptionThe functional version of the EGT2 board is N1.
7.4.2 Function and FeatureThe EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-12 lists the functions and features of the EGT2.
Table 7-12 Functions and features of the EGT2
Function andFeature
EGT2
Basic function Transparently transmits 2 x GE services.
Specification ofthe opticalinterface
The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. The optical interfaces support the auto-negotiation, compliantwith IEEE 802.3z. The optical interfaces use the hot-swappable opticalmodule SFP. When multimode optical fiber is used, the maximumtransmission distance is 550 m. When single-mode optical fiber is used,the maximum transmission distance is 10 km. The optical modules canbe used for different requirements for the transmission distance, such as40 km and 70 km.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.
Max. uplinkbandwidth
2.5 Gbit/s.
Number ofVCTRUNKs
2.
Encapsulationformat
Supports HDLC, LAPS, and GFP-F.
Mappinggranularity
Supports VC-4, VC-3, VC-3-Xv (X≤24), and VC-4-Xv (X≤8).
Ethernet servicetype
Supports EPL.
MPLS Not supported.
VLAN Supports VLAN transparent transmission.
LPT Not supported.
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Function andFeature
EGT2
CAR Not supported.
Flow controlfunction
Supports the IEEE 802.3x flow control based on GE port.
LCAS Dynamically increases or decreases the bandwidth and realizes theprotection function, compliant with ITU-T G.7042.
Test frame Receives and transmits Ethernet test frames.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
7.4.3 Working Principle and Signal FlowThe EGT2 consists of the ethernet access module, mapping module, interface convertingmodule, interface converting module, Communication and Control Module and so on.
Figure 7-7 shows the block diagram for the functions of the EGT2.
Figure 7-7 Block diagram for the functions of the EGT2
Ethernetaccessmodule
Communicationand control
moduleSCC unit
GE
SCC unit
Communication
Cross-connect unit
Reference clock and frame header
Cross-connect unit
Clock module
77MHz
125MHz
155MHz
LOS
Interfaceconverting
module
ENCP
DENCP
Mapping module
VCP
Lasershutdown
- 48 V/-60V
+3.3 V backuppower
+3.3 V+2.5 V
+3.3 V - 48 V/-60VDC/DCconverter
Fuse
FuseDC/DCconverter
+1.8 V+1.5 V
ENCP: data encapsulation module DENCP: decapsulation module
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VCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter Module
Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.4.4 Front PanelOn the front panel of the EGT2, there are indicators, interfaces and barcode.
Appearance of the Front Panel
Figure 7-8 shows the appearance of the front panel of the EGT2.
Figure 7-8 Front panel of the EGT2
EGT2
EGT2
STATACTPROGSRVLINK1ACT1
ACT2LINK2
CLASS 1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usageof the interfaces.
Table 7-13 Optical interfaces of the EGT2
Interface Interface Type Usage
IN1/OUT1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
IN2/OUT2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
7.4.5 Valid SlotsThe EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.4.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGT2 indicates the optical interface type.
Table 7-14 lists the relation between the board feature code and optical interface type for theEGT2.
Table 7-14 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN1EGT210 10 1000Base-SX (0.55 km)
SSN1EGT211 11 1000Base-LX (10 km)
SSN1EGT212 12 1000Base-ZX (40 km)
SSN1EGT213 13 1000Base-ZX (70 km)
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7.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGT2.
You can use the T2000 to set the following parameters for the EGT2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.4.8 Technical SpecificationsThe specifications of the EGT2 cover the optical interface specifications, mechanicalspecifications and power consumption.
Optical Interface SpecificationsTable 7-15 lists the specifications of the interfaces of the EGT2.
Table 7-15 Specifications of the optical interfaces of the EGT2
Item Specification
Opticalinterface type
1000Base-ZX(70 km)
1000Base-ZX(40 km)
1000Base-LX(10 km)
1000Base-SX(0.55 km)
Optical sourcetype
MLM MLM MLM MLM
Launchedoptical power(dBm)
–4 to +2 –2 to +5 –9 to –3 –9.5 to 0
Centralwavelength(nm)
1480 to 1580 1270 to 1355 1270 to 1355 770 to 860
Overloadoptical power(dBm)
–3 –3 –3 0
Receiversensitivity(dBm)
–22 –23 –19 –17
Extinction ratio(dB)
9 9 9 9
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the EGT2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGT2 is 29 W.
7.5 EFS0This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
7.5.1 Version DescriptionThe EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version isstopped.
7.5.2 Function and FeatureThe EFS0 supports Layer 2 switching, MPLS and broadcast.
7.5.3 Working Principle and Signal FlowThe EFS0 consists of the ethernet access module, network processor module, mapping module,interface converting module and so on.
7.5.4 Front PanelOn the front panel of the EFS0, there are indicators, interfaces and barcode.
7.5.5 Valid SlotsThe EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.
7.5.6 TPS ProtectionThe EFS0 supports the 1:N TPS protection.
7.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFS0.
7.5.8 Technical SpecificationsThe specifications of the EFS0 cover the mechanical specifications and power consumption.
7.5.1 Version DescriptionThe EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version isstopped.
The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0.
Table 7-16 lists the details on the versions of the EFS0 board.
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Table 7-16 Version Description of the EFS0
Item Description
Functionalversion
The EFS0 has three versions, N1, N2, and N4.
Difference The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.The N1EFS0 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,and port+VLAN PRI flow.
Replaceability The N2EFS0 supports the board version replacement function and canreplace the N1EFS0.The N4EFS0 supports the board version replacement function and canreplace the N1EFS0 and N2EFS0.
7.5.2 Function and FeatureThe EFS0 supports Layer 2 switching, MPLS and broadcast.
Table 7-17 lists the functions and features of the EFS0.
Table 7-17 Functions and features of the EFS0
Function andFeature
EFS0
Basic function Processes 8 x FE services.
Used with theinterface board
Accesses 8 x FE signals at the electrical interface when used with theETF8.Accesses 8 x FE signals at the optical interface when used with the EFF8.Realizes the TPS protection for 8 x FE signals at the electrical interfacewhen used with the ETS8 and TSB8.
Specification ofthe opticalinterface
Supports the 10Base-T/100Base-TX signals when used with the ETF8.Supports the 100Base-FX signals when used with the EFF8. The opticalinerfaces comply with IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumboframes with a length less than 9600 bytes.
Max. uplinkbandwidth
The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s.
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Function andFeature
EFS0
Number ofVCTRUNKs
The number of the VCTRUNKs of the N1EFS0 is 12.The number of the VCTRUNKs of the N2EFS0 is 24.The number of the VCTRUNKs of the N4EFS0 is 24.
Mappinggranularity
Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).
Encapsulationformat
GFP.
EPL Supports transparent transmission based on port and Ethernet private lineservices based on port+VLAN.
EVPL Supports EVPL services that use the frame encapsulation formats ofMartinioE and stack VLAN.
EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function.Supports switching at the client and SDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of static MAC route.The N1EFS0 and N2EFS0 support the dynamic query of the MACaddress, and support the query of the number of the learned MACaddresses according to VB+VLAN or VB+LP.The N4EFS0 does not support the dynamic query of the MAC address,but it supports the query of the number of the learned MAC addressesaccording to VB+VLAN or VB+LP.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16. The maximum number of logical ports for eachVB is 30.
EVPLAN Supports EVPLAN services. The N1EFS0 uses the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EFS0 and N4EFS0 use the frame encapsulation formats of MPLSMartinioE and stack VLAN.
MPLS Supported.
VLAN Compliant with IEEE 802.1q/p.
VLANconvergence
Supported (4k VLAN).
RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE802.1w.
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Function andFeature
EFS0
Multicast (IGMPSnooping)
Supported.
CAR Supported.The granularity is 64 kbit/s.
Service basedQoS flowclassification
The N1EFS0 supports the port service, port+VLAN ID service, and port+VLAN PRI service.The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,and port+VLAN PRI flow.
LCAS Dynamically increases or decreases the bandwidth and realizes theprotection function, compliant with ITU-T G.7042.
LPT Supports the LPT function, which can be enabled or disabled.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Test frame Receives and transmits Ethernet test frames.
Loopbackfunction
Supports inloop at the Ethernet port (PHY layer or MAC layer). Supportsinloop and outloop at the VC-3 level.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
7.5.3 Working Principle and Signal FlowThe EFS0 consists of the ethernet access module, network processor module, mapping module,interface converting module and so on.
Figure 7-9 shows the block diagram for the functions of the EFS0.
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Figure 7-9 Block diagram for the functions of the EFS0
Ethernetaccessmodule
FE Interfacecoversion
module
ENCP
DENCP
Mapping module
VCP
Control
Data
Switchfabric
Networkprocessor
Network processor module
Communicationand control module
SCC unit
SCC unit
Communication
Reference clock and frame header
Clock module
77MHz
125MHz
155MHz
LOSLasershutdown
50MHz
+2.5 V+1.8 V+1.5 V
Cross-connect unit
Cross-connect unit
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access Module
In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor Module
The network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l Multi-protocol label switching (MPLS)
l L2MPLS VPN
l Ethernet/ VLAN
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In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. The LCAS function is supported. Ethernet signals are thenconverted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Conversion Module
The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control Module
The communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter Module
Through the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.
7.5.4 Front PanelOn the front panel of the EFS0, there are indicators, interfaces and barcode.
Appearance of the Front Panel
Figure 7-10 shows the appearance of the front panel of the EFS0.
Figure 7-10 Front panel of the EFS0
EFS0
EFS0
STATACTPROGSRV
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IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8or EFF8.
7.5.5 Valid SlotsThe EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.
When the N1EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack, thebandwidth is 622 Mbit/s.
When the N2EFS0 or N4EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack,the bandwidth is 1.25 Gbit/s.
The EFS0 can be used with the ETF8 and EFF8.
Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8.
Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500B subrack
Valid Slot for the EFS0 Corresponding Slot for the ETF8 and EFF8
Slot 12 Slot 14
Slot 13 Slot 16
7.5.6 TPS ProtectionThe EFS0 supports the 1:N TPS protection.
Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.
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Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500Bsubrack
Slot 14PIU
Slot 20
FAN
AUX
TSB8
ETS8
EFS0 Protection
EFS0 Working
CXL16/4/1 EOW
PIU
Slot 15
Slot 16
Slot 17
Slot 11
Slot 12
Slot 13
Slot 4
Slot 5
Slot 18
Slot 19
Slot 6
Slot 7
Slot 8
Slot 9
Slot 10CXL16/4/1
As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed inslot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot14, is used with the protection EFS0.
7.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFS0.
You can use the T2000 to set the following parameters for the EFS0:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.5.8 Technical SpecificationsThe specifications of the EFS0 cover the mechanical specifications and power consumption.
Mechanical SpecificationsThe mechanical specifications of the EFS0 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFS0 is 35 W.
7.6 EFS4This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
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7.6.1 Version DescriptionThe EFS4 has two functional versions, N1 and N2. The two versions have different maximumuplink bandwidth.
7.6.2 Function and FeatureThe EFS4 supports Layer 2 switching, MPLS and broadcast.
7.6.3 Working Principle and Signal FlowThe EFS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication Module and thepower supply module
7.6.4 Front PanelOn the front panel of the EFS4, there are indicators, interfaces and barcode.
7.6.5 Valid SlotsThe EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFS4.
7.6.7 Technical SpecificationsThe specifications of the EFS4 cover the mechanical specifications and power consumption.
7.6.1 Version DescriptionThe EFS4 has two functional versions, N1 and N2. The two versions have different maximumuplink bandwidth.
Table 7-19 lists the details on the versions of the EFS4 board.
Table 7-19 Version Description of the EFS4
Item Description
Functionalversion
The EFS4 has two versions, N1 and N2.
Difference The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.The N2EFS4 supports the board version replacement function.
Replaceability The N2EFS4 supports the board version replacement function and canreplace the N1EFS4.
7.6.2 Function and FeatureThe EFS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-20 lists the functions and features of the EFS4.
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Table 7-20 Functions and features of the EFS4
Function andFeature
EFS4
Basic function Processes 4 x FE services.
Specification ofthe opticalinterfaces
Supports 10Base-T/100Base-TX signals. The optical interfaces complywith IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frameswith a length less than 9600 bytes.
Max. uplinkbandwidth
The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.
Number ofVCTRUNKs
The number of the VCTRUNKs of the N1EFS4 is 12.The number of the VCTRUNKs of the N2EFS4 is 24.
Mappinggranularity
Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).
Encapsulationformat
GFP.
EPL Supports transparent transmission based on port and Ethernet private lineservices based on port+VLAN.
EVPL Supports EVPL services that use the frame encapsulation formats ofMartinioE and stack VLAN.
EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function and switching at the client andSDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of static MAC route.The N1EFS4 supports the dynamic query of the MAC address, andsupports the query of the number of the learned MAC addresses accordingto VB+VLAN or VB+LP.The N2EFS4 does not support the dynamic query of the MAC address,but it supports the query of the number of the learned MAC addressesaccording to VB+VLAN or VB+LP.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16 (a maximum of two VBs for the N2EGS2). Themaximum number of logical ports for each VB is 30.
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Function andFeature
EFS4
EVPLAN Supports EVPLAN services. The N1EFS4 uses the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EFS4 uses the frame encapsulation formats of MPLS MartinioE andstack VLAN.
MPLS Supported.
VLAN Compliant with IEEE 802.1q/p.
VLANconvergence
Supported (4k VLAN).
RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE802.1w.
Multicast (IGMPSnooping)
Supported.
CAR Supported.The granularity is 64 kbit/s.
Service based The N1EFS4 supports the port service, port+VLAN ID service, and port+VLAN PRI service.
QoS flowclassification
The N2EFS4 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
LPT Supports the LPT function, which can be enabled or disabled.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Test frame Receives and transmits Ethernet test frames.
Loopbackfunction
Supports inloop at the Ethernet port (PHY layer or MAC layer). Supportsinloop and outloop at the VC-3 level.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
7.6.3 Working Principle and Signal FlowThe EFS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication Module and thepower supply module
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Figure 7-12 shows the block diagram for the functions of the EFS4.
Figure 7-12 Block diagram for the functions of the EFS4
Ethernetaccessmodule
FE Interfacecoversion
module
ENCP
DENCP
Mapping module
VCP
Control
Data
Switchfabric
Networkprocessor
Network processor module
Communicationand control module
SCC unit
SCC unit
Communication
Reference clock and frame header
Clock module
77MHz
125MHz
155MHz
LOSLasershutdown
50MHz
+2.5 V+1.8 V+1.5 V
Cross-connect unit
Cross-connect unit
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l Multi-protocol label switching (MPLS)
l L2MPLS VPN
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l Ethernet/ VLAN
In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. The LCAS function is supported. Ethernet signals are thenconverted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Conversion ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter Module
Through the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.
7.6.4 Front PanelOn the front panel of the EFS4, there are indicators, interfaces and barcode.
Appearance of the Front Panel
Figure 7-13 shows the appearance of the front panel of the EFS4.
Figure 7-13 Front panel of the EFS4
EFS4
EFS4
STATACTPROGSRV
FE1
FE2
FE3
FE4
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usageof the interfaces.
Table 7-21 Optical interfaces of the EFS4
Interface Interface Type Usage
FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
Table 7-22 lists the pins of the RJ-45 interface.
Table 7-22 Pins of the RJ-45 of the EFS4
Pin Description
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Grounding
5 Grounding
6 Receiving negative
7 Grounding
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Pin Description
8 Grounding
7.6.5 Valid SlotsThe EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFS4.
You can use the T2000 to set the following parameters for the EFS4:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.6.7 Technical SpecificationsThe specifications of the EFS4 cover the mechanical specifications and power consumption.
Mechanical SpecificationsThe mechanical specifications of the EFS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFS4 is 30 W.
7.7 EGS2This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.
7.7.1 Version DescriptionThe EGS2 has two functional versions, N1 and N2. The two versions have different functionsand features.
7.7.2 Function and FeatureThe EGS2 supports Layer 2 switching, MPLS and broadcast.
7.7.3 Working Principle and Signal FlowThe EGS2 consists of the ethernet access module, network processor module, mapping module,interface converting module, communication and control module and so on.
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7.7.4 Front PanelOn the front panel of the EGS2, there are indicators, interfaces and barcode.
7.7.5 Valid SlotsThe EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGS2 indicates the optical interface type.
7.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGS2.
7.7.8 Technical SpecificationsThe specifications of the EGS2 cover the optical interface specifications, mechanicalspecifications and power consumption.
7.7.1 Version DescriptionThe EGS2 has two functional versions, N1 and N2. The two versions have different functionsand features.
Table 7-23 lists the details on the versions of the EGS2 board.
Table 7-23 Version Description of the EGS2
Item Description
Functionalversion
The EGS2 has two versions, N1 and N2.
Difference The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. Themaximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.The number of the VCTRUNKs of the N1EGS2 is 24. The number of theVCTRUNKs of the N2EGS2 is 48.The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC.The encapsulation format of the N1EGS2 is GFP.The N1EGS2 supports the MartinioP encapsulation of the MPLS. TheN2EGS2 does not support the MartinioP encapsulation.The N2EGS2 supports the board version replacement function.
Replaceability On certain conditions, the N2EGS2 can replace the N1EGS2. When theN2EGS2 replaces the N1EGS2, the N1EGS2 should not be configuredwith MartinioP or CoS of the MPLS.
7.7.2 Function and FeatureThe EGS2 supports Layer 2 switching, MPLS and broadcast.
Table 7-24 lists the functions and features of the EGS2.
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Table 7-24 Functions and features of the EGS2
Function andFeature
EGS2
Basic function Processes 2 x GE services.
Specification ofthe opticalinterface
The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces.The optical interfaces support the auto-negotiation, compliant with IEEE802.3z. The optical interfaces use the hot-swappable optical moduleSFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, the maximumtransmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumboframes with a length less than 9600 bytes.
Max. uplinkbandwidth
The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s.The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.
Number ofVCTRUNKs
The number of the VCTRUNKs of the N1EGS2 is 24.The number of the VCTRUNKs of the N2EGS2 is 48.
Mappinggranularity
Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤12).
Encapsulationformat
The encapsulation formats for the N1EGS2 are GFP, LAPS, and HDLC.The encapsulation format for the N2EGS2 is GFP.
EPL Supports transparent transmission based on port and Ethernet privateline services based on port+VLAN.
EVPL Not supported by the N1EGS2.The N2EGS2 supports EVPL services that use the frame encapsulationformats of MartinioE and stack VLAN.
EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function and switching at the client andSDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of the static MAC route.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 2. The maximum number of logical ports for eachVB is 30.
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Function andFeature
EGS2
EVPLAN Not supported by the N1EGS2.The N2EGS2 supports EVPL services that use the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EGS2 does not support the encapsulation format of MPLS MartinioP.
MPLS Not supported by the N1EGS2.Supported by the N2EGS2.
VLAN Compliant with IEEE 802.1q/p.
VLANconvergence
Supported (4k VLAN).
RSTP Not supported by the N1EGS2.The N2EGS2 supports broadcast packet suppression and RSTP,compliant with IEEE 802.1w.
Multicast (IGMPSnooping)
Not supported by the N1EGS2.Supported by the N2EGS2.
CAR Supported.The granularity is 64 kbit/s.
Service basedQoS flowclassification
The N1EGS2 supports the port service, port+VLAN ID service, and port+VLAN PRI service.The N2EGS2 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.
LCAS Not supported by the N1EGS2.The N2EGS2 supports LCAS, compliant with ITU-T G.7042.Dynamically increases or decreases the bandwidth, and realizes theprotection function.
LPT Supports the LPT function, which can be enabled or disabled.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Test frame Receives and transmits Ethernet test frames.
Loopbackfunction
Supports inloop at the Ethernet port (PHY layer or MAC layer). Supportsinloop and outloop at the VC-3 level.
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevent
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
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7.7.3 Working Principle and Signal FlowThe EGS2 consists of the ethernet access module, network processor module, mapping module,interface converting module, communication and control module and so on.
Figure 7-14 shows the block diagram for the functions of the EGS2.
Figure 7-14 Block diagram for the functions of the EGS2
Ethernetaccessmodule
GE Interfacecoversion
module
ENCP
DENCP
Mapping module
VCP
Control
Data
Switchfabric
Networkprocessor
Network processor module
Communicationand control module
SCC unit
SCC unit
Communication
Reference clock and frame header
Clock module
77MHz
125MHz
155MHz
LOSLasershutdown
50MHz
+2.5 V+1.8 V+1.5 V
Cross-connect unit
Cross-connect unit
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
The function modules of ethernet switching boards are described below:
Ethernet Access Module
In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor Module
The network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
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After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l Multi-protocol label switching (MPLS)
l L2MPLS VPN
l Ethernet/ VLAN
In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. The LCAS function is supported. Ethernet signals are thenconverted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Conversion ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
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l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.
7.7.4 Front PanelOn the front panel of the EGS2, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-15 shows the appearance of the front panel of the EGS2.
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Figure 7-15 Front panel of the EGS2
EGS2
EGS2
STATACTPROGSRVLINK1ACT1
ACT2LINK2
CLASS 1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usageof the interfaces.
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Table 7-25 Optical interfaces of the EGS2
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
7.7.5 Valid SlotsThe EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGS2 indicates the optical interface type.
Table 7-26 lists the relation between the board feature code and optical interface type for theEGS2.
Table 7-26 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN2EGS210 10 1000Base-SX (0.55 km)
SSN2EGS211 11 1000Base-LX (10 km)
SSN2EGS212 12 1000Base-ZX (40 km)
SSN2EGS213 13 1000Base-ZX (70 km)
7.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGS2.
You can use the T2000 to set the following parameters for the EGS2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.7.8 Technical SpecificationsThe specifications of the EGS2 cover the optical interface specifications, mechanicalspecifications and power consumption.
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Optical Interface SpecificationsTable 7-27 lists the specifications of the interfaces of the EGS2.
Table 7-27 Specifications of the optical interfaces of the EGS2
Item Specification
Optical interfacetype
1000Base-ZX(70 km)
1000Base-ZX(40 km)
1000Base-SX(10 km)
1000Base-LX(0.55 km)
Optical sourcetype
MLM MLM MLM MLM
Launched opticalpower (dBm)
–4 to +2 –2 to +5 –9 to –3 –9.5 to 0
Centralwavelength (nm)
1480 to 1580 1270 to 1355 1270 to 1355 770 to 860
Overload opticalpower (dBm)
–3 –3 –3 0
Receiversensitivity (dBm)
–22 –23 –19 –17
Extinction ratio(dB)
9 9 9 9
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the EGS2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EGS2 is 43 W.
7.8 EMS4This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission andconvergence board, in terms of the version, function, principle, front panel, configuration andspecifications.
7.8.1 Version DescriptionThe functional version of the EMS4 board is N1.
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7.8.2 Function and FeatureThe EMS4 supports Layer 2 switching, link convergence, and multicast.
7.8.3 Working Principle and Signal FlowThe EMS4 consists of the ethernet access module, mapping module, interface conversion moduleand so on.
7.8.4 Front PanelOn the front panel of the EMS4, there are indicators, interfaces and barcode.
7.8.5 Valid SlotsThe EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500Bsubrack.
7.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMS4 indicates the optical interface type.
7.8.7 Board ProtectionThe EMS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.
7.8.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMS4.
7.8.9 Technical SpecificationsThe specifications of the EMS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.
7.8.1 Version DescriptionThe functional version of the EMS4 board is N1.
7.8.2 Function and FeatureThe EMS4 supports Layer 2 switching, link convergence, and multicast.
Table 7-28 lists the functions and features of the EMS4.
Table 7-28 Functions and features of the EMS4
Function andFeature
EMS4
Basic function Accesses and processes 4 x GE services, and processes 16 x FEservices.
Used with theinterface board
Accesses 16 x FE signals at the electrical interface when used withthe ETF8.Accesses 16 x FE signals at the optical interface when used with theEFF8.Accesses 8 x FE signals at the electrical interface and 8 x FE signalsat the optical interface when used with the ETF8 and EFF8.
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Function andFeature
EMS4
Specification of theoptical interface
The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. Supports the auto-negotiation, compliant with IEEE802.3z.The optical interfaces use the hot-swappable optical module SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.Supports 10Base-T/100Base-TX signals when used with the ETF8.Supports 100Base-FX signals when used with the EFF8.The optical interfaces are compliant with IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE802.1p TAG.Supports frames with a length ranging from 64 bytes to 9216 bytes.Supports Jumbo frames with a length less than 9216 bytes.
Max. uplinkbandwidth
2.5 Gbit/s.
Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64),VC-3-Xv (X≤24), and VC-4-Xv (X≤8).
VCG A maximum of 64.
Encapsulation format Supports GFP-F, LAPS, and HDLG.
EPL Supports transparent transmission based on port. Supports 42 xbidirectional services.
EVPL Supports EVPL services based on port+VLAN. Supports amaximum of 8000 links.Supports EVPL services based on QinQ. Supports serviceforwarding based on port.
EPLAN Supports the Layer 2 forwarding function and switching at the clientand SDH sides.Supports 1k MAC switching or 4K VLAN MAC switching.Supports the function of self-learning the source MAC address.The length of the MAC address table is 128k. The aging time of theMAC address can be set and queried.The configuration of static MAC routes is supported.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of VB. The maximumnumber of VBs is two.
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Function andFeature
EMS4
VLAN Supports VLAN and QinQ, the addition, deletion and switching ofVLAN labels, compliant with IEEE 802.1q/p.
RSTP Supports broadcast packet suppression and RSTP, compliant withIEEE 802.1w.
Multicast(IGMP-Snooping)
Supported.
ETH-OAM Supports CC for the multicast and LB test for the unicast.
Test frame Supported.
Service mirroring Not supported.
Link convergence Supports manual link convergence and static link convergence.
VLAN convergence Supported (4095 VLAN).
Protection Supports the 1+1 hot backup for the board and the PPS protection.
CAR Supported.The granularity is 64 kbit/s.
Flow classification Supports the port flow and port+VLAN ID flow.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
LPT Supported.
Flow control function Supports the IEEE 802.3x flow control based on port.
Loopback function Supports inloop at the Ethernet port (PHY layer) and outloop at theSDH side.
Ethernet performancemonitoring
Supports Ethernet performance monitoring RMON at the port leveland VCTRUNK.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
7.8.3 Working Principle and Signal FlowThe EMS4 consists of the ethernet access module, mapping module, interface conversion moduleand so on.
Figure 7-16 shows the block diagram for the functions of the EMS4.
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Figure 7-16 Block diagram for the functions of the EMS4
Ethernetaccessmodule
GE/FE Interfacecoversion
module
ENCP
DENCP
Mapping module
VCP
Control
Data
Switchfabric
Networkprocessor
Network processor module
Communicationand control module
SCC unit
SCC unit
Communication
Reference clock and frame header
Clock module
77MHz
125MHz
155MHz
LOSLasershutdown
50MHz
+2.5 V+1.8 V+1.5 V
Cross-connect unit
Cross-connect unit
+3.3 VDC/DC
converterFuse -48 V/ -60 V
-48 V/ -60 VDC/DCconverter
ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module
In the Transmit Direction
The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals tothe EGS4 through the backplane. The interface module transmits the signals to the encapsulationand mapping module. The encapsulation and mapping module then compensates for the timedelay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,strips the data packets, and transmits the data packets to the service processing module. Finally,the service processing module converges the data and transmits the data through the ethernetphysical interface.
In the Receive Direction
The interface module accesses the signals from external Ethernet device, such as the Ethernetswitch and router. The interface module then decodes the signals and converts the series signalsinto parallel signals. The service processing module then aligns the frames, strips the preamblecode, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance.In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats)according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local portsaccording to the configuration. If the data services are to be transmitted to the upstream SDHline, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLCformats. Finally, the encapsulation module transmits the frames to the mapping module, whichmaps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame.The interface module then transmits the frames to the cross-connect unit.
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Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l Ethernet/ VLAN
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLCformat. The concatenation is processed. The LCAS function is supported. Ethernet signals arethen converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Conversion ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
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l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V.
7.8.4 Front PanelOn the front panel of the EMS4, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-17 shows the appearance of the front panel of the EMS4.
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Figure 7-17 Front panel of the EMS4
EMS4
EMS4STATACTPROGSRV
CLASS 1LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
LINK ACT
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.l Service activating state indicator (ACT), which is green when lit.l Board software state indicator (PROG), which is green or red when lit.l Service alarm indicator (SRV), which is red, green or yellow when lit.l Connection status indicator (LINK), which is green when lit.l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists thetype and usage of the optical interfaces.
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Table 7-29 Optical interfaces of the EMS4
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT3/IN3 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT4/IN4 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
7.8.5 Valid SlotsThe EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500Bsubrack.
The EMS4 can be used with the ETF8 and EFF8.
Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for theETF8 and EFF8.
Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500A subrack
Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8
Slot 12 Without the interface board
Slot 13 Without the interface board
Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500B subrack
Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8
Slot 11 Without the interface board
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
7.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMS4 indicates the optical interface type.
Table 7-32 lists the relation between the board feature code and optical interface type for theEMS4.
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Table 7-32 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN1EMS410 10 1000Base-LX (0.55 km)
SSN1EMS411 11 1000Base-SX (10 km)
SSN1EMS412 12 1000Base-ZX (40 km)
SSN1EMS413 13 1000Base-ZX (70 km)
7.8.7 Board ProtectionThe EMS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.
Protection PrincipleWhen the BPS protection is performed to the EMS4, the GE and FE ports use the single-feddual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, whichmay be connected to many communication devices. Normally, the active board is working andservices are transmitted in the two directions of the active link. On the backup link, the EMS4disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdownstate. At the same time, the opposite board enables the transmission and does not transmitservices. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. Thesolid lines in Figure 7-18 show how the EMS4 normally works.
Figure 7-18 Normal working of the EMS4
EMS4Active
EMS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
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l BPS Protection
For the BPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and3 are all switched to the standby EMS4 and corresponding communication equipment.
Figure 7-19 Principle of the BPS protection for the EMS4
EMS4Active
EMS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
l PPS Protection
For the PPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed.Only the service numbered 1 is switched to the standby EMS4 and the standby communicationequipment.
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Figure 7-20 Principle of the PPS protection for the EMS4
EMS4Active
EMS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
The conditions that trigger the protection for the EMS4 are as follows:
l Fault at at the PHY layer of the MAC port, also Linkdown
l Fault in key board hardware units, such as the power supply module and the optical module
WARNINGWhen the board-level protection is performed, FE ports only support the 100M full duplex modeand GE ports support the auto-negotiation and 1000M full duplex mode.
Board ConfigurationTwo EMS4 boards should be configured for the protection. One EMS4 is the active board andthe other is the standby board. For the protection, the access capacity of the slot for the standbyboard must be larger than that of the slot for the active board.
7.8.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMS4.
You can use the T2000 to set the following parameters for the EMS4:
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l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.8.9 Technical SpecificationsThe specifications of the EMS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.
Optical Interface Specifications
Table 7-33 lists the specifications of the interfaces of the EMS4.
Table 7-33 Specifications of the optical interfaces of the EMS4
Item Specification
Optical interfacetype
1000Base-ZX(70 km)
1000Base-ZX(40 km)
1000Base-SX(10 km)
1000Base-LX(0.55 km)
Optical sourcetype
MLM MLM MLM MLM
Launched opticalpower (dBm)
–4 to +2 –2 to +5 –9 to –3 –9.5 to 0
Centralwavelength (nm)
1480 to 1580 1270 to 1355 1270 to 1355 770 to 860
Overload opticalpower (dBm)
–3 –3 –3 0
Receiversensitivity (dBm)
–22 –23 –19 –17
Extinction ratio(dB)
9 9 9 9
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the EMS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EMS4 is 65 W ifthe EMS4 is not used with an interface board.
In the normal temperature (25℃), the maximum power consumption of the EMS4 is 75 W ifthe EMS4 is used with an interface board.
7.9 EGS4This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,function, principle, front panel, configuration and specifications.
7.9.1 Version DescriptionThe functional version of the EGS4 board is N1.
7.9.2 Function and FeatureThe EGS4 supports Layer 2 switching, MPLS and broadcast.
7.9.3 Working Principle and Signal FlowThe EGS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication module and thepower supply module.
7.9.4 Front PanelOn the front panel of the EGS4, there are indicators, interfaces and barcode.
7.9.5 Valid SlotsThe EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGS4 indicates the optical interface type.
7.9.7 Board ProtectionThe EGS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.
7.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGS4.
7.9.9 Technical SpecificationsThe specifications of the EGS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.
7.9.1 Version DescriptionThe functional version of the EGS4 board is N1.
7.9.2 Function and FeatureThe EGS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-34 lists the functions and features of the EGS4.
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Table 7-34 Functions and features of the EGS4
Function andFeature
EGS4
Basic function Accesses and processes 4 x GE services.
Specification of theoptical interface
The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces.The optical interfaces support the auto-negotiation, compliant withIEEE 802.3z. The optical interfaces use the hot-swappable opticalmodule SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE802.1p TAG.Supports frames with a length ranging from 64 bytes to 9216 bytes.Supports Jumbo frames with a length less than 9216 bytes.
Max. uplinkbandwidth
2.5 Gbit/s.
Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64),VC-3-Xv (X≤24), and VC-4-Xv (X≤8).
VCG 64 to the maximum.
Encapsulation format Supports GFP-F, LAPS, and HDLG.
EPL Supports transparent transmission based on port.
EVPL Supports EVPL services based on port+VLAN. Supports a maximumof 8000 links.Supports EVPL services based on QinQ. Supports service forwardingbased on port.
EPLAN Supports the Layer 2 forwarding function and switching at the clientand SDH sides.Supports 1k MAC switching or 4k VLAN MAC switching.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 128k. The aging time of the MACaddress can be set and queried. The configuration of static MACroutes is supported.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of VB. The maximumnumber of VBs is two.
VLAN Supports VLAN and QinQ, the addition, deletion and switching ofVLAN labels, compliant with IEEE 802.1q/p.
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Function andFeature
EGS4
RSTP Supports broadcast packet suppression and RSTP, compliant withIEEE 802.1w.
Multicast(IGMP-Snooping)
Supported.
ETH-OAM Supports CC for the multicast and LB test for the unicast.
Test frame Supported.
Service mirroring Not supported.
Link convergence Supports manual link convergence and static link convergence.
VLAN convergence Supported (4095 VLAN).
Protection Supports the 1+1 hot backup for the board and the PPS protection.
CAR Supported.The granularity is 64 kbit/s.
Flow classification Supports the port flow and port+VLAN ID flow.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
LPT Supported.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Loopback function Supports inloop at the Ethernet port (PHY layer).
Ethernetperformancemonitoring
Supports Ethernet performance monitoring RMON at the port leveland VCTRUNK.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
7.9.3 Working Principle and Signal FlowThe EGS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication module and thepower supply module.
Figure 7-21 shows the block diagram for the functions of the EGS4.
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Figure 7-21 Block diagram for the functions of the EGS4
Ethernetaccessmodule
GE Interfacecoversion
module
ENCP
DENCP
Mapping module
VCP
Control
Data
Switchfabric
Networkprocessor
Network processor module
Communicationand control module
SCC unit
SCC unit
Communication
Reference clock and frame header
Clock module
77MHz
125MHz
155MHz
LOSLasershutdown
50MHz
+2.5 V+1.8 V+1.5 V
Cross-connect unit
Cross-connect unit
+3.3 VDC/DC
converterFuse -48 V/ -60 V
-48 V/ -60 VDC/DCconverter
In the Transmit DirectionThe cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals tothe EGS4 through the backplane. The interface module transmits the signals to the encapsulationand mapping module. The encapsulation and mapping module then compensates for the timedelay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,strips the data packets, and transmits the data packets to the service processing module. Finally,the service processing module converges the data and transmits the data through the ethernetphysical interface.
In the Receive DirectionThe interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device,such as the Ethernet switch and router. The interface module then decodes the signals andconverts the series signals into parallel signals. The service processing module then aligns theframes, strips the preamble code, terminates the CRC code and performs the Ethernet statisticsfor the Ethernet performance. In addition, the service processing module classifies the flow(Ethernet or VLAN packet formats) according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local portsaccording to the configuration. If the data services are to be transmitted to the upstream SDHline, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLCformats. Finally, the encapsulation module transmits the frames to the mapping module, whichmaps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module thentransmits the frames to the cross-connect unit.
Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l Ethernet/ VLAN
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLCformat. The concatenation is processed. The LCAS function is supported. Ethernet signals arethen converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.
Interface Conversion ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
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The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V.
7.9.4 Front PanelOn the front panel of the EGS4, there are indicators, interfaces and barcode.
Appearance of the Front PanelFigure 7-22 shows the appearance of the front panel of the EGS4.
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Figure 7-22 Front panel of the EGS4
EGS4
EGS4STATACTPROGSRV
CLASS 1
LASERPRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
LINK ACT
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four pairs of optical interfaces on the front panel of the EGS4. Table 7-35 lists thetype and usage of the optical interfaces.
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Table 7-35 Optical interfaces of the EGS4
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT3/IN3 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT4/IN4 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
7.9.5 Valid SlotsThe EGS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGS4 indicates the optical interface type.
Table 7-36 lists the relation between the board feature code and optical interface type for theEGS4.
Table 7-36 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN1EGS410 10 1000Base-SX (0.55 km)
SSN1EGS411 11 1000Base-LX (10 km)
SSN1EGS412 12 1000Base-ZX (40 km)
SSN1EGS413 13 1000Base-ZX (70 km)
7.9.7 Board ProtectionThe EGS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.
Protection PrincipleWhen the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dual-selective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which maybe connected to many communication devices. Normally, the active board is working andservices are transmitted in the two directions of the active link. On the standby link, the EGS4disables the transmission of all ports. In this case, the ports of the opposite board are in theLinkdown state. At the same time, the opposite board enables the transmission and does not
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transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdownstate. The solid lines in Figure 7-23 show how the EGS4 normally works.
Figure 7-23 Normal working of the EGS4
EGS4Active
EGS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
l BPS Protection
For the BPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The lines in Figure 7-24 show how the BPS protection is performed. Theservices numbered 1, 2 and 3 are all switched to the standby EGS4 and correspondingcommunication equipment.
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Figure 7-24 Principle of the BPS protection for the EGS4
EGS4Active
EGS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
l PPS Protection
For the PPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed.Only the service numbered 1 is switched to the standby EGS4 and the standby communicationequipment.
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Figure 7-25 Principle of the PPS protection for the EGS4
EGS4Active
EGS4Standby
XCS
No.1
No.2
No.3
No.1
No.2
No.3
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
Activecommunication
equipment
Standbycommunication
equipment
A
B
C
The conditions that trigger the protection for the EGS4 are as follows:
l Fault at at the PHY layer of the MAC port, also Linkdown
l Fault in key board hardware units, such as the power supply module and the optical module
WARNINGWhen the protection is performed, the GE ports support auto-negotiation and 1000M full duplexmodes.
Board Configuration
Two EGS4 boards should be configured for the protection. One EGS4 is the active board andthe other is the standby board. For the protection, the access capacity of the slot for the standbyboard must be larger than that of the slot for the active board.
7.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGS4.
You can use the T2000 to set the following parameters for the EGS4:
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l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.9.9 Technical SpecificationsThe specifications of the EGS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.
Optical Interface Specifications
Table 7-37 lists the specifications of the interfaces of the EGS4.
Table 7-37 Specifications of the optical interfaces of the EGS4
Item Specification
Optical interfacetype
1000Base-ZX(70 km)
1000Base-ZX(40 km)
1000Base-LX(10 km)
1000Base-SX(0.55 km)
Optical sourcetype
MLM MLM MLM MLM
Launched opticalpower (dBm)
–4 to +2 –2 to +5 –9 to –3 –9.5 to 0
Centralwavelength (nm)
1480–1580 1270–1355 1270–1355 770–860
Overload opticalpower (dBm)
–3 –3 –3 0
Receiversensitivity (dBm)
–22 –23 –19 –17
Extinction ratio(dB)
9 9 9 9
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the EGS4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
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Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EGS4 is 70 W.
7.10 EGR2This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.10.1 Version DescriptionThe functional version of the EGR2 board is N2.
7.10.2 Function and FeatureThe EGR2 supports Layer 2 switching, port convergence, and RPR.
7.10.3 Working Principle and Signal FlowThe EGR2 consists of the ethernet processing module, network processor module, RPR protocolprocessing module and so on.
7.10.4 Front PanelOn the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety classlabel.
7.10.5 Valid SlotsThe EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGR2 indicates the optical interface type.
7.10.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGR2.
7.10.8 Technical SpecificationsThe technical specifications of the EGR2 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.10.1 Version DescriptionThe functional version of the EGR2 board is N2.
7.10.2 Function and FeatureThe EGR2 supports Layer 2 switching, port convergence, and RPR.
Table 7-38 lists the functions and features of the EGR2.
Table 7-38 Functions and features of the EGR2
Function andFeature
EGR2
Basic function Accesses and processes 2 x GE services. Supports the RPR feature.
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Function andFeature
EGR2
Specification of theoptical interface
The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. The optical interfaces support the auto-negotiation,compliant with IEEE 802.3z.The optical interfaces use the hot-swappable optical module SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km. The optical modules can beused for different requirements for the transmission distance, such as40 km and 70 km.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.Supports frames with a length ranging from 64 bytes to 9600 bytes.Supports Jumbo frames with a length less than 9600 bytes.
Max. uplinkbandwidth
2.5 Gbit/s.
Mappinggranularity
Supports VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).
Encapsulationformat
Supports GFP-F and LAPS.
EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE802.3, IEEE 802.1q TAG, or MPLS Martini.Supports the MPLS encapsulation and forwarding based on port andport+VLAN.Supports five types of LSP, including ingress LSP, egress LSP, transitLSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.
EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.Supports the function of self-learning the source MAC address. For theN2EGR2, the capacity of the MAC address table is 64k. The aging timeof the MAC address can be set and queried.Supports the configuration of static MAC routes (maximum: 4k).Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16. The maximum number of logical ports foreach VB is 32.
MPLS Supports MartinioE.
Stack VLAN Supported.
VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,and the switching function, compliant with IEEE 802.1q/p.
VLANconvergence
Supported (4k VLAN).
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Function andFeature
EGR2
VLAN switching Supports the replacement of VLAN in Ethernet signal frames.
Port convergence Supports the convergence at a maximum of two GE ports.
RPR Supports RPR, compliant with IEEE 802.17.The ring network supports a maximum of 255 nodes, and it supportsthe dropping of sink nodes and weighted fairness algorithm.Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.Provides topology automatic discovery function, and detects thenetwork status in real time.Supports three protection modes, including Steering, Wrapping, andWrapping+Steering. The invalid time for signals is less than 50 ms.Supports the manual configuration of the ringlet route in the RPR ringnetwork.Supports the ringlet self-learning, which learns the mapping relationbetween the MAC address and node number.
RSTP Supports broadcast packet suppression and RSTP, compliant withIEEE 802.1w.
Multicast (IGMPSnooping)
Supported.
CAR Supported.The granularity is 64 kbit/s.
Flow classification Supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.
LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Echo test frame Supports the Echo function of the PRP OAM, which is used to test theavailability of the link.
Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformance event
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Weighted fairnessalgorithm
Supported.
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Function andFeature
EGR2
Topologyautomaticdiscovery
Supported.
Max. number ofnodes
255.
Service prioritylevel
Supports A0, A1, B_CIR, B_EIR and C.
7.10.3 Working Principle and Signal FlowThe EGR2 consists of the ethernet processing module, network processor module, RPR protocolprocessing module and so on.
Figure 7-26 shows the block diagram for the functions of the EGR2.
Figure 7-26 Block diagram for the functions of the EGR2
Interfaceconversion
module
Ethernetaccessmodule
GE/FE
RPR protocolprocess module Mapping module
Network processor module
Controlsingnal
Data
+2.5 V
+1.8 V
+1.5 V
ENCP
DNCP
VCP
Cross-connect
unit
Reference clock and frame header
Communication
Switchfabric
Networkprocessor
RPRMACwest
Communication andcontrol module
Clock module
77 MHZ
50 MHZ
125 MHZ
100 MHZ
RPRMACeast
LOS
Laser shut down
Cross-connect
unit
SCC unit
Cross-connectunit
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
RPR: resilient package ring
The function modules are described as follows:
Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l MPLS
l L2MPLS VPN
l Ethernet/ VLAN
In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
RPR Protocol Processing ModuleRPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protectionswitching schemes. By applying the RPR protocol and RPR weight fair algorithm, this modulecontrols the bandwidth of each node to access the ring network. Therefore, the RPR ring featuresspatial reuse and statistic multiplex. Bandwidth utilization is then improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol fortopology auto-discovery provides correct and reliable means to fast find topologies of all nodesand the changes to these topologies.
RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reusedspatially.
The entire RPR ring accommodates 255 nodes to the maximum.
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulationformats are LAPS and GFP.
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In the downstream direction, virtual concatenations are received. The time delay of virtualconcatenation is compensated. After aligning, packets are decapsulated as per encapsulationformat. The decapsulated data are transmitted to the RPR protocol processing module in packets.
Interface Converting Module
The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control Module
The communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.
DC/DC Converter Module
Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.10.4 Front PanelOn the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front Panel
Figure 7-27 shows the appearance of the front panel of the EGR2.
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Figure 7-27 Front panel of the EGR2
EGR2
EGR2
LINK1ACT1
ACT2LINK2
STATACTPROGSRV
CLASS 1
LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are two optical interfaces on the front panel of the EGR2. Table 7-39 lists the type andusage of the optical interfaces.
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Table 7-39 Optical interfaces of the EGR2
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
OUT2/IN2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
7.10.5 Valid SlotsThe EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGR2 indicates the optical interface type.
Table 7-40 lists the relation between the board feature code and optical interface type for theEGR2.
Table 7-40 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN2EGR210 10 1000Base-SX (0.55 km)
SSN2EGR211 11 1000Base-LX (10 km)
SSN2EGR212 12 1000Base-ZX (40 km)
SSN2EGR213 13 1000Base-ZX (70 km)
7.10.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGR2.
You can use the T2000 to set the following parameters for the EGR2:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.10.8 Technical SpecificationsThe technical specifications of the EGR2 cover the optical interface specifications, boarddimensions, weight and power consumption.
Table 7-41 lists the specifications of the interfaces of the EGR2.
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Table 7-41 Specifications of the interfaces of the EGR2
OpticalInterface Type
OpticalSourceType
LaunchedOpticalPower(dBm)
CentralWavelength(nm)
Overload OpticalPower(dBm)
ReceiverSensitivity (dBm)
ExtinctionRatio(dB)
1000Base-ZX(70 km)
MLM –4 to +2 1480 to1580
–3 –22 9
1000Base-ZX(40 km)
MLM –2 to +5 1270 to1355
–3 –23 9
1000Base-LX(10 km)
MLM –9 to –3 1270 to1355
–3 –19 9
1000Base-SX(0.55 km)
MLM –9.5 to 0 770 to860
0 –17 9
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the EGR2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EGR2 is 40 W.
7.11 EMR0This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in termsof the version, function, principle, front panel, configuration and specifications.
7.11.1 Version DescriptionThe EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.
7.11.2 Function and FeatureThe EMR0 supports Layer 2 switching, port convergence, and RPR.
7.11.3 Working Principle and Signal FlowThe EMR0 consists of the ethernet processing module, network processor module, RPR protocolprocessing module, mapping module and so on.
7.11.4 Front PanelOn the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety classlabel.
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7.11.5 Valid SlotsThe EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN1500B subrack.
7.11.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMR0 indicates the optical interface type.
7.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMR0.
7.11.8 Technical SpecificationsThe technical specifications of the EMR0 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.11.1 Version DescriptionThe EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.
Table 7-42 lists the details on the versions of the EMR0 board.
Table 7-42 Version description of the EMR0
Item Description
Functionalversion
The EMR0 has two versions, N1 and N2.
Difference The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 alsohas some new functions and extends some functions of the N1EMR0. Fordetails, see Table 7-43.
Replaceability The N2EMR0 can replace the N1EMR0.
Table 7-43 Comparison of features of the N1EMR0 and N2EMR0
Item N1EMR0 N2EMR0
Port convergencefunction
- Supports the convergence function at amaximum of eight FE ports.
VLAN labelswitching
- Supports the VLAN label switching forthe Ethernet data.
EVPLAN services Supports EVPLAN servicesand uses the stack VLANencapsulation.
Supports EVPLAN services and usesthe stack VLAN encapsulation.
MAC address table Supports the 16k MACaddress table.
Supports the 64k MAC address table.
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Item N1EMR0 N2EMR0
VB features Supports the creation,deletion and query of the VB.The maximum number of theVBs is 32. The maximumnumber of logical ports foreach VB is 16.
Supports the creation, deletion andquery of the VB. The maximum numberof the VBs is 16. The maximum numberof logical ports for each VB is 32.
PRP ring network - Supports the manual configuration ofthe ringlet route in the RPR ringnetwork.
RPR OAM - Supports the Echo function of the PRPOAM, which is used to test theavailability of the link.
CAR Supported. Supported.
Flow classification Supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.
Supports the port flow, port+VLAN IDflow, and port+VLAN ID+VLAN PRIflow.
7.11.2 Function and FeatureThe EMR0 supports Layer 2 switching, port convergence, and RPR.
Table 7-44 lists the functions and features of the EMR0.
Table 7-44 Functions and features of the EMR0
Function andFeature
EMR0
Basic function Accesses and processes 12 x FE services and 1 x GE services. Supportsthe RPR feature.
Used with theinterface board
Supports four FE ports and one GE ports.Accesses 12 x FE signals at the electrical interface when used with theETF8.Accesses 8 x FE signals at the optical interface when used with theEFF8.
Specification of theoptical interface
Supports the 10Base-T/100Base-TX signals when used with the ETF8.The maximum transmission distance is 100 m.Supports the 100Base-FX signals when used with the EFF8, compliantwith IEEE 802.3u.
Format of serviceframes
Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.
Max. uplinkbandwidth
2.5 Gbit/s.
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Function andFeature
EMR0
Mappinggranularity
VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).
Encapsulationformat
Supports GFP-F and LAPS.
EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services supportthe MPLS encapsulation and forwarding based on port and port+VLAN. Supports five types of LSP, including ingress LSP, egressLSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512LSPs.
EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.Supports the function of self-learning the source MAC address. For theN2EMR0, the capacity of the MAC address table is 16k. The aging timeof the MAC address can be set and queried.Supports the configuration of static MAC routes (maximum: 4k).Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The N2EMR0supports a maximum of 16 VBs. The maximum number of logical portsfor each VB is 32. The N1EMR0 supports a maximum of 32 VBs. Themaximum number of logical ports for each VB is 16.
MPLS Supports MartinioE.
Stack VLAN Supported.
VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,and the switching function, compliant with IEEE 802.1q/p.
VLANconvergence
Supported (4k VLAN).
VLAN switching Supports the replacement of VLAN in Ethernet signal frames.
Port convergence Supports the convergence function at a maximum of eight FE ports.
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Function andFeature
EMR0
RPR Supported and compliant with IEEE 802.17.Supports a maximum of 255 nodes in the ring network, and the droppingof sink nodes.Supports weighted fairness algorithm.Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.Provides topology automatic discovery function, and detects thenetwork status in real time. Supports three protection modes, includingSteering, Wrapping, and Wrapping+Steering. The invalid time forsignals is less than 50 ms.Supports the ringlet self-learning, which learns the mapping relationbetween the MAC address and node number.The N2EMR0 supports the manual configuration of the ringlet route inthe RPR ring network.
RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE802.1w.
Multicast (IGMPSnooping)
Supported.
CAR Supported.The granularity is 64 kbit/s.
Flow classification The N1EMR0 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.The N2EMR0 supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.
LCAS Dynamically increases or decreases the bandwidth and realizes theprotection function, compliant with ITU-T G.7042.
Flow controlfunction
Supports the IEEE 802.3x flow control based on port.
Echo test frame Supports the Echo function of the PRP OAM, which is used to test theavailability of the link.
Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).
Ethernetperformancemonitoring
Supports Ethernet performance monitoring at the port level.
Alarm andperformanceevents
Provides rich alarms and performance events for easy management andmaintenance of the equipment.
Weighted fairnessalgorithm
Supported.
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Function andFeature
EMR0
Topologyautomaticdiscovery
Supported.
Max. number ofnodes
255.
Service prioritylevels
Supports A0, A1, B_CIR, B_EIR and C.
7.11.3 Working Principle and Signal FlowThe EMR0 consists of the ethernet processing module, network processor module, RPR protocolprocessing module, mapping module and so on.
Figure 7-28 shows the block diagram for the functions of the EMR0.
Figure 7-28 Block diagram for the functions of the EMR0
Interfaceconversion
module
Ethernetaccessmodule
GE/FE
RPR protocolprocess module Mapping module
Network processor module
Controlsingnal
Data
+2.5 V
+1.8 V
+1.5 V
ENCP
DNCP
VCP
Cross-connect
unit
Reference clock and frame header
Communication
Switchfabric
Networkprocessor
RPRMACwest
Communication andcontrol module
Clock module
77 MHZ
50 MHZ
125 MHZ
100 MHZ
RPRMACeast
LOS
Laser shut down
Cross-connect
unit
SCC unit
Cross-connectunit
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
-48 V/ -60 V
-48 V/ -60 VDC/DCconverter
RPR: resilient package ring
The function modules are described as follows:
Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.
Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:
l MPLS
l L2MPLS VPN
l Ethernet/ VLAN
In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l Supports flow sense and flow classification
l Supports uni-cast, multi-cast and broadcast of the flow
l Provides data priority setting
l Provides weighted fair queuing (WFQ)
l Provides four classes of services (CoS)
RPR Protocol Processing ModuleRPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protectionswitching schemes. By applying the RPR protocol and RPR weight fair algorithm, this modulecontrols the bandwidth of each node to access the ring network. Therefore, the RPR ring featuresspatial reuse and statistic multiplex. Bandwidth utilization is then improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol fortopology auto-discovery provides correct and reliable means to fast find topologies of all nodesand the changes to these topologies.
RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reusedspatially.
The entire RPR ring accommodates 255 nodes to the maximum.
Mapping ModuleThe mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulationformats are LAPS and GFP.
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In the downstream direction, virtual concatenations are received. The time delay of virtualconcatenation is compensated. After aligning, packets are decapsulated as per encapsulationformat. The decapsulated data are transmitted to the RPR protocol processing module in packets.
Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:
l Manages and configures other modules of the boards.
l Performs inter-board communication through internal Ethernet interface.
The control module also contains basic logic units. This module enjoys the following functions:
l Writes and reads register
l Provides interface for CPU
l Checks, selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Controls the shutting down of the optical module
l Processes communication
l Control indicators
Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.
7.11.4 Front PanelOn the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 7-29 shows the appearance of the front panel of the N1EMR0.
Figure 7-30 shows the appearance of the front panel of the N2EMR0.
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Figure 7-29 Front panel of the N1EMR0
EMR0
EMR0
STATACTPROGSRVLINKACT
CLASS 1
LASER
PRODUCT
OU
T1IN
1
FE1
FE2
FE3
FE4
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Figure 7-30 Front panel of the N2EMR0
EMR0
EMR0
STAT
ACT
PROG
SRV
LINK
ACT
CLASS 1
LASER
PRODUCT
OU
T1IN
1
FE1
FE2
FE3
FE4
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
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InterfacesThere are five interfaces on the front panel of the EMR0. Table 7-45 lists the type and usage ofthe interfaces.
Table 7-45 Optical interfaces of the EMR0
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.
FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE2 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE3 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
FE4 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.
7.11.5 Valid SlotsThe EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN1500B subrack.
The EMR0 can be used with the ETF8 and EFF8.
Table 7-46 and Table 7-47 list the valid slots for the EMR0 and corresponding slots for theETF8 and EFF8.
Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500A subrack
Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8
Slot 12 Without the interface board
Slot 13 Without the interface board
Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500B subrack
Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8
Slot 11 Without the interface board
Slot 12 Slot 15
Slot 13 Slot 17
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7.11.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMR0 indicates the optical interface type.
Table 7-48 lists the relation between the board feature code and optical interface type for theEMR0.
Table 7-48 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN2EMR010 10 1000Base-SX (0.55 km)
SSN2EMR011 11 1000Base-LX (10 km)
SSN2EMR012 12 1000Base-ZX (40 km)
SSN2EMR013 13 1000Base-ZX (70 km)
7.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMR0.
You can use the T2000 to set the following parameters for the EMR0:
l Working mode
l Enabling of the LCAS
l Maximum packet length
l Mapping protocol
For details on the parameters, refer to F Board Configuration Reference.
7.11.8 Technical SpecificationsThe technical specifications of the EMR0 cover the optical interface specifications, boarddimensions, weight and power consumption.
Table 7-49 lists the specifications of the interfaces of the EMR0.
Table 7-49 Specifications of the optical interfaces of the EMR0
Item Specification
Optical interfacetype
1000Base-ZX(70 km)
1000Base-ZX(40 km)
1000Base-LX(10 km)
1000Base-SX(0.55 km)
Optical sourcetype
MLM MLM MLM MLM
Launched opticalpower (dBm)
–4 to +2 –2 to +5 –9 to –3 –9.5 to 0
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Item Specification
Centralwavelength (nm)
1480 to 1580 1270 to 1355 1270 to 1355 770 to 860
Overload opticalpower (dBm)
–3 –3 –3 0
Receiversensitivity (dBm)
–22 –23 –19 –17
Extinction ratio(dB)
9 9 9 9
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the EMR0 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.2
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EMR0 is 50 W.
7.12 ADL4This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.12.1 Version DescriptionThe functional version of the ADL4 board is N1.
7.12.2 Function and FeatureThe ADL4 supports the ATM switching and ATM protection.
7.12.3 Working Principle and Signal FlowThe ADL4 consists of the O/E converting module, physical layer module, ATM module and soon.
7.12.4 Front PanelOn the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety classlabel.
7.12.5 Valid SlotsThe ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.12.6 Board Feature Code
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The code behind the board name in the barcode is the board feature code. The board feature codeof the ADL4 indicates the optical interface type.
7.12.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADL4.
7.12.8 Technical SpecificationsThe technical specifications of the ADL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.12.1 Version DescriptionThe functional version of the ADL4 board is N1.
7.12.2 Function and FeatureThe ADL4 supports the ATM switching and ATM protection.
Table 7-50 lists the functions and features of the ADL4.
Table 7-50 Functions and features of the ADL4
Function andFeature
ADL4
Basic function Accesses and processes 1 x STM-4 ATM services.
Optical interface type Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2types.
Connector type LC.
Optical module type SFP.
E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/N1PL3A.
IMA function Not supported.
Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.
ATM switchingcapability
1.2 Gbit/s.
Mapping granularity Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).
Service type Supports CBR, rt-VBR, nrt-VBR and UBR.
ATM connection 2048.
Statistical multiplexing Supported.
Flow type and QoS Supports IETF RFC2514, ATM forum TM4.0.
ATM multicastconnection
Supports spacial multicast and logical multicast.
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Function andFeature
ADL4
ATM protection (ITU-T I.630)
Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.
OAM function (ITU-TI.610)
Supports AIS, RDI, LB , and CC.
Maintenance feature Supports inloop and outloop at the ATM layer levels, supportsinloop at the optical interface, which are used for maintenance andfault locating.
Alarm and performanceevent
Provides rich alarms and performance events. The loopback is usedfor maintenance and fault locating.
7.12.3 Working Principle and Signal FlowThe ADL4 consists of the O/E converting module, physical layer module, ATM module and soon.
Figure 7-31 shows the block diagram for the functions of the ADL4.
Figure 7-31 Block diagram for the functions of the ADL4
E/O
O/E
PHYmodule
ATMmodule
Mappingmodule
E3module
high speed bus
Communicationand control module
LOS
Laser shut down
Reference clock and frame header
Communication
Cross-connet unit
Scc unit
Clock module
50 MHz
77 MHz
100 MHz
622Mbit/s
Cross-connet unit A
+3.3 V backuppower
3.3 V Fuse
Fuse
-48 V/ -60 V
-48 V/ -60 V
DC/DCconverter
+2.5 V
+1.8 V
+1.5 V
+1.2 V
DC/DCconverter
high speed busCross-connet unit B
622Mbit/s
622Mbit/s622Mbit/s
The function modules are described as follows.
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O/E Converting ModuleIn the receive direction, optical signals are converted to electrical signals. In the transmitdirection, electrical signals are converted to optical signals.
Physical Layer ModuleThe physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation ofHEC series
ATM ModuleThe ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:
l Flow control
l Extraction and generation of cell headers
l ATM switching
E3 ModuleThe E3 module mainly processes the ATM services at E3 rate. This module:
l Mappings the ATM cells into E3 containers
l Demappings E3 containers to ATM cells
l Perform ATM physical layer function to the ATM service at E3 rate
Mapping ModuleThe mapping module:
l Mappings ATM cells into SDH frame payload
l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC-4-Xv (X≤4) virtual concatenation
Communication and Control ModuleThe communication and control module:
l Controls writing and reading of each chip
l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
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l Controls the shutting of transmission
Clock ModuleThis module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.
7.12.4 Front PanelOn the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 7-32 shows the appearance of the front panel of the ADL4.
Figure 7-32 Front panel of the ADL4
ADL4
ADL4
STATACTPROGSRV
CLASS 1
LASER
PRODUCT
IN1
OU
T1
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IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere is one optical interface on the front panel of the ADL4. Table 7-51 lists the type and usageof the optical interface.
Table 7-51 Optical interface of the ADL4
Interface InterfaceType
Usage
OUT1/IN1 LC(pluggable)
Transmits and receives STM-4 optical signals.
7.12.5 Valid SlotsThe ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.12.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADL4 indicates the optical interface type.
Table 7-52 lists the relation between the board feature code and optical interface type of theADL4.
Table 7-52 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN1ADL410 10 S-4.1
SSN1ADL411 11 L-4.1
SSN1ADL412 12 L-4.2
SSN1ADL413 13 Ve-4.2
7.12.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADL4.
You can use the T2000 to set the following parameters for the ADL4:
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l Port type
l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)
For details on these parameters, refer to F Board Configuration Reference.
7.12.8 Technical SpecificationsThe technical specifications of the ADL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 7-53 lists the specifications of the optical interfaces of the ADL4.
Table 7-53 Specifications of the optical interfaces of the ADL4
Item Specification
Optical interfacetype
S-4.1 L-4.1 L-4.2 Ve-4.2
Optical sourcetype
MLM SLM SLM SLM
Transmissiondistance (km)
2–15 15–40 40–80 80–100
Wavelength (nm) 1274–1356 1280–1335 1480–1580 1480–1580
Overload opticalpower (dBm)
–8 –8 –8 –8
Receiversensitivity (dBm)
–23 –28 –28 –33
Launched opticalpower (dBm)
–15 to –8 –3 to +2 –3 to +2 –2 to +2
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the ADL4 are as follows:
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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the ADL4 is 41 W.
7.13 ADQ1This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.13.1 Version DescriptionThe functional version of the ADQ1 board is N1.
7.13.2 Function and FeatureThe ADQ1 supports the ATM switching and ATM protection.
7.13.3 Working Principle and Signal FlowThe ADQ1 consists of the O/E converting module, physical layer module, ATM module and soon.
7.13.4 Front PanelOn the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety classlabel.
7.13.5 Valid SlotsThe ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.13.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADQ1 indicates the optical interface type.
7.13.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADQ1.
7.13.8 Technical SpecificationsThe technical specifications of the ADQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.13.1 Version DescriptionThe functional version of the ADQ1 board is N1.
7.13.2 Function and FeatureThe ADQ1 supports the ATM switching and ATM protection.
Table 7-54 lists the functions and features of the ADQ1.
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Table 7-54 Functions and features of the ADQ1
Function andFeature
ADQ1
Basic function Accesses and processes 4 x STM-1 ATM services.
Optical interface type Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 andVe-1.2 types.
Connector type LC.
Optical module type SFP.
E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/N1PL3A.
IMA function Not supported.
Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.
ATM switchingcapability
1.2 Gbit/s.
Mapping granularity Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).
Service type Supports CBR, rt-VBR, nrt-VBR and UBR.
ATM connection 2048.
Statisticalmultiplexing
Supported.
Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.
ATM multicastconnection
Supports spacial multicast and logical multicast.
ATM protection (ITU-T I.630)
Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.
OAM function (ITU-TI.610)
Supports AIS, RDI, LB , and CC.
Maintenance feature Supports inloop and outloop at the ATM layer levels, supportsinloop at the optical interface, which are used for maintenance andfault locating.
Alarm andperformance event
Provides rich alarms and performance events, which are used formaintenance and fault locating.
7.13.3 Working Principle and Signal FlowThe ADQ1 consists of the O/E converting module, physical layer module, ATM module and soon.
Figure 7-33 shows the block diagram for the functions of the ADQ1.
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Figure 7-33 Block diagram for the functions of the ADQ1
E/O
O/E
PHYmodule
4x155 Mbit/s
4x155Mbit/s
ATMmodule
Mappingmodule
E3module
high speed bus
Communicationand control module
LOS
Laser shut down
Reference clock and frame header
Communication
Cross-connet unit
Scc unit
Clock module
50 MHz
77 MHz
100 MHz
Cross-connet unit A
+3.3 V backuppower
3.3 V Fuse
Fuse
-48 V/ -60 V
-48 V/ -60 V
DC/DCconverter
+2.5 V
+1.8 V
+1.5 V
+1.2 V
DC/DCconverter
high speed busCross-connet unit B
4x155Mbit/s
4x155Mbit/s
The function modules are described as follows.
O/E Converting ModuleIn the receive direction, optical signals are converted to electrical signals. In the transmitdirection, electrical signals are converted to optical signals.
Physical Layer ModuleThe physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation ofHEC series
ATM ModuleThe ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:
l Flow control
l Extraction and generation of cell headers
l ATM switching
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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:
l Mappings the ATM cells into E3 containers
l Demappings E3 containers to ATM cells
l Perform ATM physical layer function to the ATM service at E3 rate
Mapping Module
The mapping module:
l Mappings ATM cells into SDH frame payload
l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC-4-Xv (X≤4) virtual concatenation
Communication and Control Module
The communication and control module:
l Controls writing and reading of each chip
l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission
Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.
DC/DC Converter Module
Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.
7.13.4 Front PanelOn the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front Panel
Figure 7-34 shows the appearance of the front panel of the ADQ1.
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Figure 7-34 Front panel of the ADQ1
ADQ1
ADQ1
STATACTPROGSRV
CLASS 1
LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-55 lists thetype and usage of the optical interfaces.
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Table 7-55 Optical interfaces of the ADQ1
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT2/IN2 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT3/IN3 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT4/IN4 LC (pluggable) Transmits and receives STM-1 optical signals.
7.13.5 Valid SlotsThe ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.13.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADQ1 indicates the optical interface type.
Table 7-56 lists the relation between the board feature code and optical interface type for theADQ1.
Table 7-56 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN1ADQ110 10 S-1.1
SSN1ADQ111 11 L-1.1
SSN1ADQ112 12 L-1.2
SSN1ADQ113 13 Ve-1.2
SSN1ADQ114 14 Ie-1
7.13.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADQ1.
You can use the T2000 to set the following parameters for the ADQ1:
l Port type
l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)
For details on the parameters, refer to F Board Configuration Reference.
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7.13.8 Technical SpecificationsThe technical specifications of the ADQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 7-57 lists the specifications of the optical interfaces of the ADQ1.
Table 7-57 Specifications of the optical interfaces of the ADQ1
Item Specification
Opticalinterface type
Ie-1 S-1.1 L-1.1 L-1.2 Ve-1.2
Optical sourcetype
MLM MLM MLM, SLM SLM SLM
Wavelength(nm)
1260 to1360
1261 to 1360 1263 to 1360 1480 to1580
1480 to 1580
Transmissiondistance (km)
0 to 0.5 2 to 15 15 to 40 40 to 80 80 to 100
Launchedoptical power(dBm)
–19 to –14 –15 to –8 –5 to 0 –5 to 0 –3 to 0
Receivingoptical power(dBm)
–31 –28 –34 –34 –34
Overloadoptical power(dBm)
–14 –8 –10 –10 –10
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the ADQ1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ADQ1 is 37 W.
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7.14 IDL4This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.14.1 Version DescriptionThe functional version of the IDL4 board is N1.
7.14.2 Function and FeatureThe IDL4 supports the ATM switching, IMA, and ATM protection.
7.14.3 Working PrincipleThe IDL4 consists of the O/E converting module, physical layer module, ATM module and soon.
7.14.4 Front PanelOn the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety classlabel.
7.14.5 Valid SlotsThe IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.14.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDL4 indicates the optical interface type.
7.14.7 Board ProtectionThe IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should behoused in paired slots.
7.14.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDL4.
7.14.9 Technical SpecificationsThe technical specifications of the IDL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.14.1 Version DescriptionThe functional version of the IDL4 board is N1.
7.14.2 Function and FeatureThe IDL4 supports the ATM switching, IMA, and ATM protection.
Table 7-58 lists the functions and features of the IDL4.
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Table 7-58 Functions and features of the IDL4
Function andFeature
IDL4
Basic function Accesses and processes 1 x STM-4 ATM services.
Optical interfacetype
Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2types.
Connector type LC.
Optical moduletype
SFP.
E3 ATM interface Not supported.
IMA function(ATM Forum IMA1.1 standard)
Accesses and processes IMA services when used with E1 serviceprocessing board N1PQ1/N1PQM.Supports a maximum of 63 IMA E1 services.One ATM port supports a maximum of 16 IMA groups. Each IMA groupsupports 1–32 E1 signals.One ATM port supports a maximum of E1 links of 16 non-IMA groups.The maximum IMA multichannel delay is 226 ms.
Max. uplinkbandwidth
Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4.
ATM switchingcapability
1.0 Gbit/s.
Mappinggranularity
Supports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).
IMA feature Accesses and processes IMA services when used with E1 serviceprocessing board.Processes IMA services for a maximum of 63 x E1 signals.Supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals.The maximum IMA multichannel delay is 226 ms.
Service type Supports CBR, rt-VBR, nrt-VBR and UBR.
ATM connection 2048.
Statisticalmultiplexing
Supported.
Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.
ATM multicastconnection
Supports spacial multicast and logical multicast.
ATM protection(ITU-T I.630)
Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ringprotection schemes.
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Function andFeature
IDL4
Board level 1+1protection
Supported.
OAM function(ITU-T I.610)
Supports AIS, RDI, LB , and CC.
Maintenancefeature
Supports inloop and outloop at the ATM layer levels, supports inloopat the optical interface, which are used for maintenance and faultlocating.
Alarm andperformance event
Provides rich alarms and performance events, which are used formaintenance and fault locating.
Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group cancoexist with single E1. The IMA group can dynamically increase or decrease the bandwidthto enhance the bandwidth utilization. The IMA group can also converge 2M services, and canconnect to other IMA equipment.
7.14.3 Working PrincipleThe IDL4 consists of the O/E converting module, physical layer module, ATM module and soon.
Figure 7-35 shows the block diagram for the functions of the IDL4.
Figure 7-35 Block diagram for the functions of the IDL4
+1.5 V
high speed bus
Communicationand control module
LOS
Laser shut down
Reference clock and frame header
Communication
Cross-connet unit
Scc unit
50 MHz
77 MHz
100 MHz
622 Mbit/s
Cross-connet unit A
+3.3 V
+2.5 V+1.8 V
+1.2 V
Clockmodule
DC/DCconverters
ATMmodule
PHYmodule
Mappingmodule
E/O
O/E IMAmodule
+3.3 V backuppower
DC/DCconverter
Fuse
Fuse
-48 V/ -60 V
-48 V/ -60 V
high speed busCross-connet unit B
622 Mbit/s
622 Mbit/s 622 Mbit/s
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E/O Converting ModuleThe E/O converting module is responsible for E/O conversion.
Physical Layer ModuleThe physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation ofheader error control (HEC) sequence
ATM ModuleThe ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:
l Flow control
l Extraction and generation of cell headers
l ATM switching
IMA ModuleThis module mainly performs IMA protocol functions. These functions are:
l Separation and re-creation of ATM cells
l Frame synchronization
l Insertion and extraction of IMA control protocol (ICP) cells
l Management of IMA groups
Mapping ModuleThe mapping module:
l Mappings ATM cells into SDH frame payload
l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC-4-Xv (X≤4) virtual concatenation
Communication and Control ModuleThe communication and control module:
l Controls writing and reading of each chip
l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
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l Controls the shutting of transmission
Clock ModuleThis module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.
DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.
7.14.4 Front PanelOn the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 7-36 shows the appearance of the front panel of the IDL4.
Figure 7-36 Front panel of the IDL4
IDL4
IDL4
STATACTPROGSRV
CLASS 1
LASER
PRODUCT
IN1
OU
T1
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IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are one optical interface on the front panel of the IDL4. Table 7-59 lists the type andusage of the optical interface.
Table 7-59 Optical interface of the IDL4
Interface InterfaceType
Usage
OUT1/IN1 LC(pluggable)
Transmits and receives STM-4 optical signals.
7.14.5 Valid SlotsThe IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.14.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDL4 indicates the optical interface type.
Table 7-60 lists the relation between the board feature code and optical interface type for theIDL4.
Table 7-60 Relation between the board feature code and the optical interface type
Board Feature Code Optical Interface Type
SSN1IDL410 10 S-4.1
SSN1IDL411 11 L-4.1
SSN1IDL412 12 L-4.2
SSN1IDL413 13 Ve-4.2
7.14.7 Board ProtectionThe IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should behoused in paired slots.
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The paired slots for the IDL4 are slots 13 and 12.
7.14.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDL4.
You can use the T2000 to set the following parameters for the IDL4:
l Port type
l Flow type
l Service type
l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)
For details on the parameters, refer to F Board Configuration Reference.
7.14.9 Technical SpecificationsThe technical specifications of the IDL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 7-61 lists the specifications of the optical interfaces of the IDL4.
Table 7-61 Specifications of the optical interfaces of the IDL4
Item Specification
Optical interfacetype
S-4.1 L-4.1 L-4.2 Ve-4.2
Optical source type MLM SLM SLM SLM
Wavelength (nm) 1274 to 1356 1280 to 1335 1480 to 1580 1480 to 1580
Transmissiondistance (km)
2 to 15 15 to 40 40 to 80 80 to 100
Launched opticalpower (dBm)
–15 to –8 –3 to +2 –3 to +2 –3 to +2
Receiver sensitivity(dBm)
–28 –28 –28 –33
Overload opticalpower (dBm)
–8 –8 –8 –13
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the IDL4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the IDL4 is 41 W.
7.15 IDQ1This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.
7.15.1 Version DescriptionThe functional version of the IDQ1 board is N1.
7.15.2 Function and FeatureThe IDQ1 supports the ATM switching, IMA, and ATM protection.
7.15.3 Working Principle and Signal FlowThe ADQ1 consists of the O/E converting module, physical layer module, ATM module and soon.
7.15.4 Front PanelOn the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety classlabel.
7.15.5 Valid SlotsThe IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.15.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDQ1 indicates the optical interface type.
7.15.7 Board ProtectionThe IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should behoused in paired slots.
7.15.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDQ1.
7.15.9 Technical SpecificationsThe technical specifications of the IDQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
7.15.1 Version DescriptionThe functional version of the IDQ1 board is N1.
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7.15.2 Function and FeatureThe IDQ1 supports the ATM switching, IMA, and ATM protection.
Table 7-62 lists the functions and features of the IDQ1.
Table 7-62 Functions and features of the IDQ1
Function andFeature
IDQ1
Basic function Accesses and processes 4 x STM-1 ATM services.
Optical interfacetype
Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2types.
Connector type LC.
Optical moduletype
SFP.
E3 ATM interface Not supported.
IMA function(ATM Forum IMA1.1 standard)
Accesses and processes IMA services when used with E1 serviceprocessing board N1PQ1/N1PQM.Supports a maximum of 63 IMA E1 services.One ATM port supports a maximum of 16 IMA groups. Each IMA groupsupports 1–32 E1 signals.One ATM port supports a maximum of E1 links of 16 non-IMA groups.The maximum IMA multichannel delay is 226 ms.
Max. uplinkbandwidth
Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4.
ATM switchingcapability
1.0 Gbit/s.
Mappinggranularity
Suppports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).
IMA feature Accesses and processes IMA services when used with E1 serviceprocessing board.Processes IMA services for a maximum of 63 x E1 signals.Supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals.The maximum IMA multichannel delay is 226 ms.
Service type Supports CBR, rt-VBR, nrt-VBR and UBR.
ATM connection 2048.
Statisticalmultiplexing
Supported.
Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.
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Function andFeature
IDQ1
ATM multicastconnection
Supports spacial multicast and logical multicast.
ATM protection(ITU-T I.630)
Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ringprotection schemes.
Board level 1+1protection
Supported.
OAM function(ITU-T I.610)
Supports AIS, RDI, LB , and CC.
Maintenancefeature
Supports inloop and outloop at the ATM layer levels, supports inloopat the optical interface, which are used for maintenance and faultlocating.
Alarm andperformance event
Provides rich alarms and performance events, which are used formaintenance and fault locating.
Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group cancoexist with single E1. The IMA group can dynamically increase or decrease the bandwidthto enhance the bandwidth utilization. The IMA group can also converge 2M services, and canconnect to other IMA equipment.
7.15.3 Working Principle and Signal FlowThe ADQ1 consists of the O/E converting module, physical layer module, ATM module and soon.
Figure 7-37 shows the block diagram for the functions of the IDQ1.
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Figure 7-37 Block diagram for the functions of the IDQ1
+1.5 V
4 x 155Mbit/s
4 x 155Mbit/s
4 x 155Mbit/s
4 x 155Mbit/s
high speed bus
Communicationand control module
LOS
Laser shut down
Reference clock and frame header
Communication
Cross-connet unit
Scc unit
50 MHz
77 MHz
100 MHz
Cross-connet unit A
+3.3 V
+2.5 V+1.8 V
+1.2 V
Clockmodule
DC/DCconverters
ATMmodule
PHYmodule
Mappingmodule
E/O
O/E IMAmodule
+3.3 V backuppower
DC/DCconverter
Fuse
Fuse
-48 V/ -60 V
-48 V/ -60 V
high speed busCross-connet unit B
E/O Converting Module
The E/O converting module is responsible for E/O conversion.
Physical Layer Module
The physical layer module mainly:
l Mappings ATM cells into SDH frames
l Demappings SDH frames to ATM cells
l Processes ATM service physical layer functions: cell delimitation, test and generation ofheader error control (HEC) sequence
ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:
l Flow control
l Extraction and generation of cell headers
l ATM switching
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IMA Module
This module mainly performs IMA protocol functions. These functions are:
l Separation and re-creation of ATM cells
l Frame synchronization
l Insertion and extraction of IMA control protocol (ICP) cells
l Management of IMA groups
Mapping Module
The mapping module:
l Mappings ATM cells into SDH frame payload
l Demappings SDH frame payload to ATM cells
l Supports ATM physical layer functions
l Supports VC-4-Xv (X≤4) virtual concatenation
Communication and Control Module
The communication and control module:
l Controls writing and reading of each chip
l Communicates with the NE
l Issues configured services
l Reports alarms of each functional module
l Checks R_LOS alarms of optical modules
l Controls the shutting of transmission
Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.
DC/DC Converter Module
Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.
7.15.4 Front PanelOn the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front Panel
Figure 7-38 shows the appearance of the front panel of the IDQ1.
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Figure 7-38 Front panel of the IDQ1
IDQ1
IDQ1
STATACTPROGSRV
CLASS 1
LASER
PRODUCT
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four optical interfaces on the front panel of the IDQ1. Table 7-63 lists the type andusage of the optical interfaces.
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Table 7-63 Optical interfaces of the IDQ1
Interface Interface Type Usage
OUT1/IN1 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT2/IN2 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT3/IN3 LC (pluggable) Transmits and receives STM-1 optical signals.
OUT4/IN4 LC (pluggable) Transmits and receives STM-1 optical signals.
7.15.5 Valid SlotsThe IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.15.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDQ1 indicates the optical interface type.
Table 7-64 lists the relation between the board feature code and optical interface type for theIDQ1.
Table 7-64 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSN1IDQ110 10 S-1.1
SSN1IDQ111 11 L-1.1
SSN1IDQ112 12 L-1.2
SSN1IDQ113 13 Ve-1.2
SSN1IDQ114 14 Ie-1
7.15.7 Board ProtectionThe IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should behoused in paired slots.
The paired slots for the IDQ1 are slots 13 and 12.
7.15.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDQ1.
You can use the T2000 to set the following parameters for the IDQ1:
l Port type
l Flow type
l Service type
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l Peak cell rate (PCR)
l Sustainable cell rate (SCR)
l Maximum cell burst size
l Cell delay variation tolerance (CDVT)
For details on the parameters, refer to F Board Configuration Reference.
7.15.9 Technical SpecificationsThe technical specifications of the IDQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 7-65 lists the specifications of the optical interfaces of the IDQ1.
Table 7-65 Specifications of the optical interfaces of the IDQ1
Item Specification
Opticalinterface type
Ie-1 S-1.1 L-1.2 Ve-1.2 L-1.1
Optical sourcetype
MLM MLM SLM SLM MLM, SLM
Wavelength(nm)
1260 to1360
1261 to 1360 1480 to1580
1480 to 1580 1263 to 1360
Transmissiondistance (km)
0 to 0.5 2 to 15 40 to 80 80 to 100 15 to 40
Launchedoptical power(dBm)
–19 to –14 –15 to –8 –5 to 0 –3 to 0 –5 to 0
Receiversensitivity(dBm)
–31 –28 –34 –34 –34
Overloadoptical power(dBm)
–14 –8 –10 –10 –10
Laser Safety Class
The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specifications
The mechanical specifications of the IDQ1 are as follows:
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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the IDQ1 is 41 W.
7.16 MST4This section describes the MST4, a 4-channel multi-service transparent transmission board, interms of the version, function, principle, front panel, configuration and specifications.
7.16.1 Version DescriptionThe functional version of the MST4 board is N1.
7.16.2 Function and FeatureThe MST4 is used to access multiple services, and to maintain alarms.
7.16.3 Working Principle and Signal FlowThe MST4 consists of the client-side access module, FC protocol processing module,encapsulation and mapping module, Communication and control module and so on.
7.16.4 Front PanelOn the front panel of the MST4, there are indicators, interfaces and barcode.
7.16.5 Valid SlotsThe MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.16.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the MST4 indicates the service type, optical interface type and transmission distance.
7.16.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the MST4.
7.16.8 Technical SpecificationsThe specifications of the MST4 cover the optical interface specifications, mechanicalspecifications and power consumption.
7.16.1 Version DescriptionThe functional version of the MST4 board is N1.
7.16.2 Function and FeatureThe MST4 is used to access multiple services, and to maintain alarms.
Table 7-66 lists the functions and features of the MST4.
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Table 7-66 Functions and features of the MST4
Function andFeature
MST4
Basic function Provides four independent ports to access multiple services, and supportsthe transparent transmission of the SAN and Video services.
Connector type LC.
Optical moduletype
SFP.
Service type Supports the FC100/FICON, FC200, ESCON, and DVB-ASIservices.Table 7-67 lists types and rates of the services.Accesses four-channel FC services (FC100/FICON and FC200) at thesame time, and the total bandwidth is less than 2.5 Gbit/s.Supports the full-rate transmission of the FC services (one-channel FC200services or two-channel FC100 services).Accesses four-channel ESCON or DVB-ASI services, and the totalbandwidth is less than 2.5 Gbit/s.
Distanceextension
The first and second ports support the distance extension function at theSDH side. (FC100: 3000 km; FC200: 1500 km)
Max. uplinkbandwidth
2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directlyconnect to the cross-connect unit.)
Mappinggranularity
Supports VC-4-Xc (X: 4, 8, 16).
ESCON Accesses four-channel ESCON services, and the total bandwidth is lessthan 2.5 Gbit/s.
DVB-ASI Accesses four-channel DVB-ASI services, and the total bandwidth is lessthan 2.5 Gbit/s.
Encapsulationformat
Supports GFP-T, compliant with ITU-T G.7041.
Maintenancefeature
Supports the inloop and outloop at the port level of the client side. Theloopack is used for maintenance and fault locating.
Alarm andperformanceevent
Provides rich alarms and performance events, which are used formaintenance and fault locating.
Table 7-67 Services and service rates provided by the MST4
Service Type Rate Remarks
FC100/FICON 1062.5 Mbit/s SAN service
FC200 2125 Mbit/s SAN service
ESCON 200 Mbit/s. SAN service.
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Service Type Rate Remarks
DVB-ASI 270 Mbit/s Video service
7.16.3 Working Principle and Signal FlowThe MST4 consists of the client-side access module, FC protocol processing module,encapsulation and mapping module, Communication and control module and so on.
Figure 7-39 shows the block diagram for the functions of the MST4.
Figure 7-39 Block diagram for the functions of the MST4
Interfaceconversion
module
Client-side
accessmodule
FC50FC100FC200FICONDVB-ASI
Reference clock and frame header
SCC unitCommunication
FC processing module
FC1_SND
Encapsulation
Decapsulation
FC1_RCV
FC2 FC1_SND
FC2
Communication and controlmodule
Clockmodule
135 MHz125 MHz100 MHz
212.5 MHz622 MHz
Cross-connect unit
+1.2 V+1.5 V
+2.5 V+1.8 V
FC1_RCV
Mapping
ESCON
Encapsulation andmapping module
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
FuseDC/DC
converter
-48 V/ -60 V
-48 V/ -60 V
Cross-connectunit A/B
Cross-connectunit A/B
The function modules are described as follows:
Client-side Access ModuleThe client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCONservices. The client-side interface unit performs O/E conversion for services and monitors theoptical signals at client side.
In the upstream direction, the client-side data interface (CDI) receives serial data signals inputby the SFP optical module. The serial data signals are then transmitted to the PCS functionmodule for physical layer and 8B/10B line performance monitoring.
In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. Thesignals are then adapted into client reference clock by inserting or discarding idle packets. Afterbeing converted from parallel signals to serial signals, the signals are transmitted through theCDI interface to the optical module at client side.
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FC protocol Processing ModuleThe FC protocol processing unit mainly extends the distance the FC services. This modulesupports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km.
The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layerfunctions include:
l 8B/10B conversion
l Synchronous processing
l Extraction of primitive signal and primitive sequence
The FC2 layer functions include:
l Check and statistics of all special frames
l Modification of values of some special frames (FLOG1, PLOG1 and ELP)
l CRC check
Encapsulation and Mapping ModuleThe encapsulation and mapping module mainly:
l Encapsulates and mappings data
l Decapsulates and demappings data
According to signal flow direction, the function modules inside the chip can be classified intomodules in ingress direction and ones in egress direction. The ingress direction is for processingfrom client side to line side. The egress direction is for line-side processing.
Ingress direction:
Through GFP-T encapsulation, 64B/65B conversion is performed to data bytes after decoding.The data bytes are then mapped under GFP-T protocol.
Egress direction:
SDH data frames are received from the line-side interface module. After the overhead isprocessed, GFP-T data frames are extracted from SDH concatenated channels and then aretransmitted to the decapsulating module for decapsulation.
Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module manages and configures other modules of the boards. This module containsbasic logic units:
l Writes and reads register
l Provides interface for CPU
l Checks and selects clock
l Performs phase discrimination and frequency division to the clock
l Checks the in-service state of the cross-connect, the SCC and the line boards
l Checks reset control circuits of each chip
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l Controls the shutting down of the optical module
l Processes communications
l Controls indicators
System Clock Module
This module provides required reference clocks for boards. The clock frequencies are 100 MHz,125 MHz and so on.
DC/DC Converter Module
Through the DC/DC module, the power unit generates direct currents for each chip on the board.The –48 V/ –60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.
7.16.4 Front PanelOn the front panel of the MST4, there are indicators, interfaces and barcode.
Appearance of the Front Panel
Figure 7-40 shows the appearance of the front panel of the MST4.
Figure 7-40 Front panel of the MST4
MST4
MST4
STATACTPROGSRV
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are four pairs of optical interfaces on the front panel of the MST4. Table 7-68 lists thetype and usage of the optical interfaces.
Table 7-68 Optical interfaces of the MST4
Interface InterfaceType
Usage
IN1-IN4 LC Receives multi-service optical signals.
OUT1-OUT4 LC Transmits multi-service optical signals.
7.16.5 Valid SlotsThe MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.
7.16.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the MST4 indicates the service type, optical interface type and transmission distance.
Table 7-69 lists the relation between the board feature code and service type.
Table 7-69 Relation between the board feature code and service type
Board Barcode FeatureCode
Service Type (Optical InterfaceType)
TransmissionDistance
SSN1MST410 10 2 x FC (SM) 2 km
SSN1MST411 11 2 x FC (SM) 15 km
SSN1MST412 12 2 x FC (MM) 0.5 km
SSN1MST413 13 4 x ESCON/DVB-ASI (SM) 15 km
SSN1MST414 14 4 x ESCON/DVB-ASI (MM) 2 km
SSN1MST415 15 1 x FC2 (MM) -
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Board Barcode FeatureCode
Service Type (Optical InterfaceType)
TransmissionDistance
ESCON/DVB-ASI (MM)
SSN1MST416 16 1 x FC2 (MM) -
ESCON/DVB-ASI (SM)
SSN1MST417 17 1 x FC (SM) 2 km
2 x ESCON/DVB-ASI (SM) -
SSN1MST418 18 1 x FC (SM) 2 km
2 x ESCON/DVB-ASI (MM) -
7.16.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the MST4.
You can use the T2000 to set the following parameters for the MST4:
l J1 byte
l C2 byte
For details on the parameters, refer to F Board Configuration Reference.
7.16.8 Technical SpecificationsThe specifications of the MST4 cover the optical interface specifications, mechanicalspecifications and power consumption.
Optical Interface SpecificationsThe optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-70lists the specifications of the optical interfaces.
Table 7-70 Specifications of the optical interfaces of the MST4
Item Specification
Optical interfacetype
X3.296/(DVB-ASI )EN50083-9200-M5-SN-I 200-SM-LC-I
Optical modulecode
34060277 34060287 34060325 34060288 34060278
Service type ESCON/DVB FC200, FC100
Service rate STM-4 STM-1 2.125 Gbit/s STM-16
Optical sourcetype
SLM LED LED MLM SLM
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Item Specification
Wavelength(nm)
1310 850 1310
Transmissiondistance (km)
15 2 0.5 2 15
Max. launchedoptical power(dBm)
–8 –14 -2.5 -3 0
Min. launchedoptical power(dBm)
–15 –19 -9.5 -10 -5
Receiversensitivity(dBm)
–31 –30 –17 –21
Overload opticalpower (dBm)
–8 –14 0 –3 0
Mechanical SpecificationsThe mechanical specifications of the MST4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the MST4 is 26 W.
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8 Interface Boards and Switching Boards
About This Chapter
This chapter describes the interface and switching boards. The interface boards are used to accesscables and fibers. The switching boards are used to provide the TPS protection.
8.1 L12SThis section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.2 D12BThis section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,function, principle, front panel and specifications.
8.3 D12SThis section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.4 L75SThis section describes the L75S, a 16 x E1 electrical interface switching board, in terms of theversion, function, principle, front panel and specifications.
8.5 D75SThis section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.6 D34SThis section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.7 C34SThis section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.8 EU04This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.
8.9 EU08
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This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.
8.10 OU08This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
8.11 MU04This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of theversion, function, principle, front panel and specifications.
8.12 TSB8This section describes the TSB8, an 8-channel optical interface switching board, in terms of theversion, function, principle, front panel and specifications.
8.13 EFF8This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of theversion, function, principle, front panel and specifications.
8.14 ETF8This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms ofthe version, function, principle, front panel and specifications.
8.15 ETS8This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,in terms of the version, function, principle, front panel and specifications.
8.16 DM12This section describes the DM12, a DDN interface board, in terms of the version, function,principle, front panel and specifications.
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8.1 L12SThis section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.1.1 Version DescriptionThe functional version of the L12S is R1.8.1.2 Function and FeatureThe L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must beused with the PD1.8.1.3 Working Principle and Signal FlowThe L12S consists of the interface module, switch matrix module, and power supply module.8.1.4 Front PanelOn the front panel of the L12S, there are interfaces and barcode.8.1.5 Valid SlotsAs the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiXOSN 1500A subrack.8.1.6 Technical SpecificationsThe technical specifications of the L12S cover the board dimensions, weight and powerconsumption.
8.1.1 Version DescriptionThe functional version of the L12S is R1.
8.1.2 Function and FeatureThe L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must beused with the PD1.
8.1.3 Working Principle and Signal FlowThe L12S consists of the interface module, switch matrix module, and power supply module.
Figure 8-1 shows the block diagram for the functions of the L12S.
Figure 8-1 Block diagram for the functions of the L12S
Swictchmatrix
module
E1/T1
E1/T1
PD1
Backplane
Interfacemodule
+3.3 V Power+3.3 V Fuse
PD1
Cross-connectboard
Powersupplymodule
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Interface Module
The interface module receives and transmits the E1/T1 electrical signals.
Switch Matrix Module
In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.
8.1.4 Front PanelOn the front panel of the L12S, there are interfaces and barcode.
Appearance of the Front Panel
Figure 8-2 shows the appearance of the front panel of the L12S.
Figure 8-2 Front panel of the L12S
L12S
1-16
Interfaces
On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16x E1/T1 electrical signals.
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8.1.5 Valid SlotsAs the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiXOSN 1500A subrack.
Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housedin the slot with a smaller number accesses the first 16 (1–16) channels of E1/T1 electrical signals.The L12S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1/T1 electrical signals.
Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500Asubrack
Valid Slot for the PD1 Corresponding Slot for the L12S
Slot 12 Slots 6 and 7
8.1.6 Technical SpecificationsThe technical specifications of the L12S cover the board dimensions, weight and powerconsumption.
Mechanical Specifications
The mechanical specifications of the L12S are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.27
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the L12S is 4.5 W.
8.2 D12BThis section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,function, principle, front panel and specifications.
8.2.1 Version DescriptionThe functional version of the D12B board is N1.
8.2.2 Function and FeatureThe D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must beused with the PQ1 or PQM.
8.2.3 Working Principle and Signal FlowThe D12B consists of the interface module and power supply module.
8.2.4 Front PanelOn the front panel of the D12B, there are interfaces and barcode.
8.2.5 Valid Slots
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The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Bcan be used as the interface board for the PQ1 or PQM.
8.2.6 Technical SpecificationsThe technical specifications of the D12B cover the board dimensions, weight and powerconsumption.
8.2.1 Version DescriptionThe functional version of the D12B board is N1.
8.2.2 Function and FeatureThe D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must beused with the PQ1 or PQM.
8.2.3 Working Principle and Signal FlowThe D12B consists of the interface module and power supply module.
Figure 8-3 shows the block diagram for the functions of the D12B.
Figure 8-3 Block diagram for the functions of the D12B
E1/T1
E1/T1
PQ1/PQM
+3.3 V+3.3 V Fuse
PQ1/PQM
Interfacemodule
Backplane
PowerPowersupplymodule
Interface ModuleThe interface module receives and transmits the E1/T1 electrical signals.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.2.4 Front PanelOn the front panel of the D12B, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-4 shows the appearance of the front panel of the D12B.
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Figure 8-4 Front panel of the D12B
D12B
17~
249~
161~
825
~32
D12B
InterfacesThere are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type andusage of the interfaces.
Table 8-2 Interfaces on the front panel of the D12B
Interface InterfaceType
Usage
1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.
9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.
17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.
25–32 DB44 Receive eight channels (25-32) of E1/T1 signals.
Table 8-3 lists the pins of the DB44 interfaces.
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Table 8-3 Pins of the DB44 interfaces of the D12B
Front View Pin Usage Pin Usage
1
44
38 R1 to receive thefirst channel ofsignals.
34 R5 to receive thefifth channel ofsignals.23 19
37 R2 to receive thesecond channel ofsignals.
33 R6 to receive thesixth channel ofsignals.22 18
36 R3 to receive thethird channel ofsignals.
32 R7 to receive theseventh channel ofsignals.21 17
35 R4 to receive thefourth channel ofsignals.
31 R8 to receive theeighth channel ofsignals.20 16
15 T1 to transmit thefirst channel ofsignals.
11 T5 to transmit thefifth channel ofsignals.30 26
14 T2 to transmit thesecond channel ofsignals.
10 T6 to transmit thesixth channel ofsignals.29 25
13 T3 to transmit thethird channel ofsignals.
9 T7 to transmit theseventh channel ofsignals.28 24
12 T4 to transmit thefourth channel ofsignals.
8 T8 to transmit theeighth channel ofsignals.27 7
8.2.5 Valid SlotsThe D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Bcan be used as the interface board for the PQ1 or PQM.
Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12Bhoused in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electricalsignals. The D12B housed in the slot with a larger number accesses the last 31 (33–63) channelsof E1/T1 electrical signals.
Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN1500B subrack
Valid Slot for the PQ1/PQM Corresponding Slot for the D12B
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
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8.2.6 Technical SpecificationsThe technical specifications of the D12B cover the board dimensions, weight and powerconsumption.
Mechanical SpecificationsThe mechanical specifications of the D12B are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.3
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the D12B is 0 W.
8.3 D12SThis section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.3.1 Version DescriptionThe functional version of the D12S board is N1.
8.3.2 Function and FeatureThe D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must beused with the PQ1 or PQM.
8.3.3 Working Principle and Signal FlowThe D12S consists of the interface module, switch matrix module, and power supply module.
8.3.4 Front PanelOn the front panel of the D12S, there are interfaces and barcode.
8.3.5 Valid SlotsThe D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Scan be used as the interface board for the PQ1 or PQM.
8.3.6 Technical SpecificationsThe technical specifications of the D12S cover the board dimensions, weight and powerconsumption.
8.3.1 Version DescriptionThe functional version of the D12S board is N1.
8.3.2 Function and FeatureThe D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must beused with the PQ1 or PQM.
8.3.3 Working Principle and Signal FlowThe D12S consists of the interface module, switch matrix module, and power supply module.
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Figure 8-5 shows the block diagram for the functions of the D12S.
Figure 8-5 Block diagram for the functions of the D12S
Swictchmatrix
module
E1/T1
E1/T1PQ1/PQM
Backplane
Interfacemodule
+3.3 V Power+3.3 V Fuse
Cross-connectboard
Powersupplymodule
PQ1/PQM
Interface ModuleThe interface module receives and transmits the E1/T1 electrical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 or PQM board. When the TPS protection is performed,the switch matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.3.4 Front PanelOn the front panel of the D12S, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-6 shows the appearance of the front panel of the D12S.
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Figure 8-6 Front panel of the D12S
D12S
D12S
17~24
9~
161~
825
~32
InterfacesThere are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usageof the optical interfaces.
Table 8-5 Interfaces on the front panel of the D12S
Interface InterfaceType
Usage
1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.
9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.
17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.
25–32 DB44 Receive eight channels (25–32) of E1/T1 signals.
Table 8-6 lists the pins of the DB44 interfaces.
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Table 8-6 Pins of the DB44 interfaces of the D12S
Front View Pin Usage Pin Usage
1
44
38 R1 to receive thefirst channel ofsignals.
34 R5 to receive the fifthchannel of signals.
23 19
37 R2 to receive thesecond channel ofsignals.
33 R6 to receive the sixthchannel of signals.
22 18
36 R3 to receive thethird channel ofsignals.
32 R7 to receive theseventh channel ofsignals.21 17
35 R4 to receive thefourth channel ofsignals.
31 R8 to receive theeighth channel ofsignals.20 16
15 T1 to transmit thefirst channel ofsignals.
11 T5 to transmit thefifth channel ofsignals.30 26
14 T2 to transmit thesecond channel ofsignals.
10 T6 to transmit thesixth channel ofsignals.29 25
13 T3 to transmit thethird channel ofsignals.
9 T7 to transmit theseventh channel ofsignals.28 24
12 T4 to transmit thefourth channel ofsignals.
8 T8 to transmit theeighth channel ofsignals.27 7
8.3.5 Valid SlotsThe D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Scan be used as the interface board for the PQ1 or PQM.
Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12Shoused in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electricalsignals. The D12S housed in the slot with a larger number accesses the last 31 (33–63) channelsof E1/T1 electrical signals.
Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN1500B subrack
Valid Slot for the PQ1/PQM Corresponding Slot for the D12S
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
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8.3.6 Technical SpecificationsThe technical specifications of the D12S cover the board dimensions, weight and powerconsumption.
Mechanical Specifications
The mechanical specifications of the D12S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D12S in the switchingstate is 9 W and that of the D12S in the normal state is 0 W.
8.4 L75SThis section describes the L75S, a 16 x E1 electrical interface switching board, in terms of theversion, function, principle, front panel and specifications.
8.4.1 Version DescriptionThe functional version of the L75S is R1.
8.4.2 Function and FeatureThe L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be usedwith the PD1.
8.4.3 Working Principle and Signal FlowThe L75S consists of the interface module, switch matrix module, and power supply module.
8.4.4 Front PanelOn the front panel of the L75S, there are interfaces and barcode.
8.4.5 Valid SlotsThe L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interfaceboard for the PD1.
8.4.6 Technical SpecificationsThe technical specifications of the L75S cover the board dimensions, weight and powerconsumption.
8.4.1 Version DescriptionThe functional version of the L75S is R1.
8.4.2 Function and FeatureThe L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be usedwith the PD1.
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8.4.3 Working Principle and Signal FlowThe L75S consists of the interface module, switch matrix module, and power supply module.
Figure 8-7 shows the block diagram for the functions of the L75S.
Figure 8-7 Block diagram for the functions of the L75S
Swictchmatrix
module
E1
E1
Backplane
Interfacemodule
+3.3 V Power+3.3 V Fuse
Cross-connectboard
Powersupplymodule
PD1
PD1
Interface Module
The interface module receives and transmits the E1 electrical signals.
Switch Matrix Module
In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.
8.4.4 Front PanelOn the front panel of the L75S, there are interfaces and barcode.
Appearance of the Front Panel
Figure 8-8 shows the appearance of the front panel of the L75S.
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Figure 8-8 Front panel of the L75S
L75S
1-16
Interfaces
On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16x E1 electrical signals.
8.4.5 Valid SlotsThe L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interfaceboard for the PD1.
Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housedin the slot with a smaller number accesses the first 16 (1–16) channels of E1 electrical signals.The L75S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1electrical signals.
Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S
Valid Slot for the PD1 Corresponding Slot for the L75S
Slot 12 Slots 6 and 7
8.4.6 Technical SpecificationsThe technical specifications of the L75S cover the board dimensions, weight and powerconsumption.
Mechanical Specifications
The mechanical specifications of the L75S are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.24
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Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the L75S is 2.7 W.
8.5 D75SThis section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.5.1 Version DescriptionThe functional version of the D75S board is N1.
8.5.2 Function and FeatureThe D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must beused with the PQ1 or PQM.
8.5.3 Working Principle and Signal FlowThe D75S consists of the interface module, switch matrix module, and power supply module.
8.5.4 Front PanelOn the front panel of the D75S, there are interfaces and barcode.
8.5.5 Valid SlotsAs the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 inthe OptiX OSN 1500B subrack.
8.5.6 Technical SpecificationsThe technical specifications of the D75S cover the board dimensions, weight and powerconsumption.
8.5.1 Version DescriptionThe functional version of the D75S board is N1.
8.5.2 Function and FeatureThe D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must beused with the PQ1 or PQM.
8.5.3 Working Principle and Signal FlowThe D75S consists of the interface module, switch matrix module, and power supply module.
Figure 8-9 shows the block diagram for the functions of the D75S.
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Figure 8-9 Block diagram for the functions of the D75S
Swictchmatrix
module
E1/T1
Backplane
Interfacemodule
+3.3 V Power+3.3 V Fuse
Cross-connectboard
Powersupplymodule
PQ1/PQM
PQ1/PQME1/T1
Interface ModuleThe interface module receives and transmits the E1/T1 electrical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PQ1 or PQM board. When the TPS protection is performed,the switch matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.5.4 Front PanelOn the front panel of the D75S, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-10 shows the appearance of the front panel of the D75S.
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Figure 8-10 Front panel of the D75S
D75S
D75S
17~24
9~
161~
825
~32
InterfacesThere are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usageof the DB44 interfaces.
Table 8-9 Interfaces on the front panel of the D75S
Interface InterfaceType
Usage
1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.
9–16 DB44 Receive eight channels (9–16) of E1/T1 signals.
17–24 DB44 Receive eight channels (17–24) of E1/T1 signals.
25–32 DB44 Receive eight channels (25–32) of E1/T1 signals.
Table 8-10 lists the pins of the DB44 interface.
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Table 8-10 Pins of the DB44 interfaces of the D75S
Front View Pin Usage Pin Usage
1
44
38 R1 to receive thefirst channel ofsignals.
34 R5 to receive the fifthchannel of signals.
23 19
37 R2 to receive thesecond channel ofsignals.
33 R6 to receive the sixthchannel of signals.
22 18
36 R3 to receive thethird channel ofsignals.
32 R7 to receive theseventh channel ofsignals.21 17
35 R4 to receive thefourth channel ofsignals.
31 R8 to receive theeighth channel ofsignals.20 16
15 T1 to transmit thefirst channel ofsignals.
11 T5 to transmit thefifth channel ofsignals.30 26
14 T2 to transmit thesecond channel ofsignals.
10 T6 to transmit thesixth channel ofsignals.29 25
13 T3 to transmit thethird channel ofsignals.
9 T7 to transmit theseventh channel ofsignals.28 24
12 T4 to transmit thefourth channel ofsignals.
8 T8 to transmit theeighth channel ofsignals.27 7
8.5.5 Valid SlotsAs the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 inthe OptiX OSN 1500B subrack.
Table 8-11 lists the valid slots for the PQ1/PQM and corresponding slots for the D75S. TheD75S housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1electrical signals. The D75S housed in the slot with a larger number accesses the last 31 (33–63) channels of E1/T1 electrical signals.
Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiXOSN 1500B subrack
Valid Slot for the PQ1/PQM Corresponding Slot for the D75S
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
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8.5.6 Technical SpecificationsThe technical specifications of the D75S cover the board dimensions, weight and powerconsumption.
Mechanical Specifications
The mechanical specifications of the D75S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the D75S in the switchingstate is 6 W and that of the D75S in the normal state is 0 W.
8.6 D34SThis section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.6.1 Version DescriptionThe functional version of the D34S board is N1.
8.6.2 Function and FeatureThe D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must beused with the PD3.
8.6.3 Working Principle and Signal FlowThe D34S consists of the interface module, switch matrix module, and power supply module.
8.6.4 Front PanelOn the front panel of the D34S, there are interfaces and barcode.
8.6.5 Valid SlotsAs the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.6.6 Technical SpecificationsThe technical specifications of the D34S cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.6.1 Version DescriptionThe functional version of the D34S board is N1.
8.6.2 Function and FeatureThe D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must beused with the PD3.
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8.6.3 Working Principle and Signal FlowThe D34S consists of the interface module, switch matrix module, and power supply module.
Figure 8-11 shows the block diagram for the functions of the D34S.
Figure 8-11 Block diagram for the functions of the D34S
E3/T3
E3/T3
PD3
+3.3 V+3.3 V Fuse
PD3
TSB8
TSB8
Interfacemodule
Swictchmatrix
module
Power
BackplaneCross-
connectboard
Powersupplymodule
Interface Module
The interface module receives and transmits the E3/T3 electrical signals.
Switch Matrix Module
In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD3 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.
8.6.4 Front PanelOn the front panel of the D34S, there are interfaces and barcode.
Appearance of the Front Panel
Figure 8-12 shows the appearance of the front panel of the D34S.
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Figure 8-12 Front panel of the D34S
D34S
D34S
OU
T4IN
4O
UT5
IN5
OU
T6IN
6O
UT1
IN1
OU
T2IN
2O
UT3
IN3
InterfacesThere are six pairs of electrical interfaces on the front panel of the D34S.
Table 8-12 lists the type and usage of interfaces on the D34S.
Table 8-12 Interfaces of the D34S
Interface InterfaceType
Usage
IN1–IN6 SMB Receive six channels (1–6) of E3/T3 electrical signals.
OUT1–OUT6 SMB Transmit six channels (1–6) of E3/T3 electrical signals.
8.6.5 Valid SlotsAs the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-13 lists the valid slots for the PD3 and corresponding slots for the D34S.
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Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN1500B subrack
Valid Slot for the PD3 Corresponding Slot for the D34S
Slot 12 Slot 14
Slot 13 Slot 16
8.6.6 Technical SpecificationsThe technical specifications of the D34S cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 8-14 lists the specifications of the electrical interfaces of the D34S.
Table 8-14 Specifications of the electrical interfaces of the D34S
Item Specification
Interface type 34368 kbit/s and 44736k bit/s
Code HDB3 (E3) and B3ZS (T3)
Output signal bit rate Compliant with ITU-T G.703
Allowed input frequencydeviation
Allowed input attenuation
Input jitter tolerance
Mechanical SpecificationsThe mechanical specifications of the D34S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the D34S in the switchingstate is 2 W and that of the D34S in the normal state is 0 W.
8.7 C34SThis section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.
8.7.1 Version Description
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The functional version of the C34S board is N1.
8.7.2 Function and FeatureThe C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must beused with the PL3.
8.7.3 Working Principle and Signal FlowThe C34S consists of the interface module, switch matrix module, and power supply module.
8.7.4 Front PanelOn the front panel of the C34S, there are interfaces and barcode.
8.7.5 Valid SlotsAs the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiXOSN 1500B subrack.
8.7.6 Technical SpecificationsThe technical specifications of the C34S cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.7.1 Version DescriptionThe functional version of the C34S board is N1.
8.7.2 Function and FeatureThe C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must beused with the PL3.
8.7.3 Working Principle and Signal FlowThe C34S consists of the interface module, switch matrix module, and power supply module.
Figure 8-13 shows the block diagram for the functions of the C34S.
Figure 8-13 Block diagram for the functions of the C34S
+3.3 Vbackeuppower
E3/T3
E3/T3
PL3
+3.3 V -48 V/-60 VFuse
Fuse
-48 V/-60 V
PL3
TSB8
TSB8
Interfacemodule
Cross-connectboard
Backplane
Powersupplymodule
Powersupplymodule
Swictchmatrix
module
Interface ModuleThe interface module receives and transmits the E3/T3 electrical signals.
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Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PL3 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.7.4 Front PanelOn the front panel of the C34S, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-14 shows the appearance of the front panel of the C34S.
Figure 8-14 Front panel of the C34S
C34S
C34S
OU
T1IN
1O
UT2
IN2
OU
T3IN
3
InterfacesThere are three pairs of electrical interfaces on the front panel of the C34S.
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Table 8-15 lists the type and usage of interfaces on the C34S.
Table 8-15 Interfaces of the C34S
Interface InterfaceType
Usage
IN1–IN3 SMB Receive the first three channels (1–3) of E3/T3 electricalsignals.
OUT1–OUT3 SMB Transmit the first three channels (1–3) of E3/T3 electricalsignals.
8.7.5 Valid SlotsAs the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiXOSN 1500B subrack.
Table 8-16 lists the valid slots for the PL3 and corresponding slots for the C34S.
Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN1500B subrack
Valid Slot for the PL3 Corresponding Slot for the C34S
Slot 12 Slot 14
Slot 13 Slot 16
8.7.6 Technical SpecificationsThe technical specifications of the C34S cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 8-17 lists the specifications of the electrical interfaces of the C34S.
Table 8-17 Specifications of the electrical interfaces of the C34S
Item Specification
Interface type 34368 kbit/s and 44736 kbit/s
Code HDB3 (E3) and B3ZS (T3)
Output signal bit rate Compliant with ITU-T G.703
Allowed input frequencydeviation
Allowed input attenuation
Input jitter tolerance
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Mechanical Specifications
The mechanical specifications of the C34S are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.3
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the C34S in the switchingstate is 2 W and that of the C34S in the normal state is 0 W.
8.8 EU04This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.
8.8.1 Version DescriptionThe functional version of the EU04 board is N1.
8.8.2 Function and FeatureThe EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must beused with the SEP.
8.8.3 Working Principle and Signal FlowThe EU04 consists of the interface module, switch matrix module, and power supply module.
8.8.4 Front PanelOn the front panel of the EU04, there are interfaces and barcode.
8.8.5 Valid SlotsAs the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.8.6 Technical SpecificationsThe technical specifications of the EU04 cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.8.1 Version DescriptionThe functional version of the EU04 board is N1.
8.8.2 Function and FeatureThe EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must beused with the SEP.
8.8.3 Working Principle and Signal FlowThe EU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1signals.
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Figure 8-15 Block diagram for the functions of the EU04
+3.3 Vbackeuppower
STM-1(e)
+3.3 V -48 V/-60 VFuse
Fuse
-48 V/-60 V
TSB8Interfacemodule
Cross-connectboard
Backplane
Powersupplymodule
Powersupplymodule
Swictchmatrix
module
STM-1(e)SEP
TSB8SEP
Interface ModuleThe interface module receives and transmits the STM-1 electrical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SEP board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.8.4 Front PanelOn the front panel of the EU04, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-16 shows the appearance of the front panel of the EU04.
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Figure 8-16 Front panel of the EU04
EU04
EU04
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
InterfacesThere are four pairs of electrical interfaces on the front panel of the EU04.
Table 8-18 lists the type and usage of interfaces on the EU04.
Table 8-18 Interfaces of the EU04
Interface InterfaceType
Usage
IN1–IN4 SMB Receive four (1–4) channels of electrical interfaces.
OUT1–OUT4 SMB Transmit four (1–4) channels of electrical interfaces.
8.8.5 Valid SlotsAs the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-19 lists the valid slots for the SEP and corresponding slots for the EU04.
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Table 8-19 Valid slots for the SEP and corresponding slots for the EU04
Valid Slot for the SEP Corresponding Slot for the EU04
Slot 12 Slot 14
Slot 13 Slot 16
8.8.6 Technical SpecificationsThe technical specifications of the EU04 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
Table 8-20 lists the specifications of the electrical interfaces of the EU04.
Table 8-20 Specifications of the electrical interfaces of the EU04
Item Specification
Interface Type 155520 kbit/s
Code CMI
Output signal bit rate Compliant with ITU-T G.703
Allowed input frequencydeviation
Allowed input attenuation
Mechanical Specifications
The mechanical specifications of the EU04 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EU04 is 6 W.
8.9 EU08This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.
8.9.1 Version DescriptionThe functional version of the EU08 board is N1.
8.9.2 Function and Feature
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The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must beused with the SEP.
8.9.3 Working Principle and Signal FlowThe EU08 consists of the interface module, switch matrix module, and power supply module.
8.9.4 Front PanelOn the front panel of the EU08, there are interfaces and barcode.
8.9.5 Valid SlotsAs the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.9.6 Technical SpecificationsThe technical specifications of the EU08 cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.9.1 Version DescriptionThe functional version of the EU08 board is N1.
8.9.2 Function and FeatureThe EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must beused with the SEP.
8.9.3 Working Principle and Signal FlowThe EU08 consists of the interface module, switch matrix module, and power supply module.
Figure 8-17 shows the block diagram for the functions of the EU08.
Figure 8-17 Block diagram for the functions of the EU08
+3.3 Vbackeuppower
STM-1(e)
+3.3 V
TSB8Interfacemodule
Cross-connectboard
Backplane
Powersupplymodule
Swictchmatrix
module
STM-1(e)SEP
TSB8SEP
Fuse
Interface ModuleThe interface module receives and transmits the STM-1 electrical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signals
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from the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SEP board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.9.4 Front PanelOn the front panel of the EU08, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-18 shows the appearance of the front panel of the EU08.
Figure 8-18 Front panel of the EU08
EU08
EU08
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
OU
T5IN
5O
UT6
IN6
OU
T7IN
7O
UT8
IN8
InterfacesThere are eight pairs of electrical interfaces on the front panel of the EU08.
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Table 8-21 lists the type and usage of interfaces on the EU08.
Table 8-21 Interfaces of the EU08
Interface InterfaceType
Usage
IN1–IN8 SMB Receive eight (1–8) channels of electrical interfaces.
OUT1–OUT8 SMB Transmit eight (1–8) channels of electrical interfaces.
8.9.5 Valid SlotsAs the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-22 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiXOSN 1500B.
NOTE
The OptiX OSN 1500A does not support the EU08 board.
Table 8-22 Valid slots for the SEP and corresponding slots for the EU08
Valid Slot for the SEP Corresponding Slot for the EU08
Slot 12 Slot 14
Slot 13 Slot 16
8.9.6 Technical SpecificationsThe technical specifications of the EU08 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 8-23 lists the specifications of the electrical interfaces of the EU08.
Table 8-23 Specifications of the electrical interfaces of the EU08
Item Specification
Interface type 155520 kbit/s
Code CMI
Output signal bit rate Compliant with ITU-T G.703
Allowed input frequency deviation
Allowed input attenuation
Input jitter tolerance
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Mechanical Specifications
The mechanical specifications of the EU08 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EU08 is 11 W.
8.10 OU08This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.
8.10.1 Version DescriptionThe OU08 has two versions, N1 and N2. The main difference between the two versions lies inthe connector type for optical interfaces and the pluggability of the optical modules.
8.10.2 Function and FeatureThe OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must beused with the SEP.
8.10.3 Working Principle and Signal FlowThe OU08 consists of the interface module and power supply module.
8.10.4 Front PanelOn the front panel of the OU08, there are interfaces and barcode.
8.10.5 Valid SlotsAs the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.10.6 Technical SpecificationsThe technical specifications of the OU08 cover the optical interface specifications, boarddimensions, weight and power consumption.
8.10.1 Version DescriptionThe OU08 has two versions, N1 and N2. The main difference between the two versions lies inthe connector type for optical interfaces and the pluggability of the optical modules.
Table 8-24 lists the details on the two versions of the OU08 board.
Table 8-24 Version description of the OU08
Item Specification
Functionalversion
The OU08 has two versions, N1 and N2.
Commonness The N1 and N2 versions share the same working principle.
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Item Specification
Difference The optical interface of the N1OU08 uses the LC connector. The opticalinterface of the N2OU08 uses the SC connector. The N1OU08 uses thepluggable optical module. The N2OU08 does not use the pluggableoptical module.
Replaceability None.
8.10.2 Function and FeatureThe OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must beused with the SEP.
8.10.3 Working Principle and Signal FlowThe OU08 consists of the interface module and power supply module.
Figure 8-19 shows the block diagram for the functions of the OU08.
Figure 8-19 Block diagram for the functions of the OU08
STM-1(o) SEP
+3.3 V+3.3 V Fuse
SEP
Backplane
Power
Interfacemodule
STM-1(o)
Powersupplymodule
Interface ModuleIn the receive direction, the interface module performs O/E convertion for the STM-1 signals,and transmits the signals to the SEP board.
In the transmit direction, the interface module performs the E/O convertion for the STM-1signals, and transmits the signals to the optical interface.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.10.4 Front PanelOn the front panel of the OU08, there are interfaces and barcode.
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Appearance of the Front PanelFigure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 andN2OU08 respectively.
Figure 8-20 Front panel of the N1OU08
OU08
OU08
OU
T4IN
4O
UT3IN
3O
UT2
IN2
OU
T1IN1
OU
T8IN
8O
UT7IN
7O
UT6IN
6O
UT5IN
5
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Figure 8-21 Front panel of the N2OU08
OU08
OU08
IN8
IN7
OU
T8O
UT7
OU
T6IN
6O
UT5
IN5
OU
T4IN
4O
UT3
IN3
OU
T2IN
2O
UT1
IN1
InterfacesThere are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08.
Table 8-25 lists the interface type and usage for the N1OU08. Table 8-26 lists the interface typeand usage for the N2OU08.
Table 8-25 Interfaces of the N1OU08
Interface InterfaceType
Usage
IN1–IN8 LC Receive eight (1–8) channels of STM-1 optical signals.
OUT1–OUT8 LC Transmit eight (1–8) channels of STM-1 optical signals.
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Table 8-26 Interfaces of the N2OU08
Interface InterfaceType
Usage
IN1–IN8 SC Receive eight (1–8) channels of STM-1 optical signals.
OUT1–OUT8 SC Transmit eight (1–8) channels of STM-1 optical signals.
8.10.5 Valid SlotsAs the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-27 lists the valid slots for the SEP and corresponding slots for the OU08.
Table 8-27 Valid slots for the SEP and corresponding slots for the OU08
Valid Slot for the SEP Corresponding Slot for the OU08
Slot 12 Slot 14
Slot 13 Slot 16
8.10.6 Technical SpecificationsThe technical specifications of the OU08 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 8-28 lists the specifications of the optical interfaces of the OU08.
Table 8-28 Specifications of the optical interfaces of the OU08
Item Specification
Nominal bit rate 155520 kbit/s
Line code NRZ
Optical interface type S-1.1
Working wavelength(nm)
N1OU08 (1260–1360)N2OU08 (1261–1360)
Optical source type MLM
Mean launched opticalpower (dBm)
–15 to –8
Receiver sensitivity(dBm)
–28
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Mechanical Specifications
The mechanical specifications of the OU08 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the OU08 is 6 W.
8.11 MU04This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of theversion, function, principle, front panel and specifications.
8.11.1 Version DescriptionThe functional version of the MU04 board is N1.
8.11.2 Function and FeatureThe MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 mustbe used with the SPQ4.
8.11.3 Working Principle and Signal FlowThe MU04 consists of the interface module, switch matrix module, and power supply module.
8.11.4 Front PanelOn the front panel of the MU04, there are interfaces and barcode.
8.11.5 Valid SlotsAs the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.11.6 Technical SpecificationsThe technical specifications of the MU04 cover the optical interface specifications, boarddimensions, weight and power consumption.
8.11.1 Version DescriptionThe functional version of the MU04 board is N1.
8.11.2 Function and FeatureThe MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 mustbe used with the SPQ4.
8.11.3 Working Principle and Signal FlowThe MU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-22 shows the block diagram for the functions of the MU04.
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Figure 8-22 Block diagram for the functions of the MU04
+3.3 Vbackeuppower
+3.3 V
TSB8Interfacemodule
Cross-connectboard
Backplane
Powersupplymodule
Swictchmatrix
module
E4/STM-1(e)SPQ4
TSB8
Fuse
E4/STM-1(e) SPQ4
Interface ModuleThe interface module receives and transmits the E4/STM-1 electrical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SPQ4 board. When the TPS protection is performed, theswitch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.11.4 Front PanelOn the front panel of the MU04, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-23 shows the appearance of the front panel of the MU04.
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Figure 8-23 Front panel of the MU04
MU04
MU04
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
InterfacesThere are four pairs of electrical interfaces on the front panel of the MU04.
Table 8-29 lists the type and usage of interfaces on the MU04.
Table 8-29 Interfaces of the MU04
Interface InterfaceType
Usage
IN1–IN4 SMB Receive four (1–4) channels of E4/STM-1 electricalinterfaces.
OUT1–OUT4 SMB Transmit four (1–4) channels of E4/STM-1 electricalinterfaces.
8.11.5 Valid SlotsAs the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-30 lists the valid slots for the SPQ4 and corresponding slots for the MU04.
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Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04
Valid Slot for the SPQ4 Corresponding Slot for the MU04
Slot 12 Slot 14
Slot 13 Slot 16
8.11.6 Technical SpecificationsThe technical specifications of the MU04 cover the optical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 8-31 lists the specifications of the electrical interfaces of the MU04.
Table 8-31 Specifications of the electrical interfaces of the MU04
Item Specification
Interface Type 139264 kbit/s and 155520 kbit/s
Code CMI
Output signal bit rate Compliant with ITU-T G.703
Allowed input frequency deviation
Allowed input attenuation
Mechanical SpecificationsThe mechanical specifications of the MU04 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the MU04 is 2 W.
8.12 TSB8This section describes the TSB8, an 8-channel optical interface switching board, in terms of theversion, function, principle, front panel and specifications.
8.12.1 Version DescriptionThe functional version of the TSB8 board is N1.
8.12.2 Function and FeatureThe TSB8, an eight-channel electrical interface switching board, is used to provide the TPSprotection.
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8.12.3 Working Principle and Signal FlowThe TSB8 consists of the switch matrix module and power supply module.
8.12.4 Front PanelOn the front panel of the TSB8, there is the barcode.
8.12.5 Valid SlotsWhen used with different processing boards and interface boards to realize the TPS protection,the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.
8.12.6 Technical SpecificationsThe technical specifications of the TSB8 cover the board dimensions, weight and powerconsumption.
8.12.1 Version DescriptionThe functional version of the TSB8 board is N1.
8.12.2 Function and FeatureThe TSB8, an eight-channel electrical interface switching board, is used to provide the TPSprotection.l When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.
l When used with the C34S, the TSB8 provides the TPS protection for the PL3.
l When used with the D34S, the TSB8 provides the TPS protection for the PD3.
l When used with the EU04, the TSB8 provides the TPS protection for the SEP1.
l When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1.
l When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.
8.12.3 Working Principle and Signal FlowThe TSB8 consists of the switch matrix module and power supply module.
Figure 8-24 shows the block diagram for the functions of the TSB8 when it processes one-channel signals.
Figure 8-24 Block diagram for the functions of the TSB8
Standbyprocessing
board
Interfaceboard 1
+3.3 V+3.3
V Fuse
BackplaneBackplaneCross-
connectboard
PowerPowermodule
Swictchmatrix
module
Interfaceboard 2Interfaceboard 3
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Switch Matrix Module
In the receive direction, the switch matrix module selects signals from one of the three interfaceboards according to the TPS protection control signals from the cross-connect board, and outputsthe signals to the backup processing board.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.
8.12.4 Front PanelOn the front panel of the TSB8, there is the barcode.
Appearance of the Front Panel
Figure 8-25 shows the appearance of the front panel of the TSB8.
Figure 8-25 Front panel of the TSB8
TSB8
TSB8
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8.12.5 Valid SlotsWhen used with different processing boards and interface boards to realize the TPS protection,the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.
Table 8-32 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04.
Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04
Valid Slot for the TSB8 Valid Slot for the SPQ4 Corresponding Slot forthe MU04
Slot 14 Slot 13 Slot 16
Table 8-33 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S.
Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S
Valid Slot for the TSB8 Valid Slot for the PD3 Corresponding Slot forthe D34S
Slot 14 Slot 13 Slot 16
Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04.
Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04
Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot forthe EU04
Slot 14 Slot 13 Slot 16
Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08.
Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08
Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot forthe EU08
Slot 14 Slot 13 Slot 16
NOTE
On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panelof the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface boardto realize the TPS protection, the SEP is displayed as the SEP on the T2000.
Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.
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Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8
Valid Slot for the TSB8 Valid Slot for the EFS0 Corresponding Slot forthe ETS8
Slot 14 Slot 13 Slot 16
Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S.
Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S
Valid Slot for the TSB8 Valid Slot for the PL3 Corresponding Slot forthe C34S
Slot 14 Slot 13 Slot 16
8.12.6 Technical SpecificationsThe technical specifications of the TSB8 cover the board dimensions, weight and powerconsumption.
Mechanical SpecificationsThe mechanical specifications of the TSB8 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.3
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the TSB8 in theswitching state is 5 W and that of the TSB8 in the normal state is 0 W.
8.13 EFF8This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of theversion, function, principle, front panel and specifications.
8.13.1 Version DescriptionThe functional version of the EFF8 board is N1.
8.13.2 Function and FeatureThe EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 mustbe used with the Ethernet processing board.
8.13.3 Working Principle and Signal FlowThe EFF8 consists of the interface module, switch matrix module, and power supply module.
8.13.4 Front PanelOn the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety classlabel.
8.13.5 Valid Slots
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When used with different Ethernet processing boards, the EFF8 can be housed in different slots.
8.13.6 Technical SpecificationsThe technical specifications of the EFF8 cover the optical interface specifications, boarddimensions, weight and power consumption.
8.13.1 Version DescriptionThe functional version of the EFF8 board is N1.
8.13.2 Function and FeatureThe EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 mustbe used with the Ethernet processing board.
8.13.3 Working Principle and Signal FlowThe EFF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-26 shows the block diagram for the functions of the EFF8 when it processes 1 x 100MEthernet signals.
Figure 8-26 Block diagram for the functions of the EFF8
EFT8/ EFS0/EMS4/EMR0
Backplane
+3.3 V Backup Power+3.3 V Fuse
EFT8/EFS0/EMS4/EMR0
100M
100M
moduleInterface
Powermodule
Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernetsignals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernetsignals, and transmits the signals to the optical interface.
Power Supply Module
The power supply module provides the DC voltages required by the modules of the board.
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8.13.4 Front PanelOn the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front Panel
Figure 8-27 shows the appearance of the front panel of the EFF8.
Figure 8-27 Front panel of the EFF8
EFF8
EFF8
LINKACT
12345678
OU
T1IN
1O
UT2
IN2
OU
T3IN
3O
UT4
IN4
OU
T5IN
5O
UT6
IN6
OU
T7IN
7O
UT8
IN8
CLASS 1LASER
PRODUCT
Indicators
For indication of indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are eight pairs of optical interfaces on the front panel of the EFF8.
Table 8-38 lists the type and usage of interfaces on the EFF8.
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Table 8-38 Interfaces of the EFF8
Interface InterfaceType
Usage
IN1–IN8 LC Receives eight (1–8) channels of Ethernet optical signals.
OUT1 – OUT8 LC Transmits eight (1–8) channels of Ethernet opticalsignals.
8.13.5 Valid SlotsWhen used with different Ethernet processing boards, the EFF8 can be housed in different slots.
The slots valid for the EFF8 are as follows:
l As the interface board for the EFT8, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EFS0, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EMS4, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EMR0, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
Table 8-39 lists the valid slots for the EFT8 and corresponding slots for the EFF8.
Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8
Valid Slot for the EFT8 Corresponding Slot for the EFF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
Table 8-40 lists the valid slots for the EFS0 and corresponding slots for the EFF8.
Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8
Valid Slot for the EFS0 Corresponding Slot for the EFF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
Table 8-41 lists the valid slots for the EMS4 and corresponding slots for the EFF8.
Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8
Valid Slot for the EMS4 Corresponding Slot for the EFF8
Slot 12 Slots 14 and 15
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Valid Slot for the EMS4 Corresponding Slot for the EFF8
Slot 13 Slots 16 and 17
Table 8-42 lists the valid slots for the EMR0 and corresponding slots for the EFF8.
Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8
Valid Slot for the EMR0 Corresponding Slot for the EFF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
8.13.6 Technical SpecificationsThe technical specifications of the EFF8 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 8-43 lists the specifications of the optical interfaces of the EFF8.
Table 8-43 Specifications of the optical interfaces of the EFF8
Item Specification
Nominal bit rate 10 Mbit/s or 100 Mbit/s
Line code Manchester encoding signal (10M) or MLT-3 encoding signal(100M)
Optical interface type 100Base-FX
Working wavelength(nm)
100Base-FX (15 km): 1261 to 1360
100Base-FX (2 km): 1270 to 1380
Optical source type MLM
Mean launchedoptical power (dBm)
100Base-FX (15 km): –15 to –8
100Base-FX (2 km): –19 to –14
Receiver sensitivity(dBm)
100Base-FX (15 km): –28
100Base-FX (2 km): –30
Min. overload (dBm) 100Base-FX (15 km): –7
100Base-FX (2 km): –14
Min. extinction ratio(dB)
10
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Mechanical Specifications
The mechanical specifications of the EFF8 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.4
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the EFF8 is 6 W.
8.14 ETF8This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms ofthe version, function, principle, front panel and specifications.
8.14.1 Version DescriptionThe functional version of the ETF8 board is N1.
8.14.2 Function and FeatureThe ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8must be used with the Ethernet processing board.
8.14.3 Working Principle and Signal FlowThe ETF8 consists of the interface module, switch matrix module, and power supply module.
8.14.4 Front PanelOn the front panel of the ETF8, there are interfaces and barcode.
8.14.5 Valid SlotsWhen used with different Ethernet processing boards, the ETF8 can be housed in different slots.
8.14.6 Technical SpecificationsThe technical specifications of the ETF8 cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.14.1 Version DescriptionThe functional version of the ETF8 board is N1.
8.14.2 Function and FeatureThe ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8must be used with the Ethernet processing board.
8.14.3 Working Principle and Signal FlowThe ETF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-28 shows the block diagram for the functions of the ETF8 when it processes 1 x 100MEthernet signals.
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Figure 8-28 Block diagram for the functions of the ETF8
100M EFT8/ EFS0/EMS4/EMR0
+3.3 V+3.3 V Fuse
EFT8/EFS0/EMS4/EMR0100M
Backplane
moduleInterface
Powermodule
Power
Interface ModuleIn the receive direction, the interface module performs the O/E convertion for the Ethernetsignals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernetsignals, and transmits the signals to the optical interface.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.14.4 Front PanelOn the front panel of the ETF8, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-29 shows the appearance of the front panel of the ETF8.
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Figure 8-29 Front panel of the ETF8
ETF8
ETF8
FE1FE2
FE3FE4
FE5FE6
FE7FE8
InterfacesThere are eight electrical interfaces on the front panel of the ETF8.
Table 8-44 lists the type and usage of interfaces on the ETF8.
Table 8-44 Interfaces of the ETF8
Interface InterfaceType
Usage
FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electricalsignals.
Table 8-45 lists the pins of the RJ-45 connector of the ETF8.
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Table 8-45 Pins of the RJ-45 connector of the ETF8
Front View Pin Specification
8 7 6 5 4 3 2 1
1 Transmittingpositive
2 Transmittingnegative
3 Receiving positive
4 Grounding
5 Grounding
6 Receivingnegative
7 Grounding
8 Grounding
8.14.5 Valid SlotsWhen used with different Ethernet processing boards, the ETF8 can be housed in different slots.
The slots valid for the ETF8 are as follows:
l As the interface board for the EFT8, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EFS0, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EMS4, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
l As the interface board for the EMR0, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.
Table 8-46 lists the valid slots for the EFT8 and corresponding slots for the ETF8.
Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8
Valid Slot for the EFT8 Corresponding Slot for the ETF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
Table 8-47 lists the valid slots for the EFS0 and corresponding slots for the ETF8.
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Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8
Valid Slot for the EFS0 Corresponding Slot for the ETF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
Table 8-48 lists the valid slots for the EMS4 and corresponding slots for the ETF8.
Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8
Valid Slot for the EMS4 Corresponding Slot for the ETF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
Table 8-49 lists the valid slots for the EMR0 and corresponding slots for the ETF8.
Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8
Valid Slot for the EMR0 Corresponding Slot for the ETF8
Slot 12 Slots 14 and 15
Slot 13 Slots 16 and 17
8.14.6 Technical SpecificationsThe technical specifications of the ETF8 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface SpecificationsTable 8-50 lists the specifications of the electrical interfaces of the ETF8.
Table 8-50 Specifications of the electrical interfaces of the ETF8
Item Specification
Rate 10 Mbit/s or 100 Mbit/s
Code Manchester encoding signal (10M) or MLT-3 encoding signal(100M)
Interface standard Compliant with IEEE 802.3u
Mechanical SpecificationsThe mechanical specifications of the ETF8 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
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l Weight (kg): 0.4
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the ETF8 is 2 W.
8.15 ETS8This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,in terms of the version, function, principle, front panel and specifications.
8.15.1 Version DescriptionThe functional version of the ETS8 board is N1.
8.15.2 Function and FeatureThe ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, andthe ETS8 must be used with the EFS0.
8.15.3 Working Principle and Signal FlowThe ETS8 consists of the interface module, switch matrix module, and power supply module.
8.15.4 Front PanelOn the front panel of the ETS8, there are interfaces and barcode.
8.15.5 Valid SlotsAs the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
8.15.6 Technical SpecificationsThe technical specifications of the ETS8 cover the electrical interface specifications, boarddimensions, weight and power consumption.
8.15.1 Version DescriptionThe functional version of the ETS8 board is N1.
8.15.2 Function and FeatureThe ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, andthe ETS8 must be used with the EFS0.
8.15.3 Working Principle and Signal FlowThe ETS8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-30 shows the block diagram for the functions of the ETS8 when it processes 1 x 100MEthernet signals.
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Figure 8-30 Block diagram for the functions of the ETS8
+3.3 Vbackeuppower
+3.3 V
TSB8Interfacemodule
Cross-connectboard
Backplane
Powersupplymodule
Swictchmatrix
module
100MEFS0
TSB8
Fuse
100M EFS0
Interface ModuleThe interface module receives and transmits the Ethernet optical signals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the EFS0 board. When the TPS protection is performed, theswitch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.15.4 Front PanelOn the front panel of the ETS8, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-31 shows the appearance of the front panel of the ETS8.
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Figure 8-31 Front panel of the ETS8
ETS8
ETS8
FE1FE2
FE3FE4
FE5FE6
FE7FE8
InterfacesThere are eight electrical interfaces on the front panel of the ETS8.
Table 8-51 lists the type and usage of interfaces on the ETS8.
Table 8-51 Interfaces of the ETS8
Interface InterfaceType
Usage
FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electricalsignals.
Table 8-52 lists the pins of the RJ-45 connector of the ETS8.
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Table 8-52 Pins of the RJ-45 connector of the ETS8
Front View Pin Specification
8 7 6 5 4 3 2 1
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Grounding
5 Grounding
6 Receiving negative
7 Grounding
8 Grounding
8.15.5 Valid SlotsAs the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.
Table 8-53 lists the valid slots for the EFS0 and corresponding slots for the ETS8.
Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8
Valid Slot for the EFS0 Corresponding Slot for the ETS8
Slot 12 Slot 14
Slot 13 Slot 16
8.15.6 Technical SpecificationsThe technical specifications of the ETS8 cover the electrical interface specifications, boarddimensions, weight and power consumption.
Electrical Interface Specifications
Table 8-54 lists the specifications of the electrical interfaces of the ETS8.
Table 8-54 Specifications of the electrical interfaces of the ETS8
Item Specification
Rate 10 Mbit/s or 100 Mbit/s
Code Manchester encoding signal (10M) or MLT-3 encodingsignal (100M)
Interface standard Compliant with IEEE 802.3u
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Mechanical Specifications
The mechanical specifications of the ETS8 are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 0.37
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the ETS8 in the switchingstate is 3 W and that of the ETS8 in the normal state is 0 W.
8.16 DM12This section describes the DM12, a DDN interface board, in terms of the version, function,principle, front panel and specifications.
8.16.1 Version DescriptionThe functional version of the DM12 board is N1.
8.16.2 Function and FeatureThe DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1electrical signals, and the DM12 must be used with the DX1.
8.16.3 Working Principle and Signal FlowThe DM12 consists of the interface module, switch matrix module, and power supply module.
8.16.4 Front PanelOn the front panel of the DM12, there are interfaces and barcode.
8.16.5 Valid SlotsAs the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiXOSN 1500B subrack.
8.16.6 Technical SpecificationsThe technical specifications of the DM12 cover the board dimensions, weight and powerconsumption.
8.16.1 Version DescriptionThe functional version of the DM12 board is N1.
8.16.2 Function and FeatureThe DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1electrical signals, and the DM12 must be used with the DX1.
8.16.3 Working Principle and Signal FlowThe DM12 consists of the interface module, switch matrix module, and power supply module.
Figure 8-32 shows the block diagram for the functions of the DM12 when it processes onechannel of N x 64 kbit/s or framed E1 electrical signals.
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Figure 8-32 Block diagram for the functions of the DM12
Nx64kbit/s /Frame E1
DX1
+3.3 V+3.3 V Fuse
DX1
Nx64kbit/s /Frame E1
Interfacemodule
Swictchmatrix
module
Power
Cross-connectboard
Backplane
Powersupplymodule
Interface ModuleThe interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electricalsignals.
Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the DX1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the DX1 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.
Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.
8.16.4 Front PanelOn the front panel of the DM12, there are interfaces and barcode.
Appearance of the Front PanelFigure 8-33 shows the appearance of the front panel of the DM12.
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Figure 8-33 Front panel of the DM12
DM12
DM12
DD
N1
DD
N2
DD
N3
DD
N4
E1(1-8)
InterfacesOn the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-55 lists thespecifications of the interfaces.
Table 8-55 Interfaces on the front panel of the DM12
Interface InterfaceType
Usage
E1 (1–8) DB44 Access 8 x framed E1 signals.
DDN1–DDN4 DB28 Access four channels of N x 64 kbit/s signals.
Table 8-56 lists the pins of the DB44 interfaces.
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Table 8-56 Pins of the DB44 interfaces of the DM12
Front View Pin Specification Pin Specification
1
44
30 T1 to transmitthe first channelof signals.
8 T8 to transmit theeighth channel ofsignals.15 7
29 T2 to transmitthe secondchannel ofsignals.
36 R3 to receive thethird channel ofsignals.14 21
28 T3 to transmitthe third channelof signals.
35 R4 to receive thefourth channel ofsiganls.13 20
27 T4 to transmitthe fourthchannel ofsignals.
34 R5 to receive thefifth channel ofsignals.12 19
26 T5 to transmitthe fifth channelof signals.
33 R6 to receive thesixth channel ofsignals.11 18
25 T6 to transmitthe sixth channelof signals.
32 R7 to receive theseventh channel ofsignals.10 17
24 T7 to transmitthe seventhchannel ofsignals.
31 R8 to receive theeighth channel ofsignals.9 16
38 R1 to receive thefirst channel ofsignals.
44–39, 6–1 Grounding
23
37 R2 to receive thesecond channelof signals.22
Table 8-57 lists the pins of the DB28 interfaces.
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Table 8-57 Pins of the DB28 interfaces of the DM12
Front View Pin Specification Pin Specification
1
28
1 Transmits datasignals.
19 Receives data signals.
2 20
3 Transmits theclock signals.
21 Grounds.
4 22 Loopbacks thecontrol signals.
11 Detects thecarrier.
23 Permits thetransmission.
12 24
13 Requests fortransmission.
25 Prepares theterminatingequipment.14 26
15 Transmits theclock of theexternalequipment.
27 Prepares the terminalequipment.
16 28
17 Receives theclock signals.
- -
18
8.16.5 Valid SlotsAs the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiXOSN 1500B subrack.
Table 8-58 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channelsof N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only fourchannels of N x 64 kbit/s signals.
Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12
Valid Slot for the DX1 Corresponding Slot for the DM12
Slot 12 Slots 1 and 2
Slot 13 Slots 3 and 4
8.16.6 Technical SpecificationsThe technical specifications of the DM12 cover the board dimensions, weight and powerconsumption.
Mechanical SpecificationsThe mechanical specifications of the DM12 are as follows:
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l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the DM12 in theswitching state is 8 W and that of the DM12 in the normal state is 0 W.
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9 Cross-Connect and System Control Boards
About This Chapter
The chapter describes the integrated boards of the cross-connect, SCC and line units at differentrates.
9.1 CXL1This section describes the CXL1, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
9.2 CXL4This section describes the CXL4, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
9.3 CXL16This section describes the CXL16, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
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9.1 CXL1This section describes the CXL1, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
9.1.1 Version DescriptionThe functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.
9.1.2 Function and FeatureThe CXL1 is used to process SDH signals, control communication, groom services, and to inputand output the clock.
9.1.3 Working Principle and Signal FlowThe CXL1 consists of the SDH overhead processing module, RST, MST and so on.
9.1.4 Front PanelOn the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety classlabel.
9.1.5 Valid SlotsThe CXL1 can be housed in any of slots 4–5 in the subrack.
9.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL1 indicates the optical interface type.
9.1.7 Board Configuration ReferenceThe physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL1.
9.1.8 Technical SpecificationsThe technical specifications of the CXL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
9.1.1 Version DescriptionThe functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.
9.1.2 Function and FeatureThe CXL1 is used to process SDH signals, control communication, groom services, and to inputand output the clock.
SDH Processing UnitTable 9-1 lists the function and feature of the SDH processing unit of the CXL1.
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Table 9-1 Function and feature of the SDH processing unit of the CXL1
Function andFeature
CXL1
Basic function Transmits and receives 1 x STM-1 optical signals.
Specification of theoptical interface
Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, andVe-1.2 types.
Specification of theoptical module
l Supports detection and query of the information on the opticalmodule.
l Supports the function of setting the on/off state of the laser and theALS function.
Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.
Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.
l Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.
Maintenance feature l Supports inloop and outloop for optical interfaces.
l Supports the warm reset and cold reset. The warm reset does notaffect services.
l Supports the function of querying the manufacturing informationof the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affectingservices.
SCC UnitTable 9-2 lists the function and feature of the SCC unit of the CXL1.
Table 9-2 Function and feature of the SCC unit of the CXL1
Function andFeature
CXL1
Basic function Configures and monitors services, monitors the service performance,and collects performance events and alarm information.
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Function andFeature
CXL1
Specification of theoptical interface
l Provides 10M/100M compatible Ethernet NMS interface.
l Provides the F&f interface to manage the COA, and the F&finterface is present on the auxiliary interface board.
l Provides one 10M/100M Ethernet interface, which is used forinter-board communication.
l Provides one 10M Ethernet interface, which is used forcommunication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on the auxiliaryinterface board to connect to the PC or workstation. Supports theremote maintenance by using the RS232 DCE modem.
DCC processingcapability
Processes 40-channel DCC.
Fan alarmmanagement
Manages fan alarms.
PIU management Provides the in-service check function for the PIU board, and thefailure check function for the lightning protection module of the PIU.
Protection scheme Supports 1+1 hot backup for the SCC unit.
Cross-Connect UnitTable 9-3 lists the function and feature of the cross-connect unit of the CXL1.
Table 9-3 Function and feature of the cross-connect unit of the CXL1
Function andFeature
CXL1
Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4level, and 20 Gbit/s non-blocking full cross-connection at the VC-12or VC-3 level.
Fast emergencychannel
Provides two 4M HDLC fast emergency channels, which are used forthe MSP and SNCP protection switching.
Service processing l Dynamically grooms services.
l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports concatenation services at the VC-4-4c, VC-4-8c, andVC-4-16c levels.
Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connectunit.
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Clock UnitTable 9-4 lists the function and feature of the clock unit of the CXL1.
Table 9-4 Function and feature of the clock unit of the CXL1
Function andFeature
CXL1
Basic function Provides standard system synchronization clock.
Other function Supports the extraction, insertion and management of the SSM andclock ID.
Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, andselects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.
9.1.3 Working Principle and Signal FlowThe CXL1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-1 shows the block diagram for the functions of the CXL1.
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Figure 9-1 Block diagram for the functions of the CXL1
STM-1DEMUX
MUX
Cross-connectunit B
16x155Mbit/s data
16x155Mbit/s data
SDH overhead processing module
K1/K2insertion/extration SCC unit
Per
form
ance
repo
rt
Lase
r shu
t dow
n
high speed bus
RST MST MSA HPTO/E
O/E
-48 V/-60V
Fuse
DC/DCconverter
Cross-connectunit A
high speed bus
155 MHz
XC Cross Connect
(HPC)
Another CXL
ETH interface
OAM interface
Boot ROM NVRAMRAMFLASH
K1/K2 bytesprocess
Other unit
Communication andcontrol module
Laser control
Another CXLunit
Anotherconnect unit
DCC
DCCK1/K2 bytes
XC Cross Connect
(LPC)
155MHz PLL
high speed bus
+1.6V
+1.8V
+1.2V
DCCprocess
STM-1
Pow
er m
onito
r
Master and slaver board comunication
ETH channels comunication
-48 V/-60V
AUX
AUX
+5V
Line unit
F&f interface
Phone interface
S1-S4 interfaceEOW
Time &synchronizaton
(SETS)
SETG
38MHzOSC
Line units
Tributary units
Frame header
T1
T2
T3
T0
AUX
T0 (reference clock)
T4(Clock external output)
PIU
Service units
Service units
+3.3 V DC/DCconverter
high speed bus
The function modules are described as follows:
Synchronous Timing Unit
The synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronoussource (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
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l Timing signal (T1) from STM-N
l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)
The clock module outputs:
l T0, system clock (38 MHz)
l T4, external timing (2 Mbit/s or 2 MHz) output by line
O/E Conversion Modulel In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.
MUX/DEMUX Modulel In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received fromthe SDH overhead processing module into high rate electrical signals.
SDH Overhead Processing Module
It includes RST, MST, MSA and HPT, provides inloop and outloop function.
RSTl In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.
l In transmitting direction, it performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.
MSTl In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.
l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDIand MS_AIS insertion.
l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AISgeneration.
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HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit alsoinitializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be usedas the MODEM port and thus can be configured as a serial port to connect to MODEM portin running state.
l F&f interface, which provides F&f interface to manage COA. This serial port multiplexeswith the commissioning serial port and is the commissioning serial port in BIOS state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the activeand the standby CXL unit.
Cross-connect ModuleThe cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCPswitching
l Higher and lower order cross-connect module, which performs the functions of higher andlower order cross-connect units. This module consists of higher order cross-connect unitand lower order cross-connect unit.
Figure 9-2 illustrates the block diagram of higher and lower order cross-connect modules.
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Figure 9-2 Block diagram of higher and lower order cross-connect modules
Data DataInputinterface
VC_DATA_FIFO RX_TOP
high speed bus
Lower orderconnection
XC_TOP
Higher orderconnection
XCconnection
Ouputinterface
TX_TOP
high speed bus
The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higherorder services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower orderservices.
Other Functionsl Responses to and processes k bytes
l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms
DC/DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.
9.1.4 Front PanelOn the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 9-3 shows the front panel of the CXL1.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 9 Cross-Connect and System Control Boards
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Figure 9-3 Front panel of the CXL1
CXL1
CXL1STATACTXACTCPROGSRVXSRVLSYNCALMC
CLASS 1LASER
PRODUCT
RESET
ALM CUT
OU
TIN
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is greenwhen lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellowwhen lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow whenlit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
On the front panel of the CXL1, there are one optical interface and two switches. Table 9-5 liststhe type and usage of the optical interface and switches on the CXL1.
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Table 9-5 Optical interface and switches on the CXL1
Interface InterfaceType
Usage
IN LC Receives optical signals. The pluggable optical module isused for easy maintenance.
OUT LC Transmits optical signals. The pluggable optical module isused for easy maintenance.
RESET Warm resetswitch
Press the switch to reset the SCC unit.
ALM CUT Alarm cutswitch
Press the switch to mute the alarm. Press the switch for threeseconds to mute the alarm permanently. Press the switchagain for three seconds to resume the alarm sound.
9.1.5 Valid SlotsThe CXL1 can be housed in any of slots 4–5 in the subrack.
9.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL1 indicates the optical interface type.
Table 9-6 lists the relation between the board feature code and optical interface type for theCXL1.
Table 9-6 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSQ2CXL110 orSSQ1CXL110
10 S-1.1 (LC)
SSQ2CXL111 orSSQ1CXL111
11 L-1.1 (LC)
SSQ2CXL112 orSSQ1CXL112
12 L-1.2 (LC)
SSQ2CXL113 orSSQ1CXL113
13 Ve-1.2 (LC)
SSQ2CXL114 orSSQ1CXL114
14 I-1 (LC)
9.1.7 Board Configuration ReferenceThe physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL1.
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Displayed SlotThe CXL1 is housed in one slot in the subrack.
The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC.
Table 9-7 lists the logical slots displayed on the T2000.
Table 9-7 Logical slots displayed on the T2000 for the CXL1
Board Logical Board Logical Slot
CXL1 Q1SL1 Slots 4–5
ECXL Slots 80–81
GSCC Slots 82–83
Board Parametersl J1 byte
l C2 byte
l Clock parameters
For details on the parameters, refer to F Board Configuration Reference.
9.1.8 Technical SpecificationsThe technical specifications of the CXL1 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 9-8 lists the specifications of the optical interfaces of the CXL1.
Table 9-8 Specifications of the optical interfaces of the CXL1
Item Specification
Nominal bit rate 155520 kbit/s
Line code NRZ
Optical interfacetype
I-1 S-1.1 L-1.1 L-1.2 Ve-1.2
Workingwavelength (nm)
1260 to1360
1261 to1360
1263 to1360
1480 to1580
1480 to1580
Optical sourcetype
MLM, LED MLM MLM, SLM SLM SLM
Mean launchedoptical power(dBm)
–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0
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Item Specification
Receiversensitivity (dBm)
–23 –28 –34 –34 –34
Min. overload(dBm)
–8 –8 –10 –10 –10
Min. extinctionratio (dB)
8.2 8.2 10 10 10
Cross-Connect CapacityThe cross-connect capacity of the CXL1 is as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s
Clock Access CapabilityThe clock access capability of the CXL1 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the CXL1 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the CXL1 is 40 W.
9.2 CXL4This section describes the CXL4, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
9.2.1 Version DescriptionThe functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4.
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9.2.2 Function and FeatureThe CXL4 is used to process SDH signals, control communication, groom services, and to inputand output the clock.
9.2.3 Working Principle and Signal FlowThe CXL4 consists of the SDH overhead processing module, RST, MST and so on.
9.2.4 Front PanelOn the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety classlabel.
9.2.5 Valid SlotsThe CXL4 can be housed in any of slots 4–5 in the subrack.
9.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL4 indicates the optical interface type.
9.2.7 Board Configuration ReferenceThe physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL4.
9.2.8 Technical SpecificationsThe technical specifications of the CXL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
9.2.1 Version DescriptionThe functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4.
9.2.2 Function and FeatureThe CXL4 is used to process SDH signals, control communication, groom services, and to inputand output the clock.
SDH Processing Unit
Table 9-9 lists the function and feature of the SDH processing unit of the CXL4.
Table 9-9 Function and feature of the SDH processing unit of the CXL4
Function andFeature
CXL4
Basic function Transmits and receives 1 x STM-4 optical signals.
Specifications ofoptical interfaces
Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, andVe-4.2 types.
Specifications of theoptical module
l Supports detection and query of the information on the opticalmodule.
l Supports the function of setting the on/off state of the laser and theALS function.
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Function andFeature
CXL4
Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4cconcatenation services.
Overhead processing l Supports the processing of the SOH bytes of the STM-4 signals.
l Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0/J1/C2 bytes.
Alarms andperformance events
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
Protection schemes Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.
Maintenancefeatures
l Supports inloop and outloop for optical interfaces.
l Supports warm reset and cold reset. The warm reset does not affectservices.
l Supports the function of querying the manufacturing informationof the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affectingservices.
SCC UnitTable 9-10 lists the function and feature of the SCC unit of the CXL4
Table 9-10 Function and feature of the SCC unit of the CXL4
Function andFeature
CXL4
Basic function Configures and monitors services, monitors the service performance,and collencts performance events and alarm information.
Specification of theoptical interface
l Provides 10M/100M compatible Ethernet NMS interface.
l Provides the F&f interface to manage the COA, and the F&finterface is on the auxiliary interface board.
l Provides one 10M/100M Ethernet interface, which is used forinter-board communication.
l Provides one 10M Ethernet interface, which is used forcommunication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on on theauxiliary interface board to connect to the PC or workstation.Supports the remote maintenance by using the RS232 DCEmodem.
DCC processingcapability
Processes 40-channel DCC.
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Function andFeature
CXL4
Fan alarmmanagement
Manages fan alarms.
PIU management Provides the in-service check function for the PIU board, and thefailure check function for the lightning protection module of the PIU.
Protection scheme Supports 1+1 hot backup for the SCC unit.
Cross-Connect Unit
Table 9-11 lists the function and feature of the cross-connect unit of the CXL4.
Table 9-11 Function and feature of the cross-connect unit of the CXL4
Function andFeature
CXL4
Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4level, and 20 Gbit/s non-blocking full cross-connection at the VC-12or VC-3 level.
Fast emergencychannel
Provides two 4M HDLC fast emergency channels, which are used forthe MSP and SNCP protection switching.
Service processing l Dynamically grooms services.
l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports concatenation services at the VC-4-4c level.
Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connectunit.
Clock Unit
Table 9-12 lists the function and feature of the clock unit of the CXL4.
Table 9-12 Function and feature of the clock unit of the CXL4
Function andFeature
CXL4
Basic function Provides standard system synchronization clock.
Other function Supports the extraction, insertion and management of the SSM andclock ID.
Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, andselects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.
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9.2.3 Working Principle and Signal FlowThe CXL4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-4 shows the block diagram for the functions of the CXL4.
Figure 9-4 Block diagram for the functions of the CXL4
STM-4DEMUX
MUX
Cross-connectunit B
16x155Mbit/s data
16x155Mbit/s data
SDH overhead processing module
K1/K2insertion/extration SCC unit
Per
form
ance
repo
rt
Lase
r shu
t dow
n
high speed bus
RST MST MSA HPTO/E
O/E
-48 V/-60V
Fuse
DC/DCconverter
Cross-connectunit A
high speed bus
155 MHz
XC Cross Connect
(HPC)
Another CXL
ETH interface
OAM interface
Boot ROM NVRAMRAMFLASH
K1/K2 bytesprocess
Other unit
Communication andcontrol module
Laser control
Another CXLunit
Anotherconnect unit
DCC
DCCK1/K2 bytes
XC Cross Connect
(LPC)
155MHz PLL
high speed bus
+1.6V
+1.8V
+1.2V
DCCprocess
STM-4
Pow
er m
onito
r
Master and slaver board comunication
ETH channels comunication
-48 V/-60V
AUX
AUX
+5V
Line unit
F&f interface
Phone interface
S1-S4 interfaceEOW
Time &synchronizaton
(SETS)
SETG
38MHzOSC
Line units
Tributary units
Frame header
T1
T2
T3
T0
AUX
T0 (reference clock)
T4(Clock external output)
PIU
Service units
Service units
+3.3 V DC/DCconverter
high speed bus
The function modules are described as follows:
Synchronous Timing UnitThe synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
l Timing signal (T1) from STM-N
l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)
The clock module outputs:
l T0, system clock (38 MHz)
l T4, external timing (2 Mbit/s or 2 MHz) output by line
O/E Conversion Modulel In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.
MUX/DEMUX Modulel In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.l In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.
SDH Overhead Processing ModuleIt includes RST, MST, MSA and HPT, provides inloop and outloop function.
RSTl In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In transmitting direction, it performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.
MSTl In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI
and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.
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l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AISgeneration.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit alsoinitializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be usedas the MODEM port and thus can be configured as a serial port to connect to MODEM portin running state.
l F&f interface, which provides F&f interface to manage COA. This serial port multiplexeswith the commissioning serial port and is the commissioning serial port in BIOS state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the activeand the standby CXL unit.
Cross-connect ModuleThe cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCPswitching
l Higher and lower order cross-connect module, which performs the functions of higher andlower order cross-connect units. This module consists of higher order cross-connect unitand lower order cross-connect unit.
Figure 9-5 illustrates the block diagram of higher and lower order cross-connect modules.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 9 Cross-Connect and System Control Boards
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Figure 9-5 Block diagram of higher and lower order cross-connect modules
Data DataInputinterface
VC_DATA_FIFO RX_TOP
high speed bus
Lower orderconnection
XC_TOP
Higher orderconnection
XCconnection
Ouputinterface
TX_TOP
high speed bus
The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higherorder services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower orderservices.
Other Functionsl Responses to and processes k bytes
l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms
DC/DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.
9.2.4 Front PanelOn the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 9-6 shows the front panel of the CXL4.
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Figure 9-6 Front panel of the CXL4
CXL4
CXL4STATACTXACTCPROGSRVXSRVLSYNCALMC
CLASS 1LASER
PRODUCT
RESET
ALM CUT
OU
TIN
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is greenwhen lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellowwhen lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow whenlit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesOn the front panel of the CXL4, there are one optical interface and two switches. Table 9-13lists the type and usage of the optical interface and switches on the CXL4.
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Table 9-13 Optical interface and switches on the CXL4
Interface InterfaceType
Usage
IN LC Receives optical signals. The pluggable optical module isused for easy maintenance.
OUT LC Transmits optical signals. The pluggable optical module isused for easy maintenance.
RESET Warm resetswitch
Press the switch to reset the SCC unit.
ALM CUT Alarm cutswitch
Press the switch to mute the alarm. Press the switch for threeseconds to mute the alarm permanently. Press the switchagain for three seconds to resume the alarm sound.
9.2.5 Valid SlotsThe CXL4 can be housed in any of slots 4–5 in the subrack.
9.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL4 indicates the optical interface type.
Table 9-14 lists the relation between the board feature code and optical interface type for theCXL4.
Table 9-14 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSQ2CXL410 orSSQ1CXL410
10 S-4.1 (LC)
SSQ2CXL411 orSSQ1CXL411
11 L-4.1 (LC)
SSQ2CXL412 orSSQ1CXL412
12 L-4.2 (LC)
SSQ2CXL413 orSSQ1CXL413
13 Ve-4.2 (LC)
SSQ2CXL414 orSSQ1CXL414
14 I-4 (LC)
9.2.7 Board Configuration ReferenceThe physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL4.
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Displayed SlotThe CXL4 is housed in one slot in the subrack.
The logical boards for the CXL4 are the Q1SL4, EXCL and GSCC.
Table 9-15 lists the logical slots displayed on the T2000.
Table 9-15 Logical slots displayed on the T2000 for the CXL4
Board Logical Board Logical Slot
CXL4 Q1SL4 Slots 4–5
ECXL Slots 80–81
GSCC Slots 82–83
Board Parametersl J1 byte
l C2 byte
l Clock parameters
For details on the parameters, refer to F Board Configuration Reference.
9.2.8 Technical SpecificationsThe technical specifications of the CXL4 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 9-16 lists the specifications of the optical interfaces of the CXL4.
Table 9-16 Specifications of the optical interfaces of the CXL4
Item Specification
Nominal bit rate 622080 kbit/s
Line code NRZ
Optical interfacetype
I-4 S-4.1 L-4.1 L-4.2 Ve-4.2
Workingwavelength (nm)
1261 to1360
1274 to1356
1280 to1335
1480 to1580
1480 to1580
Optical sourcetype
MLM MLM SLM SLM SLM
Mean launchedoptical power(dBm)
–15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2
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Item Specification
Receiversensitivity (dBm)
–23 –28 –28 –28 –34
Min. overload(dBm)
–8 –8 –8 –8 –13
Min. extinctionratio (dB)
8.2 8.2 10 10 10.5
Cross-Connect CapacityThe cross-connect capacity of the CXL4 is described as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s
Clock Access CapabilityThe clock access capability of the CXL4 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the CXL4 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the CXL4 is 40 W.
9.3 CXL16This section describes the CXL16, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.
9.3.1 Version DescriptionThe functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support theQ1CXL16.
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9.3.2 Function and FeatureThe CXL16 is used to process SDH signals, control communication, groom services, and toinput and output the clock.
9.3.3 Working Principle and Signal FlowThe CXL16 consists of the SDH overhead processing module, RST, MST and so on.
9.3.4 Front PanelOn the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety classlabel.
9.3.5 Valid SlotsThe CXL16 can be housed in any of slots 4–5 in the subrack.
9.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL16 indicates the optical interface type.
9.3.7 Board Configuration ReferenceThe physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL16.
9.3.8 Technical SpecificationsThe technical specifications of the CXL16 cover the optical interface specifications, boarddimensions, weight and power consumption.
9.3.1 Version DescriptionThe functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support theQ1CXL16.
9.3.2 Function and FeatureThe CXL16 is used to process SDH signals, control communication, groom services, and toinput and output the clock.
SDH Processing Unit
Table 9-17 lists the function and feature of the SDH processing unit of the CXL16.
Table 9-17 Function and feature of the SDH processing unit of the CXL16
Function andFeature
CXL16
Basic function Transmits and receives 1 x STM-16 optical signals.
Specification of theoptical interface
Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2types.
Specification of theoptical module
l Supports detection and query of the information on the opticalmodule.
l Supports the function of setting the on/off state of the laser and theALS function.
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Function andFeature
CXL16
Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c,and VC-4-16c concatenation services.
Overhead processing l Supports the processing of the SOH bytes of the STM-16 signals.
l Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0/J1/C2 bytes.
Alarm andperformance event
Provides rich alarms and performance events for easy managementand maintenance of the equipment.
Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.
Maintenance feature l Supports inloop and outloop for optical interfaces.
l Supports warm reset and cold reset. The warm reset does not affectservices.
l Supports the function of querying the manufacturing informationof the board.
l Supports the in-service loading of the FPGA.
l Supports the upgrade of the board software without affectingservices.
SCC UnitTable 9-18 lists the function and feature of the SCC unit of the CXL16
Table 9-18 Function and feature of the SCC unit of the CXL16
Function andFeature
CXL16
Basic function Configures and monitors services, monitors the service performance,and collects performance events and alarm information.
Specification of theoptical interface
l Provides 10M/100M compatible Ethernet NMS interface.
l Provides the F&f interface to manage the COA, and the F&finterface is on the auxiliary interface board.
l Provides one 10M/100M Ethernet interface, which is used forinter-board communication.
l Provides one 10M Ethernet interface, which is used forcommunication between the active and standby SCC boards.
l Provides the RS232 OAM interface that is present on on theauxiliary interface board to connect to the PC or workstation.Supports the remote maintenance by using the RS232 DCEmodem.
DCC processingcapability
Processes 40-channel DCC.
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Function andFeature
CXL16
Fan alarmmanagement
Manages fan alarms.
PIU management Provides the in-service check function for the PIU board, and thefailure check function for the lightning protection module of the PIU.
Protection scheme Supports 1+1 hot backup for the SCC unit.
Cross-Connect UnitTable 9-19 lists the function and feature of the cross-connect unit of the CXL16.
Table 9-19 Function and feature of the cross-connect unit of the CXL16
Function andFeature
CXL16
Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4level, and 20 Gbit/s non-blocking full cross-connection at the VC-12or VC-3 level.
Fast emergencychannel
Provides two 4M HDLC fast emergency channels, which are used forthe MSP and SNCP protection switching.
Service processing l Dynamically grooms services, such as the cross-connect andbroadcast services.
l Adds or deletes services without interrupting services.
l Supports the SNCP protection at the VC-3 and VC-12 levels.
l Supports concatenation services at the VC-4-4c, VC-4-8c, andVC-4-16c levels.
Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connectunit.
Clock UnitTable 9-20 lists the function and feature of the clock unit of the CXL16.
Table 9-20 Function and feature of the clock unit of the CXL16
Function andFeature
CXL16
Basic function Provides standard system synchronization clock.
Other function Supports the extraction, insertion and management of the SSM andclock ID.
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Function andFeature
CXL16
Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, andselects the external timing source.
l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.
9.3.3 Working Principle and Signal FlowThe CXL16 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-7 shows the block diagram for the functions of the CXL16.
Figure 9-7 Block diagram for the functions of the CXL16
STM-16DEMUX
MUX
Cross-connectunit B
16x155Mbit/s data
16x155Mbit/s data
SDH overhead processing module
K1/K2insertion/extration SCC unit
Per
form
ance
repo
rt
Lase
r shu
t dow
n
high speed bus
RST MST MSA HPTO/E
O/E
-48 V/-60V
Fuse
DC/DCconverter
Cross-connectunit A
high speed bus
155 MHz
XC Cross Connect
(HPC)
Another CXL
ETH interface
OAM interface
Boot ROM NVRAMRAMFLASH
K1/K2 bytesprocess
Other unit
Communication andcontrol module
Laser control
Another CXLunit
Anotherconnect unit
DCC
DCCK1/K2 bytes
XC Cross Connect
(LPC)
155MHz PLL
high speed bus
+1.6V
+1.8V
+1.2V
DCCprocess
STM-16
Pow
er m
onito
r
Master and slaver board comunication
ETH channels comunication
-48 V/-60V
AUX
AUX
+5V
Line unit
F&f interface
Phone interface
S1-S4 interfaceEOW
Time &synchronizaton
(SETS)
SETG
38MHzOSC
Line units
Tributary units
Frame header
T1
T2
T3
T0
AUX
T0 (reference clock)
T4(Clock external output)
PIU
Service units
Service units
+3.3 V DC/DCconverter
high speed bus
The function modules are described as follows:
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Synchronous Timing Unit
The synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronoussource (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
l Timing signal (T1) from STM-N
l Timing signal (T2) from PDH
l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)
The clock module outputs:
l T0, system clock (38 MHz)
l T4, external timing (2 Mbit/s or 2 MHz) output by line
O/E Conversion Modulel In receive direction, it converts the received optical signals into electrical signals.
l In transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.
l The SPI detects the R_LOS alarm and provides the laser shut down function.
MUX/DEMUX Modulel In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.
l In transmit direction, the MUX part multiplexes the parallel electrical signals received fromthe SDH overhead processing module into high rate electrical signals.
SDH Overhead Processing Module
It includes RST, MST, MSA and HPT, provides inloop and outloop function.
RSTl In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.
l In transmitting direction, it performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.
MSTl In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.
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l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDIand MS_AIS insertion.
l Provides extraction or insertion of K1 byte and K2 byte.
MSAl In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS
generation.
HPTl OH termination
l J1 path trace message recovery
l REI information recovering
l HP_RDI detection (path status monitoring
l UNEQ and AIS detection (signal label monitoring)
l VC-4 BIP-8 errored block count
Communication and Control Modulel Traces the clock signal from the active and the standby cross-connect unit.
l Implements laser controlling function.
l Selects the clock and frame header from the active or the standby cross-connect units.
l Controls the indicator on the board.
l CPU control unit, which controls and monitors other function modules. The unit alsoinitializes other function modules after power on.
l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.
l OAM interface, which provides serial port for network management. This port can be usedas the MODEM port and thus can be configured as a serial port to connect to MODEM portin running state.
l F&f interface, which provides F&f interface to manage COA. This serial port multiplexeswith the commissioning serial port and is the commissioning serial port in BIOS state.
l COM interface for commissioning port
l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the activeand the standby CXL unit.
Cross-connect ModuleThe cross-connect module consists of two parts:
l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCPswitching
l Higher and lower order cross-connect module, which performs the functions of higher andlower order cross-connect units. This module consists of higher order cross-connect unitand lower order cross-connect unit.
Figure 9-8 illustrates the block diagram of higher and lower order cross-connect modules.
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Figure 9-8 Block diagram of higher and lower order cross-connect modules
Data DataInputinterface
VC_DATA_FIFO RX_TOP
high speed bus
Lower orderconnection
XC_TOP
Higher orderconnection
XCconnection
Ouputinterface
TX_TOP
high speed bus
The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higherorder services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower orderservices.
Other Functionsl Responses to and processes k bytes
l Collects performance data of the optical module and shuts output of the optical module
l Collects and processes DCC of each board
l Inserts the DCC back into each line board after processing
l Monitors the power supply of the board
l Resets the unit
l Cuts alarms
DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.
9.3.4 Front PanelOn the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety classlabel.
Appearance of the Front PanelFigure 9-9 shows the front panel of the CXL16.
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Figure 9-9 Front panel of the CXL16
CXL16
CXL16STATACTXACTCPROGSRVXSRVLSYNCALMC
CLASS 1LASER
PRODUCT
OU
TIN
RESET
ALM CUT
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Activating state indicator for the services at the cross-connect unit (ACTX), which is greenwhen lit.
l Active/standby state indicator for the SCC units (ACTC), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellowwhen lit.
l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow whenlit.
l Synchronization clock state indicator (SYNC), which is red or green when lit.
l Alarm cutting indicator (ALMC), which is yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
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InterfacesOn the front panel of the CXL16, there are one optical interface and two switches. Table 9-21lists the type and usage of the optical interface and switches on the CXL16.
Table 9-21 Optical interface and switches on the CXL16
Interface InterfaceType
Usage
IN LC Receives optical signals. The pluggable optical module isused for easy maintenance.
OUT LC Transmits optical signals. The pluggable optical module isused for easy maintenance.
RESET Warm resetswitch
Press the switch to reset the SCC unit.
ALM CUT Alarm cutswitch
Press the switch to mute the alarm. Press the switch for threeseconds to mute the alarm permanently. Press the switchagain for three seconds to resume the alarm sound.
9.3.5 Valid SlotsThe CXL16 can be housed in any of slots 4–5 in the subrack.
9.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL16 indicates the optical interface type.
Table 9-22 lists the relation between the board feature code and optical interface type for theCXL16.
Table 9-22 Relation between the board feature code and the optical interface type
Board Barcode Feature Code Optical Interface Type
SSQ2CXL1601 01 I-16
SSQ2CXL1602 02 S-16.1
SSQ2CXL1603 03 L-16.1
SSQ2CXL1604 04 L-16.2
9.3.7 Board Configuration ReferenceThe physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL16.
Displayed SlotThe CXL16 is housed in one slot in the subrack.
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The logical boards for the CXL16 are the Q1SL16, EXCL and GSCC.
Table 9-23 lists the logical slots displayed on the T2000.
Table 9-23 Logical slots displayed on the T2000 for the CXL16
Board Logical Board Logical Slot
CXL16 Q1SL16 Slots 4–5
ECXL Slots 80–81
GSCC Slots 82–83
Board Parametersl J1 byte
l C2 byte
l Clock parameters
For details on the parameters, refer to F Board Configuration Reference.
9.3.8 Technical SpecificationsThe technical specifications of the CXL16 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 9-24 lists the specifications of the optical interfaces of the CXL16.
Table 9-24 Specifications of the optical interfaces of the CXL16
Item Specification
Nominal bit rate 2488320 kbit/s
Line code NRZ
Optical interfacetype
I-16 S-16.1 L-16.1 L-16.2
Workingwavelength (nm)
1266 to 1360 1260 to 1360 1280 to 1335 1500 to 1580
Optical sourcetype
MLM SLM SLM SLM
Mean launchedoptical power(dBm)
–10 to –3 –5 to 0 –2 to 3 –2 to 3
Receiversensitivity (dBm)
–18 –18 –27 –28
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Item Specification
Min. overload(dBm)
–3 0 –9 –9
Min. extinctionratio (dB)
8.2 8.2 8.2 8.2
Cross-Connect CapacityThe cross-connect capacity of the CXL16 described as follows:
l Higher order cross-connect capacity: 20 Gbit/s
l Lower order cross-connect capacity: 20 Gbit/s
l Access capacity: 18.75 Gbit/s
Clock Access CapabilityThe clock access capability of the CXL16 is described as follows:
l External input clock: two channels, 2048 kbit/s or 2048 kHz
l External output clock: two channels, 2048 kbit/s or 2048 kHz
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the CXL16 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the CXL16 is 40 W.
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10 Auxiliary Boards
About This Chapter
This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA.
10.1 EOWThis section describes the EOW, an orderwire processing board, in terms of the version, function,principle, front panel and specifications.
10.2 AUXThis section describes the AUX, a system auxiliary interface board, in terms of the version,function, working principle, front panel and specifications.
10.3 AMUThis section describes the AMU, an orderwire processing and alarm concatenation board, interms of the version, function, principle, front panel and specifications.
10.4 FANThis section describes the FAN, a fan control board, in terms of the version, function, principle,front panel, configuration and specifications.
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10.1 EOWThis section describes the EOW, an orderwire processing board, in terms of the version, function,principle, front panel and specifications.
10.1.1 Version DescriptionThe functional version of the EOW is R1.
10.1.2 Function and FeatureThe EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other databytes.
10.1.3 Working Principle and Signal FlowThe EOW consists of the clock module, switch module, OHP module, and DC/DC convertermodule.
10.1.4 Front PanelOn the front panel of the EOW, there are indicators and interfaces.
10.1.5 Valid SlotsThe EOW can be housed in slot 9 in the subrack.
10.1.6 Technical SpecificationsThe technical specifications of the EOW cover the board dimensions, weight and powerconsumption.
10.1.1 Version DescriptionThe functional version of the EOW is R1.
10.1.2 Function and FeatureThe EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other databytes.
Table 10-1 lists the functions and features of the EOW.
Table 10-1 Functions and features of the EOW
Function andFeature
EOW
Auxiliary interface Provides four broadcast data interfaces (Serial 1–4).
Orderwire interface Provides one orderwire interface.
Overheadprocessing
Processes the E1, E2, and Serial 1–4 bytes.
10.1.3 Working Principle and Signal FlowThe EOW consists of the clock module, switch module, OHP module, and DC/DC convertermodule.
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Figure 10-1 shows the block diagram for the functions of the EOW.
Figure 10-1 Block diagram for the functions of the EOW
S1~S4interface
Phone interface
Clockmodule
Reference clock and frame header
SwitchmoduleOHP module
S1~S4
E1/E2
+3.3 V backuppower from AUX
+5 V
+1.8 V
+3.3 V -48 V/ -60 VFuse
-48 V/ -60 V
Fuse
+3.3 V
DC/DCconverter
DC/DCconverter
SLIC
CXL unit A/B
CXL unit A/B
Clock ModuleThe clock module first divides frequencies of the system clock and header sent from the cross-connect board. The system clock and header are then transmitted to other modules as OHPProcess module and the switch module.
Switch ModuleThe switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslotsunder control of micro processor. The switch module can switch any timeslot of overhead signalsent from the SCC to any timeslot of output overhead signals.
OHP Modulel Processes E1 and E2 bytes sent by the CXL board.
l Realizes interconnection between orderwire audio interface.
l Interconnects with orderwire phone port through SLIC unit.
l Processes serial1–serial4 sent from the CXL board.
l Provides S1–S4 as RS232/RS422 serial transparent data interfaces, the level of which canbe set by software.
DC/DC ConverterThrough the DC/DC converter module, the power converting module generates required DCvoltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. Inaddition, protection is provided to board +3.3 V power supply.
10.1.4 Front PanelOn the front panel of the EOW, there are indicators and interfaces.
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Appearance of the Front PanelFigure 10-2 shows the appearance of the front panel of the EOW.
Figure 10-2 Front panel of the EOW
EOW
EOW
PH
ON
ES
1S
2S
3S
4
STATPROG
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage ofthese interfaces.
Table 10-2 Interfaces on the front panel of the EOW
Interface InterfaceType
Usage
PHONE RJ-11 Orderwire phone interface
S1 RJ-45 Broadcast data interface S1
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Interface InterfaceType
Usage
S2 RJ-45 Broadcast data interface S2
S3 RJ-45 Broadcast data interface S3
S4 RJ-45 Broadcast data interface S4
Table 10-3 lists the pins of the PHONE interface.
Table 10-3 Pins of the PHONE interface of the EOW
Front View Pin Usage
8 7 6 5 4 3 2 1
4 Signal 1
5 Signal 2
1–3 and 6–8 Not defined
Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces.
Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW
Front View Pin Usage
8 7 6 5 4 3 2 1
1 RS-422 data transmitting positive
2 RS-422 data transmitting negative
3 RS-422 data receiving positive
4 RS232 data receive end
5 Grounding
6 RS-422 data receiving negative
7 Not defined
8 RS232 data transmit end
10.1.5 Valid SlotsThe EOW can be housed in slot 9 in the subrack.
10.1.6 Technical SpecificationsThe technical specifications of the EOW cover the board dimensions, weight and powerconsumption.
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Mechanical SpecificationsThe mechanical specifications of the EOW are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.4
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EOW is 10 W.
10.2 AUXThis section describes the AUX, a system auxiliary interface board, in terms of the version,function, working principle, front panel and specifications.
10.2.1 Version DescriptionThe AUX has two versions, R1 and R2.
10.2.2 Function and FeatureThe AUX is used to provide various management and auxiliary interfaces, and to provide thecentral backup of the +3.3 V power supply for the boards in the subrack.
10.2.3 Working Principle and Signal FlowThe AUX consists of the control module, communication module, DC/DC converter moduleand so on.
10.2.4 JumperA jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack asthe main subrack or extended subrack.
10.2.5 Front PanelOn the front panel of the AUX, there are many types of interfaces.
10.2.6 Valid SlotsThe AUX can be housed in slot 10 in the subrack.
10.2.7 Technical SpecificationsThe technical specifications of the AUX cover the board dimensions, weight and powerconsumption.
10.2.1 Version DescriptionThe AUX has two versions, R1 and R2.
The R1AUX and R2AUX are two versions developed in different periods. The two versions canbe replaced by each other.
10.2.2 Function and FeatureThe AUX is used to provide various management and auxiliary interfaces, and to provide thecentral backup of the +3.3 V power supply for the boards in the subrack.
Table 10-5 lists the functions and features of the AUX.
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Table 10-5 Functions and features of the AUX
Item AUX
Managementinterface
Provides the OAM/F&f interface, which supports the X.25 protocol.Provides the ETH NMS interface.
Clock interface Provides two BITS clock input interfaces and two BITS clock outputinterfaces (impedance: 120 ohms).
Alarm interface Provides three alarm input and one alarm output interfaces.
Commissioninginterface
Provides one commissioning COM interface.
Internalcommunication
Realizes the inter-board communication among boards in thesubrack.
Backup and check ofthe power supply
Monitors the two independent –48 power supplies in the subrack,and performs the overvoltage (–72 V) check and undervoltage (–38.4V) check.Provides the central backup of the +3.3 V power supply for theboards in the subrack, which is the 1:N protection for the secondarypower supply of each board. The power of the +3.3 V power supplyis 80 W.Performs the overvoltage (3.8 V) check and undervoltage (3.1 V)check on the output of the +3.3 V backup power supply.
Audible alarm Supports the audible alarm and the clearing of the audible alarm.
10.2.3 Working Principle and Signal FlowThe AUX consists of the control module, communication module, DC/DC converter moduleand so on.
Figure 10-3 shows the block diagram for the functions of the R1AUX.
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Figure 10-3 Block diagram for the functions of the R1AUX
Control module
3 x input and1 x output -48 V/ -60 V
F&f/OAMinterface CXL
CLK interface CXL
Other unitETH
interface
COMinterface
100/10 Mbit/s Ehernet bus
2 X 100/10 Mbit/s
100/10 Mbit/s
100/10 Mbit/sCXL
Housekeepinginput/output
-48 V/BAK 3.3 Vpower test &
thunder-proof test
Communication module
+1.8 V
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
DC/DCconverter
-48 V/ -60 V
-48 V/ -60 V
Figure 10-4 shows the block diagram for the functions of the R2AUX.
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Figure 10-4 Block diagram for the functions of the R2AUX
Control module
3 x input and1 x output -48 V/ -60 V
F&f/OAMinterface CXL
CLK interface CXL
Otherunit
ETHinterface
COMinterface
100/10 Mbit/s Ehernet bus
2 x 100/10 Mbit/s
100/10 Mbit/s
100/10 Mbit/sCXL
Housekeepinginput/output
-48 V/BAK 3.3 Vpower test &
thunder-proof test
Communication module
+1.8 V
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
DC/DCconverter
-48 V/ -60 V
-48 V/ -60 V
CXL
The function modules of the R1AUX board are described below:
Communication ModuleThis module applies LAN Switch principle to construct inter-board communication for the OptiXOSN 1500. This module provides:
l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connectthe SCC, the cross-connect, the line and the tributary boards for inter-board communicationof the OptiX OSN 1500.
l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioningnetwork interface for service slots, which forms a VLAN with the 13 inter-boardcommunication network interfaces. The other interface is the interface for networkmanagement.
l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLBboards. These two interfaces and one network interface on the front panel are of the sameVLAN.
Control ModuleThe control module mainly consists of CPUs and monitors the running state of the board.
Alarm Input and Output ModuleThis module reads and sets 3 x input and 1 x output alarms.
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Detection of –48 V and Backup +3.3 V Powers and Lightening Protection ModuleThis module detects:
l Over-voltage and under-voltage of –48 V and backup +3.3 V powers
l System lightening protection fault
Other Functionl F&f interface
l OAM serial interface for network management
l Two-in and two-out BITS clock interface (120 ohms)
l COM, ETH, F&f and OAM interfaces
DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides40 W/+3.3 V backup power supply for the system.
The function modules of the R2AUX board are described below:
Communication ModuleThis module applies LAN Switch principle to construct inter-board communication for the OptiXOSN 1500. This module provides:
l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connectthe SCC, the cross-connect, the line and the tributary boards for inter-board communicationof the OptiX OSN 1500.
l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioningnetwork interface for service slots, which forms a VLAN with the 13 inter-boardcommunication network interfaces. The other interface is the interface for networkmanagement.
l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLBboards. These two interfaces and one network interface on the front panel are of the sameVLAN.
Control ModuleThe control module mainly consists of CPLDs and reports the local board state to the CXL boardthrough the control bus with the CXL board. This module also obtains the control informationof the local board.
Alarm Input and Output ModuleThis module reads and sets 3 x input and 1 x output alarms.
Detection of –48 V and Backup +3.3 V Powers and Lightening Protection ModuleThis module detects:
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l Over-voltage and under-voltage of –48 V and backup +3.3 V powersl System lightening protection fault
Other Functionl F&f interfacel OAM serial interface for network managementl Two-in and two-out BITS clock interface (120 ohms)l COM, ETH, F&f and OAM interfaces
DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides40 W/+3.3 V backup power supply for the system.
10.2.4 JumperA jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack asthe main subrack or extended subrack.
Figure 10-5 shows where the jumper J9 is located on the AUX board.
Figure 10-5 Position of J9 on the AUX
PowerModule
J9
Use the J9 to set the subrack as follows:
l Cap the jumper to set the subrack as the main subrack.l Remove the cap from the jumper to set the subrack as the extended subrack.
10.2.5 Front PanelOn the front panel of the AUX, there are many types of interfaces.
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Appearance of the Front PanelFigure 10-6 shows the appearance of the front panel of the AUX.
Figure 10-6 Front panel of the AUX
AUX
AUX
ETH
CO
MC
LKA
LMO
AM
/F&f
InterfacesThere are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage ofthese interfaces.
Table 10-6 Interfaces on the front panel of the AUX
Interface InterfaceType
Usage
ETH RJ-45 NM interface
COM RJ-45 Commissioning interface
CLK RJ-45 120-ohm external clock input/output interface
ALM RJ-45 3 x input and 1 x output alarm interface
OAM/F&f RJ-45 Serial NM and management interface
Table 10-7 lists the pins of the CLK interface.
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Table 10-7 Pins of the CLK interface of the AUX
Front View Pin Usage
8 7 6 5 4 3 2 1
1 Receiving negative for 120-ohm clock 1
2 Receiving positive for 120-ohm clock 1
3 Receiving negative for 120-ohm clock 2
4 Transmitting negative for 120-ohm clock 1
5 Transmitting positive for 120-ohm clock 1
6 Receiving positive for 120-ohm clock 2
7 Transmitting negative for 120-ohm clock 2
8 Transmitting positive for 120-ohm clock 2
Table 10-8 lists the pins of the ETH and COM interfaces.
Table 10-8 Pins of the ETH and COM interfaces of the AUX
Front View Pin Usage
8 7 6 5 4 3 2 1
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Not defined
5 Not defined
6 Receiving negative
7–8 Not defined
Table 10-9 lists the pins of the ALM interface.
Table 10-9 Pins of the ALM interface of the AUX
Front View Pin Usage
8 7 6 5 4 3 2 1
1 Positive for critical and major alarm signaloutput
2 Negative for critical and major alarm signaloutput
3 Positive for minor and warning alarm signaloutput
4 Positive for alarm signal output 1
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Front View Pin Usage
5 Negative for alarm signal output 1
6 Negative for minor and warning alarm signaloutput
7 Positive for alarm signal output 2
8 Negative for alarm signal output 2
Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table10-10 lists pins of the interface used as the OAM interface.
Table 10-10 Pins of the OAM interface of the AUX
Front View Pin Usage
8 7 6 5 4 3 2 1
1 Requests for transmission.
2 Prepares the DTE.
3 Transmits data.
4 Grounds.
5 Grounds.
6 Receives data.
7 Prepare the DCE.
8 Prepares for the receiving ofsignals.
Table 10-11 lists the pins of the interface used as the F&f interface.
Table 10-11 Pins of the F&f interface of the AUX
Front View Pin Usage
8 7 6 5 4 3 2 1
4 RS232 receive end
5 Grounding end
8 RS232 transmit end
1–3 and 6–7 Not defined
10.2.6 Valid SlotsThe AUX can be housed in slot 10 in the subrack.
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10.2.7 Technical SpecificationsThe technical specifications of the AUX cover the board dimensions, weight and powerconsumption.
Mechanical Specifications
The mechanical specifications of the AUX are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the AUX is 19 W.
10.3 AMUThis section describes the AMU, an orderwire processing and alarm concatenation board, interms of the version, function, principle, front panel and specifications.
10.3.1 Version DescriptionThe functional version of the AMU board is R1.
10.3.2 Function and FeatureThe AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for theequipment.
10.3.3 Working Principle and Signal FlowThe AMU consists of the clock module, overhead processing module and power supply module.
10.3.4 Front PanelOn the front panel of AMU, there are board indicators and interfaces of many types.
10.3.5 Valid SlotsThe AMU can be housed in slot 9 in the subrack.
10.3.6 Technical SpecificationsThe technical specifications of the AMU cover the board dimensions, weight and powerconsumption.
10.3.1 Version DescriptionThe functional version of the AMU board is R1.
10.3.2 Function and FeatureThe AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for theequipment.
Table 10-12 lists the functions and features of the AMU.
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Table 10-12 Functions and features of the AMU
Item AMU
Auxiliary interface Provides two broadcast data interfaces (Serial 1–2).
Cabinet alarmindicator
Drives and concatenates the four cabinet indicators.
Orderwire interface Provides one orderwire interface.
Commissioninginterface
Supports the commissioning serial port and 100M commissioningnetwork port, when connected to the AUX.
Overhead processing Processes the E1, E2, and Serial 1–2 bytes.
Backup and check ofthe power supply
Performs the overvoltage/undervoltage check on the output of thepower supply modules.
10.3.3 Working Principle and Signal FlowThe AMU consists of the clock module, overhead processing module and power supply module.
Figure 10-7 shows the block diagram for the functions of the AMU.
Figure 10-7 Block diagram for the functions of the AMU
Reference clock
S1~S4
E1/E2
+3.3 V power backupfrom AUX
-48 V
CXL unit
CXL unit
Clockmodule
Overheadprocessmodule
+3.3 V
Backplane
Powersupplymodule
Clock Module
The clock module extracts and processes the reference clock signals from the CXL.
Overhead Processing Module
The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, anduses the orderwire bytes for the connection of the orderwire phones. This module also processesSerial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives andconcatenates the cabinet indicators. Figure 10-8 shows the positions of the orderwire bytes inthe SDH frame.
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Figure 10-8 Positions of orderwire bytes in the SDH frame
A1 A1 A1 A2 A2 A2 J0
B1 E1
D1 D2 D3 Serial 1 Serial2
AU_PTR
B2 B2 B2 K1 K2
D4 D5 D6
D7 D8 D9
D10 D11 D12
S1 M1 E2
Power Supply ModuleThe power supply module provides supplies power to the AMU board and provides centralized+3.3 V power backup for other boards.
10.3.4 Front PanelOn the front panel of AMU, there are board indicators and interfaces of many types.
Appearance of the Front PanelFigure 10-9 shows the appearance of the front panel of the AMU.
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Figure 10-9 Front panel of the AMU
PH
ON
ES
1S
2LA
MP
1
STATPROG
LAM
P2
AMU
AMU
Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Connection status indicator (LINK), which is green when lit.
l Data receiving and transmission indicator (ACT), which is orange when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usageof these interfaces.
Table 10-13 Interfaces on the front panel of the AMU
Interface Interface Type Usage
PHONE RJ-11 Orderwire phone interface
S1 RJ-45 Broadcast data interface S1
S2 RJ-45 Broadcast data interface S2
LAMP1 RJ-45 Cabinet alarm indicator output interface
LAMP2 RJ-45 Cabinet concatenated alarm indicator inputinterface
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Table 10-14 lists the pins of the PHONE interface.
Table 10-14 Pins of the PHONE interface of the AMU
Front View Pin Usage
8 7 6 5 4 3 2 1
4 Signal 1
5 Signal 2
1–3 and 6–8 Not defined
Table 10-15 lists the pins of the S1 and S2 interfaces.
Table 10-15 Pins of the S1 and S2 interfaces of the AMU
Front View Pin Usage
8 7 6 5 4 3 2 1
1 RS-422 data transmittingpositive
2 RS-422 data transmittingnegative
3 RS-422 data receiving positive
4 RS232 data receive end
5 Grounding
6 RS-422 data receiving negative
7 Not defined
8 RS232 data transmit end
Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces.
Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU
Front View Pin Usage
8 7 6 5 4 3 2 1
1 Positive for critical alarmsignals
2 Negative for critical alarmsignals
3 Positive for major alarmsignals
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Front View Pin Usage
4 Positive for power indicatorsignals
5 Negative for power indicatorsignals
6 Negative for major alarmsignals
7 Positive for minor alarmsignals
8 Negative for minor alarmsignals
Connection for Alarm ConcatenationThe AMU provides the concatenation interface for the cabinet alarm indicators. Connect theLAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of thesubrack 1 to the indicator interface on the top of the cabinet.
Figure 10-10 shows how to connect the cabinet alarm indicators.
Figure 10-10 Connection of the cabinet alarm indicators
LAMP1
Subrack 2
Cabinet
Cabinetindicators
LAMP2
LAMP1 LAMP2
Subrack 1
10.3.5 Valid SlotsThe AMU can be housed in slot 9 in the subrack.
10.3.6 Technical SpecificationsThe technical specifications of the AMU cover the board dimensions, weight and powerconsumption.
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Mechanical Specifications
The mechanical specifications of the AMU are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 0.5
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the AMU is 8 W.
10.4 FANThis section describes the FAN, a fan control board, in terms of the version, function, principle,front panel, configuration and specifications.
10.4.1 Version DescriptionThe functional version of the FAN board is R1.
10.4.2 Function and FeatureThe FAN is used to adjust the fan speed, check the fan status, report the fault of the fan controlboard, and to report the off-service alarm of the fan.
10.4.3 Working Principle and Signal FlowThe FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
10.4.4 Front PanelThere are no indicators on the front panel of the FAN.
10.4.5 Valid SlotsThe FAN can be housed in slot 20 in the subrack.
10.4.6 Technical SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, power consumptionand working voltage.
10.4.1 Version DescriptionThe functional version of the FAN board is R1.
10.4.2 Function and FeatureThe FAN is used to adjust the fan speed, check the fan status, report the fault of the fan controlboard, and to report the off-service alarm of the fan.
Table 10-17 lists the functions and features of the FAN.
Table 10-17 Functions and features of the FAN
Function andFeature
FAN
Hot swap function Provides the hot swap function for the fan frame.
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Function andFeature
FAN
Status checkfunction
Provides the function of fan status check.
Alarm checkfunction
Reports the fan alarm and in-service information.
10.4.3 Working Principle and Signal FlowThe FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
Figure 10-11 shows the block diagram for the functions of the FAN.
Figure 10-11 Block diagram for the functions of the FAN
Poweraccess
unit
Statusdetection
unitVoltagedrop unit
FanDelaystart unit
- 48 V 1
- 48 V 2
GND1
GND2
GND
- 48 V
GND
- 48 V
-48 V
GN
D
- 48 V GND
Fan alarmsignals
Power Interface UnitThe power interface unit accesses the –48 V power supply for the FAN.
State Detecting UnitThis unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarmto the CXL to indicate the off state of the fan and drives the alarm indicator.
10.4.4 Front PanelThere are no indicators on the front panel of the FAN.
Appearance of the Front PanelThe OptiX OSN equipment applies a modular fan platform.
One OptiX OSN 1500 subrack uses one fan tray assembly.
Figure 10-12 shows the appearance of the front panel of the FAN.
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Figure 10-12 Front panel of the FAN
FANRUN
ALM
IndicatorsThe following indicators are present on the front panel of the board:
l Board running state (RUN), which is green when lit.
l Fan alarm indicator (ALM), which is red when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
10.4.5 Valid SlotsThe FAN can be housed in slot 20 in the subrack.
10.4.6 Technical SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, power consumptionand working voltage.
Mechanical SpecificationsThe mechanical specifications of the FAN are as follows:
l Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃) and with –48 V input voltage, the maximum powerconsumption of the FAN is 20 W.
Working VoltageThe working voltage for the FAN can be –48 V±20% DC.
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11 WDM Processing Boards
About This Chapter
This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A,MR2B, MR2C, MR4, LWX, OBU1, and FIB.
11.1 CMR2This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.2 CMR4This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.3 MR2This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.4 MR2AThis section describes the MR2A, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.5 MR2BThis section describes the MR2B, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.6 MR2CThis section describes the MR2C, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.7 MR4This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.8 LWXThis section describes the LWX, an arbitrary rate wavelength converting board, in terms of theversion, function, principle, front panel, configuration and specifications.
11.9 OBU1
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This section describes the TN11OBU1, an optical booster amplifier board, in terms of theversion, function, principle, front panel, configuration and specifications.
11.10 FIBThis section describes the FIB, a wavelength filter and isolation board, in terms of the version,function, principle, front panel, configuration and specifications.
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11.1 CMR2This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.1.1 Version DescriptionThe functional version of the CMR2 board is TN11.
11.1.2 Function and FeatureThe CMR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.1.3 Working Principle and Signal FlowThe CMR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.
11.1.4 Front PanelOn the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.
11.1.5 Valid SlotsThe CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.1.6 Board Feature CodeThe board feature code of the CMR2 contains eight characters, which indicate the wavelengthsfor the 2-channel optical signals processed by the board.
11.1.7 Technical SpecificationsThe technical specifications of the CMR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
11.1.1 Version DescriptionThe functional version of the CMR2 board is TN11.
11.1.2 Function and FeatureThe CMR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-1 lists the functions and features of the CMR2.
Table 11-1 Functions and features of the CMR2
Function andFeature
CMR2
Basic function Adds/Drops two wavelengths to/from the multiplexed signals.
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Function andFeature
CMR2
Channel expansion Provides the intermediate port used for expansion. Under certainconditions, the capacity of upstream and downstream channels can beexpanded when the intermediate port is connected to other opticaladd/drop multiplexing boards.
Wavelength query Specifies and queries the added/dropped wavelengths.
11.1.3 Working Principle and Signal FlowThe CMR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.
Figure 11-1 shows the block diagram for the functions of the CMR2.
Figure 11-1 Block diagram for the functions of the CMR2
Control and communication module
OADM module
IN
D01 D02 A01 A02
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It alsoprovides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The CMR2 is a passive board that has no interface with thebackplane.
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OADM moduleThe board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.1.4 Front PanelOn the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-2 shows the appearance of the front panel of the CMR2.
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Figure 11-2 Front panel of the CMR2
CMR2
CMR2
STAT
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
OU
TIN
MO
MI
D1
A1
D2
A2
IndicatorOn the front panel of the CMR2, there is one board hardware state indicator (STAT), which isred or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.
InterfacesThere are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type andusage of the optical interfaces.
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Table 11-2 Optical interfaces of the CMR2
Interface InterfaceType
Usage
A1–A2 LC Receive the signals output from the optical wavelengthconverting board or centralized client-side equipment.
D1–D2 LC Transmit signals to the optical wavelength converting boardor centralized client-side equipment.
IN LC Receives multiplexed signals.
OUT LC Transmits multiplexed signals.
MO LC Acts as a concatenation output optical interface and connectsto the input optical interfaces of other OADM boards.
MI LC Acts as a concatenation input optical interface and connectsto the output optical interfaces of other OADM boards.
11.1.5 Valid SlotsThe CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.1.6 Board Feature CodeThe board feature code of the CMR2 contains eight characters, which indicate the wavelengthsfor the 2-channel optical signals processed by the board.
Table 11-3 lists the details on the board feature code.
Table 11-3 Feature code of the CMR2
Barcode Indication Description
First four characters Wavelength for the opticalsignals
The wavelength is for thefirst channel of opticalsignals processed by theboard.
Last four characters Wavelength for the opticalsignals
The wavelength is for thesecond channel of opticalsignals processed by theboard.
For example, the feature code of the TN11CMR2 is 14711571.
l "1471" indicates that the wavelength for the first channel of optical signals is 1471 nm.
l "1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.
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11.1.7 Technical SpecificationsThe technical specifications of the CMR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-4 lists the specifications of optical interfaces of the CMR2.
Table 11-4 Specifications of the optical interfaces of the CMR2
OpticalInterface
Item Specification
- Working wavelength range(nm)
1271–1611
- Channel spacing (GHz) 20
IN-D1IN-D2
0.5 dB passband bandwidth(nm)
≥ ±6.5
Insertion loss (dB) in thechannel for droppingwavelengths
≤ 1.5
Adjacent channel isolation(dB)
> 25
Non-adjacent channelisolation (dB)
> 35
A1-OUTA2-OUT
0.5 dB passband bandwidth(nm)
≥ ±6.5
Insertion loss (dB) in thechannel for addingwavelengths
≤ 1.5
IN-MOMI-OUT
Insertion loss (dB) ≤ 1.0
Isolation (dB) > 13
- Return loss (dB) > 40
Laser Safety Class
The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).
Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
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l Weight (kg): 0.8
Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the CMR2 is 0.2
W.l In the high temperature (55℃), the maximum power consumption of the CMR2 is 0.3 W.
11.2 CMR4This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.2.1 Version DescriptionThe functional version of the CMR4 board is TN11.
11.2.2 Function and FeatureThe CMR4 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.2.3 Working Principle and Signal FlowThe CMR4 consists of the OADM optical module, control and communication module, and DC/DC converter module.
11.2.4 Front PanelOn the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.
11.2.5 Valid SlotsThe CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.2.6 Board Feature CodeThe board feature code of the CMR4 contains eight characters, which indicate the wavelengthsfor the 4-channel optical signals processed by the board.
11.2.7 Technical SpecificationsThe technical specifications of the CMR4 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
11.2.1 Version DescriptionThe functional version of the CMR4 board is TN11.
11.2.2 Function and FeatureThe CMR4 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-5 lists the functions and features of the CMR4.
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Table 11-5 Functions and features of the CMR4
Function andFeature
CMR4
Basic function Adds/Drops four wavelengths to/from the multiplexed signals.
Channel expansion Provides the intermediate port used for expansion. Under certainconditions, the capacity of upstream and downstream channels can beexpanded when the intermediate port is connected to other opticaladd/drop multiplexing boards.
Wavelength query Specifies and queries the added/dropped wavelengths.
11.2.3 Working Principle and Signal FlowThe CMR4 consists of the OADM optical module, control and communication module, and DC/DC converter module.
Figure 11-3 shows the block diagram for the functions of the CMR4.
Figure 11-3 Block diagram for the functions of the CMR4
Control and communication module
OADM module
IN
D01 D03 A01 A04
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
D02 D04 A02 A03
OADM module
The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01–D04 four wavelengthsfrom the signal. These four dropped wavelengths are output from the MO optical interface.
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The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds four wavelengths through optical interfaces A01–A04 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.2.4 Front PanelOn the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-4 shows the appearance of the front panel of the CMR4.
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Figure 11-4 Front panel of the CMR4
CMR4
CMR4
STAT
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
OU
TIN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4
IndicatorOne the front panel of the CMR4, there is one board hardware state indicator (STAT), which isred or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.
InterfacesThere are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the typeand usage of these optical interfaces.
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Table 11-6 Optical interfaces of the CMR4
Interface InterfaceType
Usage
A1–A4 LC Receive the signals output from the optical wavelengthconverting board or centralized client-side equipment.
D1–D4 LC Transmit signals to the optical wavelength convertingboard or centralized client-side equipment.
IN LC Receives multiplexed signals.
OUT LC Transmits multiplexed signals.
MI LC Acts as a concatenation input optical interface andconnects to the output optical interfaces of otherOADM boards.
MO LC Acts as a concatenation output optical interface andconnects to the input optical interfaces of other OADMboards.
11.2.5 Valid SlotsThe CMR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.2.6 Board Feature CodeThe board feature code of the CMR4 contains eight characters, which indicate the wavelengthsfor the 4-channel optical signals processed by the board.
Table 11-7 lists the details on the board feature code.
Table 11-7 Feature code of the CMR4
Barcode Indication Description
Characters 1–2 Wavelength for the opticalsignals
The characters are twomiddle characters of the fourthat indicate the wavelengthfor the first channel of opticalsignals.
Characters 3–4 Wavelength for the opticalsignals
The characters are twomiddle characters of the fourthat indicate the wavelengthfor the second channel ofoptical signals.
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Barcode Indication Description
Characters 5–6 Wavelength for the opticalsignals
The characters are twomiddle characters of the fourthat indicate the wavelengthfor the third channel ofoptical signals.
Characters 7–8 Wavelength for the opticalsignals
The characters are twomiddle characters of the fourthat indicate the wavelengthfor the fourth channel ofoptical signals.
For example, the feature code of the TN11CMR4 is 47495961.
l "47" indicates that the wavelength for the first channel of optical signals is 1471 nm.
l "49" indicates that the wavelength for the second channel of optical signals is 1491 nm.
l "59" indicates that the wavelength for the third channel of optical signals is 1591 nm.
l "61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.
11.2.7 Technical SpecificationsThe technical specifications of the CMR4 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-8 lists the specifications of the optical interfaces of the CMR4.
Table 11-8 Specifications of the optical interfaces of the CMR4
OpticalInterface
Item Specification
– Working wavelength range(nm)
1291 to 1611 (1371 nm excluded)
– Channel spacing (GHz) 20
IN-D1IN-D2IN-D3IN-D4
0.5 dB passband bandwidth(nm)
≥ ±6.5
Insertion loss (dB) in thechannel for droppingwavelengths
≤ 2
Adjacent channel isolation(dB)
> 25
Non-adjacent channelisolation (dB)
> 35
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OpticalInterface
Item Specification
A1-OUTA2-OUTA3-OUTA4-OUT
0.5 dB passband bandwidth(nm)
≥ ±6.5
Insertion loss (dB) in thechannel for addingwavelengths
≤ 2
IN-MOMI-OUT
Insertion loss (dB) ≤ 1.5
Isolation (dB) > 13
– Return loss (dB) > 40
Laser Safety Class
The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).
Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the CMR4 is 0.2
W.l In the high temperature (55℃), the maximum power consumption of the CMR4 is 0.3 W.
11.3 MR2This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.3.1 Version DescriptionThe functional version of the MR2 board is TN11.
11.3.2 Function and FeatureThe MR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.3.3 Working Principle and Signal FlowThe MR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.
11.3.4 Front PanelOn the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
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11.3.5 Valid SlotsThe MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.3.6 Board Feature CodeThe board feature code of the MR2 contains eight characters, which indicate the frequency forthe 2-channel optical signals processed by the board.
11.3.7 Technical SpecificationsThe technical specifications of the MR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
11.3.1 Version DescriptionThe functional version of the MR2 board is TN11.
11.3.2 Function and FeatureThe MR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-9 lists the functions and features of the MR2.
Table 11-9 Functions and features of the MR2
Function andFeature
MR2
Basic function Adds/Drops two wavelengths to/from the multiplexed signals.
Channel expansion Provides the intermediate port used for expansion. Under certainconditions, the capacity of upstream and downstream channels can beexpanded when the intermediate port is connected to other opticaladd/drop multiplexing boards.
Wavelength query Specifies and queries the added/dropped wavelengths.
11.3.3 Working Principle and Signal FlowThe MR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.
Figure 11-5 shows the block diagram for the functions of the MR2.
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Figure 11-5 Block diagram for the functions of the MR2
Control and communication module
OADM module
IN
D01 D02 A01 A02
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
OADM module
The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter module
Converts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.3.4 Front PanelOn the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
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Appearance of the Front PanelFigure 11-6 shows the appearance of the front panel of the MR2.
Figure 11-6 Front panel of the MR2
MR2
MR2
STAT
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
OU
TIN
MO
MI
D1
A1
D2
A2
IndicatorOn the front panel of the MR2, there is one board hardware state indicator (STAT), which is redor green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type andusage of the optical interfaces.
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Table 11-10 Optical interfaces of the MR2
Interface InterfaceType
Usage
A1–A2 LC Receive the signals output from the optical wavelengthconverting board or centralized client-side equipment.
D1–D2 LC Transmit signals to the optical wavelength convertingboard or centralized client-side equipment.
IN LC Receives multiplexed signals.
OUT LC Transmits multiplexed signals.
MO LC Acts as a concatenation output optical interface andconnects to the input optical interfaces of other OADMboards.
MI LC Acts as a concatenation input optical interface andconnects to the output optical interfaces of otherOADM boards.
11.3.5 Valid SlotsThe MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.3.6 Board Feature CodeThe board feature code of the MR2 contains eight characters, which indicate the frequency forthe 2-channel optical signals processed by the board.
Table 11-11 lists the details on the board feature code.
Table 11-11 Feature code of the MR2
Barcode Indication Description
First four (1–4) characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the first channelof optical signals.
Last four (5–8) characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the secondchannel of optical signals.
For example, the feature code of the TN11MR2 is 93609370.
l "9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.
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l "9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.
11.3.7 Technical SpecificationsThe technical specifications of the MR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface SpecificationsTable 11-12 lists the specifications of the optical interfaces of the MR2.
Table 11-12 Specifications of the optical interfaces of the MR2
OpticalInterface
Item Specification
- Working wavelength range(nm)
1529 to 1561
- Channel spacing (GHz) 100
IN-D1IN-D2
0.5 dB passband bandwidth(nm)
≥ ±0.11
Insertion loss (dB) in thechannel for droppingwavelengths
≤ 1.5
Adjacent channel isolation(dB)
> 25
Non-adjacent channelisolation (dB)
> 35
A1-OUTA2-OUT
0.5 dB passband bandwidth(nm)
≥ ±0.11
Insertion loss (dB) in thechannel for addingwavelengths
≤ 1.5
IN-MOMI-OUT
Insertion loss (dB) ≤ 1.0
Isolation (dB) > 13
- Return loss (dB) > 40
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
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l Weight (kg): 0.9
Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the MR2 is 0.2 W.
l In the high temperature (55℃), the maximum power consumption of the MR2 is 0.3 W.
11.4 MR2AThis section describes the MR2A, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.4.1 Version DescriptionThe functional version of the MR2A board is N1.
11.4.2 Function and FeatureThe MR2A is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.4.3 Working Principle and Signal FlowThe MR2A consists of the OADM module, control and communication module, and DC/DCconverter module.
11.4.4 Front PanelOn the front panel of the MR2A, there are interfaces and laser safety class label.
11.4.5 Valid SlotsThe MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.4.6 Technical SpecificationsThe technical specifications of the MR2A cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
11.4.1 Version DescriptionThe functional version of the MR2A board is N1.
11.4.2 Function and FeatureThe MR2A is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-13 lists the functions and features of the MR2A.
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Table 11-13 Functions and features of the MR2A
Function andFeature
MR2A
Basic function Adds/Drops two arbitrary adjacent wavelengths, which are compliantwith ITU-T G.692 (DWDM). The signals are transparentlytransmitted, and the working wavelength ranges from 1535.82 nm to1560.61 nm.
OTM function The MR2A can be used as the two-channel wavelength adding/dropping OTM station. Two MR2C boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-7.
OADM function Realizes the two-channel wavelength adding/dropping OADM station,when used with the LWX. See Figure 11-8.
Central wavelength Supports the ITU-T-compliant standard wavelength with a channelspacing of 100 GHz.
Figure 11-7 MR2A used as the OTM station
(2)(1)
MR2A
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
(1) MR2A can serve as an OTM station adding/dropping two channels.Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.(2)
MR2A
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
MR2A
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADMstation
In
Out
MI
MO
D1 A1
A2 D2
MR2A
LWX
LWX
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11.4.3 Working Principle and Signal FlowThe MR2A consists of the OADM module, control and communication module, and DC/DCconverter module.
Figure 11-9 shows the block diagram for the functions of the MR2A.
Figure 11-9 Block diagram for the functions of the MR2A
Control and communication module
OADM module
IN
D01 D02 A01 A02
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It alsoprovides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2A is a passive board that has no interface with thebackplane.
OADM moduleThe board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
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Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.4.4 Front PanelOn the front panel of the MR2A, there are interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-10 shows the appearance of the front panel of the MR2A.
Figure 11-10 Front panel of the MR2A
MR2A
MR2A
CLASS 1LASER
PRODUCTO
UT
AO
1A
O2
M I
M O
DO
2D
O1
IN
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Interfaces
There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 liststhe type and usage of the optical interfaces.
Table 11-14 Optical interfaces of the MR2A
Interface InterfaceType
Usage
A01–A02 LC Adds two wavelengths of signals from the local.
D01–D02 LC Drops two wavelengths of signals to the local.
IN LC Receives multiplexed signals of two wavelengths.
OUT LC Transmits multiplexed signals of two wavelengths.
MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2A boards.
11.4.5 Valid SlotsThe MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.4.6 Technical SpecificationsThe technical specifications of the MR2A cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-15 lists the specifications of the optical interfaces of the MR2A.
Table 11-15 Specifications of the optical interfaces of the MR2A
Item Description
Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692(DWDM).
Line code NRZ
Channel spacing (GHz) 100
Insertion loss (dB) in thechannel for adding ordropping wavelengths
< 2
Adjacent channel isolation(dB)
> 25
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Item Description
Non-adjacent channelisolation (dB)
> 35
–0.5 dB channel bandwidth(nm)
< ±0.11
Laser Safety ClassThe safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).
Mechanical SpecificationsThe mechanical specifications of the MR2A are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the MR2A does not consume power.
11.5 MR2BThis section describes the MR2B, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.5.1 Version DescriptionThe functional version of the MR2B board is N1.
11.5.2 Function and FeatureThe MR2B is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.5.3 Working Principle and Signal FlowThe MR2B consists of the OADM module, control and communication module, and DC/DCconverter module.
11.5.4 Front PanelOn the front panel of the MR2B, there are interfaces and laser safety class label.
11.5.5 Valid SlotsThe MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.
11.5.6 Technical SpecificationsThe technical specifications of the MR2B cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
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11.5.1 Version DescriptionThe functional version of the MR2B board is N1.
11.5.2 Function and FeatureThe MR2B is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-16 lists the functions and features of the MR2B.
Table 11-16 Functions and features of the MR2B
Function andFeature
MR2B
Basic function Adds/Drops two arbitrary adjacent wavelengths, which arecompliant with ITU-T G.692 (DWDM). The signals aretransparently transmitted, and the working wavelength ranges from1535.82 nm to 1560.61 nm.
OTM function The MR2B can be used as the two-channel wavelength adding/dropping OTM station. Two MR2B boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-11.
OADM function Realizes the two-channel wavelength adding/dropping OADMstation, when used with the LWX. See Figure 11-12.
Central wavelength Supports the ITU-T-compliant standard central wavelength with achannel spacing of 100 GHz.
Figure 11-11 MR2B used as the OTM station
(2)(1)
MR2B
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
(1) MR2B can serve as an OTM station adding/dropping two channels.Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.(2)
MR2B
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
MR2B
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
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Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADMstation
In
Out
MI
MO
D1 A1
A2 D2
MR2B
LWX
LWX
11.5.3 Working Principle and Signal FlowThe MR2B consists of the OADM module, control and communication module, and DC/DCconverter module.
Figure 11-13 shows the block diagram for the functions of the MR2B.
Figure 11-13 Block diagram for the functions of the MR2B
Control and communication module
OADM module
IN
D01 D02 A01 A02
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2B is a passive board that has no interface with thebackplane.
OADM moduleThe board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.5.4 Front PanelOn the front panel of the MR2B, there are interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-14 shows the appearance of the front panel of the MR2B.
Figure 11-14 Front panel of the MR2B
MR2B
CLASS 1LASER
PRODUCT
MR2B
MR2B
OU
TA
O1
AO
2M
ID
O2
DO
1IN
MO
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Interfaces
There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists thetype and usage of the optical interfaces.
Table 11-17 Optical interfaces of the MR2B
Interface InterfaceType
Usage
A01–A02 LC Adds two wavelengths of signals from the local.
D01–D02 LC Drops two wavelengths of signals to the local.
IN LC Receives multiplexed signals of two wavelengths.
OUT LC Transmits multiplexed signals of two wavelengths.
MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2B boards.
11.5.5 Valid SlotsThe MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.
11.5.6 Technical SpecificationsThe technical specifications of the MR2B cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-18 lists the specifications of the optical interfaces of the MR2B.
Table 11-18 Specifications of the optical interfaces of the MR2B
Item Description
Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692.
Line code NRZ
Channel spacing (GHz) 100
Insertion loss in thewavelength-addingchannel (dB)
< 2
Adjacent channel isolation(dB)
> 25
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Item Description
Non-adjacent channelisolation (dB)
> 35
–0.5 dB channel bandwidth(nm)
< ±0.11
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the MR2B are as follows:
l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the MR2B does not consume power.
11.6 MR2CThis section describes the MR2C, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.
11.6.1 Version DescriptionThe functional version of the MR2C board is N1.
11.6.2 Function and FeatureThe MR2C is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.6.3 Working Principle and Signal FlowThe MR2C consists of the OADM module, control and communication module, and DC/DCconverter module.
11.6.4 Front PanelOn the front panel of the MR2C, there are interfaces and laser safety class label.
11.6.5 Valid SlotsThe MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2Ccan be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,the MR2C can also be housed in any of slots 69–76 and 79–86.
11.6.6 Technical SpecificationsThe technical specifications of the MR2C cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
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11.6.1 Version DescriptionThe functional version of the MR2C board is N1.
11.6.2 Function and FeatureThe MR2C is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-19 lists the functions and features of the MR2C.
Table 11-19 Functions and features of the MR2C
Function andFeature
MR2C
Basic function Adds/Drops two arbitrary adjacent wavelengths, which arecompliant with ITU-T G.692 (DWDM). The signals aretransparently transmitted, and the working wavelength ranges from1535.82 nm to 1560.61 nm.
OTM function The MR2C can be used as the two-channel wavelength adding/dropping OTM station. Two MR2C boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-15.
OADM function Realizes the two-channel wavelength adding/dropping OADMstation, when used with the LWX. See Figure 11-16.
Central wavelength Supports the ITU-T-compliant standard wavelength with a channelspacing of 100 GHz.
Figure 11-15 MR2C used as the OTM station
(2)(1)
MR2C
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
(1) MR2C can serve as an OTM station adding/dropping two channels.Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.(2)
MR2C
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
MR2C
IN
OUT
MO
MI
D1 D2
A1 A2
Add
Drop
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Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2Cand LWX
In
Out
MI
MO
D1 A1
A2 D2
MR2C
LWX
LWX
11.6.3 Working Principle and Signal FlowThe MR2C consists of the OADM module, control and communication module, and DC/DCconverter module.
Figure 11-17 shows the block diagram for the functions of the MR2C.
Figure 11-17 Block diagram for the functions of the MR2C
Control and communication module
OADM module
IN
D01 D02 A01 A02
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2C is a passive board that has no interface with thebackplane.
OADM moduleThe board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.6.4 Front PanelOn the front panel of the MR2C, there are interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-18 shows the appearance of the front panel of the MR2C.
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Figure 11-18 Front panel of the MR2C
MR2C
MR2C
CLASS 1LASER
PRODUCT
OU
TA
O1
AO
2M
IM
OD
O2
DO
1IN
InterfacesThere is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists thetype and usage of the optical interfaces.
Table 11-20 Optical interfaces of the MR2C
Interface InterfaceType
Usage
A01–A02 LC Adds two wavelengths of signals from the local.
D01–D02 LC Drops two wavelengths of signals to the local.
IN LC Receives multiplexed signals of two wavelengths.
OUT LC Transmits multiplexed signals of two wavelengths.
MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2C boards.
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11.6.5 Valid SlotsThe MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2Ccan be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,the MR2C can also be housed in any of slots 69–76 and 79–86.
11.6.6 Technical SpecificationsThe technical specifications of the MR2C cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface SpecificationsTable 11-21 lists the specifications of the optical interfaces of the MR2C.
Table 11-21 Specifications of the optical interfaces of the MR2C
Item Description
Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692.
Line code NRZ
Channel spacing (GHz) 100
Insertion loss in the add/drop channel (dB)
< 2
Adjacent channel isolation(dB)
> 25
Non-adjacent channelisolation (dB)
> 35
–0.5 dB channel bandwidth(nm)
< ±0.11
Laser Safety ClassThe safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
Mechanical SpecificationsThe mechanical specifications of the MR2C are as follows:
l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the MR2C does not consume power.
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11.7 MR4This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.
11.7.1 Version DescriptionThe functional version of the MR4 board is TN11.
11.7.2 Function and FeatureThe MR4 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
11.7.3 Working Principle and Signal FlowThe MR4 consists of the OADM optical module, control and communication module, and DC/DC converter module.
11.7.4 Front PanelOn the front panel of the MR4, there are board indicators, interfaces and laser safety class label.
11.7.5 Valid SlotsThe MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.7.6 Board Feature CodeThe feature code of the MR4 has eight numbers, which identify the frequency of the first andfourth channels of optical signals the board process.
11.7.7 Technical SpecificationsThe technical specifications of the MR4 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
11.7.1 Version DescriptionThe functional version of the MR4 board is TN11.
11.7.2 Function and FeatureThe MR4 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.
Table 11-22 lists the functions and features of the MR4.
Table 11-22 Functions and features of the MR4
Function andFeature
MR4
Basic function Adds/Drops four wavelengths to/from the multiplexed signals.
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Function andFeature
MR4
Channel expansion Provides the intermediate port used for expansion. Under certainconditions, the capacity of upstream and downstream channels can beexpanded when the intermediate port is connected to other opticaladd/drop multiplexing boards.
Wavelength query Specifies and queries the added/dropped wavelengths.
11.7.3 Working Principle and Signal FlowThe MR4 consists of the OADM optical module, control and communication module, and DC/DC converter module.
Figure 11-19 shows the block diagram for the functions of the MR4.
Figure 11-19 Block diagram for the functions of the MR4
Control and communication module
OADM module
IN
D01 D03 A01 A04
Drop Add OUT
MO MI
SCC
+5 V DC/DCconverter
Power supply module
Delayedstartup
-48 V/-60 V
Fuse
-48 V/-60 V SCCBack plane
D02 D04 A02 A03
OADM module
The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01–D04 four wavelengthsfrom the signal. These four dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds four wavelengths through optical interfaces A01–A04 and
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multiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.
Control and communication modulel Controls the entire board operation.
l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.
l Communicates data with the SCC.
DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.
11.7.4 Front PanelOn the front panel of the MR4, there are board indicators, interfaces and laser safety class label.
Appearance of the Front PanelFigure 11-20 shows the appearance of the front panel of the MR4.
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Figure 11-20 Front panel of the MR4
MR4
MR4
STAT
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
OU
TIN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4
IndicatorOn the front panel of the MR4, there is one board hardware state indicator (STAT), which is redor green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type andusage of the optical interfaces.
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Table 11-23 Optical interfaces of the MR4
Interface InterfaceType
Usage
A1–A4 LC Receive the signals output from the optical wavelengthconverting board or centralized client-side equipment.
D1–D4 LC Transmit signals to the optical wavelength convertingboard or centralized client-side equipment.
IN LC Receives multiplexed signals.
OUT LC Transmits multiplexed signals.
MI LC Acts as a concatenation input optical interface andconnects to the output optical interfaces of otherOADM boards.
MO LC Acts as a concatenation output optical interface andconnects to the input optical interfaces of other OADMboards.
11.7.5 Valid SlotsThe MR4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.7.6 Board Feature CodeThe feature code of the MR4 has eight numbers, which identify the frequency of the first andfourth channels of optical signals the board process.
Table 11-24 lists the details on the board feature code.
Table 11-24 Board feature code
Barcode Indication Description
First four characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the first channelof optical signals.
Last four characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the fourthchannel of optical signals.
For example, the feature code of the TN11MR4 is 92109240.
l "9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.
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l "9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.
The four channels of optical signals the MR4 processes are successive:
l The frequency of the second channel of optical signals is 192.20 THz.
l The frequency of the third channel of optical signals is 192.30 THz.
11.7.7 Technical SpecificationsThe technical specifications of the MR4 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-25 lists the specifications of the optical interfaces of the MR4.
Table 11-25 Specifications of the optical interfaces of the MR4
OpticalInterface
Item Specification
- Working wavelength range(nm)
1529 to 1561
- Channel spacing (GHz) 100
IN-D1IN-D2IN-D3IN-D4
0.5 dB passband bandwidth(nm)
≥ ±0.11
Insertion loss in thewavelength-droppingchannel (dB)
≤ 2.2
Adjacent channel isolation(dB)
> 25
Non-adjacent channelisolation (dB)
> 35
A1-OUTA2-OUTA3-OUTA4-OUT
0.5 dB passband bandwidth(nm)
≥ ±0.11
Insertion loss in thewavelength-adding channel(dB)
≤ 2.2
IN-MOMI-OUT
Insertion loss (dB) ≤ 1.5
Isolation (dB) > 13
- Return loss (dB) > 40
Laser Safety Class
The safety class of the laser on the board is CLASS 1M.
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The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).
Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.9
Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the MR4 is 0.2 W.
l In the high temperature (55℃), the maximum power consumption of the MR4 is 0.3 W.
11.8 LWXThis section describes the LWX, an arbitrary rate wavelength converting board, in terms of theversion, function, principle, front panel, configuration and specifications.
11.8.1 Version DescriptionThe functional version of the LWX board is N1.
11.8.2 Function and FeatureThe LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
11.8.3 Working Principle and Signal FlowThe LWX consists of the O/E conversion module, cross-connect module, CDR module and soon.
11.8.4 Front PanelOn the front panel of the LWX, there are indicators and interfaces.
11.8.5 Valid SlotsThe LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The feature code ofthe LWX indicates the schemes the optical interfaces use to receive and transmit signals.
11.8.7 Technical SpecificationsThe technical specifications of the LWX cover the optical interface specifications, boarddimensions, weight and power consumption.
11.8.1 Version DescriptionThe functional version of the LWX board is N1.
11.8.2 Function and FeatureThe LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
The LWX supports the optical wavelength convertion, 3R, protection, and loopback.
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Table 11-26 lists the functions and features of the LWX.
Table 11-26 Functions and features of the LWX
Functionand Feature
LWX
Basicfunction
Realizes the convertion between the wavelength at an arbitrary rate at theclient side and the wavelength compliant with ITU-T G.692 (DWDM).Transparently transmits signals.
3R function Provides the 3R function for the signals at the client side ranging from 10Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate.
Protectionscheme
Single fed and singlereceiving
Supports the inter-board protection and 1+1 inter-board hot backup. The switching time is less than 50ms.
Dual fed andselective receiving
Supports the intra-board protection. The opticalchannel protection can be realized by one board. Theswitching time is less than 50 ms.
ALS function Supports the ALS function. When no signals are received, the correspondingoptical transmit module is automatically turned off.
Loopbackfunction
Provides the inloop and outloop at the optical interface level, which are usedfor locating faults.
Performanceand alarmmonitoring
Provides rich alarms and performance events for easy maintenance.
Centralwavelength
Supports the ITU-T-compliant standard wavelength with a channel spacingof 100 GHz.
11.8.3 Working Principle and Signal FlowThe LWX consists of the O/E conversion module, cross-connect module, CDR module and soon.
Figure 11-21 shows the block diagram for the functions of the LWX.
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Figure 11-21 Block diagram for the functions of the LWX
-48 V/ -60 V
-48 V/ -60 V
LOS
Laser shut down
SCC Unit
Referenceclock
Multi-rateCDR
2×2 Cross-connection
Multi-rate
CDR
2×2 Cross-connection
Data
Reference clock
Loopback control
Loopback control
LOSLaser shut down
LOS
communicationand control
module
WDM sideloopback
Client side loopback
Clock
Data
Optical module 2at WDM side
10 Mbit/s~2.7 Gbit/sO/E
10 Mbit/s~2.7 Gbit/s
10 Mbit/s~2.7 Gbit/s
Optical module 1at WDM side
Opticalsplitter
O/E
O/E
Optical module at
client side
O/E
O/E
+3.3 V backuppower
+3.3 VDC/DC
converterFuse
Fuse
DC/DCconverter
+1.8 V
+1.5 V+ 5 V
10 Mbit/s~2.7 Gbit/s
10 Mbit/s~2.7 Gbit/s
Communication
communicationand control
module
module
module
O/E Conversion Modulel The optical module at client side applies SFP encapsulation and can be configured as
different types of optical module. This module supports accessing optical signals at the rateof 10 Mbit/s-2.7 Gbit/s.
l At WDM side, the module can be configured as an optical tranceiver module or an opticaltranceiver module and an optical receiver module. When two modules are configured atWDM side, an optical splitter is used to realize dual feeding.
l In the receive direction, the module converts the received optical signals into electricalsignals.
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l In the transmit direction, the module converts the electrical signals into SDH optical signals,and then send optical signals to fibers for transmission.
l Detect the R_LOS alarm and provide the function to shut down the laser.
Cross-connect Modulel Supports data selection from client side to WDM side and from WDM side to client side
l Supports WDM side optical module selection
l Supports loopback of client side signals
l Supports loopback of WDM side signals
CDR Modulel Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s
l Supports reading rates of accessed services
Communication and Control Modulel Supports Ethernet communication
l Supports reference clock of the CDR module
l Selects and configures services of other modules
l Implements laser controlling function
l Selects the clock from the active or the standby cross-connect board
l Control the indicator on the board
DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The –48 V/–60 V voltage is converted to the followingvoltages: +1.5 V, +3.3 V, +1.8 V and ±5 V. In addition, this module provides protection for theboard +3.3 V power supply.
11.8.4 Front PanelOn the front panel of the LWX, there are indicators and interfaces.
Appearance of the Front PanelFigure 11-22 shows the appearance of the front panel of the LWX.
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Figure 11-22 Front panel of the LWX
LWX
LWX
STATACTPROGSRV
CLASS 1LASER
PRODUCT
TXR
XO
UT1
IN1
OU
T2IN
2
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type andusage of the optical interfaces.
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Table 11-27 Optical interfaces on the front panel of the LWX
Interface InterfaceType
Usage
IN1/IN2 LC Receives signals from the optical add/drop multiplexingboard, MR2A.
OUT1/OUT2 LC Transmits signals to the optical add/drip multiplexingboard, MR2A.
TX LC Transmits signals to the client-side equipment.
RX LC Receives signals from the client-side equipment.
Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.
11.8.5 Valid SlotsThe LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
11.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The feature code ofthe LWX indicates the schemes the optical interfaces use to receive and transmit signals.
Table 11-28 lists the relation between the board feature code and the receive/transmit scheme.
Table 11-28 Relation between the board feature code and the receive/transmit scheme
Board Barcode Feature Code Receive/Transmit Scheme
SSN1LWX01 01 Single-fed single selective
SSN1LWX02 02 Dual-fed single selective
11.8.7 Technical SpecificationsThe technical specifications of the LWX cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 11-29 and Table 11-30 list the specifications of the client-side and WDM-side opticalinterfaces of the LWX.
Table 11-29 Specifications of the client-side optical interfaces of the LWX
Item Specification
Nominal bit rate 10 Mbit/s to 2.7 Gbit/s
Line code NRZ
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Item Specification
Optical source type SLM SLM SLM
Transmissiondistance (km)
15 40 80
Feature of the transmitter at S point
Working wavelengthrange (nm)
1260 to 1360 1260 to 1360 1500 to 1580
Max. mean launchedoptical power (dBm)
0 +3 +3
Min. mean launchedoptical power (dBm)
–5 –2 –2
Min. extinction ratio(dB)
+8.2 +8.2 +8.2
Side modesuppression ratio(dB)
30 30 30
Eye pattern Compliant with thetemplate defined inITU-T G.957Recommendations
Compliant with thetemplate defined inITU-T G.957Recommendations
Compliant with thetemplate defined inITU-T G.957Recommendations
Feature of the receiver at S point
Receiver type PIN PIN APD
Wavelength range(nm) of the receivedsignals
1200 to 1600 1200 to 1600 1200 to 1600
Receiver sensitivity(dBm)
–18 –18 –28
Min. overload (dBm) 0 –9 –9
Max. reflectioncoefficient (dB)
–27 –27 –27
Table 11-30 Specifications of the WDM-side optical interfaces of the LWX
Item Specification
Channelspacing (GHz)
100
Line code NRZ
Feature of the transmitter at Sn point
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Item Specification
Targettransmissiondistance (km) ofopticalinterfaces
640 170 (2 mW) 170 (10 mW) 360
Max. meanlaunched opticalpower (dBm)
–2 –2 +7 –2
Min. meanlaunched opticalpower (dBm)
+3 +3 +5 +3
Min. extinctionratio (dB)
+10 +10 +10 +10
Nominal centralfrequency(THz)
192.10 to196.00
192.10 to196.00
192.10 to196.00
192.10 to196.00
Centralfrequencydeviation (GHz)
±12.5 ±12.5 ±12.5 ±12.5
Max. –20 dBspectral width(nm)
0.2 0.4 0.4 0.4
Min. side modesuppressionratio (dB)
35 35 35 35
Dispersioncompensation(ps/nm)
12800 2400 3200 1600
Eye pattern Compliant withthe templatedefined in ITU-T G.957Recommendations
Compliant withthe templatedefined in ITU-T G.957Recommendations
Compliant withthe templatedefined in ITU-T G.957Recommendations
Compliant withthe templatedefined in ITU-T G.957Recommendations
Feature of the receiver at Rn point
Receiver type APD PIN
Receivingwavelengthrange (nm)
1200 to 1600 1200 to 1600
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Item Specification
Receiversensitivity(dBm)
–28 –18
Min. overload(dBm)
–9 0
Max. reflectioncoefficient (dB)
–27 –27
Mechanical Specifications
The mechanical specifications of the LWX are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.1
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the LWX is 30 W.
11.9 OBU1This section describes the TN11OBU1, an optical booster amplifier board, in terms of theversion, function, principle, front panel, configuration and specifications.
11.9.1 Version DescriptionThe functional version of the OBU1 is TN11.
11.9.2 Function and FeatureThe OBU1 supports the in-service optical performance monitoring, gain-locking technology,and transient control technology.
11.9.3 Working Principle and Signal FlowThe OBU1 consists of the EDFA optical module, optical splitter, and the control andcommunication module.
11.9.4 Front PanelOn the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.
11.9.5 Valid SlotsThe OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.9.6 Board Feature CodeThe feature code of the OBU1 contains six characters and indicates the gain and maximumnominal input optical power of the optical signals.
11.9.7 Technical SpecificationsThe technical specifications of the OBU1 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
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11.9.1 Version DescriptionThe functional version of the OBU1 is TN11.
11.9.2 Function and FeatureThe OBU1 supports the in-service optical performance monitoring, gain-locking technology,and transient control technology.
Table 11-31 lists the functions and features of the OBU1.
Table 11-31 Functions and features of the OBU1
Function andFeature
OBU1
Basic function Amplifies a maximum of 40-channel optical signals (channel spacing:100 GHz) at the same time.Supports the transmission without electrical trunks for different spans.
Typical gain The typical gain of the OBU101 is 20 dB. The typical gain of theOBU102 is 23 dB.
In-service opticalperformancemonitoring
Provides in-service performance monitoring optical interface. A smallvolume of optical signals are output at the optical interface to the opticalspectrum analyzer or optical spectrum analyzing board. The opticalspectrum analyzer or optical spectrum analyzing board monitors themultiplexed optical signals and optical performance withoutinterrupting services.
Gain-lockingtechnology
The EDFA of the board has the gain-locking function. When one ormore channels are added or dropped, or optical signals of certainchannels fluctuate, the signal gains of other channels are not affected.
Transient controltechnology
The EDFA of the board has the transient control function. Whenchannels are added or dropped, the system can be upgraded or expandedwithout interrupting services if the optical power fluctuation issuppressed.
Performance andalarm monitoring
Checks and reports the optical power.Controls the temperature of the pumping laser.Checks the pumping drive current, back facet current, cooling current,temperature of the pumping laser, and the ambient temperature of theboard.
NOTE
The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102is used at the transmit end.
11.9.3 Working Principle and Signal FlowThe OBU1 consists of the EDFA optical module, optical splitter, and the control andcommunication module.
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Figure 11-23 shows the block diagram for the functions of the OBU1.
Figure 11-23 Block diagram for the functions of the OBU1
Control and communication module
IN
Pumping and detection module
Pumpingcurrent
Detecting fortemperature andpumping current
SCC
PIN
EDFA optical module Splitter
Power supply module
+5 V DC/DCconverter
-48 V/-60 V
+5 V DC/DCconverter
+5 V
Delayedstartup
Fuse
-48 V/-60 V
Backplane
Signal Flow
The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA opticalmodule. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1also outputs few monitoring signals to the test instrument for performance analysis.
EDFA Optical Module
The EDFA module is used to amplify the input optical signals. The EDFA optical module appliesthe gain auto-adjustment technology. With this technology, the EDFA can change the gain ofworking wavelength signals in the allowed range.
Optical Splitter
The splitter is used to split the optical signals received from the EDFA optical module into twochannels of signals with different power. One channel of signlas are output from OUT opticalinterface and then transmitted in the main optical channel. The other channel of signals are outputto the MON port for sepctrum detection and monitoring. The power of signals at the MON isone ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is20 dB lower than that at the OUT interface.
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Control and Communication ModuleThe control and communication module is used to control and monitor the functional modulesof the board, and to manage the communication.
This module collects the information on alarms and performance events, and data of workingstatus and voltage detection of each functional module. This module then reports the informationand data to the SCC.
The control and communication module receives commands from the SCC to control andcoordinate the working of each functional module.
11.9.4 Front PanelOn the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.
Appearance of the Front PanelFigure 11-24 shows the appearance of the front panel of the OBU1.
Figure 11-24 Front panel of the OBU1
OBU1
OBU1
MO
NO
UT
IN
STATACTPROGSRV
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
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Indicators
The following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists thetype and usage of the optical interfaces.
Table 11-32 Optical interfaces of the OBU1
Interface InterfaceType
Usage
IN LC Inputs multiplexed signals to be amplified.
OUT LC Outputs the amplified multiplexed signals.
MON LC Connects to the test instrument to monitor the in-service performance.
11.9.5 Valid SlotsThe OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.
11.9.6 Board Feature CodeThe feature code of the OBU1 contains six characters and indicates the gain and maximumnominal input optical power of the optical signals.
Table 11-33 lists the details on the board feature code.
Table 11-33 Feature code of the OBU1
Barcode Indication Description
First character – Fixed as G
Next two (2–3) characters Gain Gain
Fourth character – Fixed as I
Last two (5–6) characters Maximum nominal inputoptical power
Maximum nominal inputoptical power
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For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that thegain is 23 dB and the maximum nominal input optical power is –3 dBm.
11.9.7 Technical SpecificationsThe technical specifications of the OBU1 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.
Optical Interface Specifications
Table 11-34 lists the specifications of the optical interfaces of the OBU1.
Table 11-34 Specifications of optical interfaces of the OBU1
Item Specification
OBU1C01 OBU1C02
Working wavelength range (nm) 1529 to 1561 1529 to 1561
Range of input optical power(dBm)
–32 to –4 –32 to –3
Range of output optical power(dBm)
–12 to 16 –9 to 20
Input power (dBm) of a typicalsingle wavelength
–20 –19
Maximum nominal output opticalpower (dBm) of a singlewavelength
0 4
Path gain (dB) 20±1.5 23±1.5
Noise figure (dB) ≤ 5.5 ≤ 6.0
Gain flatness (dB) ≤ 2.0 ≤ 2.0
Pre-incline of the gain spectralform
0±0.2 1.0±0.2
Laser Safety Class
The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).
Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.3
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Power Consumptionl The power consumption of OBU101:
– In the normal temperature (25℃), the maximum power consumption of the OBU1 is16 W.
– In the high temperature (55℃), the maximum power consumption of the OBU1 is 17.6W.
l The power consumption of OBU102:– In the normal temperature (25℃), the maximum power consumption of the OBU1 is
18 W.– In the high temperature (55℃), the maximum power consumption of the OBU1 is 19.8
W.
11.10 FIBThis section describes the FIB, a wavelength filter and isolation board, in terms of the version,function, principle, front panel, configuration and specifications.
11.10.1 Version DescriptionThe functional version of the FIB board is N1.11.10.2 Function and FeatureThe FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.11.10.3 Working Principle and Signal FlowThe FIB consists of an isolator and a filter.11.10.4 Front PanelOn the front panel of the FIB, there are two pairs of optical interfaces.11.10.5 Valid SlotsThe FIB can be housed in any of slots 12–13 in the subrack.11.10.6 Technical SpecificationsThe technical specifications of the FIB cover the optical interface specifications, boarddimensions, weight and power consumption.
11.10.1 Version DescriptionThe functional version of the FIB board is N1.
11.10.2 Function and FeatureThe FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.
The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, asingle-wavelength long distance board, the FIB can realize long-distance optical regenerationtransmission. Figure 11-25 shows the position of the FIB in an optical transmission system.
Figure 11-25 Location of the FIB in the optical transmission system.
G.652ROP Filter
1550.12
a(54dB) b(18dB)
C
BA17G.652
ROP 1550.12
a(54dB) b(18dB)
(single span)
ISOàSingle span Optical receiverErbium doped
FIB
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Table 11-35 lists the functions and features of the FIB.
Table 11-35 Functions and features of the FIB
Function andFeature
FIB
Optical isolator The isolator lets optical signals pass in a unidirectional manner. Theworking wavelength ranges from 1529 nm to 1561 nm.
Optical filter The filter filters all signals carried in wavelengths except those in the1550.12 nm wavelength.
11.10.3 Working Principle and Signal FlowThe FIB consists of an isolator and a filter.
Figure 11-26 shows the block diagram for the functions of the FIB.
Figure 11-26 Block diagram for the working principle of the FIB
Isolator Filter
After travelling for a long distance in fibers, optical signals are heavily attenuated and thendegraded. The degraded signals cannot be normally received by optical receiver. In this case,the ROP should be used to amplify the gain of the optical signals. The ROP has high opticalpower. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths.
The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters allsignals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way,the optical receiver can normally receive optical signals.
11.10.4 Front PanelOn the front panel of the FIB, there are two pairs of optical interfaces.
Appearance of the Front PanelFigure 11-27 shows the appearance of the front panel of the FIB.
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Figure 11-27 Front panel of the FIB
FIB
FIB
OU
TIN
CLASS1LASER
PRODUCT
InterfacesOn the front panel of the FIB, there are a LC optical interface and a E2000 optical interface,which are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfacesuse pluggable optical modules for easy maintenance.
Table 11-36 Optical interfaces of the FIB
Interface InterfaceType
Usage
IN E2000 Receive 1-channel 2.5 Gbit/s optical signals.
OUT LC Transmit 1-channel 2.5 Gbit/s optical signals.
11.10.5 Valid SlotsThe FIB can be housed in any of slots 12–13 in the subrack.
11.10.6 Technical SpecificationsThe technical specifications of the FIB cover the optical interface specifications, boarddimensions, weight and power consumption.
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Optical Interface SpecificationsTable 11-37 lists the specifications of the optical interfaces of the FIB.
Table 11-37 Specifications of the optical interfaces of the FIB
Item Specification
Nominal bit rate 2488320 kbit/s
Line code NRZ
Central wavelength(nm)
1550.12±0.05
–0.5 dB bandwidth(nm)
> 0.4
Mechanical SpecificationsThe mechanical specifications of the FIB are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 0.4
Power ConsumptionThe FIB does not consume power.
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12 Optical Amplifier Boards andDispersion Compensation Boards
About This Chapter
This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and thedispersion compensation boards, such as the DCU.
12.1 BA2This section describes the BA2, 2-channel optical booster amplifier board, in terms of theversion, function, working principle, front panel and specifications.
12.2 BPAThis section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, interms of the version, function, principle, front panel and specifications.
12.3 COAThis section describes the COA, a case-shaped optical amplifier, in terms of the version, function,principle, front panel, installation position and specifications.
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12.1 BA2This section describes the BA2, 2-channel optical booster amplifier board, in terms of theversion, function, working principle, front panel and specifications.
12.1.1 Version DescriptionThe functional version of the BA2 board is N1.
12.1.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAshould be used, and thus the optical receiver can normally receive optical signals.
12.1.3 Working Principle and Signal FlowThe BA2 consists of the EDFA module, control module, communication module, and DC/DCconverter module.
12.1.4 Front PanelOn the front panel of the BA2, there are indicators and interfaces.
12.1.5 Valid SlotsThe BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
12.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BA2 indicates the output optical power of the optical interfaces.
12.1.7 Technical SpecificationsThe technical specifications of the BA2 cover the optical interface specifications, boarddimensions, weight and power consumption.
12.1.1 Version DescriptionThe functional version of the BA2 board is N1.
12.1.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAshould be used, and thus the optical receiver can normally receive optical signals.
Figure 12-1 shows the location of the BA in the optical transmission system.
Figure 12-1 Location of the BA in the optical transmission system
BATransmit Receive
The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions andfeatures of the BA2.
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Table 12-1 Functions and features of the BA2
Function andFeature
BA2
Basic function Increases the launched optical power of the line board to 13–15 dBmor 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275dB/km is used, the transmission distance can be 120 km, 130 km, orabove.
EDFA Automatically controls the optical power and laser temperature of theEDFA module.Automatically monitors the input and output optical power of the EDFAmodule and queries the optical power.Protects the EDFA module. When no optical signals are input, the laseris automatically turned off. When optical signals are input, the laser isautomatically turned on.
Performance andalarm monitoring
Reports the performance parameters of the laser. Provides rich alarmsand performance events for easy management and maintenance of theequipment.
Software upgrade Supports the software upgrade and expansion without interruptingservices.
NOTE
The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off ifno input signals are detected on the receive end of the line board. Thus, this function is used to prevent thehigh laser power from damaging eyes.
12.1.3 Working Principle and Signal FlowThe BA2 consists of the EDFA module, control module, communication module, and DC/DCconverter module.
Figure 12-2 shows the block diagram for the functions of the BA2.
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Figure 12-2 Block diagram for the functions of the BA2
Fiberdistributor
Inputisolate
DopederbiumfiberWDM
coupler
Laser pumpInputpower
monitor(Pin1)
Outputpower
monitor(Pin2)
Opticalsplitter
TemperaturePumpcurrentdetect
Pumpcurrent
Filter
Pumptemperature
control
Lasershutdown
Inputpower
Outputpower
LOS inManualcontrol
SCC unitCommunication
Optical output
AD/DA
Control&Generation alarms
Optical input Outputisolate
Communicationmodule
EDFA module
Control module
+3.3 V backuppower
+3.3 V DC/DCconverter Fuse
Fuse
DC/DCconverter
5 V
-48 V/ -60 V
-48 V/ -60 V
module
module
EDFA ModuleThe optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does nothave the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.
Control ModuleThe control module:
l Detects and drives bump electricity
l Controls the pump temperature of laser
l Detects input and output power
l Reports alarms
The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/output
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optical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.
Communication ModuleThe communication module supports ethernet communication.
DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.
12.1.4 Front PanelOn the front panel of the BA2, there are indicators and interfaces.
Appearance of the Front PanelFigure 12-3 shows the appearance of the front panel of the BA2.
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Figure 12-3 Front panel of the BA2
BA2
BA2
STATACTPROGSRV
OU
T1O
UT2
IN1
IN2
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesOn the front panel of the BA2, there are two pairs of LC optical interfaces, which use thepluggable optical modules for easy maintenance. Table 12-2 lists the type and usage of theseoptical interfaces.
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Table 12-2 Optical interfaces of the BA2
Interface InterfaceType
Usage
IN1 LC Receives the first channel of optical signals.
OUT1 LC Transmits the first channel of optical signals.
IN2 LC Receives the second channel of optical signals.
OUT2 LC Transmits the second channel of optical signals.
12.1.5 Valid SlotsThe BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
12.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BA2 indicates the output optical power of the optical interfaces.
Table 12-3 lists the relation between the board feature code and the output optical power.
Table 12-3 Relation between the board feature code and output optical power for the BA2
Board Barcode Feature Code Output Optical Power
SSN1BA201 01 14 dBm for dual-channeloptical power amplification
SSN1BA202 02 17 dBm for dual-channeloptical power amplification
SSN1BA203 03 14 dBm for optical poweramplification
SSN1BA204 04 17 dBm for optical poweramplification
SSN1BA205 05 14 or 17 dBm for dual-channeloptical power amplification
12.1.7 Technical SpecificationsThe technical specifications of the BA2 cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface Specifications
Table 12-4 lists the specifications of the optical interfaces of the BA2.
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Table 12-4 Specifications of the optical interfaces of the BA2
Item Specification
Nominal bit rate 2488320 kbit/s and 9953280 kbit/s
Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2
Line code NRZ
Input wavelength (nm) BA: 1530 to 1565
Range of input opticalpower (dBm)
BA: –6 to +3
Output optical power(dBm)
BA: 13 to 15 or 15 to 17
Noise figure (dB) BA: < 6.5
Mechanical SpecificationsThe mechanical specifications of the BA2 are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power Consumption
In the normal temperature (25℃), the maximum power consumption of the BA2 is 20 W.
12.2 BPAThis section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, interms of the version, function, principle, front panel and specifications.
12.2.1 Version DescriptionThe functional version of the BPA board is N1.
12.2.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAand PA should be used, and thus the optical receiver can normally receive optical signals.
12.2.3 Working Principle and Signal FlowThe BPA consists of the EDFA module, control module, communication module, and DC/DCconverter module.
12.2.4 Front PanelOn the front panel of the BPA, there are indicators and interfaces.
12.2.5 Valid SlotsThe BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
12.2.6 Board Feature Code
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The code behind the board name in the barcode is the board feature code. The board feature codeof the BPA indicates the output optical power of the optical interfaces.
12.2.7 Technical SpecificationsThe technical specifications of the BPA cover the optical interface specifications, boarddimensions, weight and power consumption.
12.2.1 Version DescriptionThe functional version of the BPA board is N1.
12.2.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAand PA should be used, and thus the optical receiver can normally receive optical signals.
Figure 12-4 shows the location of the BA and PA in the optical transmission system.
Figure 12-4 Location of the BA and PA in the optical transmission system
BA
PA Receive
Transmit
Transmit
Receive
Table 12-5 lists the functions and features of the BPA.
Table 12-5 Functions and features of the BPA
Function andFeature
BPA
Basic function Increases the launched optical power of the line board to 13–15 dBmor 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275dB/km is used, the transmission distance can be 120 km, 130 km, orabove.
Function of the PA Provides the PA module to preamplify the received optical signals.Increases the power of the small volume of optical signals by 22–25dB, and thus enhances the sensitivity of the receiver to –37 dBm.
EDFA l Automatically controls the optical power and laser temperature ofthe EDFA module.
l Automatically monitors the input and output optical power of theEDFA module and queries the optical power.
l Protects the EDFA module. When no optical signals are input, thelaser is automatically turned off. When optical signals are input, thelaser is automatically turned on.
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Function andFeature
BPA
Performance andalarm monitoringa
Reports the performance parameters of the laser. Provides rich alarmsand performance events for easy management and maintenance of theequipment.
Software upgrade Supports the software upgrade and expansion without interruptingservices.
a:The BPA does not support the alarm in the test state and the query of the power supplyvoltage.
12.2.3 Working Principle and Signal FlowThe BPA consists of the EDFA module, control module, communication module, and DC/DCconverter module.
Figure 12-5 shows the block diagram for the functions of the BPA.
Figure 12-5 Block diagram for the working principle of the BPA
Fiberdistributor
Inputisolate
DopederbiumfiberWDM
coupler
Laser pumpInputpower
monitor(Pin1)
Outputpower
monitor(Pin2)
Opticalsplitter
TemperaturePumpcurrentdetect
Pumpcurrent
Filter
Pumptemperature
control
Lasershutdown
Inputpower
Outputpower
LOS inManualcontrol
SCC unitCommunication
Optical output
AD/DA
Control&Generation alarms
Optical input Outputisolate
Communicationmodule
EDFA module
Control module
+3.3 V backuppower
+3.3 V DC/DCconverter Fuse
Fuse
DC/DCconverter
5 V
-48 V/ -60 V
-48 V/ -60 V
module
module
EDFA ModuleThe optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does not
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have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.
Control ModuleThe control module:
l Detects and drives bump electricity
l Controls the pump temperature of laser
l Detects input and output power
l Reports alarms
The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/outputoptical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.
Communication ModuleThe communication module supports ethernet communication.
DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.
12.2.4 Front PanelOn the front panel of the BPA, there are indicators and interfaces.
Appearance of the Front PanelFigure 12-6 shows the appearance of the front panel of the BPA.
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Figure 12-6 Front panel of the BPA
BPA
BPA
STATACTPROGSRV
POU
TB
OU
TB
INPIN
IndicatorsThe following indicators are present on the front panel of the board:
l Board hardware state indicator (STAT), which is green or red when lit.
l Service activating state indicator (ACT), which is green when lit.
l Board software state indicator (PROG), which is green or red when lit.
l Service alarm indicator (SRV), which is red, green or yellow when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesOn the front panel of the BPA, there are two pairs of LC optical interfaces, which use thepluggable optical modules for easy maintenance. Table 12-6 lists the type and usage of theseoptical interfaces.
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Table 12-6 Optical interfaces of the BPA
Interface InterfaceType
Usage
BIN LC Receives one channel of optical signals for amplification.
BOUT LC Transmits one channel of amplified optical signals.
PIN LC Receives one channel of optical signals for pre-amplification.
POUT LC Transmits one channel of pre-amplified optical signals.
12.2.5 Valid SlotsThe BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.
12.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BPA indicates the output optical power of the optical interfaces.
Table 12-7 lists the relation between the board feature code and the output optical power.
Table 12-7 Relation between the board feature code and output optical power for the BPA
Board Barcode Feature Code Description
SSN1BPA01 01 Receiver sensitivity of the PAmodule: –37 dBmOutput optical power of the BAmodule: 14 dBm
SSN1BPA02 02 Receiver sensitivity of the PAmodule: –37 dBmOutput optical power of the BAmodule: 17 dBm
12.2.7 Technical SpecificationsThe technical specifications of the BPA cover the optical interface specifications, boarddimensions, weight and power consumption.
Optical Interface SpecificationsTable 12-8 lists the specifications of the optical interfaces of the BPA.
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Table 12-8 Specifications of the optical interfaces of the BPA
Item Specification
Nominal bit rate 2488320 kbit/s and 9953280 kbit/s
Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2
Line code NRZ
Input wavelength (nm) BA: 1530 to 1565PA: 1550.12
Range of input opticalpower (dBm)
BA: –6 to +3PA: –10 to –37
Output optical power(dBm)
BA: +13 to +15 or +15 to +17
Sensitivity (dBm) PA: –37
Noise figure (dB) BA: < 6.5PA: < 6
NOTE
When performing loopback to the PA module of the BPA, prevent the damage caused by high input opticalpower to the optical module.
Mechanical SpecificationsThe mechanical specifications of the BPA are as follows:
l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the BPA is 20 W.
12.3 COAThis section describes the COA, a case-shaped optical amplifier, in terms of the version, function,principle, front panel, installation position and specifications.
12.3.1 Version DescriptionThe COA has three versions, 61, 62 and N1.
12.3.2 Function and FeatureThe COA is used to integrate the EDFA module, drive circuit, and communication circuit in analuminium case.
12.3.3 Working Principle and Signal FlowThe 61COA and N1COA consist of the EDFA module, control module, communication module,and DC/DC converter module.
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12.3.4 Front PanelOn the front panel of the COA, there are indicators and interfaces.
12.3.5 Installation PositionThe COA is case-shaped, and thus it is does not occupy a slot in the subrack.
12.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the 61COA indicates the output optical power of the optical interfaces.
12.3.7 Technical SpecificationsThe technical specifications of the COA cover the dimensions, weight and power consumption.
12.3.1 Version DescriptionThe COA has three versions, 61, 62 and N1.
The 62COA, 61COA and N1COA share the working principle. The difference among them liesin the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module.The 61COA and N1COA use the EDFA optical amplifier module.
Table 12-9 lists the details on the versions of the COA.
Table 12-9 Version Description of the COA
Item Description
Functionalversion
The COA has three versions, 61, 62, and N1.
Difference The 61COA is the EDFA optical amplifier in the 1550-nm fibercommunication window.The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nmfiber communication window.The N1COA does not have the filter and is a multi-wavelength amplifier.The 62COA uses the Raman optical amplifier module.
Replaceability The versions cannot be replaced by each other.
12.3.2 Function and FeatureThe COA is used to integrate the EDFA module, drive circuit, and communication circuit in analuminium case.
The COA is an external and independent amplifier, which does not occupy a slot and can workindependently. The maximum numbers of the 61COA, N1COA, and 62COA that can beconfigured in a system are two, two, and one respectively.
61COA and N1COAThe 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFAoptical module and be used as the BA, PA, or LA. Figure 12-7 shows the appearance of the61COA and N1COA.
The optical features of the 61COA are the same as those of the BPA and BA2. The maindifference is that the 61COA and N1COA are external optical amplifier units, which are directly
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installed in the ETSI cabinetwithout occupying slots in the subrack and are independentlypowered.
Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)
The application of the 61COA and N1COA in the optical transmission system is the same asthat of the BA2 and BPA. Table 12-10 lists the functions and features of the 61COA and N1COA.
Table 12-10 Functions and features of the 61COA and N1COA
Function andFeature
61COA and N1COA
Function of the BA The 61COA enhances the launched optical power to 13–15 dBm or15–17 dBm, and thus the valid transmission distance of opticalsignals can be extended.
Function of the PA The N1COA is a PA, with a receiver sensitivity of –38 dBm.
Automatic laser shut-down
Supports the ALS function.
Function of the serialcommunication
Communicates with the CXL through the RS232 serial port, reportsthe alarms and performance events from the COA to the T2000, andreceives the configuration commands issued by the T2000.
62COAThe 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDHequipment.
The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Ramanamplification. Different from that of the 61COA, the gain medium of Raman amplification isthe line fiber that can realize better noise performance. Thus, the 62COA can extend thetransmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission fora single span.
Figure 12-8 lists the appearance of the 62COA.
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Figure 12-8 Appearance of the case-shaped 62COA
5
12
3
4
1. Captive screw 2. Ejector lever 3. COA board4. ESD jack 5. Power access board
The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmissionsystem. During the transmission, the 62COA amplifies optical signals based on the stimulatedRaman scattering of the fiber. The 62COA provides optical transmission for more than 170 km,when used with the EDFA. See Figure 12-9.
Figure 12-9 Application of the optical Raman amplifier (62COA)
Transmitting end
Opticalreceiver
Pump light
Receiving end
Signal light
Laser
EDFA Pump light
Fiber
Raman Amplifier
Coupler
During the optical transmission, the Raman amplifier amplifies optical signals by inputingcounter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus,the phase of optical signals is significantly different from that of pumping signals. The powerfluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise causedby the pumping can be effectively suppressed.
Table 12-11 lists the functions and features of the 62COA.
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Table 12-11 Functions and features of the 62COA
Function andFeature
62COA
Basic function Configured at the receive end of the SDH system, and provides extralong-haul transmission (more than 170 km), when used with anEDFA at the transmit end with an output power of 17 dBm.
Function of the PA The 62COA is a PA, with a receiver sensitivity of -39 dBm.
Automatic laser shut-down
Supports the ALS function.
Function of the serialcommunication
Communicates with the CXL through the RS232 serial port, reportsthe alarms and performance events from the COA to the T2000, andreceives the configuration commands issued by the T2000.
12.3.3 Working Principle and Signal FlowThe 61COA and N1COA consist of the EDFA module, control module, communication module,and DC/DC converter module.
The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filterunit but the N1COA does not.
Figure 12-10 shows the block diagram for the functions of the 61COA and N1COA.
Figure 12-10 Block diagram for the functions of the 61COA and N1COA
Fiberdistributor
Inputisolate
DopederbiumfiberWDM
coupler
Laser pumpInputpower
monitor(Pin1)
Outputpower
monitor(Pin2)
Opticalsplitter
TemperaturePumpcurrentdetect
Pumpcurrent
Filter
Pumptemperature
control
Lasershutdown
Inputpower
Outputpower
LOS inManualcontrol
SCC unitCommunication
Optical output
AD/DA
Control&Generation alarms
Optical input Outputisolate
Communicationmodule
EDFA module
Control module
+3.3 V backuppower
+3.3 V DC/DCconverter Fuse
Fuse
DC/DCconverter
5 V
-48 V/ -60 V
-48 V/ -60 V
module
module
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EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does nothave the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.
Control Module
The control module:
l Detects and drives bump electricity
l Controls the pump temperature of laser
l Detects input and output power
l Reports alarms
The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/outputoptical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.
Communication Module
The communication module supports ethernet communication.
DC/DC Converter Module
Through the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.
12.3.4 Front PanelOn the front panel of the COA, there are indicators and interfaces.
Appearance of the Front Panel
Figure 12-11 shows the appearance of the front panels of the 61COA and N1COA.
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Figure 12-11 Front panel of the 61COA and N1COA
1 2 3 4 5 6 7
8 9 10
11
1. ID DIP switch 2. Running indicator 3. Alarm indicator 4. RS232-15. RS232-2 6. MONITOR-1 7. MONITOR-2 8. IN optical port9. OUT optical port 10. Power switch 11. –48 V power interface
Figure 12-12 shows the appearance of the front panel of the 62COA.
Figure 12-12 Front panel of the 62COA
1. SC/PC optical interface 2. E2000 optical interface 3. Air filter4. Fan board 5. RJ-45
8. DIP switch (8–5 bits) 9. DIP switch (4–1 bits)10. Power input interface 11. Power switch
6. RS232-1-27. RS232
IndicatorsThe following indicators are present on the front panel of the board:
l Board running state (RUN), which is green when lit.
l Fan alarm indicator (ALM), which is red when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesOn the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces,which are used to input or output one channel of optical signals. The input optical interface ofthe 62COA is connected to the E2000 flange and the output optical interface is connected to theSC flange. Figure 12-13 shows the SC/PC optical interfaces of the 61COA and N1COA.
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Figure 12-13 SC/PC fiber connector
Figure 12-14 shows the flange and fiber connector used at the input optical interface of the62COA.
Figure 12-14 E2000 flange and fiber connector
NOTE
The dust cap is specially designed for the E2000 fiber jumper. Do not remove the cap during fiberconnection. For normal fiber connection, directly insert the fiber jumper into the E2000 flange.
The COA has two RS232 serial interfaces, which are connected to the SCC unit for reportingof alarms and performance events.
Table 12-12 lists the pins of the RS232 interface.
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Table 12-12 Pins of the RS232 interface
Front View RS232-1 RS232-2 Definition
1
9
2 2 Pin for receivingdata
3 3 Pin fortransmitting data
5 5 Pin for commongrounding
TIP
For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interfacethrough the serial control cable.
The RS232-2 interface is used in the case of several COA on one NE.
Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to theRS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COAnumbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 tocommunicate with the SCC unit in the subrack.
The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces arethe alarm output interfaces when the 61COA is used separately. The two interfaces are the same.Table 12-13 lists the pins of the MONITOR-1 and MONITOR-2 interfaces.
Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces
Front View MONITOR-1
MONITOR-2 Definition
1
9
1, 6 1, 6 The input optical power of theEDFA module is too low.
2, 7 2, 7 The working current of the pumplaser of the EDFA module crossesthe threshold.
3, 8 3, 8 The cooling current of the pumplaser of the EDFA module crossesthe threshold.
4, 9 4, 9 The ambient temperature of theEDFA crosses the threshold.
5 5 Digital ground.
The 62COA has one RJ-45 connector, through which the 62COA is connected to the computerfor software loading. Table 12-14 lists the pins of the RJ-45 connector of the 62COA.
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Table 12-14 Pins of the RJ-45 connector of the 62COA
Front View Pin Description
8 7 6 5 4 3 2 1
1 Transmitting positive
2 Transmitting negative
3 Receiving positive
4 Not defined
5 Not defined
6 Receiving negative
7–8 Not defined
The COA has a DIP switch.
l The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set theID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside,it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA.
l The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. TheDIP switch has eight bits, from the left to right. The most left one is 8 and the most rightone is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, itmeans 1. The first four bits (1–4) are used to set the board ID, which ranges from 20 to 35and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turnedas 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is ofthe G.655 type.
12.3.5 Installation PositionThe COA is case-shaped, and thus it is does not occupy a slot in the subrack.
In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA isinstalled directly in the cabinet with the mounting ears. On the T2000, the logical slots of the61COA, N1COA, and 62COA are slots 101–102.
Installation of the 61COA or N1COAThe installation of the 61COA is taken as an example. The bracket with guide rails is fixed onthe crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guiderails and then fixed. One bracket can house two 61COA horizontally. The front panel of the61COA is at the front side of the cabinet. Figure 12-15 shows the installation of the 61COA.
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Figure 12-15 Position of the 61COA in the ETSI cabinet
Installation of the 62COAThe case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mountingears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottomof the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied,the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet whichis not fully configured.
12.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the 61COA indicates the output optical power of the optical interfaces.
Table 12-15 lists the relation between the board feature code and the output optical power.
Table 12-15 Relation between the board feature code and output optical power for the 61COA
Board Barcode Feature Code Output Optical Power
SS61COA01 01 14 dBm
SS61COA02 02 17 dBm
12.3.7 Technical SpecificationsThe technical specifications of the COA cover the dimensions, weight and power consumption.
Optical Interface SpecificationsTable 12-16 lists the specifications of the optical interfaces of the COA.
Table 12-16 Specifications of the optical interfaces of the COA
Item Specification
61COA N1COA 62COA
Line code NRZ
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Item Specification
61COA N1COA 62COA
Working wavelength(nm)
1550 1550.12
Range of input opticalpower (dBm)
BA: -6 to +3PA: -10 to -37
-10 to -37 –39 to –20 (2.5 Gbit/s signalswithout FEC)
Output optical power(dBm)
+13 to +15 +15 to +17 NA
Pump wavelength(nm)
NA 1451.2
Max. on/off gain (dB) NA > 15 (for the G.652 fiber)
Noise figure (dB) NA < –1.5
Mechanical SpecificationsThe mechanical specifications of the 61COA and N1COA are as follows:
l Board dimensions (mm): 50 (H) x 190 (D) x 240 (W)
l Weight (kg): 3.5
The mechanical specifications of the 62COA are as follows:
l Board dimensions (mm): 86 (H) x 436 (D) x 294 (W)
l Weight (kg): 8.0
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the 61COA and N1COAis 10 W.
In the normal temperature (25℃), the maximum power consumption of the 62COA is 75 W.
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13 Power Interface Boards
About This Chapter
This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA.
13.1 UPMThis section describes the UPM, an uninterruptable power module, in terms of the version,function, principle, front panel and specifications.
13.2 PIUThis section describes the PIU, a power interface unit, in terms of the version, function, principle,front panel, configuration and specifications.
13.3 PIUAThis section describes the PIUA, a power interface unit, in terms of the version, function,principle, front panel, configuration and specifications.
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13.1 UPMThis section describes the UPM, an uninterruptable power module, in terms of the version,function, principle, front panel and specifications.
13.1.1 Version DescriptionNone13.1.2 Function and FeatureThe UPM, a special power supply system, is coded GIE4805S.13.1.3 Working Principle and Signal FlowThe UPM receives power from one channel of 220 V AC mains supply, which is rectified to –48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DCpower supplies and one channel of battery power supply.13.1.4 Rear PanelOn the rear panel of UPM, there are indicators and interfaces of many types.13.1.5 Valid SlotsThe UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, thelogical slot of the UPM is slot 50.13.1.6 Technical SpecificationsThe technical specifications of the UPM cover dimensions and weight.
13.1.1 Version DescriptionNone
13.1.2 Function and FeatureThe UPM, a special power supply system, is coded GIE4805S.
The UPM directly converts the 110 V or 220 V AC mains to the –48 DC communication voltage.As a result, the requirements of telecommunication carriers who cannot provide the –48 DCpower to communication equipment or who require the usage of the storage battery can be met.
The UPM consists of the power supply case (110 V or 220 V to –48 V) and storage battery. Theoutput power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supplycase with a height of 1U. The power supply case of the UPM can be directly installed in a 19-inch or ETSI cabinet.
Figure 13-1 Appearance of the power supply case
GIE480
5S
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NOTE
One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage andmaintain the UPM.
The storage battery of the UPM is used with the power supply case. If the external AC currentnormally charges the storage battery, the storage battery can provide power for four hours whenthe external 110 V or 220 V AC current is interrupted. When the UPM provides power supplyfor the OptiX OSN equipment, only one power supply case should be connected to the storagebattery group.
The OptiX OSN equipment requires two power supply cases and one storage battery groupcomposed of four 12 V –40 Ah storage batteries. If the equipment does not require the storagebattery, only configure one power supply case. The standard full configuration for each powersupply case requires two rectifier modules and one monitoring module.
Table 13-1 lists the functions and features of the UPM.
Table 13-1 Functions and features of the UPM
Item UPM
Two-channel hotbackup
The converting portion of the UPM has the hot backup function oftwo-channel AC/DC rectifier modules. In addition, the two rectifiermodules with the function of load balance can work at the same. Ifone rectifier module fails, the other one immediately takes over theentire load. As a result, the working equipment is not affected, andthe system stability is enhanced.
Hot swap function In the UPM power supply system, the AC/DC rectifier modules havethe hot swap function. When the faulty rectifier module is removed,the other rectifier module is not affected. Thus, the systemmaintainability is enhanced.
Protection functionfor the storagebattery
The UPM can protect the storage battery. When the mains supply isinterrupted, the power supply system can automatically switch to thestorage battery. Thus, the normal running of equipment is notaffected. The capacity of the storage battery module is 40 Ah.
Function ofmonitoring
The UPM integrates the monitoring module and T2000 monitoringmodule. The monitoring module monitors and controls theparameters and states of the rectifier module, AC/DC powerdistribution, and storage battery group in real time, and then reportsthe parameters and states to the T2000. The storage batteryautomaticallly realizes the floating charging and current limitingmanagement.
Band loadingcapacity
The band loading capacity of each rectifier module is 270 W.
13.1.3 Working Principle and Signal FlowThe UPM receives power from one channel of 220 V AC mains supply, which is rectified to –48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DCpower supplies and one channel of battery power supply.
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When the UPM works normally, the monitoring module controls the rectifier module, batteryloop circuit and loading loop circuit, which then work according to the preset parameters anduser settings. The monitoring module also monitors their status and data.
When the mains power supply goes faulty, the battery power supply system supplies power tothe equipment. Before the mains power supply goes faulty, the battery power supply systemmust be present. When the mains power supply fails and the battery starts discharging, themonitoring module reports the alarms indicating the fault of the mains power supply. As thebattery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V,the monitoring module reports the alarm indicating the undervoltage. When the battery voltagedecreases to 43 V, the battery cuts off the connection to the equipment and protects itself.
When the mains power supply recovers, the UPM works normally.
13.1.4 Rear PanelOn the rear panel of UPM, there are indicators and interfaces of many types.
Appearance of the Front PanelFigure 13-2 shows the rear view of the UPM (subject to the UPM on site ).
Figure 13-2 Rear view of the UPM
AC100~240 ALMRUN
RS232
1 32
ALM Vout ALM Vout
4
5 6
BAT-
BAT+
48V+
48V-
LOAD1 LOAD2
CAUTION!DO NOT INVERT POLARITY注意极性 防止反接
BAT
1. AC input 2. Rectifier module/air outlet 3. Communication interface 4. Battery interface5. Load 6. Load
IndicatorsThe following indicators are for the rectifier module on the left of the UPM.
l Rectifier module fault indicator (ALM), which is red when lit.
l Rectifier module output state indicator (Vout), which is green when lit.
The following indicators are for the monitoring module on the top panel of the UPM.
l Power supply system fault indicator (ALM), which is red when lit.
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l Power supply system indicator (RUN), which is green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.
InterfacesThere are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage ofthese interfaces.
Table 13-2 Interfaces on the rear panel of the UPM
Interface Interface Type Usage
AC100–240 Power interface Acts as a socket for the AC mains supply andaccesses 110 V or 220 V AC power supply.
Red switch button Button Locates on the right of the panel of the rectifiermodule. Press the switch button to enable ordisable the functioning of the rectifier module.
RS232communicationinterface
RS232 The power supply system can connect to theSCC of the OptiX OSN equipment through thisinterface to realize the functions such as thealarm reporting and remote control. Connect theRS232 serial interface of one power box to theF&f interface of the OptiX OSN equipment. TheT2000 then can monitor the battery and thepower box. Connect the RS232 interface of theother power box to the ALM1 interface of theOptiX OSN equipment. The T2000 then canmonitor the other power box.
Power outputinterface
Power interface Three power output interfaces are on the mostright of the power box. The top interface is abattery interface, which can be connected to thesocket on the battery by using battery cables.The bottom two are loading interfaces, whichcan be connected to the OptiX OSN equipmentand supply power to the equipment.
Table 13-3 lists the pins of the RS232 interface.
Table 13-3 Pins of the RS232 interface of the UPM
Item Pin Usage or on/off State
Pin for receiving data 2 Receives data.
Pin for transmitting data 3 Transmits data.
Pin for common grounding 5 Grounds.
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Item Pin Usage or on/off State
Pins for alarms indicatingfaults of the rectifiermodule
8–9 On
Pins for normal state of therectifier module
8–9 Off
Pins for alarms indicatingthe off state of the ACpower supply
8–7 On
Pins for the normal state ofthe AC power supply
8–7 Off
Pins for the alarmindicating undervoltagedischarged from the battery
8–6 On
Pins for the alarmindicating no dischargefrom the battery
8–6 Off
13.1.5 Valid SlotsThe UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, thelogical slot of the UPM is slot 50.
13.1.6 Technical SpecificationsThe technical specifications of the UPM cover dimensions and weight.
Specifications of the power supply
Table 13-4 lists the specifications of the power supply of the UPM.
Table 13-4 Specifications of the power supply of the UPM
Item Specification
Input AC voltage range 90–264 V AC
AC input One channel of monophase three-wire AC power: 47 Hz–63 Hz
Rated input current ≤ 3.5 A
Nominal output voltage 54.0±0.5 V
Rated output current 8 A (Two loading outputs, each of which has the loadingvoltage not more than 5 A)
Number of backup battery groups 1 (40 Ah)
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Item Specification
Charging current of the backupbattery
≤ 3 A
Fuse of the backup battery 10 A
Undervoltage DC point of thebattery
46±0.5 V
Termination voltage point of thebattery
43.5±0.5V
Floating charge voltage of thebattery
-54.0±0.5 V
Regulated voltage precision ≤ ±1%
Non-balance of load sharing ≤ ±5% (50%–100% loading)
Rated efficiency of the integrateddevice
≥ 80%
Peak stray noise voltage ≤ 200 mV
Voltage drop in the power panel(20℃)
≤ 500 mV
Electrical network adjustmentrate
≤ ±0.1%
Mechanical SpecificationsThe mechanical specifications of the UPM are as follows:
l Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W)
l Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)
13.2 PIUThis section describes the PIU, a power interface unit, in terms of the version, function, principle,front panel, configuration and specifications.
The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not.
13.2.1 Version DescriptionThe functional version of the PIU is R1.
13.2.2 Function and FeatureThe PIU is used to access the power supply, and to provide the lightning protection and filtering.
13.2.3 Working Principle and Signal FlowThe PIU consists of the protecting unit, filter unit, power detecting unit and clock protectingunit.
13.2.4 Front PanelOn the front panel of the PIU, there are indicators and power interfaces.
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13.2.5 Valid SlotsThe PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.
13.2.6 Technical SpecificationsThe technical specifications of the PIU cover the dimensions, weight, power consumption, inputvoltage and fuse tube.
13.2.1 Version DescriptionThe functional version of the PIU is R1.
13.2.2 Function and FeatureThe PIU is used to access the power supply, and to provide the lightning protection and filtering.
Table 13-5 lists the functions and features of the PIU.
Table 13-5 Functions and features of the PIU
Function andFeature
PIU
Function oflightning protection
Provides the lightning protection, and reports the alarm indicating thefailure of the lightning protection module.
Function offiltering
Enhances the electromagnetic compatibility of the system by filteringthe power supply port and shielding the board.
Power supplyinterface
Provides one 50 W power interface for external devices, such as theCOA.
Power supply of theFAN
Provides –48 V ± 20% voltage for the FAN.
Clock interface Provides 75-ohm clock input and output interfaces, and protects clocksignals.
Alarm monitoring Reports the board in-service alarm.
Power supplybackup
Supports the 1+1 hot backup. Any one PIU can provide power for theentire subrack by itself.
13.2.3 Working Principle and Signal FlowThe PIU consists of the protecting unit, filter unit, power detecting unit and clock protectingunit.
Figure 13-3 shows the block diagram for the functions of the PIU.
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Figure 13-3 Block diagram for the functions of the PIU
NEG(-)
RTN(+)
NEG(-)
RTN(+)
Clock input Clock output
Powerdetecting
unit
Protectingunit
Filterunit
LEDindication
Clockprotecting
unit
Filter UnitThe filter unit uses the electromagnetic interference (EMI) filter to filter the electromagneticinterference signals and thus to keep the equipment running in a stable manner.
Protecting UnitThis unit is used to prevent the equipment from overcurrent and lightning.
Power Detecting UnitThe power detecting unit checks whether the input power supply is valid and uses indicators toindicate the status of the input power supply.
Clock Protecting UnitThis unit is used to protect the input clock signals.
13.2.4 Front PanelOn the front panel of the PIU, there are indicators and power interfaces.
Appearance of the Front PanelFigure 13-4 shows the appearance of the front panel of the PIU.
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Figure 13-4 Front panel of the PIU
PIU
POWER
PWR
O I
NEG
(-)R
TN(+)
CLK
OU
T
CLK
IN
PWS
PIU
Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green whenlit..
For indication of these indicators, see A Equipment and Board Alarm Indicators.
Interfaces
There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type andusage of the interfaces.
Table 13-6 Interfaces on the front panel of the PIU
Interface InterfaceType
Usage
PWR Power inputinterface
Inputs the –48 V power supply.
ClK IN SMB 75-ohm clock input interface (SMB)
ClK OUT SMB 75-ohm clock output interface (SMB)
13.2.5 Valid SlotsThe PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.
13.2.6 Technical SpecificationsThe technical specifications of the PIU cover the dimensions, weight, power consumption, inputvoltage and fuse tube.
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Mechanical SpecificationsThe mechanical specifications of the PIU are as follows:
l Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W)
l Weight (kg): 1.3
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PIU is 1.5 W.
Input VoltageThe input voltage of the PIU ranges from –38.4 V to –72 V.
Fuse TubeThe main loop fuse of the PIU is 250 V-10 A-0.006 ohm.
13.3 PIUAThis section describes the PIUA, a power interface unit, in terms of the version, function,principle, front panel, configuration and specifications.
The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not.
13.3.1 Version DescriptionThe functional version of the PIUA is R1.
13.3.2 Function and FeatureThe PIUA is used to access the power supply, and to provide the lightning protection andfiltering.
13.3.3 Working Principle and Signal FlowThe PIUA consists of the power interface unit, protecting unit, filter unit, power supply detectingunit, fan power supply unit and external power supply interface unit.
13.3.4 Front PanelOn the front panel of the PIUA, there are indicators and power interfaces.
13.3.5 Valid SlotsThe PIUA can be housed in any of slots 1–11 in the subrack.
13.3.6 Technical SpecificationsThe technical specifications of the PIUA cover the dimensions, weight, power consumption,input voltage and fuse tube.
13.3.1 Version DescriptionThe functional version of the PIUA is R1.
13.3.2 Function and FeatureThe PIUA is used to access the power supply, and to provide the lightning protection andfiltering.
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Table 13-7 lists the functions and features of the PIUA.
Table 13-7 Functions and features of the PIUA
Function andFeature
PIUA
Function oflightning protection
Provides the lightning protection, and reports the alarm indicating thefailure of the lightning protection module.
Function offiltering
Enhances the electromagnetic compatibility of the system by filteringthe power supply port and shielding the board.
Power supplyinterface
Provides one 50 W power interface for external devices, such as theCOA.
Power supply of theFAN
Provides 48 V ± 20% voltage for the FAN.
Alarm monitoring Reports the board in-service alarm.
Power supplybackup
Supports the 1+1 hot backup. Any one PIU can provide power for theentire subrack by itself.
13.3.3 Working Principle and Signal FlowThe PIUA consists of the power interface unit, protecting unit, filter unit, power supply detectingunit, fan power supply unit and external power supply interface unit.
Figure 13-5 shows the block diagram for the functions of the PIUA.
Figure 13-5 Block diagram for the functions of the PIUA
NEG(-)
RTN(+)
NEG(-)
RTN(+)
Externalpower supply
interface
Powerdetection
Lightningprotection
module
Filtermodule
LEDindication
Fan powermodule
Power Interface UnitThis unit accesses the –48 V or –60 V power supply for the system.
Protection UnitThis unit is used to prevent the equipment from overcurrent and lightning.
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Filter UnitThe filter unit uses the electromagnetic interference (EMI) filter to filter the electromagneticinterference signals and thus to keep the equipment running in a stable manner.
Power Detecting UnitThe power detecting unit checks whether the input power supply is valid and uses indicators toindicate the status of the input power supply.
Fan Power Supply UnitThis unit is used to supply stable power to the fans.
External Power Supply Interface UnitThis unit supplies –48 V power to the external equipment, such as the COA. The interfaces arepresent on the panel.
13.3.4 Front PanelOn the front panel of the PIUA, there are indicators and power interfaces.
Appearance of the Front PanelFigure 13-6 shows the appearance of the front panel of the PIUA.
Figure 13-6 Front panel of the PIUA
PIUA
NEG
(-)R
TN(+)
PIUA
POWER
PWS
I O
IndicatorsA power supply indicator (POWER) is present on the front panel of the board and is green whenlit..
For indication of these indicators, see A Equipment and Board Alarm Indicators.
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InterfacesOn the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists thetype and usage of the interfaces and switch.
Table 13-8 Interfaces and switch on the front panel of the PIUA
Interface Interface Type Usage
PWR Inputs the –48 Vpower supply.
Inputs the –48 V power supply.
PWS Output interfacefor the 50 Wpower supply
Outputs the 50 W power supply for the COA or HUB.
Power switch Switch Turn the switch to position 1 or ON to supply powerto the equipment. Turn the switch to position 0 or OFFto shut the power supply to the equipment.
13.3.5 Valid SlotsThe PIUA can be housed in any of slots 1–11 in the subrack.
13.3.6 Technical SpecificationsThe technical specifications of the PIUA cover the dimensions, weight, power consumption,input voltage and fuse tube.
Mechanical SpecificationsThe mechanical specifications of the PIUA are as follows:
l Board dimensions (mm): 111.8 (H) x 220 (D) x 25.4 (W)
l Weight (kg): 1.5
Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PIUA is 3 W.
Input VoltageThe input voltage of the PIUA ranges from –38.4 V to –72 V.
Fuse tubeThe main loop fuse of the PIU is 250 V-10 A-0.006 ohm.
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14 Cables
About This Chapter
This chapter describes the cables used for the equipment. The cables include the fiber jumpers,power cables, alarm cables, management cables, signal cables and clock cables.
14.1 Fiber JumperThe following section describes the types of fiber jumpers and connectors.
14.2 Power Cables and Grounding CablesThe power cables and grounding cables include the cabinet power cable, equipment supply cable,and UPM power cable.
14.3 Alarm CableThe alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,alarm concatenation cable and alarm input/output cable.
14.4 Management CableThe management cable includes the serial port cable, ordinary phone wire, COA concatenatingcable and network cable.
14.5 Signal CableThe signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signalcable. The OptiX OSN 1500A supports only the E1/E3 signal cable.
14.6 Clock CableThe clock cable includes the clock cable and clock transfer cable.
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14.1 Fiber JumperThe following section describes the types of fiber jumpers and connectors.
14.1.1 Types of Fiber JumpersThe OptiX OSN equipment can use various types of fiber jumpers.
14.1.2 ConnectorThe OptiX OSN equipment can use various types of connectors.
14.1.1 Types of Fiber JumpersThe OptiX OSN equipment can use various types of fiber jumpers.
Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment.
Table 14-1 Types of fiber jumpers
Usage Connector1
Connector2
Cable Length
Optical fiber thatconnects theOptiX OSNequipment to theODF or connectsthe interfaceboard of theOptiX OSNequipment to theoptical fiber ofother equipment
LC/PC FC/PC 2 mm SLMoptical fiber
6 m, 10 m, 20 m, 30 m,50 m
2 mm MLMoptical fiber
3 m, 5 m, 10 m, 20 m,30 m, 50 m
LC/PC SC/PC 2 mm SLMoptical fiber
5m, 10 m, 20 m, 30 m,50 m
2 mm MLMoptical fiber
10 m, 20 m, 30 m, 50m
SC/PC SC/PC 2 mm SLMoptical fiber
2m, 5 m, 10 m, 20 m,30 m, 50 m, 80 m
Optical fiber thatinterconnects theOptiX OSNequipment
LC/PC LC/PC 2 mm SLMoptical fiber
1.5 m, 3 m, 5 m, 10 m,20 m, 30 m
2 mm MLMoptical fiber
3 m, 5 m, 10 m, 20 m,30 m
LC/PC FC/PC 2 mm SLMoptical fiber
6 m, 10 m, 20 m, 30 m,50 m
LC/PC SC/PC 2 mm SLMoptical fiber
5m, 10 m, 20 m, 30 m,50 m
Select the fiber connector and the fiber length according to the on-site survey.
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CAUTIONWhen selecting the fiber connector, make sure that the single-longitudinal mode or multi-longitudinal mode optical transmitting module is connected to the single-mode fiber.
14.1.2 ConnectorThe OptiX OSN equipment can use various types of connectors.
The four types of fiber connectors are listed as follows:
l Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure14-1.
l The N2OU08 and 61COA provide the SC/PC optical interfaces.
l The "IN" interface on the externally-installed case-shaped 62COA uses the E2000/APCconnector. See Figure 14-4.
l The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 andFigure 14-2 show the corresponding FC/PC and SC/PC optical connectors.
Table 14-2 lists the description of the four optical connectors.
Table 14-2 Types of connectors
Internal FiberConnector
Description
LC/PC Plug-in square fiber connector/protruding polished
E2000/APC Connector with dust-proof cover/protruding polished (8 degrees)
FC/PC Round fiber connector/protruding polished
SC/PC Square fiber connector/protruding polished
LC/PC Optical ConnectorFigure 14-1 shows the appearance of the LC/PC optical connector.
Figure 14-1 LC/PC optical connector
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The axial operation instead of rotation is required to insert or remove the LC/PC optical interface.
Align the head of the fiber jumper with the optical interface with proper strength to insert thefiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip,and then push fiber connector inward slightly, and pull out the connector.
SC/PC Optical ConnectorFigure 14-2 shows the appearance of the SC/PC optical connector.
Figure 14-2 SC/PC optical connector
FC/PC Optical ConnectorFigure 14-3 shows the appearance of the FC/PC optical connector.
Figure 14-3 FC/PC optical connector
E2000/APC Optical InterfaceFigure 14-4 shows the appearance of the E2000/APC optical interface.
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Figure 14-4 E2000/APC optical connector
14.2 Power Cables and Grounding CablesThe power cables and grounding cables include the cabinet power cable, equipment supply cable,and UPM power cable.
14.2.1 Cabinet –48 V/BGND/PGND Power CableThe –48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.
14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding CableThe equipment –48 V/–60 V power cable/PGND grounding cable directly connects to theexternal –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinettop and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to theOptiX OSN 1500 equipment.
14.2.3 UPM Power CableThis section describes the UPM power cable in terms of the structure, connection and technicalspecifications.
14.2.1 Cabinet –48 V/BGND/PGND Power CableThe –48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.
StructureFigure 14-5 shows the structure of the –48 V cabinet power cable/BGND power groundingcable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.
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Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable
1 2
3
1. Cord end terminal 2. Bare connector-OT type 3. Cable tie
Figure 14-6 Cabinet PGND protection grounding cable (JG2)
1. Bare connector-OT type 2. Cable tie 3. Bare connector (JG2)4. Heat-shrink tube 5. Main tag 6. Wire7. Heat-shrink tube
Figure 14-7 Cabinet PGND protection grounding cable (OT)
1. Bare connector-OT type 2. Cable tie 3. Bare connector (OT)4. Heat-shrink tube 5. Main tag 6. Wire7. Heat-shrink tube
Pin AssignmentNone
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Technical SpecificationsItem Description
–48 V cabinetpower cable
Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-bare ring terminal
Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12mm deep-80A-green
Cable type Power cable-450 V/750 V-16 mm2-round and bllue-85A
Cabinet BGNDpowergrounding cable
Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-bare ring terminal
Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12mm deep-80A-green
Cable type Power cable-450 V/750 V-16 mm2-round and black-85A
Cabinet PGNDprotectiongrounding cable
Connector 1 Bare crimping terminal-OT type-25mm2-M8-tin plating-bare ring terminal
Connector 3 Bare crimping connector-JG2-25 mm2-M6-95A-tinplating, or bare crimping connector-JG2-25 mm2-M8-95A-tin plating, or bare crimping terminal-OT type-25 mm2-M8-tin plating-bare ring terminal
Cable type Power cable-450 V/750 V-25 mm2-yellow and green-85 A
Fireproof level CM
Length 10 m, 20 m, 30 m
14.2.2 Equipment –48 V/–60 V Power Cable/PGND GroundingCable
The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to theexternal –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinettop and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to theOptiX OSN 1500 equipment.
StructureFigure 14-8 shows the structure of the equipment –48 V/–60 V power cable. Figure 14-9 showsthe structure of the PGND grounding cable.
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Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable
AA3
A1
A2
Figure 14-9 PGND power cable
1. Bare connector-OT type 2. Cable tie 3. Bare connector 4. Heat-shrink tube5. Main tag 6. Wire 7. Heat-shrink tube
Pin AssignmentFor details on the pin assignment, refer to Table 14-3.
Table 14-3 Equipment –48 V/–60 V power cable
Cable connector Corresponding cable Core color
A1 W1 Blue (–48 V/–60 V power)
A3 W2 Black (power ground)
Technical SpecificationsItem Equipment –48 V/–60 V
power cablePGND grounding cable
Cable connector Cable connector-Dtype-3PIN-female
Bare crimping connector-OT-6 mm2-M4-tin plating-pre-insulated ringterminal-12–10AWG bare crimpingconnector-OT-6 mm2-M8-tin plating-insulated ring terminal-12–10AWG
Cable Type Wire-300 V-16AWG-black (the core is blue andblack)-13A
Wire-600 V-10AWG-yellow/green-50A
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Item Equipment –48 V/–60 Vpower cable
PGND grounding cable
Number ofcores
2 1
Fireprooflevel
CM CM
Color Blue or black Yellow and green
Length 15 m, 30 m 15 m, 30 m
14.2.3 UPM Power CableThis section describes the UPM power cable in terms of the structure, connection and technicalspecifications.
StructureFigure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500.
Figure 14-10 Structure of the UPM power cable
X1 X2
A B
A
BA1A2A3
12
Connection of the UPM Power CableTable 14-4 lists the connections of the UPM power cables.
Table 14-4 Connection of the UPM power cable
CableConnector X1
Corresponding Cable
Cable ConnectorX2
Core Color
A1 W1 1 Blue (–48 V/–60 V powersupply)
A3 W2 2 Black (ground for the powersupply)
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Specifications of the UPM Power Cable
Table 14-5 Specifications of the UPM power cable
Item UPM Power Cable
Cable connector X1 Cable connector-D type-3PIN-female (two female and one male)
Cable connector X2 Common plug-2PIN-single row
Cable Type Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A
Number ofcores
2
Fireproofclass
CM
Color Core: blue or black
Length 2.5 m
14.3 Alarm CableThe alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,alarm concatenation cable and alarm input/output cable.
14.3.1 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXOSN equipment. The alarm output cable is used to output the alarm signals to the central alarmmonitoring equipment.
14.3.1 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXOSN equipment. The alarm output cable is used to output the alarm signals to the central alarmmonitoring equipment.
One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/output interface of the equipment. The other end uses a connector to connect to the externalequipment or central alarm monitoring equipment. The connector should be made according tothe on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarmsignals.
StructureFigure 14-11 shows the structure of the alarm input/output cable.
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Figure 14-11 Structure of the alarm input/output cable
1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A
Pin Assignment
Table 14-6 lists the pin assignment of the alarm input/output cable.
Table 14-6 Pin assignment of the alarm input/output cable
Connector X1
Color Relation Alarm Output Alarm Input
X1.1 Blue Twisted pair Positive for critical and majoralarms
SW_INPUT 1+
X1.2 White Negative for critical andmajor alarms
SW_INPUT 1–
X1.3 Orange Twisted pair Positive for minor andwarning alarms
SW_INPUT 2+
X1.6 White Negative for minor andwarning alarms
SW_INPUT 2–
X1.4 Green Twisted pair Positive for alarm signaloutput 1
SW_INPUT 3+
X1.5 White Negative for alarm signaloutput 1
SW_INPUT 3–
X1.7 Brown Twisted pair Positive for alarm signaloutput 2
SW_INPUT 4+
X1.8 White Negative for alarm signaloutput 2
SW_INPUT 4–
Technical Specifications
Item Description
Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug
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Item Description
Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 cores-PANTONE 430UTwisted pair cable-100±15 ohms-shielded enhanced type 5 CAT5ESFTP-24AWG-8 core-PANTONE445U
Number ofcores
8
Fireproof class CM
Core diameter 0.5 mm
Length 10 m, 20 m, 30 m
14.4 Management CableThe management cable includes the serial port cable, ordinary phone wire, COA concatenatingcable and network cable.
14.4.1 OAM Serial Port CableThe OAM serial port cable is used for management and remote maintenance of the OptiX OSNequipment.
14.4.2 Serial 1–4/F1/F&f Serial Port CableUse the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detectingdevice or managed external device.
14.4.3 RS232/RS-422 Serial Port CableThe RS232/RS-422 serial port cable is used to transmit the management signaling betweendifferent subnets.
14.4.4 Ordinary Telephone WireThe telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.Connect one end to PHONE interface of the equipment and connect the other end to the interfaceof the orderwire phone.
14.4.5 COA Concatenating CableWhen several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables toconnect these COA.
14.4.6 Straight Through CableThe straight through cable is used for the communication between the OptiX OSN equipment,the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.
14.4.7 Crossover CableThe crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.
14.4.1 OAM Serial Port CableThe OAM serial port cable is used for management and remote maintenance of the OptiX OSNequipment.
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Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment.Use the DB25 or DB9 connector to connect the other end to a laptop, T2000 computer or modem.
Structure
Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector).
Figure 14-12 Structure of the OAM serial port cable
1. Network interfaceconnector–RJ-45
2. Main tag 3. Cable connector-DB25 male
A-A. Sectional view indirection A
B-B. Sectional view indirection B
Pin Assignment
Table 14-7 lists the pin assignment of the alarm input/output cable.
Table 14-7 Pin assignment of the OAM serial port cable
ConnectorX1
Connector X2 Relation Description
X1.2 X2.20 Single Data terminal ready (DTR)
X1.3 X2.2 Single Transmit data (TD)
X1.6 X2.3 Single Receive data (RD)
X1.4 X2.7 Twisted pair Signaling ground (SG)
X1.5
Technical Specifications
Item Description
Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug
Connector X2 Cable connector-D type-25PIN-male or cable connector-D type-9PIN-male
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Item Description
Type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U
Number ofcores
8
Fireproof class CM
Length 5000 mm
14.4.2 Serial 1–4/F1/F&f Serial Port CableUse the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detectingdevice or managed external device.
The Serial 1–4/F1/F&f serial port cable is used for the following functions:
l Transparently transmits the environment detecting data signals.
l Manages the external device such as the COA.
StructureFigure 14-13 shows the structure of the Serial 1–4/F1/F&f serial port cable.
Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable
1. Network interfaceconnector–RJ-45
2. Main tag 3. Cable connector-DB25 male
A-A. Sectional view indirection A
B-B. Sectional view indirection B
Pin AssignmentTable 14-8 lists the pin assignment of the Serial 1–4/F1/F&f cable.
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Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable
Connector X1 Connector X2 Relation Description
X1.1 X2.8 Twisted pair RS-422RX+
X1.2 X2.9 RS-422RX–
X1.3 X2.6 Twisted pair RS-422TX+
X1.6 X2.7 RS-422TX–
X1.4 X2.3 Twisted pair RS232RX
X1.8 X2.2 RS232TX
X1.5 X2.5 Single SG
Technical SpecificationsItem Description
Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug
Connector X2 Cable connector-D type-9 PIN-male
Cable type 1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black
Number ofcores
8
Fireproof class CM
Length 15 m for cable type 1 and 3 m for cable type 2
14.4.3 RS232/RS-422 Serial Port CableThe RS232/RS-422 serial port cable is used to transmit the management signaling betweendifferent subnets.
Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port ofthe equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment thatrequires the orderwire phone communication.
StructureFigure 14-14 shows the structure of the RS232/RS-422 serial port cable.
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Figure 14-14 Structure of the RS232/RS-422 serial port cable
1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A
Pin AssignmentTable 14-9 lists the pin assignment of the RS232/RS-422 serial port cable.
Table 14-9 Pin assignment of the RS232/RS-422 serial port cable
ConnectorX1
Connector X2 Relation Description
X1.3 X2.1 Twisted pair RX+
X1.6 X2.2 RX–
X1.1 X2.3 Twisted pair TX+
X1.2 X2.6 TX–
X1.5 X2.5 Twisted pair SG
X1.4 X2.8 232RX
X1.8 X2.4 Single 232TX
Technical SpecificationsItem Description
Connector X1/X2 Network interface connector-8PIN-8 bit-shielded-crystal plug
Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U
Number of cores 8
Fireproof class CM
Length 15 m
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14.4.4 Ordinary Telephone WireThe telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.Connect one end to PHONE interface of the equipment and connect the other end to the interfaceof the orderwire phone.
StructureFigure 14-15 shows the structure of the ordinary telephone wire.
Figure 14-15 Structure of the ordinary telephone wire
1. Phone connector-RJ-11crystal plug 2. Main tag
Pin AssignmentTable 14-10 lists the pin assignment of the ordinary telephone wire.
Table 14-10 Pin assignment of the ordinary telephone wire
Connector X1 Connector X2 Description
X1.1 X2.1 No connected
X1.2 X2.2 No connected
X1.3 X2.3 TIP
X1.4 X2.4 RING
X1.5 X2.5 No connected
X1.6 X2.6 No connected
Technical SpecificationsItem Description
Connector X1/X2 Network interface connector-6PIN-26 to 28AWG
Cable type Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-coretelephone wire
Number of cores 2
Fireproof class CM
Length 15 m
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14.4.5 COA Concatenating CableWhen several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables toconnect these COA.
Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connectthe other end to the RS232-2 of another COA.
StructureFigure 14-16 shows the structure of the COA concatenating cable.
Figure 14-16 Structure of the COA concatenating cable
1. Cable connector-DB25 male 2. Tag A-A. Sectional view in direction A
Pin AssignmentTable 14-11 lists the pin assignment of the COA concatenating cable.
Table 14-11 Pin assignment of the COA concatenating cable
Connector X1 Connector X2 Remarks
3 2 One pair
2 3
5 5 Grounding
Technical SpecificationsItem Description
Connector X1/X2 Cable connector-D type-9 PIN-male
Cable type Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huaweigray
Number of cores Two pairs
Fireproof class CM
Length 0.6 m, 2.5 m
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14.4.6 Straight Through CableThe straight through cable is used for the communication between the OptiX OSN equipment,the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.
StructureFigure 14-17 shows the structure of the straight through cable.
Figure 14-17 Structure of the straight through cable
1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Tag 2
Pin AssignmentTable 14-12 lists the pin assignment of the straight through cable.
Table 14-12 Pin assignment of the straight through cable
ConnectorX1
Connector X2 Color Relation
X1.1 X2.1 White or orange Twisted pair
X1.2 X2.2 Orange
X1.3 X2.3 White or orange Twisted pair
X1.6 X2.6 Green
X1.4 X2.4 Blue Twisted pair
X1.5 X2.5 White or orange
X1.7 X2.7 White or brown Twisted pair
X1.8 X2.8 Brown
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Technical SpecificationsItem Description
Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to26AWG-CAT 6/used with SFTP network cable
Cable type Communication cable-10015 ohms-shielded enhance type 5-CAT5E-SFTP 24AWG-8 cores-PANTONE 445U
Number of cores 8
Fireproof class CM
Length 5 m, 10 m, 20 m, 30 m
14.4.7 Crossover CableThe crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.
Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipmentand connect the other end to the network interface of the computer.
StructureFigure 14-18 shows the structure of the crossover cable.
Figure 14-18 Structure of the crossover cable
1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Network cable 5. Tag 2
Pin AssignmentTable 14-13 lists the pin assignment of the crossover cable.
Table 14-13 Pin assignment of the crossover cable
ConnectorX1
Connector X2 Color Relation
X1.6 X2.2 Orange Twisted pair
X1.3 X2.1 White or orange
X1.1 X2.3 White or green Twisted pair
X1.2 X2.6 Green
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ConnectorX1
Connector X2 Color Relation
X1.4 X2.4 Blue Twisted pair
X1.5 X2.5 White or blue
X1.7 X2.7 White or brown Twisted pair
X1.8 X2.8 Brown
Technical SpecificationsItem Description
Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to26AWG-CAT 6/used with SFTP network cable
Cable type Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 cores-PANTONE 445U
Number of cores 8
Fireproof class CM
Length 5 m, 30 m
14.5 Signal CableThe signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signalcable. The OptiX OSN 1500A supports only the E1/E3 signal cable.
14.5.1 75-ohm 8 x E1 CableThe 75-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.2 75-ohm 16 x E1 CableThe 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected tothe interface of the L75S interface board.
14.5.3 120-ohm 8 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.4 120-ohm 16 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.5 E3/T3/STM-1 CableThe E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMBconnector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connectorto connect the other end to the DDF. The connector should be made according to the on-siterequirements.
14.5.6 Framed E1 CableThe framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1signals.
14.5.7 N x 64 kbit/s Cables
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The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channelof N x 64 kbit/s services.
14.5.1 75-ohm 8 x E1 CableThe 75-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interfaceboard. Use a connector to connect the other end to the digital distribution frame (DDF). Theconnector should be made according to the on-site requirements. Each cable can transmit eightchannels of E1 signals.
StructureFigure 14-19 shows the structure of the 75-ohm 8 x E1 cable.
Figure 14-19 Structure of the 75-ohm 8 x E1 cable
1. Cable connector-D type-44 PIN-male 2. Tag 1, marked: "W1 (E1:1 to 4)"3. Tag 3, marked: "W2 (E1:5 to 8)" 4. Main tag
Pin AssignmentTable 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable.
Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable
Connector
Cable W1 Remarks Connector Cable W2 Remarks
Core No. Core No.
38 Ring 1 R1 34 Ring 1 R5
23 Tip 19 Tip
37 Ring 3 R2 33 Ring 3 R6
22 Tip 18 Tip
36 Ring 5 R3 32 Ring 5 R7
21 Tip 17 Tip
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Connector
Cable W1 Remarks Connector Cable W2 Remarks
Core No. Core No.
35 Ring 7 R4 31 Ring 7 R8
20 Tip 16 Tip
15 Ring 2 T1 11 Ring 2 T5
30 Tip 26 Tip
14 Ring 4 T2 10 Ring 4 T6
29 Tip 25 Tip
13 Ring 6 T3 9 Ring 6 T7
28 Tip 24 Tip
12 Ring 8 T4 8 Ring 8 T8
27 Tip 7 Tip
Shell External braid shield layer Shell External braid shield layer
Technical Specifications
Item Description
Connector X Cable connector-D type-44 PIN-male
Cable type Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2mm-0.252 mm-Huawei white
Fireproof class CM
Number of cores 8 x E1
Cover diameter-insulation diameter-conductor diameter
9.65 mm-1.2 mm-0.252 mm
Length 3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m
CAUTIONThe pin assignment table for the E1 cable is placed in the same packing case with the cable. Donot discard it before installation.
14.5.2 75-ohm 16 x E1 CableThe 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected tothe interface of the L75S interface board.
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Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements. Each cable can transmit 16 channels of E1 signals.
StructureFigure 14-20 shows the structure of the 75-ohm 16 x E1 cable.
Figure 14-20 Structure of the 75-ohm 16 x E1 cable
Main tag
1. Cable connector 2. Terminal
Pin AssignmentTable 14-15 lists the pin assignment of the 75-ohm 16 x E1 cable.
Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable
Connector X
Cable W Remarks
Connector X
Cable W Remarks
Core No. Core No.
a1 Tip 1 R1 a10 Tip 17 R9
a2 Ring a11 Ring
a3 Tip 2 T1 a12 Tip 18 T9
a4 Ring a13 Ring
a6 Tip 3 R2 a15 Tip 19 R10
a7 Ring a16 Ring
a8 Tip 4 T2 a17 Tip 20 T10
a9 Ring a18 Ring
b1 Tip 5 R3 b10 Tip 21 R11
b2 Ring b11 Ring
b3 Tip 6 T3 b12 Tip 22 T11
b4 Ring b13 Ring
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Connector X
Cable W Remarks
Connector X
Cable W Remarks
Core No. Core No.
b6 Tip 7 R4 b15 Tip 23 R12
b7 Ring b16 Ring
b8 Tip 8 T4 b17 Tip 24 T12
b9 Ring b18 Ring
c1 Tip 9 R5 c10 Tip 25 R13
c2 Ring c11 Ring
c3 Tip 10 T5 c12 Tip 26 T13
c4 Ring c13 Ring
c6 Tip 11 R6 c15 Tip 27 R14
c7 Ring c16 Ring
c8 Tip 12 T6 c17 Tip 28 T14
a9 Ring c18 Ring
d1 Tip 13 R7 d10 Tip 29 R15
d2 Ring d11 Ring
d3 Tip 14 T7 d12 Tip 30 T15
d4 Ring d13 Ring
d6 Tip 15 R8 d15 Tip 31 R16
d7 Ring d16 Ring
d8 Tip 16 T8 d17 Tip 32 T16
d9 Ring d18 Ring
Technical SpecificationsItem Description
Connector X 2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp
Cable type W Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2mm-0.254 mm-Huawei gray
Fireproof class CM
Number of cores 16 x E1
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Item Description
Cover diameter-insulation diameter-conductor diameter
18mm-1.2 mm-0.254mm
Length 10 m, 15 m, 20 m, 25 m, 30 m
CAUTIONThe pin assignment table for the E1 cable is placed in the same packing case with the cable. Donot discard it before installation.
14.5.3 120-ohm 8 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements. Each cable can transmit 8 channels of E1 signals.
StructureFigure 14-21 shows the structure of the 120-ohm 8 x E1 cable.
Figure 14-21 Structure of the 120-ohm 8 x E1 cable
1. Cable connector-D type-44PIN-male 2. Tag 1, marked:" W1 (TX1~8) "3. Tag 3, marked:" W2 (RX1~8) " 4. Main tag
Pin AssignmentTable 14-16 lists the pin assignment of the 120-ohm 8 x E1 cable.
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Table 14-16 Pin assignment of the 120-ohm E1 cable
Connector
Cable W1 Remarks
Connector
Cable W2 Remarks
Core No. Core No.
15 Blue Twistedpair
Tx1 38 Blue Twistedpair
Rx1
30 White 23 White
14 Orange
Twistedpair
T×2 37 Orange
Twistedpair
R×2
29 White 22 White
13 Green Twistedpair
T×3 36 Green Twistedpair
R×3
28 White 21 White
12 Brown
Twistedpair
T×4 35 Brown Twistedpair
R×4
27 White 20 White
11 Grey Twistedpair
T×5 34 Grey Twistedpair
R×5
26 White 19 White
10 Blue Twistedpair
T×6 33 Blue Twistedpair
R×6
25 Red 18 Red
9 Orange
Twistedpair
T×7 32 Orange
Twistedpair
R×7
24 Red 17 Red
8 Green Twistedpair
T×8 31 Green Twistedpair
R×8
7 Red 16 Red
Shell External braid shield layer Shell External braid shield layer
Technical SpecificationsItem Description
Connector X Cable connector-D type-44PIN-male
Cable type Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16core-PANTONE 430U
Number of cores 16
Inner conductordiameter
0.5 mm
Fireproof class CM
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Item Description
Length 10 m, 15 m, 20 m, 30 m, 40 m
14.5.4 120-ohm 16 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard, L12S or PL1B. Use a connector to connect the other end to the DDF. The connectorshould be made according to the on-site requirements. Each cable can transmit 16 channels ofE1 signals.
Structure
Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable.
Figure 14-22 Structure of the 120-ohm 16 x E1 cable3
1
2X
W2
W1
1. Cable connector 2. Terminal 3. Main tag
Pin Assignment
Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable.
Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable
Connector X
Cable W1 Remarks
Connector X
Cable W2 Remarks
Core No. Core No.
a1 Blue Twisted pair
Rx1 a3 Blue Twisted pair
Tx1
a2 White a4 White
a6 Orange Twisted pair
Rx2 a8 Orange Twisted pair
Tx2
a7 White a9 White
b1 Green Twisted pair
Rx3 b3 Green Twisted pair
Tx3
b2 White b4 White
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Connector X
Cable W1 Remarks
Connector X
Cable W2 Remarks
Core No. Core No.
b6 Brown Twisted pair
Rx4 b8 Brown Twisted pair
Tx4
b7 White b9 White
c1 Grey Twisted pair
Rx5 c3 Grey Twisted pair
Tx5
c2 White c4 White
c6 Blue Twisted pair
Rx6 c8 Blue Twisted pair
Tx6
c7 Red c9 Red
d1 Orange Twisted pair
Rx7 d3 Orange Twisted pair
Tx7
d2 Red d4 Red
d6 Green Twisted pair
Rx8 d8 Green Twisted pair
Tx8
d7 Red d9 Red
a10 Brown Twisted pair
Rx9 a12 Brown Twisted pair
Tx9
a11 Red a13 Red
a15 Grey Twisted pair
Rx10 a17 Grey Twisted pair
Tx10
a16 Red a18 Red
b10 Blue Twisted pair
Rx11 b12 Blue Twisted pair
Tx11
b11 Black b13 Black
b15 Orange Twisted pair
Rx12 b17 Orange Twisted pair
Tx12
b16 Black b18 Black
c10 Green Twisted pair
Rx13 c12 Green Twisted pair
Tx13
c11 Black c13 Black
c15 Brown Twisted pair
Rx14 c17 Brown Twisted pair
Tx14
c16 Black c18 Black
d10 Grey Twisted pair
Rx15 d12 Grey Twisted pair
Tx15
d11 Black d13 Black
d15 Blue Twisted pair
Rx16 d17 Blue Twisted pair
Tx16
d16 Yellow d18 Yellow
a5 Shell External braid shieldlayer
a14 Shell External braid shieldlayer
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Technical Specifications
Item Description
Connector X 2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp
Cable typeW1/W2
Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32core-PANTONE 430U
Number ofcores
32
Innerconductordiameter
0.5 mm
Fireproof class CM
Length 10 m, 15 m, 20 m, 25 m, 30 m
14.5.5 E3/T3/STM-1 CableThe E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMBconnector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connectorto connect the other end to the DDF. The connector should be made according to the on-siterequirements.
Structure
Figure 14-23 shows the structure of the E3/T3/STM-1 cable.
Figure 14-23 Structure of the E3/T3/STM-1 cable
1. Coaxial connector-SMB 2. Main tag 3. Coaxial cable
Pin Assignment
None
Technical Specifications
Item Description
Connector Coaxial connector-SMB-75 ohms-straight and female
Cable I Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
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Item Description
Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34mm
Length: 10 m, 15 m, 20 m, 30 m
Cable II Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray
Cover diameter 4.4 mm-insulation diameter 2.4 mm-conductor diameter 0.4mm
Length: 15 m, 20 m, 25 m, 30 m, 40 m
Cable III Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray
Cover diameter 6.7 mm-insulation diameter 3.8 mm-conductor diameter 0.61mm
Length: 15 m, 20 m, 25 m, 30 m, 130 m
Cable IV Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black
Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter0.643 mm
Length: 30 cm
Fireproofclass
CM
14.5.6 Framed E1 CableThe framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1signals.
The framed E1 cables of 75 ohms and 120 ohms are available.
l See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pinassignment and technical specifications of the 75-ohm framed E1 cable.
l See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pinassignment and technical specifications of the 120-ohm framed E1 cable.
14.5.7 N x 64 kbit/s CablesThe N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channelof N x 64 kbit/s services.
Table 14-18 lists the pin assignment of the DB28 connector.
Table 14-18 Pin assignment of the DB28 connector of the DM12
Pin Signal Direction
Description
1 TXD+ ---> Transmits data.
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Pin Signal Direction
Description
2 TXD– ---> Transmits data.
3 TXC+ <--> The DCE provides the transmitting clock to theDTE.
4 TXC– <--> The DCE provides the transmitting clock to theDTE.
5 NC - -
6 GND ----- Circuit_GND
7 MODE0 <--- Identifies the cable type.
8 MODE1 <--- Identifies the cable type.
9 MODE2 <--- Identifies the cable type.
10 MODE_DCE <--- Identifies the DCE/DTE cable type.
11 DCD+ <--> Detects the carrier.
12 DCD– <--> Detects the carrier.
13 RTS+ ---> Requests for transmission.
14 RTS– ---> Requests for transmission.
15 TXCE+ ---> Transmitting data clock for DCE and loopbackclock for DTE.
16 TXCE– ---> Transmitting data clock for DCE and loopbackclock for DTE.
17 RXC+ <--- Receives clock.
18 RXC– <--- Receives clock.
19 RXD+ <--- Receives data.
20 RXD– <--- Receives data.
21 GND ----- Shield_GND
22 LL <--> Loopback control signals.
23 CTS+ <--- Prepares for transmission.
24 CTS– <--- Prepares for transmission.
25 DSR+ <--- Prepares the DCE.
26 DSR– <--- Prepares the DCE.
27 DTR+ ---> Prepares the DTE.
28 DTR– ---> Prepares the DTE.
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According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classifiedinto the following ten types.
l V.35 DCE cable
l V.35 DTE cable
l V.24 DCE cable
l V.24 DTE cable
l X.21 DCE cable
l X.21 DTE cable
l RS449 DCE cable
l RS449 DTE cable
l RS530 DCE cable
l RS530 DTE cable
V.35 DCE Cable
Figure 14-24 shows the structure of the V.35 DCE cable.
Figure 14-24 Structure of the V.35 DCE cable
21
Pos.28
Pos.1
A-A
A
3
B
D
J
N
T
X
BB
FF
LL
B
F
L
R
V
Z
DD
JJ
NN
C
H
M
S
W
AA
EE
KK
A
E
K
P
U
Y
CC
HH
MM
X1 X2
W
B-B
1. Cable connector-D28 male 2. Main tag3. Cable connector-D34 female + D34 plastic shell
Table 14-19 lists the pin assignment of the V.35 DCE cable.
Table 14-19 Pin assignment of the V.35 DCE cable
Connector X1 Connector X2 Relation
19 P Twisted pair
20 S
1 R Twisted pair
2 T
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Connector X1 Connector X2 Relation
15 V Twisted pair
16 X
3 Y Twisted pair
4 AA
17 U Twisted pair
18 W
11 F -
22 J -
23 C -
13 D -
25 H -
27 E -
21 B -
6+7+8 A Short circuiting for 6–8
The technical specifications of the V.35 DCE cable are as follows.
Item Description
Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cablesolder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM
Connector X2 Cable connector-V35 plug-34PIN-injection molding shell-tube,exclusively used for OEM
Cable connector-V35 DCE plug-34PIN-female-cable crimping-core,exclusively used for OEM
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number of cores 5 pairs and 8 cores
Core diameter 0.32 mm
Length 3 m
V.35 DTE CableFigure 14-25 shows the structure of the V.35 DTE cable.
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Figure 14-25 Structure of the V.35 DTE cable
A-A B-B
21
Pos.28
Pos.1
A
DJNTX
BBFFLL
BFLRVZ
DDJJNN
CHMSWAAEEKK
AEKPUY
CCHHMM
3 4
B
5
X2X1
W
1. Cable connector-D28 male 2. Main tag 3. Cable connector-D34 plastic shell4. Ordinary terminal 5. Cable connector-D34 male
Table 14-20 lists the pin assignment of the V.35 DTE cable.
Table 14-20 Pin assignment of the V.35 DTE cable
Connector X1 Connector X2 Relation
1 P Twisted pair
2 S
19 R Twisted pair
20 T
17 V Twisted pair
18 X
3 Y Twisted pair
4 AA
15 U Twisted pair
16 W
11 F -
22 J -
13 C -
23 D -
27 H -
25 E -
21 B -
6+10+7+8 A Short circuiting 6, 7, 8 and 10
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The technical specifications of the V.35 DTE cable are as follows.
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusivelyused for OEM
Cable connector-V35 DTE plug-34PIN-male-cable crimping-core,exclusively used for OEM
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number ofcores
5 pairs and 8 cores
Corediameter
0.32 mm
Length 3 m
V.24 DCE Cable
Figure 14-26 shows the structure of the V.24 DCE cable.
Figure 14-26 Structure of the V.24 DCE cable
2 3
Pos.1
Pos.28
A B
Pos.25
Pos.1
1
X1X2
W
A-A B-B
1. Cable connector-D25 female 2. Main tag 3. Cable connector-D28 male
Table 14-21 lists the pin assignment of the V.24 DCE cable.
Table 14-21 Pin assignment of the V.24 DCE cable
Connector X1 Connector X2 Relation
19 2 Twisted pair
1 3
23 4 Twisted pair
13 5
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Connector X1 Connector X2 Relation
25 20 Twisted pair
27 6
11 8 Twisted pair
22 18
3 15 Twisted pair
17 24
15 17 -
21 1 Single
6+7 7 Short circuiting 6 and 7
The technical specifications of the V.24 DCE cable are as follows.
Table 14-22 Technical specifications of the V.24 DCE cable
Item Description
Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
Connector X2 Cable connector-D type-25PIN-female-cable solder
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number ofcores
5 pairs and 8 cores
Core diameter 0.32 mm
Length 3 m
V.24 DTE CableFigure 14-27 shows the structure of the V.24 DTE cable.
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Figure 14-27 Structure of the V.24 DTE cable
2 31
Pos.1
Pos.28
A B
Pos.1
Pos.25 X1X2
W
A-A B-B
1. Cable connector-D25 male 2. Main tag 3. Cable connector-D28 male
Table 14-23 lists the pin assignment of the V.24 DTE cable.
Table 14-23 Pin assignment of the V.24 DTE cable
Connector X1 Connector X2 Relation
1 2 Twisted pair
19 3
13 4 Twisted pair
23 5
27 20 Twisted pair
25 6
11 8 Twisted pair
22 18
3 15 Twisted pair
15 24
17 17 -
21 1 Single
6+10+7 7 Short circuiting 6, 10 and 7
The technical specifications of the V.24 DTE cable are as follows.
Table 14-24 Technical specifications of the V.24 DTE cable
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-D type-25PIN-male-cable solder
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Item Description
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number ofcores
5 pairs and 8 cores
Corediameter
0.32 mm
Length 3 m
X.21 DCE Cable
Figure 14-28 shows the structure of the X.21 DCE cable.
Figure 14-28 Structure of the X.21 DCE cable
2 3
Pos.1
Pos.28
BA
Pos.15
Pos.1
1
X1X2
W
A-A B-B
1. Cable connector-D15 female 2. Main tag 3. Cable connector-D28 male
Table 14-25 lists the pin assignment of the X.21 DCE cable.
Table 14-25 Pin assignment of the X.21 DCE cable
Connector X1 Connector X2 Relation
13 5 Twisted pair
14 12
23 3 Twisted pair
24 10
19 2 Twisted pair
20 9
1 4 Twisted pair
2 11
15 6 Twisted pair
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Connector X1 Connector X2 Relation
16 13
21 1 –
6+9 8 Short circuiting 6 and 9
The technical specifications of the X.21 DCE cable are as follows.
Table 14-26 Technical specifications of the X.21 DCE cable
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-D type-15PIN-female-cable solder
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number ofcores
5 pairs and 8 cores
Corediameter
0.32 mm
Length 3 m
X.21 DTE CableFigure 14-29 shows the structure of the X.21 DTE cable.
Figure 14-29 Structure of the X.21 DTE cable
2 3
Pos.1
Pos.28
BA
Pos.1
Pos.15
1
X2 X1
W
A-A B-B
1. Cable connector-D15 male 2. Main tag 3. Cable connector-D28 male
Table 14-27 lists the pin assignment of the X.21 DTE cable.
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Table 14-27 Pin assignment of the X.21 DTE cable
Connector X1 Connector X2 Relation
13 3 Twisted pair
14 10
23 5 Twisted pair
24 12
19 4 Twisted pair
20 11
1 2 Pair
2 9
15 6 Twisted pair
16 13
17 6 Twisted pair
18 13
21 1 –
6+10+9 8 Short circuiting 6, 10 and 9
The technical specifications of the X.21 DTE cable are as follows.
Table 14-28 Technical specifications of the X.12 DTE cable
Item Description
Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
Connector X2 Cable connector-D type-15PIN-male-cable solder
Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM
Number ofcores
5 pairs and 8 cores
Core diameter 0.32 mm
Length 3 m
RS449 DCE CableFigure 14-30 shows the structure of the RS449 DCE cable.
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Figure 14-30 Structure of the RS449 DCE cable
2 3
Pos.1
Pos.28
BA
Pos.1
Pos.15
1
X2 X1
W
A-A B-B
1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 female-I
Table 14-29 lists the pin assignment of the RS449 DCE cable.
Table 14-29 Pin assignment of the RS449 DCE cable
Connector X1 Connector X2 Relation
27 11 Twisted pair
28 29
25 12 Twisted pair
26 30
13 9 Twisted pair
14 27
23 7 Twisted pair
24 25
11 13 Twisted pair
12 31
19 4 Twisted pair
20 22
1 6 Twisted pair
2 24
15 8 Twisted pair
16 26
17 17 Twisted pair
18 35
3 5 Twisted pair
4 23
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Connector X1 Connector X2 Relation
22 10 –
21 1 –
6+8 19 Short circuiting 6 and 8
The technical specifications of the RS449 DCE cable are as follows.
Table 14-30 Specifications of the RS449 DCE cable
Item Description
Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cablesolder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
Connector X2 Cable connector-D type-37PIN-female-cable solder-exclusively usedfor OEM
Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26core-PANTONE 296U-exclusively used for OEM
Number of cores 26
Core diameter 0.32 mm
Length 3 m
RS449 DTE CableFigure 14-31 shows the structure of the RS449 DTE cable.
Figure 14-31 Structure of the RS449 DTE cable
Pos.28
21 3
Pos.1
BA
Pos.37
Pos.1X2X1
W
A-A B-B
1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 male-I
Table 14-31 lists the pin assignment of the RS449 DTE cable.
Table 14-31 Pin assignment of the RS449 DTE cable
Connector X1 Connector X2 Relation
27 12 Twisted pair
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Connector X1 Connector X2 Relation
28 30
25 11 Twisted pair
26 29
13 7 Twisted pair
14 25
23 9 Twisted pair
24 27
11 13 Twisted pair
12 31
19 6 Twisted pair
20 24
1 4 Twisted pair
2 22
15 17 Twisted pair
16 35
17 8 Twisted pair
18 26
3 5 Twisted pair
4 23
22 10 -
21 1 -
6+8+10 19 Short circuiting 6, 8 and 10
The technical specifications of the RS449 DTE cable are as follows.
Table 14-32 Specifications of the RS449 DTE cable
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row,standard installation hole, exclusively used for OEM
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Item Description
Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM
Number ofcores
26
Corediameter
0.32 mm
RS530 DCE Cable
Figure 14-32 shows the structure of the RS530 DCE cable.
Figure 14-32 Structure of the RS530 DCE cable
Pos.1
2 31
Pos.1
Pos.28
A B
Pos.25
X1X2
W
B-BA-A
1. Cable connector-D25 female 2. Main tag 3. Cable connector-D28 male
Table 14-33 lists the pin assignment of the RS530 DCE cable.
Table 14-33 Pin assignment of the RS530 DCE cable
Connector X1 Connector X2 Relation
28 22 Twisted pair
27 6
26 23 Twisted pair
25 20
24 19 Twisted pair
23 4
22 18 Single
21 1 Single
20 14 Twisted pair
19 2
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Connector X1 Connector X2 Relation
18 11 Twisted pair
17 24
16 9 Twisted pair
15 17
14 13 Twisted pair
13 5
12 10 Twisted pair
11 8
4 12 Twisted pair
3 15
2 16 Twisted pair
1 3
6+7+9 7 Short circuiting 6, 7 and 9
The technical specifications of the RS530 DCE cable are as follows.
Table 14-34 Specifications of the RS530 DCE cable
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-D type-25PIN-female-cable solder
Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM
Number ofcores
26
Corediameter
0.32 mm
Length 3 m
RS530 DTE CableFigure 14-33 shows the structure of the RS530 DTE cable.
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Figure 14-33 Structure of the RS530 DTE cable
A-A
Pos.28
2 31
Pos.1
A B
Pos.1
Pos.25X1
X2
W
B-B
1. Cable connector-D25 male 2. Main tag 3. Cable connector-D28 male
Table 14-35 lists the pin assignment of the RS530 DTE cable.
Table 14-35 Pin assignment of the RS530 DTE cable
Connector X1 Connector X2 Relation
27 20 Twisted pair
28 23
25 6 Twisted pair
26 22
13 4 Twisted pair
14 19
23 5 Twisted pair
24 13
11 8 Twisted pair
12 10
19 3 Twisted pair
20 16
1 2 Twisted pair
2 14
15 24 Twisted pair
16 11
17 17 Twisted pair
18 9
3 15 Twisted pair
4 12
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Connector X1 Connector X2 Relation
22 18 –
21 1 –
6+7+9+10 7 Short circuiting 6, 7, 9 and 10
The technical specifications of the RS530 DTE cable are as follows.
Table 14-36 Specifications of the RS530 DTE cable
Item Description
ConnectorX1
Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
ConnectorX2
Cable connector-D type-25PIN-male-cable solder
Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM
Number ofcores
26
Corediameter
0.32 mm
Length 3 m
14.6 Clock CableThe clock cable includes the clock cable and clock transfer cable.
14.6.1 Clock CableThe clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to inputand output external clock signals.
14.6.2 One-Channel and Two-Channel Clock Transfer CablesThe clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) andtwo-channel clock transfer cable (75 ohms to 120 ohms).
14.6.1 Clock CableThe clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to inputand output external clock signals.
For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the externalclock interface of the OptiX OSN equipment. Use a connector to connect the other end to theexternal clock equipment. The connector should be made according to the on-site requirements.For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to theexternal clock interface of the OptiX OSN equipment. Use a connector to connect the other endto the external clock equipment. The connector should be made according to the on-siterequirements.
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Structure
Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohmclock cable respectively.
Figure 14-34 Structure of the 75-ohm clock cable
1. Coaxial connector-SMB 2. Tag
Figure 14-35 Structure of the 120-ohm 8 x E1 cable
1. Tag 1 (R) and Tag2 (T) 2. Communication cable 3. Main tag 4. Network interface connector-RJ-45
Pin Assignment
Table 14-37 lists the pin assignment of the 120-ohm clock cable.
Table 14-37 Pin assignment of the 120-ohm clock cable
X1 W Remark
X1.1 Blue W1
X1.2 White
X1.4 Orange W2
X1.5 White
Technical Specifications
Item Description
75-ohmclock cable
Connector: coaxial connector-SMB-75 ohms-straight and female
Cable type: coaxial cable-75 ohms-3.9 mm-2.1mm-0.34 mm-shielded
Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34mm
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Item Description
Length: 10 m, 15 m, 20 m, 30 m
120-ohmclock cable
Connector X: network interface connector-8PIN-8 bit-shielded-crystal modelconnector
Cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U
Inner conductor diameter: 0.4 mm/26AWG
Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, 100 m
14.6.2 One-Channel and Two-Channel Clock Transfer CablesThe clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) andtwo-channel clock transfer cable (75 ohms to 120 ohms).
StructureFigure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable andtwo-channel clock transfer cable respectively.
Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)
1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Main tag 3. 75 ohms/120 ohms transfer PCB
Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)
1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag5. 75 ohms/120 ohms transfer PCB 6. Tag 3:"1#" 7. Tag 4:"2#"
Pin AssignmentTable 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120ohms).
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Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)
Connector 75-ohm Cable Color 120-ohm Cable
X1 Core Blue W3
Shielding layer White
X2 Core Blue W4
Shielding layer White
Technical SpecificationsItem Description
Onechannel
Connector: coaxial connector-SMB-75 ohms-straight and female
75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductordiameter 0.34 mm
120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2pairs-Pantone 430U
Inner conductor diameter: 0.4 mm/26AWG
Length: 30 m
Twochannels
Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female
75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductordiameter 0.34 mm
120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2pairs-Pantone 430U
Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG
Length: 30 m
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A Equipment and Board Alarm Indicators
This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment.
A.1 Indicators on the CabinetThis section describes the indicators on the cabinet for the OptiX OSN equipment.
A.2 Board Alarm IndicatorThis section describes the board alarm indicators and their indications.
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A.1 Indicators on the CabinetThis section describes the indicators on the cabinet for the OptiX OSN equipment.
Indicator Indication
Normal power supply indicator: Power(green)
When it is lit, it indicates that the power is suppliedto the equipment.
When it is unlit, it indicates that no power issupplied to the equipment.
Critical alarm indicator: Critical (red) When it is lit, it indicates that critical alarms aregenerated in the equipment.
When it is unlit, it indicates that no critical alarmsare generated in the equipment.
Major alarm indicator: Major (orange) When it is lit, it indicates that major alarms aregenerated in the equipment.
When it is unlit, it indicates that no major alarms aregenerated in the equipment.
Minor alarm indicator: Minor (yellow) When it is lit, it indicates that minor alarms aregenerated in the equipment.
When it is unlit, it indicates that no minor alarmsare generated in the equipment.
A.2 Board Alarm IndicatorThis section describes the board alarm indicators and their indications.
Board Hardware State Indicator (STAT)
Status Description Indication
Lit (green) The board is working normally.
Lit (red) The board hardware is faulty.
Unlit No power is supplied to the board.
Service Activating State Indicator (ACT)
Status Description Indication
Lit (green) The service is in the activating state and the board isworking.
Unlit The service is in the non-activating state.
A Equipment and Board Alarm IndicatorsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
A-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Software State Indicator (PROG)Status Description Indication
Lit (green) The board software or software for FPGA is loadedsuccessfully, or the board software is initializednormally.
Circularly lit for 100 ms and unlit for100 ms (green)
The board software or FPGA is being loaded to theFLASH.
Circularly lit for 300 ms and unlit for300 ms (green)
The board software is being initialized and is in theBIOS boot state.
Lit (red) The board software or FPGA in the FLASH is lost.The loading and initialization of the board softwarefails.
Unlit No power is input.
Service Alarm Indicator (SRV)Status Description Indication
Lit (green) The service is running normally and no service alarmsare generated.
Lit (red) Critical or major alarms occur to the service.
Lit (yellow) Minor or remote alarms occur to the service.
Unlit The board is not configured with services and noalarms is generated, or no power is supplied to theboard.
Synchronization Clock State IndicatorStatus Description Indication
Lit (green) l The clock is working in the free-run mode and thesystem clock priority list is not set. By default, thesystem clock priority list contains only the internalsource.
l The clock is working in the tracing mode andtracing the clock source rather than the internalsource in the priority list.
Lit (red) The system clock priority list is set. Except theinternal clock source, all clock sources are lost. Theclock is working in the hold-over or free-run mode.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description A Equipment and Board Alarm Indicators
Issue 02 (2007-09-10) Huawei Technologies Proprietary A-3
Alarm Cutting Indicator (ALMC)Status Description Indication
Lit (yellow) The board is in the alarm cutting state.
Unlit Sound is generated to indicate the alarm.
Ethernet IndicatorIndicator Status
DescriptionIndication
Connection status indicator(LINK), which is green whenlit.
Lit The network cable is successfullyconnected to the equipment.
Unlit The network cable is not connected tothe equipment.
Data receiving andtransmitting indicator (ACT),which is orange when lit.
Flashing The data is being transmitted orreceived.
Unlit No data is being transmitted orreceived.
Service activating state indicator of the cross-connect unit (ACTX)Status Description Indication
Lit (green) The cross-connect unit is in the active state.
Unlit The cross-connect unit is in the standby state.
Active/standby state indicator (ACTC) of the SCC unitStatus Description Indication
Lit (green) The cross-connect unit is in the active state.
Unlit The cross-connect unit is in the standby state.
Service alarm indicator of the line unit (SRVL)Status Description Indication
Lit (green) The line service is normal and no alarms aregenerated.
Lit (red) Critical alarms or major alarms occur to the lineservice.
Lit (yellow) Minor or remote alarms occur to the line service.
A Equipment and Board Alarm IndicatorsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
A-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Status Description Indication
Unlit The unit is not configured with services and no alarmsis generated, or no power is supplied to the unit.
Fan tray assembly indicatorIndicator Status Description Indication
Board runningstate indicator(RUN)
Lit (green) The board is working normally.
Unlit The board is not powered on.
Fan alarmindicator (ALM)
Lit (red) The fan stops.
Unlit The fan is running normally.
Indicator on the panel of the COAIndicator Status Description Indication
Green runningindicator (RUN)
Flash once every twoseconds (green)
The COA is running normally.
Flash once every fourseconds (green)
The COA in in the database protectionmode. The communication between theCOA and the SCC fails.
Flash five times everysecond (green)
The program is starting or being loaded.
Alarm indicator(ALM)
Lit (red) The self-check of the memory fails.
Flash thrice every othersecond (red)
Critical alarms are generated.
Flash twice every othersecond (red)
Major alarms are generated.
Flash once every othersecond (red)
Minor alarms are generated.
Power indicator (POWER)Status Description Indication
Lit (green) The input of the power supply is normal.
Unlit No power supply is input or the power supply fails.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description A Equipment and Board Alarm Indicators
Issue 02 (2007-09-10) Huawei Technologies Proprietary A-5
Indicator on the UPMModule Indicator Status
DescriptionIndication
Rectifiermodule
ALM Lit (red) The rectifier module fails. Normally, it is unlit.
Vout Lit (green) The output of the rectifier module is normal.
Monitoring module
RUN Flashes (green) The entire power supply system is normal.
ALM Lit (red) The entire power supply system becomesfaulty. Normally, it is unlit.
A Equipment and Board Alarm IndicatorsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
A-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
B Labels
This chapter describes various labels for the OptiX OSN equipment, including the safety labels,optical module labels, and cable labels.
B.1 Safety LabelMany safety labels are stuck on the equipment. This section describes the suggestions andlocations of these safety labels.
B.2 Optical Module LabelsOptical module labels are used to recognize different types of optical modules. Optical modulelabel is stuck to the optical module.
B.3 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description B Labels
Issue 02 (2007-09-10) Huawei Technologies Proprietary B-1
B.1 Safety LabelMany safety labels are stuck on the equipment. This section describes the suggestions andlocations of these safety labels.
B.1.1 Label DescriptionOn the subrack, there are labels such as the ESD protection label, subrack grounding label andfan warning label.
B.1.2 Label PositionThe ESD protection label and the subrack grounding label are stuck on the subrack. The laserclass label and the APD warning label are stuck on the front panel of each board.
B.1.1 Label DescriptionOn the subrack, there are labels such as the ESD protection label, subrack grounding label andfan warning label.
Table B-1 Labels on the equipment
Label Type Suggestion
ESD protection label The equipment is electrostaticsensitive.
CLASS 1LASER
PRODUCT
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTSCLASS 1M
LASERPRODUCT
Laser safety class The label suggests the class ofthe laser source.
Subrack grounding label This label suggests thegrounding position.
ATTENTION 警告
CLEAN PERIODICALLY 定期清洗
! Regular cleaning label Regularly clean the air filter.
严禁在风扇高速旋转时接触叶片
DON'T TOUCH THEFAN LEAVES BEFORETHEY SLOW DOWN !
Fan warning label Do not the fan leaves beforethe fan stops.
! APDReceiver
MAX:-9dBm
APD warning label The overload point of theindicator is –9 dBm.
B LabelsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
B-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Label Type Suggestion
RoHS label The equipment is in line withthe RoHS-relatedenvironment-friendlyrequirements.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 4.5A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500A
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 6A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
For the enhanced subrack:
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 8.2A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500A
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 10.4A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
Product nameplate label The label suggests theproduct name andcertification.
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
Qualification card label The equipment is qualified.
B.1.2 Label PositionThe ESD protection label and the subrack grounding label are stuck on the subrack. The laserclass label and the APD warning label are stuck on the front panel of each board.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description B Labels
Issue 02 (2007-09-10) Huawei Technologies Proprietary B-3
Figure B-1 Labels on the OptiX OSN 1500B subrack
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
ATTENTION 警告
CLEAN PERIODICALLY 定期清洗
严禁在风扇高速旋转时接触叶片
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 6A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
DON'T TOUCH THEFAN LEAVES BEFORETHEY SLOW DOWN !
Figure B-2 Labels on the OptiX OSN 1500A subrack
合格证/QUALIFICATION CARD
华为技术有限公司 中国制作MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.
HUAWEI
ATTENTION 警告
CLEAN PERIODICALLY 定期清洗
严禁在风扇高速旋转时接触叶片
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.
POWER RATING: -48- -60V ; 4.5A
华为技术有限公司 中国制作MADE IN CHINA
电源额定值
OptiX OSN 1500A
HUAWEI TECHNOLOGIES CO.,LTD.
N14036
DON'T TOUCH THEFAN LEAVES BEFORETHEY SLOW DOWN !
B LabelsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
B-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Figure B-3 Labels on a board
LASERRADIATION
DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS
CLASS 1M LASERPRODUCT
BA2
SL16
CLASS 1LASER
PRODUCT! APD
ReceiverMAX:-9dBm
B.2 Optical Module LabelsOptical module labels are used to recognize different types of optical modules. Optical modulelabel is stuck to the optical module.
Figure B-4 shows the optical module labels.
Figure B-4 Optical module labels
As shown in Table B-2, different types of optical module have different codes.
Table B-2 Optical module code and type mapping table
OpticalModule Code
Optical Type
34060288 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-16-–3 dBm-–10 dBm-–21 dBm-LC-2 km
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OpticalModule Code
Optical Type
34060278 Optical transceiver-ESFP (internal and external alignment)-1310-STM-16-0 dBm-–5 dBm-–21 dBm-LC-15 km
34060289 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-16-3 dBm-–2 dBm-–30 dBm-LC-40 km
34060279 Optical transceiver-ESFP (internal and external alignment)-1550-STM-16-3 dBm-–2 dBm-–30 dBm-LC-80 km
34060277 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-4-–8 dBm-–15 dBm-–31 dBm-LC-15 km
34060280 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-4-2 dBm-–3 dBm-–30 dBm-LC-40 km
34060284 Optical transceiver-ESFP (internal and external alignment)-1550 nm-STM-4-2 dBm-–3 dBm-–30 dBm-LC-80km
34060285 Optical transceiver-ESFP (internal and external alignment)-1550 nm-STM-4-2 dBm-–3 dBm--36 dBm-LC-100km
34060276 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-1-–8 dBm-–15 dBm-–31 dBm-LC-15 km
34060281 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM–1-0 dBm-–5 dBm-–37 dBm-LC-40 km
34060282 Optical transceiver-ESFP (internal and external alignment)-1550-STM-1-0 dBm-–5 dBm-–37 dBm-LC-80 km
34060299 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-1-–8 dBm-–15 dBm-–31 dBm-LC (private)-15 km
34060286 Optical transceiver-ESFP (internal and external alignment)-850nm-2.125G multirate-–2.5 dBm-–9.5 dBm-–17 dBm-LC-0.5 km
34060219 Optical transceiver-ESFP (internal and external alignment)-1310nm-1.25 Gbit/s-–3 dBm-–9.5 dBm-–20 dBm-LC-10 km
34060298 Optical transceiver-ESFP (internal and external alignment)-1310nm-1.25 Gbit/s-3 dBm-–4.5 dBm-–22.5 dBm-LC-40 km
34060274 Optical transceiver-ESFP (internal and external alignment)-1550nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-80 km
34060325 Optical transceiver-ESFP (internal and external alignment)-850nm-2.125 G multirate-–2.5 dBm-–9.5dBm-–17 dBm-LC (private)-multimode-0.5 km
34060049 Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-–9.5 dBm-–17dBm-LC-–0.55 km
34060050 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-–3 dBm-–9 dBm-–20dBm-LC-–10 km
B LabelsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
B-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
OpticalModule Code
Optical Type
34060207 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-–40 km
34060051 Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-–4 dBm-–22 dBm-LC-–70 km
34060287 Optical transceiver-SFP-1310 nm-STM-1-–14 dBm-–19 dBm-–30 dBm-LC (TX disable)-2 km
34060053 Optical transceiver-SFP-1310 nm-STM-1-–8 dBm-–15 dBm-–28 dBm-LC-15 km
34060209 Optical transceiver-SFP-1310 nm-STM-1-0 dBm-–5 dBm-–34 dBm-LC-40 km
B.3 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.
The engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications. Table B-3 lists the Huawei engineering specifications forengineering labels.
For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent OpticalTransmission System Installation Guide.
Table B-3 Huawei specifications for engineering labels
Label Illustration Suggestion
Engineeringlabels forpowercables
(1) (2)
TO: A01 -48V2 B08
TO: B03 -48V2
(1) Indicates the label on the loadedcabinet side, which carries theinformation about the position ofthe cable on the power distributionunit.(2) Indicates the label on thedistribution unit side, which carriesthe information about the positionof the cable on the loaded cabinetside.
(1) On the loaded cabinet side, the labelmarked "A01/B08-–48V2" on the cableindicates that the cable is –48V2 DC powersupply, which is from the eighth connecteron the second row of the –48V bus bar inthe cabinet on Row A, and Column 1 in theequipment room.(2) On the distribution unit side, the labelmarked "B03--48V2" indicates that thecable is –48V2 DC power supply, which isfrom the loaded cabinet on Row B, Column03 in the equipment room. For PGND andBGND, it is only necessary to give the rowand column of the power distribution unit,instead of the specific serial number of theterminal block on the copper bar.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description B Labels
Issue 02 (2007-09-10) Huawei Technologies Proprietary B-7
Label Illustration Suggestion
Engineeringlabels foralarmexternalcables
The external alarm cables are connected tothe first subscriber cabinet of each row(used for power distribution). Engineeringlabels posted on the first cabinet of eachrow should indicate which equipment isusing the access terminal. Engineeringlabels are not needed on the equipment sideunless there are special requirements.The label marked "A01" indicates that thealarm cable connects the first cabinet andthe cabinet on Row A, Column 01 in theequipment room.
Engineeringlabels forEthernetcables
"A01-03-06-05" indicates that on the localend of the Ethernet cable is connected toEthernet Port 05, Slot 6, Frame 03 of thecabinet on Row A, Column 01 in theequipment room."B02-03-12" indicates that the other end ofthe Ethernet cable is connected to EthernetPort 12, Frame 03 of the cabinet on RowB, Column 02 in the equipment room. Noslot number is specified.
Engineeringlabels forfibersthatconnectequipment
"A01-01-05-05-R" indicates that the localend of the fiber jumper is connected withOptical Receiving Interface 05 on Slot 5,Frame 01 in the cabinet on Row A, Column01 in the equipment room."G01-01-01-01-T" indicates that theopposite end of the fiber jumper isconnected with optical transmittinginterface 01 on Slot 01, Frame 01 in thecabinet on Row G, Column 01 in theequipment room.
Labelsfor fibersthatconnecttheequipment to theODF
"ODF-G01-01-01-R" indicates that thelocal end of the fiber jumper is connectedto the optical receiving terminal on Row01, Column 01 of the ODF in Row GColumn 01 in the equipment room."A01-01-05-05-R" indicates that the otherend of the fiber jumper is connected tooptical receiving interface 5 on Slot 05,frame 01 in the cabinet on Row A, Column01 in the equipment room.
B LabelsOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
B-8 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Label Illustration Suggestion
Labelsfor trunkcablesthatconnecttheequipment to theODF
"A01-03-01-01-R" indicates that local endof the trunk cable connects with thereceiving terminal of Trunk Cable 01 inSlot 01, Frame 03 of the cabinet on RowA, Column 01 in the equipment room."DDF-G01-01-01-AR" indicates that theopposite end of the trunk cable connectsthe receiving terminal of Direction A(connected to optical network equipment)on Row 01, Column 01 of the DDF on RowG and Column 01 in the equipment room.
Engineeringlabels forsubscriber cables
TO:
"A01-03-01-01" indicates that the localend of the subscriber cable connects withTerminal 01 on Slot 1, Frame 03 of thecabinet on Row A, Column 01 in theequipment room."MDF-G01-01-01" indicates that theopposite end of the cable connects with theterminal on Row 01, Column 01 of theMDF on Row G, Column 01 in theequipment room.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description B Labels
Issue 02 (2007-09-10) Huawei Technologies Proprietary B-9
C Power Consumption and Weight
This chapter describes the power consumption and weight of each board for the OptiX OSN1500.
Table C-1 Power consumption and weight of each board for the OptiX OSN 1500
Board Consumption (W)
Weight (kg) Board Consumption (W)
Weight (kg)
N1ADL4 41 0.9 N1LWX 30 1.1
N1ADQ1 41 1.0 N1MR2B 0 1.0
AUX 19 1.0 N1MR2C 0 1.0
R1AMU 8 0.5 N1FIB 0 0.4
N1BA2 20 1.0 N1MST4 26 0.9
N1BPA 20 1.0 N1MU04 2 0.4
Q2CXL16 40 1.1 N1OU08 6 0.4
Q2CXL4 40 1.1 N2OU08 6 0.4
Q2CXL1 40 1.1 R1PD1 15 0.5
N1EFT8A 26 1.0 N3SL16 22 1.1
N3SL16A 17 0.9 N2PQ3 13 0.9
N2PD3 12 0.9 N2PL3 12 0.9
N2PL3A 12 0.9 TN11OBU1 16 1.3
TN11MR2 0.2 0.9 TN11MR4 0.2 0.9
TN11CMR2
0.2 0.8 TN11CMR4 0.2 0.9
N1D12B 0 0.3 N1PD3 19 1.1
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Board Consumption (W)
Weight (kg) Board Consumption (W)
Weight (kg)
N1D12S 9(switching),0 (normal)9
0.4 PIU 1.5 1.3
N1D34S 2(switching),0 (normal)
0.4 R1PL1A 6.7 0.5
N1D75S 6(switching),0 (normal)
0.4 R1PL1B 6.7 0.5
N1EFF8 6 0.4 N1PL3 15 1.0
N1EFS0 35 1.0 N1PQ1 19 1.0
N2EFS0 35 1.0 N1PQM 22 1.0
N4EFS0 35 1.0 R2PD1 10 0.6
N1EFS4 30 1.0 N1PL3A 15 1.1
N2EFS4 30 1.0 N1SEP1 17 1.0
R1EFT4 14 0.5 N1SF16 26 1.1
N1EFT8 26 1.0 N1SL1 14 1.0
N1EGS2 40 1.0 N2SL1 14 1.0
N2EGS2 43 1.0 N1SL16,N1SL16A
20 1.1
N1EGT2 29 0.9 N2SL16 20 1.1
N1EMR0 50 1.2 N1SL4 15 1.0
N2EMR0 50 1.2 N2SL4 15 1.0
EOW 10 0.4 N1SLD4 15 1.0
N1ETF8 2 0.4 N2SLD4 15 1.0
N1ETS8 3(switching),0 (normal)
0.4 N1SLQ1 15 1.0
N1EU04 6 0.4 N2SLQ1 15 1.0
N1EU08 11 0.4 N1SLQ4 16 1.0
R1FAN 20 1.0 N2SLQ4 16 1.0
N1IDL4 41 1.0 N1SLT1 15 1.2
C Power Consumption and WeightOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
C-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Consumption (W)
Weight (kg) Board Consumption (W)
Weight (kg)
N1IDQ1 41 1.0 N1SPQ4 24 0.9
R1L12S 2.7 0.2 N2SPQ4 24 0.9
R1L75S 4.5 0.3 R1SL1 10 0.5
N1TSB4 2.5 0.3 R1SL4 10 0.5
N1C34S 2(switching),0 (normal)
0.3 R1SLD4 11 0.5
N1TSB8 5(switching),0 (normal)
0.3 R1SLQ1 12 0.5
N1EGS4 70 1.1 N1DX1 15 1.0
N1EMS4 65 (not usedwith theinterfaceboard), 75(used withthe interfaceboard)
1.1 N2PQ1 13 1.0
N1DXA 10 0.8 - - -
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D Board Version Configuration
This chapter describes the version compatibility for each board.
Table D-1 lists the board versions that are compatible with the OptiX OSN products.
Table D-1 Board versions that are compatible with the OptiX OSN products
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
N1SL64 Y Y Y N Y N N
N2SL64 N Y Y N Y N N
T2SL64 Y N N N N N N
T2SL64A Y N N N N N N
N1SF64 Y Y Y N Y N N
N1SLD64 Y Y Y N N N N
N1SL16 Y Y Y Y N Y Y
N2SL16 Y Y Y Y Y Y Y
N3SL16 Y Y Y Y Y Y Y
N1SL16A Y Y Y Y N Y Y
N2SL16A Y Y Y Y N Y Y
N3SL16A Y Y Y Y Y Y Y
N1SLD16 N Y Y N N N N
N2SLQ16 Y Y Y N N N N
N1SF16 Y Y Y Y Y Y Y
N1SL4 Y Y Y Y N Y Y
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description D Board Version Configuration
Issue 02 (2007-09-10) Huawei Technologies Proprietary D-1
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
N2SL4 Y Y Y Y N Y Y
R1SL4 N N N Y N Y Y
N1SLQ4 Y Y Y Y N Y Y
N2SLQ4 Y Y Y Y N Y Y
N1SLD4 Y Y Y Y N Y Y
N2SLD4 Y Y Y Y N Y Y
R1SLD4 N N N Y N Y Y
N1SLT1 Y Y Y Y N Y Y
N1SLQ1 Y Y Y Y N Y Y
N2SLQ1 Y Y Y Y N Y Y
R1SLQ1 N N N Y N Y Y
N1SL1 Y Y Y Y N Y Y
N2SL1 Y Y Y Y N Y Y
R1SL1 N N N Y N Y Y
N1SLH1 Y Y Y N N N N
N1SEP1 Y Y Y Y N Y Y
N2SLO1 Y Y Y Y N Y Y
R1PL1 N N N N N Y Y
R1PD1 N N N Y N Y Y
R2PD1 N N N Y N Y Y
N1PQ1 Y Y Y Y N N Y
N2PQ1 Y Y Y Y N N Y
N1PQM Y Y Y Y N N Y
N1PL3 Y Y Y Y N N Y
N2PL3 Y Y Y Y N N Y
N1PL3A Y Y Y Y N Y Y
N2PL3A Y Y Y Y N Y Y
N1PD3 Y Y Y Y N N Y
N2PD3 Y Y Y Y N N Y
D Board Version ConfigurationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
D-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
N2PQ3 Y Y Y Y N N Y
N1DX1 Y Y Y Y N N Y
N1DXA Y Y Y Y N Y Y
N1SPQ4 N Y Y Y N N Y
N2SPQ4 Y Y Y Y N N Y
R1EFT4 N N N Y N Y Y
N1EFT8 Y Y Y Y N Y Y
N1EFT8A Y Y Y Y N Y Y
N1EGT2 Y Y Y Y N Y Y
N1EFS0 N Y Y Y N N Y
N2EFS0 Y Y Y Y N N Y
N4EFS0 Y Y Y Y N N Y
N1EFS4 Y Y Y Y N Y Y
N2EFS4 Y Y Y Y N Y Y
N1EGS2 N Y Y Y N Y Y
N2EGS2 Y Y Y Y N Y Y
N1EMS4 Y Y Y Y N Y Y
N1EGS4 Y Y Y Y N Y Y
N2EGR2 Y Y Y Y N Y Y
N1EMR0 N Y Y Y N Y Y
N2EMR0 Y Y Y Y N Y Y
N1ADL4 Y Y Y Y N Y Y
N1ADQ1 Y Y Y Y N Y Y
N1IDL4 Y Y Y Y N Y Y
N1IDQ1 Y Y Y Y N Y Y
N1MST4 Y Y Y Y N Y Y
N1EU08 Y Y Y Y N N Y
N1OU08 Y Y Y Y N N Y
N2OU08 Y Y Y Y N N Y
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description D Board Version Configuration
Issue 02 (2007-09-10) Huawei Technologies Proprietary D-3
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
N1D75S Y Y Y Y N N Y
N1MU04 Y Y Y Y N N Y
N1D34S Y Y Y Y N N Y
N1C34S Y Y Y Y N N Y
N1EU04 N Y Y Y N N Y
N1D12S Y Y Y Y N N Y
N1D12B Y Y Y Y N N Y
R1L12S N N N N N Y N
R1L75S N N N N N Y N
N1EFF8 Y Y Y Y N N Y
N1ETF8 Y Y Y Y N N Y
N1ETS8 Y Y Y Y N N Y
N1DM12 Y Y Y Y N N Y
N1TSB4 N Y Y Y N N Y
N1TSB8 Y Y Y Y N N Y
Q2CXL1 N N N Y N Y Y
Q2CXL4 N N N Y N Y Y
Q2CXL16 N N N Y N Y Y
T1GXCSA Y N N N N N N
N1GXCSA N Y Y N N N N
T1EXCSA Y N N N N N N
N1EXCSA N Y Y N N N N
T2UXCSA Y N N N N N N
N1UXCSA N Y Y N N N N
N1UXCSB N Y Y N N N N
T1SXCSA Y N N N N N N
T2SXCSA Y N N N N N N
N1SXCSA N Y Y N N N N
N1SXCSB N Y Y N N N N
D Board Version ConfigurationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
D-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
T1IXCSA Y N N N N N N
N1IXCSA N Y Y N N N N
N1IXCSB N Y Y N N N N
N1XCE N Y Y N N N N
N1GSCC N Y N N N N N
N2GSCC Y N N N N N N
N3GSCC Y Y Y N N N N
CRG N N N N Y N N
T1EOW Y N N N N N N
R1EOW N N N N N Y Y
T1AUX Y N N N N N N
N1AUX N Y Y N N N N
R1AUX N N N N N Y Y
R2AUX N N N N N Y Y
R1AMU N N N N N Y Y
Q1SAP N N N Y Y N N
Q2SAP N N N Y Y N N
Q1SEI N N N Y Y N N
N1FAN N Y Y Y Y N N
R1FAN N N N N N Y Y
N1FANA Y Y Y N N N N
TN11CMR2
Y Y Y Y N Y Y
TN11CMR4
Y Y Y Y N Y Y
TN11MR2 Y Y Y Y N Y Y
TN11MR4 Y Y Y Y N Y Y
N1MR2A Y Y Y Y N Y Y
N1MR2B N N N Y N Y Y
N1MR2C Y Y Y Y N N Y
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description D Board Version Configuration
Issue 02 (2007-09-10) Huawei Technologies Proprietary D-5
Product OptiXOSN7500
OptiXOSN3500
OptiXOSN3500T
OptiXOSN2500
OptiXOSN 2500REG
OptiXOSN1500A
OptiXOSN1500B
N1LWX Y Y Y Y N Y Y
TN11OBU1
Y Y Y Y Y Y Y
N1FIB Y Y Y Y Y Y Y
N1BA2 Y Y Y Y Y Y Y
N1BPA Y Y Y Y Y Y Y
61COA Y Y Y Y Y Y Y
62COA Y Y Y Y Y Y Y
N1COA Y Y Y Y Y Y Y
N1DCU Y Y Y N Y N N
N2DCU Y Y Y N Y N N
UPM N N N Y Y Y Y
T1PIU Y N N N N N N
N1PIU N Y Y N N N N
Q1PIU N N N Y Y N N
R1PIU N N N N N Y Y
R1PIUA N N N N N Y N
D Board Version ConfigurationOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
D-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
E Board Loopbacks
The SDH, PDH, data processing board for the OptiX OSN equipment support various types ofloopbacks.
In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability ofsupporting the loopbacks.
Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment
Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop
Q2SL1 Supported. Supported. Supported. Not supported.
Q2SL4 Supported. Supported. Supported. Not supported.
Q2SL16 Supported. Supported. Supported. Not supported.
N1SL64 Supported. Supported. Supported. Supported.
N2SL64 Supported. Supported. Not supported. Not supported.
T2SL64 Supported. Supported. Not supported. Not supported.
T2SL64A Supported. Supported. Not supported. Not supported.
N1SF64 Supported. Supported. Supported. Supported.
N1SLD64 Supported. Supported. Supported. Supported.
N1SL16 Supported. Supported. Supported. Not supported.
N2SL16 Supported. Supported. Not supported. Not supported.
N3SL16 Supported. Supported. Supported. Supported.
N1SL16A Supported. Supported. Supported. Not supported.
N2SL16A Supported. Supported. Not supported. Not supported.
N3SL16A Supported. Supported. Supported. Supported.
N1SLD16 Supported. Supported. Supported. Supported.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description E Board Loopbacks
Issue 02 (2007-09-10) Huawei Technologies Proprietary E-1
Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop
N2SLQ16 Supported. Supported. Not supported. Not supported.
N1SF16 Supported. Supported. Supported. Not supported.
N1SL4 Supported. Supported. Supported. Not supported.
N2SL4 Supported. Supported. Not supported. Not supported.
R1SL4 Supported. Supported. Supported. Not supported.
N1SLQ4 Supported. Supported. Supported. Not supported.
N2SLQ4 Supported. Supported. Not supported. Not supported.
N1SLD4 Supported. Supported. Supported. Not supported.
N2SLD4 Supported. Supported. Not supported. Not supported.
R1SLD4 Supported. Supported. Supported. Not supported.
N1SLT1 Supported. Supported. Supported. Not supported.
N1SLQ1 Supported. Supported. Supported. Not supported.
N2SLQ1 Supported. Supported. Not supported. Not supported.
R1SLQ1 Supported. Supported. Supported. Not supported.
N1SL1 Supported. Supported. Supported. Not supported.
N2SL1 Supported. Supported. Not supported. Not supported.
R1SL1 Supported. Supported. Supported. Not supported.
N1SLH1 Supported. Supported. Supported. Not supported.
N1SEP1 Supported. Supported. Supported. Not supported.
N2SLO1 Supported. Supported. Not supported. Not supported.
In the case of the PDH boards for the OptiX OSN equipment, Table E-2 lists the capability ofsupporting the loopbacks.
Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment
Board Port Inloop Port Outloop
R1PL1 Supported. Supported.
R1PD1 Supported. Supported.
N1PQ1 Supported. Supported.
N1PQM Supported. Supported.
N1PD3 Supported. Supported.
E Board LoopbacksOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
E-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Board Port Inloop Port Outloop
N1PL3 Supported. Supported.
N2SPQ4 Supported. Supported.
In the case of the Ethernet boards for the OptiX OSN equipment, Table E-3 lists the capabilityof supporting the loopbacks.
Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment
Board MACLayerOutloop
MACLayerInloop
PHYLayerOutloop
PHYLayerInloop
VC-4Inloop,VC-4Outloop
VC-3Inloop,VC-3Outloop
N1EFS4 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N2EFS4 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N1EFS0 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N2EFS0 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N4EFS0 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N1EGS2 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N1EGT2 Supported.
Supported. Notsupported.
Supported. Notsupported.
Notsupported.
N1EFT8 Supported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N1EFT8A
Supported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
R1EFT4 Supported.
Supported. Notsupported.
Supported. Notsupported.
Supported.
N1EMS4 Notsupported.
Notsupported.
Notsupported.
Supported. Notsupported.
Notsupported.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description E Board Loopbacks
Issue 02 (2007-09-10) Huawei Technologies Proprietary E-3
Board MACLayerOutloop
MACLayerInloop
PHYLayerOutloop
PHYLayerInloop
VC-4Inloop,VC-4Outloop
VC-3Inloop,VC-3Outloop
N1EGS4 Notsupported.
Notsupported.
Notsupported.
Supported. Notsupported.
Notsupported.
N2EGS4 Notsupported.
Notsupported.
Notsupported.
Supported. Notsupported.
Notsupported.
N2EGR2 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Notsupported.
N1EMR0 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Notsupported.
N2EMR0 Notsupported.
Supported. Notsupported.
Supported. Notsupported.
Notsupported.
N1MST4 Notsupported.
Notsupported.
Supported. Supported. Notsupported.
Notsupported.
In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-3 lists the capabilityof supporting the loopbacks.
Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment
Board External PortOutloop
External PortInloop
Internal PortOutloop
Internal PortInloop
N1ADL4 Not supported. Supported. Supported. Supported.
N1ADQ1 Not supported. Supported. Supported. Supported.
N1IDL4 Not supported. Supported. Supported. Supported.
N1IDQ1 Not supported. Supported. Supported. Supported.
E Board LoopbacksOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
E-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
F Board Configuration Reference
The T2000 can be used to configure various parameters for SDH boards, PDH boards, dataprocessing boards, and cross-connect and timing boards.
F.1 SDH Processing BoardsThe parameters that can be configured for the SDH processing boards include the J0 byte, J1byte, C2 byte and V5 byte.
F.2 PDH Processing BoardThe parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2byte , V5 byte and tributary loopback.
F.3 Data Processing BoardThe parameters that should be set for data processing boards include SDH parameters, Ethernetparameters and ATM parameters.
F.4 Cross-Connect and Timing UnitThe clock parameters should be set on the cross-connect and timing unit.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description F Board Configuration Reference
Issue 02 (2007-09-10) Huawei Technologies Proprietary F-1
F.1 SDH Processing BoardsThe parameters that can be configured for the SDH processing boards include the J0 byte, J1byte, C2 byte and V5 byte.
J0 Byte
J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receiveend learns that it is in the continuous connection with the specified transmit end. The value ofJ1 is "0" by default.
J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higherorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection with the specified transmit end in this channel. When the receive enddetects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm.
Set the J1 byte as " HuaWei SBS " for the SL01 and as "0" for all other boards.
NOTE
By default, the J1 byte is " HuaWei SBS ". One space is present before "HuaWei SBS" and five behind.
C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.
Table F-1 lists the mapping relation between the service type and setting of the C2.
Table F-1 Mapping relation between the service type and setting of the C2
Input Service Type C2 Byte (in Hex)
TUG structure 02
34M/45M asynchronously mapped intoa C-3
04
140M asynchronously mapped into aC-4
12
Unequipped 00
F.2 PDH Processing BoardThe parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2byte , V5 byte and tributary loopback.
F Board Configuration ReferenceOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
F-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
J1 ByteThe J1 byte is the path tracing byte. The transmit end transmits the higher order access pointidentifiers in a successive manner. Hence, the receive end learns that it is in the continuousconnection with the specified transmit end. When the receive end detects the J1 mismatch, thecorresponding VC-4 channel generates an HP_TIM alarm.
By default, the J1 byte is set to "0".
NOTE
By default, the J1 byte is "HuaWei SBS ".
C2 ByteThe C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.
Table F-2 lists the mapping relation between the service type and setting of the C2.
Table F-2 Mapping relation between the service type and setting of the C2
Input Service Type C2 Byte (in Hex)
TUG structure 02
34M/45M asynchronously mapped intoa C-3
04
140M asynchronously mapped into aC-4
12
Unequipped 00
J2 ByteThe J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lowerorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection to the specified transmit end in this channel.
V5 ByteThe V5 is a channel status and signal identification byte. This byte is used to detect bit error andindicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms aregenerated accordingly. Table F-3 lists the mapping relation between the service type and settingof the V5.
Table F-3 Mapping relation between the service type and setting of the V5
Input Service Type V5 Byte (in Hex)
Asynchronization 02
Byte synchronization 04
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description F Board Configuration Reference
Issue 02 (2007-09-10) Huawei Technologies Proprietary F-3
Input Service Type V5 Byte (in Hex)
HDLC/PPP mapping 0A
Unequipped or Supervisory-Unequipped 00
Equipping IndicationWhen a service channel just carries the service and does not process the service, selectUnequipped or Supervisory-Unequipped.
When a service channel carries the service and also processes the service, select Equipped-Unspecific Payload.
Tributary LoopbackThe tributary loopback function is used to locate faults in the service channels.
The tributary loopback is also a diagnosis function. When the tributary loopback is performed,related services are interrupted.
Path Service TypeThis parameter is set to specify service type for the channel.
l Select E1 or T1 for E1/T1 processing boards according to the actual service type in thechannel.
l Select E3 or T3 for E3/T3 processing boards according to the actual service type in thechannel.
Serial Port Protocol ModeFor the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includesV.35, V.24, X.21, RS449, RS530 and RS530A.
DDN Clock Source ManagementThe timing scheme and working clock source can be set for the DX1.
Set the timing scheme of the DDN channels 10–12 and 14–16 to the DCE internal scheme, DCEslave scheme or DTE external scheme. Set the timing scheme of the DDN channels 9 and 13 tothe DCE internal scheme, DCE slave scheme, DTE external scheme, DTE internal scheme, DTEslave scheme or DCE external scheme. By default, the timing scheme is the DCE internal schemefor channels 9 and 13 is the DCE internal scheme.
F.3 Data Processing BoardThe parameters that should be set for data processing boards include SDH parameters, Ethernetparameters and ATM parameters.
F.3.1 SDH ParametersThe SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,J2 byte and V5 byte.
F Board Configuration ReferenceOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
F-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
F.3.2 Ethernet ParametersThe Ethernet parameters that should be set for the Ethernet boards include the working modeand LCAS state.
F.3.3 ATM ParameterThe ATM parameters that the ATM boards should be set include port type and flow type.
F.3.1 SDH ParametersThe SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,J2 byte and V5 byte.
J1 ByteThe J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner.Hence, the receive end learns that it is in the continuous connection to the specified transmit endin this path.
When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3path and the HP_TIM_VC4 in the VC-4 path.
If the J1 byte is of the default value, "0", these alarms are not reported.
NOTE
l For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1byte is "0".
l For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".
C2 ByteThe C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.
In case of the C2 mismatch, the LP_SLM_VC3 alarm is generated in the VC-3 path and theHP_SLM_VC4 alarm is generated in the VC-4 path.
J2 ByteThe J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lowerorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection to the specified transmit end in this path.
In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path.
If the J1 byte is of the default value, "0", these alarms are not reported.
V5 ByteThe V5 is a path status and signal identification byte. This byte is used to detect bit error andindicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms aregenerated accordingly.
When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12path.
Table F-4 lists the mapping relation between the service type and setting of the V5.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description F Board Configuration Reference
Issue 02 (2007-09-10) Huawei Technologies Proprietary F-5
Table F-4 Mapping relation between the service type and setting of the V5
Input Service Type V5 Byte (in Hex)
Asynchronization 02
Byte synchronization 04
HDLC/PPP mapping 0A
Unequipped or Supervisory-Unequipped 00
F.3.2 Ethernet ParametersThe Ethernet parameters that should be set for the Ethernet boards include the working modeand LCAS state.
Working Mode
Generally, the interconnected equipment should work in the same fixed working mode. If theworking modes at both ends mismatch, packets may be lost or the rate becomes less. In case oflarge volume of data, services may be even interrupted.
For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex.
For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex.
For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M full-duplex, 100M half full-duplex or 100M full-duplex.
For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex,10M full-duplex, 100M half full-duplex or 100M full-duplex.
LCAS State
Enable or disable the LCAS.
Maximum Packet Length
For external ports, set the maximum packet length, which is 1522-byte by default.
Mapping Protocol
The mapping protocols of the interconnected equipment should be the same.
For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS andGFP-F. By default, the mapping protocol is GFP-F.
Choose the GFP-F mapping protocol for the EGS2, EFS4 and EFS0.
For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mappingprotocol is GFP.
F Board Configuration ReferenceOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
F-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
TAG Flag
The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware,Access and Hybrid.
1. When the TAG flag is set as the TAG Aware for a port, the port transparently transmits thepackets with a TAG and discards the packets without a TAG.
2. When the TAG flag is set as Access for a port, the port adds a TAG to the received packetsthat does not contain any TAG according to the VLAN ID of the port, and discards thepackets that contain a TAG.
3. When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAGor without any TAG. In this case, the port adds a TAG to the received packets that doesnot contain any TAG according to the VLAN ID of the port.
VLAN ID
Set the default VLAN ID of the local port.
Port Type
For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE)indicates the edge port of the service provider and provider (P) indicates the core network portof the service provider. When configuring the EVPL and EVPLAN services, set this parameter.Set the external port to PE and the internal port to P.
Port Encapsulation Format
The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the Ptype, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. ForEVPLAN services, set the encapsulation format to stack VLAN.
Port Attribute
For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Awareor C-Aware.
F.3.3 ATM ParameterThe ATM parameters that the ATM boards should be set include port type and flow type.
Port Type
The port types include NNI and UNI (default).
Flow Type
The flow type should meet the requirements of the port.
Service Type
There are four service types, CBR, rt-VBR, nrt-VBR, and UBR.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description F Board Configuration Reference
Issue 02 (2007-09-10) Huawei Technologies Proprietary F-7
Peak Cell RateSet the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.
Sustainable Cell RateSet the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrt-VBR services.
Maximum Cell Burst SizeSet the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBRand nrt-VBR services.
Cell Delay Variation ToleranceSet the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set onCBR, rt-VBR and UBR services.
F.4 Cross-Connect and Timing UnitThe clock parameters should be set on the cross-connect and timing unit.
Set the following parameters when synchronization status message (SSM) is not enabled andthe external clock is unavailable.
l Reference clock source
l Reference clock source level
Set the following parameters when the external clock is configured and the SSM is enabled.
l Reference clock source
l Reference clock source level
l Building integrated timing supply (BITS) type
l S1 byte
l Threshold for selecting the clock in case of the switching protection
F Board Configuration ReferenceOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
F-8 Huawei Technologies Proprietary Issue 02 (2007-09-10)
G Glossary
This document defines the following terms:
1
1:N protection A 1:N protection architecture has N normal traffic signals, N workingSNCs/trails and one protection SNC/trail. It may have one extra trafficsignal.
1+1 protection A 1+1 protection architecture has one normal traffic signal, one workingSNC/trail, one protection SNC/trail and a permanent bridge.
100Base-TX Physical Layer specification for a 100 Mbit/s CSMA/CD local areanetwork over two pairs of Category 5 unshielded twisted-pair (UTP) orshielded twisted-pair (STP) wire.
10BASE-T Physical Layer specification for a 10 Mb/s CSMA/CD local areanetwork over two pairs of twisted-pair telephone wire.
19-inch cabinet A cabinet which is 19 inches in width and 600mm in depth, compliantwith the standards of the IEC297.
A
Add/DropMultiplexer
A multiplexer capable of extracting and inserting lower-rate signalsfrom a higher-rate multiplexed signal without completelydemultiplexing the signal.
ADM add/drop multiplexer. see add/drop multiplexer.
Administrator A user who has authority to access all the Management Domains of theEML Core product. He has access to the whole network and to all themanagement functionalities.
AIS Alarm Indication Signal. A signal sent downstream in a digital networkif an upstream failure has been detected and persists for a certain time.
Alarm cable The cable which is used to transmit alarm signals.
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description G Glossary
Issue 02 (2007-09-10) Huawei Technologies Proprietary G-1
Alarm A visible or an audible indication to notify the person concerned that afailure or an emergency has occurred. See also Event.
AMI Alternate Mark Inversion. The line-coding format in transmissionsystems where successive ones (marks) are alternatively inverted (sentwith polarity opposite that of the preceding mark).
APD Avalanche Photodiode. A semiconductor photodetector with integraldetection and amplification stages. Electrons generated at a p/n junctionare accelerated in a region where they free an avalanche of otherelectrons. APDs can detect faint signals but require higher voltages thanother semiconductor electronics.
Asynchronous A network where transmission system payloads are not synchronizedand each network terminal runs on its own clock.
ATM Asynchronous Transfer Mode. A transfer mode in which the informationis organized into cells. It is asynchronous in the sense that the recurrenceof cells containing information from an individual user is not necessarilyperiodic. It is a protocol within the OSI layer 1. An ATM cell consistsof a 5 octet header followed by 48 octets of data.
Attenuation Reduction of signal magnitude or signal loss, usually expressed indecibels.
Attenuator A passive component that attenuates an electrical or optical signal.
Attribute Property of an object.
AU administrative unit. see administrative unit
Auto-negotiation The rate/work mode of the communication party set as self-negotiationis specified through negotiation according to the transmission rate of theopposite party.
B
Back up A method to copy the important data into a backing storage in case thatthe original is damaged or corrupted.
Backplane A PCB circuit board in the subrack, which is connected with all theboards in position.
Bandwidth Information-carrying capacity of a communication channel. Analogbandwidth is the range of signal frequencies that can be transmitted bya communication channel or network.
BITS Building Integrated Timing Supply. A building timing supply thatminimises the number of synchronization links entering an office.Sometimes referred to as a synchronization supply unit.
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Board VersionReplacementFunction
A function that enables a board supporting several board IDs. Generally,a board of an old version is used to the NE also of an old version, whichdoes not support the board of a new version. When a board of a newversion is used to replace a board of an old version, the former shouldwork with the ID of the board of the old version. The board of a newversion works on the NE of a new version with the ID of the board ofnew version. In this way, the board of the new version has several boardIDs.
Bridge The action of transmitting identical traffic (SPE contents) on both theworking and protection channels.
Broadcast The act of sending a frame addressed to all stations on the network
C
Cable tie The tape used to bind the cables.
CBR Constant Bit Rate. The Constant Bit Rate service category is used byconnections that request a static amount of bandwidth that iscontinuously available during the connection lifetime. This amount ofbandwidth is characterized by a peak cell Rate (PCR) value.
CDVT Cell Delay Variation Tolerance. Information sent in the forward andbackward direction to determine the upper bound of the toleranceadmitted for the time interval between cells pertaining to a given cellflow. The backward CDVT values included in the IAM and MOD shallbe interpreted as maximum acceptable values for the cell flow in thebackward direction.
Channel spacing The center to center difference in frequency or wavelength betweenadjacent channels in a WDM device.
Channel The smallest subdivision of a circuit that provides a type ofcommunication service; usually a path with only one direction.
Circuit A communications path or network; usually a pair of channels providingbi-directional communication.
Client A kind of terminal (PC or workstation) connected to a network that cansend instructions to a server and get results through a user interface. Seealso server.
Coded MarkInversion
This is the STS-3 line code. This is a two level non-return to zero code.A binary 1 is coded by either of the amplitude levels, +A or -A, for onefull unit time interval (T) in such a way that the level alternates forsuccessive binary ones. For a binary zero there is always a positivetransition (-A to +A) at the mid point of the binary unit interval (T/2).
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Configuration data The data that configures the NE hardware for coordination between thisNE and other NEs in the entire network, and for operation of specifiedservices. Configuration data is the instruction file of NEs, and it is a keyelement to ensure that the network runs efficiently. The typicalconfiguration data includes board configuration, clock configurationand protection relationship.
Configure To set the basic parameters of an operation object.
Connection A "transport entity" which consists of an associated pair of"unidirectional connections" capable of simultaneously transferringinformation in opposite directions between their respective inputs andoutputs.
Convergence The process of developing a model of the echo path which will be usedin the echo estimator to produce the estimate of the circuit echo.
Conversion In the context of message handling, a transmittal event in which an MTAtransforms parts of a message content from one encoded informationtype to another, or alters a probe so it appears that the described messageswere so modified.
CyclicRedundancyCheck
A technique for using overhead bits to detect transmission errors.
D
DDF Digital Distribution Frame. A frame which is used to transfer cables.
DenseWavelengthDivisionMultiplexing
The higher capacity version of WDM, which is a means of increasingthe capacity of fiber-optic data transmission systems through themultiplexing of multiple wavelengths of light. Commercially availableDWDM systems support the multiplexing of from 8 to 40 wavelengthsof light.
Drop The port on a network element where the service to an end customermay be connected, e.g., a tributary card on a SONET ADM. Forexample, a drop for a DS1 customer service may be provided by a VT1.5card terminating a VT1.5 trail.
Dual-Fed A description of a ring that has entry nodes that add traffic to the ringvia the bridging function.
DWDM Dense Wavelength Division Multiplexing. The technology utilizes thecharacteristics of broad bandwidth and low attenuation of single modeoptical fiber, employs multiple wavelengths with specific frequencyspacing as carriers, and allows multiple channels to transmitsimultaneously in the same fiber.
E
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E13 A funciton used to multiplex E1 signals into E3 signals or to demultipexE3 signals into E1 signals.
ECC Embedded Control Channel. An ECC provides a logical operationschannel between SDH NEs, utilizing a data communications channel(DCC) as its physical layer.
EDFA Erbium-Doped Fiber Amplifier. The optical amplifier that its fiberdoped with the rare earth element erbium, which can amplify at 1530 to1610 nm when the optical amplifier is pumped by an external lightsource.
Ejector lever A component at the two ends of the front panel of a board, which is usedfor inserting or removing the board.
Encapsulation In 1000BASE-X, the process by which a MAC packet is enclosed withina PCS code-group stream
EPL Ethernet Private Line. An EPL service is a point-to-pointinterconnection between two UNIs without SDH bandwidthsharing.Transport bandwidth is never shared between differentcustomers.
ESCON Enterprise System Connection. A path protocol which connects the hostwith various control units in an storage system. It is a serial bit streamtransmission protocol. The transmission rate is 200 Mbit/s.
ESD jack Electrostatic discharge jack. A hole in the cabinet or subrack, whichconnect the subrack or cabinet to the insertion of ESD wrist strap.
ESD Electrostatic Discharge. The phenomena the energy being produced byelectrostatic resource discharge instantly.
Ethernet A data link level protocol comprising the OSI model's bottom two layers.It is a broadcast networking technology that can use several differentphysical media, including twisted pair cable and coaxial cable. Ethernetusually uses CSMA/CD. TCP/IP is commonly used with Ethernetnetworks.
ETSI European Telecommunications Standards Institute
EVPL Ethernet Virtual Private Line. An EVPL service is a service that is botha line service and a virtual private service.
Eye pattern A graphic presentation formed by the superimposition of the waveformsof all possible pulse sequences.
F
Fan tray assembly A module which contains fans used for heat dissipation.
Fault A fault is the inability of a function to perform a required action. Thisdoes not include an inability due to preventive maintenance, lack ofexternal resources, or planned actions.
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FC Fiber Channel. A standard of data storage network for transmittingsignals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.
Fiber connector A device mounted on the end of a fiber-optic cable, light source,receiver, or housing that mates to a similar device to couple light intoand out of optical fibers. A connector joins two fiber ends, or one fiberend and a light source or detector.
Fiber jumper The fiber which is used to connect the subrack with the ODF.
FICON Fibre Connect. A new generation connection protocol which connectsthe host with various control units. It carries single byte commandprotocol through the physical path of fiber channel, and provides higherrate and better performance than ESCON.
Flow An aggregation of packets that have the same characteristics. On theT2000 or NE software, flow is a group of classification rules. On boards,it is a group of packets that have the same quality of service (QoS)operation. At present, two flows are supported: port flow and port +VLAN flow. Port flow is based on port ID and port + VLAN flow isbased on port ID and VLAN ID. The two flows cannot coexist in thesame port.
Frame A cyclic set of consecutive time slots in which the relative position ofeach time slot can be identified.
Free-run mode An operating condition of a clock, the output signal of which is stronglyinfluenced by the oscillating element and not controlled by servo phase-locking techniques. In this mode the clock has never had a networkreference input, or the clock has lost external reference and has no accessto stored data, that could be acquired from a previously connectedexternal reference. Free-run begins when the clock output no longerreflects the influence of a connected external reference, or transitionfrom it. Free-run terminates when the clock output has achieved lock toan external reference.
Full duplex Pertaining to both parties that can send and receive data at the same timeon the communication link.
G
Gain The ratio between the optical power from the input optical interface ofthe optical amplifier and the optical power from the output opticalinterface of the jumper fiber, which expressed in dB.
Grooming Consolidating or segregating traffic for efficiency.
Guide rail A groove in the subrack, which ensures the correct connection of a boardto the backplane.
H
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Half duplex Pertaining to, both parties that only one party can send data, while theother party can only receive data on the communication link.
I
IMA frame The IMA frame is used as the unit of control in the IMA protocol. It isa logical frame defined as M consecutive cells, numbered 0 to M-l,transmitted on each of the N links in an IMA group.
IMA Inverse Multiplexing for ATM. The ATM inverse multiplexingtechnique involves inverse multiplexing and de-multiplexing of ATMcells in a cyclical fashion among links grouped to form a higherbandwidth logical link whose rate is approximately the sum of the linkrates. This is referred to as an IMA group.
Interface boardarea
The area for the interface boards on the subrack.
Isolation A nonreciprocal optical device intended to suppress backwardreflections along an optical fiber transmission line while havingminimum insertion loss in the forward direction.
J
Jitter Short waveform variations caused by vibration, voltage fluctuations,control system instability, etc.
L
Label A mark on a cable, a subrack, or a cabinet for identification.
Laser The device that generates the directional light covering a narrow rangeof wavelengths. Laser light is more coherent than ordinary light.Semiconductor diode lasers are the used light source in fiber-opticsystem.
Layer A concept used to allow the transport network functionality to bedescribed hierarchically as successive levels; each layer being solelyconcerned with the generation and transfer of its characteristicinformation.
LCAS Link Capacity Adjustment Scheme. A solution features flexiblebandwidth and dynamic adjustment. In addition, it provides a failuretolerance mechanism, which enhances the viability of virtualconcatenations and enables the dynamic adjustment to bandwidth (non-service affecting).
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Link A "topological component" that provides transport capacity betweentwo endpoints in different subnetworks via a fixed (i.e., inflexiblerouting) relationship. The endpoints are "subnetwork termination pointpools" for SONET, and link termination points for ATM. Multiple linksmay exist between a pair of subnetworks. A link also represents a set of"link connections".
Loopback The fault of each path on the optical fiber can be located by settingloopback for each path of the line. There are three kinds of loopbackmodes: No loopback, Outloop, Inloop.
Lower subrack The subrack close to the bottom of the cabinet when a cabinet containsseveral subracks.
M
M13 A function used to multiplex T1 signals into T3 signals or to demultiplexT3 signals into T1 signals.
MAC Media Access Control. The data link sublayer that is responsible fortransferring data to and from the Physical Layer.
Mapping A procedure by which tributaries are adapted into virtual containers atthe boundary of an SDH network.
Mean launchedpower
The average power of a pseudo-random data sequence coupled into thefiber by the transmitter.
Mounting ear A component on the side of a subrack, which is used to install the subrackin a cabinet.
MPLS Multiprotocol Label Switching. Multi-protocol label switching. It is astandard routing and switching technology platform, capable ofsupporting various high level protocols and services. The datatransmission over an MPLS network is independent of route calculating.MPLS, as a connection-oriented transmission technology, guaranteesQoS effectively, supports various network level technologies, and isindependent of the link layer.
MSP The MSP function provides capability for switching a signal betweenand including two MST functions, from a working to a protectionchannel.
Multicast Transmission of a frame to stations specified by a group address.
Multiplex sectionprotection
A function provides capability for switching a signal between andincluding two MST functions, from a working to a protection channel.
Multiplex To transmit two or more signals over a single channel.
Multiplexer An equipment which combines a number of tributary channels onto afewer number of aggregate bearer channels, the relationship betweenthe tributary and aggregate channels being fixed.
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Multiplexing A procedure by which multiple lower order path layer signals areadapted into a higher order path or the multiple higher order path layersignals are adapted into a multiplex section.
N
NNI Network Node Interface. NNI identifies the interface between the ATMnetwork nodes. Compare SDH NNI.
Noise figure The specification to scale the random signal in the system presenting inaddition to any wanted signal.
Non-revertive In non-revertive mode, when a protection switch occurs, the workingservice will be switched to the protection service and the status willremain after it returns normal.
NRZ Non Return to Zero. A digital code in which the signal level is low fora 0 bit and high for a 1 bit and dose not return to 0 between successive1 bits.
O
OADM Optical Add/Drop Multiplexer. A device that can be used to add theoptical signals of various wavelengths to one channel and drop theoptical signals of various wavelengths from one channel.
ODF Optical Distribution Frame. A frame which is used to transfer and spoolfibers.
ONE Optical Network Element. A stand-alone physical entity in an opticaltransmission network that supports at least network element functions.
Optical add/dropmultiplexing
A process that add the optical signals of various wavelengths to onechannel and drop the optical signals of various wavelengths from onechannel.
Optical Amplifier A device or subsystem in which optical signals can be amplified bymeans of stimulated emission taking place in an suitable active medium.It is used to amplify the optical signal of the optical transmission system.
Optical connector A component normally attached to an optical cable or piece of apparatusfor the purpose of providing frequent optical interconnection/disconnection of optical fibers or cables.
Optical interface A device to allow two or more corresponding optical transmitting unitsto be connected.
OTM Optical Terminal Multiplexer. A device that multiplex or demultiplexoptical signals into a transmission link or into the client side.
OTU Optical Transponder Unit. A device that access service signalscompliant with standards at the client side and convert them intostandard DWDM or CWDM wavelengths.
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Output opticalpower
The ranger of optical energy level of output signals.
Overhead Extra bits in a digital stream used to carry information besides trafficsignals. Orderwire, for example, would be considered overheadinformation.
P
Packing case A case which is used for packing the board or subrack.
Paired Slots When SDH boards are used to configure the MSP ring, the two boardsforming a ring must be inserted in paired slots.
Pass-Through The action of transmitting by a node exactly what is received by thatnode for any given direction of transmission. A pass-through can beunidirectional or bidirectional. For BLSRs, a pass-through refers to theK1 and the K2 bytes and the protection channels. Three types of pass-through are used in BLSRs: K byte pass through, unidirectional fullpass-through, and bidirectional full pass-through.
Path protection The working principle of path protection: When the system works inpath protection mode, the PDH path uses the dual-fed and signalselection mode. Through the tributary unit and cross-connect unit, thetributary signal is sent simultaneously to the east and west lines.Meanwhile, the cross-connect matrix sends the signal dually sent fromthe opposite end to the tributary board through the active and standbybuses, and the hardware of the tributary board automatically andselectively receive the signal from the two groups of buses automaticallyaccording to the AIS number of the lower order path.
Path A logical connection between the point at which a standard frame formatfor the signal at the given rate is assembled, and the point at which thestandard frame format for the signal is disassembled.
PCR Peak Cell Rate. An upper limit on the rate at which cells can be submittedon an ATM connection.
PDH Plesiochronous Digital Hierarchy. PDH is the digital networkinghierarchy that was used before the advent of Sonet/SDH.
PIN Photodiode. A semiconductor detector with an intrinsic (i) regionseparating the p- and n-doped regions. It has fast linear response and isused in fiber-optic receivers.
Plesiochronous A network with nodes timed by separate clock sources with almost thesame timing.
Pointer An indicator whose value defines the frame offset of a virtual containerwith respect to the frame reference of the transport entity on which it issupported.
Power unit A direct current power distribution unit at the upper part of a cabinet,which supplies power for the subracks in the cabinet.
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PRBS When there are cross-connections between a line board and a tributary/data board, many alarms are raised on the tributary/data board if alarmsare raised on the line board. These alarms are all reported to the T2000.Such a large number of alarms can disturb the troubleshooting and affectthe problem solution efficiency. Therefore, the inter-board alarmsuppression function is used to solve this problem.
Private line Both communication parties are connected permanently.
Procedure A generic term for an action.
Process A generic term for a collection of actions.
Processing boardarea
An area for the processing boards on the subrack.
Provisioning The process of making available various telecommunications resources(such as switching systems and transport facilities) fortelecommunication services. Provisioning includes forecasting thedemand for services, determining the additions or changes to thenetwork that will be needed, determining where and when they will beneeded, and installing all the necessary network elements to providesuch services.
R
Receiver overload Receiver overload is the maximum acceptable value of the receivedaverage power at point R to achieve a 1 x 10-10 BER.
Receiversensitivity
Receiver sensitivity is defined as the minimum acceptable value ofaverage received power at point R to achieve a 1 x 10-10 BER.
Reference clock A clock of very high stability and accuracy that may be completelyautonomous and whose frequency serves as a basis of comparison forthe frequency of other clocks.
REG A device that performs regeneration.
Regeneration The process of receiving and reconstructing a digital signal so that theamplitudes, waveforms and timing of its signal elements are constrainedwithin specified limits.
Revertiveswitching
In revertive switching, there is a working and protection line, board andso on. Services always revert back to the original working line or boardif the switch requests are terminated; that is, when the working line orboard has recovered from the fault or the external request is cleared.
RPR Resilient Packet Ring. A metropolitan area network (MAN) technologysupporting data transfer among stations interconnected in a dual-ringconfiguration.
RS232 In the asynchronous transfer mode and there is no hand-shaking signal.It can communicate with RS232 and RS422 of other stations in point-to-point mode and the transmission is transparent. Its highest speed is19.2 kbit/s.
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S
S1 byte The byte defined in ITU-T to transmit the network synchronizationstatus information.
SAN Storage Area Network. A dedicated high-speed data storage networkwhich interconnects multiple independent storage systems with multipleservers through fiber path switch or other switch equipment.
SDH Synchronous Digital Hierarchy. A hierarchical set of digital transportstructures, standardized for the transport of suitably adapted payloadsover physical transmission networks.
Section The portion of a SONET transmission facility, including terminatingpoints, between (i) a terminal network element and a regenerator or (ii)two regenerators. A terminating point is the point after signalregeneration at which performance monitoring is (or may be) done.
Settings Parameters of an operation that can be selected by the user.
SF signal fail.See signal fail.
SFP small form-factor pluggable.see small form-factor pluggable.
Side modesuppression ratio
The ratio of the largest peak of the total source spectrum to the secondlargest peak.
Side panel The panel on the side of the cabinet.
Signal cable The cable which is used to transmit electrical signals, different from thepower cable or fiber.
Signal fail A signal indicating the associated data has failed in the sense that a near-end defect condition (not being the degraded defect) is active.
SNCMP The SNCMP is an N+1 protection scheme, which means multipleprotection paths protect a working path.
SNCTP The SNCTP provides protection paths at the VC-4 level. When theworking path is faulty, all its services can be switched to the protectionpath.
Span The set of SONET lines between two adjacent nodes on a ring.
SSM Synchronization Status Message. ITU-T defines S1 byte to transmit thenetwork synchronization status information. It uses the lower four bitsof the multiplex section overhead S1 byte to indicate 16 types ofsynchronization quality grades.
Synchronous A network where transmission system payloads are synchronized to amaster (network) clock and traced to a reference clock.
T
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T2000 The T2000 is a subnet management system (SNMS). In thetelecommunication management network architecture, the T2000 islocated between the NE level and network level, which can supports allNE level functions and part of the network level management functions.See also NM.
TCM Tandem Connection Monitor. In the SDH transport hierarchy, the TCMis located between the AU/TU management layer and HP/LP layer. Ituses the N1/N2 byte of POH overhead to monitor the quality of thetransport channels on a transmission section (TCM section).
TPS Tributary Protection Switching. A function provided by the equipment,is intended to protect N tributary processing boards through a standbytributary processing board.
Tray A discal component in the cabinet, which is used to place the chassis orother equipment.
Tributaryloopback
A fault location method. A fault can be located for each service path byperforming loopback on each path of the tributary board. There are threetypes of loopback modes: Non-loopback, Outloop and Inloop.
TUG tributary unit group.see tributary unit group.
U
Upload To report all or part of the configuration data of the NE to the T2000and overwrite the configuration data saved in the NE layer on the T2000.
Upper subrack The subrack close to the top of the cabinet when a cabinet containsseveral subracks.
V
VC virtual container. see virtual container.
Virtualconcatenation
The payload whose transmission bandwidth is bigger than VC4. Virtualconcatenation combines multiple VC4 payloads (successive or non-successive) to form a virtual large structure VC4-Xv in cascade modefor transmission. The transmission of the broadband cascaded payloadis implemented via the virtual cascade, thus improving the SDHtransmission payload bandwidth capability from VC4 to VC4-4C.
VLAN Virtual local area network. A subset of the active topology of a BridgedLocal Area Network. Associated with each VLAN is a VLAN Identifier(VID).
VPN Virtual Private Network. Enables IP service to be transmitted securelyover a public TCP/IP network by encrypting all service from onenetwork to another.
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W
WavelengthDivisionMultiplexing
A means of increasing the capacity of fiber-optic data transmissionsystems through the multiplexing of multiple wavelengths of light.WDM systems support the multiplexing of as many as four wavelengths.
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H Acronyms and Abbreviations
A
ADM Add/Drop Multiplexer
AMI Alternate Mark Inversion
APS Automatic Protection Switching
ATM Asynchronous Transfer Mode
B
BITS Building Integrated Timing Supply
C
CAR Committed Access Rate
CBR Constant Bit Rate
CC Continuity Check
CMI Coded Mark Inversion
COA Case-shaped Optical Amplifier
CPU Central Processing Unit
CRC Cyclic Redundancy Check
D
DC Direct Current
DCC Data Communication Channel
DCE Data Circuit-terminal Equipment
DCU Dispersion Compensation Unit
DDF Digital Distribution Frame
DTR Data Terminal Ready
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DVB-ASI Digital Video Broadcast-Asynchronous Serial Interface
DWDM Dense Wavelength Division Multiplexing
E
ECC Embedded Control Channel
EDFA Erbium-Doped Fiber Amplifier
EMC Electromagnetic Compatibility
EMI Electro Magnetic Interference
EPL Ethernet Private Line
EPLAN Ethernet Private LAN
ESCON Enterprise Systems Connection
ETS European Telecommunication Standards
ETSI European Telecommunications Standards Institute
EVPL Ethernet Virtual Private Line
EVPLAN Ethernet Virtual Private LAN
F
FC Fiber Channel
FE Fast Ethernet
FEC Forward Error Correction
FICON Fiber Connection
FPGA Field Programmable Gate Array
G
GE Gigabit Ethernet
GFP Generic Framing Procedure
H
HDB3 High Density Bipolar of order 3 code
HDLC High level Data Link Control
I
IEEE Institute of Electrical and Electronics Engineers
IS-IS Intermedia System-Intermedia System
ITU-T International Telecommunication Union - TelecommunicationStandardization Sector
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H-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
L
LAPS Link Access Procedure-SDH
LB LoopBack
LCAS Link Capacity Adjustment Scheme
LCT Local Craft Terminal
M
MPLS Multi-protocol Label Switch
MSP Multiplex Section Protection
MLM Multi-Longitudinal Mode
N
NA Not available
NRZ Non Return to Zero
O
OAM Operation Administration and Maintenance
OSPF Open Shortest Path First
P
PA Power Amplifier
PDH Plesiochronous Digital Hierarchy
RAM Random-access Memory
R
RD Receive Data
RIP Routing Information Protocol
RSTP Rapid Spanning Tree Protocol
S
SDH Synchronous Digital Hierarchy
SG Signaling Ground
SLM Single- Longitudinal Mode
SNCP Sub-Network Connection Protection
SSM Synchronization Status Message
T
TD Transmit Data
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TPS Tributary Protection Switching
U
UBR Unspecified Bit Rate
UPM Uninterruptible Power Modules
V
VBR Variable Bit Rate
VLAN Virtual Local Area Network
VPN Virtual Private Network
W
WDM Wavelength Division Multiplexing
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H-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
Index
AADL4
configuration reference, 7-104feature code, 7-104front panel, 7-103function and feature, 7-100principle and signal flow, 7-101technical specifications, 7-105valid slots, 7-104version, 7-100
ADQ1configuration reference, 7-111feature code, 7-111front panel, 7-109function and feature, 7-106principle and signal flow, 7-107technical specifications, 7-112valid slots, 7-111version, 7-106
AMUfront panel, 10-17function and feature, 10-15principle and signal flow, 10-16technical specification, 10-20valid slot, 10-20version, 10-15
AUXfront panel, 10-12function and feature, 10-6jumper, 10-11principle and signal flow, 10-7technical specification, 10-15valid slot, 10-14version, 10-6
BBA2
board feature code, 12-7front panel, 12-5function and feature, 12-2principle and signal flow, 12-3technical specification, 12-7
valid slot, 12-7version, 12-2
boardbarcode, 4-3classification
Amplifier, 4-11Auxiliary, 4-10Compensation, 4-11Control, 4-10Data, 4-7Interface, 4-9PDH, 4-6Power, 4-12SDH, 4-4Switching, 4-9WDM, 4-11
loopbacks, E-1version configuration, D-1
BPAboard feature code, 12-13Front Panel, 12-11function and feature, 12-9principle and signal flow, 12-10technical specification, 12-13valid slot, 12-13version, 12-9
CC34S
front panel, 8-25function and feature, 8-24principle and signal flow, 8-24technical specification, 8-26valid slot, 8-26version, 8-24
cabinetconfiguration, 2-2
DC PDU, 2-3indicator, 2-3
technical specifications, 2-5type, 2-2
Cabinet ConfigurationOther, 2-4
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CMR2feature code, 11-7front panel, 11-5function and feature, 11-3principle and signal flow, 11-4technical specification, 11-8valid slot, 11-7version, 11-3
CMR4board feature code, 11-13front panel, 11-11function and feature, 11-9principle and signal flow, 11-10technical specification, 11-14valid slot, 11-13version, 11-9
COAboard feature code, 12-24front panel, 12-19function and feature, 12-15installation position, 12-23principle and signal flow, 12-18technical specification, 12-24version, 12-15
CXL1board configuration reference, 9-11board feature code, 9-11front panel, 9-9function and feature, 9-2principle and signal flow, 9-5technical specification, 9-12valid slot, 9-11version, 9-2
CXL16board configuration reference, 9-33board feature code, 9-33front panel, 9-31function and feature, 9-25principle and signal flow, 9-28technical specification, 9-34valid slot, 9-33version, 9-25
CXL4board configuration reference, 9-22board feature code, 9-22front panel, 9-20function and feature, 9-14principle and signal flow, 9-17technical specification, 9-23valid slot, 9-22version, 9-14
DD12B
front panel, 8-6function and feature, 8-6principle and signal flow, 8-6
technical specification, 8-9valid slot, 8-8version, 8-6
D12Sfront panel, 8-10function and feature, 8-9principle and signal flow, 8-10technical specification, 8-13valid slot, 8-12version, 8-9
D34Sfront panel, 8-21function and feature, 8-20principle and signal flow, 8-21technical specification, 8-23valid slot, 8-22version, 8-20
D75Sfront panel, 8-17function and feature, 8-16principle and signal flow, 8-16technical specification, 8-20valid slot, 8-19version, 8-16
DM12front panel, 8-61function and feature, 8-60principle and signal flow, 8-60technical specification, 8-64valid slot, 8-64version, 8-60
DX1board configuration reference, 6-70board feature code, 6-68front panel, 6-67function and feature, 6-65principle and signal flow, 6-66technical specification, 6-70TPS Protection, 6-69valid slot, 6-68version, 6-65
DXAboard configuration reference, 6-75front panel, 6-73function and feature, 6-72principle and signal flow, 6-72technical specification, 6-75valid slot, 6-74version, 6-71
EEFF8
front panel, 8-48function and feature, 8-47principle and signal flow, 8-47technical specification, 8-50valid slot, 8-49
IndexOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
i-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)
version, 8-47EFS0
configuration reference, 7-37front panel, 7-35function and feature, 7-30principle and signal flow, 7-32technical specifications, 7-37TPS protection, 7-36valid slots, 7-36version, 7-29
EFS4configuration reference, 7-45front panel, 7-43function and feature, 7-38principle and signal flow, 7-40technical specifications, 7-45valid slots, 7-45version, 7-38
EFT4configuration reference, 7-8front panel, 7-6function and feature, 7-3principle and signal flow, 7-4technical specifications, 7-8valid slots, 7-8version, 7-3
EFT8configuration reference, 7-15front panel, 7-12function and feature, 7-9principle and signal flow, 7-10technical specifications, 7-15valid slots, 7-14version, 7-9
EFT8Aconfiguration reference, 7-22front panel, 7-19function and feature, 7-16principle and signal flow, 7-17technical specifications, 7-22valid slots, 7-21version, 7-16
EGR2configuration reference, 7-86feature code, 7-86front panel, 7-84function and feature, 7-79principle and signal Flow, 7-82technical specifications, 7-86valid slots, 7-86version, 7-79
EGS2configuration reference, 7-53feature code, 7-53front panel, 7-51function and feature, 7-46principle and signal flow, 7-49technical specifications, 7-53
valid slots, 7-53version, 7-46
EGS4configuration reference, 7-77feature code, 7-74front panel, 7-72function and feature, 7-67principle and signal flow, 7-69protection, 7-74technical specifications, 7-78valid slots, 7-74version, 7-67
EGT2configuration reference, 7-28feature code, 7-27front panel, 7-26function and feature, 7-23principle and signal flow, 7-24technical specifications, 7-28valid slots, 7-27version, 7-23
EMR0configuration reference, 7-98feature code, 7-98front panel, 7-94function and feature, 7-89principle and pignal Flow, 7-92technical Specifications, 7-98valid slots, 7-97version, 7-88
EMS4configuration reference, 7-65feature code, 7-62front panel, 7-60function and feature, 7-55principle and signal flow, 7-57protection, 7-63technical specifications, 7-66valid slots, 7-62version, 7-55
EOWfront panel, 10-3function and feature, 10-2principle and signal flow, 10-2technical specification, 10-6valid slot, 10-5version, 10-2
ETF8front panel, 8-52function and feature, 8-51principle and signal flow, 8-51technical specification, 8-55valid slot, 8-54version, 8-51
ETS8front panel, 8-57function and feature, 8-56principle and signal flow, 8-56
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Index
Issue 02 (2007-09-10) Huawei Technologies Proprietary i-3
technical specification, 8-59valid slot, 8-59version, 8-56
EU04front panel, 8-28function and feature, 8-27principle and signal flow, 8-27technical specification, 8-30valid slot, 8-29version, 8-27
EU08front panel, 8-32function and feature, 8-31principle and signal flow, 8-31technical specification, 8-33valid slot, 8-33version, 8-31
FFAN
front panel, 10-22function and feature, 10-21principle and signal flow, 10-22technical specification, 10-23valid slot, 10-23version, 10-21
FIBfront panel, 11-58function and feature, 11-57principle and signal flow, 11-58technical specification, 11-60valid slot, 11-59version, 11-57
IIDL4
board protection, 7-119configuration reference, 7-119feature code, 7-118front panel, 7-117function and feature, 7-113principle and signal flow, 7-115technical specifications, 7-119valid slots, 7-118version, 7-113
IDQ1configuration reference, 7-126feature code, 7-126front panel, 7-124function and feature, 7-121principle, 7-122protection, 7-126signal flow, 7-122technical specifications, 7-127valid slots, 7-126version, 7-120
indicatorsalarm, A-2cabinet, A-2
LL12S
front panel, 8-4function and feature, 8-3principle and signal flow, 8-3technical specification, 8-5valid slot, 8-5version, 8-3
L75Sfront panel, 8-14function and feature, 8-13principle and signal flow, 8-14technical specification, 8-15valid slot, 8-15version, 8-13
Labeldescription, B-2Position, B-3Safety Label, B-2
LWXboard feature code, 11-48front panel, 11-46function and feature, 11-43principle and signal flow, 11-44technical specification, 11-48valid slot, 11-48version, 11-43
MMR2
board feature code, 11-19front panel, 11-17function and feature, 11-16principle and signal flow, 11-16technical specification, 11-20valid slot, 11-19version, 11-16
MR2Afront panel, 11-24function and feature, 11-21principle and signal flow, 11-23technical specification, 11-25valid slot, 11-25version, 11-21
MR2Bfront panel, 11-29function and feature, 11-27principle and signal flow, 11-28technical specification, 11-30valid slot, 11-30version, 11-27
MR2C
IndexOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
i-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)
front panel, 11-34function and feature, 11-32principle and signal flow, 11-33technical specification, 11-36valid slot, 11-36version, 11-32
MR4board feature code, 11-41front panel, 11-39function and feature, 11-37principle and signal flow, 11-38technical specification, 11-42valid slot, 11-41version, 11-37
MST4configuration reference, 7-134feature code, 7-133front panel, 7-132function and feature, 7-128principle and pignal Flow, 7-130technical specifications, 7-134valid slots, 7-133version, 7-128
MU04front panel, 8-40function and feature, 8-39principle and signal flow, 8-39technical specification, 8-42valid slot, 8-41version, 8-39
OOBU1
feature code, 11-55front panel, 11-54function and feature, 11-52principle and signal flow, 11-52technical specification, 11-56valid slot, 11-55version, 11-52
OU08front panel, 8-35function and feature, 8-35principle and signal flow, 8-35technical specification, 8-38valid slot, 8-38version, 8-34
PPD1
board configuration reference, 6-17board feature code, 6-14front panel, 6-13function and feature, 6-9principle and signal flow, 6-10technical specification, 6-17
TPS protection, 6-15valid slot, 6-13version, 6-9
PD3board configuration reference, 6-56front panel, 6-53function and feature, 6-50principle and signal flow, 6-51technical specification, 6-57TPS protection, 6-55valid slot, 6-54version, 6-50
PIUfront panel, 13-9function and feature, 13-8principle and signal flow, 13-8technical specifications, 13-10valid slot, 13-10version, 13-8
PIUAfront panel, 13-13function and feature, 13-12principle and signal flow, 13-12technical specifications, 13-14valid slot, 13-14version, 13-11
PL1board configuration reference, 6-7board feature code, 6-7front panel, 6-6function and feature, 6-3principle and signal flow, 6-4technical specification, 6-8valid slot, 6-7version, 6-3
PL3board configuration reference, 6-42front panel, 6-39function and feature, 6-36principle and signal flow, 6-36technical specification, 6-42TPS protection, 6-40valid slot, 6-40version, 6-35
PL3Aboard configuration reference, 6-48front panel, 6-47function and feature, 6-44principle and signal flow, 6-45technical specification, 6-48valid slot, 6-48version, 6-43
PQ1board configuration reference, 6-26board feature code, 6-24front panel, 6-22function and feature, 6-19principle and signal flow, 6-20
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Index
Issue 02 (2007-09-10) Huawei Technologies Proprietary i-5
technical specification, 6-26TPS protection, 6-24valid slot, 6-23version, 6-18
PQ3board configuration reference, 6-64front panel, 6-61function and feature, 6-58principle and signal flow, 6-58technical specification, 6-64TPS protection, 6-62valid slot, 6-62version, 6-58
PQMboard configuration reference, 6-34front panel, 6-30function and feature, 6-27principle and signal flow, 6-28technical specification, 6-34TPS protection, 6-32valid slot, 6-31version, 6-27
SSEP1
configuration reference, 5-40front panel, 5-37function and feature, 5-33principle and signal flow, 5-34technical specifications, 5-41TPS Protection, 5-39valid slot, 5-39version, 5-33
SF16configuration reference, 5-86front panel, 5-85function and feature, 5-81principle and signal flow, 5-83technical specifications, 5-86valid slots, 5-86version, 5-81
SL1board configuration reference, 5-9board feature code, 5-9front panel, 5-7function and feature, 5-4principle and signal flow, 5-5technical specification, 5-9valid slot, 5-8version, 5-3
SL16board feature code, 5-70configuration reference, 5-71front panel, 5-69function and feature, 5-66principle and signal flow, 5-67technical specifications, 5-71
valid slot, 5-70version, 5-65
SL16Aboard feature code, 5-79configuration reference, 5-79front panel, 5-77function and feature, 5-74principle and signal flow, 5-75technical specifications, 5-79valid slot, 5-79version, 5-73
SL4board feature code, 5-47configuration reference, 5-48front panel, 5-45function and feature, 5-42principle and signal flow, 5-43technical specifications, 5-48valid slot, 5-47version, 5-42
SLD4board feature code, 5-55configuration reference, 5-56front panel, 5-53function and feature, 5-50principle and signal flow, 5-51technical specifications, 5-56valid slots, 5-55version, 5-50
SLO1board feature code, 5-24configuration reference, 5-24front panel, 5-22function and feature, 5-19principle and signal flow, 5-20technical specifications, 5-25valid slot, 5-24version, 5-19
SLQ1board configuration reference, 5-17feature Code, 5-17front panel, 5-15function and feature, 5-12principle and signal flow, 5-13technical specification, 5-17valid slot, 5-16version, 5-11
SLQ4board feature code, 5-63configuration reference, 5-63front panel, 5-61function and feature, 5-58principle and signal flow, 5-59technical specifications, 5-63valid slot, 5-63version, 5-58
SLT1configuration reference, 5-31
IndexOptiX OSN 1500 Intelligent Optical Transmission System
Hardware Description
i-6 Huawei Technologies Proprietary Issue 02 (2007-09-10)
front panel, 5-29function and feature, 5-26principle and signal flow, 5-27technical specifications, 5-31valid slot, 5-31version, 5-26
SPQ4board configuration reference, 6-83front panel, 6-80function and feature, 6-76principle and signal flow, 6-77technical specification, 6-83TPS protection, 6-82valid slot, 6-81version, 6-76
SubrackStructure, 3-2
subrackcapacity, 3-3technical specifications, 3-17
TTSB8
front panel, 8-44function and feature, 8-43principle and signal flow, 8-43technical specification, 8-46valid slot, 8-45version, 8-43
UUPM
function and feature, 13-2principle and signal flow, 13-3rear panel, 13-4technical specifications, 13-6valid slot, 13-6
OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Index
Issue 02 (2007-09-10) Huawei Technologies Proprietary i-7