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Optical LithographyGhassan Malek
Sr. Development Engineer
October 6, 2010
Integrated Systems Nanofabrication Cleanroom
OUTLINE
• Optical Lithography Main Tools• Lithography Support Equipment• Future Tools and Projects• Acknowledgements
October 6, 2010
SUSS CONTACT ALIGNER• Model MA6 • TSA/BSA Alignment• Pieces to Full 6” Wafers• 1 um Resolution with
Vacuum Contact• Wafer Direct Bonding
October 6, 2010
SF100 XPRESS• Maskless Lithography• Uses a Range of Wavelengths • Smart Filter Technology• Process Wafers and
Non-Wafer Substrates• Process Non-Flat Subs• File in BMP
October 6, 2010
SF100 EXPRESS
October 6, 2010
SF100 EXPRESS
October 6, 2010
Photoresist Patterns on Round Substrates
ASML STEPPER
Model PAS 5500 /200 5X I-Line
SHORT STORY
October 6, 2010
SOME DIFFICULTIES
October 6, 2010
SOME DIFFICULTIES
October 6, 2010
ASML STEPPER• Model PAS 5500 /200 5X I-Line• 2 Point Global Alignment• Resolution < 350nm• Single Machine Overlay < 50nm• Field Size X Y Max 22.0mm x 27.4mm• Pieces to Full 8” Wafers• Variable NA 0.48-0.60• ArialTM Illuminator
October 6, 2010
ILLUMINATION PATH
October 6, 2010
SIZE MATTERS
October 6, 2010
ASML STEPPER RETICLE • Reticle Size 6” x 6”• Quartz 0.250” for
Sub-0.5um• Pellicle• GDSII File• Design can be checked
before generating reticle
October 6, 2010
ALIGNMENT MARK
October 6, 2010
ANATOMY OF THE ASML JOB• Cells• Die and Exposure Fields• Images and Image IDs• Layer Numbers and Layer IDs• Layer ID, Image ID and Reticle ID• Image Location and Masking Window• Alignment Marks
October 6, 2010
RETICLE ORDER FORM
October 6, 2010
Ship to: Bill to: Today's Date:
PO#:
Req.Ship Date:
No. of Layers:
Attention: Attention: Device:
Contact: Phone: Fax:
Email:
Stepper:
Title Parity: Right WrongChrome UP X Y
Scale Data: X
Orient Data: CCW
Delivery Qty Mask Title GDS Digitized Data Address Drawn CD Bias Final CD CD Tolerance CD ToneOrder (layer specific) Layer Clear or Dark Size + or - Size + / - Clear or Dark Right Wrong
1
2
3
4
5
6
7
8
9
10Defect Criteria
Defect Size # of Readings LMS Req'd?
Defect Density (psi) OR Guaranteed to:
# Defects per plate allowed? Tolerance: +/-
Inspection Method Required: To Grid
Or Match?
Form: MOF 12/8/09
Prints to be made?
Filename:
Structure:
Parity/ Chrome UP
Shipping Instruct.
When prints are required, define parity of submaster rather than
final print
Data Format:
Plate Size:
Thickness:
Substrate:
Data Units:
Data:
Data Placed:
CD's Reported as:
Fracture Window:
lower left corner:
Pellicle Type or Part #
Requirements:
Special Instructions:
Registration: (LMS 2020)PelliclesDocumentationCritical Dimensions
120 Albright Way Los Gatos, CA. 95032
Phone (408) 341-1600 Fax: (408) 866-2248
email to: [email protected]
Customer:
Mask Order Form
Material:
Alignment Marks Req?
Product Type:
Compugraphics USA
Jpegs Required
upper right corner:
Barcode Required?
Title Format:Barcode Format:
For UT1X Steppers Only:
Remote View Reqd.
Account #
Applicable Spec:
Print Material Type:Quartz
3" x 5" 4" 5" 6" 7.25"RYesNo.090" .120" .150" .250" 1X UT1X 5X 10X4X Other Submaster
GDS MEBES DXF DWG Other
Single Sided
Double Sided
YesNo Hand Carry
FedEX
UPSMean Absolute
Die to DataDie to DieManual
Inspection Maps
LMS Maps
Certificate of Conformance
1 pattern centered Arrayed (include layout)
None
CD labels
microns mmMilsinches
cm
7"
Standard FieldWide Field
Qtz / Iron Oxide
Qtz / ARSodalime / IOSodalime / AR
Sodalime9" X .120"
ASML JOB ORDER FORM
October 6, 2010
Rev 01, 09/22/10 Page 1 of 2
Date Received: For ISNC Use Only:
Requester:
Professor/Company:
Device Name:
Device Size: X = um
Y = um
Device Field Array: Cols = Rows =
Device Field Size: X = mm
Y = mm
Device Field Shift: X = mm
Y = mm
Rotation (Circle One): 0o 45o 180o
Test Patterns (Circle One): YES NO If Yes, How Many?
Zero Layer Process (Circle One): YES NO
Zero/First Mask Combined (Circle One): YES NO
Reticle Information
ISNC ASML Job Order Request Form
Layer Name Reticle ID CDs (um) Reticle Transmission%
Rev 01, 09/22/10 Page 2 of 2
Primary Marks (PM) Calculate X and Y Coordinates from Reticle Center (0, 0)
Primary Flood Opening (PF) Calculate X and Y Coordinates from Reticle Center (0, 0)
Test Patterns Calculate X and Y Coordinates from Reticle Center (0, 0)
Specfic Instructions
X Coordinate Y CoordinateName TP Size X (um) TP Size Y (um)
Location (Layer) Mark Name X Coordinate Y Coordinate
Location (Layer) X Coordinate Y Coordinate
ISNC ASML Job Order Request Form
INITIAL RESULTS• Test Mask• Megaposit SPR 660 • Developer MF-26A• Resist Thickness 750nm• Exposure 130mJ at -0.1um Focus
October 6, 2010
INITIAL RESULTS
October 6, 2010
SVG 8800 WAFER TRACK• Two Track System• One Active Coat Track • Send-HMDS-CP-Coat-SoftBake-Receive• Configured for 4” or 6” Wafers• Two Active Resist Pumps• Capable of 3 Resists
October 6, 2010
SVG 8800 WAFER TRACK
October 6, 2010
SVG 8800 WAFER TRACK• IDI M450 Photoresist
Pumps• ChemNetTM Software • Dispense Volume Range
0.1ml to 50ml• Viscosity Range 1.0cP to
100cP
October 6, 2010
SVG 8800 WAFER TRACK
Program # Event Operation Arm Time Speed Accel Exhaust Materials Used
1 1 SPIN 0 0 0 10 PI 2771
Target: 10um 2 DISP1 6 0 10
3 SPIN 0 3.0 2.00 10
4 SPIN 0 28.0 3.00 50
5 EBR 1 25.0 1.00 50
6 2 25.0 1.00 50
7 SPIN 0 15.0 2.00 50
8 END
9
October 6, 2010
Coat Program
LITHO SUPPORT EQUIPMENT• Headway Spin Coaters• Headway Stand Alone
Coater• Hot Plates• Acid and Solvent Fume
Hoods• Carbolite High
Temperature Oven
October 6, 2010
• Vacuum Oven• Nanospec Film
Thickness Measurement• AST Contact Angle
Measurement • Leica and Nikon
Microscopes
HEADWAY SPIN COATERS
October 6, 2010
WAFER SURFACE ANALYSIS • AST VAC-3000S• Contact Angle
Measurement
October 6, 2010
CARBOLITE HIGH TEMP OVEN• Up to 600°C• Programmable • Eurotherm Controller
October 6, 2010
MICROSCOPES• Leica and Nikon Microscopes• Leica Application Software
October 6, 2010
FUTURE PROJECTS• Add Developer Track• Add Third Resist Pump • Add Spin Coater for Thick Resist• Applied Material 7830SI CDSEM • Several Fume Hoods
October 6, 2010
ACKNOWLEGEMENTS• Micron Technology & ASML
• Janine Rush-Byers• Micron University Relation Manager
• Troy Sych• ASML VP Strategic Account Management
• Michael Brennan• ASML Regional Customer Support
October 6, 2010
• International Rectifier Corporation• Oleg Khaykin
• President and CEO
• Nick Brand• GM & VP, El Segundo & WW Wafer Fab Strategies
• Larry Jones• Site Facilities Manager
October 6, 2010
ACKNOWLEGEMENTS