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Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 tegrated Systems Nanofabrication Cleanr

Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

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Page 1: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

Optical LithographyGhassan Malek

Sr. Development Engineer

October 6, 2010

Integrated Systems Nanofabrication Cleanroom

Page 2: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

OUTLINE

• Optical Lithography Main Tools• Lithography Support Equipment• Future Tools and Projects• Acknowledgements

October 6, 2010

Page 3: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SUSS CONTACT ALIGNER• Model MA6 • TSA/BSA Alignment• Pieces to Full 6” Wafers• 1 um Resolution with

Vacuum Contact• Wafer Direct Bonding

October 6, 2010

Page 4: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SF100 XPRESS• Maskless Lithography• Uses a Range of Wavelengths • Smart Filter Technology• Process Wafers and

Non-Wafer Substrates• Process Non-Flat Subs• File in BMP

October 6, 2010

Page 5: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SF100 EXPRESS

October 6, 2010

Page 6: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SF100 EXPRESS

October 6, 2010

Photoresist Patterns on Round Substrates

Page 7: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ASML STEPPER

Model PAS 5500 /200 5X I-Line

SHORT STORY

October 6, 2010

Page 8: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SOME DIFFICULTIES

October 6, 2010

Page 9: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SOME DIFFICULTIES

October 6, 2010

Page 10: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ASML STEPPER• Model PAS 5500 /200 5X I-Line• 2 Point Global Alignment• Resolution < 350nm• Single Machine Overlay < 50nm• Field Size X Y Max 22.0mm x 27.4mm• Pieces to Full 8” Wafers• Variable NA 0.48-0.60• ArialTM Illuminator

October 6, 2010

Page 11: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ILLUMINATION PATH

October 6, 2010

Page 12: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SIZE MATTERS

October 6, 2010

Page 13: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ASML STEPPER RETICLE • Reticle Size 6” x 6”• Quartz 0.250” for

Sub-0.5um• Pellicle• GDSII File• Design can be checked

before generating reticle

October 6, 2010

Page 14: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ALIGNMENT MARK

October 6, 2010

Page 15: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ANATOMY OF THE ASML JOB• Cells• Die and Exposure Fields• Images and Image IDs• Layer Numbers and Layer IDs• Layer ID, Image ID and Reticle ID• Image Location and Masking Window• Alignment Marks

October 6, 2010

Page 16: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

RETICLE ORDER FORM

October 6, 2010

Ship to: Bill to: Today's Date:

PO#:

Req.Ship Date:

No. of Layers:

Attention: Attention: Device:

Contact: Phone: Fax:

Email:

Stepper:

Title Parity: Right WrongChrome UP X Y

Scale Data: X

Orient Data: CCW

Delivery Qty Mask Title GDS Digitized Data Address Drawn CD Bias Final CD CD Tolerance CD ToneOrder (layer specific) Layer Clear or Dark Size + or - Size + / - Clear or Dark Right Wrong

1

2

3

4

5

6

7

8

9

10Defect Criteria

Defect Size # of Readings LMS Req'd?

Defect Density (psi) OR Guaranteed to:

# Defects per plate allowed? Tolerance: +/-

Inspection Method Required: To Grid

Or Match?

Form: MOF 12/8/09

Prints to be made?

Filename:

Structure:

Parity/ Chrome UP

Shipping Instruct.

When prints are required, define parity of submaster rather than

final print

Data Format:

Plate Size:

Thickness:

Substrate:

Data Units:

Data:

Data Placed:

CD's Reported as:

Fracture Window:

lower left corner:

Pellicle Type or Part #

Requirements:

Special Instructions:

Registration: (LMS 2020)PelliclesDocumentationCritical Dimensions

120 Albright Way Los Gatos, CA. 95032

Phone (408) 341-1600 Fax: (408) 866-2248

email to: [email protected]

Customer:

Mask Order Form

Material:

Alignment Marks Req?

Product Type:

Compugraphics USA

Jpegs Required

upper right corner:

Barcode Required?

Title Format:Barcode Format:

For UT1X Steppers Only:

Remote View Reqd.

Account #

Applicable Spec:

Print Material Type:Quartz

3" x 5" 4" 5" 6" 7.25"RYesNo.090" .120" .150" .250" 1X UT1X 5X 10X4X Other Submaster

GDS MEBES DXF DWG Other

Single Sided

Double Sided

YesNo Hand Carry

FedEX

UPSMean Absolute

Die to DataDie to DieManual

Inspection Maps

LMS Maps

Certificate of Conformance

1 pattern centered Arrayed (include layout)

None

CD labels

microns mmMilsinches

cm

7"

Standard FieldWide Field

Qtz / Iron Oxide

Qtz / ARSodalime / IOSodalime / AR

Sodalime9" X .120"

Page 17: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ASML JOB ORDER FORM

October 6, 2010

Rev 01, 09/22/10 Page 1 of 2

Date Received: For ISNC Use Only:

Requester:

Professor/Company:

Device Name:

Device Size: X = um

Y = um

Device Field Array: Cols = Rows =

Device Field Size: X = mm

Y = mm

Device Field Shift: X = mm

Y = mm

Rotation (Circle One): 0o 45o 180o

Test Patterns (Circle One): YES NO If Yes, How Many?

Zero Layer Process (Circle One): YES NO

Zero/First Mask Combined (Circle One): YES NO

Reticle Information

ISNC ASML Job Order Request Form

Layer Name Reticle ID CDs (um) Reticle Transmission%

Rev 01, 09/22/10 Page 2 of 2

Primary Marks (PM) Calculate X and Y Coordinates from Reticle Center (0, 0)

Primary Flood Opening (PF) Calculate X and Y Coordinates from Reticle Center (0, 0)

Test Patterns Calculate X and Y Coordinates from Reticle Center (0, 0)

Specfic Instructions

X Coordinate Y CoordinateName TP Size X (um) TP Size Y (um)

Location (Layer) Mark Name X Coordinate Y Coordinate

Location (Layer) X Coordinate Y Coordinate

ISNC ASML Job Order Request Form

Page 18: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

INITIAL RESULTS• Test Mask• Megaposit SPR 660 • Developer MF-26A• Resist Thickness 750nm• Exposure 130mJ at -0.1um Focus

October 6, 2010

Page 19: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

INITIAL RESULTS

October 6, 2010

Page 20: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SVG 8800 WAFER TRACK• Two Track System• One Active Coat Track • Send-HMDS-CP-Coat-SoftBake-Receive• Configured for 4” or 6” Wafers• Two Active Resist Pumps• Capable of 3 Resists

October 6, 2010

Page 21: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SVG 8800 WAFER TRACK

October 6, 2010

Page 22: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SVG 8800 WAFER TRACK• IDI M450 Photoresist

Pumps• ChemNetTM Software • Dispense Volume Range

0.1ml to 50ml• Viscosity Range 1.0cP to

100cP

October 6, 2010

Page 23: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

SVG 8800 WAFER TRACK

Program # Event Operation Arm Time Speed Accel Exhaust Materials Used

1 1 SPIN 0 0 0 10 PI 2771

Target: 10um 2 DISP1 6 0 10

3 SPIN 0 3.0 2.00 10

4 SPIN 0 28.0 3.00 50

5 EBR 1 25.0 1.00 50

6 2 25.0 1.00 50

7 SPIN 0 15.0 2.00 50

8 END

9

October 6, 2010

Coat Program

Page 24: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

LITHO SUPPORT EQUIPMENT• Headway Spin Coaters• Headway Stand Alone

Coater• Hot Plates• Acid and Solvent Fume

Hoods• Carbolite High

Temperature Oven

October 6, 2010

• Vacuum Oven• Nanospec Film

Thickness Measurement• AST Contact Angle

Measurement • Leica and Nikon

Microscopes

Page 25: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

HEADWAY SPIN COATERS

October 6, 2010

Page 26: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

WAFER SURFACE ANALYSIS • AST VAC-3000S• Contact Angle

Measurement

October 6, 2010

Page 27: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

CARBOLITE HIGH TEMP OVEN• Up to 600°C• Programmable • Eurotherm Controller

October 6, 2010

Page 28: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

MICROSCOPES• Leica and Nikon Microscopes• Leica Application Software

October 6, 2010

Page 29: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

FUTURE PROJECTS• Add Developer Track• Add Third Resist Pump • Add Spin Coater for Thick Resist• Applied Material 7830SI CDSEM • Several Fume Hoods

October 6, 2010

Page 30: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

ACKNOWLEGEMENTS• Micron Technology & ASML

• Janine Rush-Byers• Micron University Relation Manager

• Troy Sych• ASML VP Strategic Account Management

• Michael Brennan• ASML Regional Customer Support

October 6, 2010

Page 31: Optical Lithography Ghassan Malek Sr. Development Engineer October 6, 2010 Integrated Systems Nanofabrication Cleanroom

• International Rectifier Corporation• Oleg Khaykin

• President and CEO

• Nick Brand• GM & VP, El Segundo & WW Wafer Fab Strategies

• Larry Jones• Site Facilities Manager

October 6, 2010

ACKNOWLEGEMENTS