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2013PRODUCT CATALOGEMBEDDED OEM MEMORY THAT COVERS LEGACY TO LEADING EDGE
1
1
Introduction
About Wintec Industries // 2
Flash Products
Flash Product Naming Guide // 4
CompactFlash® Cards // 5
Secure Digital Cards // 6
CFast Cards // 7
USB Flash Drives // 8
Embedded USB // 9
Solid State Drives
Solid State Drive Naming Guide // 10
2.5" SATA // 11
1.8" microSATA // 12
SATA DOM // 13
Slim SATA // 14
PCI-E ExpressCard // 15
Half Size mini PCI-Express mSATA // 16
Full Size mini PCI-Express mSATA // 17
Legacy SSD - 2.5" PATA // 18
Legacy SSD – DOM ATA/IDE // 19
Legacy SSD – ZIF PATA/IDE // 20
DRAM Modules
Naming Guide: DDR3 // 21
Naming Guide: DDR2, DDR // 22
DDR3 // 23
DDR2 // 24
DDR // 25
Modems
Modems // 26
Table of Contents
Table Of Contents
1
Thank you to all Wintec customers for your support and partnership through the years. We look forward to
leading the way in this continuously changing and challenging industry and the exciting opportunities ahead.
Thank you again for your partnerships and commitment to building long lasting relationships!
Special Thanks
Wintec Industries is built upon a culture of hard work, opportunity
creation, and delivery of our commitments. Proudly recognized as
a globally diverse company, we continually strive to be a leader in
innovative business practices as well as a responsible member of our
global community and our environment.
Wintec’s quality policy is the backbone upon which our products and
services are built. Our 90,000 sq. ft. facility is ISO 9001:2008 certified
and equipped with state of the art manufacturing and testing machinery.
In addition, our products are manufactured with components that have
passed a stringent AVL (Approved Vendor List) and qualification process.
Through our quality policy we are committed to providing outstanding
products and services to our customers. Our quality themes outline the
direction of our daily work and also our long term goals.
About Wintec Industries
Customers Are the Heart of Our Business
QUICK TURNAROUND
QUALITY KNOWLEDGE AND EXPERIENCE
SOURCING DIVERSITY
EXTENDED LIFE CYCLE PRODUCTS
SUPPORT
// Customer Satisfaction // Consistency in the Manufacturing Process // Continual Improvement in all Business practices
PROVIDE THE HIGHEST LEVEL OF SERVICE TO OUR
CUSTOMERS
Wintec’s Embedded OEM division provides a wide range of standard
and custom hardware designs, mechanical molding, and manufacturing
services to OEM customers. From concept to final product delivery,
we provide outstanding team level support in Sales, Engineering,
Production, Quality Assurance, and Logistics. Through teamwork and
communication, our goal is to achieve the highest level of customer
satisfaction and to build long-term relationships that enable successful
engineering projects and customer design wins.
Wintec Industries is a WMBE (Women Minority Business Enterprise)
and a certified ISO 9001-2000 company located in the heart of the
Silicon Valley. Our core products and services include the design
and manufacturing of Flash products and DRAM modules in a large
assortment of technologies and form factors. Our products are certified
from industry standards committees such as, JEDEC (Joint Electron
Device Engineering Council, CFA (Compact Flash Association), and the
SD Association (Secure Digital). Our experience in product design and
successful fulfillment of customer product needs span over 25 years.
2
Introduction
// Customer Satisfaction // Consistency in the Manufacturing Process // Continual Improvement in all Business practices
Customers Are the Heart of Our Business
1
3
Leading Provider of Flash and DRAM Technology Solutions Our Embedded OEM solutions provide a wide range of standard
and custom hardware designs, mechanical molding, and
manufacturing services to OEM customers. From concept to
final product delivery, we provide outstanding team level support
in Sales, Engineering, Production, Quality Assurance, and
Logistics. Our goal is to achieve the highest level of customer
satisfaction, to build long-term relationships, and to provide
solutions and expertise to our OEM customers.
Introduction
Custom Services
Custom Products
Wintec Industries Embedded OEM division offers customers a
full service design, engineering, and manufacturing resource for
OEM system designs. Wintec account managers, engineers, and
developers work closely with our customers through the early stages
of project discovery and initial requirements though development,
testing and product delivery. Our electronic and electrical design
services offer the flexibility and customization that our customers seek.
Our teams are well experienced with creating customized solutions
with time tested technologies as well as applications that utilize the
latest tech.
Wintec OEM customers find great value in our customized testing
solutions. Customer OEM products are often developed to serve
a highly unique application. We work closely with our customer’s
to recreate their usage environments to ensure the quality of our
embedded products and our customer’s final solution. As a leading
DRAM Memory Module, Flash product, and Solid State Drive
manufacturer, we place substantial emphasis on our testing and
quality control procedures. Wintec Industries employs a standard
policy of 100% individual mainboard testing for all of our products.
We offer a wide range of SSD form factors
for use in Enterprise, Commercial and
Industrial grade applications.
We specialize in applications with tolerance
requirements for industrial temperatures
and reliability.
We provide services and support for the
latest memory technology and extended
support for legacy modules.
We Make Your Project Visions RealityWe utilize X-ray technologies, heat chambers, and diagnostic
machinery, including AOI and dedicated burn-in chambers, to ensure
that only the highest quality memory products are delivered to our
customers.
Our manufacturing base, located in Milpitas, California, offers
our customers a significant advantage in time to market, plus the
capabilities to provide quick and clear communication and updates.
We specialize in both standard and customized manufacturing options.
Our packaging design capabilities provide customers a start-to-finish
solution from concept to delivery. From initial PCB layout to the final
programming and packaging of products, the services and solutions
that are available from Wintec Industries provides customers with the
widest array of options.
Wintec Industries Embedded OEM division has extensive experience
in creating customized products, labeling, serialization, software
and disk imaging. With full Field Engineering support offered for all
Wintec products and services, our experienced team ensures that our
customers will receive the most complete solution.
Electrical Design | PCB Layout | Software and Firmware | Packaging Design and Graphics | Testing | Logistics
4
Flash Products
Flash Productspg5 CompactFlash Cards pg6 Secure Digital Cards pg7 CFAST pg8 USB Flash Drives pg9 Embedded USB
Flash Naming Guide
W 7 C F 0 3 2 G 1 D A I - H 4 1 P M - 4 Q 2 . 0 1
Firmware Revisions
Flash Component Configuration
NAND Flash & Die Revision
Program Mode
Controller Manufacturer
Temperature Rating
A = Standard
Device ID
Configuration
Density
Flash Product Type
NAND Flash Type
W = Wintec OEM Product
001 = 1 NAND Flash, Single Die, 1-CE 01D = 1 NAND Flash, Dual Die, 1-CE 002 = 2 NAND Flash, Single Die 1-CE 02D = 2 NAND Flash, Dual Die, 1-CE2Q2 = 2 NAND Flash, Quad Die, 2-CE 2P4 = 2 NAND Flash, Dual Stacked, 4-CE4D2 = 4 NAND Flash, Dual Die, 2-CE 4Q2 = 4 NAND Flash, Quad Die, 2-CE4P4 = 4 NAND Flash, Dual Stack Package, 4-CE
x = Die Revision, e.g. M-Die, A-DiePx = Samsung Mx = MicronHx = Hynix Ix = Intel
0 = PIO Mode1 = DMA / UDMA Enabled2 = UDMA disabled, MDMA Enabled
Hx = Hyperstone Controller Jx=JMicronSx = SMI Controller
None = Commercial Temp (0°C to +70°C)I = I-Temp (-40°C to +85°C) SD Extended Temp (-25°C to +85°C)
X = Removable T = Fixed DiskD = Dual ID (True IDE = fixed, PC Card Memory Mode = removable)
1 = Standard Configuration H = SDHC
M = Megabyte G = Gigabyte064 = 64 512 = 512 004 = 4128 = 128 001 = 1 008 = 8256 = 256 002 = 2 016 = 16
CF = Compact Flash CardSD = Secure Digital CardUS = USB Flash DriveEU = Embedded USB Flash DriveMU = Mini USB Flash DriveCT = CFast Card
2 = MLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 = SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration
1
5
Flash Products
CompactFlash® Cards
// Density up to 8GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// Dual 3.3V / 5V Interface
// Industrial Wear Leveling
// On-Board ECC - Corrects up to 6-bytes/Sector
// Density up to 128GB
// RISC/DSP Controller with built-in buffer support
// Solid State Data Storage
// Dual voltage support (3.3V/5V)
// Power-down and idle mode
// Built-in hardware ECC circuit (BCH), support 13/24 bit ECC errors per 1024 bytes
// Density up to 16GB
// 32-bit RISC/DSP controller
// Large internal SRAM provides firmware flexibility
// Dual voltage support (3.3V/5V)
// Internal voltage detector
// 20 Kbyte internal Boot ROM and 32 Kbyte internal SRAM
// On-Board ECC corrects up to 4 random bytes per 512 bytes
// Density up to 128GB
// RISC/DSP Controller with built-in buffer support
// Solid State Data Storage
// Dual voltage support (3.3V/5V)
// Power-down and idle mode
// Built-in hardware ECC circuit
(BCH), support 15
H2 Series H4 Series S2 Series S4 Series
Series CF TypeNAND Type
Seq. Read/Write ECC Temp Range Density Status
H2 CFA 2.1 SLC 8MBps / 6MBps 6 bit Reed Solomon
0 - 70°C 64MB - 8GB MP
-40 - 85°C 64MB - 8GB MP
H4 CFA 4.1 SLC 42MBps / 20MBps4 Bit Reed Solomon
w/ CRC
0 - 70°C 128MB - 16GB MP
-40 - 85°C 128MB - 16GB MP
S2 CFA 4.1
SLC 60MBps / 40MBps 13/24 Bit BCH 0 - 70°C 1GB - 32GB MP
MLC 50MBps / 20MBps 13/24 Bit BCH 0 - 70°C 4GB - 128GB MP
S4 CFA 4.1
SLC 90MBps / 50MBps 8/15 Bit BCH 0 - 70°C 1GB - 32GB MP
MLC 80MBps /35MBps 8/15 Bit BCH 0 - 70°C 4GB - 128GB MP
ES MPEngineering Sample Mass ProductionCustomer SampleCSKEY End of LifeEOL
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Flash Products
// Density up to 8GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// Dual 3.3V / 1.8V Interface
// Industry Standard Compatibility
// > 2,000,000 Program/Erase
// On-chip ECC and CRC16 unit for flash data protection Cycles
// Density up to 64GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// 3.3V flash Interface
// Industry Standard Compatibility
// 10,000 Program/Erase Cycles
// Hardware BCH Engine to configure ECC
H6 SeriesS3 Series
Secure Digital Cards
Series TypeNAND Type
Seq. Read/Write ECC Temp Range Density Status
S3 SD 2.0 MLC 20MBps / 10MBps 40 Bit BCH 0 - 70°C 4GB - 64GB MP
H6 SD 2.0 SLC 20MBps / 18MBps
4 Bit Reed Solomonw/ CRC
0 - 70°C 64MB - 8GB MP
4 Bit Reed Solomonw/ ECC
-25 - 85°C 64MB - 8GB MP
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1Flash Products
// Density up to 128GB
// 32-bit RISC micro processor
// SLC/MLC NAND Flash
// SATA-II 3.0Gb/s operation (Backward compatible to SATA-I 1.5Gb/s operation)
// ECC capable of correcting up to 24 bits in 1KB double sector
// PFail handling and S.M.A.R.T support
// Partial/Slumber and PHYSLP power modes support
// Density up to 128GB
// SLC/MLC NAND Flash
// SATA-II 3.0Gb/s operation (Backward compatible to SATA-I 1.5Gb/s operation)
// > 100,000 Program/Erase Cycles
// On-Board ECC capable of correcting 16 or 24 bit errors per 1024 bytes
// S.M.A.R.T and TRIM Support
A2 SeriesJM-605 Series
CFast Cards
SeriesSATA Type
NAND Type
Seq. Read/Write ECC Temp Range Density Status
JM-605 SATA-II
MLC 160MBps / 85MBps 16 / 24 Bit BCH 0 - 70°C 8GB-128GB MP
SLC
160MBps / 110MBps 16 / 24 Bit BCH 0 - 70°C 8GB-32GB MP
160MBps / 110MBps 16 / 24 Bit BCH -40 - 85°C 8GB-32GB MP
A2 SATA-II
SLC
150MBps / 130MBps8 / 24 Bit BCH w/
CRC0 - 70°C 4GB-32GB CS Q1 2013
150MBps / 130MBps8 / 24 Bit BCH w/
CRC-40 - 85°C 4GB-32GB CS Q1 2013
MLC TBD8 / 24 Bit BCH w/
CRC0 - 70°C 32GB-128GB CS Q1 2013
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1Flash Products
// Density up to 32GB
// Fully Compatible with USB v2.0 & v1.1
// True Plug and Play Functionality
// Built in LED to indicate power and transfer status
// Small form factor
W2MU-E5 Series W7MU-E5 Series
// Density up to 16GB
// Fully Compatible with USB v2.0 & v1.1
// True Plug and Play Functionality
// Built in LED to indicate power and transfer status
// Small form factor
// Density up to 32GB
// Compatible with USB v3.0, v2.0,
and v1.0
// ECC capability up to 72 bits/1KB
// True Plug and Play Functionality
// Built-in LED to indicate power and transfer status
W7US-S3 Series
USB Flash Drives
Series USB TypeNAND Type
Seq. Read/Write ECC Temp Range Density Status
W2MU-E5 USB 2.0 MLC 18MBps / 8MBps 24/48 Bit BCH 0 - 70°C 512MB - 32GB MP
W7MU-E5 USB 2.0 SLC 20MBps / 12MBps 24/48 Bit BCH0 - 70°C /-40 - 85°C
512MB - 16GB MP
W7US-S3 USB 3.0 SLC TBD TBD
0 - 70°C 512MB - 32GB ES Late Q1 2013
-40 - 85°C 512MB - 32GB ES Late Q1 2013
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9
1Flash Products
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// Density up to 16GB
// Embedded USB 2.0 Device
// SLC NAND type flash
// 5V & 3.3V operational voltage
// Various connector options
// RoHS Compliant
// Density up to 32GB
// Embedded USB 2.0 Device
// MLC NAND type flash
// 5V & 3.3V operational voltage
// Various connector options
// RoHS Compliant
// ES Late Q1 2013
Talk to an OEM sales representative for more information.
W7EU-E6W2EU-E5W7EU-E5
Embedded USB
SeriesUSB Type
NAND Type
Channels Seq. Read/Write ECC Temp Range Density Status
W7EU-E5 USB 2.0 SLC Single 20MBps / 18MBps 24/48 Bit BCH0 - 70°C
512MB - 16GB MP-40 - 85°C
W2EU-E5 USB 2.0 MLC Single 18MBps / 10MBps 24/48 Bit BCH 0 - 70°C 4GB - 32GB MP
W7EU-E6 USB 3.0
SLC Dual TBD 72 Bit BCH 0 - 70°C TBD
ES Late Q1 2013
MLC Dual TBD 72 Bit BCH0 - 70°C
TBD-40 - 85°C
1
Flash Productspg5 CompactFlash Cards pg6 Secure Digital Cards pg7 USB Flash Drives pg8 Embedded USB Flash pg9 CFast
Flash Naming Guide
W 7 C F 0 3 2 G 1 D A I - H 4 1 P M - 4 Q 2 . 0 1
Firmware Revisions
Flash Component Configuration
NAND Flash & Die Revision
Program Mode
Controller Manufacturer
Temperature Rating
A = Form-Factor
Device ID
Configuration
Density
Flash Product Type
NAND Flash Type
W = Wintec OEM Product
001 = 1 NAND Flash 01D = 1 NAND Flash, Dual Die, 1-CE 002 = 2 NAND Flash, Single Die 1-CE 02D = 2 NAND Flash, Dual Die, 1-CE2Q2 = 2 NAND Flash, Quad Die, 2-CE 2P4 = 2 NAND Flash, Dual Stacked, 4-CE4D2 = 4 NAND Flash, Dual Die, 2-CE 4Q2 = 4 NAND Flash, Quad Die, 2-CE4P4 = 4 NAND Flash, Dual Stack Package, 4-CE
x = Die Revision, e.g. M-Die, A-DiePx = Samsung Mx = MicronHx = Hynix Ix = Intel
0 = PIO Mode1 = DMA / UDMA Enabled2 = UDMA disabled, MDMA Enabled
Hx = Hyperstone ControllerSx = SMI Controller
None = Commercial Temp (0°C to +70°C)I = I-Temp (-40°C to +85°C) SD Extended Temp (-25°C to +85°C)
X = Removable T = Fixed DiskD = Dual ID (True IDE = fixed, PC Card Memory Mode = removable)
1 = Standard Configuration H = SDHC
M = Megabyte G = Gigabyte
064 = 64 512 = 512 004 = 4128 = 128 001 = 1 008 = 8256 = 256 002 = 2 016 = 16
CF = Compact Flash CardSD = Secure Digital CardUS = USB Flash DriveEU = Embedded USB Flash DriveMU = Mini USB Flash DriveCT = CFast Card
2 = MLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 = SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration
10
Solid State Drives
Solid State Drive Naming Guide
pg11 2.5" SATA SSD pg12 1.8" micro SATA SSD pg13 SATA DOM pg14 Slim SATA pg15 PCI-E ExpressCard pg16 Half Size mSATA pg17 Full Size mSATA pg18 2.5" PATA pg19 DOM ATA/IDE pg20 ZIF PATA/IDE
Solid States Drives
4D2 = 4 NAND Flash, Dual Die 2-CE4Q2 = 4 NAND Flash, Quad Die, 2-CE 08D = 8 NAND Flash, Dual Die 1-CE 8Q2 = 8 NAND Flash, Quad Die, 2-CEAS2 = 12 NAND Flash, Single Die, 2-CE AQ4 = 12 NAND Flash, Quad Die 4-CE BD2 = 16 NAND Flash, Dual Die, 2-CE BQ4 = 16 NAND Flash, Quad Die, 4-CEBO4 = 16 NAND Flash, Octal Die, 4-CECD2 = 20 NAND Flash, Quad Die, 4-CE
(blank) = 4x nm and higher3 = 3x nm2 = 2x nm
x = Die Revision, e.g. M-Die, A-DiePx = Samsung Mx = MicronHx = Hynix Ix = Intel
1 = SATA2 = PATA (DMA / UDMA Enabled)
Dx = SandForce Ex = EastWhoJx = JMicron Sx = SMI
I = I-Temp (-40°C – +85°C)None = Commercial Temp (0°C – 70°C)
A = 2.5" B = 3.5" C = 1.8"
G = Gigabyte001 = 1 016 = 16 064 = 64 160 = 160002 = 2 025 = 25 100 = 100 200 = 200004 = 4 032 = 32 120 = 120 240 = 240008 = 8 050 = 50 128 = 128 480 = 480
ES = Embedded (DOM, Slim SATA)EM = mSATAEX = ExpressCardSS = Solid State Drives (1.8", 2.5") ZF = ZIF PATA
2 = MLC NAND Flash3 = eMLC NAND Flash4 = MLC NAND Flash w/Custom Configuration7 =SLC NAND Flash8 = SLC NAND Flash w/Custom Configuration
Firmware Revision
Flash Component Configuration
Geometry
NAND Flash & Die Revision
Program Mode
Controller Manufacturer
Temperature Rating
Form Factor
T = Fixed Disk
1 = Standard Configuration
Density
SSD Type
NAND Flash Type
W = Wintec OEM Product
W 7 S S 1 2 0 G 1 TA I - D 1 1 M A 2 - B D 2 . A 2
11
1Solid State Drives
// Density up to 512GB
// 40G, 80G, 160G, 320G,
400G available
// EastWho EWS-800 controller with external DRAM buffer
// Up to 40 bits correctable per 1KB sector
// Hardware AES engine with ECB/ XTS encryption mode
// Density up to 480GB
// SandForce SF-2382 controller with internal cache buffer
// DuraWrite TM technology
// RAISE Data Protection
// Up to 55 bits correctable per 512 byte sector
// Industrial SSD
// Density up to 512GB
// SandForce SF-1200 controller with internal cache buffer
// Intelligent Block Management & Wear Leveling
// Up to 24 bytes correctable per 512B sector
// Density up to 512GB
// JMicron 612 controller with external SDRAM buffer
// Data Integrity under power cycling
// BCH ECC correction supports 16/24 bit ECC
// Density up to 400GB
// SandForce Enterprise SF-2582 controller with internal cache
// DuraWriteTM technology
// RAISETM Data Protection
// Up to 55 b/512 byte sector BCH ECC engine
// Enterprise SSD
// Tatalum PFAIL protection
// Density up to 512GB
// JMicron 662 controller with external DDR2 buffer
// Supports global wear-leveling
// Dynamic power management
// S.M.A.R.T Attribute Support
// BCH8/16/24/40 bits ECC
// Density up to 512GB
// SandForce SF-2281 controller with internal cache buffer
// Intelligent Block Management
& Wear Leveling
// Up to 55 bits correctable per 512B sector
SF-2281SF-1222JM-612
SF-2582 JM662
EWS-800
SF-2382
2.5" SATA SSD
SeriesSATA Type
NAND Type Seq. Read/WriteRandom
Read/WriteTemp Range Density Status
EWS-800 SATA-II MLC/SLC 200MBps / 150MBps 5K IOPS/1.5K IOPS 0 - 70°C / -40 - 85°C 32GB - 512GB MP
JM-612 SATA-II MLC 230MBps / 200MBps 10K IOPS/1K IOPS 0 - 70°C / -40 - 85°C 16GB - 512GB MP
SF-1222 SATA-II MLC/SLC 285MBps / 275MBps 30K IOPS/10K IOPS 0 - 70°C / -40 - 85°C32GB - 128GB
(SLC)/512GB (MLC)MP
SF-2281 SATA-IIIMLC/SLC
(Async/Sync*)550MBps / 500MBps 60K IOPS/20K IOPS 0 - 70°C 32GB - 512GB MP
SF-2382 SATA-III MLC/SLC 500MBps / 500MBps 60K IOPS/20K IOPS 0 - 70°C / -40 - 85°C 30GB - 480GBES Late Q1 2013
SF-2582 SATA-III SLC/eMLC 550MBps / 500MBps 60K IOPS/60K IOPS 0 - 70°C / -40 - 85°C 50GB - 400GB MP
JM662 SATA-III MLC 500MBps / 300MBps 50K IOPS/20K IOPS 0 - 70°C 32GB - 512GB MP
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*Sync MLC drives perform better under uncompressed data loads
12
Solid State Drives
// Density up to 256GB
// JMicron 612 controller with external SDRAM buffer
// Data Integrity under power cycling
// BCH ECC correction supports 16/24 bit ECC
// Enhanced endurance by dynamic/static wear leveling
// Density up to 256GB
// Jmicron 662 controller with external DDR2 buffer
// Supports global wear-leveling
// Dynamic power management
// S.M.A.R.T. Attribute support
// BCH8/16/24/40 bits ECC
// TRIM and S.M.A.R.T. Support
JM-612 JM-662
1.8" microSATA SSD
SeriesSATA Type
NAND Type
Seq. Read/Write Random Read/Write Temp Range Density Status
JM-612 SATA-II SLC/MLC 230MBps / 160MBps 10K IOPS/1K IOPS 0 - 70°C / -40 - 85°C 32GB - 256GB MP
JM-662 SATA-III MLC 500MBps / 300MBps 50K IOPS/20K IOPS 0 - 70°C 32GB - 256GBES LateQ1 2013
ES MPEngineering Sample Mass ProductionCustomer SampleCSKEY End of LifeEOL
Solid State Drives
13
SATA DOM
// Density up to 64GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
JM-605
SeriesSATA Type
Channel NAND Type Seq. Read/WriteTempRange
Density Status
JM-605 SATA-II
4 Channel / 2 Flash
MLC 60MBps / 20MBps 0 - 70°C 4GB-64GB MP
4 Channel / 2 Flash
SLC 80MBps / 50MBps 0 - 70°C / -40 - 85°C 1GB-16GB MP
ES MPEngineering Sample Mass ProductionCustomer SampleCSKEY End of LifeEOL
Solid State Drives
14
// Density up to 128GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
// Density up to 256 GB
// JMicron 667 controller with external DDR3 buffer
// Dynamic power management
// Data integrity under power-cycling
// BCH8/16/24/40 bits ECC
// S.M.A.R.T Attribute Support
JM-605 JM-667
Slim SATA
SeriesSATA Type
NAND Type
Seq. Read/WriteRandom
Read/WriteTempRange
Density Status
JM-605 SATA-II
MLC 140MBps / 60MBps 8.5K IOPS / 600 IOPS 0 - 70°C 8GB-128GB MP
SLC 160MBps / 100MBps 8.5K IOPS / 1.5K IOPS
0 - 70°C 8GB-32GB MP
-40 - 85°C 8GB-32GB MP
JM-667 SATA-III MLC 500MBps / 300MBps 50K IOPS / 20K IOPS 0 - 70°C 32GB-256GB ES Mid Q1 2013
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Solid State Drives
15
// Up to 128GB
// Intelligent Wear Leveling - Includes Dynamic/Static Block Management
// Spares & Bad Block Management
// On-Board ECC – Corrects up to 24 bits/ 1KB sector
// High Environmental Tolerance
// SMART (Self-Monitoring, Analysis, Reporting Technology)
JM-612
PCI-E ExpressCard SSD
Series SATA Type NAND Type Seq. Read/Write Temp Range Density Status
JM-612 SATA-II MLC 165MBps / 120MBps 0 - 70°C 64GB - 128GB MP
ES MPEngineering Sample Mass ProductionCustomer SampleCSKEY End of LifeEOL
16
Solid State Drives
Half Size mini PCI-Express mSATA SSD
// Density up to 64GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// ECC Engine: Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
// S.M.A.R.T. attribute support
// Density up to 64GB
// Advanced Wear leveling & Block Management
// SMART feature and data security support
// SSDLifeGuardTM and SSDLifeSaverTM for SSD life monitoring and extension
// 15-bit/512B data error checking and correcting capability
JM-605 SM611/SM631
Series SATA Type NAND Type Seq. Read/Write Temp Range Density Status
JM-605 SATA-II
MLC 70MBps / 20MBps 0 - 70°C 4GB-64GB MP
SLC 80MBps / 50MBps 0 - 70°C 4GB-64GB MP
SLC 80MBps / 50MBps -40 - 85°C 1GB-16GB MP
SM611/SM631 SATA-II
MLC 50MBps / 20MBps 0 - 70°C 4GB-64GB MP
SLC 60MBps / 35MBps 0 - 70°C 4GB-64GB MP
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Solid State Drives
// Density up to 256GB
// SandForce SF-2141/2181/2281 controller with internal cache buffer
// Intelligent Block Management & Wear Leveling
// Intelligent Data Retention optimization
// Up to 55 bits correctable per 512B sector
// Density up to 256GB
// JMicron 667 controller with external DDR3 cache
// Global wear leveling
// Dynamic power management
// BCH8/16/24/40 bits ECC
// S.M.A.R.T Attribute Support
// Density up to 128GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// ECC Engine: Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
// Density up to 128GB
// SandForce SF-2141/2181/2281 controller with internal cache buffer
// Intelligent Block Management & Wear Leveling
// Intelligent Data Retention
optimization
// Up to 55 bits correctable per 512B sector
// Density up to 128GB
// EWS800 Controller with SDRAM cache
// Up to 40bits correctable per 1KB sector
// Hardware AES engine with ECB/XTS encryption
// TRIM and S.M.A.R.T. attribute support
SF-2281 JM-667 SF-2141/2181 JM-605
EWS800
Full Size mini PCI-Express mSATA SSD
Series SATA Type NAND Type Seq. Read/Write Temp Range Density Status
SF-2281 SATA-III MLC 550MBps / 505MBps 0 - 70°C 32GB-256GB MP
JM-667 SATA-III MLC 500MBps / 300MBps 0 - 70°C 32GB-256GB ES Mid Q1 2013
SF-2141 / 2181 SATA-II MLC 270MBps / 250MBps 0 - 70°C 32GB-128GB MP
JM-605 SATA-II
MLC 140MBps / 60MBps 0 - 70°C 8GB-128GB MP
SLC 160MBps / 80MBps 0 - 70°C 2GB-32GB MP
SLC 160MBps / 80MBps -40 - 85°C 2GB-32GB MP
EWS800 SATA-II MLC/SLC 180MBps / 90MBps0 - 70°C /-40 - 85°C
4GB-128GB ES Mid Q1 2013
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// Density up to 256GB
// 32 bit high speed controller
// Standard ATA/IDE Bus interface
// Internal Static and Dynamic Wear Leveling
// Spares & Bad Block Management
// BCH ECC: 12 bit per 512 Byte
EWS720
Legacy SSD - 2.5" PATA SSD
Solid State Drives
Series NAND Type Seq. Read/Write Random Read/Write Temp Range Density Status
EWS720
MLC 125MBps / 90MBps 4800 IOPS / 300 IOPS 0 - 70°C 32GB - 256GB MP
SLC 125MBps / 110MBps 4800 IOPS / 300 IOPS0 - 70°C 8GB - 64GB MP
-40 - 85°C 8GB - 64GB MP
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1Solid State Drives
Legacy SSD – DOM ATA/IDE
// Density up to 32GB
// Low power, 3.3V and 5V Power Supply
// Capable of withstanding high impact and vibration shocks
// Hardware 13/24 bit BCH-ECC engines capable of correcting 24-bit errors per 1024 byte data
// Write Endurance 100K cycles per block (SLC)
// Data Retention greater than 5 years
SM2231
Series Pin NAND Type Seq. Read/Write ECC Temp Range Density Status
SM2231 40 Pin
MLC 40MBps / 16MBps 24 Bit BCH 0 - 70°C 512MB - 32GB MP
SLC 40MBps /30MBps 24 Bit BCH
0 - 70°C 512MB - 16GB MP
-40 - 85°C 512MB - 16GB MP
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// Density up to 256GB
// 8MB Cache buffer
// 32 bit high speed controller
// ZIF IDE/ATA 40-pin interface
// Internal Static and Dynamic Wear Leveling
// BCH ECC: 18 bit per 512 Byte
EWS720
Solid State Drives
Legacy SSD – ZIF PATA/IDE
Series NAND Type Seq. Read/Write Random Read/Write Temp Range Density Status
EWS720
MLC 125MBps / 90MBps 4800 IOPS / 300 IOPS 0 - 70°C 16GB - 256GB MP
SLC 125MBps / 110MBps 4800 IOPS / 300 IOPS 0 - 70°C 4GB - 32GB MP
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1DRAM
pg23 DDR3 pg24 DDR2 pg25 DDR
W L 3 R E V 9 1 G 1 3 I S E
Die Revision
DRAM Manufacturer
Module Latency
Module Speed
Module Density
Module Type
Device Type
W = Wintec OEM Product
M = M-Die C = C-DieA = A-Die D = D-DieB = B-Die
S = Samsung H = HynixM = Micron E = Elpida
I = CL6 N = CL11J = CL7 P = CL13L = CL9Note: Latency will be specified only on non-register (No Buffer) DIMMs
I = Inphi D = IDT M = MontageNote: For Registered DIMM this will be used for register identification
80 = 800Mbs @ CL6 16 = 1600Mbs @ CL1110 = 1066Mbs @CL7 18 = 1866Mbs @ CL1313 = 1333Mbs @ CL9Note: For Registered DIMM latency will not be specified using additional letter.
(0)1G =1GB (0)8G = 8GB(0)2G = 2GB (1)6G = 16GB(0)4G = 4GB 3(2)G = 32GBNote: For VLP DIMM (0) (1) (2) will be ignored.
UE(V)8 = 240-Unbuffered ECC, X8, 18-Chips, 2-RankUE(V)9 = 240-Unbuffered ECC, X8, 9-Chips, 1-RankUN(V)8 = 240-Unbuffered Non-ECC, X8, 8-Chips, 1-RankUN(V)6 = 240-Unbuffered Non-ECC, X8, 16-Chips, 2-RankRE(V)8 = 240-Registered ECC, X8, 18-Chips, 2-RankRE(V)9 = 240-Registered ECC, X8, 9-Chips, 1-RankRE(V)6 = 240-Registered ECC, X8, 36-Chips, 4-RankRE(V)4 = 240-Registered ECC, X4, 18-Chips, 1-RankRE(V)3 = 240-Registered ECC, X4, 36-Chips, 2-RankSE(V)8 = 204-SO-DIMM ECC, X8, 18-Chips, 2-RankSE(V)9 = 204-SO-DIMM ECC, X8, 9-Chips, 1-RankSE(V)8 = 204-SO-DIMM Non-ECC, X8, 8-Chips, 1-RankSE(V)6 = 204-SO-DIMM Non-ECC, X8, 16-Chips, 2-RankNote: For Standard DIMM (V) will be ignored. Mini RDIMM will use (NE), Mini UDIMM (OE), LRDIMM (DE), SO-RDIMM (AE).
(I)D3 = 1.5V DDR3 SDRAM(I)L3 = 1.35V DDR3 SDRAMNote: For I-Temp DRAM use (ID) or (IL)
DDR3 Naming Guide
DRAM
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W D 3 R E 0 8 G X 4 1 8 V - 1 3 3 3 L - P E I
Buffer/Register Set (Registered Modules Only)
DRAM Manufacturer and Die Revision
CAS Latency
Module Speed (MHz)
Module Height
Memory Footprints
Chip Configuration
Module Density
Module Type
Technology Type
W = Wintec OEM Product
I = Inphi L = Intel D = IDT
P = Samsung H = Micron A = A-Die C = C-DieC = Hynix J = Nanya B = B-Die D = D-Die E = Elpidia I = ISSI
A = CL 2 B = CL 2.5 C = CL 3G = CL 5 I = CL 6 J = CL 7 K = CL 8 L = CL 9 N = CL 11E = CL4
1600 (DDR3) 1333 (DDR3) 1066 (DDR3) 800 (DDR3/DDR2) 667 (DDR2) 533 (DDR2) 400 (DDR2/DDR) 333 (DDR) 266 (DDR) 133 (SDR) 100 (SDR)
U = Ultra Low Profile V = Very Low Profile None = Standard height PCB
02 = 2-Chip 04 = 4-Chip 05 =5-Chip (ECC) 08 = 8-Chip 09 = 9-Chip (ECC) 16 = 16-Chip 18 = 18-Chip (ECC) 32 = 32-Chip 36 = 36-Chip (ECC) 72 = 72-Chip (ECC)
X4 = x4 Mono Die H8 = x8 Stack DieX8 = x8 Mono Die Q4 = x4 Quad Die x4X16 = x16 Mono Die Q8 = x8 Quad Die x8D4 = x4 Dual/Twin Die D8 = x8 Dual/Twin Die
G = Gigabyte M = Megabyte
064 = 64 128 = 128 256 = 256512 = 512 001 = 1 002 = 2004 = 4 008 = 8 016 = 16
RE = Registered ECCModuleLE = Low Power Registered ECC (DDR3L)UE = Unbuffered ECCUN = Unbuffered Non-ECCAE = Registered ECC SODIMMSE = Unbuffered ECC SODIMMSN = Unbuffered Non-ECC SODIMMOE = Unbuffered ECC MiniDIMMNE = MiniDIMM Registerd-ECCPE=Unbuffered ECC SODIMM w/PLL
D3 = DDR3 D1 = DDRD2 = DDR2 SD = SDR
DDR2, DDR Naming Guide
DRAM
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1DRAM
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// Density up to 16GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181") and VLP (0.74")
Registered ECC High end server type applications
Unbuffered ECCNon-mission critical servers, networking Hubs/Routers and embedded
Unbuffered Non-ECCConsumer applications such as PC, Gaming machines and POS
// Density up to 8GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
Registered ECC Systems requiring large amounts of data traffic
Unbuffered ECCPC104 Boards and mini ITX boards
Unbuffered Non-ECCConsumer applications such as Notebook/Laptop
// Density up to 8GB
// Unbuffered ECC and Registered ECC
// Standard Profile (1.181") and VLP (0.74")
Registered ECC Networking systems, routers, hubs
Unbuffered ECCLess data intensive applications like compact network equipment systems
// Density up to 32GB
// Registered ECC
// Standard Profile (1.181")
Registered ECC Datacenters in need for greater scalability in both capacity and bandwidth
240 DIMM 244 mini-DIMM 204 SO-DIMM 240 LR-DIMM
DDR3
Technology Pins Profile UnbufferedUnbuffered
ECCRegistered
ECCPC3-6400 800 MT/s
PC3-8500 1066 MT/s
PC3-10600 1333 MT/s
PC3-12800 1600 MT/s
PC3-149001866 MT/s
DDR3
240 DIMM
Standard
1.5V 1GB - 8GB
1.5V 1GB - 8GB
1.5V 1GB - 16GB
MP MP MP MPCS
(Unbuffered)
1.35V 1GB - 8GB
1.35V 1GB - 16GB
MP MP MP MP
VLP
1.5V 1GB - 8GB
1.5V 1GB - 8GB
MP MP MP MP
1.35V 1GB - 8GB
1.35V 1GB - 8GB
MP MP MP MP
244 mini-DIMM
Standard1.5V
1GB - 8GB1.5V
1GB - 8GBMP MP MP MP
VLP1.5V
1GB - 8GB1.5V
1GB - 8GBMP MP MP MP
204 SO-DIMM
Standard1.5V
1GB - 8GB1.5V
1GB - 8GB1.5V
1GB - 8GBMP MP MP MP
240 LR-DIMM
Standard
1.5V 8GB - 32GB
MP MP MP
1.35V 8GB - 32GB
MP MP MP
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// Density up to 8GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181") and VLP (0.74")
Registered ECC
Data storage and servers with 24/7 data
intensive operations
Unbuffered ECC
Non-mission critical servers, networking hubs/routers and embedded applications that handle
less data traffic
Unbuffered Non-ECC)
Consumer applications such as PC, Kiosk and POS terminals
// Density up to 4GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181") and VLP (0.74")
Registered ECC
Applications that do not require address parity
Unbuffered ECC
Applications that do not require address parity
// Density up to 4GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
Registered ECC
Telecommunications and similar applications that
handle large amounts of data
Unbuffered ECC
Embedded applications such as non-critical or low traffic networking equipment
Unbuffered Non-ECC
Consumer applications such as Notebooks / Laptops
240 DIMM 200 SO-DIMM 244 mini-DIMM
DDR2
DRAM
Technology Pins Profile UnbufferedUnbuffered
ECCRegistered
ECCPC2-3200 400 MT/s
PC2-4200 533 MT/s
PC2-5300 667 MT/s
PC2-6400 800 MT/s
DDR2
240 DIMM
Standard1.8V
1GB - 4GB1.8V
1GB - 4GB1.8V
1GB - 8GBMP MP MP MP
VLP1.8V
1GB - 4GBMP MP MP MP
200 SO-DIMM
Standard1.8V
1GB - 4GB1.8V
1GB - 4GB1.8V
1GB - 2GBMP MP MP MP
244 mini-DIMM
Standard1.8V
1GB - 4GB1.8V
1GB - 2GB1.8V
1GB - 4GBMP MP MP MP
VLP1.8V
1GB - 2GB1.8V
1GB - 2GBMP MP MP MP
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1DRAM
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// Density up to 1GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
Registered ECC
High end server applications
Unbuffered ECC / Non-ECC
Embedded applications such as POS and kiosk systems
// Density up to 1GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
Unbuffered ECC / Non-ECC
Notebook and small form factor appliances such as routers, networks, 1U servers and POS that uses embedded boards.
184 DIMM 200 SO-DIMM
DDR
Technology Pins Profile UnbufferedUnbuffered
ECCRegistered
ECCPC2-2100 266 MT/s
PC2-2700 333 MT/s
PC2-3200 400 MT/s
DDR
184 DIMM
Standard2.5V
512MB - 1GB2.5V
256MB - 1GB2.5V
256MB - 1GBMP MP MP
200 SO-DIMM
Standard2.5V
128MB - 1GB2.5V
256MB - 1GBMP MP MP
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Modems
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Series Part Number Maximum SpeedError Correction
SupportData Compression
Support
RoHSCompliant
6/6
FCCCertified
Status
SL-SU
SL2404SU 2.4Kbps (V.22bis) V.42 V.42bis Yes Yes MP
SL2415SU 14.4Kbps (V.32bis) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SL2434SU 33.6Kbps (V.34) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SL2457SU 56Kbps/33.6Kbps (V.90) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SL2493SU 56Kbps/48Kbps (V.92) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SLM
SLM2404(-I) 2.4Kbps (V.22bis) V.42 V.42bis Yes Yes MP
SLM2415(-I) 14.4Kbps (V.32bis) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SLM2434(-I) 33.6Kbps (V.34) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SLM2457(-I) 56Kbps/33.6Kbps (V.90) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
SLM2493(-I) 56Kbps/48Kbps (V.92) V.42 / MNP2-4 V.42bis / MNP5 Yes Yes MP
USBModem
(Hardware)
WUMHV92-A1CN.01-xxx
56Kbps/48Kbps (V.92)14.4Kbps Fax (T.31/V.17)
V.42 / MNP2-4 V.44 / V.42 / MNP5 Yes Yes MP
USBModem
(Software)
WUMSV92-E1LS.01-xxx
56Kbps/48Kbps (V.92)14.4Kbps Fax (T.31/V.17)
V.42 / MNP2-4 V.44 / V.42 / MNP5 Yes Yes MP
// 24-pin DIP Small form-factor 1.4”x0.9”
// Low power consumption 26mA at 3.3V supply
// Parallel Phone detection and caller ID Detection
// Over-Voltage and Current Protection: 70V and 200mA
// Hardware and Software
// USB 2.0
// 56Kbps / 48Kbps (V.92)
// 14.4Kbps Fax (T.31/V.17)
// RoHS Compliant
// FCC Certified
// Supports Windows 98/2000/ XP/Vista/7 and Linux
// 24-pin DIP Small form-factor 2.0” x 1.0”
// Low power consumption
26mA at 3.3V supply
// Serial and Parallel mode support
// Dual voltage support (3.3V/5V)
// Over-Voltage and Current Protection: 70V and 200mA
SL-SU Series SLM Series USB Modem
Modems
website // www.wintecind.com/oem email // [email protected] phone // 408.856.0565
Contact a Wintec OEM Sales Representative Today!