OCTOBER 22–26, 2017 Sheraton Atlanta, GA USA...Applications of Lasers & Electro-Optics (ICALEO®), which this year returns to the hospitable city of Atlanta. We have worked hard

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Presented by:

OCTOBER 22–26, 2017Sheraton® Atlanta Hotel

Atlanta, GA USA

PEER REVIEWED PAPERS!

Advance ProgramThe World’s Premier Platform for Breakthrough Laser Solutions

Conference ChairsCongress GeneralChristoph Leyens, Fraunhofer IWS

Laser Materials Processing ConferenceKlaus Kleine, Coherent Inc.

Friedhelm Dorsch, TRUMPF Laser and Systems GmbH

Laser Microprocessing ConferenceMichelle Stock, mlstock consulting

Cather Simpson, Univ. of Auckland

Nanomanufacturing ConferenceYongfeng Lu, Univ. of Nebraska-Lincoln

Business Forum & Panel DiscussionKlaus Loeffler, TRUMPF Laser and Systems GmbH

Bo Gu, BOS Photonics

TABLE OFCONTENTS

International Advisory Board,

Cooperating Societies and

Media Partners ............................ 4

Highlighted Sessions & Events .... 5

Welcome Celebration

Appreciation Breakfast

Opening Plenary Session

President’s Reception

LIA’s Laser Running Club

Business Forum & Panel Discussion

Laser Industry Vendor Reception

Awards Luncheon

Closing Plenary Session

Student Paper Award Contest

Laser Materials

Processing Conference ................ 9

Laser Microprocessing

Conference ................................ 15

Nanomanufacturing

Conference ................................ 19

Poster Presentation Gallery ...... 22

General Information ................. 25

Conference Agenda .................. 26

The LIA, my co-chairs, all the committee members and I are looking

forward to seeing you at the 36th International Congress on

Applications of Lasers & Electro-Optics (ICALEO®), which this year

returns to the hospitable city of Atlanta.

We have worked hard to ensure that ICALEO 2017 lives up to the

status as the most important laser material processing conference

in the world, with an exciting program featuring over 200

presentations and posters on the latest in laser research. Many

of these presentations are peer reviewed, ensuring ICALEO will

provide another outstanding opportunity to learn about advances

in laser material processing. As always, it will also be a great way to

network with scientists, engineers and researchers from all over the

world, to meet old friends and to make new friends.

I hope to see you all Sunday evening all the way to Thursday

afternoon, attending the best ICALEO yet.

Christoph Leyens

Christoph LeyensFraunhofer IWS

Dresden, Germany

CONFERENCE GENERAL CHAIR WELCOME

Sheraton® Atlanta Hotel | Atlanta, GA USA | October 22–26, 2017 3

ICALEO Cooperating Societies and Media Partners

ICALEO 2017 International Advisory BoardPaul Hilton, TWI Ltd., Great Abington, Cambridge, Great Britain

Tony Hoult, IPG Photonics, Santa Clara, CA, USA

Stefan Kaierle, Laser Zentrum Hannover e.V., Hannover, Germany

Dietmar Kracht, Laser Zentrum Hannover e.V., Hannover, Germany

Lin Li, The Univ. of Manchester, Manchester, Great Britain

Xinbing Liu, Panasonic Boston Laboratory, Newton, MA, USA

Henrikki Pantsar, TRUMPF Inc., Plymouth, MI, USA

Kunihiko Washio, Paradigm Laser Research Ltd., Tokyo, Japan

Rongshi Xiao, Beijing Univ. of Technology, Beijing, People's Republic of China

Jianhua Yao, Zhejiang Univ. of Technology, Hangzhou, People's Republic of China

Minlin Zhong, Tsinghua Univ., Beijing, People's Republic of China

SPECIAL THANKS

The Laser Institute of America (LIA) presents its 36th International Congress on Applications of Lasers & Electro-Optics (ICALEO).

This conference provides an opportunity for researchers and end-users to meet and review the state-of-the-art in laser materials

processing, laser micropressing and nanomanufacturing, and predict where the future will lead. LIA’s conferences serve as the town

square of the laser community, bringing the university researcher, the business executive, and the production floor user together

under one roof for a unique and rewarding networking opportunity.

LIA is the professional society for laser applications and safety. Our mission is to foster lasers, laser applications and laser safety

worldwide. Serving the industrial, medical, research and government communities for over 45 years, LIA offers technical information,

training and networking opportunities to laser users from around the globe.

ABOUT LIA AND ITS CONFERENCES

We extend a special thank you to the ICALEO® 2017 International Advisory Board and our Cooperating Societies and Media Partners!

+1.407.380.1553 | www.icaleo.org | [email protected]

HIGHLIGHTED SESSIONS AND EVENTS

Welcome CelebrationSunday, October 22 | 4:00pm

ICALEO®’s welcome celebration is always a memorably festive affair that brings

together longtime and new attendees for an evening of snacks, beverages

and live entertainment by the Beer’s Law band, featuring Ron Schaeffer,

Henrikki Pantsar and special guest musicians. Staged at the ICALEO venue,

this gathering of old and new friends will also feature a raffle comprised of

exciting door prizes. Don’t miss out on this opportunity to socialize with the

ICALEO gang in this informal setting.

Appreciation BreakfastMonday, October 23 | 7:30am

Program Committee members and session chairs are invited to attend this informative start to the week’s events on Monday,

October 23 at 7:30am. Both new and veteran session chairs will receive important session materials and audio-visual tips, along with

any last-minute updates to the program. Please plan to arrive in time to fuel up for a strong start to an exciting conference.

Opening Plenary SessionMonday, October 23 | 9:00amSession Chair: Christoph Leyens, Fraunhofer IWS, Dresden, Germany

The ICALEO® Opening Plenary session is designed to enthrall you. Kicking off days of informative technical sessions, three renowned

speakers will present on different aspects of new frontiers in lasers and photonics. You won’t want to miss this enlightening

plenary session!

Invited Plenary Speakers:Mark Schnitzer, Howard Hughes Medical Institute, Stanford Univ., Palo Alto, CA

Henry Kapteyn, Univ. of Colorado, Boulder, CO

Jeff Deems, CIRES, National Snow and Ice Data Center, Boulder, CO

President’s ReceptionMonday, October 23 | 5:30pm

Mingle with your colleagues in a fun and relaxed environment at ICALEO’s premier networking event. Hosted by LIA President Paul

Denney, the President’s Reception is the perfect place to interact with the LIA Executive Committee, Board of Directors, ICALEO

Congress General Chair Christoph Leyens and Conference Chairs Klaus Kleine, Friedhelm Dorsch, Michelle Stock, Cather Simpson and

Yongfeng Lu.

LIA's Laser Running ClubTuesday, October 24 | 6:30am

Meet with your colleagues for our traditional sunrise run. Enjoy running

through beautiful Atlanta while catching up with your fellow early risers. A

tradition begun by former LIA President Klaus Loeffler, the LIA Laser Running

Club keeps you energized during the conference. Meet us in the hotel

lobby with your Laser Running Club shirt on! If you are a newcomer, we will

provide you with a shirt. Learn more about how to participate at the ICALEO

registration desk.


Laser market specialists from around the world provide exclusive information about the development and future trends in the

different regions. Topics like the following will be discusses: China has installed more than 60,000 laser systems last year. Is this a

opportunity or a threat for the non-Chinese laser businesses? Be part of the discussion: The forum is open for all attendees. This will

also help to show you where your professional career might lead you to. Be part of the exciting network and exchange ideas with

the speakers and attendees during the round table discussions.

Presenters

HIGHLIGHTED SESSIONS & EVENTS

Laser Industry Vendor Reception & Tabletop DisplayTuesday, October 24 | 4:00pm

Enjoy drinks and hors d’oeuvres while sharing ideas with colleagues and

suppliers representing more than 200 companies and organizations from

over 30 countries. Discuss equipment and applications in a relaxed setting

after the day’s technical sessions. To participate as an ICALEO sponsor or

vendor, contact the LIA Marketing Department at [email protected].

Sponsors and Vendors registered as of August 1st in alphabetical order.

AdlOptica GmbH

Aerotech, Inc.

Altos Photonics, Inc.

Amplitude Systemes

Cambridge Technology, a Novanta Company

Clark-MXR, Inc

Coherent, Inc.

Directed Light Inc.

EdgeWave GmbH Innovative Laser Solutions

Electro-Optics Technology, Inc.

Fraunhofer Institute for Laser Technology ILT

Haas Laser Technologies Inc.

II-VI Incorporated

IPG Photonics

Kentek Corporation

LASEA, Inc.

Laser Mechanisms, Inc.

Laserline Inc.

Laservision USA

Liburdi Automation Inc.

Light Conversion Ltd.

Lumentum

Newport Corporation

NKT Photonics

Photonics Industries International Inc.

Precision Laser Scanning

Precitec Inc.

Raptor Photonics Limited

RAYLASE Laser Technology Inc.

RT Technologies, Inc.

SCANLAB America, Inc.

Spectra-Physics, A Newport Company

SPI Lasers

TRUMPF Inc.

*Sponsors are highlighted

David Belforte, Industrial Laser SolutionsGlobal Overview and NAFTA

Klaus Loeffler, TRUMPF Laser and Systems GmbH

Laser Market in EU

Oliver Suttmann, Laser Zentrum Hannover e. V. Business Model of an Applied Not-for-profit Research Center

Kunihiko Washio, Paradigm Laser Research Ltd.

Laser Market in Japan

Bo Gu, BOS PhotonicsLaser Market in China


Klaus LoefflerTRUMPF Laser and Systems GmbHDitzingen, Germany

Bo GuBOS PhotonicsNorth Andover, MA USA

Business Forum & Panel Discussion: The Global Laser Market and Its Future DevelopmentTuesday, October 24Session Co-Chairs:

HIGHLIGHTED SESSIONS & EVENTS

Student Paper Award ContestFuture generations of laser industry experts have been

contributing papers at ICALEO for 18 years. LIA once again

will recognize the importance of student contributions with

the 19th Annual ICALEO Student Paper Award. Not only does

the student paper contest illuminate the great work of up-

and-coming researchers, but cash awards will be presented to

the first-, second- and third-place winners. Winning papers are

given the opportunity to be submitted to LIA’s Journal of Laser

Applications® for publication (papers will undergo a peer-review

process). Student papers accepted for competition will be judged

by an international panel based on originality of topic/material

presented, scientific and technical merit, and presentation

quality. Professors will not judge their own students’ papers.

Prize winners will be announced during the Closing Plenary

Session of ICALEO on Thursday, October 26th.

Closing Plenary SessionThursday, October 26 | 1:30pmSession Chair: Christoph Leyens, Fraunhofer IWS, Dresden, Germany

To close out ICALEO, we offer you a plenary session that will

hopefully broaden your horizon a bit and give you something

to think about on your way home. We hope to see you there,

for an exciting session.

Invited Plenary Speakers:Wayne King, Lawrence Livermore National Laboratory, Livermore, CA

Sanjay Correa, GE Aviation, Cincinnati, OH

Plus Additional Invited Presentations

LIA Annual Meeting & Awards Luncheon featuring the Arthur L. SchawlowAward PresentationWednesday, October 25 | 12:30pm

The 2017 Arthur L. Schawlow Award is presented to Paul Seiler.

Dr. Paul Seiler is a recognized pioneer in laser technology for

industrial use. He studied precision mechan ics at the University

of Applied Sciences in Karlsruhe, Germany. In 2008, he received

an honorary doctorate from the Univer sity of Stuttgart. From

1992 until 2003, Dr. Seiler was the man aging director of TRUMPF

Laser GmbH & Co. KG in Schramberg.

For decades, Dr. Seiler’s passion for laser technology led to

his exceptional contributions including solid-state lasers for

industrial use and his systems of lasers and components that

were instrumental in combining lasers and machines.

About the Arthur L. Schawlow Award

One of LIA’s most prestigious honors, the Arthur L. Schawlow

Award recognizes the recipient’s longstanding record of laser

industry innovation.

The Schawlow Award recognizes outstanding, career-long

contributions to basic and applied research in laser science and

engineering, leading to fundamental understanding of laser

materials interaction and/or transfer of laser technology for

increased application in industry, medicine and daily life.

The Schawlow honoree is acknowledged at the traditional LIA

Awards Luncheon, during which the recipient gives an address

that is always a memorable, must-see ICALEO moment.

The Awards Luncheon is sponsored by:

Dr. Paul Seiler (middle) with LIA’s Marketing Director Jim Naugle (left) and Past LIA President Klaus Loeffler (right).


LASER MATERIALS PROCESSING CONFERENCE

The Laser Materials Processing (LMP) Conference will feature presentations that expand the boundaries of laser processing with more powerful lasers, innovative hybrid processes and laser applications that push the boundaries of what has been done and what can be done. Welding takes up a large share of the conference followed by surface modification including cladding and coating. Processes discussed will range from traditional cutting and drilling to laser-assisted machining and 3D printing.

Sponsored by:

LMP Session 1: Sub PlenaryMonday, October 23 | 1:30pmSession Chair: Friedhelm Dorsch, TRUMPF Laser and Systems GmbH, Ditzingen, Germany

Spatial Beam Modulation to Reduce Electrical Resistance in

Laser Welded Aluminum to Copper Dissimilar Joints (101)

Michael Jarwitz, Institut fuer Strahlwerkzeuge, Univ. of Stuttgart

Experimental Analysis on Melting and Solidification Process of

Titanium with Synchrotron X-ray for Development Of Sputter-

Less SLM (102)

Yuji Sato, Osaka Univ.

Monitoring Sensor Systems for Laser Welding: a Review of

Existing Systems (103)

Eurico Assuncao, European Federation for Welding,

Joining and Cutting

LMP Session 2: LAMMonday, October 23 | 3:30pmSession Chair: Paul Denney, Lincoln Electric, Cleveland, Ohio, USA

Evaluation of 3D-Printed Parts by Means of High-Performance

Computer Tomography (201)

Elena López, Fraunhofer IWS

Electrophotographic Multi-Material Powder Deposition for

Additive Manufacturing (202)

Bastian Geißler, Bayerisches Laserzentrum GmbH

Laser-Assisted Activation for the Selective Metallization of

Polymeric Substrates (203)

Michael Güpner, Ernst-Abbe-Hochschule Jena

From Preform To Polishing – Lasers in Metal Based Additive

Manufacturing (204)

Frank Geyer, TRUMPF Inc.

LMP Session 4: Aluminum WeldingTuesday, Tuesday, October 24 | 8:30amSession Chair: Tony Hoult, IPG Photonics, Santa Clara, California, USA

Numerical and Experimental Analysis of Solidification Cracking

in Pulsed Laser Welds of Al 6082 (401)

Martin Bielenin, Technische Univ. Ilmenau

Direct Observation of Cracking and Weld Pool Formation in

Laser Welding of Al Alloy by X-Ray Phase Contrast Method (402)

Masanori Miyagi, Hitachi, Ltd.

Milan Brandt, RMIT Univ., Bundoora, Victoria, Australia

Craig Bratt, Fraunhofer USA – Center for Laser Applications, Plymouth, MI, USA

Frank Brueckner, Fraunhofer IWS, Dresden, Germany

Paul Denney, Lincoln Electric Company, Cleveland, OH, USA

Yingchun Guan, Beihang Univ., Beijing, People’s Republic of China

Masoud Harooni, TRUMPF Inc., Plymouth, MI, USA

Keith Johnson, Kondex Corporation, Lomira, WI, USA

Seiji Katayama, Osaka Univ., Ibaraki, Osaka, Japan

Annett Klotzbach, Fraunhofer IWS, Dresden, Germany

Wolfgang Knapp, Coopération Laser Franco-Allemande (CLFA) Fraunhofer ILT, Nantes, France

Markus Kogel-Hollacher, Precitec Optronik GmbH/Precitec GmbH & Co. KG, Neu-Isenburg, Germany

JP Lavoie, Coherent, Inc., Santa Clara, CA, USA

M. Angeles Montealegre, Talens Systems- EtxeTar Group, Elgoibar, Spain

Juan Pou, Univ. de Vigo, Vigo, Spain

Barbara Previtali, Politecnico Di Milano, Milano, Italy

Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, Finland

Geoff Shannon, Amada Miyachi America Inc., Monrovia, CA, USA

Anja Techel, Fraunhofer IWS, Dresden, Germany

Joerg Volpp, BIAS, Bremen, Germany

Jun Wei, Singapore Institute of Manufacturing Technology, Singapore, Singapore

Verena Wippo, Laser Zentrum Hannover e.V., Hannover, Germany

Gerd Witt, Univ. Duisburg-Essen, Duisburg, Germany

Program Committee

Conference Co-chairs:

Friedhelm DorschTRUMPF Laser and Systems GmbHDitzingen, Germany

Klaus KleineCoherent Inc.Santa Clara, CA USA


Investigations on Dual Laser Beam Welding of Aluminium High

Pressure Die Castings at Reduced Ambient Pressure (403)

Fabian Teichmann, Institut für Füge- und Schweißtechnik,

Technische Univ. Braunschweig

Numerical Modelling, Electrochemical and Surface Analyses of

Laser Deposited Ti-Zn-Ni Coatings On Ti-6Al-4V Alloy (404)

Olawale Fatoba, Tshwane Univ. Of Technology

Relationship Between Temperature History and Mechanical

Property during Laser Surface Hardening Treatment (405)

Eun-Joon Chun, Korea Institute of Machinery and Materials

Influencing Factors on Humping Effect in Laser Welding with

Small Aspect Ratios (406)

Andreas Patschger, Ernst-Abbe-Univ. of Applied Sciences

Brightline Weld – Spatter Reduced High Speed Welding with

Disk Lasers (407)

David Havrilla, TRUMPF Inc.

Next Level of Remote Welding – Intelligent Scanner Head and

Integrated Path Finding (408)

Ruediger Brockmann, TRUMPF Laser- und Systemtechnik GmbH

Using a Diode Laser Superposition to Prevent Solidification

Cracking in Pulsed Laser Beam Welding (409)

Martin Bielenin, Technische Univ. Ilmenau

LMP Session 5: CladdingTuesday, October 24 | 8:30amSession Chair: Prabu Balu, Coherent, Santa Clara, California, USA

Copper Film Formation on Metal Surfaces with 100W Blue

Direct Diode Laser System (501)

Kohei Asano, Osaka Univ.

Process Characterization of Powder Based Laser Metal

Deposition on Thin Substrates (502)

Michael Güpner, Univ. of Applied Sciences Jena

Laser Metal Deposition with 316L Stainless Wire: Macro

Morphologies and Microstructures (503)

Xiang Xu, Huazhong Univ. of Science and Technology

Local Heat Treatment Of of a Laser Build-Up (504)

Maritha Theron, Council for Scientific and Industrial

Research (CSIR)

Influence of Clad Depth and Mechanical Behaviour on the

Tensile Properties of Laser Clad 300M Steel (505)

Cameron Barr, RMIT Univ.

In-Situ Control of Tempered Martensite during Laser Cladding

Repair of Aero-Grade 300M Steel using AiSi 420 Stainless Steel

Powder (506)

Stephen Sun, RMIT Univ.

Electrochemical Machining Characteristics of Inconel 718 by

Laser Solid Forming and Forging (507)

Pengfei Guo, Northwestern Polytechnical Univ.

A Composite Stellite Alloy Hardfacing with Improved Laser

Cladding Behavior and Wear Resistance (508)

Yinping Ding, Zhejiang Univ. of Technology

Laser-Matter Interactions in Laser Beam Melting of High

Performance Oxide Ceramics (509)

Liliana Moniz, Ecole des Mines de Paris

LMP Session 6: CuttingTuesday, October 24 | 1:30pmSession Chair: JP Lavoie, Coherent, Santa Clara, California, USA

Using The Analysis Of Laser-Based Back-Reflected Light To

Improve Piercing And Cutting Performance For High Power

Fiber Lasers (601)

Paul Harrison, SPI Lasers UK Ltd

Laser Cutting Of Pure Lithium Metal Anodes – Effects Of

Atmospheric Conditions (602)

Tobias Jansen, Technische Univ. Braunschweig

Elongating Depth Of Field By Focusing Radiation Of Multimode

Lasers Using Multi-Focus Beam Shaping Optics (603)

Alexander Laskin, AdlOptica GmbH

Effect Of Beam Profile On Nanosecond Laser Drilling Of 4H-Sic (604)

Byunggi Kim, Tokyo Institute of Technology

To Application Demands Adapted Beam Qualities For Improved

Process Results (605)

Peter Kallage, Coherent Rofin

Short Wavelength Pyrometry By Photon Counting – Application

For Temperature Measurement In Laser Oxygen Cutting (606)

Nicolas RANC, Arts et Métiers

In-Situ-Visualization of Multiple Reflections on the Cut Flank

during Laser Cutting with 1 µm Wavelength (607)

Dennis Arntz, Chair for Laser Technology LLT, RWTH Aachen Univ.



LMP Session 7: Monitoring ITuesday, October 24 | 1:30pmSession Chair: Markus Kogel-Hollacher, Precitec, Neu-Isenburg, Germany

Pushing the Envelope: Exploration of Next-Gen Laser Welding

Processes with Inline Coherent Imaging (701)

Christopher Galbraith, Laser Depth Dynamics Inc.

Flexible Remote Welding with Sensor Integration for Fillet

Welding (702)

Friedhelm Dorsch, TRUMPF Laser- und Systemtechnik GmbH

Efficient Air Flow Control for Remote Laser Beam Welding (703)

Achim Mahrle, Fraunhofer IWS

M-Squared Measurement Repeatability: the Best Metric in the

Certainty of the Measurement (704)

Michael Scaggs, Haas Laser Technolologies, Inc.

Industry 4.0: Manufacturing the Digital World with Lasers (705)

Ruediger Brockmann, TRUMPF Laser- und Systemtechnik GmbH

Validation of Hyperspectral Imaging as a Useful Method for

Monitoring Laser-Based Material Processing (706)

Tobias Staudt, Friedrich-Alexander-Univ. Erlangen-Nürnberg

LMP Session 8: Modeling WeldingWednesday, October 25 | 9:00am

Analysis and Possible Estimation of Keyhole Depths Evolution,

using Laser Operating Parameters and Material Properties (801)

Remy Fabbro, PIMM Laboratory

Temperature Histories of Structural Steel Laser and Hybrid

Laser-GMA Welds Calculated using Volumetric Constraints (802)

Lou Massa, Hunter College & the Graduate School, CUNY

Analysis of the Interaction Between the Temperature Field and

the Weld Seam Morphology in Laser Transmission Welding by

using Two Different Discrete Laser Wavelengths (803)

Bastian Geißler, Bayerisches Laserzentrum GmbH

Prediction of the Resultant Microstructure and Mechanical

Properties during Laser Welding of Ti6Al4V Alloys Via

Multiphysics Modeling (804)

Yung Shin, Purdue Univ.

LMP Session 9: LAM IIWednesday, October 25 | 9:00amSession Chair: Brian Victor, nLight, Portland, Oregon, USA

Energy Efficiency Contributions and Losses During SLM (901)

Alexander Kaplan, Luleå Univ. of Technology

Quality Aim-Based Control of Geometrical Accuracy and

Residual Stresses in Laser Metal Deposition (902)

Mauritz Möller, Laser Zentrum Nord

Study of Laser Hot-Wire Additive Manufacturing in Aerospace

Applications (903)

Shuang Liu, Miller Electric

Integrated Freeform Laser Manufacturing on a Single Parallel

Robot Platform (904)

Jianyong Chen, Heriot-Watt Univ.

LMP Session 10: Steel WeldingWednesday, October 25 | 10:50amSession Chair: Sarah Nothdurft, Laser Zentrum Hannover e.V., Hannover, Germany

Residual Stress Reduction of Laser Beam Welds by Use of Low-

Transformation-Temperature (LTT) Filler Materials in Carbon

Manganese Steels – In Situ Diagnostic: Image Correlation (1001)

Simon Olschok, RWTH Aachen Univ.

Effects of Welding Speed and Edge Distance on Solidification

Cracking Length during Laser Welding at the Narrow Flange

Edge of Austenitic Stainless Steel (1002)

Shota Kikuchi, Nippon Steel & Sumitomo Metal Corporation

Development of a Joining Gap Control System for Laser

Welding of Zinc-Coated Steel Sheets Driven by Process

Observation (1003)

Felix Tenner, Friedrich-Alexander-Univ. Erlangen-Nürnberg

Effect of Post-Weld Heat Treatment on Weld Integrity in Laser

Welding and Hybrid Laser-Tig Welding of Thick Austenitic

Stainless Steel (1004)

Hui-Chi Chen, Singapore Institute of Manufacturing Technology

Study of Microstructure and Mechanical Properties of Narrow-

Gap Multi-Layer Hybrid Laser-Arc Welded 316L Austenitic

Stainless Steel (1005)

Xiong Zhang, Huazhong Univ. of Science and Technology

LMP Session 11: LAM IIIWednesday, October 25 | 10:50amSession Chair: Milan Brandt, RMIT Univ., Melbourne, Victoria, Australia

Design Guidelines for Laser Metal Deposition of Lightweight

Structures (1101)

Ake Ewald, Hamburg Univ. of Technology



Effect of Baseplate Temperature on Sputter-Generation for

Development of SLM in Vacuum (1102)

Shuto Yamagata, Osaka Univ.

Preliminary Study on Laser-Arc Hybrid Additive Manufacturing

of 316L Austenitic Stainless Steel (1103)

Mengcheng Gong, Huazhong Univ. of Science and Technology

Tailored Formation of Metal Matrix Nanocomposite

Components by Laser Additive Manufacturing (1104)

Dongdong Gu, Nanjing Univ. of Aeronautics and Astronautics

Added Value by Hybrid Additive Manufacturing and Advanced

Manufacturing Approaches (1105)

André Seidel, Fraunhofer Institute for Material and Beam

Technology & Technische Univ. Dresden

LMP Session 12: ModelingWednesday, October 25 | 3:00pm

Laser-Induced Ablation Modeling with Integrated Melt Flow

and Plasma Dynamics (1201)

Kaushik Iyer, Johns Hopkins Univ. Applied Physics Laboratory

Temperature Field and Residual Stress Distribution for Laser

Metal Deposition (1202)

Thomas Schopphoven, Fraunhofer- Institut für Lasertechnik ILT

Method for High Accuracy Measurements of Energy Coupling

and Melting Efficiency under Welding Conditions (1204)

Dominik Hipp, Technische Univ. Dresden

Influence of Directional Lorentz Force on Exhausting Effect of

Molten Pool during Laser Cladding (1205)

Yong Hu, Zhejiang Univ. of Technology

LMP Session 13: LAM IVWednesday, October 25 | 3:00pmSession Chair: Craig Bratt, Fraunofer USA – Center for Laser Applications, Plymouth, Michigan, USA

Enhanced Manufacturing Possibilities using Multi-Materials in

Laser Metal Deposition (1301)

Frank Brueckner, Fraunhofer IWS

Microstructure and Properties Of Ti64.51Fe26.40Zr5.86Sn2.93Y0.30 Biomedical Alloy Fabricated by Laser Rapid Prototyping (1302)

Cunshan Wang, Dalian Univ. of Technology

Direct Measurements of Laser Absorptivity During Metal Melt

Pool Formation Associated with Powder Bed Fusion Additive

Manufacturing Processes (1303)

Manyalibo Matthews, Lawrence Livermore National Laboratory

Comparative Study Between Cw and Pw Emissions in Selective

Laser Melting (1304)

Leonardo Caprio, Politecnico di Milano

Low Power Laser Cladding for Isotropic Material Properties (1305)

Jing Liu, Univ. of Liverpool

LMP Session 14: Surface Modification IThursday, October 26 | 8:30amSession Chair: Maritha Theron, Council for Scientific and Industrial Research, Pretoria, Gauteng, South Africa

Local Heat Tempering with Laser Radiation for Brilliant Colors

on Glass Surfaces (1401)

Kristin Plat, Laser Zentrum Hannover e.V.

Deep Engraving and Raised Marking of Metals using Pulsed

Fiber Lasers (1402)

Jack Gabzdyl, SPI Lasers UK

In-Depth Characterization of the Scanner-Based Selective Laser

Deburring (SSLD) Process (1403)

Georg Cerwenka, Hamburg Univ. of Technology (TUHH)

Dynamic Control of Laser Beam Shape for Heat Treatment (1404)

M. Angeles Montealegre, Talens Systems- Etxe-Tar Group

Laser Polishing to Improve the Surface Quality of Cocr And

Ti6Al4V Additively Manufactured Parts (1405)

Wojciech Gora, Heriot-Watt Univ.

LMP Session 15: Welding of Dissimilar Materials IThursday, October 26 | 8:30amSession Chair: Masoud Harooni, TRUMPF Inc., Plymouth, Michigan, USA

Investigations on Remote Laser Beam Welding of Dissimilar

Joints of X5Crni18-10 And Aa6082-T6 for Battery Housings (1501)

Oliver Seffer, Laser Zentrum Hannover e.V.

Laser-Based Plastic-Metal-Joining with Self-Organizing

Microstructures Considering Different Load Directions (1502)

Kira van der Straeten, Fraunhofer Institute for

Laser Technology (ILT)

Influence of Beam Position and Ultrasonic Amplitude on the

Microstructure of Laser Welded Dissimilar Steel-Steel Joints (1503)

Sarah Nothdurft, Laser Zentrum Hannover e.V.

Thin Section Dissimilar Metal Welding With Ns Pulsed Fiber

Lasers (1504)

Jack Gabzdyl, SPI Lasers UK



Laser Welding of Dissimilar Joints of Steel and Aluminum for

Ship Applications using a High-Power Diode Laser (1505)

Rabi Lahdo, Laser Zentrum Hannover e.V.

LMP Session 16: Surface Modification IIThursday, October 26 | 10:40amSession Chair: André Häusler, Fraunhofer ILT, Aachen, Germany

Effect of Grain Size Deformation on Laser Processed Sheet

Steel under High Temperature Condition (1601)

Stephen Akinlabi, Univ. of Johannesburg

Numerical Simulation and Process Optimization of Laser

Surface Treatment on Duplex Stainless Steel (1602)

Peng Wen, Tsinghua Univ.

Study on Topology Optimization Design, SLM Fabrication and

Performances of Porous Structure (1604)

Dongyun Zhang, Beijing Univ. of Technology

LMP Session 17: Welding of Dissimilar Materials IIThursday, October 26 | 10:40amSession Chair: Jack Gabzdyl, SPI Lasers, Southampton, United Kingdom

Effect of Interface Temperature on Adhesion in Laser Mixed

Joints of Plastic Reinforced and Steel (1701)

Cyril Hidalgo, Segula Technologies

Research on CFRP/Stainless Steel Laser Direct Joining (1703)

Junke Jiao, Ningbo Institute of Industrial Technology, Chinese

Academy of Sciences

A Study of Dissimilar Materials Welding by High Brightness

Laser System (1703)

Su-Jin Lee, Korea Institute of Machinery & Materials

Microstructure and Mechanical Properties of Laser-Welded Joints

of Ti-22Al-25Nb/Ti-6Al-4V Dissimilar Titanium Alloys (1704)

Lingda Xiong, Huazhong Univ. of Science and Technology



LMF Session 1: Sub PlenaryMonday, October 23 | 1:30pmSession Co-chairs: Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, Nebraska, USA; Michelle Stock, mlstock consulting, Ann Arbor, Michigan, USA

Manufacturing of Integrated Si Anode with Micro/

Nanostructures for Lithium-Ion Batteries based on Laser

Technology (M101)

Ting Huang, Beijing Univ. of Technology

Laser Direct Writing of Nanostructures for Functional Devices (M102)

Costas Grigoropoulos, Univ. of California, Berkeley

Ultrashort Pulse Laser Processing of Glass – from Cutting to Welding (M103) Stefan Nolte, Freidrich Schiller Univ. Jena

LMF Session 2: Laser Ablation for MicroelectronicsMonday, October 23 | 3:30pm

Femtosecond Laser-Induced Chemical Vapor Deposition of Tungsten Quasi-Periodic Structures on Silicon Substrates (M201) Jyi Sheuan Ten, Univ. of Cambridge

Low-Visibility Processing of Silver Nanowire Transparent Conductive Film by Pulsed Laser (M202) Yasuhiro Okamoto, Okayama Univ.

High Power Carbon Monoxide Laser Provides Materials Processing with Finer Features (M203) Ce Shi, Coherent Inc

Transformation of Gaussian Beams into M-Beams for Advanced Microvia Drilling (M204) Aravinda Kar, Univ. of Central Florida

LMF Session 10: Laser Processing of Textured Surfaces and Micro-jointsMonday, October 23 | 3:30pmSession Chair: Ting Huang, Beijing Univ. of Technology, Beijing, People’s Republic of China

Functionalised Polymers for More Efficient Nanosecond UVlaser Micromachining (M1001) M. Cather Simpson, Photon Factory, The Univ.of Auckland

LASER MICROPROCESSING CONFERENCE

Neil Ball, Directed Light Inc., San Jose, CA, USA

Adela Ben-Yakar, The Univ. of Texas at Austin, Austin, TX, USA

Robert Braunschweig, Lasea, Inc., El Cajon, CA, USA

Corey Dunsky, Aeos Consulting, Inc., Los Gatos, CA, USA

Jack Gabzdyl, SPI Lasers, Southampton, Great Britain

Bo Gu, BOS Photonics, North Andover, MA, USA

Rui Guo, GE Healthcare, Waukesha, WI, USA

Aravinda Kar, CREOL, The College of Optics and Photonics, Univ. of Central Florida, Orlando, FL, USA

Nam Seong Kim, Lutronic, Goyang, South Korea

Petri Laakso, VTT, Lappeenranta, Finland

Andres Lasagni, Fraunhofer IWS, Dresden, Germany

Eric Mottay, Amplitude Systemes, Pessac, France

Yasuhiro Okamoto, Okayama Univ., Okayama, Japan

Alexander Olowinsky, Fraunhofer ILT, Aachen, Germany

Yasu Osako, ESI, Portland, OR, USA

Michael Schmidt, Bayerisches Laserzentrum GmbH, Erlangen, Germany

Kather Simpson, Univ. of Auckland, Auckland, New Zealand

Rudolf Weber, IFSW, Univ. of Stuttgart, Stuttgart, Germany

Program Committee

Laser microprocessing is a state-of-the-art approach for achieving today’s manufacturing demands for many of our high-tech devices, from smart phones to the smallest, most precise sensors. ICALEO®’s Laser Microprocessing Conference is the premier event to learn about the most significant and far-reaching advances, and how they will achieve new capabilities for technological development. Invited talks, oral presentations and poster presentations inform the international laser processing community and contribute the latest, most exciting updates bridging the research and industry communities. Highlights of this year’s program include new findings in biomedical applications, surface processing and ultrafast laser micromachining and functionalization. The option to be peer-reviewed has added to the caliber of the submissions in this already high-level technical conference. We look forward to your participation and trust that this year, as always, the quality of the papers and networking will make this your most productive conference of the year.

Michelle Stockmlstock consulting Ann Arbor, MI USA

Cather SimpsonUniv. of Auckland Auckland, New Zealand

Conference Co-chairs:


Energy Input Of A Laser Micro Welding Process By Using Spatial Power Modulation (M1002) Andre Haeusler, Chair for Laser Technology, RWTH Aachen Univ.

Hybrid Joining Of Polymers With Difficult To Process Metal Substrates For Diverse Applications (M1003) Robert Braunschweig, LASEA, Inc.

Surface Optimization using High Power Pulsed Disk Lasers (M1004) Florian Kiefer, TRUMPF Inc.

LMF Session 3: Surface StructuringTuesday, October 24 | 8:30amSession Chair: Cather Simpson, Photon Factory, The Univ. of Auckland, Auckland, New Zealand

Combination of Short and Ultrashort Pulse Laser Processing for Productive Large Scale Structuring of 3D Plastic Mould Steel (M301) Andreas Brenner, Fraunhofer-Institute for Laser Technology

Superhydrophobic Contoured Surfaces Created on Metal and Polymer for Microfluidic Devices using a Femtosecond Laser (M302) Yung Shin, Purdue Univ.

Precision Structuring and Functionalization of Ceramics with Ultra-Short Laser Pulses (M303) Michael Seiler, Ernst-Abbe-Univ. of Applied Sciences

Superhydrophobic and Superhydrophilic Surfaces by Picosecond Laser Texturing (M304) Suwas Nikumb, National Research Council of Canada

Integration of a Smart Measurement Device in the Laser Structuring Process Chain to Ensure High Quality (M305) Mario Pothen, Fraunhofer Institute for Production Technology IPT

Femtosecond Laser Structuring of Graphite Anodes for Improved Lithium-Ion Batteries: Ablation Characteristics and Process Design (M306) Jan Habedank, Technical Univ. of Munich

Reflection Reduction in Silicon Solar Cells by Means of Laser and Plasma Treatment (M307) Ludwig Pongratz, Fraunhofer Institute for Laser Technology ILT

LMF Session 4: Microprocessing of Transparent MaterialsTuesday, October 24 | 1:30pmSession Chair: Corey Dunsky, AEOS, Los Gatos, CA, USA

Glass Color Decoration by High Repetition-Rate Ultra-Short Pulse Laser Processing (M401) Emma Verdier, ALPhANOV

Ultrashort Pulse Laser Multiburst Mode Process with Hollow Core Photonic Crystal Fiber Module (M402) Sanghoon Ahn, Korea Institute of Machinary and Materials

Glass Cutting with Femtosecond Pulses: Industrial Approach with Beam Engineering (M403) Eric Mottay, Amplitude Systemes

Aberration Control by High Na Focusing in Transparent Media (M404) Alexander Laskin, AdlOptica GmbH

Adaptive Optics for Intra-Volume Laser Engraving of Glass with Ultra-Short Laser Pulses (M405) Kevin Gaudfrin, ALPhANOV

Ablation Rate Dependence on Material Bandgap and Pulsed Time Delay for Ultrashort Pulsed Dual Wavelength Machining (M406) Tom Ward, Photon Factory, The Univ. of Auckland

LMF Session 5: Beam Shaping for MicroprocessingWednesday, October 25 | 9:00amSession Chair: Robert Braunschweig, LASEA, El Cajon, CA, USA

Multi-Dimensional Control and Optimization of Ultrafast Laser Material Processing (M501) Xiaoming Yu, Univ. of Central Florida

Programmable Spatial Beam Shaping for Femtosecond Lasers (M502) Eric Mottay, Amplitude Systemes

Beam Shaping for Efficient Femtosecond Laser Processing of Optical Glass (M503) Michael Seiler, Ernst-Abbe-Univ. of Applied Sciences

LMF Session 6: Micro-joiningWednesday, October 25 | 10:50amSession Chair: Alexander Olowinsky, Fraunhofer ILT, Aachen, Germany

Fluid Dynamical Simulation of High Speed Micro Welding (M601) Andreas Otto, TU Vienna

Quality Improvement of the Surface of Laser Micro Welds by using a Dual Beam Setup (M602) Sören Hollatz, Fraunhofer Institute for Laser Technology ILT

Laser Structuring as a Preparation for a Metal Plastic Joint (M603) Florian Kiefer, TRUMPF

Simulation of the Influence of Temperature-Dependent Material Parameters on the Temperature Evolution in Laser Micro-Spot Welding of Copper (M604) Manuel Mattern, Ruhr-Univ. Bochum

LMF Session 7: Microprocessing for Biological ApplicationsWednesday, October 25 | 3:00pmSession Chair: Claude Aguergaray, Univ. of Auckland, Auckland, New Zealand

Enhanced Laser Ablation of Bone Tissue using Ultrafast Pulsed Bessel Beams for Applications in Lassos (M701) Simon Ashforth, The Photon Factory, The Univ. of Auckland



A Parametric Investigation of Picosecond and Femtosecond Micromachining for Metals and Plastics used in the Medical Device Industry (M702) Geoff Shannon, Amada Miyachi America

Potential of Super Pulse Diode and Fiber Lasers for Treatment of Soft and Hard Tissues in Medical Applications (M704) Ilya Yaroslavsky, IPG Medical

LMF Session 8: Microprocessing of Hard MaterialsThursday, October 26 | 8:30amSession Chair: Emma Verdier, ALPhANOV, Bordeaux, France

Processing of Ultra-Hard Materials with Picosecond Pulses: from Research Work to Industrial Applications (M801) Valdemar Stankevi, ELAS, Ltd

193Nm High-Power Lasers For Drilling with High Aspect Ratio into Wide Bandgap Materials (M802) Koji Kakizaki, Gigaphoton Inc.

How do Defects Influence The Laser Ablation of Titanium Dioxide Nanotube Arrays? (M803) Rakesh Arul, Photon Factory, The Univ. of Auckland

Picosecond Laser Micro-Drilling, Engraving and Surface Texturing of Tungsten Carbide (M804) Xincai Wang, Singapore Institute of Manufacturing Technology, Agency for Science, Technology and Research (A*STAR)

A Study of Picosecond Laser Processing of Advanced Electronics Materials (M805) Robert Sposili, Spectra-Physics Lasers, MKS Instruments, Inc.

LMF Session 9: Measurements and ModelingThursday, October 26 | 10:40amSession Chair: Aravinda Kar, CREOL, The College of Optics & Photonics, Orlando, Florida, USA

Study on the Crystallization Mechanism of Amorphous Ge2Sb2Te5 Thin Films Induced by a Short Single Pulsed Laser (M901) Wenqiang Li, Beijing Univ. of Technology

3D Numerical Modeling of Short Pulsed Laser Micromachining Applications (M902) Zhibin Lin, Electro Scientific Industries

Analysis of TEA-Co2-Laser Induced Plasma to Establish a New Measurement Technique (M903) Tobias Czotscher, BIAS GmbH

Real-Time Focus Determination using Diffractive Beam Sampler and Double-Hole Mask (M904) Binh Cao, Univ. of Science and Technology


Nano Session 1: Femtosecond Laser Nanofabrication and ProcessingMonday, October 23 | 3:30pmSession Chair: Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, Nebraska, USA

Femtosecond Laser 3D Printing of Proteinaceous Micro and

Nanostructures (N101)

Koji Sugioka, RIKEN

Holographic Fabrication of Graded Photonic Super-Crystal with

Dual Symmetry, Dual Periodicity and Dual Basis (N102)

Yuankun Lin, Univ. of North Texas

Nano Session 2: Processing and Characterization at NanoscalesTuesday, October 24 | 8:30amSession Co-chairs: Alberto Pique, U.S. Naval Research Laboratory, Washington, D.C., USA; Koji Sugioka, RIKEN, Saitama, Japan

Effect of Shock Wave in Laser Nanomanufacturing and

Diagnostics (N201)

Xinwei Wang, Iowa State Univ.

Applications of Lasers in Open-Air Mass Spectrometry (N202)

Yun Shen Zhou, Jiangsu Weina Laser Application Technology

Research Institute

Laser-Based Synthesis, Processing, and Diagnostics of 2D

Materials and Heterostructures (N203)

Masoud Mahjouri-Samani, Auburn Univ.

Ultrafast Laser Induced Nanomaterial Growth, Assembly and

Structuring (N204)

Wei Xiong, Huazhong Univ. of Science and Technology

Laser Forward Transfer of Nano-Inks and Nano-Pastes (N205)

Alberto Pique, U.S. Naval Research Laboratory

Low Power Laser Cladding for Isotropic Material Properties (N207)

Jing Liu, Univ. of Liverpool

Nano Session 3: Laser Processing for PVWednesday, October 25 | 9:00amSession Chair: Anming Hu, Beijing Univ. of Technology, Beijing, People’s Republic of China

From Perc to Zebra: Lasers Pave the Way to Next-Generation

High Efficiency Solar Cells (N302)

Roland Mayerhofer, Coherent–Rofin

Laser Sintering of Al Nanoparticles for Al-Air Batteries (N303)

Yongchao Yu, Univ. of Tennessee

Conference Chair: Yongfeng Lu, Univ. of Nebraska–Lincoln, Lincoln, NE USA

The Nanomanufacturing Conference of ICALEO® presents nanomanufacturing papers relevant to

laser technologies. Much progress has been achieved in laser direct writing, laser nanomachining,

nanofabrication using ultrafast lasers, and laser-assisted growth and synthesis of nanomaterials and

nanoparticles. This conference will highlight research in emerging nanomanufacturing technologies

in 3-D micro/nanofabrication as well as laser synthesis and diagnostics of nanomaterial. This year, the

conference features a few special application topics on photovoltaics, battery materials, advanced energy

devices, spectroscopy, and imaging.

NANOMANUFACTURING CONFERENCE

Craig Arnold, Princeton Univ., Princeton, NJ, USA

Tommaso Baldacchini, Technology and Applications Center, Newport Corporation, Irvine, CA, USA

Nick Fang, MIT, Cambridge, MA, USA

Costas Grigoropoulos, Univ. of California–Berkeley, Berkeley, CA, USA

Changzhi Gu, The Institute of Physics, Chinese Academy of Sciences, Beijing, People’s Republic of China

Peter Herman, Univ. of Toronto, Toronto, Ontario, Canada

David Hwang, SUNY Stony Brook, Stony Brook, NY, USA

Yoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Japan

Sungho Jeong, Gwangju Institute of Science and Technology, Gwangju, South Korea

Lan Jiang, Beijing Institute of Technology, Beijing, People’s Republic of China

Udo Klotzbach, Fraunhofer Institute Material and Beam Technology, Dresden, Germany

Yuankun Lin, Univ. of North Texas, Denton, TX, USA

Etsuji Ohmura, Osaka Univ., Suita, Osaka, Japan

Xinwei Wang, Iowa State Univ., Ames, IA, USA

Xianfan Xu, Purdue Univ., West Lafayette, IN, USA

Yunshen Zhou, Univ. of Nebraska–Lincoln, Lincoln, NE, USA

Program Committee


NANOMANUFACTURING CONFERENCE

Nano Session 4: Laser Micro- and NanoengineeringWednesday, October 25 | 10:50amSession Chair: Yunshen Zhou, Univ. of Nebraska-Lincoln, Lincoln, Nebraska, USA

Laser Materials Processing in the Liquid Phase: Energy and

Environmental Applications (N401)

Giuseppe Compagnini, Univ. of Catania

Laser Based Micro Fabrication Systems and its Applications in

Advanced Packaging (N402)

Haibin Zhang, ESI

The Magic Nanostructure Functions Enabled by Ultrafast Laser

(N403)

Minlin Zhong, Tsinghua Univ.

Three-Dimensional Micro/Nano-Structured Mn/Mno2 Integrated

Electrodes for Electrochemical Supercapacitors (N404)

Mengya Cui, Beijing Univ. of Technology

Nano Session 5: Li-ion BatteriesWednesday, October 25 | 3:00pmSession Chair: Craig Arnold, Princeton Univ., Princeton, New Jersey, USA

State-Of-The-Art and New Approaches in Manufacturing of 3D

Lithium Ion Batteries (N501)

Stefania Ferrari, Univ. of Warwick

Ultrafast Laser Ablation 3D Chemical Imaging of Li-Ion

Batteries (N502)

Vassilia Zorba, Lawrence Berkeley National Laboratory

Design Concepts for Electrode Battery Materials and their Impact

on Lithium Distribution at Different State-Of-Health (N503)

Wilhelm Pfleging, Karlsruhe Institute of Technology (KIT)

Galvanostatic and Impedance Analysis of Silicon-Based 3D

Electrodes for High Energy Lithium-Ion Batteries (N504)

Yijing Zheng, Karlsruhe Institute of Technology

Nano Session 6: SupercapacitorsThursday, October 26 | 8:30amSession Chair: Wilhelm Pfleging, Karlsruhe Institute of Technology, Eggenstein-Leopoldshafen, Germany

Laser Direct Writing of Carbon-Based Micro-Supercapacitors

and Electronic Devices (N602)

Jinguang Cai, Institute of Materials, China Academy of

Engineering Physics

High Performance All-Solid-State Supercapacitors Based on

Hybrid Laser-Induced Porous Carbon (N603)

Anming Hu, Univ. of Tennessee

Laser Direct Writing of Reduced Graphene Oxide

Microelectrodes and the Device Application (N604)

Akira Watanabe, Tohoku Univ.

Nano Session 7: Laser Innovative ProcessingThursday, October 26 | 10:40amSession Chair: Guiseppe Compagnini, Univ. of Catania, Catania, Italy

Laser Micro Welding – a Suitable Technology for Assembling of

Lithium-Ion Batteries? (N701)

Andreas Patschger, Ernst-Abbe-Univ. of Applied Sciences

Enhancement of Performance of Interference Nano-Patterning

Techniques by Beam Shaping Optics (N703)

Alexander Laskin, AdlOptica GmbH


Tuesday, October 24 & Wednesday, October 25This longstanding ICALEO showcase draws a crowd and inspires plenty of discussion. Join presenters Wednesday morning for a spirited dialogue over breakfast. Presenters will greet interested attendees and answer questions at their posters. Poster presentations that submit a manuscript will be included in the ICALEO Proceedings.

A Flash Poster Session to be held on Tuesday will include 3-minute / 3-slide oral presentations by select poster presenters. Join in this speed session as presenters key in on specific points of their work.

POSTER PRESENTATION GALLERY

Laser Welding Copper with a High Power Cw Blue Laser (P101) Mathew Finuf, Nuburu Inc

Filament-Induced Picosecond Laser Machining of Sapphire with Zero Taper (P102) Lingfei Ji, Beijing Univ. of Technology

Effects of Pulse Parameters on Porosity Rate and Flow Characteristics of Molten Pool in Pulsed Laser Welding (P103) Xianfeng Shen, Institute of Machinery Manufacturing Technology, China Academy of Engineering Physics

A Photo-Excited Carrier Integrated Semiconductor Model to Predict the Non-Equilibrium Thermal Transport in Ge2Sb2Te5 Thin Films Under the Ultrafast Pulsed Laser (P105) Yinghao Wang, Beijing Univ. of Technology

Control of Temperature Fields and Melt Formation in Laser Transmission Welding Using Adapted Laser Wavelengths (P106) Andreas Schkutow, Technische Hochshule Nürnberg Georg Simon Ohm

Optimization of Laser-Remote-Cutting of CFRP by Means of Variable Exposure Delay Times – Simulation and Validation (P107) Max Oberlander, Hamburg Univ. of Technology

Cellular Automaton Modeling for Dendritic Growth during Laser Beam Welding Solidification Process (P108) Shaoning Geng, Huazhong Univ. of Science & Technology

Simulation of an Efficient Particle Extraction for the Detection of Explosive Materials (P109) Arndt Hohnholz, Laser Zentrun Hannover e.V.

Comparison of Microstructure and Mechanical Properties of X45Nicrmo4 Steel and Wc/X45Nicrmo4 Composites Prepared by Selective Laser Melting (P110) Hongyu Chen, Nanjing Univ. of Aeronautics and Astronautics

Study of Crack Formation in Micro Laser Welding of Al Alloy Sheets (P111) Hui-Chi Chen, Singapore Institute of Manufacturing Technology

Effect of External Magnetic Field on Solute Distribution and Molten Pool Flow Characteristics during Laser-Mig Hybrid Welding (P112) Rong Chen, School of Mechanical Science and Engineering, Huazhong Univ. of Science and Technology

Correlations of Real Weld Geometry with Microstructure and Joint Property in High Power Laser Welding (P113) Sang Liu, Huazhong Univ. of Science and Technology

Effect of Process Parameters on Magnetron Laser Welding of Low Carbon Steel Sheets (P114) Chen Yue, Huazhong Univ. of Science & Technology-Wuhan

High Speed and High Aspect Ratio Laser Processing using a High-Power Single-Mode Continuous-Wave Fiber Laser with Galvano Scanner (P115) Shinya Ikoma, Fujikura Ltd.

Optimization of Carbon Fiber Reinforced Plastics (CFRP) Laser Machining (P116) Changkyoo Park, Korea Institute of Machinery and Materials, Busan, Republic of Korea

Stress Evolution of Multi-Pass Narrow Gap Laser Welding with Filler Wire of Eh36 Steel (P117) Lvjie Liang, Huazhong Univ. of Science and Technology

Localized Laser Dispersing of Titanium-Di-Boride with Pulsed Fiber Laser (P118) Kai Hilgenberg, BAM Federal Institute for Materials Research and Testing

Experimental Investigation on Temperature Distribution of Molten Pool for Copper with Blue Direct Diode Laser Cladding (P119) Masanori Sengoku, Joining and Welding Research Institute, Osaka Univ.

Influence of Surface Oxide on Mechanical Properties of Laser-Welded Hot-Press-Forming Steel With Strength of 1.8 Gpa (P120) Minjung Kang, Korea Institute of Industrial Technology

The Microstructure Evolution of Tungsten Alloy by Laser Solid Forming (P121) Haiou Yang, The Northwestern Polytechnical Univ.

High Accuracy Positioning Control for Galvanometric Laser Scanning System in Materials Processing (P123) Jun Xie, Huazhong Univ. of Science and Technology

Coherent Beam Combining for High Power Spatial Phase Modulation (P124) Jiho Han, Univ. of Cambridge



The Effect of Pulse Width on Multi Burst Mode Ultrashort Pulse Laser Ablation (P125) Sanghoon Ahn, Korea Institue of Machinery and Materials

Effect of Ultra-Sonic Peening on Laser-Arc Hybrid Welded Nv E690 Steel (P126) Guifang Sun, Southeast Univ.

Study on High-Power Fiber Laser Spot Three-Dimensional Vibration Welding of Aluminum Alloy (P127) Qiang Wu, Beijing Univ. of Technology

Increase of Material Laser Processing Speed using Acousto-Optical Deflectors (P128) Benjamin Barbrel, ALPhANOV

Metal Powder Bed Fusion Additive Manufacturing with 100W Blue Diode Laser (P130) Shin-ichiro Masuno, Osaka Univ.

Energy Input of a Laser Micro Welding Process by Using Spatial Power Modulation (P131) Andre Haeusler, Chair for Laser Technology RWTH Aachen Univ.

The Latest Developments in Implementing Active Laser Guarding Systems (P133) Paul Tozer, Lasermet

Comparison of Nanosecond and Femtosecond Laser Micromachining of Low Density Inorganic Materials (P134) Remy Bourdenet, CEA

Hybrid Joining of Polymers with Difficult to Process Metal Substrates for Diverse Applications (P135) Robert Braunschweig, LASEA, Inc.

Single Pass Laser Cold-Wire Welding of Thick Section Aa6061-T6 Aluminum Alloy (P136) Fatemeh Mirakhorli, National Research Council Canada – Aluminium Technology Centre

Effect of Process Parameters on the Developed Residual Stresses in Laser Processed Steel Component (P137) Stephen Akinlabi, Univ. of Johannesburg

The Influence of Magnetic Field on Hybrid Laser Arc Welding (P138) Chunming Wang, Huazhong Univ. of Science and Technology

Optimal Design for Dual Laser Beam Butt Welding Process Parameter using Artificial Neural Networks and Genetic Algorithm for Sus316L Austenitic Stainless Steel (P139) Gaoyang Mi, Huazhong Unversity of Science and Technology

Effect of Heat Treatment on Morphology Evolution of Phase of Laser Additive Manufactured K465 Nickel-Based Superalloy (P140) Qiuge Li, Northwestern Polytechnical Univ.

Numerical Study Of Niti Laser Welding Process (P141) Mehrshad Mehrpouya, Sapienza Univ. of Rome

Effect of Laser Wavelength from Blue to IR on Pure Copper Film Formation by Laser Cladding (P142) Ritsuko Higashino, Joining and Welding Research Institute, Osaka Univ.

Synchrotron X-Ray Diffraction Analysis in Additively Manufactured Niti Parts (P143) Mehrshad Mehrpouya, Sapienza Univ. of Rome

Mechanical and Material Porperties of Aluminium Alloy Welding Using Disk Laser (P145) Su-Jin Lee, Korea Institute of Machinery & Materials

Surface Optimization Using High Power Pulsed Disk Lasers (P146) Florian Kiefer, TRUMPF

Microstructure and Mechanical Properties of Dissimilar Laser Welded Dual Phase and Boron Steel Joints. (P147) Isiaka Aderibigbe, Tshwane Univ. of Technology

Super-Hydrophobicity of Casted Pdms Surfaces (P148) Claude Aguergaray, Photon Factory, The Univ. of Auckland

Enhancement of Laser Machining Resolution using the Two-Photon Absorption Effect (P149) Thomas Ward, Photon Factory, The Univ. of Auckland

Functionalised Polymers for More Efficient Nanosecond UV Laser Micromachining (P150) M. Cather Simpson, Photon Factory, The Univ. of Auckland

Laser Direct Writing Lithography for Rapid Fabrication on Non-Planar Surface (P151) Jun Ai, Huazhong Univ. of Science and Technology

Study on Laser Multi-Focus Separation Technology For Thick Kdp Crystal (P152) Peng Liu, Huazhong Univ. of Science and Technology

Joining 6 Mm Thick Dissimilar Steel/Al Alloy Butt Joints using Two Keyhole Laser-Mig Hybrid Welding Processes (P153) Li Cui, Beijing Univ. of Technology

Laser Size Reduction of Radioactively Contaminated Structures (P154) Ali Khan, TWI Ltd

A Real Time Monitoring Method of Atom Emission Spectroscopy Applied on Laser Surface Remelting Process of AiSi4140 Steel (P156) Siyu Wang, Univ. of Michigan

Manufacturing of Integrated Si Anode with Micro/Nanostructures for Lithium-Ion Batteries Based on Laser Technology (P157) Ting Huang, Beijing Univ. of Technology


Plasmonic-Enhanced Laser Sintering of Metal Nanowire Networks for Improved Performance in Organic Light Emitting Devices (P159) Craig Arnold, Princeton Univ.

Spectroscopic Diagnostics of Microstructure for Nickel-Based Superalloys during Laser-Aided Direct Metal Deposition (P160) Yichen Wang, Univ. of Michigan

DSS – Dynamic Spot Shaper: Applications in Laser Hardening (P161) M. Angeles Montealegre, Talens System- Etxe-Tar Group

Localized Boiling Induced Spatter in High Power Fiber Laser Welding of AiSi 304 Stainless Steel (P162) Renzhi Hu, Huazhong Univ. of Science and Technology

Superlens Focused Laser Electrospray Microprocessing of Nanoparticles (P165) Eduardo Castillo-Orozco, Univ. of Central Florida

Innovative Approaches to using Fiber Lasers for Welding and Bonding Different Material Types (P166) Tony Hoult, IPG Photonics

Short Wavelength Pyrometry by Photon Counting – Application for Temperature Measurement in Laser Oxygen Cutting (P168) Hamie Abbas, PIMM

High-Speed Laser Shock Peening of Al Alloys using a Fiber Laser (P169) Chenfei Zhang, Univ. of Nebraska-Lincoln

Local Heat Treatment of a Laser Build-Up (P170) Maritha Theron, Council for Scientific and Industrial Research

Microstructure, Tensile and Hardness Properties of Dissimilar Laser Welded Dual Phase and Boron Steel Joints (P172) Isiaka Aderibigbe, Tshwane Univ. of Technology

Versatile Yb:Yag Thin Disk Laser with Mixed Pulse Trains Opening New Fields of Applications (P173) Johannes Trbola, Dausinger + Giesen GmbH

SiCp/AlSi10Mg Composites Manufactured by Selective Laser Melting (P175) Gang Xue, Wuhan National Laboratory for Optoelectronics, Huazhong Univ. of Science and Technology

Femtosecond Micromachining of Complex Geometries for Bio-Medical Applications (P176) Robert Braunschweig, Lasea, Inc.

Control of Dilution and Distortion of Laser Deposited Build Up (P177) Nazmul Alam, CSIRO Manufacturing, Melbourne, Australia


On-site Registration TimesSun., October 22 ..............1:00pm – 5:00pm Mon., October 23 ............. 7:00am – 5:00pm Tue., October 24............... 7:30am – 5:00pm Wed., October 25 ............. 7:30am – 5:00pm Thu., October 26 ............ 7:30am – 12:00pm

Hotel AccommodationsSheraton® Atlanta Hotel165 Courtland Street Northeast Atlanta, GA 30303

Phone: +1.404.659.6500 Fax: +1.619.692.2337

Sheraton® Atlanta is located in the heart of downtown Atlanta, just minutes from the Georgia Dome, Phillips Arena, Turner Field and Georgia Aquarium. The hotel is surrounded by sensational dining, enviable attractions and vibrant nightlife.

Book your hotel reservations by phone or at www.icaleo.org/hotel. Please note the hotel reservation deadline is Saturday, October 7, 2017.

Special NeedsIf you have any special needs that we can address to make your participation more enjoyable, please contact LIA by phone: +1.407.380.1553 or email: [email protected].

TransportationTransit AuthorityThe Metropolitan Atlanta Rapid Transit Au-thority (MARTA) provides reloadable Breeze Cards for $1 and the desired fare or $2.50 per single ride. For additional information visit itsmarta.com or call +1.404.848.5000.

Rental CarsCall Avis Rental Car® at 1.800.331.1600 and mention AVIS Worldwide Discount (AWD) number J093783.

Average October Temperatures73°F / 23°C High | 60°F / 16°C Low

Full Conference RegistrationRegistration includes admission to all Receptions, Plenary Sessions,

Technical Sessions and the Awards Luncheon.

MembershipPayment received

by August 8August 9 –

September 5September 6 –

On-site**

Member $899 $969 $1,039

Non-Member $1,069† $1,139† $1,159†

Cooperating Society

$899 $969

Not available for Cooperating Society, Student or Retired LIA Member

Student* $599† $669†

* Full-time students only. Valid student ID is required to process registration. Student registration will not be accepted on-site; students must be pre-registered by September 5.

Retired LIA Member

$629 $699

One-Day Conference RegistrationRegistration includes admission to Technical Sessions and Receptions

on specific registration date only.




On-site**

Member $479 $519 $559

Non-Member $559† $599† $639†

Two-Day Conference RegistrationRegistration includes admission to Technical Sessions and Receptions

on specific registration dates only.




On-site**

Member $799 $869 $939

Non-Member $909† $979† $1,049†

†Your registration includes a free 6-month trial membership with LIA.**Purchase orders will not be accepted for on-site registration.

ICALEO® GENERAL INFORMATION

Conference RegistrationRegistration may be completed online at www.icaleo.org, or by downloading and mailing/faxing a PDF registration form from www.icaleo.org/registration-information. Full Conference, One-Day and Two-Day registrations include the ICALEO 2017 Proceedings.

Substitutions and CancellationsWe understand that circumstances may occur to prevent you from attending the conference. If you find that you are unable to attend ICALEO, you have several options:

1. Send a substitute. Substitutions may be made at any time—even on-site at the conference. (Please have the substitute bring your letter of confirmation to the registration desk)

2. Refund of monies. Requests for refunds must be made in writing and received on or before August 8.

There is a $125 processing fee applied to all refunds. All refunds will be processed after the conference. No refund requests will be accepted after August 8. Guest Tickets, Proceedings & LIA Membership Dues are all non-refundable.


ICALEO® 2017 CONFERENCE AGENDA*

Sunday, October 2211:30am LIA Board of Directors Meeting

1:00pm ICALEO Registration Desk Open

4:00pm Welcome Celebration

Monday, October 237:00am ICALEO Registration Desk Open

7:30am Appreciation Breakfast

8:00am Attendee Continental Breakfast

9:00am Opening Plenary Session

10:10am Morning Break

Lunch on own

1:30pm LMP 1: Sub Plenary

LMF 1: Sub Plenary

3:00pm Afternoon Break

3:30pm LMP 2: LAM

LMF 2: Laser Ablation for Microelectronics

LMF 10: Laser Processing of Textured

Surfaces and Micro-joints

Nano 1: Femtosecond Laser

Nanofabrication and Processing

5:00pm President’s Reception

Tuesday, October 247:30am ICALEO Registration Desk Open


Poster Presentation Gallery Open

8:30am LMP 4: Aluminum Welding

LMP 5: Cladding

LMF 3: Surface Structuring

Nano 2: Processing and Characterization

at Nanoscales


Lunch on own

1:30pm LMP 6: Cutting

LMP 7: Monitoring I

LMF 4: Microprocessing of Transparent Materials

Flash Poster Session

4:00pm Laser Industry Vendor Reception

& Tabletop Display

Wednesday, October 257:30am ICALEO Registration Desk Open

7:30am Attendee Breakfast & Poster

Presentation Gallery Q & A

9:00am LMP 8: Modeling Welding

LMP 9: LAM II

LMF 5: Beam Shaping for Microprocessing

Nano 3: Laser Processing for PV


10:50am LMP 10: Steel Welding

LMP 11: LAM III

LMF 6: Micro-joining

Nano 4: Laser Micro- and Nanoengineering

12:30pm LIA Annual Meeting & Awards Luncheon

3:00pm LMP 12: Modeling

LMP 13: LAM IV

LMF 7: Microprocessing for

Biological Applications

Nano 5: Li-ion Batteries

4:40pm Afternoon Break

Thursday, October 267:30am ICALEO Registration Desk Open


8:30am LMP 14: Surface Modification I

LMP 15: Welding of Dissimilar Materials I

LMF 8: Microprocessing of Hard Materials

Nano 6: Supercapacitors


10:40am LMP 16: Surface Modification II

LMP 17: Welding of Dissimilar Materials II

LMF 9: Measurements and Modeling

Nano 7: Laser Innovative Processing

Lunch on own

1:30pm Closing Plenary Session

3:30pm Farewell Break

*Program subject to minor changes


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Documents

OCTOBER 22–26, 2017 Sheraton Atlanta, GA USA...Applications of Lasers & Electro-Optics (ICALEO®), which this year returns to the hospitable city of Atlanta. We have worked hard