Company Presentation

the the bright side of light

The first LED manufacturer with production center entirely based in Europe!

Octa Light Bulgaria was established in 2010 as a research and manufacturing center for Light Emitting Diodes (LED) located in Bulgaria.

The company shareholders are Monbat AD - 51% and Octagon International EOOD - 49 %.

Octa Light has a state-of-the-art production site, including 4500 sq. m production area, laboratories, clean rooms and lighting-fixtures and retrofit lamps manufacturing areas.

The company posseses own patents and know-how, as a result of long year studies and experimental activities, now successfully applied in the manufacture of LEDs, lighting fixtures and complete lighting systems.

Octa Light is completely vertically integrated producer of:

Light Emitting Diodes for today’s wide range of lighting applications including: powerful high-brightness LED, last generation of low-power & high-power SMT LEDs, COB and LED modules;

OEM & ODM supply of LEDs, modules and components,

LED luminaires for all types of lighting applications – interior, exterior, industrial, street lighting.

LED retrofit lamps – bulbs and T8 tubes.

Lighting design, measurement, audits, comprehensive engineering solutions and installation.

The company offers Electronic s Manufacturing Services through its most modern production capacity for PCB Assembly.

Company Portfolio

Milestones – LED Production

High power High brightness LEDS RND activities

2015 2014 2013 2012 2011 2010

Facility startup - Die bonding, - wire bonding, - Encapsulation

modeling and lifetime test facilities

BULLSTAR LEDS LM80 certification

1W and 3W BULLSTAR LEDS full scale production -BST LEDs

Start of RND activities for SMD LED products

Full product range insertion start of SMD LEDs and mass production -X1M -X2M -X3M -X5M -X7M -MG -MC -TG -T

Start of RND activities on PLCC products

Full product range insertion of PLCC LEDs -5730 -5630 -3528 -5050 -RGB PLCC series

Factory production capacity expansion

RND on specialized Bullstar LEDs SERIES

Full product range insertion of specialized Bullstar LEDs -Ultra high efficiency BLV – 150 lm/W 3 W packages - AC Series Bullstar LEDS – direct 110V AC 60Hz - AC Series Bullstar – Direct 230 V AC 50Hz - UVA/UVB/UVC Bullstar LEDs - Infrared and Deep infrared Bullstar LED

R&D activities on > 200 lm/W LED packages

R&D activities on < 0.0004 USD/LM LEDs

SMD, PLCC and COB products LM80 certification

Start of RND activities on COB products

Implementation of innovative encapsulation technologies - Optic free LEDs - Innovative SMD LED

substrates - Innovative COB substrates - Laser technology

implementation

Full product range insertion of COB Products and mass production - C1F – 10W - C1R – 6 W - C2F – 25 W - C2R – 12 W - C3F – 50 W - C5F - 100 W - AC COBS

• Own production area, 4500 m2 main facility, 20 000 m2 total area

• 3 Shift continuous production backed-up facility installation:

• Own UPS system for all production area,

• Double compressed air capacity for production continuity even in case of maintenance

• 25 C +- 0.2 C controlled temperature environment for all production area

• In house Light measurement laboratory, Accelerated test equipment, electric measurement laboratory, SMD production, LED micro-packaging production, Modules assembly

• On site team of electrical, mechanical, optical, process and technology set-up engineers

• On site R&D and supply chain department

Production Site

Company Structure

CEO

Commercial

Dep. F&A Dep.

Lighting Engineering Dep.

Factory Godech,

Plant Manager

LEDs Dep. R&D Dep.

LED Lamps and Luminaires Dep.

Quality Manager

EMS /SMT/ Dep. Field Service Dep. (installments and

maintenance)

Manufacture of core lighting solution, Bullstar K2, SMD, PLCC, COB and Specialized LEDs.

Street, interior, industrial, decorative, specialized lighting products. OEM luminaire assembly services, Retrofit and retail product activities`.

Cutting Edge SMD assembly facility, 2013 Equipment grade, LED assembly activities, OEM electronic manufacturing services.

Production Capabilities – Preparation, Die Bonding and Wire Bonding

DIE

BO

ND

ING

WIR

E B

ON

DIN

G

SU

RF

AC

E P

RE

PA

RA

TIO

N

• In house plasma cleaning and surface treatment. • Bulk magazine cleaning, bettered Wire bond pull strengths and Die bond shear forces. • Improved material adhesion strength, optimized encapsulation process. • Standard process working capability of Leadframes – from 30x100 mm up to 60x154 mm for all

production sections

• Wafer handling capability – 4 inch, 6 inch, 8 inch • Die handling capability – 6x6 mil up to 80 x 80 mil • Automated wafer loading system for lower MTBA • Production capacity by October 2014 – 10000 UPH (die

dependent) • Production expansion from December 2014 – 30 000 UPH • IQC standard die placement accuracy – 30 microns +/- 2

degree @ 3 sigma, average for > 10 000 000 produced units • Full PR placement check up – wafer, pre-bond, post bond • Magazine to magazine buffer lot organization

• Standard Au wire bonding capability – from 0.8 to 2 mil • Leadframe handling capability – up to 60x154 mm • Standard Square, Q, and Penta Loop wire bonding capability • Standard bond to bond length capability – 8 mm • Production capacity by October 2014 – 20 000 bonds per hour • Production expansion from December 2014 – 40 000 bond per hour • ASM IHAWK software bond handling programming setup • Magazine to magazine buffer lot organization

CO

NF

OR

MA

L

CO

AT

ING

M

ICR

O C

OA

TIN

G

Production Capabilities – Wavelength Conversion and Encapsulation

• Highly dry-parts loaded compounds microjetting capability • 0.6 % or +-0.01 µg weight dispensing precision in mass production, whichever

smaller • Workable dispense volume from 30 µg to 15g standard working capability per dot • Production capacity – 40 000 jets/hour (volume dependent) • Improved Material adhesion strength, optimized encapsulation process • Standard process working capability of Leadframes – from 30x100 mm up to 60x154

mm for all production sections

GL

OB

E

NC

AP

SU

LA

TIO

N

• Proprietary technology for large area conformal coating

• Unique production process applicable for flip chip and top wire bonded Units on proprietary substrates

• Extreme easiness on phosphor placement, precise binning control and low color shift on final products

• Process independent from luminophore particle sizing and type

• Third generation precision glob top dispensing technology in hours, shutter controlled dispensing methods for higher accuracy compared to pure time-pressure dispensing method, permitting tight color bin controlling

• +/-1.2 % dispense weight process repeatability in mass production • Production capacity by October 2014 – 15 000 globs per hour, based

on 1 mg dispense volume • Extensive experience in handling varied concentrations, varied

viscosity and varied refraction index silicone materials

Production Capabilities – Encapsulation Lens Molding

• Unique in house mold encapsulation process – Complex injection/transfer molding technology , up to 80 Tons and 100 kg cm/2 injection pressure.

• Extensive experience in molding >1,4 and > 1.5 and > 1.55 Refraction index silicones, both Methyl and Phenyl types.

• Automated dispense module, constant process and incoming material quality • Temperature controlled material storage – constant temperature assuring

constant process parameters within a full production day. • Extensive material application knowledge on varied products from main market

suppliers . • Optimized molding process for high speed and low voids process. • Yield rate (based on internal acceptance criteria) - > 99.98 % • Molding cycle – from 1 to 8 minutes based on material setup and substrates

type. • Active mold area (substrate capability) - 128 mm x 300 mm (tool depending) • Lenses repeatability characteristics – 25 µm size error, 50 µm displacement

accuracy, 0.3 degree curvature error.

NEW R&D development (April 2014): FREE FORM LENSES FORMATION BY UNIQUE PROPRIETARY PROCESS OF LAYER TO LAYER ADDITION.

Production Capabilities – Singulation Technologies

• Leadframe handling capability up to 70 mm width • Three station punching technology for leaded type LEDs • Unique custom module for leadframe-input to tube-output handling • Production capacity – 1 cut per 2 seconds (leadframe based UPH) • Easy tool interchange • Orientation recognition system for refusal of bad oriented leadframes

AU

TO

MA

TIZ

ED

SIN

GU

LA

TIO

N

FO

R L

EA

DE

D T

YP

E L

ED

S

ULT

RA

-FIN

E L

AS

ER

C

UT

TE

CH

NO

LO

GY

• In-house Ultra high power UVB micro precision laser system

• CAD design to Product cutting in less than 10 minutes, no tooling required

• 25 micrometer cutting width with 5 micrometer displacement accuracy

• Able to cut through any material • USED in standard production for varied of purposes and

applications • Silicone micro structuring processes by Laser undergoing

under 2015 R&D projects

Optimized Production Organization and Handling

• Magazine to magazine line setup. • Buffer production organization based on technological production steps. • Large inventory of magazines for varied leadframe setups. • Speed matched production – possibility of additional shifts in case of larger time. • Requiring processes. • Protected substrates handling, no risk of substrate bending and Faraday case effect

for chips ESD protection.

OP

TIM

IZE

D H

AN

DL

ING

AN

D

PR

OD

UC

TIO

N O

RG

AN

IZA

TIO

N

• Single flow production organization – from material input to LEDs output

• Inline control points for production quality • Production site control points for material qualification • Low Humidity (<25%) and stabilized temperature

environment • Clean room Class 10 000 • Over pressured environment for containment of eventual

contaminants and particles.

Production Capabilities – Testing Technologies

• Unique customized equipment for High mix/low volume testing • FULL flux measurement on all test stations • SMD, Leaded, PLCC Testing kits • Three main test unit input methods:

- Bulk (PLCC/SMD) - Tube in (Leaded type LEDS) - WAFER pack (for Lens type SMD)

• Easy package interchange organization, less than 15 minutes kit conversion

• Constant testing monitoring for high accuracy of mass test results – proven < 3%

• Deviation of Lumen/W (Cumulative electrical and optical testing deviation)

• Standard capability for optical testing of CCT, PWL, X, Y, Z, DWL, CCT, FWHM, PURITY, U’, V’ CRI, Et, Ep, Iv, Fv, R1 – R9

• Standard capability for electrical testing : • Kelvin, Open/Short, Polarity, Vf1, Vf2, Vr, Ir, Leackage current • 100 % optical vision check of packaged ready units, including • Dimensional tolerance check-up, Testing capabilities by October 2014:

- 5000 UPH for PLCC and Lens free SMD type - 7000 UPH for Lens type SMD - 4000 UPH for Leaded Type LEDs

• Capacity rise expected by December 2014: + 300 % for PLCC type LEDs. • Accurate measurement capacities down to 0.1 nm and 0.1 µV

equipment.

Testing, Qualification, Measurement Laboratories

• Wide range of material testing capabilities: - High humidity / High temperature (LEDs/Materials) - High Temperature (LEDs) - Low/High storage temperature - Thermal cycling with powered DUT - Thermal shock -40 to +150C - Reflow cycling Up to 0.5 % of standard mass production volume utilized for destructive testing, including Die shear and Wire pull

• Full spectral / photometric measurement laboratory for calibration and RND activities.

• Angular distribution, Spectral power distribution, CSVA measurement for all production series.

• In-house equipped Black room for goniophotometer type A-ἀ and B-β measurements.

AG

ING

AN

D

MA

TE

RIA

L

QU

AL

IFIC

AT

ION

SP

EC

TR

O-

RA

DIO

ME

TR

IC

ME

AS

UR

EM

EN

TS

PLCC LED Production Range

Wide Range of PLCC packages for large industrial application sector: - Retrofit products - Industrial Lighting - Commercial lighting - T8 Tubes - LED bulbs - Stage lighting and color effects

Standard production range: - 5730 and 5630 Packages

- 0.5 W White, up to 160 lm/W - 0.5 W White high voltage 25 V 0.02 a - 0.5 W Red - 9.5 W Green - 0.5 W Amber - 0.5 Blue

- 3528 Packages - 0.1 W white, - 0.1 W Red, - 0.1 W Green - 0.1 W Amber - FULL ANSI White binning and ITE color compliant binning

- 5050 packages - 0.5 W 9 V white series - 0.5 W 3 V white series - 0.8 W Color series – common anode or open anode

SMD LED Production Range

Full application Range for SMD packages - X3M Package

- Standard white Range 1 W , up to 160 lm/W - Standard White range 3 W, up to 150 lm/W @ 700mA - Ultra high efficiency range > 180 lm/W @ 350mA - High voltage variants 50 V @ 20 mA - FULL ANSI White binning - High CRI up to 95 - Color Series Red, Green, White - Variable light output distribution angle - Unique Secondary optic free technology from 2015

- TG Series - Compact range of up to 1W SMD LEDs - Small footprint , wide distribution angle – 160 deg FWHM - Standard 0.5 W power range for White - Full ANSI white and ITE color binning - Variable light output distribution – molded and flat variants

for wider distribution - Unique optic free technology from 2015 - Standard Red, Green Blue colors available

BULLSTAR Production Range

Wide range of Robust K2 packages:

- BST – up to 3 W, white Series, up to 160 lm/W @ 350mA

- BLV – ultra high efficiency series, 2.8-2.85 Vf, up to 180 lm/W series at 3 W power

- High Voltage Bullstar – BHV series – 50 V @ 20mA single package LED, up to 3 W continuous operation

- AC Bullstar RANGE 120 V 60 Hz AC – power supply free package intended for direct AC application, up to 3 W continuous operation

- AC Bullstar range 230 V 50 Hz AC – power supply free package intended for direct AC, up to 3 W continuous operation

- Bullstar Color – Full CIE 1931 Diagram coverage - Green, from 510 to 540 nm peak - Blue, from 440 to 470 nm peak - Red, from 600 to 640 nm peak - Cyean, pink, Yellow, Violet

- Bullstar UV and IR series - Specialized packages for specific applications, available for UVA, UVB, UVC and IR ranges 820 nm to 900 nm peaks

Industry Highest thermal conductivity COBs: - Unique process technology for highest efficiency - Pure copper substrate - > 400mW/mK conductivity, special silver coating

process and circuitry creation - In-house interconnection freedom - Wide range of applications - Insertion, in 2015, of power supply Free pure Semiconductor COBs - Insertion in 2015 of Secondary optics free COBs , including direct Fresnel

lensing capability

- C1F – 10 W, full white ANSI binning - C2F – 25 W , full white ANSI binning, red, green and blue colors available - C3F – 50 W, full white ANSI binning, red, green and blue colors available - C5F – compact 100W (40x40 mm) full White color ANSI BINNING - C1R – improved output , concentrated light 10 W LED, up to 150 lm/W @

85 C - C2R – improved output, concentrated light 20 W LED, up to 150 lm/W @

85 C - C3R – improved output, concentrated light 40 W LED, up to 150 lm/W - C2F RGB Series – open cathode/anode series, 25 W multicolor package

(RGBW available also) - C3F RGB series – open cathode/anode series, 50 W multicolor package

(RGBW available also)

- New products in 2015:

- Direct 230 V AC 25-100 W COBs - 200 lm/W 25-50 W white COBs - Secondary optic free COBs - Special Spectrum COBs (for food and vegetable growth industry)

COB Production Range

Electronic Manufacturing Services /EMS/ Department

Advanced Manufacturing Engineering

Test and System Development

New Product Introduction Services

Low volume and high mix manufacturing

High Volume Manufacturing

Inter-sectorial production, Hybrid Micro packaging and SMD assembly technologies

Advanced equipment with a strong team expertise enabling to provide SMD solutions with different areas of application:

Lighting

Consumer electronics

Telecommunications

Automotive industry

Medical equipment, etc.

SMD Line Equipment

Lead and Lead Free SMD technology , enabled by cutting edge equipment from leading and highly reliable companies like ASM, DEK, Famecs , Heller and Mirtec.

Conveyorized line from Famecs Corporation, automatic width adjustments from one single touch panel for all the line.

Fully automated printer Horizon 03iX using Vector Guard stencil frame and Magnatec printing accessories, highest possible accuracy in the range of 50x46 cm working frame

ASM Siplace powered Assembly capacity, X2 equipment with two working gantries (MultiStar and TwinHead) for maximum accuracy and flexibility.

Workability of components varying from 01005 up to 200x200 mm and 3 kg weight

Cutting edge feeding technology, included tray holders for odd components assembly

11 Zones Reflow oven, powered by Heller 1809 MK III, nitrogen environment operation.

Quality control assured by Offline Automated vision inspection, powered by Mirtec MV-8VH.

Flexibility an Technical Capability

Surface Mount Assembly Through the use of modern, well-maintained surface

mount (SMT) assembly equipment line we consistently achieve high yields of quality final assembly SMT products.

40 000 CPH SMD assembly Capacity, 01005 to 200x200 components assembly

Offline programming station and statistical optimization of placement powered by SIPLACE

In-house wave solder Line for Through hole assembly, powered by Vitronics

Multiple measurement and quality assurance equipment

Experienced processing of SMT applications such as: Single-sided component populated boards; Double-sided component populated boards - solder

paste and glue; Single layer rugged/heavy construction; Multi-Layer complex and handling sensitive boards;; SMT and through-hole assembly mixed component

assemblies. BGA Placement Capability

Main SMD Assembly Capabilities

Solder paste and adhesive paste Stencil printing – DEK Horizon 03iX

Maximum print area : 508 by 508 mm Substrate handling size : from 50*40mm to

460*508 Substrate thickness: from 0.2 to 6 mm Process alignment capability 2Cpk@±20um 6-

sigma Cycle time : 12 seconds Including software DEK instinctive V9

The pick and place of anything - our Siplace workhorse

Placement speed by IPC value 40 000 cph Component spectrum from 01005 to 200x200mm Maximum width :600 mm Maximum lenght:540 mm Maximum thickness : 4.5 mm Placement accuracy ± 22um, ± 0.05° 3σ

Lead Free Reflow fellow – our Heller 1809 MK III Separated controllable 9 heating zones, with a total of 18 control modules (9 upper and 9 lower) + 2 cooling zones. To support the welding rely on nitrogen. Max. width/length of board:460*500mm Max. temperature : 350° C 12 separate zones control, with up to 150 C thermal

deviation zone-zone Controllable temperature ramp-up and down ranges Lead Free backed-up technology with ppm range

Oxygen free environment

The problem finder – our Mirtec MV-8VH Automated inspection line Robust machine equipped with Triple camera vision system (horizontal, vertical, and axial) for recognition of soldering quality of any type of odd components Max. width of board : 600mm High repeatability and accuracy Full SMD quality inspection capability – from shorts, to lack of paste, to

component parameters / name look ups, resistor values, tolerances, color identification, and both binary and gray scale check-ups

OCTALED Retail Portfolio

Octa Light produces own portfolio of LED lamps for the retail market under the brand name OCTALED: T8 LED tubes in 600mm, 1200mm and

1500mm length for replacement of fluorescent tubes.

E27 LED bulb in Basic and Pro series for direct replacement of 40W, 60W and 75W conventional bulbs.

E14 LED candle bulb for direct replacement of 25W and 40W conventional bulbs.

F01 LED series specially designed for refrigerators and coolers.

OCTALED products are highly efficient and can achieve between 50% to 85% reduction of energy consumption in comparison to conventional lamps.

OCTALED E27 are among the few LED lamps in the world with A++ Energy Efficiency Class, at market competitive prices.

LED Luminaires Portfolio

Octa Light produces own range of LED luminaries that cover wide variety of lighting application: Office and interior lighting Retail outlets and shopping areas lighting Accent lighting Industrial lighting Petrol stations Street lighting Architectural and landscape lighting

Highly efficient design for achieving maximum light

output and long lifespan.

Focused on energy efficiency.

Most luminaires are suitable for direct replacement of widely spread conventional lighting fixtures

Engineered Solutions

As a vertically integrated producer we fully control our design and production starting with the LED chip to the final product. Our complete LED lighting solutions provide optimal light distribution, uniformity of illuminance and long lifetime, achieving the highest industry standards for energy savings

Selecting the right LED source – system-engineered solution takes into consideration LED type color temperature (K), viewing angle and CRI (Color Rendering Index), as well as area of application – spot vs. area illumination.

Excellent thermal management for longer lifetime – by choosing the right mechanical construction of the product.

Selecting the best optical performance – LEDs are directional light sources. The use of reflectors, lenses and diffusers allows light to be directed according to the lighting application objective.

Lighting Projects

Argun, Chechnya – Exterior LED lighting of the biggest mosque in Europe. Innovative RGB LED modules.

Completed: 2014

DOMO hypermarket in in Vulcan Value Center shopping mall in Bucharest, Romania – Interior LED lighting. Completed: 2014

Tezze Municipality, Italy – Street lighting

Completed: 2013

Project Business – Key Projects

Bulgarian Telecommunication Company /VIVACOM/ – all new retail stores from 2014 – Interior retail LED lighting.

VIVACOM National Control Center, Sofia – Interior office LED lighting

Completed: 2014

KFC restaurants

Lavov Most restaurant – Interior retail LED lighting

Boyana Ring Road restaurant – Interior and exterior LED lighting

Completed: 2014

Retail Chain Zora, Ring Road Sofia – Complete interior LED lighting replacing conventional lighting equipment.

Completed: 2013

Project Business – Key Projects

Vimi Fasteners Spa, Italy – industrial LED lighting.

Completed: 2014

Mall City Center Sofia – LED lighting of covered parking area, Interior LED lighting

Completed: 2013

Petrol AD, Company head office building, Sofia – Interior office LED lighting

Completed: 2012

Quality Management

ISO 9001, ISO 14001, OHSAS 18001 certified by INTERTEK. All LED products completely comply to EU Regulations (Low Voltage Directive, Electromagnetic Compatibility

Directive, Restriction of Hazardous Substances Directive - RoHS) and respective product standards. Product certificates from EU accredited laboratory Fully equipped company laboratory for photometric tests and electrical and electromagnetic measurements. Specially dedicated quality management and R&D teams.

THANK YOU FOR YOUR ATTENTION!