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©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
NVIDIA Tesla P100 GPU with HBM2
2.5D & 3D Packaging – TSMC CoWoS – Samsung HBM2
Adv. Packaging report by Romain FRAUXAugust 2017 – Version 1
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 7
o 2.5D & 3D Packaging Market
o NVIDIA Company Profile
o NVIDIA Tesla P100 Characteristics
o Pascal GPU Supply Chain
o TSMC CoWoS
o Samsung HBM2
Physical Analysis 17
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o NVIDIA Tesla P100 Teardown
o Package
Views & Dimensions
Passives Assembly
o DRAM Die
View, Dimensions & Marking
µBumps & TSVs
o Package Cross-Section
Laminate & Frame Cross-Section
Interposer Cross-Section
GPU Cross-Section
HBM2 Stack Cross-Section
o Comparison with AMD Fury X including SK-Hynix HBM1
Manufacturing Process Flow 65o Global Overviewo GPU Process Description & Foundryo Interposer Process Flow & Foundryo HBM2 Stack Process Flow & Foundryo CoWoS Process Flow & Foundry
Cost Analysis 95o Synthesis of the cost analysiso Yields Explanation & Hypotheses
o GPU Front-End & Die Cost
o HBM2 Stack
Front-End Cost (DRAM + Logic)
TSV Manufacturing Cost
Micro-Bumping Manufacturing Cost
Dies Cost (DRAM + Logic)
HBM2 Stack Cost
o Interposer
TSV Manufacturing Cost
Wafer Cost
Interposer Cost
o Package Substrate Cost
o CoWoS Assembly Manufacturing Cost
o Final Component Cost
Estimated Price Analysis 126
o Manufacturer Financial Ratios
o Component Manufacturer Price
Company services 129
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• Targeted for High Performance Computing (HPC) and deep learning, the NVIDIA Tesla P100 is the world's first artificialintelligence supercomputing data center GPU. It uses various leading edge technologies, including 3D stacked memorywith 2.5D integration on a silicon interposer in a Chip-on-Wafer-on-Substrate (CoWoS) process.
• Improving memory performance threefold over the NVIDIA Maxwell architecture, the Tesla P100 accelerators areequipped with 12GB or 16GB of second generation high bandwidth memory (HBM2).
• HBM2 greatly increases memory capacity and bandwidth over first generation HBM1 technology. HBM1 was limited to1GB of memory per stack of four dynamic random access memory (DRAM) die with maximum capacity of 256MB and125GB/sec of bandwidth. That compares to 8GB of memory per stack of eight stacked DRAM die with maximumcapacity of 1GB and 180GB/sec bandwidth for HBM2.
• The single 55mm x 55mm 12-layer ball grid array (BGA) package of the NVIDIA Tesla P100 includes more than 3,500mm² of silicon area. Two industry leaders, TSMC and Samsung, had to come together to deliver this much silicon areain a package.
• TSMC is the main provider for the Tesla P100. Using its 2.5D CoWoS platform, it manufactures the GP100 GPU die,featuring a 16nm FinFET process and 15.3 billion transistors. It also produces a large silicon interposer on top of whichthe GPU is assembled at the wafer-level with its four HBM2 stacks.
• Samsung provides the HBM2 stacks. A 3D assembly process yields HBM2 stacks composed of four 1GB DRAM memorydies and one buffer die, connected with via-middle through-silicon vias and micro-bumps.
• The report includes a complete physical analysis of the packaging process, with details on all technical choicesregarding process, equipment and materials. Also, the complete manufacturing supply chain is described andmanufacturing costs are calculated.
• The report also compares the Tesla P100 with AMD’s Fury X, which uses HBM1 and 2.5D assembly, to explain theinterest in evolution through the HBM2 and CoWoS 2.5D platforms. Finally, it describes NVIDIA’s key module designand related process choices.
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
The reverse costing analysis is conducted in 3 phases:
Reverse Costing Methodology
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 5
Overview / Introduction
Company Profile & Supply Chain o 2.5D & 3D Packaging Marketo NVIDIA Profileo NVIDIA Tesla P100
Characteristicso Pascal GPU Supply Chaino TSMC CoWoSo Samsung HBM2
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
NVIDIA Telsa P100 Characteristics
NVIDIA Tesla P100 with Pascal GP100 GPU
Pascal architecture for data center
21 TeraFLOPS of FP16, 10 TeraFLOPS of FP32, and 5TeraFLOPS of FP64
Deep learning and HPC applications
Memory Bandwidth: 732 GB/s
Passive heat sink for cooling (bidirectional)
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
PACKAGE STRUCTURE:
• 3D Packaging: 5 stacked dies with TSV & µBumps (HBM stack).
• 2.5D Packaging: HBM stack and GPU stacked with µBumps on a silicon interposer holding TSV.
• Flip-chip BGA: silicon interposer flip-chipped to a 12-layers PCB substrate
Synthesis of the Physical Analysis
DRAM Die
DRAM Die
DRAM Die
DRAM Die
Logic Die
Interposer
PCB Substrate
GPU Die
TSV Diam. xµm Pitch xµm
µBumps Diam. xµm Pitch xµm
µBumps Diam. xµm Pitch xµm
Flip-chip Bump Diam. xµm Pitch xµm
BGA Bump Diam. xµm Pitch xmm
TSV Diam. xµm Pitch xµm
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Views & Dimensions
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Views & Dimensions
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Dies Size
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Laminate Substrate
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Interposer
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Graphic Card Teardowno Packageo Dies Sizeo DRAM Dieso Cross-Section - Substrateo Cross-Section – Interposero Cross-Section – GPUo Cross-Section – HBM Stacko Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – HBM2 Stack
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo GPU Processo GPU Wafer Fab Unito HBM Processo HBM Wafer Fab Unito Interposer Processo Interposer Wafer Fab Unito Final Assembly Processo Final Assembly Unit
Cost Analysis
Selling Price Analysis
About System Plus
HBM – TSV Process Flow (1/2)
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo Assembly Costo Component Cost
Selling Price Analysis
About System Plus
Main Steps of Economic Analysis
4
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo Assembly Costo Component Cost
Selling Price Analysis
About System Plus
GPU Wafer & Die Cost
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo Assembly Costo Component Cost
Selling Price Analysis
About System Plus
TSV Manufacturing Cost per process steps
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo Assembly Costo Component Cost
Selling Price Analysis
About System Plus
HBM2 Stack Cost
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso GPU Costo HBM Stack Costo Interposer Costo Assembly Costo Component Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 20
COMPANYSERVICES
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | NVIDIA Tesla P100 GPU with HBM2 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal
Contact
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