NSF -UCM -INTI -IADO -IPT - Home | School of …€“These single sheets have to be laminated together and fired in one step all. Multi Chip Module Bluetooth Interface (National)

NSF - UCM - INTI - IADO - IPT

PASI-PASEO The Pan-American Sensors for Environmental

Observatories (PASEO) Workshop.

Mário Ricardo Gongora-RubioInstitute for Technological Research (IPT- São Paulo - Brazil)

OUTLINE

Microtechnology a Powerful ToolLTCC Technology & ProcessingBasic Design Rules LTCC DevicesFabrication Techniques for Microfluidic DevicesMicrofluidic Devices Lab on a PackageConclusions




MICROTECHNOLOGY A POWERFUL TOOL

WHAT IS MICROTECHNOLOGY?

Is an outstanding strategy for miniaturization and integration where the same principles as inmicroelectronics, are applied to Mechanical, Acoustic, Optical, Magnetic, Thermal, Chemical or Biotechnical components and systems.

MICROTECHNOLOGY

MicroTechnology

Micro Fluidics MicroElectronics

Micro Magnetics

Micro chemistry

Micro Mechanics

Micro acoustics Micro Optics Micro Heat Exchange




LTCC TECHNOLOGY AND PROCESSING

CERAMIC INTERCONNECTION TECHNOLOGY

Source: Green Tape Application Group

PI-LTCC

COMPARISON OF HYBRID CERAMIC TECHNOLOGIES

Thick Film HTCCLTCCDisadvantages DisadvantagesAdvantages Advantages

- Multiple printing steps

- Multiple firings

- Thickness control of dielectric

- Limited layer count

- Low Conductivity Metals (W,Mo)

- Complex Process

- No printed resistors

- High Capital investment

- High conductivity metals (Au,Ag)

- Low Q Dielectrics

- Printed resistors

- Low processing temperature

- High print Resolution of condutors- Single firing- Good dielectric thickness control- Low surface roughness- Unlimited Layer count

Si TCE Match

WHAT IS LTCC ?

–LTCC was originally developed by Hughes and DuPont for Military Systems.

– The (LTCC) technology can be defined as a way to produce multilayercircuits with the help of single tapes, which are to be used to apply conductive, dielectric and / or resistive pastes on.

–These single sheets have to be laminated together and fired in one step all.

Multi Chip Module Bluetooth Interface (National)

LOW TEMPERATURE CO-FIRED CERAMICS (LTCC)

Glass-ceramic composite materialsThe ceramic filler is usually alumina, Al2O3

The usual composition also includes a glass frit and an organic binder (plasticizerand anti-flocculant)Called green tape before firing and sintering

LTCC-951 Composition

40%

45%

15%

Alumina

Glasses (Silicates)

Other Organics

Motorola

LTCC CERAMIC MICROSYSTEMS

Meso Meso

SystemSystem

ModuleModule

TECHNOLOGY VISION

ActuatorMicro

Fluidics

LTCC PROCESSING SCHEDULE

Source:Thales Microsonics

LTCC MANUFACTURING PROCESS (1)

Materials PreparationMaterials Preparation– LTCC Ceramic tape materials are

prepared by milling precise amounts of raw materials into a homogeneous slurry.

– This mixture is principally of ceramic/glass powders with controlled particle sizes with fluxes and small amounts of organic binders and solvents.

– This slurry is poured onto a carrier and then passed under a blade to produce a uniform strip of specific thickness.

– When dried, this strip becomes a ceramic-filled “Green ceramic tape” which is easily handled in rolls or sheets for unfired processing.

Ceramic Slurry

Doctor BladeHot Air

Mylar coil Green Ceramic coil

Base

Coil Movement System


Tape PreparationTape Preparation– Cutting tape – Pre-Conditioning in the furnace – Punching or burning registration

holes – Removing Mylar-tape

BlankingBlanking–A blanking die is used to create orientation marks and the final working dimension of the green sheets.


Via MachiningVia Machining– Using high-speed mechanical

punching with a matrix tool, Laser System, CNC or JVE.

Via FillingVia Filling– Performed using an thick film

screen printer with a stencil metal mask.

– Registration is performed using a vision system.


Paste PrintingPaste Printing– Resistor, conductor and

dielectrics deposits are performed using an automatic thick film screen printer with mesh screens.

CollatingCollating– All layers will be collated and

stacked with a special tool and will be fixed together to avoid misalignment.

– Can be performed using a vision system for alignment.


LaminatingLaminating– Accomplished using

uniaxial or isostaticlamination in a specially designed press.

– Typical cycle time is 10 minutes. The range of laminating pressure is from 200 to 300 bar.

PrePre--CuttingCutting– Laminates are pre-cut with

a hot blade, meeting the panel drawing specifications.


CoCo--FiringFiring–Made in a belt or special furnace at a peak temperature of 850°C and a dwell time of 15 minutes.

–The typical cycle time is 3 hours.

glass

Alumina

glass

Alumina

Sintering Model

850

350

Temperature (oC)

Time (min)

45 min

30 min

Ramp = 10oC/min

LTCC Temperature profile

Sintering Furnace


Dimensional Measurements Dimensional Measurements /Electrical Test:/Electrical Test:

– Panel and circuit size can be checked with automatic measurement vision system. Electrical resistance test is performed with an automatic system with probe card.

Final Inspection:Final Inspection:– Optical, Laser and acoustic

inspection techniques are performed on completed parts in accordance with the applicable standards.

PUNCHINGPUNCHINGCircular or square shapeSmallest size 0.004”(~100microns)Machining of curved features is difficultPartial depth machining cannot be done

CNC MILLINGCNC MILLINGSmallest size 0.005”(~125microns)Machining of curved features is easy Partial depth penetration facilitating shallow channels and thin membranesVacuum chuck holder or wet tape is used to fix tape

Vacuum chuck holder for CNC milling

Punched curve

CNC milled curve(two layered structure; the curved slot is in the top layer only)

MilledPunched Tool

Partial depth CNC milling

MECHANICAL MACHINING OF CERAMIC TAPES

CO2, IR and CO2, IR and NdNd--YagYag LaserLaserThermal machining process

ExcimerExcimer LaserLaserSmallest size: ~10 micronsNo thermal damage (adiabatic process)Machining of whole feature at once using maskPartial depth penetration facilitating shallow channels and thin membranesSchematic of the Laser machined hole Schematic of the Laser machined hole

SideView

TopView

ExcimerExcimer Laser machined sampleLaser machined sample(~ 40 micron holes, 20X) (~ 40 micron holes, 20X)

NdNd--YagYag Laser machined sampleLaser machined sample( ~150 micron wide channel, 20X)( ~150 micron wide channel, 20X)

Yag Yag Laser Laser Machined Machined ViaVia

LASER MACHINING OF CERAMIC TAPES

LAMINATION ISSUES-THERMO-COMPRESSION

The most used method to conjoin stacked green tapes. It takes place at temperatures up to 100ºC and at pressures up to 3000 PSI.

– For microfluidic applications, the uncontrolled mass flow, which occurs during the application of high pressure, avoids the formation of fine and complex three-dimensional structures, such as channels for mixers and chambers or cavities for chemical reactions.

Channel deformation due to the thermo-compression process.Hellebrand`s Model

COLD LOW PRESSURE TECHNIQUE

In this technique, there is temporary gluing step of two adjacent green tapes using adouble-faced adhesive tape. The process works under very low pressure and atroom temperature, which minimizes deformations. Although before the sintering process the tapes are separated by the adhesive tape and the interpenetration ofparticles cannot occur, the tapes are, indeed, conjoined together homogeneously after sintering. In CLPL the joining mechanism is controlled by the chemistry of the double-sided adhesive tape and by its changes of the consistency and rheological behavior during the heat treatment.According to Roosen, the conjoining mechanism occurs due to the polymer meltingat much higher temperatures than the pure binder system of the green tape.

CLPL after Roosen

LOW TEMPERATURE AND PRESSURE LTCC LAMINATION USING ORGANIC FLUIDS

For Microfluidic applications, the uncontrolled mass flow, which takes place during the application of high pressure of thermocompression method prevents the formation of fine structures and complex three dimensional structures, such as channels for mixers and chambers for chemical reactions.A novel technique developed to conjoin different vitro-ceramic LTCC green tapes, is based on the utilization of viscous organic fluids.

–This technique consists of the deposition of a thin layer of an organic fluid upon green ceramic tape surface, by any means, to get a temporary gluing until sintering process is done. This temporary gluing process is realized at room temperature and at very low pressure.

Ceramic Green Tape

Lamination

Sintering

Organic Fluid Deposition

Ceramic Green Tape

Lamination

Sintering

Organic Fluid Deposition

Carbon Tape (Paste) Applications in LTCC

Carbon Tapes are used to form in-situ channels and cavities inlaminated ceramic structures(LTCC, HTCC). Thermally fugitive Carbon Tapes burn out cleanly in air atmospheres and begin torapidly sublimate at 600oC.

–Prevents deformation during lamination and slumping during firing of ceramic parts

–• Does not expand or melt during firing – sublimates directly without causing stress on green parts

–• Leaves no ash or residue after burnout

–• Useful as a separating medium and thermally fugitive mask

–• Tapes can be laminated, punched,sliced, machined or laser cut

SACRIFICIAL VOLUME TECHNIQUE

i - Thick film dielectric line on SVMii - Thick film conductor line on SVMiii- Conductor-on-conductor vias with

center support that is dielectriciv - Sacrificial volume area surrounded

by open area for unfired tape bondingv - Conductor bridging SVM plug on

ceramic tape to form diaphragm on firing

vi - Thick film dielectric line crossingSVM layer to form bridge suspended above substrate and crossing SVMplug to form bridge across gap in tape layer

vii - Thick film conductor line crossingSVM layer to form bridge suspended above substrate and crossing SVM plug to form bridge across gap in tape layer

viii - SVM line on top of ceramic tapelayer and on top of SVM via fill to form fluidic channel when laminated toanother ceramic tape and fired

SVM MICROCHANNEL FORMING TECHNIQUE

Sacrificial volume technique is used to create microchannels during lamination by deformation of the unfired tape.

Sandia Labs

Some Applications

Sandia Laboratories




BASIC DESIGN RULES

LTCC WITH EMBBEDED PASSIVES

FEATURE LTCC TERMINOLOGY (CROSS SECTION)


FEATURE LTCC TERMINOLOGY (TOP VIEW)


DESIGN RULES (1) CONDUCTORS & RESISTORS


LTCC DESIGN RULES (2) VIAS


DESIGN RULES (3) THERMAL VIAS


DESIGN RULES (4) CAPACITORS & INDUCTORS

CapacitorsCapacitors

InductorsInductors


LTCC DESIGN RULES (5) CAVITIES


LTCC TOP LAYER & INNER LAYER CAVITIES




LTCC DEVICES

LTCC LOAD CELL

Applied Force

Metal Sphere

Piezoresistive Post

Upper Structure

Upper Structure Lower Structure

Operation for compressive forces offer direct force measurement and allow theuse of arrays for vectorial force decomposition, without mechanical translation.Force is applied through a metal sphere.Three posts at an angle of 120o to each other, connected to an upper structure,receive the decomposed force, each post sustain 1/3 of total applied force.

EXTERNAL ELECTRODES SENSOR IMPLEMENTATION

Applied ForceCavities

LTCC Metal contacts

Piezoresistive material Sacrifice material

L6

L5

L4

L3

L2

L1

EXTERNAL ELECTRODE SENSOR

Each post has a diameter of 950 µm and a 200 µm height.

Detail of 3D sensor using SPS, after removing upper sensor structure.

Detail of 3D sensor using SPS, after removing upper sensor structure.

LTCC FLOW SENSORS

A-A

Layer

Layer 2 Layer 3

Layer 4 Layer 5 Cross-section A-A

L1

L2

L3

L4

L5

Layer 1

Fabricated Device

0 1 2 3 420

25

30

35

40

45

50

Dissipation factor Vs. Flow velocity k = 18,79 + 31,03 * e(-vf / 1,66) for exponential regression

Diss

ipat

ion

Fact

or (W

att/K

elvin

)

Flow Velocity (SLM)

Experimental Set-Up

Device Lay-out

A-A

Layer

Layer 2 Layer 3

Layer 4 Layer 5 Cross-section A-A

L1

L2

L3

L4

L5

Layer 1

Fabricated Device

0 1 2 3 420

25

30

35

40

45

50

Dissipation factor Vs. Flow velocity k = 18,79 + 31,03 * e(-vf / 1,66) for exponential regression

Diss

ipat

ion

Fact

or (W

att/K

elvin

)

Flow Velocity (SLM)

Experimental Set-Up

Device Lay-out

Gas Inlet Tube(brass)

(∅i 2.5mm)

Microcolumns(500μm x 500μm)

Upper Electrode (AgPd)(10 x10 mm2 x 30μm)

ContactTerminal

Interelectrodespacer (250μm)

Lower Electrode (AgPd)(10 x10 mm2 x 30μm)

Microchannels(∅200μm x 500μm)

9LTCC Layers

MICROPLASMA GENERATOR

POST-FIRE PROCESS USING TRANSFER TAPES

Argon microplasma:3.8 Torr, 50 sccm, 6 mA

Oxygen microplasma:3.8 Torr, 100 sccm, 8 mA

Stable and uniform DC microplasma were obtained.

RESULTS

DEVICE APPLICATIONS

The fabricated device can be used for surface treatment applications, in this case we modify surface of a polyethylene (PE) film in order to render a hydrophylicsurface, changing the water contact angle of surface.

PE film treated by N2 microplasma at 14 Torr, 30 sccm and 10 mA (DC).

0

20

40

60

80

100

0 10 20 30 40 50 60

Time (s)

Wat

er c

onta

ct a

ngle

(deg

ree)

.

Untreated sample

LTCC HEAT EXCHANGER




FABRICATION TECHNIQUES FOR MICROFLUIDIC DEVICES

MICROFLUIDICS DIMENSIONS

LTCC MANIFOLDS FOR MICROFLUIDICS

MICROCHANNELS

Poiseuille equation relates linearly pressure drop with flow in reduced geometry channels.

A A

Corte A-A

A A

A A

1mm

In microchannels of minute dimensions Reynolds Number are very low, making difficult liquid mixing.

Microchannel corners can be used as mixers.

Channel machining using CNC with features of 200 micrometers are possible.

LTCC HOT EMBOSSING

Small features can be transferred to LTCC layers using Hot Embossing TechniqueSeveral Molds for complex structures have been constructedDevelopment of the technique is in progress

Hot Embossing Mold for Pre-Concentrator

LTCC STRUCTURES FOR MICROFILTERING

Need to integrate aMicrofiltering stage intoLTCC Microfluidic systemPossibility of create structures for Catalyticmaterial deposition for Fuel Cells or chemical reactionsPossibility of creating high area for biological seeds.

Ceramic Porous Membranes

LTCC

LTCC

LTCC

POROUS LTCC & THICK FILM

200 μm




MICROFLUIDIC DEVICES

SPECTRUM OF MICROFLUIDICS APPLICATIONS

Fluid management SystemsMicro Analytical SystemsMicro Reaction SystemsMicro Heat exchange systems

3D MICROMIXERS IN LTCC

3D Micromixers can be used to accomplish Chemical Reactions, and for generating micro and particles for drug delivery

10 mm

MEMBRANE EMULSIFICATION

CONTINUOUS PARTICLE SEPARATION

SPLIT FLOW THIN FRACTIONATION

CO-PRECIPITATION PROCESS

Vortex Mixer

Ultrasonic + Vortex Mixer Crystallization




LAB ON A PACKAGE

Source: Caliper

• separation• dilution• mixing and dispensing• analysis

LAB-ON-A-CHIP SYSTEMS

Can integrate functions as:

MICROFLUIDIC BIOCHIPS

Integrate all necessary functions for biochemical analysis into one chip using microfluidics technology. Continuous-flow microfluidics vs. digital microfluidics

(University of Michigan) 1998

(Duke University) 2002

Mixed dropletElectrical pad

Electrowettingelectrode

LED Mixing sample & reagent

Photodiode

LTCC APPLICATIONS FOR MICROFLUIDICS

Technical University of Dresden

MST APPLICATIONS: PCR IN CONTINUOUS FLOW

Integrated microfluidic devices for PCR amplification and detection of biological samples that employ closed-looptemperature monitoring and control have been demonstrated within a multilayer low temperature co-fired ceramics (LTCC)platform.

Motorola Labs

SERIAL DILUTION IN LTCC

Serial Dilution device

Buffer Solution Generator IN LTCC

Buffer Solution device

5a B 4a T1 3a

A 2a

1a

5b D 4b T2 3b C 2b 1b

LedFT

A/DSalidas digitalesPCL 812

Puerto serie

válvulas microchip

Ordenes y respuestas

LedFT

A/DDigital outputsPCL 812

Serial Port

válvulas

Control & Aquisition

Grupo de Sensores y Biosensores

Universidad Autónoma de Barcelona (GSB)

TOTAL ANALYSIS MICROSYSTEMS

CHLORIDE ION WITH POTENTIOMETRIC DETECTION

[Cl-] (ppm)

1 10 100 1000

Pea

k he

ight

(mV

)

0

20

40

60

80

100

120

140

Time (s)

0 20 40 60 80 100 120 140 160 180

Pote

ntia

l (m

V)

-260

-240

-220

-200

-180

-160

-140

-1205ppm

10ppm

20ppm

40ppm

50ppm

80ppm

100ppm

200ppm

250ppm

500ppm

DiskAg2S/AgCl

Cable

Sample Cl- (ppm)CE

Cl- (ppm)LTCC (n=3, 95%)

S1 12 16±2

S2 7 11.5±0.8

S3 14 17±2

S4 22.8 26±2

S5 33.2 31.2±0.8

S6 603 599±70

Paired t test tcal=1.065, ttab=2.571 tcal<ttab No

Linear regressionLTCC vs CE

Interception:3±3Slope:0.99±0.01 r2=0.9999

No


NITRITE ION ANALYZER WITH COLORIMETRIC DETECTION

2.2cm

2.6c

m

LTCC Device

OpticalWindow Imagen RX

Time (s)

0 20 40 60 80 100 120 140 160 180

Abso

rban

ce

-0,1

0,0

0,1

0,2

0,3

0,4

0,5

0,6

0.1ppm0.5ppm1ppm2ppm5ppm7ppm10ppm

[NO2-] (ppm)

0 2 4 6 8 10 12

AB

SOR

BAN

CIA

0.0

0.5

1.0

1.5

2.0

2.5

Q=5.83µl/svolumen muestra y reactivo=29µlRango 0.1-10ppmr2=0.9959

Abs=-3.31·10-3+0.048·[NITRITO]

Grupo de Sensores y Biosensores

Universidad Autónoma de Barcelona (GSB)


Thanks for Thanks for your attention !your attention !

Micro Electronics

Pentium 4-–Top speed – 3.4ghz–Built on a 0.13 micron die

–168 million transistors on 200mm2

Micro - Optics

Ability to drill to ½ micron for half the wavelengthMicromirrors for next generation telescope optics

Micromirrors

Microlens Arrays

Micro - Chemical

Miniature fuel cellsMicro channelsChemical reactors

50 Micron Chemical Reactor

Micro Chemical Channel

Micro Fuel Cell

Microcytometer

Micro Acoustics

ultrasonic Mixer / piezoelectric vibrations (actuated membrane)

Principle:- traveling waves (produced by complex integrated structures)- mixing of aqueous / non-aqueous

Important components:

- Micro channel

- Electrokinetic (EK) pumps

Closed loop system

Two-phase system

Impinging cooling

Microchannel Heat Exchanger

Micro Magnetics

Biosampling and Immunoassay procedure using magnetic bead approach

Micro Mechanics

World’s smallest steam engine, the pistons are 5 microns

and it actually works

Micro Clutch mechanism, gears are 50 microns

Microfluidics

Capillary uptakePiezoelectric inkjetsFlow sensingDrug dispensingFlow based separation

Print Cartridges

Lab-On-Chip for DNADetection and Analysis

Micro Channels

• Molecules with largediffusion coefficientscan be extracted fromthose with small diffusion coefficients.

Documents

NSF -UCM -INTI -IADO -IPT - Home | School of …€“These single sheets have to be laminated together and fired in one step all. Multi Chip Module Bluetooth Interface (National)