Nondestructive Evaluation 2019 CALL FOR PAPERSspie.org/Documents/ConferencesExhibitions/SSN19-Call-L.pdf · Nondestructive Evaluation 2019 The leading event for advanced materials,

2019Smart Structures + Nondestructive Evaluation

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www.spie.org/SSNcall

CALL FORPAPERS

Submit abstracts by 22 August 2018

3–7 March 2019Embassy Suites by Hilton DenverDenver, Colorado

Present your work at Smart Structures + Nondestructive Evaluation 2019The leading event for advanced materials, sensor systems, and structural health monitoring.

Technologies• Nondestructive Characterization

and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation

• Health Monitoring of Structural and Biological Systems

• Smart Materials and Nondestructive Evaluation for Energy Systems

• Smart Structures and NDE for Industry 4.0


Conferences and Course 3–7 March 2019

Embassy Suites by Hilton Denver Denver, Colorado, USA


• Bioinspiration, Biomimetics, and Bioreplication

• Electroactive Polymer Actuators and Devices

• Active and Passive Smart Structures and Integrated Systems

• Behavior and Mechanics of Multifunctional Materials

• Nano-, Bio-, Info-Tech Sensors and 3D Systems

• Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

Symposium Chairs:

The Organizing Committee of SPIE’s 26th Annual International Symposium on Smart Structures and Material Systems + Nondestructive Evaluation invites you to attend this year’s meeting. This unique symposium offers many opportunities to network with colleagues from a variety of disciplines in academia, industry, and government from all over the world.

Organized in ten parallel conferences, SS/NDE brings together emerging technologies and advanced research in instrumentation, sensing, and measurement science with advanced materials, diagnostics, and smart systems. Engineers and researchers from government, military, academia and the commercial sector will discuss the current status and future directions of smart structures and materials, NDE, and health monitoring. Case studies, emerging research agendas, and innovative new technologies will be presented.

The Symposium covers all aspects of the evolving fields of materials, enabling technologies, sensor/actuator design, and applications of these technologies to cover the whole spectrum of life in the 21st century, including commercial, medical, aerospace, and military fields. It also includes several conferences on NDE and structural health monitoring, safety, security, characterization of materials, detection of materials defects and degradation, evaluation of the state of damage enabling reliable component failure prediction, application of micro- and nanomaterial systems, energy systems and infrastructure.

This meeting is a showcase for multidisciplinary research and provides an excellent opportunity to explore new research areas by teaming with new partners from many fields. We look forward to seeing you in Denver!

Plan to Participate

Symposium Co-Chairs:

Tribikram KunduThe Univ. of Arizona (USA)

Zoubeida OunaiesThe Pennsylvania State Univ. (USA)

Gregory W. ReichAir Force Research Lab. (USA)

Hoon SohnKAIST (Republic of Korea)

2 SPIE SMART STRUCTURES + NONDESTRUCTIVE EVALUATION 2019 • www.spie.org/ssncall

Advanced technologies for nondestructive evaluation, structural health monitoring, smart materials, and engineered biorobotics

EXECUTIVE ORGANIZING COMMITTEEIain A. Anderson, The Univ. of Auckland (New Zealand)

Yoseph Bar-Cohen, Jet Propulsion Lab. (USA)

Dan J. Clingman, Boeing Research and Technology (USA)

Alper Erturk, Georgia Institute of Technology (USA)

Paul Fromme, Univ. College London (United Kingdom)

Kerrie Gath, Ford Motor Co. (USA)

Andrew L. Gyekenyesi, Ohio Aerospace Institute (USA)

Jae-Hung Han, KAIST (Korea, Republic of)

Ryan L. Harne, The Ohio State Univ. (USA)

Nancy L. Johnson, General Motors Co. (USA)

Ajit Khosla, Concordia Univ. (Canada)

Jaehwan Kim, Inha Univ. (Korea, Republic of)

Mato Knez, CIC nanoGUNE Consolider (Spain)

Akhlesh Lakhtakia, The Pennsylvania State Univ. (USA)

Jerome P. Lynch, Univ. of Michigan (USA)

Raúl J. Martín-Palma, Univ. Autónoma de Madrid (Spain)

Theodoros E. Matikas, Univ. of Ioannina (Greece)

Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA)

Hani E. Naguib, Univ. of Toronto (Canada)

Christopher Niezrecki, Univ. of Massachusetts Lowell (USA)

Ilkwon Oh, KAIST (Korea, Republic of)

Kara J. Peters, North Carolina State Univ. (USA)

Peter J. Shull, The Pennsylvania State Univ. (USA)

Hoon Sohn, KAIST (Korea, Republic of)

Kyo D. Song, Norfolk State Univ. (USA)

Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China)

Kon-Well Wang, Univ. of Michigan (USA)

Aimy Wissa, Univ. of Illinois at Urbana-Champaign Chapter (USA)

H. Felix Wu, U.S. Dept. of Energy (USA)

Tzu-Yang Yu, Univ. of Massachusetts Lowell (USA)

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SSN01 Bioinspiration, Biomimetics, and Bioreplication IX (Martín-Palma) . . . 4

SSN02 Electroactive Polymer Actuators and Devices (EAPAD) XXI (Bar-Cohen) . . . . . . . . . . . . . . . . . . . . . 5

SSN03 Active and Passive Smart Structures and Integrated Systems XIII (Erturk) . . . . . . . . . . . . . . . . . . . . . 6

SSN04 Behavior and Mechanics of Multifunctional Materials XIII (Naguib) . . . . . . . . . . . . . . . . . . . . . . . . 7

SSN05 Nano-, Bio-, Info-Tech Sensors and 3D Systems (Kim) . . . . . . . . . . . . 8

SSN06 Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems (Lynch) . . 10

SSN07 Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII (Gyekenyesi) . . .12

SSN08 Health Monitoring of Structural and Biological Systems XIII (Fromme) .13

SSN09 Smart Materials and Nondestructive Evaluation for Energy Systems V (Niezrecki) . . . . . . . . . . . . . . . . . . . . . .14

SSN10 Smart Structures and NDE for Industry 4.0 (Meyendorf) . . . . . . . . .16

EAP Demo Session . . . . . . . . . . . . . . . . . . . . . . .17General Information . . . . . . . . . . . . . . . . . . . . . .18Submission of Abstracts . . . . . . . . . . . . . . . . . .19

Contents

Submit abstracts by 22 August 2018www.spie.org/ssncall


SMART STRUCTURES + NONDESTRUCTIVE EVALUATION 2019

Submit your abstract today: www.spie.org/ssncall

Bioinspiration, Biomimetics, and Bioreplication IX (SSN01)Conference Chair: Raúl J. Martín-Palma, Univ. Autónoma de Madrid (Spain)

Conference Co-Chairs: Mato Knez, CIC nanoGUNE Consolider (Spain); Akhlesh Lakhtakia, The Pennsylvania State Univ. (USA)

Program Committee: Javaan S. Chahl, Univ. of South Australia (Australia); Vincenzo Fiumara, Univ. degli Studi della Basilicata (Italy); Laurent A. Francis, Univ. Catholique de Louvain (Belgium); Olaf Karthaus, Chitose Institute of Science and Technology (Japan); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Mathias Kolle, Massachusetts Institute of Technology (USA); Bert Müller, Basel Univ. (Switzerland); Maurizio Porfiri, NYU Tandon School of Engineering (USA); Akira Saito, Osaka Univ. (Japan); Cordt Zollfrank, Technische Univ. München (Germany)

Sponsored by

Engineered biomimicry, comprising bioinspiration, biomimetics, and bioreplication, takes ideas and concepts from nature to implement them in different fields of science and technology, ranging from en-gineering to computing, aiming at the development of novel devices with tailored functionalities. This rapidly evolving field, given the broad technological advances which allow approaching the sophistica-tion of biological systems, is highly multidisciplinary in nature. As such, it embraces aspects related to physics, chemistry, biology, materials science, nan-otechnology, neuroscience, mechanical properties, computing and control, design integration, optimi-zation, multifunctionality, multicontrollability, and cost effectiveness.

The ninth edition of this conference welcomes con-tributions from industry, academia, and government research organizations. Topics of interest cover any relevant aspects of engineered biomimicry, from theoretical considerations, production, and charac-terization to practical applications.

Topics include, but are not limited to: • fundamental processes (aerodynamics,

adhesion, superhydrophobicity and self-cleaning, nano and microfluidics, structural colors, rheology, photonics, locomotion, visual systems)

• materials (biomaterials, composites, high-strength membranes, ultralightweight structures)

• detection/sensor systems (electronic noses and tongues, photonic devices)

• devices (multifunctional devices, miniature devices, neuromorphic devices and systems, polarizers)

• applications (robotics, architecture, biomedical and pharmaceutical applications, marine applications, communications and informatics, functional/decorative coatings)

• energy and resource efficiency • biobeneficial bioinspiration.

The conference will include several invited talks, contributed talks, and posters.

The Bioinspiration, Biomimetics, and Bioreplication IX conference chairs will choose the Best Student Paper Award from their conference. This award is sponsored by the Optical Society of Southern Cali-fornia. A cash prize will be given to the first, second, and third place winners.


CALL FOR PAPERS

Electroactive Polymer Actuators and Devices (EAPAD) XXI (SSN02)Conference Chair: Yoseph Bar-Cohen, Jet Propulsion Lab. (USA)

Conference Co-Chairs: Iain A. Anderson, The Univ. of Auckland (New Zealand); Nancy L. Johnson, General Motors Co. (USA)

Program Committee: Barbar J. Akle, Lebanese American Univ. (Lebanon); Kinji Asaka, National Institute of Advanced Industrial Science and Technology (Japan); Pavol Bauer, Technische Univ. Delft (Netherlands); Siegfried G. Bauer, Johannes Kepler Univ. Linz (Austria); Ray H. Baughman, The Univ. of Texas at Dallas (USA); Václav Bouda, Czech Technical Univ. in Prague (Czech Republic); Federico Carpi, Univ. degli Studi di Firenze (Italy); Suresh Chandra, Institute of Technology, Banaras Hindu Univ. (India); Hyouk Ryeol Choi, Sungkyunkwan Univ. (Korea, Republic of); Gal deBotton, Ben-Gurion Univ. of the Negev (Israel); Toribio Fernández Otero, Univ. Politécnica de Cartagena (Spain); Yahya A. Ismail, A'Shargiyah Univ. (Oman); Edwin W. H. Jager, Linköping Univ. (Sweden); Giedrius Janusas, Kaunas Univ. of Technology (Lithuania); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Gabor M. Kovacs, EMPA (Switzerland); Maarja Kruusmaa, Univ. of Tartu (Estonia); Jinsong Leng, Harbin Institute of Technology (China); John D. W. Madden, The Univ. of British Columbia (Canada); Qibing Pei, Univ. of California, Los Angeles (USA); Thelge Chaminda Peiris, MAS Innovation Ltd. (Sri Lanka); Valentin Radu, Omicron Plus S.R.L. (Romania); Mehdi Razzaghi-Kashani, Tarbiat Modares Univ. (Iran, Islamic Republic of); Jonathan M. Rossiter, Univ. of Bristol (United Kingdom); Anuvat Sirivat, Chulalongkorn Univ. (Thailand); Anne Ladegaard Skov, Technical Univ. of Denmark (Denmark); Geoffrey M. Spinks, Univ. of Wollongong (Australia); Ji Su, NASA Langley Research Ctr. (USA); Minoru Taya, Univ. of Washington (USA); I-Hsiang Tseng, Feng Chia Univ. (Taiwan); Rocco Vertechy, Univ. degli Studi di Bologna (Italy); Frédéric Vidal, Univ. de Cergy-Pontoise (France); Thomas Wallmersperger, Technische Univ. Dresden (Germany); Qiming M. Zhang, The Pennsylvania State Univ. (USA); Jian Zhu, National Univ. of Singapore (Singapore); Pawel Zylka, Wroclaw Univ. of Technology (Poland)

EAP materials have unique characteristics that are enabling many new technologies. Their character-istics include the ability to undergo larger displace-ments than almost any other class of smart materi-als, the pliability needed for biomimetic and other mechanically flexible systems, and low density. Of particular interest is their potential to augment, im-prove upon, and possibly replace biological muscles. Besides their attractive characteristics as actuators, they are also being exploited to enable new types of generators or sensors. Development of effective and robust mechanisms and devices that are actu-ated by EAP materials requires improved theoretical and empirical understanding of their behavior, de-sign concepts for efficient actuation, generation and sensing, and reliable and repeatable fabrication and characterization methods, as well as effective con-trol algorithms and electronics. The objective of this conference is to identify EAP material improvements and new developments: enhance the understanding of their behavior, including effective modeling of their electro-mechanics and chemistry, cover tech-niques of processing and characterization, and high-light applications of these materials. Further, this conference is seeking to promote the development of high performance EAP as smart materials and to increase the recognition of EAP as viable options for use in smart structures.

Papers are solicited on but not limited to the follow-ing EAP related topics: • advances in actuation, sensing, and

proprioception using EAP materials • Multi-Stimuli-Responsive EAP based materials

(namely, in addition to electric, these include materials that are driven by heat, light or other energy inputs)

• theoretical models, analysis, and simulation including computational chemistry

• measurement, testing, and characterization methods

• manufacturing technologies, including electroding, synthesis, processing, shaping, and fabrication

• design and engineering of actuators, sensors, and their integration into systems

• technology from miniature scale (MEMS, micro, and nano) to large devices

• applications in artificial muscles, robotics, biomimetics, energy harvesting, medical, industry, etc.

• driving electronics, system integration, and packaging

• control algorithms for devices and their implementation in software and hardware.

2019 Keynote Papers: "Science and Technolo-gy Contributions and Accomplishments”, Ray H. Baughman, NanoTech Institute at the Univ. of Texas in Dallas (USA) and "Inflatable Technology: Using Flexible Materials to Make Large Structures", Doug-las A. Litteken, NASA Johnson Space Ctr. (USA)

Special Session: 3D Printed EAP Materials: Prog-ress and Challenges, Session Chair: Geoff M. Spinks, Univ. Wollongong (Australia)

EAP-In-Action Demonstration Session

This Session that is held annually as part of the SPIE’s EAPAD conference is intended to turn the spotlight on Electroactive Polymers (EAP) materials and their applications as well as increase the recognition of their potential for smart structures. New materials and applications are continuing to emerge and this session is intended to provide the attendees an op-portunity to see a demonstration of EAP materials in action. This Session offers a forum of interaction between the technology developers and potential users as well as a "hands-on" experience with this emerging technology. It provides a great opportuni-ty to see the capability of state-of-the-art of EAP as potential actuators-of-choice. An award certificate will also be given to the top three Best EAP-in-Ac-tion Demonstration Award winners. Details can be found online at the Awards website page.




Active and Passive Smart Structures and Integrated Systems XIII (SSN03)Conference Chair: Alper Erturk, Georgia Institute of Technology (USA)

Conference Co-Chair: Jae-Hung Han, KAIST (Korea, Republic of)

Program Committee: Mehdi Ahmadian, Virginia Polytechnic Institute and State Univ. (USA); Steven R. Anton, Tennessee Technological Univ. (USA); Hiroshi Asanuma, Chiba Univ. (Japan); Diann E. Brei, Univ. of Michigan (USA); Matthew Bryant, North Carolina State Univ. (USA); Gregory P. Carman, Univ. of California, Los Angeles (USA); Eun Jung Chae, California State Univ., Long Beach (USA); Seung-Bok Choi, Inha Univ. (Korea, Republic of); Carlos De Marqui Jr., Univ. de São Paulo (Brazil); Alison B. Flatau, Univ. of Maryland, College Park (USA); Mehrdad N. Ghasemi-Nejhad, Univ. of Hawai'i (USA); Victor Giurgiutiu, Univ. of South Carolina (USA); Nam Seo Goo, Konkuk Univ. (Korea, Republic of); Faramarz Gordaninejad, Univ. of Nevada, Reno (USA); Nakhiah C. Goulbourne, Univ. of Michigan (USA); Ryan L. Harne, The Ohio State Univ. (USA); Daniel J. Inman, Univ. of Michigan (USA); Hyung-Jo Jung, KAIST (Korea, Republic of); M. Amin Karami, Univ. at Buffalo (USA); Jung-Ryul Lee, KAIST (Korea, Republic of); Soobum Lee, Univ. of Maryland, Baltimore County (USA); Junrui Liang, ShanghaiTech Univ. (China); Wei-Hsin Liao, The Chinese Univ. of Hong Kong (Hong Kong, China); Zhu Mao, Univ. of Massachusetts Lowell (USA); David L. Mascareñas, Los Alamos National Lab. (USA); Gyuhae Park, Chonnam National Univ. (Korea, Republic of); Norbert Schwesinger, Technische Univ. München (Germany); Shima Shahab, Virginia Polytechnic Institute and State Univ. (USA); Yi-Chung Shu, National Taiwan Univ. (Taiwan); Henry A. Sodano, Univ. of Florida (USA); Jiong Tang, Univ. of Connecticut (USA); Lihua Tang, The Univ. of Auckland (New Zealand); Dai-Hua Wang, Chongqing Univ. (China); Kon-Well Wang, Univ. of Michigan (USA); Ya S. Wang, Stony Brook Univ. (USA); Norman M. Wereley, Univ. of Maryland, College Park (USA); Byeng D. Youn, Seoul National Univ. (Korea, Republic of); Lei Zuo, Virginia Polytechnic Institute and State Univ. (USA)

In addition to the 200-word summary abstract, authors are welcome to submit an extended abstract (approximately 2 pages long, or 1,000 words) for review purposes.

Acceptance priority will be given to authors who submit a 2-page summary of their work. The file can be submitted as a Word.doc or postscript file during the abstract submission process. The extended abstract, used for se-lecting the papers by session organizers, can include figures, test results, and references. The short abstract will be included in the pub-lication that is provided to the conference at-tendees.

This conference, largely resulting from merge of the former 'Damping and Isolation' and 'Smart Structures and Integrated Systems' conferences, as well as a part of 'Modeling, Signal Processing, and Control' focuses on topics related to design, analy-sis, fabrication, and testing of active/passive smart dynamic structural systems. Structural vibration, damping, and acoustic control of integrated sys-tems can be enhanced through passive, active, and hybrid approaches. The conference emphasis is on the interplay of actuation, sensing, and process-ing capabilities to create active systems with new function capabilities. The goal is to create a multi-disciplinary forum to bring together developments in diverse application areas in aeronautical, space, marine, transportation, civil applications, etc. The scope of the conference ranges from system lev-el evaluation of smart structures to development, modeling, and optimization of new actuation and sensing techniques for integrated systems. Authors are encouraged to describe developments in active materials, 'smart' structural components, and inte-gration of these and other constituent technologies

into advanced systems that hold the potential for ex-panding the application of active and passive smart structures and integrated systems.

The primary topics for the conference are organized into the following ten sessions: • energy harvesting and scavenging • metamaterials and metastructures • biological-inspired systems and bio-MEMS • passive and active vibration isolation systems • magneto rheological systems • SMA- and piezo-based materials and systems • micro- and nano-integrated systems • aircraft, MAV/UAV, and morphing systems • smart sensing and signal processing for

diagnostics and prognostics • modeling, optimization, signal processing,

control, and design of integrated systems

Authors can select the session topic that best fits their work during the abstract submission process.


CALL FOR PAPERS

Behavior and Mechanics of Multifunctional Materials XIII (SSN04)Conference Chair: Hani E. Naguib, Univ. of Toronto (Canada)

Conference Co-Chairs: Ryan L. Harne, The Ohio State Univ. (USA); Aimy Wissa, Univ. of Illinois at Urbana-Champaign Chapter (USA)

Program Committee: Amir Ameli, Washington State Univ. Tri-Cities (USA); Gregory P. Carman, Univ. of California, Los Angeles (USA); Constantin Ciocanel, Northern Arizona Univ. (USA); Marcelo J. Dapino, The Ohio State Univ. (USA); Mohammad H. Elahinia, The Univ. of Toledo (USA); Nakhiah C. Goulbourne, Univ. of Michigan (USA); Darren J. Hartl, Texas A&M Univ. (USA); Daniel J. Inman, Univ. of Michigan (USA); Kwang Jin Kim, Univ. of Nevada, Las Vegas (USA); Dimitris C. Lagoudas, Texas A&M Univ. (USA); Hyeong Jae Lee, Jet Propulsion Lab. (USA); Donald J. Leo, Virginia Polytechnic Institute and State Univ. (USA); Jiangyu Li, Univ. of Washington (USA); Christopher S. Lynch, Univ. of California, Los Angeles (USA); William S. Oates, Florida State Univ. (USA); Zoubeida Ounaies, The Pennsylvania State Univ. (USA); Reza Rizvi, The Univ. of Toledo (USA); Ralph C. Smith, North Carolina State Univ. (USA); Vishnu Baba Sundaresan, The Ohio State Univ. (USA)

Smart structures utilize active materials as sensors and actuators to sense and respond to their environ-ment. These include piezoelectrics, electrostrictives, magnetostrictives, electroactive polymers (EAP), shape memory alloys (SMA), and ferromagnet-ic shape memory alloys (FSMAs). Development of smart structures involves the integration of active and passive material systems, often including the coupling of relevant mechanical, electrical, magnet-ic, thermal, optical, or other physical properties. This integration can subject the active materials to large stress levels, cyclic loads, thermal loads, or chemical effects that result in nonlinear responses and large variations in material properties. Meeting the mate-rials needs of the smart structures community over the coming decade and beyond will require the de-velopment of new active materials, further charac-terization of new and existing active materials, and development of mathematical models of material behavior and material failure suitable for reliable structural design.

This conference will bring together researchers from the materials, mechanics, and applications of smart materials communities with common interests in ma-terial properties. Papers are solicited in the area of smart and multifunctional materials with emphasis on their behavior and mechanics.

Topics of interest are broadly grouped into the fol-lowing categories: • mechanics of smart and multifunctional

materials • modeling and simulation of smart and

multifunctional materials • constitutive behavior: composition/structure/

property relations, coupled field behaviors, micromechanics models, multiscale models, molecular dynamics

• multifunctional materials development and characterization

• multifunctional composite materials and nano-structured composite materials

• bio-functional materials and structures • shape memory alloys (SMAs) and porous SMAs • shape memory polymers and ionic gels

• ferromagnetic shape memory alloys (FSMAs) • single crystal and polycrystalline ferroelectrics

and magnetostrictives • ferroelectrics and electrostrictives • magnetostrictives; galfenol • mechanics of metamaterials • bioinspired materials and structures • additive manufacturing • thin-film active materials for structural

applications (e.g. flow control) • reliability models: fracture toughness and

fatigue of multifunctional and active materials.

Save the dateABSTRACTS DUE:

22 August 2018

AUTHOR NOTIFICATION:

29 October 2018The contact author will be notified of acceptance by email.

MANUSCRIPT DUE DATE:

6 February 2019

PLEASE NOTE: Submissions imply the intent of at least one author to register, attend the conference, present the paper as scheduled, and submit a full-length manuscript for publication in the conference proceedings.



Nano-, Bio-, Info-Tech Sensors and 3D Systems (SSN05)Conference Chair: Jaehwan Kim, Inha Univ. (Korea, Republic of)

Conference Co-Chairs: Kyo D. Song, Norfolk State Univ. (USA); Ilkwon Oh, KAIST (Korea, Republic of); Ajit Khosla, Yamagata Univ. (Japan)

Program Committee: Amir Ameli, Washington State Univ. Tri-Cities (USA); Kean C. Aw, The Univ. of Auckland (New Zealand); Anja Boisen, Technical Univ. of Denmark (Denmark); Christina L. Brantley, U.S. Army Research, Development and Engineering Command (USA); Wei Chen, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) CAS (China); Sang H. Choi, NASA Langley Research Ctr. (USA); Eugene Edwards, U.S. Army Research, Development and Engineering Command (USA); Hidemitsu Furukawa, Yamagata Univ. (Japan); Srinivasan Gopalakrishnan, Indian Institute of Science (India); Seiich Hata, Nagoya Univ. (Japan); Taizo Hayashida, JSR Corp. (Japan); Mamoru Kawakami, Yamagata Univ. (Japan); Adrian Koh, National Univ. of Singapore (Singapore); Kimiya Komurasaki, The Univ. of Tokyo (Japan); Hideki Kyogoku, Kindai Univ. (Japan); Kam K. Leang, The Univ. of Utah (USA); Uhn Lee M.D., Gachon Univ. Gil Medical Ctr. (Korea, Republic of); Yirong Lin, The Univ. of Texas at El Paso (USA); Hani E. Naguib, Univ. of Toronto (Canada); Hidenori Okuzaki, Univ. of Yamanashi (Japan); Simon Park, Univ. of Calgary (Canada); Steve Park, KAIST (Korea, Republic of); Maurizio Porfiri, NYU Tandon School of Engineering (USA); Yongrae Roh, Kyungpook National Univ. (Korea, Republic of); Debiprosad Roy Mahapatra, Indian Institute of Science (India); Ashok Srivastava, Louisiana State Univ. (USA); Hiroya Tanaka, Keio Univ. (Japan); Tauno Vaha-Heikkila, VTT Technical Research Ctr. of Finland (Finland); Vijay K. Varadan, The Pennsylvania State Univ. (USA); Wei-Chih Wang, Univ. of Washington (USA); W. Hong Yeo, Georgia Institute of Technology (USA); Hargsoon Yoon, Norfolk State Univ. (USA); Xuanhe Zhao, Massachusetts Institute of Technology (USA)

This conference considers new ideas, technologies, and potential applications across a wide range of disciplines critical to nano-, bio-, and info-technolo-gies based sensors and systems as applied to health monitoring of human and complex systems in engi-neering and medicine. This year's theme focuses on emerging areas of wearable technology, smart tex-tile innovation, organic thin films and printable flex electronics, thought-controlled devices and systems, mobile wearable healthcare systems, wireless power feedback routines and devices for medical technolo-gy, smart optical materials technology, long-life mi-cro-power systems, and thermoelectric energy con-version films and systems. Along with the research on sensors using nanostructures, sensor networking technology enables us to imagine a future where bil-lions of people regularly access applications in glob-al network as their daily routine. Newly developed technology of nanoscale sensors integrated with microelectronic components, especially with wireless communication devices will generate significant im-pact in broad range of applications such as human health care, national security and the environmental monitoring. The integration of the nanoscale sensors with RFID and wireless communication systems will provide vast opportunities for biological sensor ap-plications, especially for physiological monitoring of human health and bio-hazard material detection system networked with personal mobile phone and internet services. The experimental, technological, and theoretical aspects of the relevant micro and na-noscience in engineering and medicine are welcome. A special focus will be given to antiterrorist efforts, homeland defense applications, security electronics, and reliability/failure issues and human disease mon-itoring and control.

Next generation of nanosensor systems in healthcare will depend on low cost manufacturing and integra-tion of sensors by 3D printing of novel materials. 3D printing is currently one of the most emerging technologies. 3D printing implied with Internet of Things (IoT) will make 3D devices communicate each other. Our aim for introducing this important area in this conference is to visualize leading ideas for ex-changing and to make networking place with the

most updated information of 3D technology among scientists, researchers, and engineers covering vast number of disciplines and develop novel knowledge in healthcare for improving the quality of life. A smart textile innovation section will also devote new tech-nology approach using 3D printing sensors on e-bra, e-shirt, e-underwear, e-bedsheets, garments to be used in space exploration and military uniforms. A hands-on training on 3D printing will also be set up in the conference and a certificate will be given as com-pletion of the training in this emerging technology.

Organic electronics provide environmentally friendly devices and material technologies that are built on flexible and conformal substrates. The flexible elec-tronics is a key enabler for a number of platform technologies such printed transistors, smart elec-tronic textiles, electronic papers and displays, em-bedded power sources and integrated sensing devic-es. A number of low-cost and large-area electronic applications also include smart cards, smart price, and inventory tags such as RFIDs.

The conference aims to add the following areas to promote interdisciplinary exchange in understanding engineering systems from biological ones: nanow-ires, carbon nanotubes, magnetic nanotubes, or-ganic electronics, MEMS, bioMEMS, nanostructures, nanoelectronics, microfluidics, high selectivity and sensitivity biological and chemical sensors, detec-tion of harmful chemical and biological agents, mi-crosensors for radioactivity, low power consumption physical and chemical sensors, security electronics, reliability and failure aspects, biomedical applica-tions, biomimetics, fast DNA sequencing, smart drug delivery, polymer electronics, nanooptics, analytical techniques at nanoscale, nanoassembly behavior, nanointegration, noise aspects and information tech-nology at nanoscale, multifunctional nanosystems, and nano/bio interface.

This conference will also focus on advanced methods for the testing, reliability, packaging, and metrology of micro-and nano-scale materials and devices. Pa-pers are solicited on, but not limited to, the following or related topics:


CALL FOR PAPERS

WEARABLE TECHNOLOGIES AND INTERFACING WITH INDUSTRIES• e-textile based smart garments • cardiac monitoring e-bra, e-bro, and e-band aid • monitoring neurological disorder with flexible

wireless EEG, EOG, EMG sensors • smart communication module with smart phone,

Wi-Fi, GSM, GPRS • monitoring the on-set of sudden cardiac death

of athletes, soldiers • panel with industries pursuing the wearable

technology • organic thin film and printable electronics • integration of flex electronics for wearable

medical devices.

3D PRINTING AND SMART SENSOR SYSTEM INNOVATION• 3D printing of materials (e.g., metal, polymer,

ceramic, composites, etc.) • computer aided design (CAD) and application • Internet of Things (IoT) in 3D printing • 3D printing in biomedical and medical

applications; tissue engineering, surgery, orthopedics, healthcare

• 3D printing or additive manufacturing of EEG, ECG devices, 'footware and shoes', etc.

• 3D printing of nano and microsensor systems • 3D printing for space • wearable power • textile based super capacitors • 3D printing of textile garments, nanosensors and

integration.

NOVEL MATERIALS AND INTEGRATION TECHNOLOGIES• nanomaterials • carbon nanotubes • 3D nanostructures • biomaterials • nanowires • integration of nano-and micro-sensors with

microelectronics • integration of sensors with flexible organic

electronics • novel nanomaterials for display systems • materials for flexible RFID systems.

SMART OPTICAL MATERIALS AND DEVICE APPLICATIONS• candidate materials and growth • field coupling techniques for control and

operation • spectral shifters • refractive index shifters • characterization methodology of smart materials • new device concepts with smart optical

materials • bandgap energy model and restructuring • conformable physical optics • error-free temporal and spatial tenability.

ENERGETIC MATERIALS AND LONG-LASTING MICRO-POWER SYSTEM• energetic materials with quantum modification • mobilization of deep level potential-well • enhanced surface energy for artificial catalysis • micro-power device concepts for long-life

operation • emerging and nascent materials for micro-power

devices.

INTEGRATED NANO- AND MICRO- STRUCTURES• smart sensors, smart actuators • smart microsystems • nanosystems • drug delivery systems • nondestructive methods for nano-engineered

materials, nanostructures, and nano-devices.

REMOTE CONTROL AND COMMUNICATION• microantenna, rectenna • remote sensing • RF MEMS • reconfigurable antenna • microwave and millimeter wave components and

devices.

SIMULATION, MODELING, AND IT SOFTWARE• CAD/CAM for nanosystems • design tools for integrated MEMS and NEMS • electro-thermo-mechanical modeling • microfluidics modeling • IT-related software.

THOUGHT-CONTROLLED DEVICES AND SYSTEMS• EEG, EOG, EMG signal acquisition system • interfacing robot • electroactive-polymer-based artificial muscles • brain-computer interface; brain-machine

interface.

APPLICATIONS IN ENGINEERING AND MEDICINE• thermoelectric energy conversion systems • thin-film hybrid PV/thermoelectric solar panels • biomedical • pharmaceutical • bio-implantable chip for disease monitoring and

control • neurotransmitter and stimulator; neurosurgical

procedures • cardiovascular monitoring sensors and systems • nanomedicine and drug delivery • wireless communication protocols • surgical procedures and nanosystems

implementation • glucose sensor system • physiological monitoring • smart textiles • sleep apnea • wireless power feedback routines and devices

for medical applications.




Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems (SSN06)Conference Chair: Jerome P. Lynch, Univ. of Michigan (USA)

Conference Co-Chairs: Hoon Sohn, KAIST (Korea, Republic of); Kon-Well Wang, Univ. of Michigan (USA)

Program Committee: Hiroshi Asanuma, Chiba Univ. (Japan); Chih Chen Chang, Hong Kong Univ. of Science and Technology (Hong Kong, China); Genda Chen, Missouri Univ. of Science and Technology (USA); Alison B. Flatau, Univ. of Maryland, College Park (USA); Branko Glisic, Princeton Univ. (USA); Faramarz Gordaninejad, Univ. of Nevada, Reno (USA); Benjamin L. Grisso, Naval Surface Warfare Ctr. Carderock Div. (USA); Ryan L. Harne, The Ohio State Univ. (USA); Jung-Wuk Hong, KAIST (Korea, Republic of); Neil A. Hoult, Queen's Univ. (Canada); Haiying Huang, The Univ. of Texas at Arlington (USA); Ying Huang, North Dakota State Univ. (USA); Mohammad Reza Jahanshahi, Purdue Univ. (USA); Gi-Woo Kim, Inha Univ. (Korea, Republic of); Jeong-Tae Kim, Pukyong National Univ. (Korea, Republic of); Simon Laflamme, Iowa State Univ. (USA); Hui Li, Harbin Institute of Technology (China); Jian Li, The Univ. of Kansas (USA); Suyi Li, Clemson Univ. (USA); Wei-Hsin Liao, The Chinese Univ. of Hong Kong (Hong Kong, China); Chin-Hsiung Loh, National Taiwan Univ. (Taiwan); Kenneth J. Loh, Univ. of California, San Diego (USA); Bryan R. Loyola, Sandia National Labs. (USA); Theodore E. Matikas, Univ. of Ioannina (Greece); Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA); Akira Mita, Keio Univ. (Japan); Yiqing Ni, The Hong Kong Polytechnic Univ. (Hong Kong, China); Hae Young Noh, Carnegie Mellon Univ. (USA); Irving J. Oppenheim, Carnegie Mellon Univ. (USA); Wieslaw M. Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland); Kara J. Peters, North Carolina State Univ. (USA); Piervincenzo Rizzo, Univ. of Pittsburgh (USA); Donghyeon Ryu, New Mexico Institute of Mining and Technology (USA); Liming W. Salvino, Office of Naval Research Global (USA); Fabio Semperlotti, Purdue Univ. (USA); Wieslaw J. Staszewski, AGH Univ. of Science and Technology (Poland); R. Andrew Swartz, Michigan Technological Univ. (USA); Tyler N. Tallman, Purdue Univ. (USA); Marco Torbol, Ulsan National Institute of Science and Technology (Korea, Republic of); Ming L. Wang, Northeastern Univ. (USA); Xingwei Wang, Univ. of Massachusetts Lowell (USA); Yang Wang, Georgia Institute of Technology (USA); Rosalind M. Wynne, Villanova Univ. (USA); Fuh-Gwo Yuan, North Carolina State Univ. (USA); Chung-Bang Yun, Zhejiang Univ. (China); Daniele Zonta, Univ. degli Studi di Trento (Italy)

Advanced sensors, smart materials, and smart struc-tures technology represent an emerging multidis-ciplinary field that has unlimited potential of broad engineering applications. This particular conference focuses on the new sensor technologies and phe-nomena that apply to the civil, mechanical, and aerospace engineering fields. To name a few, these applications include structural health monitoring (SHM), nondestructive evaluation (NDE), damage/deterioration assessment, security and emergency management, and asset management. The potential benefits of applying advanced sensors, smart mate-rials, and smart structures technology to civil, me-chanical and aerospace systems are many and they cover improved system reliability, enhanced system performance and functionality, enhanced security, decreased life cycle costs, and reduction of physical dimensions and weight.

Researchers in academia, government laboratories, and industry are making progress in advancing the state of the art of the sensor-based technologies ad-dressed by this conference. This conference will pro-vide a forum to bring together experts in the relevant but diverse fields to discuss recent advances and fu-ture challenges including international research col-laboration.

Papers are solicited on new and emerging technolo-gies in the following areas:

NEW TECHNOLOGICAL ADVANCES• machine learning • human-centric sensing and control • low-cost smart materials • large-scale monitoring systems • multifunctional sensors sensor networks and

autonomous operation • sensors for harsh and extreme environments • sensors using wireless systems • fiber optic sensing • photonic, phononic, and phoxonic crystal

sensors • computer vision and image analysis techniques • active and semi-active control systems • wearable sensors for biomedical applications.

BIO-INSPIRED SENSING AND BIO-INSPIRED ACTUATION • functional mimicking of extreme species • organization and processing in bio-networks • biomolecular sensors and actuators • biologically mediated fabrication • bio-inspired smart sensor networks.


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CALL FOR PAPERS

MODELING OF SMART MATERIALS AND SENSOR PERFORMANCE • sensor integration with structure • sensor behavior • reliability investigations • smart material response under loads and strain.

DESIGN ENGINEERING AND IMPLEMENTATION • design/characterization/creation of

multifunctional sensory systems • smart components, devices, and sub-assemblies • novel materials for sensing, actuation, and

design • smart systems for evaluation, detection,

monitoring, and control • sensor standardization.

INTEGRATION OF SMART SENSING SYSTEMS • vehicle health management • implementation of advanced technologies • big data and cloud-based analytic • cyberinfrastructure tools for data management

and curation • integrated asset management • data-driven decision making • small-scale and large-scale demonstrations • smart infrastructure security.


22 August 2018




6 February 2019


INTERROGATION OF STRUCTURES • aerospace structures, composites • geotechnical systems, mining/oil/gas

exploration and production • ship and offshore structures • pipelines • civil engineering structures • monuments of cultural heritage • conventional, nuclear, and alternative energy

systems • transportation systems and vehicles • chemical and biochemical systems.

SENSOR DEVELOPMENT AND APPLICATIONS



Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XIII (SSN07)Conference Chair: Andrew L. Gyekenyesi, Ohio Aerospace Institute (USA)

Conference Co-Chairs: Tzu-Yang Yu, Univ. of Massachusetts Lowell (USA); H. Felix Wu, U.S. Dept. of Energy (USA); Peter J. Shull, The Pennsylvania State Univ. (USA)

Program Committee: Gary Carr, Federal Railroad Administration (USA); Chia-Ming Chang, National Taiwan Univ. (Taiwan); Genda Chen, Missouri Univ. of Science and Technology (USA); Chih-Hung Chiang, Chaoyang Univ. of Technology (Taiwan); Dwight A. Clayton, Oak Ridge National Lab. (USA); Kaoshan Dai, Tongji Univ. (China); Reinhard Ebert, Fraunhofer-Institut für Optronik, Systemtechnik und Bildauswertung (Germany); Zhenhua Huang, Univ. of North Texas (USA); Dryver R. Huston, The Univ. of Vermont (USA); Xiaoning Jiang, North Carolina State Univ. (USA); Ajay M. Koshti, NASA Johnson Space Ctr. (USA); Denvid Lau, City Univ. of Hong Kong (Hong Kong, China); Shiyuan Liu, Huazhong Univ. of Science and Technology (China); Kenneth J. Loh, Univ. of California, San Diego (USA); Jerome P. Lynch, Univ. of Michigan (USA); Oliver J. Myers, Clemson Univ. (USA); Piotr Omenzetter, Univ. of Aberdeen (United Kingdom); Didem Ozevin, Univ. of Illinois at Chicago (USA); Akira Sasamoto, National Institute of Advanced Industrial Science and Technology (Japan); Caesar Singh, U.S. Dept. of Transportation (USA); Yu-Min Su, National Kaohsiung Univ. of Applied Sciences (Taiwan); Yan Wan, Univ. of Texas at Arlington (USA); Ming L. Wang, Northeastern Univ. (USA); Yang Wang, Georgia Institute of Technology (USA); Tian Xia, The Univ. of Vermont (USA); Lingyu Yu, Univ. of South Carolina (USA); Fuh-Gwo Yuan, North Carolina State Univ. (USA)

This conference creates an international forum to address the current state-of-the-art technologies in nondestructive characterization and monitoring of advanced materials and aerospace components, as well as technical challenges concerning infrastruc-ture asset management including commercial/pub-lic transportation and public utilities. The inspection technologies encompass a cradle-to-grave timeline allowing for the monitoring of the fabrication process (e.g., advanced/additive manufacturing), assessing initial component quality, in-situ monitoring and system health, as well as evaluating repairs/retrofits. The overall theme focuses on identifying and foster-ing improvements and new developments regarding theory, hardware, implementation strategies, inter-pretation of data/results, and automation.

This conference will provide a medium for communi-cation and collaborations among engineers and sci-entists in the following areas: • SHM/NDE of advanced materials (e.g.,

refractories, polymer matrix composites, metal matrix composites, ceramic matrix composites, foams, high-performance alloys)

• development of NDE and SHM tools for automotive and aerospace components/systems

• life management and system analysis/design methodologies for diagnostics and prognostics of materials and structures

• civil infrastructure management for roads, highways, rail systems, bridges, buildings, water systems, dams, levees, pipelines, tunnels, chimneys, and power generation (e.g., natural gas, coal, nuclear, wind, hydropower, geothermal, solar, etc.)

• energy (electrical grids, power transmission, pipeline distribution systems, and/or oil and gas exploration)

• SHM/NDE sensor development, MEMS/NEMS, intelligent transportation systems, complex cyber-physical systems via control, networking, verification, and real-time systems to protect infrastructure including aeronautics, civil, materials, energy, automotive, medical, chemical, manufacturing, and agriculture

• continuous and life-cycle monitoring, repair/retrofit for cost mitigation, improving measurement accuracy, reliability, safety, and inspection technologies

• integration of multiple SHM/NDE technologies for improving interpretation of results

• automation of SHM/NDE technologies and industrial applications

• monitoring and NDE of additive manufacturing processes and finished parts

• modeling, simulation, and technology development at various scales ranging from nano- and micro- scale to super-large structures

• signal processing, data fusion, wireless sensor networks, image processing, and energy harvesting for SHM/NDE

• mitigation of man-made and natural hazards in physical infrastructure including buildings, highway infrastructure, bridges, dams, levees, and nuclear power plants

• environmental monitoring/sensing technologies and applications (e.g., unmanned aerial vehicle (UAV) monitoring)

• SHM/NDE technologies and applications in homeland security and counter-terrorism

• NDE/NDT standards, codes, regulations, and acceptance criteria

• NDE/NDT of self-healing materials, structures, and systems.


CALL FOR PAPERS


Health Monitoring of Structural and Biological Systems XIII (SSN08)Conference Chair: Paul Fromme, Univ. College London (United Kingdom)

Conference Co-Chair: Zhongqing Su, The Hong Kong Polytechnic Univ. (Hong Kong, China)

Program Committee: Sourav Banerjee, Univ. of South Carolina (USA); Yoseph Bar-Cohen, Jet Propulsion Lab. (USA); Fu-Kuo Chang, Stanford Univ. (USA); Anthony J. Croxford, Univ. of Bristol (United Kingdom); Hadi Fekrmandi, South Dakota School of Mines and Technology (USA); Victor Giurgiutiu, Univ. of South Carolina (USA); Srinivasan Gopalakrishnan, Indian Institute of Science (India); Mohammad Hadi Hafezi, The Univ. of Arizona (USA); Guoliang Huang, Univ. of Missouri (USA); Xiaoning Jiang, North Carolina State Univ. (USA); Ajay M. Koshti, NASA Johnson Space Ctr. (USA); Sridhar Krishnaswamy, Northwestern Univ. (USA); Tribikram Kundu, The Univ. of Arizona (USA); Francesco Lanza di Scalea, Univ. of California, San Diego (USA); Zhu Mao, Univ. of Massachusetts Lowell (USA); Christopher Niezrecki, Univ. of Massachusetts Lowell (USA); Mostafa A. Nouh, Univ. at Buffalo (USA); Wieslaw M. Ostachowicz, The Szewalski Institute of Fluid-Flow Machinery (Poland); Xinlin Qing, Xiamen Univ. (China); Henrique L. Reis, Univ. of Illinois at Urbana-Champaign (USA); Fabrizio Ricci, Univ. degli Studi di Napoli Federico II (Italy); Piervincenzo Rizzo, Univ. of Pittsburgh (USA); Alessandro Sabato, Univ. of Massachusetts Lowell (USA); Yanfeng Shen, Shanghai Jiao Tong Univ. (China); Hoon Sohn, KAIST (Korea, Republic of); Wieslaw J. Staszewski, AGH Univ. of Science and Technology (Poland); Tadeusz Stepinski, AGH Univ. of Science and Technology (Poland); Tadeusz Uhl, AGH Univ. of Science and Technology (Poland); Wei-Chih Wang, Univ. of Washington (USA); Jinkyu Yang, Univ. of Washington (USA); Lingyu Yu, Univ. of South Carolina (USA); Andrei N. Zagrai, New Mexico Institute of Mining and Technology (USA)

The scope of the 2019 conference includes emerging and futuristic methods of Structural Health Monitor-ing: inspection, data transfer, signal processing, di-agnosis and prognosis of engineering and biological materials and structures.

In the year 2001 this conference, for the first time, brought together engineers, medical practitioners, and scientists to exchange ideas on health monitor-ing of both engineered and biological structures. The positive experience of 2001 was reinforced in 2002 through 2018 where more participants from the bio-medical engineering and NDE community attended the conference. In 2019 the topics that will be cov-ered by this conference will be expanded building on the success of the previous years.

Papers are invited on topics including, but not limited to, the following:

Engineering area: • aging, new, and future aircraft structures • aircraft and aerospace hardware • civil infrastructure (bridge, buildings, roads,

pipelines etc.) • microelectric and electronic components and

infrastructure • applications of MEMS and other integrated or

embedded multifunctional sensors • applications to energy industry (nuclear,

conventional, and green technology such as windmill, solar)

• robotics, automation, and smart structures (e.g., crawlers, wireless, multimedia, internet)

• real time sensing and testing at extreme environments (temperatures, pressure and vacuum, radiation hazards, toxic and hazardous conditions, etc.)

• emerging and futuristic techniques and issues (NEMS, energy harvesting, additive manufacturing etc.)

• elastic and acoustic metamaterials Biodiagnostic area: • biomaterials and biostructures (e.g., implants,

cells, bones, tissues, etc.) • biologically inspired technologies • medical NDE methods (MRI, CAT scan,

ultrasonography, radiography and others) • biomedical smart structures and devices

(e.g. smart materials, structures, micro/nanofabrication and applications in biomedical monitoring and diagnosis)

• NEMS/MEMS and emerging/futuristic techniques



Smart Materials and Nondestructive Evaluation for Energy Systems V (SSN09)Conference Chair: Christopher Niezrecki, Univ. of Massachusetts Lowell (USA)

Conference Co-Chairs: Kara J. Peters, North Carolina State Univ. (USA); Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA); Theodoros E. Matikas, Univ. of Ioannina (Greece)

Program Committee: Ali Abdul-Aziz, NASA Glenn Research Ctr. (USA); Nicolas P. Avdelidis, Univ. Laval (Canada); George Y. Baaklini, NASA Glenn Research Ctr. (USA); Leonard Bond, Iowa State Univ. (USA); Michael Dalichow, Quality Network Inc. (USA); Dimitrios A. Exarchos, Univ. of Ioannina (Greece); Peter Heilmann, arxes-tolina GmbH (Germany); Manfred Johannes, South African Institute for Non-Desctructive Testing (South Africa); Vassilios Kappatos, Univ. of Southern Denmark (Denmark); Michael Kroening, Pontifícia Univ. Católica do Rio de Janeiro (Brazil); Michele Meo, Univ. of Bath (United Kingdom); Alexander Michaelis, Fraunhofer IKTS (Germany); Bernd Michel, Fraunhofer-Institut für Elektronische Nanosysteme (Germany); Piotr Omenzetter, Univ. of Aberdeen (United Kingdom); Stefano Sfarra, Univ. degli Studi dell'Aquila (Italy); Tadeusz Stepinski, AGH Univ. of Science and Technology (Poland); Mark R. Woike, NASA Glenn Research Ctr. (USA); H. Felix Wu, U.S. Dept. of Energy (USA); Dong-Jin Yoon, Korea Research Institute of Standards and Science (Korea, Republic of); Lingyu Yu, Univ. of South Carolina (USA)

The Review Abstract length must be at least 450 words for this conference. Summary Abstracts can remain approximately 100 words in length.

The major focus of this conference is materials, smart structures, sensor systems, NDE, and monitoring of renewable and conventional energy systems for energy production, energy mining, energy trans-mission, energy transportation, energy storage, and energy harvesting. We will bring together specialists from industry and academia to discuss topics that will help lead to a sustainable and environmentally friendly energy base for the future. Availability of en-ergy is directly linked to well-being and prosperity across the globe. Meeting the growing demand to safely and sustainably supply more than seven billion people on earth who use energy each day is a key challenge addressed by the conference.

Our goal is to provide advanced materials and new measurement technology that can help build a re-liable, environmentally friendly, and more robust energy infrastructure. We are interested in energy systems and their NDE/SHM across a wide range of scales from nano (e.g. ultra small health implants) to macro (e.g. a whole wind farm).

Electro mobility, wireless communication, wireless sensor networks, and Structural Health Monitoring (SHM) systems are hungry for new, highly efficient and low weight, high capacity, energy generators or energy storage systems. Increased mobility of peo-ple, next generation of fabrication, noninvasive medi-cine as well as nanotechnology require new concepts of macroscopic and microscopic energy conversion and propulsion systems. Smart and cognitive mate-rials and structures with embedded sensor/actuator systems and electronics are not possible without new solutions for energy harvesting, storage, transmis-sion, and distribution.

Limited resources of conventional energy, climate change, and environmental problems all require new solutions for energy mining, transportation, conser-vation, and storage. Reduction of the emission of greenhouse gases, exploration of new resources for sustainable and conventional energy faces new chal-lenges. Renewable energy sources, such as wind and solar, create electrical energy without greenhouse gas emissions during operation. Unfortunately, the mismatch between energy generation location and point of consumption as well as time of availability and time of energy need is evident. New concepts

for energy storage and transmission are necessary. Chemical, electrical, thermal, and gravity storage technologies must be advanced to solve energy storage and transportation challenges. All require new solutions that can be impacted by developing novel materials and power management and control systems. Robust NDE and SHM for wind and solar systems are still developing to make systems more reliable and robust. All of these are high priority top-ics for future developments.

Many offshore and subsea energy systems, such as those in oil and gas industry, continue operating in many cases beyond their original design life. Moni-toring the health of such aging systems is of para-mount importance. As many basins, e.g. in North Sea, are reaching the end of their life. Decommissioning is a looming challenge and efficient monitoring tech-niques are required for this market niche including also the important aspects of the interaction of man-made systems with marine and wildlife. Meanwhile, future subsea systems will be even more complex, in-terdependent, and sophisticated requiring provisions for monitoring to be ready at the design stage for cradle-to-grave intelligent asset management. Like-wise, safety considerations for nuclear power and the need for real-time monitoring of nuclear infrastruc-tures have been driving the NDE and the SHM tech-nologies for decades and continue as critical topics today.

Major topics of interest include: • NDE and SHM of energy systems • materials, NDE, and monitoring of energy

storage systems • materials, NDE, and monitoring for energy

mining and harvesting systems • materials, NDE, and monitoring of energy

transmission systems • materials, NDE, and monitoring of energy

distribution systems • development and application of smart materials

for energy systems • characterization of materials • smart sensor phenomena, technology, networks,

and systems integration • wired, wireless, optical, and other techniques for

energy transportation • green and conventional as well as nuclear

energy


CALL FOR PAPERS

• photovoltaic and solar energy systems • wind energy systems • chemical, electrical, thermal, kinetic, and gravity

energy storage technologies • batteries • fuel cells • macroscopic and micro propulsion systems

• new materials and testing of turbines for energy mining and propulsion

• mechanical to electrical energy conversion (e.g. generators).

We especially encourage specialists from industry to share their needs with the research community.

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Smart Structures and NDE for Industry 4.0 (SSN10)Conference Chair: Norbert G. Meyendorf, Iowa State Univ. of Science and Technology (USA)

Conference Co-Chairs: Dan J. Clingman, Boeing Research and Technology (USA); Kerrie Gath, Ford Motor Co. (USA)

Program Committee: Steven R. Anton, Tennessee Technological Univ. (USA); Diann E. Brei, Univ. of Michigan (USA); Peter C. Chen, NASA Goddard Space Flight Ctr. (USA); Marcelo Dapino, The Ohio State Univ. (USA); Kevin M. Farinholt, Luna Innovations Inc. (USA); Xiao-Yan Gong, Medical Implant Mechanics LLC (USA); Steven F. Griffin, The Boeing Co. (USA); Nancy L. Johnson, General Motors Co. (USA); Jayanth N. Kudva, NextGen Aeronautics, Inc. (USA); Amrita Kumar, Acellent Technologies, Inc. (USA); Jay Lee, Univ. of Cincinnati (USA); Jung-Ryul Lee, KAIST (Korea, Republic of); Donald J. Leo, The Univ. of Georgia (USA); Zheng Liu, The Univ. of British Columbia Okanagan (Canada); Geoffrey P. McKnight, HRL Labs., LLC (USA); Tobias Melz, Fraunhofer-Institut für Betriebsfestigkeit und Systemzuverlässigkeit (Germany); Christopher Niezrecki, Univ. of Massachusetts Lowell (USA); Gyuhae Park, Chonnam National Univ. (Korea, Republic of); W. Lance Richards, Armstrong Flight Research Ctr. (USA); Janet M. Sater, Institute for Defense Analyses (USA); Edward V. White, The Boeing Co. (USA); Christian Wunderlich, Fraunhofer-IKTS (Germany)

“The Internet of Things” and “Industry 4.0” are keywords indicating an industrial revolution that is unfolding at present. Industry 4.0 is a terminology preferred in Europe to characterize the integration of production and communication technologies to the so-called “smart factory”. The process is charac-terized by customer-driven configuration and even design of products, cloud-based planning and man-agement of production and logistics, and full-scale integrated monitoring of production processes. The component behavior can be continuously monitored to optimize maintenance and improve the design.

We are also seeing a paradigm shift from the pro-duction of large numbers of similar parts to small numbers of individual parts with properties tailored to a specific application. Additive manufacturing/3D printing opens the door to new applications of Smart Materials and Structures. Millions of micro sensors, actuators, and processors can be integrated in pro-cesses, materials, or components for permanent monitoring. Data can be collected and analyzed in real time by wireless technology through the Inter-net of Things. This leads to the next generation of Structural Health Monitoring, condition assessment, and proactive maintenance.

Significant attention is also paid to the nondestruc-tive evaluation and structural health monitoring of these sometimes unique structures and components. NDE has to follow these trends, by not only adapting NDE techniques to the new technologies, but also in-troducing the capability of cyber systems into the in-spection and maintenance processes. Crucial aspects of these new NDE trends are: • 3D volume data creation by blending data from

various sources • management of large amounts of data volume/

component live data files • management and learning from big data • real time monitoring of structural integrity • reliable inspection of individual components • NDE planning and Interpretation based on

modeling, pattern recognition and machine learning.

New handheld devices like data lenses, tablet computers, or cellphones can be efficiently used as user interfaces and make process monitoring and NDE available and affordable for everybody.

Remote NDE will enable advanced competences not available on-site in an affordable way. This opens new business models and value streams for manufacturing companies as well as service providers. This might significantly increase the acceptance of NDE by solving new inspection problems for all day service. The term “NDE 4.0” is sometimes used to indicate this new quality of nondestructive inspections.

Major topics of interest are: • industrial and commercial applications of smart

structures and materials • new applications for smart structures and

materials for Industry 4.0 and Smart Factories • the Internet of Things for monitoring

components and smart structures • structures with embedded micro- and

nano-sensors, wireless communication, data collection, and analysis

• acquisition and analysis of large amounts of data (Big Data) for NDE and SHM

• 3D volume data creation and management of large live data files

• smart manufacturing, additive manufacturing, and 3D printing

• multifunctional materials for manufacturing • real-time monitoring of factory systems • reliable inspection of individual components and

products • NDE planning and interpretation based on

modeling • integration of CAD, structure modeling, and NDE • remote engineering and remote NDE • handheld devices as user interfaces for process

monitoring and NDE • cloud-based instrumentation for NDE • industrial Internet of Things for SHM and NDE • data alignment and integration for SHM and NDE • data and information fusion in NDE and SHM • VR and AR for NDE and SHM applications • industrial and commercial applications to energy

harvesting • the concept of the digital twin.



EAP-IN-ACTION SESSIONThis session that is held annually as part of the SPIE EAPAD conference is intended to turn the spotlight on Electroactive Polymers (EAP) materials and their applications, as well as increase the recognition of their potential for smart structures. New materials and applications are continuing to emerge, and this session is here to provide the attendees an opportunity to see a demonstration of EAP materials in action. This session offers a forum of interaction between the technology developers and potential users, as well as a “hands-on” experience with this emerging technology. It provides a great opportunity to see the capability of state of the art EAP as potential actuators-of-choice.

An award certificate will also be given to the Best EAP-in-Action Demonstration winner.

SPIE COURSE

Maintain your competitive edge with this EAPAD course.

Electroactive Polymer Actuators, Sensors, and Devices (SC634)Sunday 3 March 2019 Course Level: Introductory CEU: 0.4

This longstanding course will be held the day prior to the technical conferences and is a natural accompaniment to the EAPAD Conference, page 5.

www.spie.org/education

Interested in teaching a course and wish to submit a course proposal? Course proposals are due 1 September. For more information, contact Laura Sharik, [email protected].


VENUEEmbassy Suites by Hilton Denver

1420 Stout Street Denver, CO 80202 USA The Embassy Suites Denver-Downtown/Convention Center is a desirable location in the heart of Denver. It offers all the amenities that a high-end conference hotel can provide. The Colorado Convention Center is directly across from the hotel as well as shopping close by at the 16th Street Mall.

TECHNICAL PROGRAMAvailable November 2018The comprehensive Advance Technical Program for this symposium will list conferences, paper titles, and authors in order of presentation; an outline of all planned special events; and hotel and registration information. An email will be sent to you announcing the availability of the Advance Program in November.

HOTEL REGISTRATIONOpening of the hotel reservation process for Smart Structures + Nondestructive Evaluation 2019 is scheduled for November 2018. SPIE will arrange special discounted hotel rates and amenities for attendees that will be available when housing opens. Please do not contact SPIE directly.

REGISTRATIONSPIE Smart Structures + Nondestructive Evaluation registration will be available November 2018.

All participants, including invited speakers, contribut-ed speakers, session chairs, co-chairs, and committee members, must pay a registration fee.

Fee information for conferences, courses, a regis-tration form, and technical and general information will be available on the SPIE website in November.

STUDENT TRAVEL GRANTSA limited number of SPIE student travel grants will be awarded based on need. Applications must be re-ceived no later than 10 weeks prior to the meeting, by 17 December 2018. Eligible applicants must present an accepted paper at this meeting. Offer applies to undergraduate/graduate students who are enrolled full-time and have not yet received their PhD.

CLEARANCE INFORMATIONIf government and/or company clearance is required to present and publish your presenta tion, start the process now to ensure that you receive clearance if your paper is accepted.

IMPORTANT NEWS FOR ALL VISITORS FROM OUTSIDE THE USA Find important requirements for visiting the USA on the SPIE website. There are new steps that ALL visitors to the USA need to follow. Online at: www.spie.org/visa

LETTERS OF INVITATION FOR VISA PROCESSIndividuals requiring letters of invitation to obtain travel visas to present their papers may access and print an Invitation Letter Request Form found on the vent website. Online at: www.spie.org/visa

GENERAL INFORMATION


22 August 2018




6 February 2019



ABSTRACT SUBMISSION

By submitting an abstract, I agree to the following conditions: AN AUTHOR OR COAUTHOR (INCLUDING KEYNOTE, INVITED, ORAL, AND POSTER PRESENTERS) WILL: • Register at the reduced author registration rate,

attend the meeting, and make the presentation as scheduled (Current SPIE Members receive an additional discount on the registration fee).

• Authors and coauthors attending the meeting will obtain funding for their registration fees, travel, and accommodations, independent of SPIE, through their sponsoring organizations before submitting abstracts.

• All clearances, including government and company clearance, have been obtained to present and publish. If you are a DoD contractor, allow at least 60 days for clearance.

• Please submit a 250-word text abstract for technical review purposes that is suitable for publication. Accepted abstracts may be published with the printed Technical Program for distribution at the meeting.

• Please also submit a 100-word text abstract suitable for early release. If accepted, this abstract text will be published prior to the meeting in the online or printed programs promoting the conference.

• A manuscript (6 pages minimum; 20 pages maximum) for any accepted oral or poster presentation will be submitted for publication in the conference Proceedings in the SPIE Digital Library.

PREPARE TO SUBMIT: • Have all contact information (full names,

affiliations, addresses, phone numbers, and emails) for your coauthors ready.

• Only original material should be submitted.• Abstracts should contain enough detail to

clearly convey the approach and the results of the research.

• Commercial papers, papers with no new research/development content, and papers where supporting data or a technical description cannot be given for proprietary reasons will not be accepted for presentation in this conference.

SUBMIT YOUR ABSTRACT ONLINE: www.spie.org/SSNcall• If you have already chosen a conference to

submit to, return to the previous page and click the “Submit an abstract” link.

• If you haven’t yet chosen a conference to submit to, browse to locate a conference from the link at: www.spie.org/ssncall. Once you choose a conference, click “submit an abstract” from the conference call for papers.

• You will be prompted to sign in to the spie.org system and follow the submission wizard. If you have a spie.org account, sign in using your username and password. First-time users of spie.org can create a new account by clicking on the “create new account link”.

• To provide the research community with

enhanced access to information presented at SPIE conferences, SPIE will record the audio plus screen content of oral presentations and, with author permission only, will publish the recordings on the SPIE Digital Library. When submitting an abstract, you will be asked to respond to the permission request.

REVIEW, NOTIFICATION, PROGRAM PLACEMENT• To ensure a high-quality conference, all

abstracts and Proceedings manuscripts will be reviewed by the Conference Chair/Editor for technical merit and suitability of content. Conference Chair/Editors may require manuscript revision before approving publication, and reserve the right to reject for presentation or publication any paper that does not meet content or presentation expectations. SPIE’s decision on whether to accept a presentation or publish a manuscript is final.

• The contact author will be notified of abstract acceptance and sent manuscript instructions by e-mail no later than 29 October 2018.

• Final placement in an oral or poster session is subject to the Chairs’ discretion. Instructions for oral and poster presentations may be found from the “For Authors/Presenters” link.

INFORMATION ON THE PROCEEDINGS OF SPIE IN THE SPIE DIGITAL LIBRARY• Manuscripts will be Chair/Editor-reviewed and

published in the Proceedings of SPIE in the SPIE Digital Library.

• Manuscript instructions will be e-mailed to the contact author and are also available from the “For Authors/Presenters” link on the conference website.

• Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license.

• Only papers presented at the conference and received according to publication guidelines and timelines will be published in the conference Proceedings in the SPIE Digital Library.

• SPIE partners with relevant scientific databases to enable researchers to find the papers in the Proceedings of SPIE easily. The databases that abstract and index these papers include Astrophysical Data System (ADS), Chemical Abstracts (relevant content), Ei Compendex, CrossRef, Current Contents, DeepDyve, Google Scholar, Inspec, Portico, Scopus, SPIN, and Web of Science Conference Proceedings Citation Index.

• Presenters are encouraged to take advantage of the opportunity to submit their work to an SPIE peer-reviewed Journal. No reformatting is necessary for initial submission to the journal. Manuscripts submitted to the journal will go through the normal peer-review process. For more information, please visit www.spie.org/journals.



JOIN US IN DENVER Present your work to the world’s leading experts in smart materials and nondestructive evaluationShowcase your research at the leading event for advanced materials, sensor systems, and structural health monitoring. There are lots of opportunities for engagement and the community wants to hear from you.

• Present a paper and participate in the conference

• Obtain critical feedback and new ideas

• Hear a broad spectrum of other works in progress

• Develop new ideas for future research

• Network with your colleagues and find collaborators

• SPIE conference papers are published in the SPIE Digital Library, the world’s largest collection of optics and photonics research

• Publish your paper in an SPIE Journal

PLAN TO ATTEND SPIE SMART STRUCTURES + NONDESTRUCTIVE EVALUATION 2019 IN DENVER

SPIE Proceedings and Journals are indexed in Web of Science, Scopus, Ei Compendex, Inspec, Google Scholar, Astrophysical Data System (ADS), DeepDyve, ReadCube, CrossRef, and other scholarly indexes, and are widely accessible to leading research organizations, conference attendees, and individual researchers.




10 CONFERENCES




Learn from the experts at Smart Structures + Nondestructive EvaluationThe premier event for advanced materials, sensor systems, and structural health monitoring.

800 ATTENDEES

850 PAPERS

1 COURSE

Electroactive polymers are paving the way for advanced materials to enter commercial production and industrial application areas. This session encourages interaction between EAP developers and potential users, as well as a “hands-on” experience with this emerging technology.

Training Introduction to Electroactive Polymer Actuators and DevicesThis course provides an overview of the field of EAP covering the state of the art, challenges, and potential. Perfect for engineers, scientists and managers who need to understand the basic concepts of EAP. The course ends with a review of the future prospect of EAP as actuators and sensors for industrial and medical applications

EAP-In-Action Session

Applications of Uncertainty Analysis in Smart Materials and Adaptive StructuresThis hands-on tutorial exposes participants to statistical and numerical techniques that will allow them to quantify the accuracy of multi-physics models.

Tutorial

• Bioinspiration, Biomimetics, and Bioreplication

• Electroactive Polymer Actuators and Devices

• Active and Passive Smart Structures and Integrated Systems

• Behavior and Mechanics of Multifunctional Materials

• Nano-, Bio-, Info-Tech Sensors and 3D Systems

• Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems

• Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation

• Health Monitoring of Structural and Biological System

• Smart Materials and Nondestructive Evaluation for Energy Systems

• Smart Structures and NDE for Industry 4.0

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