Hands-on-access fabrication facility at Nishizawa Research Center, Tohoku University

Kentaro TOTSUMicro System Integration Center,Tohoku University, Sendai, Japan

totsu@mems.mech.tohoku.ac.jp

August, 2013

Examples of commercialized MEMS products under cooperation with Tohoku University

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Nikei-Sangyo newspaper (2003/12/12) Catheter pH, PCO2 monitor Portable pH sensor Resonating gyroscope (Yaw rate Highest evaluation by industry (Kurare) (Shindengen) Sensor & accelerometer) (Toyota)

Electrostatically levitated rotational gyroscope and multi- Integrated capacitive pressure Diaphragm vacuum gageaxis micro inertial measurement system (Tokyo Keiki) sensor (JTECT) (Canon anelva)

Silicon microphone MEMS switch for LSI tester 2-axes optical scanner LTCC with electrical feedthrough(NHK, Panasonic) (Advantest) (Nippon signal) for MEMS packaging (Nikko)

Requirement for MEMS R&D

- Development of design, process and evaluationin individual cases > No standard !

- Expensive facility (clean room) and equipment

- Trained engineer

- Much know-how

- Human network

Much time and cost

>> Open-access facility reduces the barrier to prototype and production.

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Barrier

Facility

Human resource

Know-howidea

prototype

Hands-on access fab., an open access facility at Tohoku Univ. 試作コインランドリ

The “Hands-on access fab.” is an open access facility that companies can easily access and utilize for their prototyping or small volume production. The fab. is shared with other users and managed with best efforts.

The fab. will not make contract development like MEMS foundry.Companies which have not own facility can dispatch their people to operate equipments by themselves.

The fab. is equipped with 4 and 6 inch facilities for semiconductor and MEMS.Companies pay fee depending on usage. The users can make investment small, because they are able to achieve prototyping of a device at appropriate cost. As a result, the users can reduce the risk in development, and can bridge R&D stage to manufacture stage more smoothly.

Companies can access accumulated know-howat Tohoku University.

Skilled engineer staffs coach the user.

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Aobayama campus, Tohoku Univ.

Hands-on-access fab. Nishizawa Center (4 and 6 inch MEMS and semiconductor)

Micro-nano Center(20mm, 2inch for MEMS and LSI)

Tohoku University

MEMS lab. (20mm for MEMS) MNOIC, AIST

(8 and 12 inch for MEMS)

Jun-ichi Nishizawa Memorial Research Center

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1F

2F

3F

1,800m2

1,800m2

1,600m2

Clean roomClass 100~10,000

Experimental room

Super clean roomClass 1~1,000

Utility space

Total space of experimental room : 5,000m2

1F

2F

700m2

700m2

Storage

Clean roomClass 10,000

Office,meeting room

1F

2F

3F

(Former Semiconductor Research Institute)

Sendai MEMSshowroom

Historical Museum of Technology

Layout of the Hands-on access fab. (2nd floor of the Research Center)

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紹介Video1(2F_CR_R)

6:59

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Cleaning, drying

Draft chamber Draft chamber Brush scrubber Spin dryer

HF/HNO3/H2SO4/HCl etc. Organic solvent, resist removing

Zenkyopost polishing

SEMITOOL PSC101

CO2 critical point dryer Inert oven Vacuum oven Spin dryer

SCFluids CPD1100 Yamato DN63H Yamato DP-31 Toho Kasei

Photolithography

Pattern generator Spin coater Spin coater Coater/developerNSK TZ-310

For emulsion / Cr mask making, up to 7inch

Mikasa 1H-DXII etc. Actes ASC-4000 Canon CDS-630For positive resist

Coater/developer Hot plate Clean oven Curing furnaceScreen

For negative resistYamato DE62 Yamato DN43H

For polyimide

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Stepper Double-side aligner x2 Single-side aligner EB lithography

Canon FPA1550M4Wg-line, 0.65µm、4inch

Suss MicrotechMA6/BA6

Canon PLA-501-FA Reith 5030nm, up to 3inch

Draft chamber UV curing Spray developer EB lithography

For development Ushio UMA-802 Actes ADE-3000S-8 inch, vacuum/mechanical

chuck

Elionix ELS-G125SMax130keV, 4nm, up to 6”

Photolithography

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Oxidation, diffusion, ion implantation, annealing

Oxidation/diffusion furnace

Middle-current ion implanter

High-current ion implanter Annealing

TEL XL-7 Nissin ion NH-20SRMax. 180keV, 0.6mA

Sumitomo eaton nova NV-10Max. 80keV, 6mA

AG Associates AG41001000OC

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Deposition (CVD, sputtering, evaporation, etc)

LP-CVD Thermal CVD PE-CVD PE-CVD

KokusaiSiN, Poly-Si, NSG

KokusaiEpi-Poly Si, 1200OC

JPEL VDS-5600SiN, SiO2

Sumitomo MPX-CVDSiN, SiO2

W-CVD Sputtering Sputtering EB evaporation

Applied materialsPrecision 5000

Anelva SPF-7305inch target x 3

Shibaura CFS-4ESII x 23inch target x 3

Anelva EVC-1501

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Thermal CVD for Epi Poly-Si

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Power supply: 150kHz, 100kW

4” x 8 or 6” x 4Rotatable SiC susceptor Max. temp. :1100OC

Source gas: SiH2Cl2Doping gas: PH3(5%)Carrier gas: H2Cleaning gas: HCl

Epi Poly-Si deposition

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Si

SiO2 1µm

Poly-Si 100nm

Epi Poly-Si

Deposition rate :45 μm / 60min = 0.75µm / minStress : 40MPa, compressiveResistivity : 0.002 Ω・cm

1000oCSiH2Cl2: 200 sccmPH3(5%): 10 sccmH2 : 15 SLM

Thermal oxidation

Poly-Si CVD, 800oC

Epipoly-Si CVD

SiSiO2

Random SmallPoly-SiGrains800 OC

Columnar Epi Poly-Si1000 OC

Deposition (CVD, sputtering, evaporation, etc)

Automatic sol-gel deposition Electroplating MOCVD

Technofine PZ-604 YamamotoCu, Ni, Sn, Au

Wacom Doctor-TPZT, up to 8inch

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PZT deposition

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Technofine, PZ-604

Wafer station

Dispenser and spin-coater Furnaces for drying and pyrolysis Annealing furnace

Etching

Si Deep-RIE Dry etcher Dry etcher Al RIE

Sumitomo MUC-21 Anelva DEA-506 For SiN, SiO2 etching

Anelva L-507DLFor Si etching

Shibaura HIRRIE-100

ECR etcher Asher Asher RIE

Anelva ECR60013 inch GaAs

ULVAC UNA20002.45GHz, 1kW

Branson IPC400013.56MHz, 600W

Ulvac RIH-1515ZCl2、BCl3、SF6、CF4、CHF3、Ar、O2、N2

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Measurement

Wafer dust counter Film thickness measurement Surface profiler Surface profiler

Topcon WM-3 NanometricNanoSpec 3000

Dektak 8 Tenchor AlphaStep 500

Depth measurement 4-terminal probe Spreading resistance measurement Wafer prober

Union Hisomet Solid State Measurements SSM150

Accretech EM-20A

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Measurement

Digital microscope with automatic XY stage SEM X-ray micro CT Ellipsometry

Keyence and Kunoh Hitachi S3700NMax. 12 inch, EDX

Comscan technoScanXmate D160TS110

ULVAC

Ultrasonic microscope IR microscope Ellipsometry

Insight IS350 Olympus, Hamamatsu Photonic Lattice SE-101

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Bonding, packaging, etc.

Polisher Polisher Wafer bonder Dicer

BN technologyBni62

BN technologyBni52

Suss MicrotechSB6e

Disco DAD522, DAD2H/6T

Wire bonder Reflow furnace Laser marker Sand bluster

West BondAl, Au

Shinko FB-260H/TE GSI WM-II Shinto

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How to use Hands-on access fab.

1. Consultation2. Send application to the Univ.3. Use facility at Hands-on access fab.4. Receive bill from the Univ.5. Payment

FeesFacility (CR, office, etc.) usage fee : JPY 570 /hTechnical assistant fee : JPY 5,565 /hEquipment usage fee : max. JPY 15,000 /hMaterials cost

If a company uses the Hands-on-access fab for a week, the average payment will be JPY100,000. At the end of each month, the university calculates the fee for one-month usage of each company. Then in the middle of next month, the university sends a bill to each company.

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Users

Company user

Tohoku Univ. user

Recovery from earthquakedisaster

Company users list (~110 companies)

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MiyagiKuramotoFurukawa NDKSmart SolarMGRIKEN

Mems CoreAdvantestICRTechnofineRicohAbelieve

Nakatani SangyoPacal Technologies JapanMitsumaruPhotonic LatticeDexerialsTohoku Univ.

IbaraikiRicho Printing SystemsEUVL

FukushimaEMC SemiconductorMunekataAGC Electronics

Nihon Univ.Maruwa Quartz

HokkaidoKyosemiFine Crystal

AkitaAkita Epson

YamagataChinoMitsumiYamagata Univ.Yamagata Research Institute Of Technology

Tsuruoka NTC

ChibaFurukawa Electric

TDKYoutec

TokyoTakionInfinity Storage MediaBN TechnologyYuka IndustriesMD Innovations

Namiki Precision JewelUniv. of TokyoBEANS LaboratoryRionASET

Yokogawa ElectricNanox JapanOji Holdings

KanagawaNTT-ATTokyo Polytechnic Univ.

JVC KenwoodSuss Micro TechM.T.CNLT Technologies

Kyodo InternationalNICTToshiba

ShizuokaHamamatsu PhotonicsAZ Electronic MaterialsShizuoka Univ.

AichiNGK

NiigataInstitute of Niigata Pref.

GunmaTaiyo YudenShin-Etsu

FukuokaKyusyu Univ.

HyogoSumitomo Precision ProductsYamamoto Electric Works

OsakaSumitomo Electric IndustryPanasonic

ShigaRitsumeikanUniv.Toray Research Center

KyotoTecdia Toyama

Hokuriku Electric Industry

IwateLightomFTC Corporation

Iwate Univ.Ricoh Optical

TochigiKeihin

KagawaAoi Electronics

SaitamaNippon Signal

Wacom

KoreaSamsung

SingaporeInstitute of Microelectronics (IME)

Overseas

NaganoSeiko Epson

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User cases

• Single process (deposition, etching, etc.)

• Total process (sensor, semiconductor, etc.)

• Evaluation (observation, measurement, etc.)

• Equipment manufacture’s demo

• Training

Prototyping

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• Acceleration sensor• Pressure sensor• Si microphone• Magnetic sensor• Gas sensor• Photo diode• Solar cell• Quartz device• Piezoelectric device• Micromirror device• Microfluidic device• Radiation sensor(already commercialized)

etc.

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Income

Company user

2010 2011 2012 2013

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Tohoku Univ. user

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Activity

Providing the fab. serviceInstallation, modification and maintenance

Development of system including softwareBooking system, information sharing, safety course

Process developmentFundamental technology (CVD, photolithography, etching, etc.)New materials installationEvaluation

TrainingOn the job trainingPractical training program organizedby MEMS Park Consortium (3 months)

Training program for semiconductorindustry in Tohoku region

MEMS Training Program

• Originally started as a part of METI program in 2007 and operated by MEMS Park Consortium since 2008

• Comprehensive training program containing planning, design, fabrication, testing, report for MEMS R&D

• Practical training and lecture-based training

• The fee is approx. JPY 1M.

Planning,design

Fabrication(4 inch process) Testing Presentation,

report

10 ~ 20 d 30 ~ 60 d ~ 10 d 3 d

Participants:RICOH, MEMS CORE, PENTAX, ADVANTEST, ALPS ELECTRIC, NIPPON DENPA, SYSTEC INOUE, YAMAHA, TOPPAN, KONICA MINOLTA, SEKISUI, MURATA, FUJI MACHINE, DENSO, AHIKO, YAMAMOTO ELECTRIC WORKS, JAXA

Ex. Capacitive 3-axis accelerometer

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Products fabrication

• Products fabrication by company user is available since June 2013.• The purpose of this production is

We prove University’s R&D result as a product in the market and society. Result or problem through production accelerates University’s R&D and education.

<Requirement>• The device should be developed under University’s cooperation, and should be

continuously developed at the fab.• Occupied area and time should be less than 5% of total capacity.• A report to University is required every 6 months. • Maximum period for one type of device production is 3 years.

<Note>• University states exemption from responsibility.

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Challenge

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Since starting of the Hands-on-access fab in April 2010, we re-start and modifyold equipment, and install new equipment. Many company users have alreadyaccessed the fab. This result reveals that the hands-on system (open-accessfacility) is accepted by companies. We try to find out a sustainable model bymaking efforts to increase the number of uses. The fab continues supportingcompany to accelerate commercialization.

• Build up sustainable system• Develop and keep skillful engineers• Improve and maintain quality of equipment• Accumulate practical know-how

Hands-on-access fab, a part of your home facility

紹介Video1(2F_CR_R) 6:59

紹介Video2(2F_CR_L, 1F) 4:05

Sendai MEMS Show Room, renewal open on May 16th, 2012 31

Exhibition room poster, case1. From Semiconductor Research Institute to NishizawaMemorial Research Center2. Hands-on access fab. (K..Totsu et.al.)3. What is MEMS ?4. Mechanical sensors (M.Esashi et.al.)5. Micromachining and packaging (M.Esashi, S.Tanaka et.al.)6. RF MEMS (S.Tanaka, M.Esashi et.al.)7. MEMS for production, testing, environment and safety(S.Tanaka, M.Esashi et.al.)8. Optical MEMS (K.Hane, Y.Kanamori et.al.)9. Nanomachining (T.Ono et.al.)10. Micro sensors for medical monitoring (T.Matsu, M.Esashiet.al.)11. Minimal invasive medicine (Y.Haga et.al.)12. Sensor network (H.Kuwano et.al.)13. Power MEMS (S.Tanaka et.al.)14. Formation of Innovation Center for Fusion of AdvancedTechnologies on : Tohoku University R&D Center of Excellencefor Integrated Microsystems15. Funding Program for World-Leading Innovative R&D onScience and Technology (FIRST) on : Integrated Microsystems16. Open collaboration andμSIC17. iCAN18. MEMSPC19. Richo20. Fraunhofer (1)21. Fraunhofer (2)22. Fraunhofer (3)23. Fraunhofer (4)24. Advantest IMEC25. U.C.Berkeley26. MEMS Core (1)27. MEMS Core (2)28. IMEC (1)29. IMEC (2)

30 posters and 100 samplesEnglish/Japanese, double side

Tatami zone

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